Power distribution device and charging equipment

Abstract

The embodiment of the invention provides a power distribution device and charging equipment comprising the power distribution device, and relates to the technical field of energy, the power distribution device is used for distributing input current into at least one path and outputting the current, the power distribution device comprises a circuit board, a plurality of switching devices used for controlling on-off, a metal sheet and a first glue layer, the plurality of switching devices are fixed on the board surface of the circuit board; the metal sheet is fixed on the board surface, deviating from the plurality of switching devices, of the circuit board, and the metal sheet is electrically connected with at least one of the plurality of switching devices; the first adhesive layer is located on the board face, where the metal sheet is fixed, of the circuit board, the thickness of the first adhesive layer is larger than that of the metal sheet in the thickness direction of the circuit board, the first adhesive layer is provided with a through opening, one part of the metal sheet is located in the first adhesive layer, and the other part of the metal sheet is exposed out of the first adhesive layer through the through opening.

Description

Technical Field

[0001] The present application relates to the field of energy technology, and in particular to a power distribution device and a charging device. Background Art

[0002] Due to the complex application scenarios of charging stations, frequent charging and discharging will cause frequent temperature changes in switching devices (for example, relays) and copper busbars inside the charging equipment, thereby causing condensation to form on the surface of components such as circuit boards inside the charging equipment.

[0003] Among them, the frequent temperature changes of electronic components have a more obvious impact on the power distribution device. Condensation on the circuit boards in the power distribution device can cause short circuits and damage to the circuit boards, causing the power distribution device to lose its ability to operate normally. Summary of the invention

[0004] The present application provides a power distribution device and a charging device including the power distribution device, which reduce the possibility of condensation on the circuit board causing a short circuit or damage to the circuit board.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect of the present application, a power distribution device is provided for distributing an input current into at least one path and outputting the same. The power distribution device includes a circuit board, a plurality of switch devices for controlling on and off, a metal sheet and a first adhesive layer. The plurality of switch devices are fixed on a surface of the circuit board; the metal sheet is fixed on a surface of the circuit board facing away from the plurality of switch devices, and the metal sheet is electrically connected to at least one of the plurality of switch devices; the first adhesive layer is located on a surface of the circuit board on which the metal sheet is fixed, and in a thickness direction of the circuit board, a thickness of the first adhesive layer is greater than a thickness of the metal sheet, and the first adhesive layer has a through opening, a portion of the metal sheet is located in the first adhesive layer, and another portion is exposed outside the first adhesive layer through the through opening.

[0007] A plurality of switch devices (for example, relays, contactors, etc.) are integrated on a circuit board, and the switch devices are electrically connected through a metal sheet on the circuit board. The current input or output through the metal sheet can be controlled on and off by the corresponding switch device to achieve current distribution. A first adhesive layer is set on the surface of the circuit board where the metal sheet is set. Since the thickness of the first adhesive layer is greater than the thickness of the metal sheet, a part of the metal sheet can be covered by the first adhesive layer. After condensation occurs on the circuit board, the first adhesive layer protects the surface of the circuit board, reduces the possibility of condensation soaking the metal sheet and causing a short circuit, and reduces the possibility of damage to the circuit board due to condensation. In addition, a part of the metal sheet is exposed outside the first adhesive layer through a through hole on the first adhesive layer, which is convenient for the metal sheet to be connected to an external wiring or an external busbar to achieve current input and output.

[0008] In one embodiment of the present application, the power distribution device also includes a glue-potting bottom frame, which is located on the board surface of the circuit board where a metal sheet is fixed, and the glue-potting bottom frame includes a fixed surrounding plate and a bottom plate, the surrounding plate surrounds the outer periphery of the metal sheet, the bottom plate is located on the side of the surrounding plate away from the circuit board, and a glue-potting space is provided between the bottom plate and the circuit board, the circuit board has a glue-potting hole connected to the glue-potting space, the bottom plate has an opening, the opening is connected to the through-portion, a portion of the metal sheet is exposed outside the glue-potting space through the opening, and the first glue layer is located in the glue-potting space.

[0009] The glue-filling bottom frame can be buckled on the board surface of the circuit board where the metal sheet is set, so that the metal sheet cover is set in the glue-filling space, and glue is poured into the glue-filling space through the glue-filling hole, and the first glue layer can be formed after the poured glue is solidified. In addition, after the glue filling is completed, the glue-filling bottom frame will remain in the power distribution device to form a protective structure to prevent the circuit board from being bumped or damaged during installation or transportation. In addition, the glue-filling bottom frame fixed on the circuit board can also play a good insulation effect, reducing the insulation distance requirement between the external structure and the circuit board.

[0010] In one embodiment of the present application, the surface of the enclosure facing the circuit board is bonded and fixed to the board surface of the circuit board.

[0011] The glue-potting bottom frame is fixed on the circuit board, so that the surface of the enclosure and the board surface of the circuit board are bonded and fixed by the adhesive layer. During the glue-potting process, it can not only reduce the possibility of relative displacement between the glue-potting bottom frame and the circuit board, but also play a sealing role, reducing the risk of glue leakage from between the enclosure and the circuit board, which is conducive to the smooth progress of the glue-potting process.

[0012] In one embodiment of the present application, the glue-potted bottom frame also includes a baffle, which surrounds the opening and is fixed to the bottom plate. A portion of the circuit board is exposed outside the glue-potting space through the opening. The baffle protrudes toward the circuit board and avoids the metal sheet.

[0013] In some cases, due to factors such as the size of the opening or the shape of the metal sheet, a portion of the circuit board may be exposed through the opening. During the glue pouring process, there is a gap between the portion of the circuit board exposed through the opening and the bottom plate, which may easily cause the glue in the glue pouring space to leak out. The present application provides a baffle at the opening, which can not only avoid the metal sheet, but also effectively block the glue leaking from the opening, thereby reducing the risk of glue leaking from between the bottom plate and the circuit board.

[0014] In one embodiment of the present application, the surface of the baffle facing the circuit board is bonded and fixed to the board surface of the circuit board.

[0015] The surface of the baffle is bonded and fixed to the surface of the circuit board through the adhesive layer, which plays a sealing role during the glue pouring process, reducing the risk of glue leaking out from between the baffle and the circuit board. In addition, the glue pouring bottom frame and the circuit board can be fixed more firmly, reducing the possibility of the glue pouring bottom frame moving or even falling off the circuit board during or after the glue pouring process.

[0016] In one embodiment of the present application, the glue-filled bottom frame further includes a first positioning column, the first positioning column is fixed on the bottom plate or the enclosure plate, the circuit board has a first positioning hole, and the first positioning column is inserted into the first positioning hole.

[0017] During the installation of the glue-potting bottom frame, the first positioning column on the glue-potting bottom frame can be aligned with the first positioning hole on the circuit board and inserted. The cooperation between the first positioning column and the first positioning hole can play a positioning role, which facilitates the installation of the glue-potting bottom frame on the circuit board and makes the installation position of the glue-potting bottom frame more accurate.

[0018] In one embodiment of the present application, the power distribution device also includes a mounting base, the circuit board is fixed on the mounting base, the glue-filled bottom frame is located between the circuit board and the mounting base, a portion of the bottom plate is recessed toward the circuit board, and the recessed portion of the bottom plate toward the circuit board has relative convex and concave surfaces, the concave surface is located on the side of the convex surface away from the circuit board, and the concave surface is used to avoid the raised portion on the mounting base.

