Power conversion module

Abstract

The invention provides a power conversion module. The power conversion module comprises a magnetic component and a power device layer. The magnetic assembly comprises a main body layer, a magnetic core structure, a power device layer, a pin layer and an output capacitor layer. The main body layer comprises a first surface and a second surface which are opposite. The power device layer is arranged on the first surface. The power device layer comprises a power device, the pin layer comprises a first surface and a second surface which are opposite to each other, the magnetic component is arranged between the power device layer and the pin layer along the vertical direction, and the output capacitor layer is arranged between the magnetic component and the pin layer.

Description

Technical Field

[0001] The present invention relates to the technical field of power electronic equipment, and in particular to a power conversion module. Background Art

[0002] As an important component of power conversion, modern power electronic devices are widely used in power, electronics, motors and energy industries. Ensuring the long-term stable operation of power electronic devices and improving the power conversion efficiency of power electronic devices have always been important goals pursued by technicians in this field.

[0003] With the rapid development of technologies such as mobile communications and cloud computing, high-power DC / DC power conversion modules have also been widely used in communication products. Due to the high power and miniaturization of products, new challenges have been raised in terms of conversion efficiency and volume of power conversion modules. Therefore, how to design a reasonable structure and layout for the power conversion module, improve its conversion efficiency and reduce its volume is one of the hot issues in this technical field.

[0004] However, in the power conversion module, the volume and loss of the inductor core account for a large proportion, so how to reasonably design the structure of the inductor core and the power conversion module is particularly critical. In the known power conversion module, the magnetic core is, for example, buried between several layers of a multilayer printed circuit board to reduce the volume of the power conversion module. The magnetic core can use soft ferrite as the core material, and the shape of the core is mostly annular. However, because the saturation magnetization of soft ferrite is low, the saturation current of the magnetic component made of soft ferrite is low. Therefore, in order to further improve the output current capacity of the power conversion module, it is often necessary to select an iron powder core material with a larger saturation magnetization. If a magnetic component using an iron powder core material is selected and still adopts an annular design, the loss distribution in the iron powder core may be uneven due to the large difference between the inner and outer diameters of the core, which cannot meet the actual application requirements.

[0005] Therefore, how to develop a power conversion module to solve the problems faced by the prior art and achieve the purpose of optimizing the power conversion module is indeed a topic that needs to be addressed in the art. Summary of the invention

[0006] The object of the present invention is to provide a power conversion module. By optimizing the layout of various components and arranging the power device on the top of the power conversion module, the top surface of the power device, which is the main heat source, becomes the highest surface of the power conversion module, so as to facilitate the installation of a radiator, for example, and to force the power conversion module to dissipate heat.

[0007] Another object of the present invention is to provide a power conversion module. By arranging a magnetic core group and a conductor in the main layer to construct a magnetic component, the output end of the power device is directly electrically connected to the magnetic component, reducing the parasitic impedance on the output current transmission path, and effectively improving the power density of the power conversion module. Furthermore, when the magnetic core group of the magnetic component is adjacent to the power device, in the closed path of the magnetic lines of force, the magnetic core group can be buried in the main layer using a vertical layout, further reducing the parasitic parameters, improving the power density of the power conversion module, and realizing the transmission of various signals through the main layer, making its assembly and fixation simple and reliable, while reducing the volume of the power conversion module and improving the overall power density of the power conversion module.

[0008] Another object of the present invention is to provide a power conversion module set. In conjunction with the magnetic components of the main layer structure, the pins and input capacitors of the power conversion module can also be optimized according to needs, such as making the pins and the magnetic components coplanar or the input capacitors closer to the power devices, etc., so as to optimize the circuit, reduce the influence of parasitic parameters, and further achieve the purpose of reducing the volume of the power conversion module and improving the overall power density of the power conversion module.

[0009] To achieve the above-mentioned purpose, the present invention provides a power conversion module, including a magnetic component and a power device layer. The magnetic component includes a main body layer, a first magnetic core, a second magnetic core and a conductor. The main body layer includes a first surface and a second surface. The first surface and the second surface are two opposite surfaces. The first magnetic core is embedded in the main body layer and is adjacent to the first surface. The second magnetic core is embedded in the main body layer, adjacent to the second surface, and spatially relative to the first magnetic core, wherein the first magnetic core and the second magnetic core are connected to each other to form a magnetic core group, and have a plurality of magnetic columns. The conductor is embedded between the first surface and the second surface, and includes at least one winding, and at least part of the conductor is passed through the plurality of magnetic columns. The power device layer is arranged on the first surface of the main body layer, wherein the power device layer includes at least one power device, and at least one power device is electrically connected to the conductor.

[0010] The beneficial effect of the present invention is that an embodiment of the present invention provides a power conversion module. By optimizing the layout of each component and realizing that the power device is arranged on the top of the power conversion module, the top surface of the power device, which is the main heat source, becomes the highest surface of the power conversion module, so as to facilitate the installation of a heat sink, for example, and to force the power conversion module to dissipate heat. The magnetic component is constructed by placing a magnetic core group and a conductor in the main layer, and the output end of the power device is directly electrically connected to the magnetic component, which can effectively improve the power density of the power conversion module. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 The figure is a structural exploded view of a power conversion module according to a first preferred embodiment of the present invention.

[0012] Figure 2AThe figure is a three-dimensional structural diagram of a power conversion module according to a first preferred embodiment of the present invention.

[0013] Figure 2B The invention discloses a three-dimensional structure diagram of a power conversion module in another preferred embodiment of the present invention.

[0014] Figure 3 To disclose the circuit structure corresponding to the power conversion module of the present invention.

[0015] Figure 4A An example of the winding current direction of the power conversion module according to the first preferred embodiment of the present invention is disclosed.

[0016] Figure 4B Another exemplary embodiment of the winding current direction of the power conversion module of the first preferred embodiment of the present invention is disclosed.

[0017] Figure 5 The figure is an exploded view of the structure of the magnetic component according to the first preferred embodiment of the present invention.

[0018] Figure 6 The figure is a three-dimensional structural diagram of a magnetic component according to a first preferred embodiment of the present invention.

[0019] Figure 7 for Figure 5 Cross-sectional view of .

[0020] Fig. 8A To disclose an exemplary prefabricated structure of the electrical conductor of the present invention.

[0021] Figure 8B To disclose an exemplary structure of the conductor of the present invention.

[0022] Figure 8C Another exemplary structure of the conductor of the present invention is disclosed.

[0023] Fig. 9 The figure is a structural exploded view of a power conversion module according to a second preferred embodiment of the present invention.

[0024] Fig.10 A cross-sectional view of a power conversion module according to a second preferred embodiment of the present invention is disclosed.

[0025] Fig.11A An example of the winding current direction of the power conversion module according to the third preferred embodiment of the present invention is disclosed.

[0026] Fig. 11B Another example of the winding current direction of the power conversion module of the third preferred embodiment of the present invention is disclosed.

[0027] Cross-sectional view.

[0028] Fig.12The figure is a structural exploded view of a power conversion module according to a fourth preferred embodiment of the present invention.

[0029] Fig.13 The figure is a three-dimensional structural diagram of a power conversion module according to a fourth preferred embodiment of the present invention.

[0030] Fig.14 A three-dimensional structural diagram of a power conversion module according to a fourth preferred embodiment of the present invention is disclosed at another viewing angle.

