IGBT Pin-Inserting Frame Sealing Equipment and Sealing Process

Abstract

The present invention belongs to the technical field of electrical components, specifically relates to semiconductor device packaging equipment, and particularly relates to a frame sealing device and a sealing process for IGBT pin insertion. When the frame sealing device for IGBT pin insertion is assembled, the hot air source is used to provide hot air to each carrier box and blow the IGBT modules in the carrier box to float, thereby avoiding scratching of the IGBT modules. At the same time, the temperature in the receiving groove is increased to delay the curing of the glue. By introducing hot air into the carrier box to keep the receiving groove warm, on the one hand, the curing of the glue is delayed, thereby improving the bonding effect. At the same time, the IGBT modules can be preheated in advance by the hot air to prevent the glue from curing directly when it comes into contact with the overly cold IGBT modules. On the other hand, the IGBT modules are transported in a suspended manner, which can avoid scratching of the IGBT modules during the material transfer on the turntable and improve the qualification rate of the frame for IGBT pin insertion.

Description

Technical Field

[0001] The present invention belongs to the technical field of electrical components, specifically relates to semiconductor device packaging equipment, and particularly relates to a frame sealing device and a sealing process for IGBT pin insertion. Background Art

[0002] When packaging an IGBT, glue needs to be applied to the pin surface, and then the cover body is passed through the pins and the cover body is bonded to the IGBT module.

[0003] In the related art, during bonding, the phenomenon that the IGBT module and the cover body are not firmly bonded and the IGBT module and the cover body fall off often occurs, resulting in the scrapping of the IGBT module and reducing the qualified rate of the IGBT module.

[0004] Therefore, how to improve the bonding firmness between the IGBT module and the cover body is a technical problem that needs to be solved urgently at present.

[0005] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application. Therefore, the above description is not considered as information of the prior art. Summary of the Invention

[0006] The embodiments of the present disclosure at least provide a frame sealing device and a sealing process for IGBT pin insertion.

[0007] In a first aspect, the embodiments of the present disclosure provide a frame sealing device for IGBT pin insertion, including:

[0008] An assembly platform, which is provided with a plurality of stations;

[0009] A rotating table, which is arranged on the assembly platform and is used to drive the IGBT module to flow among a plurality of stations;

[0010] A loading robot arm, which is arranged on the assembly platform and is used to grab the IGBT module and place it on the rotating table;

[0011] A glue spreading assembly, which is arranged on the assembly platform and is used to spread glue on the top surface of the IGBT module;

[0012] A cover closing robot arm, which is arranged on the assembly platform and is used to grab the cover body, align the pin holes of the cover body with the pins on the top surface of the IGBT module, and then cover the cover body on the IGBT module on the rotating table to complete the encapsulation;

[0013] A control module, which is electrically connected to the rotating table, the loading robot arm, the glue spreading assembly, and the cover closing robot arm, and is configured to control the rotating table, the loading robot arm, the glue spreading assembly, and the cover closing robot arm to work;

[0014] Among them, the rotating table includes a hot air source and a plurality of supporting boxes arranged in a circumferential array;

[0015] The supporting box is provided with a receiving groove;

[0016] A plurality of air blowing holes are uniformly distributed at the bottom of the receiving groove;

[0017] During assembly, the hot air source is used to supply hot air to each supporting box and blow the IGBT module in the supporting box to float, so as to avoid scratching the IGBT module.

[0018] In an optional embodiment, a preset distance is provided between the wall of the receiving groove and the IGBT module;

[0019] When placing the IGBT module, the hot air provided by the hot air source is used to preheat the IGBT module in the receiving groove;

[0020] When applying glue, the hot air provided by the hot air source is used to keep the receiving groove warm and delay the curing of the glue.

[0021] In an optional embodiment, a clamping assembly is further provided in the supporting box;

[0022] The clamping assembly is arranged in the supporting box and is used to adjust the IGBT module in the receiving groove to the center, so as to facilitate the positioning of the capping robot arm.

[0023] In an optional embodiment, the clamping assembly includes a plurality of pneumatic clamping plates;

[0024] A plurality of mounting recesses are provided on the wall of the receiving groove;

[0025] The plurality of pneumatic clamping plates are installed in the corresponding mounting recesses through return springs;

[0026] The mounting recess is communicated with the hot air source;

[0027] After the loading robot arm places the IGBT module into the receiving groove, the corresponding supporting box is conducted with the hot air source, and the pneumatic clamping plates clamp the floating IGBT module under the drive of the hot air.

