System and method for optical detection and repair of MiniLED chip after tin brushing and die bonding

Abstract

The invention relates to the technical field of semiconductor processing, in particular to an optical detection and repair system and method for a MiniLED chip after tin brushing and die bonding. The manufacturing method comprises a Mini LED production line, and a die bonding process, a repairing process and a reflow soldering process which are arranged on the Mini LED production line, through an automatic and precise production process, including key technologies such as SPI solder paste detection, double automatic optical detection, ultra-precise intelligent solder paste printing and nanoscale positioning die bonding, the production quality and efficiency of the MiniLED chip are remarkably improved, and the high qualified rate of products is ensured; through the synergistic effect of the optical detection module and the intelligent analysis module, the defects of the MiniLED chip are recognized and positioned, the efficient positioning and removing module is combined, defective products can be removed in time, production interruption is avoided, meanwhile, the stability of the product quality is guaranteed through bonding pad cleaning, activating treatment and re-detection procedures, and follow-up tracking management is facilitated.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a system and method for optical inspection and repair of MiniLED chips after tinning and die bonding. Background Art

[0002] As a new type of semiconductor light-emitting device, MiniLED has been widely used in the display and lighting fields due to its high brightness, low power consumption, and long life. However, in the early stages of production, various defects in chips are often encountered. In order to solve these technical problems, Chinese patent CN118737905A proposes a chip single-board processing method and a supporting computing device, which uses automatic optical detection to detect key areas and make corresponding treatments. However, this solution still faces some challenges: the MiniLED production process is complex and requires high equipment precision, which makes it difficult to improve product yield and the cost remains high. Especially in this stage from brushing tin to solid crystal to reflow furnace, since the solder paste has not yet melted and the product and chip have not yet been fully combined, any defects that occur at this time, such as position deviation, insufficient solder paste, missing chip or foreign matter contamination, will directly affect the subsequent welding quality and product performance. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a system and method for optical inspection and repair of MiniLED chips after tinning and die bonding.

[0004] The technical solution adopted by the present invention is as follows: A MiniLED chip tin brushing and die bonding optical inspection and repair system includes a MiniLED production line, and a die bonding process, a repair process, and a reflow soldering process arranged on the MiniLED production line, wherein: The die bonding process is used to fix the MiniLED chip to the predetermined position on the substrate and initially fix it with solder paste to ensure the initial connection between the chip and the substrate; The rework process includes an optical inspection module, an intelligent analysis module, a positioning and removal module, a pad cleaning and activation module, and a solder paste printing and die bonding module, among which: The optical inspection module is installed after the die bonding process and before the reflow process. It uses an ultra-high-resolution multi-spectral optical inspection lens to perform a full-scale scan of the MiniLED chip to detect chip defects, including position deviation, insufficient solder paste, missing chips, and foreign matter contamination. The intelligent analysis module is connected to the optical detection module and is used to receive the detection data for analysis and identify defects, and determine the defect location coordinates and detailed characteristic parameters; The positioning and removal module uses a vacuum scraper device to absorb defective chips or foreign objects according to the coordinate information provided by the intelligent analysis module, and introduces them into the collection container through a vacuum pipe; The pad cleaning and activation module uses alcohol cleaning, deep ultraviolet photolysis and supersonic airflow composite cleaning, and vacuum plasma activation treatment to ensure that the pad surface is clean and free of residue, improving the quality of subsequent solder paste printing and chip placement; The solder paste printing and die bonding module uses an ultra-precision intelligent solder paste printer to print an appropriate amount of uniform solder paste to the corresponding position of the substrate, and uses a nano-level positioning die bonding robot to accurately place and calibrate the new chip; Reflow process: After the rework process is completed, the MiniLED chip is sent to the reflow oven for soldering to form a firm connection between the chip and the substrate.

