A solid crystal feeding device and angle correction method thereof

Abstract

The present invention discloses a solid crystal feeding device and an angle correction method thereof, wherein the solid crystal feeding device includes a film expanding mechanism, a crystal retrieval swing arm mechanism disposed above the film expanding mechanism, a first visual component disposed above the film expanding mechanism, and a second visual component disposed below the moving path after the crystal retrieval swing arm mechanism retrieves the material; the film expanding mechanism includes a film expanding table, and a film expanding rotation drive module, an X-axis drive module, and a Y-axis drive module sequentially disposed at the bottom of the film expanding table; the first visual component is used to detect the position information of the chip on the film expanding table; and the second visual component is used to detect the position information of the chip after the crystal retrieval swing arm mechanism retrieves the material. The present invention provides a solid crystal feeding device, wherein the swing arm lifting drive module is simple in structure and easy to implement by providing a connecting rod structure, and can effectively prevent foreign matter from falling into the solid crystal product. In addition, the present invention also provides an angle correction method for a solid crystal feeding device, wherein the automated detection and correction process reduces manual intervention, and avoids solid crystal quality problems caused by angle deviation and displacement deviation by accurately calculating deviations and compensation parameters.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and in particular to a solid crystal feeding device and an angle correction method thereof. Background Art

[0002] In the field of automated equipment technology, especially in the semiconductor packaging process, the die bond feeder is a key component for achieving precise wafer placement. As electronic devices develop towards miniaturization and higher performance, the requirements for wafer placement accuracy are becoming increasingly stringent.

[0003] In existing die bond feeding systems, the wafer removal robot is often driven by a belt. This belt and pulley are prone to friction, and materials abraded by the belt can easily fall into the die bonded product, affecting product quality. Furthermore, existing die bond feeding systems often face issues with wafer angle and displacement deviations when handling wafers. These issues can cause the wafer to misalign with the preset position, thus affecting the performance and yield of the entire semiconductor device. Summary of the Invention

[0004] The present invention aims to provide a die-bonding feeder device whose swing arm lifting drive module, through the provision of a connecting rod structure, is simple and easy to implement, and effectively prevents foreign matter from falling into the die-bonding product. The swing arm module also incorporates a buffer assembly, allowing the material removal nozzle to flexibly contact the wafer during removal, thus preventing damage to the wafer. Furthermore, the present invention provides an angle correction method for the die-bonding feeder device. This automated detection and correction process reduces manual intervention and, through the precise calculation of deviations and compensation parameters, avoids die-bonding quality issues caused by angular and displacement deviations.

[0005] In order to achieve the above objectives, the following technical solutions are adopted:

[0006] A solid crystal feeding device comprises a film expanding mechanism, a crystal taking swing arm mechanism arranged above the film expanding mechanism, a first visual component arranged above the film expanding mechanism, and a second visual component arranged below the moving path of the crystal taking swing arm mechanism after taking the material; the film expanding mechanism comprises a film expanding platform, and a film expanding rotation drive module, an X-axis drive module, and a Y-axis drive module arranged in sequence at the bottom of the film expanding platform; the first visual component is used to detect the position information of the chip on the film expanding platform; the second visual component is used to detect the position information of the chip after the crystal taking swing arm mechanism takes the material; the crystal taking swing arm mechanism comprises a swing arm module, a swing arm rotation drive module for driving the swing arm module to rotate, a swing arm lifting drive module for driving the swing arm module to lift, and a swing arm module arranged at the swing arm module The material picking suction nozzle at the end; the power output end of the swing arm lifting drive module is connected to the first connecting frame, and the power output end of the swing arm rotation drive module is connected to the second connecting frame; the first connecting frame and the second connecting frame are detachably connected, and the swing arm module and the second connecting frame are detachably connected; the swing arm lifting drive module includes a connecting rod, a swing arm lifting drive motor, a rotating block connected to the swing arm lifting drive motor, and at least one first guide assembly for guiding the first connecting frame to rise and fall; the upper end of the connecting rod is rotatably connected to the rotating block, and the lower end of the connecting rod is rotatably connected to the first connecting frame; the swing arm lifting drive motor is used to drive the rotating block to drive the connecting rod to swing, so that the first connecting frame drives the swing arm module to rise and fall through the first guide assembly.

