High-performance intelligent control method and equipment for copper wire drawing

Abstract

This application relates to the field of copper wire drawing control technology, and particularly to a high-performance intelligent control method and device for copper wire drawing. The method includes: acquiring mold parameters; acquiring a first sound image and a second sound image; analyzing the mold parameters and the first sound image to obtain a propagation speed; analyzing the propagation speed, the first sound image, and the second sound image to obtain a collision position; analyzing the first sound image and the propagation speed to obtain sound attenuation; and analyzing the collision position, the first sound image, and the sound attenuation to obtain wear status. The high-performance intelligent control method for copper wire drawing provided by this application eliminates the need to remove the drawing mold from the production line for inspection, reducing inspection time, improving inspection efficiency, and enabling real-time online monitoring.

Description

Technical Field

[0001] This application belongs to the field of copper wire drawing control technology, and in particular relates to a high-performance intelligent control method and equipment for copper wire drawing. Background Technology

[0002] Copper wire drawing refers to the production process of creating high-quality copper wire with the desired properties through steps such as wire pretreatment, mold installation, parameter setting, monitoring and adjustment, and wire winding. By precisely and stably controlling the drawing process and the operating status of the drawing equipment, copper wire drawing production can maintain high efficiency and performance, thus meeting the demand for high-performance copper wire.

[0003] In related technologies, especially when it comes to the stable control of the working state of wire drawing equipment, the wear condition of the wire drawing die is particularly important. During the drawing process, the prolonged friction between the wire drawing die and the copper wire causes wear and consumption of the material on the inner surface of the die, ultimately increasing the wear level of the die. The wear condition of the wire drawing die is generally detected by visual inspection or by using tools such as magnifying glasses and microscopes to check the wear condition of the inner surface of the die. Visual inspection of the wear condition of the wire drawing die is time-consuming and will affect the production schedule. While using microscopes to inspect the wear condition of the wire drawing die can only be done when production is stopped, making online real-time monitoring impossible. Summary of the Invention

[0004] This application provides a high-performance intelligent control method and device for copper wire drawing, which can improve the problems of long detection time and inability to achieve online real-time monitoring.

[0005] In a first aspect, embodiments of this application provide a high-performance intelligent control method for copper wire drawing, including:

[0006] Obtain the mold parameters; wherein, the mold parameters are used to reflect the outer diameter and circumference of the wire drawing mold;

[0007] Acquire a first sound image and a second sound image; wherein, the first sound image is used to reflect the sound image generated when the first sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die, and the second sound image is used to reflect the sound image generated when the second sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die, the first sound detection device and the second sound detection device are located at the outer diameter of the drawing die, and the line connecting the first sound detection device and the second sound detection device is not the diameter of the drawing die;

[0008] The propagation speed is obtained by analyzing the mold parameters and the first sound pattern; wherein, the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the drawing mold propagates along the outer diameter of the drawing mold;

[0009] The collision location is obtained by analyzing the propagation speed, the first sound pattern, and the second sound pattern; wherein, the collision location is used to reflect the position where the copper wire collides with the wire drawing die;

[0010] Based on the analysis of the first sound pattern and the propagation speed, sound attenuation is obtained; wherein, the sound attenuation is used to reflect the value of how the amplitude of the sound generated when the copper wire collides with the drawing die gradually decreases with the increase of distance;

[0011] The wear condition is obtained by analyzing the collision location, the first sound pattern, and the sound attenuation.

[0012] The technical solutions described in this application embodiment have at least the following technical effects:

[0013] The high-performance copper wire drawing intelligent control method provided in this application first obtains mold parameters reflecting the outer diameter circumference of the drawing die. Then, it obtains a first sound image reflecting the sound pattern generated when the copper wire collides with the drawing die, received by a first sound detection device, and a second sound image reflecting the sound pattern generated when the copper wire collides with the drawing die, received by a second sound detection device. Based on the mold parameters and the first sound image, it analyzes to obtain the propagation speed, reflecting the speed at which the sound generated when the copper wire collides with the drawing die propagates along the outer diameter of the drawing die. Then, it analyzes the propagation speed, the first sound image, and the second sound image to obtain the collision position, reflecting the location of the copper wire collision on the drawing die. Finally, it analyzes the first sound image and the propagation speed to obtain the sound attenuation, reflecting the gradual decrease in the amplitude of the sound generated when the copper wire collides with the drawing die as the distance increases. Finally, it analyzes the collision position, the first sound image, and the sound attenuation to obtain the wear condition. This method can effectively analyze the internal wear condition of the drawing die by detecting the sound of the copper wire colliding with the drawing die during the drawing process. It eliminates the need to remove the drawing die from the production line for inspection, as it can obtain the wear condition of the drawing die during the copper wire drawing process. This reduces inspection time, improves inspection efficiency, and enables real-time online monitoring. By monitoring the wear condition of the drawing die in real time, the working state of the drawing die can be controlled, thereby ensuring the quality of copper wire drawing.

[0014] In one possible implementation of the first aspect, the propagation speed is obtained by analyzing the mold parameters and the first sound pattern, including:

[0015] Based on the analysis of the first sound pattern, a first time and a second time are obtained; wherein, the first time is used to reflect the time when the first peak appears in the first sound pattern, and the second time is used to reflect the time when the second peak appears in the first sound pattern. The propagation path of the sound from the position where the copper wire collides with the drawing die to the first sound detection device, as reflected by the first peak, is different from the propagation path of the sound from the position where the copper wire collides with the drawing die to the first sound detection device, as reflected by the second peak.

[0016] Based on the analysis of the first time, the second time, and the mold parameters, the propagation speed is obtained; wherein, the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the drawing mold propagates along the outer diameter of the drawing mold.

[0017] In one possible implementation of the first aspect, the propagation speed is obtained by analyzing the first time, the second time, and the mold parameters, including:

[0018] The time and the second time are processed to obtain the time; wherein the time is used to reflect the sum between the first time and the second time;

[0019] The propagation speed is obtained by processing the time and the mold parameters.

[0020] In one possible implementation of the first aspect, the collision location is obtained by analyzing the propagation speed, the first sound pattern, and the second sound pattern, including:

[0021] The first distance is obtained by processing the first time and the propagation speed reflected by the first sound pattern; wherein, the first distance is used to reflect the distance between the sound position generated when the copper wire collides with the drawing die and the first sound detection device.

[0022] The starting time is obtained by analyzing the second sound pattern; wherein the starting time is used to reflect the time when the first peak appears in the second sound pattern;

[0023] The second distance is obtained by processing the start time and the propagation speed; wherein the second distance is used to reflect the distance between the sound position generated when the copper wire collides with the drawing die and the second sound detection device.

[0024] The collision location is obtained by analyzing the first distance and the second distance.

