Photomask container with plating with reduced edge build-up

Abstract

A reticle container includes a lid and a substrate having contact surfaces configured to contact each other when the reticle container is assembled. A buffer region is provided adjacent to at least one of the contact surfaces. The buffer region is such that electroplating provided on the buffer region does not contact the other of the cover or the substrate when the reticle container is assembled. The buffer region may include structures such as sloped regions, recesses, and rounded regions. The buffer region may optionally further act as a grab sheet during the electroplating process.

Description

Technical Field

[0001] The present disclosure relates to photomask containers and, more particularly, to photomask containers plated with a material that reduces edge build-up during plating. Background Art

[0002] The photomask container may be plated, for example, to improve surface finish. The plating of the photomask container may include plating at the contact surface of the photomask container. The contact surface may be positioned and configured such that the electrical properties and physical structure result in edge buildup during plating, thereby providing regions of increased plating thickness at certain portions of the contact surface. These regions of increased plating thickness may be areas that experience wear, resulting in the generation of particulate material that may contaminate the contents of the photomask container. Summary of the invention

[0003] The present disclosure relates to photomask containers and, more particularly, to photomask containers plated with a material that reduces edge build-up during plating.

[0004] By shaping the lid and / or substrate of the reticle container so that edge buildup is reduced by the physical shape and / or electrical properties of the lid and / or substrate (acting as a "robber"), the amount of particles generated by friction edge buildup can be reduced, thereby improving the cleanliness of the reticle container. Additionally or alternatively, the lid and / or substrate can be shaped so that edge buildup occurs away from the contact surface, and the edge buildup does not contact and therefore does not significantly contribute to particle generation, thereby further improving the cleanliness of the reticle container. The cleaner reticle container produced during plating due to addressing edge buildup in turn improves yield and reduces losses in reticle processing (e.g., lithography including extreme ultraviolet (EUV) lithography). The reduction in edge buildup can improve the plating process of the reticle container assembly, allowing plating to be successfully performed with less precise plating devices or their control. In addition, this can simplify the plating process by reducing or removing the need to use an external grabber during the plating process.

[0005] In an embodiment, a photomask container includes a cover and a substrate. At least one of the cover or the substrate includes a base material and a coating on the base material. At least one of the cover or the substrate includes a contact surface and at least one of a first buffer region adjacent to at least a portion of an outer periphery of the contact surface or a second buffer region adjacent to at least a portion of an inner periphery of the contact surface. Each of at least one of the first buffer region and the second buffer region is configured to avoid contact between the cover and the substrate when the photomask container is assembled so that the cover and the substrate are in contact at the contact surface.

[0006] In an embodiment, the first buffer area or the second buffer area is a recessed area relative to the contact surface. In an embodiment, the first buffer area or the second buffer area is a beveled edge. In an embodiment, the first buffer area or the second buffer surface second buffer area comprises a rounded corner area. In an embodiment, the transition from the contact surface to the first buffer area or the transition from the contact surface to the second buffer area is rounded. In an embodiment, the transition from the contact surface to the second buffer area comprises a beveled edge. In an embodiment, the first buffer area or the second buffer area has a depth of at least 0.1 millimeters (mm) relative to the contact surface.

[0007] In an embodiment, the photomask container includes a first buffer region and the first buffer region surrounds an outer periphery of the contact surface. In an embodiment, the photomask container includes a second buffer region and the second buffer region is surrounded by an inner periphery of the contact surface.

[0008] In an embodiment, a method of manufacturing a photomask container includes providing a cover and a substrate. At least one of the cover or the substrate includes a contact surface and at least one of a first buffer region adjacent to at least a portion of an outer periphery of the contact surface or a second buffer region adjacent to at least a portion of an inner periphery of the contact surface. The method further includes applying a coating to at least one of the cover or the substrate. The first buffer region and the second buffer region are each configured to avoid contact between the cover and the substrate when the photomask container is assembled so that the cover and the substrate are in contact at the contact surface.

[0009] In an embodiment, applying the coating comprises electroplating. In an embodiment, at least one of the first buffer region and the second buffer region acts as a grabber during electroplating. In an embodiment, applying the coating comprises multiple discrete applications of electroplating.

