Reliability Testing Method and Reliability Testing Device for Encapsulated Devices

Abstract

The present invention relates to the field of wireless communication technologies, and provides a reliability test method and a reliability test device for a packaged device. The reliability test method includes the following steps: S1, prepare a staining agent; S2, semi-seal and heat the test chamber, maintain the relative humidity below a preset threshold, and keep it for 25 - 40 minutes; S3, perform a drying treatment on the device under test; S4, evaporate the staining agent into the test chamber through a heating pipeline, slowly increase the steam pressure in the test chamber to 180 - 210 kPa within 1 hour, and maintain the environmental temperature in the test chamber for 30 minutes; S5, after testing for a preset test time in the test chamber, slowly reduce the steam pressure in the test chamber to normal pressure within 1 hour, remove the device under test from the test chamber, and perform an external staining path analysis and an opening analysis on the removed device under test to obtain a reliability test result. The reliability test method for the packaged device of the present invention has a low experimental cost and a good reliability test effect.

Description

Technical Field

[0001] The present invention relates to the field of wireless communication technologies, and particularly to a reliability test method and a reliability test device for a packaged device. Background Art

[0002] Currently, as a core component in the fields of industrial automation, transportation, smart grid, new energy, etc., semiconductor devices have become a research hotspot for scientific research institutions and large and medium-sized high-tech enterprises. The moisture-proof reliability of semiconductor devices is a key parameter determining their lifespan, and research shows that 60% of semiconductor device failures are caused by poor internal moisture-proof performance.

[0003] The related detection methods for semiconductor device packaging generally detect through the GJB548B fluorinated oil leak detection method. Since the low-boiling-point fluorinated oil molecules are small, even tiny leak holes can be penetrated by them; if there are leak holes in the electronic device, when pressure is applied, the low-boiling-point fluorinated oil will enter the device interior. Since the boiling point of the low-boiling-point fluorinated oil is about 47°C, when exposed to a fluorinated oil with a high boiling point of about 125°C, the low-boiling-point fluorinated oil will quickly vaporize, resulting in a sharp rise in the pressure inside the device cavity. Therefore, the gas emerging through the leak holes will form bubbles emerging in the high-boiling-point fluorinated oil, and this phenomenon can be used as an obvious indicator of the existence of leak holes.

[0004] However, the above detection method requires additional imaging equipment or imaging measures to display the test results, and is only applicable to film and flip-chip packaged IC products. When there is a small leakage rate that cannot be visualized, the test accuracy is poor. Summary of the Invention

[0005] In view of the above deficiencies of the prior art, the present invention proposes a reliability test method for a packaged device to solve the problem of poor test accuracy of the existing reliability test method for packaged devices.

[0006] To solve the above technical problems, the present invention adopts the following technical solutions:

[0007] In a first aspect, an embodiment of the present invention provides a reliability test method for a packaged device, and the reliability test method includes the following steps:

[0008] S1. Use deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mix it with a chromosome and stir evenly to prepare a staining agent;

[0009] S2. Provide a test chamber, the test chamber is provided with through holes and is semi-sealed and heated to 90 - 100°C, keep the relative humidity lower than a preset threshold, and maintain for 25 - 40 min;

[0010] S3. Place the device under test into the test chamber through the through-hole and keep it for 25 - 40 minutes to perform a drying treatment on the device under test.

[0011] S4. Evaporate the dyeing agent into the test chamber through a heating pipeline to make the relative humidity in the test chamber reach 100%, the temperature reach 120 ± 2 °C, gradually increase the steam pressure in the test chamber to 180 - 210 kPa within 1 hour, and maintain the environmental temperature in the test chamber for 30 minutes.

[0012] S5. After a preset test time, gradually reduce the steam pressure in the test chamber to atmospheric pressure within 1 hour, then remove the device under test from the test chamber, perform an external dyeing path analysis and an open - cover analysis on the removed device under test, and obtain a reliability test result.

[0013] Preferably, in step S1, the chromosome is a solution with a concentration of 10% formed by a mixture and water, wherein the mixture is formed by mixing tetramethyl - para - rosaniline chloride, pentamethyl - para - rosaniline chloride, and hexamethyl - para - rosaniline chloride.

