Semiconductor device and forming method thereof

By using a combination of magnetic components and springs in optical signal conduction and processing technology, automatic alignment and stable connection of optical fiber arrays are achieved, and the problem of connection and alignment difficulties in the prior art is solved, and the efficiency and reliability of signal transmission are improved.

CN119828295APending Publication Date: 2025-04-15TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
CN202411893962.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-03-26
Filing Date
2024-12-20
Publication Date
2025-04-15

AI Technical Summary

Technical Problem

In the existing optical signal conduction and processing technologies, there are difficulties in connecting and aligning long-distance optical components and short-distance electronic components, resulting in insufficient signal transmission efficiency and reliability.

Method used

Using semiconductor devices including the first and second optical fiber arrays and connectors, the automatic alignment and connection of the optical fiber array is achieved by using magnetic components, and a stable connection is ensured through springs and magnetic attraction.

Benefits of technology

High-precision automatic alignment and stable connection of fiber arrays are achieved, improving efficiency and reliability of optical signal transmission, and allowing easy disconnection and reconnection, simplifying maintenance and replacement processes.

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Abstract

A device includes: a first optical fiber array including a first optical fiber and a first magnetic member; a second optical fiber array including a second optical fiber and a second magnetic member; the connector comprises a third magnetic component adjacent to the opening, the opening extends from the first side of the connector to the second side of the connector, and the first magnetic component of the first optical fiber array corresponds to the third magnetic component adjacent to the first side; wherein the second magnetic member of the second optical fiber array corresponds to the third magnetic member near the second side. The embodiment of the invention also relates to a semiconductor device and a forming method thereof.
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Description

Technical Field

[0001] Embodiments of the present disclosure relate to semiconductor devices and methods of forming the same. Background Art

[0002] Electrical signaling and processing is a technology used for signal transmission and processing. In recent years, optical signaling and processing has been used in an increasing number of applications, especially due to the use of optical fiber related applications for signal transmission.

[0003] Optical signal conduction and processing are often combined with electrical signal conduction and processing to provide comprehensive applications. For example, optical fibers can be used for long-distance signal transmission, while electrical signals can be used for short-distance signal transmission and processing and control. Therefore, devices integrating long-distance optical components and short-distance electronic components are formed for conversion between optical signals and electrical signals and processing of optical signals and electrical signals. Improvements in each of these long-distance optical components and short-distance electronic components are expected. Summary of the invention

[0004] An embodiment of the present disclosure provides a semiconductor device, comprising: a first optical fiber array, comprising a plurality of first optical fibers and a plurality of first magnetic components; a second optical fiber array, comprising a plurality of second optical fibers and a plurality of second magnetic components; and a connector, comprising a plurality of third magnetic components adjacent to an opening, wherein the opening extends from a first side of the connector to a second side of the connector, wherein the first magnetic components of the first optical fiber array correspond to third magnetic components near the first side, and wherein the second magnetic components of the second optical fiber array correspond to third magnetic components near the second side.

[0005] Another embodiment of the present disclosure provides a semiconductor device, comprising: an annular connector, comprising an opening, a first alignment member located at a first side of the opening, and a second alignment member located at a second side of the opening, wherein the opening is shaped to receive a first optical fiber array on the first side and to receive a second optical fiber array on the second side, wherein the first alignment member is configured to align the first optical fiber array within the opening, and wherein the second alignment member is configured to align the second optical fiber array within the opening.

[0006] Another embodiment of the present disclosure provides a method for forming a semiconductor device, comprising: bringing the end of a first optical fiber array to the vicinity of the end of a second optical fiber array, wherein the first optical fiber array includes a first magnet and the second optical fiber array includes a second magnet; magnetically attracting the first magnet to a third magnet to align the end of the first optical fiber array with the end of the second optical fiber array; and magnetically attracting the second magnet to a fourth magnet to align the end of the second optical fiber array with the end of the first optical fiber array. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or reduced for clarity of discussion.

[0008] Figure 1 A three-dimensional view of a connector for an optical fiber is shown in accordance with some embodiments.

