Wafer separation device and semiconductor equipment

Abstract

The invention discloses a wafer separating device and semiconductor equipment, the wafer separating device is used for separating a wafer on a heating stage, the wafer separating device comprises the components of the heating stage which is provided with a supporting part which can support the wafer and a driving device which drives the supporting part to lift, and the driving device can drive the supporting part to switch between a first state and a second state; the multiple lifting pins can move relative to the supporting part; in the first state, the top end of the lifting pin protrudes out of the top face of the supporting part. In the second state, the top end of the lifting pin is not higher than the top surface of the supporting part; the connecting ring is located below the supporting part and arranged on the outer side of the driving device in a sleeving mode. The plurality of lifting pins can be connected with the connecting ring; the fixed disc is arranged at the bottom of the reaction chamber and is provided with an upward positioning surface; in the first state, the positioning face can make contact with the bottom ends of the multiple lifting pins, and the top ends of the multiple lifting pins are located on the same horizontal plane.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a wafer separation device and semiconductor equipment. Background Art

[0002] Vacuum thin film etching equipment is widely used in the semiconductor industry, including inductively coupled plasma deposition (ICPCVD), plasma enhanced chemical vapor deposition (PECVD), atmospheric pressure chemical vapor deposition (SACVD) deep silicon etching, metal etching and oxide etching, etc. These equipments have the following common features: the transfer of wafers before and after the deposition of thin films on the hot stage in the reaction chamber requires a robot to grab and place the wafers, which involves the contact and separation of the wafer and the hot stage.

[0003] In the industry, the wafer and the hot plate are separated by lifting pins to lift the wafer. The lifting pins are lifted by motors or cylinders.

[0004] like Figure 1 As shown, the motor 3 is used to lift the lifting pins 2. The lifting pins 2 are only placed on the bracket 4, and the three lifting pins 2 are relatively independent. When the lifting pins 2 are raised and lowered simultaneously with the bracket 4, if one of the lifting pins 2 is stuck, the other lifting pins 2 cannot interfere with it, which is likely to cause wafer slippage.

[0005] In addition, the long-term movement of the motor 3 requires regular lubrication maintenance, and is prone to various failures, which increases the probability of the wafer slipping on the surface of the hot stage 1. In this method of raising and lowering the lifting pin 2 by the motor 3, the motor 3 that drives the lifting pin 2 to rise and fall needs to be relatively independent of the motor of the hot stage 1. For semiconductor equipment with high production capacity requirements, this lifting pin raising method will reduce the equipment production capacity.

[0006] Another lifting method uses a cylinder. Due to the instability of the cylinder's movement, it can cause the lifting pin to jam, resulting in frequent wafer slips and errors in the robot grabbing the wafer. When this failure occurs, the temperature needs to be lowered and the reaction chamber opened, and the engineer manually takes the wafer. Due to the particularity of semiconductor thin film equipment, frequent chamber opening operations will affect the product process, such as bringing in external contaminants, causing the performance indicators of the wafer film to decline.

[0007] Therefore, how to reduce the probability of wafer slippage and improve production capacity is an urgent problem to be solved by personnel in this technical field. Summary of the invention

[0008] In view of this, the present invention provides a wafer separation device to reduce the probability of wafer slippage and improve production capacity. The present invention also provides a semiconductor device.

[0009] To achieve the above object, the present invention provides the following technical solutions:

[0010] A wafer separation device, used for separating wafers from a hot stage, comprising:

[0011] A heating stage, wherein the heating stage has a support portion capable of supporting the wafer and a driving device for driving the support portion to rise and fall, wherein the driving device can drive the support portion to switch between a first state and a second state;

[0012] A lifting pin, wherein the lifting pin is plural in number and can move relative to the support portion; in the first state, the top end of the lifting pin protrudes above the top surface of the support portion; in the second state, the top end of the lifting pin is not higher than the top surface of the support portion;

[0013] A connecting ring, the connecting ring is located below the supporting portion and sleeved on the outside of the driving device; a plurality of lifting pins can be connected to the connecting ring;

[0014] A fixed plate is used to be arranged at the bottom of the reaction chamber, and the fixed plate has a positioning surface arranged upward; in the first state, the positioning surface can contact the bottom ends of the plurality of lifting pins and make the top ends of the plurality of lifting pins located on the same horizontal plane.