[0031] Fig.15 The figure is an exploded view of the structure of the magnetic component according to the second preferred embodiment of the present invention.

[0032] Fig.16 The figure is a three-dimensional structural diagram of a magnetic component according to a second preferred embodiment of the present invention.

[0033] Fig.17 for Fig.15 Cross-sectional view of .

[0034] Fig.18 The figure is a structural exploded view of a power conversion module according to a fifth preferred embodiment of the present invention.

[0035] Fig.19 The figure is a three-dimensional structural diagram of a power conversion module according to a fifth preferred embodiment of the present invention.

[0036] Fig. 20 A three-dimensional structural diagram of a power conversion module according to a fifth preferred embodiment of the present invention is disclosed at another viewing angle.

[0037] Fig.21 The figure is a structural exploded view of a power conversion module according to a sixth preferred embodiment of the present invention.

[0038] Fig. 22 The figure is a three-dimensional structural diagram of a power conversion module according to a sixth preferred embodiment of the present invention.

[0039] Fig.23 A three-dimensional structural diagram of a power conversion module according to a sixth preferred embodiment of the present invention is disclosed at another viewing angle.

[0040] Fig.24 The figure is a structural exploded view of a power conversion module according to a seventh preferred embodiment of the present invention.

[0041] Fig.25 The figure is a three-dimensional structural diagram of a power conversion module according to the seventh preferred embodiment of the present invention.

[0042] Fig.26 A three-dimensional structural diagram of a power conversion module according to a seventh preferred embodiment of the present invention is disclosed at another viewing angle.

[0043] Fig.27A and Fig.27B The figure is a three-dimensional structural diagram of a power conversion module according to an eighth preferred embodiment of the present invention.

[0044] Fig.27C The figure is a three-dimensional structural diagram of a power conversion module according to a ninth preferred embodiment of the present invention.

[0045] The reference numerals are as follows:

[0046] 1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h: Power conversion module

[0047] 10: Main layer

[0048] 11: Side 1

[0049] 12: Side 2

[0050] 13: Groove

[0051] 14: First groove

[0052] 15: Second groove

[0053] 16: Holes

[0054] 20: Magnetic components

[0055] 20a, 20b: Magnetic components

[0056] 21: First core

[0057] 210: First joint surface

[0058] 22: Second core

[0059] 220: Second joint surface

[0060] 23, 23b: Conductor

[0061] 23a: Prefabricated Structures

[0062] 231a, 231b, 231c, 231d: winding

[0063] 24: Magnetic column

[0064] 241: First connection

[0065] 242: Second connection part

[0066] 243: Third connection

[0067] 244: Fourth connection

[0068] 245: Fifth connection

[0069] 241a: Power device connection surface

[0070] 242b: Output positive terminal connection surface

[0071] 243a, 243b: Input positive terminal connection surface

[0072] 244a, 244b: Input negative terminal connection surface

[0073] 245a, 245b: Signal control connection surface

[0074] 25a, 25b, 25c, 25d: Window

[0075] 26: Side wall plating

[0076] 30: Power device layer

[0077] 30a, 30b, 30c, 30d: Power devices

[0078] 31: First circuit board

[0079] 311: First surface

[0080] 312: Second surface

[0081] 32: Control components

[0082] 33: Storage tank

[0083] 341: Power device pins

[0084] 343: Input positive pin

[0085] 344: Input negative terminal pin

[0086] 345: Signal control pin

[0087] 40: Pin layer

[0088] 40a: Side 1

[0089] 40b: Side 2

[0090] 442: Output positive terminal pin

[0091] 443: Input positive pin

[0092] 444: Input negative terminal pin

[0093] 445: Signal control pin

[0094] 41: Second circuit board

[0095] 411: First Surface

[0096] 412: Second surface

[0097] 50: Input capacitor layer

[0098] 50a: Second input capacitor layer

[0099] 60: Output capacitor layer

[0100] Cin: input capacitance

[0101] Co: output capacitance

[0102] S1: Coplanar

[0103] Vin-: negative input terminal

[0104] Vin+: positive input terminal

[0105] Vo+: output positive terminal

[0106] SW: Power device pin DETAILED DESCRIPTION

[0107] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in various ways without departing from the scope of the present invention, and the description and drawings are essentially for illustrative purposes rather than for limiting the present invention.

[0108] Figure 1 The figure is a structural exploded view of a power conversion module according to a first preferred embodiment of the present invention. Figure 2A and Figure 2B The figure is a three-dimensional structural diagram of a power conversion module according to a first preferred embodiment of the present invention. Figure 3To disclose the circuit structure corresponding to the power conversion module of the present invention. In this example, the power conversion module 1 includes a magnetic component 20, a power device layer 30 and a pin layer 40. The magnetic component 20 includes a main layer 10, a first magnetic core 21, a second magnetic core 22 and a conductor 23. The main layer 10 includes a first surface 11 and a second surface 12. In this embodiment, the main layer 10 is, for example, a plate structure, and the first surface 11 and the second surface 12 are two opposite surfaces of the plate structure. The first magnetic core 21 and the second magnetic core 22 can be, for example, composed of an iron powder core material or a ferrite material. In this embodiment, the first magnetic core 21 is embedded in the main layer 10 and is adjacent to the first surface 11. The second magnetic core 22 is embedded in the main layer 10, adjacent to the second surface 12, and is spatially relative to the first magnetic core 21. In the present embodiment, the first magnetic core 21 and the second magnetic core 22 are, for example, an E-type magnetic core, respectively, and a magnetic core group is formed by connecting the first joint surface 210 of the first magnetic core 21 and the second joint surface 220 of the second magnetic core 22, and has a plurality of magnetic columns 24. The conductor 23 is embedded between the first surface 11 and the second surface 12 of the main body layer 10. The conductor 23 is also, for example, at least partially arranged around the side walls of the first magnetic core 21 and the second magnetic core 22. In addition, the conductor 23 also includes at least one winding 231a, 231b, which is at least partially passed through the plurality of magnetic columns 24. The magnetic core group composed of at least one winding 231a, 231b and the first magnetic core 21 and the second magnetic core 22 forms at least one inductor or a transformer. In the present embodiment, the first magnetic core 21 and the second magnetic core 22 are opposite to each other in space and interlock with each other to form a stable structural support. In this embodiment, the power device layer 30 and the pin layer 40 are opposite to each other in space, and can be combined with the main layer 10 to form a plate structure, or the power device layer 30, the main layer 10 and the pin layer 40 are three plate structures respectively, or the power device layer 30 and the main layer 10 are combined into a plate structure, or the main layer 10 and the pin layer 40 are combined into a plate structure, or the power device layer 30, the main layer 10 and the pin layer 40 are combined into a plate structure, and the present invention is not limited thereto. In this embodiment, the power device layer 30 is disposed on the first surface 11 of the main layer 10, and the pin layer 40 is disposed on the second surface 12 of the main layer 10.

