A chip packaging apparatus and a chip packaging method

Abstract

The application provides a chip packaging device and a chip packaging method. The chip packaging device provided by the application is connected with a vacuum pump and a loading chamber. After the heat dissipation cover and the first intermediate part are loaded into the loading chamber each time, the air in the loading chamber is pumped out by the vacuum pump to form a vacuum space in the loading chamber. At this time, the gate between the loading chamber and the vacuum chamber is opened, and the heat dissipation cover and the first intermediate part are transferred to a hot-pressing device by a robot with a mechanical arm to form a piece to be processed. At this time, due to the vacuum working environment, a negative pressure area is formed between the heat dissipation cover and the interface heat dissipation material preform. Therefore, during hot pressing, the interface heat dissipation material preform can fill the uneven area on the heat dissipation cover to form a surface contact with the heat dissipation cover, so that air bubbles are avoided to be formed between the interface heat dissipation material preform and the heat dissipation cover, and the heat conduction and mechanical stability of the chip packaging structure can be improved.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and in particular to a chip packaging device and a chip packaging method. Background Technology

[0002] In the semiconductor packaging field, efficient heat transfer is crucial for the reliable operation of chips. Thermal interface preforms (TIMs) are applied between the chip and the heatsink to facilitate heat dissipation. However, when using TIMs to fix the chip and heatsink, large air bubbles can form between them, severely affecting the thermal transfer properties and structural stability of the chip package structure. Summary of the Invention

[0003] In view of this, this application provides a chip packaging device and a chip packaging method to solve the problem of air bubbles generated when welding a heat sink and a chip using an interface heat dissipation material preform, thereby improving the heat transfer and structural stability of the chip packaging structure.

[0004] Specifically, this application is implemented through the following technical solution:

[0005] A first aspect of this application provides a chip packaging apparatus, the chip packaging apparatus including a loading chamber, a vacuum chamber, a vacuum pump, and a controller; the loading chamber and the vacuum chamber are connected by a gate; the loading chamber and the vacuum pump are connected by a pipeline;

[0006] The loading chamber includes a first accommodating part and a second accommodating part; the first accommodating part is used to accommodate a heat dissipation cover; the second accommodating part is used to accommodate a first intermediate component; wherein, the first intermediate component includes a substrate, a chip fixed on the substrate, and an interface heat dissipation material preform placed on the chip, and the substrate is provided with a sealant for fixing the heat dissipation cover.

[0007] The vacuum chamber includes a robot with a robotic arm and a thermopressing device;

[0008] The controller is configured to control the vacuum pump to evacuate the loading chamber when the heat sink cover to be packaged is installed into the first receiving part of the loading chamber and the first intermediate component is installed into the second receiving part of the loading chamber, and to control the gate to open when the loading chamber is in a vacuum environment;

[0009] The controller is also used to control the robot to transfer the intermediate part from the second receiving part to the hot pressing device, and to place the heat dissipation cover on the intermediate part to form a part to be processed;

[0010] The controller is further configured to control the hot pressing equipment to apply temperature and pressure to the workpiece to be processed, so as to cure the sealant and fix the heat sink cover on the substrate to form a second intermediate part; wherein, when temperature and pressure are applied to the workpiece to be processed in a vacuum environment, under the action of negative pressure, the lower surface of the heat sink cover is tightly attached to the upper surface of the interface heat dissipation material preform, forming a surface contact.

[0011] A second aspect of this application provides a chip packaging method, which is implemented based on any of the chip packaging devices provided above, and the chip packaging method includes:

[0012] The heat sink to be packaged is inserted into the first receiving part of the loading chamber, and the first intermediate component to be packaged is inserted into the second receiving part of the loading chamber.

[0013] The vacuum pump is controlled to evacuate the loading chamber, and when the loading chamber is in a vacuum environment, the gate between the loading chamber and the vacuum chamber is opened;

[0014] The robot controls the transfer of the first intermediate part from the second accommodating part to the hot pressing device in the vacuum chamber, and places the heat dissipation cover on the intermediate part to form a part to be processed;

[0015] The hot pressing equipment is controlled to apply temperature and pressure to the workpiece to be processed, so that the sealant is cured and the heat dissipation cover is fixed on the substrate to form a second intermediate part; wherein, when the workpiece to be processed is subjected to temperature and pressure in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover is tightly attached to the upper surface of the interface heat dissipation material preform to form a surface contact.