[0015] Optionally, in the above-mentioned wafer separation device, in the second state, the connecting ring is separated from the fixed plate.

[0016] Optionally, in the above-mentioned wafer separation device, in the first state, the fixed plate supports the connecting ring.

[0017] Optionally, in the above-mentioned wafer separation device, the top surface of the fixed plate has a plurality of support blocks, and the top surface of the support blocks is the positioning surface;

[0018] The bottom end of each lifting pin can contact a corresponding positioning surface of the support block.

[0019] Optionally, in the above wafer separation device, the number of the support blocks is greater than the number of the lifting pins;

[0020] In the first state, the positioning surface of the support block corresponding to the lifting pin contacts the bottom end of the lifting pin, and the positioning surface of the support block not corresponding to the lifting pin contacts the bottom surface of the connecting ring.

[0021] Optionally, in the above-mentioned wafer separation device, the top surface of the fixed plate has a plurality of support blocks, and the plurality of support blocks include a first support block and a second support block;

[0022] The top surface of the first support block is the positioning surface, and the top surface of the second support block is the limiting support surface;

[0023] In the first state, the bottom end of the lifting pin is in positioning contact with the positioning surface, and the bottom surface of the connecting ring is in positioning contact with the limiting support surface.

[0024] Optionally, in the above-mentioned wafer separation device, the support portion has a pin hole penetrating through its top surface and its bottom surface;

[0025] The lifting pin comprises a pin rod and a positioning portion located at the top end of the pin rod;

[0026] The pin rod can move in the pin hole, and the positioning portion can be positioned relative to the pin hole.

[0027] Optionally, in the above-mentioned wafer separation device, one end of the pin hole close to the top surface of the supporting portion has a countersunk hole, and the positioning portion can be located in the countersunk hole.

[0028] Optionally, in the above-mentioned wafer separation device, the lifting pin is detachably connected to the connecting ring.

[0029] Optionally, in the above wafer separation device, the lifting pin has a pin rod and a connecting portion located at the bottom end of the pin rod;

[0030] The connecting ring has a connecting hole for positioning and connecting the lifting pin, and the connecting hole has a first hole section and a second hole section that are interconnected;

[0031] The pin rod and the connecting portion can pass through the first hole segment, the pin rod can pass through the second hole segment, and the connecting portion can be positioned in the second hole segment.

[0032] Optionally, in the above-mentioned wafer separation device, the connecting part is a cylindrical structure, the axis of which coincides with the axis of the pin rod, and the diameter of the connecting part is larger than that of the pin rod.

[0033] Optionally, in the above-mentioned wafer separation device, the lifting pin and the connecting ring have the same thermal expansion coefficient.

[0034] Optionally, in the above-mentioned wafer separation device, the lifting pins and the connecting ring are both made of ceramic materials.

[0035] Optionally, in the above-mentioned wafer separation device, the connecting ring has a mark indicating the installation position.

[0036] Optionally, in the above-mentioned wafer separation device, the fixing plate has a fixing pin that cooperates with the pin hole at the bottom of the reaction chamber.

[0037] The present invention also provides a semiconductor device, comprising a reaction chamber and a wafer separation device as described in any one of the above items.

