Wafer carrier clamping adjustment device and method

Abstract

The present invention relates to the technical field of wafer carrier clamping, and discloses a wafer carrier clamping and adjusting device and method, comprising a wafer carrier rack, wherein the inner side of the wafer carrier rack is fixedly connected to a clamping rack; by respectively adjusting the threaded columns on both sides of the wafer carrier rack, the position and angle of the wafer carrier rack can be adjusted, and the wafer carrier rack is kept in a horizontal position, thereby improving the stability of the wafer body in the clamping rack and improving the stability of the wafer carrier rack during use; by horizontally moving two top protective racks along the top of the wafer carrier rack, the protection of the wafer body in the wafer carrier rack is improved, and the impact of external force collision on the wafer body in the wafer carrier rack is reduced; and the dust particles contained in the gas can be captured and filtered by using the internal filter, thereby reducing the dust particles attached to the gas, and sending clean gas into the wafer carrier rack, thereby reducing the impact of dust particles on the surface of the wafer body in the wafer carrier rack.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer carrier clamping, and in particular to a wafer carrier clamping and adjusting device and method. Background Art

[0002] Wafer carriers are important semiconductor plastic products used in silicon wafer production, wafer manufacturing, and wafer storage, transportation and protection between factories. During the chip manufacturing process, wafers need to travel back and forth to the semiconductor production line hundreds of times within weeks. Therefore, wafer carriers play an indispensable role in protection and transportation throughout the production process. The clamping and adjustment device of the wafer carrier usually refers to a mechanical device used to accurately clamp and position the wafer, which can ensure that the wafer remains stable and safe during transportation, processing and storage.

[0003] Although the existing clamping device can improve the stability of the robot clamping the wafer carrier in and out of the carrier box, the slot will naturally collect particles, which can easily contaminate the wafer and reduce the yield rate of the wafer. On the other hand, if the clamping mismatch is high, higher requirements are required for the clamping position during clamping. The wafers are placed in the wafer box for a long time, and the relative positions of the clamping parts of each wafer are not exactly the same. The clamping operation is more difficult and the matching degree is low, that is, the clamping slot is much larger than the clamping block, and the clamping angle of the wafer is easy to change. It is easy to collide when entering and exiting the carrier box, thereby damaging the wafer.

[0004] Based on the above technical problems, the existing technology has also provided some solutions. For example, the Chinese patent with the authorization publication number CN111128822A discloses a carrier and a carrier clamping device for wafer loading. In the non-clamping state, the control capsule is in an expanded state, which completely blocks the receiving groove, making it difficult to accommodate external particles and preventing the particles from flying out, thereby preventing the wafers from being contaminated. During clamping, the expansion of the clamping capsule tightly holds the root of the positioning block, thereby increasing the friction between the clamping device and the carrier, avoiding slipping and rotation during clamping, and keeping the position fixed. The matching requirements between the positioning block and the receiving groove of the control capsule are also reduced. The positioning block can still be easily inserted into the receiving groove when the position change is not large, thereby reducing the positioning requirements for the clamping moving device.

[0005] However, in actual production operations, the wafer loading device is easily contaminated by dust, particles or other pollutants during the movement and placement process. Once the dust and particles enter the wafer loading device, they will cause wear and tear on the wafer body. At the same time, during the transportation and handling of the wafer carrier, if the wafer carrier is tilted, it will cause uneven force on the wafer body, resulting in wear and creases on the wafer body, affecting the quality. Summary of the Invention

[0006] The purpose of the present invention is to provide a clamping and adjustment device and method for a wafer carrier, which solves the problem that the wafer loading device proposed in the background technology is easily contaminated by dust, particles or other pollutants during the movement and placement process, and the dust and particles entering the wafer loading device will cause wear to the wafer body. At the same time, during the transportation and handling of the wafer carrier, if the wafer carrier is tilted, it will cause uneven force on the wafer body, thereby causing wear and creases on the wafer body, affecting the quality.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0008] A wafer carrier clamping and adjustment device includes a wafer carrier frame, the inner side of which is fixedly connected to a clamping frame, and two sides of the wafer carrier frame are provided with adjustment mechanisms, the adjustment mechanisms including side inclined plates, a bottom bearing plate, and a threaded sleeve, the inner side of the threaded sleeve is threadedly connected to a threaded column, and one end of the threaded column is fixedly connected to a bottom support platform;

