High-power high-voltage power supply phase-shifted full-bridge LLC module

Abstract

A high-power high-voltage power supply phase-shifted full-bridge LLC module disclosed by the present invention comprises an LLC primary side module, an LLC secondary side module and a PCB switch board, the LLC primary side module comprises a full-bridge LLC bridge arm and a primary side radiator, the full-bridge LLC bridge arm comprises a plurality of power devices, the plurality of power devices are installed at the right side of the primary side radiator, and the PCB switch board is installed at the right side of the primary side radiator. The LLC secondary side module comprises a secondary side radiator, a transformer, a resonant inductor and a plurality of rectifier diodes, the transformer and the resonant inductor are sealed in the secondary side radiator, the rectifier diodes are installed on the left side of the secondary side radiator, the secondary side radiator is installed on the left side of the primary side radiator through a heat conduction insulation assembly, and a capacitor and an inductor are arranged on the lower side of the PCB switch board. The PCB switch board is buckled on the primary side radiator and the secondary side radiator from top to bottom, and pins of the power device, the secondary side radiator, the transformer, the resonant inductor and the rectifier diode penetrate through the PCB switch board and then are welded with the PCB switch board. The power density and the heat dissipation efficiency can be effectively improved, electrical wiring is reduced, and modular assembly is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of switching power supplies, and more specifically, to a high-power high-voltage power supply phase-shifted full-bridge LLC module. Background Art

[0002] At present, the power level of AC-DC power supply products is mainly concentrated below 5kW, and the voltage level is below 270V, which indicates that there is a lack of high-power and high-voltage products and related technical reserves in the market. With the gradual improvement of the level of equipment electrification, the widespread application of high-voltage busbars, and the popularization of all-electric special vehicles, the demand for high-power and high-voltage power supplies is becoming more and more urgent. These power supplies not only charge high-voltage battery packs, but also provide power for high-voltage loads such as motor controllers and servo controllers. However, existing high-power and high-voltage power supply products face several challenges and limitations, such as large size, low power density, and serious heating problems during long-term operation, all of which lead to reduced work efficiency. In addition, complex electrical wiring is not conducive to the development trend of modularization and miniaturization. Although the progress of power electronics technology has increased power density, its improvement rate is slower than that of low-voltage power supplies, mainly due to the limitations of the voltage resistance and heat dissipation capabilities of semiconductor devices. High-power density design requires more efficient thermal management solutions and more compact component layouts, but the current technical level has not yet fully met these requirements. As the power increases, the heat generated also increases, and the existing heat dissipation technology is difficult to effectively cope with the challenges of high-density heat flow. Electrical wiring design must consider insulation problems, electromagnetic compatibility and safety issues caused by high voltage and high current. Improper wiring may cause electromagnetic interference and affect the stability and reliability of the power supply. Therefore, although high-power and high-voltage power supplies play a vital role in many industrial applications such as power transmission, industrial drives, medical equipment and scientific research facilities, they still face many challenges and shortcomings in terms of power density, heat dissipation and electrical wiring. Summary of the invention

[0003] In order to solve the technical problems of low power density and poor heat dissipation of existing high-power high-voltage power supplies, the present invention innovatively provides a high-power high-voltage power supply phase-shifted full-bridge LLC module, which effectively improves power density and heat dissipation efficiency, reduces electrical wiring, and realizes modular assembly.

[0004] To achieve the above technical objectives, an embodiment of the present invention discloses a high-power high-voltage power supply phase-shifted full-bridge LLC module, including an LLC primary module, an LLC secondary module and a PCB switch board, the LLC primary module including a full-bridge LLC bridge arm and a primary radiator, the full-bridge LLC bridge arm including multiple power devices, multiple power devices are installed on the right side of the primary radiator, the LLC secondary module including a secondary radiator, a transformer, a resonant inductor and multiple rectifier diodes, the transformer and the resonant inductor are sealed in the secondary radiator, multiple rectifier diodes are installed on the left side of the secondary radiator, the secondary radiator is installed on the left side of the primary radiator through a thermally conductive insulation component, a capacitor and an inductor are provided on the lower side of the PCB switch board, the PCB switch board is buckled on the upper side of the primary radiator and the secondary radiator from top to bottom, and the pins of the power device, the secondary radiator, the transformer, the resonant inductor and the rectifier diode are welded to the PCB switch board after passing through the PCB switch board.