[0028] In an optional embodiment, a shunt air duct is further provided in the side wall of the supporting box;

[0029] The shunt air duct is communicated with the mounting recess in the receiving groove.

[0030] In an optional embodiment, insertion grooves are provided on both sides of the bottom of the receiving groove;

[0031] When the jaws of the loading robotic arm and the capping robotic arm are working, they are inserted into the corresponding insertion slots.

[0032] In an alternative embodiment, the IGBT pin insertion frame sealing device further includes:

[0033] A vision detection component, which is arranged on the assembly platform and is used to obtain the image information of the IGBT module after gluing;

[0034] The control module is further configured to receive the image information and obtain the curing degree of the glue based on the graphic information;

[0035] If the curing degree is higher than the preset value, the temperature of the hot air blown out by the hot air source is increased.

[0036] In an alternative embodiment, a solenoid valve is provided at the connection between each support box and the air outlet pipe of the hot air source;

[0037] The control module is further configured to control the solenoid valve to conduct after the loading robotic arm places the IGBT module into the support box, so that the IGBT module floats; after the capping robotic arm removes the cover body and the IGBT module box cover, the control module controls the solenoid valve to shut off.

[0038] In a second aspect, the embodiments of the present disclosure further provide a sealing process applied to the IGBT pin insertion frame sealing device as described above. The process includes:

[0039] Control the loading robotic arm to start loading, grab the IGBT module and place it into the support box on the rotating table;

[0040] Control the hot air source to communicate with the support box, float the IGBT module in the support box, and preheat the IGBT module;

[0041] Control the rotating table to rotate, rotate the IGBT module to the lower part of the gluing component, and control the gluing component to apply glue;

[0042] Control the rotating table to rotate, rotate the IGBT module to the lower part of the capping robotic arm, and after the capping robotic arm grabs the cover body and aligns the pin holes of the cover body with the pins on the top surface of the IGBT module, cover the cover body on the IGBT module on the rotating table;

[0043] After the capping robotic arm takes out the encapsulated IGBT module, control the hot air source to disconnect from the corresponding support box.

[0044] In an alternative embodiment, the IGBT pin insertion frame sealing device further includes a vision detection component;

[0045] After gluing is completed and before capping the box;

[0046] The process further includes:

[0047] Controlling the rotation of the rotary table to rotate the IGBT module to the lower part of the vision detection component, and obtaining the image information of the IGBT module after gluing;

[0048] Receiving the image information, and obtaining the curing degree of the glue based on the graphic information;

[0049] If the curing degree is higher than the preset value, then increase the temperature of the hot air blown out by the hot air source.

[0050] The beneficial effect of the present invention is that the IGBT pin insertion frame sealing device and the sealing process keep the accommodation groove warm by introducing hot air into the supporting box. On the one hand, it delays the curing of the glue, thereby improving the bonding effect. At the same time, the IGBT module can be preheated in advance by the hot air to prevent the glue from curing directly when it comes into contact with the overly cold IGBT module. On the other hand, the IGBT module is transported in a suspended manner, which can avoid scratching of the IGBT module during the material transfer on the rotary table and improve the qualified rate of the IGBT module.

[0051] Other features and advantages of the present invention will be described in the following specification, and, in part, will be obvious from the specification, or will be understood by implementing the present invention. The objectives and other advantages of the present invention are achieved and obtained by the structures specifically pointed out in the specification and the drawings.

[0052] To make the above objectives, features, and advantages of the present invention more obvious and understandable, specific preferred embodiments are hereby given, and in conjunction with the accompanying drawings, the detailed description is as follows. Description of the Drawings

[0053] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0054] Figure 1 Structural schematic diagram of the IGBT pin insertion frame sealing device provided by the embodiment of the present disclosure;

[0055] Figure 2 Structural schematic diagram of the rotary table provided by the embodiment of the present disclosure;

[0056] Figure 3 Structural schematic diagram of the supporting box provided by the embodiment of the present disclosure;

[0057] Figure 4A cross-sectional view of the supporting box provided by the embodiment of the present disclosure;

[0058] Figure 5 An electrical control schematic diagram of the frame sealing device for IGBT pins provided by the embodiment of the present disclosure;

[0059] Figure 6 A flowchart of the sealing process of the frame sealing device for IGBT pins provided by the embodiment of the present disclosure.