[0025] In one possible implementation of the first aspect, sound attenuation is obtained by analyzing the first sound pattern and the propagation speed, including:

[0026] Based on the analysis of the first sound pattern, the interval time and amplitude ratio are obtained; wherein, the interval time is used to reflect the time interval between the first occurrence peak and the second occurrence peak of the first sound pattern; the amplitude ratio is used to reflect the ratio between the amplitude of the first occurrence peak and the amplitude of the second occurrence peak in the first sound pattern.

[0027] The attenuation distance is obtained by analyzing the interval time and the propagation speed; wherein, the attenuation distance is used to reflect the difference between the propagation distance of the first peak in the first sound pattern to the first sound detection device and the propagation distance of the second peak in the first sound pattern to the first sound detection device.

[0028] The sound attenuation is obtained by analyzing the ratio of the attenuation distance to the amplitude.

[0029] In one possible implementation of the first aspect, the wear condition is obtained by analyzing the collision location, the first sound pattern, and the sound attenuation, including:

[0030] Based on the collision location, an inherent stiffness value is obtained; wherein, the inherent stiffness value is used to reflect the ability of the wire drawing die to resist deformation when subjected to external force at the collision location without wear;

[0031] The wear stiffness value is obtained by analyzing the collision location, the first sound pattern, and the sound attenuation; wherein, the wear stiffness value is used to reflect the ability of the wire drawing die to resist deformation when it is subjected to external force at the collision location;

[0032] The degree of wear is obtained by analyzing the wear stiffness value and the inherent stiffness value.

[0033] In one possible implementation of the first aspect, the wear stiffness value is obtained by analyzing the collision location, the first sound pattern, and the sound attenuation, including:

[0034] Based on the collision location, a reference sound attenuation is obtained; wherein, the reference sound attenuation is used to reflect the degree of loss of the sound amplitude at the collision location when the wire drawing die is unworn, as it propagates in the wire drawing die;

[0035] Based on the analysis of the first sound pattern, frequency attenuation is obtained; wherein, the frequency attenuation is used to reflect the degree to which the frequency of the sound generated when the copper wire collides with the drawing die weakens as it propagates in the drawing die;

[0036] An attenuation ratio is obtained by analyzing the sound attenuation and the reference sound attenuation; wherein, the attenuation ratio is used to reflect the percentage reduction in the amplitude of the sound generated when the copper wire collides with the drawing die as it propagates in the drawing die;

[0037] The wear stiffness value is obtained by analyzing the attenuation ratio and the frequency attenuation.

[0038] In one possible implementation of the first aspect, frequency attenuation is obtained by analyzing the first sound pattern, including:

[0039] Based on the analysis of the first sound pattern, multiple durations are obtained; wherein, the duration is used to reflect the duration of peaks appearing in the first sound pattern;

[0040] Multiple frequency values ​​are obtained by processing based on multiple durations; wherein the frequency values ​​are used to reflect the reciprocal of the duration.

[0041] The frequency attenuation is obtained by processing multiple frequency values.

[0042] In one possible implementation of the first aspect, processing is performed based on a plurality of said frequency values ​​to obtain frequency attenuation, including:

[0043] Multiple differential frequencies are obtained by performing differential calculations on multiple frequency values; wherein, the differential frequency is used to reflect the difference between the i-th frequency value and the (i-2)-th frequency value, where i is a positive integer greater than 0;

[0044] The average value is calculated based on the multiple differential frequencies to obtain the differential mean value, and the differential mean value is confirmed as the frequency attenuation.

[0045] Secondly, embodiments of this application provide a high-performance copper wire drawing system, comprising:

[0046] The first acquisition module is used to acquire mold parameters; wherein, the mold parameters are used to reflect the outer diameter and circumference of the wire drawing mold;

[0047] The second acquisition module is used to acquire a first sound image and a second sound image; wherein, the first sound image is used to reflect the sound image generated when the first sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die, and the second sound image is used to reflect the sound image generated when the second sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die. The first sound detection device and the second sound detection device are set at the outer diameter of the drawing die, and the line connecting the first sound detection device and the second sound detection device is not the diameter of the drawing die.

[0048] The first analysis module is used to analyze the mold parameters and the first sound pattern to obtain the propagation speed; wherein, the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the drawing mold propagates along the outer diameter of the drawing mold;

[0049] The second analysis module is used to analyze the propagation speed, the first sound pattern, and the second sound pattern to obtain the collision position; wherein, the collision position is used to reflect the position of the copper wire collision on the wire drawing die;

[0050] The third analysis module is used to analyze the first sound pattern and propagation speed to obtain sound attenuation; wherein, sound attenuation is used to reflect the value of how the amplitude of the sound generated when the copper wire collides with the drawing die gradually decreases with the increase of distance;

[0051] The fourth analysis module is used to analyze the wear status based on the collision location, the first sound pattern, and the sound attenuation.

[0052] Thirdly, embodiments of this application provide a high-performance copper wire drawing device, including a detection device and a control device. The detection device is electrically connected to the control device. The detection device includes a first sound detection device and a second sound detection device. The control device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, it implements the method described in any of the first aspects above.

[0053] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in any of the first aspects above.

[0054] Fifthly, embodiments of this application provide a computer program that, when running on a high-performance copper wire drawing device, causes the high-performance copper wire drawing device to execute the high-performance copper wire drawing intelligent control method described in any of the first aspects above.

[0055] It is understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0057] Figure 1 This is a flowchart illustrating a high-performance copper wire drawing intelligent control method provided in an embodiment of this application;

[0058] Figure 2 This is a schematic diagram illustrating the implementation process of a high-performance copper wire drawing intelligent control method provided in an embodiment of this application;

[0059] Figure 3 This is a schematic diagram of the structure of a high-performance copper wire drawing system provided in an embodiment of this application;

[0060] Figure 4 This is a schematic diagram of the control device of a high-performance copper wire drawing equipment provided in an embodiment of this application. Detailed Implementation

[0061] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0062] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0063] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0064] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0065] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0066] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0067] In related technologies, especially when it comes to the stable control of the working state of wire drawing equipment, the wear condition of the wire drawing die is particularly important. During the drawing process, the prolonged friction between the wire drawing die and the copper wire causes wear and consumption of the material on the inner surface of the die, ultimately increasing the wear level of the die. The wear condition of the wire drawing die is generally detected by visual inspection or by using tools such as magnifying glasses and microscopes to check the wear condition of the inner surface of the die. Visual inspection of the wear condition of the wire drawing die is time-consuming and will affect the production schedule. While using microscopes to inspect the wear condition of the wire drawing die can only be done when production is stopped, making online real-time monitoring impossible.