[0009] A protective mechanism is provided on one side of the wafer carrier, and the protective mechanism is used to protect the top of the wafer carrier;

[0010] A ventilation mechanism is provided on the other side of the wafer carrier, and the ventilation mechanism is used to ventilate the inner side of the wafer carrier.

[0011] Preferably, one side of the side inclined plate is fixedly connected to one side of the wafer carrier, one side of the bottom bearing disc is movably connected to one side of the side inclined plate, and one side of the bottom bearing disc is movably connected to one side of the threaded sleeve.

[0012] Preferably, the protection mechanism includes a side support frame, a bottom connecting box and a top sliding rail, the two sides of the wafer carrier are fixedly connected with the side support frames, the top of the side support frame is fixedly connected to the bottom of the bottom connecting box, one side of the bottom connecting box is fixedly connected with a side fixing frame, one side of the side fixing frame is movably connected with a top bearing disk, one side of the top bearing disk is movably connected with a top threaded rod, one end of the top threaded rod is fixedly connected with a side grip rod, the surface of the top threaded rod is threadedly connected with a side threaded hole, a connecting frame is provided on the top of the bottom connecting box, and one side of the connecting frame is fixedly connected with a top protection frame.

[0013] Preferably, a top sliding rail is provided on the top of the bottom connecting box, the top of the top sliding rail is slidably connected to a bottom sliding block, the top of the bottom sliding block is fixedly connected to the bottom of the connecting frame, one side of the connecting frame is fixedly connected to the bottom sliding frame, and a bottom sliding groove is provided on the inner side of the bottom connecting box, and the inner side of the bottom sliding groove is slidably connected to the bottom of the bottom sliding frame.

[0014] Preferably, the ventilation mechanism includes a connecting outer plate, a connecting tube and a top fixing frame, one side of the wafer carrier is fixedly connected to the connecting outer plate, one side of the connecting outer plate is fixedly connected to the connecting tube, a motor body is provided on the outside of the wafer carrier, the output shaft of the motor body is fixedly connected to a side connecting rod, one end of the side connecting rod is fixedly connected to a side transmission rod, and one end of the side transmission rod is fixedly connected to a transmission fan.

[0015] Preferably, one side of the transmission fan is movably connected to a side bearing disk, one side of the side bearing disk is movably connected to a side connecting plate, and both sides of the side connecting plate are fixedly connected to the inner side of the connecting tube.

[0016] Preferably, top fixing frames are fixedly connected to both sides of the connecting outer plate, and one side of the top fixing frame is fixedly connected to both sides of the motor body.

[0017] Preferably, a filtering mechanism is provided on one side of the wafer carrier, and the filtering mechanism includes a connecting ring, an inner filter and a connecting plate. One side of the connecting cylinder is fixedly connected to the connecting ring, and the inner side of the connecting ring is fixedly connected to the inner filter.

[0018] Preferably, a connection disk is fixedly connected to the surface of the side connection rod, a top connection plate is fixedly connected to one side of the connection disk, and a cleaning brush is fixedly connected to one side of the top connection plate.

[0019] A method for using a wafer carrier clamping and adjusting device comprises the following steps:

[0020] S1. By holding the threaded sleeve and rotating it, the top of the threaded sleeve will be movably connected to one side of the side inclined plate through the bottom bearing plate. Through the threaded connection between the threaded sleeve and the threaded column, after rotating the threaded sleeve, the threaded column is driven to move along the inner side of the threaded sleeve. The movement of the threaded column adjusts the distance between the threaded column and the side inclined plate, thereby adjusting the angle and position of the wafer carrier;

[0021] S2. By holding the side grip and rotating it, the top threaded rod is driven to rotate synchronously, and the rotating top threaded rod is movably connected to one side of the side fixing frame through the top bearing plate. The freely rotating top bearing plate improves the stability of the top threaded rod during rotation. At the same time, through the threaded connection between the top threaded rod and the side threaded hole, the top threaded rod is driven to move horizontally when it rotates. The movement of the connecting frame will synchronously drive the top protective frame to move. By rotating the side grips on both sides of the wafer carrier, the two top protective frames are driven to move horizontally along the top of the wafer carrier respectively.

