Signal transmission device, method and system between waveguide and integrated module

Abstract

The invention provides a signal transmission device, method and system between a waveguide and an integrated module, two laminated plates are connected together through a spherical network array, a perforated metallized cavity is arranged on the first laminated plate, and a signal transmitter, a transmission line, a dielectric waveguide back cavity, a matching structure and an integrated circuit are arranged on the second laminated plate, so that the signal transmission between the waveguide and the integrated module is realized. And signal transmission between the waveguide and the integrated module is realized. Wherein a signal is input by the waveguide, is coupled to the signal transmitter through the perforated metallized cavity and the waveguide-like structure, and is further transmitted to the integrated circuit through the transmission line. Meanwhile, the signal transmission device provided by the invention is of a passive structure, so that the reverse transmission of the signal can be realized, namely the signal is transmitted to the waveguide by the integrated circuit through the signal transmission path. Furthermore, the signal transmission device and method can be expanded to an integrated antenna system to realize system-level application of the integrated antenna system. Compared with the prior art, the signal transmission loss can be effectively reduced, and high-density integration of the system is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of millimeter wave radio frequency integrated circuits, and in particular to a low-loss signal transmission device between a waveguide and an integrated module, a signal transmission method, and a signal transmission system extended thereby. Background Art

[0002] Compared with microwaves, electromagnetic waves in the millimeter wave band have shorter wavelengths and richer spectrum resources, and are increasingly used in the fields of high-speed wireless communications, high-resolution radar, and high-resolution imaging. Transmission lines such as microstrip lines, striplines, and grounded coplanar waveguides play an extremely important role in the signal transmission of millimeter wave high-integration systems. However, due to the higher frequency of millimeter waves, the loss tangent of the medium increases, and transmission lines such as microstrip lines, striplines, and grounded coplanar waveguides will produce large transmission losses, especially in applications in the W band and above. Large losses often affect the overall performance of the system. Waveguides with low transmission losses are favored by people. High-frequency electromagnetic wave signals are coupled to transmission lines through waveguides and then transmitted to planar high-integration systems. This is a commonly used signal transmission method for high-frequency and high-integration systems.

[0003] There are two structures for the coupling conversion from waveguide to transmission line: the transmission line is parallel to the waveguide signal transmission direction and the transmission line is perpendicular to the waveguide signal transmission direction. The structure in which the transmission line is parallel to the waveguide signal transmission direction often requires a longer path conversion transition and higher assembly accuracy, and will introduce a larger system aperture. The structure in which the transmission line is perpendicular to the waveguide signal transmission direction is similar to the coupling of the probe at the end of the waveguide, and often has a narrow working bandwidth. To obtain a wider working bandwidth, a metal waveguide back cavity structure can be introduced, but it will increase the complexity and assembly difficulty of the system, which is not conducive to the high-density integration of the system and may even affect the performance of the system, such as affecting the radiation performance of the side-firing antenna system. In addition, in higher frequency bands, such as the W band and above, the size of the waveguide flange is comparable to the overall size of the highly integrated system module, and the highly integrated system module also has other functional interfaces. The assembly and coordination of the waveguide and other functional interfaces is also a major challenge.

[0004] Therefore, there is a need for an effective signal transmission device and method from a high-frequency waveguide to a highly integrated system, which must meet the requirements of low transmission loss, wider operating bandwidth, friendly assembly method, and easy high-density integration of the system. Summary of the invention

[0005] The signal transmission device and signal transmission method between a waveguide and an integrated module of the present invention achieve the requirements of low transmission loss, wide working bandwidth and high-density integration by implementing an effective system integration architecture and a waveguide-transmission line vertical transmission transition structure. It has strong engineering practicality and can be easily expanded into a signal transmission system, such as an integrated antenna system.

[0006] According to one aspect of an embodiment of the present invention, a signal transmission device between a waveguide and an integrated module is provided. The device comprises: a waveguide, a first laminate, a second laminate and a spherical network array. The waveguide is a standard waveguide that works at a frequency corresponding to the system or a waveguide structure that is customized and processed on demand. The first laminate is provided with a perforated metallized cavity that has the same cross-sectional dimensions as the waveguide perpendicular to the signal transmission direction. The second laminate is provided with an integrated circuit, a transmission line and a signal transmitter on the surface of the second laminate. The spherical network array is attached between the first laminate and the second laminate to play an assembly connection role and includes a group of configured ground solder balls, which are fences or boundaries surrounding the perforated metallized cavity and the signal transmitter, forming a waveguide-like structure to transmit signals from the perforated metallized cavity to the signal transmitter.

