Laser processing system and processing method for display panel

Abstract

The invention provides a laser processing system and processing method for a display panel, and the processing system comprises a first laser device which is used for emitting ablation laser; the scanning head is used for receiving the ablation laser and ablating the display layer and the optical cement in the display panel through the ablation laser; the second laser device is used for emitting ablation laser and performing ablation treatment on the display layer through the ablation laser after the ablation laser ablates the display layer and the optical cement so as to peel off the display layer and the thin film layer, and the optical cement is located on the thin film layer; the camera is used for photographing the stripped film layer under top light and / or backlight to obtain a photographed picture; and the processing module is used for obtaining the transparency of the optical cement on the shot picture and generating laser processing information of the display panel based on the transparency of the optical cement. After the display panel is ablated and ablated, the transparency of the optical cement on the thin film layer can be obtained, and the machining precision of laser cutting can be known.

Description

Technical Field

[0001] The present invention relates to the field of laser precision processing, and in particular to a laser processing system and a processing method for a display panel. Background Art

[0002] The processing of organic light-emitting diode (OLED) display panels involves multiple steps, including substrate selection, transparent conductive layer deposition, organic light-emitting layer deposition, encapsulation, laser cutting / punching, detection / testing, and assembly / packaging. During the detection / testing of the display panel, an electrical performance test can be performed to detect the light emission of each pixel to ensure product quality. After the laser cutting step in the prior art, the cutting information corresponding to the transparent conductive layer and the organic light-emitting layer is not obtained from the physical level, so the control accuracy related to laser cutting cannot be understood. Therefore, there is room for improvement. Summary of the invention

[0003] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a laser processing system and processing method for a display panel, so as to solve the problem in the prior art that the control accuracy related to laser cutting cannot be understood after the laser cutting step.

[0004] To achieve the above objectives and other related objectives, the present invention provides a laser processing system for a display panel, comprising:

[0005] A first laser, used to emit ablation laser;

[0006] A scanning head, used for receiving the ablation laser, and ablating the display layer and the optical glue in the display panel by the ablation laser, wherein the display panel comprises a display layer, an optical glue and a thin film layer, and the optical glue is located between the display layer and the thin film layer;

[0007] a second laser, configured to emit an ablation laser, and after the ablation laser ablates the display layer and the optical glue, ablate the display layer by the ablation laser to peel off the display layer and the thin film layer, wherein the optical glue is located on the thin film layer;

[0008] A camera, used to take pictures of the peeled film layer under top light and / or back light to obtain pictures;

[0009] A processing module is used to obtain the transparency of the optical glue on the photographed image, and generate laser processing information of the display panel based on the transparency of the optical glue.

[0010] In one embodiment of the present invention, the laser processing system further comprises:

[0011] A beam splitter, disposed at the emission end of the first laser, and used to split the ablation laser into a first split laser and a second split laser according to a preset splitting ratio;

[0012] A laser monitoring module, used for monitoring and analyzing the first laser beam;

[0013] The scanning head is arranged on a side of the beam splitter that splits the ablation laser, and the processing module analyzes the second laser beam based on the beam splitting ratio and monitoring and analysis data of the first laser beam.

[0014] In one embodiment of the present invention, the laser processing system further comprises a reflector, the reflector is located on a side of the beam splitter away from the first laser, and the emission end of the first laser, the beam splitter and the reflector are arranged along a straight line;

[0015] The reflector receives the second split laser light transmitted by the beam splitter and reflects the second split laser light to the scanning head, and the first split laser light reflected by the beam splitter is irradiated onto the laser monitoring module;

[0016] In one embodiment of the present invention, the laser processing system further comprises a reflector, the reflector is located on a side of the beam splitter away from the first laser, and the emission end of the first laser, the beam splitter and the reflector are arranged along a straight line;

[0017] The reflector receives the first split laser light transmitted by the beam splitter and reflects the first split laser light to the laser monitoring module, and the second split laser light reflected by the beam splitter is irradiated to the scanning head.