[0022] S3. When a wafer is placed in the clamping rack, the motor is started to drive the side connecting rod to rotate. The rotating side connecting rod drives the side transmission rod to rotate synchronously. The rotating side transmission rod drives the transmission fan to rotate. The rotating transmission fan rotates along the inner side of the connecting tube to generate wind force. The transmission fan is protected by the connecting tube. The wind force generated by the transmission fan continuously blows toward the inner side of the wafer carrier.

[0023] S4. When the transmission fan rotates to generate wind, one side of the transmission fan will suck in the external gas and send it into the inner side of the wafer carrier through the connecting tube. Through the connection of the connecting ring, when the gas moves along the inner side of the connecting ring, it contacts the inner filter fixedly connected to the inner side of the connecting ring. When the gas passes through the inner filter, the dust particles contained in the gas are captured and filtered by the inner filter, and the rotating side connecting rod will synchronously drive the connecting disk to rotate, the rotating connecting disk will drive the top connecting plate to rotate, and the rotating top connecting plate will drive the cleaning brush to clean.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1. The distance between the threaded column and the side inclined plate can be adjusted by moving the threaded column, thereby adjusting the angle and position of the wafer carrier. The bottom of the threaded column is stably supported on the surface of the placement surface by the bottom support platform. By adjusting the threaded columns on both sides of the wafer carrier respectively, the position and angle of the wafer carrier can be adjusted, and the wafer carrier can be kept in a horizontal position, thereby improving the stability of the wafer body in the clamping frame and improving the stability of the wafer carrier during use.

[0026] 2. By rotating the side grips on both sides of the wafer carrier, the two top protective frames can be driven to move horizontally along the top of the wafer carrier. After the movement, the top of the wafer carrier is closed, which can improve the protection of the wafer body in the wafer carrier and reduce the impact of external force collision on the wafer body in the wafer carrier;

[0027] 3. The rotating side transmission rod drives the transmission fan to rotate. The rotating transmission fan rotates along the inner side of the connecting tube to generate wind force. The connecting tube protects the transmission fan. The wind force generated by the transmission fan continuously blows toward the inner side of the wafer carrier, which can improve the ventilation performance inside the wafer carrier, reduce the deposition of dust particles in the wafer carrier, and improve the cleanliness of the wafers placed in the clamping rack.

[0028] 4. When the gas moves along the inner side of the connecting ring, it contacts the inner filter fixedly connected to the inner side of the connecting ring. When the gas passes through the inner filter, the inner filter can capture and filter the dust particles contained in the gas, reduce the dust particles in the gas, and send the clean gas into the wafer carrier, reducing the impact of the dust particles on the surface of the wafer in the wafer carrier. At the same time, the rotating top connecting plate will drive the cleaning brush to clean the surface of the inner filter, remove the dust particles blocked by the filter on the surface of the inner filter, and improve the filtering effect of the inner filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the overall appearance structure of the present invention;

[0030] Figure 2 It is a schematic diagram of the top protection frame structure of the present invention;

[0031] Figure 3 It is a schematic diagram of the structure of the card frame of the present invention;

[0032] Figure 4 This is a schematic diagram of the side grip structure of the present invention;

[0033] Figure 5 It is a schematic diagram of the top protection frame structure of the present invention;

[0034] Figure 6 It is a structural schematic diagram of the threaded sleeve of the present invention;

[0035] Figure 7 This is a schematic structural diagram of the connecting tube of the present invention;

[0036] Figure 8 It is a schematic structural diagram of the top fixing frame of the present invention.