[0109] In this embodiment, the power device layer 30 is, for example, a plate structure attached to the first surface 11, including power devices 30a, 30b, a control component 32 and a first circuit board 31. The first circuit board 31 includes a first surface 311 and a second surface 312 opposite to each other, wherein the second surface 312 of the first circuit board 31 faces the first surface 11 of the main layer 10. The power devices 30a, 30b and the control component 32 are arranged on the first surface 311 of the first circuit board 31. In this embodiment, each power device 30a or 30b is a half bridge arm. In another embodiment, a plurality of power devices can be connected in parallel to form a half bridge arm, and the half bridge arm and the input capacitor Cin (see Figure 3 ) are connected in parallel. In the present embodiment, the top surfaces of the power devices 30a, 30b also form a coplanar surface S1 of the power conversion module 1. Since the power loss of the power devices 30a, 30b accounts for the largest proportion of the total power loss of the power conversion module 1 and is the main source of heat, in the present embodiment, the top surfaces of the power devices 30a, 30b form a coplanar surface S1 of the power conversion module 1 and are located on the outermost top surface of the power conversion module 1, which is conducive to the heat dissipation device (not shown) being fitted and installed on the top surfaces of the power devices 30a, 30b of the power conversion module 1, effectively improving the heat dissipation efficiency of the power devices 30a, 30b. In other embodiments, at least one power device 30a, 30b may be disposed on the second surface 312 or embedded between the first surface 311 and the second surface 312. Of course, the present invention is not limited to this.

[0110] in addition, Figure 5 This is a structural exploded view of the magnetic assembly of the first preferred embodiment of the present invention. Figure 1 and Figure 5 In this embodiment, the first surface 11 of the power device layer of the magnetic component 20 also includes a power device connection surface 241a, an input positive terminal connection surface 243a, an input negative terminal connection surface 244a, and a signal control connection surface 245a, which are correspondingly connected to the output voltage connection surface 242b, the input positive terminal connection surface 243b, the input negative terminal connection surface 244b, and the signal control connection surface 245b on the second surface 312 of the first circuit board 31 of the power device layer 30, so as to realize the connection of the power device layer 30 to the pin layer 40 through the magnetic component 20. Figure 3The circuit structure of the power device connection surface 241a is connected to the power device pin SW representing the first power device 30a and the second power device 30b. The input positive terminal connection surfaces 243a and 243b represent the connection to the input positive terminal Vin+. The input negative terminal connection surfaces 244a and 244b represent the connection to the input positive terminal Vin-. The signal control connection surfaces 245a and 245b represent the connection of multiple control signals or sampling signals to the corresponding pins of the power device. In one embodiment, the power device layer 30 and the pin layer 40 can be electrically connected through the conductor 23 of the magnetic component 20 or other via structures (not shown), which will be described in detail later.

[0111] In this embodiment, the pin layer 40 is disposed adjacent to the second surface 12 of the main body layer 10 and is attached to a lower surface of the second magnetic core 22. The pin layer 40 includes a first surface 40a and a second surface 40b opposite to each other. The first surface 40a at least includes an output positive pin 442, an input positive pin 443, an input negative pin 444, and a signal control pin 445. The input positive pin 443 corresponds to Figure 3 The positive input terminal Vin+ and the negative input terminal pin 444 correspond to Figure 3 The negative input terminal Vin- and the positive output terminal pin 442 correspond to Figure 3The output positive terminal Vo+ in the power conversion module 1 provides an electrical connection for external input and output. The signal control pin 445 is used to transmit control signals and sampling signals. In this embodiment, the output positive terminal pin 442, the input positive terminal pin 443, the input negative terminal pin 444 and the signal control pin 445 are arranged on the first surface 40a of the pin layer 40, facing the second surface power device layer of the magnetic component 20. The output positive terminal pin 442, the input positive terminal pin 443, the input negative terminal pin 444 and the signal control pin 445 can be electrically connected to the external pins arranged on the second surface 40b through the wiring in the pin layer 40, for example. The multiple external pins can be realized by BGA, LGA or pads, but are not limited thereto. The power conversion module 1 is electrically connected to the system board (not shown) including the output capacitor Co through multiple external pins, and the layout and size of the corresponding external pins on the second surface 40b are not limited, and can be designed according to the actual needs of the system board. In another embodiment, the power conversion module 1 may not include the pin layer 40, and directly connects electrically with the system board through the output voltage connection surface 242b, the input positive terminal connection surface 243b, the input negative terminal connection surface 244b and the signal control connection surface 245b disposed on the second surface 312 of the magnetic component 20, so that the power conversion module 1 can also be electrically connected to the external input and output and transmit control signals and sampling signals, and the thickness of the power conversion module 1 is reduced. In other embodiments, the pin layer 40 is also disposed on a separate PCB board, so as to increase the size of the output positive terminal pin 442, the input positive terminal pin 443, the input negative terminal pin 444 and the signal control pin 445 and the corresponding external pin positions. Of course, the present invention is not limited to this.

[0112] In this embodiment, the power conversion module 1 further includes an input capacitor layer 50, which is connected across the input end of the power conversion module. In terms of structure, the input capacitor layer 50 is preferably arranged close to the power devices 30a and 30b. In this embodiment, the input capacitor layer 50 is, for example, arranged on the second surface 312 of the first circuit board 31, or between the power device layer 30 and the main body layer 10. Preferably, the first circuit board 31 and the main body layer 10 also include, for example, a receiving groove 13, which is recessed inward from the second surface 312, and the input capacitor layer 50 is at least partially accommodated in the receiving groove 13. In one embodiment, the input capacitor layer 50 can be, for example, the same layer as the power device layer 30, so that the power devices 30a and 30b are close to the input capacitor. In other embodiments, corresponding to the positions of the power devices 30a and 30b, the input capacitor layer 50 is also, for example, arranged on the first surface 311 of the first circuit board 31, on the second surface 312, or embedded between the first surface 311 and the second surface 312, and the present invention is not limited thereto. It should be noted that, during the switching process of the power devices 30a and 30b, the parasitic parameters between the input capacitor Cin of the input capacitor layer 50 and the power devices 30a and 30b and the equivalent parameters of the power devices will generate high-frequency parasitic oscillations, affecting the switching process and loss of the power devices 30a and 30b. Therefore, the present invention adopts a design in which the input capacitor layer 50 is close to the power devices 30a and 30b, which helps to reduce the influence of parasitic parameters and further achieves the purpose of reducing the volume of the power conversion module and improving the overall power density of the power conversion module.

[0113] Figure 4A An example of the winding current direction of the power conversion module according to the first preferred embodiment of the present invention is disclosed. Figure 4B To disclose another example of the winding current direction of the power conversion module of the first preferred embodiment of the present invention. In this embodiment, the first magnetic core 21 and the second magnetic core 22 are respectively an E-type magnetic core, and are connected to each other to form a magnetic core group with three magnetic columns 24. The magnetic core group composed of the first magnetic core 21 and the second magnetic core 22 includes two windows 25a and 25b, which are respectively arranged relative to the two power devices 30a and 30b in space, that is, the window 25a is arranged adjacent to the power device 30a, and the window 25b is arranged adjacent to the power device 30b. The windings 231a and 231b pass through the two windows 25a and 25b respectively. It is worth noting that in one example, the current direction of at least one winding 231a, 231b in the two windows 25a and 25b may be the same, such as Figure 4A As shown. The DC magnetic flux cancels out, the AC magnetic flux superimposes, and the two output inductors can work independently, so that the power conversion module 1 forms two DCDC power converters that can work in time sharing. In another exemplary embodiment, the current direction of at least one winding 231a, 231b in the two windows 25a, 25b can be opposite, such as Figure 4BAs shown in the figure, the DC magnetic flux is superimposed and the AC magnetic flux is subtracted. The advantage is that the current ripple is greatly suppressed and the equivalent inductance is greatly increased.