[0005] Furthermore, the present invention provides a high-power, high-voltage power supply phase-shifted full-bridge LLC module, wherein the primary side heat sink comprises a heat sink vertical plate and a heat sink base, the lower end of the heat sink vertical plate is integrally formed with the heat sink base, the heat sink base extends to the right to form an L-shaped structure with the heat sink vertical plate, the secondary side heat sink is installed on the left side wall of the heat sink vertical plate through a thermally conductive insulating component, a plurality of the power devices are fixed in a row in pairs on the right side wall of the heat sink vertical plate, and a first thermally conductive insulating pad is provided between the power devices and the heat sink vertical plate.

[0006] Furthermore, the present invention provides a high-power high-voltage power supply phase-shifted full-bridge LLC module, wherein the front half and the rear half of the heat dissipation vertical plate are both provided with a first mounting boss extending upward, the heat dissipation vertical plate is fixedly connected to the PCB switch board through the first mounting boss, the middle part of the heat dissipation vertical plate is provided with a second mounting boss extending to the right, a first temperature sensor is installed on the second mounting boss, and a plurality of third mounting bosses extending to the right are spaced apart at the right end of the heat dissipation base, each of the third mounting bosses is provided with a first fixing through hole, and each of the fixing through holes is sleeved with a first insulating sheath.

[0007] Furthermore, the present invention provides a high-power high-voltage power supply phase-shifted full-bridge LLC module, wherein the secondary side heat sink is provided with a cavity with an upper opening, the cavity is divided into a plurality of independent mounting grooves, the transformer and the resonant inductor are respectively glue-filled and sealed in the corresponding mounting grooves, the upper surface of the secondary side heat sink is provided with a positioning partition covering the upper opening of the cavity, the pins of the transformer and the resonant inductor extend from the positioning partition, the positioning partition is provided with glue holes corresponding to the plurality of mounting grooves one by one, the rectifier diodes are installed in a row on the left side wall of the secondary side heat sink, and a second thermally conductive insulating pad is provided between the rectifier diodes and the left side wall of the secondary side heat sink.

[0008] Furthermore, the present invention provides a high-power high-voltage power supply phase-shifted full-bridge LLC module, wherein a fourth mounting boss extending to the left is provided at the lower end of the left half of the secondary side heat sink, a plurality of second fixing through holes are provided on the fourth mounting boss, a second insulating sheath is sleeved in each of the second fixing through holes, a fifth mounting boss extending toward the mounting groove is provided in the middle of the upper end of the left half of the secondary side heat sink, a second temperature sensor is installed on the fifth mounting boss, sixth mounting bosses are provided on the front and rear sides of the upper end of the left half of the secondary side heat sink, and the secondary side heat sink is fixedly connected to the PCB switch board through the plurality of sixth mounting bosses.

[0009] Furthermore, the present invention provides a high-power high-voltage power supply phase-shifted full-bridge LLC module, wherein the thermally conductive insulation component includes an insulating partition plate and a third thermally conductive insulation pad, an embedding groove is provided on the right side wall of the insulating partition plate along its length direction, a plurality of window holes penetrating the bottom of the embedding groove are evenly spaced in the middle portion of the insulating partition plate along its length direction, the third thermally conductive insulation pad is embedded in the embedding groove of the insulating partition plate, and the end of the secondary side heat sink is embedded in the window hole of the insulating partition plate and connected to the heat dissipation vertical plate through the third thermally conductive insulation pad.

[0010] Furthermore, the present invention provides a high-power high-voltage power supply phase-shifted full-bridge LLC module, wherein a first through hole is provided between two adjacent window holes on the insulating partition plate, a second through hole is provided on the third thermally conductive insulating pad that matches the majority of the first through holes one-to-one, a threaded hole is provided on the right side wall of the secondary radiator that matches the first through holes one-to-one, a connecting hole is provided on the heat dissipation vertical plate that matches the first through holes one-to-one, an insulating connector is provided in each of the connecting holes on the heat dissipation vertical plate, and the insulating connectors are fixed on the corresponding threaded holes of the secondary radiator after passing through the corresponding connecting holes, the second through holes and the first through holes from right to left in sequence.

[0011] Furthermore, the present invention provides a high-power high-voltage power supply phase-shifted full-bridge LLC module, wherein the right end of the secondary side heat sink is provided with a plurality of heat dissipation bosses that match the window holes on the insulating partition plate one by one, and the heat dissipation bosses are embedded one by one in the window holes on the insulating partition plate, and the thickness of the heat dissipation bosses is the same as the depth of the window holes.