[0019] A recessed area is provided on the bottom plate, and the recessed area has a convex surface and a concave surface. In this way, the recessed area can form a structure similar to a reinforcing rib, which strengthens the structure of the bottom plate and reduces the possibility of bending or damage to the bottom plate. In addition, since the bottom plate has a concave surface, when the mounting seat has a convex structure, the recessed area can be provided at the convex structure of the mounting seat, and the concave surface can avoid the convex structure of the mounting seat. In this way, when the recessed area plays a reinforcing role, it can also avoid the structure on the mounting seat.

[0020] In one embodiment of the present application, the circuit board has a first through hole, the metal sheet has a second through hole connected to the first through hole, and the second through hole is exposed outside the first adhesive layer through the through opening.

[0021] The first through hole and the second through hole are provided to facilitate fasteners (e.g., screws, pins, etc.) to pass through the circuit board and the metal sheet. For example, in the process of installing the circuit board, the fasteners are connected to other structures after passing through the first through hole and the second through hole, so as to fix the circuit board on the other structure. The second through hole is exposed outside the first adhesive layer, so that the circuit board and the metal sheet after the adhesive filling do not affect the normal passing of the fastener, thereby reducing the influence of the first adhesive layer on the installation of the circuit board.

[0022] In one embodiment of the present application, the power distribution device also includes screws, a busbar and a mounting seat, the busbar is fixed on the mounting seat, the first adhesive layer is located on the side of the circuit board facing the mounting seat, the busbar passes through the through hole and contacts the metal sheet, and the screws pass through the first through hole, the second through hole and the busbar and are threadedly connected to the mounting seat.

[0023] The busbar is fixed on the mounting base and is used for current input or output. The through hole allows the busbar to pass through so that the busbar can contact the metal sheet. The current input or output through the busbar can be controlled by the corresponding switch device to achieve current distribution. The screws can not only lock the connection between the circuit board and the mounting base, but also press the metal sheet on the circuit board onto the busbar. After the circuit board is stably installed, the possibility of poor contact between the metal sheet and the busbar is reduced.

[0024] In one embodiment of the present application, the power distribution device also includes a second adhesive layer, which is located on a board surface of the circuit board on which multiple switching devices are fixed; at least one switching device includes a device shell and pins fixed on the device shell, the pins pass through the circuit board and are electrically connected to the metal sheet, and the second adhesive layer covers the portion of the pins located on the side of the circuit board facing the device shell.

[0025] A second adhesive layer is provided on the surface of the circuit board where a plurality of switching devices are provided. Since the second adhesive layer covers (or immerses) the pin of at least one switching device, it protects the pin of the switching device, thereby reducing the possibility of condensation on the circuit board wetting the pin of the switching device and causing a short circuit, thereby reducing the risk of damage to the circuit board due to condensation.

[0026] In an embodiment of the present application, in the thickness direction of the circuit board, the height of the device shell of at least one switching device is greater than the height of the second adhesive layer.

[0027] The second adhesive layer mainly immerses the pins of the switch device, but does not cover (or immerse) the entire device shell of the switch device, so that the height of the second adhesive layer can be reduced. While effectively protecting the electrical connection part (for example, the pin part) of the switch device, the influence of the second adhesive layer on the heat dissipation of the switch device is reduced, the amount of the second adhesive layer is reduced, the production cost is saved, and the weight of the circuit board and the power distribution device is reduced.

[0028] In one embodiment of the present application, the power distribution device also includes a glue potting frame, which is located on one side of the circuit board where multiple switching devices are fixed. The glue potting frame surrounds the multiple switching devices, and the second glue layer is located inside the glue potting frame.

[0029] The glue filling frame and the glue filling bottom frame are located on different sides of the circuit board. During the glue filling process, the glue filling space in the glue filling bottom frame can be filled with glue through the glue filling hole first. After the glue filling space is filled with glue, the space enclosed by the glue filling frame is filled with glue. After the glue filling frame is filled with glue and solidified, the second glue layer will immerse the pins of the switching device, thereby protecting the pins of the switching device. Moreover, after the glue filling is completed, the glue filling frame remains in the power distribution device, which has a better insulation effect and reduces the insulation distance requirements between other devices on the circuit board and the switching device. In addition, the board surface of the circuit board where the switching device is set is only glued in the part inside the glue filling frame, and glue is poured in other positions as needed, so that the glue filling is more targeted, which can not only play a better protective role, but also reduce the production cost.

[0030] In one embodiment of the present application, the surface of the glue-filled frame facing the circuit board is bonded and fixed to the board surface of the circuit board.

[0031] The glue potting frame is fixed on the circuit board so that the surface of the glue potting frame is bonded to the surface of the circuit board through the adhesive layer. During the glue potting process, it can not only reduce the possibility of relative displacement between the glue potting frame and the circuit board, but also play a sealing role, reducing the risk of glue leakage from between the glue potting frame and the circuit board, which is conducive to the smooth progress of the glue potting process.

[0032] In one embodiment of the present application, the glue-filled frame includes a fixed surrounding frame and a blocking plate, the surrounding frame surrounds the multiple switch devices, the blocking plate protrudes from the surrounding frame toward the multiple switch devices, and there is a gap between the blocking plate and the circuit board.

[0033] During the process of pouring glue into the inner side of the glue pouring frame, the surrounding frame acts as an external limit for the glue, limiting the glue within the area enclosed by the surrounding frame. The blocking plate limits the height of the glue, and the glue is poured into the gap between the blocking plate and the circuit board (it may also slightly exceed the blocking plate). The blocking plate hinders the glue, reducing the possibility of the glue overflowing from the top of the surrounding frame.

[0034] In one embodiment of the present application, the glue-filled surrounding frame further includes a second positioning column, the second positioning column is fixed on the surrounding frame, the circuit board has a second positioning hole, and the second positioning column is inserted into the second positioning hole.

[0035] During the installation of the glue potting frame, the second positioning column on the glue potting frame can be aligned with the second positioning hole on the circuit board and inserted. The cooperation between the second positioning column and the second positioning hole can play a positioning role, which facilitates the installation of the glue potting frame on the circuit board and makes the installation position of the glue potting frame more accurate.

[0036] According to a second aspect of the present application, a charging device is provided, which includes a power conversion device, multiple charging interfaces, and the above-mentioned power distribution device, wherein a metal sheet of the power distribution device electrically connects the power conversion device and the multiple charging interfaces, and the power distribution device is used to distribute the direct current output by the power conversion device to at least one charging interface.

[0037] The power distribution device can distribute the current from the power conversion device according to the requirements of the charging interface, and distribute the current output by the power conversion device to one or more corresponding charging interfaces. Among them, the charging device provided by this application includes the above-mentioned power distribution device, so the charging device provided by this application and the power distribution device of the above-mentioned technical solution can solve the same technical problems and have the same technical effects, which will not be repeated here.

[0038] In one embodiment of the present application, the power distribution device further includes a busbar, the busbar contacts the metal sheet, and the busbar is electrically connected to an output end of the power conversion device and / or an input end of at least one charging interface.