[0009] Figure 2A A top-down cross-sectional view of a connector and an optical fiber array prior to connection is shown in accordance with some embodiments.

[0010] Figure 2B A top-down cross-sectional view of a connector and optical fiber array after connection is shown in accordance with some embodiments.

[0011] Figure 2C A top-down cross-sectional view of a connector and optical fiber array after disconnection is shown in accordance with some embodiments.

[0012] Figure 3A and Figure 3B Configurations of magnetic members of connectors and optical fiber arrays are shown according to some embodiments.

[0013] Figure 4 A cross-sectional view of an optical fiber array after insertion of a connector is shown in accordance with some embodiments.

[0014] Figure 5A and Figure 5B Connectors and optical fiber arrays having different magnetic member configurations are shown according to some embodiments.

[0015] Figure 6 A cross-sectional view of a connector according to some embodiments is shown.

[0016] Fig. 7A and Figure 7B A cross-sectional view of a connector and an optical fiber array after connection is shown in accordance with some embodiments.

[0017] Figure 8 A cross-sectional view of a connector and an optical fiber array after connection is shown in accordance with some embodiments.

[0018] Fig. 9 A cross-sectional view of a connector and an optical fiber array after connection is shown in accordance with some embodiments.

[0019] Fig. 10A and Fig. 10BA view showing an optical fiber array structure including a flat connector according to some embodiments.

[0020] Fig.11A A cross-sectional view of a fiber array structure prior to connection according to some embodiments is shown.

[0021] Fig. 11B A cross-sectional view of a fiber array structure after connection is shown according to some embodiments.

[0022] Fig.12 A plan view of a fiber array structure after connection is shown according to some embodiments.

[0023] Fig.13 An enclosure is shown connected to a vertical optical fiber array via a connector in accordance with some embodiments.

[0024] Fig.14 An enclosure is shown connected to a horizontal optical fiber array via a connector, according to some embodiments. DETAILED DESCRIPTION

[0025] The following disclosure provides several different embodiments or examples for implementing the different features of the present disclosure. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are directly contacted, and may also include an embodiment in which an additional component may be formed between the first component and the second component so that the first component and the second component may not be in direct contact. In addition, the present disclosure may repeat reference numbers and / or letters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or configurations discussed.

[0026] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should likewise be interpreted accordingly.

[0027] Embodiments in which magnets are used to automatically align and connect optical fibers within connectors are described herein. Embodiments are also described herein in which springs are used to secure the optical fibers within the connectors and allow the alignment of the optical fibers to be adjusted. The connectors described herein allow the optical fibers to be disconnected and reconnected. In this way, optical fibers can be replaced or repaired more efficiently. However, the embodiments described herein are intended to be illustrative and not intended to be limiting. Instead, the ideas presented can be implemented in a wide variety of embodiments, and all such embodiments are fully intended to be included within the scope of the present disclosure.

[0028] Figure 1 A three-dimensional view of a connector 100 for an optical fiber is shown in accordance with some embodiments. Figure 1 Also shown are two unconnected optical fiber arrays 10A and 10B that can be inserted into the connector 100 for connection. The connector 100 is configured to hold the two optical fiber arrays 10A-10B so that the optical fiber arrays 10A-10B are optically coupled to each other, for example, so that optical signals and / or optical power can be transmitted between the optical fiber arrays 10A-10B. The connector 100 described herein securely holds the optical fiber arrays 10A-10B, but also allows the optical fiber arrays 10A-10B to be removed if desired. Figure 1 The connector 100 and optical fiber arrays 10A- 10B shown in FIG. 1 and other figures are representative examples, and other configurations, arrangements, or features are possible.