[0018] In one embodiment of the present invention, the laser monitoring module obtains a first power corresponding to the first laser beam, and the laser processing system further includes:

[0019] A power detection instrument, located at the transmitting side of the scanning head, used for detecting a second power corresponding to the second split laser emitted by the scanning head;

[0020] The processing module is further used to determine whether the ratio of the first power to the second power is the same as the splitting ratio of the beam splitter;

[0021] When the ratio of the first power to the second power is the same as the splitting ratio of the spectroscope, the power detection instrument and the laser monitoring module are judged to be normal; when the ratio of the first power to the second power is different from the splitting ratio of the spectroscope, the power detection instrument and / or the laser monitoring module are judged to be abnormal.

[0022] In one embodiment of the present invention, the camera is used to take pictures according to the following steps:

[0023] When the peeled film layer is placed in the front, take photos under top light and / or back light to obtain the corresponding top light picture and / or back light picture when the film layer is in the front;

[0024] When the film layer after peeling is placed with the reverse side, take pictures under top light and / or back light to obtain the corresponding top light pictures and / or back light pictures when the film layer is placed with the reverse side.

[0025] In one embodiment of the present invention, the processing module is used to obtain the transparency of the optical adhesive according to the following steps:

[0026] comparing the transparency of the optical adhesive with a preset transparency threshold;

[0027] When the transparency of the optical adhesive is greater than or equal to a preset transparency threshold, generating laser processing information that meets the process requirements;

[0028] When the transparency of the optical adhesive is less than a preset transparency threshold, laser processing information that does not meet the process requirements is generated.

[0029] In one embodiment of the present invention, after generating laser processing information that does not meet the process requirements,

[0030] The processing module is also used to control according to the following steps:

[0031] Increasing the power of the ablation laser, maintaining other processing parameters of the ablation laser, and ablating the display layer in another display panel by using the second split laser light generated by the ablation laser;

[0032] After the second laser light ablates the display layer, the ablation laser light ablates the display layer to peel off the display layer and the thin film layer in another display panel, wherein the optical adhesive is located on the thin film layer;

[0033] The transparency of the optical adhesive is obtained, and based on the transparency of the optical adhesive, laser processing information of another display panel is generated.

[0034] In one embodiment of the present invention, the laser processing system further comprises a beam expander, wherein the beam expander is arranged between the first laser and the beam splitter;

[0035] Alternatively, the laser processing system further includes an attenuator, which is disposed between the first laser and the beam splitter.

[0036] The present invention further provides a laser processing method for a display panel, which is characterized by comprising:

[0037] Emitting an ablation laser by a first laser, and ablating a display layer and an optical glue in a display panel by the ablation laser, wherein the display panel comprises a display layer, an optical glue and a thin film layer, and the optical glue is located between the display layer and the thin film layer;

[0038] The ablation laser is emitted by a second laser. After the ablation laser ablates the display layer and the optical glue, the ablation laser is used to ablate the display layer to peel off the display layer and the thin film layer, wherein the optical glue is located on the thin film layer.

[0039] Taking a photo of the peeled film layer under top light and / or back light to obtain a photographic image;

[0040] The transparency of the optical glue is obtained on the photographed image, and based on the transparency of the optical glue, the laser processing information of the display panel is generated.

[0041] As described above, a laser processing system and processing method of a display panel of the present invention has the following beneficial effects: after the display panel is ablated and ablated, the transparency of the optical glue on the thin film layer in the display panel can be obtained, thereby understanding the processing accuracy of laser cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A structural block diagram of a laser processing system for a display panel provided in one embodiment of the present invention.

[0043] Figure 2 For the present invention Figure 1 A block diagram of the structure of adding an attenuator in the laser processing system of a display panel.

[0044] Figure 3 A schematic diagram of a structure for performing ablation processing on a display panel provided by an embodiment of the present invention.

[0045] Figure 4 A schematic diagram of a structure for performing ablation processing on a display panel provided by an embodiment of the present invention.

[0046] Figure 5 A schematic diagram of the structure of a display panel after ablation treatment provided by an embodiment of the present invention.

[0047] Figure 6 A structural block diagram of a laser processing system for a display panel provided in yet another embodiment of the present invention.