[0039] The current output from the output end of the power conversion device passes through the corresponding busbar, metal sheet and switch device, and is transmitted to the input end of one or more corresponding charging interfaces. The switch device controls the on and off of the current, and distributes the current output from the power conversion device to the corresponding charging interface. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A topological diagram of a charging device provided in an embodiment of the present application;

[0041] Figure 2 A schematic diagram of the overall structure of a charging device provided in an embodiment of the present application;

[0042] Figure 3 A schematic diagram of the overall structure of another charging device provided in an embodiment of the present application;

[0043] Figure 4 A schematic diagram of the overall structure of a power distribution device provided in an embodiment of the present application;

[0044] Figure 5 A schematic diagram of the structure of a circuit board provided in an embodiment of the present application;

[0045] Figure 6 A schematic diagram of the structure of a metal sheet provided in an embodiment of the present application;

[0046] Figure 7 A schematic diagram of an exploded structure of a glue-filled bottom frame and a circuit board provided in an embodiment of the present application;

[0047] Figure 8A schematic diagram of a structure in which a glue-filled bottom frame provided in an embodiment of the present application is installed on a circuit board;

[0048] Fig. 9 A schematic diagram of the structure of a glue filling space provided in an embodiment of the present application;

[0049] Fig.10 A schematic diagram of the structure of a baffle provided in an embodiment of the present application;

[0050] Fig.11 A schematic diagram of the structure of a first part and a second part provided in an embodiment of the present application;

[0051] Fig.12 A schematic diagram of the structure of a screw provided in an embodiment of the present application;

[0052] Fig.13 for Fig.12 Magnified view at A in the middle;

[0053] Fig.14 A schematic diagram of a convex surface and a concave surface provided in an embodiment of the present application;

[0054] Fig.15 A schematic diagram of the structure of a second adhesive layer provided in an embodiment of the present application;

[0055] Fig.16 A schematic diagram of the height of a second adhesive layer provided in an embodiment of the present application;

[0056] Fig.17 A schematic diagram of an exploded structure of a glue-filled enclosure and a circuit board provided in an embodiment of the present application;

[0057] Fig.18 A schematic diagram of a structure in which a glue-filled enclosure provided in an embodiment of the present application is installed on a circuit board;

[0058] Fig.19 A schematic structural diagram of a surrounding frame and a blocking plate provided in an embodiment of the present application.

[0059] Reference numerals:

[0060] 100-charging device; 101-power distribution device; 102-power conversion device; 103-charging interface; 104-equipment cabinet; 105-charging gun; 106-cable; 107-charging host; 108-charging terminal; 1-shell; 11-mounting seat; 111-raised part; 12-protective cover; 2-circuit board; 21-glue filling hole; 22-first positioning hole; 23-first through hole; 24-second through hole; 25-second positioning hole; 3-switch device; 31-device shell; 32-pin; 4-metal sheet; 51-first glue layer ;511-through opening;52-second glue layer;6-glue-filling bottom frame;60-glue-filling space;61-enclosure;62-bottom plate;621-opening;622-recessed area;6221-convex surface;6222-concave surface;63-first positioning column;64-baffle;641-first part;642-second part;7-screw;8-busbar;9-glue-filling enclosure;91-surrounding frame;92-blocking plate;921-blocking sub-plate;9211-first blocking sub-plate;9212-second blocking sub-plate;93-second positioning column;94-arc segment. DETAILED DESCRIPTION

[0061] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0062] In this application, the terms "first", "second", etc. are used only for descriptive purposes to distinguish one element from another element, and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0063] In the present application, unless otherwise clearly specified or limited, "plurality" means two or more.

[0064] In addition, in this application, the words "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in this application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0065] In the drawings of the embodiments of the present application, solid structures such as components and assemblies are represented by guide lines; hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with arrows.

[0066] The present application embodiment provides a charging device 100, Figure 1An exemplary topology diagram of a charging device 100 is shown. Figure 1 , the charging device 100 includes a power distribution device 101, a power conversion device 102 and a plurality of charging interfaces 103. The input end of the power conversion device 102 is used to receive alternating current, and the output end of the power conversion device 102 is used to output direct current. For example, in one example, the power conversion device 102 may include a plurality of AC-DC modules and a plurality of DC-DC modules. The output ends of the plurality of AC-DC modules are connected to the input ends of the plurality of DC-DC modules through a DC bus, and the output ends of the plurality of DC-DC modules output direct current. For another example, the power conversion device 102 may include a plurality of AC-DC modules, and no DC-DC modules are provided. In one example, referring to Figure 1 The output end of the power conversion device 102 is electrically connected to multiple charging interfaces 103 and the power distribution device 101. A part of the DC power output by the power conversion device 102 is directly output through the corresponding charging interface 103, and the other part is distributed to the corresponding charging interface 103 through the power distribution device 101.

[0067] In some other examples, the output end of the power conversion device 102 is electrically connected to the input end of the power distribution device 101, and the output end of the power distribution device 101 is electrically connected to the input ends of multiple charging interfaces 103. The power distribution device 101 is used to distribute the direct current output by the power conversion device 102 to at least one charging interface 103, and enable the output end of the charging interface 103 to output direct current.

[0068] Figure 1 The power distribution device 101 in the figure is only an example. In other examples, the power distribution device 101 may also be any other device capable of implementing power distribution or current distribution.

[0069] The charging device 100 of the present application may be a charging pile, for example, Figure 2 The structure of a charging device 100 is shown as an example. Figure 2 The charging device 100 may be an integrated charging pile, and the charging device 100 includes a device cabinet 104 and at least one charging gun 105 (for example, Figure 2 105 is shown), when the charging gun 105 is not charging, the charging gun 105 can be plugged into the equipment cabinet 104 for personnel to use at any time. In this example, the power conversion device 102, the power distribution device 101 and the plurality of charging interfaces 103 can all be arranged in the equipment cabinet 104, and each charging interface 103 can be electrically connected to a corresponding charging gun 105 through a cable 106, so that the device to be charged (for example, an electric vehicle) can be charged through the charging gun 105.

[0070] For another example, Figure 3 The structure of another charging device 100 is shown as an example. Figure 3 The charging device 100 may also be a split-type charging pile. The charging device 100 includes a charging host 107 , at least one charging terminal 108 and at least one charging gun 105 . Figure 3 The example shows a plurality of charging terminals 108 and a plurality of charging guns 105, wherein each charging terminal 108 is electrically connected to a charging host 107, and each charging terminal 108 corresponds to one or more charging guns 105. When the charging gun 105 is not performing a charging operation, the charging gun 105 can be plugged into the corresponding charging terminal 108 for personnel to use from the charging terminal 108. In this example, the power conversion device 102 and the power distribution device 101 can be arranged in the charging host 107, and the charging interface 103 can be arranged in the terminal cabinet of the charging terminal 108. Each charging terminal 108 is electrically connected to the charging host 107 through a corresponding cable 106, and each charging interface 103 is electrically connected to the corresponding charging gun 105 through a cable 106.

[0071] It should be noted that Figure 2 and Figure 3 The charging devices 100 shown are merely examples of two charging devices 100 provided in the present application, and are not limitations on the charging devices 100 of the present application.

[0072] The present application embodiment provides a power distribution device 101, Figure 4 The structure of a power distribution device 101 is exemplarily shown, wherein the power distribution device 101 is used to distribute the input current into at least one path and output it. For example, the power distribution device 101 is used to distribute the current input by the power conversion device 102 into one or more paths and output it to the corresponding charging interface 103.

[0073] Reference Figure 4 The power distribution device 101 includes a housing 1 and components or devices located in the housing 1. The housing 1 can be any housing or box-like structure, and the housing 1 can be an integrally formed housing or a split housing. For example, Figure 4 The housing 1 is a split structure, wherein the housing 1 includes a mounting seat 11 and a protective cover 12 which are detachably connected to each other, wherein the protective cover 12 is arranged on the mounting seat 11, and the protective cover 12 and the mounting seat 11 enclose a space for accommodating components or devices.

[0074] The power distribution device 101 further includes a circuit board 2, which is located in the housing 1. Figure 5 The structure of a circuit board 2 is shown as an example. Figure 5The protective cover 12 is hidden). The circuit board 2 may be a printed circuit board 2 (PCB), and the circuit board 2 may be fixed in the housing 1. For example, the power distribution device 101 further includes screws 7, and the circuit board 2 is fixed to the mounting seat 11 by the screws 7. For another example, the circuit board 2 may also be mounted and fixed to the mounting seat 11 (or other parts of the housing 1) by a bracket or other fixing structure.

