Manufacturing method of high-insulation circuit board and high-insulation circuit board

Abstract

The invention discloses a manufacturing method of a high-insulation circuit board and the high-insulation circuit board in the technical field of circuit boards, and aims to solve the problem that the circuit board in the prior art is difficult to apply to a scene with a higher power level due to poor insulation and voltage resistance level and heat-conducting property of the whole circuit board. The method comprises the following steps: coating two sides of an insulating ceramic part with first conductive layers to obtain assembly units; fixing an electronic component on the surface of the assembly unit to obtain an electronic unit; the two sides of the first insulating layer are coated with second conductive layers, a plate-shaped element is manufactured, and a first containing part used for containing the electronic unit is formed in the plate-shaped element; according to the invention, the insulating ceramic component below the electronic component plays a role in high voltage resistance and insulation, the application power level of a product is expanded to a high-voltage platform, and the insulation and voltage resistance level and the heat-conducting property of the whole circuit board are better improved; and interfaces and heat dissipation paths for system connection are increased, and the overall parasitic parameters and thermal resistance values are further reduced.

Description

Technical Field

[0001] The invention relates to a manufacturing method of a high-insulation circuit board and a high-insulation circuit board, belonging to the technical field of circuit boards. Background Art

[0002] A circuit board is a plate-like substrate made of insulating material with a circuit pattern printed on it, which is used to connect and fix various electronic components. Circuit boards play a very important role in electronic devices and are an indispensable component of modern electronic devices. Circuit boards are widely used in communications, consumer electronics, industry, medical care, military, aerospace, automobiles and other fields. Patent CN103339726B discloses a method for manufacturing electronic components, in which a conductive core layer made of conductive material has a housing, and an electronic structural element is placed in the housing of the conductive core layer, and both the upper and lower sides are covered with an electrically insulating thermal conductive coating, and the outer sides of the thermal conductive coatings on both sides are connected with another conductive coating. The external conductive coating is connected to the conductive core and the electronic structural element of the inner layer through metal plated through holes, realizing a circuit board with an electronic component having an electrical flow path and insulating thermal conductivity.

[0003] From the above content, it can be seen that although the circuit boards in the prior art have the advantages of high integration and low parasitic parameters, they are subject to the material limitations of the printed circuit boards themselves. The overall insulation voltage resistance level and thermal conductivity of the circuit boards are poor, which makes them difficult to apply to higher power level scenarios, affecting the use effect of the circuit boards. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for manufacturing a high-insulation circuit board and a high-insulation circuit board, so as to solve the problem that although the circuit boards in the prior art have the advantages of high integration and low parasitic parameters, they are subject to the material limitations of the printed circuit board itself, and the overall insulation withstand voltage level and thermal conductivity of the circuit board are poor, which makes it difficult to apply them to scenarios with higher power levels.

[0005] In order to solve the above technical problems, the present invention is implemented by adopting the following technical solutions: In a first aspect, the present invention provides a method for manufacturing a high-insulation circuit board, comprising the following steps: Coating a first conductive layer on both sides of the insulating ceramic component to obtain a component unit; Fixing electronic components on the surface of the assembly unit to obtain an electronic unit; A second conductive layer is coated on both sides of the first insulating layer to obtain a plate-shaped element, wherein a first receiving portion for placing the electronic unit is provided on the plate-shaped element, and the first receiving portion penetrates the plate-shaped element; Placing the electronic unit in the first receiving portion, and pressing a second insulating layer on both sides of the plate-like element to obtain a first prefabricated part; A plurality of first through holes are made in the second insulating layer on both sides of the electronic unit, and a third conductive layer is electroplated on both sides of the first preform and in the first through holes, so that the electronic component and the first conductive layer above are connected to the third conductive layer above; Laminating a third insulating layer and a fourth conductive layer on the surface of the third conductive layer, and punching holes in the third insulating layer; The surface of the fourth conductive layer is coated with an insulating protective layer, and a welding pad is arranged in the insulating protective layer.

