Display module and display device

Abstract

The invention provides a display module and a display device, and the display module comprises a flexible circuit board which is provided with a connection area; the display panel is located on one side of the flexible circuit board and comprises a binding area and a display area, the orthographic projection of the display panel on the flexible circuit board is located in the connecting area, and the orthographic projection of the flexible circuit board on the display panel is located in the binding area; the binding pad is located in the binding area, and the binding pad is located on the side, close to the flexible circuit board, of the display panel; the isolation structure is located on one side, away from the display area, of the binding pad; in the thickness direction of the display panel, the two ends of the isolation structure abut against the display panel and the flexible circuit board respectively. The circuit connecting material is arranged between the binding bonding pad and the flexible circuit board and located on the side, close to the display area, of the isolation structure. The isolation structure used for preventing the circuit connecting material from overflowing is arranged in the binding area of the flexible circuit board and the display panel, so that the situation that the binding area is corroded due to the fact that holes are formed in the back adhesive at the overflowing position due to overflowing is prevented.

Description

Technical Field

[0001] The present application relates to the technical field of displays, and in particular to a display module and a display device that prevent water vapor from entering a binding area along a back glue hole during an artificial sweat test. Background Art

[0002] With the development of display technology, the number of test items for terminals on display screens is increasing and the test requirements are becoming more and more stringent. In reliability testing, multiple products have failed in artificial sweat tests. The failure paths are as follows: Figure 1 The failed product enters the binding area along the holes in the adhesive backing, causing corrosion in the binding area. The reasons for the holes in the adhesive backing are as follows: Figure 2 When applying the back glue, the glue valve sprays glue close to the edge of the display panel, and the glue first contacts the cured area of ​​the anisotropic conductive glue. Due to its weak affinity, the UV (Ultraviolet Rays) glue preferentially fills part of the FPC (Flexible Printed Circuit) area, resulting in holes in the back glue. The current improvement method is to increase the distance from the flexible circuit board pad to the cutting margin, transfer the ACF (Anisotropic Conductive Film) inward to reduce ACF overflow, and improve the back glue UV coating effect, but it cannot fundamentally solve this problem. At the same time, this solution will increase the panel size and does not meet the requirements of some customers for the appearance size. Summary of the invention

[0003] In view of this, the embodiments of the present application are directed to providing a display module and a display device, which can prevent water vapor from entering the binding area along the holes in the adhesive back during artificial sweat testing, thereby eliminating the risk of holes in the adhesive back.

[0004] According to the inventive concept of one aspect of the present application, a display module is provided, comprising: a flexible circuit board, a display panel, a binding pad, an isolation structure and a circuit connection material. The flexible circuit board is provided with a connection area. The display panel is located on one side of the flexible circuit board, the display panel comprises a binding area and a display area, the orthographic projection of the display panel on the flexible circuit board is located on the connection area, and the orthographic projection of the flexible circuit board on the display panel is located on the binding area; the binding pad is located in the binding area, and the binding pad is located on the side of the display panel close to the flexible circuit board. The isolation structure is located on the side of the binding pad away from the display area; in the thickness direction of the display panel, the two ends of the isolation structure respectively abut the display panel and the flexible circuit board. The circuit connection material is provided between the binding pad and the flexible circuit board, and is located on the side of the isolation structure close to the display area.

[0005] According to some embodiments of the present application, a groove is provided in the connection area of ​​the flexible circuit board, and the orthographic projection of the groove on the display panel is located on a side of the isolation structure close to the display area and does not overlap with the orthographic projection of the isolation structure on the display panel.

[0006] Preferably, the orthographic projection of the groove on the display panel is located between the orthographic projection of the isolation structure on the display panel and the orthographic projection of the binding pad on the display panel; or, the orthographic projection of the groove on the display panel is located within the orthographic projection of the binding pad on the display panel.

[0007] According to some embodiments of the present application, the circuit connection material fills an area commonly defined by the isolation structure, the groove, the binding area, and the connection area.

[0008] According to some embodiments of the present application, the cross-sectional shape of the groove is rectangular, semicircular, trapezoidal, or arcuate.

[0009] According to some embodiments of the present application, the binding structure further includes a back glue, and the back glue is located on a side of the isolation structure away from the display area.

[0010] Preferably, the adhesive covers at least a portion of the area outside the connection area on the flexible circuit board.

