Wafer cleaning device and wafer processing equipment

Abstract

The invention provides a wafer cleaning device and wafer processing equipment. The wafer cleaning device comprises a box body and a cleaning assembly in the box body, the box body is provided with a top cover, side walls and a bottom plate, the top cover comprises a fixed cover plate, a movable door and a fixed liquid receiving disc, an opening is formed in the middle of the fixed cover plate, and the movable door is installed at the opening and can horizontally move relative to the fixed cover plate to open and close the opening; the movable door comprises a movable door plate, a connecting piece and a movable liquid receiving disc, the connecting piece penetrates through the opening, the two ends of the connecting piece are fixedly connected with the movable door plate and the movable liquid receiving disc respectively, and the movable liquid receiving disc is provided with a first inclined bottom plate to guide liquid drops to obliquely flow down; the fixed liquid receiving tray is provided with a second inclined bottom plate which is the same as the first inclined bottom plate in inclination direction, the first inclined bottom plate and the second inclined bottom plate have an overlapping distance in the horizontal direction, and the fixed liquid receiving tray is used for receiving liquid drops flowing down from the movable liquid receiving tray, so that the liquid drops are prevented from directly dropping on the surface of a wafer to cause pollution.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing equipment, and in particular to a wafer cleaning device and a wafer processing equipment. Background Art

[0002] Wafer manufacturing is a key link that restricts the development of the ultra-large-scale integrated circuit (IC) industry. As the feature size of integrated circuits continues to shrink, the requirements for wafer surface quality are getting higher and higher, so the control of defect size and quantity in the wafer manufacturing process is becoming more and more stringent. Contaminants are an important factor that causes the quality of the wafer surface to deteriorate or even cause defects. Therefore, cleaning technology is needed to remove contaminants on the wafer surface to obtain an ultra-clean surface, especially in the post-cleaning and drying of chemical mechanical polishing (CMP). The water film on the wafer surface may contain contaminants such as particles and chemical liquids, and the collision of process components with the water film on the wafer surface will cause sputtering to produce a large number of droplets.

[0003] The inside of the box for cleaning wafers is a very humid environment, and droplets are easily condensed on the top of the box. In the cleaning process, liquid will be thrown onto the top cover of the box, causing the wastewater on the top cover of the box to drip down when the wafer cleaning is completed and the robot takes the wafer, contaminating the surface of the cleaned wafer, causing secondary contamination of the wafer surface, seriously affecting the cleaning effect. In addition, the overflow of droplets from the gap between the movable door panel and the fixed cover panel can easily pollute the air environment in the post-cleaning unit, and accumulate on the lower and side surfaces of the movable door panel to form a pollution source, seriously affecting the chip manufacturing yield. Summary of the invention

[0004] The embodiments of the present application provide a wafer cleaning device and a wafer processing device, aiming to solve at least one of the technical problems existing in the prior art.

[0005] The embodiment of the present application provides a wafer cleaning device, including a box body and a cleaning component inside the box body, wherein the box body has a top cover, side walls and a bottom plate, the top cover includes a fixed cover plate, a movable door and a fixed liquid receiving tray, the fixed cover plate is provided with an opening in the middle position, the movable door is installed at the opening and can move horizontally relative to the fixed cover plate to open and close the opening; the movable door includes a movable door plate, a connecting piece and a movable liquid receiving tray, the connecting piece passes through the opening, and the two ends are respectively fixedly connected to the movable door plate and the movable liquid receiving tray, the movable liquid receiving tray has a first inclined bottom plate to guide droplets to flow obliquely; the fixed liquid receiving tray has a second inclined bottom plate with the same inclination direction as the first inclined bottom plate, the first inclined bottom plate and the second inclined bottom plate have an overlapping distance in the horizontal direction, and the fixed liquid receiving tray is used to receive droplets flowing down from the movable liquid receiving tray, thereby preventing the droplets from directly dripping on the wafer surface to cause contamination.

[0006] In one embodiment, the lower surface of the fixed cover has a recessed portion near the opening, and the recessed portion is inclined from the middle to both sides to guide the liquid formed on the lower surface of the fixed cover to flow down obliquely, wherein the droplets flowing down to one side of the opening are guided toward the movable liquid receiving tray.

