Capacitor electrical aging treatment support plate device

Abstract

The invention relates to a carrier plate device for electric aging treatment of a capacitor, and belongs to the technical field of capacitors. Comprising an upper board, a first PCB, an FPC board, a second PCB and a lower board which are sequentially arranged from top to bottom, the lower surface of the first PCB is provided with a conductive copper plate, the conductive copper plate is provided with a plurality of first conductive spring probes and second conductive spring probes, the FPC board is provided with accommodating holes which are in one-to-one correspondence with the first conductive spring probes, the accommodating holes are used for loading capacitor products, and the second PCB is provided with a plurality of second conductive spring probes. A printed circuit is arranged on the upper surface of the second PCB, a conductor is plated on the printed circuit, a golden finger is arranged on one side of the second PCB, and a conductive contact communicated with the second conductive spring probe is arranged on the upper surface of the second PCB. According to the invention, an electrical aging screening test is carried out, so that the screening efficiency and the screening accuracy are greatly improved.

Description

Technical Field

[0001] The invention relates to a capacitor electrical aging treatment carrier device, belonging to the technical field of capacitors. Background Art

[0002] As an important component of electronic components, the performance stability of capacitors is crucial to the normal operation of the circuit. The finished capacitors usually need to undergo ceramic aging tests to screen out defective products and ensure the reliability of the final circuit.

[0003] At present, in the prior art, my country's invention patent application number: 201910451050.4 discloses a capacitor carrier box and a method for capacitor testing and aging using the carrier box. The capacitor carrier box has an upper plate and a bottom plate, and a receiving hole for placing the capacitor is provided on the upper plate; an upper electrode corresponding to the position of the receiving hole is provided on the top of the bottom plate, and a lower electrode corresponding to the upper electrode is provided at the bottom of the bottom plate. When in use, first, the capacitor to be tested is placed in the receiving hole of the capacitor carrier box; when testing, the capacitor carrier box containing the capacitor is placed on the test station, and the capacitor is connected to the test table for testing by controlling the test contacts to contact the upper electrode of the capacitor and the lower electrode of the capacitor carrier box respectively; when aging, the capacitor carrier box containing the capacitor is installed on the aging board, and the aging board is inserted into the aging machine to power and heat the capacitor for aging. However, this capacitor carrier box cannot be electrically aged alone. In addition, for capacitors with special structures, such as products with upper and lower electrodes, and the product thickness is extremely thin, the product needs to be electrically aged, and the traditional loading plate is difficult to effectively carry and conduct electricity.

[0004] Therefore, there is an urgent need for a carrier that can effectively carry the above-mentioned special structure capacitors and has conductivity and reduces the difficulty of personnel operation, so as to achieve convenient screening during the electrical aging process and improve the efficiency of ceramic aging tests. Summary of the invention

[0005] The present invention proposes a capacitor electrical aging treatment carrier board device, the purpose of which is to design a capacitor electrical aging treatment carrier board device that has both conductivity and reduces the difficulty of personnel operation, so as to achieve convenient screening during the electrical aging process and improve the efficiency of the aging test.

[0006] The technical solution adopted by the present invention is a capacitor electrical aging treatment carrier device, including an upper plate, a first PCB board, an FPC board, a second PCB board and a lower plate from top to bottom, wherein a conductive copper plate is provided on the lower surface of the first PCB board, a plurality of first conductive spring probes and second conductive spring probes are provided on the conductive copper plate, the FPC board is provided with accommodating holes corresponding to the first conductive spring probes one by one, the accommodating holes are used to load capacitor products, a printed circuit is provided on the upper surface of the second PCB board, a conductor is plated on the printed circuit, a gold finger is provided on one side of the second PCB board, and a conductive contact for connecting with the second conductive spring probe is provided on the upper surface of the second PCB board.

[0007] Furthermore, the diameter of the needle tip of the first conductive spring probe is larger than the diameter of the accommodating hole.

[0008] Furthermore, a guide column is provided on the upper surface of the second PCB board, and the guide column passes through the first PCB board and the upper board in sequence.

[0009] Furthermore, the upper plate, the first PCB board, the second PCB board and the lower plate are all provided with screw holes, and the upper plate, the first PCB board, the second PCB board and the lower plate are connected together by a bolt assembly.