[0007] Preferably, the swing arm module includes a swing arm arranged in the horizontal direction, a swing arm frame provided between the swing arm and the second connecting frame, and a buffer assembly connected between the swing arm and the swing arm frame; the buffer assembly includes a buffer rod, a fixed block mounted on the top of the swing arm frame, and a buffer spring sleeved on the buffer rod; one end of the swing arm frame is provided with an opening for one end of the swing arm to extend into, and the height of the opening is slightly larger than the thickness of the end of the swing arm; the buffer rod vertically penetrates the fixed block, the swing arm frame, and the swing arm setting in sequence; the upper part of the buffer rod is also provided with a limit block, and the buffer spring abuts between the limit block and the swing arm.

[0008] Preferably, the film expanding platform includes a film expanding plate, a top plate, a film expanding lifting drive module, a bottom plate, and a film expanding ring that moves through the film expanding plate and the top plate in sequence and is detachably connected to the film expanding lifting drive module; the film expanding lifting drive module includes a driving carrier plate, a film expanding lifting drive motor, a driving wheel connected to the film expanding lifting drive motor, a plurality of driven wheels spaced apart at the top of the driving carrier plate, a transmission belt connected between the driving wheel and the driven wheel, a lifting sleeve passing through the driven wheel, and a lifting slide rod slidably connected to the lifting sleeve; the lifting sleeve is fixedly connected to the top plate, and the lifting slide rod is fixedly connected to the bottom plate.

[0009] Preferably, the X-axis drive module and the Y-axis drive module both include a drive motor and a slide rail and slider assembly.

[0010] In addition, a method for correcting the angle of a die-bonding feeding device is provided, which is applied to the die-bonding feeding device and includes the following steps:

[0011] Step S1: The film expansion stage stretches the blue film so that the horizontal and vertical spacing between the wafers carried on the blue film increases;

[0012] Step S2: The swing arm rotation drive module drives the swing arm module to drive the material picking nozzle to rotate above the film expansion table, and detects the position information of the wafer on the blue film through the first vision component;

[0013] Step S3: The backend determines whether there is an angle deviation between the current position of the wafer and the preset position; if there is an angle deviation, the backend calculates the angle deviation and controls angle compensation; if there is no angle deviation, the process proceeds to step S4;

[0014] Step S4: The backend determines whether there is a displacement deviation between the current position of the wafer and the preset position; if there is a displacement deviation, the backend calculates the displacement deviation and controls displacement compensation; if there is no displacement deviation, the process proceeds to step S5;

[0015] Step S5: The swing arm lifting drive module drives the swing arm module to drive the material picking nozzle to descend, and the material picking nozzle rises after picking up the wafer;

[0016] Step S6: The swing arm rotation drive module drives the swing arm module to drive the material pickup nozzle to rotate and transfer the wafer. During the transfer process, the second vision component detects the position information of the wafer picked up by the material pickup nozzle;

[0017] Step S7: If the background determines that there is an angle and / or displacement deviation between the current position of the chip and the preset position, the chip is discarded; if the background determines that there is no angle and / or displacement deviation between the current position of the chip and the preset position, the chip is sent to the crystal bonding process.

[0018] Preferably, in step S3, after the background calculates the angle deviation, the control to perform angle compensation includes the following steps:

[0019] Step S31: Compare the detected wafer angle position with the preset position and calculate the angle deviation:

[0020]

[0021] Step S32: The film expansion stage is controlled to rotate around the central axis by an angle θ by the film expansion rotation drive module to compensate for the wafer angle.

[0022] Preferably, in step S4, after the background calculates the displacement deviation, the control for displacement compensation includes the following steps:

[0023] Step S41: The detected chip displacement position P actual =(x actual ,y actual ) and the preset position P target =(x target ,y target ) to compare and calculate the displacement deviations Δx and Δy; where Δx=x target -x actual , Δy=y target -y actual ;

[0024] Step S42: Calculate the distance and direction that the film expansion platform needs to move based on the displacement deviation. Assume that the moving distances of the film expansion platform on the X axis and Y axis are d x and d y , and d x =k x· Δx, d y =k y· Δy, where k x and k y is the proportionality coefficient;

[0025] Step S43: Drive the film expansion platform to move horizontally by the X-axis driving module and the Y-axis driving module, so that the film expansion platform moves along the X-axis by d x Distance, moved along the Y axis d y distance.