[0007] Further, in an implementation device, the first stacked plate has: a waveguide interface side; a quasi-waveguide interface side, which is opposite to the waveguide interface side; a perforated metallized cavity, which is perpendicular to the plane of the first stacked plate and extends from the waveguide interface side to the quasi-waveguide interface side. The second stacked plate has: an integrated circuit, which includes a signal transmission interface; a signal transmitter, which is configured on the surface of the second stacked plate to transmit or receive signals; a transmission line, one end of which is connected to the signal transmitter, and the other end is connected to the signal transmission interface corresponding to the integrated circuit; a dielectric waveguide back cavity, which is composed of a configured first group of metal vias and a layer of metal short-circuit surface on the second stacked plate; a matching structure, which is composed of a configured second group of metal vias connected to the layer of metal short-circuit surface and a group of metal guide strips connecting the second group of metal vias on other layers except the layer occupied by the metal short-circuit surface. The ball network array includes a quasi-waveguide structure composed of a group of configured ground solder balls, which couples the perforated metallized cavity to the signal transmitter.

[0008] Further, the waveguide, the perforated metallized cavity, the quasi-waveguide and the dielectric waveguide back cavity are substantially aligned.

[0009] Furthermore, the ball grid array includes solder balls for transmitting power, ground, various digital signals and control signals between the first stacked board and the second stacked board.

[0010] Furthermore, the signal transmission interface included in the integrated circuit includes at least one group of configured solder balls, and the group of configured solder balls has at least one grounding solder ball and one non-grounding solder ball.

[0011] Furthermore, the non-ground solder ball is connected to the transmission line, and the ground solder ball is connected to the reference ground plane of the transmission line.

[0012] According to another aspect of an embodiment of the present invention, a method for signal transmission between a waveguide and an integrated module is provided. The method comprises: any of the devices for signal transmission between the waveguide and the integrated module. The method comprises: receiving a signal through the waveguide and transmitting the signal to the perforated metallized cavity, and then transmitting the signal to the waveguide-like structure through the perforated metallized cavity, and then transmitting the signal to the signal transmitter through the waveguide-like structure, and then transmitting the signal to the transmission line through the signal transmitter, and then transmitting the signal to the integrated circuit through the transmission line; or collecting a signal through the integrated circuit and transmitting the signal to the transmission line, and then transmitting the signal to the signal transmitter through the transmission line, and then transmitting the signal to the waveguide-like structure through the signal transmitter, and then transmitting the signal to the waveguide-like structure through the waveguide-like structure, and then transmitting the signal to the perforated metallized cavity through the waveguide, and then transmitting the signal to the waveguide through the metallized cavity, and then transmitting the signal out through the waveguide.

[0013] According to another aspect of an embodiment of the present invention, a signal transmission system between a waveguide and an integrated module is further provided: an integrated antenna system, comprising: a signal transmitter or a signal receiver; an antenna; and all structures or partial structures configured in the above-mentioned signal transmission device between the waveguide and the integrated module. The signal transmitter or the signal receiver is connected to the waveguide; the integrated circuit further comprises an antenna connection interface, and the antenna is configured on the surface of the second laminate and connected to the antenna connection interface. When the signal transmitter is connected to the waveguide, the integrated circuit is configured as a transmitting function, the integrated antenna system is an integrated transmitting antenna system, and the signal transmitter generates a signal that is radiated via the system antenna; when the signal receiver is connected to the waveguide, the integrated circuit is configured as a receiving function, the integrated antenna system is an integrated receiving antenna system, and the signal receiver receives and processes the signal received by the system antenna.

