Built-in radiant air conditioning system of floor system and control method thereof

Abstract

The invention belongs to the technical field of radiation air conditioners, and particularly relates to a floor system built-in radiation air conditioning system and a control method thereof, a first channel and a second channel which are in a multilayer net shape are arranged in a cavity floor system, and a heat exchange device is arranged between the first channel and the second channel; the first ventilation device is arranged at one end of the first channel; the second air interchanger is arranged at the other end, connected with the outdoor, of the second channel; the detection devices are arranged indoors, outdoors, in the first channel and in the second channel respectively. A multi-layer net-shaped channel is adopted, air flowing is optimized, the heat exchange efficiency is enhanced, semiconductor refrigeration is adopted as a heat exchange device, different air exchange devices are assisted, and the working modes of the heat exchange device and the air exchange devices are changed by detecting the channel and the indoor and outdoor environment; the effects of real-time adjustment and accurate temperature control according to the environment are achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of radiation air conditioning, and in particular relates to a floor built-in radiation air conditioning system and a control method thereof. Background Art

[0002] As people's requirements for indoor environmental comfort continue to increase, air conditioning systems are increasingly used in buildings. Traditional air conditioning systems, such as fan coil units plus fresh air systems, have many problems during operation. For example, the noise generated by the fan coil unit during operation affects the work and rest of indoor personnel; its air circulation method easily causes secondary pollution of indoor air, which is not conducive to human health; moreover, the energy consumption of traditional air conditioning systems is high, which undoubtedly increases the operating cost of buildings in today's increasingly tight energy situation.

[0003] At present, there is a radiation air conditioning system on the market, which adopts the method of radiation heat exchange + convection heat exchange, exchanges heat with the enclosure structure through pre-buried pipes or capillary networks, and then radiates cold or heat directly to the indoor room by the enclosure structure, or uses ceiling-mounted metal radiation panels to directly radiate cold or heat to the room. Since the radiated cold or heat directly acts on the human body, people feel comfortable and noiseless. However, the terminal heat exchanger of this air conditioning system needs to be pre-buried with pipes or capillary networks before home decoration, which limits the scope of application. In addition, the system is complex, difficult to install, uses a lot of materials, and has high costs. In addition, the temperature cannot be adjusted in real time according to the environment. Summary of the invention

[0004] The present invention aims to provide a floor built-in radiation air conditioning system and a control method thereof, so as to solve the technical problems of high air conditioning noise, high energy efficiency, poor comfort and inability to adjust in real time according to the environment in cavity floor buildings.

[0005] In order to solve the above technical problems, the specific technical solutions of the present invention are as follows:

[0006] In some embodiments of the present application, a floor built-in radiation air conditioning system and a control method thereof are provided, including:

[0007] A cavity floor, wherein a first channel and a second channel in a multi-layer mesh are provided inside the cavity floor, and the first channel and the second channel are arranged in layers;

[0008] One end of the first channel is interconnected with the indoor room, and the other end is interconnected with the outdoor room;

[0009] Both ends of the second channel are respectively connected to the outdoors;

[0010] The first control valve is provided at one end of the first channel connected to the indoor space, and the second control valve is provided at one end of the second channel connected to the outdoor space;

[0011] A heat exchange device, the heat exchange device is arranged between the first channel and the second channel, and has a temperature regulating end and a heat dissipation end, the temperature regulating end is arranged in the first channel, and the heat dissipation end is arranged in the second channel;

[0012] a first ventilation device, the first ventilation device being disposed at one end of the first channel;

[0013] A second ventilation device, the second ventilation device is arranged at the other end of the second passage connected to the outside;

[0014] Detection devices, which are respectively arranged indoors, outdoors, and in the first channel and the second channel;

[0015] The control device is respectively connected to the heat exchange device, the first ventilation device, the second ventilation device, and the detection device by electrical signals, and issues instructions to the heat exchange device and the first ventilation device and the second ventilation device by receiving parameter data collected by the detection device, thereby changing the airflow inside the first channel and the second channel.

[0016] In some embodiments of the present application, the heat exchange device is a combined structure, including:

[0017] A radiation plate, wherein the radiation plate is arranged in the first channel and is fixedly connected to the cavity floor;

[0018] A semiconductor refrigeration plate, wherein the temperature regulating end of the semiconductor refrigeration plate is connected to the radiation plate through a heat conducting member, and the heat dissipation end is located in the second channel and is connected to the control device via an electrical signal.

[0019] In some embodiments of the present application, the first channel and the second channel are interconnected, and a third control valve is provided at the junction of the two channels, and a liquid collecting channel is provided in the first channel and the second channel, and the liquid collecting channel is connected to the outside.

[0020] In some embodiments of the present application, a polymer water-proof coating is coated on the radiation plate and the semiconductor refrigeration sheet.

[0021] In some embodiments of the present application, the detection device includes: a temperature detector and a humidity detector.

[0022] In some implementations of the present application, thermoelectric materials (such as antimony telluride) are arranged at the hot end of the semiconductor refrigerator and the second channel. In the cooling mode, a large amount of heat is generated at the hot end of the refrigerator and is rapidly conducted away by the thermoelectric material with higher thermal conductivity. At the same time, waste heat is reused through thermal power generation, and thermal energy is converted into electrical energy, which is directly supplied to the semiconductor refrigerator and the fan, thereby improving the energy utilization efficiency of the semiconductor refrigerator.

[0023] In some embodiments of the present application, the control device includes:

[0024] A signal acquisition module, which is electrically connected to the detection device, obtains the temperature and humidity information of the indoor, outdoor, first channel and second channel collected by the detection device, and converts the format into an internal identification signal;

[0025] A processing module, wherein the processing module generates an execution signal by processing the signal converted by the received signal acquisition module;

[0026] An execution module, wherein the execution module receives an execution signal from the processing module and controls the heat exchange device, the first ventilation device, the second ventilation device, the first control valve, the second control valve and the third control valve to generate corresponding actions;

[0027] The wireless signal transmission module is electrically connected to the processing module and wirelessly connected to the external terminal. It sends the command changes in the processing module to the terminal, receives the command information sent by the terminal, and feeds back to the processing module.