[0048] Figure 7 In the display panel provided by an embodiment of the present invention, the film layer is arranged on the front side, and the picture is taken under top light.

[0049] Figure 8 For the present invention Figure 7 In the provided display panel, the film layer is arranged on the front side, and the photographic picture is taken under the backlight.

[0050] Fig. 9 For the present invention Figure 7 In the provided display panel, the film layer is arranged on the reverse side, and a picture is taken under top light.

[0051] Fig.10 For the present invention Figure 7 In the provided display panel, the film layer is arranged on the reverse side, and a photograph is taken under backlight.

[0052] Fig.11 In a display panel provided in yet another embodiment of the present invention, the film layer is disposed on the front side, and a picture is taken under top light.

[0053] Fig.12 For the present invention Fig.11 In the provided display panel, the film layer is arranged on the front side, and the photographic picture is taken under the backlight.

[0054] Fig.13 For the present invention Fig.11 In the provided display panel, the film layer is arranged on the reverse side, and a picture is taken under top light.

[0055] Fig.14 For the present invention Fig.11 In the provided display panel, the film layer is arranged on the reverse side, and a photograph is taken under backlight.

[0056] Fig.15 A schematic diagram of the steps of a laser processing method for a display panel provided by an embodiment of the present invention.

[0057] Reference numerals

[0058] 100, display panel; 101, display layer; 102, thin film layer; 103, glass substrate; 104, indium tin oxide layer; 105, electroluminescent film layer; 106, silver layer;

[0059] 10. First laser; 20. Spectroscope; 30. Laser monitoring module; 40. Scanning head; 410. Power detection instrument; 50. Camera; 60. Processing module; 610. Upper computer; 620. Lower computer; 710. Beam expander; 720. Attenuator; 80. Reflector. DETAILED DESCRIPTION

[0060] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0061] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0062] In the following description, numerous details are discussed to provide a more thorough explanation of the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present invention difficult to understand.

[0063] See also Figures 1 to 15 The present invention provides a laser processing system and processing method for a display panel, which can be applied to the field of laser precision processing, such as the processing field of organic light-emitting diode (OLED) display panels. After the display panel is ablated and ablated, the present invention can obtain the transparency of the optical glue on the thin film layer in the display panel, so as to determine whether the laser processing meets the process requirements, and facilitate understanding of the processing accuracy of laser cutting. The following is a detailed description through specific embodiments.

[0064] See also Figure 1 , Figure 2 In one embodiment of the present invention, a laser processing system for a display panel is provided, which may include a first laser 10, a spectroscope 20, a laser monitoring module 30, a scanning head 40, a second laser, a camera 50 and a processing module 60.

[0065] Specifically, the first laser 10 can be used to emit ablation laser to ablate the display panel 100. Laser ablation is a process that uses a high-energy-density laser beam to irradiate the surface of a material, causing the material to be locally heated to a vaporization temperature or undergo a phase change and then removed.

[0066] Specifically, the second laser (not shown) can be used to emit ablation laser to ablate the display panel 100. Laser ablation is a key process in laser processing, which uses a high-energy-density laser beam to emit a material surface, causing the material to be locally rapidly heated, melted, vaporized or decomposed, thereby achieving material removal.

[0067] like Figure 3 , Figure 4 ,and Figure 5 As shown, the display panel 100 includes a display layer 101 and a thin film layer 102. The display layer 101 may include an electroluminescent film layer (EL) 105 and a silver layer 106, and the silver layer 106 may be disposed between two electroluminescent film layers 105. The electroluminescent film layer 105 and the silver layer 106 have different absorption rates for different lights. Specifically, the electroluminescent film layer 105 and the silver layer 106 have the highest absorption rate under green light, so the ablation laser may be a green laser. The thin film layer 102 includes a glass substrate 103 and an indium tin oxide (ITO) layer 104. The ablation laser may be a red laser.

[0068] For example, an optical adhesive (not shown) is formed between the display layer 101 and the film layer 102, that is, an optical adhesive is formed between the indium tin oxide layer 104 and the electroluminescent film layer 105. The optical adhesive is not only used to bond different layers, but also has multiple functions to ensure the performance and reliability of the display.

