Calibration method and device for horizontal grid of machine table, overlay machine and storage medium

Abstract

The invention relates to the field of machine grid calibration, and discloses a machine horizontal grid calibration method and device, an overlay machine and a storage medium, the method is applied to the overlay machine, and the method comprises the following steps: obtaining an independent field pattern formed by exposure of a machine by using a horizontal grid calibration mask; the horizontal grid calibration mask comprises a plurality of overlay marks; obtaining a combined field pattern formed by multiple exposure of the machine table by using the horizontal grid calibration mask, wherein the combined field pattern comprises a plurality of overlay mark groups; according to an error value between an actual position of an overlay mark in the field pattern and a nominal position of a corresponding overlay mark on the horizontal grid calibration mask plate, determining a first grid error of the measuring end of the machine table; determining an overlay difference value between an inner overlay mark and an outer overlay mark in an overlay mark group in the combined field pattern to obtain a second grid error of the exposure end; and the first grid error and the second grid error are sent to the machine table, horizontal grid calibration is achieved, and the machine table and the machine hour are not occupied.

Description

Technical Field

[0001] The present application relates to the field of machine grid calibration, and in particular to a machine horizontal grid calibration method, device, overlay machine and computer-readable storage medium. Background Art

[0002] At present, the positioning of the machine stage in the lithography process mainly adopts the plane grating positioning system to achieve nanometer-level control of the workpiece stage length stroke. However, the installation error, splicing error and inherent defects of the plane grating will cause grid errors.

[0003] The horizontal calibration of the grating can be used to partially compensate for the grid error. At present, the main process of horizontal grid precision calibration includes: exposing the alignment mark on the machine, then measuring all the alignment marks with the alignment system built into the machine, and then calculating with the model built into the machine to obtain the machine constants of the high-density array (such as 400x400) at the measurement end (M-Side) and the exposure end (E-Side) respectively, to achieve horizontal grid calibration. The current calibration method has the following defects: first, due to the large number of alignment marks, more than 20,000, it takes a long time to measure all the alignment marks with the alignment system built into the machine, and the machine time is too long, about 10 to 20 hours; second, due to the long-term continuous measurement of the machine, the reliability requirements of the machine alignment system are very high; third, using the model built into the machine for calculation, it is difficult to upgrade and iterate the analysis model.

[0004] Therefore, how to solve the above technical problems should be the focus of technical personnel in this field. Summary of the invention

[0005] The purpose of the present application is to provide a method, device, overlay machine and computer-readable storage medium for horizontal grid calibration of a machine, so as to reduce the reliability requirements of the machine alignment system when the machine's measuring machine is not occupied during calibration, and avoid dependence on the machine's own model.

[0006] In order to solve the above technical problems, the present application provides a machine horizontal grid calibration method, which is applied to an overlay machine, comprising:

[0007] Obtaining a separate field pattern formed by exposing the machine using a horizontal grid calibration mask; the horizontal grid calibration mask includes a plurality of overlay marks;

[0008] Obtaining a combined field pattern formed by multiple exposures of the machine using the horizontal grid calibration mask, wherein the combined field pattern includes a plurality of overlay mark groups; each of the overlay mark groups includes an inner overlay mark and an outer overlay mark, and the inner overlay mark and the outer overlay mark are formed by the overlay marks in different field patterns;

[0009] Determining a first grid error of a measuring end of the machine according to an error value between an actual position of an overlay mark in the field pattern and a nominal position of a corresponding overlay mark on the horizontal grid calibration mask;

[0010] Determine the overlay difference between the inner overlay mark and the outer overlay mark in each overlay mark group in the combined field pattern to obtain a second grid error of the exposure end of the machine;

[0011] The first grid error and the second grid error are sent to the platform, so that the platform can achieve horizontal grid calibration.

[0012] Optionally, sending the first grid error and the second grid error to the machine platform includes:

[0013] Arranging the first grid error and the second grid error to form a grid array;

[0014] The grid array is sent to the tool.