[0010] In an embodiment, the first buffer area or the second buffer area comprises a beveled edge. In an embodiment, the first buffer area or the second buffer area comprises a rounded corner. In an embodiment, the first buffer area or the second buffer area is a recess having a depth of at least 0.1 millimeters (mm) relative to the contact surface.

[0011] In an embodiment, at least one of the cover and the substrate comprises a first buffer region, wherein the first buffer region surrounds an outer periphery of the contact surface. In an embodiment, at least one of the cover and the substrate comprises a second buffer region, wherein the second buffer region is surrounded by an inner periphery of the contact surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 An exploded view of a reticle container according to an embodiment is shown.

[0013] Figure 2 A perspective view showing a lid of a reticle container according to an embodiment.

[0014] Figure 3 A perspective view of a substrate showing a reticle container according to an embodiment.

[0015] Figure 4 A cross-sectional view of a reticle container according to an embodiment is shown.

[0016] Figure 5 A cross-sectional view of a reticle container according to an embodiment is shown.

[0017] Figure 6 A flow chart of a method according to an embodiment is shown. DETAILED DESCRIPTION

[0018] The present disclosure relates to photomask containers and, more particularly, to photomask containers plated with a material that reduces edge build-up during plating.

[0019] Figure 1 An exploded view of a reticle container according to an embodiment is shown. The reticle container 100 includes a cover 102 and a substrate 104. A reticle 106 can be accommodated in an interior space defined by the cover 102 and the substrate 104. The cover 102 includes a cover contact surface (not shown), and the substrate 104 includes a substrate contact surface 108. The substrate 104 includes a first buffer region 110 and a second buffer region 112.

[0020] The reticle container 100 is a container configured to hold a reticle 106, such as a reticle for a process such as photolithography, such as an extreme ultraviolet (EUV) process. The reticle container 100 can be used to transport and / or store the reticle. In an embodiment, the reticle container 100 is an EUV reticle container. In an embodiment, the reticle container 100 is a storage box for storing the reticle 106 before, during, or after processing. In an embodiment, the reticle container 100 can be received at a load port of an EUV processing device to be opened and used to add or remove the reticle 106 from the reticle container 100. The reticle container 100 accommodates the reticle 106 in an interior space within the reticle container 100.

[0021] The cover 102 forms a first container section of the reticle container 100. The cover 102 forms a portion of an interior space configured to accommodate the reticle 106. At least some surfaces of the cover 102 may be formed by plating a material on a base material of the cover 102.

[0022] The substrate 104 forms a second container section of the photomask container 100. The substrate 104 forms an interior space capable of accommodating the photomask 106 when combined with the cover 102. At least some surfaces of the substrate 104 may be formed by plating a material on a base material of the cover 102.

[0023] The reticle 106 is a reticle received in the reticle container 100. The reticle 106 may be any suitable reticle, for example, a reticle processed by a method such as photolithography including extreme ultraviolet (EUV) lithography.

[0024] The substrate contact surface 108 is a surface of the substrate 104 that is configured to contact a corresponding surface on the lid 102 when the reticle container 100 is assembled.

[0025] The first buffer region 110 may be positioned outside of the substrate contact surface 108. The first buffer region 110 may be configured to avoid the cover 102 when the photomask container 100 is assembled. Avoidance of the cover 102 may include avoiding contact between plated edge structures provided on either or both of the cover 102 and the substrate 104. The size and shape of the first buffer region 110 may be any suitable shape and size to achieve avoidance of the cover 102. For example, the first buffer region 110 may be a groove or recess in the surface of the substrate 104. In an embodiment, the first buffer region 110 is a recess having a depth of at least 0.1 millimeters (mm) and a width in a range from 2 mm to 4 mm relative to the contact surface. In an embodiment, the first buffer region 110 includes a beveled edge. In an embodiment, the transition from the substrate contact surface 108 to the first buffer region 110 is rounded. In an embodiment, the first buffer region 110 may be spaced apart from the substrate contact surface 108. In an embodiment, the first buffer region 110 is immediately adjacent to the substrate contact surface 108. In an embodiment, the first buffer region 110 is electrically connected to the substrate contact surface 108 .