[0006] Furthermore, it also includes: The plate-like element is provided with a second receiving portion for placing the rigid metal body; Making a plurality of the first through holes in the second insulating layer below the rigid metal body; A through hole is made on the second insulating layer, the third conductive layer, the third insulating layer, the fourth conductive layer and the insulating protection layer above the rigid metal body, and the through hole is located above the rigid metal body.

[0007] Furthermore, the step of preparing the first prefabricated part specifically includes: The electronic unit is placed in the first accommodating portion, the rigid metal body is placed in the second accommodating portion, and a second insulating layer, a plate-shaped element, and a second insulating layer are placed in sequence from bottom to top and pressed together to obtain a first prefabricated part.

[0008] Furthermore, the drilling of the third insulating layer specifically includes: A plurality of second through holes are formed in the third insulating layer so that the adjacent third conductive layer is connected to the fourth conductive layer.

[0009] Furthermore, the pad is located on one side of the second through hole.

[0010] Furthermore, the electronic components include diodes, triodes, MOSFETs, IGBTs, resistors, capacitors and inductors.

[0011] Furthermore, the first accommodation portion passes through the first insulating layer and the second conductive layer above it.

[0012] In a second aspect, the present invention provides a high-insulation circuit board, comprising a plate-like element, a first accommodating portion for placing an electronic component is provided on the plate-like element, a second insulating layer is provided on both the upper and lower sides of the plate-like element, a third conductive layer is provided on the outer wall of the second insulating layer, a third insulating layer is provided on the outer wall of the third conductive layer, a fourth conductive layer is provided on the outer wall of the third insulating layer, and an insulating protective layer is provided on the outer wall of the fourth conductive layer; The electronic element is connected to the third conductive layer through a first through hole, and the third conductive layer is connected to the fourth conductive layer through a second through hole; The electronic element comprises an insulating ceramic component. First conductive layers are arranged on both the upper and lower sides of the insulating ceramic component, and an electronic component is arranged on an outer wall of one of the first conductive layers.

[0013] Furthermore, a second accommodating portion for placing a rigid metal body is provided on the plate-like element, a plurality of the first through holes are provided in the second insulating layer below on one side of the second accommodating portion, and through holes are provided in the second insulating layer, the third conductive layer, the third insulating layer, the fourth conductive layer and the insulating protection layer above the rigid metal body, and the through holes are located above the rigid metal body.

[0014] Furthermore, a pad is provided in the insulating protection layer on one side of the second through hole.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The manufacturing method of the high-insulation circuit board uses an insulating ceramic component. Compared with the prior art, the insulating ceramic component under the electronic component replaces the insulating coating under the conductive core layer accommodating portion, and plays a high-voltage insulation role, expanding the product application power level to a high-voltage platform, and better improving the overall insulation voltage resistance level and thermal conductivity of the circuit board; at the same time, in order to fit the use scenarios of higher power levels, the system connection interface and heat dissipation path are added, and the overall parasitic parameters and thermal resistance values ​​are further reduced, so that the present application can be applied to scenarios of higher power levels. The application scenarios of the present invention are expanded from low voltage to high voltage range, ensuring the use effect of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of a front cross-section of a high-insulation circuit board provided according to an embodiment of the present invention; Figure 2 is a schematic front cross-sectional view of a component unit provided according to an embodiment of the present invention; Figure 3 is a schematic front cross-sectional view of an electronic unit provided according to an embodiment of the present invention; Figure 4is a schematic front cross-sectional view of a plate-like element provided according to an embodiment of the present invention; Figure 5 is a schematic front cross-sectional view of a plate-like element provided according to an embodiment of the present invention when a first accommodation portion and a second accommodation portion are provided; Figure 6 is a schematic front cross-sectional view of a plate-shaped component provided in an embodiment of the present invention when an electronic unit and a rigid metal body are placed; Figure 7 is a schematic front cross-sectional view of a first prefabricated component provided according to an embodiment of the present invention; Figure 8 is a schematic front cross-sectional view of a first through hole provided according to an embodiment of the present invention; Fig. 9 is a schematic front cross-sectional view of a third conductive layer provided in an embodiment of the present invention; Fig.10 is a schematic front cross-sectional view of a third insulating layer provided in an embodiment of the present invention; Fig.11 is a schematic front cross-sectional view of a second through hole provided in an embodiment of the present invention; Fig.12 4 is a schematic front cross-sectional view of a fourth conductive layer provided according to an embodiment of the present invention.

