Planar SSR optocoupler

Abstract

The invention relates to the technical field of optocouplers, in particular to a planar SSR optocoupler. Through a light emitting diode arranged on an input loop and a bidirectional photosensitive silicon controlled rectifier and a bidirectional thyristor arranged on an output loop, the bidirectional photosensitive silicon controlled rectifier can be driven by light emitted by the light emitting diode to open a gate pole of the bidirectional thyristor, and the thyristors T1 and T2 are driven to control a load LOAD, so that the product can complete the function of a relay; the number of electronic components in the circuit is smaller, the probability that the whole circuit breaks down is greatly reduced, various electronic components can be protected by means of the shading body, the influence of external environment factors on the various electronic components is reduced, and therefore the probability that the electronic components in the circuit break down can be further reduced, and the service life of the circuit is prolonged. The fault probability of the whole circuit is reduced; the problem that the circuit damage probability is increased due to the fact that an existing relay circuit needs to be composed of a plurality of electronic components is solved.

Description

Technical Field

[0001] The present invention relates to the application field of optical coupling technology, and in particular to a planar SSR optical coupling. Background Art

[0002] Relay circuits are mainly used in the home appliance and industrial equipment markets. In terms of home appliances, they are often used in air conditioners, microwave ovens, clothes dryers, personal hygiene systems, refrigerators, fan heaters, induction heating cookers and water heaters. Their main function is to drive the negative, control the load switch, etc. Conventional designs usually use bidirectional thyristor optocouplers to drive bidirectional thyristors to control the load. The circuit also includes several electronic components such as resistors and capacitors. Therefore, the circuit requires more electronic components, so it occupies a larger PCB area, and due to the relatively large number of electronic components, the probability of overall circuit failure increases. Summary of the invention

[0003] In view of the deficiencies of the prior art, the present invention provides a planar SSR optocoupler, which solves the problem that the current relay circuit requires a large number of electronic components, which increases the probability of circuit failure.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A planar SSR optocoupler, comprising a light shielding body for packaging, an input circuit for inputting electrical signals arranged on the light shielding body, a light emitting diode located in the light shielding body arranged on the input circuit, and an output circuit for outputting electrical signals, wherein the output circuit is further provided with a control module located in the light shielding body for converting the optical signal of the light emitting diode into an electrical signal;

[0006] The control module includes a bidirectional photosensitive thyristor arranged on an output circuit for receiving light signals from a light emitting diode, a bidirectional thyristor arranged on the output circuit, an M1 interface of the bidirectional photosensitive thyristor connected to the gate of the bidirectional thyristor, an M2 interface of the bidirectional photosensitive thyristor connected to the output circuit, and the bidirectional thyristor connected in series to the output circuit through its T1 interface and T2 interface.

[0007] Preferably, the output circuit includes a pin 4 and a pin 6, one end of which is arranged inside the light shielding body, and also includes a pin 5 arranged inside the light shielding body, and a bidirectional photosensitive thyristor and a bidirectional thyristor are arranged on the pin 5.

[0008] Preferably, insulating glue for insulation isolation is arranged between the bidirectional photosensitive thyristor and pin 5, conductive glue is arranged between the bidirectional thyristor and pin 5, the M2 interface of the bidirectional photosensitive thyristor is connected to pin 5, the T1 interface of the bidirectional thyristor is connected to pin 4, and a conductive wire is connected between pin 4 and pin 5.

[0009] Preferably, a glue blocking groove for preventing the two colloids from contacting each other is provided on the pin 5 between the insulating glue and the conductive glue, and the glue blocking groove is provided on the side of the pin 5 where the insulating glue and the conductive glue are provided.

[0010] Preferably, the glue blocking groove is provided with a narrow portion and a wide portion whose width is greater than the narrow portion.

[0011] Preferably, there are at least two conductive wires.

[0012] Preferably, the pins 4 and 6 are each provided with at least two through holes located in the light shielding body.

[0013] Preferably, the input circuit includes pin 1, pin 2 and pin 3, one pole of the light emitting diode is conductively arranged on pin 2, pin 2 is connected to pin 1 through a wire, and the other pole of the light emitting diode is connected to pin 3.