[0069] Specifically, the beam splitter 20 is used to split the ablation laser emitted by the first laser 10 according to the splitting ratio, and the beam splitter 20 is arranged at the emission end of the first laser 10. In the laser field, the beam splitter 20 (also called a beam splitter or beam splitter) is an optical element that can split the incident laser beam into two or more parts. The beam splitter 20 distributes the light intensity according to a certain ratio, a part of the light is reflected, and the other part passes through the beam splitter 20. This ratio can be 50%:50%, and can also be customized according to specific application requirements.

[0070] Specifically, the laser monitoring module 30 is used to monitor the first split laser beam split by the beam splitter 20 , and the processing module 60 analyzes the second split laser beam based on the splitting ratio and the monitoring and analysis data of the first split laser beam.

[0071] Specifically, the scanning head 40 is used to receive the second laser beam and ablate the display layer 101 and the optical glue in the display panel 100 through the second laser beam. After the second laser beam ablates the display layer 101 and the optical glue, obvious gray-brown marks will remain and evenly cover the light spot marks, such as Figure 1 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 As shown, the second laser will leave a spot mark on the optical glue.

[0072] After the second split laser ablates the display layer 101 and the optical glue, the second laser emits an ablation laser and ablates the display layer 101 by the ablation laser to peel off the display layer 101 and the film layer 102, and the optical glue is located on the film layer 102. For example, the second laser can be arranged on one side of the first laser 10, and the second laser can emit the beam splitter 20, and ablate the display layer 101 under the action of the beam splitter 20, the laser monitoring module 30, the scanning head 40, the camera 50 and the processing module 60.

[0073] Specifically, the camera 50 is used to take a picture of the peeled film layer 102 under top light and / or back light to obtain a picture. The processing module 60 is used to obtain the transparency of the optical glue in the picture and generate laser processing information of the display panel 100 based on the transparency of the optical glue.

[0074] See also Figure 6 , Figure 7 , Figure 8 and Fig. 9 In one embodiment of the present invention, the transmittance of the optical adhesive is less than 70%. After the second laser scan, the scanned area has obvious gray-brown marks and evenly covers the light spot marks. The light spot marks in the scanned area are clear as Figure 7 and Figure 8 , the light is not obvious when observed from the backlight. Fig. 9 .

[0075] See also Figure 6 , Figure 7 , Figure 8 and Fig. 9 In one embodiment of the present invention, the transmittance of the optical adhesive is less than 70%, and the corresponding ablation laser frequency is 100Khz, the focal length is 255mm, the scanning speed is 2000mm / s, and the power is 8w. After the second laser scan, Figure 6 , Fig. 9 , the scanning area has obvious gray-brown marks and is evenly covered with light spot marks. The light spot marks in the scanning area are clear, such as Figure 7 and Figure 8 . The light is not obvious when observed from the back. Fig. 9 , does not meet the process requirements.

[0076] See also Fig.10 , Fig.11 , Fig.12 and Fig.13In one embodiment of the present invention, the transmittance of the optical glue is less than 70%, and the corresponding ablation laser frequency is 100Khz, the focal length is 255mm, the scanning speed is 2000mm / s, and the power is 9w. After the second laser scan, Fig.10 , Fig.13 , the scanning area has obvious gray-brown marks and is evenly covered with light spot marks. The light spot marks in the scanning area are clear, such as Fig.11 and Fig.12 . The light is obvious when observed from the back. Fig. 9 , in line with process requirements.

[0077] It can be seen from this that Figure 1 As shown, under appropriate power, the ablation laser ablates the display layer 101 and the optical glue more deeply and has a better ablation effect, so that after the ablation laser ablates the display layer 101, the transparency of the optical glue on the thin film layer 102 is higher, meeting the process requirements.

[0078] See also Figure 1 , Figure 2 In one embodiment of the present invention, the laser processing system further includes a beam expander 710 or an attenuator 720 , and the beam expander 710 or the attenuator 720 is disposed between the first laser 10 and the beam splitter 20 .

