Wafer cleaning device and semiconductor process machine table
By designing a wafer cleaning device that can rotate 360°, the problem of poor cleaning effect of traditional cleaning equipment is solved, and more efficient cleaning effect and higher wafer yield are achieved.
Patent Information
- Application Number
- CN202311302317.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-09
- Publication Date
- 2025-04-11
AI Technical Summary
Traditional wafer cleaning equipment has poor cleaning effect and cannot effectively remove residues on the wafer surface.
A wafer cleaning device is designed, including a first stage and a second stage. The first stage is provided with a groove and a scrubbing surface. The second stage is arranged in the groove. The bearing surface is flush with the scrubbing surface and can rotate 360° to increase the cleaning area of the scrubbing surface.
Through the 360° rotation design, the cleaning efficiency and cleaning effect are significantly improved, and the residue on the wafer surface can be effectively removed and the yield of the wafer is improved.
Smart Images
Figure CN119812089A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer cleaning device and a semiconductor process machine. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.
[0003] In the wafer manufacturing process, the processing of the wafer includes grinding, corrosion, oxidation, deposition, photolithography, etching, ion implantation and other processes. After the relevant processes are completed, the wafer needs to be cleaned to remove the residue on the surface of the wafer. However, the cleaning effect of traditional wafer cleaning equipment is poor. Summary of the invention
[0004] Based on this, it is necessary to provide a wafer cleaning device and a semiconductor process machine to address the above problems.
[0005] In a first aspect, an embodiment of the present application provides a wafer cleaning device, comprising:
[0006] A first carrier, wherein a scrubbing surface is provided on one side surface of the first carrier; a groove is also provided on the first carrier, and the groove extends from the scrubbing surface toward the inside of the first carrier; and
[0007] A second carrier is arranged in the groove, and a bearing surface is provided on one side surface of the second carrier, and the bearing surface is flush with the scrubbing surface;
[0008] One of the first stage and the second stage can rotate around the center of the second stage, and the distance between the side wall of the groove and the rotation center is greater than the distance between the rotation center and the side edge of the second stage.
[0009] In one embodiment, the scrubbing surface is disposed around the periphery of the groove.
[0010] In one embodiment, the first carrier includes a rotating part and a first scrubbing part arranged at one side of the rotating part; the scrubbing surface is arranged at a side of the first scrubbing part away from the rotating part; and the rotating part can rotate around the center of the second carrier.
[0011] In one embodiment, the first carrier further comprises:
[0012] An extension portion, one end of which is connected to a side of the first scrubbing portion away from the rotating portion, and the other end of which extends in a direction away from the rotating portion;
[0013] A second scrubbing portion, disposed at one end of the extension portion away from the rotating portion; wherein one end of the second scrubbing portion is connected to a side of the extension portion close to the groove, and the other end extends toward the first scrubbing portion;
[0014] There is a distance between one end of the second scrubbing portion close to the first scrubbing portion and the first scrubbing portion, and a receiving space is formed between the second scrubbing portion and the extending portion; the second scrubbing portion is configured as a resilient flexible structure.
[0015] In one embodiment, the extension portion is disposed around the periphery of the scrubbing surface;
[0016] There are multiple second scrubbing parts, and the multiple second scrubbing parts are arranged in sequence along the circumferential direction of the extending part.
[0017] In one embodiment, the orthographic projection of the second scrubbing portion on the first scrubbing portion is a first figure; the first figure extends from the extending portion toward the groove;
[0018] From an end of the first figure away from the extending portion to an end of the first figure close to the extending portion, a size of the first figure along a first direction gradually increases; the first direction is perpendicular to an extending direction of the first figure.
[0019] In one embodiment, the rotating portion is rotatably disposed on the base;
[0020] The second carrier includes a connecting shaft and a bearing portion arranged at one end of the connecting shaft, and a surface of the bearing portion on a side away from the connecting shaft is the bearing surface; the connecting shaft is movably arranged on the base along its own axial direction.
[0021] In one embodiment, the first scrubbing portion and / or the carrying portion is configured as a flexible member capable of absorbing water.