[0029] The optical fiber arrays 10A- 10B may be structures each including one or more optical fibers 11 , such as an optical fiber array unit, a ferrule, a substrate, a holder, or other suitable components configured to hold the optical fibers 11 . Figure 1 A single optical fiber 11 is shown in each of the optical fiber arrays 10A-10B, but each optical fiber array 10A-10B may include any suitable number of optical fibers 11 in any suitable arrangement. The optical fiber 11 may extend away from the optical fiber array 10A-10B (not shown), wherein the shown portion of the optical fiber array 10A-10B includes the end of the optical fiber 11. In this manner, connecting the optical fiber arrays 10A-10B using the connector 100 may facilitate end-to-end optical coupling of the optical fiber 11 of the optical fiber array 10A to the optical fiber 11 of the optical fiber array 10B. In some embodiments, the optical fiber array 10A includes one or more magnetic members 12 (e.g., magnetic members 12A and 12B), and the optical fiber array 10B includes one or more magnetic members 13 (e.g., magnetic members 13A and 13B), which will be described in more detail below. In some embodiments, the optical fiber array 10A may have a different size (e.g., a different thickness) than the optical fiber array 10B.

[0030] like Figure 1As shown, the connector 100 may include an annular member having an opening 103, and the optical fiber arrays 10A-10B may be inserted into the opening 103 for connection. Therefore, the opening 103 of the connector 100 may be slightly larger than the optical fiber arrays 10A or 10B to be connected. For example, Figure 1 The opening 103 shown has a rectangular shape corresponding to the rectangular shape of the optical fiber arrays 10A-10B, but other shapes are possible. In some embodiments, the opening 103 can have different sizes on different sides of the connector 100, wherein the size of each side of the opening 103 corresponds to the size of the optical fiber array 10A or 10B inserted into that side.

[0031] In some embodiments, the connector 100 includes magnetic members 102 located at laterally opposite side walls of the opening 103. For example, Figure 1 One magnetic member 102A is shown on a first vertical sidewall of the opening 103, and another magnetic member 102B is shown on a second vertical sidewall of the opening 103 facing the first vertical sidewall. The magnetic member 102 is a magnet including one or more suitable magnetic materials. Figure 1 A single magnetic member 102 is shown at each side wall, but there may be multiple magnetic members 102 at each side wall (see, for example, FIG. 5A to FIG. 5B ). The magnetic member 102 may be exposed or may be located below the sidewall surface (eg, covered by the sidewall surface). The magnetic member 102 may protrude from the sidewall surface, may be flush with the sidewall surface, or may be recessed from the sidewall surface.

[0032] The magnetic member 102 is used to provide improved alignment of the optical fiber arrays 10A-10B while also allowing the optical fiber arrays 10A-10B to be disconnected from the connector 100. The magnetic member 102 is configured to magnetically attract a corresponding magnetic member on the optical fiber arrays 10A-10B. Figure 1 As shown, the optical fiber array 10A includes magnetic members 12 located on laterally opposite side walls, shown as magnetic members 12A and 12B, and the optical fiber array 10B includes magnetic members 13 located on laterally opposite side walls, shown as magnetic members 13A and 13B. The magnetic members 12 of the optical fiber array 10A and the magnetic members 13 of the optical fiber array 10B may be collectively referred to as "magnetic members 12 / 13" herein, and the magnetic members 102 and magnetic members 12 / 13 of the connector 100 may be collectively referred to as "magnetic members 102 / 12 / 13" herein. The magnetic members 12 / 13 are magnets including one or more suitable magnetic materials. Figure 1 A single magnetic member 12 at each side wall of the optical fiber array 10A and a single magnetic member 13 at each side wall of the optical fiber array 10B are shown, but there may be multiple magnetic members 12 / 13 at each side wall (see, for example, FIG. 5A to FIG. 5B). The magnetic member 102 may be exposed or may be located below the sidewall surface (eg, covered by the sidewall surface). The magnetic member 102 may protrude from the sidewall surface, may be flush with the sidewall surface, or may be recessed from the sidewall surface.

