Wafer cutting edge rolling brush, cleaning device, cutting equipment and wafer cleaning method

Abstract

The invention provides a wafer cutting edge rolling brush, a cleaning device, cutting equipment and a wafer cleaning method. The wafer cutting edge rolling brush comprises a core cylinder and a brush body, the brush body is fixedly connected to the core cylinder in a sleeved mode, a first end of the brush body comprises an umbrella-shaped structure, and the umbrella-shaped structure is constructed to obliquely extend outwards from the inner circumferential side of the brush body and the axial direction of the brush body in an angle mode and is suitable for cleaning the wafer cutting edge. According to the invention, full-coverage cleaning treatment can be carried out on pollutants in a dead angle space at the inner side of a wafer cutting mark.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology; specifically, the present invention relates to a wafer dicing edge rolling brush, a cleaning device and method, and a wafer dicing equipment. Background Art

[0002] Wafer edge cutting is a key step in the semiconductor manufacturing process. By removing the stress on the wafer edge, the edge damage is prevented, which facilitates the subsequent back thinning process and prevents the wafer from having a blade-like edge. When cutting the edge of the wafer, the high-speed rotating spindle cutter accurately cuts the edge of the wafer. After the edge of the wafer is cut, a large amount of mud-like contaminants will be splashed on its surface (see Figure 1 ). The muddy contaminants on the inner side of the wafer dicing edge are difficult to be removed by conventional cleaning equipment, resulting in unqualified contaminant detection. Conventional cleaning roller brush 31 (see Figure 2 ) During the wafer cleaning process, the cylindrical shape cannot cover the dead corner inside the cutting edge during the deformation process, resulting in muddy contaminants that are difficult to be removed by conventional cleaning roller brushes 31. Summary of the invention

[0003] In view of this, the present invention provides a wafer dicing edge roller brush, a cleaning device, a dicing equipment and a wafer cleaning method, so as to solve or at least alleviate one or more of the above-mentioned problems or other problems existing in the prior art.

[0004] In order to achieve the aforementioned objectives, the first aspect of the present invention provides a wafer scribing edge roller brush, wherein the roller brush comprises a core tube and a brush body, the brush body is fixedly sleeved on the core tube, the first end of the brush body comprises an umbrella-shaped structure, the umbrella-shaped structure is configured to extend outwardly from the inner peripheral side of the brush body at an angle to the axial direction of the brush body, and is suitable for cleaning the wafer scribing edge.

[0005] In the wafer scribing edge roller brush as described above, optionally, the first end of the brush body includes a plurality of the umbrella-shaped structures arranged axially in succession, and there is a gap between the outer peripheries of adjacent umbrella-shaped structures, and the gap forms an annular groove.

[0006] In the wafer scribing edge rolling brush as described above, optionally, the second end of the brush body is cylindrical, and the outer diameter at the second end is between the inner diameter of the annular groove and the outer diameter of the umbrella structure.

[0007] In the wafer scribing edge rolling brush as described above, optionally, the axial length of the brush body is greater than the width of the wafer scribing edge to ensure that the wafer scribing edge can be effectively cleaned.

[0008] In the wafer cutting edge roller brush as described above, optionally, a hollow flow channel for circulating liquid is formed inside the core tube, brush body moisturizing holes penetrating the peripheral wall are distributed on the peripheral wall of the core tube, the brush body covers the brush body moisturizing holes, and the brush body moisturizing holes are configured to guide the liquid in the hollow flow channel to the brush body to moisturize and clean the brush body.

[0009] In the wafer cutting edge roller brush as described above, optionally, the first end of the core barrel facing the wafer to be cleaned during use is surrounded by the brush body, and the second end of the core barrel facing away from the wafer to be cleaned during use is configured to connect to a liquid supply device.

[0010] In the wafer cutting edge roller brush as described above, optionally, the first end of the core barrel is connected to a spray pipe in a relatively rotatable manner, the spray pipe is connected to the hollow flow channel fluid, and the side wall of the spray pipe is provided with a plurality of spray holes, which are suitable for oblique spraying of the wafer cutting edge.

[0011] In the wafer scribing edge rolling brush as described above, optionally, the spray hole is inclined toward the umbrella-shaped structure, so that the liquid sprayed from the spray hole washes the wafer scribing edge from inside to outside along the radial direction of the wafer.

[0012] In the wafer scribing edge rolling brush as described above, optionally, the rolling brush further comprises:

[0013] A brush body plug, the brush body plug is located at the end surface of the first end of the core barrel and is sleeved on the spray pipe to prevent fluid from leaking from the end surface of the first end of the core barrel;

[0014] A sealing ring is located at the first end of the core barrel and is used to form a fluid seal between the spray pipe and the core barrel.

[0015] In order to achieve the aforementioned objective, a second aspect of the present invention provides a wafer cleaning device, wherein the wafer cleaning device has a wafer scribing edge roller brush as described in any one of the aforementioned first aspects.

[0016] In the wafer cleaning device as described above, optionally, the wafer cleaning device further comprises an air jet assembly having an air jet hole for spraying air toward the cut edge of the wafer to remove water stains remaining after the cut edge of the wafer is cleaned by a roller brush.