[0005] This technical solution realizes automated and precise production, and ensures the production quality and efficiency of MiniLED chips through the synergy of optical inspection and intelligent analysis, precise positioning and efficient removal, pad surface cleaning and activation, precise control of solder paste printing and solid crystal, and stability of the reflow soldering process. Specifically, the solid crystal process ensures the stability of the initial connection by precisely controlling the chip position and solder paste amount, reduces manual operation errors, and improves production efficiency; the optical inspection module uses an ultra-high-resolution multi-spectral optical inspection lens, which can scan the MiniLED chip in all directions to detect defects such as position deviation, insufficient solder paste, missing chips, and foreign matter contamination; the intelligent analysis module analyzes the inspection data, identifies defects and determines their position coordinates and detailed characteristic parameters; the positioning and removal module uses a vacuum scraper device to accurately absorb defective chips or foreign matter based on the coordinate information provided by the intelligent analysis module, and introduces them into the collection container through a vacuum pipe to ensure defective products. The pad cleaning and activation module ensures that the pad surface is clean and free of residue, improves the quality of subsequent solder paste printing and chip placement, and reduces defects in the welding process. The vacuum plasma activation treatment improves the activity of the pad, which is conducive to the close bonding of the solder paste and the pad. The solder paste printing and solid crystal module adopts an ultra-precision intelligent solder paste printer and a nano-level positioning solid crystal robot to achieve precise control of solder paste printing and accurate placement of chips, ensuring that the repaired MiniLED chip can meet the same quality standards as the initial production. The reflow process ensures the stability of the welding process by controlling parameters such as the temperature and time of the reflow oven.

[0006] In addition, the optical inspection and repair system and method for MiniLED chips after tinning and die bonding according to the present invention also have the following additional technical features: According to one embodiment of the present invention, the die bonding process includes an SPI solder paste detection module, which is used to detect the distribution of the solder paste after printing to ensure the printing quality.

[0007] This technical solution uses the SPI solder paste detection module to detect the distribution of solder paste after solder paste printing to ensure printing quality, thereby optimizing the die bonding process.

[0008] According to one embodiment of the present invention, the optical inspection module includes a dual automatic optical inspection module, which is used to inspect the substrate before and after die bonding to ensure the accuracy of chip placement and the consistency of solder paste printing.

[0009] This technical solution uses dual automatic optical inspection modules to inspect the substrate before and after die bonding to ensure the accuracy of chip placement and the consistency of solder paste printing, thereby improving the product qualification rate.

[0010] According to one embodiment of the present invention, the system further comprises a re-detection process, wherein: The re-inspection process is set after the reflow process and is used to conduct a comprehensive quality inspection on the repaired MiniLED chips to ensure that all defects have been effectively repaired and the product quality meets the standards.

[0011] This technical solution sets up a re-inspection process after the reflow soldering process to conduct a comprehensive quality inspection on the repaired MiniLED chips, ensuring that all defects have been effectively repaired, that the product quality meets the standards, and that the product quality is guaranteed.

[0012] According to one embodiment of the present invention, the re-inspection process includes an automatic optical inspection module and an electrical measurement module to ensure welding quality and chip function.

[0013] This technical solution ensures welding quality and chip function and verifies product reliability and stability by re-testing the automatic optical inspection module and electrical measurement module in the process.

[0014] According to one embodiment of the present invention, the system further comprises a data encryption and recording process, wherein: The data encryption and recording process encrypts the QR code of the MiniLED chips that have passed the inspection and records the relevant data for subsequent tracking and management.

[0015] This technical solution encrypts the QR code of the MiniLED chips that have passed the inspection and records the relevant data for subsequent tracking and management, thereby improving product traceability and management efficiency.

[0016] According to one embodiment of the present invention, the data encryption and recording process includes an MES module for recording data in the production process to achieve comprehensive monitoring and quality control of the production process.

[0017] This technical solution records the data in the production process through the MES module in the data encryption and recording process, realizes comprehensive monitoring and quality control of the production process, and ensures the stability and controllability of the production process.

[0018] In order to achieve the above-mentioned purpose, the present invention also provides an optical inspection and repair method after tinning and die bonding in a MiniLED production line.