[0068] To address the aforementioned problems, this application provides a high-performance intelligent control method for copper wire drawing. In this method, mold parameters reflecting the outer diameter circumference of the drawing die are acquired. Then, a first sound image reflecting the sound pattern generated when the copper wire collides with the drawing die, received by a first sound detection device, and a second sound image reflecting the sound pattern generated when the copper wire collides with the drawing die, received by a second sound detection device, are acquired. Based on the mold parameters and the first sound image, a propagation speed reflecting the speed at which the sound generated when the copper wire collides with the drawing die propagates along the outer diameter of the drawing die are obtained. Further analysis of the propagation speed, the first sound image, and the second sound image yields the collision position reflecting the location of the copper wire collision on the drawing die. Then, analysis of the first sound image and the propagation speed yields the sound attenuation, reflecting the decrease in amplitude of the sound generated when the copper wire collides with the drawing die as distance increases. Finally, analysis of the collision position, the first sound image, and the sound attenuation yields the wear condition. This method can effectively analyze the internal wear condition of the drawing die by detecting the sound of the copper wire colliding with the drawing die during the drawing process. It eliminates the need to remove the drawing die from the production line for inspection, as it can obtain the wear condition of the drawing die during the copper wire drawing process. This reduces inspection time, improves inspection efficiency, and enables real-time online monitoring. By monitoring the wear condition of the drawing die in real time, the working state of the drawing die can be controlled, thereby ensuring the quality of copper wire drawing.

[0069] The high-performance copper wire drawing intelligent control method provided in this application embodiment can be applied to high-performance copper wire drawing equipment. In this case, the high-performance copper wire drawing equipment is the execution subject of the high-performance copper wire drawing intelligent control method provided in this application embodiment. This application embodiment does not impose any restrictions on the specific type of high-performance copper wire drawing equipment.

[0070] High-performance copper wire drawing equipment includes a detection device and a control device. The detection device and the control device are electrically connected. The detection device includes a first sound detection device, a second sound detection device, and a drawing die. Both the first and second sound detection devices are used to detect the sound generated when the copper wire collides with the drawing die. The first sound detection device is located at a first position on the outer diameter of the drawing die, and the second sound detection device is located at a second position on the drawing die, with the first position different from the second position. The line connecting the first and second positions does not pass through the center of the inner diameter of the drawing die. For example, the sound detection device can be a microphone, a sound sensor, or a noise meter. The control device is used to monitor and control the copper wire drawing process.

[0071] For example, the control device can be a mobile phone, tablet computer, laptop computer, ultra-mobile personal computer (UMPC), netbook, smart screen, smart TV, handheld device with wireless communication function, desktop computer, handheld device with wireless communication function, computer, laptop computer, handheld computing device, microcontroller, microcontroller, application-specific integrated circuit, etc.

[0072] To better understand the high-performance copper wire drawing intelligent control method provided in the embodiments of this application, the specific implementation process of the high-performance copper wire drawing intelligent control method provided in the embodiments of this application will be described by way of example below.

[0073] Figure 1 and Figure 2 A schematic flowchart of the intelligent control method for high-performance copper wire drawing provided in this application embodiment is shown. Please refer to [link / reference]. Figure 1 and Figure 2 High-performance copper wire drawing intelligent control methods include:

[0074] S100, obtain the mold parameters; where the mold parameters are used to reflect the outer diameter circumference of the wire drawing mold.

[0075] For example, die parameters can be manually input. Alternatively, they can be obtained directly from a parameter database. A parameter database contains the outer diameter circumference of wire drawing dies with different reduction rates. This data can be obtained through laboratory experiments, on-site measurements and monitoring, and past experience. After acquisition, the collected data is organized, classified, and archived, useful information and patterns are extracted, and the relevant data is saved to form the parameter database.

[0076] S200, acquire a first sound image and a second sound image; wherein, the first sound image is used to reflect the sound image generated when the first sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die, and the second sound image is used to reflect the sound image generated when the second sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die, the first sound detection device and the second sound detection device are set at the outer diameter of the drawing die, and the line connecting the first sound detection device and the second sound detection device is not the diameter of the drawing die.

[0077] It's understandable that when drawing copper wire, the front end of the copper wire needs to be manually passed through the drawing die, and then a traction wheel applies tension to the copper wire, forcing it through the die and ultimately drawing it into the required size. When the high-performance copper wire drawing equipment begins drawing the copper wire, because the thin copper wire is manually passed through the drawing die (its size is smaller than the die's inner diameter), the copper wire will collide with the inner wall of the die when pulled by the traction wheel, thus producing sound.

[0078] For example, the collision sound propagating to the first sound detection device when a copper wire collides with a drawing die can be acquired using a first sound detection device. Then, a first sound image is obtained by creating a graphic from the collision sound. The image creation process can involve first processing the collision sound data to remove unnecessary background noise and reduce abrupt changes and jitter in the signal to ensure accuracy, and then directly plotting the collision sound using Python code and the matplotlib library. The matplotlib library is a 2D plotting tool in Python code. Similarly, a second sound image can be obtained by using a similar method to obtain the first sound image.

[0079] S300, based on the analysis of the mold parameters and the first sound pattern, the propagation speed is obtained; wherein, the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the drawing mold propagates along the outer diameter of the drawing mold.

[0080] For example, the propagation speed can be obtained by analyzing the first sound pattern to obtain the response time of the first peak and the response time of the second peak in the first sound pattern, and then by analyzing the response time of the first peak and the response time of the second peak in the first sound pattern with the mold parameters.

[0081] Furthermore, by analyzing the second sound pattern, the response times of the first and second peaks in the second sound pattern can be obtained. Then, by analyzing the response times of the first and second peaks in the second sound pattern with the mold parameters, the propagation speed can be finally obtained.

[0082] In one possible implementation, in step S300, the propagation speed is obtained by analyzing the mold parameters and the first acoustic pattern, including:

[0083] S310, Analyze the first sound pattern to obtain a first time and a second time; wherein, the first time is used to reflect the time when the first peak appears in the first sound pattern, and the second time is used to reflect the time when the second peak appears in the first sound pattern. The propagation path of the sound reflected by the first peak from the position where the copper wire collides with the drawing die to the first sound detection device is different from the propagation path of the sound reflected by the second peak from the position where the copper wire collides with the drawing die to the first sound detection device.

[0084] It is understandable that when the collision sound propagates along the outer diameter of the wire drawing die, it travels clockwise and counterclockwise along the outer diameter of the annular wire drawing die. Since the collision sound is not on the line connecting the first sound detection device and the center of the inner diameter of the wire drawing die, the time it takes for the first sound detection device to receive the collision sound propagating in different clockwise directions varies, ultimately resulting in different peaks in the first sound waveform. When the collision sound is on the line connecting the first sound detection device and the center of the inner diameter of the wire drawing die, it will propagate clockwise and counterclockwise along the outer diameter of the annular wire drawing die, with the clockwise and counterclockwise propagation distances being the same. The time it takes for the clockwise sound to reach the first sound detection device will be the same as the time it takes for the counterclockwise sound to reach the first sound detection device. Therefore, when the first sound detection device first receives the collision sound propagating clockwise and counterclockwise along the outer diameter of the annular wire drawing die, only one peak is displayed in the first sound waveform.

