Manufacturing process of multi-layer high-density circuit board

Abstract

The invention relates to the technical field of circuit board processing, in particular to a manufacturing process of a multi-layer high-density circuit board, which comprises a fixing frame, a soaking pool and the like. A soaking pool is placed below the fixing frame; and a demolding liquid is stored in the soaking pool. According to the invention, a film attached to the circuit board is cleaned through the cleaning plate, the film easy to fall off on the surface of the circuit board is also automatically cleaned, the production process is optimized, and the manual labor amount is reduced; demolding liquid circulation is generated in the storage box through the water pipe, the phenomenon that the independent concentration diffusion time is long is avoided through the flowing demolding liquid, and the situation that subsequent circuit board demolding is incomplete is avoided. The compressed second intercepting net is matched with the water pipe, so that the film is guided and intercepted by the V-shaped second intercepting net in the process of flowing to the liquid discharging groove, and the film cannot be adhered to the surface of the circuit board again; and the circuit board is pushed upwards in the rising process through the expanded second intercepting net, so that the circuit board is lifted out of the storage box, a worker can conveniently take out the circuit board subsequently, and the use convenience of the device is improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a manufacturing process of a multi-layer high-density circuit board. Background Art

[0002] Before etching the circuit board, the film (dry film) remaining from the previous process on the circuit board needs to be processed. The current common methods for processing the film on the surface of the circuit board are spraying and immersion. The immersion method soaks the circuit board in the stripping liquid for a period of time, and the film on the surface of the circuit board reacts with the stripping liquid, thereby creating a gap between the circuit board and the circuit board and making it easy to loosen. Then, during the lifting and subsequent rinsing process, the remaining film on the circuit board is cleaned up. During the immersion process, the film on the circuit board may fall off. If the film that falls off is small, the small film will float in the stripping liquid. If the film that falls off is large, the large film will be deposited in the stripping liquid. Regardless of whether it is a small film or a large film, it may still reattach to the circuit board after being separated from the circuit board, and even attach to the area where the film on the circuit board has not yet reacted completely with the stripping liquid, affecting the reaction effect of the remaining films on the circuit board with the stripping liquid, so that the area of ​​the circuit board covered by the detached film is not completely stripped, thereby affecting the subsequent process. At the same time, since the stripping solution is corrosive, the film is easily decomposed after being accumulated in the stripping liquid for a long time, resulting in a poor stripping effect of the stripping liquid. Summary of the invention

[0003] In order to overcome the disadvantage that the existing film is easy to re-adhere to the surface of the circuit board after being peeled off, thus affecting the normal film removal, the present invention provides a manufacturing process for a multi-layer high-density circuit board.

[0004] The technical solution of the present invention is: a manufacturing process of a multi-layer high-density circuit board, comprising the following steps: S1: Cutting, cutting the required substrate into sizes suitable for the production process for subsequent processing; S2: Inner layer pattern production, after the double-sided copper-clad substrate is etched to form the inner layer circuit, the bonding force between the copper foil and the resin is strengthened by browning; S3: Lamination, forming a multi-layer circuit board by stacking the inner layer board, prepreg and copper foil in sequence and hot pressing them; S4: Drilling, making holes on the circuit board to facilitate interconnection between layers; S5: Copper deposition, attaching conductive metal copper to the holes to interconnect the layers; S6: Electroplating: electroplating a copper layer with the required thickness on the exposed copper skin of the circuit pattern or on the hole wall; S7: Demolding, immersing the circuit board in a demolding device, soaking the circuit board with a demolding liquid, so that the electroplated covering film layer is removed and the non-circuit copper layer is exposed; S8: Etching, using chemical reaction to corrode the copper layer in non-circuit areas; S9: Forming, punching into the desired shape through a die.