[0038] It can be seen from the above technical solution that the wafer separation device provided by the present invention connects multiple lifting pins through a connecting ring. When the lifting pins move (rise and fall) relative to the support part, if one of the lifting pins is stuck, the other lifting pins have a linkage effect with the stuck lifting pin through the connecting ring, and can apply a force to the stuck lifting pin, so that the multiple lifting pins can move smoothly relative to the support part, avoiding the occurrence of the lifting pin stuck, and reducing the probability of wafer slip. In addition, by using a fixed plate to be arranged at the bottom of the reaction chamber, combined with a driving device to drive the support part to switch between the first state and the second state, the distance between the fixed plate and the support part can be adjusted. Since the connecting ring is located below the support part and is sleeved on the outside of the driving device, and the connecting ring and the lifting pins form an integral structure, the position of the connecting ring and the lifting pins can be adjusted by adjusting the distance between the fixed plate and the support part. In the first state, the fixed plate is relatively close to the support part, and the positioning surface of the fixed plate contacts the bottom ends of the multiple lifting pins, so that the position of the fixed plate and the overall structure (connecting ring and lifting pins) is fixed. At this time, the top ends of the multiple lifting pins are located on the same horizontal plane, so that the wafer can be placed on the top ends of the multiple lifting pins by an external device (manipulator) or the wafer supported by the top ends of the multiple lifting pins can be taken away by an external device, further reducing the probability of wafer slippage. In the second state, the fixed plate is relatively far away from the support part, and the connecting ring and the lifting pins move relative to the support part under the action of gravity, so that the lifting pins move to a position where the top ends are not higher than the top surface of the support part, thereby facilitating the action of contacting the wafer supported by the multiple lifting pins with the top surface of the support part. Through the above arrangement, the probability of wafer slippage is effectively reduced; and there is no need to set up an additional driving device to drive the lifting pins. Only the driving device of the hot stage can realize the lifting operation mode of the lifting pins, thereby reducing the occurrence of production stoppage due to failure of the additional driving device, thereby improving production capacity.

[0039] The present invention also provides a semiconductor device, including a reaction chamber and any one of the above-mentioned wafer separation devices. Since the above-mentioned wafer separation device has the above-mentioned technical effects, the semiconductor device having the above-mentioned wafer separation device should also have the same technical effects, which will not be described one by one here. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 It is a structural schematic diagram of a wafer separation device in the prior art;

[0042] Figure 2 A schematic structural diagram of a wafer separation device provided in an embodiment of the present invention;

[0043] Figure 3 A schematic diagram of the structure of a lifting pin provided in an embodiment of the present invention;

[0044] Figure 4 A schematic diagram of the structure of a heat stage provided in an embodiment of the present invention;

[0045] Figure 5 A schematic diagram of the structure of a connecting ring provided in an embodiment of the present invention;

[0046] Figure 6 A schematic diagram of the structure of a fixed disk provided in an embodiment of the present invention;

[0047] Figure 7 A schematic diagram of the assembly process of the lifting pin and the connecting ring provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0048] The invention discloses a wafer separation device to reduce the probability of wafer slippage and improve production capacity. The invention also provides a semiconductor device.

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] like Figure 2-Figure 6 As shown, an embodiment of the present invention provides a wafer separation device for separating wafers from a hot stage, comprising a hot stage 1, lifting pins 2, a connecting ring 3 and a fixing plate 4 for being arranged at the bottom of a reaction chamber.

[0051] The heat stage 1 has a support portion 11 capable of supporting the wafer and a driving device 12 for driving the support portion 11 to rise and fall. The driving device 12 can drive the support portion 11 to switch between a first state and a second state.

[0052] There are multiple lifting pins 2 and they can move relative to the support portion 11; in the first state, the top of the lifting pin 2 protrudes from the top surface of the support portion 11; in the second state, the top of the lifting pin 2 is not higher than the top surface of the support portion 11;

[0053] The connecting ring 3 is located below the supporting portion 11 and sleeved on the outside of the driving device 12; a plurality of lifting pins 2 can be connected to the connecting ring 3;

[0054] The fixing plate 4 has a positioning surface arranged upward; in the first state, the positioning surface can contact the bottom ends of the plurality of lifting pins 2 and make the top ends of the plurality of lifting pins 2 located on the same horizontal plane.