[0085] By analyzing the first sound image, the occurrence time of the first peak and the occurrence time of the second peak in the first sound image are directly obtained, and the occurrence time of the first peak is identified as the first time and the occurrence time of the second peak is identified as the second time.

[0086] S320, based on the analysis of the first time, the second time and the mold parameters, the propagation speed is obtained; whereby the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the drawing mold propagates along the outer diameter of the drawing mold.

[0087] For example, the propagation speed can be obtained by processing the first and second time points to obtain their sum, and then by processing the sum with the mold parameters. Alternatively, the propagation speed can be obtained by analyzing the first sound pattern to obtain the time of the first peak and the time of the third peak in the second sound pattern, and then by processing the difference between the times of the first and third peaks with the mold parameters.

[0088] This setup allows for the analysis of the propagation speed of the sound generated when the copper wire collides with the drawing die through sound image analysis, providing a real-time and accurate data foundation for subsequent analysis of the wear condition of the drawing die.

[0089] In one possible implementation, in step S320, the propagation speed is obtained by analyzing the first time, the second time, and the mold parameters, including:

[0090] S321, Process according to the first time and the second time to obtain the time; where the time is used to reflect the sum between the first time and the second time.

[0091] It's understandable that time equals the first time plus the second time.

[0092] For example, if the first time interval is 0.01ms and the second time interval is 0.017ms, then the total time is 0.027(0.01+0.017)ms; if the first time interval is 0.015ms and the second time interval is 0.015ms, then the total time is 0.03(0.015+0.015)ms, and so on.

[0093] S322, the propagation speed is obtained by processing the time and mold parameters.

[0094] It can be understood that the propagation speed = mold parameters ÷ time.

[0095] For example, if the mold parameters are 157mm and the time is 0.03ms, the propagation speed is 5233(157÷0.03)m / s, and so on.

[0096] This setup enables non-destructive evaluation of the material's internal properties through precise time measurement and parameter processing, allowing for real-time analysis of the sound propagation speed in the wire drawing die under different wear levels.

[0097] S400, based on the propagation speed, the first sound pattern and the second sound pattern, the collision position is obtained; whereby the collision position is used to reflect the position of the copper wire collision on the wire drawing die.

[0098] For example, the distance between the collision sound and the first sound detection device can be obtained by processing the time and propagation speed of the first peak in the first sound pattern. Then, the time of the first peak in the second sound pattern can be obtained by analyzing the second sound pattern. The distance between the collision sound and the second sound detection device can be obtained by processing the time and propagation speed of the first peak in the second sound pattern. Finally, the collision location can be obtained by analyzing the distances between the collision sound and the first and second sound detection devices.

[0099] Alternatively, by analyzing the second sound pattern, the time of the second peak in the second sound pattern can be obtained. Then, by processing the time of the second peak in the second sound pattern with the propagation speed, the distance of the collision sound from the second sound detection device can be obtained. Then, by processing the second time and the propagation speed, the position of the collision sound from the first sound detection device can be obtained. Finally, by analyzing the distances of the collision sound from the first sound detection device and the distances of the collision sound from the second sound detection device, the collision position can be obtained.

[0100] In one possible implementation, in step S400, the collision location is obtained by analyzing the propagation speed, the first sound pattern, and the second sound pattern, including:

[0101] S410, the first distance is obtained by processing the first time and propagation speed reflected by the first sound pattern; wherein, the first distance is used to reflect the distance between the sound position generated when the copper wire collides with the drawing die and the first sound detection device.

[0102] It can be understood that the first distance = the first time × the propagation speed.

[0103] For example, if the first time interval is 0.01 ms and the propagation speed is 5233 m / s, then the first distance is 52.33 mm, and so on.

[0104] S420, Analyze the second sound pattern to obtain the start time; where the start time is used to reflect the time when the first peak appears in the second sound pattern.

[0105] For example, the occurrence time of the first peak in the second sound graph can be directly obtained by analyzing the second sound graph, and the occurrence time can be identified as the start time.

[0106] S430, based on the start time and propagation speed, a second distance is obtained; wherein, the second distance is used to reflect the distance between the sound position generated when the copper wire collides with the drawing die and the second sound detection device.

[0107] It can be understood that the second distance = starting time × propagation speed.

[0108] For example, if the start time is 0.017 ms and the propagation speed is 5233 m / s, then the second distance is 88.961 mm (0.017 ms × 5233 m / s), and so on.

[0109] S440, based on the analysis of the first distance and the second distance, the collision position is obtained.

[0110] It can be understood that the first distance and the second distance are respectively the sound generated when the copper wire collides with the drawing die and propagates clockwise and counterclockwise along the outer diameter of the drawing die. The first distance can determine the position of the sound generated when the copper wire collides with the drawing die from the first sound detection device. However, the sound generated when the copper wire collides with the drawing die can be at the first distance in the clockwise direction from the first sound detection device, and it can also be at the first distance in the counterclockwise direction from the first sound detection device. By verifying the common position of the second distance and the first distance, the position of the copper wire colliding with the drawing die can be determined.

[0111] With this setup, by accurately measuring the sound wave propagation time and calculating the distance, collisions and wear inside the mold can be monitored and located more precisely. By combining the second distance with the first distance, the collision location can be located at two points, and the location of the sound source can be determined more accurately.

[0112] S500, based on the analysis of the first sound pattern and propagation speed, obtains the sound attenuation; whereby the sound attenuation is used to reflect the value of how the amplitude of the sound generated when the copper wire collides with the drawing die gradually decreases with the increase of distance.

[0113] For example, by analyzing the first sound pattern, the time interval between the first and second peaks in the first sound pattern and the ratio between the amplitudes of the first and second peaks can be obtained. Then, based on the time interval and propagation speed, the ratio reflecting the propagation distance of the first peak in the first sound pattern to the first sound detection device and the propagation distance of the second peak in the first sound pattern to the first sound detection device can be obtained. Finally, by analyzing the ratio reflecting the propagation distance of the first peak in the first sound pattern to the first sound detection device and the ratio reflecting the amplitudes of the first and second peaks in the first sound pattern, sound attenuation can be obtained.

[0114] Furthermore, by analyzing the first sound pattern, the time interval between the first and second peaks in the first sound pattern, as well as the difference between the amplitudes of the first and second peaks, can be obtained. Then, by analyzing the time interval between the first and second peaks in the first sound pattern, the difference between the amplitudes of the first and second peaks, and the propagation speed, sound attenuation can be obtained.

[0115] In one possible implementation, in step S500, sound attenuation is obtained by analyzing the first sound pattern and propagation speed, including:

[0116] S510, based on the analysis of the first sound pattern, the interval time and amplitude ratio are obtained; wherein, the interval time is used to reflect the time interval between the first occurrence peak and the second occurrence peak of the first sound pattern; the amplitude ratio is used to reflect the ratio between the amplitude of the first occurrence peak and the amplitude of the second occurrence peak in the first sound pattern.