[0012] Furthermore, the present invention provides a high-power high-voltage power supply phase-shifted full-bridge LLC module, wherein a positioning protrusion coaxial with the first through hole and extending to the left is provided on the left side wall of the insulating partition plate, and a positioning groove coaxially arranged with the threaded hole is provided on the secondary side heat sink, and the positioning protrusion is embedded in the positioning groove.

[0013] Furthermore, the present invention provides a high-power high-voltage power supply phase-shifted full-bridge LLC module, wherein the secondary side heat sink is shaped like a convex character with a small left side and a large right side, the inductor and the capacitor on the PCB switch board are arranged in the gaps on both sides of the secondary side heat sink, and the PCB switch board is also provided with a primary side process hole, a secondary side process hole, a first mounting hole and a second mounting hole, respectively, the primary side process hole is coaxial with the first fixed through hole, the secondary side process hole is coaxial with the second fixed through hole, the first mounting hole is opposite to the second mounting boss, and the second mounting hole is opposite to the fifth mounting boss.

[0014] The beneficial effects of the present invention are as follows: the present invention is provided with an LLC primary module, an LLC secondary module and a PCB switch board, wherein the LLC primary module includes a full-bridge LLC bridge arm and a primary radiator, the full-bridge LLC bridge arm includes a plurality of power devices, and the plurality of power devices are all installed on the right side of the primary radiator, and the LLC secondary module includes a secondary radiator, a transformer, a resonant inductor and a plurality of rectifier diodes, the transformer and the resonant inductor are sealed in the secondary radiator, the plurality of rectifier diodes are installed on the left side of the secondary radiator, the secondary radiator is installed on the left side of the primary radiator through a heat-conducting insulation component, a capacitor and an inductor are provided on the lower side of the PCB switch board, the PCB switch board is buckled on the primary radiator and the secondary radiator from top to bottom, the pins of the power device, the secondary radiator, the transformer, the resonant inductor and the rectifier diode are passed through the PCB switch board and then welded thereto. The present invention fixes the secondary radiator and the primary radiator to the left and right sides of the heat-conducting insulation component respectively, and accurately buckles the PCB switch board between the two radiators. This design enables the LLC primary module, LLC secondary module and PCB switch board to be tightly integrated, achieving efficient use of assembly space. The volume of the assembled module is significantly reduced. At the same time, by adopting a dual heat sink design, that is, the configuration of the primary heat sink and the secondary heat sink, the heat generated by the LLC primary module, LLC secondary module and high-power electrical components on the PCB switch board can be quickly dissipated, thereby improving the heat dissipation efficiency. While ensuring efficient heat dissipation, the design also enhances the module's ability to perform efficient energy conversion and output in a limited space, thereby improving power density. In addition, the welding connection between the electrical components on the LLC primary module and the LLC secondary module and the PCB switch board greatly simplifies the electrical wiring, effectively avoiding the problems that may be caused by complex wiring of traditional high-power high-voltage power supplies, and achieving more convenient modular assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is the circuit schematic diagram of the phase-shifted full-bridge LLC;

[0016] Figure 2 It is a three-dimensional structural schematic diagram of a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0017] Figure 3 It is a three-dimensional structural schematic diagram of another angle of a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0018] Figure 4 It is a three-dimensional structural schematic diagram of an LLC primary module in a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0019] Figure 5 It is a three-dimensional structural schematic diagram of another angle of the LLC primary module in a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0020] Figure 6 It is a three-dimensional structural schematic diagram of an LLC secondary side module in a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0021] Figure 7 It is a schematic diagram of the three-dimensional structure of a secondary side heat sink in a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0022] Figure 8 It is a three-dimensional structural schematic diagram of another angle of the LLC secondary side module in a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0023] Fig. 9 It is a three-dimensional structural schematic diagram of a heat-conducting insulation component in a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0024] Fig.10 It is a schematic diagram of the three-dimensional structure of a heat-conducting insulation component in a high-power high-voltage power supply phase-shifted full-bridge LLC module from another angle of the present invention;

[0025] Fig.11 It is a three-dimensional structural schematic diagram of a PCB switch board in a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0026] Fig.12 It is a three-dimensional structural schematic diagram of another angle of a PCB switch board in a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention;

[0027] Fig.13 This is a schematic diagram of the exploded structure of a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention. DETAILED DESCRIPTION

[0028] The following is a detailed explanation and description of a high-power high-voltage power supply phase-shifted full-bridge LLC module of the present invention in conjunction with the drawings in the specification.

