Shell of electronic equipment and electronic equipment

Abstract

The invention provides a shell of electronic equipment and the electronic equipment. The shell is of a multi-layer composite structure and comprises at least one high-heat-conduction film layer, the two sides of each high-heat-conduction film layer are each provided with at least one high-modulus film layer, the high-heat-conduction film layers and the high-modulus film layers are arranged in a stacked mode, the heat conduction coefficient of the high-heat-conduction film layers is larger than or equal to 100 W / m * K, and the elasticity modulus of the high-modulus film layers is larger than or equal to 70 GPa. According to the shell, the shell of the electronic equipment has high rigidity and relatively high heat conduction capability, so that internal heat of the electronic equipment can be quickly conducted to the outside of the electronic equipment.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular to a housing of an electronic equipment and the electronic equipment. Background Art

[0002] With the improvement of mobile phone performance and the extreme thinness of design, the internal space is getting smaller and smaller, and the requirements for heat dissipation of products are getting higher and higher. In order to improve the heat dissipation capacity of mobile phones, a vacuum chamber (VC) heat spreader, graphite sheet, graphene sheet, thermal conductive silicone grease, etc. are set as heat dissipation plates to dissipate heat from the mobile phone. The above heat dissipation method only solves the problem of uniform heat dispersion inside. If the heat dissipation of the back cover of the mobile phone is not good, the internal heat lacks a channel to be discharged from the inside to the outside, which will also cause the mobile phone to heat up seriously. The accumulation of heat will affect the life of the battery and cause the running speed of the mobile phone to decrease. The materials commonly used for the back cover of mobile phones include plastic, metal, plain leather, glass, ceramic and other materials. In order to pursue texture, the back cover of various terminal mobile phones is currently made of glass as the mainstream material, and ceramics, plain leather and other materials are also used, all of which do not have a good heat dissipation effect. The back cover of metal materials has a good heat dissipation effect, but it is easy to deform and oxidize, and at the same time affects the signal. The plastic back cover has the advantages of light weight and not easy to break, but its rigidity is poor, it is easy to deform, and the heat dissipation performance of the current plastic back cover is also poor. Therefore, there is currently a lack of a mobile phone back cover with high thermal conductivity and high rigidity that can quickly export internal heat to the external environment and improve the heat dissipation capacity of the mobile phone. Summary of the invention

[0003] The present application provides a housing of an electronic device and an electronic device, so that the housing of the electronic device has high rigidity and high thermal conductivity, so as to quickly conduct the internal heat of the electronic device to the outside of the electronic device.

[0004] In a first aspect, the present application provides a shell of an electronic device, wherein the shell is a multi-layer composite structure, including at least one high thermal conductivity film layer, at least one high modulus film layer is provided on both sides of the high thermal conductivity film layer, the high thermal conductivity film layer and the high modulus film layer are stacked, the thermal conductivity of the high thermal conductivity film layer is ≥100W / m*K, and the elastic modulus of the high modulus film layer is ≥70GPa.

[0005] The shell of the electronic device provided in the present application is a multi-layer composite structure, including at least one layer of high thermal conductivity film layer. The thermal conductivity of the high thermal conductivity film layer is ≥100W / m*K. Among them, at least one layer of high modulus film layer is provided on both sides of the high thermal conductivity film layer, and the high modulus film layer and the high thermal conductivity film layer are stacked, and the elastic modulus of the high modulus film layer is ≥70GPa. The shell utilizes the high thermal conductivity film layer to achieve rapid heat conduction, and utilizes the high modulus film layer to enhance the rigidity of the shell, so that it has a higher ability to resist deformation. Therefore, the shell of the present application has high rigidity and high thermal conductivity, so as to quickly conduct the internal heat of the electronic device to the outside of the electronic device.

[0006] In an optional implementation, the thermal conductivity of the high modulus film layer is also ≥100 W / m*K, and the high thermal conductivity film layer is also ≥70 GPa. In this method, the high thermal conductivity module and the high modulus film layer have the characteristics of high thermal conductivity and high modulus at the same time, further improving the thermal conductivity and stiffness of the shell.

