Chip heating control method of dispensing machine

Abstract

The invention provides a chip heating control method of a dispensing machine. The chip heating control method comprises the following steps: step 1, obtaining a chip carrier plate loaded with a chip at a pre-dispensing station; secondly, the chip carrier plate moves forwards along a track, a dispensing preheating plate at a dispensing front station is driven to move synchronously with the chip carrier plate, and a heating part of the dispensing preheating plate is driven to heat the chip carrier plate; thirdly, when the chip carrier plate reaches the dispensing station, the dispensing preheating plate is driven to return to the pre-dispensing station; meanwhile, a dispensing heating plate at the dispensing station is driven to heat the chip carrier plate; and 4, after all the chips on the chip carrier plate are subjected to dispensing operation, the chip carrier plate moves to the post-dispensing station along the track, and the post-dispensing heating plate continuously performs heating treatment. According to the chip heating control method of the dispensing machine provided by the invention, the heating areas of the dispensing preheating plate, the dispensing heating plate and the post-dispensing heating plate are controlled, so that the chip can obtain better preheating, heating and cooling effects, and the dispensing effect is better.

Description

Technical Field

[0001] The invention relates to the field of chip manufacturing, and in particular to a method for controlling chip heating by a glue dispensing machine. Background Art

[0002] The glue dispensing machine is a commonly used equipment in the chip manufacturing process. During the dispensing process, the glue is heated by the dispensing head to melt the glue and put it in the best working state. After the chip is transported from the track, the dispensing head is controlled to dispense glue on the chip.

[0003] The heating link of the current dispensing machine is mainly in the dispensing head. Once the glue leaves the dispensing head, it will enter the working environment, and the temperature of the working environment is actually much lower than the temperature of the dispensing head. Therefore, after the dispensing head completes the dispensing and makes the glue drip on the chip, the temperature of the chip is basically the same as the ambient temperature. Considering that the temperature of the working environment is usually much lower than the temperature of the dispensing head, the glue will quickly exchange heat with the air in the working environment, that is, the glue will cool down quickly. However, the rapid cooling of the glue is not conducive to the bonding strength between the glue and the chip.

[0004] The patent publication number is CN116475011B, which discloses a chip copper substrate dispensing auxiliary heating seat. In fact, the dispensing process is subjected to auxiliary heat treatment, but the auxiliary heating structure is set in the entire dispensing area, which results in heat dispersion and waste of heat energy. Since the chip dispensing process is a progressive process, that is to say, when the previous batch of chips is being dispensed, the subsequent batch of chips is in a waiting state. Therefore, if the heating can be designed according to the chip batch, it will undoubtedly make the heat enter the chip more concentratedly, reducing the heat energy of the chip before dispensing. Dissipation to the environment. Summary of the invention

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a method for controlling chip heating by a dispensing machine, which performs follow-up heating according to the process of the chip, thereby solving the problem of heat energy dispersion and waste.

[0006] In order to solve the above technical problems, the present invention provides a method for controlling chip heating by a dispensing machine, comprising:

[0007] The first step is to obtain a chip carrier board with a chip at the pre-dispensing station;

[0008] In the second step, the chip carrier moves forward along the track, and drives the dispensing preheating plate at the pre-dispensing station to move synchronously with the chip carrier, and drives the heating component of the dispensing preheating plate to heat the chip carrier;

[0009] Step 3: When the chip carrier arrives at the dispensing station, the dispensing preheating plate is driven to return to the dispensing pre-station; at the same time, the dispensing heating plate of the dispensing station is driven to heat the chip carrier;

[0010] Step 4: After all chips on the chip carrier have completed the glue dispensing operation, the chip carrier moves along the track to the post-glue dispensing station and continues to be heated by the post-glue dispensing heating plate.

[0011] In the second step, when the heating component is started, the chip temperature T=T0 on the chip carrier is obtained through the infrared sensor, and the power Pa of the dispensing preheating plate is controlled according to the temperature T0, so that the chip temperature T reaches the preset temperature T2 before the chip carrier reaches the dispensing station.