[0028] In some embodiments of the present application, a control method for a cavity floor built-in radiation air conditioning system adopts the above-mentioned cavity floor built-in radiation air conditioning system, comprising the following steps:

[0029] Step 1: Set various preset values ​​for the current system operation;

[0030] Step 2: Obtain the temperature and humidity information of indoor, outdoor, first channel and second channel through the detection device, and compare it with the system preset value to generate an active dynamic mark;

[0031] Step 3: According to the active dynamic mark, the control device changes the working states of the heat exchange device, the first ventilation device, the second ventilation device, the first control valve, the second control valve and the third control valve according to the preset mode until the active dynamic mark is consistent with the preset value and stops running.

[0032] In some embodiments of the present application, the preset values ​​in step 1 include: temperature in the first channel, humidity in the first channel, temperature in the second channel, humidity in the second channel, indoor temperature and indoor humidity.

[0033] In some embodiments of the present application, the active dynamic mark in step 2 includes:

[0034] A first dynamic mark, wherein the first dynamic mark indicates that the heat exchange device is in cooling mode;

[0035] A second dynamic mark, wherein the second dynamic mark indicates that the heat exchange device is in heating mode;

[0036] A third dynamic indicator, wherein the temperature and humidity in the first channel are lower than a preset value;

[0037] A fourth dynamic indicator, wherein the temperature and humidity in the first channel are higher than a preset value;

[0038] A fifth dynamic indicator, wherein the temperature and humidity in the second channel are lower than a preset value;

[0039] A sixth dynamic indicator, wherein the temperature and humidity in the second channel are higher than a preset value;

[0040] A seventh dynamic indicator, wherein the seventh dynamic indicator is that the indoor temperature and humidity are higher than a preset value;

[0041] The eighth dynamic mark is that the indoor temperature and humidity are lower than a preset value.

[0042] In some embodiments of the present application, in step 3, according to the active dynamic mark, the control device changes the working states of the heat exchange device, the first ventilation device, the second ventilation device, the first control valve, the second control valve and the third control valve according to the preset mode:

[0043] According to the first dynamic mark and the second dynamic mark, the processing module sends an instruction to the execution module, thereby switching the current flow to the heat exchange device, thereby switching the cooling and heating modes;

[0044] According to the third dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to reduce the current input to the heat exchange device, and opens the third control valve to allow the gas in the second channel to enter, while increasing the air intake of the first ventilation device, so that the temperature in the first channel increases until the third dynamic mark is consistent with the preset value; in the heating mode, the processing module sends an instruction to the execution module to increase the current input to the heat exchange device, and at this time closes the third control valve, reduces the air intake of the first ventilation device, and increases the temperature in the first channel until the third dynamic mark is consistent with the preset value;

[0045] According to the fourth dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to increase the current input to the heat exchange device, close the third control valve, and reduce the air intake of the first ventilation device, so that the temperature in the first channel is reduced until the third dynamic mark is consistent with the preset value; in the heating mode, the processing module sends an instruction to the execution module to reduce the current input to the heat exchange device, and at this time, the third control valve is opened, the air intake of the first ventilation device is increased, and the temperature in the first channel is reduced until the third dynamic mark is consistent with the preset value;

[0046] According to the fifth dynamic mark, in the heating mode, the processing module sends a command to the execution module to open the second control valve, increase the air intake of the second ventilation device in the second channel, thereby increasing the temperature in the second channel until the fifth dynamic mark is consistent with the preset value;

[0047] According to the sixth dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to open the second control valve, increase the air intake of the second ventilation device in the second channel, thereby reducing the temperature in the second channel until the fifth dynamic mark is consistent with the preset value;

[0048] According to the seventh dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to increase the current input to the heat exchange device, close the third control valve, and reduce the air intake of the first ventilation device, so that the indoor temperature is reduced until the seventh dynamic mark is consistent with the preset value; in the heating mode, the processing module sends an instruction to the execution module to reduce the current input to the heat exchange device, and at this time, the third control valve is opened, the air intake of the first ventilation device is increased, and the indoor temperature is reduced until the seventh dynamic mark is consistent with the preset value;

[0049] According to the eighth dynamic mark, in the cooling mode, the processing module sends a command to the execution module to reduce the current input to the heat exchange device and open the third control valve, while increasing the air intake of the first ventilation device to increase the indoor temperature until the eighth dynamic mark is consistent with the preset value; in the heating mode, the processing module sends a command to the execution module to increase the current input to the heat exchange device, at which time the third control valve is closed, and the air intake of the first ventilation device is reduced to increase the indoor temperature until the eighth dynamic mark is consistent with the preset value.

[0050] Compared with the prior art, the beneficial effects of the present invention lie in that, by adopting multi-layer mesh channels, air flow is optimized and heat exchange efficiency is enhanced, and by adopting semiconductor refrigeration as a heat exchange device, supplemented by different ventilation devices, the working modes of the heat exchange device and the ventilation device are changed by detecting the environment of the channels and indoor and outdoor environments, thereby achieving the effect of real-time adjustment and precise temperature control according to the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0052] Figure 1 A schematic diagram of the heat exchange device provided in an embodiment of the present invention;

[0053] Figure 2 A schematic diagram of the installation structure of a heat exchange device provided in an embodiment of the present invention;

[0054] Figure 3 A schematic diagram of the internal structure of a cavity floor provided in an embodiment of the present invention;

[0055] Figure 4 A schematic diagram of the internal three-dimensional structure of a cavity floor provided in an embodiment of the present invention; DETAILED DESCRIPTION

[0056] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0057] In order to better understand the purpose, structure and function of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings.