[0022] In one embodiment, the wafer cleaning device further comprises a first driving member disposed on the base, the first driving member being in transmission connection with the rotating part, and the first driving member being used to drive the rotating part to rotate;
[0023] And / or, the groove passes through the rotating part and the first scrubbing part; the wafer cleaning device also includes a second driving member arranged on the base, the second driving member is transmission-connected to the connecting shaft, and the second driving member is used to drive the connecting shaft to move along its own axial direction.
[0024] In a second aspect, an embodiment of the present application provides a semiconductor process machine, which includes the wafer cleaning device described in any embodiment of the first aspect.
[0025] The wafer cleaning device and semiconductor process machine provided by the embodiment of the present application can ensure that the scrubbing surface and the surface of the wafer can effectively contact each other after the wafer is loaded by the loading part by arranging a scrubbing surface for scrubbing the wafer on the first stage, and arranging a bearing part for carrying the wafer on the second stage, and making the bearing surface flush with the scrubbing surface. By arranging a groove on the first stage, and arranging the second stage in the groove, so that the distance between the side wall of the groove and the rotation center is greater than the distance between the rotation center and the side edge of the second stage, the first stage or the second stage can drive the wafer to rotate 360 degrees, thereby increasing the cleaning area of the scrubbing surface, and further improving the cleaning efficiency and cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0027] Figure 1 Schematic diagram of a silicon wafer after the thinning process.
[0028] Figure 2 A schematic structural diagram of a first carrier and a second carrier of a wafer cleaning device provided in an embodiment of the present application in a state to be assembled.
[0029] Figure 3 for Figure 2 A schematic top view of the first carrier is shown.
[0030] Figure 4 for Figure 2 The schematic top view of the wafer cleaning device in the assembled state is shown.
[0031] Figure 5 for Figure 3 A schematic diagram of an orthographic projection of a second scrubbing portion is shown.
[0032] Figure 6 for Figure 2 The schematic diagram of the wafer cleaning device and the wafer in the first state is shown.
[0033] Figure 7 for Figure 6 The schematic diagram of the wafer cleaning device and the wafer in the second state is shown.
[0034] Figure 8 for Figure 6 Schematic top view of .
[0035] Fig. 9 A comparison chart of test data of different cleaning equipment provided in the embodiments of the present application.
[0036] Reference numerals:
[0037] 1. Silicon wafer; 2. Residual particles;
[0038] 10. Wafer cleaning device; 11. First carrier; 11a. Groove; 111. First scrubbing portion; 1111. Scrubbing surface; 112. Rotating portion; 113. Extending portion; 114. Second scrubbing portion; 114'. First pattern; 12. Second carrier; 121. Connecting shaft; 122. Carrying portion; 1221. Carrying surface; 20. Wafer. DETAILED DESCRIPTION
[0039] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0041] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers, doping types and / or parts, these elements, components, regions, layers, doping types and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, doping type or part from another element, component, region, layer, doping type or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, doping type or part discussed below can be represented as a second element, component, region, layer or part.
[0042] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.
[0043] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, in this specification, the term "and / or" includes any and all combinations of the relevant listed items.
[0044] Embodiments of the application are described herein with reference to cross-sectional views that are schematic diagrams of ideal embodiments (and intermediate structures) of the application, so that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, embodiments of the application should not be limited to the specific shapes of the zones shown herein, but rather include shape deviations due to, for example, manufacturing techniques. For example, an implanted region shown as a rectangle typically has rounded or curved features and / or an implant concentration gradient at its edges, rather than a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation is performed. Therefore, the regions shown in the figures are schematic in nature, their shapes do not represent the actual shape of the region of the device, and do not limit the scope of the application.
[0045] In the silicon wafer manufacturing process, the silicon wafer backside thinning process is commonly used in power devices. When the thickness of the silicon wafer backside is thinned to less than 130um, the Taiko process is usually used, that is, when grinding the silicon wafer, only the inner area of the silicon wafer is thinned, and the edge of the silicon wafer is retained. Figure 1 As shown, after the silicon wafer 1 thinning process, residual particles 2 are attached to the front and back sides of the silicon wafer 1 , and a cleaning device is usually required to clean the silicon wafer 1 to remove the residual particles 2 .