[0037] Among them: 1. Wafer carrier; 2. Clamping frame; 3. Adjustment mechanism; 301. Side inclined plate; 302. Bottom bearing plate; 303. Threaded sleeve; 304. Threaded column; 305. Bottom support platform; 4. Protection mechanism; 401. Side support frame; 402. Bottom connecting box; 403. Top sliding rail; 404. Connecting frame; 405. Bottom sliding block; 406. Bottom sliding frame; 407. Bottom sliding groove; 408. Top threaded rod; 409. Top bearing plate; 4010. Side fixing frame ; 4011, side grip; 4012, side threaded hole; 4013, top protective frame; 5, ventilation mechanism; 501, connecting outer plate; 502, connecting cylinder; 503, top fixing frame; 504, motor body; 505, side connecting rod; 506, side transmission rod; 507, transmission fan; 508, side bearing disk; 509, side connecting plate; 6, filtering mechanism; 601, connecting ring; 602, inner filter; 603, connecting disk; 604, top connecting plate; 605, cleaning brush. DETAILED DESCRIPTION

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] See also Figure 1-8 A wafer carrier clamping and adjustment device includes a wafer carrier frame 1, a clamping frame 2 is fixedly connected to the inner side of the wafer carrier frame 1, and adjustment mechanisms 3 are provided on both sides of the wafer carrier frame 1. The adjustment mechanism 3 includes a side inclined plate 301, a bottom bearing plate 302 and a threaded sleeve 303. The inner side of the threaded sleeve 303 is threadedly connected to a threaded column 304, and one end of the threaded column 304 is fixedly connected to a bottom support platform 305;

[0040] A protection mechanism 4 is provided on one side of the wafer carrier 1, and the protection mechanism 4 is used to protect the top of the wafer carrier 1;

[0041] A ventilation mechanism 5 is provided on the other side of the wafer carrier 1 , and the ventilation mechanism 5 is used to ventilate the inner side of the wafer carrier 1 .

[0042] It should be noted that the wind force generated by the transmission fan 507 continuously blows toward the inside of the wafer carrier 1 , which can improve the ventilation performance inside the wafer carrier 1 and reduce the deposition of dust particles inside the wafer carrier 1 .

[0043] In this embodiment, one side of the side inclined plate 301 is fixedly connected to one side of the wafer carrier 1 , one side of the bottom bearing disk 302 is movably connected to one side of the side inclined plate 301 , and one side of the bottom bearing disk 302 is movably connected to one side of the threaded sleeve 303 .

[0044] It should be noted that by adjusting the threaded columns 304 on both sides of the wafer carrier 1 respectively, the position and angle of the wafer carrier 1 can be adjusted, and the wafer carrier 1 can be kept in a horizontal position, thereby improving the stability of the wafer body in the clamping frame 2 and improving the stability of the wafer carrier 1 during use.

[0045] In this embodiment, the protection mechanism 4 includes a side support frame 401, a bottom connecting box 402 and a top sliding rail 403. The side support frames 401 are fixedly connected to both sides of the wafer carrier 1, the top of the side support frame 401 is fixedly connected to the bottom of the bottom connecting box 402, one side of the bottom connecting box 402 is fixedly connected to a side fixing frame 4010, one side of the side fixing frame 4010 is movably connected to a top bearing disk 409, one side of the top bearing disk 409 is movably connected to a top threaded rod 408, one end of the top threaded rod 408 is fixedly connected to a side grip rod 4011, the surface of the top threaded rod 408 is threadedly connected to a side threaded hole 4012, a connecting frame 404 is provided on the top of the bottom connecting box 402, and one side of the connecting frame 404 is fixedly connected to a top protection frame 4013.

[0046] It should be noted that the movement of the connecting frame 404 will synchronously drive the top protective frame 4013 to move. By rotating the side grips 4011 on both sides of the wafer carrier 1, the two top protective frames 4013 can be driven to move horizontally along the top of the wafer carrier 1. After the movement, the top of the wafer carrier 1 is closed, which can improve the protection of the wafer body in the wafer carrier 1 and reduce the collision impact of external force collision on the wafer body in the wafer carrier 1.