[0075] Reference Figure 5 The power distribution device 101 further includes a plurality of switch devices 3, wherein the switch devices 3 may be any electronic component capable of controlling the on and off of a circuit, for example, the switch device 3 may be a relay, or a contactor, and the plurality of switch devices 3 may be fixed on a board surface on one side of the circuit board 2 by means of a pin-like structure. Furthermore, the plurality of switch devices 3 may be arranged on the circuit board 2 in any suitable manner, for example, the plurality of switch devices 3 may be arranged at intervals along the same direction ( Figure 5 For example, multiple switch devices 3 are arranged in a matrix.

[0076] The power distribution device 101 further comprises a metal sheet 4, Figure 6 The structure of the metal sheet 4 is shown as an example. One or more metal sheets 4 can be provided. The metal sheet 4 can be a copper bar or a copper sheet. The metal sheet 4 can also be an aluminum bar, etc. Figure 6 The metal sheet 4 is fixed on the surface of the circuit board 2 away from the multiple switch devices 3. The metal sheet 4 can be fixed on the circuit board 2 by any suitable method such as crimping, bonding, welding, etc. The present application does not impose any specific restrictions on the fixing method of the metal sheet 4 and the circuit board 2.

[0077] The metal sheet 4 is electrically connected to at least one of the multiple switch devices 3, for example, one metal sheet 4 is electrically connected to one switch device 3, another example, one metal sheet 4 is electrically connected to multiple switch devices 3, another example, multiple metal sheets 4 are electrically connected to one switch device 3, and another example, multiple metal sheets 4 are electrically connected to multiple switch devices 3, and the present application does not impose specific restrictions on this. There are many ways for the metal sheet 4 to be electrically connected to the switch device 3. In one example provided in the present application, the pin portion of the switch device 3 passes through the circuit board 2 and is electrically connected to the corresponding metal sheet 4.

[0078] In the present application, multiple switching devices 3 are integrated on a circuit board 2, and corresponding switching devices 3 are electrically connected via a metal sheet 4 on the circuit board 2. The current input or output via the metal sheet 4 can be controlled on and off by the corresponding switching devices 3, thereby achieving current distribution.

[0079] In addition, refer to Figure 6The power distribution device 101 further includes a first adhesive layer 51, wherein the material of the first adhesive layer 51 can be any suitable insulating material, for example, the first adhesive layer 51 can be a polyurethane potting glue; for another example, the first adhesive layer 51 can also be a silicone potting glue; for another example, the first adhesive layer 51 can also be an epoxy resin potting glue, etc., and the present application does not impose any specific restrictions on this. The first adhesive layer 51 is located on the board surface of the circuit board 2 where the metal sheet 4 is fixed, and the first adhesive layer 51 has a through hole 511. A part of the metal sheet 4 is located in the first adhesive layer 51 (or, covered by the first adhesive layer 51), and the other part is exposed outside the first adhesive layer 51 through the through hole 511.

[0080] In order to make a part of the metal sheet 4 located in the first adhesive layer 51 (or covered by the first adhesive layer 51), in the thickness direction of the circuit board 2, the thickness of the first adhesive layer 51 is greater than the thickness of the metal sheet 4. In this way, except for the part of the metal sheet 4 exposed outside the first adhesive layer 51 through the through hole 511, the rest of the metal sheet 4 is located in the first adhesive layer 51, so that the first adhesive layer 51 protects the metal sheet 4.

[0081] exist Figure 6 In the example shown, a plurality of through-holes 511 are provided, and a plurality of metal sheets 4 are also provided, and each through-hole 511 exposes a portion of the corresponding metal sheet 4. In some other examples, a plurality of through-holes 511 are provided, and a single metal sheet 4 is provided, and each through-hole 511 exposes a portion of the metal sheet 4. In some other examples, a single through-hole 511 may also be provided.

[0082] Among them, a first adhesive layer 51 is arranged on the surface of the circuit board 2 where the metal sheet 4 is arranged, and a part of the metal sheet 4 is covered by the first adhesive layer 51. After condensation occurs on the circuit board 2, the first adhesive layer 51 protects the surface of the circuit board 2 where the metal sheet 4 is arranged, thereby reducing the possibility of condensation wetting the metal sheet 4 and causing a short circuit, and reducing the possibility of damage to the circuit board 2 due to condensation. In addition, another part of the metal sheet 4 is exposed outside the first adhesive layer 51 through the through hole 511 on the first adhesive layer 51, so that the metal sheet 4 is connected to an external wire or an external conductive metal bar to realize the input and output of current.

[0083] Regarding the formation of the first glue layer 51, in some examples, the power distribution device 101 further includes a glue-filled bottom frame 6. Figure 7 An exploded structure of a glue-filled bottom frame 6 and a circuit board 2 is shown as an example. Figure 7 The first adhesive layer 51 is not shown, and the plurality of metal sheets 4 are exposed. Figure 8 The structure after the glue-filled bottom frame 6 is installed on the circuit board 2 is exemplarily shown. The glue-filled bottom frame 6 is located on the board surface of the circuit board 2 where the metal sheet 4 is fixed, and the glue-filled bottom frame 6 is covered outside the metal sheet 4, wherein: Figure 8The first glue layer 51 is covered by the glue-filled bottom frame 6 .

[0084] The glue-filled bottom frame 6 can be made of any suitable material, for example, the glue-filled bottom frame 6 can be a plastic frame; for another example, the glue-filled bottom frame 6 can also be a rubber frame, etc. This application does not impose any specific limitation on this.

[0085] Reference Figure 7 and Figure 8 The glue-filling bottom frame 6 includes a fixed enclosure 61 and a bottom plate 62. For example, the enclosure 61 and the bottom plate 62 can be integrally formed. The enclosure 61 surrounds the outer periphery of the plurality of metal sheets 4, and the bottom plate 62 is located on the side of the enclosure 61 away from the circuit board 2. There is a glue-filling space 60 between the bottom plate 62 and the circuit board 2. Fig. 9 The structure of a glue filling space 60 is shown as an example. Fig. 9 The circuit board 2 has a glue injection hole 21 connected to the glue injection space 60, wherein the first glue layer 51 is located in the glue injection space 60 ( Fig. 9 The dotted shaded portion in the figure indicates the first glue layer 51). That is, glue can be poured into the glue pouring space 60 through the glue pouring hole 21, and the first glue layer 51 can be formed after the poured glue is solidified.

[0086] Reference Figure 8 and Fig. 9 The bottom plate 62 has an opening 621, and the opening 621 can be provided with a plurality of openings. Since the first glue layer 51 is formed between the glue-filling bottom plate 62 and the circuit board 2, the opening 621 on the bottom plate 62 is connected to the through-hole 511 of the first glue layer 51 (the through-hole 511 can also refer to Figure 6 ), when there are a plurality of openings 621, the first glue layer 51 also forms a plurality of through openings 511, and each opening 621 is connected to a corresponding through opening 511. A portion of the metal sheet 4 is exposed outside the glue pouring bottom frame 6 through the corresponding opening 621, that is, a portion of the metal sheet 4 is exposed outside the glue pouring space 60 through the corresponding opening 621. After the glue poured into the glue pouring space 60 solidifies to form the first glue layer 51, a portion of the metal sheet 4 is exposed outside the first glue layer 51 through the through opening 511 on the first glue layer 51.