[0005] The demoulding device described in the manufacturing process S7 includes a fixed frame, a soaking tank and a storage box; a soaking tank is placed under the fixed frame; demoulding liquid is stored in the soaking tank; a storage box is placed under the fixed frame, and the width of the storage box is smaller than the width of the upper opening of the soaking tank; it also includes a cleaning plate, a first interception net, a water pipe, a pump, a conveying component and a sliding component; a plurality of limit grooves are provided on the storage box; a conveying component is provided on the fixed frame; a sliding component is installed on the storage box; a cleaning plate for cleaning the film on the surface of the circuit board is provided on the sliding component, and a plurality of notches for matching the limit grooves to limit the circuit board are provided on the cleaning plate; a plurality of drainage grooves for draining liquid during movement are provided on the cleaning plate; the storage box is provided with two upper and lower openings, and a first interception net for facilitating the removal of the film is detachably connected to the lower opening of the storage box; a plurality of water pipes for maintaining a consistent concentration of the demoulding liquid are connected to the left and right sides of the storage box; each water pipe is connected to a pump, and the opening on each water pipe is located above the storage box, and one end of each water pipe connected to the corresponding pump output end is rotatably connected to the pump output end.

[0006] As a preferred technical solution of the present invention, the conveying assembly includes a first slide rail, a first electric slider, a connecting plate and an electric push rod; two first slide rails are fixedly connected to the fixed frame; each first slide rail is slidably connected to a first electric slider; the two first electric sliders are commonly fixedly connected to a connecting plate; a number of electric push rods are fixedly connected to the connecting plate; the telescopic ends of the several electric push rods are connected to the upper side of the storage box by magnetic attraction.

[0007] As a preferred technical solution of the present invention, the sliding assembly includes a second slide rail and a second electric slider; a plurality of second slide rails are fixedly connected to the storage box; and each second slide rail is slidably connected to a second electric slider.

[0008] As a preferred technical solution of the present invention, it also includes a sealing plate; each second slide rail is detachably connected to a sealing plate on one side facing the cleaning plate to prevent the second slide rail and the second electric slider from being corroded by the stripping liquid; the cleaning plate is made of magnetic material, and a magnet is provided on the side of the second electric slider facing the cleaning plate, and all the second electric sliders drive the cleaning plate to move through magnetic attraction.

[0009] As a preferred technical solution of the present invention, it also includes a second interception net; a plurality of second interception nets are connected to the cleaning board to prevent the film from adhering to the circuit board, and each second interception net is made of elastic material; each second interception net is located at an adjacent drainage trough.

[0010] As a preferred technical solution of the present invention, the first interception net is configured in a V shape.

[0011] As a preferred technical solution of the present invention, a rotating rod is arranged in the middle of each second intercepting net, and each rotating rod slides on the cleaning plate.

[0012] As a preferred technical solution of the present invention, it also includes a guide plate; a guide plate for guiding water flow to the surface of the circuit board is fixedly connected to the lower side of each drainage groove of the cleaning plate; each guide plate has a spacing between it and the adjacent circuit board.

[0013] As a preferred technical solution of the present invention, each guide piece is configured to be in an inverted V shape.

[0014] The beneficial effects are as follows: the present invention realizes the cleaning of the film attached to the circuit board by the cleaning plate, and is also used to automatically clean the film that is easy to fall off the surface of the circuit board, thereby optimizing the production process, improving efficiency, and reducing manual labor; The stripping liquid is circulated in the storage box through the water pipe, and the flowing stripping liquid is used to avoid the phenomenon of long concentration autonomous diffusion time, thereby avoiding incomplete stripping of the circuit board; The compressed second interception net cooperates with the water pipe so that the film is guided and intercepted by the V-shaped second interception net when flowing to the drainage trough, so that the film cannot adhere to the surface of the circuit board again; The expanded second interception net pushes the circuit board upward during the rising process, so that the circuit board is lifted out of the storage box, thereby facilitating workers to take out the circuit board later, thereby improving the convenience of using the device; The guide piece is used to reduce the accumulation of film at the drainage groove to ensure the normal flow of the stripping liquid. At the same time, by setting the guide piece in an inverted V shape, smaller films cannot pass over the guide piece and adhere to the surface of the circuit board, thereby improving the stripping effect of the device on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 This is a diagram of the storage box of the present invention in a hoisting state; Figure 3 is a cross-sectional view of a storage box of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the storage box and the cleaning plate combination of the present invention; Figure 5 It is a schematic diagram of the combined three-dimensional structure of the storage box, the cleaning plate and the first interception net of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the sliding assembly of the present invention; Figure 7 A front view of the cleaning plate and the second interception net of the present invention; Figure 8It is a schematic diagram of the three-dimensional structure of the cleaning plate and the guide piece of the present invention; Fig. 9 It is a schematic diagram of the three-dimensional structure of the storage box, cleaning plate and guide plate combination of the present invention.