[0017] In the wafer cleaning device as described above, optionally, the spray pipe is located between the jet assembly and the core barrel.

[0018] In the wafer cleaning device as described above, optionally, the gas injection assembly includes an air guide pipe, the air guide pipe has an air inlet end and a blind end, and the gas injection hole is located at the blind end of the air guide pipe.

[0019] In the wafer cleaning device as described above, optionally, the wafer cleaning device further comprises an air pipe fixing bracket, and the air guide pipe is fixed to the wafer cutting edge roller brush through the air pipe fixing bracket.

[0020] In the wafer cleaning device as described above, optionally, the air pipe fixing bracket has an air pipe holding part, a first supporting part and a second supporting part, the air pipe holding part holds the air pipe through an air pipe fixing clamp, the first supporting part is fixedly connected to the blind end of the spray pipe, and the second supporting part is connected to the second end of the core barrel.

[0021] In the wafer cleaning device as described above, optionally, a float is provided in the blind end of the air duct, and the float is connected to the end wall of the blind end of the air duct through a spring. The float can move back and forth on both sides of the air jet hole under the thrust of the spring and the intake pressure of the air duct, thereby repeatedly generating shock waves to remove water stains through fluctuating negative pressure.

[0022] In order to achieve the above-mentioned object, a third aspect of the present invention provides a wafer dicing device, wherein the wafer dicing device comprises:

[0023] A dicing module, which is used to remove stress from the edge of the wafer to prevent damage to the edge of the wafer;

[0024] A transmission module, the transmission module is used to move the wafer from the dicing module to the cleaning module;

[0025] A cleaning module, the cleaning module comprising a back cleaning device, a front cleaning device and a wafer cleaning device as described in any one of the second aspects above, wherein the back cleaning device is used to clean the back of the wafer to remove contaminants on the back, and the front cleaning device is used to clean the front of the wafer to ensure that the cleanliness of the front meets the process requirements;

[0026] The gas-liquid circuit module comprises a gas circuit and a liquid circuit, wherein the gas circuit is connected to the gas supply device for conveying and controlling gas, and the liquid circuit is connected to the liquid supply device for conveying and controlling liquid.

[0027] In order to achieve the aforementioned object, a fourth aspect of the present invention provides a wafer cleaning method, which uses a wafer cleaning device as described in any one of the aforementioned second aspects to clean a wafer cut edge, wherein the method comprises the following steps:

[0028] Step I: Open the liquid supply device, spray the liquid to moisturize the brush body of the wafer scribing edge roller brush through the brush body moisturizing hole, and spray the wafer scribing edge obliquely through the spray hole;

[0029] Step II: controlling the rotation of the brush body to move the wafer cleaning device toward the wafer cutting edge, so that the umbrella-shaped structure of the brush body cleans the wafer cutting edge;

[0030] Step III: Move the wafer cleaning device away from the wafer cutting edge, spray liquid on the brush body of the roller brush structure through the brush body moisturizing hole to clean the brush body, and spray the wafer cutting edge obliquely through the spray hole to flush away residual stains;

[0031] Step IV: closing the liquid supply device, opening the gas supply device, allowing continuous gas to flow into the gas duct, and the continuous gas generates the shock wave through the gas jet hole to remove the water stains attached to the cut edge of the wafer;

[0032] Step V: Stop the rotation of the brush body and close the air supply device.

[0033] The wafer cutting edge roller brush of the present invention adopts a special brush body, the end of which is an umbrella-shaped structure. During the process, it can cover the dead corner space inside the cut, and fully cover and clean the pollutants in the dead corner space inside the cut, thereby achieving the cleaning effect of the dead corner space inside the cut. At the same time, the brush body has a self-cleaning function to prevent secondary pollution.

[0034] In a further optional technical solution, the present invention also repeatedly generates shock waves through a special jet assembly. The shock wave passes quickly on the surface of the wafer, and when passing the inner side of the cut, the cut and the surface drop will form an air pressure difference and produce a weak impact, causing an upward fluctuating negative pressure at the dead corner of the cut, thereby taking away the water stains attached to the dead corner of the cut, so as to achieve the effect of completely removing the dead corner water stains and drying. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The disclosure of the present invention will become more apparent with reference to the accompanying drawings. It should be understood that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In the drawings:

[0036] Figure 1 and Figure 2 It is a schematic diagram of a conventional cleaning roller brush cleaning a wafer;

[0037] Figure 3 It is a structural schematic diagram of an embodiment of a wafer scribing edge roller brush of the present invention;

[0038] Figure 4It is a structural schematic diagram of an embodiment of a wafer cleaning device of the present invention;

[0039] Figure 5 and Figure 6 yes Figure 4 Demonstration diagram of the spring action of the jet assembly of the wafer cleaning device;

[0040] Figure 7 yes Figure 4 A demonstration diagram of the jet assembly of the wafer cleaning device;

[0041] Figure 8 is a schematic diagram of an embodiment of a wafer dicing device of the present invention;

[0042] Fig. 9 It is a schematic flow chart of a method for cleaning a wafer scribe edge using the wafer cleaning device of the present invention;

[0043] Figures 10 to 14 It is a schematic diagram of a method for cleaning a wafer cut edge using the wafer cleaning device of the present invention.