[0029] The present invention can be applied to Figure 1 The phase-shifted full-bridge LLC circuit shown in Figure 1It consists of two groups of full-bridge LLC circuits, with inputs in series and outputs in parallel. Each group of full-bridge bridge arms consists of a leading arm and a lagging arm. The secondary side rectifier uses a voltage doubler rectifier circuit. The operating frequencies of the two groups of full-bridge LLCs remain consistent, and the phases are staggered by 180°. The output gain is adjusted by adjusting the operating frequency or the phase shift angle of the lagging arm relative to the leading arm. Under high-power and high-frequency working conditions, the transformer, resonant inductor, MOSFET power devices on the primary side, and rectifier diodes on the secondary side will generate heat during operation.

[0030] like Figure 2 , Figure 3 Combined with Figure 4 , Figure 6 and Fig.11 As shown, an embodiment of the present invention discloses a high-power high-voltage power supply phase-shifted full-bridge LLC module, including an LLC primary module 1, an LLC secondary module 2 and a PCB switch board 3. The LLC primary module 1 includes a full-bridge LLC bridge arm and a primary heat sink, and the full-bridge LLC bridge arm includes a plurality of power devices 11, and the plurality of power devices 11 are installed on the right side of the primary heat sink. The LLC secondary module 2 includes a secondary heat sink 21, a transformer 22, a resonant inductor 23 and a plurality of rectifier diodes 24, wherein the transformer 22 and the resonant inductor 23 are sealed in the secondary heat sink 21, and the plurality of rectifier diodes 24 are installed on the left side of the secondary heat sink 21, and the secondary heat sink 21 is installed on the left side of the primary heat sink through a thermally conductive insulating component 4. A capacitor 31 (such as Figure 1The primary or secondary filter capacitors, busbar support capacitors and resonant capacitors) and inductors 32 (such as primary filter inductors) are installed in the PCB switch board 3, and the PCB switch board 3 is buckled on the primary radiator and the secondary radiator 21 from top to bottom, so that the pins of the power device 11, the secondary radiator 21, the transformer 22, the resonant inductor 23 and the rectifier diode 24 pass through the PCB switch board 3 and are welded thereto. In this embodiment, the secondary radiator 21 and the primary radiator are respectively fixed to the left and right sides of the thermally conductive insulating component 4, and the PCB switch board 3 is precisely buckled between the two radiators. This design enables the LLC primary module 1, the LLC secondary module 2 and the PCB switch board 3 to be tightly integrated, realizing efficient use of the assembly space. The volume of the assembled module is significantly reduced. At the same time, by adopting a double radiator design, that is, the configuration of the primary radiator and the secondary radiator 21, the heat generated by the LLC primary module 1, the LLC secondary module 2 and the high-power electrical components on the PCB switch board 3 can be quickly dissipated, thereby improving the heat dissipation efficiency. While ensuring efficient heat dissipation, the design also enhances the module's ability to perform efficient energy conversion and output in a limited space, improving power density. In addition, the welding connection between the electrical components on the LLC primary module 1 and the LLC secondary module 2 and the PCB switch board 3 greatly simplifies the electrical wiring, effectively avoiding the problems that may be caused by complex wiring of traditional high-power and high-voltage power supplies, and achieving more convenient modular assembly.

[0031] like Figure 4 Combined with Figure 5 As shown, in one embodiment of the present invention, the primary heat sink includes a heat sink upright 12 and a heat sink base 13, the lower end of the heat sink upright 12 is integrally formed with the heat sink base 13, and the heat sink base 13 extends to the right to form an L-shaped structure with the heat sink upright 12. The secondary heat sink 21 is installed on the left side wall of the heat sink upright 12 through the heat-conducting insulation component 4, and a plurality of power devices 11 are fixed on the right side wall of the heat sink upright 12 in groups of two. A first heat-conducting insulation pad 14 is arranged between the power device 11 and the heat sink upright 12 to ensure that the heat generated by the power device 11 can be effectively transferred to the heat sink upright 12 and dissipated therethrough, while achieving electrical isolation between the power device 11 and other components. Of course, the heat sink base 13 can also dissipate part of the heat of the power device 11. The L-shaped setting significantly improves the heat dissipation speed and efficiency of the power device 11.