[0014] Compared with the prior art, the present invention provides a planar SSR optocoupler, which has the following beneficial effects:

[0015] 1. By arranging the light-emitting diode on the input circuit and the bidirectional photosensitive thyristor and the bidirectional thyristor on the output circuit, the light-emitting diode can emit light to drive the bidirectional photosensitive thyristor to open the gate of the bidirectional thyristor, and at the same time drive the thyristors T1 and T2 to control the load LOAD, so that the product can complete the function of the relay, and the number of electronic components in the circuit of the present invention is less, which greatly reduces the probability of failure of the entire circuit, and can protect various electronic components with the help of a light-shielding body, reduce the influence of external environmental factors on various electronic components, so as to further reduce the probability of failure of electronic components in the circuit and reduce the probability of failure of the entire circuit.

[0016] 2. The insulating glue and the conductive glue are prevented from moving to the other side of the pin 5 by setting the glue blocking groove, thereby preventing the insulating glue from flowing into between the bidirectional thyristor and the pin 5, and preventing the conductive glue from flowing into between the bidirectional photosensitive thyristor and the pin 5, so as to ensure the connection effect between the photosensitive thyristor and the bidirectional thyristor and the pin 5.

[0017] 3. By setting a narrow part and a wide part in the glue blocking groove, the narrow part can be used to ensure the connection strength between the pins on both sides of the narrow part, and the wide part is used to increase the space for accommodating the colloid in the glue blocking groove.

[0018] 4. By making the number of conductive wires at least two, it can be found through experiments that when there are two conductive wires, under different ID currents, the VTM when welding two conductive wires can be lower than the VTM when welding one conductive wire and meet the specification requirements, thereby setting the minimum number of conductive wires. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0020] Figure 1 Schematic diagram of a planar SSR optocoupler of the present invention;

[0021] Figure 2 It is a front view of the planar SSR optical coupler of the present invention;

[0022] Figure 3 is a schematic diagram of the glue blocking groove of the present invention;

[0023] Figure 4 It is an equivalent circuit diagram of the planar SSR optocoupler of the present invention;

[0024] Figure 5 A schematic diagram of a first current flow direction of a planar SSR optocoupler of the present invention;

[0025] Figure 6 A schematic diagram of the second current flow direction of the planar SSR optocoupler of the present invention;

[0026] Figure 7 The schematic diagram and equivalent circuit diagram of the bidirectional photosensitive thyristor of the present invention are shown in FIG.

[0027] Figure 8 It is a schematic diagram and an equivalent circuit diagram of the bidirectional thyristor of the present invention.

[0028] In the figure: 1. light shielding body; 2. input circuit; 3. light emitting diode; 4. output circuit; 5. control module; 51. bidirectional photosensitive thyristor; 52. bidirectional thyristor; 53. conductive wire; 54. glue blocking groove; 55. narrow part; 56. wide part; 6. through hole. DETAILED DESCRIPTION

[0029] The following will describe the implementation methods of the present application in detail with the help of accompanying drawings and examples, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0030] In order to solve the problem that the current relay circuit requires more electronic components, which increases the probability of circuit damage, the present invention provides a planar SSR optocoupler, such as Figure 1-Figure 8As shown, several electronic components are re-integrated and the circuit is designed, thereby greatly reducing the number of electronic components required, so as to reduce the probability of circuit damage, thereby making the current circuit more stable. The light shielding body 1 is provided with an input circuit 2 for inputting electrical signals, and the input circuit 2 is provided with a light emitting diode 3 located in the light shielding body 1. The light emitting diode 3 is driven by the input circuit 2 to emit light, and also includes an output circuit 4 for outputting electrical signals, the output circuit 4 is connected to the load LOAD, and the output circuit 4 is also provided with a control module 5 located in the light shielding body 1 for converting the optical signal of the light emitting diode 3 into an electrical signal;

