Wafer isopropanol atomization drying equipment

Abstract

The invention relates to wafer isopropyl alcohol atomization drying equipment which comprises a drying box body and a wafer swing disc mechanism arranged in the drying box body, the upper end face of the wafer swing disc mechanism is provided with a plurality of wafer overturning type vacuum suction cup assemblies which are circumferentially distributed at equal intervals, and the upper side of the drying box body is provided with a circumferentially rotating water vapor introducing assembly; the water vapor introducing assembly comprises a rotating disc arranged on the upper side of the drying box body, the rotating disc is provided with a deionized water pipeline, an isopropanol pipeline and a hot nitrogen pipeline, and the deionized water pipeline, the isopropanol pipeline and the hot nitrogen pipeline on the rotating disc are distributed in the rotating direction of the rotating disc; and the deionized water pipeline, the isopropanol pipeline and the hot nitrogen pipeline are arranged right above any wafer workpiece. The wafer overturning type vacuum chuck assembly has the following advantages that the breakage rate during wafer drying is reduced, the drying effect on wafers with unsmooth surfaces is improved, double-face overturning type drying is achieved through the wafer overturning type vacuum chuck assembly, pollution is reduced, and the drying efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the field of silicon wafer processing, and in particular relates to wafer isopropyl alcohol atomization drying equipment. Background Art

[0002] Perfect drying cannot leave any defects on the wafer surface, such as peeling of surface material, particles and water marks. The presence of water marks will cause a thin natural oxide layer to form on the wafer surface, causing pattern defects in subsequent processes or causing the interface between the film formed in subsequent processes and the underlying substrate to be different from the expected state, thereby affecting the characteristics of the device. Therefore, drying is the top priority in the cleaning process.

[0003] When drying wafers, the following two drying methods are usually used: First, spin drying is to use mechanical high-speed rotation to spin dry, and blow nitrogen inside the chamber to accelerate drying; second, using the difference in surface tension between isopropyl alcohol and deionized water, the water molecules on the wafer surface are absorbed and returned to the processing tank to achieve the effect of drying the wafer surface. However, these two drying methods are better for wafers with smooth surfaces. If the wafer surface has certain grooves, there will be water droplets formed by a mixture of isopropyl alcohol and water in the wafer gap, which is difficult to fully dry in a small space. When nitrogen is subsequently sprayed, the water droplets will spread around under the action of nitrogen, forming a crescent-shaped defect; secondly, in the drying method where the wafer rotates at high speed with the machine, the wafer is positioned in the rotating disk by a small suction cup, and the wafer surface is dried by directional blowing and high-speed rotation force. However, the overload force generated during high-speed rotation can easily cause the wafer to break, and the breakage rate is high. Only single-sided drying of multiple wafers can be achieved at one time. When the other side needs to be dried, it is necessary to turn it over manually or by a robot, which causes certain pollution and affects the drying efficiency. Therefore, these two drying methods not only increase the breakage rate of the wafers, but also have poor drying effects on wafers with rough surfaces. There is certain contamination when turning over and drying, which affects the drying efficiency. Summary of the invention

[0004] The purpose of the present invention is to overcome the above shortcomings and provide a wafer isopropyl alcohol atomization drying device to reduce the breakage rate of wafers during drying, improve the drying effect on wafers with rough surfaces, realize double-sided flip drying through a wafer flip vacuum suction cup assembly, reduce pollution and improve drying efficiency.

[0005] The object of the present invention is achieved through the following technical scheme: a wafer isopropyl alcohol atomization drying device, comprising a drying box and a wafer swing plate mechanism placed in the drying box, the upper end surface of the wafer swing plate mechanism has a plurality of wafer flipping vacuum suction cup assemblies distributed circumferentially at equal intervals, and the upper side of the drying box has a circumferentially rotating water vapor introduction assembly; The water vapor introduction component includes a rotating disk arranged on the upper side of the drying box body, the rotating disk is provided with a deionized water pipeline, an isopropanol pipeline and a hot nitrogen pipeline, the rotating disk is placed directly above the wafer swing disk mechanism, the deionized water pipeline, the isopropanol pipeline and the hot nitrogen pipeline on the rotating disk are distributed along the rotating direction of the rotating disk, and the deionized water pipeline, the isopropanol pipeline and the hot nitrogen pipeline are placed directly above any wafer workpiece; Multiple wafer workpieces are horizontally positioned on the wafer flip type vacuum suction cup assembly in sequence, the wafer swing plate mechanism swings horizontally, the water vapor introduction assembly rotates in a circle, the deionized water pipeline of the water vapor introduction assembly sprays deionized water to the wafer workpiece on the wafer flip type vacuum suction cup assembly, so that a water film is formed on the surface of the wafer workpiece, and the isopropyl alcohol pipeline of the water vapor introduction assembly sprays isopropyl alcohol mist to the wafer workpiece on the wafer flip type vacuum suction cup assembly, and the different surface tensions between isopropyl alcohol and deionized water and the swing of the wafer swing plate mechanism are used to remove water molecules on the surface of the wafer workpiece. It flows back to the bottom of the drying box to achieve preliminary drying of the surface of the wafer workpiece; the isopropyl alcohol pipeline of the water vapor introduction component continuously sprays isopropyl alcohol mist, and the hot nitrogen pipeline of the water vapor introduction component sprays hot nitrogen to the wafer workpiece on the wafer swing plate mechanism. The isopropyl alcohol mist is easier to enter the grooves on the surface of the wafer workpiece under the carry of hot nitrogen, and the grooves on the surface of the wafer workpiece are dried again under the swinging action of the wafer swing plate mechanism; when the upper end face of the wafer workpiece is dried, the wafer flipping vacuum suction cup assembly flips the wafer workpiece to dry the other end face.