[0026] The second buffer region 112 is positioned inboard of the substrate contact surface 108. The second buffer region 112 may be configured to avoid the cover 102 when the photomask container 100 is assembled. Avoidance of the cover 102 may include avoiding contact between plated edge structures provided on either or both of the cover 102 and the substrate 104. For example, the second buffer region 112 may be a groove or recess in the surface of the substrate 104. The size and shape of the second buffer region 112 may be any suitable shape and size to achieve avoidance of the cover 102. In an embodiment, the second buffer region 112 is a recess having a depth of at least 0.1 millimeters (mm) and a width in a range from 2 mm to 4 mm relative to the contact surface. In an embodiment, the second buffer region 112 includes a beveled edge. In an embodiment, the transition from the substrate contact surface 108 to the second buffer region 112 is rounded. In an embodiment, the second buffer region 112 may be spaced apart from the substrate contact surface 108. In an embodiment, the second buffer region 112 is immediately adjacent to the substrate contact surface 108. In an embodiment, the second buffer region 112 is electrically connected to the substrate contact surface 108 .

[0027] Figure 2A perspective view of a lid of a reticle container according to an embodiment is shown. The lid 200 includes a lid contact surface 202 , a first buffer region 204 , a first transition portion 206 , a second buffer region 208 , and a second transition portion 210 .

[0028] The cover 200 is a cover of the photomask container. The cover 200 is configured so that when it is in contact with a substrate (such as the one described below and Figure 3 The illustrated substrate 300 ) defines an interior space when assembled, wherein the interior space is capable of accommodating a photomask.

[0029] The cover contact surface 202 may be provided on the exterior of the portion of the cover 200 that defines the interior space. The cover contact surface 202 is configured to contact a substrate when assembling a photomask container including the cover 200. In an embodiment, the cover contact surface 202 may be a continuous flat surface. In an embodiment, the cover contact surface 202 may include a plurality of flat surface areas, each of which is configured to contact a substrate. The cover contact surface 202 may include a surface formed of a material plated onto a base material of the cover 200.

[0030] The first buffer region 204 is positioned outside of the cover contact surface 202. In an embodiment, the first buffer region 204 can be positioned adjacent to at least a portion of the cover contact surface 202. In an embodiment, the first buffer region 204 can surround the outside of the cover contact surface 202. The first buffer region 204 is a portion of the cover 200 configured to be disposed between the cover 200 and the substrate to form a photomask container (e.g., Figure 1 The first buffer region 204 avoids contact with the substrate when the photomask container 100 shown and described above is formed. The first buffer region 204 avoids contact with the substrate and may include avoiding contact between the edge structure of the plated formed on one or both of the cover 200 and the substrate. The first buffer region 204 may include an area that is recessed relative to the cover contact surface 202. In an embodiment, the first buffer region 204 is a recess having a depth of at least 10 micrometers (μm) and a width of at least 50 μm relative to the cover contact surface 202. In an embodiment, the first buffer region 204 is a recess having a depth of at least 0.1 millimeters (mm) and a width in a range from 2 mm to 4 mm relative to the cover contact surface 202. In an embodiment, the first buffer region 204 is a surface that is angled relative to the cover contact surface 202 so as to form an inclined edge adjacent to at least a portion of the cover contact surface 202. In an embodiment, the first buffer region 204 may be spaced apart from the cover contact surface 202. In an embodiment, the first buffer region 204 is adjacent to the cover contact surface 202. In an embodiment, the first buffer region 204 and the cover contact surface 202 are electrically connected to each other.

[0031] The first transition portion 206 is a transition portion from the cover contact surface 202 to the first buffer region 204. In an embodiment, the first transition portion 206 is a step portion from the cover contact surface 202 to the relatively recessed first buffer region 204. In an embodiment, the first transition portion 206 is a corner where the inclined surface of the first buffer region 204 intersects the cover contact surface 202. In an embodiment, the first transition portion 206 may include rounded corners, such as at one or more corners included in or formed by the first transition portion 206.