[0011] Back glue The back glue includes: UV curing glue, heat curing glue, and structural glue.

[0012] According to some embodiments of the present application, the isolation structure extends from the binding area of ​​the display panel toward the connection area along a direction perpendicular to the plane where the display panel is located.

[0013] According to some embodiments of the present application, the isolation structure extends from the connection area of ​​the flexible circuit board toward the binding area in a direction perpendicular to the plane where the connection area is located.

[0014] According to some embodiments of the present application, the isolation structure is bonded to one of the flexible circuit board and the display panel, and abuts against the other one.

[0015] Preferably, the orthographic projection of the isolation structure on the display panel is a rectangle.

[0016] According to some embodiments of the present application, the flexible circuit board includes: a substrate layer, a conductive layer and a protective film layer. The conductive layer is located on one side of the substrate layer. The protective film layer is located on a side of the conductive layer away from the substrate layer, and the protective film layer covers the area outside the connection area on the flexible circuit board.

[0017] Preferably, the material of the protective film includes polyimide and polyester.

[0018] According to another aspect of the invention concept of the present application, a display device is further provided, comprising the display module of the above-mentioned embodiment.

[0019] According to the display module and display device of the embodiments of the present application, an isolation structure for blocking overflow of circuit connection material is provided in the binding area between the flexible circuit board and the display panel to prevent overflow from causing holes in the back glue at the overflow location, thereby causing corrosion in the binding area. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the display module during artificial sweat testing in the prior art.

[0021] Figure 2 It is a structural schematic diagram of a method for solving the problem of glue overflow from a display module during an artificial sweat test in the prior art.

[0022] Figure 3 It is a structural schematic diagram of a display module according to an embodiment of the present application.

[0023] Figure 4 It is a partial structural decomposition diagram of a display module before binding according to an embodiment of the present application.

[0024] Figure 5 It is a schematic diagram of partial structural decomposition of a display module before binding according to another embodiment of the present application.

[0025] Figure 6 This is a partial structural decomposition diagram of a display module before binding according to another embodiment of the present application.

[0026] Figure 7 It is a process flow chart of binding the display module of the embodiment of the present application.

[0027] Figure 8 yes Figure 7 The sub-step flowchart of step S2 in the flowchart shown.

[0028] Fig. 9 yes Figure 7 The sub-step flowchart of step S7 in the flowchart shown.

[0029] Fig.10 It is a schematic diagram of the planar structure of the display device provided in an embodiment of the present application.

[0030] Description of reference numerals:

[0031] 1-Flexible circuit board;

[0032] 101 - connection area;

[0033] 110- base material layer;

[0034] 120-conductive layer;

[0035] 130-protective film layer;

[0036] 2-Display panel;

[0037] 201-binding area;

[0038] 202-display area;

[0039] 210-screen body;

[0040] 220-functional layer;

[0041] 3- Binding pads;

[0042] 4-Isolation structure;

[0043] 5-Circuit connection materials;

[0044] 6-groove;

[0045] 7- Adhesive backing;

[0046] 100-display device. DETAILED DESCRIPTION

[0047] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0048] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0049] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0050] Figure 1 It is a schematic diagram of the structure of the display module during artificial sweat testing in the prior art. Figure 2 It is a structural schematic diagram of a method for solving the problem of glue overflow from a display module during an artificial sweat test in the prior art.

[0051] In related technologies, such as Figure 1 As shown, the display module includes a flexible circuit board 1 and a display panel 2. The flexible circuit board 1 includes a substrate layer 110, a conductive layer 120 and a protective film layer 130, wherein a connection area 101 is provided on the flexible circuit board 1. The display panel 2 includes a screen body 210 and a functional layer 220, wherein the display panel 2 includes a binding area 201 and a display area 202. An electrical connection needs to be achieved between the flexible circuit board 1 and the display panel 2, that is, the connection area 101 of the flexible circuit board 1 is aligned with the binding area 201 of the display panel 2, and they are bonded by a circuit connection material 5, wherein during the bonding process, the circuit connection material 5 will diffuse from the center to the outside along the contact section of the two, wherein part of the circuit connection material 5 will exceed the binding area of ​​the two, so as to Figure 1 For example, the circuit connection material 5 overflows to the area outside the left end of the display panel 2, and this part of the area needs to be coated with adhesive 7 later. When the adhesive 7 is coated, the circuit connection material 5 has been cured. Since the adhesive 7 has a weak affinity with the circuit connection material 5, the adhesive 7 cannot completely fill the part of the area outside the left end of the display panel 2, leaving adhesive holes at the overflow position in the area. These adhesive holes expose the circuit connection material 5 or the binding area 201 directly or indirectly to the external environment. When performing an artificial sweat test, the artificial sweat will corrode the components in the binding area 201 through these adhesive holes, resulting in the failure of the test.