[0032] like Figure 5As shown, the front and rear halves of the heat dissipation vertical plate 12 are both provided with a first mounting boss 121 extending upward. The first mounting boss 121 enables the heat dissipation vertical plate 12 to be tightly combined with the PCB switch board 3 by a fixed connection, thereby enhancing the stability of the connection. Through the provision of the first mounting boss 121, a recessed structure is formed in the middle of the heat dissipation vertical plate 12, so that the boss part (i.e., the first mounting boss 121) contacts the ground wire (i.e., the copper coating) of the PCB switch board 3, ensuring the reliability of grounding. The recessed position maintains a necessary safety distance from the LLC switch board 3 PCB, thereby achieving electrical isolation. A second mounting boss 122 extending to the right is also provided in the middle of the heat dissipation vertical plate 12, on which a first temperature sensor 15 is installed for real-time monitoring of the temperature of the power device 11. A plurality of third mounting bosses 131 extending to the right are provided at intervals at the right end of the heat dissipation base 13, each of which is provided with a first fixing through hole 1311 and is covered with a first insulating sheath 16 for connection with a chassis or other external structures. The number of the third mounting bosses 131 can be based on Figure 4 The arrangement shown is three to achieve a stable installation with the chassis. During the installation process, a thermally conductive insulating pad is laid between the bottom plane of the heat dissipation base 13 and the chassis installation plane, and a first insulating sheath 16 is arranged at the three third mounting bosses 131 to ensure electrical isolation between the heat dissipation base 13 and the chassis.

[0033] like Figure 6-8 As shown, in one embodiment of the present invention, the secondary heat sink 21 is provided with a cavity structure with an upper opening, and the cavity is divided into a plurality of independent mounting grooves 211. The plurality of mounting grooves 211 are each independent (e.g. Figure 7211 ), which does not interfere with each other, ensuring that the transformer 22 and the resonant inductor 23 can be sealed in their respective mounting grooves 211 by glue filling, and can ensure electrical isolation between the transformer 22 and the resonant inductor 23. Such a design not only makes full use of the internal space of the secondary radiator 21, but also effectively saves assembly space. By installing relatively large components such as the transformer 22 and the resonant inductor 23 inside the secondary radiator 21, these components can have more surface area in contact with the secondary radiator 21, thereby accelerating the heat dissipation and improving the heat dissipation effect. In order to further optimize the heat dissipation effect, a positioning partition 25 is designed on the upper surface of the secondary radiator 21, and the positioning partition 25 covers the upper end opening of the cavity. The pins of the transformer 22 and the resonant inductor 23 extend from the positioning partition 25 so as to be welded with the PCB switch board 3. In order to facilitate the glue filling operation, the positioning partition 25 is also provided with glue filling holes 251 corresponding to the multiple mounting grooves 211 to ensure the smooth progress of the glue filling process. The rectifier diodes 24 are installed in a row on the left side wall of the secondary heat sink 21. In order to achieve better heat transfer effect and maintain electrical isolation, a second thermally conductive insulating pad 26 is placed between the rectifier diodes 24 and the left side wall of the secondary heat sink 21. The second thermally conductive insulating pad 26 not only improves the heat dissipation efficiency, but also plays an electrical isolation role and can withstand higher power rectifier diodes 24.

[0034] like Figure 7 and Figure 8As shown, a fourth mounting boss 212 extending to the left is provided at the lower end of the left half of the secondary radiator 21, and a plurality of second fixing through holes 2121 are provided on the fourth mounting boss 212. A second insulating sheath 28 is sleeved in each second fixing through hole 2121 to ensure that the secondary radiator 21 can be electrically isolated from the chassis or other external structures when connected. In order to further improve the stability and reliability of the connection, the fourth mounting boss 212 can be designed as a plate-like structure, and the second fixing through holes 2121 are respectively arranged at the front and rear ends of the plate-like structure. When connected, a thermally conductive insulating pad can be laid between the bottom plane of the secondary radiator 21 and the chassis mounting plane, and the electrical isolation of the secondary radiator 21 from the chassis or external connection structure is achieved by sleeved on the second insulating sheath 28 in the second fixing through hole 2121, so as to be suitable for application scenarios with higher power requirements. A fifth mounting boss 213 extending toward the mounting groove 211 is provided in the middle of the upper end of the left half of the secondary radiator 21. A second temperature sensor 27 is mounted on the fifth mounting boss 213, which is used to monitor the temperature of the transformer 22, the resonant inductor 23 and the rectifier diode 24 in real time. In this way, the operating status of each component can be timely understood to ensure that each component operates within a safe temperature range. In order to further strengthen the fixed connection between the secondary heat sink 21 and the PCB switch board 3, a sixth mounting boss 214 is provided on both the front and rear sides of the upper end of the left half of the secondary heat sink 21. Through these sixth mounting bosses 214, the secondary heat sink 21 can be firmly fixedly connected to the PCB switch board 3, ensuring the stability and reliability of the entire connection structure.