[0016] The chip packaging equipment and method provided in this application connect a vacuum pump to a loading chamber. After each loading of the heat sink cover and the first intermediate component into the loading chamber, the air inside the loading chamber is extracted by the vacuum pump to form a vacuum space inside the loading chamber. At this time, the gate between the loading chamber and the vacuum chamber is opened, and a robot with a robotic arm is used to transfer the heat sink cover and the first intermediate component to a hot pressing device to form a component to be processed. At this time, due to the vacuum working environment, there is a negative pressure area between the heat sink cover and the interface heat dissipation material preform. In this way, during hot pressing, the interface heat dissipation material preform can fill the uneven area on the heat sink cover and form a surface contact with the heat sink cover, avoiding the formation of air bubbles between the interface heat dissipation material preform and the heat sink cover, which can improve the thermal conductivity and mechanical stability of the chip packaging structure. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a first embodiment of the chip packaging equipment provided in this application;

[0018] Figure 2A schematic diagram illustrating a first middleware as an exemplary embodiment of this application;

[0019] Figure 3 A schematic diagram illustrating the implementation principle of chip packaging using traditional chip packaging equipment;

[0020] Figure 4 A schematic diagram illustrating the implementation principle of chip packaging using the chip packaging equipment provided in this application;

[0021] Figure 5 A schematic diagram illustrating a chip packaging structure as shown in another exemplary embodiment of this application;

[0022] Figure 6 A top view of the middleware to be packaged, as shown in an exemplary embodiment of this application;

[0023] Figure 7 This is a flowchart of an embodiment of the chip packaging method provided in this application.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1: Loading compartment;

[0026] 11: First receiving section;

[0027] 12: Second receiving section;

[0028] 2: Vacuum chamber;

[0029] 21: Robot;

[0030] 22: Hot pressing equipment;

[0031] 3: Vacuum pump;

[0032] 4: Pipeline;

[0033] 5: Gate;

[0034] 6: Heat sink cover;

[0035] 7: First Middleware;

[0036] 71: Substrate;

[0037] 72: Chip;

[0038] 73: Interface heat dissipation material preforms;

[0039] 74: Sealant;

[0040] 8: Items pending processing. Detailed Implementation

[0041] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application.

[0042] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used herein are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0043] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0044] In the field of chip packaging, efficient heat transfer within the chip package structure is crucial for the reliable operation of the chip. To improve the heat transfer within the chip package structure, an interface heat dissipation material preform is often placed between the chip and the heat sink to promote heat dissipation. However, when the heat sink is soldered to the chip using the interface heat dissipation material preform to form the chip package structure, air may become trapped between the interface heat dissipation material preform and the heat sink, forming large air bubbles. This can lead to instability in the thermal resistance, hot spots, and mechanical structure of the chip package structure.

[0045] Specifically, when packaging chips using traditional chip packaging equipment, the chip is fixed to a substrate, an interface heat dissipation material preform is placed on the chip, and then a heat sink is placed on top of the interface heat dissipation material preform, making contact with the sealant on the substrate for initial bonding, assembling the component to be processed. Then, a thermoforming device is used to apply temperature and pressure to the component to be processed, causing the sealant to cure and fixing the substrate and heat sink. Simultaneously, the interface heat dissipation material preform and the heat sink further tighten their contact, forming a surface contact. It should be noted that because the surface of the heat sink facing the interface heat dissipation material preform is uneven, small air pockets may form between the heat sink and the interface heat dissipation material preform after the substrate and heat sink are fixed by the thermoforming device. Furthermore, during the sealant curing process, the interface heat dissipation material preform has not yet melted and requires a reflow soldering operation. This allows the unmelted interface heat dissipation material preform to melt during the reflow soldering process, and the melted interface heat dissipation material preform adheres the heat sink and chip together. However, during reflow soldering, small cavities can enlarge, forming larger bubbles that then accumulate in the final chip package structure, severely impacting its heat transfer and structural stability. Therefore, preventing bubble formation between the interface heat dissipation material preform and the heat sink has become a critical issue to address in chip packaging.