[0012] When the chip temperature T0>T1, the dispensing preheating plate uses power Pa=P0 to heat the chip carrier;

[0013] When the chip temperature T0≤T1, the dispensing preheating plate uses power Pa=P1 to heat the chip carrier, and P1>P0.

[0014] In the second step, when the chip carrier moves to the midpoint between the pre-glue station and the glue station, if the chip temperature T<(T1+T2) / 2, the power of the glue preheating plate is adjusted to Pa=P2 to heat the chip carrier, P2>P1.

[0015] When the chip carrier reaches the preset temperature T2 before the chip carrier arrives at the glue dispensing station, the power P of the glue dispensing preheating plate is adjusted to P0 to heat the chip carrier.

[0016] In the third step, when the chip temperature T>T2, the dispensing heating plate is controlled to heat the chip carrier with power Pb=P0; when the chip temperature T≤T2, the dispensing heating plate is controlled to heat the chip carrier with power Pb=P2.

[0017] In the fourth step, when the chip temperature T>T3, the post-dispensing heating plate is controlled to heat the chip carrier at a power of Pc=P0; wherein T2>T3>T1;

[0018] When the chip temperature T≤T3, the post-dispensing heating plate is controlled to heat the chip carrier at a power of Pc=P1.

[0019] The dispensing preheating plate and the dispensing post-heating plate heat the chip carrier by blowing hot air toward the chip carrier.

[0020] The dispensing heating plate heats the chip carrier in the form of electric heating plate radiation.

[0021] The position of the chip carrier on the translation track is detected by a photoelectric sensor, thereby determining the workstation where the chip carrier is located.

[0022] The chip heating control method of the glue dispensing machine provided by the present invention controls the heating areas of the glue dispensing preheating plate, the glue dispensing heating plate and the glue dispensing post-heating plate, so that the chip can obtain better preheating, heating and cooling effects, and the glue dispensing effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the auxiliary heating system of the glue dispensing machine described in an embodiment of the present invention.

[0024] In the figure:

[0025] 10. Translation track; 20. Chip carrier; 30. Glue dispensing preheating plate; 40. Glue dispensing heating plate; 50. Glue dispensing post-heating plate; 60. Glue dispensing head; A. Pre-glue dispensing station; B. Glue dispensing station; C. Post-glue dispensing station. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0029] like Figure 1 As shown, the present invention provides a method for controlling chip heating by a dispensing machine, comprising:

[0030] The first step is to obtain a chip carrier 20 with a chip at a pre-dispensing station A;

[0031] Step 2: The chip carrier 20 moves forward along the translation track 10, and drives the glue dispensing preheating plate 30 of the pre-glue dispensing station A to move synchronously with the chip carrier 20, and drives the heating component of the glue dispensing preheating plate 30 to heat the chip carrier 20;

[0032] Step 3: When the chip carrier 20 reaches the glue dispensing station B, the glue dispensing preheating plate 30 is driven to return to the glue dispensing pre-station A; at the same time, the glue dispensing heating plate 40 of the glue dispensing station B is driven to heat the chip carrier 20;

[0033] Step 4: After all chips on the chip carrier 20 have completed the glue dispensing operation, the chip carrier 20 moves along the track to the post-glue dispensing station C and is continuously heated by the post-glue dispensing heating plate 50 .

[0034] The chip heating control method of the glue dispensing machine provided by the present invention controls the heating areas of the glue dispensing preheating plate, the glue dispensing heating plate and the glue dispensing post-heating plate, so that the chip can obtain better preheating, heating and cooling effects, and the glue dispensing effect is better.

[0035] In the second step, when the heating component is started, the chip temperature T=T0 on the chip carrier is obtained by the infrared sensor, and the power Pa of the dispensing preheating plate is controlled according to the temperature T0, so that the chip temperature T reaches the preset temperature T2 before the chip carrier 20 reaches the dispensing station. This step is to determine different heating powers according to the initial temperature by detecting the starting temperature of the chip, specifically:

[0036] When the chip temperature T0>T1, the dispensing preheating plate uses power Pa=P0 to heat the chip carrier;

[0037] When the chip temperature T0≤T1, the dispensing preheating plate uses power Pa=P1 to heat the chip carrier, and P1>P0.