[0035] like Fig. 9 and Fig.10As shown, in one embodiment of the present invention, the thermally conductive insulating component 4 includes an insulating partition plate 41 and a third thermally conductive insulating pad 42. An embedding groove 411 is provided on the right side wall of the insulating partition plate 41 along its own length direction, and the third thermally conductive insulating pad 42 is embedded in the embedding groove 411 of the insulating partition plate 41. In addition, a plurality of window holes 412 penetrating the bottom of the embedding groove 411 are evenly spaced in the middle part of the insulating partition plate 41 along its length direction. These window holes 412 provide a channel for heat dissipation. The third thermally conductive insulating pad 42 is cleverly embedded in the embedding groove 411 of the insulating partition plate 41, ensuring its close combination with the insulating partition plate 41. The end of the secondary side heat sink 21 is embedded in the window hole 412 of the insulating partition plate 41, and is connected to the heat dissipation vertical plate 12 through the third thermally conductive insulating pad 42. This arrangement not only improves the heat dissipation efficiency, but also ensures good contact between the secondary side heat sink 21 and the heat dissipation vertical plate 12. The third thermally conductive insulating pad 42 is embedded in the partition plate. It has excellent thermal conductivity and certain elasticity, and can be effectively filled between the heat dissipation vertical plate 12 and the secondary radiator 21. It forms good contact with the two opposite surfaces of the heat dissipation vertical plate 12 and the secondary radiator 21, thereby forming a good heat dissipation path. This structure not only improves the overall heat dissipation effect, but also ensures the stability and reliability of the equipment during high-power operation. At the same time, the third thermally conductive insulating pad 42 also has good electrical insulation, which can achieve electrical isolation between the LLC primary module and the LLC secondary module 2, thereby meeting higher power requirements.

[0036] A first through hole 413 is provided between two adjacent window holes 412 on the insulating partition plate 41, and the first through hole 413 facilitates the connection between the heat sinks. A second through hole 421 matching the majority of the first through holes 413 is provided on the third thermally conductive insulating pad 42. A threaded hole 215 matching the first through holes 413 is provided on the right side wall of the secondary heat sink 21. A connection hole 123 matching the first through hole 413 is provided on the heat dissipation vertical plate 12. An insulating connector 5 is provided in each connection hole 123, and these insulating connectors 5 are fixed on the corresponding threaded hole 215 of the secondary heat sink 21 after passing through the corresponding connection hole 123, the second through hole 421 and the first through hole 413 from right to left. In this way, the insulating connector 5 not only ensures the firmness of the connection between the primary heat sink and the secondary heat sink 21, but the insulation of the insulating connector 5 also ensures the electrical isolation between the two, thereby meeting higher power requirements.

[0037] The right end of the secondary radiator 21 is provided with a plurality of heat dissipation bosses 217 that match the window holes 412 on the insulating partition plate 41 one by one. The heat dissipation bosses 217 are embedded in the window holes 412 on the insulating partition plate 41 one by one, and their thickness is the same as the depth of the window holes 412. When the heat dissipation vertical plate 12 and the secondary radiator 21 are connected, the heat dissipation bosses 217 of the secondary radiator 21 can be completely embedded in the window holes 412 of the insulating partition plate 41. At this time, the heat dissipation bosses 217 are against the third thermally conductive insulating pad 42, forming an effective heat dissipation mechanism. When the temperature of the primary radiator is higher than that of the secondary radiator 21, the heat can be dissipated through the secondary radiator 21, and vice versa. This design enables the radiator to be reasonably utilized according to the temperature difference and fully dissipate heat, thereby improving the overall heat dissipation efficiency.

[0038] like Fig.10 Combined with Figure 7 As shown, in order to further improve the convenience and accuracy of installation, a positioning protrusion 414 is provided on the left side wall of the insulating partition plate 41, which is coaxial with the first through hole 413 and extends to the left. A positioning groove 216 is provided on the secondary heat sink 21, which is coaxial with the threaded hole 215, and the positioning protrusion 414 can be embedded in the positioning groove 216. During the installation process, the insulating partition plate 41 and the secondary heat sink 21 can be quickly positioned by the positioning protrusion 414, thereby completing the installation of the entire component. This design not only improves the installation efficiency, but also ensures the accuracy and reliability of the component during the installation process.