[0007] In an optional implementation, the high thermal conductivity film layer and the high modulus film layer can be prepared from the same material, which can simplify the material composition and preparation process.

[0008] In an optional implementation, the thickness of a single layer of the high thermal conductivity film layer is 0.01 to 0.3 mm, and the thickness of a single layer of the high modulus film layer is 0.01 to 0.3 mm. If the thickness of a single layer of the high thermal conductivity film layer and a single layer of the high modulus film layer is too low, the effect of high thermal conductivity and high stiffness cannot be achieved. If the thickness of a single layer of the high thermal conductivity film layer and a single layer of the high modulus film layer is too thick, the total thickness of the shell will increase.

[0009] In an optional implementation, the number of layers of the high thermal conductivity film layer is one, and the number of layers of the high modulus film layer on either side of the high thermal conductivity film layer is greater than or equal to 2. Increasing the number of layers of the high modulus film layer can help improve the rigidity of the housing and reduce the deformation of the housing.

[0010] In an optional implementation, the high thermal conductivity film layer includes at least one of a graphene film layer, a graphite film layer, a boron nitride film layer, a nanosilver layer, a pitch-based carbon fiber film layer, a carbon / carbon composite film layer, a carbon / ceramic composite film layer, a diamond film layer, a silicon carbide film layer, a boron oxide film layer, and an aluminum nitride film layer. In an optional implementation, the high modulus film layer includes at least one of a glass fiber film layer, a PAN-based carbon fiber film layer, a ceramic fiber film layer, an aramid fiber film layer, a polyimide fiber film layer, a pitch-based carbon fiber film layer, a carbon / carbon composite film layer, a carbon / ceramic composite film layer, a diamond film layer, a silicon carbide film layer, a boron oxide film layer, and an aluminum nitride film layer. Among them, any one of the pitch-based carbon fiber film layer, the carbon / carbon composite film layer, the carbon / ceramic composite film layer, the diamond film layer, the silicon carbide film layer, the boron oxide film layer, and the aluminum nitride film layer can be used as both a high thermal conductivity film layer and a high modulus film layer.

[0011] In an optional implementation, when the high thermal conductivity film layer and the high modulus film layer contain fibers, the fibers in any layer are unidirectionally laid fibers, and the laying directions of the fibers in any two adjacent layers are arranged at an angle of 90°. By staggered laying, the shell can be endowed with high thermal conductivity and high modulus in different directions, which can further improve the thermal conductivity and stiffness of the shell.

[0012] In an optional implementation, the housing includes a signal enhancement area, and the material of the high thermal conductivity film layer and the high modulus film layer corresponding to the signal enhancement area is an insulating material. By setting the signal enhancement area in a specific area of ​​the housing, the housing can be prevented from affecting the transmission of the signal.

[0013] In a second aspect, the present application provides an electronic device, which includes a housing of each possible implementation manner in the first aspect of the present application.

[0014] The technical effects that can be achieved in the above-mentioned second aspect can be described with reference to the corresponding effects in the above-mentioned first aspect, and will not be repeated here.

[0015] Among them, the data in the above-mentioned possible implementation methods of the present application, such as the thermal conductivity of the high thermal conductivity film layer, the elastic modulus of the high modulus film layer, the thickness of the high thermal conductivity film layer, the thickness of the high modulus film layer and other data, when measuring, the values ​​within the range of engineering measurement error should be understood to be within the range specified in the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a mobile phone housing according to an embodiment;

[0017] Figure 2 is a schematic structural diagram of a housing in another embodiment;

[0018] Figure 3This is a schematic diagram of the thickness direction structure of a shell of an embodiment of the present application;

[0019] Figure 4 A schematic diagram of the structure of a shell in the thickness direction of another embodiment of the present application;

[0020] Figure 5 is a schematic structural diagram of a housing in another embodiment;

[0021] Figure 6 This is a schematic structural diagram of a shell in the thickness direction of an embodiment of the present application;

[0022] Figure 7 This is a schematic structural diagram of a shell in the thickness direction of an embodiment of the present application;

[0023] Figure 8 This is a schematic structural diagram of a shell in the thickness direction of an embodiment of the present application;

[0024] Fig. 9 This is a schematic structural diagram of a shell in the thickness direction of an embodiment of the present application;

[0025] Fig.10 This is a schematic structural diagram of the thickness direction of the shell corresponding to the signal enhancement area of ​​one embodiment of the present application.