[0038] That is to say, when the initial temperature of the chip is low, a relatively high power is used to heat the chip carrier, so that the temperature of the chip is quickly increased; and when the initial temperature of the chip is high, a relatively low temperature is used to heat the chip carrier, so that the temperature of the chip is slowly increased. However, no matter which heating method is used, it is possible that the preset temperature value T2 cannot be reached or the preset temperature T2 is reached in advance. Therefore, the applicant has made different treatments according to different actual situations. The general treatment idea is: when the chip carrier reaches half of the stroke of the station before dispensing, the chip temperature at this position is detected, and judged according to the midpoint value (T1+T2) / 2 of the preset value: when the chip temperature is lower than the midpoint value of the preset value, the power processing should be further increased, otherwise it will continue to be heated according to the original power. The advantage of this design is that the temperature of the chip can be raised more accurately, avoiding the chip temperature being too high, and also avoiding the chip temperature being too low, so that when the chip reaches the dispensing station, the chip temperature just reaches the preset temperature value T2 required for dispensing.

[0039] In the second step, when the chip carrier moves to the midpoint between the pre-glue station and the glue station, if the chip temperature T<(T1+T2) / 2, the power of the glue preheating plate is adjusted to Pa=P2 to heat the chip carrier, P2>P1.

[0040] When the chip carrier reaches the preset temperature T2 before the chip carrier arrives at the dispensing station, the power P of the dispensing preheating plate is adjusted to P0 to heat the chip carrier. The operation function of this step is to maintain the detection of the chip temperature T. When the chip carrier 20 reaches T2 in advance before arriving at the dispensing station B, there is no need to continue to heat the chip carrier with high power. Only a relatively low power is needed to heat the chip carrier. This can not only avoid further increase of the chip temperature T, but also avoid waste of electric energy, thereby selecting an optimal time to control the chip temperature T.

[0041] The third step is that the chip carrier arrives at the glue dispensing station B, and the chip carrier 20 is heated by the glue dispensing heating plate 40 of the glue dispensing station B, so as to keep the chip temperature T in the range of about T2 during the glue dispensing process of the glue dispensing machine. The glue dispensing heating plate 40 is usually fixed, and in order to avoid affecting the glue dispensing of the glue dispensing head 60, the glue dispensing heating plate 40 uses electric heat radiation to heat the chip carrier 20.

[0042] In the third step, when the chip temperature T>T2, the glue dispensing heating plate is controlled to heat the chip carrier with power Pb=P0; when the chip temperature T≤T2, the glue dispensing heating plate is controlled to heat the chip carrier with power Pb=P2. This control idea is also based on the previous control idea, that is, when the chip temperature T is higher than T2, the glue dispensing heating plate is controlled to heat the chip carrier 20 with relatively low power, and when the chip temperature T is lower than 2, the glue dispensing heating plate is controlled to heat the chip carrier 20 with a relatively high power, so that the chip temperature T can basically be kept within the optimal temperature range, thereby obtaining a better glue dispensing effect.

[0043] The fourth step is to keep the chip temperature T in a slow and reasonable downward trend by auxiliary heating during the cooling process of the glue and the chip after the dispensing is completed. As we all know, after the dispensing is completed, if the chip is directly placed in the air environment, the temperature of the chip and the glue on it will drop relatively quickly, and such a rapid temperature drop will not achieve the best dispensing effect. Therefore, it is necessary to control the chip cooling process after the dispensing is completed, so that the chip can be cooled in a controllable and slow manner after the dispensing is completed, so as to achieve the best dispensing effect.

[0044] In the fourth step, when the chip temperature T>T3, the post-dispensing heating plate is controlled to heat the chip carrier at a power of Pc=P0; wherein T2>T3>T1;

[0045] When the chip temperature T≤T3, the post-dispensing heating plate is controlled to heat the chip carrier at a power of Pc=P1.