[0044] Figure numerals: 1-trachea cover; 2-spring; 201-stretch spring; 202-compression spring; 3-float; 4-connecting sleeve; 5-water pipe cover; 6-water pipe plug; 7-spray pipe; 701-spray hole; 8-brush body plug; 9-sealing ring; 10-brush body; 1001-umbrella structure; 1002-brush body moisturizing hole; 1003-annular groove; 11-brush body tail sleeve; 12-fixing ring; 13-bearing; 14-shaft sleeve ring; 15-water pipe fixed joint; 1 6-trachea fixing clamp; 17-trachea fixing bracket; 1701-first supporting part; 1702-second supporting part; 1703 trachea holding part; 18-air guide tube; 1801-jet hole; 19-trachea fixing joint; 20-continuous gas; 21-shock wave; 22-negative pressure area; 23-core tube; 24-wafer; 25-roller; 26; waterproof box; 27-gas path; 28-liquid path; 29-wafer cleaning device; 30-wafer cutting edge; 31-conventional cleaning roller brush. DETAILED DESCRIPTION

[0045] With reference to the accompanying drawings and specific embodiments, the wafer dicing edge brush, cleaning device and method, structure, composition, characteristics and advantages of the wafer dicing equipment of the present invention will be described below in an illustrative manner. However, all descriptions should not be used to form any limitations on the present invention.

[0046] For any single technical feature described or implied in the embodiments mentioned in this document, or any single technical feature displayed or implied in the accompanying drawings, the present invention still allows any combination or deletion between these technical features (or their equivalents) without any technical obstacles, and thus it should be considered that these more embodiments according to the present invention are also within the scope of the description of this document.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

[0048] Figure 3 It is a structural schematic diagram of an embodiment of the wafer scribing edge roller brush of the present invention.

[0049] like Figure 3 As shown, the roller brush includes a core barrel 23 and a brush body 10. The brush body 10 is fixedly sleeved on the core barrel, and the first end of the brush body 10 includes an umbrella structure 1001, which extends outward from the inner peripheral side of the brush body 10 at an angle to the axial direction of the brush body 10, and is suitable for fully cleaning the wafer dicing edge 30 (see Fig.10 ), covering a wider area during cleaning. In an optional embodiment, the first end of the brush body 10 includes a plurality of umbrella structures 1001, which are arranged in succession along the axial direction of the brush body 10, and there are gaps between the outer peripheries of adjacent umbrella structures 1001, and the gaps form an annular groove 1003. This implementation method helps to increase the contact between the brush body 10 and the wafer 24 (see Fig.10 ) contact surface area and better adapt to the shape of the cut edge of the wafer 24, thereby improving the cleaning efficiency. The number of umbrella structures 1001 is not limited and can be set according to the actual needs. In an optional embodiment, the axial length of the brush body 10 is greater than the width of the cut edge of the wafer 24, so that the brush body 10 can completely cover the cut edge of the wafer 24 to effectively clean all parts of the cut edge of the wafer 24, including the hard-to-reach corners. In different embodiments, the material type of the brush body 10 is not limited, and soft, elastic and water-absorbent materials such as polyvinyl alcohol all fall within the protection scope of the present invention. The second end of the brush body 10 is cylindrical, and the outer diameter at the second end is between the outer diameter of the annular groove 1003 and the outer diameter of the umbrella structure 1001.

[0050] A hollow flow channel is formed inside the core barrel 23 for circulating fluid. Brush body moisturizing holes 1002 are distributed on the peripheral wall of the core barrel 23 and penetrate the peripheral wall. The brush body moisturizing holes 1002 can spray liquid to the brush body 10 to keep the brush body 10 moist, thereby more effectively cleaning the wafer 24. The number of brush body moisturizing holes 1002 is not limited and can be set according to actual conditions. The brush body 10 covers the brush body moisturizing holes 1002, so that the brush body moisturizing holes 1002 can guide the liquid in the hollow flow channel to the brush body 10, thereby moisturizing and cleaning the brush body 10.

[0051] exist Figure 3 In the example, the first end of the core barrel 23 is surrounded by the brush body 10. When the wafer cleaning device 29 cleans the wafer 24, the first end of the core barrel 23 faces the wafer 24 to be cleaned, and the second end of the core barrel 23 faces away from the wafer 24 to be cleaned. The second end of the core barrel 23 is configured to connect to the liquid supply device. During the cleaning process, the core barrel 23 can stably support and guide the liquid. The first end of the core barrel 23 is connected to the spray pipe 7 in a relatively rotatable manner. The end of the spray pipe 7 is a blind end. The spray pipe 7 is in fluid communication with the central control channel. The end of the spray pipe 7 is closed and not directly connected to the external environment to prevent liquid from leaking from the end. The side wall of the spray pipe 7 is provided with a plurality of spray holes 701, which are suitable for oblique spraying of the wafer cutting edge 30. The second end of the core barrel 23 is used to connect the water pipe fixing joint 15, and the water pipe fixing joint 15 is used to connect the liquid supply device to ensure a continuous supply of liquid during the cleaning process. The number of spray holes 701 is not limited and can be set according to actual conditions. In an optional embodiment, the type of the spray pipe is not limited, and various types of spray pipes including polypropylene pipes, steel pipes, polyethylene pipes, etc. fall within the protection scope of the present invention. The selection of the spray pipe 7 is determined based on actual needs and environmental conditions.