[0016] Among them: 1-fixed frame, 2-immersion tank, 3-storage box, 3001-limiting groove, 4-circuit board, 5-cleaning plate, 5001-drainage groove, 6-first interception net, 101-first slide rail, 102-first electric slider, 103-connecting plate, 104-electric push rod, 105-water pipe, 106-pump, 107-second slide rail, 108-second electric slider, 109-sealing plate, 110-second interception net, 201-guide plate. DETAILED DESCRIPTION

[0017] The technical solution is further described below in conjunction with specific embodiments. It should be noted that the words indicating directions such as up, down, left, and right mentioned in this article are only for the position of the structure shown in the corresponding drawings. The serial numbers of the parts in this article, such as first, second, etc., are only used to distinguish the objects described and do not have any order or technical meaning. The words such as connection and coupling in this application include direct and indirect connection (coupling) unless otherwise specified.

[0018] Example 1 A manufacturing process of a multi-layer high-density circuit board includes the following steps: S1: Cutting, cutting the required substrate into sizes suitable for the production process for subsequent processing; S2: Inner layer pattern production, after the double-sided copper-clad substrate is etched to form the inner layer circuit, the bonding force between the copper foil and the resin is strengthened by browning; S3: Lamination, forming a multi-layer circuit board by stacking the inner layer board, prepreg and copper foil in sequence and hot pressing them; S4: Drilling, making holes on the circuit board to facilitate interconnection between layers; S5: Copper deposition, attaching conductive metal copper to the holes to interconnect the layers; S6: Electroplating: electroplating a copper layer with the required thickness on the exposed copper skin of the circuit pattern or on the hole wall; S7: Demolding, immersing the circuit board in a demolding device, soaking the circuit board with a demolding liquid, so that the electroplated covering film layer is removed and the non-circuit copper layer is exposed; S8: Etching, using chemical reaction to corrode the copper layer in non-circuit areas; S9: Forming, punching into the desired shape through a die.

[0019] like Figure 1-Figure 7As shown, the demoulding device described in the manufacturing process S7 includes a fixing frame 1, a soaking pool 2 and a storage box 3; the soaking pool 2 is placed below the fixing frame 1; the soaking pool 2 stores demoulding liquid; the storage box 3 is placed below the fixing frame 1, and the width of the storage box 3 is smaller than the width of the upper opening of the soaking pool 2; It also includes a cleaning plate 5, a first intercepting net 6, a water pipe 105, a pump 106, a conveying assembly and a sliding assembly; a plurality of limit grooves 3001 are arranged on the storage box 3; a conveying assembly is arranged on the fixed frame 1; a sliding assembly is installed on the storage box 3; a cleaning plate 5 is arranged on the sliding assembly, and a plurality of notches are opened on the cleaning plate 5; a plurality of drainage grooves 5001 are opened on the cleaning plate 5; the storage box 3 is provided with two upper and lower openings, and the first intercepting net 6 is bolted to the lower opening of the storage box 3; two water pipes 105 are connected to the left and right sides of the storage box 3; each water pipe 105 is connected to a pump 106, and the opening on each water pipe 105 is located above the storage box 3, and one end of each water pipe 105 connected to the corresponding output end of the pump 106 is rotatably connected to the output end of the pump 106, so that when the circuit board 4 is placed, the direction of the water pipe 105 can be rotated to adjust to avoid the placement of the circuit board 4.

