System and method for measuring gap between chip carrier plates up and down

Abstract

The embodiment of the invention discloses a system and a method for measuring a gap between chip support plates up and down, and the method comprises the steps: respectively measuring the distance from an upper range finder to a lower range finder, the distance from the lower surface of an upper support plate to the lower range finder, and the distance from the upper surface of a lower support plate to the upper range finder through the upper range finder and the lower range finder which are correspondingly arranged up and down; the gap distance between the upper carrier plate and the lower carrier plate is indirectly calculated without penetrating the light beam of the range finder through the upper carrier plate or the lower carrier plate, so that the problem that the gap distance between the upper carrier plate and the lower carrier plate cannot be measured due to the fact that the light beam of the range finder cannot penetrate through the upper carrier plate or the lower carrier plate is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of distance detection, and in particular to a system and method for measuring the gap between chip carriers from top to bottom. Background Art

[0002] Micro LED technology is considered to be the next generation of display technology in the field of consumer electronics. Its outstanding features such as high resolution, fast response, low energy consumption, and long life can meet the needs of ultra-small and ultra-large displays, showing great application potential. After the Micro LED light-emitting chips are prepared, tens of thousands to hundreds of thousands of Micro LED light-emitting chips need to be transferred from the transient substrate to the driver circuit board to form an LED array. This process is called "mass transfer."

[0003] The current method of mass transfer is to adhere all the chips to the same membrane, and a temporary substrate carries the membrane above the driver circuit board, and a laser device emits a laser to knock down the chips adhered to the membrane and drop them onto the driver circuit board. In this process, it is necessary to measure and control the gap distance between the temporary substrate and the driver circuit board to achieve a stable chip transfer effect. Specifically, the larger the gap distance between the temporary substrate and the driver circuit board, the greater the drop height of the chip after peeling off. During the drop process, it is easy to be affected by airflow or various factors, and position offset, angle deflection, and core flipping problems; conversely, if the gap distance between the temporary substrate and the driver circuit board is too small, the chip will easily rebound or have other problems when it falls, resulting in poor transfer effect.

[0004] In order to measure the gap distance between the transient substrate and the driver circuit board in the prior art, the ranging beam of the rangefinder needs to pass through the transient substrate to capture the value. For some transient substrates with dense chips or membranes with special adhesive layers, the ranging beam cannot pass through the dense chips and the special adhesive layer to capture the value, resulting in the inability to measure the gap distance between the transient substrate and the driver circuit board, and the chip transfer effect is unstable. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a system and method for measuring the gap between chip carriers from top to bottom, so as to solve the problem that in order to measure the gap distance between a transient substrate and a driving circuit board in the prior art, a ranging beam of a rangefinder needs to pass through the transient substrate to capture a value. For some transient substrates with dense chips or membranes with a special adhesive layer, the ranging beam cannot pass through the dense chips and the special adhesive layer to capture the value, resulting in the inability to measure the gap distance between the transient substrate and the driving circuit board, and the disadvantage of unstable chip transfer effect.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] In a first aspect, an embodiment of the present invention provides a system for measuring the gap between chip carriers from top to bottom, which is used to measure the gap distance between an upper loading board and a downloading board, and includes: an upper distance meter and a lower distance meter respectively arranged above and below, the upper distance meter is used to obtain the distance from the upper distance meter to the upper surface of the downloading board, and the lower distance meter is used to obtain the distance from the lower distance meter to the lower surface of the upper loading board.

[0008] Furthermore, it also includes a distance measuring adjustment component, which is used to adjust the relative position and relative angle between the upper distance meter and the lower distance meter.

[0009] Furthermore, it also includes a carrier plate adjustment component, which is used to adjust the relative position and relative angle between the upper loading plate and the lower loading plate.

[0010] Furthermore, the distance measuring adjustment component comprises an upper distance measuring adjustment platform, the upper distance measuring instrument is slidably mounted on the upper distance measuring adjustment platform along a vertical direction, and the upper distance measuring adjustment platform is used to control the upper distance measuring instrument to rise or fall vertically.

[0011] Furthermore, the distance measuring adjustment component includes a lower distance measuring adjustment platform, the lower distance measuring adjustment platform includes a vertical adjustment seat and a five-axis mirror frame, the five-axis mirror frame is installed on the upper side of the vertical adjustment seat, and the lower rangefinder is installed on the upper side of the five-axis mirror frame.