[0039] like Figure 11-13 Combined with Figure 6As shown, in one embodiment of the present invention, the secondary radiator 21 is in the shape of a convex character with a small left side and a large right side. The inductor 32 and the capacitor 31 on the PCB switch board 3 are arranged in the vacant areas on both sides of the secondary radiator 21. This layout makes full use of the limited assembly space, making the entire structure more compact, and the inductor 32 and the capacitor 31 can also be cooled by the secondary radiator 21 and the primary radiator. This arrangement can significantly improve the power density, thereby achieving a higher power output in the same space. In addition, a plurality of process holes (i.e., the primary process hole 33 and the secondary process hole 34) and mounting holes (i.e., the first mounting hole 35 and the second mounting hole 36) are also provided on the PCB switch board 3 to meet different installation requirements. The primary process hole 33 and the secondary process hole 34 are coaxial with the first fixing through hole 1311 and the second fixing through hole 2121, respectively. Such a design greatly simplifies the installation process of the primary radiator and the secondary radiator 21. In order to further optimize the installation process, the first mounting hole 35 is opposite to the second mounting boss 122, while the second mounting hole 36 is opposite to the fifth mounting boss 213. Such a design ensures that the first temperature sensor 15 and the second temperature sensor 27 can be conveniently installed in the corresponding positions. In order to further improve the assembly efficiency, the pins of the power device 11 on the primary heat sink are designed to face upward, and similarly, the pins of the upper transformer 22, the resonant inductor 23 and the rectifier diode 24 on the secondary heat sink 21 are also facing upward. Such a design enables the pins of each device to be easily inserted into the pre-set electrical connection holes 123 on the PCB switch board 3 when the PCB switch board 3 is buckled together with the primary heat sink and the secondary heat sink 21, thereby facilitating the welding operation and improving the assembly efficiency.

[0040] It is worth noting that the heat dissipation vertical plate 12, the heat dissipation base 13 and the secondary radiator 21, these key heat dissipation components, can all be realized through the fine processing technology of aluminum. This process not only benefits from the low density characteristics of aluminum metal, which enables aluminum to reduce the overall weight while maintaining structural strength, thereby providing convenience during movement and installation; but also benefits from the excellent thermal conductivity of aluminum, which ensures that heat can be quickly and evenly conducted from the heat source to various parts of the radiator, and then effectively dissipated to the environment; in addition, the excellent processability of aluminum makes the shape and structure of the radiator more diverse to adapt to different heat dissipation needs and space limitations.

[0041] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0042] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and simple improvements made to the essential contents of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-power high-voltage power supply phase-shifted full-bridge LLC module, characterized in that: It comprises an LLC primary module, an LLC secondary module and a PCB switch board, wherein the LLC primary module comprises a full-bridge LLC bridge arm and a primary radiator, wherein the full-bridge LLC bridge arm comprises a plurality of power devices, wherein the plurality of power devices are mounted on the right side of the primary radiator, wherein the LLC secondary module comprises a secondary radiator, a transformer, a resonant inductor and a plurality of rectifier diodes, wherein the transformer and the resonant inductor are sealed in the secondary radiator, wherein the plurality of rectifier diodes are mounted on the left side of the secondary radiator, wherein the secondary radiator is mounted on the left side of the primary radiator through a heat-conducting insulating component, wherein capacitors and inductors are arranged on the lower side of the PCB switch board, wherein the PCB switch board is buckled on the upper sides of the primary radiator and the secondary radiator from top to bottom, wherein the pins of the power devices, the secondary radiator, the transformer, the resonant inductor and the rectifier diode pass through the PCB switch board and are welded thereto.

2. A high-power high-voltage power supply phase-shifted full-bridge LLC module according to claim 1, characterized in that: The primary radiator comprises a heat dissipation vertical plate and a heat dissipation base. The lower end of the heat dissipation vertical plate is integrally formed with the heat dissipation base. The heat dissipation base extends to the right to form an L-shaped structure with the heat dissipation vertical plate. The secondary radiator is installed on the left side wall of the heat dissipation vertical plate through a thermally conductive insulating component. A plurality of power devices are fixed in a row in pairs on the right side wall of the heat dissipation vertical plate at intervals. A first thermally conductive insulating pad is provided between the power devices and the heat dissipation vertical plate.