[0015] Optionally, determining the first grid error of the measuring end of the machine according to the error value between the actual position of the overlay mark in the field pattern and the nominal position of the overlay mark corresponding to the overlay mark on the horizontal grid calibration mask includes:

[0016] Determining an error value between an actual position of each of the overlay marks in the field pattern and a nominal position of a corresponding overlay mark on the horizontal grid calibration mask;

[0017] The grid error introduced by the measuring end at each of the marks is determined by determining the error value between the actual position of each of the overlay marks in the field pattern and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, the exposure end error, and the measurement end error, thereby obtaining the first grid error.

[0018] Optionally, the relationship between the error value between the actual position of the overlay mark in the field pattern and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, the exposure end error, and the measurement end error is:

[0019] dx i =dx i (meas)+dx(exp);

[0020] dy i =dy i (meas)+dy(exp);

[0021] In the formula, dx iis the error value in the x direction between the actual position of the overlay mark i and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, dx i (meas) is the error generated by the measurement end in the x direction at the overlay mark i, dx(exp) is the error generated by the exposure end, and dy i is the error value in the y direction between the actual position of the overlay mark i and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, dy i (meas) is the error generated by the measuring end in the y direction at the overlay mark i.

[0022] Optionally, the plurality of overlay marks include any one or any combination of a Bar-in-Bar mark, an AIM mark, and a uDBO mark.

[0023] Optionally, before obtaining the combined field pattern formed by multiple exposures of the machine using the horizontal grid calibration mask, wherein the combined field pattern includes a plurality of overlay mark groups, the method further includes:

[0024] The machine uses the horizontal grid calibration mask to perform exposure to form a center field pattern;

[0025] The workpiece stage of the mobile machine is exposed by using the horizontal grid calibration mask to form adjacent field patterns around the central field pattern; the adjacent field patterns and the central field pattern have overlapping overlay nesting areas, and the overlay nesting areas include multiple overlay mark groups.

[0026] The present application also provides a machine horizontal grid calibration device, comprising:

[0027] A first acquisition module is used to obtain a separate field pattern formed by the machine using a horizontal grid calibration mask for exposure; the horizontal grid calibration mask includes a plurality of overlay marks;

[0028] A second obtaining module is used to obtain a combined field pattern formed by multiple exposures of the machine using the horizontal grid calibration mask, wherein the combined field pattern includes a plurality of overlay mark groups; each of the overlay mark groups includes an inner overlay mark and an outer overlay mark, and the inner overlay mark and the outer overlay mark are formed by the overlay marks in different field patterns;

[0029] A first determination module, configured to determine a first grid error of a measuring end of the machine according to an error value between an actual position of an overlay mark in the field pattern and a nominal position of a corresponding overlay mark on the horizontal grid calibration mask;

[0030] A second determination module is used to determine the overlay difference between the inner overlay mark and the outer overlay mark in each overlay mark group in the combined field pattern to obtain a second grid error of the exposure end of the machine;

[0031] A sending module is used to send the first grid error and the second grid error to the machine platform, so that the machine platform can achieve horizontal grid calibration.

[0032] Optionally, the first determining module includes:

[0033] A first determining unit, configured to determine an error value between an actual position of each of the overlay marks in the field pattern and a nominal position of the corresponding overlay mark on the horizontal grid calibration mask;

[0034] The second determination unit is used to determine the grid error introduced by the measuring end at each of the marks through the relationship between the error value between the actual position of each of the overlay marks in the field pattern and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, the exposure end error, and the measurement end error, so as to obtain the first grid error.

[0035] The present application also provides a set engraving machine, comprising:

[0036] Memory for storing computer programs;

[0037] A processor is used to implement the steps of any one of the above-mentioned methods for calibrating the horizontal grid of the machine platform when executing the computer program.

[0038] The present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of any one of the above-mentioned methods for calibrating the machine horizontal grid are implemented.