[0055] The wafer separation device provided by the embodiment of the present invention connects a plurality of lifting pins 2 through a connecting ring 3. When the lifting pins 2 move (rise and fall) relative to the support portion 11, if one of the lifting pins 2 is stuck, the other lifting pins 2 can exert a force on the stuck lifting pin 2 through the connecting ring 3, so that the plurality of lifting pins 2 can move smoothly relative to the support portion 11, avoiding the occurrence of the lifting pin 2 being stuck, and reducing the probability of wafer slippage. In addition, by using a fixed plate 4 arranged at the bottom of the reaction chamber, the support portion 11 is driven to switch between the first state and the second state in combination with the driving device 12, and the spacing between the fixed plate 4 and the support portion 11 can be adjusted. Since the connecting ring 3 is located below the support portion 11 and is sleeved on the outside of the driving device 12, and the connecting ring 3 and the lifting pins 2 form an integral structure, the positions of the connecting ring 3 and the lifting pins 2 can be adjusted by adjusting the spacing between the fixed plate 4 and the support portion 11. In the first state, the fixed plate 4 is relatively close to the support part 11, and the positioning surface of the fixed plate 4 contacts the bottom ends of the multiple lifting pins 2, so that the position of the fixed plate 4 and the overall structure (connecting ring 3 and lifting pins 2) is fixed. At this time, the top ends of the multiple lifting pins 2 are located on the same horizontal plane, so that the wafer can be placed on the top ends of the multiple lifting pins 2 or the wafer supported by the top ends of the multiple lifting pins 2 can be removed by external equipment (manipulator), further reducing the probability of wafer slip. In the second state, the fixed plate 4 is relatively far away from the support part 11, and the connecting ring 3 and the lifting pins 2 move relative to the support part 11 under the action of gravity, so that the lifting pins 2 move to a position where their top ends are not higher than the top surface of the support part 11, thereby facilitating the action of contacting the wafer supported by the multiple lifting pins 2 with the top surface of the support part 11. Through the above arrangement, the probability of wafer slippage is effectively reduced; and, there is no need to set up an additional driving device for driving the lifting pin 2. Only the driving device 12 of the hot platform 1 is required to realize the lifting operation of the lifting pin, thereby reducing the need to stop production due to failure of the additional driving device, thereby improving production capacity.

[0056] In this embodiment, the number of the lifting pins 2 is three and they are evenly distributed along the circumferential direction of the connecting ring 3 .

[0057] It can be understood that the "top surface" in this application refers to the side of the wafer separation device with the components facing upward when the wafer separation device is correctly placed; the "top" in this application refers to the end of the wafer separation device with the components facing upward when the wafer separation device is correctly placed; the "bottom surface" in this application refers to the side of the wafer separation device with the components facing downward when the wafer separation device is correctly placed; and the "bottom end" in this application refers to the end of the wafer separation device with the components facing downward when the wafer separation device is correctly placed. When the wafer separation device is correctly placed, moving upward is rising, and moving downward is falling.

[0058] By using the wafer separation device provided by the embodiment of the present invention, the lifting pin 2 can be used to place and separate the wafer from the heating platform (heating platform 1) in a manner of simultaneously lifting and lowering the heating platform 1, eliminating the need for a motor or cylinder used to drive the lifting pin in the traditional tooling, thereby simplifying the wafer separation device. In addition, by constraining the lifting pin 2 by the connecting ring 3, the lifting pin 2 can accurately place and separate the wafer from the heating platform 1 under the action of the horizontal constraint force and vertical pulling force (gravity of the connecting ring 3) applied to the lifting pin 2 by the connecting ring 3, which facilitates the accuracy, consistency and stability of the external mechanical device in grasping and transmitting the wafer, thereby effectively improving the stability of the process production of semiconductor equipment (such as PVD (Physical Vapor Deposition, physical vapor deposition), CVD (Chemical Vapor Deposition, chemical vapor deposition), Etch (etching) and CMP (Chemical Mechanical Polishing, chemical mechanical polishing)).