[0006] A further improvement of the present invention is that the wafer swing plate mechanism includes a supporting base arranged at the center of the drying box and a reduction motor placed at the center of the supporting base. The supporting base is provided with vertical positioning plates on the left and right sides of the reduction motor, and the driving end of the reduction motor is eccentrically connected to a supporting rotating rod. A wafer swing plate is provided above the two vertical positioning plates, and a central connecting column is provided at the center of the lower end surface of the wafer swing plate. The upper end of the supporting rotating rod is fixedly connected to the center of the lower end surface of the central connecting column, and the extension direction of the supporting rotating rod is consistent with the extension direction of the central connecting column. A limiting movable component is used between the central connecting column and the vertical positioning plates on both sides to realize support and limitation of the wafer swing plate during its circular swing.

[0007] A further improvement of the present invention is that: the position limiting movable assembly comprises a positioning rod body 1 arranged on the inner side of the vertical positioning plate and a positioning rod body 2 arranged on both sides of the center connecting column, and the center connecting column and the two vertical positioning plates are movably connected by a sleeve ring, and the sleeve ring is sleeved on the two positioning rod bodies 1 and the two positioning rod bodies 2; The sleeve ring includes a ring body portion which is sequentially sleeved on the first positioning rod body and the second positioning rod body. Two adjacent ring bodies are fixedly connected via an arc body portion. Multiple ring bodies are connected to multiple arc bodies to form a ring-shaped structure.

[0008] A further improvement of the present invention is that: the wafer flipping vacuum suction cup assembly comprises a driving box arranged on the wafer swinging plate, a workpiece positioning plate arranged through the driving box, and a flipping stopper driving the bottom of the workpiece positioning plate to flip and position, and the wafer workpiece is adsorbed on the workpiece positioning plate by vacuum; The turning limiter comprises a rotating disk body arranged on the side end surface of the driving box and a reduction motor two arranged in the driving box, a fixing block is fixedly arranged in the driving box, the upper end surface of the fixing block has a concave portion, the lower end surface of the fixing block has a convex portion, and the concave portion and the convex portion have a smooth transition, the upper and lower end surfaces of the workpiece positioning plate are provided with a workpiece material stopper plate, the two workpiece material stopper plates are respectively connected with the concave portion and the convex portion of the fixing block, a connecting rod one is fixedly connected between the end of the workpiece positioning plate and the fixing block, one end of the connecting rod two away from the workpiece positioning plate horizontally penetrates the rotating disk body, the fixing block and is fixedly connected to the driving end of the reduction motor two, the connecting rod two is fixedly connected to the center of the rotating disk body, and the connecting rod two is movably connected to the fixing block, the two connecting rods one both horizontally penetrate the rotating disk body, the circumferential limit between the connecting rod one and the rotating disk body is realized by a circumferential limit clamp, and a spring is sleeved on the outer circumference of the connecting rod one placed between the inner wall of the driving box and the fixing block; Before the water vapor is passed into the assembly to spray and dry the upper surface of the wafer workpiece on the workpiece positioning plate, the upper connecting rod 1 contacts the concave portion, so that the upper workpiece material stopper plate is separated from the upper surface of the wafer workpiece, which is convenient for positioning the wafer workpiece into the workpiece positioning plate, and the lower connecting rod 1 contacts the convex portion, so that the lower workpiece material stopper plate is lifted to the bottom of the wafer workpiece, thereby realizing the vertical load-bearing limit of the wafer workpiece; When the water vapor is introduced into the assembly to spray and dry the lower surface of the wafer workpiece on the workpiece positioning plate, the reduction motor 2 drives the connecting rod 2 and the rotating disk body to rotate 180° in a circle, and simultaneously drives the workpiece positioning plate and the two workpiece stop plates to rotate 180° in a circle, thereby realizing the flipping of the wafer workpiece on the workpiece stop plate. At the same time, the upper and lower connecting rods 1 realize offset movement during the circular rotation as the positions of the concave portion and the convex portion are switched, so that the workpiece stop plate on the lower side after the flipping is still placed on the lower end surface of the wafer workpiece to limit its vertical load.

[0009] A further improvement of the present invention is that the circumferential limit clamp includes two through holes arranged on the rotating disc body, two connecting rods pass through the two through holes in sequence, both sides of the through holes have limit grooves, and connecting rod one has limit ribs corresponding to the two limit grooves in sequence, and the extension direction of the limit ribs is consistent with the extension direction of connecting rod one.