[0087] In the example provided in the present application, after the glue filling is completed, the glue filling bottom frame 6 will remain in the power distribution device 101 to form a protective structure to prevent the circuit board 2 from being bumped or damaged during installation or transportation. In addition, the glue filling bottom frame 6 fixed on the circuit board 2 can also play a good insulation effect, reducing the insulation distance requirement between the external structure and the circuit board 2. In some other examples, the glue filling bottom frame 6 can be removed after the first glue layer 51 is formed.

[0088] In some examples, the reference is returned Figure 7The glue-filled bottom frame 6 may further include a first positioning column 63, which is fixed to the enclosure 61. For example, the first positioning column 63 is integrally formed with the enclosure 61. In other examples, the first positioning column 63 may also be fixed to the bottom plate 62. The circuit board 2 has a first positioning hole 22, and the first positioning column 63 is inserted into the first positioning hole 22. The state of the first positioning column 63 after being inserted into the first positioning hole 22 can be referred to. Figure 8 .

[0089] The cooperation between the first positioning column 63 and the first positioning hole 22 can play a role in positioning, which is convenient for installing the glue-filled bottom frame 6 on the circuit board 2 and makes the installation position of the glue-filled bottom frame 6 more accurate. Figure 7 and Figure 8 In the example shown, in order to make the installation position of the glue-filled bottom frame 6 more accurate, a plurality of first positioning posts 63 (for example, two) are provided. In some other examples, a single first positioning post 63 may also be provided. The present application does not specifically limit the number of first positioning posts 63. In the example where a plurality of first positioning posts 63 are provided, the number of first positioning holes 22 is the same as the number of first positioning posts 63, wherein each first positioning post 63 is inserted into the corresponding first positioning hole 22.

[0090] In addition, the glue-filled bottom frame 6 can be mounted on the circuit board 2 in any suitable manner, for example, Fig. 9 , the surface of the enclosing plate 61 facing the circuit board 2 (surface S1) is bonded and fixed to the board surface of the circuit board 2 through an adhesive layer (for example, a back adhesive layer). It can be understood that the surface of the enclosing plate 61 facing the circuit board 2 is an annular surface. During the glue pouring process, the bonding between the surface of the enclosing plate 61 and the circuit board 2 can play a sealing role, reducing the risk of the glue in the glue pouring space 60 leaking out from between the enclosing plate 61 and the circuit board 2. In addition, the glue pouring bottom frame 6 and the circuit board 2 can also be fixed more firmly, reducing the possibility of the glue pouring bottom frame 6 moving or even falling off the circuit board 2 during or after the glue pouring process.

[0091] In some examples, the connection between the enclosure 61 and the circuit board 2 can be made more secure by increasing the bonding area between the enclosure 61 and the circuit board 2. For example, the area of ​​the surface of the enclosure 61 facing the circuit board 2 (surface S1) can be increased.

[0092] In some other examples, the enclosure 61 or the base plate 62 may also be fixed to the circuit board 2 by means of structures such as bolts, screws or rivets.

[0093] In some cases, due to factors such as the size of the opening 621 or the shape of the metal sheet 4, a portion of the circuit board 2 may be exposed through the opening 621. During the glue pouring process, there is a gap between the portion of the circuit board 2 exposed through the opening 621 and the bottom plate 62, which may easily cause the glue in the glue pouring space 60 to leak out. In order to solve the above problem, in the example provided in the present application, the glue pouring bottom frame 6 may further include a baffle 64. Fig.10 The structure of a baffle 64 is shown as an example. Fig.10 A portion of the circuit board 2 is exposed outside the glue pouring space 60 through the opening 621 (the glue pouring space 60 can refer to Fig. 9 ), the baffle 64 surrounds the opening 621 and is fixed on the bottom plate 62, and the baffle 64 protrudes toward the circuit board 2 and avoids the metal sheet 4. For example, the baffle 64 includes a first portion 641 and a second portion 642, wherein the first portion 641 protrudes toward the circuit board 2 and avoids the metal sheet 4, and the second portion 642 protrudes toward the circuit board 2 but does not need to avoid the metal sheet 4.

[0094] Fig.11 The structure of the first part 641 and the second part 642 of the baffle 64 is shown as an example. Fig.11 Due to the presence of the metal sheet 4, in the thickness direction of the circuit board 2, it is necessary to avoid that the first part 641 of the metal sheet 4 is shorter than the second part 642. For example, the first part 641 only abuts or contacts the metal sheet 4, while the second part 642 abuts or contacts the circuit board 2.

[0095] Reference Fig.10 and Fig.11 The present application provides a baffle 64 surrounding the opening 621 at the opening 621 , which can not only avoid the metal sheet 4 , but also effectively block the glue leaking from the opening 621 , thereby reducing the risk of glue leaking from the opening 621 .

[0096] In some examples, the surface of the baffle 64 facing the circuit board 2 is bonded and fixed to the board surface of the circuit board 2. For example, the surface (surface S2) of the second part 642 of the baffle 64 facing the circuit board 2 is provided with a backing adhesive layer, and the surface of the baffle 64 is bonded to the board surface of the circuit board 2 through the backing adhesive layer. During the glue filling process, the bonding position of the baffle 64 and the circuit board 2 can play a sealing role, reducing the risk of glue leaking out from between the baffle 64 and the circuit board 2. In addition, the firmness of the fixation between the glue filling bottom frame 6 and the circuit board 2 is further improved, and the possibility of the glue filling bottom frame 6 falling off from the circuit board 2 is reduced.

[0097] In some other examples, the glue-filling bottom frame 6 may not be provided with the baffle 64 , and a protruding structure is formed on the bottom plate 62 of the glue-filling bottom frame 6 to prevent the injected glue from leaking from the opening 621 , and the function of the protruding structure is similar to that of the above-mentioned baffle 64 .

[0098] In some examples, reference Fig.11 , the circuit board 2 has a plurality of first through holes 23, the metal sheet 4 has a plurality of second through holes 24, each first through hole 23 is connected to a second through hole 24 in a one-to-one correspondence, and the second through hole 24 is exposed to the outside of the first glue layer 51 through the through hole 511. For example, in the case where a plurality of second through holes 24 and a plurality of through holes 511 are provided, each through hole 511 can be used to expose a second through hole 24; for another example, in the case where a plurality of second through holes 24 and a plurality of through holes 511 are provided, each through hole 511 can be used to expose a plurality of second through holes 24. In the example where a glue-filled bottom frame 6 is installed on the circuit board 2, each second through hole 24 will also be exposed to the outside of the glue-filled bottom frame 6 through the corresponding opening 621. In other examples, one first through hole 23 and one second through hole 24 can be provided.

[0099] The first through hole 23 and the second through hole 24 can be used for fasteners (for example, bolts, screws, pins, etc.) to pass through. During the process of installing the circuit board 2, the fasteners can be passed through the first through hole 23 and the second through hole 24 to fix the circuit board 2. The second through hole 24 is exposed outside the first adhesive layer 51, so that the circuit board 2 and the metal sheet 4 after the glue filling do not affect the normal passage of the fasteners, thereby reducing the influence of the first adhesive layer 51 on the installation of the circuit board 2.

[0100] The circuit board 2 can be installed on any suitable structure in the power distribution device 101. For example, the circuit board 2 is installed on the shell 1. When the shell 1 includes a mounting seat 11 and a protective cover 12, the circuit board 2 can be installed on the mounting seat 11. Alternatively, the circuit board 2 can be first installed in the protective cover 12 and then installed on the mounting seat 11 together with the protective cover 12. The present application does not impose any specific restrictions on this.