[0058] Embodiment 1

[0059] See attached Figure 1-4 As shown, according to an embodiment of the present application, a floor built-in radiation air conditioning system is disclosed, comprising:

[0060] A cavity floor, wherein a first channel and a second channel in a multi-layer mesh are arranged inside the cavity floor, and the first channel and the second channel are arranged in layers; one end of the first channel is interconnected with the indoor, and the other end is interconnected with the outdoor; the two ends of the second channel are respectively interconnected with the outdoor; a first control valve is provided at the end of the first channel connected to the indoor, and a second control valve is provided at the end of the second channel connected to the outdoor; the first channel and the second channel are interconnected, and a third control valve is provided at the junction of the two, and a liquid collecting channel is provided in the first channel and the second channel, and the liquid collecting channel is connected to the outside.

[0061] In other words, the cavity floor comprises a plurality of cavity slabs combined with each other, wherein a single or multiple multifunctional cavities are arranged inside the cavity slabs, and connected openings are provided on the functional cavities. Different multifunctional cavities are interconnected to form channels, and are arranged according to actual installation requirements, and are stacked and installed to form a first channel and a second channel respectively.

[0062] The heat exchange device 1 is a semiconductor refrigeration plate 101 such as TEC1-12706, which works by thermoelectric effect. When electric current passes through the semiconductor refrigeration plate 101, the cold end absorbs heat and the hot end releases heat. The change in the direction of the current will cause the heat transfer direction to change, thereby changing the performance of the cooling and heating functions. When the current flows into the refrigeration plate, the cold end absorbs heat and produces a cooling effect; when the direction of the current is reversed, the heat is transferred from the hot end to the cold end, and the cold end releases heat to produce a heating effect. By precisely adjusting the direction and intensity of the current, the switching of the cold and hot functions can be achieved to adapt to different indoor needs and seasonal changes. The heat exchange device 1 is arranged between the first channel and the second channel, and has a temperature regulating end and a heat dissipation end. The temperature regulating end is placed in the first channel, and the heat dissipation end is placed in the second channel;

[0063] It should be noted that the heat exchange device 1 is a combined structure, comprising:

[0064] The radiation plate 102 is disposed in the first channel and is fixedly connected to the cavity floor;

[0065] The semiconductor refrigeration sheet 101 has a temperature regulating end connected to the radiation plate 102 through a heat conducting member, and a heat dissipation end located in the second channel, and is electrically connected to the control device. In other words, the semiconductor refrigeration sheet is connected to the radiation plate 102 of the cavity floor through a heat conducting aluminum plate or copper plate, ensuring that the temperature regulating end is in close contact with the radiation plate 102, and heat can be effectively transferred to the entire cavity structure; the semiconductor refrigeration sheets 101 are arranged in a grid shape, covering the entire floor surface, ensuring that each area of ​​the room can dissipate heat evenly, avoiding areas with large temperature differences;

[0066] The first ventilation device 2 is a negative pressure fan, which is arranged outdoors, and its air inlet end is connected to the indoor room, and a plurality of openings are provided at the position of the first channel in the cavity floor. At this time, one end of the first channel is interconnected with the outdoors, and a first control valve is provided. By starting the first ventilation device 2, a negative pressure area is formed indoors, and the external gas is prompted to enter the first channel to exchange heat with the heat exchange device 1, and enter the room from the opening at the bottom of the first channel, thereby performing cooling or heating operations. When the negative pressure fan is not started, the indoor gas enters the first channel through the opening, exchanges heat with the heat exchange device 1, thereby achieving cooling and heating effects. At this time, the first control valve is in a closed state.

[0067] The second ventilation device 3 is a negative pressure fan, which is arranged at the other end of the second channel connected to the outside. The second ventilation device 3 controls the temperature of the gas in the second channel, thereby preventing the heat dissipation end of the semiconductor refrigeration plate 101 from overheating and causing damage. The second ventilation device 3 is installed outdoors, and its air inlet end is connected to one end of the second channel, and the other end of the second channel is connected to the outside. A second control valve is provided at the connection. By starting the second ventilation device 3 and opening the second control valve, a negative pressure area is formed in the second channel, so that the external gas enters the second channel, exchanges heat with the heat dissipation end of the heat exchange device 1, and is discharged by the second ventilation device 3.

[0068] The detection device comprises a temperature detector and a humidity detector, and the detection devices are respectively arranged indoors, outdoors, and in the first channel and the second channel;

[0069] Control device, including:

[0070] A signal acquisition module, which is electrically connected to the detection device, obtains the temperature and humidity information of the indoor, outdoor, first channel and second channel collected by the detection device, and converts the format into an internal identification signal;

[0071] A processing module, wherein the processing module generates an execution signal by processing the signal converted by the received signal acquisition module;

[0072] An execution module, which receives an execution signal from the processing module and controls the heat exchange device 1, the first ventilation device 2, the second ventilation device 3, the first control valve, the second control valve and the third control valve to generate corresponding actions;

[0073] The wireless signal transmission module is electrically connected to the processing module and wirelessly connected to the external terminal. It sends the command changes in the processing module to the terminal, receives the command information sent by the terminal, and feeds back to the processing module.

[0074] Through the above technical solution, the technical effects produced in the embodiments of the present application are:

[0075] By adopting the first channel and the second channel arranged in a multi-layer mesh structure, the air flow mode is optimized and the heat exchange efficiency is enhanced. By using the thermoelectric semiconductor refrigeration sheet 101 as the core refrigeration element and combining the efficient radiation plate 102 design, a semiconductor radiation refrigeration air conditioning system is formed. By combining the refrigeration system with the cavity floor, the steps of air conditioning installation are reduced, the installation and maintenance of various pipelines are omitted, and the air flow path is optimized in this technology. The cavity floor is designed as a closed cavity below, and is connected to the heat dissipation area of ​​the semiconductor refrigeration sheet 101 through each precisely controlled channel. When the air is sucked out by the negative pressure fan, the air quickly passes through the cavity floor to take away the heat, and the fresh air quickly enters the room through the channel. This process ensures the stability of air flow and reduces the possibility of hot air retention, and enhances the temperature uniformity in the room. And cooperate with the detection device and the control device, so as to realize the accurate and real-time adjustment of the working mode of the heat exchange device 1 and the first ventilation device 2 and the second ventilation device 3 according to the actual environment, and then accurately adjust the indoor temperature to save energy consumption.