[0046] In the related silicon wafer cleaning technology, the silicon wafer is placed on a moving stage and transferred to a fixed stage through the moving stage. During cleaning, the moving stage drives the silicon wafer to rotate, and the sponge on the fixed stage cleans the silicon wafer. However, due to the interference between the fixed stage and the moving stage, the moving stage can only rotate 30-50 degrees, so that the sponge on the fixed stage can only clean part of the surface of the silicon wafer, resulting in poor cleaning effect.
[0047] In view of the above problems, the embodiments of the present application provide a wafer cleaning device and a semiconductor process machine. By setting a scrubbing surface for scrubbing the wafer on the first carrier, and by setting a bearing part for bearing the wafer on the second carrier, and making the bearing surface flush with the scrubbing surface, it can be ensured that after the bearing part bears the wafer, the scrubbing surface and the surface of the wafer can be effectively in contact. By setting a groove on the first carrier, and setting the second carrier in the groove, so that the distance between the side wall of the groove and the rotation center is greater than the distance between the rotation center and the side edge of the second carrier, the first carrier or the second carrier can drive the wafer to rotate 360°, thereby increasing the cleaning area of the scrubbing surface, and further improving the cleaning efficiency and cleaning effect.
[0048] Specifically, in the first aspect, referring to Figure 2 and Figure 3As shown, an embodiment of the present application provides a wafer cleaning device 10, which includes a first carrier 11 and a second carrier 12. A scrubbing surface 1111 is provided on one side surface of the first carrier 11. A groove 11a is also provided on the first carrier 11, and the groove 11a extends from the scrubbing surface 1111 toward the inside of the first carrier 11. The second carrier 12 is arranged in the groove 11a. A carrying surface 1221 for carrying a wafer 20 is provided on one side surface of the second carrier 12, and the carrying surface 1221 is flush with the scrubbing surface 1111.
[0049] One of the first stage 11 and the second stage 12 can rotate around the center of the second stage 12 , and the distance between the side wall of the groove 11 a and the rotation center is greater than the distance between the rotation center and the side edge of the second stage 12 .
[0050] Here, the rotation center is the center of the second carrier 12, and the side edge of the second carrier 12 refers to the side edge of the side wall of the second carrier 12 close to the groove 11a. The bearing surface 1221 is flush with the scrubbing surface 1111, which means that during the cleaning process of the wafer 20, the plane where the bearing surface 1221 is located is parallel to the plane where the scrubbing surface 1111 is located, and both the bearing surface 1221 and the scrubbing surface 1111 are in contact with the wafer 20. In one example, during the cleaning process of the wafer 20, the plane where the bearing surface 1221 is located coincides with the plane where the scrubbing surface 1111 is located. 。
[0051] The distance between the side wall of the groove 11a and the rotation center refers to the minimum distance between the side wall of the groove 11a and the rotation center. The distance between the rotation center and the side edge of the second stage 12 refers to the maximum distance between the rotation center and the side edge of the second stage 12.
[0052] The wafer cleaning device 10 provided in the embodiment of the present application can ensure that after the carrying portion 122 carries the wafer 20, the scrubbing surface 1111 and the surface of the wafer 20 can form effective contact by providing a scrubbing surface 1111 on the first carrier 11 and providing a carrying portion 122 for carrying the wafer 20 on the second carrier 12, and making the carrying surface 1221 flush with the scrubbing surface 1111. By providing a groove 11a on the first carrier 11 and arranging the second carrier 12 in the groove 11a, so that the distance between the side wall of the groove 11a and the rotation center is greater than the distance between the rotation center and the side edge of the second carrier 12, the first carrier 11 or the second carrier 12 can drive the wafer 20 to rotate 360 degrees, thereby increasing the cleaning area of the scrubbing surface 1111, and further improving the cleaning efficiency and cleaning effect.
[0053] In one example, the scrubbing surface 1111 may be disposed around a portion of the outer periphery of the groove 11a. For example, the scrubbing surface 1111 is shaped like a "c" shape, and the groove 11a is disposed inside the "c" shape. In this way, when the first carrier 11 or the second carrier 12 rotates 360°, it can be ensured that the wafer 20 can be cleaned by the scrubbing surface 1111 in a circumferential direction.