[0052] In the prior art, in order to solve the above technical problems, Figure 2 As shown, the method of increasing the distance from the pad of the flexible circuit board 1 to the cutting margin is often adopted to move the circuit connection material 5 inward (such as Figure 2The above method can only reduce the overflow of the circuit connection material 5 and reduce the adhesive holes in the adhesive, but cannot eliminate them. In addition, the method of increasing the distance from the pad of the flexible circuit board 1 to the cutting margin will lead to the increase of the screen body 210, which will affect the size of the product.

[0053] Figure 3 is a schematic structural diagram of a display module according to an embodiment of the present application. Figure 4 is a partial structural decomposition diagram of a display module before binding according to an embodiment of the present application. Figure 5 is a partial structural decomposition diagram of another embodiment of the present application before the display module is bound. Figure 6 This is a partial structural decomposition diagram of a display module before binding according to another embodiment of the present application.

[0054] According to an inventive concept of one aspect of the present application, a display module is provided, such as Figures 3 to 6 As shown, the display module includes: a flexible circuit board 1, a display panel 2, a binding pad 3, an isolation structure 4 and a circuit connection material 5. The flexible circuit board 1 is provided with a connection area 101. The display panel 2 is located on one side of the flexible circuit board 1. The display panel 2 includes a binding area 201 and a display area 202. The orthographic projection of the display panel 2 on the flexible circuit board 1 is located in the connection area 101, and the orthographic projection of the flexible circuit board 1 on the display panel 2 is located in the binding area 201. The binding pad 3 is located in the binding area 201. The binding pad 3 is located on the side of the display panel 2 close to the flexible circuit board 1. The isolation structure 4 is located on the side of the binding pad 3 away from the display area 202; in the thickness direction of the display panel, the two ends of the isolation structure 4 abut the display panel 2 and the flexible circuit board 1 respectively. The circuit connection material 5 is arranged between the binding pad 3 and the flexible circuit board 1, and is located on the side of the isolation structure 4 close to the display area 202.

[0055] In this embodiment, an isolation structure 4 for blocking overflow of the circuit connection material 5 is provided in the binding area 201 of the flexible circuit board 1 and the display panel 2 to prevent the overflow from causing holes in the back glue at the overflow location, thereby causing corrosion in the binding area 201.

[0056] According to some embodiments of the present application, the functional layer 220 includes an insulating layer, a flat layer, a packaging layer, a printed circuit board and other functional structural layers. Optionally, the binding pad 3 is located on the printed circuit board. Preferably, the binding pad 3 is located on the top of the functional layer 220 (that is, Figure 4The outermost layer on the side away from the screen body 210 in the top layer is provided to facilitate the connection between the electronic components and the printed circuit board. The pads are located on the top layer to shorten the signal transmission path, thereby reducing signal loss and delay. This is particularly important for the display panel 2 that requires high-speed, low-latency signal transmission.

[0057] According to some embodiments of the present application, the binding area 201 is generally located on the periphery of the display area 202, and one or more binding pads 3 are provided in the binding area 201 for subsequent binding of the driver chip or the flexible circuit board 1 to provide a driving signal for the signal routing in the display area 202. Specifically, the binding pads 3 are coupled to components such as light-emitting devices or touch electrodes inside the display panel 2 through signal leads. These signal leads are responsible for transmitting driving signals and data signals to achieve normal operation of the display panel 2.

[0058] According to some embodiments of the present application, the metal pad is generally made of copper (Cu) or other highly conductive metals, and is tin-plated, gold-plated or subjected to other surface treatments to enhance its solderability and corrosion resistance.

[0059] According to some embodiments of the present application, the circuit connection material 5 is an anisotropic conductive film (ACF).

[0060] According to some embodiments of the present application, Figure 3 As shown in (a), the connection area of ​​the flexible circuit board 1 is provided with a groove 6, and the orthographic projection of the groove 6 on the display panel 2 is located on the side of the isolation structure 4 close to the display area 202, and does not overlap with the orthographic projection of the isolation structure on the display panel.