[0114] In this embodiment, due to the height limitation of the power conversion module 1, the first magnetic core 21 and the second magnetic core 22 are, for example, E-type magnetic cores, and the thickness of the magnetic column in the direction of the center line of the magnetic column is relatively thin, so that in the closed path of the magnetic line of force, the difference between the inner and outer diameters of the E-type magnetic core is effectively reduced, so that even if the first magnetic core 21 and the second magnetic core 22 are composed of iron powder materials with low magnetic permeability and high magnetic resistance, a relatively uniform distribution of magnetic lines of force and the benefits of low core loss can be obtained. In addition, the windings penetrating the E-type magnetic core group window are arranged horizontally, and the E-type magnetic core group is equipped with horizontal windings. Compared with the ring-type magnetic core group equipped with vertical windings, the size of the ring-type magnetic core will increase the ring cross-sectional area when horizontally extended, resulting in uneven distribution of magnetic lines of force in the inner and outer diameters, and it is impossible to effectively increase the ring cross-sectional area to achieve the purpose of reducing the core loss. The E-type magnetic core can be horizontally extended in a direction perpendicular to the center line of the magnetic column without increasing the thickness of the magnetic column in the direction of the center line of the magnetic column, so as to achieve the purpose of reducing the core loss by increasing the cross-sectional area. Therefore, the first magnetic core 21 and the second magnetic core 22 can effectively increase the cross-sectional area of ​​the magnetic column or the magnetic substrate, thereby achieving the effect of reducing the magnetic core loss.

[0115] On the other hand, in the aforementioned power conversion module 1, the structure of the magnetic component 20 proposed by the present invention is also as follows: Figures 5 to 8A and Figure 8B shown. Figure 5 The figure is an exploded view of the structure of the magnetic component according to the first preferred embodiment of the present invention. Figure 6 The figure is a three-dimensional structural diagram of a magnetic component according to a first preferred embodiment of the present invention. Figure 7 for Figure 5 Cross-sectional view of . Fig. 8A To disclose an exemplary prefabricated structure of the electrical conductor of the present invention. Figure 8B To disclose an exemplary structure of the conductor of the present invention. Figure 1 , Figures 5 to 7 , Fig. 8A and Figure 8B. In this embodiment, the magnetic component 20 has a structure including a main body layer 10, a first magnetic core 21, a second magnetic core 22 and a conductor 23. The main body layer 10 includes a first surface 11, a second surface 12, a first groove 14, a second groove 15 and at least one hole 16. The first surface 11 and the second surface 12 are two opposite surfaces, the first groove 14 is recessed inward from the first surface 11, the second groove 15 is recessed inward from the second surface 12, and the first groove 14 and the second groove 15 are connected through at least one hole 16. The first magnetic core 21 is accommodated in the first groove 14. The second magnetic core 22 is accommodated in the second groove 15, and is spatially relative to the first magnetic core 21, wherein the first joint surface 210 of the first magnetic core 21 and the second joint surface 220 of the second magnetic core 22 are connected to each other to form a magnetic core group, and at least one magnetic column 24 is formed through at least one hole 16. In this embodiment, the conductor 23 may be, for example, composed of at least one copper layer or at least one copper block, and pre-embedded in the main body layer 10. In this embodiment, a prefabricated structure 23a, for example, composed of a copper block, is first embedded in a circuit board structure, and then the conductor 23a is embedded in the circuit board structure by a process such as controlled depth milling. Fig. 8A The prefabricated structure 23a shown is formed by a milling cutter. Figure 8B The structure of the conductor 23 shown in FIG. 1 is shown. In this embodiment, the conductor 23 is pre-embedded in the main body layer 10, and includes at least one winding 231a, 231b, a first connecting portion 241, a second connecting portion 242, a third connecting portion 243, and a fourth connecting portion 244. The first connecting portion 241, the second connecting portion 242, the third connecting portion 243, and the fourth connecting portion 244 are embedded in the wall surface of the main body layer 10 and are located between the first surface 11 and the second surface 12. In this embodiment, the first connecting portion 241 and the second connecting portion 242 are also respectively embedded in two opposite wall surfaces of the main body layer 10. At least one winding 231a, 231b is connected across the first connecting portion 241 and the second connecting portion 242. The third connection portion 243 and the fourth connection portion 244 are embedded in the side wall adjacent to the second connection portion 242, and the fourth connection portion 244 is located between the second connection portion 242 and the third connection portion 243; in another embodiment, the third connection portion 243 can also be located between the second connection portion 242 and the fourth connection portion 244. In this embodiment, the first end surface of the first connection portion 241 is at least partially exposed to the first surface 11, for example, forming a power device connection surface 241a in the power conversion module 1, so as to achieve Figure 3 The second end surface of the first connection portion 241 can be selectively exposed on the second surface 12, which is not limited here. The second end surface of the second connection portion 242 is at least partially exposed on the second surface 12, for example, forming the output positive terminal connection surface 242b in the power conversion module 1, connected to the output positive terminal pin 442 of the pin layer 40, so as to achieve Figure 3The first end surface of the second connection portion 242 can be selectively exposed on the first surface 11, which is not limited here. The first end surface of the third connection portion 243 is at least partially exposed on the first surface 11, for example, forming the input negative terminal connection surface 243a in the power conversion module 1, and its second end surface is at least partially exposed on the second surface 12, forming the input negative terminal connection surface 243b in the power conversion module 1, which is used to connect to the input negative terminal pin 443 of the pin layer 40, so as to achieve Figure 3 In addition, the first end surface of the fourth connection 244 is at least partially exposed on the first surface 11, for example, forming an input positive terminal connection surface 244a in the power conversion module 1, and the second end surface thereof is at least partially exposed on the second surface 12, forming an input positive terminal connection surface 244b in the power conversion module 1, for connecting to the input positive terminal pin 444 of the pin layer 40.

[0116] Meanwhile, the magnetic component 20 in this embodiment further includes a fifth connection portion 245, which can be formed by a copper block pre-buried in the main layer 10, or by a via hole in the plate structure. Figure 1 As shown in , the fifth connection portion 245 is arranged on the same side of the main body layer where the first connection portion 241 is located, and is formed by a plurality of vias arranged in the main body layer 10. The first end of the fifth connection portion 245 is at least partially exposed to the first surface 11, for example, forming a signal control connection surface 245a in the power conversion module 1, and the second end thereof is at least partially exposed to the second surface 12, forming a signal control connection surface 245b in the power conversion module 1, which is used to connect to the signal control pin 445 of the pin layer 40, to achieve the signal connection between the power switch layer and the pin layer of the power conversion module 1, or to achieve the electrical connection of the control signal or sampling signal between at least one power device in the power conversion module 1 and the system board. In another embodiment, the fifth connection portion 245 can also be arranged on the same side of the main body layer where the second connection portion 242 is located, and can be designed according to actual needs.

[0117] In this embodiment, in addition to realizing the connection of the input negative terminal Vin- (i.e., the ground terminal GND of the power conversion module), the fourth connection portion 244 is also, for example, a vertical copper block structure as a GND conductor, connected to the GND network of the power device layer 30 upwards, and connected to the GND pin of the pin layer 40 downwards. Since the power device layer 30 of the present invention and the input capacitor layer 50 and the pin layer 40 are separated by the E-type output inductor of the magnetic component 20, the distance between the input capacitor layer 50 and the pin layer 40 is long, the loop is large, and the parasitic inductance of the loop is large. The design of the GND conductor helps to reduce the parasitic inductance between the input capacitor layer 50 and the pin layer 40, thereby greatly reducing the risk of resonance between the parasitic inductance and the capacitance of the input capacitor layer 50.