[0026] Reference numerals:

[0027] 10-shell; 01-avoidance hole; 02-signal enhancement area; 11-high thermal conductivity film layer; 12-high modulus film layer; 13-appearance layer. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0029] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0030] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0031] Electronic devices, such as mobile phones, tablet computers, laptops, watches, etc., usually include display screens, processing chips, batteries, and housings. The display screen and housing are assembled to form a storage space, and electrical components such as processing chips and batteries are placed in the above storage space. The processing chip and battery will generate a lot of heat during operation, and this part of the heat needs to be transferred to the outside of the electronic device through the housing. Figure 1 FIG. 1 is a schematic diagram of the structure of a mobile phone housing according to an embodiment of the present invention. Figure 1 As shown, the housing 10 is a rear cover of a mobile phone. A avoidance hole 01 can be provided at the portion where the camera is provided, so that the camera is exposed to the outside. Figure 2 FIG. 1 is a schematic diagram of the structure of the housing 10 of another embodiment. Figure 2 As shown, the housing 10 and Figure 1 The difference of the housing 10 shown is that, in addition to the avoidance hole 01, a signal enhancement area 02 is also provided. The signal enhancement area 02 is used to improve the transmittance of the signal and reduce the signal loss. The specific setting of the signal enhancement area 02 will be described later.

[0032] Figure 3 FIG. 1 is a schematic diagram of the thickness direction structure of the housing 10 according to an embodiment of the present application. Figure 3 As shown, the housing 10 of this embodiment includes a high thermal conductivity film layer 11 and a high modulus film layer 12. The high thermal conductivity film layer 11 is at least one layer. At least one high modulus film layer 12 is provided on both sides of the high thermal conductivity film layer 11. Figure 3 The number of layers of the high thermal conductivity film layer 11 is one layer, and a high modulus film layer 12 is respectively arranged on both sides of the high thermal conductivity film layer 11. The high thermal conductivity film layer 11 and the high modulus film layer 12 are stacked.

[0033] The thermal conductivity of the high thermal conductivity film layer 11 is ≥100 W / m*K, such as ≥120 W / m*K, and another example is ≥150 W / m*K. The high thermal conductivity film layer 11 with a thermal conductivity of ≥100 W / m*K can achieve rapid heat conduction, so as to quickly transfer the heat in the housing 10 to the outside through the high thermal conductivity film layer 11 to achieve heat dissipation.

[0034] The number of layers of the high thermal conductivity film layer 11 can be one layer. The thickness of a single layer of the high thermal conductivity film layer 11 can be 0.01 to 0.3 mm. If the thickness of the high thermal conductivity film layer 11 is too small, a good thermal conductivity effect cannot be achieved. If the thickness of the high thermal conductivity film layer 11 is too thick, it will affect the overall thickness of the housing 10, and further affect the volume and weight of the electronic device.

[0035] The high thermal conductivity film layer 11 can be selected from at least one of a graphene film layer, a graphite film layer, a boron nitride film layer and a nanosilver layer. At the same time, the high thermal conductivity film layer 11 can also be prepared from a material with high thermal conductivity and high modulus. For example, the high thermal conductivity film layer 11 can be at least one of an asphalt-based carbon fiber film layer, a carbon / carbon composite film layer, a carbon / ceramic composite film layer, a diamond film layer, a silicon carbide film layer, a boron oxide film layer, and an aluminum nitride film layer.