[0061] In this embodiment, when the circuit connection material 5 is used to bind the connection area 101 and the bonding pad 3, the circuit connection material 5 diffused toward the side close to the adhesive coated area will enter the groove 6, further reducing the risk of adhesive overflow.

[0062] According to some optional embodiments of the present application, such as Figure 3 As shown in (b), the orthographic projection of the groove 6 on the display panel 2 is located between the orthographic projection of the isolation structure 4 on the display panel 2 and the orthographic projection of the binding pad 3 on the display panel 2 .

[0063] In this embodiment, by staggering the groove 3 and the binding pad 3 , the binding effect between the display panel 2 and the flexible circuit board 1 can be improved to avoid being affected by the groove 6 .

[0064] According to some alternative embodiments of the present application, Figure 3As shown in (c), the orthographic projection of the groove 6 on the display panel 2 is located within the orthographic projection of the binding pad 3 on the display panel 2 .

[0065] In this embodiment, by placing the groove 6 within the range of the binding pad 3 (that is, the groove 6 is located in the binding area of ​​the binding pad 3), the binding width can be effectively reduced, the amount of glue used can be reduced, the overall size of the display module can be reduced, and the occupied space can be saved. It should be noted that the binding area occupied by the groove 6 in the binding pad 3 should not affect the binding effect between the display panel 2 and the flexible circuit board 1, and should not affect the transmission of signals and power between the two.

[0066] According to some embodiments of the present application, the isolation structure 4 extends along the boundary line of the binding area 201 away from the display area 202. Optionally, the isolation structure 4 may also extend along the boundary lines on both sides adjacent to the above boundary line to further improve the effect of preventing glue from overflowing.

[0067] According to some embodiments of the present application, Figure 3 As shown in (a) to (c), the circuit connecting material 5 fills the area defined by the isolation structure 4, the groove 6, the binding area 201 and the connection area 101, and the circuit connecting material 5 will not overflow to the side of the isolation structure away from the display area 202, thereby ensuring that the cured circuit connecting material 5 will not affect the subsequent coating operation of the back glue 7.

[0068] According to some embodiments of the present application, preferably, the groove 6 is arranged adjacent to the isolation structure 4 .

[0069] According to some embodiments of the present application, the cross-sectional shape of the groove 6 is rectangular, semicircular, trapezoidal, or arcuate.

[0070] In this embodiment, the cross section refers to the sectioning along the width direction of the groove 6, that is, the section perpendicular to the length or extension direction of the groove 6 (correspondingly, the longitudinal section refers to the section parallel to the length or extension direction of the groove 6), and the groove 6 can be prepared by etching.

[0071] According to some embodiments of the present application, the groove 6 can be prepared by patterning and etching when preparing the flexible circuit board.

[0072] According to some embodiments of the present application, the binding structure further includes adhesive backing, and the adhesive backing 7 is located on a side of the isolation structure 4 away from the display area 202. Preferably, the adhesive backing 7 at least covers a portion of the flexible circuit board 1 outside the connection area 101.

[0073] In this embodiment, the role of the back glue 7 is mainly reflected in two aspects. One aspect is to enhance the connection strength between the flexible circuit board 1 and the display panel 2 to prevent the deformation of the flexible circuit board 1 from causing the two to tear on the side of the binding area 201 close to the isolation structure 4. On the other hand, it is to improve the sealing performance to prevent water vapor, sweat, etc. from invading the binding area 201 in this area and corroding the components inside.

[0074] According to some embodiments of the present application, the adhesive 7 formed by spraying is in strip shape and extends along the boundary of the binding area 201 , thereby enhancing the connection strength and sealing effect between the flexible circuit board 1 and the display panel 2 .

[0075] According to some embodiments of the present application, the material of the back adhesive includes: ultraviolet rays (UV) curing adhesive, thermal curing adhesive, and structural adhesive.

[0076] According to some embodiments of the present application, Figure 4 As shown, the isolation structure 4 is configured to extend from the binding area 201 of the display panel 2 toward the connection area 101 along a direction perpendicular to the plane where the display panel 2 is located.