[0010] A further improvement of the present invention is that one end of the connecting rod close to the fixed block has a rotating ball in contact with the fixed block, one end of the spring is in contact with the rotating ball, and the other end of the spring is fixed to the rotating disc body.

[0011] A further improvement of the present invention is that: the workpiece positioning plate is provided with an embedding hole for accommodating the wafer workpiece to be placed horizontally, and the upper and lower end surfaces of the wafer workpiece are flush with the upper and lower end surfaces of the workpiece positioning plate.

[0012] A further improvement of the present invention is that a vacuum suction cup is embedded in the end surface of the workpiece stopper plate that contacts the wafer workpiece.

[0013] A further improvement of the present invention is that a water storage tank is provided on the lower side of the drying box body, and a sinking cone surface is provided at the bottom of the drying box body for supplying deionized water on the surface of the wafer workpiece to flow to the water storage tank. A connecting pipe is provided between the center of the sinking cone surface and the water storage tank, and the water storage tank is connected to the deionized water pipeline to realize the circulation of deionized water.

[0014] A further improvement of the present invention is that the rotating disc includes a rotating disc body that rotates with the top of the drying box body and a driving disc body placed on the upper end surface of the rotating disc body, the rotating disc body and the driving disc body are coaxially arranged, and the outer circumference of the rotating disc body has a gear ring, the top of the drying box body is provided with a reduction motor three, and the driving shaft of the reduction motor three has a gear that meshes with the gear ring.

[0015] Compared with the prior art, the present invention has the following advantages: 1. The present invention positions multiple wafer workpieces on the wafer flipping vacuum suction cup assembly of the wafer swing plate mechanism, sprays deionized water on multiple wafer workpieces on the wafer swing plate in sequence through the rotating water vapor introduction assembly to form a water film on the surface of the wafer workpiece, and then sprays isopropyl alcohol mist, and utilizes the difference in surface tension between the isopropyl alcohol mist and the deionized water to absorb the water molecules in the grooves on the surface of the wafer and quickly return the water molecules to the bottom of the drying box under the swinging action of the wafer swing plate, so as to achieve preliminary drying, and finally sprays hot nitrogen on multiple wafer workpieces in sequence, and the isopropyl alcohol molecules are carried by the hot nitrogen, and are more likely to enter the grooves on the surface of the wafer workpiece, take away the water molecules in the grooves, avoid residual water vapor in the grooves on the surface of the wafer workpiece, achieve re-drying, and improve the drying effect of the wafer with an uneven surface. The present invention combines the water vapor introduction assembly with the wafer swing plate mechanism, changes the traditional high-speed rotation mode through the micro-swinging mode, further accelerates the separation of the water molecules on the surface of the wafer workpiece, and at the same time avoids the damage of the wafer workpiece due to the overload force generated by the high-speed rotation.

[0016] 2. The wafer workpiece in the present invention is positioned on the wafer flipping vacuum suction cup assembly, and the workpiece positioning plate and the rotating disc body are driven to rotate as a whole by the reduction motor 2 in the driving box, so that the workpiece blocking plates on the upper and lower sides of the workpiece positioning plate are synchronously rotated with the workpiece positioning plate, and at the same time, the connecting rod 2 at one end of the workpiece blocking plate is driven to switch between the concave portion and the convex portion of the fixed block, so that the workpiece blocking plate located on the lower side after flipping is lifted to the lower end surface of the wafer workpiece and vacuum-absorbed on it, and the workpiece blocking plate located on the upper side after flipping is withdrawn from the upper surface of the wafer workpiece, providing an avoidance space for drying the upper surface of the wafer workpiece, and the double-sided flipping drying of the wafer workpiece is achieved by the wafer flipping vacuum suction cup assembly, thereby reducing pollution and improving drying efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of a wafer isopropyl alcohol atomization drying device in the present invention.

[0018] Figure 2 for Figure 1 Schematic diagram of the structure of the wafer swing plate mechanism.

[0019] Figure 3 for Figure 2 Connection diagram of the middle limit movable component.

[0020] Figure 4 for Figure 3 Schematic diagram of the position of the wafer flip vacuum suction cup assembly on the wafer swing plate.

[0021] Figure 5 for Figure 4 Schematic diagram of the structure of the wafer flipping vacuum suction cup assembly.

[0022] Figure 6 for Figure 5 Structural section view along AA axis.

[0023] Numbers in the figure: 1-drying box, 2-wafer swing plate mechanism, 3-wafer flip vacuum suction cup assembly, 4-water vapor introduction assembly, 5-wafer workpiece; 21-support base, 22-reduction motor 1, 23-vertical positioning plate, 24-support rotating rod, 25-wafer swing plate, 26-center connecting column, 27-limiting movable assembly; 271-positioning rod body 1, 272-positioning rod body 2, 273-sleeve ring, 2731-ring body, 2732-arc body; 31-driving box, 32-workpiece positioning plate, 33-flipping limiter, 331-rotating disc body, 332-reduction motor 2, 333-fixing block, 334-concave part, 335-convex part, 336-workpiece blocking plate, 337-connecting rod 1, 338-connecting rod 2, 339-circumferential limiter, 3310-spring, 3311-rotating ball, 3312-embedded hole, 3313-vacuum suction cup; 3391-through hole, 3392-limiting groove, 3393-limiting convex rib; 41-deionized water pipeline, 42-isopropanol pipeline, 43-hot nitrogen pipeline, 44-rotating disc, 441-rotating disc body, 442-driving disc body, 443-gear ring, 444-reduction motor 2, 445-gear. DETAILED DESCRIPTION

[0024] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with embodiments and drawings. The embodiments are only used to explain the present invention and do not constitute a limitation on the protection scope of the present invention.