[0007] In one embodiment, the first inclined bottom plate has a guide hole and a first stopper protruding from the upper surface of the first inclined bottom plate at the downwardly inclined end, and the upper end of the first stopper is close to the lower surface of the fixed cover plate.

[0008] In one embodiment, the fixed liquid receiving tray has a gap near the side wall, and the gap is used to guide the liquid droplets on the upper surface of the second inclined bottom plate to be discharged along the gap and the side wall.

[0009] In one embodiment, the movable door plate has a middle portion with the same inclination direction as the first inclined bottom plate and an upper end and a lower end adjacent to the middle portion, the upper end having a second stop protruding from the lower surface of the movable door plate, and the lower end having a third stop protruding from the lower surface of the movable door plate, and the lower end of the second stop and the lower end of the third stop are close to the upper surface of the fixed cover plate.

[0010] In one embodiment, the upper surface of the fixed cover plate has a fourth stop protruding from the upper surface at the opening, the second stop, the third stop, and the fourth stop have inclined surfaces and pointed ends, the inclined surface of the third stop and the inclined surface of the fourth stop are arranged opposite to each other, and the inclined surface of the third stop and the inclined surface of the fourth stop are arranged opposite to each other; the connecting member is close to the second stop, and when the movable door closes the opening, the first stop, the second stop, the third stop, and the fourth stop are used to prevent mist droplets from overflowing.

[0011] In one embodiment, the upper end portion has a fifth stop portion protruding from the upper surface of the movable door panel, the fifth stop portion has an inclined surface with the same inclination direction as the middle portion, the inclined surface of the fifth stop portion is connected to the middle portion, and the inclination angle of the inclined surface of the fifth stop portion is greater than the inclination angle of the middle portion.

[0012] In one embodiment, the first inclined bottom plate is inclined downward in the direction in which the movable door opens the opening, the inclination angle of the middle portion is less than or equal to the inclination angle of the first inclined bottom plate, the inclination angle of the middle portion is 1-10°, and the inclination angle of the first inclined bottom plate is 5-15°.

[0013] In one embodiment, the cleaning assembly is used for vertical cleaning of wafers, and the cleaning assembly and the fixed liquid receiving tray are located on opposite sides of the opening, respectively.

[0014] Another embodiment of the present application provides a wafer processing device, comprising the wafer cleaning device and the wafer conveying device described in any of the preceding embodiments, wherein the wafer conveying device is used to place the wafer into and take out the wafer cleaning device through the opening, and the wafer cleaning device closes the movable door when cleaning the wafer.

[0015] The beneficial effects of the embodiments of the present application include: effectively preventing mist droplets from overflowing from the gap between the movable door panel and the fixed cover plate and polluting the air environment in the post-cleaning unit and then polluting the cleaned wafers; effectively preventing a large number of mist droplets from accumulating into liquid droplets and dripping on the lower surface of the top cover during the process, thereby contaminating the wafers, thereby stably improving the wafer cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a three-dimensional schematic diagram of a wafer cleaning device in the prior art.

[0018] Figure 2 yes Figure 1 Schematic diagram of the longitudinal section of the wafer cleaning device.

[0019] Figure 3 It is a schematic longitudinal cross-sectional view of the wafer cleaning device disclosed in the present application.

[0020] Figure 4 yes Figure 3A partial cross-sectional schematic diagram of a wafer cleaning device in FIG. 1 when the movable door is opened.

[0021] Figure 5 yes Figure 3 Schematic cross-sectional view of the top cover of the wafer cleaning device.

[0022] Figure 6 yes Figure 3 Schematic diagram of the structure of the movable liquid receiving plate and the fixed liquid receiving plate of the wafer cleaning device.