[0033] Figure 2A , Figure 2B and Figure 2C A top-down cross-sectional view of connector 100 and optical fiber arrays 10A- 10B is shown in accordance with some embodiments. Figure 2A 1 shows an array of optical fibers 10A-10B prior to insertion of a connector 100 according to some embodiments, Figure 2B shows an array of optical fibers 10A-10B after being connected by a connector 100 according to some embodiments, and Figure 2C 1 shows the optical fiber arrays 10A-10B after being disconnected and removed from the connector 100 according to some embodiments. The connector 100 may be similar to Figure 1 The connector 100 and the optical fiber arrays 10A-10B may be similar to Figure 1 For example, the connector 100 includes magnetic members 102A-102B located at opposite side walls of the opening 103, the optical fiber array 10A includes magnetic members 12A-12B located at opposite side walls, and the optical fiber array 10B includes magnetic members 13A-13B located at opposite side walls.

[0034] exist Figure 2A , the optical fiber arrays 10A-10B are brought toward the opening 103 of the connector 100. For example, the optical fiber array 10A is brought toward a first side of the opening 103 for insertion, and the optical fiber array 10B is brought toward a second side of the opening 103 for insertion. The optical fiber arrays 10A-10B may be inserted simultaneously or sequentially. As the optical fiber arrays 10A-10B are brought toward the opening 103, the magnetic attraction between the magnetic members 102A-102B and the magnetic members 12 / 13 pulls the optical fiber arrays 10A-10B into the opening 103, facilitating the insertion of the optical fiber arrays 10A-10B into the connector 100. For example, the magnetic member 102A of the connector 100 attracts the magnetic member 12A of the optical fiber array 10A and the magnetic member 13A of the optical fiber array 10B, and the magnetic member 102B of the connector 100 attracts the magnetic member 12B of the optical fiber array 10A and the magnetic member 13B of the optical fiber array 10B. In this manner, connector 100 allows for easier and more "automatic" connection of optical fiber arrays 10A-10B.

[0035] Figure 2BThe optical fiber array 10A-10B is shown after being fully inserted into the connector 100 according to some embodiments. The magnetic force between the magnetic members 102A-102B and the magnetic members 12 / 13 pulls the optical fiber array 10A-10B so that the optical fiber array 10A-10B is connected within the connector 100. In some embodiments, the magnetic members 102 / 12 / 13 are positioned or arranged so that the magnetic force positions the optical fiber arrays 10A-10B to be optically aligned with each other when connected. For example, the magnetic force can position the optical fiber arrays 10A-10B so that the optical fibers 11 in the optical fiber array 10A are optically coupled with the corresponding optical fibers 11 in the optical fiber array 10B, allowing optical signals and / or optical power to be transmitted between the optical fiber arrays 10A-10B. In this way, the magnetic members 102 / 12 / 13 can facilitate easier or more "automatic" optical alignment of the connected optical fiber arrays 10A-10B. Thus, as described herein, the use of magnetic members 102 / 12 / 13 may allow for faster or more precise optical alignment of optical fiber arrays 10A- 10B, which may allow for improved quality or improved efficiency of optical fiber transmission.

[0036] Magnetic members 102, 12 and 13 may have any suitable configuration or arrangement. As an example, Figure 3A and Figure 3B Example configurations of magnetic members 102B, 12B, and 13B are shown. Similar configurations may be used for magnetic members 102A, 12A, and 13A. FIG. 3A to FIG. 3B The view could be something like Figure 2B A top-down view of. Figure 3A An embodiment is shown in which the same magnetic pole of magnetic member 102B is used to attract magnetic members 12B and 13B. For example, the south pole of magnetic member 102B attracts the north pole of magnetic member 12B and the north pole of magnetic member 13B. The south poles of magnetic members 12B / 13B are not shown and can have any suitable location or arrangement. Figure 3B An embodiment is shown in which different magnetic poles of magnetic member 102B are used to attract magnetic members 12B and 13B. For example, the south pole of magnetic member 102B attracts the north pole of magnetic member 12B, and the north pole of magnetic member 102B attracts the south pole of magnetic member 13B. The south pole of magnetic member 12B and the north pole of magnetic member 13B are not shown and can have any suitable position or arrangement. In a similar Figure 3B In the illustrated embodiment, magnetic members 12B and 13B may also be attracted to each other via their respective opposite poles, which may facilitate connection and / or alignment of optical fiber arrays 10A- 10B. FIG. 3A to FIG. 3B The configurations and arrangements shown are representative examples, and other arrangements or configurations are possible.