[0039] A method for calibrating a machine horizontal grid provided in the present application is applied to an overlay machine, comprising: obtaining a separate field pattern formed by exposing the machine using a horizontal grid calibration mask; the horizontal grid calibration mask comprises a plurality of overlay marks; obtaining a combined field pattern formed by multiple exposures of the machine using the horizontal grid calibration mask, the combined field pattern comprising a plurality of overlay mark groups; each of the overlay mark groups comprises an inner overlay mark and an outer overlay mark, the inner overlay mark and the outer overlay mark being formed by the overlay marks in different field patterns; determining a first grid error at a measuring end of the machine according to an error value between an actual position of the overlay mark in the field pattern and a nominal position of the corresponding overlay mark on the horizontal grid calibration mask; determining an overlay difference between the inner overlay mark and the outer overlay mark in each of the overlay mark groups in the combined field pattern to obtain a second grid error at an exposure end of the machine; and sending the first grid error and the second grid error to the machine to enable the machine to achieve horizontal grid calibration.

[0040] It can be seen that in the horizontal grid calibration method of the machine in the present application, after the machine performs exposure processing on the horizontal grid calibration mask to form a field pattern and a combined field pattern, the overprinter can obtain the first grid error of the machine measurement end through the error between the actual position of the overprint mark in the field pattern and the nominal position of the corresponding overprint mark on the horizontal grid calibration mask, and the second grid error of the machine exposure end can be obtained through the difference between the inner overprint mark and the outer overprint mark in the overprint mark group. That is, the error measurement process is carried out on the overprinter, which does not occupy the measuring machine time of the machine, and is not affected by the reliability of the machine alignment system, thereby reducing the requirements for the reliability of the machine alignment system. In addition, since there is no need to use the machine for error measurement and analysis calculation, dependence on the machine's own model is avoided.

[0041] In addition, the present application also provides a device, an engraving machine and a computer-readable storage medium having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0043] Figure 1 A flow chart of a method for calibrating a horizontal grid of a machine provided in an embodiment of the present application;

[0044] Figure 2A schematic diagram of a horizontal grid calibration mask provided in an embodiment of the present application;

[0045] Figure 3 A schematic diagram of splicing and nesting a central field and adjacent fields provided in an embodiment of the present application;

[0046] Figures 4 to 6 A schematic diagram of an inner and outer nested combination of an overlay mark provided in an embodiment of the present application;

[0047] Figure 7 A comparison chart of the nominal and actual positions of the markers;

[0048] Figure 8 A schematic diagram of the distribution of the grid array and wafers on the machine;

[0049] Fig. 9 This is a comparison chart before and after the machine grid calibration;

[0050] Fig.10 A structural block diagram of a machine horizontal grid calibration device provided in an embodiment of the present application;

[0051] Fig.11 A structural block diagram of an overlay machine provided in an embodiment of the present application. DETAILED DESCRIPTION

[0052] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0053] As described in the background technology section, currently in the lithography process, when calibrating the horizontal grid of the machine, data measurement and analysis are performed on the machine, which takes up too much machine time and places high requirements on the reliability of the machine alignment system. At the same time, it is highly dependent on the machine's own model.

[0054] In view of this, the present application provides a machine horizontal grid calibration method, which is applied to the engraving machine, please refer to Figure 1 ,include:

[0055] Step S101: obtaining a separate field pattern formed by exposing a horizontal grid calibration mask on a machine; the horizontal grid calibration mask includes a plurality of overlay marks.

[0056] The multiple overlay marks include but are not limited to any one or any combination of Bar-in-Bar marks, AIM (Advanced Image Metrology) marks, and uDBO (Micro Diffraction Based Overlay) marks.

[0057] Before obtaining the individual field patterns formed by the machine using the horizontal grid calibration mask for exposure, a universal overlay mark is placed on the horizontal grid calibration mask, and then the machine uses the horizontal grid calibration mask to expose the wafer to form the field pattern. Figure 2 As shown, Figure 2 Includes 8 overlay marks 1, Figure 2 The middle overlay mark 1 is shown as a Bar-in-Bar mark.