[0026] Preferably, in step S42, k x and k y The optimal value of is as follows:

[0027]

[0028] Among them, ω x and ω y are the natural frequencies of the X-axis drive module and the Y-axis drive module, ζ x and ζ y They are the damping ratios of the X-axis drive module and the Y-axis drive module respectively.

[0029] By adopting the above scheme, the beneficial effects of the present invention are:

[0030] The present invention provides a solid crystal feeding device whose swing arm lifting drive module is simple and easy to implement by providing a connecting rod structure, and can effectively prevent foreign matter from falling into the solid crystal product. In a preferred embodiment, the swing arm module is provided with a buffer component, so that the material suction nozzle can flexibly contact the wafer when removing the wafer, avoiding damage to the wafer. In addition, the present invention also provides an angle correction method for the solid crystal feeding device. The automated detection and correction process reduces manual intervention and avoids solid crystal quality problems caused by angle deviation and displacement deviation by accurately calculating deviations and compensation parameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A perspective view of the present invention;

[0032] Figure 2 A perspective view of the crystal retrieval swing arm mechanism of the present invention;

[0033] Figure 3 An exploded view of the swing arm module of the present invention;

[0034] Figure 4 An exploded view of the film expansion mechanism of the present invention;

[0035] Figure 5 A perspective view of the film expansion platform and the film expansion rotation drive module of the present invention;

[0036] The accompanying drawings illustrate:

[0037] 1—film expansion mechanism, 2—crystal taking swing arm mechanism,

[0038] 11—film expansion platform, 12—film expansion rotation drive module,

[0039] 13—X-axis drive module, 14—Y-axis drive module,

[0040] 21—swing arm module, 22—swing arm rotation drive module,

[0041] 23—swing arm lifting drive module, 24—reclaiming nozzle,

[0042] 25 - first connecting frame, 26 - second connecting frame,

[0043] 111—film expansion plate, 112—top plate,

[0044] 113 - film expansion lifting drive module, 114 - bottom plate,

[0045] 115—expanding ring, 116—lifting sleeve,

[0046] 117 - lift slide, 211 - swing arm,

[0047] 212—swing arm frame, 213—buffer rod,

[0048] 214—fixed block, 215—buffer spring,

[0049] 216—limit block, 231—connecting rod,

[0050] 232—swing arm lifting drive motor, 233—rotating block,

[0051] 234—First guide assembly. DETAILED DESCRIPTION

[0052] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0053] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0054] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0055] Reference Figures 1 to 5As shown, the present invention provides a solid crystal feeding device, including a film expanding mechanism 1, a crystal retrieval swing arm mechanism 2 arranged above the film expanding mechanism 1, a first visual component arranged above the film expanding mechanism 1, and a second visual component arranged below the moving path of the crystal retrieval swing arm mechanism 2 after retrieving the material; the film expanding mechanism 1 includes a film expanding platform 11, and a film expanding rotation drive module 12, an X-axis drive module 13, and a Y-axis drive module 14 arranged in sequence at the bottom of the film expanding platform 11; the first visual component is used to detect the position information of the chip on the film expanding platform 11; the second visual component is used to detect the position information of the chip after the crystal retrieval swing arm mechanism 2 retrieves the material; specifically, the first visual component and the second visual component both include a camera, a lens, a light source, a visual system, etc. The film expanding rotation drive module 12 includes a film expanding rotation shaft arranged at the bottom of the film expanding platform 11, and a film expanding rotation drive motor for driving the film expanding rotation shaft to rotate.

[0056] Among them, the crystal retrieval swing arm mechanism 2 includes a swing arm module 21, a swing arm rotation drive module 22 for driving the swing arm module 21 to rotate, a swing arm lifting drive module 23 for driving the swing arm module 21 to rise and fall, and a material retrieval nozzle 24 arranged at the end of the swing arm module 21; specifically, the swing arm rotation drive module 22 includes a swing arm rotation shaft connected to the second connecting frame 26, and a swing arm rotation drive motor driven by the swing arm rotation shaft.