[0020] The conveying assembly includes a first slide rail 101, a first electric slider 102, a connecting plate 103 and an electric push rod 104; two first slide rails 101 are fixedly connected to the fixed frame 1; each first slide rail 101 is slidably connected to a first electric slider 102; the two first electric sliders 102 are commonly fixedly connected to a connecting plate 103; four electric push rods 104 are fixedly connected to the connecting plate 103; the telescopic ends of several electric push rods 104 are connected to the upper side of the storage box 3 by magnetic attraction.

[0021] The sliding assembly includes a second slide rail 107 and a second electric slider 108 . Four second slide rails 107 are fixedly connected to the storage box 3 . A second electric slider 108 is slidably connected to each second slide rail 107 .

[0022] It also includes a sealing plate 109; each second slide rail 107 is bolted to a sealing plate 109 on one side facing the cleaning plate 5; the cleaning plate 5 is made of magnetic material, and a magnet is provided on the side of the second electric slider 108 facing the cleaning plate 5, and all the second electric sliders 108 drive the cleaning plate 5 to move through the magnetic attraction.

[0023] It also includes a second interception net 110; a plurality of second interception nets 110 are connected to the cleaning plate 5, and each second interception net 110 is made of elastic material; each second interception net 110 is located at an adjacent drainage trough 5001.

[0024] The first interception net 6 is set in a V shape to concentrate the film, making it easier for subsequent workers to collect and clean it, while preventing the film from clogging the first interception net 6.

[0025] A rotating rod is arranged in the middle of each second intercepting net 110 , and each rotating rod slides on the cleaning plate 5 .

[0026] Before immersing the circuit board 4 in the stripping liquid, the worker first passes the circuit board 4 through each limiting groove 3001, and then allows the circuit board 4 to pass through the notch on the cleaning plate 5 under the guidance of the limiting groove 3001. Under the restriction of the limiting groove 3001 and the cleaning plate 5, two adjacent circuit boards 4 cannot contact each other, preventing the contacting parts of the circuit boards 4 from being difficult to contact the stripping liquid. Then, when each limiting groove 3001 is filled with circuit boards 4, all electric push rods 104 are started to extend, so that the telescopic ends of the electric push rods 104 are adsorbed on the upper side of the storage box 3 by magnetic attraction, and then the electric push rods 104 are controlled to retract, so that the storage box 3 is lifted , then start the two first electric sliders 102 to drive the connecting plate 103 to move to the right, and then drive the electric push rod 104 and the storage box 3 to move to the right, so that the storage box 3 moves to the top of the immersion tank 2, and finally start the electric push rod 104 to extend, and slowly put the storage box 3 into the immersion tank 2, so that the storage box 3 is completely submerged in the stripping liquid, and then use the stripping liquid to dissolve the film on the surface of the circuit board 4, and then lift the storage box 3 out of the immersion tank 2 after soaking for a period of time, and the worker uses clean water to rinse the circuit board 4 in the storage box 3, and cleans the residual stripping liquid and film on the circuit board 4 to complete the stripping work of the circuit board 4.