[0014] Preferably, in step S2, the preset threshold value of the relative humidity is 10%.

[0015] Preferably, in step S2, semi - seal the test chamber and heat it to 90 °C, keep the relative humidity lower than the preset threshold value, and maintain it for 30 minutes.

[0016] Preferably, in step S4, gradually increase the steam pressure in the test chamber to 205 kPa within 1 hour.

[0017] Preferably, in step S5, the preset test time t satisfies the following conditions:

[0018] t = 4E - 17V 2 + 2E - 08V + 4.355;

[0019] wherein, V is the volume of the internal cavity of the chip of the device under test, and the unit is um 3 ; E is the base of the natural logarithm.

[0020] Preferably, the length of the internal cavity of the chip of the device under test is 300 - 1500 um; the width of the internal cavity of the chip of the device under test is 300 - 1500 um; the height of the internal cavity of the chip of the device under test is 300 um.

[0021] In a second aspect, an embodiment of the present invention provides a reliability test device for a packaged device, and the reliability test device includes:

[0022] Mixing module, which is used to mix deionized water with a conductivity greater than 1 MΩ·cm at room temperature into chromosomes and stir evenly to prepare a staining agent;

[0023] Heating module, which is used to provide a test chamber. The test chamber is provided with through holes, semi-sealed, and heated to 90 - 100 °C, maintaining the relative humidity below a preset threshold for 25 - 40 min;

[0024] Drying module, which places the device under test into the test chamber through the through hole and keeps it for 25 - 40 min to perform a drying treatment on the device under test;

[0025] Pressurizing module, which is used to evaporate the staining agent into the test chamber through a heating pipeline, so that the relative humidity in the test chamber reaches 100%, the temperature reaches 120 ± 2 °C, and gradually increases the steam pressure in the test chamber to 180 - 210 kPa within 1 h, and maintains the ambient temperature in the test chamber for 30 min;

[0026] Analysis module, which is used to gradually reduce the steam pressure in the test chamber to atmospheric pressure within 1 h after a preset test time, then remove the device under test from the test chamber, and perform an external staining path analysis and an open - lid analysis on the removed device under test to obtain a reliability test result.

[0027] Compared with the related technology, in the embodiments of the present invention, according to the tracking staining agent, it can be directly displayed under a microscope, with low cost and high speed, and can determine the path and speed of water vapor intrusion, which is beneficial to improving the dynamic detection accuracy of water vapor intrusion and fundamentally enhancing the moisture - proof reliability of packaged devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention will be described in detail below with reference to the drawings. Through the detailed description in combination with the following drawings, the above - mentioned or other aspects of the present invention will become clearer and easier to understand. In the drawings:

[0029] Figure 1 is a flowchart of a reliability test method for a packaged device provided in Embodiment 1 of the present invention;

[0030] Figure 2 is a module schematic diagram of a reliability test device for a packaged device provided in Embodiment 2 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above drawings are used to distinguish different objects and not to describe a specific order.

[0032] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0034] Embodiment 1

[0035] Please refer to Figure 1 As shown, the embodiment of the present invention provides a method for testing the reliability of a packaged device. The reliability testing method includes the following steps:

[0036] S1. Use deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mix it with a chromosome and stir evenly to prepare a staining agent.

[0037] S2. Provide a test chamber. The test chamber is provided with through holes, semi-sealed and heated to 90 - 100 °C, and the relative humidity is maintained below a preset threshold for 25 - 40 min.

[0038] S3. Put the device under test into the test chamber through the through holes and keep it for 25 - 40 min to perform a drying treatment on the device under test.

[0039] S4. Evaporate the dye through a heating pipe into the test chamber to make the relative humidity in the test chamber reach 100%, the temperature reach 120 ± 2 °C, and gradually increase the steam pressure in the test chamber to 180 - 210 kPa within 1 h, and maintain the ambient temperature in the test chamber for 30 min.

[0040] S5. After the preset test time, gradually reduce the steam pressure in the test chamber to atmospheric pressure within 1 h, then remove the device under test from the test chamber, and perform external dyeing path analysis and open - lid analysis on the removed device under test to obtain the reliability test result.