[0060] In the figure: 100, assembly platform; 200, rotating table; 210, supporting box; 211, receiving groove; 2111, insertion groove; 212, air blowing hole; 213, clamping assembly; 2131, pneumatic clamping plate; 2132, return spring; 2133, mounting recess; 2134, shunt air passage; 220, solenoid valve; 300, loading robot arm; 400, glue applying assembly; 500, capping robot arm; 600, vision inspection assembly; 700, IGBT module; 800, cover body. Detailed implementation manners

[0061] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0062] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component can be directly formed on the second component, or a third component can be inserted between the first component and the second component. In addition, in the drawings, to effectively describe the technical content, the thickness of the components may be exaggerated or reduced.

[0063] Regarding the defects existing in the above solutions, they are all the results obtained by the inventor through practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present disclosure in this article for the above problems should be the contributions made by the inventor to the present disclosure during the process of the present disclosure.

[0064] It has been found through research that during the encapsulation of IGBT modules in the related art, due to external temperature reasons, the glue will solidify in advance, resulting in a decrease in the viscosity of the glue when capping the box, and the cover body cannot be firmly bonded to the IGBT module, thus causing the IGBT module and the cover body to fall off. At the same time, when applying glue, the overflowing glue is likely to cause the IGBT module to adhere to the rotating disk. As a result, when taking out the encapsulated frame later, the IGBT module adheres to the rotating table. When pulling the IGBT down by external force, the risk of the IGBT module and the cover body falling off will increase.

[0065] Based on the above research, an IGBT pin frame sealing device is provided in an embodiment of the present disclosure. A hot air source is used to blow the IGBT module to float, increase the temperature in the accommodation groove, delay the curing of the glue, preheat the IGBT module in advance, and avoid direct curing of the glue. At the same time, the IGBT module is directly separated from the rotating table to avoid adhesion between the IGBT module and the rotating table, thereby solving the technical problem that the cover is prone to falling off after being bonded to the IGBT in the related art.

[0066] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0067] The following will describe in detail some embodiments of the present invention with reference to the drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0068] Please refer to Figure 1 and Figure 5 At least one embodiment provides an IGBT pin frame sealing device, including the following structures.

[0069] An assembly platform 100, which is provided with a plurality of workstations.

[0070] A rotating table 200, which is arranged on the assembly platform 100 and is used to drive the IGBT module 700 to flow among a plurality of workstations.

[0071] A loading robot arm 300, which is arranged on the assembly platform 100 and is used to grab the IGBT module 700 and place it on the rotating table 200.

[0072] A glue spreading assembly 400, which is arranged on the assembly platform 100 and is used to spread glue on the top surface of the IGBT module 700.

[0073] A capping robot arm 500, which is arranged on the assembly platform 100 and is used to grab the cover 800, align the pin holes of the cover 800 with the pins on the top surface of the IGBT module 700, and then cap the cover 800 on the IGBT module 700 on the rotating table 200 to complete the encapsulation.

[0074] A control module, which is electrically connected to the rotating table 200, the loading robot arm 300, the glue spreading assembly 400, and the capping robot arm 500, and is configured to control the operation of the rotating table 200, the loading robot arm 300, the glue spreading assembly 400, and the capping robot arm 500. Please refer to Figure 2 and Figure 3, wherein, the rotary table 200 includes a hot air source and a plurality of supporting boxes 210 arranged in a circumferential array; the supporting box 210 is provided with a receiving groove 211; a plurality of air blowing holes 212 are uniformly distributed at the bottom of the receiving groove 211; during assembly, the hot air source is used to supply hot air to each supporting box 210, and blow the IGBT module 700 in the supporting box 210 to float, so as to avoid scratching the IGBT module 700. At the same time, the temperature in the receiving groove 211 is increased to delay the curing of the glue.

[0075] By introducing hot air into the supporting box 210 to keep the receiving groove 211 warm, on the one hand, the curing of the glue is delayed, thereby improving the bonding effect. At the same time, the IGBT module 700 can be preheated by the hot air to prevent the glue from curing directly when it contacts the overly cold IGBT module 700; on the other hand, the IGBT module 700 is transported in a suspended manner, which can avoid scratching the IGBT module 700 during the transfer of materials on the rotary table 200 and improve the qualified rate of the IGBT module 700.

[0076] It should be noted that the groove wall of the receiving groove 211 is spaced from the IGBT module 700 by a preset distance; when placing the IGBT module 700, the hot air provided by the hot air source preheats the IGBT module 700 in the receiving groove 211; when applying glue, the hot air provided by the hot air source keeps the receiving groove 211 warm to delay the curing of the glue. By setting the size of the receiving groove 211 to be larger than the size of the IGBT module 700, on the one hand, it meets the assembly requirements of different sizes, and on the other hand, it avoids scratching the IGBT module 700 when it falls in.