[0037] Figure 4A cross-sectional view of optical fiber array 10A is shown after insertion of connector 100 in accordance with some embodiments. Figure 4 The arrangement of the magnetic members 102 / 12 in FIG. 1 is an example, and other arrangements or positions of the magnetic members 102 / 12 / 13 are possible. In some embodiments, the optical fiber arrays 10A-10B can be separated from the connector 100 during connection, such as Figure 2B and Figure 4 In other embodiments, the optical fiber arrays 10A-10B may physically contact the connector 100 when connected.

[0038] Back to Figure 2B , when connected by the connector 100, the ends of the optical fiber arrays 10A-10B may be separated by a gap, such as Figure 2B As shown, or the ends of the optical fiber arrays 10A-10B may be in physical contact when connected. The magnetic members 12 / 13 of the optical fiber arrays 10A-10B may be located near the ends of the optical fiber arrays 10A-10B so that when the optical fiber arrays 10A-10B are connected, the magnetic members 12 / 13 are at least partially located within the openings 103. For example, in some embodiments, the magnetic members 12 / 13 may be completely located within the openings 103, such as Figure 2B As shown, and in other embodiments, when the optical fiber arrays 10A-10B are connected, the magnetic members 12 / 13 may protrude outside the opening 103. The magnetic attraction between the magnetic members 102 / 12 / 13 may allow the optical fiber arrays 10A-10B to be securely connected via the connector 100, which may allow for a more stable and reliable connection. For example, the magnetic attraction may reduce the chances of the optical fiber arrays 10A-10B being displaced or accidentally disconnected, which may improve the life and durability of the connected optical fiber arrays 10A-10B.

[0039] In some embodiments, the use of magnetic members 102 / 12 / 13 to secure the optical fiber arrays 10A-10B to the connector 100 may allow the optical fiber arrays 10A-10B to be disconnected if desired. Figure 2C It is shown in Figure 2BThe optical fiber array 10A-10B has been removed from the connector 100. One or both of the optical fiber arrays 10A-10B may be removed from the connector 100 for any suitable reason, such as for repair, replacement, disassembly, diagnostic purposes, etc. Being able to easily disconnect the optical fiber arrays 10A-10B may allow for easier replacement of one or both of the optical fiber arrays 10A, 10B, or the connector 100 without having to replace all three components, which may reduce time and cost. In this way, the magnetic members 102 / 12 / 13 and connector 100 described herein may be viewed as a "modular" system. In addition, the alignment aid provided by the magnetic members 102 / 12 / 13 may make it easier and more accurate to align the optical fiber arrays 10A-10B, and may reduce the time or effort spent reconnecting the optical fiber arrays 10A-10B after disconnection, making replacement or repair more efficient.

[0040] In other embodiments, connector 100 may have more magnetic members 102, and optical fiber arrays 10A-10B may have more magnetic members 12 / 13. As a non-limiting example, Figure 5A A top-down view of a connector 100 including four magnetic members 102A-102D is shown, and Figure 5A A cross-sectional view of a connector 100 including four magnetic members 102A-102B and an optical fiber array 10A including four magnetic members 12A-12D is shown. Figure 5A The view is similar to Figure 2B , and Figure 5B The view is similar to Figure 4 In other embodiments, connector 100 or optical fiber arrays 10A-10B may have other numbers or arrangements of magnetic members.

[0041] exist Figure 5A , connector 100 has four magnetic members 102A-102D, each magnetic member is used to attract the corresponding magnetic member 12 / 13 of the optical fiber array 10A-10B. For example, during insertion, magnetic member 102A attracts magnetic member 12B, magnetic member 102B attracts magnetic member 13B, magnetic member 102C attracts magnetic member 12A, and magnetic member 13A attracts magnetic member 102D. Therefore, magnetic members 102A and 102C can be located near one side of opening 103, and magnetic members 102B and 102D can be located near the opposite side of opening 103.

