Composite adhesive tape, preparation method thereof and display module

Abstract

The invention discloses a composite adhesive tape and a preparation method thereof and a display module, the composite adhesive tape comprises an adhesive layer and a buffer layer, the buffer layer is arranged on one side of the adhesive layer, and at least one of a charging coil, a sealing bubble and a cooling fin is embedded in the buffer layer. When the charging coil is embedded in the buffer layer, the composite adhesive tape has a wireless charging function; when sealing bubbles are embedded in the buffer layer, the composite adhesive tape has better buffer performance; when the cooling fins are embedded in the buffer layer, the composite adhesive tape has a better cooling effect.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a composite tape and a preparation method thereof, and a display module. Background Art

[0002] With the development of display technology, flexible display panels are playing an increasingly important role in foldable mobile phones and wearable smart devices due to their low power consumption and bendability. In order to protect the flexible display panel, composite tape is usually pasted on the flexible display panel during the assembly process to use the cushioning effect of the composite tape to prevent the flexible display panel from being squeezed, impacted, etc.

[0003] Therefore, in order to better protect the flexible display panel and avoid damage to the flexible display panel caused by impact, it is urgent to improve the composite tape and enhance the reliability of the display panel. Summary of the invention

[0004] The present application mainly provides a composite tape and a preparation method thereof, and a display module, which can improve the performance of the composite tape.

[0005] In order to solve the above technical problems, the technical solution adopted in the present application is: to provide a composite tape, which includes an adhesive layer and a buffer layer, wherein the buffer layer is arranged on one side of the adhesive layer, wherein at least one of a charging coil, a sealing bubble, and a heat sink is embedded in the buffer layer.

[0006] In order to solve the above technical problem, another technical solution adopted in the present application is: to provide a display module, which includes the composite tape in the above embodiment.

[0007] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a method for preparing a composite tape, the method comprising: placing at least one of a charging coil, a sealing bubble, and a heat sink between two adjacent buffer sublayers; rolling two adjacent buffer sublayers to obtain a buffer layer; and setting a glue layer on one side of the buffer layer.

[0008] The beneficial effect of the present application is that at least one of a charging coil, a sealing bubble, and a heat sink is embedded in the buffer layer of the composite tape of the present application. When the charging coil is embedded in the buffer layer, the composite tape has a wireless charging function; when the sealing bubble is embedded in the buffer layer, the composite tape has better buffering performance; when the heat sink is embedded in the buffer layer, the composite tape has better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0010] Figure 1 This is a schematic structural diagram of an implementation method of the composite tape in this application;

[0011] Figure 2 for Figure 1 A schematic structural diagram of an implementation method of embedding a charging coil in a middle buffer layer;

[0012] Figure 3 for Figure 2 A schematic side view of the structure of an embodiment of a middle buffer layer;

[0013] Figure 4 for Figure 1 A schematic structural diagram of an embodiment of embedding a heat sink in a middle buffer layer;

[0014] Figure 5 for Figure 4 A schematic side view of the structure of an embodiment of a middle buffer layer;

[0015] Figure 6 for Figure 1 A schematic structural diagram of an embodiment of embedding a sealed bubble in a middle buffer layer;

[0016] Figure 7 for Figure 6 A schematic side view of the structure of an embodiment of a middle buffer layer;

[0017] Figure 8 for Figure 1 A schematic side view of another embodiment of the middle buffer layer;

[0018] Fig. 9 for Figure 1 A schematic side view of another embodiment of the middle buffer layer;

[0019] Fig.10 It is a schematic diagram of a process for preparing a composite tape in the present application.

[0020] Explanation of reference numerals: 10 adhesive layer; 20 buffer layer; 21 charging coil; 211 P pole; 212 N pole; 22 sealing bubble; 23 heat sink; 24 through hole; 25 shell; 26 buffer sublayer; 30 metal layer. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0023] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0024] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0025] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0026] See also Figure 1 The present application provides a composite tape, which includes an adhesive layer 10 and a buffer layer 20. Specifically, the adhesive layer 10 in the composite tape plays a bonding role, which facilitates the use of the composite tape. The buffer layer 20 plays a buffering role. The adhesive layer 10 and the buffer layer 20 can be directly connected or indirectly connected, that is, there can be other film layers between the adhesive layer 10 and the buffer layer 20.

[0027] Combination Figure 1 , Figure 2 as well as Figure 3 , the charging coil 21 is embedded in the buffer layer 20; at this time, the composite tape has the function of wireless charging.