[0041] Among them, after the test is completed, slowly reduce the steam pressure in the chamber to atmospheric pressure within 1 hour. Be especially careful during the equipment control and cooling procedures to prevent the device under test from being damaged by the pressure reduction. After the end of the descending stage, the device is removed from the test chamber. If it needs to be stored, the device under test needs to be placed in a sealed humid bag (without desiccant) to reduce the moisture release rate of the device. Through optical microscope observation, check whether there are obvious traces of chromosome invasion around the package body, and dissect the package to check for internal invasion, so as to better analyze the test results and improve the test accuracy.

[0042] Specifically, prepare a dye by using deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mixing it with the chromosome and stirring evenly; provide a test chamber, the test chamber is provided with through - holes and is semi - sealed and heated to 90 - 100 °C, keep the relative humidity lower than the preset threshold, and maintain for 25 - 40 min; place the device under test into the test chamber through the through - holes and keep it for 25 - 40 min to perform a drying treatment on the device under test; evaporate the dye through a heating pipe into the test chamber to make the relative humidity in the test chamber reach 100%, the temperature reach 120 ± 2 °C, and gradually increase the steam pressure in the test chamber to 180 - 210 kPa within 1 h, and maintain the ambient temperature in the test chamber for 30 min; after the preset test time, gradually reduce the steam pressure in the test chamber to atmospheric pressure within 1 h, then remove the device under test from the test chamber, and perform external dyeing path analysis and open - lid analysis on the removed device under test to obtain the reliability test result; in this way, it can be used to evaluate the reliability of non - hermetic packaged IC devices in a humidity environment; temperature / humidity / bias conditions are applied to accelerate the penetration of moisture, which can penetrate through the external protective material (molding compound or seal) or along the interface between the external protective material and the metal conduction material, and can realize low - cost visual airtightness analysis of semiconductor packages. By tracking the dye, which can be directly shown under the microscope, it has low cost and high speed, can determine the path and speed of water vapor invasion, is beneficial to improving the dynamic detection accuracy of water vapor invasion, and fundamentally improves the moisture - proof reliability of packaged devices.

[0043] In this embodiment, in step S1, the chromosome is a solution with a concentration of 10% formed by a mixture and water, where the mixture is formed by mixing tetramethylpararosaniline chloride, pentamethylpararosaniline chloride, and hexamethylpararosaniline chloride. Among them, methylpararosaniline chloride is easily soluble in water, has bright colors, and high stability. By mixing the mixture of tetramethylpararosaniline chloride, pentamethylpararosaniline chloride, and hexamethylpararosaniline chloride with water, the obtained stain has a good staining effect and high clarity.

[0044] In this embodiment, in step S2, the preset threshold of the relative humidity is 10%.

[0045] In this embodiment, in step S2, the test chamber is semi-sealed and heated to 90 °C, and the relative humidity is kept below the preset threshold and maintained for 30 min. This improves the penetration performance of the stain and facilitates the observation of the encapsulation test analysis results.

[0046] In this embodiment, in step S4, the steam pressure in the test chamber is gradually increased to 205 kPa within 1 h.

[0047] In this embodiment, in step S5, the preset test time t satisfies the following conditions:

[0048] t = 4E-17V 2 + 2E-08V + 4.355;

[0049] where V is the volume of the internal cavity of the chip of the device under test, and the unit is um 3 ; E is the base of the natural logarithm.

[0050] In this embodiment, the length of the internal cavity of the chip of the device under test is 300 - 1500 um; the width of the internal cavity of the chip of the device under test is 300 - 1500 um; the height of the internal cavity of the chip of the device under test is 300 um.

[0051] Specifically, the length of the internal cavity of the chip of the device under test is 300 um; the width of the internal cavity of the chip of the device under test is 300 um; the height of the internal cavity of the chip of the device under test is 300 um, and the volume is 3E+07 um 3 . The pressurization time is 5 h.

[0052] The length of the internal cavity of the chip of the device under test is 500 um; the width of the internal cavity of the chip of the device under test is 500 um; the height of the internal cavity of the chip of the device under test is 300 um, and the volume is 8E+07 um 3 . The pressurization time is 6 h.