[0025] In the description of the present invention, it is necessary to understand that terms indicating orientation or positional relationships, such as orientation or positional relationships based on the drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the structure or unit referred to must have a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0026] In the present invention, unless otherwise clearly stipulated and limited, terms such as "connected", "provided with", "having" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be said to be a mechanical connection, or it can be directly connected, or it can be connected through an intermediate medium. For those skilled in the art, the basic meaning of the above terms in the present invention can be understood according to the specific circumstances.

[0027] A wafer isopropyl alcohol atomization drying device, referring to Figure 1 , comprising a drying box 1 and a wafer swing plate mechanism 2 placed in the drying box 1, the upper end surface of the wafer swing plate mechanism 2 has a plurality of wafer flipping vacuum suction cup assemblies 3 distributed circumferentially at equal intervals, and the upper side of the drying box 1 has a circumferentially rotating water vapor introduction assembly 4; The water vapor introduction component 4 includes a rotating disk 44 arranged on the upper side of the drying box 1, and a deionized water pipeline 41, an isopropanol pipeline 42 and a hot nitrogen pipeline 43 are arranged on the rotating disk 44. The rotating disk 44 is placed directly above the wafer swing disk mechanism 2. The deionized water pipeline 41, the isopropanol pipeline 42 and the hot nitrogen pipeline 43 on the rotating disk 44 are distributed along the rotation direction of the rotating disk 44, and the deionized water pipeline 41, the isopropanol pipeline 42 and the hot nitrogen pipeline 43 are placed directly above any wafer workpiece 5; A plurality of wafer workpieces 5 are horizontally positioned on the wafer flipping vacuum chuck assembly 3 in sequence, the wafer swing plate mechanism 2 swings horizontally, the water vapor introduction assembly 4 rotates in a circle, the deionized water pipeline 41 of the water vapor introduction assembly 4 sprays deionized water to the wafer workpiece 5 on the wafer flipping vacuum chuck assembly 3, so that a water film is formed on the surface of the wafer workpiece 5, and the isopropyl alcohol pipeline 42 of the water vapor introduction assembly 4 sprays isopropyl alcohol mist to the wafer workpiece 5 on the wafer flipping vacuum chuck assembly 3, and utilizes the difference in surface tension between isopropyl alcohol and deionized water and the swing of the wafer swing plate mechanism 2 to remove moisture from the surface of the wafer workpiece 5 The isopropyl alcohol mist flows back to the bottom of the drying box 1 to achieve preliminary drying of the surface of the wafer workpiece 5; the isopropyl alcohol pipeline 42 of the water vapor introduction component 4 continuously sprays isopropyl alcohol mist, and the hot nitrogen pipeline 43 of the water vapor introduction component 4 sprays hot nitrogen to the wafer workpiece 5 on the wafer swing plate mechanism 2. The isopropyl alcohol mist is more easily carried by the hot nitrogen into the grooves on the surface of the wafer workpiece 5, and the grooves on the surface of the wafer workpiece 5 are dried again under the swinging action of the wafer swing plate mechanism 2; when the upper end face of the wafer workpiece 5 is dried, the wafer flipping vacuum suction cup assembly 3 flips the wafer workpiece 5 to dry the other end face.

[0028] The present invention positions a plurality of wafer workpieces 5 on a wafer flipping vacuum suction cup assembly 3 of a wafer swing plate mechanism 2, and sequentially sprays deionized water on the plurality of wafer workpieces 5 on the wafer swing plate 25 through a rotating water vapor introduction assembly 4 to form a water film on their surfaces, and then sprays isopropyl alcohol mist vapor, and utilizes the difference in surface tension between the isopropyl alcohol mist vapor and the deionized water to absorb water molecules in the grooves on the wafer surfaces, and rapidly returns the water molecules to the bottom of the drying box 1 under the swinging action of the wafer swing plate 25, thereby achieving preliminary drying, and finally sequentially spraying hot nitrogen gas on the plurality of wafer workpieces 5, and the isopropyl alcohol molecules, carried by the hot nitrogen gas, are more easily able to enter the grooves on the surfaces of the wafer workpieces 5, and take away the water molecules in the grooves, thereby avoiding residual water vapor in the grooves on the surfaces of the wafer workpieces 5, thereby achieving secondary drying, and improving the drying effect on wafers with rough surfaces. The present invention combines the water vapor introduction component 4 with the wafer swing plate mechanism 2, and changes the traditional high-speed rotation mode through micro-swinging mode, thereby further accelerating the separation of water molecules on the surface of the wafer workpiece 5, while avoiding damage to the wafer workpiece due to overload force generated by high-speed rotation.