[0077] In this embodiment, the isolation structure 4 is arranged on the display panel 2. The isolation structure 4 is formed into a structure protruding from the surrounding plane by deposition or etching. During the binding process, the circuit connection material 5 is coated on the binding pad 3 and cured by heat pressing. At this time, the protruding end of the isolation structure 4 is against the flexible circuit board 1, thereby preventing the liquid circuit connection material 5 from overflowing.

[0078] According to some embodiments of the present application, compared with the aforementioned embodiments ( Figure 4 ) is different, such as Figure 5 As shown, the isolation structure 4 is configured to extend from the connection area 101 of the flexible circuit board 1 toward the binding area 201 along a direction perpendicular to the plane where the connection area 101 is located.

[0079] In this embodiment, the isolation structure 4 is arranged on the flexible circuit board 1. The isolation structure 4 is formed into a structure protruding from the surrounding plane by deposition or etching. During the binding process, the circuit connection material 5 is coated on the binding pad 3 and hot-pressed and cured. At this time, the protruding end of the isolation structure 4 is against the display panel 2, thereby preventing the liquid circuit connection material 5 from overflowing.

[0080] According to some embodiments of the present application, compared with the aforementioned embodiments ( Figure 4 , Figure 5 ) is different, such as Figure 6 As shown, the isolation structure 4 is bonded to one of the flexible circuit board 1 and the display panel 2, and abuts against the other one. Preferably, the orthographic projection of the isolation structure 4 on the display panel 3 is a rectangle.

[0081] In this embodiment, the isolation structure 4 is independent of the display panel 2 and the flexible circuit board 1. During the binding process, the isolation structure 4 needs to be pasted on the display panel 2 or the flexible circuit board 1 first, and then the circuit connection material 5 is coated on the binding pad 3 and cured by heat pressing. At this time, one end of the isolation structure 4 is against the display panel 2 or the flexible circuit board 1, and the other end is pasted on the flexible circuit board 1 or the display panel 2, so as to prevent the liquid circuit connection material 5 from overflowing. Compared with the previous two embodiments, the isolation structure is formed by deposition and etching, and the independently set isolation structure 4 is more efficient and has lower cost in combination with the pasting process.

[0082] According to some embodiments of the present application, the flexible circuit board 1 includes: a substrate layer 110, a conductive layer 120 and a protective film layer 130. The conductive layer 120 is located on one side of the substrate layer 110. The protective film layer 130 is located on a side of the conductive layer 120 away from the substrate layer 110, and the protective film layer 130 covers the area outside the connection area 101 on the flexible circuit board 1.

[0083] According to some embodiments of the present application, the substrate layer 110 is the supporting structure of the flexible circuit board 1, which provides the overall shape and stability of the circuit board. Common materials include polyimide (PI) and polyester (PET). PI has high heat resistance and insulation, and is often used in applications with high requirements for heat resistance; PET has low cost, good flexibility and processability, but relatively poor heat resistance, and is mostly used in general consumer electronic products. The conductive layer 120 is commonly copper (CU), and the copper foil layer is used as the conductive layer 120 of the FPC to form the required circuit pattern through an etching process. Copper foil is often electrolytic copper foil and rolled copper foil. Electrolytic copper foil has a low cost and is suitable for applications with low flexibility requirements; rolled copper foil has good ductility and is suitable for scenes requiring high flexibility and high frequency bending. In some special applications, other metals or alloys may be used to replace copper foil to provide better conductivity, corrosion resistance or high temperature resistance. The protective film layer 130 is used to protect the copper foil circuit to avoid external environmental influences (such as moisture, dust, mechanical damage, etc.). It is usually made of the same material as the substrate layer 110, such as polyimide (PI) and polyester (PET). In some applications, other high-performance insulating materials may be used to replace the cover film to improve the overall performance and reliability of the circuit board.

[0084] In addition, flexible circuit boards also include adhesive layers, which are mainly used to bond different layers of materials together to ensure the overall structural stability of the circuit board, such as acrylic and epoxy resins. These two adhesives perform well in terms of heat resistance, chemical resistance, and flexibility. Other types of adhesives or adhesives can also be selected according to application requirements to provide better bonding performance and stability.

[0085] According to some embodiments of the present application, according to actual needs, the flexible circuit board 1 also includes some other layer structures, such as a solder mask, a surface treatment layer, a reinforcement plate, an electromagnetic shielding film, etc., which will not be described in detail here.

