Sensor integrated circuit (IC) with an ambient light sensor and a proximity sensor facilitating over

Abstract

A sensor integrated circuit (IC) employing oppositely facing ambient light and proximity sensors, and related electronic devices and methods of manufacture. As an example, a sensor IC may be integrated into an electronic device (e.g., a wearable device) to detect proximity of a user and ambient light to control functionality of the electronic device. In order that a proximity sensor and an ambient light sensor are disposed outwardly in different (e.g., opposite) directions in a package in a sensor IC to align toward a user and a user experience with ambient light, the proximity sensor and the ambient light sensor are disposed on different sides of the sensor IC. In this manner, the ambient light sensor may face a direction of ambient light perceived by a user of the electronic device, and the proximity sensor detects the user from different sides of the electronic device.

Description

[0001] background

[0002] I. Public Domain

[0003] The field of the present disclosure relates to electronic devices, such as real-world computing devices, that incorporate environmental sensors for detecting ambient light to control display brightness and proximity sensors for detecting a user to control an operating mode of the electronic device.

[0004] II. Background

[0005] Computing devices can be used for extended reality applications, including virtual reality (VR), augmented reality (AR), and extended reality (XR) applications. For example, a reality computing device can display imaged real-world objects on a screen together with computer-generated information, such as images or text information. VR is a simulated experience that can be similar to or completely different from the real world. AR is a technology that changes your perception of reality by digitally overlaying information onto a live camera feed. XR, on the other hand, blends the physical and virtual worlds together and extends them beyond the background. A mobile computing device can be used as a computing device for a reality device while also providing the user with access to various information via a wireless communication system. An example of a reality mobile computing device is an electronic device in the form of head-mounted XR glasses, such as Figure 1 XR glasses 100 are shown. The XR glasses 100 are an electronic computing device that includes a computing device 102 that controls an integrated display 104 integrated into lenses 106, which allows a user to see VR images and / or the real world with objects added by the computing device 102.

[0006] The real computing device may include an integrated circuit (IC) including (s) ambient light sensor and (s) proximity sensor for addressing certain functionalities. The ambient light sensor is used in the real computing device to detect the ambient light conditions of the real device. The real computing device may include an electronic device that can control the brightness of the display based on the ambient lighting conditions detected by the ambient light sensor. The ambient light sensor is usually integrated into the real computing device so that (s) ambient light sensor faces outward from the user so that the ambient light sensor detects light from the same general direction as received by the user. The proximity sensor is integrated into the real computing device to detect whether the user is wearing the real computing device (for example, in the case where the real computing device is glasses or a head cover). The real computing device can control its operating mode based on the proximity sensor detecting the user as an object. For example, if the proximity sensor detects the user, the real computing device can be converted to an active power mode, where the real computing device can operate with higher power consumption to operate at a higher performance level. If the proximity sensor no longer detects the user within a determined period of time, the real computing device can be converted to an idle or sleep power mode to save power because higher performance is not concerned in this mode. The proximity sensor is typically integrated into the real computing device such that the proximity sensor is oriented toward the user (eg, facing the user) depending on how the real computing device is oriented when worn by the user, such that the proximity sensor can detect the user's use of the real computing device.

[0007] Public Overview

[0008] Various aspects disclosed herein include a sensor integrated circuit (IC) that employs an ambient light sensor and a proximity sensor facing oppositely. Related electronic devices and manufacturing methods are also disclosed. As an example, the sensor IC may be included in a reality computing electronic device (such as a user mobile and / or wearable reality computing device). The ambient light sensor receives ambient light in an ambient field of view of the ambient light sensor in the environment of the sensor IC. As an example, an electronic device including the sensor IC may adjust the brightness of its (all) displays based on the amount of ambient light detected by the ambient light sensor. The proximity sensor is configured to emit light from the sensor IC at a field angle in the emission field, and also detects return emission light reflected or scattered from another object (such as a user) in its adjacent field of view. As another example, an electronic device including the sensor IC may adjust its operating mode based on the amount of detected return emission light as an indication of a detected user of the electronic device. It may be important that the proximity sensor and the ambient light sensor face outward in different and / or opposite directions from each other due to the inherent configuration of the electronic device, whereby the user of the electronic device will be detected from the side of the electronic device opposite to the side where the user will perceive the ambient light. Thus, in an exemplary aspect, a sensor IC is provided that includes a proximity sensor and an ambient light sensor disposed adjacent to different (e.g., opposite) respective sides of the sensor IC. The proximity sensor and the ambient light sensor may be disposed in the sensor IC to face outward in opposite directions from one another in a single package. As an example, such an arrangement may also make a wearable electronic device incorporating the sensor IC more ergonomically feasible for integration into a wearable device because the orientation of the proximity sensor and the ambient light sensor in the sensor IC on different (e.g., opposite) sides may automatically align toward a user and the user's experience of ambient light when the wearable electronic device is designed to be worn. Furthermore, by disposing the proximity sensor and the ambient light sensor as integrated components facing different directions in a single sensor IC, the additional cost and / or area of ​​having to provide such sensors in multiple packages to enable such sensors disposed in an electronic device to face outward in different directions may be avoided.

[0009] Furthermore, in other exemplary aspects, the ambient field of view of the ambient light sensor and the emission field of the proximity sensor can be non-overlapping by positioning the proximity sensor and the ambient light sensor adjacent to different (e.g., opposing) respective sides of the sensor IC. This allows light emitted by the proximity sensor to not be received by the ambient light sensor, or to be received by the ambient light sensor at a reduced intensity as a false indication of ambient light. This can improve the accuracy of ambient light detection by the ambient light sensor, which in turn can allow an electronic device incorporating the sensor IC to adjust the brightness of the display(s) based on accurate detection of ambient light.

[0010] In one exemplary aspect, an ambient light sensor of a sensor IC includes an ambient visible light receiver (e.g., a PD) configured to receive visible light in an ambient field of view in a first direction toward a first side of the sensor IC to detect ambient light in the ambient field of view. The proximity sensor of the sensor IC includes a proximity light emitter (e.g., a light emitting diode (LED)) configured to emit light (e.g., infrared (IR) light) in a second direction opposite to the first direction in the emission field and outwardly from a second side of the sensor IC package. For example, the first and second sides of the sensor IC may be opposite sides. The proximity sensor also includes a proximity light receiver (e.g., a photodetector (PD)) configured to receive light (e.g., infrared (IR) light) emitted from the proximity light returned in its proximity field of view in the first direction toward the second side of the IC to allow detection of objects adjacent to the IC.

[0011] In addition, because the ambient visible light receiver may also be sensitive to receiving ambient IR light, the sensor IC may also include an optional ambient IR light receiver disposed on a second side of the sensor IC and configured to receive ambient IR light. An electronic device incorporating the sensor IC may use the IR light level detected by the ambient optional IR light receiver to compensate for (e.g., reduce or eliminate) the IR light received by the ambient visible light receiver. As another example, an optical filter disposed in the ambient visible light receiver's field of view may be provided to filter out or reduce the amount of IR light received by the ambient visible light receiver.

[0012] In another exemplary aspect, the sensor IC includes a circuit board and one or more semiconductor dies ("dies") mounted on the circuit board. The proximity sensor and the ambient light sensor can share the circuit board as a common circuit board to limit the pins, area, and cost of the sensor IC package. In one example, the ambient light sensor is disposed adjacent to the first die in the sensor IC package, and the proximity sensor is disposed adjacent to the second die in the sensor IC package. The second die as the top die can be vertically stacked on top of the first die as the bottom die as a three-dimensional (3D) stacked die module, wherein the first bottom side of the first die is disposed or coupled on the first top surface of the circuit board. The first bottom side of the first die is opposite to the second top side of the second die. In another example, the first and second dies can be disposed adjacent to each other, side by side, wherein each of their first bottom sides is disposed on or coupled to the first top surface of the circuit board. The first bottom sides of the first and second dies are adjacent to the top surface of the sensor IC package, and the second top sides of the first and second dies are the sides opposite to their respective first bottom sides. The ambient light sensor is disposed on or adjacent to a first bottom side of the first die such that its ambient field of view is in a first direction outward from a first side of the sensor IC package. The proximity sensor is disposed on or adjacent to a second top side of the second die on a second side of the sensor IC such that its proximity emission field is in a second direction opposite to the first direction and outward from a second side of the sensor IC package. In this manner, light emitted by the proximity sensor is in the proximity emission field in the second direction outward from the second side of the sensor IC and is outside the ambient field of view of the ambient sensor.

[0013] In another example, in order to provide an environmental sensor with an environmental field of view that is not blocked by the circuit board, a light pipe is provided in the circuit board. In one example, the light pipe includes an opening extending between the first and second surfaces of the circuit board, wherein the opening is adjacent to the environmental sensor. The opening forms an environmental field of view of the ambient light sensor. In this way, the ambient light sensor can receive ambient light in a first direction toward a first side of the sensor IC and a second surface of the circuit board through the opening of the circuit board that forms the environmental field of view. As a filtering (i.e., blocking) method, the diameter of the opening can be adjusted to control the desired angle of the environmental field of view. In another example, a filter can be disposed in or above the opening on the second surface of the circuit board to filter light of wavelengths contained in the light emitted by the proximity sensor.

[0014] In this regard, in one exemplary aspect, an IC is provided. The IC includes a first die, the first die including a first side and a second side opposite the first side. The IC also includes an ambient light sensor adjacent to the first side of the first die, the ambient light sensor outward from the first side of the first die in a first direction. The IC also includes a proximity sensor adjacent to the second side of the first die, the proximity sensor outward from the second side of the first die in a second direction opposite the first direction.

[0015] In another exemplary aspect, a method of manufacturing an IC is provided. The method includes providing a first die, the first die including a first side and a second side opposite the first side. The method also includes coupling an ambient light sensor adjacent to the first side of the first die, the ambient light sensor outward from the first side of the first die in a first direction. The method also includes coupling a proximity sensor adjacent to the second side of the first die, the proximity sensor outward from the second side of the first die in a second direction opposite the first direction.