[0023] Reference numerals :

[0024] 1- Prior art wafer cleaning device; W- wafer;

[0025] 10-top cover; 20-side wall; 30-bottom plate; 40-cleaning part; 50-wafer station; 51-chuck; 52-movable retaining ring; 53-fixed retaining ring; 60-mist droplet; 70-liquid droplet

[0026] 100 - fixed cover plate; 110 - recessed portion; 111, 112 - inclined lower surface; 120 - fourth stop portion;

[0027] 200-trample door;

[0028] 210 - movable door panel; 211 - middle part; 212 - second stop part; 213 - third stop part; 214 - fifth stop part;

[0029] 220-connector;

[0030] 230 - movable liquid receiving tray; 231 - first inclined bottom plate; 232 - upper part of movable liquid receiving tray; 233 - lower part of movable liquid receiving tray; 234 - first stopper; 235 - flow guide hole;

[0031] 300-fixed liquid receiving tray; 310-second inclined bottom plate; 320-back plate; 330-gap; 340-baffle;

[0032] 1000-The wafer cleaning device of this application. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0034] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0036] In order to illustrate the technical solution described in the present application, the following description will be given with reference to the accompanying drawings and in combination with embodiments.

[0037] Figure 1 to Figure 2 The wafer cleaning device in the prior art is shown, comprising a box body 1 surrounded by a top cover 10, a side wall 20 and a bottom plate 30, and a space for operating wafer cleaning is formed in the box body 1. A cleaning assembly 40 (not shown) and a wafer station 50 are arranged in the box body, the cleaning assembly 40 is used to clean the surface of the wafer, the wafer station 50 is a position where the wafer W is clamped and fixed when the wafer W is cleaned by the cleaning assembly, the cleaning assembly 40 exemplarily comprises a combination of a cleaning brush and a nozzle, and the wafer station 50 exemplarily comprises a chuck 51, a movable retaining ring 52 and a fixed retaining ring 53.

[0038] Before the robot (not shown) clamps the wafer and enters the box, the wafer W is directly above the top cover 10. The top cover 10 includes a fixed cover plate 100 and a movable door 200. An opening is provided in the middle of the fixed cover plate 100. The movable door 200 is installed at the opening and is used to move horizontally to open and close the opening. Before the robot (not shown) clamps the wafer W and enters the box, the wafer is directly above the movable door 200, and the chuck 51 moves horizontally in a direction away from the wafer station 50 until it is fully extended from the movable retaining ring 52. After the movable door 200 is opened, the robot moves downward through the opening to transport the wafer W to the chuck 51, and the wafer W is then fixed by the wafer clamping mechanism on the chuck 51. The robot releases the wafer W and leaves the box. After the movable door 200 is closed, the chuck 51 moves horizontally toward the wafer station 50 until it completely enters the movable retaining ring 52. Driven by the motor, the chuck 51 and the movable retaining ring 52 rotate at high speed, and the cleaning component 40 is used to process the wafer W. The process includes but is not limited to washing the wafer surface with liquid and brushing the wafer surface with a cleaning brush. Due to the high-speed rotation of the wafer, a layer of liquid film will form on the wafer surface. During the process, the cleaning component 40 collides with the liquid film on the wafer surface to generate a large number of droplets 60. Although the movable retaining ring 52 can block some of the droplets 60, some of the droplets 60 will randomly diffuse and overflow from the gap between the movable door 200 and the fixed cover plate 100 to pollute the air environment in the post-cleaning unit. At the same time, the mist droplets 60 will also accumulate on the lower surface of the movable door 200 and the fixed cover plate 100 to form liquid droplets 70. A part of the liquid droplets 70 may fall on the fixed retaining ring 53 and be guided to flow to the bottom plate and discharged from the outlet. However, when the process is completed, the chuck 51 moves horizontally away from the wafer station 50 until it is fully extended from the movable retaining ring 52 and the wafer is clamped by the robot and leaves the box. In this process, contaminants will still fall onto the front of the wafer along with the liquid droplets 70 due to the movement of the movable door 200, causing secondary contamination of the wafer.

[0039] In order to solve the above technical problems, Figures 3 to 6 As shown, the wafer cleaning device 1000 disclosed in the present application includes a box body, a cleaning assembly 40 (not shown) in the box body, and a wafer station 50. The box body is surrounded by a top cover 10, a side wall 20, and a bottom plate 30. The cleaning assembly 40 is used to clean the surface of the wafer. The wafer station 50 is a position where the wafer W is clamped and fixed when the wafer W is cleaned by the cleaning assembly 40. The cleaning assembly 40 exemplarily includes a combination of a cleaning brush and a nozzle, and the wafer station 50 exemplarily includes a chuck 51, a movable retaining ring 52, and a fixed retaining ring 53.