[0077] Please refer to Figure 3 and Figure 4 , a clamping assembly 213 is further arranged in the supporting box 210; the clamping assembly 213 is arranged in the supporting box 210 and is used to adjust the IGBT module 700 in the receiving groove 211 to the center, so as to facilitate the positioning of the capping robot arm 500. By clamping the IGBT module 700 with the clamping assembly 213, the position of the IGBT module 700 clamped by the clamping assembly 213 will not change when producing the same batch of IGBT modules 700, thus facilitating the subsequent positioning of the packaging robot arm, and aligning the pin holes of the cover body 800 with the pins of the IGBT module 700, thereby improving the assembly accuracy.

[0078] Specifically, the clamping assembly 213 includes a plurality of pneumatic clamping plates 2131; a plurality of mounting recesses 2133 are formed in the groove wall of the receiving groove 211; the plurality of pneumatic clamping plates 2131 are installed in the corresponding mounting recesses 2133 through return springs 2132; the mounting recesses 2133 are communicated with the hot air source; after the IGBT module 700 is placed in the receiving groove 211 by the loading robot arm 300, the corresponding supporting box 210 is conducted with the hot air source, and the pneumatic clamping plates 2131 clamp the floating IGBT module 700 under the drive of the hot air.

[0079] It should be noted that the air volume provided by the hot air source is always the same. Each time the clamping plate is activated for clamping, the movement process of each pneumatic clamping plate 2131 under the drive of the hot air is the same as the previous time, so as to ensure that the IGBT module 700 is fixed at the same position each time the pneumatic clamping plate 2131 clamps.

[0080] Please continue to refer to Figure 3 and Figure 4 , a shunt air duct 2134 is further provided in the side wall of the supporting box 210; the shunt air duct 2134 is communicated with the mounting recesses 2133 in the receiving groove 211. The hot air is dispersed through the shunt air duct 2134 to ensure that each pneumatic clamping plate 2131 can receive uniform wind force.

[0081] It should be noted that in order to prevent the pneumatic clamping plate 2131 from clamping and damaging the IGBT module 700 when clamping, the surface of the activated clamping plate is a flexible layer.

[0082] Please continue to refer to Figure 4 , insertion grooves 2111 are formed on both sides of the bottom of the receiving groove 211; when the clamping claws of the loading robot arm 300 and the capping robot arm 500 are working, they are inserted into the corresponding insertion grooves 2111. By providing the insertion grooves 2111, it is convenient for the insertion of the loading robot arm 300 and the capping robot arm 500.

[0083] Please refer to Figure 1 and Figure 5 , the IGBT pin frame sealing device further includes: a vision detection component 600, which is arranged on the assembly platform 100 and is used to obtain the image information of the IGBT module 700 after applying glue; the control module is further configured to receive the image information and obtain and judge the curing degree of the glue according to the graphic information; if the curing degree is higher than the preset value, the temperature of the hot air blown out by the hot air source is increased. By providing the vision detection component 600, the curing degree of the glue is detected to improve the quality of subsequent bonding.

[0084] Specifically, the preset value of the curing degree is obtained as follows:

[0085] Use a high-resolution camera to capture continuous images of the glue from the time of dispensing to complete curing to obtain sample data;

[0086] Denoise the sample data and improve the image quality of the sample data through histogram equalization;

[0087] Focus all the sample data on the glue area and crop the sample data centered on the focus point to complete the unification of the image size and complete the preprocessing of the sample data;

[0088] Extract features from the preprocessed sample data to obtain the color value of each image;

[0089] Sort the color values in the order of the acquisition time of the sample data to complete the construction of the curing degree time series characterized by the color values;

[0090] According to the glue performance, select the color value at one time point in the curing degree time series as the preset value of the curing degree, and this time point is set manually.

[0091] In order to control the on-off of each carrier box 210 with the hot air source respectively, an electromagnetic valve 220 is provided at the connection between each said carrier box 210 and the air outlet pipe of the hot air source; the control module is further configured to control the electromagnetic valve 220 to conduct after the loading robot arm 300 places the IGBT module 700 into the carrier box 210, so that the IGBT module 700 floats; after the capping robot arm 500 takes out the cover body 800 and the box cover of the IGBT module 700, control the electromagnetic valve 220 to shut off.