[0117] It can be understood that the interval time refers to the ratio between the time of the first peak in the first sound pattern and the time of the second peak in the first sound pattern.

[0118] For example, the occurrence time of the first peak and the occurrence time of the second peak in the first sound graph can be obtained by analyzing the first sound graph. Then, by comparing the occurrence time of the first peak and the occurrence time of the second peak in the first sound graph, the interval time can be obtained.

[0119] By analyzing the first sound pattern, we can obtain the first amplitude value of the first peak and the second amplitude value of the second peak in the first sound pattern. Then, by comparing the first amplitude value and the second amplitude value, we can finally obtain the amplitude ratio.

[0120] S520, based on the interval time and propagation speed, the attenuation distance is obtained; wherein, the attenuation distance is used to reflect the difference between the propagation distance of the first peak in the first sound pattern to the first sound detection device and the propagation distance of the second peak in the first sound pattern to the first sound detection device.

[0121] It can be understood that attenuation distance = interval time × propagation speed. The interval time is the difference between the appearance time of the first peak and the appearance time of the second peak in the first sound pattern. The appearance time of the first peak in the first sound pattern can be used to reflect the time it takes for the sound generated when the copper wire collides with the drawing die to propagate along the outer diameter of the drawing die to the first sound detection device. Similarly, the appearance time of the second peak in the first sound pattern can be used to reflect the time it takes for the sound generated when the copper wire collides with the drawing die to propagate along the outer diameter of the drawing die to the first sound detection device. Therefore, the attenuation distance can be obtained by analyzing the interval time and the propagation speed.

[0122] For example, if the interval is 0.07ms and the propagation speed is 5233m / s, then the attenuation distance is (0.07ms × 5233m / s).

[0123] S530, based on the analysis of the attenuation distance and amplitude ratio, yields the sound attenuation.

[0124] For example, the attenuation can be obtained by processing the amplitude ratio, and then processed by the attenuation distance to finally obtain the sound attenuation. The attenuation can be obtained by logarithmic processing of the amplitude ratio. The processing steps to obtain the attenuation can be by logarithmic processing of the amplitude ratio. The attenuation refers to the reduction in amplitude. The attenuation can be obtained by formula... Where ΔL refers to the attenuation amount, 20 is the logarithmic correlation coefficient of the amplitude ratio, A0 refers to the amplitude value of the first peak appearing in the first sound pattern, and A refers to the amplitude value of the second peak appearing in the first sound pattern. The sound attenuation processing steps can be achieved by comparing the attenuation amount with the attenuation distance, ultimately yielding the sound attenuation. Sound attenuation = Attenuation amount ÷ Attenuation distance.

[0125] With this setup, by analyzing the obtained amplitude ratio, information on the energy attenuation of the collision sound as it propagates in the wire drawing die can be obtained. The sound attenuation can provide a direct indicator for quantifying the wear degree of the wire drawing die.

[0126] S600 analyzes the wear status based on the collision location, the first sound pattern, and sound attenuation.

[0127] For example, the collision location can be analyzed to obtain the ability of the wire drawing die to resist deformation when subjected to external force at the collision location without wear. Then, by analyzing the collision location, the first sound pattern, and the sound attenuation, the ability of the current wire drawing die to resist deformation when subjected to external force at the collision location can be obtained. Finally, by comparing the ability of the current wire drawing die to resist deformation when subjected to external force at the collision location with the ability of the wire drawing die to resist deformation when subjected to external force at the collision location without wear, the wear status of the wire drawing die can be obtained.

[0128] Wear conditions can also be obtained by training a wear model. This involves inputting the collision location, the initial sound pattern, and the sound attenuation into the wear model, which then outputs the corresponding wear condition. The training process for the wear model involves using the processed data (collision location, initial sound pattern, sound attenuation, and corresponding wear condition) as the training dataset. This training dataset is then input into the wear model for training and learning, ultimately resulting in the wear model.

[0129] In one possible implementation, in step S600, the wear condition is obtained by analyzing the collision location, the first acoustic pattern, and the acoustic attenuation, including:

[0130] S610, based on the collision location, obtain the inherent stiffness value; wherein, the inherent stiffness value is used to reflect the ability of the wire drawing die to resist deformation when subjected to external force at the collision location when it is unworn.

[0131] It is understandable that different working areas exist inside the wire drawing die, and these different working areas have different stiffness values. By identifying the collision location, the stiffness value at the collision location within the unworn wire drawing die is obtained and confirmed as the inherent stiffness value. The inherent stiffness value can be obtained manually or directly from an attribute database. An attribute database contains stiffness values ​​for various locations within the wire drawing die at different reduction rates. This data can be obtained through laboratory experiments, on-site measurements and monitoring, and past experience. After acquisition, the collected data is organized, classified, and archived, useful information and patterns are extracted, and the relevant data is saved to the database to form the attribute database.

[0132] S620, based on the collision location, the first sound pattern and sound attenuation, the wear stiffness value is obtained; the wear stiffness value is used to reflect the ability of the current wire drawing die to resist deformation when subjected to external force at the collision location.

[0133] For example, by analyzing the collision location, the degree of loss of the sound amplitude at the collision location when the drawing die is unworn can be obtained. Then, by analyzing the first sound pattern, the degree of attenuation of the sound frequency generated when the copper wire collides with the drawing die when it propagates in the drawing die can be obtained. Then, by analyzing the sound attenuation and the degree of attenuation of the sound frequency generated when the copper wire collides with the drawing die when it propagates in the drawing die, the percentage reduction of the sound amplitude generated when the copper wire collides with the drawing die when it propagates in the drawing die can be obtained. Finally, by analyzing the percentage reduction of the sound amplitude generated when the copper wire collides with the drawing die and the degree of attenuation of the sound frequency generated when the copper wire collides with the drawing die when it propagates in the drawing die, the wear stiffness value can be obtained.

[0134] Wear stiffness values ​​can also be obtained by training an analytical model. This involves inputting the collision location, the initial sound pattern, and the sound attenuation into the analytical model, which then outputs the corresponding wear stiffness value. The training process for the analytical model can be achieved by using the processed data (collision location, initial sound pattern, sound attenuation, and corresponding wear stiffness values) as the training dataset. This training dataset is then input into the analytical model for training and learning, ultimately resulting in the analytical model.

[0135] In one possible implementation, step S610 involves analyzing the collision location, the first acoustic pattern, and the acoustic attenuation to obtain the wear stiffness value, including:

[0136] S611, based on the collision position, the reference sound attenuation is obtained; wherein, the reference sound attenuation is used to reflect the degree of loss of the sound amplitude at the collision position when the drawing die is unworn, as it propagates in the drawing die.