[0014] In an embodiment of the present invention, two stacked plates are connected and fixed together through a spherical network array, and a perforated metal cavity is configured on the first stacked plate, and a signal transmitter, a transmission line, a dielectric waveguide back cavity, a matching structure and an integrated circuit are configured on the second stacked plate to achieve signal transmission between the waveguide and the integrated module. The signal is input by the waveguide, coupled to the signal transmitter through the perforated metal cavity and the waveguide-like structure, and then transmitted to the integrated circuit through the transmission line. At the same time, the signal transmission path involved in this implementation case is a passive structure, so the reverse transmission of the signal can also be achieved, that is, the signal is transmitted from the integrated circuit to the waveguide through the signal transmission path. Furthermore, the signal transmission device and method can be expanded to an integrated antenna system to realize its system-level application. Compared with the existing public technology, the present invention can effectively reduce the signal transmission loss and achieve high-density integration of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The detailed description of the embodiments will be made with reference to the accompanying drawings to provide a further understanding of the present invention, in which:

[0016] Figure 1 An overall schematic front view of a signal transmission device between a waveguide and an integrated module according to a specific embodiment of the present invention is described.

[0017] Figure 2a to 2b The overall schematic side view and top view of the signal transmission device between the waveguide and the integrated module in a specific embodiment of the present invention are described.

[0018] Figures 3a to 3b A specific schematic front view and side view of the first stacked plate in a specific embodiment of the present invention are described.

[0019] Figures 4a to 4c The specific schematic front view, top view and side view of the second stacked plate in a specific embodiment of the present invention are described.

[0020] Figure 5 A specific schematic front view of a spherical network array according to a specific embodiment of the present invention is described.

[0021] Figures 6a to 6b A simulation schematic diagram illustrating the signal transmission path from a W-band rectangular waveguide to a grounded coplanar waveguide transmission line in a specific embodiment of the present invention and a diagram illustrating the return loss and insertion loss from a W-band rectangular waveguide port to a grounded coplanar waveguide transmission line port.

[0022] Figures 7a to 7b A schematic flow chart illustrating a method for transmitting signals between a waveguide and an integrated module according to an embodiment of the present invention.

[0023] Figures 8a to 8c The block diagram and overall schematic diagram of the integrated antenna system provided in the embodiment of the present invention are described. DETAILED DESCRIPTION

[0024] This specific embodiment discloses a signal transmission device, a signal transmission method and a signal transmission system between a waveguide and an integrated module. The present invention is further explained below in conjunction with the accompanying drawings and embodiments, and the described embodiments are only part of the embodiments of the present invention, not all of them.

[0025] According to one aspect of an embodiment of the present invention, the disclosed signal transmission device provides an interface with robustness and low insertion loss to manufacturing and assembly tolerances to an external signal transmitter or signal receiver. The disclosed device includes a waveguide, a first stacked plate, a spherical network array, and a second stacked plate. The waveguide is a standard waveguide corresponding to the required frequency or a waveguide structure processed on demand; the first stacked plate includes a perforated metallized cavity, and its cross-sectional dimensions perpendicular to the signal transmission direction are consistent with the cross-sectional dimensions of the waveguide perpendicular to the signal transmission direction; the second stacked plate includes an integrated circuit and includes a signal transmitter configured on the surface of the second stacked plate and a transmission line connected thereto, and the other end of the transmission line is connected to the signal transmission interface of the integrated circuit; the spherical network array is attached between the first stacked plate and the second stacked plate to play an assembly connection role and signal transmission between the two stacked plates, and includes a configured group of grounding solder balls, and the group of grounding solder balls are arranged as a fence or boundary around the perforated metallized cavity and the signal transmitter and receiver to form a waveguide-like structure.

[0026] In some examples, the laminate of the disclosed device comprises a printed circuit board. Figure 1 and Figure 2a to 2b As shown, the disclosed signal transmission method and device may include: a waveguide 1, a first printed circuit board 2, a spherical network array 3 and a second printed circuit board 4.

[0027] The waveguide 1 is the external signal transmission interface of the disclosed device, which can be connected to an external signal transmitter or signal receiver to realize the signal input or output of the signal transmission device. The waveguide 1 is configured as a standard waveguide component corresponding to the required frequency or as a waveguide structural component customized on demand.