[0031] The control module 5 includes a bidirectional photosensitive thyristor 51 arranged on the output circuit 4 for receiving the light signal of the light emitting diode 3, a bidirectional thyristor 52 is arranged on the output circuit 4, the M1 interface of the bidirectional photosensitive thyristor 51 is connected to the gate of the bidirectional thyristor 52, the M2 interface of the bidirectional photosensitive thyristor 51 is connected to the output circuit 4, and the bidirectional thyristor 52 is connected in series to the output circuit 4 through its T1 interface and T2 interface. By using the light emitting diode 3 to light up and drive the bidirectional photosensitive thyristor 51 to open the gate of the bidirectional thyristor 52, the bidirectional thyristor 52 is turned on and off. The gate is opened and the thyristors T1 and T2 are driven to control the load LOAD at the same time, so that the product can complete the function of a relay. Compared with the prior art, the number of electronic components in the circuit of the present invention is smaller, which greatly reduces the probability of failure of the entire circuit, and all the electronic components are encapsulated in the light shielding body 1, so that the light shielding body 1 can be used to protect various electronic components and reduce the impact of external environmental factors on various electronic components, thereby further reducing the probability of failure of electronic components in the circuit and reducing the probability of failure of the entire circuit.

[0032] In order to further illustrate the structure of the output circuit 4 and to fully explain the structure of the output circuit 4, the output circuit 4 includes a pin 4 and a pin 6, one end of which is arranged inside the light shielding body 1, and also includes a pin 5 arranged inside the light shielding body 1, and a bidirectional photosensitive thyristor 51 and a bidirectional thyristor 52 are arranged on the pin 5.

[0033] In order to reduce the difficulty of connecting the bidirectional photosensitive thyristor 51 and the bidirectional thyristor 52 in the output circuit 4 and reduce the production difficulty of the circuit, an insulating glue for insulation isolation is provided between the bidirectional photosensitive thyristor 51 and the pin 5, and a conductive glue is provided between the bidirectional thyristor 52 and the pin 5, so that the T2 interface of the bidirectional thyristor 52 is electrically connected to the pin 5, the M2 interface of the bidirectional photosensitive thyristor 51 is connected to the pin 5, and the T1 interface of the bidirectional thyristor 52 is connected to the pin 4, and a conductive wire 53 is connected between the pin 4 and the pin 5, thereby further explaining the structure of the output circuit 4 and the control module 5, and the overall structure is more solid, and does not require too many redundant wires for connection.

[0034] The insulating glue and the conductive glue may flow after coating. If the two colloids are mixed with each other, the conductive and insulating properties of each other may be affected, thereby affecting the connection method between the bidirectional photosensitive thyristor 51 and the bidirectional thyristor 52 and the pin 5. A glue blocking groove 54 is provided on the pin 5 between the insulating glue and the conductive glue to prevent the two colloids from contacting each other. The glue blocking groove 54 is provided on the side of the pin 5 where the insulating glue and the conductive glue are provided. Therefore, when the insulating glue and the conductive glue flow, they will flow into the glue blocking groove 54 and be blocked, thereby preventing the insulating glue from flowing between the bidirectional thyristor 52 and the pin 5, and preventing the conductive glue from flowing between the bidirectional photosensitive thyristor 51 and the pin 5, so as to ensure the connection effect between the bidirectional photosensitive thyristor 51 and the bidirectional thyristor 52 and the pin 5.

[0035] If the width of the glue blocking groove 54 is too large, the pin 5 may be broken at the glue blocking groove 54. If the width of the glue blocking groove 54 is too small, the glue blocking groove 54 may not be able to accommodate all the insulating glue and conductive glue that have flowed out here, and the conductive glue may continue to flow between the bidirectional photosensitive thyristor 51 and the pin 5, or the insulating glue may continue to flow between the bidirectional thyristor 52 and the pin 5. Therefore, in order to ensure the space for accommodating the colloid in the glue blocking groove 54 and to ensure the strength of the pin 5, a narrow portion 55 and a wide portion 56 whose width is greater than the narrow portion 55 are provided in the glue blocking groove 54. The narrow portion 55 is used to ensure the connection strength between the pins 5 on both sides of the narrow portion 55, and the wide portion 56 is used to increase the space for accommodating the colloid in the glue blocking groove 54.

[0036] During the experiment, it was found that the VTM of the product was relatively high, exceeding the specification requirements of the product. Therefore, in order to reduce the VTM of the product, the number of conductive wires 53 is set to at least two. As the number of conductive wires 53 increases, the VTM is theoretically relatively lower. It was found through experiments that setting the number of conductive wires 53 to two can meet the requirements, as shown in Tables 1 and 2 below. It can be found that under different ID currents, the VTM when welding two conductive wires 53 is lower than the VTM when welding one conductive wire 53, and meets the specification requirements.