[0027] During the immersion of the circuit board 4, the film on the circuit board 4 may fall off. If the fallen film is small, the small film will float in the demoulding liquid. If the fallen film is large, the large film will be deposited in the demoulding liquid. Regardless of whether it is a small film or a large film, it may still be reattached to the circuit board 4 after it falls off the circuit board 4, or even attached to the area of ​​the circuit board 4 where the film has not yet reacted completely with the demoulding liquid, affecting the reaction effect of the remaining films on the circuit board 4 with the demoulding liquid, making the overall demoulding effect of the circuit board 4 uneven within a specified time. In order to avoid this phenomenon, during the demoulding process of the circuit board 4, the second electric slider 108 is started to move downward. Since a magnet is provided on the side of the second electric slider 108 facing the cleaning plate 5, and a sealing plate 109 for isolating the solution is provided between each second electric slider 108 and the cleaning plate 5, and at the same time, the cleaning plate 5 is made of a magnetic material, and then during the downward movement of the second electric slider 108, the cleaning plate 5 is also synchronously driven to slide downward, so that the cleaning plate 5 slides downward against the surface of each circuit board 4, thereby The attached detached film is scraped downward, and then after the cleaning plate 5 moves downward and separates from the circuit board 4, the second electric slider 108 drives the cleaning plate 5 to slide upward and reset, and so on, so that during the demoulding process of the circuit board 4, the cleaning plate 5 continues to scrape downward the detached film attached to the surface of the circuit board 4 to prevent the detached film from re-attaching to the circuit board 4 and affecting the reaction effect of the remaining films on the circuit board 4 with the demoulding liquid. It should be noted that during the downward movement of the cleaning plate 5, the demoulding liquid flows through the drainage groove 5001, and it should be further noted that during the downward sliding process of the cleaning plate 5 against the surface of the circuit board 4, the cleaning plate 5 can also push off the film that is easy to fall off the surface of the circuit board 4. In this way, during the demoulding process of the circuit board 4, the film on the circuit board 4 is automatically cleaned by the cleaning plate 5. When the circuit board 4 is subsequently transferred, there is no need for workers to use clean water to rinse the circuit board 4 in the storage box 3. In this way, the cleaning plate 5 used to clean the film attached to the circuit board 4 is also used to automatically clean the film that is easy to fall off the surface of the circuit board 4, thereby optimizing the production process, improving efficiency, and reducing manual labor.

[0028] It is also taken into consideration that if the film that falls off the circuit board 4 and the film that is scraped off by the cleaning plate 5 accumulate in the solution for a long time, the film is easily decomposed in the solution due to the corrosiveness of the stripping solution, resulting in a decrease in the solubility of the stripping solution and a deterioration in the stripping effect. Therefore, when the storage box 3 is lifted out of the immersion tank 2, the film that is scraped off the cleaning plate 5 is scooped out of the immersion tank 2 together with the deposited film through the first interception net 6. Subsequent workers only need to clean the film on the first interception net 6, so that there is no film residue in the immersion tank 2, thereby extending the service life of the stripping solution.

[0029] It is also considered that when the storage box 3 is lifted out of the immersion pool 2, the cleaning plate 5 is first lowered to the lower side of the storage box 3, and then the cleaning plate 5, the first interception net 6 and the second interception net 110 are used to restrict the film to prevent the storage box 3 from flowing out of the drainage groove 5001 driven by the water flow and re-attaching to the surface of the circuit board 4 during the rising process. When the cleaning plate 5 moves downward to clean the film that is easy to fall off and adhere to the surface of the circuit board 4, the cleaning plate 5 will scrape the loose film that has not completely reacted on the surface of the circuit board 4, causing the loose film that has not completely reacted on the surface of the circuit board 4 to loosen, causing the completely loose film to easily fall off after the cleaning plate 5 passes. During the upward resetting process of the cleaning plate 5, the cleaning plate 5 scrapes it and collects it on the upper surface of the cleaning plate 5, which will cause the film to re-attach to the surface of the circuit board 4. At this time, the cleaning plate 5 cannot drive the film above it to push to the first interception net 6, resulting in affecting the demolding of the circuit board 4. Therefore, during the rising process of the cleaning plate 5, if Figure 7 As shown, the second interception net 110 is in a compressed state through two adjacent circuit boards 4, so that after each second interception net 110 is squeezed, the rotating rod connecting the second interception net 110 and the cleaning plate 5 rotates, thereby causing the second interception net 110 to contract, so that each second interception net 110 is in a V shape. It should be noted that: in the initial state, the second interception net 110 can expand through its own elasticity, and when the second interception net 110 is in an expanded state, the second interception net 110 drives the rotating rod to rotate, and the rotating rod also slides upward on the cleaning plate 5; When the circuit board 4 compresses the second interception net 110 in a V-shaped state, when the cleaning plate 5 moves downward, the film scraped by the cleaning plate 5 cannot float upward through the drainage groove 5001 due to the obstruction of the second interception net 110, thereby preventing the film from passing over the cleaning plate 5. When the cleaning plate 5 moves upward, it contacts the circuit board 4 through the second interception net 110, and the second interception net 110 is used to scrape the film on the circuit board 4, so that the film is collected on the V-shaped second interception net 110, thereby preventing the scraped film from passing over the second interception net 110 and adhering to the circuit board 4 again.