[0046] This application provides a chip packaging device and a chip packaging method to solve the problem of air bubbles generated when soldering a heat sink and a chip using an interface heat dissipation material preform, thereby improving the heat transfer and structural stability of the chip packaging structure.

[0047] The following specific embodiments are given to illustrate the technical solution of this application in detail.

[0048] Figure 1 This is a schematic diagram of an embodiment of the chip packaging equipment provided in this application. Figure 1 Figures (A), (B), and (C) are schematic diagrams illustrating the chip packaging equipment at different stages of the chip packaging process. Figure 1 Figure (A) in the diagram is a schematic diagram of the loading chamber in its initial state; Figure 1 Figure (B) shows a schematic diagram of the robot in operation inside the vacuum chamber. Figure 1 Figure (C) shows a schematic diagram of the hot pressing equipment in the vacuum chamber when it is in operation. Please refer to... Figure 1 The chip packaging equipment provided in this embodiment includes a loading chamber 1, a vacuum chamber 2, a vacuum pump 3, and a controller (not shown in the figure); the loading chamber 1 and the vacuum chamber 2 are connected through a gate 5; the loading chamber 1 and the vacuum pump 3 are connected through a pipe 4;

[0049] The loading chamber 1 includes a first accommodating part 11 and a second accommodating part 12; the first accommodating part 11 is used to accommodate the heat dissipation cover 6; the second accommodating part 12 is used to accommodate the first intermediate part 7; wherein, the first intermediate part 7 includes a substrate 71, a chip 72 fixed on the substrate, and an interface heat dissipation material preform 73 placed on the chip, and the substrate 71 is provided with a sealant 74 for fixing the heat dissipation cover 6.

[0050] The vacuum chamber 2 includes a robot 21 with a robotic arm and a thermopressing device 22;

[0051] The controller is used to control the vacuum pump 3 to evacuate the loading chamber 1 when the heat dissipation cover 6 to be packaged is installed into the first receiving part 11 of the loading chamber 1 and the first intermediate part 7 is installed into the second receiving part 12 of the loading chamber, and to control the gate 5 to open when the loading chamber 1 is in a vacuum environment.

[0052] The controller is also used to control the robot to transfer the first intermediate part 7 from the second accommodating part 12 to the hot pressing device 22, and to place the heat dissipation cover 6 on the first intermediate part 7 to form the part to be processed 8;

[0053] The controller is also used to control the hot pressing device 22 to apply temperature and pressure to the workpiece 8 to be processed, so that the sealant 74 is cured and the heat dissipation cover 6 is fixed on the substrate 71 to form a second intermediate part; wherein, when the workpiece 8 is subjected to temperature and pressure in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover 6 is tightly attached to the upper surface of the interface heat dissipation material preform 73 to form a surface contact.

[0054] Specifically, a gate 5 is provided on the left side of the loading chamber 1. When the chip packaging equipment is needed for chip packaging operations, the gate 5 is opened, the heat sink 6 and the first intermediate component 7 are placed into the loading chamber 1, and then the gate 5 is closed to proceed to the next step.

[0055] Please continue to refer to Figure 1 The loading chamber 1 includes a first accommodating part 11 and a second accommodating part 12, wherein the first accommodating part 11 is used to accommodate the heat dissipation cover 6, and the second accommodating part 12 is used to accommodate the first intermediate component 7. That is, when the heat dissipation cover 6 and the first intermediate component 7 are placed into the loading chamber 1, the heat dissipation cover 6 is placed into the first accommodating part 11, and the first intermediate component 7 is placed into the second accommodating part 12.

[0056] Figure 2 A schematic diagram of the first middleware shown in an exemplary embodiment of this application is provided below. Figure 2The first intermediate component 7 includes a substrate 71, a chip 72 fixed on the substrate, and an interface heat dissipation material preform 73 placed on the chip, and the substrate is provided with a sealant 74 for fixing the heat dissipation cover.

[0057] It should be noted that in the first intermediate component 7, the substrate 71, as the basic part, is often made of a material with good thermal conductivity. It can not only support other structures of the first intermediate component 7, but also help to transfer the heat generated by the chip and help the chip dissipate heat.