[0028] The first printed circuit board 2 is configured as follows Figures 3a to 3b As shown, it has a first and a second surface opposite to each other and a waveguide interface side 22 and a waveguide-like interface side 23 configured on the two surfaces, wherein the first circuit printed board 2 includes a perforated metallized cavity 21, which is perpendicular to the first and the second surfaces and extends from the waveguide interface side 22 to the waveguide-like interface side 23, and the cross-sectional dimensions of the perforated metallized cavity 21 parallel to the first and the second surfaces of the first printed circuit board 2 are consistent with the cross-sectional dimensions of the waveguide.

[0029] The second printed circuit board 4 is configured as follows Figures 4a to 4cAs shown, it includes an integrated circuit 41, a signal transmitter 42, a matching structure 43, a transmission line 44 and a dielectric waveguide back cavity 45. The integrated circuit 41 includes a signal transmission interface 411, which is a group of configured solder balls, including a non-ground solder ball and a plurality of ground solder balls surrounding the non-ground solder ball; the integrated circuit 41 also includes other solder balls 412 defined as power supply, ground, signal transmission and signal control interface functions. The signal transmitter 42 is configured on the surface of the second printed circuit board 4 and connected to one end of the transmission line 44. The signal transmitter 42 is configured to convert the signal mode transmitted by the waveguide 1 to the signal mode transmitted by the transmission line 44. The dielectric waveguide back cavity 45 is composed of a configured first group of metal vias 451 and a metal short-circuit surface 452. One end of the first group of metal vias 451 is connected to the metal short-circuit surface 452. On each stacking layer occupied by the first group of metal vias 451 except the stacking layer occupied by the metal short-circuit surface 452, a rectangular metal groove 453 is configured corresponding to the first group of metal vias 451 to achieve avoidance, so as to cooperate with the first group of metal vias 451 and the metal short-circuit surface 452 to form the dielectric waveguide back cavity 45. The matching structure 43 is composed of a configured second group of metal vias 431 connected to the metal short-circuit surface 452 and a metal guide strip 432 connecting the group of metal vias on other layers except the layer occupied by the metal short-circuit surface. The signal transmitter 42 and the matching structure 43 are respectively placed on both sides of the center line of the short side of the dielectric waveguide back cavity 45. The dielectric waveguide back cavity 45 and the matching structure 43 cooperate with the signal transmitter 42 to improve the insertion loss and return loss of the signal converted from the waveguide 1 to the transmission line 44, and to achieve a wider working bandwidth.

[0030] The spherical network array 3 is configured as follows Figure 5 As shown, the spherical network array 3 is attached between the first printed circuit board 2 and the second printed circuit board 4, serving as an assembly connection structure for the two printed circuit boards and serving as a power supply, ground and signal connection transmission between them. The spherical network array 3 includes a waveguide-like structure 31 composed of a group of configured ground solder balls, which is configured as a fence or boundary formed around the perforated metallized cavity 21, and its boundary size is slightly larger than the cross-sectional size of the perforated metallized cavity.

[0031] As an optional embodiment, the waveguide 1 can be configured as a rectangular waveguide or a circular waveguide, and the corresponding perforated metallized cavity 21, the waveguide-like structure 31, and the dielectric waveguide back cavity 45 are also configured to be circular or other shapes that achieve optimal signal transmission of the overall structure. Similarly, as an optional embodiment, the transmission line 44 can be configured as a grounded coplanar waveguide, or as a substrate-integrated coaxial line, strip line, microstrip line, or other transmission line forms that are applicable as needed. Similarly, as an optional embodiment, the signal transmitter 42 and the matching structure 43 can be placed on both sides of the center line of the short side of the dielectric waveguide back cavity, and the matching structure 43 can also be configured in other positions as needed, such as being divided into two parts and placed on both sides of the center line of the long side of the dielectric waveguide back cavity, in order to optimize the signal transmission performance.