[0058] It can be understood that the schematic diagram of the field pattern is similar to the schematic diagram of the horizontal grid calibration mask, and the field pattern includes marks corresponding to the overlay marks on the horizontal grid calibration mask.

[0059] It should be pointed out that the separate field pattern in this step is also formed in the overlay process.

[0060] Step S102: obtaining a combined field pattern formed by multiple exposures of the machine using the horizontal grid calibration mask, wherein the combined field pattern includes a plurality of overlay mark groups;

[0061] Each of the overlay mark groups includes an inner overlay mark and an outer overlay mark, and the inner overlay mark and the outer overlay mark are formed by the overlay marks in different field patterns.

[0062] By translating the workpiece stage of the machine in the x-direction and the y-direction, the overlay marks in the adjacent field patterns are nested and combined with the overlay marks in the central field pattern to form an overlay mark group. The combined field pattern is formed by combining the central field pattern and the overlapping area of ​​the central field pattern and the adjacent field pattern.

[0063] The schematic diagram of the central field pattern and the adjacent field pattern being spliced ​​and nested is shown in Figure 3 As shown, each overlay mark group 2 in the combined field pattern 3 includes an inner overlay mark and an outer overlay mark. Figure 3The middle overlay mark group 2 is shown as a Bar-in-Bar mark. The horizontal grid calibration mask has two outer engraved marks on the left side and two inner engraved marks on the right side. After exposure, two outer engraved marks are formed on the left side of the center field pattern, and two inner engraved marks are formed on the right side. Then the workpiece stage of the machine is translated, such as moving to the right, and then exposure is performed, so that the two outer engraved marks on the left side of the right adjacent field pattern are nested outside the two inner engraved marks on the right side of the center field pattern, forming a bar-in-bar overlay mark group. Similarly, if it is moved to the left and then exposed, the two inner engraved marks on the right side of the left adjacent field are nested inside the two outer engraved marks on the left side of the center field pattern, forming a bar-in-bar overlay mark group. Similarly, the horizontal grid calibration mask has two outer engraved marks on the top and bottom, and two inner engraved marks on the top. After exposure, two outer engraved marks are formed on the top and bottom of the center field pattern, and two inner engraved marks are formed on the top. By moving the workpiece stage up and down and then exposing, an overlay mark group is also formed. The left-right movement is the movement in the x-direction, and the up-down movement is the movement in the y-direction. When both the inner engraved mark and the outer engraved mark are Bar-in-Bar marks, the schematic diagram of the nested combination is as follows: Figure 4 As shown; when the inner engraved mark and the outer engraved mark are both AIM marks, the schematic diagram of the nested combination is as shown Figure 5 As shown; when the inner engraved mark and the outer engraved mark are both uDBO marks, the schematic diagram of the nested combination is as follows Figure 6 shown.

[0064] As an implementation method, obtaining a combined field pattern formed by multiple exposures of the machine using the horizontal grid calibration mask, wherein the combined field pattern includes a plurality of overlay mark groups, further includes:

[0065] The machine uses the horizontal grid calibration mask to perform exposure to form a center field pattern;

[0066] The workpiece stage of the mobile machine is exposed by using the horizontal grid calibration mask to form adjacent field patterns around the central field pattern; the adjacent field patterns and the central field pattern have overlapping overlay nesting areas, and the overlay nesting areas include multiple overlay mark groups.

[0067] There is only one horizontal grid calibration mask used for overlay in this application.

[0068] Step S103: determining a first grid error of the measuring end of the machine according to an error value between an actual position of the overlay mark in the field pattern and a nominal position of the overlay mark corresponding to the overlay mark on the horizontal grid calibration mask.

[0069] The overlay marks in the field pattern are formed by exposing the mask through a horizontal grid alignment.

[0070] The nominal position of the overlay mark refers to the position of the overlay mark on the horizontal grid calibration mask.