[0079] Specifically, Figure 1 As shown, a beam expander 710 is disposed between the first laser 10 and the beam splitter 20. The beam expander 710 can be used to expand the diameter of the laser beam while reducing its divergence angle.

[0080] Specifically, Figure 2 As shown, an attenuator 720 is provided between the first laser 10 and the beam splitter 20. The attenuator 720 is used to control the light intensity, for example, a device for reducing the intensity of the light beam, and the attenuator 720 will not significantly change other characteristics of the light beam, such as the wavelength, polarization state or propagation direction.

[0081] See also Figure 1 , Figure 2 and Fig.14 In one embodiment of the present invention, the laser processing system further comprises a reflector 80, which is located on a side of the beam splitter 20 away from the first laser 10, and the emission end of the first laser 10, the beam splitter 20 and the reflector 80 are arranged along a straight line.

[0082] Specifically, Figure 1 and Figure 2As shown, the reflector 80 receives the second split laser beam split by the beam splitter 20 and reflects the second split laser beam to the scanning head 40. The first split laser beam split by the beam splitter 20 is directly emitted to the laser monitoring module 30, which is used to detect the power of the first split laser beam.

[0083] In addition, due to the splitting effect of the spectroscope 20, the ratio of the energy of the first split laser to the energy of the second split laser is known. Therefore, even if the laser monitoring module 30 only detects the power of the first split laser, the power corresponding to the second split laser can be known. For example, the processing module 60 analyzes the second split laser based on the splitting ratio and the monitoring and analysis data of the first split laser.

[0084] Specifically, Fig.14 As shown, the reflector 80 receives the first split laser beam split by the beam splitter 20 and reflects the first split laser beam to the laser monitoring module 30. The second split laser beam split by the beam splitter 20 is directly emitted to the scanning head 40.

[0085] See also Figure 1 , Figure 2 In one embodiment of the present invention, the laser monitoring module 30 obtains a first power corresponding to a first laser beam, and the laser processing system further includes a power detection meter 410, which is located on the transmitting side of the scanning head 40 and is used to detect a second power corresponding to a second laser beam emitted by the scanning head 40.

[0086] Specifically, the processing module 60 is electrically connected to the power detection meter 410 and the laser monitoring module 30 to obtain the first power and the second power, which are used to determine whether the ratio of the first power to the second power is the same as the splitting ratio of the spectroscope 20. When the ratio of the first power to the second power is the same as the splitting ratio of the spectroscope, the power detection meter and the laser monitoring module are normal. When the ratio of the first power to the second power is different from the splitting ratio of the spectroscope, the power detection meter and / or the laser monitoring module are abnormal.

[0087] See also Figure 1 , Figure 2 In one embodiment of the present invention, the processing module 60 is electrically connected to the attenuator 720, and the processing module 60 adjusts the beam intensity of the ablation laser output by the attenuator 720 based on the magnitude of the first power and the second power.

[0088] See also Figure 1 , Figure 2 and Fig.14In one embodiment of the present invention, the camera 50 takes pictures according to the following steps. When the peeled film layer 102 is placed on the front side, take pictures under top light and / or back light, and obtain the corresponding top light picture and / or back light picture when the film layer 102 is on the front side. When the peeled film layer 102 is placed on the back side, take pictures under top light and / or back light, and obtain the corresponding top light picture and / or back light picture when the film layer 102 is on the back side.

[0089] See also Figure 1 , Figure 2 and Fig.14 In one embodiment of the present invention, the processing module 60 is used to obtain the transparency of the optical adhesive according to the following steps. The processing module 60 compares the transparency of the optical adhesive with a preset transparency threshold. When the transparency of the optical adhesive is greater than or equal to the preset transparency threshold, laser processing information that meets the process requirements is generated. When the transparency of the optical adhesive is less than the preset transparency threshold, laser processing information that does not meet the process requirements is generated.