[0017] In the figure: 1. insulating ceramic component; 21. first conductive layer; 22. second conductive layer; 23. third conductive layer; 24. fourth conductive layer; 3. electronic component; 41. first insulating layer; 42. second insulating layer; 43. third insulating layer; 51. first accommodating portion; 52. second accommodating portion; 6. rigid metal body; 71. first through hole; 72. second through hole; 8. insulating protection layer; 9. solder pad; 10. through hole. DETAILED DESCRIPTION

[0018] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0019] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances. Embodiment 1:

[0021] like Figure 1-Figure 12 As shown, the present invention provides a method for manufacturing a high-insulation circuit board, comprising the following steps: The first conductive layer 21 is applied to both sides of the insulating ceramic component 1 to obtain a component unit; Fixing the electronic component 3 on the surface of the assembly unit to obtain the electronic unit; The second conductive layer 22 is coated on both sides of the first insulating layer 41 to obtain a plate-like element, on which a first receiving portion 51 for placing the electronic unit is opened, and the first receiving portion 51 passes through the plate-like element; wherein the size of the first receiving portion 51 is consistent with the size of the electronic unit; The electronic unit is placed in the first receiving portion 51, and then the second insulating layer 42 is pressed onto both sides of the plate-like element to obtain a first prefabricated component; A plurality of first through holes 71 are made in the second insulating layer 42 on both sides of the electronic unit, and the third conductive layer 23 is electroplated on both sides of the first preform and in the first through holes 71, so that the electronic component 3 and the first conductive layer 21 above are connected to the third conductive layer 23 above; The third insulating layer 43 and the fourth conductive layer 24 are pressed onto the surface of the third conductive layer 23, and the third insulating layer 43 is punched; The surface of the fourth conductive layer 24 is coated with an insulating protective layer 8 , and a soldering pad 9 is disposed in the insulating protective layer 8 .

[0022] The plate-like element is provided with a second receiving portion 52 for receiving the rigid metal body 6; A plurality of first through holes 71 are formed in the second insulating layer 42 below the rigid metal body 6; A through hole 10 is made on the second insulating layer 42 , the third conductive layer 23 , the third insulating layer 43 , the fourth conductive layer 24 and the insulating protection layer 8 above the rigid metal body 6 , and the through hole 10 is located above the rigid metal body 6 .