[0036] Exemplarily, the thickness of the asphalt-based carbon fiber membrane layer can be 0.01 to 0.3 mm, its modulus ≥ 400 GPa, and its thermal conductivity ≥ 400 W / m*K. The asphalt-based carbon fiber membrane layer can be formed into a prepreg that can be used for hot pressing or autoclave molding by pre-impregnating the resin. The pre-impregnated resin can be a thermosetting resin, such as epoxy resin, phenolic resin, bismaleimide, or a thermoplastic resin, such as polyphenylene sulfide, polyetheretherketone, polycarbonate, etc. The mass fraction of the resin in the prepreg can be adjusted from 20-60%.

[0037] Exemplarily, carbon / carbon composite film layers, carbon / ceramic composite film layers, diamond film layers, silicon carbide film layers, boron oxide film layers and aluminum nitride film layers are sheet-type thermal conductive film layers with a thickness of 0.01 to 0.3 mm, an elastic modulus ≥150 GPa, and a thermal conductivity coefficient ≥100 W / m*K, which can simultaneously achieve the characteristics of high thermal conductivity and high modulus.

[0038] Continue to refer to Figure 3 The elastic modulus of the high modulus film layer 12 is ≥70 GPa, such as ≥100 GPa, and another example is ≥120 GPa. The thickness of the single-layer high modulus film layer 12 is 0.01-0.3 mm. When the elastic modulus of the high modulus film layer 12 is ≥70 GPa, the housing 10 can have a higher rigidity to prevent the housing 10 from being deformed.

[0039] The high modulus film layer 12 can be selected from glass fiber film layers, PAN-based carbon fiber film layers, ceramic fiber film layers, aramid fiber film layers, polyimide fiber film layers and other material film layers with low thermal conductivity and high elastic modulus, and can also be selected from material film layers with both high thermal conductivity and high elastic modulus. For example, the high thermal conductivity film layer 11 can be at least one of an asphalt-based carbon fiber film layer, a carbon / carbon composite film layer, a carbon / ceramic composite film layer, a diamond film layer, a silicon carbide film layer, a boron oxide film layer, and an aluminum nitride film layer.

[0040] Among them, when preparing high modulus membrane layers 12 such as glass fiber membrane layers, polyacrylonitrile (PAN)-based carbon fiber membrane layers, ceramic fiber membrane layers, aramid fiber membrane layers, and polyimide fiber membrane layers, the fibers can first be pre-impregnated with resin to form a formable prepreg. Among them, the pre-impregnated resin can be a thermosetting resin, such as epoxy resin, phenolic resin, and bismaleimide. It can also be a thermoplastic resin, such as polyphenylene sulfide, polyetheretherketone, polycarbonate, etc. The mass fraction of the resin in the prepreg can be adjusted from 20-60%. When the high thermal conductivity film layer 11 and the high modulus film layer 12 are both made of fiber membrane layers, the fibers in any layer can be laid unidirectionally. The laying direction of the fibers between adjacent high thermal conductivity film layers 11 and high modulus film layers 12 can be at an angle of 90°.

[0041] Figure 4 FIG. 1 is a schematic diagram of the structure of the housing 10 in the thickness direction of another embodiment of the present application. Figure 4 As shown, this embodiment is Figure 3 The difference between the illustrated embodiments is that, in this embodiment, the number of layers of the high modulus film layer 12 on either side of the high thermal conductivity film layer 11 is two. When both the high thermal conductivity film layer 11 and the high modulus film layer 12 are formed using fiber film layers, the laying direction of the fibers between adjacent high modulus film layers 12 may be at an angle of 90°. By staggered laying, the shell 10 may be endowed with high thermal conductivity and high modulus properties in different directions, which may further improve the thermal conductivity and stiffness of the shell 10. During preparation, the fibers in each film layer may be laid out at a designed angle, placed in a mold, and then formed by applying a certain temperature and pressure through a hot press, autoclave, or other equipment to obtain a shell 10 with high thermal conductivity.