[0059] In the wafer separation device provided by the embodiment of the present invention, in the second state, the connecting ring 3 is separated from the fixed plate 4. That is, the connecting ring 3 realizes the horizontal constraint force on the multiple lifting pins 2 under the positioning constraint effect on the multiple lifting pins 2, and in the second state, the connecting ring 3 is separated from the fixed plate 4, so that the connecting ring 3 is suspended in the air, and the gravity of the connecting ring 3 applies a vertical downward force to the multiple lifting pins 2, further avoiding the lifting pins 2 from getting stuck, and then effectively ensuring that the top ends of the multiple lifting pins 2 are not higher than the top surface of the support part 11 in the second state, ensuring the precise placement of the lifting pins 2 between the wafer and the hot stage 1.

[0060] Of course, in the second state, the connecting ring 3 and the fixing disk 4 may be in contact but without any mutual squeezing force; or, the pressure between the connecting ring 3 and the fixing disk 4 may be smaller than the gravity of the connecting ring 3 .

[0061] In the wafer separation device provided by the embodiment of the present invention, in the first state, the fixed plate 4 supports the connecting ring 3. That is, in the first state, the fixed plate 4 supports the connecting ring 3, and at this time, the top of the lifting pin 2 protrudes from the top surface of the supporting portion 11. Since the connecting ring 3 is supported by the fixed plate 4, effective support for multiple lifting pins 2 is ensured, so that the multiple lifting pins 2 can be aligned, and the support stability of the lifting pins 2 to the wafer is further improved, so that it is convenient for an external device (manipulator) to place the wafer on the top of the multiple lifting pins 2 or to remove the wafer supported by the top of the multiple lifting pins 2 through an external device.

[0062] Preferably, the top surface of the fixed plate 4 has a plurality of support blocks 43, and the top surface of the support blocks 43 is a positioning surface; the bottom end of each lifting pin 2 can contact a corresponding positioning surface of a support block 43. Through the above arrangement, the lifting pin 2 can directly contact the fixed plate 4. That is, in the first state, the positioning surfaces of the plurality of support blocks 43 of the fixed plate 4 contact the bottom ends of the plurality of lifting pins 2, and under the support of the fixed plate 4, the structural stability of the plurality of lifting pins 2 is further ensured, and the support stability of the wafer is further improved.

[0063] In this embodiment, the number of support blocks 43 is greater than the number of lifting pins 2; in the first state, the positioning surface of the support block 43 corresponding to the lifting pin 2 contacts the bottom end of the lifting pin 2, and the positioning surface of the support block 43 not corresponding to the lifting pin 2 contacts the bottom surface of the connecting ring 3.

[0064] In this embodiment, the supporting connecting ring 3 and the lifting pin 2 are both supported by different supporting blocks 43 of the same structure. Among them, the bottom contact surface of the connecting ring 3 (the bottom surface in contact with the positioning surface of the supporting block 43) and the bottom end of the lifting pin 2 need to be located on the same horizontal plane, which improves the flexibility of installing the wafer separation device.

[0065] like Figure 2 and Figure 6 As shown, the number of support blocks 43 is six, and the number of lifting pins 2 is three. By assembling the heating platform 1, lifting pins 2, connecting ring 3 and fixed plate 4, in the first state, the bottom ends of three lifting pins 2 are in contact with the positioning surfaces of three support blocks 43, and the positioning surfaces of the other three support blocks 43 can be in contact with the connecting ring 3, so that the fixed plate 4 directly and indirectly supports the connecting ring 3 and the lifting pins 2, and the support stability is further improved. Since the three lifting pins 2 are evenly distributed along the circumferential direction of the connecting ring 3, the positioning surfaces of the three support blocks 43 arranged at intervals among the six support blocks 43 are in contact with the bottom ends of the three lifting pins 2. That is, among two adjacent support blocks 43, the positioning surface of one support block 43 is in contact with the bottom end of the lifting pin 2, and the positioning surface of the other support block 43 is in contact with the bottom contact surface of the connecting ring 3.