[0058] Furthermore, a gate 5 is provided between the loading chamber 1 and the vacuum chamber 2. The vacuum chamber 2 is equipped with a robot 21 with a robotic arm and a thermopressing device 22.

[0059] Specifically, vacuum chamber 2 is a completely vacuum-equipped space where the workpiece 8 can be placed and subjected to temperature and pressure using a thermo-pressing device 22. It should be noted that the loading chamber 1 is not a vacuum area. Transferring the first intermediate component 7 and the heat sink 6 from loading chamber 1 to vacuum chamber 2 would disrupt the vacuum environment inside vacuum chamber 2. Therefore, in this embodiment, a vacuum pump 3 is provided, and loading chamber 1 is connected to the vacuum pump 3 via a pipe 4. After initially loading the heat sink 6 and the first intermediate component 7 into the first receiving portion 11 and the second receiving portion 12 of loading chamber 1 from the outside, the vacuum pump 3 can be used to evacuate loading chamber 1, placing it in a vacuum environment. Thus, after loading chamber 1 is in a vacuum environment, as... Figure 1 As shown in Figure (B), when the gate 5 between the loading chamber 1 and the vacuum chamber 2 is opened, no air will enter the vacuum chamber 2, thus maintaining the vacuum environment inside. At this point, the robot 21 with a robotic arm can remove the first intermediate component 7 from the second receiving portion 12 and place it on the hot press device 22. Further, the heat sink 6 is removed from the first receiving portion 11 and placed on the first intermediate component 7. Using the sealant 74 on the substrate 71 of the first intermediate component 7, the first intermediate component 7 and the heat sink 6 are initially fixed together, forming the part to be processed 8. Then, the gate between the loading chamber 1 and the vacuum chamber 2 is closed. Further details can be found in the following section. Figure 1 As shown in Figure (C), the workpiece 8 to be processed can then be subjected to temperature and pressure by hot pressing equipment 22 to cure the sealant 74 and fix the heat dissipation cover 6 on the substrate 71 to form a second intermediate part; wherein, when the workpiece 8 to be processed is subjected to temperature and pressure in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover 6 is tightly attached to the upper surface of the interface heat dissipation material preform 73 to form a surface contact.

[0060] The following describes the function and effects of the chip packaging equipment provided in this application:

[0061] Figure 3 A schematic diagram illustrating the implementation principle of chip packaging using traditional chip packaging equipment. Figure 4 A schematic diagram illustrating the implementation principle of chip packaging using the chip packaging equipment provided in this application.

[0062] Please refer to Figure 3 In traditional chip packaging equipment, such as Figure 3 As shown in Figure (A), the heat sink 6 is first placed on the interface heat dissipation material preform 73 of the first intermediate part 7 to obtain the part to be processed. At this time, the side of the heat sink 6 facing the chip 72 is uneven and has multiple small air holes; further, as shown in Figure (A), the heat sink 6 is placed on the interface heat dissipation material preform 73 of the first intermediate part 7 to obtain the part to be processed. Figure 3 In Figure (B), the workpiece to be processed is placed in the hot press 22; further, as shown in Figure (B), Figure 3 In Figure (C), the workpiece is subjected to temperature and pressure using a hot press 22 to cure the sealant 74, resulting in the following: Figure 3 The second intermediate component shown in Figure (D) is in a state where the heat dissipation material preform 73 has not yet melted, and there are small air pockets between the heat dissipation cap 6 and the interface heat dissipation material preform 73. Further reflow soldering is performed on the second intermediate component to obtain... Figure 3 As shown in Figure (E), during the reflow soldering process, small cavities expand due to heat, forming larger bubbles.