[0076] Example 2

[0077] The embodiment of the present application adopts the structure of the above embodiment, wherein, in order to prevent frost on the surface of the heat exchange device 1, a polymer water-proof coating is coated on the radiation plate 102 and the semiconductor refrigeration plate 101. The residence time of water droplets on the refrigeration plate is reduced, the formation of frost is reduced, and a fresh air system is added at the air inlet of the first channel and the second channel to make the air entering dry, reduce the contact of humid water vapor with the refrigeration plate, and reduce the formation of frost.

[0078] In order to further improve the defrosting efficiency, the temperature regulating end and the heat dissipation end of the heat exchange device 1 are respectively provided with real-time temperature monitoring. When the temperature is lower than the set threshold, the current direction is changed and the hot and cold ends are switched, thereby achieving automatic defrosting and avoiding energy waste due to excessive defrosting. After defrosting, the melted water is discharged through the reserved grooves on the semiconductor refrigeration plate 101 and the reserved liquid collection tanks 103 on both sides of the cavity body, ensuring long-term and stable operation of the overall system.

[0079] Example 3

[0080] In an embodiment of the present application, a control method for a cavity floor built-in radiation air conditioning system is disclosed, using a cavity floor built-in radiation air conditioning system in the above embodiment, comprising the following steps:

[0081] Step 1: Set various preset values ​​for the current system operation, including: temperature in the first channel, humidity in the first channel, temperature in the second channel, humidity in the second channel, indoor temperature and indoor humidity;

[0082] Step 2: Obtain the temperature and humidity information of indoor, outdoor, first channel and second channel through the detection device, and compare it with the system preset value to generate an active dynamic mark;

[0083] Active dynamic tags include:

[0084] A first dynamic mark, wherein the first dynamic mark indicates that the heat exchange device 1 is in cooling mode;

[0085] A second dynamic mark, wherein the second dynamic mark indicates that the heat exchange device 1 is in heating mode;

[0086] A third dynamic indicator, wherein the temperature and humidity in the first channel are lower than a preset value;

[0087] A fourth dynamic indicator, wherein the temperature and humidity in the first channel are higher than a preset value;

[0088] A fifth dynamic indicator, wherein the temperature and humidity in the second channel are lower than a preset value;

[0089] A sixth dynamic indicator, wherein the temperature and humidity in the second channel are higher than a preset value;

[0090] A seventh dynamic indicator, wherein the seventh dynamic indicator is that the indoor temperature and humidity are higher than a preset value;

[0091] The eighth dynamic mark is that the indoor temperature and humidity are lower than a preset value.

[0092] Step 3: According to the active dynamic mark, the control device changes the working states of the heat exchange device 1, the first ventilation device 2, the second ventilation device 3, the first control valve, the second control valve and the third control valve according to the preset mode until the active dynamic mark is consistent with the preset value and stops running; taking the temperature exceeding the threshold as an example, the specific method is as follows:

[0093] According to the first dynamic mark and the second dynamic mark, the processing module sends an instruction to the execution module, thereby switching the current flow to the heat exchange device 1, thereby switching the cooling and heating modes;

[0094] According to the third dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to reduce the current input to the heat exchange device 1, and opens the third control valve to allow the gas in the second channel to enter, while increasing the air intake of the first ventilation device 2, so that the temperature in the first channel increases until the third dynamic mark is consistent with the preset value; in the heating mode, the processing module sends an instruction to the execution module to increase the current input to the heat exchange device 1, and at this time closes the third control valve, reduces the air intake of the first ventilation device 2, and increases the temperature in the first channel until the third dynamic mark is consistent with the preset value;

[0095] It should be noted that in this process, the order of adjustment should be selected according to the actual environment, that is, the humidity and external environmental parameters should be considered. For example: when the humidity in the first channel and the indoor humidity meet the set value and the outdoor humidity is higher or lower than the preset value, the third control valve is opened first and the current input of the heat exchange device 1 is reduced; when the humidity in the first channel, the indoor humidity and the outdoor humidity meet the preset value, the air intake of the first ventilation device 2 is increased first, and then the current input of the heat exchange device 1 is reduced, and finally the third control valve is opened; when the indoor humidity and the gas humidity in the first channel are higher than the set value, and the outdoor humidity is higher or lower than the set value, the current input of the heat exchange device 1 is adjusted first, and then it is determined whether to open or close the third control valve, and finally the air intake is adjusted;

[0096] According to the fourth dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to increase the current input to the heat exchange device 1, close the third control valve, and reduce the air intake of the first ventilation device 2, so that the temperature in the first channel is reduced until the third dynamic mark is consistent with the preset value; in the heating mode, the processing module sends an instruction to the execution module to reduce the current input to the heat exchange device 1, and at this time, the third control valve is opened, the air intake of the first ventilation device 2 is increased, and the temperature in the first channel is reduced until the third dynamic mark is consistent with the preset value;

[0097] It should be noted that in this process, the order of adjustment should be selected according to the actual environment, that is, the humidity and external environmental parameters should be considered. For example: when the humidity in the first channel and the indoor humidity meet the set value and the outdoor humidity is higher or lower than the preset value, the third control valve is opened first and the current input of the heat exchange device 1 is reduced; when the humidity in the first channel, the indoor humidity and the outdoor humidity meet the preset value, the air intake of the first ventilation device 2 is increased first, and then the current input of the heat exchange device 1 is reduced, and finally the third control valve is opened; when the indoor humidity and the gas humidity in the first channel are higher than the set value, and the outdoor humidity is higher or lower than the set value, the current input of the heat exchange device 1 is adjusted first, and then it is determined whether to open or close the third control valve, and finally the air intake is adjusted;

[0098] According to the fifth dynamic mark, in the heating mode, the processing module sends a command to the execution module to open the second control valve, increase the air intake of the second ventilation device 3 in the second channel, thereby increasing the temperature in the second channel until the fifth dynamic mark is consistent with the preset value;

[0099] According to the sixth dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to open the second control valve, increase the air intake of the second ventilation device 3 in the second channel, thereby reducing the temperature in the second channel until the fifth dynamic mark is consistent with the preset value;

[0100] It should be further explained that the adjustment of the heat exchange device 1 according to the fifth dynamic mark and the sixth dynamic mark in the second channel should preferably follow the adjustment method of the third dynamic mark and the fourth dynamic mark, and then be selected in sequence.