[0052] exist Figure 3 In the embodiment, the spray hole 701 is inclined toward the umbrella structure 1001, so that the liquid sprayed from the spray hole 701 is sprayed in front of the umbrella structure 1001, and the wafer dicing edge 30 is washed from the inside to the outside along the radial direction of the wafer 24 to achieve more effective cleaning. Figure 1In the example, the water path of the roller brush includes a brush body moisturizing hole 1002 and a spray hole 701. The brush body moisturizing hole 1002 is used to spray liquid to moisturize the brush body 10 of the roller brush structure, maintain the shape of the brush body 10, and self-clean the surface of the brush body 10 to prevent the brush body 10 from accumulating dirt due to long-term use; the spray hole 701 runs through the side wall of the spray pipe 7, and is used to perform an inclined spray on the dead corner space inside the dicing edge, weaken the microstructural strength of the pollutants at the dead corner inside the dicing edge, and make the pollutants easier to be cleaned by the brush body 10. The advantage of this embodiment is that the inclined spray angle can better cover various parts of the wafer dicing edge 30, and the inclined spray can generate a certain impact force to help flush the pollutants on the wafer dicing edge 30, so as to achieve efficient cleaning of the wafer dicing edge 30. At the same time, the brush body moisturizing hole 1002 sprays liquid on the brush body 10 for moisturizing and self-cleaning, thereby improving the efficiency and effect of the cleaning process.

[0053] like Figure 3 As shown, a bearing 13, a fixing ring 12 and a shaft sleeve ring 14 can also be provided at the connection between the second end of the core barrel 23 and the water pipe fixing joint 15. The bearing 13 is used to support the brush body 10 to rotate around the axis, the fixing ring 12 is used to fix the inner ring of the bearing 13, and the shaft sleeve ring 14 is used to fix the outer ring of the bearing 13. The shaft sleeve ring 14 and the fixing ring 12 ensure that the bearing 13 remains stable during the rotation process. The rotational driving force of the brush body 10 connected to the core barrel 23 can be provided by a motor or realized by other mechanical devices. The bearing 13 can be a ceramic bearing 13, which has high hardness, low friction coefficient and good wear resistance, so the ceramic bearing 13 can provide low-friction support and the ceramic material makes the bearing 13 perform better in high temperature or corrosive environment. In an optional embodiment, the type of bearing 13 is not limited. In addition to the aforementioned ceramic bearings, other bearings 13 such as steel bearings that can be used to support the rotation of the brush body 10 all fall within the protection scope of the present invention. In an optional embodiment, the wafer cutting edge roller brush can rotate when working.

[0054] exist Figure 3 In the embodiment, the wafer scribing edge roller brush further includes a brush body plug 8 and a sealing ring 9. The brush body plug 8 is located at the end face of the first end of the core barrel 23 and is sleeved on the spray pipe 7, which is used to prevent the fluid from leaking from the end face of the first end of the core barrel 23. The brush body plug 8 ensures that the fluid can be effectively guided from the core barrel 23 to the spray pipe 7; the sealing ring 9 is located at the first end of the core barrel 23, which is used to form a fluid seal between the spray pipe 7 and the core barrel 23. The brush body plug 8 and the sealing ring 9 jointly ensure the sealing of the wafer scribing edge roller brush and the effective transmission of the fluid, thereby improving the cleaning efficiency of the wafer scribing edge roller brush and the cleaning device of the wafer 24.

[0055] Figure 4 It is a schematic structural diagram of an embodiment of a wafer cleaning device of the present invention.

[0056] like Figure 4 As shown, the wafer cleaning device 29 includes a wafer scribing edge rolling brush and an air jet assembly and an air pipe fixing bracket connecting the air jet assembly and the wafer scribing edge rolling brush.

[0057] In the figure, the jet assembly has a jet hole 1801 for spraying air toward the wafer cutting edge 30 to remove the water stains remaining after the wafer cutting edge is cleaned by a roller brush. The spray pipe 7 is located between the jet assembly and the core barrel 23. In an optional embodiment, the core barrel 23, the spray pipe 7 and the jet assembly can be axially aligned. The advantage of this arrangement is that the axial alignment helps to ensure the overall coordination and stability of the wafer cleaning device 29, and can make the flow of fluid in the system smoother. The jet assembly includes an air duct 18, which has an air inlet end and a blind end. The jet hole 1801 is located at the blind end of the air duct 18. The main function of the air duct 18 is to transport the gas from the air inlet end to the jet hole 1801. The blind end of the air duct 18 is closed with an air duct cover 1 so that the gas can only be discharged from the jet hole 1801, ensuring that the gas will not leak from other positions, thereby ensuring the directionality and stability of the gas ejection. The wafer cleaning device 29 further has an air pipe fixing bracket 24, and the air pipe 18 is fixed to the wafer cutting edge roller brush through the air pipe fixing bracket 24. The air pipe fixing bracket 24 has an air pipe holding portion 1703, a first support portion 1701 and a second support portion 1702. The air pipe holding portion 1703 holds the air pipe 18 through an air pipe fixing clamp 16 to ensure that the air pipe 18 does not move during operation. The first support portion 1701 is fixedly connected to the blind end of the spray pipe 7, and the second support portion 1702 is connected to the second end of the core barrel 23. The first support portion 1701 and the second support portion 1702 provide support for the air pipe 18 to ensure that the air pipe 18 remains stable during operation. In an optional embodiment, the type of the air pipe fixing bracket 24 is not limited, and can be made of metal or plastic. Stability and durability need to be considered during design to withstand the force and vibration generated when the equipment is running. The air pipe fixing clamp 16 is a clamp used to fix the air pipe on the air pipe fixing bracket 24. The fixing clip may be a spring clip, a buckle or other types of fasteners, and its purpose is to ensure that the air pipe does not loosen or fall off during the operation of the equipment. The jet assembly may also include an air pipe fixing joint 19 and a connecting sleeve 4, wherein the air pipe fixing joint 19 is used to connect the air supply device, and the air supply device can provide continuous gas 20, which refers to continuous and uninterrupted gas; the connecting sleeve 4 is sleeved on the corner of the air guide pipe 18 to enhance the sealing and fixation of the air guide pipe 18.