[0032] The second buffer region 208 is positioned inside the cover contact surface 202. In an embodiment, the second buffer region 208 can be positioned adjacent to at least a portion of the cover contact surface 202. In an embodiment, the second buffer region 208 can be surrounded by the interior of the cover contact surface 202. The second buffer region 208 is a portion of the cover 200 configured to be assembled with the substrate to form a photomask container (e.g., Figure 1 2 and the photomask container 100 shown in and described above). The second buffer region 208 avoiding the substrate may include avoiding contact between the edge structure of the plated formed on one or both of the cover 200 and the substrate. The second buffer region 208 may include a region recessed relative to the cover contact surface 202. In an embodiment, the first buffer region 204 is a recess having a depth of at least 10 micrometers (μm) relative to the cover contact surface 202. In an embodiment, the second buffer region 208 is a recess having a depth of at least 0.1 millimeters (mm) relative to the cover contact surface 202. In an embodiment, the second buffer region 208 is a surface that is angled relative to the cover contact surface 202 so as to form an inclined edge surrounding at least a portion of the cover contact surface 202. In an embodiment, the second buffer region 208 may be spaced apart from the cover contact surface 202. In an embodiment, the second buffer region 208 is adjacent to the cover contact surface 202. In an embodiment, the second buffer region 208 and the cover contact surface 202 are electrically connected to each other.

[0033] The second transition portion 210 is a transition portion from the cover contact surface 202 to the second buffer area 208. In an embodiment, the second transition portion 210 is a step from the cover contact surface 202 to the relatively recessed second buffer area 208. In an embodiment, the second transition portion 210 is a corner where the inclined surface of the second buffer area 208 intersects the cover contact surface 202. In an embodiment, the second transition portion 210 may include rounded corners, such as at one or more corners included in or formed by the second transition section 210.

[0034] Figure 3A perspective view of a substrate of a reticle container according to an embodiment is shown. The substrate 300 includes a substrate contact surface 302 , a first buffer region 304 , a first transition portion 306 , a second buffer region 308 , and a second transition portion 310 .

[0035] The substrate contact surface 302 may be provided when the substrate 300 is attached to a cover (such as described above and in Figure 2 The substrate contact surface 302 is configured to contact the exterior of the portion of the substrate 300 that defines the interior space when the photomask container including the substrate 300 is assembled, such as when the cover contact surface (such as described above and in Figure 2 300). In an embodiment, the substrate contact surface 302 may be a continuous flat surface. In an embodiment, the substrate contact surface 302 may include a plurality of flat surface areas, each of which is configured to contact the lid. The substrate contact surface 302 may include a surface formed by a material plated onto a base material of the substrate 300.

[0036] The first buffer region 304 is positioned outside of the substrate contact surface 302. In an embodiment, the first buffer region 304 may be positioned directly outside of the substrate contact surface 302. In an embodiment, the first buffer region 304 may surround the outside of the substrate contact surface. The first buffer region 304 is a portion of the substrate 300 configured to be removed when the substrate 300 is assembled with the cover to form a photomask container (e.g., Figure 1 The first buffer region 304 avoids contact with the cover when the photomask container 100 shown and described above is formed. The first buffer region 304 avoids contact with the cover and can include avoiding contact between the edge structure of the plated formed on one or both of the cover and the substrate 300. The first buffer region 304 can include an area that is recessed relative to the substrate contact surface 302. In an embodiment, the first buffer region 304 is a recess having a depth of at least 0.1 millimeters (mm) and a width in a range from 2 mm to 4 mm relative to the substrate contact surface 302. In an embodiment, the first buffer region 304 is a surface that is angled relative to the substrate contact surface 302 so as to form an inclined edge surrounding the substrate contact surface 302.

[0037] The first transition portion 306 is a transition portion from the substrate contact surface 302 to the first buffer region 304. In an embodiment, the first transition portion 306 is a step portion from the substrate contact surface 302 to the relatively recessed first buffer region 304. In an embodiment, the second transition portion 310 is a corner where the inclined surface of the first buffer region 304 intersects the substrate contact surface 302. In an embodiment, the first transition portion 306 may include rounded corners, such as at one or more corners included in or formed by the first transition portion 306.

[0038] The second buffer region 308 is positioned within the interior of the substrate contact surface 302. In an embodiment, the second buffer region 308 may be positioned directly within the interior of the substrate contact surface 302. In an embodiment, the second buffer region 308 may be surrounded by the interior of the substrate contact surface 302. The second buffer region 308 is a portion of the substrate 300 configured to be removed when the substrate 300 is assembled with the cover to form a photomask container (e.g., Figure 1 The second buffer region 308 avoids contact with the lid when the photomask container 100 shown in and described above is avoided. The second buffer region 308 avoids contact with the lid and may include avoiding contact between the edge structure of the plated formed on one or both of the lid and the substrate 300. The second buffer region 308 may include an area recessed relative to the substrate contact surface 302. In an embodiment, the second buffer region 308 is a recess having a depth of at least 0.1 millimeters (mm) and a width in a range from 2 mm to 4 mm relative to the substrate contact surface 302. In an embodiment, the second buffer region 308 is a surface that is angled relative to the substrate contact surface 302 so as to form an inclined edge surrounding the substrate contact surface 302.