[0037]

[0038]

[0039]

[0040] In order to further ensure the stability of the position of pin 4 and pin 6 in the finished SSR optocoupler, pin 4 and pin 6 are provided with at least two through holes 6 located in the light shielding body 1. The colloid of the light shielding body 1 will flow into the through hole 6 during packaging, and then solidify into a column in the through hole 6. Therefore, pin 4 and pin 6 can be fixed by at least two columns, preventing the position of pin 4 and pin 6 in the finished SSR optocoupler from shaking, thereby avoiding damage to various wires, such as the conductive wire 53.

[0041] The input circuit 2 includes pin 1, pin 2 and pin 3. One pole of the light-emitting diode 3 is conductively arranged on pin 2. Pin 2 is connected to pin 1 through a wire. The other pole of the light-emitting diode 3 is connected to pin 3. For example, the positive pole of the light-emitting diode 3 is bonded to pin 1, that is, pin 1, and the negative pole is bonded to pin 3, that is, pin 3, so that the light-emitting diode 3 can be turned on through pins 1 and 2 or pins 1 and 3. Figure 5 and Figure 6 shown.

[0042] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A planar SSR optocoupler, comprising a light shielding body (1) for packaging, an input circuit (2) for inputting an electrical signal disposed on the light shielding body (1), a light emitting diode (3) located inside the light shielding body (1) disposed on the input circuit (2), and an output circuit (4) for outputting an electrical signal, characterized in that: The output circuit (4) is also provided with a control module (5) located inside the light shielding body (1) and used for converting the light signal of the light emitting diode (3) into an electrical signal; The control module (5) comprises a bidirectional photosensitive thyristor (51) arranged on an output circuit (4) for receiving a light signal from a light emitting diode (3); a bidirectional thyristor (52) is arranged on the output circuit (4); an M1 interface of the bidirectional photosensitive thyristor (51) is connected to a gate of the bidirectional thyristor (52); an M2 interface of the bidirectional photosensitive thyristor (51) is connected to the output circuit (4); and the bidirectional thyristor (52) is connected in series to the output circuit (4) via its T1 interface and T2 interface.

2. A planar SSR optical coupler according to claim 1, characterized in that: The output circuit (4) comprises a pin 4 and a pin 6, one end of which is arranged inside the light shielding body (1), and a pin 5 arranged inside the light shielding body (1), and a bidirectional photosensitive thyristor (51) and a bidirectional thyristor (52) are arranged on the pin 5.

3. A planar SSR optical coupler according to claim 2, characterized in that: An insulating glue for insulation isolation is provided between the bidirectional photosensitive thyristor (51) and the pin 5, a conductive glue is provided between the bidirectional thyristor (52) and the pin 5, the M2 interface of the bidirectional photosensitive thyristor (51) is connected to the pin 5, the T1 interface of the bidirectional thyristor (52) is connected to the pin 4, and a conductive wire (53) is connected between the pin 4 and the pin 5.

4. A planar SSR optical coupler according to claim 3, characterized in that: The pin 5 between the insulating glue and the conductive glue is provided with a glue blocking groove (54) for preventing the two glues from contacting each other. The glue blocking groove (54) is arranged on the side of the pin 5 where the insulating glue and the conductive glue are arranged.

5. A planar SSR optical coupler according to claim 4, characterized in that: The glue blocking groove (54) is provided with a narrow portion (55) and a wide portion (56) whose width is greater than the narrow portion (55).

6. A planar SSR optical coupler according to claim 3, characterized in that: There are at least two conductive wires (53).

7. A planar SSR optical coupler according to claim 2, characterized in that: The pins 4 and 6 are each provided with at least two through holes (6) located in the light shielding body (1).

8. A planar SSR optical coupler according to claim 1, characterized in that: The input circuit (2) comprises a pin 1, a pin 2 and a pin 3, one pole of the light emitting diode (3) is conductively arranged on the pin 2, the pin 2 is connected to the pin 1 via a wire, and the other pole of the light emitting diode (3) is connected to the pin 3.

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