[0028] See also Figure 1 , Figure 4 as well as Figure 5 , the heat sink 23 is embedded in the buffer layer 20, and the composite tape has a better heat dissipation effect.

[0029] See also Figure 1 , Figure 6 as well as Figure 7 , the sealing bubbles 22 are embedded in the buffer layer 20, and the composite tape has better buffering performance.

[0030] It should be noted that the buffer layer 20 may be embedded only in the charging coil 21, the sealing bubble 22 or the heat sink 23, or may be embedded in two or three of the charging coil 21, the sealing bubble 22 and the heat sink 23. For example, the charging coil 21 and the sealing bubble 22 are embedded in the buffer layer 20, and the composite tape has both the function of wireless charging and better buffering performance. For another example, the buffer layer 20 is embedded in the charging coil 21, the sealing bubble 22 and the heat sink 23 at the same time, and the composite tape has both the function of wireless charging and better buffering performance, and also has better heat dissipation effect.

[0031] In one embodiment, the material of the buffer layer 20 includes silicone. Specifically, silicone has the functions of insulation, shock absorption, sealing, etc., and the hardness and thickness are adjustable, which can meet the use requirements of the buffer layer 20. At the same time, silicone has good cold resistance and heat resistance, and has a wide range of operating temperatures, and can work in a temperature range of -40 to 220°C.

[0032] Of course, in other embodiments, the buffer layer 20 may also be made of foam.

[0033] In one embodiment, silica gel is an organosilicon polymer; wherein the main chain of the organosilicon polymer is -Si-O-Si-O-, and the side chain includes silicon atoms and organic groups; the organic group includes at least one of methyl, phenyl, and vinyl. Specifically, the basic structural unit of the organosilicon polymer is composed of silicon-oxygen chain segments, and the side chains are connected to various other organic groups through silicon atoms. Therefore, the structure of the organosilicon polymer contains both "organic groups" and "inorganic structures". This special composition and molecular structure enables it to combine the characteristics of organic matter with the functions of inorganic matter. Compared with other polymer materials, it has better electrical insulation performance and high temperature resistance. In addition, the bond energy of the silicon-oxygen bond is stronger than the bond energy of the carbon-carbon bond, so the performance of the organosilicon polymer is superior to that of the traditional polymer with a -CC- main chain.

[0034] In one embodiment, the base material of the silica gel includes linear polyorganosiloxane, and the auxiliary material of the silicone polymer includes at least one of a catalyst, an inhibitor, and a crosslinking agent. The silicone polymer is a network elastic body formed by crosslinking and curing with the help of catalysts, inhibitors, crosslinking agents and other auxiliary agents with linear polyorganosiloxane as the base material by heating or other conditions.

[0035] In addition, silicone rubber can be divided into high temperature vulcanized silicone rubber (HTV) and room temperature vulcanized silicone rubber (RTV) according to the vulcanization temperature. According to different reaction mechanisms, HTV silicone rubber can be divided into peroxide type and addition type, and RTV silicone rubber can be divided into condensation type and addition type. There are many types of silicone polymers, and you can choose the appropriate silicone polymer according to your needs.

[0036] In one embodiment, the material of the buffer layer 20 further includes a thermally conductive filler. By adding the thermally conductive filler into the buffer layer 20, the thermal conductivity of the buffer layer 20 is improved.

[0037] In one embodiment, the thermally conductive filler includes at least one of metal, metal oxide, nitride, and carbide. Specifically, the thermally conductive filler can be selected from one or more of metal, metal oxide, nitride, and carbide to meet the thermal conductivity of the composite tape.

[0038] In one embodiment, the silica gel in the buffer layer 20 includes silicone oil, and the thermal conductive filler includes various thermal conductive powders such as ceramic powder, metal oxide, etc. In this case, the buffer layer 20 has good elasticity and flexibility, and can well fill the gap to complete the heat transfer between the heating part and the heat dissipation part.

[0039] In one embodiment, the thickness of the buffer layer 20 is in the range of 0.1 to 0.18 mm. Specifically, the thickness of the buffer layer 20 may be 0.1, 0.12, 0.14, 0.15, 0.16 or 0.18 mm.

[0040] In one embodiment, the buffer layer 20 is in a mesh structure, which has a better buffering effect.