[0057] The power output end of the swing arm lifting drive module 23 is connected to the first connecting frame 25, and the power output end of the swing arm rotation drive module 22 is connected to the second connecting frame 26; the first connecting frame 25 and the second connecting frame 26 are detachably connected, and the swing arm module 21 and the second connecting frame 26 are detachably connected; specifically, the cross-sections of the first connecting frame 25 and the second connecting frame 26 are both L-shaped, the L-shaped vertical end of the first connecting frame 25 and the L-shaped vertical end of the second connecting frame 26 are arranged opposite to each other, the L-shaped horizontal end of the first connecting frame 25 is stacked on the bottom of the L-shaped horizontal end of the second connecting frame 26, and the swing arm module 21 and the L-shaped vertical end of the second connecting frame 26 are detachably connected.

[0058] The swing arm lifting drive module 23 includes a connecting rod 231, a swing arm lifting drive motor 232, a rotating block 233 driven by the swing arm lifting drive motor 232, and at least one first guide assembly 234 for guiding the first connecting frame 25 to rise and fall; the upper end of the connecting rod 231 is rotatably connected to the rotating block 233, and the lower end of the connecting rod 231 is rotatably connected to the first connecting frame 25; the swing arm lifting drive motor 232 is used to drive the rotating block 233 to drive the connecting rod 231 to swing, so that the first connecting frame 25 drives the swing arm module 21 to rise and fall through the first guide assembly 234.

[0059] Furthermore, the crystal retrieval swing arm mechanism 2 also includes a third connecting frame, the cross-section of which is an inverted L-shaped structure. The swing arm rotation drive module 22 is disposed on the inverted L-shaped horizontal end of the third connecting frame, and the swing arm lifting drive module 23 is disposed on the inverted L-shaped vertical end of the third connecting frame. In one specific embodiment, two first guide assemblies 234 are provided and mounted on both sides of the connecting rod 231. The first guide assembly 234 includes a first roller guide fixed to the third connecting frame and a second roller guide fixed to the first connecting frame 25. When the swing arm lifting drive motor 232 drives the connecting rod 231 to move, the connecting rod 231 drives the first connecting frame 25 to cooperate with the first roller guide via the second roller guide, thereby driving the swing arm module 21 to move up and down.

[0060] Among them, the swing arm module 21 includes a swing arm 211 arranged in the horizontal direction, a swing arm frame 212 provided between the swing arm 211 and the second connecting frame 26, and a buffer assembly connected between the swing arm 211 and the swing arm frame 212; the buffer assembly includes a buffer rod 213, a fixed block 214 mounted on the top of the swing arm frame 212, and a buffer spring 215 mounted on the buffer rod 213; one end of the swing arm frame 212 is provided with an opening for one end of the swing arm 211 to extend into, and the height of the opening is slightly greater than the thickness of the end of the swing arm 211; when the material suction nozzle 24 sucks the chip, the opening provided at one end of the swing arm frame 212 reserves space for the swing arm 211 to move up and down. By setting the buffer assembly, the rigid contact between the material suction nozzle 24 and the chip is converted into flexible contact, thereby avoiding accidental damage to the chip during material removal. The buffer rod 213 is vertically inserted into the fixing block 214 , the swing arm frame 212 , and the swing arm 211 in sequence; a limit block 216 is further provided on the upper portion of the buffer rod 213 , and the buffer spring 215 abuts between the limit block 216 and the swing arm 211 .