[0058] exist Figure 4In the example, the blind end of the spray pipe 7 is connected to the water pipe plug 6, which is used to plug the spray pipe 7 to prevent fluid leakage. One end of the water pipe plug 6 is connected to the blind end of the spray pipe 7, and the other end is connected to the water pipe cover 5, which is used to close the spray pipe 7 to prevent fluid leakage.

[0059] In an optional embodiment, a float 3 is provided in the blind end of the air duct 18. The float 3 is connected to the end wall of the blind end of the air duct 18 through a spring 2. The float 3 can move back and forth on both sides of the jet hole 1801 under the thrust of the spring 2 and the intake pressure of the air duct 18. Such a regular cycle is repeated, so that the gas ejected from the air duct 18 generates a weak shock wave, which generates a fluctuating negative pressure at the cutting edge of the wafer, thereby removing water stains.

[0060] Figure 5 and Figure 6 yes Figure 4 Demonstration diagram of the spring action of the jet assembly in the wafer cleaning device.

[0061] like Figure 5 and Figure 6 As shown, the position change of the float 3 is controlled by the continuous gas 20 provided by the gas supply device (not shown) and the force of the spring 2, and its principle includes:

[0062] like Figure 5 As shown, when the float 3 is not subjected to the pressure of the continuous gas 20 and the thrust of the spring 2, the float 3 is located at the end wall side of the air jet hole 1801 away from the blind end of the air guide tube 18. At this time, the float 3 is located at the initial position, and the air jet hole 1801 has no shock wave 21 generated. At this time, the spring 2 is an extended spring 201.

[0063] The gas supply device is turned on, and the continuous gas 20 is introduced. The continuous gas 20 begins to flow through the air guide tube 18. The continuous gas 20 acts on the float 3, causing the spring 2 to be compressed. As the pressure of the continuous gas 20 increases, the float 3 overcomes the thrust of the compressed spring 202 and moves toward the end wall side of the blind end of the air guide tube 18, until the float 3 passes over the air jet hole 1801. The float 3 is located at the end wall side of the air jet hole 1801 close to the blind end of the air guide tube 18;

[0064] like Figure 6 As shown, after the float 3 passes over the jet hole 1801, the continuous gas 20 ejects a shock wave 21 through the jet hole 1801, and at the same time, the pressure of the continuous gas 20 on the float 3 is weakened. Under the thrust of the compression spring 202, the float 3 moves toward the end wall away from the blind end of the air guide tube 18 until the float 3 passes over the jet hole 1801, and the float 3 is located on the side of the end wall of the jet hole 1801 away from the blind end of the air guide tube 18;

[0065] The float 3 passes over the air guide tube 18 and the continuous gas 20 does not pass through the jet hole 1801. At the same time, the pressure of the continuous gas 20 on the float 3 gradually increases. The float 3 overcomes the thrust of the compression spring 202 and moves toward the end wall of the blind end of the air guide tube 18.

[0066] This process is repeated over and over again, and the float 3 moves back and forth on both sides of the jet hole 1801 , so that the continuous gas 20 passes through the jet hole 1801 and repeatedly generates shock waves 21 .

[0067] Figure 7 yes Figure 4 Illustration of the jet assembly of the wafer cleaning device.

[0068] like Figure 7 As shown, when the gas supply device is turned on, the continuous gas 20 flows through the air guide tube 18, and the float 3 moves back and forth on both sides of the gas jet hole 1801 under the thrust of the spring 2 and the pressure of the continuous gas 20, so that the gas jet hole 1801 can repeatedly generate shock waves 21. When the shock wave 21 passes through the inner side of the cut edge of the surface of the wafer 24, due to the drop between the cut edge and the surface of the wafer 24, this drop area will form an air pressure difference. This air pressure difference is due to the increase in the speed of the air flow when passing through a narrow or uneven surface. According to the Bernoulli principle, the increase in flow rate leads to a decrease in pressure, thereby forming a negative pressure area 22 at the dead corner of the cut edge, and an upward fluctuating negative pressure will be generated at the wafer cut edge 30, thereby taking away the water stains attached to the wafer cut edge 30. It can be understood that negative pressure refers to a pressure state where the pressure is lower than the surrounding environment. The fluctuating negative pressure generated by the shock wave 21 can gently and efficiently remove the water stains attached to the wafer cut edge 30 without losing the wafer 24. While the water stains are being removed, the shock wave 21 can also quickly take away the liquid vapor after the liquid evaporates, preventing the water stains from re-condensing on the surface of the wafer 24 , which helps to quickly dry the surface of the wafer 24 .