[0012] Furthermore, it also includes a controller, and the upper rangefinder, the lower rangefinder, the distance adjustment component, and the carrier plate adjustment component are all electrically connected to the controller.

[0013] In a second aspect, an embodiment of the present invention provides a method for measuring the gap between a chip carrier and a substrate, the method being applied to a system for measuring the gap between a chip carrier and a substrate as described above, the method comprising the following steps:

[0014] Adjust the ranging light spot of the upper rangefinder to be vertically aligned with the ranging light spot of the lower rangefinder;

[0015] Inserting a calibration plate of a preset thickness between the upper rangefinder and the lower rangefinder, and calculating the distance from the upper rangefinder to the lower rangefinder;

[0016] Inserting an upper loading board and a downloading board between the upper rangefinder and the lower rangefinder to obtain the distance from the upper rangefinder to the upper surface of the downloading board and the distance from the lower rangefinder to the lower surface of the upper loading board;

[0017] The distance between the upper rangefinder and the lower rangefinder, the distance between the upper rangefinder and the upper surface of the download board, and the distance between the lower rangefinder and the lower surface of the upper upload board are obtained, and the gap distance between the upper upload board and the download board is calculated.

[0018] Furthermore, the step of inserting a calibration plate of a preset thickness between the upper rangefinder and the lower rangefinder to calculate the distance from the upper rangefinder to the lower rangefinder comprises the following steps:

[0019] Obtaining the distance from the upper rangefinder to the upper surface of the calibration plate;

[0020] Obtaining the distance from the lower rangefinder to the lower surface of the calibration plate;

[0021] The preset thickness of the calibration plate, the distance from the upper rangefinder to the upper surface of the calibration plate, and the distance from the lower rangefinder to the lower surface of the calibration plate are calculated to obtain the spacing from the upper rangefinder to the lower rangefinder.

[0022] Further, the distance between the upper rangefinder and the lower rangefinder, the distance between the upper rangefinder and the upper surface of the download board, and the distance between the lower rangefinder and the lower surface of the upper upload board are obtained, and the gap distance between the upper upload board and the download board is calculated according to the following formula:

[0023] H = B + CA;

[0024] Among them, H is the gap distance between the upper upload board and the download board, A is the distance from the upper rangefinder to the lower rangefinder, B is the distance from the upper rangefinder to the upper surface of the download board, and C is the distance from the lower rangefinder to the lower surface of the upper upload board.

[0025] Furthermore, after the upper loading board and the downloading board are inserted between the upper rangefinder and the lower rangefinder to obtain the distance from the upper rangefinder to the upper surface of the downloading board and the distance from the lower rangefinder to the lower surface of the upper loading board, the following steps are included:

[0026] Controlling the upper distance meter to measure the distances between multiple points on the upper surface of the download board, and fitting to form a download board plane function;

[0027] Controlling the lower distance meter to measure the distances between multiple points on the lower surface of the upper loading plate, and fitting to form a plane function of the upper loading plate;

[0028] Calculate the angle between the upload board plane function and the download board plane function;

[0029] The relative angle between the upper upload board and the download board is adjusted according to the angle between the plane function of the upper upload board and the plane function of the download board, so that the upper upload board is parallel to the download board.

[0030] Compared with the prior art, the system and method for measuring the gap between chip carriers from top to bottom of the present invention respectively measures the distance from the upper rangefinder to the lower rangefinder, the distance from the lower surface of the upper loading board to the lower rangefinder, and the distance from the upper surface of the downloading board to the upper rangefinder through the upper rangefinder and the lower rangefinder correspondingly arranged above and below, and indirectly calculates the gap distance between the two without requiring the rangefinder beam to penetrate the upper loading board or the downloading board, thus solving the problem that the rangefinder beam cannot penetrate the upper loading board or the downloading board, resulting in the inability to measure and obtain the gap distance between the upper loading board and the downloading board.