[0029] Based on this embodiment, refer to Figure 2The wafer swing plate mechanism 2 includes a support base 21 arranged at the center of the drying box 1 and a reduction motor 22 placed at the center of the support base 21. The support base 21 is placed at the left and right sides of the reduction motor 22 and has vertical positioning plates 23 respectively. The driving end of the reduction motor 22 is eccentrically connected to a support rotating rod 24. A wafer swing plate 25 is provided above the two vertical positioning plates 23. A central connecting column 26 is provided at the center of the lower end surface of the wafer swing plate 25. The upper end of the support rotating rod 24 is fixedly connected to the center of the lower end surface of the central connecting column 26, and the extension direction of the support rotating rod 24 is consistent with the extension direction of the central connecting column 26. The central connecting column 26 and the vertical positioning plates 23 on both sides are supported and limited by a limiting movable component 27 to limit the circular swing of the wafer swing plate 25.

[0030] The working principle of the wafer swing mechanism 2 is as follows: the reduction motor 22 is started, driving the central connecting column 26 eccentrically connected to the reduction motor 22 and the supporting rotating rod 24 to rotate, thereby realizing the swinging and shaking of the wafer swing plate 25 in the circumferential direction, accelerating the separation of water molecules from the surface of the wafer workpiece 5.

[0031] Based on this embodiment, refer to Figure 3 The limiting movable assembly 27 includes a positioning rod body 1 271 arranged on the inner side of the vertical positioning plate 23 and a positioning rod body 272 arranged on the front and rear sides of the central connecting column 26. The central connecting column 26 and the two vertical positioning plates 23 are movably connected through a ring 273, and the ring 273 is sleeved on the two positioning rod bodies 1 271 and the two positioning rod bodies 272.

[0032] The collar 273 includes a ring body 2731 which is sequentially sleeved on the first positioning rod body 271 and the second positioning rod body 272 . Two adjacent ring bodies 2731 are fixedly connected via an arc body 2732 . A plurality of ring bodies 2731 and a plurality of arc bodies 2732 are connected to form a ring-shaped structure.

[0033] Among them, the limiting movable component 27 plays a certain supporting and limiting role on the swinging wafer swing plate 25, avoiding that the gravity of the wafer swing plate 25, the wafer flip vacuum suction cup assembly 3, and multiple wafer workpieces 5 are all concentrated on the driving end of the supporting rotating rod 24 and the reduction motor 22, thereby damaging the supporting rotating rod 24 and the reduction motor 22.

[0034] Based on this embodiment, refer to Figures 4 to 6 The wafer flipping vacuum suction cup assembly 3 includes a driving box 31 arranged on the wafer swing plate 25, a workpiece positioning plate 32 arranged through the driving box 31, and a flipping stopper 33 driving the upper and lower sides of the workpiece positioning plate 32 to flip and position, and the wafer workpiece 5 is adsorbed on the workpiece positioning plate 32 by vacuum; The flip limiter 33 includes a rotating disc body 331 arranged on the side end surface of the driving box 31 and a reduction motor 332 arranged in the driving box 31. A fixed block 333 is fixedly arranged in the driving box 31. The upper end surface of the fixed block 333 has a concave portion 334, and the lower end surface of the fixed block 333 has a convex portion 335. The concave portion 334 and the convex portion 335 have a smooth transition. The upper and lower end surfaces of the workpiece positioning plate 32 are both provided with a workpiece stopper plate 336. A connecting rod 337 is respectively connected between the two workpiece stopper plates 336 and the concave portion 334 and the convex portion 335 of the fixed block 333. A connecting rod 338 is fixedly connected between the workpiece positioning plate 32, and one end of the connecting rod 338 away from the workpiece positioning plate 32 horizontally penetrates the rotating disc body 331 and the fixed block 333 and is fixedly connected to the driving end of the reduction motor 332. The connecting rod 338 is fixedly connected to the center of the rotating disc body 331, and the connecting rod 338 is movably connected to the fixed block 333. The two connecting rods 337 both horizontally penetrate the rotating disc body 331, and the circumferential limiting clamp 339 is used to realize the circumferential limiting between the connecting rod 337 and the rotating disc body 331. A spring 3310 is sleeved on the outer circumference of the connecting rod 337 placed between the inner wall of the drive box 31 and the fixed block 333. Before the water vapor introduction component 4 sprays and dries the upper surface of the wafer workpiece 5 on the workpiece positioning plate 32, the upper connecting rod 337 contacts the concave portion 334, so that the upper workpiece stop plate 336 is separated from the upper surface of the wafer workpiece 5, which is convenient for positioning the wafer workpiece 5 into the workpiece positioning plate 32, and the lower connecting rod 337 contacts the convex portion 335, so that the lower workpiece stop plate 336 is lifted to the bottom of the wafer workpiece 5, so as to realize the vertical load limit of the wafer workpiece 5; When the water vapor introduction component 4 sprays and dries the lower surface of the wafer workpiece 5 on the workpiece positioning plate 32, the reduction motor 2 332 drives the connecting rod 2 338 and the rotating disk body 331 to rotate 180° in a circle, and simultaneously drives the workpiece positioning plate 32 and the two workpiece stop plates 336 to rotate 180° in a circle, thereby realizing the flipping of the wafer workpiece 5 on the workpiece stop plate 336. At the same time, the upper and lower connecting rods 1 337 are offset and moved during the circular rotation as the positions of the concave portion 334 and the convex portion 335 are switched, so that the workpiece stop plate 336 on the lower side after the flipping is still placed on the lower end surface of the wafer workpiece 5 to limit its vertical load.