[0071] As an implementation method, determining the first grid error of the measuring end of the machine according to the error value between the actual position of the overlay mark in the field pattern and the nominal position of the overlay mark corresponding to the overlay mark on the horizontal grid calibration mask includes:

[0072] Step S1031: determining an error value between an actual position of each of the overlay marks in the field pattern and a nominal position of the corresponding overlay mark on the horizontal grid calibration mask.

[0073] Please refer to Figure 7 All overlay marks in a field pattern are formed in one exposure and are marks of the same exposure field. Figure 7 In the figure, taking the nominal position of the overlay mark in the dotted box and the actual position of the overlay mark formed on the wafer as an example, the error value between the overlay mark in the field pattern and the corresponding overlay mark on the horizontal grid calibration mask can be obtained by the difference between the center point of the actual position of the overlay mark and the center point of the nominal position. Each error value includes the error value in the x direction and the error value in the y direction. The calculation formulas for the error value in the x direction and the error value in the y direction are:

[0074] dx i =dx i实际 -dx i名义 (1)

[0075] dy i =dy i实际 -dy i名义 (2)

[0076] In the formula, dx i实际 is the actual position value of the overlay mark i in the field pattern in the x direction, dx i名义 is the nominal position value of the overlay mark on the horizontal grid calibration mask in the x direction corresponding to the overlay mark i in the field pattern, dx i dy is the error value in the x direction between the actual position of the overlay mark i in the field pattern and the nominal position of the overlay mark on the corresponding horizontal grid calibration mask; i实际 is the actual position value of the overlay mark i in the field pattern in the y direction, dy i名义 is the nominal position value of the overlay mark in the y direction on the horizontal grid calibration mask corresponding to the overlay mark i in the field pattern, dy i is the error value in the y direction between the overlay mark i in the field pattern and the corresponding overlay mark on the horizontal grid calibration mask.

[0077] Step S1032: Determine the grid error introduced by the measuring end at each of the marks through the error value between the actual position of each of the overlay marks in the field pattern and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, the exposure end error, the measurement end error, and the error value, and obtain the first grid error.

[0078] The relationship between the error value between the actual position of the overlay mark in the field pattern and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, the exposure end error, and the measurement end error is:

[0079] dx i =dx i (meas)+dx(exp) (3)

[0080] dy i =dy i (meas)+dy(exp) (4)

[0081] In the formula, dx i is the error value in the x direction between the actual position of the overlay mark i and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, dx i (meas) is the error generated by the measurement end in the x direction at the overlay mark i, dx(exp) is the error generated by the exposure end, and dy i is the error value in the y direction between the actual position of the overlay mark i and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, dy i (meas) is the error generated by the measuring end in the y direction at the overlay mark i.

[0082] Similarly, for other markers j in the same field pattern, we can obtain:

[0083] dx j =dx j (meas)+dx(exp) (5)

[0084] dy j =dy j (meas)+dy(exp) (6)

[0085] In the formula, dx j is the error value in the x direction between the actual position of the overlay mark j and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, dx j (meas) is the error generated by the measuring end in the x direction at the overlay mark j, dx(exp) is the error generated by the exposure end, and dy jis the error value in the y direction between the actual position of the overlay mark j and the nominal position of the overlay mark on the corresponding horizontal grid calibration mask, dy j (meas) is the error generated by the measuring end in the y direction at the overlay mark j.

[0086] For different overlay marks in the same field pattern, the error generated at the exposure end is the same at the same workpiece stage position at the exposure end. Therefore, the same exposure end error is used in formulas (3) to (6).

[0087] Subtract the error values ​​of different overlay marks to get:

[0088] dx i -dx j =dx i (meas)-dx j (meas) (7)

[0089] dy i -dy j =dy i (meas)-dy j (meas) (8)

[0090] Among them, dx i anddy i The specific values ​​can be obtained by formulas (1) and (2). Similarly, the dx of other overlay marks j is j anddy j The specific value can also be obtained. By combining the equations between multiple overlay marks, the grid error at each overlay mark can be obtained. For example, at overlay mark i, the grid error includes the error dx generated by the measuring end in the x direction at overlay mark i. i (meas) and the error dy generated by the measuring end at the overlay mark i in the y direction i (meas); at the overlay mark j, the grid error includes the error dx generated by the measuring end in the x direction at the overlay mark j j (meas) and the error dy generated by the measuring end at the overlay mark j in the y direction j (meas).