[0031] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0033] Figure 1 It is a first three-dimensional structural schematic diagram of a system for measuring the gap between chip carriers from top to bottom according to the present invention;

[0034] Figure 2 A second three-dimensional structural schematic diagram of a system for measuring the gap between chip carriers from top to bottom according to the present invention;

[0035] Figure 3 A side view of a system for measuring the gap between a chip carrier and a substrate from top to bottom according to the present invention;

[0036] Figure 4 A schematic diagram of a first state of a system for measuring the gap between chip carriers from top to bottom according to the present invention;

[0037] Figure 5 A schematic diagram of a second state of a system for measuring the gap between chip carriers from top to bottom according to the present invention;

[0038] Figure 6 It is a schematic diagram of the cooperation structure of a lower distance meter and a lower distance measuring adjustment platform of a system for measuring the gap between upper and lower chip carriers of the present invention;

[0039] Figure 7 It is a schematic diagram of the cooperation structure of another lower distance meter and a lower distance measuring adjustment platform of a system for measuring the gap between upper and lower chip carriers of the present invention;

[0040] Figure 8A schematic diagram of a process of measuring the gap between chip carriers from top to bottom according to the present invention;

[0041] Fig. 9 A schematic diagram of a sub-process of a method for measuring the gap between chip carriers from top to bottom according to the present invention;

[0042] Fig.10 It is another sub-process diagram of a method for measuring the gap between chip carriers from top to bottom according to the present invention;

[0043] Description of the symbols in the figure:

[0044] 1. Upper rangefinder; 2. Lower rangefinder; 3. Upper rangefinder adjustment platform; 4. Lower rangefinder adjustment platform; 41. Vertical adjustment seat; 42. Five-axis mirror frame; 5. Upper loading board; 6. Download board. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0049] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0052] See also Figures 1 to 4The embodiment of the present invention discloses a system for measuring the gap between chip carriers from top to bottom, which is used to measure the gap distance between the upper loading board and the downloading board, and includes: an upper rangefinder and a lower rangefinder which are arranged correspondingly from top to bottom, the upper rangefinder is used to obtain the distance from the upper rangefinder to the upper surface of the downloading board, and the lower rangefinder is used to obtain the distance from the lower rangefinder to the lower surface of the upper loading board. It should be explained that the rangefinder in the prior art is generally placed on one side, and the ranging beam of the rangefinder needs to pass through the upper loading board to capture the value of the downloading board during the ranging process. In some cases, the ranging beam cannot pass through the upper loading board, resulting in the rangefinder being unable to measure and obtain the gap distance between the upper loading board and the downloading board. Based on this, in this embodiment, the distance from the upper rangefinder to the upper surface of the downloading board and the distance from the lower rangefinder to the lower surface of the upper loading board are measured respectively by the upper rangefinder and the lower rangefinder which correspond to each other from top to bottom, thereby avoiding the situation in the prior art where the ranging beam of the rangefinder needs to pass through the loading board, so that the gap distance between the upper loading board and the downloading board can be smoothly calculated according to the measurement results of the upper rangefinder and the lower rangefinder. Optionally, the upper rangefinder and the lower rangefinder may be of the same model or of different models.

[0053] Furthermore, it also includes a distance measuring adjustment component, which is used to adjust the relative position and relative angle between the upper distance meter and the lower distance meter.

[0054] Specifically, the distance measuring adjustment component includes an upper distance measuring adjustment platform, on which the upper distance measuring instrument is slidably mounted in a vertical direction, and the upper distance measuring adjustment platform is used to control the upper distance measuring instrument to rise or fall vertically. Optionally, the upper distance measuring adjustment platform is a Z-axis lifting device, and the upper distance measuring instrument is connected to a moving part of the upper distance measuring adjustment platform, so that the upper distance measuring instrument can be driven to rise or fall by the upper distance measuring adjustment platform.

[0055] Specifically, the distance measuring adjustment component includes a lower distance measuring adjustment platform, and the lower distance measuring adjustment platform includes a vertical adjustment seat and a five-axis mirror frame. The five-axis mirror frame is installed on the upper side of the vertical adjustment seat, and the lower rangefinder is installed on the upper side of the five-axis mirror frame. It should be explained that the vertical adjustment seat is used to fine-tune the height of the five-axis mirror frame in the Z-axis direction. The five-axis mirror frame has a mounting portion, and the mounting portion has five degrees of freedom, which can move along the X-axis and Y-axis and rotate around the X-axis, Y-axis, and Z-axis. Optionally, the lower distance measuring adjustment platform is connected to the X-axis moving module and the Y-axis moving module. It can be understood that the specific structures of the vertical adjustment seat and the five-axis mirror frame belong to the prior art and will not be repeated here.