[0016] In another exemplary aspect, an electronic device is provided. The electronic device includes a computing device and a display coupled to the computing device. The electronic device also includes an IC coupled to the computing device. The IC includes a first die, the first die including a first side and a second side opposite to the first side. The IC also includes an ambient light sensor adjacent to the first side of the first die, the ambient light sensor outward from the first side of the first die in a first direction. The IC also includes a proximity sensor adjacent to the second side of the first die, the proximity sensor outward from the second side of the first die in a second direction opposite to the first direction. The ambient light sensor is configured to receive visible light in an ambient field of view in a second direction toward the first side of the first die, and generate an ambient light signal including ambient light information indicating the amount of visible light received. The proximity sensor is configured to emit first light in an emission field in a first direction outward from the second side of the first die, receive at least a portion of the first light returned in a proximity field of view in a second direction toward the second side of the first die, and generate a proximity signal including proximity information indicating the proximity of an object to the IC. The computing device is configured to receive an ambient light signal, control brightness of a display based on ambient light information in the ambient light signal, receive a proximity signal, and control an operating mode of the computing device based on proximity information in the proximity signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a perspective view of an exemplary electronic device in the form of wearable reality computer glasses including an integrated computing system for controlling an integrated display;

[0019] Figure 2A and 2Bis a side view of an exemplary sensor integrated circuit (IC) including oppositely facing proximity sensors and ambient light sensors;

[0020] Figure 3 is a side view of a sensor IC including an ambient light sensor and a proximity sensor facing the same direction from the sensor IC;

[0021] Figure 4 yes Figure 2A and 2B A block diagram of a sensor IC including a proximity sensor configured to detect proximity of an object and an ambient light sensor configured to detect ambient light;

[0022] Figure 5 is a side view of another exemplary sensor IC including first and second dies stacked on top of each other adjacent to and coupled to a circuit board, wherein the sensor IC includes an ambient light sensor outward from a first side of the sensor IC and a proximity sensor outward from a second side of the sensor IC opposite the first side of the sensor IC;

[0023] Figure 6 is a side view of another sensor IC including first and second dies disposed adjacent to each other on a circuit board, wherein the sensor IC includes an ambient light sensor outwardly from a first side of the sensor IC and a proximity sensor outwardly from a second side of the sensor IC opposite the first side;

[0024] Figure 7 is with Figure 6 A side view of another exemplary sensor IC similar to the sensor IC in , wherein the first and second dies are disposed between an external circuit board;

[0025] Figure 8 is with Figure 4 A side view of another exemplary sensor IC similar to the sensor IC in , but having a second bottom circuit board disposed adjacent to the ambient light sensor and including a light pipe to allow the ambient field of view of the ambient light sensor to extend beyond the second circuit board;

[0026] Fig.9A and 9B The front and rear perspective views are respectively of an electronic device in the form of extended reality (XR) glasses, the electronic device including a sensor IC mounted in a nose bridge of the XR glasses, wherein the sensor IC includes oppositely facing proximity sensors and ambient light sensors, including but not limited to Figure 2A-2B and the sensor IC in 4-8;

[0027] Fig. 10A and 10B They are Fig.9A and9B A front perspective view and a side view of the XR glasses in FIG. 1 , but the sensor IC is installed in the left temple and / or the right temple of the XR glasses;

[0028] Fig.11A and 11B 1 and 2 are front and rear perspective views, respectively, of an electronic device in the form of a head mounted virtual reality (VR) display device, the electronic device including a sensor IC including oppositely facing proximity sensors and ambient light sensors, including but not limited to Figure 2A-2B and the sensor IC in 4-8;

[0029] Fig.12 is a flow chart illustrating an exemplary manufacturing process for manufacturing a sensor IC including oppositely facing proximity sensors and ambient light sensors, including but not limited to Figure 2A-2B and the sensor IC in 4-8;

[0030] Figures 13A-13C is a flow chart illustrating another exemplary manufacturing process for manufacturing a sensor IC including oppositely facing proximity sensors and ambient light sensors, including but not limited to Figure 2A-2B and the sensor IC in 4-8;

[0031] Figures 14A-14E is based on Figures 13A-13C exemplary manufacturing stages during the manufacture of a sensor IC using an exemplary manufacturing process in; and

[0032] Fig.15 is a block diagram of an exemplary electronic device in the form of a processor-based system that may include a sensor IC including oppositely facing proximity sensors and ambient light sensors, including but not limited to Figure 2A-2B and 4-8 and according to the manufacturing process (including but not limited to Figure 12-13C The sensor IC is manufactured using the exemplary manufacturing process in FIG.

[0033] Detailed Description

[0034] Referring now to the accompanying drawings, several exemplary aspects of the present disclosure are described. The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" is not necessarily to be construed as preferred or superior to other aspects.

[0035] Various aspects disclosed herein include a sensor integrated circuit (IC) that employs an ambient light sensor and a proximity sensor facing oppositely. Related electronic devices and manufacturing methods are also disclosed. As an example, the sensor IC may be included in a reality computing electronic device (such as a user mobile and / or wearable reality computing device). The ambient light sensor receives ambient light in an ambient field of view of the ambient light sensor in the environment of the sensor IC. As an example, an electronic device including the sensor IC may adjust the brightness of its (all) displays based on the amount of ambient light detected by the ambient light sensor. The proximity sensor is configured to emit light from the sensor IC at a field angle in the emission field, and also detects return emission light reflected or scattered from another object (such as a user) in its adjacent field of view. As another example, an electronic device including the sensor IC may adjust its operating mode based on the amount of detected return emission light as an indication of a detected user of the electronic device. It may be important that the proximity sensor and the ambient light sensor face outward in different and / or opposite directions from each other due to the inherent configuration of the electronic device, whereby the user of the electronic device will be detected from the side of the electronic device opposite to the side where the user will perceive the ambient light. Thus, in an exemplary aspect, a sensor IC is provided that includes a proximity sensor and an ambient light sensor disposed adjacent to different (e.g., opposite) respective sides of the sensor IC. The proximity sensor and the ambient light sensor may be disposed in the sensor IC to face outward in opposite directions from each other in a single package. As an example, such an arrangement may also make a wearable electronic device incorporating the sensor IC more ergonomically feasible for integration into a wearable device because, when the wearable electronic device is designed to be worn, the orientation of the proximity sensor and the ambient light sensor in the sensor IC on different (e.g., opposite) sides may automatically align toward a user and the user's experience of ambient light. Furthermore, by providing the proximity sensor and the ambient light sensor as integrated components facing different directions in a single sensor IC, the additional cost and / or area of ​​having to provide such sensors in multiple packages to enable such sensors disposed in an electronic device to face outward in different directions may be avoided.

[0036] Furthermore, in other exemplary aspects, the ambient field of view of the ambient light sensor and the emission field of the proximity sensor can be non-overlapping by positioning the proximity sensor and the ambient light sensor adjacent to different (e.g., opposing) respective sides of the sensor IC. This allows light emitted by the proximity sensor to not be received by the ambient light sensor, or to be received by the ambient light sensor at a reduced intensity as a false indication of ambient light. This can improve the accuracy of ambient light detection by the ambient light sensor, which in turn can allow an electronic device incorporating the sensor IC to adjust the brightness of the display(s) based on accurate detection of ambient light.

[0037] In this regard, Figure 2A and 2B 2 is a side view of an exemplary sensor IC 200 including a proximity sensor 202 and an ambient light sensor 204. As discussed in more detail below, the proximity sensor 202 is disposed in the sensor IC 200 to face opposite to the ambient light sensor 204. In this example, the proximity sensor 202 is disposed in the sensor IC 200 to face opposite to the ambient light sensor 204 in a vertical direction (Z-axis direction), but this is not limiting. As an example, the sensor IC 200 may be included in a computing electronic device (such as a user mobile and / or wearable reality computing device) to detect the proximity of a user to such an electronic device and detect ambient light around the electronic device.

[0038] refer to Figure 2A , the ambient light sensor 204 in the sensor IC 200 in FIG2 includes a visible light receiver 206, which is configured to detect visible light in the ambient visible light 208 in the environment of the sensor IC 200 from a first direction D1 (vertical Z-axis direction) in an ambient field of view 210 having a first central axis A1 in the environment of the sensor IC 200. The first central axis A1 extends in a vertical direction (Z-axis direction) orthogonal to the horizontal direction (X-axis and Y-axis directions). As an example, an electronic device including the sensor IC can adjust the brightness of its display(s) based on the amount of ambient visible light 208 detected by the visible light receiver 206.

[0039] Even though the visible light receiver 206 of the ambient light sensor 204 is configured to receive and detect visible light, the visible light receiver 206 may detect some IR light. It may be desirable to compensate for this detected IR light in the detected ambient visible light 208, so that the IR light received by the ambient light sensor 204 is not used, or its impact is reduced as an indication of the amount of visible light observed by the user of the electronic device. In this regard, the ambient light sensor 204 in the sensor IC 200 in FIG. 2 in this example also includes an optional second light receiver 212, which is an IR light receiver in this example. The second light receiver 212 is configured to receive and detect ambient IR light 208R in the ambient visible light 208. Therefore, in an example, an electronic device including the sensor IC 200 can interface with the second light receiver 212 to receive an indication of the amount of IR light detected in the ambient visible light 208 to compensate for (e.g., subtract from) the amount of ambient visible light 208 detected by the visible light receiver 206. This provides a more accurate representation of the amount of visible light detected in ambient visible light 208 .

[0040] Continue to refer Figure 2A, the proximity sensor 202 in the sensor IC 200 in this example includes a light emitter 214, which is configured to emit a first light 216 in a second direction D2 (vertical Z-axis direction) in an emission field 218 having a second central axis A2. The second central axis A2 extends in a vertical direction (Z-axis direction) orthogonal to the horizontal direction (X-axis and Y-axis directions). For example, the light emitter 214 can be a light emitting device (LED). The light emitter 214 can be an infrared (IR) light emitter (e.g., an IRLED) configured to emit IR light as the first light 216. The proximity sensor 202 also includes a proximity light receiver 220, which is configured to detect at least a portion of the first light 216 reflected and / or scattered from an object as light 216R returned to the proximity light receiver 220 in a proximity field of view 222. For example, the proximity light receiver 220 can be a photodetector, and more specifically, an IR photodetector configured to detect IR light. As an example, an electronic device including sensor IC 200 may use information about the amount of returned light 216R as an indication of a detected user of the electronic device to subsequently adjust its operating mode accordingly. For example, it may be desirable to place the electronic device in an active or ready mode when an object is detected using proximity sensor 202 as an indication that a user is using the electronic device.

[0041] In order to allow the proximity sensor 202 and the ambient light sensor 204 to be provided as part of the same sensor IC 200, but to be used in an electronic device to detect the proximity of a user and ambient light from opposite sides of the sensor IC 200, the proximity sensor 202 and the ambient light sensor 204 are disposed adjacent to different (e.g., opposite) sides S1, S2 of the sensor IC 200. Figure 2B A side view of the sensor IC 200 is shown in FIG. Figure 2BAs shown, the sensor IC 200 is provided in the form of an IC package 224. The IC package 224 includes a first die 226, an ambient light sensor 204, and a proximity sensor 202 encapsulated in an overmolding material 228 to form the IC package 224. The first die 226 includes circuitry configured to interface with the ambient light sensor 204 and the proximity sensor 202 to detect ambient light and objects adjacent to the sensor IC 200 (such as for the reasons discussed above). The first die 226 is coupled to the pins 230 of the IC package 224 via wire bonds 232. The first die 226 has a first surface 234(1) on a first side 236(1) and a second surface 234(2) on a second side 236(2) opposite to the first side 236(1) in a vertical direction (Z-axis direction). The first side 236(1) of the first die 226 is on the first side S1 of the sensor IC 200 and the IC package 224. The second side 236 ( 2 ) of the first die 226 is on the second side S2 of the sensor IC 200 and the IC package 224 .