[0042] Refer to Figure 3 and Figure 4 In an optional embodiment, the thermal conductivity of the high thermal conductivity film layer 11 and the high modulus film layer 12 may be ≥100W / m*K, and the elastic modulus of the high thermal conductivity film layer 11 and the high modulus film layer 12 may be ≥70GPa. That is, the high thermal conductivity film layer 11 and the high modulus film layer 12 both have the characteristics of high thermal conductivity and high modulus. For example, the high thermal conductivity film layer 11 and the high modulus film layer 12 can be made of at least one of an asphalt-based carbon fiber film layer, a carbon / carbon composite film layer, a carbon / ceramic composite film layer, a diamond film layer, a silicon carbide film layer, a boron oxide film layer, and an aluminum nitride film layer. Among them, the high thermal conductivity film layer 11 and the high modulus film layer 12 can be made of different materials or the same material.

[0043] Reference Figure 2When the signal enhancement area 02 is provided in the housing 10, the material of the signal enhancement area 02 can be prepared from insulating materials. For example, the materials of the high thermal conductivity film layer 11 and the high modulus film layer 12 corresponding to the signal enhancement area 02 are both insulating materials. For example, each film layer of the signal enhancement area 02 can be prepared from materials such as glass fiber, ceramic fiber, aramid fiber, silicon nitride, aluminum oxide, or aluminum nitride.

[0044] Figure 5 FIG. 1 is a schematic diagram of the structure of the housing 10 of another embodiment. Figure 5 As shown, the housing 10 may include a high thermal conductivity film layer 11 and a high modulus film layer 12, and may also be provided with an appearance layer 13. The appearance layer 13 may be provided on a side of the high modulus film layer 12 away from the high thermal conductivity layer 11. The appearance layer 13 may be an electroplating layer, a chemical vapor deposition layer, a spray layer, an in-mold transfer layer, or a woven carbon fiber cloth layer, and the appearance layer 13 may be used to make various patterns or logos.

[0045] The housing 10 of the embodiment of the present application will be further described in detail below in combination with specific materials and specific structures.

[0046] Example 1

[0047] This embodiment is a housing 10, and its structural schematic diagram in the thickness direction is as follows Figure 6 See Figure 6 , the shell 10 of this embodiment includes a high thermal conductivity film layer 11, and two high modulus film layers 12 are arranged on both sides of the high thermal conductivity film layer 11. The outer surface of the high modulus film layer 12 located in the outermost layer is provided with an appearance layer 13. Among them, the high thermal conductivity film layer 11 and the high modulus film layer 12 are both asphalt-based fiber film layers. The thickness of each asphalt-based fiber film layer is 0.1mm. The laying direction of the fibers in each asphalt-based fiber film layer is unidirectional. If the laying direction of the fibers in the asphalt-based fiber film layer as the high thermal conductivity film layer 11 is in the 0° direction. The laying direction of the fibers in the high modulus film layer 12 bonded to the high thermal conductivity film layer 11 is in the 90° direction. That is, the laying direction of the fibers in the high thermal conductivity film layer 11 is perpendicular to the laying direction of the fibers in the adjacent high modulus film layer 12. In addition, the laying directions of the fibers in the two adjacent high modulus film layers 12 are also perpendicular, and are arranged at an angle of 90°.

[0048] The thermal conductivity of the fiber in the asphalt-based fiber membrane layer is ≥600W / m*K, and the elastic modulus is ≥600GPa. The pre-impregnated resin in the preparation process of the asphalt-based fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%. Five layers of asphalt-based fiber pre-impregnated cloth are laid in the order of 0°, 90°, 0°, 90° and 0°, and are formed by hot pressing of a mold. After forming, the avoidance hole 01 is machined to install the camera. The appearance layer 13 can be processed by electroplating, PVD, spraying, in-mold transfer or weaving carbon fiber cloth on one side of the outermost layer.

[0049] The symmetrical composite structure of multiple layers of asphalt-based fiber membranes, each layer has thermal conductivity, which can give the material high thermal conductivity and high rigidity in both the 0° and 90° directions. Among them, the thermal conductivity in the 0° direction is ≥200W / m*K, and the thermal conductivity in the 90° direction is ≥100W / m*K. The elastic modulus in the 0° direction is ≥200GPa, and the elastic modulus in the 90° direction is ≥100GPa.