[0035] The wafer workpiece 5 in the present invention is positioned on the wafer flipping vacuum suction cup assembly 3, and the workpiece positioning plate 32 and the rotating disk body 331 are driven to rotate as a whole by the reduction motor 2 332 in the driving box 31, so that the workpiece material blocking plates 336 on the upper and lower sides of the workpiece positioning plate 32 are synchronously rotated with the workpiece positioning plate 32, and at the same time, the connecting rod 1 337 at one end of the workpiece material blocking plate 336 is driven to switch between the concave portion 334 and the convex portion 335 of the fixed block 333, so that the workpiece material blocking plate 336 disposed on the lower side after flipping is lifted to the lower end surface of the wafer workpiece 5 and vacuum-absorbed, and the workpiece material blocking plate 336 disposed on the upper side after flipping is withdrawn from the upper surface of the wafer workpiece 5, providing an avoidance space for drying the upper surface of the wafer workpiece 5, and the double-sided flipping drying of the wafer workpiece 5 is achieved through the wafer flipping vacuum suction cup assembly 3, thereby reducing pollution and improving drying efficiency.

[0036] On the basis of this embodiment, the circumferential limit clamp 339 includes two through holes 3391 arranged on the rotating disk body 331, and two connecting rods 337 pass through the two through holes 3391 in sequence. Both sides of the through holes 3391 have limit grooves 3392, and the connecting rod 337 has limit ribs 3393 corresponding to the two limit grooves 3392 in sequence, and the extension direction of the limit ribs 3393 is consistent with the extension direction of the connecting rod 337.

[0037] In the present application, the connecting rod 2 338 drives the rotating disc body 331 to rotate as a whole as the reduction motor 2 332 drives. During rotation, the ends of the two connecting rods 1 337 passing through the through hole 3391 slide from the concave portion 334 to the convex portion 335 or from the convex portion 335 to the concave portion 334. Due to the cooperation between the limiting rib 3393 and the limiting groove 3392, the two connecting rods 1 337 make axial displacement under the elastic force of the spring 3310 during the rotation of the rotating disc body 331, thereby realizing the alternating displacement of the two workpiece baffle plates 336.

[0038] On the basis of this embodiment, one end of the connecting rod 337 close to the fixed block 333 has a rotating ball 3311 in contact with the fixed block 333, one end of the spring 3310 is in contact with the rotating ball 3311, and the other end of the spring 3310 is fixed to the rotating disc body 331. When the connecting rod 337 rotates with the rotating disc body 331, the rotating ball 3311 arranged at its end has the function of reducing the friction between the connecting rod 337 and the fixed block 333, thereby avoiding direct wear between the connecting rod 337 and the fixed block 333.

[0039] On the basis of this embodiment, the workpiece positioning plate 32 has an embedding hole 3312 for accommodating the wafer workpiece 5 to be placed horizontally, and the upper and lower end surfaces of the wafer workpiece 5 are flush with the upper and lower end surfaces of the workpiece positioning plate 32 .

[0040] On the basis of this embodiment, a vacuum suction cup 3313 is embedded in the end surface of the workpiece stopper plate 336 that contacts the wafer workpiece 5 . The vacuum suction cup 3313 in this application has the function of adsorbing the wafer workpiece 5 into the workpiece positioning plate 32 .

[0041] Based on this embodiment, a water tank 6 is provided on the lower side of the drying box body 1, and a sinking cone 7 is provided at the bottom of the drying box body 1 for supplying deionized water on the surface of the wafer workpiece 5 to flow to the water tank 6. A connecting pipe 8 is provided between the center of the sinking cone 7 and the water tank 6, and the water tank 6 is connected to the deionized water pipeline 41 to realize the circulation of deionized water.

[0042] On the basis of this embodiment, the rotating disk 44 includes a rotating disk 441 that rotates with the top of the drying box 1 and a driving disk 442 placed on the upper end surface of the rotating disk 441. The rotating disk 441 and the driving disk 442 are coaxially arranged, and the outer circumference of the rotating disk 441 has a ring gear 443. The top of the drying box 1 is provided with a reduction motor 3 444. The driving shaft of the reduction motor 3 444 has a gear 445 that meshes with the ring gear 443. After the reduction motor 3 444 is started, the gear 445 is driven to mesh with the ring gear 443, thereby driving the rotating disk 44 to rotate in a circle, driving the water vapor introduction component 4 to pass in sequence directly above the multiple wafer workpieces 5, so as to facilitate the spraying of deionized water, isopropyl alcohol mist and hot nitrogen to the multiple wafer workpieces 5.