[0101] The circuit board 2 and the mounting seat 11 may be connected and fixed by any suitable fasteners. For example, the power distribution device 101 further includes screws 7 (bolts or screws). Fig.12 The structure of a screw 7 is shown by way of example, wherein a plurality of screws 7 may be provided. Fig.13 for Fig.12 The enlarged view of A in the middle, refer to Fig.13, the screw 7 passes through the first through hole 23 and the second through hole 24 and is threadedly connected to the mounting base 11. In the example where a plurality of first through holes 23 and second through holes 24 are provided, each screw 7 passes through a corresponding first through hole 23 and a corresponding second through hole 24. In the example where a first through hole 23 and a second through hole 24 are provided, a single screw 7 may also be provided.

[0102] In addition, refer to Fig.13 The power distribution device 101 may also include a plurality of busbars 8 ( Figure 1 The topology of the busbar 8 is shown in FIG. 1 ), the busbar 8 is fixed on the mounting seat 11 and is used for current input or output. The first glue layer 51 is located on the side of the circuit board 2 facing the mounting seat 11. Each busbar 8 passes through the corresponding through-hole 511 and contacts the metal sheet 4 exposed by the through-hole 511. When the glue-filled bottom frame 6 is mounted on the mounting seat 11, the busbar 8 passes through the corresponding opening 621 and contacts the metal sheet 4. When the metal sheet 4 is turned on, the current input or output through the busbar 8 can be turned on and off by the corresponding switch device 3 to achieve current distribution.

[0103] Reference Fig.13 In the example where the power distribution device 101 includes a plurality of busbars 8, after the screw 7 passes through the first through hole 23 and the second through hole 24, the screw 7 can also pass through the busbar 8 and be threadedly connected with the mounting seat 11. In this example, the screw 7 can not only lock the connection between the circuit board 2 and the mounting seat 11, but also press the metal sheet 4 on the circuit board 2 onto the busbar 8, which reduces the possibility of poor contact between the metal sheet 4 and the busbar 8 after the circuit board 2 is stably installed.

[0104] Regarding the connection mode of the busbar 8 in the charging device 100, in some examples (not shown in the drawings), the power conversion device 102 includes multiple power modules, the busbar 8 is provided with multiple busbars 8(a), busbar 8(b), etc., and the multiple charging interfaces 103 include charging interface 103(a), charging interface 103(b), etc. The busbar 8(a) is electrically connected to the output end of the power module (a), and the busbar 8(a) is also electrically connected to the input end of the charging interface 103(a) corresponding to the power module (a), and the current output by the power module (a) can be directly transmitted to the corresponding charging interface 103(a) through the busbar 8(a). When the charging interface 103(b) needs to call the current of the power module (a), the current of the power module (a) can be transmitted to the metal sheet 4 corresponding to the busbar 8(a) through the busbar 8(a), and then flow through the switching device 3 electrically connected to the metal sheet 4, and the current is distributed to the busbar 8(b) through the switching device 3. The busbar 8(b) is electrically connected to the charging interface 103(b), thereby realizing the current of the power module (a) being allocated to the charging interface 103(b).

[0105] In some other examples (not shown in the drawings), the busbar 8 is provided with a plurality of busbars 8 including busbar 8(c), busbar 8(d), etc. The output end of the power conversion device 102 is connected to the busbar 8(c), and the input end of one of the charging interfaces 103 is connected to the busbar 8(d), and the busbar 8(c) and the busbar 8(d) are respectively in contact with different metal sheets 4. That is, the busbar 8(c) connected to the output end of the power conversion device 102 is not directly connected to or in contact with the busbar 8(d), and the current output from the power conversion device 102 needs to pass through the power distribution device 101 before it can be delivered to the designated charging interface 103.

[0106] In other examples, only one busbar 8 may be provided, and the present application does not impose any specific limitation on the number of busbars 8 .

[0107] In some examples where the power distribution device 101 includes a mounting base 11, there may be some raised portions 111 on the mounting base 11. For example, the raised portions 111 may be bosses on the mounting base 11 for fixing the busbar 8. A portion of the bottom plate 62 is recessed toward the circuit board 2. For example, referring to Fig.13 The bottom plate 62 has a recessed area 622 (one or more), and the recessed portion of the bottom plate 62 (recessed area 622) facing the circuit board 2 has a convex surface 6221 and a concave surface 6222 opposite to each other. Fig.14 The structure of a convex surface 6221 and a concave surface 6222 is shown as an example. Fig.14 The convex surface 6221 and the concave surface 6222 can be understood as two back-to-back surfaces of the recessed area 622 in the thickness direction of the circuit board 2, wherein the concave surface 6222 is located on the side of the convex surface 6221 away from the circuit board 2, and the concave surface 6222 is used to avoid the raised portion 111 on the mounting seat 11.

[0108] Reference Fig.14 , the recessed area 622 can form a structure similar to a reinforcing rib, which strengthens the structure of the bottom plate 62 and reduces the possibility of bending or damage to the bottom plate 62. In addition, since the bottom plate 62 has a concave surface 6222, when the mounting seat 11 has a convex portion 111, the recessed area 622 can be set at the convex portion 111 of the mounting seat 11, and the concave surface 6222 can avoid the convex portion 111 of the mounting seat 11. In this way, when the recessed area 622 strengthens the structural strength of the bottom plate 62, it can also avoid the structure on the mounting seat 11. Among them, the recessed area 622 can be set at any suitable position on the bottom plate 62, and the recessed area 622 corresponds to the position of the convex portion 111 on the mounting seat 11, and the present application does not impose specific restrictions on this.

[0109] In some examples, the power distribution device 101 further includes a second adhesive layer 52. Fig.15The structure of the second adhesive layer 52 is shown as an example, wherein the material of the second adhesive layer 52 can be any suitable insulating material, for example, the second adhesive layer 52 can be a polyurethane potting glue; for another example, the second adhesive layer 52 can also be a silicone potting glue; for another example, the second adhesive layer 52 can also be an epoxy resin potting glue, etc., and the present application does not impose specific restrictions on this. The second adhesive layer 52 is located on the board surface of the circuit board 2 where multiple switch devices 3 are fixed, that is, the first adhesive layer 51 and the second adhesive layer 52 are located on different board surfaces of the circuit board 2 ( Fig.15 The glue-filled bottom frame 6 is not shown).

[0110] Fig.16 The height contrast of the second adhesive layer 52 is shown as an example. In order to show the bottom structure of the switch device 3, the second adhesive layer 52 is in the form of a transparent shadow ( Fig.16 ). Fig.16 At least one switching device 3 includes a device shell 31 (the structure inside the device shell 31 is not shown in the drawings) and a pin 32, the pin 32 is fixed on the device shell 31, and the pin 32 of the switching device 3 passes through the circuit board 2 and is electrically connected to one or more metal sheets 4, and the second adhesive layer 52 covers the pin 32.

[0111] The second adhesive layer 52 covers the portion of the pin 32 located on the side of the circuit board 2 facing the device housing 31. Fig.16 Since the pin 32 passes through the circuit board 2, a part of the pin 32 is located on the side of the circuit board 2 facing the device shell 31, and the other part of the pin 32 is located on the side of the circuit board 2 away from the device shell 31. In this case, the part of the pin 32 located on the side of the circuit board 2 facing the device shell 31 is covered by the second adhesive layer 52 (the second adhesive layer 52 covers the pin 32). In this way, the switch device 3 has no metal conductor exposed outside the second adhesive layer 52, reducing the risk of short circuit or damage to the switch device 3 caused by condensation on the circuit board 2.

[0112] In one example, each switch device 3 includes a device housing 31 and pins 32, and the pins 32 of each switch device 3 are covered by the second adhesive layer 52. In another example, one or a part of the switch devices 3 among the plurality of switch devices 3 includes a device housing 31 and pins 32.