[0040] In one embodiment, the side wall 20 includes a front plate, a rear plate, a left plate and a right plate, the front plate is arranged opposite to the rear plate, and the left plate is arranged opposite to the right plate. The top cover 10 includes a fixed cover plate 100, a movable door 200 and a fixed liquid receiving tray 300. An opening is provided in the middle of the fixed cover plate 100, and the movable door 200 is installed at the opening. The movable door 200 includes a movable door plate 210, a connecting member 220 and a movable liquid receiving tray 230, and the movable door plate 210 and the movable liquid receiving tray 230 are fixedly connected by the connecting member 220. The movable door plate 210 is located above the fixed cover plate 100 as a whole in the vertical direction, and the movable liquid receiving tray 230 is located below the fixed cover plate 100 as a whole. The connecting member 220 passes through the opening and is fixedly connected to the movable door plate 210 and the movable liquid receiving tray 230, respectively, so that the movable door plate 210, the connecting member 220 and the movable liquid receiving tray 230 can move synchronously horizontally, so that the movable door 200 opens and closes the opening. The fixed liquid receiving pan 300 is fixedly mounted on the lower surface of the fixed cover plate 100 and forms a receiving space with the fixed cover plate 100. When the movable door 200 is opened, most of the movable liquid receiving pan 230 is in the receiving space between the fixed cover plate 100 and the fixed liquid receiving pan 300. When the movable door 200 is closed, the movable door plate 210, the movable liquid receiving pan 230, the fixed cover plate 100 and the fixed liquid receiving pan 300 are staggered to form a closed structure.

[0041] like Figure 5 As shown, the movable liquid receiving tray 230 has a first inclined bottom plate 231 that is inclined downward, and the first inclined bottom plate 231 has a first inclined angle α and is wider than the opening, so that when the movable door 200 is closed, the mist droplets are blocked from moving toward the gap between the fixed cover plate 100 and the movable door 200, and the droplets accumulated on its lower surface are guided to flow down obliquely. Some of the droplets will continue to escape and accumulate on the lower surface of the fixed cover plate 100, the lower surface of the movable door 200, and the edges and gaps of the two to form droplets, and some of the droplets drip on the upper surface of the first inclined bottom plate 231 under the action of gravity, and then flow down obliquely along the upper surface of the first inclined bottom plate 231.

[0042] The fixed liquid receiving tray 300 has a second inclined bottom plate 310 with the same inclination direction as the first inclined bottom plate 231. The second inclined bottom plate 310 has a second inclination angle β and is located entirely below the first inclined bottom plate 231, so that the second inclined bottom plate 310 and the fixed cover plate 100 form a receiving space that can accommodate the first inclined bottom plate 231. When the movable door 200 is opened, the first inclined bottom plate 231 and the second inclined bottom plate 310 still have an overlapping distance in the horizontal direction. Figure 3As shown, the first inclined bottom plate 231 and the second inclined bottom plate 310 move relative to each other as the movable door 200 is opened and closed. When the movable door 200 opens, the overlapping distance reaches the maximum value H, and when the movable door 200 closes, the overlapping distance reaches the minimum value h. Therefore, the droplets flowing down the first inclined bottom plate 231 are received by the upper surface of the second inclined bottom plate 310, and the droplets accumulated on the lower surface of the second inclined bottom plate 310 are also guided to flow obliquely toward the side wall 20, thereby preventing the droplets from directly dripping on the surface of the wafer and causing contamination. In addition, when the movable door 200 closes the opening, the staggered structure formed by the second inclined bottom plate 310 and the first inclined bottom plate 231 is conducive to blocking the droplets from moving toward the gap between the fixed cover plate 100 and the movable door 200. Preferably, the minimum value h of the overlapping distance is greater than or equal to 1 / 10 of the opening width or greater than or equal to 5 mm.

[0043] In one embodiment, the first inclined bottom plate 231 is arranged to be inclined downward in the direction in which the movable door 200 opens the opening, that is, the inclined direction is consistent with the direction in which the sliding door is opened. In this way, during the door opening process, the movement of the movable door 200 has the least interference with the guiding effect of the droplets, that is, the droplets are not likely to drop directly due to vibration. At the same time, when the movable door 200 changes from moving to stationary, the droplets are accelerated by inertia to flow along the first inclined bottom plate 231 in the direction of the side wall 20 away from the opening, and are not likely to accumulate near the opening, greatly reducing the risk of contaminating the wafer.