[0039] The second transition portion 310 is a transition portion from the substrate contact surface 302 to the second buffer region 308. In an embodiment, the second transition portion 310 is a step portion from the substrate contact surface 302 to the relatively recessed second buffer region 308. In an embodiment, the second transition portion 310 is a corner where the inclined surface of the second buffer region 308 intersects the substrate contact surface 302. In an embodiment, the second transition portion 310 may include rounded corners, such as at one or more corners included in or formed by the second transition portion 310.

[0040] Figure 4 A cross-sectional view of a reticle container according to an embodiment is shown. Reticle container 400 includes a lid 402 and a substrate 404. Lid 402 includes a lid contact surface 406, a first buffer region 408, and a second buffer region 410. Substrate 404 includes a substrate contact surface 412.

[0041] The lid 402 forms a portion of the reticle container 400. When combined with the substrate 404, the lid 402 and the substrate 404 define an interior space configured to accommodate a reticle. The lid 402 includes a lid contact surface 406. The lid contact surface 406 is a portion of the lid 402 configured to contact the substrate 404 when the reticle container 400 is assembled. The lid contact surface 406 may be one or more flat surfaces positioned so that the one or more flat surfaces face the substrate 404. The lid contact surface 406 may be a plated surface formed on the base material of the lid 402.

[0042] A first buffer region 408 is provided on the outside of the cover contact surface 406. The first buffer region 408 is on the side of the cover contact surface 406 opposite to the interior space defined by the cover 402 and the substrate 404. Figure 4 In the illustrated embodiment, the first buffer region 408 is a region that is recessed relative to the cover contact surface 406. In an embodiment, the first buffer region 408 may have a depth of at least 0.1 millimeters (mm) and a width in a range from 2 mm to 4 mm relative to the cover contact surface 406. Figure 4 As shown, the transition from the lid contact surface 406 to the first buffer area 408 may be rounded, where the rounded corner is formed at the corner where the first buffer area 408 is recessed from the lid contact surface 406. In an embodiment, the transition from the lid contact surface 406 to the first buffer area 408 may include a beveled edge, a sharp corner, or the like.

[0043] The second buffer region 410 is provided on the inner side of the cover contact surface 406. The second buffer region 410 is on the side of the cover contact surface 406 that faces the inner space defined by the cover 402 and the substrate 404. Figure 4 In the illustrated embodiment, the second buffer region 410 is a region that is recessed relative to the cover contact surface 406. In an embodiment, the second buffer region 410 may have a depth of at least 0.1 millimeters (mm) and a width in a range from 2 mm to 4 mm relative to the cover contact surface 406. Figure 4 As shown, the transition from the lid contact surface 406 to the second buffer region 410 may be rounded, wherein the rounded corner is formed at a corner where the second buffer region 410 is recessed from the lid contact surface 406. In an embodiment, the transition from the lid contact surface 406 to the second buffer region 410 may include a sloped edge, a sharp corner, or the like.

[0044] The substrate 404 is configured to be coupled to the lid 402 to form the reticle container 400. The substrate 404 includes a substrate contact surface 412 configured to contact the lid contact surface 406 when the lid 402 is coupled to the substrate 404. The substrate contact surface 412 is a flat area positioned to correspond to the location of the lid contact surface 406.

[0045] Although Figure 4 The first and second buffer regions 408, 410 are shown as being provided around the lid contact surface 406, but it is understood that the corresponding buffer regions may alternatively or additionally be formed around the substrate contact surface 412. The buffer regions may be provided on the substrate 404, inside and outside the substrate contact surface 412, by providing grooves or recesses inside and outside the substrate contact surface 412, for example.

[0046] Figure 5A cross-sectional view of a reticle container according to an embodiment is shown. Reticle container 500 includes a lid 502 and a substrate 504. Lid 502 includes a lid contact surface 506, a first buffer region 508, and a second buffer region 510. Substrate 504 includes a substrate contact surface 512.