[0101] According to the seventh dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to increase the current input to the heat exchange device 1, close the third control valve, and reduce the air intake of the first ventilation device 2, so that the indoor temperature is reduced until the seventh dynamic mark is consistent with the preset value; in the heating mode, the processing module sends an instruction to the execution module to reduce the current input to the heat exchange device 1, and then open the third control valve, increase the air intake of the first ventilation device 2, and reduce the indoor temperature until the seventh dynamic mark is consistent with the preset value;

[0102] According to the eighth dynamic mark, in the cooling mode, the processing module sends a command to the execution module to reduce the current input to the heat exchange device 1, open the third control valve, and increase the air intake of the first ventilation device 2 to increase the indoor temperature until the eighth dynamic mark is consistent with the preset value; in the heating mode, the processing module sends a command to the execution module to increase the current input to the heat exchange device 1, and at this time close the third control valve, reduce the air intake of the first ventilation device 2, and increase the indoor temperature until the eighth dynamic mark is consistent with the preset value.

[0103] It should be noted that the adjustment schemes of the third, fourth, fifth and sixth dynamic marks in the first and second channels should be based on the adjustment schemes of the seventh and eighth dynamic marks. When the seventh and eighth dynamic marks are adjusted sequentially, the ambient humidity needs to be considered. That is, when the indoor humidity is higher or lower than the set value, the first ventilation device 2 is turned on first. When the indoor humidity meets the set value, the current input to the heat exchange device 1 is adjusted first, and then whether to turn on the third control valve is selected, and finally whether to turn on the first ventilation device 2 and / or the second ventilation device 3 is selected.

[0104] Application Examples

[0105] The temperature control system design of this embodiment involves the use of TEC1-12706 thermoelectric cooling sheet, radiation steel plate and negative pressure fan to work together to effectively reduce the temperature and ensure the efficient operation of the temperature control system. The specific implementation of the present invention is described in detail below, including the working principle of the temperature control system, system composition, selection and calculation method of cooling sheet and fan, installation and debugging steps.

[0106] 1. Overall system design

[0107] The system of the present invention is mainly composed of the following three parts:

[0108] TEC1-12706 thermoelectric cooling chip: used for local or overall cooling.

[0109] Radiant steel plate: used to spread the radiation area and quickly cool down.

[0110] Negative pressure fan: used to accelerate the removal of heat in the room, quickly take away the hot air through exhaust flow, and promote the improvement of heat dissipation efficiency.

[0111] Through the coordination of these components, the present invention can achieve efficient cooling in rooms of different areas and different heat loads, and is particularly suitable for environments requiring precise temperature control.

[0112] 2. Selection and configuration of semiconductor thermoelectric cooling chips

[0113] The semiconductor thermoelectric cooling chip is the core cooling element of the system of the present invention. Its working principle is based on the thermoelectric effect. When the current passes through, a temperature difference will be formed on both sides of the thermoelectric material, so that one side absorbs the heat and transfers it to the other side. In order to ensure the effective operation of the thermoelectric cooling chip, the required number of cooling chips needs to be calculated according to the heat load of the room and the target temperature drop.

[0114] 2.1 Heat load calculation

[0115] Heat load refers to the heat in the room, which needs to be transferred and dissipated by the thermoelectric cooler. Generally speaking, the heat load of a room can be simply calculated by the following formula:

[0116] Q=V×ΔT×K

[0117] Q is the total heat that needs to be removed from the room

[0118] V is the volume of the room

[0119] ΔT is the amount by which the room needs to be lowered

[0120] K is the heat load coefficient of the room (unit: W / m 3 ·℃). This factor takes into account the room's insulation, the wall's thermal conductivity, and the heat generated by the equipment in the room. Usually 20-40W / m 3 ℃

[0121] 2.2 Calculation of the number of thermoelectric cooling chips

[0122] This article takes the TEC1-12706 thermoelectric cooler as an example, whose cooling capacity is about 40-60W. In order to determine the number of coolers required, the following formula can be used for calculation:

[0123]

[0124] The other specifications of cooling plates can be estimated based on the mathematical model of thermoelectric elements

[0125] q c =α e,c IT c -0.5I 2 R e -K e (T h -T c )

[0126] 1. Seebeck coefficient of the cold end of the thermoelectric element: α e,c

[0127] 2. Resistor R e

[0128] 3. Thermal conductivity K e

[0129] 4. Cold end temperature T C

[0130] 5. Hot end temperature T h

[0131] 6. Current: I

[0132] 2.3 Refrigeration chip configuration plan

[0133] According to the required number of cooling plates calculated above, the TEC1-12706 thermoelectric cooling plates are evenly arranged in the cavity floor above the room, especially where the heat source is concentrated. In order to improve the cooling efficiency, the cold end of each thermoelectric cooling plate should face the area that needs to be cooled and radiate into the room through the radiation plate 102.

[0134] 3. Heat dissipation design and installation of radiation panel 102

[0135] Material selection: Radiant steel plates should be made of metal materials with good thermal conductivity, such as aluminum or copper, and the surface can be coated with a black heat-absorbing coating to increase the thermal radiation effect.

[0136] Area calculation: Based on the heat load and heat dissipation requirements, the total surface area of ​​the radiant steel panel can be calculated by the following formula:

[0137]

[0138] in:

[0139] A rad is the total area of ​​the radiant steel plate (square meters, m 2 ).