[0043] Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A wafer isopropyl alcohol atomization drying device, characterized in that: It comprises a drying box (1) and a wafer swing plate mechanism (2) placed in the drying box (1), the upper end surface of the wafer swing plate mechanism (2) having a plurality of wafer flipping vacuum suction cup assemblies (3) distributed circumferentially at equal intervals, and the upper side of the drying box (1) having a circumferentially rotating water vapor introduction assembly (4); The water vapor introduction component (4) comprises a rotating disk (44) arranged on the upper side of the drying box (1), the rotating disk (44) having a deionized water pipeline (41), an isopropanol pipeline (42) and a hot nitrogen pipeline (43), the rotating disk (44) being placed directly above the wafer swing disk mechanism (2), the deionized water pipeline (41), the isopropanol pipeline (42) and the hot nitrogen pipeline (43) on the rotating disk (44) being distributed along the rotation direction of the rotating disk (44), and the deionized water pipeline (41), the isopropanol pipeline (42) and the hot nitrogen pipeline (43) being placed directly above any wafer workpiece (5); A plurality of wafer workpieces (5) are horizontally positioned on a wafer flipping vacuum suction cup assembly (3) in sequence, a wafer swing plate mechanism (2) swings in the horizontal direction, a water vapor introduction assembly (4) rotates in a circle, a deionized water pipeline (41) of the water vapor introduction assembly (4) sprays deionized water onto the wafer workpieces (5) on the wafer flipping vacuum suction cup assembly (3), so that a water film is formed on the surface of the wafer workpieces (5), an isopropyl alcohol pipeline (42) of the water vapor introduction assembly (4) sprays isopropyl alcohol mist onto the wafer workpieces (5) on the wafer flipping vacuum suction cup assembly (3), and utilizes the difference in surface tension between isopropyl alcohol and deionized water and the swinging of the wafer swing plate mechanism (2) to remove water from the surface of the wafer workpieces (5). The molecules flow back to the bottom of the drying box (1), thereby achieving preliminary drying of the surface of the wafer workpiece (5); the isopropyl alcohol pipeline (42) of the water vapor introduction component (4) continuously sprays isopropyl alcohol mist, and the hot nitrogen pipeline (43) of the water vapor introduction component (4) sprays hot nitrogen toward the wafer workpiece (5) on the wafer swing plate mechanism (2); the isopropyl alcohol mist is carried by the hot nitrogen and more easily enters the grooves on the surface of the wafer workpiece (5), and the grooves on the surface of the wafer workpiece (5) are dried again under the swinging action of the wafer swing plate mechanism (2); when the upper end surface of the wafer workpiece (5) is dried, the wafer flipping vacuum suction cup component (3) flips the wafer workpiece (5) to dry the other end surface.

2. The wafer isopropyl alcohol atomization drying device according to claim 1, characterized in that: The wafer swing plate mechanism (2) comprises a support base (21) arranged at the center of the drying box (1) and a reduction motor (22) arranged at the center of the support base (21); the support base (21) is provided with vertical positioning plates (23) at the left and right sides of the reduction motor (22); the driving end of the reduction motor (22) is eccentrically connected to a support rotating rod (24); a wafer swing plate (25) is provided above the two vertical positioning plates (23); a center connecting column (26) is provided at the center of the lower end surface of the wafer swing plate (25); the upper end of the support rotating rod (24) is fixedly connected to the center of the lower end surface of the center connecting column (26); the extension direction of the support rotating rod (24) is consistent with the extension direction of the center connecting column (26); the center connecting column (26) and the vertical positioning plates (23) on both sides are connected by limit movable components (27) to achieve support and limit of the wafer swing plate (25) during circular swing.

3. The wafer isopropyl alcohol atomization drying device according to claim 2, characterized in that: The limit movable assembly (27) comprises a first positioning rod body (271) arranged on the inner side of the vertical positioning plate (23) and a second positioning rod body (272) arranged on both sides of the center connecting column (26), wherein the center connecting column (26) and the two vertical positioning plates (23) are movably connected via a sleeve ring (273), and the sleeve ring (273) is sleeved on the two first positioning rod bodies (271) and the two second positioning rod bodies (272); The sleeve ring (273) comprises a ring body portion (2731) which is sequentially sleeved on the first positioning rod body (271) and the second positioning rod body (272); two adjacent ring body portions (2731) are fixedly connected via a circular arc body portion (2732); and a plurality of ring body portions (2731) and a plurality of circular arc body portions (2732) are connected to form a ring-shaped structure.