[0010] Furthermore, a fuse connected to the printed circuit is provided on the other upper surface of the second PCB board.

[0011] Furthermore, the upper plate and the first PCB board are bonded together, and the lower plate and the second PCB board are fixed together by screws.

[0012] Furthermore, the upper plate and the lower plate are made of insulating and high-temperature resistant materials.

[0013] Furthermore, the upper plate and the lower plate are both bakelite plates.

[0014] The present invention discloses a capacitor electrical aging treatment carrier device, which has the beneficial effect that the present invention realizes the connection and aging of the capacitor through a multi-layer carrier. The first conductive spring probe contacts the capacitor product, the second conductive spring probe contacts the conductive contact, the bottom of the capacitor product contacts the conductor, and the gold finger is inserted into the socket to complete the circuit connection, so as to realize convenient screening in the electrical aging process and improve the efficiency of the aging test. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 The figure shows a schematic top view of the upper plate in Example 1;

[0017] Figure 2 The figure shows a bottom view of the first PCB board in Embodiment 1;

[0018] Figure 3 The figure shows a bottom view of the FPC board in Example 1;

[0019] Figure 4 The figure shows a schematic top view of the second PCB board in Embodiment 1;

[0020] Figure 5 The figure shows a bottom view of the lower plate in Embodiment 1;

[0021] Figure 6 Shown is a schematic diagram of the guide post in Example 1;

[0022] Figure 7 Shown Figure 2 Schematic diagram of the first conductive spring probe.

[0023] As shown in the figure:

[0024] 1. Upper board; 2. First PCB board; 3. FPC board; 4. Second PCB board; 5. Lower board; 6. Conductive copper plate; 7. First conductive spring probe; 8. Second conductive spring probe; 9. Accommodation hole; 10. Screw hole; 11. Guide column; 12. Fuse; 13. Gold finger; 14. Conductive contact; 15. Conductor; 16. Printed circuit. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In order to solve the technical problem and to further understand the content of the present invention, this technical solution is further explained below in combination with specific implementation methods.

[0027] Example 1: Figures 1 to 7As shown, the present embodiment provides a capacitor electrical aging treatment carrier device, comprising an upper plate 1, a first PCB board 2, an FPC board 3, a second PCB board 4 and a lower plate 5, from top to bottom, wherein a conductive copper plate 6 is provided on the lower surface of the first PCB board 2, 200 first conductive spring probes 7 and 4 second conductive spring probes 8 are provided on the conductive copper plate 6, the FPC board 3 is provided with accommodating holes 9 corresponding to the first conductive spring probes 7, and the accommodating holes 9 are used to load capacitor products, a printed circuit 16 is provided on the upper surface of the second PCB board 4, and a conductor 15 is plated on the printed circuit 16, a gold finger 13 is provided on one side of the second PCB board 4, and four conductive contacts 14 are provided on the upper surface of the second PCB board 4, and when the first PCB board 2 is covered on the FPC board 3, the second conductive spring probes 8 are in contact with the conductive contacts 14. In order to ensure that the first conductive spring probe 7 is in good contact with the capacitor product in the receiving hole 9, a guide post 11 is provided on the upper surface of the second PCB board 4. Guide holes are reserved on the first PCB board 2 and the upper board 1. The guide post 11 passes through the guide holes of the first PCB board 2 and the upper board 1 in sequence. The guide post 11 plays a role in guiding and positioning. The guide post 11 cooperates with the guide hole to achieve rapid installation and positioning. The needle tip diameter of the first conductive spring probe 7 is larger than the diameter of the receiving hole 9, so that the first conductive spring probe 7 cannot pass through the receiving hole 9. The first conductive spring probe 7 is provided to avoid wear of the capacitor product during aging screening.

[0028] The upper plate 1, the first PCB board 2, the second PCB board 4 and the lower plate 5 are all provided with screw holes 10. The lower plate 5, the second PCB board 4, the FPC board 3, the first PCB board 2 and the upper plate 1 are sequentially installed from bottom to top and connected together by bolt assemblies.