[0061] The film expansion platform 11 includes, from top to bottom, a film expansion plate 111, a top plate 112, a film expansion lifting drive module 113, and a bottom plate 114, and a film expansion ring 115 that moves through the film expansion plate 111 and the top plate 112 in sequence and is detachably connected to the film expansion lifting drive module 113. The film expansion lifting drive module 113 includes a driving carrier plate, a film expansion lifting drive motor, a driving wheel connected to the film expansion lifting drive motor, a plurality of driven wheels spaced apart on the top of the driving carrier plate, a transmission belt connected between the driving and driven wheels, a lifting sleeve 16 passing through the driven wheels, and a lifting slide 117 slidably connected to the lifting sleeve 116. The lifting sleeve 116 is fixedly connected to the top plate 112, and the lifting slide 117 is fixedly connected to the bottom plate 114. The film expansion lifting drive motor drives the driving wheel to rotate, and the lifting sleeve 116 can rise and fall and slide relative to the lifting slide 117. When the film expansion lift motor drives the lifting sleeve 116, causing the top plate 112 to lower the film expansion plate 111, the blue film loaded on the film expansion plate 111 is blocked by the film expansion ring 115 below. Under the force, the blue film will be stretched in all directions, and the horizontal and vertical spacing between the wafers supported on the blue film will increase accordingly. When the film expansion plate 111 descends to the appropriate height, the film expansion lift motor stops, and the expanded blue film is tightened on the film expansion ring 115.

[0062] The X-axis driving module 13 and the Y-axis driving module 14 each include a driving motor and a slide rail and slider assembly.

[0063] In addition, a method for correcting the angle of a die-bonding feeding device is provided, which is applied to the die-bonding feeding device and includes the following steps:

[0064] Step S1: The film expansion stage 11 is operated to stretch the blue film so that the horizontal and vertical spacing between the wafers carried on the blue film is increased;

[0065] Step S2: The swing arm rotation drive module 22 drives the swing arm module 21 to drive the material taking nozzle 24 to rotate to the top of the film expansion platform 11, and detects the position information of the wafer on the blue film through the first visual component;

[0066] Step S3: The backend determines whether there is an angle deviation between the current position of the wafer and the preset position; if there is an angle deviation, the backend calculates the angle deviation and controls angle compensation; if there is no angle deviation, the process proceeds to step S4;

[0067] Furthermore, after the background calculates the angle deviation, it controls the angle compensation, including the following steps:

[0068] Step S31: Compare the detected wafer angle position with the preset position and calculate the angle deviation:

[0069]

[0070] Step S32: The film expansion stage 11 is controlled to rotate around the central axis by an angle θ by the film expansion rotation drive module 12 to compensate for the wafer angle.

[0071] Step S4: The backend determines whether there is a displacement deviation between the current position of the wafer and the preset position; if there is a displacement deviation, the backend calculates the displacement deviation and controls displacement compensation; if there is no displacement deviation, the process proceeds to step S5;

[0072] Furthermore, after the background calculates the displacement deviation, it controls the displacement compensation, including the following steps:

[0073] Step S41: The detected chip displacement position P actual =(x actual ,y actual ) and the preset position P target =(x target ,y target ) to compare and calculate the displacement deviations Δx and Δy; where Δx=x target -x actual , Δy=y target -y actual ;

[0074] Step S42: Calculate the distance and direction that the film expansion platform 11 needs to move according to the displacement deviation. Assume that the moving distances of the film expansion platform 11 on the X axis and the Y axis are d x and d y , and d x =k x· Δx, d y =k y· Δy, where k x and k y is the proportionality coefficient;

[0075] Step S43: Drive the film expansion platform 11 to move horizontally by the X-axis driving module 13 and the Y-axis driving module 14, so that the film expansion platform 11 moves along the X-axis by d x Distance, moved along the Y axis d y distance.

[0076] Step S5: The swing arm lifting drive module 23 drives the swing arm module 21 to drive the material pickup nozzle 24 to descend, and the material pickup nozzle 24 rises after sucking the wafer;

[0077] Step S6: The swing arm rotation drive module 22 drives the swing arm module 21 to drive the material pickup nozzle 24 to rotate and transfer the wafer. During the transfer process, the second vision component detects the position information of the wafer picked up by the material pickup nozzle 24;

[0078] Step S7: If the background determines that there is an angle and / or displacement deviation between the current position of the chip and the preset position, the chip is discarded; if the background determines that there is no angle and / or displacement deviation between the current position of the chip and the preset position, the chip is sent to the crystal bonding process.

[0079] Furthermore, in step S42, k x and k y The optimal value of is as follows:

[0080]

[0081] Among them, ω x and ω y are the natural frequencies of the X-axis drive module 13 and the Y-axis drive module 24, respectively. x and ζ y are the damping ratios of the X-axis drive module 13 and the Y-axis drive module 14 respectively.