[0063] For further details, please refer to Figure 4 The chip packaging equipment provided in this embodiment, such as Figure 4 As shown in Figure (A), before placing the heat sink 6 onto the first intermediate component 7, a vacuum process can create a negative pressure area in the uneven area of ​​the heat sink 6, transforming small cavities into negative pressure areas. Thus, as shown in Figure (A), Figure 4 As shown in Figures (B) and (C), after the heat sink 6 is placed on the first intermediate part 7 to form a workpiece to be processed, and after the workpiece to be processed is processed by the hot pressing equipment 22, the interface heat dissipation material preform 73 fills the negative pressure area and forms a surface contact with the heat sink 6. Further details can be found in Figures (B) and (C). Figure 4 In Figure (D), at this point, in the prepared second intermediate part, the interface heat dissipation material preform 73 and the heat dissipation cover 6 form a surface base, and there are no longer small air pockets between the interface heat dissipation material preform 73 and the heat dissipation cover 6. Further, the second intermediate part is subjected to a reflow soldering process to obtain... Figure 4 The chip packaging structure shown in Figure (E) has a chip 72 and a heat sink 6 that are adhered together by an interface heat dissipation material preform 73 and a heat sink 6 that are in surface contact. At this time, the thermal conductivity and structural stability of the chip packaging structure are both good.

[0064] It should be noted that the chip packaging equipment provided in this embodiment can assemble the heat sink and interface heat dissipation preform in a vacuum environment, which can solve the problem of air retention, ensure that there is no air during the bonding process, eliminate gaps, and improve heat transfer efficiency and reliability.

[0065] The chip packaging equipment provided in this embodiment connects a vacuum pump to the loading chamber. After each loading of the heat sink cover and the first intermediate component into the loading chamber, the air inside the loading chamber is extracted by the vacuum pump to form a vacuum space inside the loading chamber. At this time, the gate between the loading chamber and the vacuum chamber is opened, and a robot with a robotic arm is used to transfer the heat sink cover and the first intermediate component to the hot pressing equipment to form the component to be processed. At this time, due to the vacuum working environment, there is a negative pressure area between the heat sink cover and the interface heat dissipation material preform. In this way, during hot pressing, the interface heat dissipation preform can fill the uneven area on the heat sink cover and form a surface contact with the heat sink cover, avoiding the formation of air bubbles between the interface heat dissipation material preform and the heat sink cover, which can improve the thermal conductivity and mechanical stability of the chip packaging structure.

[0066] Figure 5 This is a schematic diagram illustrating a chip packaging structure as shown in another exemplary embodiment of this application. Figure 5 Figure (A) in the diagram is a schematic diagram of the chip packaging structure in its initial state; Figure 5 Figure (B) in the diagram is a schematic diagram of the robotic arm in loading chamber 1 when it is in working condition; Figure 5 Figure (C) shows a schematic diagram of the thermopressing device 22 in the vacuum chamber 2 when it is in operation. Please refer to... Figure 5 In the chip packaging structure provided in this embodiment, the loading chamber 1 is equipped with a robotic arm; the controller is further configured to place the heat dissipation cover 6 on top of the interface heat dissipation material preform 73 of the intermediate component to be packaged when the heat dissipation cover 6 to be packaged is loaded into the first receiving part 11 of the loading chamber 1 and the intermediate component to be packaged is loaded into the second receiving part 12 of the loading chamber, thereby forming an initial package; wherein, the sealant 74 on the intermediate component to be packaged for fixing the heat dissipation cover 6 has a notch;

[0067] The controller is also used to control the vacuum pump 3 to evacuate the loading chamber 1 so that the air between the heat dissipation cover 6 and the substrate 71 in the initial package can escape from the gap.

[0068] The controller is also used to control the gate 5 to open when the loading chamber 1 is in a vacuum environment, and to control the robot 21 to transfer the initial package to the thermopressing device 22;

[0069] The controller is also used to control the hot pressing device 22 to apply temperature and pressure to the initial package to cure the sealant 74 and fix the heat sink 6 on the substrate 71.

[0070] Specifically, in the chip packaging equipment provided in this embodiment, when packaging a chip, firstly, after the heat sink to be packaged is placed into the first receiving portion of the loading chamber and the intermediate component to be packaged is placed into the second receiving portion of the loading chamber, the robotic arm of the loading chamber uses a tool to place the heat sink to be packaged onto the interface heat dissipation material preform of the intermediate component to be packaged, forming an initial package. At this time, there is air between the interface heat dissipation material preform and the heat sink in the initial package.

[0071] Figure 6 This is a top view of the middleware to be packaged, as shown in an exemplary embodiment of this application. Please refer to... Figure 6 The sealant on the intermediate component to be packaged, used to fix the heat sink cover, has notches.