[0041] Please continue reading Figure 2 and Figure 3 , the charging coil 21 is embedded in the buffer layer 20, and the winding direction of the charging coil 21 is parallel to the adhesive layer 10. Specifically, the design of making the winding direction of the charging coil 21 parallel to the adhesive layer 10 can reduce the total thickness of the buffer layer 20 containing the charging coil 21, reduce the volume, and reduce the stacking space.

[0042] In one embodiment, the P-pole 211 and the N-pole 212 of the charging coil 21 extend to the same side of the buffer layer 20 , so as to facilitate connecting the P-pole 211 and the N-pole 212 of the charging coil 21 to the flexible circuit board in the display panel.

[0043] In one embodiment, an insulating protective layer (not shown) is formed on the outer surface of the charging coil 21. The insulating protective layer can protect the charging coil 21 and facilitate the combined use of the charging coil 21 and one or more of the heat sink 23 and the sealing bubble 22 to prevent the charging coil 21 from being affected by the heat sink 23 or the sealing bubble.

[0044] In one embodiment, if Figure 3 As shown, the charging coil 21 is located in the middle of the buffer layer 20 , which can effectively ensure the stability of the buffer layer 20 .

[0045] In one embodiment, the thickness of the charging coil 21 is less than one-third of the thickness of the buffer layer 20 to ensure the safety of the charging coil 21 during operation. For example, the thickness of the charging coil 21 is one-quarter, one-fifth or one-sixth of the thickness of the buffer layer 20 .

[0046] Please continue reading Figure 4 and Figure 5 The buffer layer 20 is embedded with a heat sink 23, which is parallel to the adhesive layer 10. At the same time, the area of ​​the heat sink 23 is smaller than that of the buffer layer 20, so as to ensure that the heat sink 23 has a stable heat dissipation channel. In particular, when the material of the buffer layer 20 also includes a thermally conductive filler, the combination of the heat sink 23 and the thermally conductive filler can further improve the heat dissipation performance of the composite tape.

[0047] In one embodiment, the heat sink 23 is provided with a plurality of through holes 24 , and a portion of the buffer layer 20 is embedded in the through holes 24 , so that the heat sink 23 and the buffer layer 20 are tightly combined and difficult to separate.

[0048] In one embodiment, the cross section of the through hole 24 perpendicular to the adhesive layer 10 is rectangular, circular or triangular. The through hole 24 can be designed in various forms, and the corresponding cross-sectional shape of the through hole 24 can be designed as needed, but is not limited to the above shapes.

[0049] In one embodiment, the thickness of the heat sink 23 is in the range of 0.018-0.05 mm. Specifically, the thickness of the heat sink 23 is 0.018, 0.02, 0.03, 0.04 or 0.05 mm. The above thickness design can ensure the heat dissipation effect of the heat sink 23.

[0050] In one embodiment, the thermal conductivity of the heat sink 23 is greater than or equal to 1300W / MK. The thermal conductivity reflects the efficiency of heat transfer inside the material. The larger the thermal conductivity, the stronger the thermal conductivity of the material, which ensures the thermal conductivity of the heat sink 23. At the same time, materials with better thermal conductivity have better heat dissipation ability, which can more effectively transfer heat from the inside to the outside, and thus have better heat dissipation performance.

[0051] In one embodiment, the material of the heat sink 23 is graphite. Specifically, graphite has excellent heat dissipation performance and shielding effect, can shield weak interference signals, and meet the use requirements of the composite tape. In other embodiments, the material of the heat sink 23 can also be a metal material, for example, the heat sink 23 is a copper sheet.

[0052] See also Figure 6 and Figure 7 , the buffer layer 20 is embedded with a sealed bubble 22, and the sealed bubble 22 includes a shell 25 and a gas sealed in the shell 25. The design of sealing the gas in the shell 25 and then embedding the buffer layer 20 is convenient for preparation, and at the same time, the sealed bubble 22 is filled in the buffer layer 20 to increase the rebound against external force, and further improve the buffering performance of the composite tape. In addition, the sealed bubble 22 can reduce the weight of the material and can be applied to weight-restricted products.

[0053] In one embodiment, the material of the housing 25 includes a polyethylene terephthalate (PET) film, wherein the PET film has the advantage of being structurally stable and can increase the service life of the sealing bubble 22 .

[0054] In one embodiment, the thickness of the sealed bubble 22 is less than one-third of the thickness of the buffer layer 20 to ensure the overall structural stability of the buffer layer 20. For example, the thickness of the sealed bubble 22 is one-quarter, one-fifth or one-sixth of the thickness of the buffer layer 20.