[0030] It is also taken into consideration that when the cleaning plate 5 descends to the bottom of the storage box 3, the second interception net 110 is completely separated from the lower side of the circuit board 4, thereby causing the V-shape to lose the restricted expansion of the circuit board 4. When the second interception net 110 is expanded, the unfolded width of the second interception net 110 is greater than the thickness of the circuit board 4. Then, when the storage box 3 is lifted out of the immersion tank 2, in order to facilitate the workers to take out the circuit board 4, the cleaning plate 5 is driven to move upward by starting the second electric slider 108. At this time, since the second interception net 110 is in an unfolded state, the second interception net 110 is against the lower side of the adjacent circuit board 4 during the rising process, thereby pushing the circuit board 4 upward, and lifting the circuit board 4 out of the storage box 3, thereby facilitating the workers to take out the circuit board 4 later, thereby improving the convenience of the device when used.

[0031] At the same time, considering that after the stripping liquid reacts with the thin film on the surface of the circuit board 4, there is a concentration difference between the consumption area close to the circuit board and the area far away from the circuit board, and this difference requires the solution to diffuse and replenish itself. In this process, the circuit board is in a state of continuous stripping, and the autonomous diffusion of the solution takes time, resulting in the circuit board being unable to completely and effectively precipitate the thin film on its surface after being fished out for the originally set stripping time, causing the thin film in some areas of the circuit board to adhere more firmly. In order to avoid this phenomenon, when the lower side of the storage box 3 is attached to the bottom of the immersion tank 2, the storage box 3 stores stripping liquid, and then the pump 106 is started to pump liquid from the water pipe 105, so that the lower end of the water pipe 105 draws the solution at the bottom of the storage box 3, and then it is re-discharged to the upper side of the storage box 3 through the upper end of the water pipe 105, thereby generating a stripping liquid circulation in the storage box 3, so that the stripping liquid flows from top to bottom and is then pumped away by the water pipe 105, thereby generating stripping liquid on the surface of the circuit board 4. Flow, using the flowing stripping liquid to avoid the phenomenon of long autonomous diffusion time of concentration, thereby avoiding incomplete stripping of the circuit board 4. At the same time, the downward-flowing stripping liquid can also drive the floating film to flow downward, so that the film is intercepted on the first interception net 6, further avoiding the phenomenon of the film adhering to the circuit board 4. Since the storage box 3 is far away from the water pipe 105, the fluidity of the solution above the storage box 3 is poor, so the film cannot be cleaned off by the flow of the solution. Therefore, the setting of the cleaning plate 5 is necessary. At the same time, since the stripping liquid in the storage box 3 always flows from top to bottom, the film on the second interception net 110 is always pressed on the second interception net 110 by the flow of the stripping liquid, and the film is collected on the second interception net 110. Even if a small amount of film passes over the cleaning plate 5 and is above the cleaning plate 5, it cannot adhere to the surface of the circuit board 4 under the action of the second interception net 110 and the flow of the stripping liquid.