[0019] A method for optical inspection and repair after tinning and die bonding in a MiniLED production line comprises the following steps: S1. Solder paste printing and preliminary inspection: On the MiniLED production line, solder paste printing is first performed, and the SPI solder paste inspection module is used to detect the solder paste distribution to ensure printing quality; S2. MiniLED chip bonding: The MiniLED chip is accurately placed at the predetermined position on the substrate and initially fixed with solder paste to ensure stable connection; dual automatic optical inspection modules are used before and after bonding to ensure accurate chip placement and consistency with solder paste printing; S3, optical inspection module scanning: After the die bonding is completed, an ultra-high-resolution multi-spectral optical inspection lens is used to comprehensively scan the chip to detect position deviation, insufficient solder paste, missing chips, and foreign matter contamination; S4. Intelligent analysis module identifies defects: Optical detection data is transmitted to the intelligent analysis module, which quickly analyzes and identifies defects and determines the location coordinates and characteristic parameters; S5. Positioning and removing defective chips or foreign objects: Based on the coordinate information of the intelligent analysis module, the positioning and removal module uses a vacuum scraper device to absorb defective chips or foreign objects and introduces them into a collection container through a vacuum pipe; S6, pad cleaning and activation: The pad surface is cleaned with alcohol, treated with deep ultraviolet photolysis and supersonic airflow composite cleaning, and vacuum plasma activation to ensure cleanliness without residue and improve the quality of subsequent processes; S7, solder paste printing and die bonding repair: After the pad is cleaned and activated, an ultra-precision intelligent solder paste printer is used to print an appropriate amount of uniform solder paste, and a nano-level positioning die bonding robot is used to accurately place and calibrate the new chip to complete the repair; S8, MiniLED core reflow: After the rework process, the MiniLED chip is sent into the reflow oven for soldering to form a firm connection; S9, re-testing process: After reflow soldering, use the automatic optical inspection module and electrical test module to fully inspect the repaired chips to ensure that the defect repair is effective and the product quality meets the standards; S10. Data encryption and recording: Encrypt the QR code of qualified MiniLED chips and use the MES module to record the production process data, including inspection, rework and re-inspection data, to achieve comprehensive monitoring and quality control, and facilitate subsequent tracking management.

[0020] This technical solution realizes optical inspection and rework after tin brushing and crystal bonding in the MiniLED production line. Specifically, in the solder paste printing and preliminary inspection stage, the quality of solder paste printing is ensured to lay a solid foundation for subsequent processes; in the process of crystal bonding of MiniLED chips, the chips are accurately placed and the dual automatic optical inspection modules are used to ensure that the chip placement is accurate and consistent with the solder paste printing to ensure the stability of the initial connection; the optical inspection module comprehensively scans the chip, and the intelligent analysis module quickly identifies defects, providing precise guidance for locating and removing bad chips or foreign objects; the pad cleaning and activation steps ensure that the pad surface is clean and free of residue, improving the quality of subsequent processes. Afterwards, the solder paste printing and crystal bonding repair steps use high-precision equipment to complete the repair to ensure the quality of the repair; the MiniLED chip forms a firm connection after reflow soldering, and the re-inspection process comprehensively inspects the repaired chip to ensure that the product quality meets the standards; the data encryption and recording steps mark qualified chips and record production process data to achieve comprehensive monitoring and quality control, which is convenient for subsequent tracking and management.

[0021] Compared with the prior art, the present invention has the following beneficial effects: (1) Through automated and precise production processes, including key technologies such as SPI solder paste inspection, dual automatic optical inspection, ultra-precision intelligent solder paste printing and nano-level positioning and bonding, the production quality and efficiency of MiniLED chips are significantly improved, ensuring a high product qualification rate.

[0022] (2) Through the synergy of optical detection and intelligent analysis modules, MiniLED chip defects can be identified and located. Combined with efficient positioning and removal modules, defective products can be removed in a timely manner to avoid production interruptions. At the same time, through pad cleaning and activation treatment and re-inspection processes, the stability of product quality is guaranteed and subsequent tracking and management is facilitated. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the system of the present invention.