[0066] In another embodiment, the top surface of the fixed plate 4 has a plurality of support blocks 43, wherein the plurality of support blocks 43 include a first support block and a second support block; the top surface of the first support block is a positioning surface, and the top surface of the second support block is a position-limiting support surface; in the first state, the bottom end of the lifting pin 2 is in positional contact with the positioning surface, and the bottom surface of the connecting ring 3 is in positional contact with the position-limiting support surface. The structures of the first support block and the second support block may be the same or different.

[0067] like Figure 6 As shown, the fixed plate 4 may also be provided with structures such as a weight-reducing groove 42 .

[0068] In the wafer separation device provided by an embodiment of the present invention, the support part 11 has a pin hole 111 passing through its top surface and its bottom surface; the lifting pin 2 has a pin rod 21 and a positioning part 22 located at the top end of the pin rod 21; the pin rod 21 can move in the pin hole 111, and the positioning part 22 can be positioned relative to the pin hole 111.

[0069] Specifically, the positioning portion 22 of the lifting pin 2 is slightly larger than the diameter of the pin hole 111 of the heating stage 1, that is, the lifting pin 2 will not slip out of the pin hole 111 of the support portion 11, so that the three lifting pins 2 can move along with the lifting and lowering of the support portion 11 of the heating stage 1. Of course, the positioning portion 22 of the lifting pin 2 can also be set to other structures, as long as the positioning portion 22 can be positioned relative to the pin hole 111.

[0070] In order to ensure the flatness of the top surface of the support portion 11 , one end of the pin hole 111 close to the top surface of the support portion 11 has a countersunk hole, and the positioning portion 22 can be located in the countersunk hole.

[0071] In the wafer separation device provided by the embodiment of the present invention, the lifting pin 2 is detachably connected to the connecting ring 3. Through the above arrangement, the lifting pin 2 and the connecting ring 3 can be processed separately, and then the two can be connected by assembling the lifting pin 2 and the connecting ring 3. In addition, since the lifting pin 2 and the connecting ring 3 are detachably connected, when the lifting pin 2 or the connecting ring 3 is damaged, it can be relatively disassembled and replaced separately, saving the repair and maintenance costs.

[0072] like Figure 4 and Figure 5 As shown, the lifting pin 2 has a pin rod 21 and a connecting portion 23 located at the bottom end of the pin rod 21; the connecting ring 3 has a connecting hole 32 for positioning and connecting the lifting pin 2, and the connecting hole 32 has a first hole section 321 and a second hole section 322 that are connected to each other; the pin rod 21 and the connecting portion 23 can pass through the first hole section 321, the pin rod 21 can pass through the second hole section 322, and the connecting portion 23 can be positioned in the second hole section 322. Through the above arrangement, the relative assembly of the lifting pin 2 and the connecting ring 3 can be achieved.

[0073] In this embodiment, the connecting portion 23 is a cylindrical structure, whose axis coincides with the axis of the pin 21, and the diameter of the connecting portion 23 is larger than the pin 21. Of course, the connecting portion 23 can also be set as a prism, whose axis coincides with the axis of the pin 21, and the diameter of the circumscribed circle of the connecting portion 23 is larger than the pin 21.

[0074] In order to ensure the normal operation of the wafer separation device in a high-temperature process environment, the lifting pins 2 and the connecting ring 3 have the same thermal expansion coefficient.

[0075] Furthermore, the lifting pin 2 and the connecting ring 3 are both made of ceramic materials.

[0076] In order to facilitate assembly, the connecting ring 3 has a mark indicating the installation position. The mark can be set on the top surface of the connecting ring 3 so that the operator can see the mark during assembly. The mark can also be set on the side of the connecting ring 3 and indicate the correct placement direction of the connecting ring 3. The mark can also be set on the bottom surface of the connecting ring 3, and the operator cannot see the mark during assembly, which means that the connecting ring 3 is correctly placed.

[0077] Specifically, the logo may be an English mark TOP set on the top surface of the connecting ring 3 .