[0047] The lid 502 forms a portion of the reticle container 500. When combined with the substrate 504, the lid 502 and the substrate 504 define an interior space configured to accommodate a reticle. The lid 502 includes a lid contact surface 506. The lid contact surface 506 is a portion of the lid 502 that is configured to contact the substrate 504 when the reticle container 500 is assembled. The lid contact surface 506 may be one or more flat surfaces that are positioned so that the one or more flat surfaces face the substrate 504. The lid contact surface 506 may be a plated surface formed on the base material of the lid 502.

[0048] A first buffer region 508 is provided on the outer side of the cover contact surface 506. The first buffer region 508 is on the side of the cover contact surface 506 that is away from the inner space defined by the cover 502 and the substrate 504. Figure 5 In the illustrated embodiment, the first buffer region 508 is a surface that is angled relative to the cover contact surface 506, such that the first buffer region 508 provides an angled edge surrounding the contact surface 506. The angle can be any suitable angle that allows the first buffer region 508 to avoid contact with the substrate 504, including avoiding contact between plating (e.g., edge buildup of plating on one or both of the cover 502 and the substrate 504). Figure 5 As shown, the transition from the lid contact surface 506 to the first buffer area 508 can be a corner formed by the intersection of the lid contact surface 506 and the first buffer area 508. In an embodiment, the transition from the lid contact surface 506 to the first buffer area 508 can be rounded.

[0049] The second buffer region 510 is provided on the inner side of the cover contact surface 506. The second buffer region 510 is on the side of the cover contact surface 506 that faces the inner space defined by the cover 502 and the substrate 504. Figure 5 In the illustrated embodiment, the second buffer region 510 is a surface that is angled relative to the cover contact surface 506, such that the second buffer region 510 provides an angled edge surrounding the contact surface 506. The angle can be any suitable angle that allows the second buffer region 510 to avoid contact with the substrate 504, including avoiding contact between plating (e.g., edge buildup of plating on one or both of the cover 502 and the substrate 504). Figure 5As shown, the transition from the lid contact surface 506 to the second buffer region 510 can be a corner formed by the intersection of the lid contact surface 506 and the second buffer region 510. In an embodiment, the transition from the lid contact surface 506 to the second buffer region 510 can be rounded.

[0050] The substrate 504 is configured to be coupled to the lid 502 to form the reticle container 500. The substrate 504 includes a substrate contact surface 512 configured to contact the lid contact surface 506 when the lid 502 is coupled to the substrate 504. The substrate contact surface 512 is a flat area positioned to correspond to the position of the lid contact surface 506.

[0051] Although Figure 5 The first and second buffer regions 508, 510 are shown as being provided around the lid contact surface 506, but it is understood that the corresponding buffer regions may alternatively or additionally be formed around the substrate contact surface 512. The buffer regions may be provided on the substrate 504, inside and outside the substrate contact surface 512, by providing grooves or recesses inside and outside the substrate contact surface 512, for example.

[0052] Figure 6 A flow chart of a method according to an embodiment is shown. Method 600 includes providing a lid or substrate 602, applying a charge to the lid or substrate 604, and plating the lid or substrate 606. In an embodiment, method 600 may be applied to both a lid of a reticle container and a substrate of a reticle container.

[0053] The cover or substrate provided at 602 may include a contact surface, a first buffer region outside the contact surface, and a second buffer region inside the contact surface. In an embodiment, the cover or substrate provided at 602 is a solid piece of a base material. A non-limiting example of a base material is aluminum. In an embodiment, a cover or substrate such as Figure 2 The cover of the cover 200 shown and described above. In an embodiment, a cover such as Figure 3 The substrate 300 shown and described above. The contact surface and the first and second buffer areas on the cover or substrate provided at 602 can be according to any of the contact surfaces and buffer areas described herein, including but not limited to areas recessed from the contact surface, beveled edges, and the like. In an embodiment, the transition from the contact surface to the first buffer area and / or the second buffer area can be rounded.

[0054] At 604, a charge is applied to the cover or substrate. The charge can be supplied by any suitable electroplating means. During the application of the charge to the cover or substrate at 604, for example, the characteristics of the first buffer region and / or the second buffer region can affect the distribution of the charge within the cover or substrate. In an embodiment, the first buffer region and / or the second buffer region act as a grabber, reducing the charge at the boundary of the contact surface, and thus resulting in less plating at the edge of the contact surface.