[0053] The length of the internal cavity of the chip of the device under test is 1000 um; the width of the internal cavity of the chip of the device under test is 1000 um; the height of the internal cavity of the chip of the device under test is 300 um, and the volume is 3E+08 um 3 . The pressurization time is 14 h.

[0054] The length of the internal cavity of the chip of the device under test is 1500 um; the width of the internal cavity of the chip of the device under test is 1500 um; the height of the internal cavity of the chip of the device under test is 300 um, and the volume is 7E+08 um 3 . The pressurization time is 36 h.

[0055] In summary, it can be seen that when the volume of the device under test gradually increases, the required pressurization time also increases accordingly, so as to better dye the device under test and improve the test accuracy.

[0056] Example Two

[0057] As Figure 2 shown, the embodiment of the present invention provides a reliability test device 200 for a packaged device. The reliability test device 200 includes:

[0058] A mixing module 21, which is used to mix deionized water with a conductivity greater than 1 MΩ·cm at room temperature and mix it with the chromosome evenly to prepare a staining agent.

[0059] A heating module 22, which is used to provide a test chamber. The test chamber is provided with through holes and is semi-sealed and heated to 90-100 °C, and the relative humidity is kept below a preset threshold and maintained for 25-40 min.

[0060] A drying module 23, which is used to place the device under test into the test chamber through the through hole and keep it for 25-40 min to perform a drying treatment on the device under test.

[0061] A pressurization module 24, which is used to evaporate the staining agent into the test chamber through a heating pipeline, so that the relative humidity in the test chamber reaches 100%, the temperature reaches 120±2 °C, and the steam pressure in the test chamber is gradually increased to 180-210 kPa within 1 h, and the ambient temperature in the test chamber is maintained for 30 min.

[0062] The analysis module 25 is configured to gradually reduce the steam pressure in the test chamber to atmospheric pressure within 1 hour after a preset test time, then remove the device under test from the test chamber, and perform external dyeing path analysis and open - lid analysis on the removed device under test to obtain the reliability test result. This can be used to evaluate the reliability of non - hermetically packaged IC devices in a humidity environment; temperature / humidity / bias conditions are applied to accelerate the penetration of moisture, which can penetrate through the external protective material (molding compound or seal) or along the interface between the external protective material and the metal conductive material, enabling low - cost visualization of the hermeticity analysis of semiconductor packages. By tracking the dye, it can be directly shown under a microscope, with low cost and high speed, which can determine the path and speed of water vapor intrusion, facilitating the improvement of the dynamic detection accuracy of water vapor intrusion and fundamentally enhancing the moisture - proof reliability of packaged devices.

[0063] In this embodiment, the chromosome is a 10% solution formed by a mixture and water, where the mixture is formed by mixing tetramethyl - para - rosaniline chloride, pentamethyl - para - rosaniline chloride, and hexamethyl - para - rosaniline chloride. Among them, methyl - para - rosaniline chloride is easily soluble in water, with bright colors and high stability. By mixing the mixture of tetramethyl - para - rosaniline chloride, pentamethyl - para - rosaniline chloride, and hexamethyl - para - rosaniline chloride with water, the obtained dye has a good dyeing effect and high clarity.

[0064] In this embodiment, the preset threshold of the relative humidity is 10%.

[0065] In this embodiment, the test chamber is semi - sealed and heated to 90 °C, and the relative humidity is maintained below the preset threshold for 30 minutes. This improves the penetration performance of the dye and facilitates the observation of the encapsulation test analysis results.

[0066] In this embodiment, the steam pressure in the test chamber is gradually increased to 205 kPa within 1 hour.

[0067] In this embodiment, the preset test time t satisfies the following conditions:

[0068] t = 4E - 17V 2 + 2E - 08V + 4.355;

[0069] where V is the volume of the internal cavity of the chip of the device under test, with the unit of um 3 ; E is the base of the natural logarithm.

[0070] In this embodiment, the length of the internal cavity of the chip of the device under test is 300-1500um; the width of the internal cavity of the chip of the device under test is 300-1500um; the height of the internal cavity of the chip of the device under test is 300um. When the volume of the device under test is gradually increasing, the required pressurization time is also increasing, so as to better dye the device under test and improve the test accuracy.