[0042] Continue to refer Figure 2B , the first die 226 is also coupled to the first and second light receivers 206, 212 of the ambient light sensor 204 by wire bonds 238. The first and second light receivers 206, 212 of the ambient light sensor 204 are adjacent to the first surface 234(1) of the first die 226 on the first side 236(1) of the first die 226 on the first side S1 of the IC package 224. The first and second light receivers 206, 212 of the ambient light sensor 204 are oriented so that their detector components 240, 242 face outward from the first side S1 of the IC package 224 in a third direction D3 in the vertical direction (Z-axis direction). The detector components 240, 242 are components that receive light and are sensitive to electromagnetic radiation of the received light (such as through a photoelectric or photochemical effect). Thus, the first and second light receivers 206, 212 of the ambient light sensor 204 are configured to receive ambient visible light 208 (e.g., light emitted in the first direction D1 (also in the second direction D2) toward the first side 236(1) of the first die 226 on the first side S1 of the IC package 224. Figure 2A shown).

[0043] In addition, if Figure 2BAs shown, the light emitter 214 and the proximity light receiver 220 of the proximity sensor 202 are adjacent to the second surface 234(2) of the first die 226 on the second side 236(2) of the first die 226 on the second side S2 of the IC package 224. The light emitter 214 is directly coupled to the second surface 234(2) of the first die 226 and is electrically connected to the first die 226. The proximity light receiver 220 is electrically coupled to the first die 226 through (a plurality of) wire bonds 239. The light emitter 214 and the proximity light receiver 220 of the proximity sensor 202 are oriented so that their respective emitter components 244 and detector components 246 face outward from the second side S2 of the IC package 224 in a second direction D2 that is opposite to the third direction D3 that the ambient light sensor 204 faces in a vertical direction (Z-axis direction). The emitter component 244 is a component in the light emitter 214 that emits light. The detector component 246 of the proximity light receiver 220 is a component that receives light and is sensitive to electromagnetic radiation of the received light (such as through a photoelectric or photochemical effect). Thus, the light emitter 214 of the proximity sensor 202 is configured to emit the first light 216 outwardly from the second side 236(2) of the first die 226 on the second side S2 of the IC package 224 in the second direction D2 (see Figure 2A The proximity light receiver 220 of the proximity sensor 202 is configured to receive and detect light (including light emitted from the second side 236(2) of the first die 226 on the second side S2 of the IC package 224) in a fourth direction D4 (also toward the first direction D1). Figure 2A Light emitter 214 is shown emitting light 216).

[0044] In this way, the arrangement of the sensor IC 200 allows the sensor IC 200 to be integrated into an electronic device in a more ergonomically feasible manner because the orientation of the proximity sensor and the ambient light sensor in the sensor IC on different (e.g., opposite) sides can automatically align toward the user and the user's experience of ambient light when the wearable electronic device is designed to be worn. In addition, by providing the proximity sensor 202 and the ambient light sensor 204 as integrated components facing different directions in a single sensor IC 200, the additional cost and / or area of ​​having to provide such proximity sensors 202 and ambient light sensors 204 in multiple packages to enable such sensors provided in the electronic device to face outward in different directions can be avoided.

[0045] In addition, if Figure 2AAs shown, the ambient field of view 210 of the ambient light sensor 204 and the emission field 218 of the proximity sensor 202 can be non-overlapping, so that the light 216 emitted by the proximity sensor 202 is not received by the ambient light sensor 204, or is received by the ambient light sensor 204 at a reduced intensity as a false indication of ambient light. This can improve the accuracy of ambient light detection performed by the ambient light sensor 204, which in turn can allow an electronic device incorporating the sensor IC 200 to adjust the brightness of the display(s) based on the accurate detection of ambient visible light 208. This arrangement can also make a wearable electronic device incorporating the sensor IC 200 more ergonomically feasible for integration into a wearable device, because when the wearable electronic device is designed to be worn, the orientation of the proximity sensor 202 and the ambient light sensor 204 in the sensor IC 200 on different (e.g., opposite) S1, S2 sides can automatically align toward the user and the user's experience of the ambient visible light 208.

[0046] therefore, Figure 2A and 2B The sensor IC 200 in FIG. 1 is different from a sensor IC that incorporates a proximity sensor and an ambient light sensor on the same side of the sensor IC that transmit and receive light on the same side of the sensor IC, such as Figure 3 The sensor IC shown in sensor IC300 in FIG. Figure 3 As shown, sensor IC 300 includes proximity sensor 302 and ambient light sensor 304 both disposed adjacent to a same second side 306(2) of die 308. Second side 306(2) of die 308 is on second side S4 of sensor IC 300. First side 306(1) of die 308 is on first side S3 of sensor IC 300. Figure 3 Such an arrangement of sensor IC 300 in FIG. 300 may not allow sensor IC 300 to be feasibly incorporated into a wearable electronic device because the orientation of proximity sensor 302 and ambient light sensor 304 in sensor IC 300 is outward from the same side S4 of sensor IC 300. Thus, proximity sensor 302 or ambient light sensor 304, which are part of the same sensor IC 300 and its packaging, will not be aligned toward the user for detecting its proximity to the electronic device including sensor IC 300, and will not be aligned toward the direction of ambient light perceived by the user of the electronic device. Furthermore, in FIG. Figure 3 In the sensor IC 300 in FIG. 1 , the ambient light sensor 304 may receive light emitted by the proximity sensor 302 , which may result in inaccurate ambient light detection.

[0047] Figure 4 yes Figure 2A and 2BFIG. 2 is a block diagram of a sensor IC 200 illustrating an exemplary architecture of components in the sensor IC 200 including a proximity sensor 202 and an ambient light sensor 204. Figure 4 As shown, the proximity sensor 202 includes a light emitter 214, which in this example includes an emitter component 244 in the form of an IR LED 402. The IR LED 402 is oriented to emit light outwardly from the sensor IC 200, such as Figure 2A As shown and described above. The proximity sensor 202 includes an IRLED drive circuit 403, which is configured to drive current to the IR LED 402 so that the IR LED 402 emits IR light as the first light 216 (also referred to herein as "IR light 216"). If an object is in the path of the IR light 216 and reflects or scatters at least a portion of the light emitter 214 as return light 216R, the proximity sensor 202 also includes a proximity light receiver 220, which includes a detector assembly 246 in the form of an IR photodetector 404. The IR photodetector 404 is configured to receive and detect the IR light, including the return light 216R. The proximity light receiver 220 also includes a light suppression amplifier 406, which is configured to amplify a signal received from the IR light detector 404 and generated due to the IR photodetector 404 absorbing the IR light.

[0048] Continue to refer Figure 4 , sensor IC 200 also includes an ambient light sensor 204 that includes a visible light receiver 206. In this example, detector assembly 240 includes an optical filter 407 that is configured to receive and filter ambient visible light 208 and direct the filtered ambient visible light 208 toward detector assembly 240 in the form of a visible light photodetector 408. Visible light photodetector 408 is coupled to an amplifier 410 (e.g., an operational amplifier) ​​to amplify a signal generated by visible light photodetector 408 in response to receiving ambient visible light 208. In this example, to share front-end circuitry between proximity sensor 202 and ambient light sensor 204, sensor IC 200 includes a shared analog switch 411. The analog switch 411 can be switched to couple the proximity sensor 202 or the ambient light sensor 204 to an analog-to-digital (ADC) controller 412 circuit that converts the proximity signal 414(1) and the ambient light signal 414(2) generated by the corresponding proximity light receiver 220 and the visible light receiver 206 into a digital signal 415 representing the detected light 216R, 208. The sensor IC 200 includes a selection logic circuit 416 that is controlled by a data register 424 to switch the analog switch 411.

[0049] The sensor IC 200 also includes a corresponding proximity sensor control logic circuit system 418, which is configured to activate and deactivate the LED plus generator 420 in the light emitter 214 in the proximity sensor 202 to cause the IR LED driver circuit 403 to cause the IR LED 402 to emit IR light 216. The proximity sensor control logic circuit system 418 is also configured to receive a digital signal 415 indicating the amount of return light 216R detected by the proximity light receiver 220. The sensor IC 200 also includes an ambient light control logic circuit system 422, which is configured to receive a digital signal 415 indicating the amount of ambient visible light 208 detected by the visible light receiver 206 of the ambient light sensor 204. The ambient light control logic circuit system 422 and the proximity sensor control logic circuit system 418 interface with a data register 424 that can be written by a controller (such as a microcontroller or microprocessor) through an interface circuit 426. The data registers 424 are mapped to specific registers assigned to the proximity sensor 202 and the ambient light sensor 204 such that writing data to these specific registers allows an external device to control the operation of the proximity sensor 202 and the ambient light sensor 204. The ambient light control logic circuit system 422 and the proximity sensor control logic circuit system 418 also write data received via the digital signal 415 regarding the return light 216R detected from the proximity sensor 202 and the ambient light sensor 204 and the detected ambient visible light 208 to determine whether an object is detected nearby and the ambient light conditions of the sensor IC 400.

[0050] Continue to refer Figure 4, an electronic device 428 as part of a computing device 430 may interface with the sensor IC 200 through the interface circuit 426 of the sensor IC 200. The electronic device 428 may include a controller 432 (e.g., a microcontroller, a microprocessor) that interfaces with the interface circuit 426 of the sensor IC 200 to control certain features of the electronic device 428 using proximity and ambient light data from the sensor IC 200. For example, the computing device 430 may include a display 434 controlled by the controller 432. The controller 432 is configured to retrieve or receive ambient light information 436 indicating the amount of ambient visible light 208 detected by the ambient light sensor 204 from the sensor IC 200 through the interface circuit 426. The controller 432 is also configured to retrieve or receive proximity information 438 indicating the proximity of an object detected by the proximity sensor 202 from the sensor IC 200 through the interface circuit 426. The controller 432 may be configured to adjust the brightness of the display 434 based on the ambient light information 436. For example, the controller 432 may reduce the brightness of the display 434 based on the detected increase in the amount of ambient visible light 208. The controller 432 may also be configured to control the operating mode of the electronic device 428 based on the proximity information 438. For example, the controller 432 may cause the electronic device 428 to enter an idle or sleep mode with reduced functionality to reduce power consumption when an object (e.g., a user) is not detected based on the proximity information 438. The controller 432 may cause the electronic device 428 to enter an active or wake-up mode with increased functionality when an object (e.g., a user) is detected based on the proximity information 438, which consumes more power.