[0078] Furthermore, in order to improve the stable operation effect of the wafer separation device, the fixed plate 4 has a fixed pin 41 that cooperates with the pin hole at the bottom of the reaction chamber. The fixed plate 4 is positioned by plugging and matching the fixed pin 41 with the pin hole at the bottom of the reaction chamber, thereby achieving the positioning of the wafer separation device. Among them, the horizontal placement of the fixed plate 4 depends on the horizontal effect of the bottom of the reaction chamber. The plugging and matching of the fixed pin 41 with the pin hole at the bottom of the reaction chamber does not affect the horizontal support effect of the bottom of the reaction chamber on the fixed plate 4.

[0079] The fixing pin 41 and the reaction chamber may also be connected by other connecting parts, such as bolt connection, interference fit or welding.

[0080] like Figure 2-Figure 7 As shown, the specific assembly operation of the wafer separation device is as follows:

[0081] 1. Install the fixed plate 4 at the bottom of the reaction chamber, and put the fixed pin 41 at the bottom of the fixed plate 4 into the pin hole at the bottom of the reaction chamber. The fixed plate 4 is attached to the horizontal setting of the structure of the reaction chamber, that is, the positioning surface of the fixed plate 4 used to contact the three lifting pins 2 is located on the same horizontal plane, ensuring that the three lifting pins 2 are at the same height in the first state.

[0082] 2. Place the connecting ring 3 on the fixing plate 4, paying attention to the front and back sides, and do not put it in the wrong place. The marking on the connecting ring 3 can indicate the installation position.

[0083] 3. Install the hot stage 1 in the reaction chamber. Note that the hole position of the lifting pin 2 needs to be aligned with the first hole section 321 of the connecting hole 32 on the connecting ring 3.

[0084] 4. If Figure 6 As shown, after the lifting pin 2 is inserted into the first hole section 321 from directly above the heat table 1, the connecting ring 3 is lifted and rotated clockwise to move the connecting portion 23 of the lifting pin 2 into the second hole section 322. The connecting portion 23 is relatively positioned with the inner wall of the second hole section 322 to complete the constraint and fixation of the lifting pin 2 by the connecting ring 3.

[0085] 5. After installation, the bottoms of the three lifting pins 2 are constrained by the connecting ring 3 , and the positioning portion 22 of the lifting pin 2 is slightly larger than the diameter of the pin hole 111 of the heating platform 1 , so the three lifting pins 2 will move with the heating platform 1 .

[0086] 6. When the driving device 12 (motor) of the hot stage 1 drives the support part 11 to the first state (low home position), the top end of the lifting pin 2 protrudes from the top surface of the support part 11, and the bottoms (connecting parts 23) of the three lifting pins 2 are located on the fixed plate 4 and are all located on the same horizontal plane. The robot places the wafer at this position.

[0087] 7. When the driving device 12 (motor) of the heat stage 1 drives the support part 11 to the second state (high process position), the lifting pin 2 and the connecting ring 3 rise simultaneously with the support part 11 of the heat stage 1. After the process is completed, the driving device 12 of the heat stage 1 descends again, drives the support part 11 to switch to the first state, and the robot takes away the wafer again.

[0088] The embodiment of the present invention further provides a semiconductor device, including a reaction chamber, and also including any of the above-mentioned wafer separation devices. Since the above-mentioned wafer separation device has the above-mentioned technical effects, the semiconductor device having the above-mentioned wafer separation device should also have the same technical effects, which will not be described one by one here.

[0089] The semiconductor equipment may be a vacuum thin film etching equipment or other equipment with a wafer separation device, and no specific limitation is made here.

[0090] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0091] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer separation device for separating wafers from a hot stage, characterized in that: include: A heating platform (1), the heating platform (1) comprising a support portion (11) capable of supporting the wafer and a driving device (12) for driving the support portion (11) to rise and fall, the driving device (12) being capable of driving the support portion (11) to switch between a first state and a second state; A lifting pin (2), wherein the lifting pin (2) is in a plurality and is movable relative to the support portion (11); in the first state, the top end of the lifting pin (2) protrudes above the top surface of the support portion (11); in the second state, the top end of the lifting pin (2) is not higher than the top surface of the support portion (11); A connecting ring (3), the connecting ring (3) being located below the supporting portion (11) and sleeved on the outside of the driving device (12); a plurality of the lifting pins (2) being capable of being connected to the connecting ring (3); A fixed plate (4) for being arranged at the bottom of a reaction chamber, the fixed plate (4) having a positioning surface arranged upward; in the first state, the positioning surface can contact the bottom ends of the plurality of lifting pins (2) and enable the top ends of the plurality of lifting pins (2) to be located on the same horizontal plane.