[0032] In some specific implementation cases, a signal transmission device from a rectangular waveguide operating in the W frequency band to a high-density integrated module may be configured. Figures 6a to 6b A simulation schematic diagram illustrating the rectangular waveguide to grounded coplanar waveguide transmission line portion in a W-band transmission device and a diagram illustrating the insertion loss and return loss of a direct interface. The waveguide 1 is configured as a standard rectangular waveguide WR-10 operating in the W-band, and its cross-sectional dimensions are 2.54mm×1.27mm. The cross-sectional dimensions of the perforated metallized cavity are consistent with those of the rectangular waveguide, also 2.54mm×1.27mm. The waveguide-like structure 31 is composed of 16 ground solder balls with a diameter of 0.4mm, and the 16 ground solder balls are arranged in a rectangular shape to form an air boundary for transmitting signals. The signal transmitter 42 is configured as a "T"-shaped patch, connected to the metal guide strip 441 in the middle of the grounded coplanar waveguide transmission line 44. The dielectric waveguide back cavity 45 is composed of a first group of metal vias 451 arranged in a rectangular shape and a metal short-circuit 452. The dielectric waveguide back cavity 45 involves 4 layers of dielectric plates and 5 layers of metal. Except for the 5th metal layer where the metal short-circuit 452 is located, the other 4 metal layers have rectangular metal grooves 453 between the rectangular boundaries surrounded by the first group of metal vias 451. The first group of metal vias 451 are connected to the metals other than the grooves in the above 4 metal layers. The matching structure 43 is composed of 8 second groups of metal vias 431 connected to the metal short-circuit 452 and rounded rectangular metal guide strips 432 on the remaining 4 metal layers. The rounded rectangular metal guide strips 432 connect the second group of metal vias 431 in the remaining 4 layers.

[0033] Figure 6b The insertion loss 51, the return loss 52 on the rectangular waveguide side, and the return loss 53 on the grounded coplanar waveguide transmission line side in decibels (dB) across the frequency range of 75 GHz to 110 GHz are illustrated. It can be seen that the -10 dB port return loss can cover the entire W-band frequency (75-110 GHz), the relative impedance bandwidth is 37.84%, and the insertion loss is less than 0.5 dB in the entire W-band.

[0034] According to another aspect of an embodiment of the present invention, a method for signal transmission between a waveguide and an integrated module is provided. Figures 7a to 7b A schematic flow chart illustrating a method for signal transmission between a waveguide and an integrated module provided in an embodiment of the present invention. Figure 7a The signal transmission method from the waveguide 1 to the integrated circuit 41 is described as follows: the waveguide 1 receives the signal and transmits the signal to the perforated metallized cavity 21, which then transmits the signal to the waveguide-like structure 31, which then transmits the signal to the signal transmitter 42, which then transmits the signal to the transmission line 44, which then transmits the signal to the integrated circuit 41; Figure 7b The signal transmission method from the integrated circuit 41 to the waveguide 1 is described as follows: the integrated circuit 41 collects the signal and transmits the signal to the transmission line 44, and then transmits the signal to the signal transmitter 42, and then transmits the signal to the waveguide-like structure 31, and then transmits the signal to the perforated metallized cavity 21, and then transmits the signal to the waveguide 1, and then the waveguide 1 transmits the signal out.

[0035] According to another aspect of an embodiment of the present invention, a signal transmission system between a waveguide and an integrated module is further provided: an integrated antenna system. Figures 8a to 8c A schematic diagram of an integrated antenna system provided by an embodiment of the present invention and a specific example are described. Figure 8a The figure shows a schematic diagram of an integrated transmitting antenna, wherein the system includes a signal transmitter, an antenna, and all structures of a signal transmission device between the waveguide and the integrated module. Figure 8b The figure shows a schematic diagram of an integrated receiving antenna, wherein the system includes a signal receiver, an antenna, and all structures of a signal transmission device between the waveguide and the integrated module. Figure 8c The integrated antenna system model is further proposed by adding an antenna part based on the signal transmission device and transmission method embodiment between the waveguide and the integrated module. The waveguide 1 is the external interface of the system, which can be connected to an external signal transmitter or signal receiver; the antenna 46 is arranged on the surface of the second printed circuit board 4, which is located on the other side of the surface where the integrated circuit 41 is located, and the antenna 46 is connected to the antenna connection interface 413 of the integrated circuit 41 to realize the transmission between the antenna transmission or reception signal and the integrated circuit 41.