[0118] In this embodiment, the main body layer 10 and the conductor 23 of the magnetic component 20 can be integrated into an integral structure through a molding process. The main body layer 10 can be made of, for example, epoxy resin molding material or printed circuit board material, but the present invention is not limited thereto.

[0119] Figure 8C Another exemplary structure of the conductor of the present invention is disclosed. In this embodiment, the conductor 23b and Figure 8B The conductors 23 shown are similar, and the same reference numerals represent the same components, structures and functions, which will not be described in detail. Figure 1 , Figures 5 to 7 and Figure 8C In this embodiment, the conductor 23b includes at least one winding 231a, 231b, a first connection portion 241, a second connection portion 242, and a third connection portion 243. At least one winding 231a, 231b is connected across the first connection portion 241 and the second connection portion 242, and also forms a bent copper block structure, wherein the horizontal copper block portion is at least one winding 231a, 231b passing through the window formed by the first magnetic core 21 and the second magnetic core 22, and the first connection portion 241 is bent upward, for example, and its first end surface is at least partially exposed to the first surface 11, forming a power device connection surface 241a in the power conversion module 1, so as to achieve Figure 3 The second connection portion 242 is bent downward and its second end surface is at least partially exposed on the second surface 12, forming an output positive terminal connection surface 242b in the power conversion module 1, which is used to electrically connect the output positive terminal pin 442 of the pin layer 40 to achieve Figure 3 The first end surface of the third connection portion 243 is at least partially exposed on the first surface 11, for example, forming an input positive terminal connection surface 243a in the power conversion module 1, and its second end surface is exposed on the second surface 12, forming an input positive terminal connection surface 243b, which is electrically connected to the input positive terminal pin 443 of the pin layer 40, so as to realize Figure 3The connection of the positive input terminal Vin+. In the present embodiment, at least one winding 231a, 231b, the first connection part 241, the second connection part 242 and the third connection part 243 can be, for example, a prefabricated structure and then bonded together using PCB materials or plastic packaging materials, and then a first groove 14 is formed using, for example, a milling cutter to accommodate the first magnetic core, a second groove 15 is formed using a milling cutter to accommodate the second magnetic core 22, and at least one hole 16 is formed using a milling cutter for the magnetic column 24 to pass through, and at the same time, the integrated conductive structure is milled to form the windings and various connection parts of the conductor 23b. In the present embodiment, the side wall of the position where the magnetic column 24 passes through will expose the conductor 23b. The side wall exposing the conductor 23b can effectively increase the cross-sectional area of ​​the conductor 23b without increasing the volume of the power conversion module 1, further reduce the DC resistance of the conductor 23b, and reduce the loss.

[0120] Similarly, in this embodiment, in addition to realizing the connection of the input positive terminal Vin+, the third connection portion 243 is also, for example, a vertical copper block structure as a Vin+ conductor, whose first end is connected to the Vin+ network of the power device layer 30, and whose second end is connected to the input positive terminal pin 443 of the pin layer 40. In one embodiment, the magnetic component 20 may, for example, include two input negative terminal conductors (not shown) formed by vias, which are disposed on both sides of the input positive terminal conductor. The first end of the input negative terminal conductor is connected to the input negative terminal pin 344 of the power device layer 30 on the first circuit board 31, and the second end is connected to the input negative terminal pin 444 of the pin layer 40. Since the power device layer 30 and the input capacitor layer 50 and the pin layer 40 are separated by the E-type output inductor of the magnetic component 20, the distance between the input capacitor layer 50 and the pin layer 40 is long, the loop is large, and the loop parasitic inductance is large. There is a high risk of resonance between the parasitic inductance and the capacitance of the input capacitor layer 50 disposed on the second surface 312 of the first circuit board 31. In this embodiment, the two input negative-end conductors are disposed on both sides of the input positive-end conductor, so that the parasitic inductance between the input capacitor Cin and the pin layer 40 is reduced, thereby greatly reducing the risk of resonance between the parasitic inductance and the input capacitor. In some implementations, the input negative-end conductor formed by the via can also be replaced by an input negative-end conductor of a vertical copper block. The layout structure in which the input negative-end conductor is distributed on both sides of the input positive-end conductor is also suitable for the design in which the output inductor is formed by a toroidal magnetic core and a vertical winding between the input capacitor layer 50 and the pin layer 40. In other embodiments, in addition to the layout structure in which the input positive end conductor is distributed on both sides of the input negative end conductor, the third connection portion 243 in the previous embodiment can also be replaced by the fourth connection portion 244, and the first connection portion 241, the second connection portion 242 and the fourth connection portion 244 can be, for example, a prefabricated structure and then bonded together using PCB materials or plastic packaging materials, and then the winding and each connection portion of the conductor 23b are formed using, for example, a milling cutter. The difference from the previous embodiment is that the fourth connection portion 244 realizes the connection of the input negative end Vin-, and its first end is connected to the Vin- network of the power device layer 30, and its second end is connected to the input negative end pin 444 of the pin layer 40. In one embodiment, the magnetic component 20 can, for example, include two input positive end conductors (not shown) formed by vias, which are arranged on both sides of the input negative end conductor. The first end of the input positive end conductor is connected to the input positive end pin 343 of the power device layer 30 on the first circuit board 31, and the second end is connected to the input positive end pin 443 of the pin layer 40. The layout structure in which the input positive terminal conductor is distributed on both sides of the input negative terminal conductor has the same effect of reducing the parasitic inductance between the input capacitor layer 50 and the pin layer 40 .

[0121] refer to Figures 1 to 3 as well as Figures 5 to 7. It is worth noting that in order to effectively improve the power density of the power conversion module 1, the present invention adopts a multi-layer printed circuit board embedded with, for example, an E-type magnetic core group and a conductor 23 to form a magnetic component 20. The output ends of the power devices 30a and 30b can be directly electrically connected to the magnetic component 20. In this embodiment, the magnetic core group consisting of the E-type first magnetic core 21 and the second magnetic core 22 is adjacent to the power devices 30a and 30b, which can effectively reduce the influence of parasitic parameters. In addition, in the closed path of the magnetic lines of force, a magnetic core shape with a small thickness of the magnetic substrate and a narrow width of the magnetic core center column and the magnetic core side column along the direction of the magnetic column center point connection line can be selected to effectively reduce the inner and outer diameter difference between the E-type first magnetic core 21 and the second magnetic core 22, so that the magnetic core group can be buried in the main layer 10 in a vertical layout, further improving the power density of the power conversion module 1, and realizing the transmission of various signals through the main layer 10, making it simple and reliable to assemble and fix, while reducing the volume of the power conversion module 1 and improving the overall power density of the power conversion module 1.