[0113] exist Fig.16In the example shown, the pins 32 are fixed on the surface of the device shell 31 facing the circuit board 2 (that is, the bottom of the device shell 31). In the thickness direction of the circuit board 2, the distance (L1) between the surface of the device shell 31 of each switch device 3 facing the circuit board 2 and the circuit board 2 is smaller than the height (L2) of the second adhesive layer 52. Since the height of the second adhesive layer 52 is higher than the distance between the bottom surface of the device shell 31 and the circuit board 2, the second adhesive layer 52 can fill the gap between the device shell 31 of each switch device 3 and the circuit board 2. That is, the second adhesive layer 52 will immerse the pins 32 of the switch device 3, and the second adhesive layer 52 protects the pins 32 of the switch device 3, reduces the possibility of condensation on the circuit board 2 wetting the pins 32 of the switch device 3 and causing a short circuit, and reduces the possibility of damage to the circuit board 2 due to condensation.

[0114] In some other examples, the pins 32 may be fixed on the side wall of the device shell 31 . The present application does not impose any specific limitation on the position of the pins 32 on the device shell 31 , as long as the second adhesive layer 52 can cover the pins 32 .

[0115] In addition, in some examples, reference Fig.16 In the thickness direction of the circuit board 2, the height (L3) of the device shell 31 of each switch device 3 is greater than the height (L2) of the second adhesive layer 52. In this way, the second adhesive layer 52 mainly immerses the pins 32 of the switch device 3, but does not cover (or immerse) the entire device shell 31 of the switch device 3, so that the height of the second adhesive layer 52 is reduced. On the basis of effectively protecting the electrical connection part (for example, the pins 32) of the switch device 3, the influence of the second adhesive layer 52 on the heat dissipation of the switch device 3 is reduced, and the amount of the second adhesive layer 52 is also reduced, which saves production costs and reduces the weight of the circuit board 2 and the power distribution device 101.

[0116] Regarding the formation of the second glue layer 52, in some examples, the power distribution device 101 further includes a glue-filled frame 9. Fig.17 An exploded view of a glue-filled frame 9 and a circuit board 2 is shown as an example. Fig.18 The structure of the glue potting frame 9 installed on the circuit board 2 is shown as an example. The glue potting frame 9 is located on one side of the circuit board 2 where multiple switch devices 3 are fixed. The glue potting frame 9 surrounds the multiple switch devices 3. Glue is poured into the glue potting frame 9. After the glue solidifies, a Fig.15 and Fig.16 The second adhesive layer 52 shown (wherein, Fig.15 and Fig.16 No glue filling frame 9 is provided in the embodiment. It is understandable that Fig.17 and Fig.18In the example shown, after the glue is poured into the glue-filling frame 9, the second glue layer 52 is located in the glue-filling frame 9, and the glue-filling frame 9 may not be removed and remains in the power distribution device 101. Fig.15 and Fig.16 In the example shown), the glue potting frame 9 can be removed after the second glue layer 52 is formed.

[0117] The glue-filled frame 9 may be made of any suitable material, for example, the glue-filled frame 9 may be a plastic frame; for another example, the glue-filled frame 9 may also be a rubber frame, etc. This application does not impose any specific limitation on this.

[0118] Among them, when the glue potting frame 9 is set, in order to make the height of the second glue layer 52 able to immerse the bottom of the switching device 3, in the thickness direction of the circuit board 2, the distance between the surface of each switching device 3 facing the circuit board 2 and the circuit board 2 is smaller than the height of the glue potting frame 9, and the gap between each switching device 3 and the circuit board 2 is located in the space enclosed by the glue potting frame 9.

[0119] In the case where the power distribution device 101 includes both the glue potting bottom frame 6 and the glue potting surrounding frame 9, the glue potting surrounding frame 9 and the glue potting bottom frame 6 are respectively located on different sides of the circuit board 2, and the circuit board 2 has a glue potting hole 21, and the glue potting hole 21 can be located on the inner side of the glue potting surrounding frame 9, for example, referring to Fig.19 , Fig.19 The positional relationship between the glue injection hole 21 and the glue injection frame 9 is shown as an example. The glue injection frame 9 may have an arc segment 94 protruding outward to surround the glue injection hole 21 inside the glue injection frame 9. In this example, the glue injection frame 9 is a special-shaped frame, and its structure is designed according to installation and matching requirements. In some other examples, the glue injection frame 9 may also be a rectangular frame or a circular frame, and the present application does not make specific restrictions on this.

[0120] During the glue pouring process, the glue pouring space 60 in the glue pouring bottom frame 6 can be firstly poured with glue through the glue pouring holes 21. After the glue in the glue pouring space 60 is filled with glue, glue pouring is continued. The glue will overflow from the glue pouring holes 21 and enter the space surrounded by the glue pouring frame 9. Then, glue is poured into the space surrounded by the glue pouring frame 9. After the glue pouring frame 9 is filled with glue and solidified, a second glue layer 52 will be formed. The glue pouring frame 9 can be left in the power distribution device 101, which has a better insulation effect and reduces the insulation distance requirement between other devices on the circuit board 2 and the switch device 3.

[0121] In some other examples, the glue injection hole 21 may also be located outside the glue injection surrounding frame 9 , and the glue injection bottom frame 6 and the glue injection surrounding frame 9 are injected with glue separately.

[0122] In addition, the board surface of the circuit board 2 where the switch device 3 is arranged is only glued on the part inside the glue-potting frame 9, and other positions are glued as needed, so that the glue pouring is more targeted, which can not only play a better protective role but also reduce the production cost.

[0123] When the first through hole 23 is provided on the circuit board 2 , the first through hole 23 is located outside the glue-filled frame 9 so as to allow the fastener to pass through.

[0124] In addition, the glue-filled frame 9 can be mounted on the circuit board 2 in any suitable manner, for example, Fig.19 The surface (surface S3) of the glue potting frame 9 facing the circuit board 2 is bonded and fixed to the board surface of the circuit board 2 through an adhesive layer (e.g., a back adhesive layer). During the glue potting process, the bonding between the surface of the glue potting frame 9 and the circuit board 2 can play a sealing role, reducing the risk of the glue in the glue potting frame 9 leaking out from between the glue potting frame 9 and the circuit board 2, which is conducive to the smooth progress of the glue potting process. In addition, the glue potting frame 9 and the circuit board 2 can also be fixed more firmly, reducing the possibility of the glue potting frame 9 falling off from the circuit board 2.

[0125] In some examples, the connection between the glue potting frame 9 and the circuit board 2 can be made more secure by increasing the bonding area between the glue potting frame 9 and the circuit board 2 , for example, by increasing the surface area of ​​the glue potting frame 9 facing the circuit board 2 .

[0126] In some other examples, the glue-filled frame 9 may also be fixed on the circuit board 2 by means of structures such as bolts, screws or rivets.

[0127] The glue filling frame 9 can be any suitable structure, for example, Fig.19 The glue-filling frame 9 includes a fixed surrounding frame 91 and a blocking plate 92. For example, the surrounding frame 91 and the blocking plate 92 are integrally formed. The surrounding frame 91 surrounds the plurality of switch devices 3. In the case where the glue-filling frame 9 has an arc segment 94, the arc segment 94 can be formed on the surrounding frame 91 and become a part of the surrounding frame 91. The blocking plate 92 protrudes from the surrounding frame 91 toward the plurality of switch devices 3. There is a gap between the blocking plate 92 and the circuit board 2. The glue poured into the surrounding frame 91 is used to fill the gap.