[0024] Figure 2 It is a flow diagram of the method of the present invention.

[0025] In the figure: 1. Die bonding process; 2. Rework process; 3. Reflow process. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Example 1 like Figure 1 As shown, this embodiment provides a MiniLED chip tin brushing and die bonding optical inspection and repair system, including a MiniLED production line, and a die bonding process 1, a repair process 2, and a reflow soldering process 3 arranged on the MiniLED production line, wherein: The die bonding process 1 is used to fix the MiniLED chip at a predetermined position on the substrate and initially fix it with solder paste to ensure the initial connection between the chip and the substrate; Rework process 2, including optical inspection module, intelligent analysis module, positioning and removal module, pad cleaning and activation module and solder paste printing and die bonding module, including: The optical inspection module is installed after the die bonding process 1 and before the reflow process 3. It uses an ultra-high-resolution multi-spectral optical inspection lens to perform a full-scale scan of the MiniLED chip to detect chip defects, including position deviation, insufficient solder paste, missing chips, and foreign matter contamination. The intelligent analysis module is connected to the optical detection module and is used to receive the detection data for analysis and identify defects, and determine the defect location coordinates and detailed characteristic parameters; The positioning and removal module uses a vacuum scraper device to absorb defective chips or foreign objects according to the coordinate information provided by the intelligent analysis module, and introduces them into the collection container through a vacuum pipe; The pad cleaning and activation module uses alcohol cleaning, deep ultraviolet photolysis and supersonic airflow composite cleaning, and vacuum plasma activation treatment to ensure that the pad surface is clean and free of residue, improving the quality of subsequent solder paste printing and chip placement; The solder paste printing and die bonding module uses an ultra-precision intelligent solder paste printer to print an appropriate amount of uniform solder paste to the corresponding position of the substrate, and uses a nano-level positioning die bonding robot to accurately place and calibrate the new chip; Reflow process 3, after the rework process 2 is completed, the MiniLED chip is sent to the reflow oven for soldering to form a firm connection between the chip and the substrate.

[0028] like Figure 1As shown, this technical solution realizes automated and precise production, and ensures the production quality and efficiency of MiniLED chips through the synergy of optical inspection and intelligent analysis, precise positioning and efficient removal, pad surface cleaning and activation, precise control of solder paste printing and solid crystal, and stability of the reflow soldering process. Specifically, the solid crystal process 1 ensures the stability of the initial connection by precisely controlling the chip position and solder paste amount, reduces manual operation errors, and improves production efficiency; the optical inspection module uses an ultra-high-resolution multi-spectral optical inspection lens, which can scan the MiniLED chip in all directions to detect defects such as position deviation, insufficient solder paste, missing chips, and foreign matter contamination; the intelligent analysis module analyzes the inspection data, identifies defects and determines their position coordinates and detailed characteristic parameters; the positioning and removal module uses a vacuum scraper device to accurately absorb defective chips or foreign matter based on the coordinate information provided by the intelligent analysis module, and introduces them into the collection container through a vacuum pipe to ensure defective products. The pad cleaning and activation module ensures that the pad surface is clean and free of residue, improves the quality of subsequent solder paste printing and chip placement, and reduces defects in the welding process. The vacuum plasma activation treatment improves the activity of the pad, which is conducive to the close bonding of the solder paste and the pad. The solder paste printing and solid crystal module adopts an ultra-precision intelligent solder paste printer and a nano-level positioning solid crystal robot to achieve precise control of solder paste printing and accurate placement of chips, ensuring that the repaired MiniLED chip can meet the same quality standards as the initial production. The reflow process 3 ensures the stability of the welding process by controlling parameters such as the temperature and time of the reflow oven.