[0044] In one embodiment, the lower surface of the second inclined bottom plate 310 extends all the way to the side wall 20 of the box, so that the liquid droplets are guided to flow to the bottom plate of the box through the side wall 20 and are finally discharged.

[0045] Due to the limited space inside the box and the special properties of the impurities remaining on the wafer surface, and because of the stringent requirements of the wafer manufacturing process for preventing contamination caused by droplets, it is necessary to set a special tilt angle for the first tilted bottom plate 231 and the second tilted bottom plate 310. Specifically, under normal circumstances, the larger the tilt angle, the more conducive it is to the diversion of the surface liquid, but too large a tilt angle is also likely to cause interference between the movable door 200 or the fixed liquid receiving tray 300 and the movable movable retaining ring 52 or the cleaning component 40, and will also affect the interaction between the manipulator and the chuck 51. The droplets formed on the surface of the top cover 10 will contain metal ions and chemicals remaining on the surface of the wafer in the previous process, which have strong adsorption force and are easy to adsorb each other to form larger droplets. If the tilt angle is too small, the droplets are not only easy to drip and contaminate the wafer, but also easy to form crystals due to long-term attachment and non-flow, which interferes with the normal diversion of the droplets, making the droplet situation more complicated and uncontrollable, and also increasing the maintenance cost. In one embodiment, the first inclination angle α is 5-15°, preferably 6-12°; the second inclination angle β is 5-15°, preferably 6-12°. The first inclination angle α, the second inclination angle β and the minimum value h of the overlap distance need to cooperate with each other. One of them can be determined first according to the actual situation in the box and the specific requirements in use, and then the other two can be adjusted accordingly to achieve the appropriate diversion effect of the first inclined bottom plate 231 and the second inclined bottom plate 310.

[0046] In one embodiment, the top cover 10 is installed on the top of the box body in an integrally detachable manner. For example, the fixed cover plate 100 is fixed to the side wall 20 of the box body by screws, etc., which provides convenience for maintenance inside the box body. At the same time, the top cover can be removed for cleaning.

[0047] In one embodiment, the lower surface of the fixed cover plate 100 has a recessed portion 110 near the opening, and the recessed portion 110 is inclined from the middle to both sides to form opposite inclined lower surfaces 111 and 112, and the end of the inclined lower surface 111 extends toward the side wall, for example, extends to the top of the fixed retaining ring; the end of the inclined lower surface 112 extends toward the movable liquid receiving pan 230 to guide the liquid flowing down obliquely to be received by the movable liquid receiving pan 230. Preferably, the end of the inclined lower surface 112 is connected to the side wall of the opening to form a tip.

[0048] In one embodiment, the movable liquid receiving tray 230 is divided into an upper movable liquid receiving tray 232 with an upwardly inclined end and an opposite lower movable liquid receiving tray 233 in the horizontal direction by using the connecting member 220 as a partition. The fixed cover plate 100 is provided with a recessed portion 110 only on one side relative to the upper movable liquid receiving tray 232, and the upper movable liquid receiving tray 232 overlaps with the inclined lower surface 112 in the horizontal direction. The connecting member 220 is configured to allow liquid droplets to be guided from the upper movable liquid receiving tray 232 to the lower movable liquid receiving tray 233. Preferably, the connecting member 220 is at least two columnar structural members arranged at intervals. Therefore, the liquid droplets flowing obliquely from the inclined lower surface 112 and the liquid droplets dripping from other positions of the movable door plate 210, the connecting member 220 and the fixed cover plate 100 are all guided by the upper surface of the movable liquid receiving tray 230 and flow obliquely downward to the lower movable liquid receiving tray 233.