[0091] The errors of all the overlay marks in the x direction and the y direction are obtained, that is, the first grid error is obtained.

[0092] Step S104: determining the overlay difference between the inner overlay mark and the outer overlay mark in each overlay mark group in the combined field pattern, and obtaining a second grid error of the exposure end of the machine.

[0093] For an overlay mark group, the measurement is performed on the overlay machine without using the grating at the measuring end of the machine. Therefore, the grid at the measuring end of the machine has no effect and can be ruled out.

[0094] Please refer to Figure 3 For an overlay mark group, the measurement of the inner overlay mark and the outer overlay mark uses different grid areas at the exposure end, so the overlay error can fully reflect the grid error at the exposure end of the machine.

[0095] For one overlay mark group, the grid error generated by the exposure end is:

[0096] OVx m =dx m-i -dx m-o (9)

[0097] OV m =dy m-i -dy m-o (10)

[0098] In the formula, OVx m is the overlay difference generated by the overlay mark group m in the x direction, dx m-i is the value of the inner overlay mark in the overlay mark group m in the x direction, dx m-o is the value of the outer cover engraving mark in the overlay mark group m in the x direction, OVy m is the overlay difference generated by the overlay mark group m in the y direction, dy m-i is the value of the inner overlay mark in the overlay mark group m in the y direction, dy m-o is the value of the outer cover mark in the overlay mark group m in the y direction.

[0099] Step S105: sending the first grid error and the second grid error to the machine platform, so that the machine platform can achieve horizontal grid calibration.

[0100] As an implementable method, sending the first grid error and the second grid error to the machine platform includes:

[0101] Step S1051: Arrange the first grid error and the second grid error to form a grid array.

[0102] The size of the grid array is not limited in this application and can be set by oneself. For example, the grid array can be 400×400 with a step size of 1 mm.

[0103] Step S1052: Send the grid array to the machine.

[0104] The machine receives the grid array, and the distribution diagram of the grid array 4 and the wafer 5 on the machine is as follows: Figure 8The comparison of the machine grid before and after calibration is shown in Fig. 9 shown.

[0105] In the machine horizontal grid calibration method of this embodiment, after the machine performs exposure processing on the horizontal grid calibration mask to form a field pattern and a combined field pattern, the overprinter can obtain the first grid error of the machine measurement end through the error between the actual position of the overprint mark in the field pattern and the nominal position of the corresponding overprint mark on the horizontal grid calibration mask, and the second grid error of the machine exposure end can be obtained through the difference between the inner overprint mark and the outer overprint mark in the overprint mark group. That is, the error measurement process is carried out on the overprinter, which does not occupy the measuring machine time of the machine, and is not affected by the reliability of the machine alignment system, thereby reducing the requirements for the reliability of the machine alignment system. In addition, since there is no need to use the machine for error measurement and analysis calculation, it avoids dependence on the machine's own model, and the offline data analysis model upgrade and iteration is easier than the fixed model of the machine.

[0106] The following is an introduction to a machine horizontal grid calibration device provided in an embodiment of the present application. The machine horizontal grid calibration device described below and the machine horizontal grid calibration method described above can be referenced to each other.