[0023] Specifically, Figure 2 As shown, firstly, the upper and lower parts of the insulating ceramic component 1 are coated with a first conductive layer 21, the first conductive layer 21 is a conductive material, to form a component unit with a middle insulating layer and a conductive layer on the upper and lower parts; Figure 3 As shown, any type of electronic components 3 are placed on the surface of the assembly and combined into an electronic unit through metal connection methods such as welding, sintering, diffusion welding, etc.; Figure 4 As shown, another plate-like element is made, the middle layer is a first insulating layer 41, optionally, the first insulating layer 41 is an insulating resin material, and the upper and lower sides thereof are coated with a second conductive layer 22, optionally, the second conductive layer 22 is a conductive material, and the second conductive layer 22 is a copper metal material; as shown Figure 5 As shown, the plate-like element is provided with a first receiving portion 51 for placing the electronic unit, and the first receiving portion 51 passes through the plate-like element; Figure 6 As shown, the electronic unit is placed in the first receiving portion 51, and the rigid metal body 6 is placed in the second receiving portion 52. Figure 7 As shown, the second insulating layer 42, the plate-like element, and the second insulating layer 42 are placed in sequence from bottom to top, and then pressed together to obtain a first preform. During the pressing process, the second insulating layer 42 undergoes a melting, flowing, and solidifying process to connect the whole. Depending on the type of electronic component 3 placed, there will be different design options for the height after the combination, and the situation of being higher or lower than the plate exists. In the same layer, a rigid metal body 6 is placed as a port for circuit input and output, and the second insulating layer 42 is connected to the upper and lower sides by pressing. The second insulating layer 42 is an insulating resin material. The resin tightly combines all the components together during the melting process, and while insulating, it also acts as a bonding agent to connect the upper and lower and middle structural parts; as shown Figure 8 and Fig. 9As shown, a plurality of first through holes 71 are made in the second insulating layer 42 on both sides of the electronic unit, and the third conductive layer 23 is electroplated on both sides of the first preform and in the first through holes 71, so that the electronic component 3 and the first conductive layer 21 above are connected to the third conductive layer 23 above, wherein the third conductive layer 23 is fully covered in the first through hole 71 and the upper and lower sides by electroplating, and the third conductive layer 23 is a metal conductive material, preferably a copper material, and the copper-plated through hole on the upper side (i.e., the first through hole 71) exposes the electronic component 3 and the first conductive layer 21 combined therewith, and connects the two, and the copper-plated through hole on the lower layer enhances the heat dissipation performance of the system, and the lower layer of the rigid metal body 6 can be connected to other conductive layers to realize the input and output of current; as shown Figure 10-12 As shown, after the power part is completed, the third insulating layer 43 and the fourth conductive layer 24 are pressed on the surface of the third conductive layer 23, and the third insulating layer 43 is punched. The drive signal can be led out to other layers through the second through hole 72, and considering the heat dissipation, a heat transfer path is still made under the electronic component 3. The power and drive signals are separated by the electroplated second through hole 72 and different conductive layers to reduce electromagnetic interference. At the same time, other extended areas of the circuit board can be used to make control and logic circuits to achieve more functions and higher integration; the surface of the fourth conductive layer 24 is coated with an insulating protective layer 8, and a soldering pad 9 is provided in the insulating protective layer 8, that is, the soldering pad 9 and the insulating protective layer 8 on the surface of the circuit board are finally made. Optionally, the insulating protective layer 8 is an insulating ink coating, and all layers above the rigid metal body 6 are penetrated and opened to form a through hole 10 to achieve direct connection with the input and output ends of the system.

[0024] The electronic component 3 and the component unit are embedded in the first accommodating portion 51 of the plate-like element, and the overall thickness of the embedded body is different from the thickness of the first insulating layer 41 according to the type of the electronic component 3; the electrodes of the electronic component 3 and the surface electrodes of the component unit are led out through the first through hole 71 and the second through hole 72 and connected to each conductive layer; each conductive layer has different graphics and network designs to meet different current path requirements; the insulating protection layer 8 is used to prevent leakage, scratches, etc.; the pad 9 can be surface mounted on active and passive components or connected to other circuits; the ceramic layer of the insulating ceramic component 1 has a higher voltage resistance than the insulating layer and better thermal conductivity, which can improve the acceptable power level of the product; the rigid metal body 6 is directly connected to the system as a direct connection channel for the system input and output interface, and is directly connected to the system through the conductive layer and the metal via (i.e., the first through hole 7 1) The electrode is led out and connected to the current loop to reduce the current path length and loss, and can withstand high-power connection processes and conduction requirements. The insulating medium above the electronic component 3, the rigid metal body 6 and part of the conductive material is removed by laser drilling, and the metal material is filled in by electroplating or coating. The metal vias made connect the electrodes of the electronic component 3 and the conductive layer; as a more integrated solution, the circuit board manufacturing solution with more than eight layers combines power and logic together; considering the energy loss and heat dissipation of the high-power platform, the first through holes 71 and the second through holes 72 are densely arranged under the electronic component 3 to play a heat dissipation role; in order to achieve more electrical functions, the present invention again presses a third insulating layer 43 and a fourth conductive layer 24 to make corresponding metal vias (i.e., the second through holes 72), which can have a more complex and higher integrated design solution.