[0054] In another example, the scrubbing surface 1111 is arranged around the outer periphery of the groove 11a. In this way, the scrubbing area of the scrubbing surface 1111 can be increased, which is conducive to improving the cleaning efficiency and cleaning effect. For example, the scrubbing surface 1111 can be in the shape of a ring. The groove 11a is arranged on the inner side of the ring.
[0055] In one embodiment, the first stage 11 includes a rotating portion 112 and a first scrubbing portion 111 disposed on one side of the rotating portion 112. The scrubbing surface 1111 is disposed on a side of the first scrubbing portion 111 away from the rotating portion 112. The rotating portion 112 can rotate around the center of the second stage 12. Thus, by providing the rotating portion 112, the first stage 11 can rotate around the center of the second stage 12.
[0056] In one embodiment, referring to Figure 2 , Figure 6 and Figure 7 As shown, the first carrier 11 further includes an extension portion 113 and a second scrubbing portion 114. One end of the extension portion 113 is connected to a side of the first scrubbing portion 111 away from the rotating portion 112, and the other end of the extension portion 113 extends in a direction away from the rotating portion 112. In a specific example, the extension direction of the extension portion 113 is perpendicular to the scrubbing surface 1111.
[0057] Further, the second scrubbing portion 114 is disposed at one end of the extension portion 113 away from the rotating portion 112 . One end of the second scrubbing portion 114 is connected to one side of the extension portion 113 close to the groove 11 a , and the other end extends toward the first scrubbing portion 111 .
[0058] Further, there is a gap between the end of the second scrubbing portion 114 close to the first scrubbing portion 111 and the first scrubbing portion 111, and a receiving space is formed between the second scrubbing portion 114 and the extension portion 113. The second scrubbing portion 114 is configured as a resilient flexible structure. Exemplarily, the material of the second scrubbing portion 114 can be sponge or a polymer material with flexibility and elasticity.
[0059] It should be noted that, refer to Figure 7As shown, the space between one end of the second scrubbing part 114 close to the first scrubbing part 111 and the first scrubbing part 111 is used to accommodate the thinned portion of the wafer 20, and the accommodating space between the first scrubbing part 111 and the extending part 113 is used to accommodate the unthinned portion of the wafer 20, that is, the edge portion of the wafer 20.
[0060] It is understandable that after the wafer 20 is thinned, residual particles are easily attached to the edge of the thinning groove on the back side of the wafer 20. The embodiment of the present application sets an extension portion 113 and a second scrubbing portion 114. In this way, while cleaning the front side of the wafer 20, the edge of the thinning groove on the back side of the wafer 20 can also be cleaned, which is beneficial to reducing the residual particles on the back side of the wafer 20, thereby helping to improve the yield of the wafer 20.
[0061] It should be noted that, refer to Figure 8 As shown, when cleaning the wafer 20, the orthographic projection of the wafer 20 on the first scrubbing part 111 and the orthographic projection of the second scrubbing part 114 on the first scrubbing part 111 have an overlapping area, and in addition, one end of the second scrubbing part 114 close to the first scrubbing part 111 contacts the edge of the thinning groove on the back side of the wafer 20. In this way, it can be ensured that the second scrubbing part 114 effectively cleans the edge of the thinning groove on the back side of the wafer 20.
[0062] It is understandable that when cleaning the wafer 20, the wafer 20 needs to fall from directly above the scrubbing surface 1111 to the scrubbing surface 1111. During the falling process, the wafer 20 will pass through the second scrubbing portion 114. In the embodiment of the present application, by setting the second scrubbing portion 114 as a resilient flexible structure, on the one hand, when the wafer 20 passes, the second scrubbing portion 114 can be deformed to facilitate the passage of the wafer 20 without damaging the wafer 20; on the other hand, after the wafer 20 is placed on the scrubbing surface 1111, the second scrubbing portion 114 can be guaranteed to return to the initial position, so that the second scrubbing portion 114 can form an effective contact with the edge of the thinning groove on the back of the wafer 20.