[0029] In addition, the optical inspection and repair system and method for MiniLED chips after tinning and die bonding according to the present invention also have the following additional technical features: According to one embodiment of the present invention, the die bonding process 1 includes an SPI solder paste detection module, which is used to detect the distribution of the solder paste after printing to ensure the printing quality.

[0030] This technical solution uses the SPI solder paste detection module to detect the distribution of solder paste after solder paste printing to ensure printing quality, thereby optimizing the die bonding process 1.

[0031] According to one embodiment of the present invention, the optical inspection module includes a dual automatic optical inspection module, which is used to inspect the substrate before and after die bonding to ensure the accuracy of chip placement and the consistency of solder paste printing.

[0032] This technical solution uses dual automatic optical inspection modules to inspect the substrate before and after die bonding to ensure the accuracy of chip placement and the consistency of solder paste printing, thereby improving the product qualification rate.

[0033] According to one embodiment of the present invention, the system further comprises a re-detection process, wherein: The re-inspection process is set after the reflow soldering process 3 and is used to perform a comprehensive quality inspection on the repaired MiniLED chip to ensure that all defects have been effectively repaired and the product quality meets the standards.

[0034] This technical solution sets up a re-inspection process after the reflow soldering process 3 to conduct a comprehensive quality inspection on the repaired MiniLED chip to ensure that all defects have been effectively repaired, the product quality meets the standards, and the product quality is guaranteed.

[0035] According to one embodiment of the present invention, the re-inspection process includes an automatic optical inspection module and an electrical measurement module to ensure welding quality and chip function.

[0036] This technical solution ensures welding quality and chip function and verifies product reliability and stability by re-testing the automatic optical inspection module and electrical measurement module in the process.

[0037] According to one embodiment of the present invention, the system further comprises a data encryption and recording process, wherein: The data encryption and recording process encrypts the QR code of the MiniLED chips that have passed the inspection and records the relevant data for subsequent tracking and management.

[0038] This technical solution encrypts the QR code of the MiniLED chips that have passed the inspection and records the relevant data for subsequent tracking and management, thereby improving product traceability and management efficiency.

[0039] According to one embodiment of the present invention, the data encryption and recording process includes an MES module for recording data in the production process to achieve comprehensive monitoring and quality control of the production process.

[0040] This technical solution records the data in the production process through the MES module in the data encryption and recording process, realizes comprehensive monitoring and quality control of the production process, and ensures the stability and controllability of the production process.

[0041] Example 2 Based on Example 1, Figure 2 As shown, this embodiment provides an optical inspection and repair method after tinning and die bonding in a MiniLED production line, comprising the following steps: S1. Solder paste printing and preliminary inspection: On the MiniLED production line, solder paste printing is first performed, and the SPI solder paste inspection module is used to detect the solder paste distribution to ensure printing quality; S2. MiniLED chip bonding: The MiniLED chip is accurately placed at the predetermined position on the substrate and initially fixed with solder paste to ensure stable connection; dual automatic optical inspection modules are used before and after bonding to ensure accurate chip placement and consistency with solder paste printing; S3, optical inspection module scanning: After the die bonding is completed, an ultra-high-resolution multi-spectral optical inspection lens is used to comprehensively scan the chip to detect position deviation, insufficient solder paste, missing chips, and foreign matter contamination; S4. Intelligent analysis module identifies defects: Optical detection data is transmitted to the intelligent analysis module, which quickly analyzes and identifies defects and determines the location coordinates and characteristic parameters; S5. Positioning and removing defective chips or foreign objects: Based on the coordinate information of the intelligent analysis module, the positioning and removal module uses a vacuum scraper device to absorb defective chips or foreign objects and introduces them into a collection container through a vacuum pipe; S6, pad cleaning and activation: The pad surface is cleaned with alcohol, treated with deep ultraviolet photolysis and supersonic airflow composite cleaning, and vacuum plasma activation to ensure cleanliness without residue and improve the quality of subsequent processes; S7, solder paste printing and die bonding repair: After the pad is cleaned and activated, an ultra-precision intelligent solder paste printer is used to print an appropriate amount of uniform solder paste, and a nano-level positioning die bonding robot is used to accurately place and calibrate the new chip to complete the repair; S8, MiniLED core reflow: After the rework process 2, the MiniLED chip is sent into the reflow oven for soldering to form a firm connection; S9, re-testing process: After reflow soldering, use the automatic optical inspection module and electrical test module to fully inspect the repaired chips to ensure that the defect repair is effective and the product quality meets the standards; S10. Data encryption and recording: Encrypt the QR code of qualified MiniLED chips and use the MES module to record the production process data, including inspection, rework and re-inspection data, to achieve comprehensive monitoring and quality control, and facilitate subsequent tracking management.