[0137] It is understood that each part of the wire drawing die has a corresponding stiffness value, and the distance from each part of the wire drawing die to its outer wall is different, meaning that the thickness of different working areas of the wire drawing die is different. By identifying the collision location, the sound attenuation at the collision location in the unworn wire drawing die is obtained, and this sound attenuation is confirmed as the reference sound attenuation. The reference sound attenuation can be obtained by manually inputting it, or it can be directly obtained from an attenuation database. An attenuation database is a database containing reference sound attenuations at various points inside the wire drawing die for different reduction rates. This data can be obtained through laboratory experiments, on-site measurements and monitoring, and past experience. After acquisition, the collected data is organized, classified, and archived, useful information and patterns are extracted, and the relevant data is saved to the database to form the attenuation database.

[0138] S612, based on the analysis of the first sound pattern, the frequency attenuation is obtained; wherein, the frequency attenuation is used to reflect the degree to which the frequency of the sound generated when the copper wire collides with the drawing die weakens as it propagates in the drawing die.

[0139] For example, the duration corresponding to multiple peaks in the first sound pattern can be obtained by analyzing the first sound pattern, and then the reciprocal corresponding to the duration can be obtained by processing the duration corresponding to the multiple peaks in the first sound pattern. Finally, the frequency attenuation can be obtained by processing the reciprocal corresponding to the duration.

[0140] Alternatively, by performing a fast Fourier transform on the first sound graph, the amplitude-related first sound graph can be converted into a frequency domain graph. Then, by analyzing the frequency domain graph, the difference between the maximum and minimum frequencies in the frequency domain graph can be obtained, and the difference between the maximum and minimum frequencies can be identified as frequency attenuation.

[0141] In one possible implementation, step S612 involves analyzing the first sound pattern to obtain frequency attenuation, including:

[0142] S6121, Analyze the first sound pattern to obtain multiple durations; wherein, the duration is used to reflect the duration of the peak in the first sound pattern.

[0143] It is understandable that duration is the time interval between the initial appearance of a peak in the first sound graph and the return of the peak's amplitude to 0.

[0144] For example, peaks in the first sound graph can be identified and their durations extracted using libraries such as MATLAB, Python's SciPy library, or NumPy library. By extracting the durations of multiple peaks, multiple durations can be obtained. SciPy and NumPy are computational tool libraries in Python.

[0145] S6122, processes multiple durations to obtain multiple frequency values; wherein, the frequency value is used to reflect the reciprocal of the duration.

[0146] It can be understood that the frequency value refers to the number of times the peak in the first sound pattern completes a periodic change per unit time.

[0147] For example, the reciprocals of the durations corresponding to multiple peaks can be obtained by processing the durations, and these reciprocals can be used as frequency values. Alternatively, the first sound pattern can be processed to obtain its spectrum, and the frequency values ​​corresponding to multiple peaks in the first sound pattern can be directly obtained from the spectrum. The process of obtaining the spectrum of the first sound pattern can be achieved by first performing a Fast Fourier Transform (FFT) on the first sound pattern to convert it into a spectrum, and finally, multiple frequency values ​​can be directly read from the spectrum.

[0148] S6123 processes multiple frequency values ​​to obtain frequency attenuation.

[0149] For example, multiple frequency values ​​can be processed to obtain a value reflecting the difference between the i-th frequency value and the (i-2)-th frequency value, where i is a positive integer greater than 0. Then, by analyzing the processed frequency values, frequency attenuation can be obtained. Alternatively, multiple frequency values ​​can be processed and a frequency curve can be plotted. The maximum rate of change of the frequency curve can then be analyzed to obtain the maximum rate of change, which can then be used to determine frequency attenuation. The maximum rate of change refers to the maximum slope of the frequency curve. The frequency curve can be plotted directly using Python code by calling the matplotlib library.

[0150] This setup, by measuring the duration of the peak in the first sound pattern and converting the duration into a frequency value, makes the analysis more comprehensive. Furthermore, the analysis of frequency attenuation provides important information for evaluating the performance of the internal wear condition of the wire drawing die. By monitoring frequency attenuation, signs of material wear or performance degradation can be detected early, allowing for timely maintenance or replacement. This provides a non-invasive, high-precision detection method that helps improve product quality and production efficiency.

[0151] In one possible implementation, step S6122 involves processing multiple frequency values ​​to obtain frequency attenuation, including:

[0152] S61221, perform differential calculations based on multiple frequency values ​​to obtain multiple differential frequencies; where the differential frequency is used to reflect the difference between the i-th frequency value and the (i-2)-th frequency value, and i is a positive integer greater than 0.

[0153] As can be understood, differential calculation refers to the difference between consecutive frequency values ​​among multiple frequency values. The formula for differential calculation can be ΔX. i =X i -X i-2 , where ΔX i For differential frequency, X iX is the i-th frequency value among multiple frequency values. i-2 It is the (i-2)th frequency value among multiple frequency values.

[0154] For example, if multiple frequency values ​​are 40Hz, 37Hz, 32Hz, 28Hz, 24Hz, 21Hz, etc., then the first differential frequency is 8 (40-32)Hz, the second differential frequency is 9 (37-28)Hz, the third differential frequency is 8 (32-24)Hz, the fourth differential frequency is 7 (28-21)Hz, and so on.

[0155] S61222 calculates the average value based on multiple differential frequencies to obtain the differential average value, and confirms the differential average value as the frequency attenuation.

[0156] It is understandable that the difference mean refers to the average value among multiple difference frequencies.

[0157] For example, if the multiple differential frequencies are 8Hz, 9Hz, 8Hz, and 7Hz, then the average differential frequency is 8(8+9+8+7)Hz, and so on.

[0158] This setup allows for more accurate identification of the frequency variation trend of collision sounds through differential frequency calculation, thereby capturing minute attenuation changes. By calculating the differential mean, random errors in single measurements are reduced, improving the reliability of frequency attenuation assessment. The quantification of frequency attenuation provides a direct indicator for wear monitoring of wire drawing dies, helping to detect wear signs early and carry out timely maintenance.

[0159] S613, based on the sound attenuation and the reference sound attenuation, the attenuation ratio is obtained; whereby the attenuation ratio is used to reflect the percentage reduction in the amplitude of the sound generated when the copper wire collides with the drawing die as it propagates in the drawing die.

[0160] It can be understood that the attenuation ratio = (sound attenuation - reference sound attenuation) ÷ reference sound attenuation.

[0161] For example, if the reference sound attenuation is 20 dB and the sound attenuation is 26.02 dB, then the attenuation ratio is 0.301, and so on.

[0162] S614, based on the analysis of attenuation ratio and frequency attenuation, the wear stiffness value is obtained.

[0163] It is understandable that wire drawing dies have different attenuation ratios at different frequencies, and different attenuation ratios correspond to different stiffness values.