[0049] In one embodiment, the first inclined bottom plate 231 is provided with a first stopper 234 at the downwardly inclined end, and a guide hole 235 penetrating the first inclined bottom plate 231 is provided adjacent to the first stopper 234, so that the droplets flowing to the lower part 233 of the movable liquid receiving plate drip through the guide hole 235 to the fixed liquid receiving plate 300 under the gathering effect of the first stopper 234. The first stopper 234 and the guide hole 235 together play a role in reducing the momentum of the droplets, thereby preventing the droplets from splashing on the upper surface of the fixed liquid receiving plate 300 due to excessive momentum. Preferably, a plurality of guide holes 235 can be arranged at equal intervals along the first stopper 234 to speed up the diversion of the droplets and prevent large droplets from gathering. Preferably, the guide hole 235 is a strip hole, and the length of the strip hole is 20 mm to 30 mm. Meanwhile, in order to further prevent the mist droplets from overflowing from the gap between the first stopper 234 and the fixed cover plate 100 , the upper end portion of the first stopper 234 is disposed as close to the lower surface of the fixed cover plate 100 as possible.

[0050] In one embodiment, the fixed liquid receiving tray 300 includes a back plate 320, which is located at the end of the second inclined bottom plate 310 of the fixed liquid receiving tray 300 and is fixedly connected to the fixed cover plate 100. The distance between the back plate 320 and the first stopper 234 is set so that when the movable door 200 is opened, the back plate 320 does not contact the first stopper 234. Figure 6 As shown, the second inclined bottom plate 310 is adjacent to the side wall 20 in a direction perpendicular to the inclined direction, and a gap 330 is provided at the adjacent position, and the liquid droplets collected on the upper surface of the fixed liquid receiving tray 300 are guided to be discharged through the gap 330. Preferably, a baffle 340 is provided in another direction relative to the gap 330, and the upper edge of the baffle 340 is close to the lower surface of the fixed cover plate 100.

[0051] In one embodiment, the movable door plate 210 has a middle portion 211 with the same inclination direction as the first inclined bottom plate 231 and upper and lower ends on both sides of the middle portion. The middle portion 211 has a third inclination angle γ, which is used to guide the droplets on the upper and lower surfaces of the movable door plate 210 to flow down obliquely. The upper end of the movable door plate 210 is provided with a second stopper 212 protruding from its lower surface, and the lower end is provided with a third stopper 213 protruding from its lower surface. The lower ends of the second stopper 212 and the third stopper 213 are both close to the upper surface of the fixed cover plate 100. Preferably, the connecting member 220 is close to the second stopper 212 to keep the structure stable and compact.

[0052] In one embodiment, the upper surface of the fixed cover plate 100 has a fourth stopper 120 protruding from the upper surface at the opening. When the movable door 200 closes the opening, the first stopper 234, the second stopper 212, the third stopper 213 and the fourth stopper 120 are interlaced with each other or interlaced with the fixed cover plate to form a sealing structure to prevent the mist droplets from overflowing. Preferably, the second stopper 212, the third stopper 213 and the fourth stopper 120 all have inclined surfaces and pointed ends, the inclined surfaces of the second stopper 212 and the inclined surfaces of the fourth stopper 120 are opposite, and the inclined surfaces of the third stopper 213 and the inclined surfaces of the fourth stopper 120 are opposite. The relative inclined surfaces and pointed ends not only enhance the effect of preventing the mist droplets from overflowing, but also facilitate the mist droplets to form droplets at the inclined surfaces and be guided by the inclined surfaces to flow to the upper surface of the fixed cover plate 100, thereby avoiding the random diffusion of the mist droplets and polluting the air environment.

[0053] When the wafer transport equipment in the wafer processing equipment, such as a robot, holds the wafer and transfers it from the previous process to the current cleaning process, the liquid droplets attached to the surface of the wafer at the previous process will also drip from the surface of the wafer toward the top cover 10, and may just drip and adhere to the vertical side of the upper end of the movable door plate 210, and fall into the cleaning box when the movable door plate 210 is opened, thereby contaminating the wafer. Even if the liquid droplets are not attached to the vertical side of the upper end of the movable door plate 210, the liquid droplets dripping near the upper end of the movable door plate 210 may pass over the movable door plate due to inertia when the movable door plate 210 is opened and fall into the box, thereby contaminating the wafer.