[0092] Please refer to Figure 6 , at least one embodiment further provides a sealing process applied to the IGBT pinning frame sealing device as described above, and the process includes:

[0093] S110: Control the loading robot arm to start loading, grab the IGBT module 700 and place it into the carrier box on the rotating table;

[0094] S120: Control the hot air source to conduct with the carrier box, float the IGBT module 700 in the carrier box, and preheat the IGBT module 700;

[0095] S130: Control the rotating table to rotate, rotate the IGBT module 700 to the lower part of the glue applying assembly, and control the glue applying assembly to apply glue;

[0096] S140: Control the rotation of the turntable to rotate the IGBT module 700 under the capping robotic arm. After controlling the capping robotic arm to grasp the cover body 800, align the pin holes of the cover body 800 with the pins on the top surface of the IGBT module 700, and then cap the cover body 800 on the IGBT module 700 on the turntable;

[0097] S150: After controlling the capping robotic arm to take out the encapsulated IGBT module 700, control the hot air source to disconnect from the corresponding support box.

[0098] It should be noted that the IGBT pin insertion frame sealing device further includes a vision detection component 600;

[0099] After the glue application is completed and before capping the box;

[0100] The process further includes: controlling the rotation of the turntable 200 to rotate the IGBT module 700 under the vision detection component 600 to obtain the image information of the IGBT module 700 after glue application; receiving the image information, and obtaining the degree of curing of the glue based on the graphic information. If the degree of curing is higher than the preset value, increase the temperature of the hot air blown by the hot air source.

[0101] In summary, the present invention provides a frame sealing device and a sealing process for IGBT pins. Among them, the frame sealing device for IGBT pins includes an assembly platform 100, which is provided with a plurality of workstations; a rotating table 200, which is arranged on the assembly platform 100 and is used to drive the IGBT module 700 to flow among the plurality of workstations; a loading robotic arm 300, which is arranged on the assembly platform 100 and is used to grab the IGBT module 700 and place it on the rotating table 200; a glue spreading assembly 400, which is arranged on the assembly platform 100 and is used to spread glue on the top surface of the IGBT module 700; a capping robotic arm 500, which is arranged on the assembly platform 100 and is used to grab the cover 800, align the pin holes of the cover 800 with the pins on the top surface of the IGBT module 700, and then cap the cover 800 on the IGBT module 700 on the rotating table 200 to complete the encapsulation; a control module, which is electrically connected to the rotating table 200, the loading robotic arm 300, the glue spreading assembly 400, and the capping robotic arm 500, and is configured to control the operation of the rotating table 200, the loading robotic arm 300, the glue spreading assembly 400, and the capping robotic arm 500. The rotating table 200 includes a hot air source and a plurality of supporting boxes 210 arranged in a circumferential array; the supporting box 210 is provided with a receiving groove 211; a plurality of air blowing holes 212 are evenly distributed at the bottom of the receiving groove 211; during assembly, the hot air source is used to provide hot air to each supporting box 210 and blow the IGBT module 700 in the supporting box 210 to float, so as to avoid scratching the IGBT module 700. At the same time, the temperature in the receiving groove 211 is increased to delay the curing of the glue. By introducing hot air into the supporting box 210 to keep the receiving groove 211 warm, on the one hand, the curing of the glue is delayed, thereby improving the bonding effect. At the same time, the IGBT module 700 can be preheated in advance by the hot air to avoid the glue from curing directly when it contacts the overly cold IGBT module 700; on the other hand, the IGBT module 700 is transported in a suspended manner, which can avoid scratching the IGBT module 700 during the transfer of the IGBT module 700 on the rotating table 200 and improve the qualified rate of the IGBT module 700.