[0090] See also Figure 1 , Figure 2 and Fig.14 In one embodiment of the present invention, after generating laser processing information that does not meet the process requirements, the processing module 60 is also used to perform processing according to the following steps. Increase the power of the ablation laser, maintain other processing parameters of the ablation laser, and ablate the display layer 101 in another display panel 100 by the second laser split by the ablation laser. After the display layer 101 is ablated by the second laser, the display layer 101 is ablated by the ablation laser to peel off the display layer 101 and the thin film layer 102 in another display panel 100, and the optical glue is located on the thin film layer 102. The processing module 60 obtains the transparency of the optical glue, and generates laser processing information of another display panel 100 based on the transparency of the optical glue.

[0091] See also Fig.15 In one embodiment of the present invention, a laser processing method for a display panel may be provided, which may include the following steps.

[0092] Step S10, emitting an ablation laser by a first laser, and ablating the display layer and the optical glue in the display panel by the ablation laser, wherein the display panel comprises a display layer, the optical glue and a thin film layer, and the optical glue is located between the display layer and the thin film layer.

[0093] Step S20, emitting an ablation laser through a second laser, after the ablation laser ablates the display layer and the optical glue, ablating the display layer through the ablation laser to peel off the display layer and the thin film layer, the optical glue is located on the thin film layer.

[0094] Step S30: photograph the peeled film layer under top light and / or back light to obtain a photographic image.

[0095] Step S40: Obtain the transparency of the optical glue on the photographed image, and generate laser processing information of the display panel based on the transparency of the optical glue.

[0096] For details, please refer to Figure 6 , Figure 7 , Figure 8 and Fig. 9 , the transmittance of the optical glue is less than 70%, the corresponding ablation laser frequency is 100Khz, the focal length is 255mm, the scanning speed is 2000mm / s, and the power is 8w. After the second laser scan, Figure 6 , Fig. 9 , the scanning area has obvious gray-brown marks and is evenly covered with light spot marks. The light spot marks in the scanning area are clear, such as Figure 7 and Figure 8 . The light is not obvious when observed from the back. Fig. 9 , does not meet the process requirements.

[0097] See also Fig.10 , Fig.11 , Fig.12 and Fig.13 , the transmittance of the optical glue is less than 70%, the corresponding ablation laser frequency is 100Khz, the focal length is 255mm, the scanning speed is 2000mm / s, and the power is 9w. After the second laser scan, Fig.10 , Fig.13 , the scanning area has obvious gray-brown marks and is evenly covered with light spot marks. The light spot marks in the scanning area are clear, such as Fig.11 and Fig.12 . The light is obvious when observed from the back. Fig. 9 , in line with process requirements.

[0098] It can be seen from this that Figure 1 As shown, under appropriate power, the ablation laser ablates the display layer 101 and the optical glue more deeply and has a better ablation effect, so that after the ablation laser ablates the display layer 101, the transparency of the optical glue on the thin film layer 102 is higher, meeting the process requirements.

[0099] In summary, the present invention discloses a laser processing system and processing method for a display panel. After ablation and ablation of the display panel, the present invention can obtain the transparency of the optical glue on the thin film layer in the display panel, so as to understand the processing accuracy of laser cutting. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0100] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A laser processing system for a display panel, characterized in that: include: A first laser, used to emit ablation laser; A scanning head, used for receiving the ablation laser, and ablating the display layer and the optical glue in the display panel by the ablation laser, wherein the display panel comprises a display layer, an optical glue and a thin film layer, and the optical glue is located between the display layer and the thin film layer; a second laser, configured to emit an ablation laser, and after the ablation laser ablates the display layer and the optical glue, ablate the display layer by the ablation laser to peel off the display layer and the thin film layer, wherein the optical glue is located on the thin film layer; A camera, used to take pictures of the peeled film layer under top light and / or back light to obtain pictures; A processing module is used to obtain the transparency of the optical glue on the photographed image, and generate laser processing information of the display panel based on the transparency of the optical glue.

2. The laser processing system for a display panel according to claim 1, characterized in that: The laser processing system also includes: A beam splitter, disposed at the emission end of the first laser, and used to split the ablation laser into a first split laser and a second split laser according to a preset splitting ratio; A laser monitoring module, used for monitoring and analyzing the first laser beam; The scanning head is arranged on a side of the beam splitter that splits the ablation laser, and the processing module analyzes the second laser beam based on the beam splitting ratio and monitoring and analysis data of the first laser beam.