[0056] Furthermore, it also includes a carrier adjustment component, which is used to adjust the relative position and angle between the upper loading board and the downloading board. It should be explained that the carrier adjustment component should have the function of adjusting the upper loading board and the downloading board to be relatively parallel, so that the chip on the upper loading board can fall stably and accurately onto the downloading board.

[0057] Furthermore, it also includes a controller, and the upper rangefinder, the lower rangefinder, the distance adjustment component, and the carrier adjustment component are all electrically connected to the controller. The controller is used to receive and analyze and process the signal information transmitted by the upper rangefinder and the lower rangefinder, and control the distance adjustment component and the carrier adjustment component to work based on this.

[0058] In a second aspect, an embodiment of the present invention provides a method for measuring the gap between a chip carrier and a substrate, the method being applied to a system for measuring the gap between a chip carrier and a substrate as described above, the method comprising the following steps:

[0059] S10, adjusting the ranging light spot of the upper rangefinder to be vertically aligned with the ranging light spot of the lower rangefinder;

[0060] S20, inserting a calibration plate of a preset thickness between the upper rangefinder and the lower rangefinder, and calculating the distance from the upper rangefinder to the lower rangefinder;

[0061] S30, inserting an upper loading board and a downloading board between the upper rangefinder and the lower rangefinder to obtain a distance from the upper rangefinder to the upper surface of the downloading board and a distance from the lower rangefinder to the lower surface of the upper loading board;

[0062] S40, obtaining the distance between the upper rangefinder and the lower rangefinder, the distance between the upper rangefinder and the upper surface of the download board, and the distance between the lower rangefinder and the lower surface of the upper upload board, and calculating the gap distance between the upper upload board and the download board.

[0063] In this embodiment, first, by adjusting the position and angle of the upper rangefinder and the lower rangefinder, it is ensured that the ranging spots of the two are precisely aligned in the vertical direction, so that the upper rangefinder and the lower rangefinder are vertically aligned, so as to ensure that the ranging beam can accurately point to the target surface in the subsequent measurement process to avoid measurement errors. Then, a calibration plate of preset thickness is inserted between the upper rangefinder and the lower rangefinder, and the distance from the upper rangefinder to the upper surface of the calibration plate and the distance from the lower rangefinder to the lower surface of the calibration plate are measured respectively. According to these two measured values ​​and the known thickness of the calibration plate, the actual spacing between the upper rangefinder and the lower rangefinder can be calculated. This step is a key reference for the subsequent calculation of the gap distance. Optionally, the calibration plate can be an upload plate or a download plate. Next, the upper upload board and the download board are sent between the upper rangefinder and the lower rangefinder, and the distance from the upper rangefinder to the upper surface of the download board and the distance from the lower rangefinder to the lower surface of the upper upload board are measured respectively. These two measured values ​​will be directly used for the subsequent calculation of the gap distance. It should be explained that the ranging beam of the upper rangefinder is directly irradiated to the download board, and the ranging beam of the lower rangefinder is directly irradiated to the upper upload board. Finally, the gap distance between the upper upload board and the download board can be calculated based on the distance from the upper rangefinder to the download board, the distance from the lower rangefinder to the upper upload board, and the distance from the upper rangefinder to the lower rangefinder obtained in the previous steps. The design of the upper and lower dual rangefinders avoids the problem of the ranging beam being blocked by obstacles, thereby improving the accuracy and reliability of the measurement.

[0064] Further, the step S20 includes the following steps S21-S23:

[0065] S21, obtaining the distance from the upper rangefinder to the upper surface of the calibration plate;

[0066] S22, obtaining the distance from the lower rangefinder to the lower surface of the calibration plate;

[0067] S23, calculating the sum of the preset thickness of the calibration plate, the distance from the upper rangefinder to the upper surface of the calibration plate, and the distance from the lower rangefinder to the lower surface of the calibration plate to obtain the spacing from the upper rangefinder to the lower rangefinder.