[0047] In this embodiment, a top sliding rail 403 is provided at the top of the bottom connecting box 402, and the top of the top sliding rail 403 is slidably connected to a bottom sliding block 405. The top of the bottom sliding block 405 is fixedly connected to the bottom of the connecting frame 404, and one side of the connecting frame 404 is fixedly connected to a bottom sliding frame 406. A bottom sliding groove 407 is provided on the inner side of the bottom connecting box 402, and the inner side of the bottom sliding groove 407 is slidably connected to the bottom of the bottom sliding frame 406.

[0048] It should be noted that the bottom of the connecting frame 404 slides on the surface of the top sliding rail 403 through the bottom sliding block 405, which can improve the stability of the movement of the connecting frame 404. At the same time, when the connecting frame 404 moves, it will slide on the inner side of the bottom sliding groove 407 through the bottom sliding frame 406, which can reduce the offset generated when the connecting frame 404 moves and improve the accuracy of the movement of the connecting frame 404.

[0049] In this embodiment, the ventilation mechanism 5 includes a connecting outer plate 501, a connecting tube 502 and a top fixing frame 503. One side of the wafer carrier 1 is fixedly connected to the connecting outer plate 501, and one side of the connecting outer plate 501 is fixedly connected to the connecting tube 502. A motor body 504 is provided on the outside of the wafer carrier 1. The output shaft of the motor body 504 is fixedly connected to a side connecting rod 505, one end of the side connecting rod 505 is fixedly connected to a side transmission rod 506, and one end of the side transmission rod 506 is fixedly connected to a transmission fan 507.

[0050] It should be noted that the rotating side transmission rod 506 will drive the transmission fan 507 to rotate, and the rotating transmission fan 507 will rotate along the inner side of the connecting tube 502 to generate wind force, and the transmission fan 507 will be protected by the connecting tube 502. The wind force generated by the transmission fan 507 continuously blows toward the inner side of the wafer carrier rack 1, which can improve the ventilation performance of the inner side of the wafer carrier rack 1, reduce the deposition of dust particles in the wafer carrier rack 1, and improve the cleanliness of the wafer body placed in the clamping rack 2.

[0051] In this embodiment, one side of the transmission fan 507 is movably connected to a side bearing disk 508 , and one side of the side bearing disk 508 is movably connected to a side connecting plate 509 . Both sides of the side connecting plate 509 are fixedly connected to the inner side of the connecting tube 502 .

[0052] It should be noted that during the rotation of the transmission fan 507, it will be movably connected and supported on one side of the side connecting plate 509 through the side bearing disk 508, which can stably support and limit the transmission fan 507, thereby improving the stability of the transmission fan 507 during rotation.

[0053] In this embodiment, a top fixing frame 503 is fixedly connected to both sides of the connecting outer plate 501 , and one side of the top fixing frame 503 is fixedly connected to both sides of the motor body 504 .

[0054] It should be noted that the motor body 504 can be fixed by the top fixing frame 503 , and the motor body 504 can be firmly connected to the outer side of the connecting outer plate 501 .

[0055] In this embodiment, a filtering mechanism 6 is provided on one side of the wafer carrier 1, and the filtering mechanism 6 includes a connecting ring 601, an inner filter screen 602 and a connecting plate 603. The connecting ring 601 is fixedly connected to one side of the connecting tube 502, and the inner filter screen 602 is fixedly connected to the inner side of the connecting ring 601.

[0056] It should be noted that when the gas passes through the inner filter 602, the inner filter 602 can capture and filter the dust particles contained in the gas, reduce the dust particles attached to the gas, and send the clean gas into the wafer carrier 1, reducing the impact of the dust particles on the surface of the wafer body in the wafer carrier 1.

[0057] In this embodiment, a connection disk 603 is fixedly connected to the surface of the side connection rod 505 , a top connection plate 604 is fixedly connected to one side of the connection disk 603 , and a cleaning brush 605 is fixedly connected to one side of the top connection plate 604 .