[0051] In addition to IC package 224 of sensor IC 200 in FIG. 200 , a sensor IC having a proximity sensor oriented to face opposite to the ambient light sensor to reduce or prevent the ambient light sensor from receiving light emitted from the proximity sensor may also be provided in other packaging configurations. In this regard, Figure 5 5 is a side view of another exemplary sensor IC 500 including an IC package 502, which in this example includes a first bottom die 504(1) and a second top die 504(2) adjacent to each other and stacked on top of each other in a vertical direction (Z-axis direction). The first die 504(1) is coupled to a circuit board 506 as part of the IC package 502. Note that the circuit board 506 can be, for example, a printed circuit board (PCB) or a package substrate. Pins 508 physically and electrically couple the first and second dies 504(1), 504(2) to the circuit board 506. The ambient light sensor 204 (e.g., Figure 2A and 2BThe ambient light sensor 204 in the sensor IC 200 is disposed adjacent to and coupled to the first die 504(1) on the first side 510(1) of the first die 504(1). The first die 504(1) also has a second side 510(2) adjacent to the first side 511(1) of the second die 504(2).

[0052] Figure 5 The ambient light sensor 204 in the sensor IC 500 in FIG. 5 has only a visible light receiver 206. Figure 2A and 2B The discussion of ambient light sensor 204 and its light emission in sensor IC 200 in FIG. 2 may be applicable to Figure 5 5. The ambient light sensor 204 in the sensor IC 500 in FIG. 5 is oriented outward in a fifth direction D5 from a first side S5 of the IC package 502 in a vertical direction (Z-axis direction). The proximity sensor 202 is disposed adjacent to and coupled to a second side 511(2) of the second die 504(2), and is oriented outward in a sixth direction D6 opposite to the fifth direction D5 from a second side S6 of the IC package 502 in a vertical direction (Z-axis direction). Figure 5 The proximity sensor 202 in the sensor IC 500 in FIG. 5 may be similar to Figure 2A and 2B 200 in the proximity sensor IC 202. Thus, in this orientation, the proximity sensor 202 is oriented to face opposite to the ambient light sensor 204 to reduce or avoid the ambient light sensor receiving light from the ambient light sensor 204. Figure 2A and 2B The proximity sensor 202 provided in the sensor IC 200 in FIG.

[0053] Continue to refer Figure 5, the circuit board 506 has a first surface 512(1) and a second surface 512(2) opposite to the first surface 512(1) in a vertical direction (Z-axis direction). The first tube core 504(1) is adjacent to and coupled to the second surface 512(2) of the circuit board 506. In order to prevent the circuit board 506 from blocking the ambient field of view 210 of the ambient light sensor 204, the circuit board 506 also includes a light pipe 518. In this example, the light pipe 518 is an opening 520 in the circuit board 506 extending from the first surface 512(1) to the second surface 512(2). The first tube core 504(1) is coupled to the ambient light sensor 204 and is placed on the circuit board 506 so that the ambient light sensor 204 is disposed adjacent to the opening 520. In this way, the detector assembly 240 of the ambient light sensor 204 is provided with a field of view 210 to receive ambient light through the opening 520 in the circuit board 506. The opening 520 in the circuit board 506 has a first diameter DIA1 that controls an angle Φ1 of the ambient field 210 for receiving ambient light emitted in a sixth direction D6 toward the second surface 512(1) of the circuit board 506 and the first side 510(1) of the first die 504(1).

[0054] Figure 6 is with Figure 5 A side view of another sensor IC 600 similar to the sensor IC 500 in FIG. 1 , except that Figure 6 The sensor IC 600 in FIG. 5 has first and second dies 504 ( 1 ), 504 ( 2 ) disposed side by side and adjacent to each other on a circuit board 506 . Figure 5 The sensor IC 500 and Figure 6Common elements between the sensor ICs 600 in FIG. 6 are shown with common element numbers and are not described again. The first die 504(1) is disposed adjacent to and on the second surface 512(1) of the circuit board 506. The second die 504(2) is also disposed on the second surface 512(1) of the circuit board 506. The second die 504(2) is adjacent to the first die 504(1) in the horizontal direction (X-axis and Y-axis directions). The ambient light sensor 204 is disposed adjacent to and coupled to the first die 504(1) on the first side 510(1) of the first die 504(1). The ambient light sensor 204 is oriented outward in a fifth direction D5 from the first side S5 of the IC package 602 in the vertical direction (Z-axis direction). The proximity sensor 202 is disposed adjacent to and coupled to the second side 511(2) of the second die 504(2) and is oriented outwardly in a vertical direction (Z-axis direction) from the second side S6 of the IC package 502 in a sixth direction D6 that is opposite to the fifth direction D5. Thus, in this orientation of the sensor IC 600, the proximity sensor 202 is oriented to face opposite to the ambient light sensor 204 to reduce or prevent the ambient light sensor 204 from receiving light from the ambient light sensor 204. Figure 2A and 2B The proximity sensor 202 provided in the sensor IC 200 in FIG.

[0055] as Figure 5 Like the sensor IC 500 in Figure 6 In the sensor IC 600 of FIG. 5 , to prevent the circuit board 506 from blocking the ambient field of view 210 of the ambient light sensor 204, the circuit board 506 also includes a light conduit 518. In this example, the light conduit 518 is an opening 520 in the circuit board 506 that extends from the first surface 512(1) to the second surface 512(2). The first die 504(1) and its coupled ambient light sensor 204 are positioned on the circuit board 506 such that the ambient light sensor 204 is disposed adjacent to the opening 520. In this manner, the detector assembly 240 of the ambient light sensor 204 is provided with the ambient field of view 210 to receive ambient light through the opening 520 in the circuit board 506.

[0056] Figure 7 is a side view of another exemplary sensor IC 700, which is provided as an IC package 702 and is similar to Figure 5 The sensor IC 500 in Figure 7 In the sensor IC 700 , a second circuit board 704 is provided in the IC package 702 , wherein the first and second dies 504 ( 1 ), 504 ( 2 ) are disposed between the first and second circuit boards 506 , 704 . Figure 5The sensor IC 500 and Figure 7 Components common between the sensor ICs 700 in the embodiment of the present invention are shown with common component numbers and will not be described again. Because the second circuit board 704 is disposed adjacent to the second side 511(2) of the second die 504(1), the second circuit board 704 will block the emission field 218 and the adjacent field of view 222 of the corresponding light emitter 214 and the adjacent light receiver 220 of the proximity sensor 202. However, as with the light pipe 518 provided in the first circuit board 506 for the ambient light sensor 204, the second circuit board 704 also includes a second light pipe 706 and a third light pipe 708 in the form of respective second and third openings 710, 712. The light pipes 706, 708 are provided so that the emission field 218 and the adjacent field of view 222 of the corresponding light emitter 214 and the adjacent light receiver 220 of the proximity sensor 202 are not blocked by the second circuit board 704.

[0057] In this regard, if Figure 7 As shown, in this example, a second opening 710 in the second circuit board 704 extends from a first surface 714(1) of the second circuit board 704 to a second surface 714(2) of the second circuit board 704. A third opening 712 in the second circuit board 704 also extends from the first surface 714(1) of the second circuit board 704 to the second surface 714(2) of the second circuit board 704. The second die 504(2) and its coupled proximity sensor 202 are disposed on the second circuit board 704 such that the light emitter 214 and the proximity light receiver 220 of the proximity sensor 202 are disposed adjacent to the respective second and third openings 710, 712. In this manner, the light emitter 214 of the proximity sensor 202 is provided with an emission field 218 to emit light through the second opening 710 in the second circuit board 704. In addition, the proximity light receiver 220 of the proximity sensor 202 is provided with a proximity field of view 222 to receive light through the third opening 712 in the second circuit board 704.

[0058] Figure 8 is a side view of another exemplary sensor IC 800, which is provided as an IC package 802 and is similar to Figure 5 The sensor IC 500 in Figure 8 In sensor IC 800, a second circuit board 804 is provided in IC package 802, disposed below first surface 512(1) of circuit board 506. Second circuit board 804 is coupled to circuit board 506 via external connector 806 (e.g., which may be solder bumps or ball grid array (BGA) interconnects). Figure 5 The sensor IC 500 and Figure 8Components common between sensor ICs 800 in FIG. 5 are shown with common component numbers and will not be described again. Because second circuit board 804 is disposed adjacent to first surface 512(1) of circuit board 506, second circuit board 804 will block ambient field of view 210 of visible light receiver 206 of ambient light sensor 204. However, as with light pipe 518 provided in first circuit board 506 for ambient light sensor 204, second circuit board 804 also includes second light pipe 808 in the form of second opening 810. Second light pipe 808 is provided so that ambient field of view 210 of visible light receiver 206 of ambient light sensor 204 will not be blocked by second circuit board 804.

[0059] In this regard, if Figure 8 As shown, in this example, the second opening 810 in the second circuit board 804 extends from the first surface 814(1) of the second circuit board 804 to the second surface 814(2) of the second circuit board 804. The second circuit board 804 is aligned relative to the first circuit board 506 so that the opening 520 in the first circuit board 506 and the second opening 810 in the second circuit board 804 at least partially overlap in the vertical direction (Z-axis direction). In this way, the visible light receiver 206 of the ambient light sensor 204 is provided with the ambient field of view 210 to receive light through the second opening 810 in the second circuit board 804 and the opening 520 in the first circuit board 506.