[0068] In this embodiment, the upper distance meter and the lower distance meter respectively measure the distance to the upper and lower surfaces of the calibration plate, and combined with the known thickness of the calibration plate, the actual distance between the upper distance meter and the lower distance meter can be indirectly calculated, and the use of the calibration plate can eliminate or reduce the influence of the distance meter installation position error and insufficient measurement accuracy on the measurement benchmark, thereby improving the accuracy of the entire measurement system. In other embodiments, the distance between the upper distance meter and the lower distance meter can also be directly measured using physical means such as ruler measurement.

[0069] Furthermore, in step S40, the gap distance between the upload board and the download board is calculated according to the following formula:

[0070] H = B + CA;

[0071] Wherein, H is the gap distance between the upper upload board and the download board, A is the distance between the upper rangefinder and the lower rangefinder, B is the distance from the upper rangefinder to the upper surface of the download board, and C is the distance from the lower rangefinder to the lower surface of the upper upload board. In this embodiment, by directly using the measurement data for calculation, the error that may be introduced by indirect deduction or estimation is avoided, thereby improving the accuracy of the gap distance measurement.

[0072] Further, after step S30, the following steps S50-S53 are included:

[0073] S50, controlling the upper distance meter to measure the distances between multiple points on the upper surface of the download board, and fitting to form a download board plane function;

[0074] S51, controlling the lower distance meter to measure the distances between multiple points on the lower surface of the upper loading plate, and fitting to form a plane function of the upper loading plate;

[0075] S52, calculating and obtaining the angle between the plane function of the upload board and the plane function of the download board;

[0076] S53, adjusting the relative angle between the upload board and the download board according to the angle between the plane function of the upload board and the plane function of the download board, so that the upload board is parallel to the download board.

[0077] It should be explained that the above steps S50-S53 are arranged between steps S30 and S40. First, the upper loading board and the downloading board are relatively leveled to more accurately measure the distance between them, and also make the chip transfer more stable and accurate. In this embodiment, the upper rangefinder measures the spacing between multiple points on the upper surface of the downloading board. The point spacing here refers to the distance from the upper rangefinder to the point. These points are evenly distributed on the board to ensure that the fitted plane function can accurately reflect the actual shape of the downloading board. Preferably, the upper rangefinder measures the spacing between 16 points on the upper surface of the downloading board, and these 16 points are arranged in a matrix on the upper surface of the downloading board. The lower rangefinder measures the spacing between multiple points on the lower surface of the upper loading board. The point spacing here refers to the distance from the lower rangefinder to the point. Preferably, the lower rangefinder measures the spacing between 16 points on the lower surface of the upper loading board, and these 16 points are arranged in a matrix on the lower surface of the upper loading board. This embodiment can significantly improve the parallelism between the upload board and the download board through precise measurement and calculation, combined with an automated adjustment mechanism, to meet the needs of high-precision manufacturing and testing. Under the premise that parallelism is guaranteed, subsequent operations such as gap distance measurement will be more accurate and reliable, reducing errors introduced by parallelism deviation.

[0078] Compared with the prior art, the system and method for measuring the gap between chip carriers from top to bottom of the present invention respectively measures the distance from the upper rangefinder to the lower rangefinder, the distance from the lower surface of the upper loading board to the lower rangefinder, and the distance from the upper surface of the downloading board to the upper rangefinder through the upper rangefinder and the lower rangefinder correspondingly arranged above and below, and indirectly calculates the gap distance between the two without requiring the rangefinder beam to penetrate the upper loading board or the downloading board, thus solving the problem that the rangefinder beam cannot penetrate the upper loading board or the downloading board, resulting in the inability to measure and obtain the gap distance between the upper loading board and the downloading board.

[0079] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A system for measuring the gap between upper and lower chip carriers, used to measure the gap distance between the upper loading board and the lower loading board, characterized in that: include: An upper rangefinder and a lower rangefinder are arranged correspondingly above and below, wherein the upper rangefinder is used to obtain the distance from the upper rangefinder to the upper surface of the download board, and the lower rangefinder is used to obtain the distance from the lower rangefinder to the lower surface of the upper upload board.

2. A system for measuring the gap between a chip carrier and a substrate as claimed in claim 1, characterized in that: It also includes a distance measuring adjustment component, which is used to adjust the relative position and relative angle between the upper distance meter and the lower distance meter.

