A carrier plate for preparing a coreless packaging substrate, a preparation method thereof, and an application thereof

Abstract

The present invention relates to the technical field of coreless substrate processing, and in particular to a carrier plate for preparing a coreless packaging substrate. The carrier plate provided by the present invention can significantly reduce the material cost of a traditional coreless substrate; and can well solve the problem of drug seepage during positioning drilling during the processing of a traditional coreless substrate, and avoid the problem of delamination and pulling off of the coreless substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of coreless substrate processes, and in particular to a carrier plate for preparing a coreless packaging substrate. Background Art

[0002] The thinning of electronic products has given rise to coreless packaging substrates, which are not only thinner than cored packaging substrates but also have superior electrical performance. Compared with ordinary cored substrates, the greatest advantages of coreless substrates are that the substrate thickness is greatly reduced, the signal transmission performance is increased, the via / wiring density is increased, and the design flexibility is enhanced. Currently, coreless packaging substrate thin plates are mainly realized through the coreless substrate process (coreless process). In the coreless process, since the substrate fabricated by the coreless layer process has no core layer, a carrier plate is used for processing during the processing, and then the carrier plate is removed after the main laminated structure and circuit board pattern are completed. The structure of the existing coreless substrate mainly includes copper layer / copper layer / core layer / copper layer / copper layer, where the copper layers at both ends will enter the product, and the copper layer / core layer / copper layer in the middle will be removed and discarded. Since coreless substrates are expensive, and during the subsequent processing, the outer frame will cause the penetration of the positioning drilling solution and delamination and peeling due to positioning drilling, resulting in a low qualification rate of the subsequent processed products. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide a carrier plate for preparing a coreless packaging substrate, its preparation method and application. The carrier plate can greatly reduce the material cost of traditional coreless substrates; and can well solve the problem of the penetration of the positioning drilling solution during the processing of traditional coreless substrates and avoid the delamination and peeling of coreless substrates.

[0004] To achieve the above-mentioned invention purpose, the present invention provides the following technical solutions:

[0005] The present invention provides a carrier plate for preparing a coreless packaging substrate, which is obtained by laminating and pressing a first large copper foil, a first PP layer, a first small copper foil, a second large copper foil, a second small copper foil, a second PP layer, and a third large copper foil in sequence; the first large copper foil, the second large copper foil, and the third large copper foil have the same size;

[0006] The first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the sizes of the first large copper foil, the second large copper foil, and the third large copper foil are larger than those of the first PP layer and the second PP layer;

[0007] The sizes of the first PP layer and the second PP layer are larger than those of the first small copper foil and the second small copper foil;

[0008] Positioning drill holes are provided at the edges of the carrier plate, and the positioning drill holes penetrate through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer, and the third large copper foil.

[0009] Preferably, the first large copper foil and the third large copper foil have the same thickness;

[0010] The first small copper foil and the second small copper foil have the same thickness.

[0011] Preferably, taking the center of the plane where the carrier plate is located as the center point, the direction parallel to the long side passing through this center point is the X-axis, the direction parallel to the short side passing through this center point is the Y-axis, and the direction perpendicular to the plane is the Z-axis;

[0012] The center points of the first large copper foil, the first PP layer, the first small copper foil, the second large copper foil, the second small copper foil, the second PP layer, and the third large copper foil are located in the same vertical direction, and the vertical direction is the Z-axis direction perpendicular to the plane where the carrier plate is located;

[0013] The X-axis and Y-axis of the carrier plate are both symmetric.

[0014] The present invention also provides a method for preparing the carrier plate described in the above technical solution, including the following steps:

[0015] Stack and arrange them in sequence according to the order of the first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP, and the third large copper foil. After pressing and trimming the edges in sequence, position and drill holes at the edge positions to obtain the carrier plate;

[0016] The positioning drill holes penetrate through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer, and the third large copper foil of the obtained carrier plate.

[0017] The present invention also provides the application of the carrier plate described in the above technical solution or the carrier plate prepared by the preparation method described in the above technical solution in the preparation of a coreless packaging substrate.