[0063] It is understandable that the number of the second scrubbing part 114 may be one, so that when the first carrier 11 or the second carrier 12 rotates 360°, it can be ensured that the entire circumferential circle of the wafer 20 can be cleaned by the scrubbing surface 1111 .
[0064] In one embodiment, referring to Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, the extension portion 113 is disposed around the outer periphery of the scrubbing surface 1111. There are multiple second scrubbing portions 114, which are sequentially arranged along the circumferential direction of the extension portion 113. In this way, the cleaning efficiency of the back side of the wafer 20 can be improved.
[0065] In a preferred embodiment, the plurality of second scrubbing parts 114 are evenly arranged along the circumferential direction of the extending part 113. In this way, the second scrubbing parts 114 can clean the wafer 20 more evenly, thereby improving the cleaning effect on the back side of the wafer 20.
[0066] In a preferred embodiment, any two adjacent second scrubbing parts 114 are adjacent to each other. In this way, a larger number of second scrubbing parts 114 can be arranged in the circumferential direction of the extension part 113, thereby improving the cleaning efficiency and cleaning effect of the back side of the wafer 20.
[0067] In one embodiment, referring to Figure 3 and Figure 5 As shown, the orthographic projection of the second scrubbing portion 114 on the first scrubbing portion 111 is a first figure 114'. The first figure 114' extends from the extension portion 113 toward the groove 11a, that is, in the first figure 114', the direction from the end of the first figure 114' close to the extension portion 113 to the end of the first figure 114' close to the groove 11a is the extension direction of the first figure 114'. From the end of the first figure 114' away from the extension portion 113 to the end of the first figure 114' close to the extension portion 113, the size of the first figure 114' along the first direction X gradually increases. The first direction X is perpendicular to the extension direction of the first figure 114'. Among them, the size of the first figure 114' along the first direction X is W. In one example, the first figure 114' is serrated, and the second scrubbing portion is a serrated sponge. In another example, the first figure 114' is semicircular or semi-elliptical.
[0068] In this way, the difficulty of deformation of the second scrubbing part 114 can be reduced. When the wafer 20 falls from directly above the scrubbing surface 1111 to the scrubbing surface 1111, it is not only conducive to the deformation of the second scrubbing part 114, but also conducive to reducing the reaction force applied by the second scrubbing part 114 to the wafer 20, thereby reducing the risk of damage to the wafer 20.
[0069] In one embodiment, the first scrubbing part 111 is constructed as a flexible part that can absorb water. Specifically, the material of the first scrubbing part 111 can be a sponge or a polymer material with flexibility and elasticity. Exemplarily, the first scrubbing part 111 is a block sponge, and the surface of the block sponge constitutes the scrubbing surface. In this way, on the one hand, the risk of damage to the wafer 20 can be reduced, and on the other hand, the cleaning efficiency can be improved.
[0070] In one embodiment, the bearing part 122 is constructed as a flexible member capable of absorbing water. For example, the bearing part 122 is a block sponge, and the surface of the block sponge constitutes the bearing surface 1221. In this way, the risk of damage to the wafer 20 can be reduced on the one hand, and the cleaning efficiency can be improved on the other hand.
[0071] In one embodiment, the wafer cleaning device 10 further includes a base (not shown), and the rotating portion 112 is rotatably disposed on the base. The second carrier 12 includes a connecting shaft 121 and a bearing portion 122 disposed at one end of the connecting shaft 121, and a side surface of the bearing portion 122 away from the connecting shaft 121 is a bearing surface 1221, and the connecting shaft 121 is movably disposed on the base along its own axial direction. In this way, an assembly foundation can be provided for the first carrier 11 and the second carrier 12, so as to facilitate the assembly of the first carrier 11 and the second carrier 12 together.
[0072] The connecting shaft 121 is arranged on the base so as to be movable along its own axial direction. Thus, when cleaning the wafer 20, the connecting shaft 121 drives the second carrier 12 to rise to receive the wafer 20. After the second carrier 12 receives the wafer 20, the connecting shaft 121 drives the second carrier 12 to fall so that the front side of the wafer 20 contacts the scrubbing surface 1111. Then, the rotating part 112 drives the first carrier 11 to rotate, and the scrubbing surface 1111 and the second scrubbing part 114 clean the wafer 20.