[0069] Figure 8 Schematic diagram of an embodiment of a wafer dicing device of the present invention.

[0070] The wafer dicing equipment includes a dicing module (not shown in the figure), a transmission module (not shown in the figure), a cleaning module, and a gas-liquid path module. The dicing module is used to remove edge stress of the wafer 24 to prevent damage to the edge of the wafer 24; the transmission module is used to move the wafer 24 from the dicing module to the cleaning module; the cleaning module includes a back cleaning device (not shown in the figure), a front cleaning device (not shown in the figure), and a wafer cleaning device 29, wherein the back cleaning device is used to clean the back of the wafer 24 to remove contaminants on the back, and the front cleaning device is used to clean the front of the wafer 24 to ensure that the cleanliness of the front meets the process requirements; the gas-liquid path module, the gas-liquid path module includes a gas path and a liquid path, the gas path 27 is connected to the gas supply device, and the gas is transported and controlled by the gas path 27, and the liquid path 28 is connected to the liquid supply device, and the liquid is transported and controlled by the liquid path 28.

[0071] Figure 8 The wafer 24 after dicing is shown. The wafer 24 is against the roller 25. The roller 25 rotates to drive the wafer 24 to rotate. One end of the wafer cleaning device 29 is close to the wafer 24 and the other end is connected to the gas path 27 and the liquid path 28. Figure 7 In the embodiment, the four rollers 25 rotate in the opposite direction to the wafer 24, and the rollers 25 rotate clockwise to drive the wafer 24 to rotate counterclockwise. In an optional embodiment, the number of rollers 25 is not limited, and the rotation direction can be counterclockwise or clockwise, and accordingly, the rotation direction of the wafer 24 can be clockwise or counterclockwise. During the cleaning process of the wafer 24, the back cleaning device can clean the back of the wafer 24 and the wafer cleaning device 29 can clean the wafer 24 at the same time or separately, and then the front cleaning device can be used to clean the front of the wafer 24. During the cleaning process, a two-fluid of carbon dioxide and water can be used as a liquid for cleaning the wafer 24. Carbon dioxide forms carbonic acid in water, which has a certain acidity and can react chemically with various pollutants such as metal ions and organic matter on the surface of the wafer 24. Water can dissolve and rinse off these reacted compounds, thereby cleaning the wafer 24 more thoroughly. Compared with some traditional strong corrosive cleaning agents, the two-fluid formed by carbon dioxide and water is relatively mild and environmentally friendly, and can be easily rinsed clean without leaving a large amount of chemical residue on the surface of the wafer 24.

[0072] The wafer 24 can be rotated by the rotation of the roller 25, so that the back cleaning device, the front cleaning device, and the wafer cleaning device 29 of the cleaning module can fully clean the entire wafer 24 and its edges. After the wafer 24 is cleaned, the nitrogen can be transported by the gas supply device to remove the water stains while the wafer 24 is rotated and dried to remove the moisture on the surface of the wafer 24, so that the wafer 24 reaches a dry state in a short time. The advantage of this embodiment is that nitrogen, as an inert gas, will not chemically react with the wafer 24, thereby ensuring the stability and quality of the wafer 24. Figure 7 As shown, the wafer dicing equipment may further include a waterproof box 26, which can provide a relatively closed environment for the cleaning process of the wafer 24 to prevent gas and liquid from splashing to the outside, while also protecting operators and the surrounding environment.

[0073] Fig. 9 The present invention is a schematic flow chart of a method for cleaning a wafer scribe edge using the wafer cleaning device of the present invention.

[0074] like Fig. 9 As shown, the method for cleaning the wafer dicing edge using the wafer cleaning device of the present invention comprises the following steps:

[0075] Step I: Turn on the liquid supply device, spray the liquid on the brush body of the wafer scribing edge roller brush through the brush body moisturizing hole to moisturize the brush body, and spray the wafer scribing edge obliquely through the spray hole;

[0076] Step II: Control the rotation of the brush body to move the wafer cleaning device toward the wafer cutting edge, and the umbrella-shaped structure of the brush body cleans the wafer cutting edge;

[0077] Step III: Move the wafer cleaning device away from the wafer cutting edge, spray the liquid to the brush body of the roller brush structure through the brush body moisturizing hole to clean the brush body, and spray the wafer cutting edge obliquely through the spray hole to flush away residual stains;

[0078] Step IV: close the liquid supply device, open the gas supply device, and allow continuous gas to flow into the gas pipe. The continuous gas generates shock waves through the gas jet holes to remove water stains attached to the wafer dicing edge;

[0079] Step V: Stop the brush body from rotating and turn off the air supply.