[0140] σ is the emissivity, and the value commonly used is 0.9.

[0141] ΔT is the temperature difference that heat needs to be transferred, and a smaller temperature difference is usually selected to improve heat transfer efficiency.

[0142] The radiant steel plates should be distributed as evenly as possible and cover the hot end of the thermoelectric cooler to effectively dissipate the generated heat.

[0143] 4. Selection and configuration of negative pressure fan

[0144] Negative pressure fans are used to quickly extract hot air from the room to speed up heat removal and improve cooling efficiency. The fan selection should be based on the room volume, required air volume and heat load.

[0145] 4.1 Fan air volume calculation

[0146] The air volume of the fan can usually be estimated by the following formula:

[0147]

[0148] in:

[0149] V fan is the required air volume (cubic meters per second, m 3 / s).

[0150] Q is the amount of heat that needs to be removed from the room (W).

[0151] ΔT is the temperature drop in the room (°C).

[0152] ρ is the air density, about 1.225 kg / m 3 .

[0153] Cp is the specific heat capacity of air, which is approximately 1005 J / kg·℃.

[0154] 4.2 Fan layout

[0155] The negative pressure fan is installed in the cavity floor near the outer wall. The high-temperature air generated by the semiconductor refrigeration plate 101 in the cavity floor is extracted through negative pressure. Its power and air volume must be proportional to the semiconductor refrigeration plate 101 to extract heat in time and avoid affecting the normal operation of the semiconductor refrigeration plate 101 due to excessive temperature.

[0156] 4.3 Fan duct calculation

[0157] According to the existing standards, the main wind speed shall not exceed 7m / s, so

[0158]

[0159] in

[0160] A 管 is the main area (square meters, m 2 )

[0161] V fan is the air volume (cubic meters per second, m 3 / s)

[0162] V is wind speed (meters per second, m / s)

[0163] D is the pipe diameter (meters, m)

[0164] 5. System debugging and optimization

[0165] After the system is installed, comprehensive debugging is required to ensure the coordination of various equipment and the stability of the system. The debugging process includes:

[0166] Temperature control: Monitor the temperature in the room through the temperature control sensor, adjust the working current of the thermoelectric cooling chip and the speed of the fan to ensure that the room temperature can be stabilized within the target range.

[0167] Energy efficiency optimization: According to actual usage, timely adjust the cooling chip power output and fan operation mode to minimize energy consumption and optimize cooling efficiency.

[0168] Long-term stability test: Perform a long-term operation test on the system to observe the working status and temperature changes of the equipment to ensure that the equipment will not overheat or malfunction during long-term operation.

[0169] This design takes a TEC1-12706 semiconductor module with a size of 40cm×40cm, a room with a size of 8.5×8.5m and a floor height of 5m, an outdoor temperature of 35℃, a target temperature of 26℃, and a temperature drop from the outdoor temperature to the target temperature in one hour as an example:

[0170] According to the mathematical model of thermoelectric element

[0171] q c =α e,c IT c -0.5I 2 R e -K e (T h -T c )

[0172] According to the data TEC1-12706 known parameters:

[0173] 1. Seebeck coefficient of the cold end of the thermoelectric element: α e,c =0.045V / K

[0174] 2. Resistor R e =2Ω

[0175] 3. Thermal conductivity K e =0.22W / K

[0176] 4. Cold end temperature T C :26℃=299K

[0177] 5. Hot end temperature T h :36℃=308K

[0178] 6. Current: TEC1-12706 maximum operating current 6A

[0179] When Thomson effect is ignored, the cooling power of a single module is

[0180] q c =80.73-36-1.98=42.75W

[0181] During the operation of TEC1-12706, due to the Joule effect and other thermal effects, heat will be generated at the hot end.

[0182] q h =q c +I 2 R e +K e (T h -T c )

[0183] q h=42.75+72+1.98=116.73W

[0184] 1. Calculation of heat transfer in a room

[0185] For the heat transfer loss of the room, the formula is:

[0186] Q loss =U·A·ΔT

[0187] in:

[0188] U is the heat transfer coefficient, unit is W / (m 2 K), reflecting the thermal insulation performance of walls or windows.

[0189] A is the heat transfer area in m 2 .

[0190] ●ΔT is the temperature difference between the inside and outside of the room, in K.

[0191] Typical values ​​of heat transfer coefficient U:

[0192] ●Wall (insulation wall): about 0.5W / (m 2 ·K)

[0193] ●Window (ordinary single-layer glass): about 5.0W / (m 2 ·K)

[0194] Calculation of heat transfer area A:

[0195] ●Assume that the room size is 8.5m×8.5m and the floor height is 5m.

[0196] ●Wall area = perimeter × height = 34m 2 .

[0197] ●Assume the room is 15m 2 of window area.

[0198] ●Total heat transfer area A = wall area + window area = 185m 2 .

[0199] Indoor and outdoor temperature difference ΔT:

[0200] ●Temperature difference ΔT=T out -T c =9K

[0201] Calculation of heat transfer loss of each part:

[0202] Q wall = U 墙壁 ·A 墙壁 ΔT=0.5·170·9=765W

[0203] Qwindow=U窗户 ·A 窗户 ΔT=5.0·15·9=675W

[0204] Q loss =Q 墙壁 +Q 窗户 =765+675=1440W

[0205] Q total =Q 空气 +Q loss =1090.7+697.5=2530.7W

[0206]

[0207]

[0208] Therefore, for a room of 8.5×8.5m and 5m in height, with an outdoor temperature of 35℃ and a target temperature of 26℃, 60 TEC1-12706 semiconductor modules are required to reduce the outdoor temperature to the target temperature in one hour, and the diameter of the air duct is 0.19m

[0209] This article gives a rough estimation formula. If the room size is m×n (unit: meter), the floor height is h (unit: meter), the room temperature is h0 (unit: Celsius), and the set temperature is h (unit: Celsius), then the number N (unit: piece) of semiconductor cooling sheets 101 is approximately

[0210]

[0211] A 室内 Indoor surface area

[0212] P is the power of semiconductor refrigeration chip

[0213] U is the average heat transfer coefficient, which can be found in the table.