[0018] The present invention provides a carrier plate for manufacturing a coreless package substrate, which is obtained by laminating and pressing a first large copper foil, a first PP layer, a first small copper foil, a second large copper foil, a second small copper foil, a second PP layer, and a third large copper foil in sequence; the first large copper foil, the second large copper foil, and the third large copper foil have the same size; the first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the sizes of the first large copper foil, the second large copper foil, and the third large copper foil are larger than those of the first PP layer and the second PP layer; the sizes of the first PP layer and the second PP layer are larger than those of the first small copper foil and the second small copper foil; positioning drill holes are provided at the edge of the carrier plate, and the positioning drill holes penetrate through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer, and the third large copper foil. With the pressed carrier plate itself as the carrier, subsequent build-up manufacturing can be continued; at the same time, by utilizing the size difference between the copper foils, positioning drill holes are provided at the difference positions. Since there is no situation where two adjacent copper foils are together at this position, that is, there is no delamination problem, correspondingly, the problem of positioning drill holes leaking chemical solution and the problem of delamination and pulling-off can be well solved. At the same time, after the build-up manufacturing is completed to prepare the coreless package substrate with the carrier plate of the present invention through a stacked structure design using the product itself as the carrier plate, the first large copper foil and the first small copper foil will become two circuit layers of the carrier plate, and the first PP layer will become a dielectric layer of the carrier plate; (the same applies to the third large copper foil, the second small copper foil, and the second PP layer); the second large copper foil will be taken out and discarded after splitting. In addition, other board manufacturing processes for manufacturing the coreless package substrate using the carrier plate of the present invention are the same as those for conventional coreless package substrates. Detailed Embodiments

[0019] The present invention provides a carrier plate for manufacturing a coreless package substrate, which is obtained by laminating and pressing a first large copper foil, a first PP layer, a first small copper foil, a second large copper foil, a second small copper foil, a second PP layer, and a third large copper foil in sequence; the first large copper foil, the second large copper foil, and the third large copper foil have the same size;

[0020] the first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the sizes of the first large copper foil, the second large copper foil, and the third large copper foil are larger than those of the first PP layer and the second PP layer;

[0021] the sizes of the first PP layer and the second PP layer are larger than those of the first small copper foil and the second small copper foil;

[0022] positioning drill holes are provided at the edge of the carrier plate, and the positioning drill holes penetrate through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer, and the third large copper foil.

[0023] In the present invention, the thicknesses of the first large copper foil and the third large copper foil are the same;

[0024] The thicknesses of the first small copper foil and the second small copper foil are the same.

[0025] In the present invention, taking the center of the surface where the carrier board is located as the center point, the direction parallel to the long side passing through this center point is the X-axis, the direction parallel to the short side passing through this center point is the Y-axis, and the direction perpendicular to the plane is the Z-axis;

[0026] The center points of the first large copper foil, the first PP layer, the first small copper foil, the second large copper foil, the second small copper foil, the second PP layer, and the third large copper foil are located in the same vertical direction, and the vertical direction is the Z-axis direction perpendicular to the surface where the carrier board is located;

[0027] Both the X-axis and the Y-axis of the carrier board are symmetric.

[0028] The present invention does not have any special limitations on the arrangement of the positioning drill holes, and the arrangements well-known to those skilled in the art can be adopted.

[0029] The present invention also provides a method for preparing the carrier board described in the above technical solution, including the following steps:

[0030] Stack and arrange them in sequence according to the order of the first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP, and the third large copper foil. After pressing and trimming the edges in sequence, position and drill holes at the edge positions to obtain the carrier board;

[0031] The positioning drill holes penetrate through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer, and the third large copper foil of the obtained carrier board.

[0032] The present invention does not have any special limitations on the processes of pressing, trimming, and positioning drill holes, and the processes well-known to those skilled in the art can be adopted.

[0033] The present invention also provides the application of the carrier board described in the above technical solution or the carrier board prepared by the preparation method described in the above technical solution in the preparation of a coreless packaging substrate. The present invention does not have any special limitations on the application method, and the methods well-known to those skilled in the art can be adopted.