[0071] It should be noted that the various embodiments described above with reference to the accompanying drawings are only used to illustrate the present invention rather than to limit the scope of the present invention. Those skilled in the art should understand that any modification or equivalent substitution of the present invention without departing from the spirit and scope of the present invention should be included within the scope of the present invention. In addition, unless otherwise indicated by the context, words appearing in the singular include the plural form, and vice versa. In addition, unless otherwise specified, all or part of any embodiment may be used in combination with all or part of any other embodiment.

Claims

1. A reliability test method for a packaged device, characterized in that, The reliability test method includes the following steps: S1. Use deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mix it with chromosomes and stir evenly to prepare a staining agent. S2. Provide a test chamber. The test chamber is provided with through holes, semi-sealed, and heated to 90 - 100 °C, maintain the relative humidity below a preset threshold, and maintain for 25 - 40 min. S3. Put the device under test into the test chamber through the through hole, keep it for 25 - 40 min, and perform a drying treatment on the device under test. S4. Evaporate the staining agent into the test chamber through a heating pipe, so that the relative humidity in the test chamber reaches 100%, the temperature reaches 120 ± 2 °C, gradually increase the steam pressure in the test chamber to 180 - 210 kPa within 1 h, and maintain the ambient temperature in the test chamber for 30 min. S5. After the preset test time, gradually reduce the steam pressure in the test chamber to atmospheric pressure within 1 h, then take out the device under test from the test chamber, perform an external staining path analysis and an open - cover analysis on the taken - out device under test, and obtain the reliability test result.

2. The reliability test method for the packaged device according to claim 1, characterized in that, In step S1, the chromosome is a solution with a concentration of 10% formed by a mixture and water, where the mixture is formed by mixing tetramethyl - para - rosaniline chloride, pentamethyl - para - rosaniline chloride, and hexamethyl - para - rosaniline chloride.

3. The reliability test method for the packaging device according to claim 1, wherein In step S2, the preset threshold of the relative humidity is 10%.

4. The reliability test method for the encapsulation device according to claim 1, characterized in that In step S2, the test chamber is semi - sealed and heated to 90 °C, maintain the relative humidity below the preset threshold, and maintain for 30 min.

5. The reliability test method for the encapsulated device according to claim 1, wherein In step S4, gradually increase the steam pressure in the test chamber to 205 kPa within 1 h.

6. The reliability test method for the encapsulation device according to claim 1, wherein In step S5, the preset test time t satisfies the following conditions: ； wherein, V is the volume of the internal cavity of the chip of the device to be measured, with the unit of um 3 ; E is the base of the natural logarithm.

7. The reliability test method for the packaging device according to claim 1, characterized in that The length of the internal cavity of the chip of the device under test is 300 - 1500 μm; the width of the internal cavity of the chip of the device under test is 300 - 1500 μm; the height of the internal cavity of the chip of the device under test is 300 μm.

8. A reliability test device for a packaging device, characterized in that, The reliability test device includes: A mixing module, which is used to use deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mix it with chromosomes and stir evenly to prepare a staining agent. A heating module, which is used to provide a test chamber. The test chamber is provided with through holes, semi - sealed, and heated to 90 - 100 °C, maintain the relative humidity below a preset threshold, and maintain for 25 - 40 min. A drying module, which performs a drying treatment on the device under test by putting the device under test into the test chamber through the through hole and keeping it for 25 - 40 min. A pressurizing module, which is used to evaporate the staining agent into the test chamber through a heating pipe, so that the relative humidity in the test chamber reaches 100%, the temperature reaches 120 ± 2 °C, gradually increase the steam pressure in the test chamber to 180 - 210 kPa within 1 h, and maintain the ambient temperature in the test chamber for 30 min. An analysis module is configured to gradually reduce the steam pressure in the test chamber to atmospheric pressure within 1 hour after a preset test time, then remove the device under test from the test chamber, and perform external dyeing path analysis and open - cover analysis on the removed device under test to obtain the reliability test result.

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