[0025] In one embodiment, the punching operation for the third insulating layer 43 specifically includes: A plurality of second through holes 72 are formed in the third insulating layer 43 , so that the adjacent third conductive layer 23 is connected to the fourth conductive layer 24 .

[0026] The pad 9 is located at one side of the second through hole 72; The electronic components 3 include diodes, triodes, MOSFETs, IGBTs, resistors, capacitors and inductors, and may also be electronic component products that have been plastic-encapsulated with resin. Some electrodes may be connected through the conductive layer at the bottom, and there are also first through holes 71 and second through holes 72 to directly lead out the electrodes on the upper surface for use.

[0027] In one embodiment, the first receiving portion 51 penetrates the first insulating layer 41 and the second conductive layer 22 above, thereby retaining the second conductive layer 22 below for connecting with the electronic component 3 placed inside to form a current path.

[0028] Compared with the prior art, the present invention uses an insulating ceramic component 1 to replace the insulating coating under the conductive core layer accommodating portion. The insulating ceramic component 1 under the electronic component 3 plays a high-voltage insulation role, expanding the product application power level to a high-voltage platform, and better improving the overall insulation voltage resistance level and thermal conductivity of the circuit board; at the same time, in order to adapt to higher power level usage scenarios, system connection interfaces and heat dissipation paths are added to further reduce the overall parasitic parameters and thermal resistance values, so that the present application can be applied to higher power level scenarios. The application scenarios of the present invention are expanded from low voltage to high voltage range, ensuring the use effect of the circuit board.

[0029] Specifically, a high-insulation ceramic material, i.e., an insulating ceramic component 1, is selected as the bearing unit for the electronic component 3 in the circuit board. The electronic component 3 realizes current path transmission through the conductive layer, the first through hole 71 and the second through hole 72 in the circuit board. At the same time, an electrically insulating thermally conductive material (i.e., an insulating layer) is used as filling for other areas that are not electrically connected. In addition, a rigid metal body 6 serves as a high-power input and output port in the circuit board. The ceramic material serving as the bearing unit for the electronic component 3 has an isolation and protection effect on high voltage, and also has better heat dissipation performance, and can be applied to scenarios with higher power levels and switching frequencies. Embodiment 2:

[0030] like Figure 1 As shown, the present invention provides a high-insulation circuit board, including a plate-like element, on which a first accommodating portion 51 for placing electronic components is opened, and a second insulating layer 42 is provided on both upper and lower sides of the plate-like element, and an outer wall of the second insulating layer 42 is provided with a third conductive layer 23, and an outer wall of the third conductive layer 23 is provided with a third insulating layer 43, and an outer wall of the third insulating layer 43 is provided with a fourth conductive layer 24, and an outer wall of the fourth conductive layer 24 is provided with an insulating protective layer 8; The electronic component is connected to the third conductive layer 23 through the first through hole 71, and the third conductive layer 23 is connected to the fourth conductive layer 24 through the second through hole 72; The electronic component comprises an insulating ceramic component 1 . First conductive layers 21 are provided on both the upper and lower sides of the insulating ceramic component 1 . An electronic component 3 is provided on an outer wall of one of the first conductive layers 21 .

[0031] In one embodiment, a second accommodating portion 52 for placing a rigid metal body 6 is provided on the plate-like element, a plurality of first through holes 71 are provided in the second insulating layer 42 below on one side of the second accommodating portion 52, and through holes 10 are provided in the second insulating layer 42, the third conductive layer 23, the third insulating layer 43, the fourth conductive layer 24 and the insulating protection layer 8 above the rigid metal body 6, and the through holes 10 are located above the rigid metal body 6; a soldering pad 9 is provided in the insulating protection layer 8 on one side of the second through hole 72.