[0107] Fig.10 The structural block diagram of the machine horizontal grid calibration device provided in the embodiment of the present application is shown in FIG. Fig.10 The machine horizontal grid calibration device may include:

[0108] The first obtaining module 100 is used to obtain a separate field pattern formed by the machine using a horizontal grid calibration mask for exposure; the horizontal grid calibration mask includes a plurality of overlay marks;

[0109] A second obtaining module 200 is used to obtain a combined field pattern formed by the machine using the horizontal grid calibration mask to perform multiple exposures, wherein the combined field pattern includes a plurality of overlay mark groups; each of the overlay mark groups includes an inner overlay mark and an outer overlay mark, and the inner overlay mark and the outer overlay mark are formed by the overlay marks in different field patterns;

[0110] A first determination module 300 is used to determine a first grid error of the measuring end of the machine according to an error value between an actual position of an overlay mark in the field pattern and a nominal position of a corresponding overlay mark on the horizontal grid calibration mask;

[0111] A second determination module 400 is used to determine the overlay difference between the inner overlay mark and the outer overlay mark in each overlay mark group in the combined field pattern to obtain a second grid error of the exposure end of the machine;

[0112] The sending module 500 is used to send the first grid error and the second grid error to the machine platform, so that the machine platform can achieve horizontal grid calibration.

[0113] The machine horizontal grid calibration device of the present embodiment is used to implement the aforementioned machine horizontal grid calibration method. Therefore, the specific implementation method of the machine horizontal grid calibration device can be seen in the embodiment part of the machine horizontal grid calibration method in the previous text. For example, the first acquisition module 100, the second acquisition module 200, the first determination module 300, the second determination module 400, and the sending module 500 are respectively used to implement steps S101, S102, S103, S104 and S105 in the aforementioned machine horizontal grid calibration method. Therefore, its specific implementation method can refer to the description of the corresponding embodiments of each part, which will not be repeated here.

[0114] Optionally, the sending module includes:

[0115] an arranging unit, configured to arrange the first grid error and the second grid error to form a grid array;

[0116] A sending unit is used to send the grid array to the machine platform.

[0117] Optionally, the first determining module includes:

[0118] A first determining unit, configured to determine an error value between an actual position of each of the overlay marks in the field pattern and a nominal position of the corresponding overlay mark on the horizontal grid calibration mask;

[0119] The second determination unit is used to determine the grid error introduced by the measuring end at each of the marks through the relationship between the error value between the actual position of each of the overlay marks in the field pattern and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, the exposure end error, and the measurement end error, so as to obtain the first grid error.

[0120] The following is an introduction to the overlay machine provided in the embodiment of the present application. The overlay machine described below and the machine horizontal grid calibration method described above can be referenced to each other.

[0121] Please refer to Fig.11 The present application also provides a set engraving machine, comprising:

[0122] A memory 11, used for storing computer programs;

[0123] The processor 12 is used to implement the steps of the machine horizontal grid calibration method described in any of the above embodiments when executing the computer program.

[0124] The computer-readable storage medium provided in the embodiment of the present application is introduced below. The computer-readable storage medium described below and the machine horizontal grid calibration method described above can be referenced to each other.

[0125] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the machine horizontal grid calibration method described in any of the above embodiments are implemented.

[0126] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0127] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0128] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0129] The above is a detailed introduction to the machine horizontal grid calibration method, device, overlay machine and computer-readable storage medium provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A method for calibrating a horizontal grid of a machine, characterized in that: Applicable to overlay machines, including: Obtaining a separate field pattern formed by exposing the machine using a horizontal grid calibration mask; the horizontal grid calibration mask includes a plurality of overlay marks; Obtaining a combined field pattern formed by multiple exposures of the machine using the horizontal grid calibration mask, wherein the combined field pattern includes a plurality of overlay mark groups; each of the overlay mark groups includes an inner overlay mark and an outer overlay mark, and the inner overlay mark and the outer overlay mark are formed by the overlay marks in different field patterns; Determining a first grid error of a measuring end of the machine according to an error value between an actual position of an overlay mark in the field pattern and a nominal position of a corresponding overlay mark on the horizontal grid calibration mask; Determine the overlay difference between the inner overlay mark and the outer overlay mark in each overlay mark group in the combined field pattern to obtain a second grid error of the exposure end of the machine; The first grid error and the second grid error are sent to the platform, so that the platform can achieve horizontal grid calibration.

2. The machine horizontal grid calibration method according to claim 1, characterized in that: Sending the first grid error and the second grid error to the machine platform includes: Arranging the first grid error and the second grid error to form a grid array; The grid array is sent to the tool.