[0055] In an embodiment, the first buffer region has a plating having a first depth, and the contact region between the cover and the substrate has a plating having a second depth, wherein the second depth is less than the first depth. The second buffer region may have a plating having a third depth, wherein the second depth is less than the third depth. In some embodiments, the plating on the buffer region is used to make the plating on the contact region more uniform in thickness. The buffer region can inhibit preferential deposition of plating material on the edges of the contact region. This can allow for a flatter and more uniform contact region compared to a plated contact region lacking a proximal buffer region.

[0056] The first and second buffer regions may be electrically connected to the contact region. For example, during plating, the first and second buffer regions may have a shared potential applied to the first and second buffer regions and the contact region. Compared to the contact region, the current per unit surface area at the buffer region will tend to be higher. This larger current per unit area may be associated with a relative increase in plating material during plating of the cover or substrate. Since the buffer region is located at the edge of the plating region, it will tend to accumulate more plating material. On the contrary, due to the presence of the buffer region, the contact region will tend to have a more uniform deposition.

[0057] Plating is applied to the cover or substrate at 606. Plating is formed on the cover or substrate by electroplating caused by applying a charge to the cover or substrate at 604. In the case where the first buffer region and / or the second buffer region acts as a grabber, the buildup of plating at the edge of the contact surface can be reduced due to the reduced charge at the boundary of the contact surface. In an embodiment, applying plating to the cover or substrate at 606 may include multiple plating steps. In an embodiment, the plating applied to the cover or substrate at 606 may include one or more of EN plating, bright nickel plating, and / or chrome.

[0058] aspect:

[0059] It should be appreciated that any of aspects 1-9 may be combined with any of aspects 10-20.

[0060] Aspect 1. A photomask container comprising a cover and a substrate, wherein:

[0061] At least one of the cover or the substrate comprises a base material and a coating on the base material,

[0062] At least one of the cover or the substrate includes a contact surface and at least one of:

[0063] a first buffer region adjacent to at least a portion of an outer periphery of the contact surface, or

[0064] a second buffer region adjacent at least a portion of an inner perimeter of the contact surface, and

[0065] Each of the at least one of the first buffer area and the second buffer area is configured to avoid contact between the cover and the substrate when the photomask container is assembled such that the cover and the substrate are in contact at the contact surface.

[0066] Aspect 2. The photomask container according to aspect 1, wherein the first buffer region or the second buffer region is a region recessed relative to the contact surface.

[0067] Aspect 3. The photomask container according to aspect 1, wherein the first buffer region or the second buffer region is a sloped edge.

[0068] Aspect 4. The photomask container according to aspect 1, wherein the first buffer region or the second buffer region of the second buffer surface comprises a rounded corner area.

[0069] Aspect 5. The photomask container according to any one of aspects 1 to 4, wherein a transition portion from the contact surface to the first buffer region or a transition portion from the contact surface to the second buffer region is rounded.

[0070] Aspect 6. The reticle container of any one of aspects 1 to 5, wherein a transition from the contact surface to the second buffer region comprises a sloped edge.

[0071] Aspect 7. The photomask container according to any one of aspects 1 to 6, wherein the first buffer region or the second buffer region has a depth of at least 0.1 millimeters (mm) relative to the contact surface.

[0072] Aspect 8. The reticle container according to any one of aspects 1 to 7, comprising the first buffer region and wherein the first buffer region surrounds the outer periphery of the contact surface.

[0073] Aspect 9. The reticle container of claim 1, comprising the second buffer region and wherein the second buffer region is surrounded by the inner periphery of the contact surface.

[0074] Aspect 10. A method for manufacturing a photomask container, comprising:

[0075] A cover and a substrate are provided, wherein at least one of the cover or the substrate includes a contact surface and at least one of:

[0076] a first buffer region adjacent to at least a portion of an outer periphery of the contact surface, or

[0077] a second buffer region adjacent to at least a portion of an inner perimeter of the contact surface; and

[0078] applying a coating to at least one of the cover or the substrate,

[0079] Wherein each of the at least one of the first buffer area and the second buffer area is configured to avoid contact between the cover and the substrate when the photomask container is assembled so that the cover and the substrate are in contact at the contact surface.

[0080] Aspect 11. The method according to aspect 10, wherein applying the coating comprises electroplating.