[0032] Example 2 On the basis of Example 1, Figure 8 and Fig. 9 As shown, a guide piece 201 is also included; a guide piece 201 is fixedly connected to the lower side of each drainage groove 5001 of the cleaning plate 5; and a distance is left between each guide piece 201 and the adjacent circuit board 4.

[0033] Each guide piece 201 is configured in an inverted V shape.

[0034] During the reciprocating lifting and lowering process of the cleaning plate 5, small films tend to float and accumulate in the drainage groove 5001, which will cause the fluidity of the solution originally above the storage box 3 to be poor, and will further affect the flow of the solution when it is blocked by the floating film. Therefore, by setting the guide plate 201, when the cleaning plate 5 is lowered and then raised, after the stripping liquid passes through the guide plate 201, the stripping liquid first flows from the upper side of each guide plate 201, and then flows to the left and right sides of the guide plate 201 respectively, and finally flows to the two adjacent circuit boards 4. In this process, since the flow rate on the left and right sides behind the guide plate 201 is greater than the flow rate on the lower side of the guide plate 201, the scraped film is gathered on the lower side of the guide plate 201 under the action of the flow rate difference, thereby reducing the accumulation of film at the drainage groove 5001 and ensuring the normal flow of the stripping liquid. At the same time, by setting the guide plate 201 to an inverted V shape, when a smaller film is scraped off, it is temporarily The accumulated film on the lower side of the inverted V-shaped guide sheet 201 prevents the smaller film from passing over the guide sheet 201 and adhering to the surface of the circuit board 4 during the descending process of the cleaning plate 5, thereby improving the film stripping effect of the device on the circuit board 4. Furthermore, the inverted V-shaped guide sheet 201 can also guide the film stripping liquid to rush to the surface of the circuit board 4 and then flow downward, so that the film stripping liquid directly rushes to the surface of the circuit board 4, and the film is easier to detach from the surface of the circuit board 4 with the scraping of the cleaning plate 5, thereby improving the cleaning effect of the device on the film on the circuit board 4. At the same time, when the guide sheet 201 drives the film to approach the first interception net 6, since this area is in the suction area at the lower end of the water pipe 105, the lower side of the guide sheet 201 and a small amount of film accumulated on the drainage groove 5001 are attached to the first interception net 6 under the action of suction, and then when the cleaning plate 5 moves upward, the film cannot move upward with the cleaning plate 5, thereby further avoiding the phenomenon of film re-adhesion.

[0035] The above embodiments are provided for persons familiar with the art to implement or use the present invention. Personnel familiar with the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope of the innovative features mentioned in the claims.

Claims

1. A process for manufacturing a multi-layer high-density circuit board comprises the following steps: S1: Cutting, cutting the required substrate into sizes suitable for the production process for subsequent processing; S2: Inner layer pattern production, after the double-sided copper-clad substrate is etched to form the inner layer circuit, the bonding force between the copper foil and the resin is strengthened by browning; S3: Lamination, forming a multi-layer circuit board by stacking the inner layer board, prepreg and copper foil in sequence and hot pressing them; S4: Drilling, making holes on the circuit board to facilitate interconnection between layers; S5: Copper deposition, attaching conductive metal copper to the holes to interconnect the layers; S6: Electroplating: electroplating a copper layer with the required thickness on the exposed copper skin of the circuit pattern or on the hole wall; S7: Demolding, immersing the circuit board in a demolding device, soaking the circuit board with a demolding liquid, so that the electroplated covering film layer is removed and the non-circuit copper layer is exposed; S8: Etching, using chemical reaction to corrode the copper layer in non-circuit areas; S9: Forming, punching into the desired shape through a die.