[0072] Furthermore, after the initial package is formed, the loading chamber 1 is evacuated, that is, the air in the loading chamber 1 is extracted by the vacuum pump 3 to form a vacuum area. In this way, after evacuation, the air between the heat dissipation cover 6 and the interface heat dissipation material preform 73 in the initial package can overflow from the gap at the sealant 74, and a negative pressure area is formed between the heat dissipation cover 6 and the interface heat dissipation material preform 73.

[0073] Further, see Figure 5 In Figure (B), when loading chamber 1 is in a vacuum environment, the valve between loading chamber 1 and vacuum chamber 2 is opened, and robot 21 transfers the initial packaged part to the middle of the thermopressing device 22; further, see Figure (B). Figure 5 In Figure (C), the initial package is subjected to temperature and pressure using a hot press device 22, causing the sealant 74 to cure and fixing the heat sink 6 onto the substrate 71, forming the second intermediate component. It can be understood that during the processing of the hot press device 22, the interface heat dissipation material preform 73 fills the negative pressure area and forms surface contact with the heat sink 6.

[0074] Referring to the description above, it should be noted that any of the above-mentioned chip packaging devices can be selected according to actual needs, and this application does not limit them.

[0075] It should be noted that, in the chip packaging equipment provided in this application, when the heat sink cover to be packaged is installed into the first receiving part of the loading chamber and the intermediate component to be packaged is installed into the second receiving part of the loading chamber, the heat sink cover is placed on top of the interface heat dissipation material preform of the intermediate component to be packaged to form an initial package. Furthermore, a vacuum pump is controlled to evacuate the loading chamber. This allows air between the heat sink cover and the substrate in the initial package to overflow from the gap, creating a negative pressure area between the heat sink cover and the substrate. When the initial package is subjected to temperature and pressure using a hot-pressing device to cure the sealant and fix the heat sink cover to the substrate, the interface heat dissipation material preform can fill the negative pressure area and form surface contact with the heat sink cover. This prevents the formation of air bubbles in the chip packaging structure and improves the thermal conductivity and stability of the chip packaging structure.

[0076] Optionally, in one possible implementation, the vacuum chamber is further provided with optical detection equipment;

[0077] The optical inspection device is used to detect whether the placement of the heat sink cover is accurate after the heat sink cover is placed on the intermediate component.

[0078] Specifically, the optical monitoring device is installed in a vacuum chamber and is used to detect whether the heat sink cover is placed in the correct position on the intermediate component after the heat sink cover is placed on the intermediate component.

[0079] The chip packaging equipment provided in this embodiment can ensure that the heat sink is placed in the correct position by setting up an optical inspection device in the vacuum chamber. In this way, when applying temperature and pressure using a hot pressing device, the packaging quality of the obtained second intermediate can be ensured, and packaging defects caused by incorrect heat sink position can be reduced.

[0080] Furthermore, in one possible implementation, the vacuum chamber is also equipped with a reflow soldering station;

[0081] The controller is further configured to control the robot to transfer the second intermediate component to the reflow soldering station;

[0082] The reflow soldering station is used to reflow solder the second intermediate component so that the chip and the heat sink of the second intermediate component are fixed together through the interface heat dissipation material preform to form a chip package structure.

[0083] It should be noted that after applying temperature and pressure to the initial package or the part to be processed using a hot press to obtain the second intermediate part, the interface heat dissipation material preform in the second intermediate part has not yet melted, and a tight connection has not been achieved between the interface heat dissipation material preform and the heat sink cover. Therefore, a reflow soldering station is installed in the vacuum chamber, and the second intermediate part is transferred to the reflow soldering station. The reflow soldering station is used to perform a reflow soldering operation on the second intermediate part, heating the second intermediate part to melt the interface heat dissipation material preform. After a certain period of time, the melted interface heat dissipation material preform is tightly bonded to the heat sink cover. Then, the second intermediate part is cooled. At this time, the interface heat dissipation material preform cools and solidifies, and the heat sink cover, the interface heat dissipation material preform, and the chip are fixed together to form a chip package structure.

[0084] The chip packaging equipment provided in this embodiment performs reflow soldering on the formed second intermediate part by setting up a reflow soldering station in the vacuum chamber, melting and solidifying the interface heat dissipation material preform, so that the heat dissipation cover and the interface heat dissipation material preform form a tight and fixed fit, improving the stability of the chip packaging structure, simplifying the chip packaging process, and improving the efficiency of chip packaging.