[0055] In one embodiment, there are multiple sealed bubbles 22, and the multiple sealed bubbles 22 are arranged at intervals. Providing multiple sealed bubbles 22 can effectively improve the buffering effect.

[0056] In one embodiment, see Figure 8 The buffer layer 20 includes at least two buffer sublayers 26 stacked together, wherein at least one of the charging coil 21, the sealing bubble 22, and the heat sink 23 is disposed between two adjacent buffer sublayers 26. Specifically, the number of the buffer sublayers 26 can be one or more. During preparation, the charging coil 21 / sealing bubble 22 / heat sink 23 is placed between two adjacent buffer sublayers 26, and then the two adjacent buffer sublayers 26 are rolled to obtain the buffer layer 20.

[0057] In one embodiment, please continue to refer to Figure 8 , a plurality of the charging coil 21, the sealing bubble 22, and the heat sink 23 are disposed between two adjacent buffer sublayers 26. For example, the charging coil 21 and the sealing bubble 22 are placed between the same two buffer sublayers 26; or, the charging coil 21 and the heat sink 23 are placed between the same two buffer sublayers 26 (e.g. Figure 8 As shown); or, the sealing bubble 22 and the heat sink 23 are placed between the same two buffer sub-layers 26 at the same time; or, the charging coil 21, the sealing bubble 22 and the heat sink 23 are all placed between the same two buffer sub-layers 26 at the same time.

[0058] In one embodiment, see Fig. 9 The buffer layer 20 is embedded with multiple charging coils 21, sealing bubbles 22, and heat sinks 23, and one of the charging coils 21, sealing bubbles 22, and heat sinks 23 is disposed between two adjacent buffer sublayers 26. Figure 8 The difference in the implementation is that only one of the charging coil 21, the sealing bubble 22 and the heat sink 23 is arranged between two adjacent buffer sublayers 26. For example, when the charging coil 21 and the sealing bubble 22 are embedded in the buffer layer 20, the charging coil 21 and the sealing bubble 22 are respectively arranged between two different buffer sublayers 26.

[0059] In other embodiments, when the charging coil 21, the sealing bubble 22 and the heat sink 23 are simultaneously embedded in the buffer layer 20, two of the charging coil 21, the sealing bubble 22 and the heat sink 23 may be embedded between the same two buffer sub-layers 26, and the other may be embedded between another two buffer sub-layers 26.

[0060] In summary, the charging coil 21, the sealing bubble 22, and the heat sink 23 can be arranged between the same two buffer sub-layers 26, or between two different buffer sub-layers 26, or partially between the same two buffer sub-layers 26. The present application does not limit the manner in which the charging coil 21, the sealing bubble 22, and the heat sink 23 are embedded in the buffer layer 20.

[0061] Please continue reading Figure 1 The composite tape further includes a metal layer 30, which is arranged on the side of the buffer layer 20 away from the tape; the design of the metal layer 30 can prevent signal interference and has excellent heat dissipation performance, thereby improving the comprehensive performance of the composite tape after application.

[0062] In one embodiment, the material of the metal layer 30 includes at least one of copper, aluminum, and stainless steel; wherein the metal layer 30 may be copper foil, which has excellent electromagnetic shielding performance and is easy to prepare. Of course, in other embodiments, the metal layer 30 may be made of other metal materials.

[0063] In one embodiment, the material of the adhesive layer 10 includes mesh adhesive, which has the advantages of wide selection of materials, good performance, and easy application.

[0064] The present application also provides a display module, which includes the composite tape in the above embodiment. The display module in the embodiment of the present invention can be any product or component with display function, such as electronic paper, mobile phone, tablet computer, television, display, notebook computer, digital photo frame or navigator.

[0065] See also Fig.10 The present application also provides a method for preparing a composite tape, the method comprising:

[0066] S10: placing at least one of the charging coil 21 , the sealing bubble 22 , and the heat sink 23 between two adjacent buffer sub-layers 26 .

[0067] One or more of the charging coil 21 , the sealing bubble 22 , and the heat sink 23 are embedded between two adjacent buffer sub-layers 26 .

[0068] S20: rolling two adjacent buffer sub-layers 26 to obtain a buffer layer 20.