[0058] It should be noted that the rotating side connecting rod 505 will synchronously drive the connecting disk 603 to rotate, the rotating connecting disk 603 will drive the top connecting plate 604 to rotate, and the rotating top connecting plate 604 will drive the cleaning brush 605 to clean the surface of the inner filter 602, thereby removing the dust particles filtered and blocked on the surface of the inner filter 602, thereby improving the filtering effect of the inner filter 602.

[0059] The specific working steps of a method for using a wafer carrier clamping and adjusting device are as follows:

[0060] S1. First, hold the threaded sleeve 303 and rotate it. The top of the threaded sleeve 303 will be movably connected to one side of the side inclined plate 301 through the bottom bearing plate 302. Through the threaded connection between the threaded sleeve 303 and the threaded column 304, after rotating the threaded sleeve 303, the threaded column 304 can be driven to move along the inner side of the threaded sleeve 303. The movement of the threaded column 304 can adjust the distance between the threaded column 304 and the side inclined plate 301, so that the angle and position of the wafer carrier 1 can be adjusted, and the bottom of the threaded column 304 is stably supported on the surface of the placement surface by the bottom support platform 305. By adjusting the threaded columns 304 on both sides of the wafer carrier 1 respectively, the position and angle of the wafer carrier 1 can be adjusted, and the wafer carrier 1 can be kept in a horizontal position, thereby improving the stability of the wafer body in the clamping frame 2 and improving the stability of the wafer carrier 1 when in use;

[0061] S2. After placing more wafers on the inner side of the clamping frame 2, by holding the side grip 4011 and rotating the side grip 4011, the top threaded rod 408 can be driven to rotate synchronously, and the rotating top threaded rod 408 will be movably connected to one side of the side fixing frame 4010 through the top bearing plate 409. The freely rotating top bearing plate 409 can improve the stability of the top threaded rod 408 during rotation. At the same time, the threaded connection between the top threaded rod 408 and the side threaded hole 4012 can drive the connecting frame 404 to move horizontally when the top threaded rod 408 rotates, and the bottom of the connecting frame 404 slides on the surface of the top sliding rail 403 through the bottom sliding block 405, which can be In order to improve the stability of the movement of the connecting frame 404, at the same time, when the connecting frame 404 moves, it will slide on the inner side of the bottom sliding groove 407 through the bottom sliding frame 406, which can reduce the offset generated when the connecting frame 404 moves, and improve the accuracy of the movement of the connecting frame 404. The movement of the connecting frame 404 will synchronously drive the top protective frame 4013 to move. By rotating the side grips 4011 on both sides of the wafer carrier 1, the two top protective frames 4013 can be driven to move horizontally along the top of the wafer carrier 1. After the movement, the top of the wafer carrier 1 is closed, which can improve the protection of the wafer body in the wafer carrier 1 and reduce the impact of external force collision on the wafer body in the wafer carrier 1.

[0062] S3. When placing the wafer in the clamping rack 2 at the same time, the motor body 504 is first started, and the side connecting rod 505 can be driven to rotate by the motor body 504. The rotating side connecting rod 505 will drive the side transmission rod 506 to rotate synchronously. The rotating side transmission rod 506 will drive the transmission fan 507 to rotate. The rotating transmission fan 507 will rotate along the inner side of the connecting cylinder 502 to generate wind force, and the transmission fan 507 is protected by the connecting cylinder 502. The wind force generated by the transmission fan 507 continuously blows toward the inner side of the wafer carrier rack 1, which can improve the ventilation performance of the inner side of the wafer carrier rack 1, reduce the deposition of dust particles in the wafer carrier rack 1, and improve the cleanliness of the wafers placed in the clamping rack 2;