[0029] Furthermore, a fuse 12 connected to the printed circuit 16 is disposed on the other upper surface of the second PCB board 4 to provide a safety guarantee for the electrical aging process.

[0030] The upper plate 1 and the lower plate 5 are made of insulating and high temperature resistant materials. As a specific implementation in this embodiment, the upper plate 1 and the lower plate 5 are both bakelite plates. During the aging operation, the test voltage is maintained at 10-25V, the temperature is 25°-150° for heating and power aging, and the plate is taken out after being placed for 48h or 96h.

[0031] Example 2: Figures 1 to 7 As shown, on the basis of Example 1, the upper plate 1 and the first PCB board 2 are bonded together, and the lower plate 5 and the second PCB board 4 are fixed together by screws.

[0032] like Figures 1 to 7As shown, taking Example 2 as an example, the capacitor product is placed in the receiving hole 9 of the FPC board 3, and then the first PCB board 2 and the upper board 1 are installed. At this time, the first conductive spring probe 7 contacts the capacitor product, the second conductive spring probe 8 contacts the conductive contact 14, the bottom of the capacitor product contacts the conductor 15, and the gold finger 13 is inserted into the socket to complete the circuit connection. The voltage is guaranteed to be 25V and the temperature is 150° for heating and electrical aging. After being placed for 96 hours, it is taken out, and after removing the first PCB board 2 and the upper board 1, it is observed whether the capacitor product is damaged under thermal stress and electrical stress. Aging screening of multiple capacitor products can be achieved at one time. The current is transmitted by the contact between the first conductive spring probe 7 and the capacitor product, and the circuit is connected by the contact between the second conductive spring probe 8 and the conductive contact 14, so that the capacitor product can achieve the electrical aging process. Thereby improving the efficiency of electrical aging screening and reducing the difficulty of manual operation.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A capacitor electrical aging treatment substrate device, characterized in that: The invention comprises an upper plate (1), a first PCB plate (2), an FPC plate (3), a second PCB plate (4) and a lower plate (5) arranged in sequence from top to bottom, wherein a conductive copper plate (6) is arranged on the lower surface of the first PCB plate (2), a plurality of first conductive spring probes (7) and second conductive spring probes (8) are arranged on the conductive copper plate (6), the FPC plate (3) is provided with accommodating holes (9) corresponding to the first conductive spring probes (7), the accommodating holes (9) are used to load capacitor products, a printed circuit (16) is arranged on the upper surface of the second PCB plate (4), a conductor (15) is plated on the printed circuit (16), a gold finger (13) is arranged on one side of the second PCB plate (4), and a conductive contact (14) for connecting with the second conductive spring probes (8) is arranged on the upper surface of the second PCB plate (4).

2. A capacitor electrical aging treatment substrate device according to claim 1, characterized in that: The diameter of the needle tip of the first conductive spring probe (7) is greater than the diameter of the accommodating hole (9).

3. A capacitor electrical aging treatment substrate device according to claim 1, characterized in that: A guide column (11) is provided on the upper surface of the second PCB board (4), and the guide column (11) passes through the first PCB board (2) and the upper board (1) in sequence.

4. A capacitor electrical aging treatment substrate device according to claim 3, characterized in that: The upper plate (1), the first PCB board (2), the second PCB board (4) and the lower plate (5) are all provided with screw holes (10), and the upper plate (1), the first PCB board (2), the second PCB board (4) and the lower plate (5) are connected together by a bolt assembly.

5. A capacitor electrical aging treatment substrate device according to claim 1, characterized in that: A fuse (12) connected to the printed circuit (16) is provided on the upper surface of the other side of the second PCB board (4).

6. A capacitor electrical aging treatment substrate device according to any one of claims 1 or 4, characterized in that: The upper plate (1) and the first PCB board (2) are bonded together, and the lower plate (5) and the second PCB board (4) are fixed together by screws.

7. A capacitor electrical aging treatment substrate device according to claim 1, characterized in that: The upper plate (1) and the lower plate (5) are made of insulating and high-temperature resistant materials.

8. A capacitor electrical aging treatment substrate device according to claim 7, characterized in that: The upper plate (1) and the lower plate (5) are both made of bakelite.

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