[0034] Next, the technical solutions in the present invention will be clearly and completely described in conjunction with the embodiments in the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without making creative efforts belong to the scope of protection of the present invention.

[0035] Example 1

[0036] Structure: It is obtained by laminating a first large copper foil, a first PP layer, a first small copper foil, a second large copper foil, a second small copper foil, a second PP layer, and a third large copper foil in sequence; the first large copper foil, the second large copper foil, and the third large copper foil have the same size; the first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the sizes of the first large copper foil, the second large copper foil, and the third large copper foil are larger than those of the first PP layer and the second PP layer; the sizes of the first PP layer and the second PP layer are larger than those of the first small copper foil and the second small copper foil; positioning drill holes are provided at the edge of the carrier plate, and the positioning drill holes penetrate through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer, and the third large copper foil; the thicknesses of the first large copper foil, the second large copper foil, and the third large copper foil are independently 18 μm; the thicknesses of the first small copper foil and the second small copper foil are independently 12 μm; taking the center of the plane where the carrier plate is located as the center point, the direction parallel to the long side passing through this center point is the X-axis, the direction parallel to the short side passing through this center point is the Y-axis, and the direction perpendicular to the plane is the Z-axis; the center points of the first large copper foil, the first PP layer, the first small copper foil, the second large copper foil, the second small copper foil, the second PP layer, and the third large copper foil are located in the same vertical direction, and the vertical direction is the Z-axis direction perpendicular to the plane where the carrier plate is located; the X-axis and Y-axis of the carrier plate are both symmetrical.

[0037] Preparation method: Take 3 large copper foils (size: 520*420 mm, thickness: 18 μm), two PPs (size: 515*415 mm, thickness: 40 μm), and two small copper foils (size: 506*406 mm, thickness: 12 μm);

[0038] Stack and arrange them in sequence according to the order of the first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP, and the third large copper foil (wherein, the center points of the first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP, and the third large copper foil are located in the same vertical direction), perform lamination and trimming in sequence, and then drill positioning holes at the edge position to obtain the carrier plate.

[0039] The above is only the preferred implementation method of the present invention, and it does not impose any form of limitation on the present invention. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements and refinements can still be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A carrier plate for manufacturing a coreless encapsulation substrate, characterized in that, It is obtained by laminating and pressing a first large copper foil, a first PP layer, a first small copper foil, a second large copper foil, a second small copper foil, a second PP layer, and a third large copper foil in sequence; the first large copper foil, the second large copper foil, and the third large copper foil have the same size; the first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the sizes of the first large copper foil, the second large copper foil, and the third large copper foil are larger than those of the first PP layer and the second PP layer; the sizes of the first PP layer and the second PP layer are larger than those of the first small copper foil and the second small copper foil; Positioning drill holes are provided at the edge of the carrier plate, and the positioning drill holes penetrate through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer, and the third large copper foil; Taking the center of the plane where the carrier plate is located as the center point, the direction parallel to the long side passing through this center point is the X-axis, the direction parallel to the short side passing through this center point is the Y-axis, and the direction perpendicular to the plane is the Z-axis; The center points of the first large copper foil, the first PP layer, the first small copper foil, the second large copper foil, the second small copper foil, the second PP layer, and the third large copper foil are located in the same vertical direction, and the vertical direction is the Z-axis direction perpendicular to the plane where the carrier plate is located; Both the X-axis and the Y-axis of the carrier plate are symmetric.

2. The carrier plate according to claim 1, wherein The first large copper foil and the third large copper foil have the same thickness; The first small copper foil and the second small copper foil have the same thickness.

3. The preparation method of the carrier plate according to claim 1 or 2, characterized in that, It includes the following steps: Laminating and arranging in sequence according to the order of the first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP, and the third large copper foil, performing lamination and edge trimming in sequence, and then positioning and drilling holes at the edge position to obtain the carrier plate; The positioning drill holes penetrate through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer, and the third large copper foil of the obtained carrier plate.

4. Application of the carrier plate according to claim 1 or 2 or the carrier plate prepared by the preparation method according to claim 3 in the preparation of a coreless packaging substrate.