[0102] Inspired by the above ideal embodiments of the present invention, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A frame sealing device for IGBT pins, characterized in that: include: An assembly platform (100) is provided with a plurality of workstations; A rotating table (200) is used to drive the IGBT module (700) to circulate on multiple workstations; A loading robot arm (300), used for grabbing the IGBT module (700) and placing it on the rotating table (200); A glue spreading component (400), which is arranged on the assembly platform (100) and is used to spread glue on the top surface of the IGBT module (700); The capping mechanical arm (500) covers the cover body (800) on the IGBT module (700) on the rotating platform (200) to complete the packaging; A control module configured to control the operation of the rotating table (200), the loading robot arm (300), the glue spreading assembly (400), and the capping robot arm (500); Wherein, the rotating platform (200) comprises a hot air source and a plurality of supporting boxes (210) arranged in a circumferential array; The supporting box (210) is provided with a receiving groove (211); The bottom of the containing groove (211) is evenly distributed with a plurality of blowing holes (212); During assembly, the hot air source is used to provide hot air to each support box (210) and blow the IGBT module (700) in the support box (210) until it floats; A clamping assembly (213) is also provided in the supporting box (210); The clamping assembly (213) is arranged in the supporting box (210) and is used to adjust the IGBT module (700) in the containing groove (211) to be centered so as to facilitate positioning of the capping robot arm (500); The clamping assembly (213) comprises a plurality of pneumatic clamping plates (2131); The groove wall of the containing groove (211) is provided with a plurality of mounting recesses (2133); The plurality of pneumatic clamping plates (2131) are installed in corresponding installation recesses (2133) via return springs (2132); The mounting recess (2133) is in communication with the hot air source; After the loading robot arm (300) places the IGBT module (700) into the containing groove (211), the corresponding supporting box (210) is connected to the hot air source, and the pneumatic clamping plate (2131) clamps the floating IGBT module (700) under the drive of the hot air.

2. The IGBT pin frame sealing device according to claim 1, characterized in that: A groove wall of the accommodating groove (211) and the IGBT module (700) are spaced apart by a preset distance; When placing the IGBT module (700), the IGBT module (700) in the receiving groove (211) is preheated by hot air provided by a hot air source; When applying glue, the hot air provided by the hot air source is used to keep the containing groove (211) warm, thereby delaying the curing of the glue.

3. The IGBT pin frame sealing device according to claim 2, characterized in that: A diversion air channel (2134) is also provided in the side wall of the support box (210); The diverter air channel (2134) is in communication with the mounting recess (2133) in the accommodating groove (211).

4. The IGBT pin frame sealing device according to claim 1, characterized in that: Insertion grooves (2111) are provided on both sides of the bottom of the accommodating groove (211); When working, the clamping claws of the loading robot arm (300) and the capping robot arm (500) are inserted into the corresponding insertion slots (2111).

5. The IGBT pin frame sealing device according to claim 1, characterized in that: The IGBT pin frame sealing device also includes: A visual inspection component (600), which is arranged on the assembly platform (100) and is used to obtain image information of the IGBT module (700) after the glue is applied; The control module is also configured to receive image information and determine the curing degree of the glue based on the image information; If the curing degree is higher than the preset value, the temperature of the hot air blown out by the hot air source is increased.

6. The IGBT pin frame sealing device according to claim 1, characterized in that: A solenoid valve (220) is provided at the connection between each of the supporting boxes (210) and the air outlet pipe of the hot air source; The control module is further configured to control the solenoid valve (220) to be turned on to float the IGBT module (700) after the loading robot arm (300) places the IGBT module (700) into the supporting box (210); and to control the solenoid valve (220) to be turned off after the capping robot arm (500) takes out the cover body (800) and the box cover of the IGBT module (700).

7. A sealing process applied to the IGBT pin frame sealing device as claimed in claim 1, characterized in that: The sealing process comprises: Controlling the loading robot arm (300) to start loading, grabbing the IGBT module (700) and placing it in a supporting box (210) on the rotating table (200); Controlling the hot air source to be connected to the support box (210), floating the IGBT module (700) in the support box (210), and preheating the IGBT module (700); Controlling the rotating table (200) to rotate, rotating the IGBT module (700) to below the glue spreading assembly (400), and controlling the glue spreading assembly (400) to spread glue; Controlling the rotating platform (200) to rotate, rotating the IGBT module (700) to the bottom of the capping mechanical arm (500), and controlling the capping mechanical arm (500) to grab the cover body (800), aligning the pinholes of the cover body (800) with the pins on the top surface of the IGBT module (700), and then covering the cover body (800) on the IGBT module (700) on the rotating platform (200); After the capping robot arm (500) is controlled to take out the packaged IGBT module (700), the hot air source is controlled to be disconnected from the corresponding supporting box (210).

8. The sealing process of the frame sealing device for IGBT pins according to claim 7, characterized in that: The frame sealing device for IGBT pins also includes a visual inspection component (600); After the glue is applied and before the lid is covered, the process also includes: Controlling the rotating table (200) to rotate, rotating the IGBT module (700) to below the visual inspection component (600), and obtaining image information of the IGBT module (700) after the glue is applied; Receive image information, and determine the curing degree of the glue based on the graphic information; If the curing degree is higher than the preset value, the temperature of the hot air blown out by the hot air source is increased.

Images