[0054] To solve the above technical problems, in one embodiment, the upper end of the movable door plate 210 is provided with a fifth stopper 214 protruding from its upper surface, the fifth stopper 214 having an inclined surface and a tip, the inclined surface of the fifth stopper 214 extending from its tip to the middle portion 211, and the tip of the fifth stopper 214 and the tip of the second stopper 212 are between the vertical side of the upper end of the movable door plate 210. In this embodiment, the liquid droplets that originally dripped and attached to the vertical side of the upper end of the movable door plate 210 will be blocked and divided by the tip of the fifth stopper 214, so that most of the liquid droplets are guided along the inclined surface side of the fifth stopper 214 due to the surface tension of the liquid, and the probability of the liquid droplets attaching to the vertical side of the upper end of the movable door plate 210 is reduced. At the same time, the inclined surface of the fifth blocking portion 214 has a larger inclination angle than the middle portion 211 of the movable door plate 210, and has a more significant effect on guiding the liquid droplets. The liquid is not easy to adhere to the vicinity of the upper end of the movable door plate 210. At the same time, it can also prevent the liquid droplets attached to the middle portion 211 from falling into the box due to inertia when the door is opened.

[0055] In one embodiment, in order to ensure that the movable door plate 210, especially the fifth stopper 214, does not interfere with the wafer clamped by the robot, the third tilt angle γ is set to be less than or equal to the first tilt angle α. Preferably, the third tilt angle γ is 1-10°, further 3-8°, so that the movable door plate 210 can simultaneously ensure that the movable door plate 210 has a good flow guiding effect. The droplets dripping on the upper surface of the movable door plate 210 are guided to flow down obliquely, and flow along the third stopper 213 to the upper surface of the fixed cover plate 100; the mist droplets that escape to the lower surface of the movable door plate 210 gather into droplets and are also guided to flow down obliquely, and flow along the third stopper 213 to the upper surface of the fixed cover plate 100, which effectively reduces the risk of contaminating the wafer.

[0056] In one embodiment, the top cover 10 is made of corrosion-resistant plastic, such as PP, PVDF, PTFE, PEEK, etc. Optionally, the lower surface of the top cover 10 is covered with a hydrophilic material layer and sandblasted to further improve the water-conducting effect of the top cover 10 .

[0057] In one embodiment, the cleaning assembly is used for vertical wafer cleaning, that is, the wafer is clamped and fixed in the box in such a way that the front and back surfaces of the wafer are parallel to the vertical direction. The cleaning assembly includes a wafer processing station, and the wafer is clamped and fixed in the wafer processing station, and the wafer processing station includes an outermost fixed retaining ring. The opening is located in the middle of the fixed cover plate 100, and its length is greater than the diameter of the wafer to be processed. For example, in a 12-inch wafer processing device, the length of the opening is greater than 300mm; its width will not interfere with the robot that clamps the wafer. Preferably, the width of the opening is set to 30-80mm. Figure 3-4As shown, the cleaning assembly is located on one side of the opening as a whole, wherein the fixed retaining ring is used to receive part of the liquid droplets dripping from the lower surface of the fixed cover plate 100 on this side, especially the liquid droplets that are guided by the inclined lower surface 111 of the recessed portion 110 and flow down obliquely; the fixed liquid receiving tray 300 is located on the other side of the opening as a whole, and is used to receive part of the liquid droplets dripping from the lower surface of the fixed cover plate 100 on this side and the liquid droplets guided and dripped by the movable liquid receiving tray 230.

[0058] The present application also provides a wafer processing device, including the wafer cleaning device 1000 and the wafer conveying device 2000 (not shown) disclosed in any of the aforementioned embodiments, and the wafer conveying device 2000 is used to transfer wafers in the wafer processing device. The wafer conveying device 2000 includes a robot 400 (not shown), and the robot 400 clamps the wafer from the previous process or the transfer position between processes, and moves it to the top of the opening of the wafer cleaning device 1000. After the wafer cleaning device 1000 opens the movable door 200, the wafer is placed into the wafer cleaning device 1000 through the opening, and after the robot 400 is reset, the wafer cleaning device 1000 closes the movable door 200, and the cleaning component starts to process the wafer, including but not limited to one or more processing procedures of rinsing, brushing or drying. After the cleaning component completes the processing of the wafer, the wafer cleaning device 1000 opens the movable door, the robot 400 clamps and takes out the wafer through the opening, and transfers the wafer to a subsequent process or a transfer position between processes. The use of the wafer cleaning device 1000 disclosed in the embodiment of the present application can effectively prevent the mist droplets generated during wafer processing in the wafer cleaning device 1000 from escaping into the air environment of the wafer processing equipment, and avoid the mist droplets adhering to the wafer surface when the wafer conveying device 2000 transfers the wafer to cause contamination.