4. The wafer isopropyl alcohol atomization drying device according to claim 3, characterized in that: The wafer flipping vacuum suction cup assembly (3) comprises a driving box (31) arranged on a wafer swinging plate (25), a workpiece positioning plate (32) arranged through the driving box (31), and a flipping stopper (33) for driving the upper and lower surfaces of the workpiece positioning plate (32) to flip and position, and the wafer workpiece (5) is adsorbed on the workpiece positioning plate (32) by vacuum. The flip limiter (33) comprises a rotating disc (331) arranged on the side end surface of the drive box (31) and a second reduction motor (332) arranged in the drive box (31); a fixed block (333) is fixedly arranged in the drive box (31); the upper end surface of the fixed block (333) has a concave portion (334); the lower end surface of the fixed block (333) has a convex portion (335); the concave portion (334) and the convex portion (335) have a smooth transition; the upper and lower end surfaces of the workpiece positioning plate (32) both have workpiece stopper plates (336); the two workpiece stopper plates (336) are respectively connected to the concave portion (334) and the convex portion (335) of the fixed block (333); the end of the workpiece positioning plate (32) is connected to the fixed block (333) A second connecting rod (338) is fixedly connected between the workpiece positioning plate (33), one end of the second connecting rod (338) away from the workpiece positioning plate (32) horizontally penetrates the rotating disc body (331), the fixed block (333) and is fixedly connected to the driving end of the second reduction motor (332), the second connecting rod (338) is fixedly connected to the center of the rotating disc body (331), and the second connecting rod (338) is movably connected to the fixed block (333), the two connecting rods (337) both horizontally penetrate the rotating disc body (331), the circumferential limiting clamp (339) is used to realize circumferential limiting between the first connecting rod (337) and the rotating disc body (331), and a spring (3310) is sleeved on the outer circumference of the first connecting rod (337) placed between the inner wall of the drive box (31) and the fixed block (333); Before the water vapor introduction component (4) sprays and dries the upper surface of the wafer workpiece (5) on the workpiece positioning plate (32), the upper connecting rod (337) contacts the concave portion (334), so that the upper workpiece stop plate (336) is separated from the upper surface of the wafer workpiece (5), thereby facilitating the positioning of the wafer workpiece (5) into the workpiece positioning plate (32); the lower connecting rod (337) contacts the convex portion (335), so that the lower workpiece stop plate (336) is lifted to the bottom of the wafer workpiece (5), thereby realizing vertical load-bearing and limiting of the wafer workpiece (5); When the water vapor introduction component (4) sprays and dries the lower surface of the wafer workpiece (5) on the workpiece positioning plate (32), the second reduction motor (332) drives the second connecting rod (338) and the rotating disc (331) to rotate 180 degrees in a circle, and simultaneously drives the workpiece positioning plate (32) and the two workpiece stop plates (336) to rotate 180 degrees in a circle, thereby realizing the flipping of the wafer workpiece (5) on the workpiece stop plates (336). At the same time, the upper and lower connecting rods (337) are displaced and moved as the positions of the concave portion (334) and the convex portion (335) are switched during the circular rotation, so that the lower workpiece stop plate (336) after flipping is still placed on the lower end surface of the wafer workpiece (5) to limit its vertical bearing.

5. The wafer isopropyl alcohol atomization drying device according to claim 4, characterized in that: The circumferential limiting clamp (339) comprises two through holes (3391) arranged on the rotating disc body (331); two connecting rods (337) pass through the two through holes (3391) in sequence; both sides of the through holes (3391) are provided with limiting grooves (3392); the connecting rod (337) is provided with limiting convex ribs (3393) corresponding to the two limiting grooves (3392) in sequence; and the extending direction of the limiting convex ribs (3393) is consistent with the extending direction of the connecting rod (337).

6. The wafer isopropyl alcohol atomization drying device according to claim 5, characterized in that: One end of the connecting rod 1 (337) close to the fixed block (333) has a rotating ball (3311) in contact with the fixed block (333), one end of the spring (3310) is in contact with the rotating ball (3311), and the other end of the spring (3310) is fixed to the rotating disc body (331).

7. The wafer isopropyl alcohol atomization drying device according to claim 6, characterized in that: The workpiece positioning plate (32) is provided with an embedding hole (3312) for accommodating a wafer workpiece (5) to be placed horizontally, and the upper and lower end surfaces of the wafer workpiece (5) are flush with the upper and lower end surfaces of the workpiece positioning plate (32).

8. The wafer isopropyl alcohol atomization drying device according to claim 7, characterized in that: A vacuum suction cup (3313) is embedded in the end surface of the workpiece material blocking plate (336) that contacts the wafer workpiece (5).

9. The wafer isopropyl alcohol atomization drying device according to claim 8, characterized in that: The drying box (1) has a water storage tank (6) at its lower side, and the bottom of the drying box (1) has a water-sinking cone (7) for supplying deionized water on the surface of the wafer workpiece (5) to flow toward the water storage tank (6). A connecting pipe (8) is provided between the center of the water-sinking cone (7) and the water storage tank (6), and the water storage tank (6) is connected to a deionized water pipeline (41) to achieve circulation of deionized water.

10. The wafer isopropyl alcohol atomization drying device according to claim 9, characterized in that: The rotating disc (44) comprises a rotating disc (441) rotatably matched with the top of the drying box (1) and a driving disc (442) disposed on the upper end surface of the rotating disc (441); the rotating disc (441) and the driving disc (442) are coaxially arranged, and the outer circumference of the rotating disc (441) has a gear ring (443); the top of the drying box (1) has a reduction motor three (444), and the driving shaft of the reduction motor three (444) has a gear (445) meshing with the gear ring (443).

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