[0081] Aspect 12. The method of aspect 11, wherein at least one of the first buffer region and the second buffer region acts as a grab sheet during the electroplating.

[0082] Aspect 13. The method according to aspect 11, wherein applying the coating comprises multiple discrete applications of the electroplating.

[0083] Aspect 14. The method according to any one of aspects 10 to 13, wherein the first buffer region or the second buffer region comprises a sloped edge.

[0084] Aspect 15. The method according to any one of aspects 10 to 14, wherein the first buffer area or the second buffer area includes a rounded corner area.

[0085] Aspect 16. The method according to any one of aspects 10 to 15, wherein the first cushioning area or the second cushioning area is a depression having a depth of at least 0.1 millimeters (mm) relative to the contact surface.

[0086] Aspect 17. The method according to any one of aspects 10 to 16, wherein the at least one of the cover and the substrate includes the first buffer area, wherein the first buffer area surrounds the outer perimeter of the contact surface.

[0087] Aspect 18. The method according to any one of aspects 10 to 17, wherein the at least one of the cover and the substrate includes the second buffer area, wherein the second buffer area is surrounded by the inner perimeter of the contact surface.

[0088] The examples disclosed in this application are to be considered in all respects as illustrative and not restrictive. The scope of the invention is indicated by the appended claims rather than by the foregoing description; and all changes within the meaning and equivalency range of the claims are to be embraced therein.

Claims

1. A photomask container, comprising a cover and a substrate, wherein: At least one of the cover or the substrate includes a base material and a coating on the base material, at least one of the cover or the substrate includes a contact surface and at least one of: a first buffer region adjacent to at least a portion of an outer periphery of the contact surface, or a second buffer region adjacent at least a portion of an inner perimeter of the contact surface, and Each of the at least one of the first buffer area and the second buffer area is configured to avoid contact between the cover and the substrate when the photomask container is assembled such that the cover and the substrate are in contact at the contact surface. 2 . The photomask container according to claim 1 , wherein the first buffer region or the second buffer region is a region recessed relative to the contact surface. 3 . The photomask container of claim 1 , wherein the first buffer region or the second buffer region is a sloped edge. 4 . The photomask container according to claim 1 , wherein the first buffer area or the second buffer area of ​​the second buffer surface comprises a rounded corner area. 5 . The photomask container of claim 1 , wherein a transition portion from the contact surface to the first buffer region or a transition portion from the contact surface to the second buffer region is rounded.

6. The reticle container of claim 1, wherein a transition from the contact surface to the second relief area comprises a sloped edge.

7. The photomask container of claim 1, wherein the first buffer region or the second buffer region has a depth of at least 0.1 millimeters (mm) relative to the contact surface.

8. The reticle container of claim 1, comprising the first buffer region and wherein the first buffer region surrounds the outer perimeter of the contact surface.

9. The reticle container of claim 1, comprising the second buffer area and wherein the second buffer area is surrounded by the inner periphery of the contact surface.

10. A method for manufacturing a photomask container, comprising: A cover and a substrate are provided, wherein at least one of the cover or the substrate includes a contact surface and at least one of: a first buffer region adjacent to at least a portion of an outer periphery of the contact surface, or a second buffer region adjacent to at least a portion of an inner perimeter of the contact surface; and applying a coating to at least one of the cover or the substrate, The first buffer area and the second buffer area are each configured to avoid contact between the cover and the substrate when the photomask container is assembled so that the cover and the substrate are in contact at the contact surface. The method of claim 10 , wherein applying the coating comprises electroplating.

12. The method of claim 11, wherein at least one of the first buffer region and the second buffer region acts as a grab sheet during the electroplating.

13. The method of claim 11, wherein applying the coating comprises multiple discrete applications of the electroplating.

14. The method of claim 10, wherein the first buffer region or the second buffer region comprises a sloped edge. The method of claim 10 , wherein the first buffer region or the second buffer region includes a rounded corner area.

16. The method of claim 10, wherein the first cushioning area or the second cushioning area is a depression having a depth of at least 0.1 millimeters (mm) relative to the contact surface.

17. The method of claim 10, wherein the at least one of the cover and the substrate includes the first buffer region, wherein the first buffer region surrounds the outer perimeter of the contact surface.

18. The method of claim 10, wherein the at least one of the cover and the substrate includes the second buffer region, wherein the second buffer region is surrounded by the inner perimeter of the contact surface.

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