[0082] Proportional coefficient k x and k y The selection of the proportional coefficient requires comprehensive consideration of factors such as device characteristics, system stability, correction accuracy, response speed, and adjustability. Adjustability allows for adjustments based on different device characteristics and correction requirements to ensure efficient and accurate displacement correction of the die bond feeder. Determining the optimal value for the proportional coefficient has the following benefits: 1) ensuring system stability during displacement correction; 2) ensuring accurate displacement compensation, improving die bond accuracy; and 3) increasing system response speed, thereby improving production efficiency.

[0083] In one embodiment, k is determined x and k y The optimal value method is as follows:

[0084] 1) System Modeling: A mathematical model of the die bonding feeding device is established, including the dynamic characteristics of the X-axis drive module 13 and the Y-axis drive module 14, and the system state variables of position, velocity and acceleration are set.

[0085] 2) Response analysis: Analyze the system's dynamic response in terms of overshoot, oscillation frequency, and settling time under different proportional coefficients, and use transfer functions to describe the system's response.

[0086] 3) Parameter Optimization: Based on the results of the system response analysis, the optimization goal is to minimize the stabilization time and determine the optimal value of the proportional coefficient while ensuring the correction accuracy. The following formula is used to calculate the optimal value of the proportional coefficient:

[0087]

[0088] Among them, ω x and ω yare the natural frequencies of the X-axis drive module 13 and the Y-axis drive module 14, respectively. x and ζ y are the damping ratios of the X-axis drive module 13 and the Y-axis drive module 14 respectively.

[0089] 4) Experimental Verification: Conduct experiments on an actual die-bonding feeder to verify the optimal value of the proportional coefficient. Adjust the proportional coefficient based on the experimental results until the system stability and calibration accuracy requirements are met.

[0090] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention. Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the field, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A solid crystal feeding device, characterized in that: It includes a film expanding mechanism, a crystal retrieval swing arm mechanism arranged above the film expanding mechanism, a first visual component arranged above the film expanding mechanism, and a second visual component arranged below the moving path of the crystal retrieval swing arm mechanism after taking the material; the film expanding mechanism includes a film expanding table, and a film expanding rotation drive module, an X-axis drive module, and a Y-axis drive module arranged at the bottom of the film expanding table in sequence; the first visual component is used to detect the position information of the chip on the film expanding table; the second visual component is used to detect the position information of the chip after the crystal retrieval swing arm mechanism takes the material; the crystal retrieval swing arm mechanism includes a swing arm module, a swing arm rotation drive module for driving the swing arm module to rotate, a swing arm lifting drive module for driving the swing arm module to lift, and a crystal retrieval swing arm mechanism provided at the end of the swing arm module. material suction nozzle; the power output end of the swing arm lifting drive module is connected to the first connecting frame, and the power output end of the swing arm rotation drive module is connected to the second connecting frame; the first connecting frame and the second connecting frame are detachably connected, and the swing arm module and the second connecting frame are detachably connected; the swing arm lifting drive module includes a connecting rod, a swing arm lifting drive motor, a rotating block connected to the swing arm lifting drive motor, and at least one first guide assembly for guiding the first connecting frame to rise and fall; the upper end of the connecting rod is rotatably connected to the rotating block, and the lower end of the connecting rod is rotatably connected to the first connecting frame; the swing arm lifting drive motor is used to drive the rotating block to drive the connecting rod to swing, so that the first connecting frame drives the swing arm module to rise and fall through the first guide assembly.

2. The die bonding feeding device according to claim 1, characterized in that: The swing arm module includes a swing arm arranged in the horizontal direction, a swing arm frame provided between the swing arm and the second connecting frame, and a buffer assembly connected between the swing arm and the swing arm frame; the buffer assembly includes a buffer rod, a fixed block mounted on the top of the swing arm frame, and a buffer spring sleeved on the buffer rod; one end of the swing arm frame is provided with an opening for one end of the swing arm to extend into, and the height of the opening is slightly larger than the thickness of the end of the swing arm; the buffer rod vertically penetrates the fixed block, the swing arm frame, and the swing arm setting in sequence; a limit block is also provided on the upper part of the buffer rod, and the buffer spring abuts between the limit block and the swing arm.