[0060] Figure 2A-2B The sensor ICs 200, 500, 600, 700, 800 of and 4-8 may be incorporated or integrated into electronic devices, including but not limited to user-wearable or mobile electronic devices, to detect ambient light and proximity. In this regard, Fig.9A and 9B 902 are front and rear perspective views, respectively, of a device 900 in the form of extended reality (XR) glasses 902, which are designed to be worn by a user and include a sensor IC 904 mounted in a nose bridge 906 of the XR glasses 902. The sensor IC 904 may be, for example, Figure 2A-2B Any of the sensor ICs 200, 500, 600, 700, 800 in 4-8. The sensor IC 904 includes a proximity sensor 908 and an ambient light sensor 910 facing oppositely to reduce or prevent the ambient light sensor 910 from receiving light emitted from the proximity sensor 908. Fig.9A As shown in the front view of the XR glasses 902, the ambient light sensor 910 is adjacent to, exposed from, and faces outward from the front side 912 of the XR glasses 902, such that the ambient light sensor 910 receives ambient light in the same direction as perceived by the user wearing the XR glasses 902. Fig. 9BAs shown in the rear view of the XR glasses 902, the proximity sensor 908 is adjacent to, exposed from, and facing outwardly of a rear side 914 of the XR glasses 902, so that the proximity sensor 908 can detect when a user brings the XR glasses 902 close to them when they are about to wear or are wearing the XR glasses 902. The orientation in which the proximity sensor 908 and the ambient light sensor 910 are disposed on opposite sides of the sensor IC 904 is particularly advantageous in this arrangement of the XR glasses 902, as the desired orientation is for the proximity sensor 908 to be exposed and facing outwardly from the rear side 914 of the XR glasses 902, and for the ambient light sensor 910 to be exposed and facing outwardly from the front side 912 of the XR glasses 902. Thus, having the proximity sensor 908 and the ambient light sensor 910 already disposed on opposite sides of the sensor IC 904 means that the sensor IC 904 can be integrated into the XR glasses 902 without requiring a routing or rerouting interface to the proximity sensor 908 or the ambient light sensor 910 (if the proximity sensor 908 and the ambient light sensor 910 are not located on opposite sides of the sensor IC 904).

[0061] The XR glasses 902 may have an integrated display 916 that may be controlled by an electronic device 918. The electronic device 918 is also interfaced with the sensor IC 904 so that the electronic device 918 retrieves or receives ambient light information from the sensor IC 904 indicating the amount of ambient light detected by the ambient light sensor 910. The electronic device 918 may be configured to adjust the brightness of the display 916 based on the ambient light information. For example, the electronic device 918 may reduce the brightness of the display 916 according to an increase in the amount of ambient light detected. The electronic device 918 is also configured to retrieve or receive proximity information from the sensor IC 904 indicating the proximity of an object detected by the proximity sensor 908. The electronic device 918 may also be configured to control an operating mode of the electronic device 918 based on the proximity information. For example, the electronic device 918 may cause the electronic device 918 to enter an idle or sleep mode with reduced functionality to reduce power consumption when an object (e.g., a user) is not detected based on the proximity information. The electronic device 918 may enter an active or awake mode with increased functionality when an object (eg, a user) is detected based on the proximity information, which causes more power to be consumed.

[0062] Fig. 10A and 10B They are Fig.9A and 9B 902, but the sensor IC 904 is mounted in the left temple 920 of the XR glasses 902 opposite the right temple 922. The left and right temples 920, 924 protrude from the front of the XR glasses 902 to facilitate the user to wear the XR glasses 902 on their head. Fig. 10A and 10B As shown, in this example, the ambient light sensor 910 is adjacent to the outer side 924 of the left temple 922 of the XR glasses 902, exposed from the outer side 924 of the left temple 922 of the XR glasses 902, and faces outward, so that the ambient light sensor 910 receives ambient light in a direction outward from the XR glasses 902. In this example, the proximity sensor 908 is adjacent to the back side 914 of the left temple 922, exposed from the back side 914 of the left temple 922, and faces outward, so that the proximity sensor 908 can detect when the user brings the XR glasses 902 close to them when they are about to wear or are wearing the XR glasses 902. The orientation in which the proximity sensor 908 and the ambient light sensor 910 are disposed on opposite sides of the sensor IC 904 is particularly advantageous in this arrangement of the XR glasses 902 because the desired orientation is for the proximity sensor 908 to be exposed and facing outward from the back side 914 of the XR glasses 902 and for the ambient light sensor 910 to be exposed and facing outward from the front side 912 of the XR glasses 902.

[0063] In another example, Fig.11A and 11B 1 and 1 are front and rear perspective views, respectively, of another wearable device 1100 in the form of a head-mounted virtual reality (VR) display device 1102, which is designed to be worn by a user and includes a sensor IC 1104 mounted in a head cover 1106 of the head-mounted VR display device 1102. The sensor IC 1104 may be, for example, Figure 2A-2B Any of the sensor ICs 200, 500, 600, 700, 800 in 4-8. The sensor IC 1104 includes a proximity sensor 1108 and an ambient light sensor 1110 facing oppositely to reduce or prevent the ambient light sensor 1110 from receiving light emitted from the proximity sensor. Fig.11A As shown in the front view of the head mounted VR display device 1102, the ambient light sensor 1110 is adjacent to the front side 1112 of the head mounted VR display device 1102, exposed from the front side 1112 of the head mounted VR display device 1102 and facing outward, so that the ambient light sensor 1110 receives ambient light in the same direction as the direction perceived by the user wearing the head mounted VR display device 1102. Fig. 11BAs shown in the rear view of the head mounted VR display device 1102, the proximity sensor 1108 is adjacent to, exposed from, and facing outwardly from the rear side 1114 of the head mounted VR display device 1102, so that the proximity sensor 1102 can detect when a user brings the head mounted VR display device 1102 close to them when they are about to wear or are wearing the head mounted VR display device 1102. The orientation in which the proximity sensor 1108 and the ambient light sensor 1110 are disposed on opposite sides of the sensor IC 1104 is particularly advantageous in this arrangement of the head mounted VR display device 1102, because the desired orientation is that the proximity sensor 1108 is exposed from the rear side 1114 of the head mounted VR display device 1102 and faces outwardly, and the ambient light sensor 1110 is exposed from the front side 1112 of the head mounted VR display device 1102 and faces outwardly. Therefore, the proximity sensor 1108 and the ambient light sensor 1110 already being disposed on opposite sides of the sensor IC 1104 means that the sensor IC 1104 can be integrated into the head-mounted VR display device 1102 without the need for routing or rerouting interfaces to the proximity sensor 1108 or the ambient light sensor 1110 (if the proximity sensor 1108 and the ambient light sensor 1110 are not located on opposite sides of the sensor IC 1104).

[0064] The head mounted VR display device 1102 may have Fig. 11B , which can be controlled by the electronic device 1118. The electronic device 1118 is also interfaced with the sensor IC 1104 so that the electronic device 1118 retrieves or receives ambient light information indicating the amount of ambient light detected by the ambient light sensor 1110 from the sensor IC 1104. The electronic device 1118 can be configured to adjust the brightness of the display 1116 based on the ambient light information. For example, the electronic device 1118 can reduce the brightness of the display 1116 according to the increase in the amount of ambient light detected. The electronic device 1118 is also configured to retrieve or receive proximity information indicating the proximity of an object detected by the proximity sensor 1108 from the sensor IC 1104. The electronic device 1118 can also be configured to control the operating mode of the electronic device 1118 based on the proximity information. For example, the electronic device 1118 can cause the electronic device 1118 to enter an idle or sleep mode with reduced functionality to reduce power consumption when an object (e.g., a user) is not detected based on the proximity information. The electronic device 1118 may enter an active or awake mode with increased functionality when an object (eg, a user) is detected based on the proximity information, which causes more power to be consumed.

[0065] A manufacturing process may be employed to manufacture a sensor IC comprising oppositely facing proximity sensors and ambient light sensors, including but not limited to Figure 2A-2B and sensor ICs 200, 400, 500, 600, 700 and 800 in 4-8. In this regard, Fig.12 is a flow chart illustrating an exemplary manufacturing process 1200 for manufacturing a sensor IC including oppositely facing proximity sensors and ambient light sensors, including but not limited to Figure 2A-2B and sensor ICs 200, 400, 500, 600, 700, and 800 in FIG. 2. Fig.12 2 , but note that manufacturing process 1200 is not limited to manufacturing sensor ICs similar to sensor IC 200 in FIG. 2 . Fig.12 The manufacturing process 1200 may be used to manufacture Figure 4 and 6 -8 in sensor IC 400, 600, 700, 800.

[0066] In this regard, if Fig.12 As shown in FIG. 1 , the first step of the manufacturing process 1200 in this example is to provide a first die 226 ( 1 ) including a first side 236 ( 1 ) and a second side 236 ( 2 ) opposite to the first side. Fig.12 In this example, the next step of the manufacturing process 1200 is to couple the ambient light sensor 204 adjacent to the first side 236(1) of the first die 226, the ambient light sensor 204 facing outward from the first side 236(1) of the first die 226 in a first direction D1 ( Fig.12 In this example, the next step of the manufacturing process 1200 is to couple the proximity sensor 202 adjacent to the second side 236(2) of the first die 226, the proximity sensor 202 facing outward from the second side 236(2) of the first die 226 in a second direction D2 opposite to the first direction D1 ( Fig.12 1206 in the figure).

[0067] Other manufacturing processes may also be employed to manufacture a sensor IC including oppositely facing proximity sensors and ambient light sensors, including but not limited to Figure 2A-2B and sensor ICs 200, 400, 500, 600, 700 and 800 in 4-8. In this regard, Figures 13A-13C is a flow chart illustrating another exemplary manufacturing process 1300 for manufacturing a sensor IC including oppositely facing proximity sensors and ambient light sensors, including but not limited to Figure 2A-2B and sensor ICs 200, 400, 500, 600, 700 and 800 in 4-8. Figures 14A-14E is based on Figures 13A-13CExemplary manufacturing stages 1400A-1400E during the manufacture of a sensor IC in the manufacturing process 1300 of FIG. Figure 4 The sensor IC 400 is discussed in Figures 13A-13C The manufacturing process 1400 in Figures 14A-14E ), but note that this is not limiting. Fig.12 The manufacturing process 1200 in FIG. 1 may be used to manufacture the sensor ICs 200 , 600 , 700 , 800 in FIGS. 2 and 6 - 8 .

[0068] In this regard, if Fig.14A As shown in manufacturing stage 1400A in FIG. 1 , a second die 504 ( 2 ) including a proximity sensor 202 is prepared ( Fig.13A 1302 in FIG. 1303 ). The light emitter 214 and the proximity light receiver 220 of the proximity sensor 202 are disposed on the second side 511(2) of the second die 504(2). A light resistant resin 1402 is also disposed in the second die 504(2) adjacent to the second side 511(2) of the second die 504(2) to provide a light barrier between the light emitter 214 and the proximity light receiver 220. Subsequently, as Fig. 14B As shown in manufacturing stage 1400B in FIG. 1 , a first die 504 ( 1 ) including an ambient light sensor 204 is prepared ( Fig.13A 1304 in FIG. 1305 ). The visible light receiver 206 of the ambient light sensor 204 is disposed on the first side 510 ( 1 ) of the first die 504 ( 1 ). Fig. 14C As shown in manufacturing stage 1400C in FIG. 1 , the second die 504 ( 2 ) is coupled to the first die 504 ( 1 ) in the vertical direction (Z-axis direction) so that the second die 504 ( 2 ) is stacked on the first die 504 ( 1 ) ( Fig. 13B 1306 in FIG. 1307 ). Then, as shown in FIG. Fig.14D As shown in manufacturing stage 1400D in FIG. 1 , pins 508 are formed and coupled to the first and second dies 504(1), 504(2) to provide interconnects to the first and second dies 504(1), 504(2). Fig. 13B The overmolding material 1404 is disposed around the first and second dies 504(1), 504(2) and the leads 508 to form the IC package 224 ( Fig. 13B 1308 in FIG. 13). Then, as shown in FIG. Fig.14E As shown in manufacturing stage 1400E in FIG. 1 , an opening 520 is formed in the circuit board 506, and the IC package 224 of the sensor IC 200 is mounted on the circuit board 506 ( Fig. 13CIC package 224 is coupled to second surface 512(2) of circuit board 506 such that ambient light sensor 204 is disposed adjacent opening 520 such that opening 520 forms a light pipe 518 for ambient light sensor 204 and provides ambient field of view 210( Fig. 13C 1310 in FIG. 1314 ).