[0080] Figures 10 to 14 It is a schematic diagram of a method for cleaning a wafer cut edge using the wafer cleaning device of the present invention.

[0081] like Figures 10 to 14 As shown, the method for using the wafer cleaning device 29 of the present invention includes the following steps:

[0082] like Fig.10 As shown, in step I, the liquid supply device is turned on, and the liquid is sprayed on the brush body 10 through the brush body moisturizing hole 1002 on the core barrel 23 to keep the brush body 10 moist, prevent the brush body 10 from being too dry during the cleaning process, and reduce the risk of the brush body 10 damaging the wafer 24. At the same time, the liquid in the spray pipe 7 is sprayed on the cut edge of the wafer 24 through the spray hole 701. This inclined spraying method helps to soften the stains that may be attached to the edge, preparing for subsequent cleaning work.

[0083] like Fig.11As shown, in step II, after the brush body 10 is moisturized by spraying liquid and the wafer cut edge 30 is sprayed, the brush body 10 is controlled to rotate so that the brush body 10 can evenly contact the edge of the wafer 24 to improve the cleaning efficiency. The wafer cleaning device 29 moves toward the wafer cut edge 30, so that the umbrella structure 1001 of the brush body 10 can contact the wafer cut edge 30, and the umbrella structure 1001 compresses and fills the edge space, ensuring that the brush body 10 can closely fit the wafer cut edge 30 for effective cleaning.

[0084] like Fig.12 As shown, in step III, after completing the cleaning of the space of the wafer cutting edge 30, the wafer cleaning device 29 moves away from the wafer cutting edge and leaves the edge of the wafer 24. In order to clean the brush body 10, liquid is sprayed on the brush body 10 through the brush body moisturizing hole 1002 to clean the stains and residues on the brush body 10. At the same time, liquid is sprayed on the wafer cutting edge 30 through the spray hole 701 to flush away possible residual stains, thereby ensuring the cleanliness of the wafer cutting edge 30.

[0085] like Fig.13 As shown, in step IV, the liquid supply device is closed, and the gas supply device is opened. The air guide tube 18 acts on the float 3 through the continuous gas 20 to make the float 3 move back and forth on both sides of the gas jet hole 1801, so that the continuous gas 20 repeatedly shocks the wave 21 through the gas jet hole 1801. When the shock wave 21 passes through the inner side of the wafer cutting edge 30, the difference in pressure with the surface of the wafer 24 will form a weak impact, causing an upward fluctuating negative pressure at the dead corner of the cut, thereby taking away the water stains attached to the dead corner of the cut.

[0086] like Fig.14 As shown, in step V, after the wafer dicing edge 30 is cleaned, the gas supply device is turned off. At this time, the spring 2 returns to the extended state 202.

[0087] The technical solution of the present invention is suitable for cleaning the cut edge of the wafer 24 after the cutting process, and can prevent the cut edge of the wafer 24 from being contaminated by mud after the cutting process.

[0088] Some technical solutions of the present invention achieve the effect of conventional cleaning that cannot be thoroughly cleaned by the scribe process through a roller brush and an air jet assembly with a specific structure. The roller brush of the present invention can cover the dead corner space inside the cut in the process engineering, and fully cover and clean the pollutants in the dead corner space inside the cut, so as to achieve the cleaning effect of the dead corner space inside the cut.

[0089] In a further technical solution of the present invention, the brush body of the wafer cutting edge roller brush has a self-cleaning function, which can prevent secondary contamination.

[0090] In a further technical solution of the present invention, the jet assembly of the wafer cleaning device of the present invention can repeatedly generate shock waves after continuous gas is introduced. The shock wave passes quickly on the surface of the wafer, and when passing the inner side of the cut, the cut and the surface drop will form an air pressure difference and produce a weak impact, causing an upward fluctuating negative pressure at the dead corner of the cut, thereby taking away the water stains attached to the dead corner of the cut, achieving the effect of completely removing the dead corner water stains and drying.

[0091] The above implementation modes are only used to illustrate the embodiments of the present invention, and are not intended to limit the embodiments of the present invention. Ordinary technicians in the relevant technical field may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions also belong to the scope of the present invention. The patent protection scope of the present invention should be defined by the claims.

Claims

1. A wafer scribing edge rolling brush, characterized in that: The roller brush includes a core tube and a brush body, wherein the brush body is fixedly sleeved on the core tube, and the first end of the brush body includes an umbrella-shaped structure, which is configured to extend outwardly from the inner peripheral side of the brush body at an angle to the axial direction of the brush body, and is suitable for cleaning the wafer cutting edge.

2. The wafer scribing edge rolling brush according to claim 1, characterized in that: The first end of the brush body includes a plurality of the umbrella-shaped structures arranged axially in succession, and there is a gap between the outer peripheries of adjacent umbrella-shaped structures, and the gap forms an annular groove.

3. The wafer scribing edge rolling brush according to claim 2, characterized in that: The second end of the brush body is cylindrical, and the outer diameter of the second end of the brush body is between the inner diameter of the annular groove and the outer diameter of the umbrella-shaped structure.

4. The wafer scribing edge rolling brush according to claim 1, characterized in that: The axial length of the brush body is greater than the width of the wafer dicing edge to ensure that the wafer dicing edge can be effectively cleaned.