[0046] The dispensing preheating plate and the dispensing post-heating plate heat the chip carrier by blowing hot air toward the chip carrier.

[0047] The dispensing heating plate heats the chip carrier in the form of electric heating plate radiation.

[0048] The position of the chip carrier on the translation track is detected by a photoelectric sensor, thereby determining the workstation where the chip carrier is located.

[0049] The chip heating control method of the glue dispensing machine provided by the present invention controls the heating areas of the glue dispensing preheating plate, the glue dispensing heating plate and the glue dispensing post-heating plate, so that the chip can obtain better preheating, heating and cooling effects, and the glue dispensing effect is better.

[0050] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. A method for controlling chip heating by a dispensing machine, characterized in that: include: The first step is to obtain a chip carrier board with a chip at the pre-dispensing station; In the second step, the chip carrier moves forward along the track, and drives the dispensing preheating plate at the pre-dispensing station to move synchronously with the chip carrier, and drives the heating component of the dispensing preheating plate to heat the chip carrier; Step 3: When the chip carrier arrives at the dispensing station, the dispensing preheating plate is driven to return to the dispensing pre-station; at the same time, the dispensing heating plate of the dispensing station is driven to heat the chip carrier; Step 4: After all chips on the chip carrier have completed the glue dispensing operation, the chip carrier moves along the track to the post-glue dispensing station and continues to be heated by the post-glue dispensing heating plate.

2. The method for controlling chip heating by a dispensing machine according to claim 1, characterized in that: In the second step, when the heating component is started, the chip temperature T=T0 on the chip carrier is obtained through the infrared sensor, and the power Pa of the dispensing preheating plate is controlled according to the temperature T0, so that the chip temperature T reaches the preset temperature T2 before the chip carrier reaches the dispensing station.

3. The method for controlling chip heating by a dispensing machine according to claim 2, characterized in that: When the chip temperature T0>T1, the dispensing preheating plate uses power Pa=P0 to heat the chip carrier; When the chip temperature T0≤T1, the dispensing preheating plate uses power Pa=P1 to heat the chip carrier, and P1>P0.

4. The method for controlling chip heating by a dispensing machine according to claim 3, characterized in that: In the second step, when the chip carrier moves to the midpoint between the pre-glue station and the glue station, if the chip temperature T<(T1+T2) / 2, the power of the glue preheating plate is adjusted to Pa=P2 to heat the chip carrier, P2>P1.

5. The method for controlling chip heating by a dispensing machine according to claim 4, characterized in that: When the chip carrier reaches the preset temperature T2 before the chip carrier arrives at the glue dispensing station, the power P of the glue dispensing preheating plate is adjusted to P0 to heat the chip carrier.

6. The method for controlling chip heating by a dispensing machine according to claim 1, characterized in that: In the third step, when the chip temperature T>T2, the dispensing heating plate is controlled to heat the chip carrier with power Pb=P0; when the chip temperature T≤T2, the dispensing heating plate is controlled to heat the chip carrier with power Pb=P2.

7. The method for controlling chip heating by a dispensing machine according to claim 1, characterized in that: In the fourth step, when the chip temperature T>T3, the post-dispensing heating plate is controlled to heat the chip carrier at a power of Pc=P0; wherein T2>T3>T1; When the chip temperature T≤T3, the post-dispensing heating plate is controlled to heat the chip carrier at a power of Pc=P1.

8. The method for controlling chip heating by a dispensing machine according to claim 1, characterized in that: The dispensing preheating plate and the dispensing post-heating plate heat the chip carrier by blowing hot air toward the chip carrier.

9. The method for controlling chip heating by a dispensing machine according to claim 1, characterized in that: The dispensing heating plate heats the chip carrier by means of electric heating plate radiation.

10. The method for controlling chip heating by a dispensing machine according to claim 1, characterized in that: The position of the chip carrier on the translation track is detected by a photoelectric sensor, thereby determining the workstation where the chip carrier is located.

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