[0059] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer cleaning device, characterized in that: The invention comprises a box body and a cleaning assembly therein, wherein the box body has a top cover, side walls and a bottom plate, the top cover comprises a fixed cover plate, a movable door and a fixed liquid receiving tray, an opening is arranged in the middle of the fixed cover plate, the movable door is installed at the opening and can move horizontally relative to the fixed cover plate to open and close the opening; The movable door comprises a movable door plate, a connecting piece and a movable liquid receiving tray, wherein the connecting piece passes through the opening and has two ends respectively fixedly connected to the movable door plate and the movable liquid receiving tray, and the movable liquid receiving tray has a first inclined bottom plate to guide the liquid droplets to flow down obliquely; The fixed liquid receiving tray has a second inclined bottom plate with the same inclination direction as the first inclined bottom plate, and the first inclined bottom plate and the second inclined bottom plate have an overlapping distance in the horizontal direction. The fixed liquid receiving tray is used to receive the droplets flowing from the movable liquid receiving tray, thereby preventing the droplets from directly dripping on the wafer surface and causing contamination.

2. The wafer cleaning device according to claim 1, characterized in that: The lower surface of the fixed cover has a recessed portion near the opening, and the recessed portion is inclined from the middle to both sides to guide the liquid formed on the lower surface of the fixed cover to flow down obliquely, wherein the droplets flowing down to one side of the opening are guided to the movable liquid receiving tray.

3. The wafer cleaning device according to claim 2, characterized in that: The first inclined bottom plate has a guide hole and a first stopper protruding from the upper surface of the first inclined bottom plate at the downwardly inclined end, and the upper end of the first stopper is close to the lower surface of the fixed cover plate.

4. The wafer cleaning device according to claim 3, characterized in that: The fixed liquid receiving tray has a gap near the side wall, and the gap is used to guide the liquid droplets on the upper surface of the second inclined bottom plate to be discharged along the gap and the side wall.

5. The wafer cleaning device according to claim 2, characterized in that: The movable door plate has a middle portion with the same inclination direction as the first inclined bottom plate and an upper end and a lower end adjacent to the middle portion, the upper end having a second stop protruding from the lower surface of the movable door plate, and the lower end having a third stop protruding from the lower surface of the movable door plate, and the lower end of the second stop and the lower end of the third stop are close to the upper surface of the fixed cover plate.

6. The wafer cleaning device according to claim 5, characterized in that: The upper surface of the fixed cover plate has a fourth stopper protruding from the upper surface at the opening, the second stopper, the third stopper and the fourth stopper have inclined surfaces and pointed ends, the inclined surface of the third stopper is arranged opposite to the inclined surface of the fourth stopper, and the inclined surface of the third stopper is arranged opposite to the inclined surface of the fourth stopper; When the movable door closes the opening, the first stopper, the second stopper, the third stopper and the fourth stopper are used to prevent mist droplets from overflowing.

7. The wafer cleaning device according to claim 5, characterized in that: The upper end portion has a fifth stop portion protruding from the upper surface of the movable door panel, the fifth stop portion has an inclined surface with the same inclination direction as the middle portion, the inclined surface of the fifth stop portion is connected to the middle portion, and the inclination angle of the inclined surface of the fifth stop portion is greater than the inclination angle of the middle portion.

8. The wafer cleaning device according to claim 5, characterized in that: The first inclined bottom plate is inclined downward in the direction in which the movable door opens the opening, the inclination angle of the middle portion is less than or equal to the inclination angle of the first inclined bottom plate, the inclination angle of the middle portion is 1-10°, and the inclination angle of the first inclined bottom plate is 5-15°.

9. The wafer cleaning device according to any one of claims 1 to 8, wherein the cleaning assembly is used for vertical wafer cleaning, and the cleaning assembly and the fixed liquid receiving tray are respectively located on opposite sides of the opening.

10. A wafer processing equipment, comprising a wafer conveying device and a wafer cleaning device as described in any one of claims 1 to 9, wherein the wafer conveying device comprises a robot for placing the wafer into and taking out the wafer cleaning device through the opening, and the wafer cleaning device closes the movable door when cleaning the wafer.

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