[0086] Figure 7 is a process flow chart of binding the display module of the embodiment of the present application, Figure 8 yes Figure 7 The sub-step flow chart of step S2 in the flow chart shown, Fig. 9 yes Figure 7 The sub-step flowchart of step S7 in the flowchart shown.

[0087] According to some embodiments of the present application, Figures 7 to 9 As shown, the binding of the flexible circuit board and the display panel includes steps S1 to S7.

[0088] Step S1: preparation work, including: cleaning the binding area of ​​the display panel and the flexible circuit board, removing oil, dust and other impurities, and checking whether the pads are intact, free of oxidation and damage.

[0089] Step S2: Binding process, binding the connection area and the binding pad. Specifically, Figure 8 As shown, step S2 includes sub-steps S201 to S204.

[0090] Sub-step S201: ACF attachment, tearing the ACF film off the protective film (release film) and attaching it to the pad of the flexible circuit board or display panel, ensuring that the ACF film is flat and free of bubbles and completely covers the pad area.

[0091] Sub-step S202: Alignment and pre-pressing, aligning the flexible circuit board with the display panel, ensuring that the pads correspond correctly to the ACF film, using a pre-pressing device to pre-press the ACF film to make it initially contact with the pads, and expel some bubbles.

[0092] Sub-step S203: Press curing, placing the aligned flexible circuit board and display panel into the press equipment, setting appropriate temperature, time and pressure conditions according to the ACF specifications, starting the press equipment, and allowing the ACF film to cure at a specific temperature and pressure to form a stable conductive connection.

[0093] Sub-step S204: Inspection and testing: Use a microscope or other testing equipment to check whether there are defects such as bubbles and cracks in the ACF binding area, and perform a conductivity test to ensure that the circuit connection between the flexible circuit board and the display panel is normal.

[0094] Step S3: Cleaning: Use a dust-free cloth or a special cleaning agent to clean the area to be sprayed and the surrounding area, and dry them thoroughly to ensure that the area to be sprayed and the surrounding area are clean and free of oil, dust and other impurities.

[0095] Step S4: preparing the adhesive and setting the parameters of the spraying equipment;

[0096] Step S5: Adjust the spraying equipment to the preset parameters and perform adhesive spraying on the adhesive spraying area and the surrounding area. During the spraying process, be careful to prevent the adhesive from flowing into the binding area or overflowing the edge. When spraying, keep a stable distance between the spray gun and the binding area to ensure uniform spraying.

[0097] Step S6: Curing, adjusting the curing equipment parameters, placing the display panel sprayed with adhesive into the curing machine, starting the curing machine, and curing according to the preset parameters. During the curing process, the curing state of the adhesive should be carefully observed to avoid insufficient or excessive curing.

[0098] Step S7: Inspection and testing. Specifically, Fig. 9 As shown, step S7 includes sub-steps S701 to S703.

[0099] Sub-step S701: Appearance inspection: Use a microscope or a magnifying glass to check the spraying quality and curing state of the adhesive to ensure that the adhesive evenly covers the edge of the binding area and is free of defects such as bubbles, cracks, and holes.

[0100] Sub-step S702: Sealing test: perform a sealing test, such as an artificial sweat test, a bubble test, a water pressure test, etc., to ensure that the binding area is well sealed.

[0101] Sub-step S703: electrical performance test, performing a continuity test to ensure that the circuit connection between the flexible circuit board and the display panel is normal.

[0102] According to some embodiments of the present application, in step S2, before the ACF glue is pressed, the conductive particles in the ACF glue are approximately evenly distributed and do not contact each other; when the ACF glue is placed between the binding pad of the display panel and the FPC, and pressure and heating are applied, the ACF glue softens, and the conductive particles begin to flow and evenly distribute; under sufficient pressure, the insulating film of the conductive particles breaks, allowing the particles to form contact with the pads and electrodes on the FPC. Among them, the conductive particles form a stable electrical connection during the pressing process to ensure signal transmission between the display panel and the FPC. Due to the anisotropic conductivity of the ACF glue, adjacent electrodes will not form a short circuit due to the presence of the conductive particles.

[0103] According to some optional embodiments of the present application, in sub-step S203, the FOG (Film On Glass) ACF binding temperature range is 150-205°C. The ACF attachment and pre-pressing time is about 12 seconds, and the main pressing time is generally about 58 seconds. The blasting effect of the conductive particles in the ACF is mainly affected by the pressure, and the blasting pressure is determined by the hardness of the plastic core.