2. According to the manufacturing process of a multi-layer high-density circuit board according to claim 1, the mold removal device in the manufacturing process S7 is characterized by: The invention comprises a fixed frame (1), a soaking pool (2) and a storage box (3); the soaking pool (2) is placed below the fixed frame (1); a stripping liquid is stored in the soaking pool (2); the storage box (3) is placed below the fixed frame (1), and the width of the storage box (3) is smaller than the width of the upper opening of the soaking pool (2); the invention also comprises a cleaning plate (5), a first intercepting net (6), a water pipe (105), a pump (106), a conveying assembly and a sliding assembly; a plurality of limiting grooves (3001) are arranged on the storage box (3); the conveying assembly is arranged on the fixed frame (1); the sliding assembly is installed on the storage box (3); a cleaning plate (5) for cleaning a thin film on the surface of a circuit board (4) is arranged on the sliding assembly, and a slot is opened on the cleaning plate (5) There are a plurality of notches for matching with the limit groove (3001) to limit the circuit board (4); a plurality of drainage grooves (5001) for discharging liquid when moving are provided on the cleaning plate (5); the storage box (3) is provided with two upper and lower openings, and a first interception net (6) is detachably connected to the lower opening of the storage box (3) for facilitating the removal of the film; the left and right sides of the storage box (3) are connected to a plurality of water pipes (105) for maintaining a consistent concentration of the stripping liquid; each water pipe (105) is connected to a pump (106), the upper opening of each water pipe (105) is located above the storage box (3), and one end of each water pipe (105) connected to the output end of the corresponding pump (106) is rotatably connected to the output end of the pump (106).

3. The manufacturing process of a multi-layer high-density circuit board according to claim 2 is characterized in that: The conveying assembly comprises a first slide rail (101), a first electric slider (102), a connecting plate (103) and an electric push rod (104); two first slide rails (101) are fixedly connected to the fixed frame (1); each first slide rail (101) is slidably connected to a first electric slider (102); the two first electric sliders (102) are commonly fixedly connected to a connecting plate (103); a plurality of electric push rods (104) are fixedly connected to the connecting plate (103); and the telescopic ends of the plurality of electric push rods (104) are connected to the upper side of the storage box (3) by means of magnetic attraction.

4. The manufacturing process of a multi-layer high-density circuit board according to claim 2 is characterized in that: The sliding assembly comprises a second sliding rail (107) and a second electric sliding block (108); a plurality of second sliding rails (107) are fixedly connected to the storage box (3); and each second sliding rail (107) is slidably connected to a second electric sliding block (108).

5. The manufacturing process of a multi-layer high-density circuit board according to claim 4 is characterized in that: It also includes a sealing plate (109); one side of each second slide rail (107) facing the cleaning plate (5) is detachably connected to the sealing plate (109) to prevent the second slide rail (107) and the second electric slider (108) from being corroded by the stripping liquid; the cleaning plate (5) is made of a magnetic material, and a magnet is provided on the side of the second electric slider (108) facing the cleaning plate (5), and all the second electric sliders (108) drive the cleaning plate (5) to move by magnetic attraction.

6. The manufacturing process of a multi-layer high-density circuit board according to claim 5 is characterized in that: It also includes a second interception net (110); a plurality of second interception nets (110) are connected to the cleaning plate (5) to prevent the film from adhering to the circuit board (4), and each second interception net (110) is made of elastic material; each second interception net (110) is located at an adjacent drainage groove (5001).

7. The manufacturing process of a multi-layer high-density circuit board according to claim 2 is characterized in that: The first interception net (6) is arranged in a V shape.

8. The manufacturing process of a multi-layer high-density circuit board according to claim 6 is characterized in that: A rotating rod is provided in the middle of each second intercepting net (110), and each rotating rod slides on the cleaning plate (5).

9. The manufacturing process of a multi-layer high-density circuit board according to claim 2 is characterized in that: It also includes a guide sheet (201); a guide sheet (201) is fixedly connected to the lower side of each drainage groove (5001) of the cleaning plate (5) for guiding water flow to the surface of the circuit board (4); and a spacing is left between each guide sheet (201) and the adjacent circuit board (4).

10. The manufacturing process of a multi-layer high-density circuit board according to claim 9, characterized in that: Each guide piece (201) is configured in an inverted V shape.

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