[0073] In one embodiment, the connecting shaft 121 and the bearing portion 122 are connected by screws; in another embodiment, the connecting shaft 121 and the bearing portion 122 are bonded by adhesive.
[0074] In one embodiment, referring to Figure 3 and Figure 4 As shown, the bearing portion 122 is cylindrical, the groove 11a is a cylindrical groove 11a, and the outer diameter of the bearing portion 122 is smaller than the inner diameter of the cylindrical groove 11a. In a preferred embodiment, the difference between the outer diameter of the bearing portion 122 and the inner diameter of the cylindrical groove 11a is between 2mm and 10mm.
[0075] Thus, on the one hand, during the cleaning process of the wafer 20, the first carrier 11 and the second carrier 12 will not interfere with each other when they rotate relative to each other. On the other hand, it is beneficial to increase the contact area between the wafer 20 and the carrier 122 and the first scrubbing part 111, thereby improving the cleaning efficiency and cleaning effect.
[0076] In one embodiment, the wafer cleaning device 10 further includes a first driving member (not shown) disposed on the base, the first driving member being in transmission connection with the rotating portion 112, and the first driving member being used to drive the rotating portion 112 to rotate. Exemplarily, the first driving member may be a rotating motor, and the output shaft of the rotating motor is in transmission connection with the rotating portion 112. By providing the first driving member, the power source may be used to drive the rotation of the first carrier 11, thereby reducing labor costs.
[0077] In one embodiment, the groove 11a passes through the rotating part 112 and the first scrubbing part 111, and the wafer cleaning device 10 further includes a second driving member (not shown) disposed on the base, the second driving member is transmission-connected to the connecting shaft 121, and the second driving member is used to drive the connecting shaft 121 to move along its own axial direction. Exemplarily, the second driving member can be an electric cylinder, and the output shaft of the electric cylinder is transmission-connected to the connecting shaft 121. By providing the second driving member, the movement of the second carrier 12 can be driven by a power source, thereby reducing labor costs.
[0078] It should be noted that, refer to Fig. 9 As shown, the inventors conducted an experimental comparison of the cleaning effects of the cleaning equipment in the related art and the wafer cleaning device 10 in the embodiment of the present application. As can be seen from the figure, the embodiment of the present application can significantly reduce the number of residual particles on the wafer 20, and the improvement rate of residual particles on the wafer reaches more than 200%.
[0079] In one embodiment, the first carrier 11 is a fixed carrier, and the second carrier 12 is a movable carrier. Exemplarily, the connecting shaft 121 can drive the second carrier 12 to rotate around its own center, and can also drive the second carrier 12 to move along its own axis. Further, the first driving member and the second driving member are both connected to the connecting shaft 121 in a transmission manner. When the second carrier 12 needs to rotate, the first driving member works. When the second carrier 12 needs to move, the second driving member works.
[0080] In a second aspect, an embodiment of the present application provides a semiconductor process machine, which includes a wafer cleaning device 10 according to any one of the embodiments in the first aspect.
[0081] The wafer cleaning device 10 provided in the embodiment of the present application can ensure that after the bearing part 122 carries the wafer 20, the scrubbing surface 1111 and the surface of the wafer 20 can be effectively contacted by setting a scrubbing surface 1111 on the first carrier 11, and setting a bearing part 122 for carrying the wafer 20 on the second carrier 12, and making the bearing surface 1221 flush with the scrubbing surface 1111. By setting a groove 11a on the first carrier 11, and setting the second carrier 12 in the groove 11a, so that the distance between the side wall of the groove 11a and the rotation center is greater than the distance between the rotation center and the side edge of the second carrier 12, the first carrier 11 or the second carrier 12 can drive the wafer 20 to rotate 360°, thereby increasing the cleaning area of the scrubbing surface 1111, and further improving the cleaning efficiency and cleaning effect. The specific description of the wafer cleaning device can be found in the above embodiment, which will not be repeated here.
[0082] In one embodiment, the semiconductor process machine may further include a thinning device, and the thinning device may thin the wafer 20 .