3. The machine horizontal grid calibration method according to claim 1, characterized in that: Determining a first grid error of the measuring end of the machine according to an error value between an actual position of an overlay mark in the field pattern and a nominal position of a corresponding overlay mark on the horizontal grid calibration mask comprises: Determining an error value between an actual position of each of the overlay marks in the field pattern and a nominal position of a corresponding overlay mark on the horizontal grid calibration mask; The grid error introduced by the measuring end at each of the marks is determined by determining the error value between the actual position of each of the overlay marks in the field pattern and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, the exposure end error, and the measurement end error, thereby obtaining the first grid error.

4. The machine horizontal grid calibration method according to claim 3, characterized in that: The relationship between the error value between the actual position of the overlay mark in the field pattern and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, the exposure end error, and the measurement end error is: dx i =dx i (meas)+dx(exp); of i =dy i (mean)+of(exp): In the formula, dx i is the error value in the x direction between the actual position of the overlay mark i and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, dx i (meas) is the error generated by the measurement end in the x direction at the overlay mark i, dx(exp) is the error generated by the exposure end, and dy i is the error value in the y direction between the actual position of the overlay mark i and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, dy i (meas) is the error generated by the measuring end in the y direction at the overlay mark i.

5. The machine horizontal grid calibration method according to claim 1, characterized in that: The plurality of overlay marks include any one or any combination of a Bar-in-Bar mark, an AIM mark, and a uDBO mark.

6. The machine horizontal grid calibration method according to claim 1, characterized in that: Before obtaining a combined field pattern formed by multiple exposures of the machine using the horizontal grid calibration mask, wherein the combined field pattern includes a plurality of overlay mark groups, the method further includes: The machine uses the horizontal grid calibration mask to perform exposure to form a center field pattern; The workpiece stage of the mobile machine is exposed by using the horizontal grid calibration mask to form adjacent field patterns around the central field pattern; the adjacent field patterns and the central field pattern have overlapping overlay nesting areas, and the overlay nesting areas include multiple overlay mark groups.

7. A machine horizontal grid calibration device, characterized in that: include: A first acquisition module is used to obtain a separate field pattern formed by the machine using a horizontal grid calibration mask for exposure; The horizontal grid calibration mask includes a plurality of overlay marks; A second obtaining module is used to obtain a combined field pattern formed by multiple exposures of the machine using the horizontal grid calibration mask, wherein the combined field pattern includes a plurality of overlay mark groups; each of the overlay mark groups includes an inner overlay mark and an outer overlay mark, and the inner overlay mark and the outer overlay mark are formed by the overlay marks in different field patterns; A first determination module, configured to determine a first grid error of a measuring end of the machine according to an error value between an actual position of an overlay mark in the field pattern and a nominal position of a corresponding overlay mark on the horizontal grid calibration mask; A second determination module is used to determine the overlay difference between the inner overlay mark and the outer overlay mark in each overlay mark group in the combined field pattern to obtain a second grid error of the exposure end of the machine; A sending module is used to send the first grid error and the second grid error to the machine platform, so that the machine platform can achieve horizontal grid calibration.

8. The machine horizontal grid calibration device according to claim 7, characterized in that: The first determining module comprises: A first determining unit, configured to determine an error value between an actual position of each of the overlay marks in the field pattern and a nominal position of the corresponding overlay mark on the horizontal grid calibration mask; The second determination unit is used to determine the grid error introduced by the measuring end at each of the marks through the relationship between the error value between the actual position of each of the overlay marks in the field pattern and the nominal position of the corresponding overlay mark on the horizontal grid calibration mask, the exposure end error, and the measurement end error, so as to obtain the first grid error.

9. A set engraving machine, characterized in that: include: Memory for storing computer programs; A processor is used to implement the steps of the machine horizontal grid calibration method as described in any one of claims 1 to 5 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the machine horizontal grid calibration method according to any one of claims 1 to 5 are implemented.

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