[0050] Example 2

[0051] This embodiment is a housing 10, and its structural schematic diagram in the thickness direction is as follows Figure 7 See Figure 7 The housing 10 of this embodiment includes a high thermal conductivity film layer 11, and two high modulus film layers 12 are arranged on both sides of the high thermal conductivity film layer 11. The outer surface of the outermost high modulus film layer 12 is provided with an appearance layer 13. The high thermal conductivity film layer 11 is an asphalt-based fiber film layer, the two high modulus film layers 12 bonded to the high thermal conductivity film layer 11 are asphalt-based fiber film layers, and the other two high modulus film layers 12 are glass fiber film layers.

[0052] The thickness of each asphalt-based fiber membrane layer and the thickness of each glass fiber membrane layer are both 0.1 mm. The laying direction of the fibers in each asphalt-based fiber membrane layer and each glass fiber membrane layer is unidirectional. If the laying direction of the fibers in the asphalt-based fiber membrane layer serving as the high thermal conductivity membrane layer 11 is in the 0° direction. The laying direction of the fibers in the high modulus membrane layer 12 bonded to the high thermal conductivity membrane layer 11 is in the 90° direction. That is, the laying direction of the fibers in the high thermal conductivity membrane layer 11 is perpendicular to the laying direction of the fibers in the adjacent high modulus membrane layer 12. In addition, the laying directions of the fibers in the two adjacent high modulus membrane layers 12 are also perpendicular, and are arranged at an angle of 90°.

[0053] The thermal conductivity of the fiber in the asphalt-based fiber membrane layer is ≥600W / m*K, and the elastic modulus is ≥600GPa. The pre-impregnated resin in the preparation process of the asphalt-based fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%. In the glass fiber membrane layer, the elastic modulus of the glass fiber is ≥50GPa. The pre-impregnated resin for forming the glass fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%.

[0054] The shell 10 of this embodiment has a thermal conductivity of ≥50 W / m*K in the 0° direction and a thermal conductivity of ≥100 W / m*K in the 90° direction. The elastic modulus in the 0° direction is ≥50 GPa and the elastic modulus in the 90° direction is ≥100 GPa.

[0055] Example 3

[0056] This embodiment is a housing 10, and its structural schematic diagram in the thickness direction is as follows Figure 8 As shown. Figure 7 The difference between the embodiments is that the high modulus membrane layer 12 located at the outermost layer is a PAN carbon fiber membrane layer.

[0057] In the PAN carbon fiber membrane layer, the elastic modulus of the carbon fiber is ≥200 GPa. The pre-impregnated resin for forming the glass fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%.

[0058] The shell 10 of this embodiment has a thermal conductivity of ≥50 W / m*K in the 0° direction and a thermal conductivity of ≥100 W / m*K in the 90° direction. The elastic modulus in the 0° direction is ≥80 GPa and the elastic modulus in the 90° direction is ≥100 GPa.

[0059] Example 4

[0060] This embodiment is a housing 10, and its structural schematic diagram in the thickness direction is as follows Fig. 9 As shown. Figure 6 The difference of the housing 10 shown is that the high thermal conductivity film layer 11 is one layer, and is a carbon / ceramic composite film layer. The high modulus film layer 12 is four layers, and two high modulus film layers 12 are respectively arranged on both sides of the high thermal conductivity film layer 11. The high modulus film layers 12 are all PAN carbon fiber film layers.

[0061] The thickness of the PAN carbon fiber membrane layer is 0.1mm, and the elastic modulus of the carbon fiber therein is ≥200GPa. The pre-impregnated resin for forming the glass fiber membrane layer is epoxy resin, and the mass fraction of the resin is 30%. The laying direction of the fibers in the PAN carbon fiber membrane layer is as follows: Figure 6 Angled laying of the embodiment shown.

[0062] The thickness of the carbon / ceramic composite film layer is 0.1 mm, the elastic modulus is ≥ 200 GPa, and the thermal conductivity is ≥ 400 W / m*K.

[0063] The shell 10 of this embodiment has a thermal conductivity of ≥50 W / m*K in the 0° direction and a thermal conductivity of ≥50 W / m*K in the 90° direction. The elastic modulus in the 0° direction is ≥50 GPa and the elastic modulus in the 90° direction is ≥50 GPa.