[0069] Note that the terms "inwardly" and "outwardly" are relative terms and are not necessarily limited to external or internal components. Note also that components described herein as "mounted," "coupled," and "disposed on" are not limited to such components being directly or indirectly attached or coupled.

[0070] A sensor IC including oppositely facing proximity sensors and ambient light sensors (including but not limited to Figure 2A-2B , 4-8 and 14A-14E and according to the manufacturing process (including but not limited to Figure 12-13C The sensor ICs 200, 400, 500, 600, 700, 800) manufactured by the exemplary manufacturing processes 1200, 1300 in the embodiment of the present invention and according to any aspect disclosed herein may be provided in or integrated into any processor-based device. Non-limiting examples include: glasses (including XR glasses), head mounted display devices, electronic watches, set-top boxes, entertainment units, navigation devices, communication devices, fixed location data units, mobile location data units, global positioning system (GPS) devices, mobile phones, cellular phones, smart phones, session initiation protocol (SIP) phones, tablet devices, tablet phones, servers, computers, portable computers, mobile computing devices, laptop computers, wearable computing devices (e.g., smart watches, health or fitness trackers, glasses, etc.), desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, and vehicle components.

[0071] In this regard, Fig.15 An example of a processor-based system 1500 is illustrated that may include a sensor IC 1502 including oppositely facing proximity sensors and ambient light sensors (including but not limited to Figure 2A-2B , 4-8 and 14A-14E and according to the manufacturing process (including but not limited to Figure 12-13C1500 ) and according to any aspect disclosed herein. For example, the processor-based system 1500 may be integrated into a mobile device, including a wearable device (such as XR glasses or (other) devices). In this example, the processor-based system 1500 may be formed as an IC 1504 and formed as part of an IC package (such as a system on a chip (SoC) 1506). The processor-based system 1500 includes a central processing unit (CPU) 1508, which includes one or more processors 1510, which may also be referred to as CPU cores or processor cores. The CPU 1508 may have a cache memory 1512 coupled to the CPU 1508 for fast access to temporarily stored data. The CPU 1508 is coupled to a system bus 1514, and may couple master devices and slave devices included in the processor-based system 1500 to each other. As is well known, CPU 1508 communicates with these other devices by exchanging address, control, and data information on system bus 1514. For example, CPU 1508 may communicate bus transaction requests to memory controller 1516, which is an example of a slave device. Fig.15 Not illustrated, multiple system buses 1514 may be provided, with each system bus 1514 constituting a different fabric.

[0072] Other master devices and slave devices may be connected to the system bus 1514. Fig.15 As illustrated in , as examples, these devices may include a memory system 1520 including a memory controller 1516 and (s) memory array 1518, one or more input devices 1522, one or more output devices 1524, one or more network interface devices 1526, and one or more display controllers 1528. The (s) input device 1522 may include any type of input device, including but not limited to input keys, switches, voice processors, etc. The (s) output device 1524 may include any type of output device, including but not limited to audio, video, other visual indicators, etc. The (s) network interface device 1526 may be any device configured to allow data exchange to and from the network 1530. The network 1530 may be any type of network, including but not limited to a wired or wireless network, a private or public network, a local area network (LAN), a wireless local area network (WLAN), a wide area network (WAN), a Bluetooth TM Network, and the Internet. The network interface device(s) 1526 may be configured to support any type of communication protocol desired.

[0073] The CPU 1508 may also be configured to access the display controller(s) 1528 via the system bus 1514 to control information sent to one or more displays 1532. The display controller(s) 1528 sends information to be displayed to the display(s) 1532 via one or more video processors 1534, which processes the information to be displayed into a format suitable for the display(s) 1532. The display(s) 1532 may include any type of display, including but not limited to a cathode ray tube (CRT), a liquid crystal display (LCD), a plasma display, a light emitting diode (LED) display, etc.

[0074] The CPU 1508 and / or the display controller 1528 in the processor-based system 1500 may use information received from the sensor IC 1502 to control the brightness of the display 1532 based on the ambient lighting conditions detected by the ambient light sensor in the sensor IC 1502. The CPU 1508 and / or the display controller 1528 may also control its operating mode based on the proximity sensor in the sensor IC 1502 detecting a user as an object.

[0075] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits and algorithms described in conjunction with the aspects disclosed herein can be implemented as electronic hardware, instructions stored in a memory or in another computer-readable medium and executed by a processor or other processing device, or a combination of the two. The memory disclosed herein can be a memory of any type and size, and can be configured to store any type of information desired. In order to clearly explain this interchangeability, various illustrative components, frames, modules, circuits and steps have been generally described above in the form of their functionality. How such functionality is implemented depends on specific applications, design choices, and / or design constraints imposed on the overall system. The technician can implement the described functionality in different ways for each specific application, but such implementation decisions should not be interpreted as causing departure from the scope of the present disclosure.

[0076] The various illustrative logical blocks, modules, and circuits described in conjunction with the various aspects disclosed herein may be implemented or executed with a processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. The processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in cooperation with a DSP core, or any other such configuration).

[0077] The various aspects disclosed herein may be embodied in hardware and instructions stored in hardware, and may reside in, for example, random access memory (RAM), flash memory, read-only memory (ROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), registers, hard disks, removable disks, CD-ROMs, or any other form of computer-readable medium known in the art. An exemplary storage medium is coupled to the processor so that the processor can read and write information from / to the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a remote station. In an alternative, the processor and storage medium may reside in a remote station, a base station, or a server as discrete components.

[0078] It is also noted that the operation steps described in any exemplary aspect of this article are described in order to provide examples and discussions. The described operations can be performed in many different orders except for the order illustrated. In addition, the operation described in a single operation step can actually be performed in multiple different steps. In addition, one or more operation steps discussed in the exemplary aspects can be combined. It should be understood that, as is obvious to those skilled in the art, the operation steps illustrated in the flow chart can be modified in many different ways. Those skilled in the art will also understand that any of a variety of different technologies and techniques can be used to represent information and signals. For example, the data, instructions, commands, information, signals, bits, code elements and code chips that may be mentioned throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or light particles, or any combination thereof.

[0079] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the universal principles defined herein may be applied to other variations. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the broadest scope consistent with the principles and novel features disclosed herein.

[0080] Implementation examples are described in the following numbered clauses:

[0081] 1. An integrated circuit (IC), comprising:

[0082] a first die comprising a first side and a second side opposite the first side;

[0083] an ambient light sensor adjacent to the first side of the first die, the ambient light sensor facing outward from the first side of the first die in a first direction; and

[0084] A proximity sensor is adjacent to the second side of the first die, the proximity sensor outward from the second side of the first die in a second direction opposite the first direction.

[0085] 2. An IC as set out in clause 1, wherein:

[0086] The ambient light sensor is configured to receive visible light in an ambient field of view in a second direction toward the first side of the first die; and

[0087] The proximity sensor is configured to:

[0088] emitting first light in an emission field in a first direction outward from a second side of the first die; and

[0089] At least a portion of the first light returned in the adjacent field of view in a second direction toward the second side of the first die is received.

[0090] 3. An IC as referred to in clause 1 or 2, wherein:

[0091] the ambient light sensor is coupled to the first side of the first die; and

[0092] The proximity sensor is coupled to the second side of the first die.

[0093] 4. The IC of clause 3, further comprising a circuit board, the circuit board comprising a first surface and a second surface opposite to the first surface;

[0094] in:

[0095] A first side of the first die is adjacent to the first surface of the circuit board;

[0096] The circuit board further includes a light pipe including a first opening extending from a first surface to a second surface of the circuit board; and

[0097] The ambient light sensor is adjacent to the first opening.

[0098] 5. An IC as set out in clause 4, wherein:

[0099] The first opening has a first diameter to produce a field of view of the environment in a second direction toward the first side of the first die; and

[0100] The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening.

[0101] 6. The IC of clause 1 or 2, further comprising a second die, the second die comprising a third side and a fourth side opposite the third side; and

[0102] in:

[0103] the ambient light sensor is coupled to the first side of the first die; and

[0104] The proximity sensor is coupled to the second side of the second die.

[0105] 7. The IC of clause 6, further comprising a circuit board, the circuit board comprising a first surface and a second surface opposite to the first surface;

[0106] in:

[0107] A first side of the first die is adjacent to the first surface of the circuit board;

[0108] The circuit board further includes a light pipe including a first opening extending from a first surface to a second surface of the circuit board; and

[0109] The ambient light sensor is adjacent to the first opening.

[0110] 8. An IC as set out in clause 7, wherein:

[0111] The first opening has a first diameter to produce a field of view of the environment in a second direction toward the first side of the first die; and

[0112] The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening.

[0113] 9. The IC of any of clauses 6-8, wherein the third side of the second die is adjacent to the second side of the first die in a vertical direction.

[0114] 10. The IC of clause 9, further comprising a first circuit board, the first circuit board comprising a first surface and a second surface opposite to the first surface;

[0115] in:

[0116] A first side of the first die is adjacent to a first surface of the first circuit board;

[0117] The first circuit board further includes a light pipe including a first opening extending from the first surface to the second surface of the first circuit board; and

[0118] The ambient light sensor is adjacent to the first opening.

[0119] 11. An IC as set out in clause 10, wherein:

[0120] The first opening has a first diameter to produce a field of view of the environment in a second direction toward the first side of the first die; and

[0121] The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening.

[0122] 12. The IC of any of clauses 6-8, further comprising a first circuit board comprising a first surface and a second surface opposite to the first surface;

[0123] in:

[0124] A first side of the first die is adjacent to a first surface of the first circuit board;

[0125] A third side of the second die is adjacent to the first surface of the first circuit board and adjacent to the first die;

[0126] The first circuit board further includes a first light pipe including a first opening extending from the first surface to the second surface of the first circuit board; and

[0127] The ambient light sensor is adjacent to the first opening.