[0085] Furthermore, in one possible implementation, the loading chamber is also provided with a dispensing device; wherein the dispensing device is used to dispense sealant for fixing the heat sink onto the substrate placed in the substrate assembly of the second receiving portion; wherein the substrate assembly includes a substrate and a chip fixed on the substrate.

[0086] It should be noted that, in one possible implementation, the sealant on the substrate of the first intermediate component or the intermediate component to be packaged can be applied to the substrate before being inserted into the second receiving portion; in another possible implementation, the substrate assembly can be placed in the second receiving portion, and then the sealant for fixing the heat sink can be dispensed onto the substrate of the substrate assembly using a dispensing device.

[0087] The chip packaging equipment provided in this embodiment, by incorporating a dispensing device in the loading chamber, allows for the application of sealant to the substrate of the substrate assembly after the substrate assembly is placed into the second receiving portion within the loading chamber. This sealant is used to fix the heat sink, preventing displacement of the sealant during transportation and ensuring its secure fixation to the heat sink. Furthermore, it enhances the integration level of the chip packaging equipment.

[0088] Corresponding to the aforementioned chip packaging equipment, this application also provides a chip packaging method, which is described below:

[0089] Figure 7 This is a flowchart of an embodiment of the chip packaging method provided in this application. Please refer to... Figure 7The chip packaging method provided in this embodiment is implemented based on any one of the chip packaging devices provided in the first aspect of this application. The chip packaging method includes:

[0090] S701, The heat sink cover to be packaged is inserted into the first receiving part of the loading chamber, and the first intermediate component to be packaged is inserted into the second receiving part of the loading chamber.

[0091] S702. Control the vacuum pump to evacuate the loading chamber, and when the loading chamber is in a vacuum environment, open the gate between the loading chamber and the vacuum chamber.

[0092] S703. Control the robot to transfer the first intermediate part from the second accommodating part to the hot pressing device in the vacuum chamber, and place the heat dissipation cover on the intermediate part to form a part to be processed.

[0093] S704. Control the hot pressing equipment to apply temperature and pressure to the workpiece to be processed, so that the sealant is cured and the heat dissipation cover is fixed on the substrate to form a second intermediate part; wherein, when the workpiece to be processed is subjected to temperature and pressure in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover is tightly attached to the upper surface of the interface heat dissipation material preform to form a surface contact.

[0094] Optionally, the temperature range applied to the workpiece is 30℃-150℃, and the pressure range applied to the workpiece is 0.1MPa to 1MPa. It should be noted that the temperature and pressure applied to the workpiece using the hot pressing equipment can be selected according to actual needs; this application does not limit these settings.

[0095] Furthermore, in one possible implementation, the method further includes:

[0096] A reflow soldering operation is performed on the second intermediate component to fix the chip and the heat sink of the second intermediate component together through the interface heat dissipation material preform to form a chip package structure.

[0097] Specifically, in reflow soldering, the interface heat dissipation material preform is melted, and the melted interface heat dissipation material preform fills the negative pressure area between the interface heat dissipation material preform and the heat sink, forming a surface contact between the two.

[0098] Optionally, the reflow soldering temperature is 160℃ to 300℃. It should be noted that the specific reflow soldering temperature can be selected according to actual needs, and this application does not limit it.

[0099] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A chip packaging device, characterized in that, The chip packaging equipment includes a loading chamber, a vacuum chamber, a vacuum pump, and a controller; the loading chamber and the vacuum chamber are connected by a gate; the loading chamber and the vacuum pump are connected by a pipeline. The loading chamber includes a first accommodating part and a second accommodating part; the first accommodating part is used to accommodate a heat dissipation cover; the second accommodating part is used to accommodate a first intermediate component; wherein, the first intermediate component includes a substrate, a chip fixed on the substrate, and an interface heat dissipation material preform placed on the chip, and the substrate is provided with a sealant for fixing the heat dissipation cover. The vacuum chamber includes a robot with a robotic arm and a thermopressing device; The controller is configured to control the vacuum pump to evacuate the loading chamber when the heat sink cover to be packaged is installed into the first receiving part of the loading chamber and the first intermediate component is installed into the second receiving part of the loading chamber, and to control the gate to open when the loading chamber is in a vacuum environment; The controller is also used to control the robot to transfer the first intermediate part from the second accommodating part to the hot pressing device, and to place the heat dissipation cover on the first intermediate part to form a part to be processed; The controller is also used to control the hot pressing equipment to apply temperature and pressure to the workpiece to be processed, so that the sealant is cured and the heat dissipation cover is fixed on the substrate to form a second intermediate part; wherein, when the workpiece to be processed is subjected to temperature and pressure in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover is tightly attached to the upper surface of the interface heat dissipation material preform to form a surface contact.