[0164] For example, a stiffness analysis model can be constructed using machine learning methods (such as decision trees, random forests, support vector machines, etc.) to obtain the wear stiffness value of the wire drawing die. That is, the attenuation ratio and frequency attenuation are input into the stiffness analysis model, which then outputs the corresponding wear stiffness value. The training process of the stiffness analysis model can begin by cleaning the attenuation ratio and frequency attenuation data (handling missing values, duplicate values, and outliers) to remove outliers (e.g., outliers may be caused by measurement errors, data entry errors, or other abnormalities) and noise (e.g., random errors or meaningless interference in historical fault data, which may lead to data inaccuracy and reduced usability), ensuring the quality of the attenuation ratio and frequency attenuation. The processed attenuation ratio and frequency attenuation, along with the corresponding wear stiffness value, are then used as the training dataset. This training dataset is input into the stiffness analysis model for training, ultimately yielding the stiffness analysis model.

[0165] This setup allows for monitoring of die wear by comparing baseline and actual sound attenuation without requiring downtime or destructive testing. Analysis of frequency attenuation provides additional information about energy loss as impact sound propagates within the drawing die, contributing to a more comprehensive understanding of die wear. Quantifying the attenuation ratio provides an intuitive indicator for assessing die wear, facilitating maintenance decisions. Calculating wear stiffness values ​​provides a scientific basis for evaluating the die's mechanical properties, helping to predict its lifespan and performance degradation.

[0166] S630, the degree of wear is obtained by analyzing the wear stiffness value and the inherent stiffness value.

[0167] For example, stiffness attenuation can be obtained by processing the wear stiffness value and the inherent stiffness value. Then, the wear degree can be obtained by matching the stiffness attenuation with a set of attenuation levels. Different wear degrees of the wire drawing die correspond to a stiffness attenuation. Stiffness attenuation = (Inherent stiffness value - Wear stiffness value) ÷ Inherent stiffness value. The set of attenuation levels includes multiple attenuation degree intervals, which refer to the intervals of wear stiffness values ​​corresponding to different wear degrees. If the inherent stiffness is 500 N / μm and the wear stiffness is 400 N / μm, then the stiffness decay is 0.2[500-400)÷500]. The set of decay levels can be (0, 0.1), (0.1, 0.3), and (0.3, 1), where (0, 0.1) corresponds to light wear, (0.1, 0.3) corresponds to moderate wear, and (0.3, 1) corresponds to heavy wear. When the stiffness decay is 0.03, the corresponding wear level is light wear; when the stiffness decay is 0.2, the corresponding wear level is moderate wear, and so on.

[0168] This setup allows for analysis of the internal wear condition of the drawing die by analyzing the sound of the copper wire colliding with it during drawing. It eliminates the need to remove the drawing die from the production line for inspection, enabling the analysis of the die's wear during the copper wire drawing process. This reduces inspection time, improves efficiency, and allows for real-time online monitoring. Real-time monitoring of the die's wear condition ensures controllable operation, thereby guaranteeing the quality of the drawn copper wire.

[0169] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0170] Corresponding to the high-performance copper wire drawing intelligent control method described in the above embodiments, this application also provides a high-performance copper wire drawing system. Each module of the high-performance copper wire drawing system can realize each step of the high-performance copper wire drawing intelligent control method. Figure 3 A structural block diagram of a high-performance copper wire drawing system provided in an embodiment of this application is shown. For ease of explanation, only the parts related to the embodiments of this application are shown.

[0171] Reference Figure 3 High-performance copper wire drawing systems include:

[0172] The first acquisition module is used to acquire mold parameters; wherein, the mold parameters are used to reflect the outer diameter and circumference of the wire drawing mold.

[0173] The second acquisition module is used to acquire a first sound image and a second sound image; wherein, the first sound image is used to reflect the sound image generated when the first sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die, and the second sound image is used to reflect the sound image generated when the second sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die. The first sound detection device and the second sound detection device are set at the outer diameter of the drawing die, and the line connecting the first sound detection device and the second sound detection device is not the diameter of the drawing die.

[0174] The first analysis module is used to analyze the mold parameters and the first sound pattern to obtain the propagation speed; wherein, the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the drawing mold propagates along the outer diameter of the drawing mold.

[0175] The second analysis module is used to analyze the propagation speed, the first sound pattern, and the second sound pattern to obtain the collision position; wherein, the collision position is used to reflect the position of the copper wire collision on the wire drawing die.

[0176] The third analysis module is used to analyze the first sound pattern and propagation speed to obtain sound attenuation; wherein, sound attenuation is used to reflect the value of how the amplitude of the sound generated when the copper wire collides with the drawing die gradually decreases with the increase of distance.

[0177] The fourth analysis module is used to analyze the wear status based on the collision location, the first sound pattern, and the sound attenuation.

[0178] It should be noted that the information interaction and execution process between the above systems / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0179] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0180] This application embodiment also provides a high-performance copper wire drawing device, which includes a sound detection device and a control device, and the sound detection device and the control device are electrically connected. Figure 4 This is a schematic diagram of the structure of the control device 4 provided in one embodiment of this application. Figure 4 As shown, the control device 4 in this embodiment includes: at least one processor 40 ( Figure 4 Only one is shown in the image), at least one memory 41 ( Figure 4 (Only one is shown in the image) and a computer program 42 stored in the at least one memory 41 and executable on the at least one processor 40. When the processor 40 executes the computer program 42, it causes the control device 4 to implement the steps in any of the above embodiments of the high-performance copper wire drawing intelligent control method, or causes the control device 4 to implement the functions of each module / unit in the above system embodiments.

[0181] For example, the computer program 42 may be divided into one or more modules / units, which are stored in the memory 41 and executed by the processor 40 to complete this application. The one or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program 42 in the control device 4.

[0182] The control device 4 can be a computing device such as a desktop computer, laptop, handheld computer, or cloud server. The control device 4 may include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art will understand that... Figure 4 This is merely an example of control device 4 and does not constitute a limitation on control device 4. It may include more or fewer components than shown, or combine certain components, or different components, such as input / output devices, network access devices, buses, etc.

[0183] The processor 40 can be a Central Processing Unit (CPU), but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0184] In some embodiments, the memory 41 may be an internal storage unit of the control device 4, such as a hard disk or memory of the control device 4. In other embodiments, the memory 41 may be an external storage device of the control device 4, such as a plug-in hard disk, smart media card (SMC), secure digital card (SD), flash card, etc., equipped on the control device 4. Furthermore, the memory 41 may include both internal storage units and external storage devices of the control device 4. The memory 41 is used to store operating systems, applications, bootloaders, data, and other programs, such as the program code of computer programs. The memory 41 can also be used to temporarily store data that has been output or will be output.

[0185] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0186] This application provides a computer program product that, when run on a high-performance copper wire drawing device, enables the high-performance copper wire drawing device to perform the steps in any of the above-described method embodiments.

[0187] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying computer program code to high-performance copper wire drawing equipment, recording media, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, such as USB flash drives, portable hard drives, magnetic disks, or optical disks.