[0032] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for manufacturing a high insulation circuit board, characterized in that: The following steps are involved: Coating a first conductive layer on both sides of the insulating ceramic component to obtain a component unit; Fixing electronic components on the surface of the assembly unit to obtain an electronic unit; A second conductive layer is coated on both sides of the first insulating layer to obtain a plate-shaped element, wherein a first receiving portion for placing the electronic unit is provided on the plate-shaped element, and the first receiving portion penetrates the plate-shaped element; Placing the electronic unit in the first receiving portion, and pressing a second insulating layer on both sides of the plate-like element to obtain a first prefabricated part; A plurality of first through holes are made in the second insulating layer on both sides of the electronic unit, and a third conductive layer is electroplated on both sides of the first preform and in the first through holes, so that the electronic component and the first conductive layer above are connected to the third conductive layer above; Laminating a third insulating layer and a fourth conductive layer on the surface of the third conductive layer, and punching holes in the third insulating layer; The surface of the fourth conductive layer is coated with an insulating protective layer, and a welding pad is arranged in the insulating protective layer.

2. The method for manufacturing a high insulation circuit board according to claim 1, characterized in that: Also includes: The plate-like element is provided with a second receiving portion for placing the rigid metal body; Making a plurality of the first through holes in the second insulating layer below the rigid metal body; A through hole is made on the second insulating layer, the third conductive layer, the third insulating layer, the fourth conductive layer and the insulating protection layer above the rigid metal body, and the through hole is located above the rigid metal body.

3. The method for manufacturing a high insulation circuit board according to claim 2, characterized in that: The method of preparing the first prefabricated part specifically comprises: The electronic unit is placed in the first accommodating portion, the rigid metal body is placed in the second accommodating portion, and a second insulating layer, a plate-shaped element, and a second insulating layer are placed in sequence from bottom to top and pressed together to obtain a first prefabricated part.

4. The method for manufacturing a high insulation circuit board according to claim 1, characterized in that: The punching operation for the third insulating layer specifically includes: A plurality of second through holes are formed in the third insulating layer so that the adjacent third conductive layer is connected to the fourth conductive layer.

5. The method for manufacturing a high insulation circuit board according to claim 4, characterized in that: The pad is located at one side of the second through hole.

6. The method for manufacturing a high insulation circuit board according to claim 1, characterized in that: The electronic components include diodes, triodes, MOSFETs, IGBTs, resistors, capacitors and inductors.

7. The method for manufacturing a high insulation circuit board according to claim 1, characterized in that: The first receiving portion penetrates the first insulating layer and the second conductive layer thereon.

8. A high insulation circuit board, characterized in that: A plate-shaped element is provided with a first receiving portion for placing an electronic element, a second insulating layer is provided on both upper and lower sides of the plate-shaped element, a third conductive layer is provided on the outer wall of the second insulating layer, a third insulating layer is provided on the outer wall of the third conductive layer, a fourth conductive layer is provided on the outer wall of the third insulating layer, and an insulating protective layer is provided on the outer wall of the fourth conductive layer; The electronic element is connected to the third conductive layer through a first through hole, and the third conductive layer is connected to the fourth conductive layer through a second through hole; The electronic element comprises an insulating ceramic component. First conductive layers are arranged on both the upper and lower sides of the insulating ceramic component, and an electronic component is arranged on an outer wall of one of the first conductive layers.

9. The high insulation circuit board according to claim 8, characterized in that: The plate-like element is provided with a second accommodating portion for placing a rigid metal body, and the second insulating layer below is provided with a plurality of the first through holes on one side of the second accommodating portion, and the second insulating layer, the third conductive layer, the third insulating layer, the fourth conductive layer and the insulating protection layer above the rigid metal body are all provided with through holes, and the through holes are located above the rigid metal body.

10. The high insulation circuit board according to claim 8, characterized in that: A pad is provided in the insulating protection layer at one side of the second through hole.

Images