3. The laser processing system for a display panel according to claim 2, characterized in that: The laser processing system further comprises a reflector, wherein the reflector is located on a side of the beam splitter away from the first laser, and the emission end of the first laser, the beam splitter and the reflector are arranged along a straight line; The reflector receives the second split laser light transmitted by the beam splitter and reflects the second split laser light to the scanning head, and the first split laser light reflected by the beam splitter is irradiated onto the laser monitoring module.

4. The laser processing system for a display panel according to claim 2, characterized in that: The laser processing system further comprises a reflector, wherein the reflector is located on a side of the beam splitter away from the first laser, and the emission end of the first laser, the beam splitter and the reflector are arranged along a straight line; The reflector receives the first split laser light transmitted by the beam splitter and reflects the first split laser light to the laser monitoring module, and the second split laser light reflected by the beam splitter is irradiated to the scanning head.

5. The laser processing system for a display panel according to claim 2, characterized in that: The laser monitoring module obtains a first power corresponding to the first laser beam, and the laser processing system further includes: A power detection instrument, located at the transmitting side of the scanning head, used for detecting a second power corresponding to the second split laser emitted by the scanning head; The processing module is further used to determine whether the ratio of the first power to the second power is the same as the splitting ratio of the beam splitter; When the ratio of the first power to the second power is the same as the splitting ratio of the spectroscope, the power detection instrument and the laser monitoring module are judged to be normal; when the ratio of the first power to the second power is different from the splitting ratio of the spectroscope, the power detection instrument and / or the laser monitoring module are judged to be abnormal.

6. The laser processing system for a display panel according to claim 2, characterized in that: The camera is used to take pictures according to the following steps: When the peeled film layer is placed in the front, take photos under top light and / or back light to obtain the corresponding top light picture and / or back light picture when the film layer is in the front; When the film layer after peeling is placed with the reverse side, take pictures under top light and / or back light to obtain the corresponding top light pictures and / or back light pictures when the film layer is placed with the reverse side.

7. The laser processing system for a display panel according to claim 6, characterized in that: The processing module is used to obtain the transparency of the optical adhesive according to the following steps: comparing the transparency of the optical adhesive with a preset transparency threshold; When the transparency of the optical adhesive is greater than or equal to a preset transparency threshold, generating laser processing information that meets the process requirements; When the transparency of the optical adhesive is less than a preset transparency threshold, laser processing information that does not meet the process requirements is generated.

8. The laser processing system for a display panel according to claim 7, characterized in that: After generating laser processing information that does not meet process requirements, The processing module is also used to control according to the following steps: Increasing the power of the ablation laser, maintaining other processing parameters of the ablation laser, and ablating the display layer in another display panel by using the second split laser light generated by the ablation laser; After the second laser light ablates the display layer, the ablation laser light ablates the display layer to peel off the display layer and the thin film layer in another display panel, wherein the optical adhesive is located on the thin film layer; The transparency of the optical adhesive is obtained, and based on the transparency of the optical adhesive, laser processing information of another display panel is generated.

9. The laser processing system for a display panel according to claim 1, characterized in that: The laser processing system further comprises a beam expander, which is arranged between the first laser and the beam splitter; Alternatively, the laser processing system further includes an attenuator, which is disposed between the first laser and the beam splitter.

10. A laser processing method for a display panel, characterized in that: include: Emitting an ablation laser by a first laser, and ablating a display layer and an optical glue in a display panel by the ablation laser, wherein the display panel comprises a display layer, an optical glue and a thin film layer, and the optical glue is located between the display layer and the thin film layer; The ablation laser is emitted by a second laser. After the ablation laser ablates the display layer and the optical glue, the ablation laser is used to ablate the display layer to peel off the display layer and the thin film layer, wherein the optical glue is located on the thin film layer. Taking a photo of the peeled film layer under top light and / or back light to obtain a photographic image; The transparency of the optical glue is obtained on the photographed image, and based on the transparency of the optical glue, the laser processing information of the display panel is generated.

Images