3. The die bonding feeding device according to claim 1, characterized in that: The film expanding platform includes a film expanding plate, a top plate, a film expanding lifting drive module, and a bottom plate arranged in sequence from top to bottom, and a film expanding ring that moves through the film expanding plate and the top plate in sequence and is detachably connected to the film expanding lifting drive module; the film expanding lifting drive module includes a driving carrier plate, a film expanding lifting drive motor, a driving wheel connected to the film expanding lifting drive motor, a plurality of driven wheels arranged at intervals on the top of the driving carrier plate, a transmission belt connected between the driving wheel and the driven wheels, a lifting sleeve arranged through the driven wheel, and a lifting slide rod slidably connected to the lifting sleeve; the lifting sleeve is fixedly connected to the top plate, and the lifting slide rod is fixedly connected to the bottom plate.

4. The die bonding feeding device according to claim 1, characterized in that: The X-axis drive module and the Y-axis drive module both include a drive motor and a slide rail and slider assembly.

5. A method for correcting the angle of a die-bonding feeding device, characterized in that: The die bonding feeding device according to any one of claims 1 to 4 comprises the following steps: Step S1: The film expansion stage stretches the blue film so that the horizontal and vertical spacing between the wafers carried on the blue film increases; Step S2: The swing arm rotation drive module drives the swing arm module to drive the material picking nozzle to rotate above the film expansion table, and detects the position information of the wafer on the blue film through the first vision component; Step S3: The backend determines whether there is an angle deviation between the current position of the wafer and the preset position; if there is an angle deviation, the backend calculates the angle deviation and controls angle compensation; if there is no angle deviation, the process proceeds to step S4; Step S4: The backend determines whether there is a displacement deviation between the current position of the wafer and the preset position; if there is a displacement deviation, the backend calculates the displacement deviation and controls displacement compensation; if there is no displacement deviation, the process proceeds to step S5; Step S5: The swing arm lifting drive module drives the swing arm module to drive the material picking nozzle to descend, and the material picking nozzle rises after picking up the wafer; Step S6: The swing arm rotation drive module drives the swing arm module to drive the material pickup nozzle to rotate and transfer the wafer. During the transfer process, the second vision component detects the position information of the wafer picked up by the material pickup nozzle; Step S7: If the background determines that there is an angle and / or displacement deviation between the current position of the chip and the preset position, the chip is discarded; if the background determines that there is no angle and / or displacement deviation between the current position of the chip and the preset position, the chip is sent to the crystal bonding process.

6. The angle correction method of the die bonding feeding device according to claim 5, characterized in that: In step S3, after the background calculates the angle deviation, the control is performed to perform angle compensation, including the following steps: Step S31: Compare the detected wafer angle position with the preset position and calculate the angle deviation: Step S32: The film expansion stage is controlled to rotate around the central axis by an angle θ by the film expansion rotation drive module to compensate for the wafer angle.

7. The angle correction method of the die bonding feeding device according to claim 5, characterized in that: After the displacement deviation is calculated in the background in step S4, the displacement compensation is controlled, including the following steps: Step S41: The detected chip displacement position P actual =(x actual ,y actual ) and the preset position P target =(x target ,y target ) to compare and calculate the displacement deviations Δx and Δy; where Δx=x target -x actual , Δy=y target -y actual ; Step S42: Calculate the distance and direction that the film expansion platform needs to move based on the displacement deviation. Assume that the moving distances of the film expansion platform on the X axis and Y axis are d x and d y , and d x =k x· Δx, d y =k y· Δy, where k x and k y is the proportionality coefficient; Step S43: Drive the film expansion platform to move horizontally by the X-axis driving module and the Y-axis driving module, so that the film expansion platform moves along the X-axis by d x Distance, moved along the Y axis d y distance.

8. The angle correction method of the die bonding feeding device according to claim 7, characterized in that: In step S42, k x and k y The optimal value of is as follows: Among them, ω x and ω y are the natural frequencies of the X-axis drive module and the Y-axis drive module, ζ x and ζ y They are the damping ratios of the X-axis drive module and the Y-axis drive module respectively.

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