[0063] S4. When the transmission fan 507 rotates to generate wind, one side of the transmission fan 507 will suck in the external air and send it into the inner side of the wafer carrier 1 through the connecting tube 502. Through the connection of the connecting ring 601, when the air moves along the inner side of the connecting ring 601, it will contact the inner filter 602 fixedly connected to the inner side of the connecting ring 601. When the air passes through the inner filter 602, the inner filter 602 can capture and filter the dust particles contained in the air, thereby reducing the dust particles in the air and sending clean air into the wafer. Inside the carrier 1, the impact of dust particles on the surface of the wafer body inside the wafer carrier 1 is reduced. At the same time, when the dust particles are filtered through the inner filter 602, the rotating side connecting rod 505 will synchronously drive the connecting disk 603 to rotate, and the rotating connecting disk 603 will drive the top connecting plate 604 to rotate. The rotating top connecting plate 604 will drive the cleaning brush 605 to clean the surface of the inner filter 602, and remove the dust particles filtered and blocked on the surface of the inner filter 602, thereby improving the filtering effect of the inner filter 602.

[0064] It should be noted that the parts not described in detail in the present invention are all existing technologies, and the corresponding models can be selected according to actual needs. The internal structure and operating principles of the above parts are also common knowledge of those skilled in the art, and will not be elaborated on in detail.

[0065] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A wafer carrier clamping and adjusting device, comprising a wafer carrier frame (1), characterized in that: The inner side of the wafer carrier (1) is fixedly connected to a clamping frame (2), and adjustment mechanisms (3) are provided on both sides of the wafer carrier (1), the adjustment mechanism (3) comprising a side inclined plate (301), a bottom bearing plate (302) and a threaded sleeve (303), the inner side of the threaded sleeve (303) is threadedly connected to a threaded column (304), and one end of the threaded column (304) is fixedly connected to a bottom support platform (305); A protective mechanism (4) is provided on one side of the wafer carrier (1), and the protective mechanism (4) is used to protect the top of the wafer carrier (1); A ventilation mechanism (5) is provided on the other side of the wafer carrier (1), and the ventilation mechanism (5) is used to ventilate the inner side of the wafer carrier (1); The protection mechanism (4) comprises a side support frame (401), a bottom connection box (402) and a top sliding rail (403), the two sides of the wafer carrier (1) are fixedly connected with the side support frame (401), the top of the side support frame (401) is fixedly connected to the bottom of the bottom connection box (402), one side of the bottom connection box (402) is fixedly connected with a side fixing frame (4010), one side of the side fixing frame (4010) is movably connected with a top bearing disk (409), one side of the top bearing disk (409) is movably connected with a top threaded rod (408), one end of the top threaded rod (408) is fixedly connected with a side grip rod (4011), the surface of the top threaded rod (408) is threadedly connected with a side threaded hole (4012), a connecting frame (404) is provided on the top of the bottom connection box (402), one side of the connecting frame (404) is fixedly connected with a top protection frame (4013), the ventilation mechanism (5) comprises The wafer carrier (1) comprises a connecting outer plate (501), a connecting tube (502) and a top fixing frame (503), one side of the wafer carrier (1) is fixedly connected to the connecting outer plate (501), one side of the connecting outer plate (501) is fixedly connected to the connecting tube (502), the outer side of the wafer carrier (1) is provided with a motor body (504), the output shaft of the motor body (504) is fixedly connected to a side connecting rod (505), one end of the side connecting rod (505) is fixedly connected to a side transmission rod (506), one end of the side transmission rod (506) is fixedly connected to a transmission fan (507), one side of the wafer carrier (1) is provided with a filtering mechanism (6), the filtering mechanism (6) comprises a connecting ring (601), an inner filter (602) and a connecting plate (603), one side of the connecting tube (502) is fixedly connected to the connecting ring (601), and the inner side of the connecting ring (601) is fixedly connected to the inner filter (602).

2. The wafer carrier clamping and adjusting device according to claim 1, wherein: One side of the side inclined plate (301) is fixedly connected to one side of the wafer carrier (1), one side of the bottom bearing disc (302) is movably connected to one side of the side inclined plate (301), and one side of the bottom bearing disc (302) is movably connected to one side of the threaded sleeve (303).