2. The chip packaging equipment according to claim 1, characterized in that, The loading chamber is equipped with a robotic arm; the controller is also used to place the heat dissipation cover on top of the interface heat dissipation material preform of the intermediate part to be packaged when the heat dissipation cover to be packaged is loaded into the first receiving part of the loading chamber and the intermediate part to be packaged is loaded into the second receiving part of the loading chamber, to form an initial package; wherein the sealant on the intermediate part to be packaged for fixing the heat dissipation cover has a notch. The controller is also used to control the vacuum pump to evacuate the loading chamber so that the air between the heat sink and the substrate in the initial package can escape from the notch; The controller is also configured to control the gate to open and control the robotic arm to transfer the initial package to the thermopressing device when the loading chamber is in a vacuum environment; The controller is also used to control the hot pressing equipment to apply temperature and pressure to the initial package to cure the sealant and fix the heat sink to the substrate.

3. The chip packaging equipment according to claim 1, characterized in that, The vacuum chamber is also equipped with optical detection equipment; The optical inspection device is used to detect whether the placement of the heat sink cover is accurate after the heat sink cover is placed on the intermediate component.

4. The chip packaging equipment according to claim 1 or 3, characterized in that, The vacuum chamber is also equipped with a reflow soldering station; The controller is further configured to control the robot to transfer the second intermediate component to the reflow soldering station; The reflow soldering station is used to reflow solder the second intermediate component so that the chip and the heat sink of the second intermediate component are fixed together through the interface heat dissipation material preform to form a chip package structure.

5. The chip packaging equipment according to claim 1, characterized in that, The loading chamber is also equipped with a dispensing device; The dispensing device is used to dispense sealant for fixing the heat sink onto the substrate placed in the substrate assembly of the second receiving portion; wherein the substrate assembly includes a substrate and a chip fixed on the substrate.

6. The chip packaging equipment according to claim 1, characterized in that, The interface heat dissipation material preform on the intermediate component is a flux-free interface heat dissipation material preform.

7. A chip packaging method, characterized in that, The chip packaging method is implemented based on the chip packaging equipment according to any one of claims 1-6, and the chip packaging method includes: The heat sink to be packaged is inserted into the first receiving part of the loading chamber, and the first intermediate component to be packaged is inserted into the second receiving part of the loading chamber. The vacuum pump is controlled to evacuate the loading chamber, and when the loading chamber is in a vacuum environment, the gate between the loading chamber and the vacuum chamber is opened; The robot controls the transfer of the first intermediate part from the second accommodating part to the hot pressing device in the vacuum chamber, and places the heat dissipation cover on the intermediate part to form a part to be processed; The hot pressing equipment is controlled to apply temperature and pressure to the workpiece to be processed, so that the sealant is cured and the heat dissipation cover is fixed on the substrate to form a second intermediate part; wherein, when the workpiece to be processed is subjected to temperature and pressure in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover is tightly attached to the upper surface of the interface heat dissipation material preform to form a surface contact.

8. The method according to claim 7, characterized in that, The temperature range applied to the workpiece is 30℃-150℃, and the pressure range applied to the workpiece is 0.1MPa to 1MPa.

9. The method according to claim 7 or 8, characterized in that, The method further includes: The second intermediate component is reflow soldered so that the chip and the heat sink of the second intermediate component are fixed together through the interface heat dissipation material preform to form a chip package structure.

10. The method according to claim 9, characterized in that, The reflow soldering temperature is 160℃~300℃.

Images