3. A system for measuring the gap between chip carriers from top to bottom according to claim 2, characterized in that: It also includes a carrier plate adjustment component, which is used to adjust the relative position and relative angle between the upper loading plate and the lower loading plate.

4. The system for measuring the gap between chip carriers from top to bottom according to claim 2, characterized in that: The distance measuring adjustment assembly comprises an upper distance measuring adjustment platform, on which the upper distance measuring instrument is slidably mounted in a vertical direction, and the upper distance measuring adjustment platform is used to control the upper distance measuring instrument to rise or fall vertically.

5. The system for measuring the gap between chip carriers from top to bottom according to claim 2, characterized in that: The distance measuring adjustment component comprises a lower distance measuring adjustment platform, and the lower distance measuring adjustment platform comprises a vertical adjustment seat and a five-axis frame, the five-axis frame is installed on the upper side of the vertical adjustment seat, and the lower rangefinder is installed on the upper side of the five-axis frame.

6. The system for measuring the gap between chip carriers from top to bottom according to claim 3, characterized in that: It also includes a controller, and the upper rangefinder, the lower rangefinder, the distance adjustment component, and the carrier plate adjustment component are all electrically connected to the controller.

7. A method for measuring the gap between a chip carrier and a substrate, characterized in that: The method is applied to a system for measuring the gap between upper and lower chip carriers as claimed in any one of claims 1 to 6, and the method comprises the following steps: Adjust the ranging light spot of the upper rangefinder to be vertically aligned with the ranging light spot of the lower rangefinder; Inserting a calibration plate of a preset thickness between the upper rangefinder and the lower rangefinder, and calculating the distance from the upper rangefinder to the lower rangefinder; Inserting an upper loading board and a downloading board between the upper rangefinder and the lower rangefinder to obtain the distance from the upper rangefinder to the upper surface of the downloading board and the distance from the lower rangefinder to the lower surface of the upper loading board; The distance between the upper rangefinder and the lower rangefinder, the distance between the upper rangefinder and the upper surface of the download board, and the distance between the lower rangefinder and the lower surface of the upper upload board are obtained, and the gap distance between the upper upload board and the download board is calculated.

8. The method for measuring the gap between chip carriers from top to bottom according to claim 7, characterized in that: The step of inserting a calibration plate of preset thickness between the upper rangefinder and the lower rangefinder and calculating the distance from the upper rangefinder to the lower rangefinder comprises the following steps: Obtaining the distance from the upper rangefinder to the upper surface of the calibration plate; Obtaining the distance from the lower rangefinder to the lower surface of the calibration plate; The preset thickness of the calibration plate, the distance from the upper rangefinder to the upper surface of the calibration plate, and the distance from the lower rangefinder to the lower surface of the calibration plate are calculated to obtain the spacing from the upper rangefinder to the lower rangefinder.

9. The method for measuring the gap between chip carriers from top to bottom according to claim 7, characterized in that: In the step of obtaining the distance between the upper rangefinder and the lower rangefinder, the distance between the upper rangefinder and the upper surface of the download board, and the distance between the lower rangefinder and the lower surface of the upper upload board, and calculating the gap distance between the upper upload board and the download board, the gap distance between the upper upload board and the download board is calculated according to the following formula: H = B + CA; Among them, H is the gap distance between the upper upload board and the download board, A is the distance from the upper rangefinder to the lower rangefinder, B is the distance from the upper rangefinder to the upper surface of the download board, and C is the distance from the lower rangefinder to the lower surface of the upper upload board.

10. The method for measuring the gap between chip carriers from top to bottom according to claim 7, characterized in that: After the upper loading board and the downloading board are inserted between the upper rangefinder and the lower rangefinder to obtain the distance from the upper rangefinder to the upper surface of the downloading board and the distance from the lower rangefinder to the lower surface of the upper loading board, the following steps are included: Controlling the upper distance meter to measure the distances between multiple points on the upper surface of the download board, and fitting to form a download board plane function; Controlling the lower distance meter to measure the distances between multiple points on the lower surface of the upper loading plate, and fitting to form a plane function of the upper loading plate; Calculate the angle between the upload board plane function and the download board plane function; The relative angle between the upper upload board and the download board is adjusted according to the angle between the plane function of the upper upload board and the plane function of the download board, so that the upper upload board is parallel to the download board.

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