[0128] 13. An IC as set out in clause 12, wherein:

[0129] The first opening has a first diameter to produce a field of view of the environment in a second direction toward the first side of the first die; and

[0130] The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening.

[0131] 14. An IC as in clause 10 or 11, further comprising:

[0132] a second circuit board including a third surface and a fourth surface opposite to the third surface;

[0133] in:

[0134] The fourth surface of the second circuit board is adjacent to the first surface of the first circuit board;

[0135] The second circuit board further includes a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; and

[0136] The first opening is at least partially aligned with the second opening in a vertical direction.

[0137] 15. An IC as referred to in clause 14, wherein:

[0138] The first opening has a first diameter and the second opening has a second diameter, thereby creating a field of view of the environment in a second direction toward the first side of the first die; and

[0139] The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening and the second opening.

[0140] 16. The IC of clause 10 or 11, further comprising a second circuit board comprising a third surface and a fourth surface opposite the third surface; and

[0141] in:

[0142] The third surface of the second circuit board is adjacent to the second side of the second die;

[0143] The second circuit board further comprises:

[0144] a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; and

[0145] a third light pipe including a third opening extending from the third surface to the fourth surface of the second circuit board; and

[0146] The proximity sensor includes:

[0147] a light emitter adjacent to the second opening in the second circuit board; and

[0148] An optical receiver is adjacent to the third opening in the second circuit board.

[0149] 17. An IC as referred to in clause 16, wherein:

[0150] The second opening has a second diameter to produce a launch field;

[0151] The second opening has a third diameter to produce a second field of view in a first direction toward the second side of the first die;

[0152] The ambient light sensor is configured to receive visible light in an ambient field of view through the first opening;

[0153] The light emitter is configured to emit light in an emission field through the second opening in a second direction outward from a second side of the first die; and

[0154] The light receiver is configured to receive second light in a second field of view through a third opening.

[0155] 18. An IC as in any of clauses 2-17, wherein:

[0156] The ambient light sensor includes a visible light receiver configured to detect visible light in an ambient field of view in a first direction toward a first side of the first die; and

[0157] The proximity sensor includes:

[0158] an infrared light emitter configured to emit first light including first infrared (IR) light in an emission field in a second direction outward from a second side of the first die; and

[0159] An IR light receiver is configured to detect at least a portion of the first IR light including at least a portion of the first IR light returned in an adjacent field of view in a first direction toward the second side of the first die.

[0160] 19. The IC of clause 18, wherein the ambient light sensor further comprises a second IR light receiver configured to detect ambient IR light.

[0161] 20. An IC as in any of clauses 1-19, the IC being integrated into a device selected from the group consisting of glasses, XR glasses, a head mounted display device, an electronic watch, a set-top box, an entertainment unit, a navigation device, a communication device, a fixed location data unit, a mobile location data unit, a global positioning system (GPS) device, a mobile phone, a cellular phone, a smart phone, a session initiation protocol (SIP) phone, a tablet device, a tablet phone, a server, a computer, a portable computer, a mobile computing device, a wearable computing device, a desktop computer, a personal digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, a portable digital video player, an automobile, and a vehicle component.

[0162] 21. A method of manufacturing an integrated circuit (IC), comprising:

[0163] providing a first die comprising a first side and a second side opposite the first side;

[0164] coupling an ambient light sensor adjacent to the first side of the first die, the ambient light sensor outward from the first side of the first die in a first direction; and

[0165] A proximity sensor is coupled adjacent to the second side of the first die, the proximity sensor outward from the second side of the first die in a second direction opposite the first direction.

[0166] 22. The method of clause 21, further comprising:

[0167] Providing a circuit board, the circuit board comprising a first surface and a second surface opposite to the first surface;

[0168] forming a light pipe comprising an opening in the circuit board extending from a first surface to a second surface of the circuit board; and

[0169] A first die is coupled adjacent to the first surface of the circuit board such that the ambient light sensor is adjacent to the opening.

[0170] 23. The method of clause 21 or 22, further comprising:

[0171] providing a second die including a third side and a fourth side opposite the third side; and

[0172] in:

[0173] Coupling the ambient light sensor includes coupling the ambient light sensor to a first side of the first die, the ambient light sensor outward from the first side of the first die in a first direction; and

[0174] Coupling the proximity sensor includes coupling the proximity sensor to the second side of the second die, the proximity sensor outward from the second side of the second die in a second direction opposite the first direction.

[0175] 24. The method of clause 23, further comprising coupling the third side of the second die adjacent to the second side of the first die in a vertical direction.

[0176] 25. The method of clause 23, further comprising:

[0177] Providing a first circuit board, the first circuit board comprising a first surface and a second surface opposite to the first surface;

[0178] coupling a first side of the first die adjacent to a first surface of the first circuit board; and

[0179] A third side of the second die is coupled adjacent to the first surface of the first circuit board and adjacent to the first die.

[0180] 26. The IC as in clause 21, further comprising:

[0181] providing a first circuit board, the first circuit board comprising a first surface and a second surface opposite to the first surface; and

[0182] providing a second circuit board, the second circuit board comprising a third surface and a fourth surface opposite to the third surface;

[0183] in:

[0184] Coupling the ambient light sensor further includes coupling the ambient light sensor adjacent to the second surface of the first circuit board; and

[0185] Coupling the proximity sensor further includes coupling the proximity sensor adjacent to the second surface of the first circuit board; and

[0186] The method further comprises:

[0187] forming a first light pipe comprising a first opening in the first circuit board extending from a first surface to a second surface of the first circuit board;

[0188] forming a second light pipe including a second opening in the second circuit board extending from the third surface to the fourth surface of the second circuit board;

[0189] Disposing a fourth surface of the second circuit board adjacent to the first surface of the first circuit board such that the first opening and the second opening are at least partially aligned in a vertical direction; and

[0190] The first die is coupled adjacent to the first surface of the first circuit board such that the ambient light sensor is adjacent to the first opening.

[0191] 27. The method of clause 23, further comprising:

[0192] providing a first circuit board, the first circuit board comprising a first surface and a second surface opposite to the first surface; and

[0193] providing a second circuit board, the second circuit board comprising a third surface and a fourth surface opposite to the third surface;

[0194] forming a first light pipe comprising a first opening in the first circuit board extending from a first surface to a second surface of the first circuit board;

[0195] forming a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board;

[0196] forming a third light pipe including a third opening extending from the third surface to the fourth surface of the second circuit board;

[0197] Disposing a third surface of the second circuit board adjacent to the second surface of the first circuit board;

[0198] coupling the first die adjacent to the first surface of the first circuit board such that the ambient light sensor is adjacent to the first opening; and

[0199] A second die is coupled adjacent to the fourth surface of the second circuit board such that the light emitter of the proximity sensor is adjacent to the second opening and the light receiver of the proximity sensor is adjacent to the third opening.

[0200] 28. An electronic device comprising:

[0201] Computing equipment;

[0202] a display coupled to the computing device;

[0203] an integrated circuit (IC) coupled to the computing device, the IC comprising:

[0204] a first die comprising a first side and a second side opposite the first side;

[0205] an ambient light sensor adjacent to the first side of the first die, the ambient light sensor facing outward from the first side of the first die in a first direction; and

[0206] a proximity sensor adjacent to the second side of the first die, the proximity sensor outward from the second side of the first die in a second direction opposite the first direction;

[0207] in:

[0208] The ambient light sensor is configured to:

[0209] receiving visible light in an ambient field of view in a second direction toward the first side of the first die; and

[0210] generating an ambient light signal including ambient light information indicative of an amount of received visible light;

[0211] The proximity sensor is configured to:

[0212] emitting first light in an emission field in a first direction outward from a second side of the first die;

[0213] receiving at least a portion of the first light returned in a second direction toward a second side of the first die in an adjacent field of view; and

[0214] generating a proximity signal including proximity information indicating proximity of the object to the IC; and

[0215] The computing device is configured to:

[0216] Receiving ambient light signals;

[0217] controlling the brightness of the display based on the ambient light information in the ambient light signal;

[0218] receiving a proximity signal; and

[0219] An operating mode of the computing device is controlled based on the proximity information in the proximity signal.

[0220] 29. The electronic device of clause 28, wherein the IC further comprises:

[0221] an interface circuit coupled to the computing device;

[0222] a switch configured to receive the ambient light signal and the proximity signal and to couple to an output of the interface circuit; and

[0223] A selection logic circuit is coupled to the switch, the selection logic circuit being configured to pass one of the ambient light signal and the proximity signal to an output.

[0224] 30. An electronic device as claimed in clause 28 or 29, comprising wearable glasses.

[0225] 31. The electronic device of clause 30, wherein the wearable eyewear further comprises a nose bridge, the nose bridge comprising a third side and a fourth side opposite the third side; wherein the fourth side is configured to be adjacent to a user wearing the wearable eyewear;

[0226] Wherein the IC is coupled to the nose bridge such that a first side of the first die is adjacent to a third side of the nose bridge and a second side of the first die is adjacent to a fourth side of the nose bridge.

[0227] 32. The electronic device of clause 30, wherein the wearable eyewear further comprises a temple, the temple comprising a third side and a fourth side opposite the third side; wherein the fourth side is configured to be adjacent to a user wearing the wearable eyewear;

[0228] Wherein the IC is coupled to the temple such that a first side of the first die is adjacent to a third side of the temple and a second side of the first die is adjacent to a fourth side of the temple.

[0229] 33. An electronic device as described in clause 28, comprising a head-mounted display device.

[0230] 34. The electronic device of clause 33, wherein the head mounted display device comprises a head cover, the head cover comprising a third side and a fourth side opposite to the third side; wherein the fourth side is configured to be adjacent to a user wearing the head mounted display;

[0231] Wherein the IC is coupled to the header cover such that a first side of the first die is adjacent to a third side of the header cover and a second side of the first die is adjacent to a fourth side of the header cover.

Claims

1. An integrated circuit (IC), comprising: a first die including a first side and a second side opposite the first side; an ambient light sensor adjacent to a first side of the first die, the ambient light sensor facing outward from the first side of the first die in a first direction; as well as A proximity sensor is adjacent to a second side of the first die, the proximity sensor outward from the second side of the first die in a second direction opposite the first direction.

2. The IC of claim 1, wherein: The ambient light sensor is configured to receive visible light in an ambient field of view in the second direction toward the first side of the first die; and The proximity sensor is configured to: emitting first light in an emission field in the first direction outward from the second side of the first die; as well as At least a portion of the first light is received that is returned in the second direction toward the second side of the first die in an adjacent field of view.

3. The IC of claim 1, wherein: the ambient light sensor is coupled to the first side of the first die; and The proximity sensor is coupled to the second side of the first die.