[0042] This technical solution realizes optical inspection and rework after tin brushing and crystal bonding in the MiniLED production line. Specifically, in the solder paste printing and preliminary inspection stage, the quality of solder paste printing is ensured to lay a solid foundation for subsequent processes; in the process of crystal bonding of MiniLED chips, the chips are accurately placed and the dual automatic optical inspection modules are used to ensure that the chip placement is accurate and consistent with the solder paste printing to ensure the stability of the initial connection; the optical inspection module comprehensively scans the chip, and the intelligent analysis module quickly identifies defects, providing precise guidance for locating and removing bad chips or foreign objects; the pad cleaning and activation steps ensure that the pad surface is clean and free of residue, improving the quality of subsequent processes. Afterwards, the solder paste printing and crystal bonding repair steps use high-precision equipment to complete the repair to ensure the quality of the repair; the MiniLED chip forms a firm connection after reflow soldering, and the re-inspection process comprehensively inspects the repaired chip to ensure that the product quality meets the standards; the data encryption and recording steps mark qualified chips and record production process data to achieve comprehensive monitoring and quality control, which is convenient for subsequent tracking and management.

[0043] Although the present invention is described in detail by referring to the accompanying drawings and in combination with the preferred embodiments, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, a person of ordinary skill in the art may make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions shall be within the scope of the present invention. Any person of ordinary skill in the art may easily think of changes or substitutions within the technical scope disclosed by the present invention, and these shall be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A MiniLED chip optical inspection and repair system after tinning and die bonding, characterized in that: The invention comprises a MiniLED production line, and a die bonding process (1), a rework process (2), and a reflow process (3) arranged on the MiniLED production line, wherein: The die bonding process (1) is used to fix the MiniLED chip at a predetermined position on the substrate and initially fix it with solder paste to ensure the initial connection between the chip and the substrate; The rework process (2) includes an optical inspection module, an intelligent analysis module, a positioning and removal module, a pad cleaning and activation module, and a solder paste printing and die bonding module, wherein: The optical inspection module is arranged after the die bonding process (1) and before the reflow soldering process (3), and uses an ultra-high resolution multi-spectral optical inspection lens to perform an all-round scan of the MiniLED chip to detect defects of the chip, including position deviation, insufficient solder paste, missing chip, and foreign matter contamination; The intelligent analysis module is connected to the optical detection module and is used to receive the detection data, analyze and identify defects, and determine the defect location coordinates and detailed characteristic parameters; The positioning and removal module uses a vacuum scraper device to absorb defective chips or foreign objects according to the coordinate information provided by the intelligent analysis module, and introduces them into the collection container through a vacuum pipe; The pad cleaning and activation module uses alcohol cleaning, deep ultraviolet photolysis and supersonic airflow composite cleaning, and vacuum plasma activation treatment to ensure that the pad surface is clean and free of residue, improving the quality of subsequent solder paste printing and chip placement; The solder paste printing and die bonding module uses an ultra-precision intelligent solder paste printer to print an appropriate amount of uniform solder paste to the corresponding position of the substrate, and uses a nano-level positioning die bonding robot to accurately place and calibrate the new chip; Reflow soldering process (3): After the rework process (2) is completed, the MiniLED chip is sent to the reflow soldering furnace for soldering to form a firm connection between the chip and the substrate.