3. The wafer carrier clamping and adjusting device according to claim 2, wherein: A top sliding rail (403) is provided on the top of the bottom connection box (402), a bottom sliding block (405) is slidably connected to the top of the top sliding rail (403), a top of the bottom sliding block (405) is fixedly connected to the bottom of the connection frame (404), a side of the connection frame (404) is fixedly connected to the bottom sliding frame (406), a bottom sliding groove (407) is provided on the inner side of the bottom connection box (402), and the inner side of the bottom sliding groove (407) is slidably connected to the bottom of the bottom sliding frame (406).

4. The wafer carrier clamping and adjusting device according to claim 3, wherein: One side of the transmission fan (507) is movably connected to a side bearing disc (508), and one side of the side bearing disc (508) is movably connected to a side connecting plate (509). Both sides of the side connecting plate (509) are fixedly connected to the inner side of the connecting cylinder (502).

5. The wafer carrier clamping and adjusting device according to claim 4, characterized in that: Top fixing frames (503) are fixedly connected to both sides of the connecting outer plate (501), and one side of the top fixing frame (503) is fixedly connected to both sides of the motor body (504).

6. The wafer carrier clamping and adjusting device according to claim 5, characterized in that: A connection disk (603) is fixedly connected to the surface of the side connection rod (505), a top connection plate (604) is fixedly connected to one side of the connection disk (603), and a cleaning brush (605) is fixedly connected to one side of the top connection plate (604).

7. A method for using a wafer carrier clamping and adjusting device, applied to a wafer carrier clamping and adjusting device according to any one of claims 1 to 6, characterized in that: The steps include: S1. By holding the threaded sleeve (303) and rotating it, the top of the threaded sleeve (303) is movably connected to one side of the side inclined plate (301) through the bottom bearing plate (302). Through the threaded connection between the threaded sleeve (303) and the threaded column (304), after rotating the threaded sleeve (303), the threaded column (304) is driven to move along the inner side of the threaded sleeve (303). The distance between the threaded column (304) and the side inclined plate (301) is adjusted by the movement of the threaded column (304), thereby adjusting the angle and position of the wafer carrier (1); S2. By holding the side grip (4011) and rotating it, the top threaded rod (408) is driven to rotate synchronously, and the rotating top threaded rod (408) is movably connected to one side of the side fixing frame (4010) through the top bearing plate (409). The top bearing plate (409) that rotates freely is used to improve the stability of the top threaded rod (408) during rotation. At the same time, through the threaded connection between the top threaded rod (408) and the side threaded hole (4012), the connecting frame (404) is driven to move horizontally when the top threaded rod (408) rotates. The movement of the connecting frame (404) will synchronously drive the top protective frame (4013) to move. By rotating the side grips (4011) on both sides of the wafer carrier frame (1), the two top protective frames (4013) are driven to move horizontally along the top of the wafer carrier frame (1). S3. When a wafer is placed in the clamping frame (2), the motor body (504) is started to drive the side connecting rod (505) to rotate. The rotating side connecting rod (505) drives the side transmission rod (506) to rotate synchronously. The rotating side transmission rod (506) drives the transmission fan (507) to rotate. The rotating transmission fan (507) rotates along the inner side of the connecting tube (502) to generate wind force. The transmission fan (507) is protected by the connecting tube (502). The wind force generated by the transmission fan (507) continues to blow toward the inner side of the wafer carrier (1). S4. When the transmission fan (507) rotates to generate wind, one side of the transmission fan (507) will suck in the external gas and send it into the inner side of the wafer carrier (1) through the connection of the connecting ring (601). When the gas moves along the inner side of the connecting ring (601), it contacts the inner filter (602) fixedly connected to the inner side of the connecting ring (601). When the gas passes through the inner filter (602), the dust particles contained in the gas are captured and filtered by the inner filter (602). The rotating side connecting rod (505) will synchronously drive the connecting disk (603) to rotate, and the rotating connecting disk (603) will drive the top connecting plate (604) to rotate. The rotating top connecting plate (604) will drive the cleaning brush (605) to clean.

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