[0122] Fig. 9 The figure is a structural exploded view of a power conversion module according to a second preferred embodiment of the present invention. Fig.10 FIG. 2 is a cross-sectional view of a power conversion module according to a second preferred embodiment of the present invention. In this embodiment, the power conversion module 1a and Figures 1 to 3 as well as Figure 4A and Figure 4B The power conversion module 1 shown is similar, and the same reference numerals represent the same components, structures and functions, which will not be repeated here. In this embodiment, the power conversion module 1a, for example, has only one power device 30a. And unlike the first preferred embodiment in which the first magnetic core 21 and the second magnetic core 22 are an E-type magnetic core, in this embodiment, the first magnetic core 21 and the second magnetic core 22 are respectively a U-type magnetic core, and the magnetic core group formed by the connection of the first magnetic core 21 and the second magnetic core 22 has a window 25a in addition to the magnetic column 24. The window 25a is spatially relative to the power device 30a, that is, the projection of the power device 30a on the surface where the window 25a is located at least partially overlaps with the window 25a. At least one winding 231a passes through the window 25a to form the required magnetic component 20. Therefore, the magnetic core group can be buried in the main layer 10 in a vertical layout, further improving the power density of the power conversion module 1a, and can realize the transmission of various signals through the main layer 10, making its assembly and fixation simple and reliable, while reducing the volume of the power conversion module 1a and improving the overall power density of the power conversion module 1a.

[0123] in addition, Fig.11A An example of the winding current direction of the power conversion module according to the third preferred embodiment of the present invention is disclosed. Fig. 11B Another example of the current direction of the winding of the power conversion module of the third preferred embodiment of the present invention is disclosed. In this embodiment, the power conversion module 1b and Fig. 9 as well as Fig.10 The power conversion module 1a shown is similar, and the same reference numerals represent the same components, structures and functions, which will not be repeated here. In this embodiment, the first magnetic core 21 and the second magnetic core 22 are respectively an I-type magnetic core, and the first magnetic core 21 and the second magnetic core 22 are further connected by a plurality of magnetic columns 24 to form a magnetic core group, and form four windows 25a, 25b, 25c, 25d. In this embodiment, the four windows 25a, 25b, 25c, 25d are spatially relative to the four power devices 30a, 30b, 30c, 30d of the power conversion module, that is, the projections of the four power devices 30a, 30b, 30c, 30d on the surfaces where the four windows 25a, 25b, 25c, 25d are located at least partially overlapped with the four windows 25a, 25b, 25c, 25d. The current direction of at least one winding 231a, 231b, 231c, 231c in the four windows 25a, 25b, 25c, 25d can be staggered in positive and negative directions, such as Fig.11A In another example, the current directions of at least one winding 231a, 231b, 231c, 231d in the four windows 25a, 25b, 25c, 25d may be completely the same, such as Fig. 11B In other words, the four power devices 30a, 30b, 30c, 30d can be, for example, N power devices, and the current direction of at least one winding 231a, 231b, 231c, 231c in the N windows can be modulated according to actual application requirements to make them completely the same or staggered in positive and negative directions, respectively, relative to the N windows represented by the four windows 25a, 25b, 25c, 25d in space. Wherein N is an integer and is not less than 2. However, the present invention is not limited to this and will not be repeated.

[0124] Fig.12 The figure is a structural exploded view of a power conversion module according to a fourth preferred embodiment of the present invention. Fig.13 and Fig.14 FIG. 1 is a three-dimensional structural diagram of a power conversion module according to a fourth preferred embodiment of the present invention. In this embodiment, the power conversion module 1c and Figures 1 to 3 as well as Figure 4A and Figure 4BThe power conversion module 1 shown is similar, and the same reference numerals represent the same components, structures and functions, which will not be repeated here. In this embodiment, the power conversion module 1c also includes at least one side wall plating 26, which is arranged along the side wall of the magnetic component 20, extending from the first surface 11 of the main layer 10 to the second surface 12, so as to achieve the connection between the power device layer 30 adjacent to the first surface 11 and the pin layer 40 adjacent to the second surface 12 through the at least one side wall plating 26, for example, to provide the transmission of various signals, and further improve the power density of the power conversion module 1c. In other embodiments, the side wall plating 26 can be integrally formed with the windings 231a, 231b and then embedded in a circuit board, and formed by controlled depth milling and other processes, and can also, for example, extend along the side wall of the power device layer 30, through the side wall of the main layer 10 of the magnetic component 20a, to the side wall of the pin layer 40, so as to achieve the connection between a top line and a bottom line of the power conversion module 1c through the at least one side wall plating 26. In one embodiment, at least one sidewall electroplating 26 transmits a pulse width modulation signal, for example, to drive the half-bridge arms of the power devices 30a and 30b on the first circuit board 31, or transmits a current sensing signal, for example, to reflect the current magnitude of the half-bridge arms of the power devices 30a and 30b. The present invention is not limited thereto.

[0125] In addition, the detailed structure of the magnetic component 20a of the power conversion module 1c is also disclosed in Figures 15 to 17 .in Fig.15 The figure is an exploded view of the structure of the magnetic component according to the second preferred embodiment of the present invention. Fig.16 The figure is a three-dimensional structural diagram of a magnetic component according to a second preferred embodiment of the present invention. Fig.17 for Fig.15 In this embodiment, the magnetic component 20a and Figures 5 to 7 The magnetic component 20 shown is similar, and the same reference numerals represent the same components, structures and functions, which will not be repeated here. In this embodiment, the magnetic component 20a also includes at least one side wall plating 26, extending between the first surface 11 and the second surface 12 along the side wall of the main layer 10, so as to achieve the connection between the first surface 11 and the second surface 12 through the at least one side wall plating 26. The conductor 23 can also be formed in the main layer 10 by pre-embedding, and includes at least one winding 231a, 231b, a first connecting portion 241, a second connecting portion 242, a third connecting portion 243 and a fourth connecting portion 244 (see Figure 8B ). The conductor 23 is connected with the first magnetic core 21 and the second magnetic core 22 to form a magnetic core group to form at least one transformer or inductor. In this embodiment, the first end surface of the first connecting portion 241 is at least partially exposed to the first surface 11, for example, forming a power device connection surface 241a in the power conversion module 1c, so as to achieve Figure 3The second end surface of the second connection portion 242 is at least partially exposed to the first surface 12, for example, forming the output positive end connection surface 242b in the power conversion module 1c, so as to realize Figure 3 The first end surface of the third connection portion 243 is at least partially exposed on the first surface 11, for example, forming an input positive terminal connection surface 243a in the power conversion module 1c, and the second end surface is at least partially exposed on the second surface 12, forming an input positive terminal connection surface 243b, connected to the input positive terminal pin 443 of the pin layer 40, to achieve Figure 3 The connection of the input positive terminal Vin+. In addition, the first end surface of the fourth connection portion 244 is at least partially exposed to the first surface 11, for example, forming the input negative terminal connection surface 244a in the power conversion module 1c, and the second end surface is at least partially exposed to the second surface 12, forming the input negative terminal connection surface 244b, connected to the input negative terminal pin 444 of the pin layer 40. It should be noted that at least one winding 231a, 231b, the first connection portion 241, the second connection portion 242, the third connection portion 243 and the fourth connection portion 244 of the conductor 23 are composed of, for example, a copper layer or a copper block, which can be used as the main current connection in the power conversion module 1c. In this embodiment, the side wall plating 26 is formed by, for example, a copper-plated half hole, which can be used as a connection for control signals and detection signals in the power conversion module 1c. Of course, the present invention is not limited to this. Since the first magnetic core 21 and the second magnetic core 22 of the magnetic component 20a occupy a large area on the first surface 11 and the second surface 12 of the main layer 10, respectively, in addition to the conductor 23, the transmission of various signals between the first surface 11 and the second surface 12 is realized through the side wall plating 26, which is more helpful to increase the flexibility of the circuit design on the power conversion module 1c and is conducive to reducing the volume of the power conversion module 1c. However, the present invention is not limited to this and will not be repeated.