[0036] It should be noted that the aforementioned method embodiments are only preferred implementation modes of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

[0037] The term "coupled" may include connections, communications or signal paths that achieve a functional relationship consistent with the description of the present disclosure. In addition, the use of words such as "first" and "second" to define components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above words have no special meaning. At the same time, unless otherwise stated, in this description, "aligned" or "substantially aligned" means that the two are 90% aligned or more than 90% aligned.

Claims

1. A signal transmission device between a waveguide and an integrated module, characterized in that: It includes a waveguide, a first stacked plate, a spherical network array and a second stacked plate arranged in sequence; The waveguide is an external signal transmission interface of the device; The first stacked plate is provided with a perforated metalized cavity, and the perforated metalized cavity plays a role in signal transmission between the waveguide and the spherical network array; The second laminated board includes a signal transmitter, a transmission line and an integrated circuit, one end of the transmission line is connected to the signal transmitter, and the other end is connected to the signal transmission interface of the integrated circuit, and the signal transmitter is arranged on the surface of the second laminated board to transmit or receive signals; The ball network array is assembled between the first stacked board and the second stacked board and includes a waveguide-like structure composed of a group of grounded solder balls surrounding the perforated metallized cavity. The waveguide-like structure plays a role in transmitting signals between the signal transmitter and the perforated metallized cavity.

2. The device according to claim 1, characterized in that: The second stacked board also includes a dielectric waveguide back cavity and a matching structure, wherein the dielectric waveguide back cavity is composed of a configured first group of metal vias and a layer of metal short-circuit surface on the second stacked board; the matching structure is composed of a configured second group of metal vias connected to the layer of metal short-circuit surface and a group of metal conductive strips connecting the second group of metal vias in other layers occupied by the second group of metal vias except the layer occupied by the metal short-circuit surface.

3. The device according to claim 1, characterized in that: The ball grid array includes solder balls for transmitting power, ground, digital signals and control signals between the first laminate and the second laminate.

4. The device according to claim 1, characterized in that: The waveguide-like structure is arranged as a fence or boundary surrounding the signal transmitter and the perforated metallized cavity.

5. The device according to claim 1, characterized in that: The integrated circuit includes: a signal transmission interface, which includes a group of configured solder balls, wherein the group of configured solder balls includes at least one solder ball connected to the reference ground plane of the transmission line and at least one solder ball connected to the transmission line.

6. The device according to claim 2, characterized in that: The number of metal layers and dielectric substrate layers occupied by the dielectric waveguide back cavity in the second stacked plate is greater than the number of metal layers and dielectric substrate layers occupied by the transmission line, wherein the configured first group of metal vias are interconnected with each occupied metal layer, wherein each occupied metal layer except the one metal short circuit path is grooved between the areas surrounded by the first group of metal vias to cooperate with the first group of metal vias to form the dielectric waveguide back cavity.

7. The device according to claim 2, characterized in that: The waveguide, the perforated metallized cavity, the waveguide-like structure and the dielectric waveguide back cavity are aligned.

8. A method for signal transmission between a waveguide and an integrated module, characterized in that: Based on the device described in any one of claims 1 to 7 and implemented as required in the following manner: The signal is received through the waveguide and transmitted to the perforated metallized cavity, the signal is transmitted to the waveguide-like structure through the perforated metallized cavity, the signal is transmitted to the signal transmitter through the waveguide-like structure, the signal is transmitted to the transmission line through the signal transmitter, and the signal is transmitted to the integrated circuit through the transmission line.

9. A method for signal transmission between a waveguide and an integrated module, characterized in that: Based on the device described in any one of claims 1 to 7 and implemented as required in the following manner: The integrated circuit collects the signal and transmits the signal to the transmission line, transmits the signal to the signal transmitter through the transmission line, transmits the signal to the waveguide-like structure through the signal transmitter, transmits the signal to the perforated metallized cavity through the waveguide-like structure, and transmits the signal to the waveguide through the metallized cavity.

10. A signal transmission system between a waveguide and an integrated module, characterized in that: It comprises a signal transmitter or a signal receiver, an antenna and the device described in any one of claims 1 to 7, wherein the signal transmitter or the signal receiver is connected to the waveguide; wherein the integrated circuit also comprises an antenna connection interface, and the antenna connection interface is connected to the antenna arranged on the surface of the second laminate.

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