5. The wafer scribing edge roller brush according to any one of claims 1 to 4, characterized in that: A hollow channel for circulating liquid is formed inside the core tube, brush body moisturizing holes penetrating the peripheral wall are distributed on the peripheral wall of the core tube, the brush body covers the brush body moisturizing holes, and the brush body moisturizing holes are configured to guide the liquid in the hollow channel to the brush body to moisturize and clean the brush body.

6. The wafer scribing edge rolling brush as claimed in claim 5, characterized in that: The first end of the core barrel facing the wafer to be cleaned during use is surrounded by the brush body, and the second end of the core barrel facing away from the wafer to be cleaned during use is configured to be connected to a liquid supply device.

7. The wafer scribing edge rolling brush according to claim 6, characterized in that: The first end of the core barrel is connected to a spray pipe in a relatively rotatable manner, the spray pipe is in fluid communication with the hollow flow channel, and a plurality of spray holes are provided on the side wall of the spray pipe, which are suitable for oblique spraying of the wafer cutting edge.

8. The wafer scribing edge rolling brush according to claim 7, characterized in that: The spray hole is inclined toward the umbrella-shaped structure, so that the liquid sprayed from the spray hole washes the wafer cutting edge from inside to outside along the radial direction of the wafer.

9. The wafer scribing edge rolling brush according to claim 7 or 8, characterized in that: The roller brush further comprises: A brush body plug, the brush body plug is located at the end surface of the first end of the core barrel and is sleeved on the spray pipe to prevent fluid from leaking from the end surface of the first end of the core barrel; A sealing ring is located at the first end of the core barrel and is used to form a fluid seal between the spray pipe and the core barrel. 10 . A wafer cleaning device, comprising the wafer scribing edge roller brush according to any one of claims 1 to 9 .

11. The wafer cleaning device according to claim 10, characterized in that: The wafer cleaning device further comprises an air jet assembly having an air jet hole for spraying air toward the wafer cut edge to remove water stains remaining after the wafer cut edge is cleaned by a roller brush.

12. The wafer cleaning device according to claim 11, characterized in that: In the case of the wafer scribing edge roller brush of claim 6, the spray pipe is located between the air injection assembly and the core barrel.

13. The wafer cleaning device according to claim 10, characterized in that: The jet assembly comprises an air guide tube having an air inlet end and a blind end, and the jet hole is located at the blind end of the air guide tube.

14. The wafer cleaning device according to claim 13, characterized in that: The wafer cleaning device further comprises an air pipe fixing bracket, and the air pipe is fixed to the wafer cutting edge roller brush through the air pipe fixing bracket.

15. The wafer cleaning device according to claim 14, characterized in that: The trachea fixing bracket comprises an airway tube holding portion, a first supporting portion and a second supporting portion, wherein the airway tube holding portion holds the airway tube via an airway fixing clamp, the first supporting portion is fixedly connected to the blind end of the spray pipe, and the second supporting portion is connected to the second end of the core tube.

16. The wafer cleaning device according to any one of claims 13 to 15, characterized in that: A float is arranged in the blind end of the air duct, and the float is connected to the end wall of the blind end of the air duct through a spring. The float can move back and forth on both sides of the jet hole under the thrust of the spring and the intake pressure of the air duct, thereby repeatedly generating shock waves to remove water stains through fluctuating negative pressure.

17. A wafer dicing device, characterized in that: The wafer dicing equipment comprises: A dicing module, which is used to remove stress from the edge of the wafer to prevent damage to the edge of the wafer; A transmission module, the transmission module is used to move the wafer from the dicing module to the cleaning module; A cleaning module, the cleaning module comprising a back cleaning device, a front cleaning device and a wafer cleaning device as claimed in any one of claims 10 to 16, wherein the back cleaning device is used to clean the back of the wafer to remove contaminants on the back, and the front cleaning device is used to clean the front of the wafer to ensure that the cleanliness of the front meets the process requirements; The gas-liquid circuit module includes a gas circuit and a liquid circuit. The gas circuit is connected to the gas supply device for conveying and controlling gas, and the liquid circuit is connected to the liquid supply device for conveying and controlling liquid.

18. A wafer cleaning method, using the wafer cleaning device as claimed in claim 16 to clean a wafer dicing edge, characterized in that: The method comprises the following steps: Step I: Open the liquid supply device, spray the liquid on the brush body of the wafer scribing edge roller brush through the brush body moisturizing hole to moisturize the brush body, and spray the wafer scribing edge obliquely through the spray hole; Step II: controlling the rotation of the brush body to move the wafer cleaning device toward the wafer cutting edge, so that the umbrella-shaped structure of the brush body cleans the wafer cutting edge; Step III: Move the wafer cleaning device away from the wafer cutting edge, spray liquid on the brush body of the roller brush structure through the brush body moisturizing hole to clean the brush body, and spray the wafer cutting edge obliquely through the spray hole to flush away residual stains; Step IV: closing the liquid supply device, opening the gas supply device, allowing continuous gas to flow into the gas duct, and the continuous gas generates the shock wave through the gas jet hole to remove the water stains attached to the cut edge of the wafer; Step V: Stop the rotation of the brush body and close the air supply device.

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