[0126] Fig.18 The figure is a structural exploded view of a power conversion module according to a fifth preferred embodiment of the present invention. Fig.18 The power conversion module is inverted in the vertical direction. Fig.19 and Fig. 20 FIG. 1 is a three-dimensional structural diagram of a power conversion module according to a fifth preferred embodiment of the present invention. In this embodiment, the power conversion module 1d and Figure 12 to Figure 14The power conversion module 1c shown is similar, and the same reference numerals represent the same components, structures and functions, which will not be repeated here. In this embodiment, the first circuit board 31 of the power device layer 30 is adjacent to the first surface 11 of the main body layer 10. At least one power device 30a, 30b and the control component 32 are arranged on the first surface 311 of the first circuit board 31. The pin layer 40 is, for example, a connection surface formed on the second surface 312 of the main body layer 10, and at least includes an output positive terminal connection surface 242b, an input positive terminal connection surface 243b, an input negative terminal connection surface 244b and a signal control connection surface 245b. The output positive terminal connection surface 242b, the input positive terminal connection surface 243b, the input negative terminal connection surface 244b and the signal control connection surface 245b form a coplanar surface with the lower surface of the second magnetic core 22 on the second surface 12, or the second magnetic core 22 is lower than the second surface 12. A plurality of output positive terminal connection surfaces 242b, input positive terminal connection surfaces 243b, input negative terminal connection surfaces 244b and signal control connection surfaces 245b can be used as external pins of the power conversion module to be directly electrically connected to the system board. In the present embodiment, the second end of the signal control connection portion of the power conversion module 1d is, for example, disposed on the second surface 12 of the main body layer 10 to form a signal control connection surface 245b, which can be electrically connected to the first circuit board 31 by, for example, sidewall electroplating 26. Of course, the present invention is not limited thereto. In addition, in the present embodiment, the power conversion module 1d further includes a second input capacitor layer 50a, for example, disposed on the first surface 311 of the first circuit board 31 in a coplanar manner with at least one power device 30a, 30b and the control component 32. Thus, the power device layer 30 and the second input capacitor layer 50a are both structured on the first circuit board 31, which can be regarded as a same-layer structure, and the power density of the power conversion module 1d can be further improved. Of course, the present invention is not limited thereto.

[0127] Fig.21 The figure is a structural exploded view of a power conversion module according to a sixth preferred embodiment of the present invention. Fig.21 The power conversion module is inverted in the vertical direction. Fig. 22 and Fig.23 FIG. 1 is a three-dimensional structural diagram of a power conversion module according to a sixth preferred embodiment of the present invention. In this embodiment, the power conversion module 1e and Figure 12 to Figure 14The power conversion module 1c shown is similar, and the same reference numerals represent the same components, structures and functions, which will not be repeated here. In this embodiment, the power device layer 30 and the pin layer 40 are respectively arranged on the first surface 11 and the second surface 12 of the main layer 10. In this embodiment, the power device layer 30 is, for example, a plate structure attached to the first surface 11, including at least one power device 30a, 30b, a control component 32 and a first circuit board 31. The power devices 30a, 30b and the control component 32 are arranged on the first surface 311 of the first circuit board 31. The first circuit board 31 also includes a receiving groove 33. The receiving groove 33 is recessed inward from the second surface 312, and the input capacitor layer 50 is at least partially accommodated in the receiving groove 33, so as to further improve the power density of the power conversion module 1e. Of course, the present invention is not limited to this.

[0128] Fig.24 The figure is a structural exploded view of a power conversion module according to a seventh preferred embodiment of the present invention. Fig.25 and Fig.26 FIG. 1 is a three-dimensional structural diagram of a power conversion module according to a seventh preferred embodiment of the present invention. In this embodiment, the power conversion module 1f and Figures 1 to 3 as well as Figure 4A and Figure 4B The power conversion module 1 shown is similar, and the same reference numerals represent the same components, structures and functions, which will not be repeated here. In this embodiment, the pin layer 40 is, for example, a plate structure, including a second circuit board 41 and an output positive terminal pin 442, an input positive terminal pin 443, an input negative terminal pin 444 and a signal control pin 445 arranged on the first surface 411 of the second circuit board. The second circuit board 41 has a first surface 411 and a second surface 412, which are two opposite surfaces to each other. The first surface 411 faces the second surface 12 of the main body layer 10. The power conversion module 1f also includes an input capacitor layer 50 and an output capacitor layer 60. In this embodiment, the second surface 312 of the first circuit board forms a recessed portion (not shown), which is recessed from the second surface 312 of the first circuit board to the first surface 311 of the first circuit board to accommodate the input capacitor layer 50, so that the input capacitor layer 50 is arranged close to the power devices 30a and 30b. After the second magnetic core 22 is buried in the main body layer 10, the surface of the second magnetic core 22 is lower than the second surface 12 of the main body layer 10, forming a recessed portion (not shown), and the output capacitor layer 60 can be fixedly electrically connected to the first surface 411 of the second circuit board 41 and accommodated in the recessed portion. In another embodiment, the first surface 411 of the second circuit board 41 is recessed toward the second surface 412 of the second circuit board 41 to form a receiving groove for accommodating the output capacitor layer 60, so that the output capacitor layer 60 is disposed between the second magnetic core 22 and the second circuit board 41.

[0129] In addition, in this embodiment, the pin layer 40 includes at least two input negative pins 444 disposed on both sides of an input positive pin 433. In addition, the magnetic component 20b also forms at least two input negative connection surfaces 244a disposed on both sides of an input positive connection surface 243a on the first surface 11 of the main layer 10. It should be noted that in this embodiment, the structure of the conductor 23b of the magnetic component 20b can be, for example, Figure 8C As shown. The third connecting portion 243 realizes the electrical connection of the input positive terminal pin 443 with a vertical copper block structure. In this embodiment, the magnetic component 20b may, for example, include two input negative terminal conductors (not shown) formed by vias to realize the connection between the input negative terminal pin 444 and the input negative terminal connection surface 244b. In this embodiment, since the input capacitor layer 50 and the pin layer 40 are separated by the magnetic component 20b, the distance between the input capacitor layer 50 and the pin layer 40 is long, the loop is large, and the parasitic inductance of the loop is large. The risk of resonance between the parasitic inductance and the input capacitor arranged on the second surface 312 of the first circuit board 31 is high. In this embodiment, by placing the two input negative terminal conductors on both sides of the input positive terminal conductor, the parasitic inductance between the input capacitor layer 50 and the pin layer 40 is reduced, thereby greatly reducing the risk of resonance between the parasitic inductance and the input capacitor. In other embodiments, the layout structure in which the input positive terminal conductor is distributed on both sides of the input negative terminal conductor has the same effect of reducing the parasitic inductance between the input capacitor layer 50 and the pin layer 40. It will not be described in detail here.

[0130] like Fig.27A and Fig.27B The third embodiment of the present invention discloses a three-dimensional structure diagram of a power conversion module 1g according to an eighth preferred embodiment of the present invention. In this embodiment, the power device layer 30, the main body layer 10 and the pin layer 40 are combined into a plate structure. The structure decomposition diagram after cross-cutting along the side wall of the power conversion module 1g can be shown as follows: Figure 1 , Figure 4A to Figure 12 , Figure 15 to Figure 17 , Fig.21 and Fig.24 The technical features and implementation methods disclosed in the first, second, third, fourth, sixth and seventh preferred embodiments shown in the figure, wherein the fifth connection portion can be realized by a guide hole in the board structure, or by side wall electroplating shown in the power conversion module 1g, thereby electrically connecting a top circuit and a bottom circuit of the power conversion module 1g.