[0214] This embodiment mainly uses the thermoelectric effect to perform precise temperature control to solve the problems of high energy consumption, high noise, frost, etc. in existing air conditioning systems. The system achieves energy-saving, efficient, quiet and environmentally friendly air conditioning effects through intelligent control, current direction adjustment, cooling fan optimization, defrosting technology and other measures.

[0215] Semiconductor Radiant Refrigeration Air Conditioning Design

[0216] The present invention uses the thermoelectric semiconductor cooling sheet 101 as the core cooling element, combined with the efficient radiation steel plate design, to form a semiconductor radiation cooling air conditioning system. Specifically, the indoor heat is transported to the cavity floor by the semiconductor cooling sheet 101, and the heat is quickly taken away by the negative pressure fan.

[0217] When the refrigeration system is running, the radiant steel plate transfers heat to the surrounding air by radiation, causing the room temperature to drop rapidly. The design of the radiant steel plate forms a large radiation surface inside the room and controls the installation angle and position of the steel plate to evenly distribute the heat, thereby achieving a more efficient cooling effect.

[0218] Design of cavity floor structure

[0219] The cavity floor structure is an innovative design that guides air flow through a space cavity. By combining the refrigeration system with the cavity floor, this design reduces the steps of air conditioning installation, omits the installation and maintenance of various pipelines, and optimizes the air flow path in this technology. The cavity floor is designed as a closed cavity under the cavity floor, and is connected to the cooling area of ​​the refrigeration plate through a precisely controlled channel. When the air is sucked out by the negative pressure fan, the air quickly passes through the cavity floor to take away the heat, and the fresh air quickly enters the room through the channel. This process ensures the stability of air flow and reduces the possibility of hot air retention, enhancing the temperature uniformity in the room.

[0220] Design and working principle of negative pressure fan

[0221] The negative pressure fan is a key component in the present invention to achieve efficient heat removal. The system installs the negative pressure fan in the cavity floor and ensures that the fan can quickly extract the hot air in the room through the accurately calculated air inlet position. The negative pressure fan continuously extracts the hot air in the room, removes the heat generated by the hot end of the refrigeration plate, and ensures that the temperature in the whole room is balanced to avoid local heat accumulation.

[0222] In terms of design, the negative pressure fan is not only responsible for exhausting hot air, its wind speed and air volume are adjusted according to the real-time temperature. When the temperature in the room is high, the fan speed increases to quickly take away the excess heat; when the temperature reaches the set target, the fan automatically reduces the wind speed to save energy. The working mode of the fan is adjusted by the intelligent temperature control system to ensure that the system is in the lowest energy consumption state when the room reaches the preset temperature.

[0223] Super hydrophobic material defrosting technology

[0224] During long-term use, the temperature of the cold end of the refrigeration plate is too low, which will cause water vapor to condense and form a frost layer. Frosting will not only significantly reduce the refrigeration efficiency, but also may damage the components of the refrigeration plate. In order to prevent this problem, the present invention adopts super-hydrophobic material defrosting technology to solve the frosting problem. The super-hydrophobic material enables the formed condensed droplets to obtain a faster spontaneous jump migration speed, and still maintain the Cassie-Baxter state under the condensation environment, and is exported through the reserved collection tank 103 in the board.

[0225] System collaboration and intelligent regulation

[0226] The temperature control system of the present invention adopts an intelligent temperature control regulator, which can automatically adjust the power of the refrigeration plate, the speed of the negative pressure fan and the working state of the defrosting system according to the real-time temperature and humidity of the room. The intelligent regulator realizes accurate temperature control and frost layer monitoring by combining with temperature sensors and humidity sensors.

[0227] When the system starts, the intelligent thermostat automatically adjusts the operating parameters of the refrigeration fins and negative pressure fans according to the preset temperature. During the cooling process, the radiation steel plate accelerates the cooling through radiation, and after the system stabilizes, the intelligent control system adjusts the fan speed and refrigeration fin power to keep the room temperature stable within the set range.

[0228] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0229] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0230] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0231] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0232] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cavity floor built-in radiation air conditioning system, characterized in that: include: A cavity floor, wherein a first channel and a second channel in a multi-layer mesh are provided inside the cavity floor, and the first channel and the second channel are arranged in layers; One end of the first channel is interconnected with the indoor room, and the other end is interconnected with the outdoor room; Both ends of the second channel are respectively connected to the outdoors; The first control valve is provided at one end of the first channel connected to the indoor space, and the second control valve is provided at one end of the second channel connected to the outdoor space; A heat exchange device, the heat exchange device is arranged between the first channel and the second channel, and has a temperature regulating end and a heat dissipation end, the temperature regulating end is arranged in the first channel, and the heat dissipation end is arranged in the second channel; a first ventilation device, the first ventilation device being disposed at one end of the first channel; a second ventilation device, the second ventilation device being arranged at the other end of the second passage connected to the outside; Detection devices, which are respectively arranged indoors, outdoors, and in the first channel and the second channel; The control device is respectively connected to the heat exchange device, the first ventilation device, the second ventilation device, and the detection device by electrical signals, and issues instructions to the heat exchange device and the first ventilation device and the second ventilation device by receiving parameter data collected by the detection device, thereby changing the airflow inside the first channel and the second channel.

2. The built-in radiation air conditioning system of a cavity floor according to claim 1, characterized in that: The heat exchange device is a combined structure, comprising: A radiation plate, wherein the radiation plate is arranged in the first channel and is fixedly connected to the cavity floor; A semiconductor refrigeration plate, wherein the temperature regulating end of the semiconductor refrigeration plate is connected to the radiation plate through a heat conducting member, and the heat dissipation end is located in the second channel and is connected to the control device via an electrical signal.