[0188] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0189] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0190] In the embodiments provided in this application, it should be understood that the disclosed high-performance copper wire drawing system and equipment can be implemented in other ways. For example, the embodiments of the high-performance copper wire drawing system described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0191] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0192] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A high-performance intelligent control method for copper wire drawing, characterized in that, include: Obtain the mold parameters; wherein, the mold parameters are used to reflect the outer diameter and circumference of the wire drawing mold; Acquire a first sound image and a second sound image; wherein, the first sound image is used to reflect the sound image generated when the first sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die, and the second sound image is used to reflect the sound image generated when the second sound detection device of the detection device receives the sound image generated when the copper wire collides with the drawing die, the first sound detection device and the second sound detection device are located at the outer diameter of the drawing die, and the line connecting the first sound detection device and the second sound detection device is not the diameter of the drawing die; The propagation speed is obtained by analyzing the mold parameters and the first sound pattern; wherein, the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the drawing mold propagates along the outer diameter of the drawing mold; The collision location is obtained by analyzing the propagation speed, the first sound pattern, and the second sound pattern; wherein, the collision location is used to reflect the position where the copper wire collides with the wire drawing die; Based on the analysis of the first sound pattern and the propagation speed, sound attenuation is obtained; wherein, the sound attenuation is used to reflect the value of how the amplitude of the sound generated when the copper wire collides with the drawing die gradually decreases with the increase of distance; The wear condition is obtained by analyzing the collision location, the first sound pattern, and the sound attenuation. The step of analyzing the wear condition based on the collision location, the first sound pattern, and the sound attenuation includes: Based on the collision location, an inherent stiffness value is obtained; wherein, the inherent stiffness value is used to reflect the ability of the wire drawing die to resist deformation when subjected to external force at the collision location without wear; The wear stiffness value is obtained by analyzing the collision location, the first sound pattern, and the sound attenuation; wherein, the wear stiffness value is used to reflect the ability of the wire drawing die to resist deformation when it is subjected to external force at the collision location; The degree of wear is obtained by analyzing the wear stiffness value and the inherent stiffness value.

2. The high-performance copper wire drawing intelligent control method as described in claim 1, characterized in that, The step of analyzing the mold parameters and the first sound pattern to obtain the propagation speed includes: Based on the analysis of the first sound pattern, a first time and a second time are obtained; wherein, the first time is used to reflect the time when the first peak appears in the first sound pattern, and the second time is used to reflect the time when the second peak appears in the first sound pattern. The propagation path of the sound from the position where the copper wire collides with the drawing die to the first sound detection device, as reflected by the first peak, is different from the propagation path of the sound from the position where the copper wire collides with the drawing die to the first sound detection device, as reflected by the second peak. Based on the analysis of the first time, the second time, and the mold parameters, the propagation speed is obtained; wherein, the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the drawing mold propagates along the outer diameter of the drawing mold.

3. The high-performance copper wire drawing intelligent control method as described in claim 2, characterized in that, The step of analyzing the propagation speed based on the first time, the second time, and the mold parameters includes: The time and the second time are processed to obtain the time; wherein the time is used to reflect the sum between the first time and the second time; The propagation speed is obtained by processing the time and the mold parameters.

4. The high-performance copper wire drawing intelligent control method as described in claim 2, characterized in that, The step of analyzing the propagation speed, the first sound pattern, and the second sound pattern to obtain the collision location includes: The first distance is obtained by processing the first time and the propagation speed reflected by the first sound pattern; wherein, the first distance is used to reflect the distance between the sound position generated when the copper wire collides with the drawing die and the first sound detection device. The starting time is obtained by analyzing the second sound pattern; wherein the starting time is used to reflect the time when the first peak appears in the second sound pattern; The second distance is obtained by processing the start time and the propagation speed; wherein the second distance is used to reflect the distance between the sound position generated when the copper wire collides with the drawing die and the second sound detection device. The collision location is obtained by analyzing the first distance and the second distance.

5. The high-performance copper wire drawing intelligent control method as described in claim 1, characterized in that, The step of analyzing the first sound pattern and the propagation speed to obtain sound attenuation includes: Based on the analysis of the first sound pattern, the interval time and amplitude ratio are obtained; wherein, the interval time is used to reflect the time interval between the first occurrence peak and the second occurrence peak of the first sound pattern; the amplitude ratio is used to reflect the ratio between the amplitude of the first occurrence peak and the amplitude of the second occurrence peak in the first sound pattern. The attenuation distance is obtained by analyzing the interval time and the propagation speed; wherein, the attenuation distance is used to reflect the difference between the propagation distance of the first peak in the first sound pattern to the first sound detection device and the propagation distance of the second peak in the first sound pattern to the first sound detection device. The sound attenuation is obtained by analyzing the attenuation distance and the amplitude ratio.

6. The high-performance copper wire drawing intelligent control method as described in claim 1, characterized in that, The step of analyzing the collision location, the first sound pattern, and the sound attenuation to obtain the wear stiffness value includes: Based on the collision location, a reference sound attenuation is obtained; wherein, the reference sound attenuation is used to reflect the degree of loss of the sound amplitude at the collision location when the wire drawing die is unworn, as it propagates in the wire drawing die; Based on the analysis of the first sound pattern, frequency attenuation is obtained; wherein, the frequency attenuation is used to reflect the degree to which the frequency of the sound generated when the copper wire collides with the drawing die weakens as it propagates in the drawing die; An attenuation ratio is obtained by analyzing the sound attenuation and the reference sound attenuation; wherein, the attenuation ratio is used to reflect the percentage reduction in the amplitude of the sound generated when the copper wire collides with the drawing die as it propagates in the drawing die; The wear stiffness value is obtained by analyzing the attenuation ratio and the frequency attenuation.

7. The high-performance copper wire drawing intelligent control method as described in claim 6, characterized in that, The step of analyzing the first sound pattern to obtain frequency attenuation includes: Based on the analysis of the first sound pattern, multiple durations are obtained; wherein, the duration is used to reflect the duration of peaks appearing in the first sound pattern; Multiple frequency values ​​are obtained by processing based on multiple durations; wherein the frequency values ​​are used to reflect the reciprocal of the duration. The frequency attenuation is obtained by processing multiple frequency values.

8. The high-performance copper wire drawing intelligent control method as described in claim 7, characterized in that, The process of processing multiple frequency values ​​to obtain frequency attenuation includes: Multiple differential frequencies are obtained by performing differential calculations on multiple frequency values; wherein, the differential frequency is used to reflect the difference between the i-th frequency value and the (i-2)-th frequency value, where i is a positive integer greater than 0; The average value is calculated based on the multiple differential frequencies to obtain the differential mean value, and the differential mean value is confirmed as the frequency attenuation.

9. A high-performance copper wire drawing device, characterized in that, The device includes a detection device and a control device, the detection device being electrically connected to the control device, the detection device including a first sound detection device and a second sound detection device, and the control device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the computer program, implements the method as described in any one of claims 1 to 8.

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