[0064] Example 5

[0065] This embodiment is a housing 10, and its appearance and structure are as follows: Figure 2 The housing 10 of this embodiment is provided with a signal enhancement area 02. The schematic diagram of the structure of the housing 10 in the thickness direction corresponding to the signal enhancement area 02 is shown in FIG. Fig.10 As shown. Figure 1 The difference between the illustrated embodiments is that the material used to set the signal enhancement area 02 of the present application is changed, and the material composition of the shell 10 before the signal enhancement area 02 is the same as that of the first embodiment.

[0066] The housing 10 of the embodiment of the present application, the high thermal conductivity film layer 11 and the high modulus film layer 12 of the signal enhancement area 02 are both glass fiber film layers. The laying direction of the fibers in the glass fiber film layer is the same as that of the signal enhancement area 02. The characteristics of glass fiber are that it is non-conductive and will not generate eddy currents for the signal, thus reducing the risk of signal attenuation.

[0067] Based on the same technical purpose, the present application also provides an electronic device, which includes a housing of an embodiment of the present application. The housing can be used as a back cover of the electronic device. The electronic device can also include components such as a display screen, a processing chip, and a battery. The processing chip and the battery can be packaged using the display screen and the housing. The heat generated by the processing chip and the battery can be dissipated outward through the housing.

[0068] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A housing of an electronic device, characterized in that: The shell is a multi-layer composite structure, including at least one high thermal conductivity film layer, at least one high modulus film layer is provided on both sides of the high thermal conductivity film layer, the high thermal conductivity film layer and the high modulus film layer are stacked, the thermal conductivity of the high thermal conductivity film layer is ≥100W / m*K, and the elastic modulus of the high modulus film layer is ≥70GPa.

2. The housing according to claim 1, characterized in that The thermal conductivity of the high modulus film layer is ≥100 W / m*K, and the elastic modulus of the high thermal conductivity film layer is ≥70 GPa.

3. The housing according to claim 2, characterized in that: The high thermal conductivity film layer and the high modulus film layer are made of the same material.

4. The housing according to any one of claims 1 to 3, characterized in that: The thickness of a single layer of the high thermal conductivity film layer is 0.01 to 0.3 mm, and the thickness of a single layer of the high modulus film layer is 0.01 to 0.3 mm.

5. The housing according to any one of claims 1 to 4, characterized in that: The number of layers of the high thermal conductivity film layer is one, and the number of layers of the high modulus film layer on either side of the high thermal conductivity film layer is greater than or equal to two.

6. The housing according to any one of claims 1 to 5, characterized in that: The high thermal conductivity film layer includes at least one of a graphene film layer, a graphite film layer, a boron nitride film layer, a nanosilver layer, an asphalt-based carbon fiber film layer, a carbon / carbon composite film layer, a carbon / ceramic composite film layer, a diamond film layer, a silicon carbide film layer, a boron oxide film layer, and an aluminum nitride film layer.

7. The housing according to any one of claims 1 to 6, characterized in that: The high modulus membrane layer includes at least one of a glass fiber membrane layer, a PAN-based carbon fiber membrane layer, a ceramic fiber membrane layer, an aramid fiber membrane layer, a polyimide fiber membrane layer, an asphalt-based carbon fiber membrane layer, a carbon / carbon composite membrane layer, a carbon / ceramic composite membrane layer, a diamond membrane layer, a silicon carbide membrane layer, a boron oxide membrane layer, and an aluminum nitride membrane layer.

8. The housing according to any one of claims 1 to 7, characterized in that: When the high thermal conductivity film layer and the high modulus film layer contain fibers, the fibers in any layer are unidirectionally laid fibers, and the laying directions of the fibers in any two adjacent layers are arranged at an angle of 90°.

9. The housing according to any one of claims 1 to 8, characterized in that: The shell includes a signal enhancement area, and the material of the high thermal conductivity film layer and the high modulus film layer corresponding to the signal enhancement area is an insulating material.

10. An electronic device, characterized in that: Comprising a housing as described in any one of claims 1-9.

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