3. The built-in radiation air conditioning system of a cavity floor according to claim 2, characterized in that: The first channel and the second channel are interconnected, and a third control valve is arranged at the junction of the two channels. A liquid collecting channel is arranged in the first channel and the second channel, and the liquid collecting channel is connected to the outside.

4. The built-in radiation air conditioning system for cavity floor according to claim 3, characterized in that: The radiation plate and the semiconductor refrigeration sheet are coated with a polymer water-proof coating.

5. The built-in radiation air conditioning system for cavity floor according to claim 4, characterized in that: The detection device includes: a temperature detector and a humidity detector.

6. The cavity floor built-in radiation air conditioning system according to claim 5, characterized in that: The control device includes: A signal acquisition module, which is electrically connected to the detection device, obtains the temperature and humidity information of the indoor, outdoor, first channel and second channel collected by the detection device, and converts the format into an internal identification signal; A processing module, wherein the processing module processes the signal converted by the received signal acquisition module to generate an execution signal; An execution module, wherein the execution module receives an execution signal from the processing module and controls the heat exchange device, the first ventilation device, the second ventilation device, the first control valve, the second control valve and the third control valve to generate corresponding actions; The wireless signal transmission module is electrically connected to the processing module and wirelessly connected to the external terminal. It sends the command changes in the processing module to the terminal, receives the command information sent by the terminal, and feeds back to the processing module.

7. A control method for a built-in radiation air conditioning system in a cavity floor, using a built-in radiation air conditioning system in a cavity floor as claimed in any one of claims 1 to 6, characterized in that: The following steps are involved: Step 1: Set various preset values ​​for the current system operation; Step 2: Obtain the temperature and humidity information of indoor, outdoor, first channel and second channel through the detection device, and compare it with the system preset value to generate an active dynamic mark; Step 3: According to the active dynamic mark, the control device changes the working states of the heat exchange device, the first ventilation device, the second ventilation device, the first control valve, the second control valve and the third control valve according to the preset mode until the active dynamic mark is consistent with the preset value and stops running.

8. The control method of a cavity floor built-in radiation air conditioning system according to claim 7, characterized in that: The preset values ​​in step 1 include: temperature in the first channel, humidity in the first channel, temperature in the second channel, humidity in the second channel, indoor temperature and indoor humidity.

9. The control method of a cavity floor built-in radiation air conditioning system according to claim 7, characterized in that: The active dynamic mark in step 2 includes: A first dynamic mark, wherein the first dynamic mark indicates that the heat exchange device is in cooling mode; A second dynamic mark, wherein the second dynamic mark indicates that the heat exchange device is in heating mode; A third dynamic indicator, wherein the temperature and humidity in the first channel are lower than a preset value; A fourth dynamic indicator, wherein the temperature and humidity in the first channel are higher than a preset value; A fifth dynamic indicator, wherein the temperature and humidity in the second channel are lower than a preset value; A sixth dynamic indicator, wherein the temperature and humidity in the second channel are higher than a preset value; A seventh dynamic indicator, wherein the seventh dynamic indicator is that the indoor temperature and humidity are higher than a preset value; The eighth dynamic mark is that the indoor temperature and humidity are lower than a preset value.

10. The control method of a cavity floor built-in radiation air conditioning system according to claim 7, characterized in that: In step 3, according to the active dynamic mark, the control device changes the working states of the heat exchange device, the first ventilation device, the second ventilation device, the first control valve, the second control valve and the third control valve according to the preset mode: According to the first dynamic mark and the second dynamic mark, the processing module sends an instruction to the execution module, thereby switching the current flow to the heat exchange device, thereby switching the cooling and heating modes; According to the third dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to reduce the current input to the heat exchange device, and opens the third control valve to allow the gas in the second channel to enter, while increasing the air intake of the first ventilation device, so that the temperature in the first channel increases until the third dynamic mark is consistent with the preset value; in the heating mode, the processing module sends an instruction to the execution module to increase the current input to the heat exchange device, and at this time closes the third control valve, reduces the air intake of the first ventilation device, and increases the temperature in the first channel until the third dynamic mark is consistent with the preset value; According to the fourth dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to increase the current input to the heat exchange device, close the third control valve, and reduce the air intake of the first ventilation device, so that the temperature in the first channel is reduced until the third dynamic mark is consistent with the preset value; in the heating mode, the processing module sends an instruction to the execution module to reduce the current input to the heat exchange device, and at this time, the third control valve is opened, the air intake of the first ventilation device is increased, and the temperature in the first channel is reduced until the third dynamic mark is consistent with the preset value; According to the fifth dynamic mark, in the heating mode, the processing module sends a command to the execution module to open the second control valve, increase the air intake of the second ventilation device in the second channel, thereby increasing the temperature in the second channel until the fifth dynamic mark is consistent with the preset value; According to the sixth dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to open the second control valve, increase the air intake of the second ventilation device in the second channel, thereby reducing the temperature in the second channel until the fifth dynamic mark is consistent with the preset value; According to the seventh dynamic mark, in the cooling mode, the processing module sends an instruction to the execution module to increase the current input to the heat exchange device, close the third control valve, and reduce the air intake of the first ventilation device, so that the indoor temperature is reduced until the seventh dynamic mark is consistent with the preset value; in the heating mode, the processing module sends an instruction to the execution module to reduce the current input to the heat exchange device, and at this time, the third control valve is opened, the air intake of the first ventilation device is increased, and the indoor temperature is reduced until the seventh dynamic mark is consistent with the preset value; According to the eighth dynamic mark, in the cooling mode, the processing module sends a command to the execution module to reduce the current input to the heat exchange device and open the third control valve, while increasing the air intake of the first ventilation device to increase the indoor temperature until the eighth dynamic mark is consistent with the preset value; in the heating mode, the processing module sends a command to the execution module to increase the current input to the heat exchange device, at which time the third control valve is closed, and the air intake of the first ventilation device is reduced to increase the indoor temperature until the eighth dynamic mark is consistent with the preset value.

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