4. The IC of claim 3, further comprising a circuit board, the circuit board comprising a first surface and a second surface opposite to the first surface; in: A first side of the first die is adjacent to the first surface of the circuit board; The circuit board further includes a light pipe including a first opening extending from the first surface to the second surface of the circuit board; and The ambient light sensor is adjacent to the first opening.

5. The IC of claim 4, wherein: The first opening has a first diameter to produce an ambient field of view in the second direction toward the first side of the first die; and The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening.

6. The IC of claim 1 , further comprising a second die, the second die comprising a third side and a fourth side opposite the third side; and in: the ambient light sensor is coupled to the first side of the first die; and The proximity sensor is coupled to the second side of the second die.

7. The IC of claim 6, further comprising a circuit board, the circuit board comprising a first surface and a second surface opposite to the first surface; in: A first side of the first die is adjacent to the first surface of the circuit board; The circuit board further includes a light pipe including a first opening extending from the first surface to the second surface of the circuit board; and The ambient light sensor is adjacent to the first opening.

8. The IC of claim 7, wherein: The first opening has a first diameter to produce an ambient field of view in the second direction toward the first side of the first die; and The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening.

9. The IC of claim 6, wherein a third side of the second die is vertically adjacent to the second side of the first die.

10. The IC of claim 9, further comprising a first circuit board, the first circuit board comprising a first surface and a second surface opposite the first surface; in: A first side of the first die is adjacent to the first surface of the first circuit board; The first circuit board further includes a light pipe including a first opening extending from the first surface of the first circuit board to the second surface; and The ambient light sensor is adjacent to the first opening.

11. The IC of claim 10, wherein: The first opening has a first diameter to produce an ambient field of view in the second direction toward the first side of the first die; and The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening.

12. The IC of claim 6, further comprising a first circuit board, the first circuit board comprising a first surface and a second surface opposite to the first surface; in: A first side of the first die is adjacent to the first surface of the first circuit board; A third side of the second die is adjacent to the first surface of the first circuit board and adjacent to the first die; The first circuit board further includes a first light pipe including a first opening extending from the first surface of the first circuit board to the second surface; and The ambient light sensor is adjacent to the first opening.

13. The IC of claim 12, wherein: The first opening has a first diameter to produce an ambient field of view in the second direction toward the first side of the first die; and The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening.

14. The IC of claim 10, further comprising: a second circuit board, the second circuit board comprising a third surface and a fourth surface opposite to the third surface; in: The fourth surface of the second circuit board is adjacent to the first surface of the first circuit board; The second circuit board further includes a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; and The first opening is at least partially aligned with the second opening in the vertical direction.

15. The IC of claim 14, wherein: The first opening has a first diameter and the second opening has a second diameter to produce a field of view of the environment in the second direction toward the first side of the first die; and The ambient light sensor is configured to receive visible light in the ambient field of view through the first opening and the second opening.

16. The IC of claim 10, further comprising a second circuit board, the second circuit board comprising a third surface and a fourth surface opposite to the third surface; in: The third surface of the second circuit board is adjacent to the second side of the second die; The second circuit board further comprises: a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; and a third light pipe including a third opening extending from the third surface of the second circuit board to the fourth surface; and The proximity sensor comprises: a light emitter adjacent to the second opening in the second circuit board; and An optical receiver is adjacent to the third opening in the second circuit board.

17. The IC of claim 16, wherein: The second opening has a second diameter to produce a launch field; The second opening has a third diameter to produce a second field of view in the first direction toward the second side of the first die; The ambient light sensor is configured to receive visible light in an ambient field of view through the first opening; the light emitter being configured to emit light in the emission field through the second opening in the second direction outward from the second side of the first die; and The light receiver is configured to receive second light in the second field of view through the third opening.

18. The IC of claim 2, wherein: the ambient light sensor comprising a visible light receiver configured to detect visible light in the ambient field of view in the first direction toward the first side of the first die; and The proximity sensor comprises: an infrared light emitter configured to emit first light including first infrared (IR) light in the emission field in the second direction outward from the second side of the first die; as well as An IR light receiver is configured to detect at least a portion of the first IR light including at least a portion of the first IR light returning in the adjacent field of view in the first direction toward the second side of the first die.

19. The IC of claim 18, wherein the ambient light sensor further comprises a second IR light receiver configured to detect ambient IR light.

20. The IC of claim 1 , wherein the IC is integrated into a device selected from the group consisting of glasses, XR glasses, a head mounted display device, an electronic watch, a set top box, an entertainment unit, a navigation device, a communication device, a fixed location data unit, a mobile location data unit, a global positioning system (GPS) device, a mobile phone, a cellular phone, a smart phone, a session initiation protocol (SIP) phone, a tablet device, a tablet phone, a server, a computer, a portable computer, a mobile computing device, a wearable computing device, a desktop computer, a personal digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, a portable digital video player, an automobile, and a vehicle component.

21. A method of manufacturing an integrated circuit (IC), comprising: providing a first die, the first die comprising a first side and a second side opposite the first side; coupling an ambient light sensor adjacent to the first side of the first die, the ambient light sensor outward from the first side of the first die in a first direction; as well as A proximity sensor is coupled adjacent to the second side of the first die, the proximity sensor outward from the second side of the first die in a second direction opposite the first direction.

22. The method of claim 21, further comprising: Providing a circuit board, the circuit board comprising a first surface and a second surface opposite to the first surface; forming a light pipe comprising an opening in the circuit board extending from the first surface to the second surface of the circuit board; as well as The first die is coupled adjacent to the first surface of the circuit board such that the ambient light sensor is adjacent to the opening.

23. The method of claim 21, further comprising: providing a second die, the second die comprising a third side and a fourth side opposite the third side; and in: coupling the ambient light sensor comprises coupling the ambient light sensor to a first side of the first die, the ambient light sensor outward from the first side of the first die in the first direction; and Coupling the proximity sensor includes coupling the proximity sensor to a second side of the second die, the proximity sensor outward from the second side of the second die in a second direction opposite the first direction.

24. The method of claim 23, further comprising coupling a third side of the second die adjacent to the second side of the first die in a vertical direction.

25. The method of claim 23, further comprising: Providing a first circuit board, the first circuit board comprising a first surface and a second surface opposite to the first surface; coupling a first side of the first die adjacent to the first surface of the first circuit board; as well as A third side of the second die is coupled adjacent to the first surface of the first circuit board and adjacent to the first die.

26. The IC of claim 21, further comprising: Providing a first circuit board, the first circuit board comprising a first surface and a second surface opposite to the first surface; as well as providing a second circuit board, the second circuit board comprising a third surface and a fourth surface opposite to the third surface; in: Coupling the ambient light sensor further comprises coupling the ambient light sensor adjacent to the second surface of the first circuit board; and Coupling the proximity sensor further comprises coupling the proximity sensor adjacent to the second surface of the first circuit board; and The method further comprises: forming a first light pipe comprising a first opening in the first circuit board extending from the first surface to the second surface of the first circuit board; forming a second light pipe comprising a second opening in the second circuit board extending from the third surface to the fourth surface of the second circuit board; disposing the fourth surface of the second circuit board adjacent to the first surface of the first circuit board such that the first opening and the second opening are at least partially aligned in a vertical direction; and The first die is coupled adjacent to the first surface of the first circuit board such that the ambient light sensor is adjacent to the first opening.

27. The method of claim 23, further comprising: Providing a first circuit board, the first circuit board comprising a first surface and a second surface opposite to the first surface; as well as providing a second circuit board, the second circuit board comprising a third surface and a fourth surface opposite to the third surface; forming a first light pipe comprising a first opening in the first circuit board extending from the first surface to the second surface of the first circuit board; forming a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; forming a third light pipe including a third opening extending from the third surface of the second circuit board to the fourth surface; Disposing the third surface of the second circuit board adjacent to the second surface of the first circuit board; coupling the first die adjacent to the first surface of the first circuit board such that the ambient light sensor is adjacent to the first opening; as well as The second die is coupled adjacent to the fourth surface of the second circuit board such that a light emitter of the proximity sensor is adjacent to the second opening and a light receiver of the proximity sensor is adjacent to the third opening.

28. An electronic device comprising: Computing equipment; a display coupled to the computing device; an integrated circuit (IC) coupled to the computing device, the IC comprising: a first die comprising a first side and a second side opposite the first side; an ambient light sensor adjacent to a first side of the first die, the ambient light sensor facing outward from the first side of the first die in a first direction; and a proximity sensor adjacent to a second side of the first die, the proximity sensor outward from the second side of the first die in a second direction opposite the first direction; in: The ambient light sensor is configured to: receiving visible light in an ambient field of view in the second direction toward the first side of the first die; and generating an ambient light signal including ambient light information indicative of an amount of received visible light; The proximity sensor is configured to: emitting first light in an emission field in the first direction outward from the second side of the first die; receiving at least a portion of the first light returned in the second direction toward the second side of the first die in an adjacent field of view; and generating a proximity signal including proximity information indicating proximity of an object to the IC; and The computing device is configured to: receiving the ambient light signal; controlling the brightness of the display based on the ambient light information in the ambient light signal; receiving the proximity signal; and An operating mode of the computing device is controlled based on the proximity information in the proximity signal.

29. The electronic device of claim 28, wherein the IC further comprises: an interface circuit coupled to the computing device; a switch configured to receive the ambient light signal and the proximity signal and to couple to an output of the interface circuit; as well as A selection logic circuit is coupled to the switch, the selection logic circuit being configured to pass one of the ambient light signal and the proximity signal to the output.

30. The electronic device of claim 28 comprising wearable glasses.

31. The electronic device of claim 30, wherein the wearable glasses further comprise a nose bridge, the nose bridge comprising a third side and a fourth side opposite the third side; wherein the fourth side is configured to be adjacent to a user wearing the wearable glasses; Wherein the IC is coupled to the nose bridge such that a first side of the first die is adjacent to a third side of the nose bridge and a second side of the first die is adjacent to a fourth side of the nose bridge.

32. The electronic device of claim 30, wherein the wearable glasses further include a temple, the temple including a third side and a fourth side opposite the third side; wherein the fourth side is configured to be adjacent to a user wearing the wearable glasses; Wherein the IC is coupled to the temple such that a first side of the first die is adjacent to a third side of the temple and a second side of the first die is adjacent to a fourth side of the temple.

33. The electronic device of claim 28, comprising a head mounted display device.

34. The electronic device of claim 33, wherein the head mounted display device comprises a head cover, the head cover comprising a third side and a fourth side opposite the third side, wherein the fourth side is configured to be adjacent to a user wearing the head mounted display; The IC is coupled to the header cover such that a first side of the first die is adjacent to a third side of the header cover and a second side of the first die is adjacent to a fourth side of the header cover.

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