[0083] Specifically, after the thinning is completed, the second stage 12 rises, and after the wafer 20 is transferred to the carrying surface 1221 of the second stage 12, the second stage 12 falls. Since the second scrubbing portion 114 is a resilient flexible structure, the wafer 20 will pass through the second scrubbing portion 114 during the falling process and fall onto the scrubbing surface 1111. Then, the first stage 11 rotates, and the serrated second scrubbing portion 114 cleans the edge of the thinning groove on the back of the wafer 20 to prevent secondary contamination of the back of the wafer 20. At the same time, the scrubbing surface 1111 rotates and cleans the front of the wafer 20 during the rotation process, so as to achieve the purpose of cleaning and improving the cleaning efficiency. After the cleaning is completed, the second stage 12 lifts the wafer 20 to facilitate the robot arm to transfer the wafer 20 to the next process module.
[0084] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0085] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A wafer cleaning device, characterized in that: include: A first carrier, wherein a scrubbing surface is provided on one side surface of the first carrier; a groove is also provided on the first carrier, and the groove extends from the scrubbing surface toward the inside of the first carrier; as well as A second carrier is arranged in the groove, and a side surface of the second carrier is provided with a bearing surface, and the bearing surface is flush with the scrubbing surface; Among them, one of the first carrier and the second carrier can rotate around the center of the second carrier; the distance between the side wall of the groove and the rotation center is greater than the distance between the rotation center and the side edge of the second carrier.
2. The wafer cleaning device according to claim 1, characterized in that: The scrubbing surface is disposed around the outer periphery of the groove.
3. The wafer cleaning device according to claim 2, characterized in that: The first carrier includes a rotating part and a first scrubbing part arranged at one side of the rotating part; the scrubbing surface is arranged at a side of the first scrubbing part away from the rotating part; and the rotating part can rotate around the center of the second carrier.
4. The wafer cleaning device according to claim 3, characterized in that: The first carrier further comprises: An extension portion, one end of which is connected to a side of the first scrubbing portion away from the rotating portion, and the other end of which extends in a direction away from the rotating portion; A second scrubbing portion, disposed at one end of the extension portion away from the rotating portion; wherein one end of the second scrubbing portion is connected to a side of the extension portion close to the groove, and the other end extends toward the first scrubbing portion; There is a distance between one end of the second scrubbing portion close to the first scrubbing portion and the first scrubbing portion, and a receiving space is formed between the second scrubbing portion and the extending portion; the second scrubbing portion is configured as a resilient flexible structure.
5. The wafer cleaning device according to claim 4, characterized in that: The extension portion is arranged around the periphery of the scrubbing surface; There are multiple second scrubbing parts, and the multiple second scrubbing parts are arranged in sequence along the circumferential direction of the extending part.
6. The wafer cleaning device according to claim 5, characterized in that: The orthographic projection of the second scrubbing portion on the first scrubbing portion is a first figure; the first figure extends from the extending portion toward the groove; From an end of the first figure away from the extending portion to an end of the first figure close to the extending portion, a size of the first figure along a first direction gradually increases; the first direction is perpendicular to an extending direction of the first figure.
7. The wafer cleaning device according to any one of claims 3 to 6, characterized in that: The wafer cleaning device further comprises a base, and the rotating part is rotatably arranged on the base; The second carrier includes a connecting shaft and a bearing portion arranged at one end of the connecting shaft, and a surface of the bearing portion on a side away from the connecting shaft is the bearing surface; the connecting shaft is movably arranged on the base along its own axial direction.
8. The wafer cleaning device according to claim 7, characterized in that: The first scrubbing portion and / or the carrying portion is / are configured as a flexible member capable of absorbing water.
9. The wafer cleaning device according to claim 7, characterized in that: The wafer cleaning device further comprises a first driving member disposed on the base, the first driving member being in transmission connection with the rotating part, and the first driving member being used for driving the rotating part to rotate; And / or, the groove passes through the rotating part and the first scrubbing part; the wafer cleaning device also includes a second driving member arranged on the base, the second driving member is transmission-connected to the connecting shaft, and the second driving member is used to drive the connecting shaft to move along its own axial direction.
10. A semiconductor process machine, characterized in that: It comprises a wafer cleaning device as described in any one of claims 1 to 9.