3. A high-power high-voltage power supply phase-shifted full-bridge LLC module according to claim 2, characterized in that: The front and rear halves of the heat dissipation vertical plate are both provided with a first mounting boss extending upward, and the heat dissipation vertical plate is fixedly connected to the PCB switch board through the first mounting boss. The middle part of the heat dissipation vertical plate is provided with a second mounting boss extending to the right, and a first temperature sensor is installed on the second mounting boss. A plurality of third mounting bosses extending to the right are spaced apart at the right end of the heat dissipation base, and each of the third mounting bosses is provided with a first fixing through hole, and each of the fixing through holes is sleeved with a first insulating sheath.

4. A high-power high-voltage power supply phase-shifted full-bridge LLC module according to claim 3, characterized in that: The secondary radiator is provided with a cavity with an upper opening, and the cavity is divided into a plurality of independent mounting grooves. The transformer and the resonant inductor are respectively sealed in the corresponding mounting grooves by glue filling. The upper surface of the secondary radiator is provided with a positioning partition covering the upper opening of the cavity. The pins of the transformer and the resonant inductor extend from the positioning partition, and the positioning partition is provided with glue filling holes corresponding to the plurality of mounting grooves one by one. The rectifier diodes are installed in a row on the left side wall of the secondary radiator, and a second thermally conductive insulating pad is provided between the rectifier diodes and the left side wall of the secondary radiator.

5. A high-power high-voltage power supply phase-shifted full-bridge LLC module according to claim 4, characterized in that: A fourth mounting boss extending to the left is provided at the lower end of the left half of the secondary radiator, a plurality of second fixing through holes are provided on the fourth mounting boss, a second insulating sheath is sleeved in each of the second fixing through holes, a fifth mounting boss extending toward the mounting groove is provided in the middle of the upper end of the left half of the secondary radiator, a second temperature sensor is installed on the fifth mounting boss, sixth mounting bosses are provided on the front and rear sides of the upper end of the left half of the secondary radiator, and the secondary radiator is fixedly connected to the PCB switch board through the plurality of sixth mounting bosses.

6. A high-power high-voltage power supply phase-shifted full-bridge LLC module according to claim 5, characterized in that: The thermally conductive insulation component includes an insulating partition plate and a third thermally conductive insulation pad. An embedding groove is provided on the right side wall of the insulating partition plate along its length direction. A plurality of window holes penetrating the bottom of the embedding groove are evenly spaced in the middle part of the insulating partition plate along its length direction. The third thermally conductive insulation pad is embedded in the embedding groove of the insulating partition plate. The end of the secondary side radiator is embedded in the window hole of the insulating partition plate and is connected to the heat dissipation vertical plate through the third thermally conductive insulation pad.

7. A high-power high-voltage power supply phase-shifted full-bridge LLC module according to claim 6, characterized in that: A first through hole is provided between two adjacent window holes on the insulating partition plate, a second through hole is provided on the third thermally conductive insulating pad that matches the majority of the first through holes one by one, a threaded hole that matches the first through holes one by one is provided on the right side wall of the secondary radiator, a connecting hole that matches the first through holes one by one is provided on the heat dissipation vertical plate, an insulating connector is provided in each of the connecting holes on the heat dissipation vertical plate, and the insulating connectors are fixed on the corresponding threaded holes of the secondary radiator after passing through the corresponding connecting holes, the second through holes and the first through holes from right to left in sequence.

8. A high-power high-voltage power supply phase-shifted full-bridge LLC module according to claim 7, characterized in that: The right end of the secondary radiator is provided with a plurality of heat dissipation bosses which match the window holes on the insulating partition plate one by one. The heat dissipation bosses are embedded in the window holes on the insulating partition plate one by one. The thickness of the heat dissipation bosses is the same as the depth of the window holes.

9. A high-power high-voltage power supply phase-shifted full-bridge LLC module according to claim 8, characterized in that: A positioning convex ring coaxial with the first through hole and extending to the left is provided on the left side wall of the insulating partition plate, and a positioning groove coaxially arranged with the threaded hole is provided on the secondary side heat sink, and the positioning convex ring is embedded in the positioning groove.

10. A high-power high-voltage power supply phase-shifted full-bridge LLC module according to claim 9, characterized in that: The secondary side heat sink is in the shape of a convex character with a small left side and a large right side. The inductor and the capacitor on the PCB switch board are arranged in the vacancies on both sides of the secondary side heat sink. The PCB switch board is also provided with a primary side process hole, a secondary side process hole, a first mounting hole and a second mounting hole, respectively. The primary side process hole is coaxial with the first fixed through hole, the secondary side process hole is coaxial with the second fixed through hole, the first mounting hole is opposite to the second mounting boss, and the second mounting hole is opposite to the fifth mounting boss.

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