2. The optical inspection and repair system for MiniLED chips after tinning and die bonding as claimed in claim 1, characterized in that: The die bonding process (1) includes an SPI solder paste detection module, which is used to detect the distribution of the solder paste after printing to ensure the printing quality.

3. The optical inspection and repair system for MiniLED chips after tinning and die bonding as claimed in claim 1, characterized in that: The optical inspection module includes a dual automatic optical inspection module, which is used to inspect the substrate before and after die bonding to ensure the accuracy of chip placement and the consistency of solder paste printing.

4. The optical inspection and repair system for MiniLED chips after tinning and die bonding as claimed in claim 1, characterized in that: The system also includes a re-testing process, wherein: The re-inspection process is set after the reflow process (3) and is used to perform a comprehensive quality inspection on the repaired MiniLED chip to ensure that all defects have been effectively repaired and the product quality meets the standards.

5. The optical inspection and repair system for MiniLED chips after tinning and die bonding as claimed in claim 4, characterized in that: The re-inspection process includes an automatic optical inspection module and an electrical measurement module to ensure welding quality and chip function.

6. The optical inspection and repair system for MiniLED chips after tinning and die bonding as claimed in claim 1, characterized in that: The system also includes a data encryption and recording process, wherein: The data encryption and recording process encrypts the QR code of the MiniLED chips that have passed the inspection and records the relevant data for subsequent tracking and management.

7. The optical inspection and repair system after tinning and die bonding of MiniLED chips according to claim 6, characterized in that: The data encryption and recording process includes an MES module, which is used to record data in the production process to achieve comprehensive monitoring and quality control of the production process.

8. A method for optical inspection and repair after tinning and die bonding in a MiniLED production line, using the optical inspection and repair system for MiniLED chips after tinning and die bonding as described in any one of claims 1 to 7, characterized in that: The steps include: S1. Solder paste printing and preliminary inspection: On the MiniLED production line, solder paste printing is first performed, and the SPI solder paste inspection module is used to detect the solder paste distribution to ensure printing quality; S2. MiniLED chip bonding: The MiniLED chip is accurately placed at the predetermined position on the substrate and initially fixed with solder paste to ensure stable connection; dual automatic optical inspection modules are used before and after bonding to ensure accurate chip placement and consistency with solder paste printing; S3, optical inspection module scanning: After the die bonding is completed, an ultra-high-resolution multi-spectral optical inspection lens is used to comprehensively scan the chip to detect position deviation, insufficient solder paste, missing chips, and foreign matter contamination; S4. Intelligent analysis module identifies defects: Optical detection data is transmitted to the intelligent analysis module, which quickly analyzes and identifies defects and determines the location coordinates and characteristic parameters; S5. Positioning and removing defective chips or foreign objects: Based on the coordinate information of the intelligent analysis module, the positioning and removal module uses a vacuum scraper device to absorb defective chips or foreign objects and introduces them into a collection container through a vacuum pipe; S6, pad cleaning and activation: The pad surface is cleaned with alcohol, treated with deep ultraviolet photolysis and supersonic airflow composite cleaning, and vacuum plasma activation to ensure cleanliness without residue and improve the quality of subsequent processes; S7, solder paste printing and die bonding repair: After the pad is cleaned and activated, an ultra-precision intelligent solder paste printer is used to print an appropriate amount of uniform solder paste, and a nano-level positioning die bonding robot is used to accurately place and calibrate the new chip to complete the repair; S8, MiniLED core reflow: After the rework process (2), the MiniLED chip is sent into the reflow oven for soldering to form a firm connection; S9, re-testing process: After reflow soldering, use the automatic optical inspection module and electrical test module to fully inspect the repaired chips to ensure that the defect repair is effective and the product quality meets the standards; S10. Data encryption and recording: Encrypt the QR code of qualified MiniLED chips and use the MES module to record the production process data, including inspection, rework and re-inspection data, to achieve comprehensive monitoring and quality control, and facilitate subsequent tracking management.

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