[0128] In some examples, reference Fig.19The blocking plate 92 may include multiple sections of blocking sub-plates 921, some of which protrude toward the switch device 3 by a shorter distance (e.g., the first blocking sub-plate 9211), and some of which protrude toward the switch device 3 by a longer distance (e.g., the second blocking sub-plate 9212). The blocking sub-plates 921 with a shorter protruding distance may avoid some devices disposed on the circuit board 2 and located inside the surrounding frame 91. In some other examples, the protruding distances of the multiple sections of blocking sub-plates 921 toward the switch device 3 may be equal.

[0129] Reference Fig.19 , a blocking sub-plate 921 can be arranged at a required position of the surrounding frame 91 according to requirements, and a plurality of blocking sub-plates 921 together form the blocking plate 92 of the present application. In some other examples, the blocking plate 92 can also be a complete plate without being divided into multiple sections. In some other examples, the blocking plate 92 can be annular and arranged around a plurality of switch devices 3.

[0130] Among them, compared with the surface of the switching device 3 facing the circuit board 2, the blocking plate 92 is farther away from the circuit board 2. In the process of pouring glue into the inner side of the surrounding frame 91, the surrounding frame 91 plays an outer limiting role on the glue, and limits the glue to the area enclosed by the surrounding frame 91. The blocking plate 92 limits the height of the glue, and the glue is poured into the gap between the blocking plate 92 and the circuit board 2 (it can also slightly exceed the blocking plate 92). The blocking plate 92 hinders the glue, thereby reducing the possibility of the glue overflowing from the top of the surrounding frame 91.

[0131] In some examples, the reference is returned Fig.17 The glue-filled surrounding frame 9 further includes a second positioning column 93, which is fixed to the surrounding frame 91. For example, the second positioning column 93 is integrally formed with the surrounding frame 91. The circuit board 2 has a second positioning hole 25, and the second positioning column 93 is inserted into the second positioning hole 25. The state of the second positioning column 93 after being inserted into the second positioning hole 25 can be referred to Fig.18 .

[0132] The cooperation between the second positioning column 93 and the second positioning hole 25 can play a role in positioning, making it easier to install the glue-filling frame 9 on the circuit board 2. Fig.17 and Fig.18 In the example shown, in order to make the installation position of the glue-filling frame 9 more accurate, a plurality of second positioning posts 93 (for example, two) may be provided. In some other examples, a single second positioning post 93 may also be provided. The present application does not specifically limit the number of second positioning posts 93. In the example where a plurality of second positioning posts 93 are provided, the number of second positioning holes 25 is the same as the number of second positioning posts 93, wherein each second positioning post 93 may be inserted into a corresponding second positioning hole 25.

[0133] In other examples, the power distribution device 101 may not include the housing 1 . In this example, the circuit board 2 is directly exposed to the outside and electrically connects the power conversion device 102 and the plurality of charging interfaces 103 .

[0134] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A power distribution device for distributing an input current into at least one path and outputting the current, characterized in that: The power distribution device comprises: Circuit boards; A plurality of switch devices for controlling on and off, wherein the plurality of switch devices are fixed on a surface of the circuit board; a metal sheet, the metal sheet being fixed to a surface of the circuit board facing away from the plurality of switch devices, the metal sheet being electrically connected to at least one of the plurality of switch devices; A first adhesive layer, wherein the first adhesive layer is located on the surface of the circuit board to which the metal sheet is fixed, wherein in the thickness direction of the circuit board, the thickness of the first adhesive layer is greater than the thickness of the metal sheet, and the first adhesive layer has a through opening, wherein a portion of the metal sheet is located in the first adhesive layer, and another portion of the metal sheet is exposed outside the first adhesive layer through the through opening.

2. The power distribution device according to claim 1, characterized in that: The power distribution device also includes a glue-potting bottom frame, which is located on the board surface of the circuit board where the metal sheet is fixed, and the glue-potting bottom frame includes a fixed enclosure and a bottom plate, the enclosure surrounds the outer periphery of the metal sheet, the bottom plate is located on the side of the enclosure away from the circuit board, a glue-potting space is provided between the bottom plate and the circuit board, the circuit board has a glue-potting hole connected to the glue-potting space, the bottom plate has an opening, the opening is connected to the through-portion, a portion of the metal sheet is exposed outside the glue-potting space through the opening, and the first glue layer is located in the glue-potting space.

3. The power distribution device according to claim 2, characterized in that: The surface of the enclosure facing the circuit board is bonded and fixed to the board surface of the circuit board.

4. The power distribution device according to claim 2, characterized in that: The glue-filling bottom frame also includes a baffle, which surrounds the opening and is fixed to the bottom plate. A portion of the circuit board is exposed outside the glue-filling space through the opening. The baffle protrudes toward the circuit board and avoids the metal sheet.

5. The power distribution device according to claim 4, characterized in that: The surface of the baffle facing the circuit board is bonded and fixed to the board surface of the circuit board.

6. The power distribution device according to claim 2, characterized in that: The glue-filled bottom frame further includes a first positioning column, which is fixed to the bottom plate or the enclosure plate. The circuit board has a first positioning hole, and the first positioning column is inserted into the first positioning hole.

7. The power distribution device according to claim 2, characterized in that: The power distribution device also includes a mounting base, the circuit board is fixed on the mounting base, the glue-filled bottom frame is located between the circuit board and the mounting base, a portion of the bottom plate is recessed toward the circuit board, and the portion of the bottom plate recessed toward the circuit board has relative convex and concave surfaces, the concave surface is located on the side of the convex surface away from the circuit board, and the concave surface is used to avoid the raised portion on the mounting base.

8. The power distribution device according to claim 1, characterized in that: The circuit board has a first through hole, the metal sheet has a second through hole communicating with the first through hole, and the second through hole is exposed outside the first adhesive layer through the through opening.

9. The power distribution device according to claim 8, characterized in that: The power distribution device also includes screws, a busbar and a mounting seat, the busbar is fixed on the mounting seat, the first adhesive layer is located on the side of the circuit board facing the mounting seat, the busbar passes through the through-hole and contacts the metal sheet, and the screw passes through the first through hole, the second through hole and the busbar and is threadedly connected to the mounting seat.

10. The power distribution device according to claim 1, characterized in that: The power distribution device further comprises a second adhesive layer, wherein the second adhesive layer is located on a board surface of the circuit board on which the plurality of switch devices are fixed; At least one of the switch devices includes a device shell and pins fixed on the device shell, the pins pass through the circuit board and are electrically connected to the metal sheet, and the second adhesive layer covers a portion of the pins located on a side of the circuit board facing the device shell.

11. The power distribution device according to claim 10, characterized in that: The power distribution device further comprises a glue-potting frame, which is located at one side of the circuit board where the plurality of switch devices are fixed, and surrounds the plurality of switch devices, and the second glue layer is located inside the glue-potting frame.

12. The power distribution device according to claim 11, characterized in that: The surface of the glue-filled surrounding frame facing the circuit board is bonded and fixed to the board surface of the circuit board.

13. The power distribution device according to claim 11, characterized in that: The glue-potting frame includes a fixed surrounding frame and a blocking plate. The surrounding frame surrounds the plurality of switch devices. The blocking plate protrudes from the surrounding frame toward the plurality of switch devices. There is a gap between the blocking plate and the circuit board.

14. The power distribution device according to claim 13, characterized in that: The glue-filled surrounding frame further includes a second positioning column, which is fixed on the surrounding frame. The circuit board has a second positioning hole, and the second positioning column is inserted into the second positioning hole.

15. A charging device, characterized in that: It comprises a power conversion device, a plurality of charging interfaces, and a power distribution device according to any one of claims 1 to 14, wherein the metal sheet of the power distribution device electrically connects the power conversion device and the plurality of charging interfaces, and the power distribution device is used to distribute the direct current output by the power conversion device to at least one of the charging interfaces.

Images