[0104] According to some embodiments of the present application, the display panel may be a flexible display panel or a rigid display panel. The light extraction mode of the display panel may be a bottom light extraction mode or a top light extraction mode.

[0105] According to some embodiments of the present application, the display panel can be applied to any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, an e-book reader, a player, a laptop computer, a car computer, a desktop computer or a set-top box.

[0106] According to some embodiments of the present application, the display panel can be applied to a display device, and the display device can be various electronic display products, specifically including but not limited to at least one of a mobile phone, a tablet computer, an e-book reader, a player, a digital camera, a laptop computer, a car computer, a desktop computer, a set-top box, a smart TV, and a wearable device.

[0107] In addition, according to actual needs, the display device may also include other structures such as a touch panel.

[0108] It should be noted that, for the sake of clarity, not all structures of the above-mentioned display panel and display device are described. To achieve the necessary functions of the display panel or display device, those skilled in the art may set other structures according to specific application scenarios.

[0109] Fig.10 It is a schematic diagram of the planar structure of the display device provided in an embodiment of the present application.

[0110] According to another aspect of the invention of the present application, a display device is provided, comprising the display module as described in the above embodiment. The display device 100 comprises the display panel 2 as described in any one of the above embodiments.

[0111] The display device 100 provided in this embodiment can be a mobile phone, a notebook, a tablet computer, a smart watch, a smart bracelet, a navigator, a display, a personal digital assistant (PDA), and other products or components with display functions.

[0112] Since the display device 100 has the above-mentioned display panel 2 , the display device 100 at least includes the beneficial effects of any one or several of the above-mentioned display panels 2 . The specific effects are described above and will not be repeated here.

[0113] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display module, characterized in that: include: A flexible circuit board is provided with a connection area; A display panel is located on one side of the flexible circuit board, the display panel includes a binding area and a display area, the orthographic projection of the display panel on the flexible circuit board is located in the connection area, and the orthographic projection of the flexible circuit board on the display panel is located in the binding area; A binding pad, located in the binding area, and the binding pad is located on a side of the display panel close to the flexible circuit board; An isolation structure is located on a side of the binding pad away from the display area; in the thickness direction of the display panel, two ends of the isolation structure abut against the display panel and the flexible circuit board respectively; The circuit connection material is arranged between the binding pad and the flexible circuit board and is located on a side of the isolation structure close to the display area.

2. The display module according to claim 1, characterized in that: The connection area of ​​the flexible circuit board is provided with a groove, the orthographic projection of the groove on the display panel is located on a side of the isolation structure close to the display area, and does not overlap with the orthographic projection of the isolation structure on the display panel; Preferably, the orthographic projection of the groove on the display panel is located between the orthographic projection of the isolation structure on the display panel and the orthographic projection of the binding pad on the display panel; Alternatively, the orthographic projection of the groove on the display panel is located within the orthographic projection of the binding pad on the display panel.

3. The display module according to claim 2, characterized in that: The circuit connection material fills a region defined by the isolation structure, the groove, the bonding region, and the connection region.

4. The display module according to claim 2, characterized in that: The cross-sectional shape of the groove is rectangular, semicircular, trapezoidal or arcuate.

5. The display module according to any one of claims 1 to 4, characterized in that: The display module also includes: A back glue, located on a side of the isolation structure away from the display area; Preferably, the adhesive backing at least covers a portion of the area outside the connection area on the flexible circuit board.

6. The display module according to claim 4, characterized in that: The back adhesive includes: ultraviolet curing adhesive, thermal curing adhesive, and structural adhesive.

7. The display module according to claim 1, characterized in that: The isolation structure extends from the binding area of ​​the display panel toward the connection area along a direction perpendicular to the plane where the display panel is located.

8. The display module according to claim 1, characterized in that: The isolation structure is bonded to one of the flexible circuit board and the display panel, and abuts against the other one; Preferably, the orthographic projection of the isolation structure on the display panel is a rectangle.

9. The display module according to claim 1, characterized in that: The flexible circuit board comprises: substrate layer; A conductive layer, located on one side of the substrate layer; A protective film layer, located on a side of the conductive layer away from the substrate layer, the protective film layer covering an area outside the connection area on the flexible circuit board; Preferably, the material of the protective film includes polyimide and polyester.

10. A display device, characterized in that: It comprises the display module as claimed in any one of claims 1 to 9.

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