2. The wafer separation device according to claim 1, characterized in that: In the second state, the connecting ring (3) is separated from the fixing disk (4).

3. The wafer separation device according to claim 1, characterized in that: In the first state, the fixing plate (4) supports the connecting ring (3).

4. The wafer separation device according to claim 1, characterized in that: The top surface of the fixed plate (4) has a plurality of support blocks (43), and the top surfaces of the support blocks (43) serve as the positioning surfaces; The bottom end of each lifting pin (2) can correspondingly contact a positioning surface of the support block (43).

5. The wafer separation device according to claim 4, characterized in that: The number of the support blocks (43) is greater than the number of the lifting pins (2); In the first state, the positioning surface of the support block (43) corresponding to the lifting pin (2) contacts the bottom end of the lifting pin (2), and the positioning surface of the support block (43) not corresponding to the lifting pin (2) contacts the bottom surface of the connecting ring (3).

6. The wafer separation device according to claim 1, characterized in that: The top surface of the fixed disk (4) has a plurality of support blocks (43), wherein the plurality of support blocks (43) include a first support block and a second support block; The top surface of the first support block is the positioning surface, and the top surface of the second support block is the limiting support surface; In the first state, the bottom end of the lifting pin (2) is in positioning contact with the positioning surface, and the bottom surface of the connecting ring (3) is in positioning contact with the limit support surface.

7. The wafer separation device according to claim 1, characterized in that: The support portion (11) has a pin hole (111) penetrating its top surface and its bottom surface; The lifting pin (2) comprises a pin rod (21) and a positioning portion (22) located at the top end of the pin rod (21); The pin rod (21) is movable in the pin hole (111), and the positioning portion (22) is positionable relative to the pin hole (111).

8. The wafer separation device according to claim 7, characterized in that: One end of the pin hole (111) close to the top surface of the support portion (11) has a countersunk hole, and the positioning portion (22) can be located in the countersunk hole.

9. The wafer separation device according to claim 1, characterized in that: The lifting pin (2) is detachably connected to the connecting ring (3).

10. The wafer separation device according to claim 1, characterized in that: The lifting pin (2) comprises a pin rod (21) and a connecting portion (23) located at the bottom end of the pin rod (21); The connecting ring (3) has a connecting hole (32) for positioning and connecting the lifting pin (2), and the connecting hole (32) has a first hole section (321) and a second hole section (322) which are connected to each other; The pin rod (21) and the connecting portion (23) can pass through the first hole section (321), the pin rod (21) can pass through the second hole section (322), and the connecting portion (23) can be positioned in the second hole section (322).

11. The wafer separation device according to claim 10, characterized in that: The connecting portion (23) is a cylindrical structure, the axis of which coincides with the axis of the pin rod (21), and the diameter of the connecting portion (23) is greater than that of the pin rod (21).

12. The wafer separation device according to claim 1, characterized in that: The lifting pin (2) and the connecting ring (3) have the same thermal expansion coefficient.

13. The wafer separation device according to claim 12, characterized in that: The lifting pin (2) and the connecting ring (3) are both made of ceramic material.

14. The wafer separation device according to claim 1, characterized in that: The connecting ring (3) is provided with a mark indicating the installation position.

15. The wafer separation device according to claim 1, characterized in that: The fixing plate (4) has a fixing pin (41) which matches with the pin hole at the bottom of the reaction chamber.

16. A semiconductor device comprising a reaction chamber, characterized in that: It also includes a wafer separation device as described in any one of claims 1-15.

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