[0069] Two adjacent buffer sublayers 26 are processed by rolling to obtain a prepared buffer layer 20. Specifically, two buffer sublayers 26, three buffer sublayers 26, four buffer sublayers 26 or more buffer sublayers 26 are rolled to obtain the buffer layer 20. The charging coil 21, the sealing bubble 22, and the heat sink 23 can be arranged between the same two buffer sublayers 26, between two different buffer sublayers 26, or partially between the same two buffer sublayers 26.

[0070] S30 : Disposing a glue layer 10 on one side of the buffer layer 20 .

[0071] An adhesive layer 10 is arranged on one side of the buffer layer so that the composite tape has adhesiveness and is easy to use.

[0072] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A composite tape, characterized in that: The composite tape comprises: Adhesive layer; The buffer layer is arranged on one side of the adhesive layer, wherein at least one of a charging coil, a sealing bubble, and a heat sink is embedded in the buffer layer.

2. The composite tape according to claim 1, characterized in that: The material of the buffer layer includes silica gel; Preferably, the silica gel is an organic silicon polymer; Preferably, the main chain of the organosilicon polymer is -Si-O-Si-O-, and the side chain includes silicon atoms and organic groups; Preferably, the organic group includes at least one of methyl, phenyl and vinyl; Preferably, the base material of the silica gel includes linear polysiloxane, and the auxiliary material of the silicone polymer includes at least one of a catalyst, an inhibitor, and a cross-linking agent.

3. The composite tape according to claim 2, characterized in that: The material of the buffer layer also includes a thermally conductive filler; Preferably, the thermally conductive filler comprises at least one of metal, metal oxide, nitride and carbide; Preferably, the thickness of the buffer layer ranges from 0.1 to 0.18 mm; Preferably, the buffer layer has a mesh structure.

4. The composite tape according to claim 1, characterized in that: A charging coil is embedded in the buffer layer, and a winding direction of the charging coil is parallel to the adhesive layer; Preferably, the P pole and the N pole of the charging coil extend to the same side of the buffer layer; Preferably, an insulating protective layer is formed on the outer surface of the charging coil; Preferably, the charging coil is located in the middle of the buffer layer; Preferably, the thickness of the charging coil is less than one third of the thickness of the buffer layer.

5. The composite tape according to claim 1, characterized in that: A heat sink is embedded in the buffer layer, and the heat sink is parallel to the adhesive layer; Preferably, the heat sink is provided with a plurality of through holes, and parts of the buffer layer are embedded in the through holes; Preferably, the cross section of the through hole perpendicular to the adhesive layer is rectangular, circular or triangular; Preferably, the thickness of the heat sink is in the range of 0.018-0.05 mm; Preferably, the thermal conductivity of the heat sink is greater than or equal to 1300 W / MK; Preferably, the heat sink is made of graphite.

6. The composite tape according to claim 1, characterized in that: A sealed bubble is embedded in the buffer layer, and the sealed bubble includes a shell and a gas sealed in the shell; Preferably, the material of the shell includes polyethylene terephthalate film; Preferably, the thickness of the sealed bubble is less than one third of the thickness of the buffer layer; Preferably, there are multiple sealed bubbles, and the multiple sealed bubbles are arranged at intervals.

7. The composite tape according to claim 1, characterized in that: The buffer layer includes at least two buffer sublayers stacked together, wherein at least one of a charging coil, a sealing bubble, and a heat sink is disposed between two adjacent buffer sublayers; Preferably, a plurality of charging coils, sealing bubbles, and heat sinks are arranged between two adjacent buffer sublayers; Preferably, a plurality of charging coils, sealing bubbles and heat sinks are embedded in the buffer layer, and one of the charging coils, sealing bubbles and heat sinks is arranged between two adjacent buffer sub-layers.

8. The composite tape according to claim 1, characterized in that: The composite tape further comprises: A metal layer is disposed on a side of the buffer layer away from the adhesive tape; Preferably, the material of the metal layer includes at least one of copper, aluminum and stainless steel; Preferably, the material of the adhesive layer includes grid adhesive.

9. A display module, characterized in that: The composite adhesive tape comprises the composite adhesive tape as claimed in any one of claims 1 to 8.

10. A method for preparing a composite tape, characterized in that: The method comprises: At least one of a charging coil, a sealing bubble, and a heat sink is placed between two adjacent buffer sublayers; Roll-pressing two adjacent buffer sub-layers to obtain a buffer layer; A glue layer is arranged on one side of the buffer layer.

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