[0131] The three-dimensional structure diagram of the power conversion module 1h of the ninth preferred embodiment of the present invention is as follows Fig.27C Refer to Fig.27A As shown, in this embodiment, the power conversion module 1h does not include the pin layer 40, and its power device layer 30 and the main body layer 10 are combined into a plate structure. The structural decomposition diagram after cross-cutting along the side wall of the power conversion module 1g can be referred to as shown in FIG. Fig.18 As shown, Fig.18 The difference is that the magnetic core 22 is entirely embedded in the plate-like structure, and the external pin surface is formed by the second end surfaces 242b, 243b, 244b and 245b of the second, third, fourth and fifth connection parts. In addition, the features of the power device layer 30 and the main body layer 10 in this embodiment refer to the technical features and implementation methods of the first to seventh preferred embodiments, and the fifth connection part can be realized by the guide hole in the plate structure, or by the side wall electroplating of the power conversion module, but it is not limited thereto.

[0132] From the above descriptions, it can be seen that the power conversion module 1 of the present invention can be widely varied according to actual application requirements. For a typical two-phase buck parallel circuit, for different applications, the power conversion module 1 of the present invention can have similar Figure 3 The circuit shown is deformed. This can be achieved by slightly deforming the structure of the power module of the present invention and the design of the circuit pattern. The present invention is not limited to this.

[0133] In summary, an embodiment of the present invention provides a power conversion module and a magnetic component thereof. By optimizing the layout of each component and realizing that the power device is arranged on the top of the power conversion module, the top surface of the power device, which is the main heat source, becomes the highest surface of the power conversion module, so as to facilitate the installation of a heat sink, for example, and to force the power conversion module to dissipate heat. The magnetic component is constructed by placing a magnetic core group and a conductor in the main layer, and the output end of the power device is directly electrically connected to the magnetic component, which can effectively improve the power density of the power conversion module. Furthermore, the power device is adjacent to the magnetic core group of the magnetic component, which can also effectively reduce parasitic parameters. When the magnetic core group of the magnetic component is adjacent to the power device, in the closed path of the magnetic lines of force, the magnetic component can be buried in the main layer using a vertical layout, further improving the power density of the power conversion module, and realizing the transmission of various signals through the main layer, so that its assembly and fixation are simple and reliable, while reducing the volume of the power conversion module and improving the overall power density of the power conversion module. On the other hand, in conjunction with the magnetic components of the main layer architecture, the pins and input capacitors of the power conversion module can also be optimized as needed, such as making the external pins coplanar with the magnetic components or making the input capacitors closer to the power devices, etc., so as to optimize the circuit, reduce the impact of parasitic parameters, and further achieve the purpose of reducing the volume of the power conversion module and improving the overall power density of the power conversion module.

[0134] The present invention can be modified in various ways by those skilled in the art, but all of them are within the protection of the attached claims.

Claims

1. A power conversion module, comprising: A magnetic assembly comprising: A main body layer, comprising a first surface and a second surface, wherein the first surface and the second surface are two opposite surfaces; a magnetic core structure disposed in the main body layer; and At least one winding is at least partially disposed in the magnetic core structure; a power device layer, the power device layer comprising at least one power device, the power device layer further comprising a first circuit board electrically connected to the at least one power device, wherein the first circuit board comprises a first surface and a second surface opposite to each other, the at least one power device is disposed on the first surface or the second surface or embedded between the first surface and the second surface; a pin layer, the pin layer comprising a first surface and a second surface opposite to each other, wherein the magnetic component is disposed between the power device layer and the pin layer; and An output capacitor layer is arranged between the magnetic component and the pin layer, wherein the power device layer, the magnetic component and the pin layer are arranged in a vertical direction to improve the power density of the power conversion module. 2 . The power conversion module as claimed in claim 1 , wherein the power conversion module further comprises an input capacitor layer. 3 . The power conversion module as claimed in claim 2 , wherein the input capacitor layer is disposed between the power device layer and the main body layer.

4. The power conversion module as claimed in claim 2, wherein a receiving groove is further provided between the first circuit board and the main body layer, and is recessed inward from the second surface, and the input capacitor layer is at least partially received in the receiving groove. 5 . The power conversion module as claimed in claim 2 , wherein the input capacitor layer and the power device layer are in the same layer so that the power device is close to the input capacitor. 6 . The power conversion module as claimed in claim 2 , wherein the input capacitor layer is disposed on the first surface, the second surface, or embedded between the first surface and the second surface of the first circuit board. 7 . The power conversion module as claimed in claim 1 , wherein the pin layer comprises a second circuit board having a first surface and a second surface opposite to each other.

8. A power conversion module as described in claim 7, wherein the pin layer includes an input positive terminal pin, an output positive terminal pin and an input negative terminal pin arranged on the second surface, wherein the input positive terminal pin is electrically connected to an input positive terminal connection surface of the second surface, the output positive terminal pin is electrically connected to an output positive terminal connection surface of the second surface, and the input negative terminal pin is electrically connected to a negative terminal pin connection surface of the second surface. 9 . The power conversion module as claimed in claim 7 , wherein the output capacitor layer is electrically connected to the first surface of the second circuit board. 10 . The power conversion module as claimed in claim 1 , wherein the pin layer has a recessed portion, wherein the power conversion module further comprises an output capacitor layer at least partially accommodated in the recessed portion.

11. The power conversion module as claimed in claim 1, wherein the second surface of the first circuit board faces the main layer, the at least one power device is arranged on the first surface of the first circuit board, and the top surface of the at least one power device forms a coplanar surface of the power conversion module. 12 . The power conversion module as claimed in claim 1 , further comprising a conductor embedded between the first surface and the second surface. 13 . The power conversion module as claimed in claim 1 , wherein the magnetic core structure has at least one window, the at least one window is spatially relative to the at least one power device, and the at least one winding passes through the at least one window. 14 . The power conversion module as claimed in claim 12 , wherein the conductor is composed of at least one copper layer or at least one copper block and is pre-embedded in the main body layer.

15. The power conversion module as described in claim 1, wherein the power conversion module also includes at least one side wall electroplating, extending along the side wall of the power device layer, through the side wall of the main layer, to the pin layer, so as to achieve a top circuit and a bottom circuit connecting the power conversion module through the at least one side wall electroplating. 16 . The power conversion module as claimed in claim 1 , wherein the magnetic component further comprises at least one side wall plating extending along the side wall of the main layer, so that the first surface and the second surface are connected through the at least one side wall plating. 17 . The power conversion module as claimed in claim 1 , wherein the first surface of the pin layer at least comprises an output positive terminal pin, an input positive terminal pin, an output negative terminal pin and a signal control pin.

18. A power conversion module as described in claim 17, wherein the pin positions on the first surface can be connected to the second surface of the pin layer through unlimited electrical connections within the pin layer, wherein the second surface of the pin layer is provided with corresponding multiple external pin positions, and the multiple external pin positions realize the electrical connection between the power conversion module and the system board.

19. The power conversion module as claimed in claim 18, wherein the plurality of external pins are implemented by BGA, LGA or pads.

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