[0042] exist Figure 5BIn the embodiment, the connector 100 has four magnetic members 102A-102D, each of which is used to attract the corresponding magnetic members 12A-12D of the optical fiber array 10A. For example, during insertion, the magnetic members 102A, 102B, 102C and 102D attract the magnetic members 12A, 12B, 12C and 12D respectively. Therefore, multiple magnetic members 102 can be positioned along the same side wall of the opening 103, and multiple magnetic members 12 can be positioned along the same side wall of the optical fiber array 10A. The magnetic members 102A-102D can be used to attract the four corresponding magnetic members 13 of the optical fiber array 10B, or the connector 100 can have multiple magnetic members 102 corresponding to the magnetic members 13 of the optical fiber array 10B. In other embodiments, one or more magnetic members 102 can be positioned along the top side wall and / or the bottom side wall of the opening 103, or one or more magnetic members 12 / 13 can be positioned along the top surface and / or the bottom surface of the optical fiber array 10A-10B.

[0043] Figure 6 A cross-sectional view of an adjustable connector 200 configured to connect to an array of optical fibers is shown in accordance with some embodiments. Figure 6 An end view of the connector 200 is shown, similar to Figure 4 In some embodiments, the connector 200 fixes two optical fiber arrays (e.g., FIG. 7A to FIG. 7B The connector 200 is a ring-shaped structure including an opening 203, into which the optical fiber array can be inserted. The optical fiber array can be similar to those previously described for the optical fiber arrays 10A-10B, and may or may not include the magnetic member 12 / 13. The connector 200 allows the optical fiber array to be vertically adjusted after insertion, which will be described in more detail below.

[0044] Figure 6The connector 200 shown includes an upper plate 208A and a lower plate 208B within the opening 203. The surfaces of the upper plate 208A and the lower plate 208B facing the center of the opening 203 are configured to physically contact the inserted optical fiber array, and thus the plates 208A-208B can be considered "fixed members" or the like. The plates 208A-208B can have flat surfaces or can have other surface contours, such as a surface contour whose shape corresponds to the shape of the inserted optical fiber array. One or more upper springs 204A are located between the upper plate 208A and the top surface of the opening 203, and one or more lower springs 204B are located between the lower plate 208B and the bottom surface of the opening 203. In some embodiments, the springs 204A-204B are loaded compression springs that apply a compressive force to the plates 208A-208B toward the center of the opening 203. For example, the upper spring 204A pushes the upper plate 208A toward the bottom surface of the opening 203, and the lower spring 204B pushes the lower plate 208B toward the upper surface of the opening 203. In this way, the optical fiber array inserted between the plates 208A-208B is compressed by the plates 208A-208B due to the force applied by the springs 204A-204B. In addition, as described herein, connecting the optical fiber array using the spring-loaded compression plates 208A-208B allows the optical fiber array to be securely held, but also allows the optical fiber array to be easily removed or replaced.

[0045] Figure 6 Four upper springs 204A and four lower springs 204B are shown, but any suitable number of springs 204A-204B may be utilized. Using multiple upper springs 204A or multiple lower springs 204B allows for more uniform compression along the top and bottom of the inserted optical fiber array. Additionally, Figure 6 Springs 204A-204B are shown as being helical (eg, coiled) springs, but other types of structures that exert similar forces on plates 208A-208B may be used, such as leaf springs, serpentine springs, foam or other compressible materials, etc.

[0046] The connector 200 also includes an upper adjustment member 206A and a lower adjustment member 206B, also referred to herein as the upper adjustment member 206A and the lower adjustment member 206B, respectively. The upper adjustment member 206A protrudes from the top surface of the opening 203 toward the upper plate 208A. The upper adjustment member 206A provides a stopper that prevents the upper plate 208A from being pushed closer toward the top surface of the opening 203. For example, Figure 6 The upper plate 208A is shown to hit the end of the upper adjustment piece 206A. Similarly, the lower adjustment piece 206B protrudes from the bottom surface of the opening 203 toward the lower plate 208B. The lower adjustment piece 206B provides a stopper that prevents the lower plate 208B from being pushed closer toward the bottom surface of the opening 203. For example, Figure 6 The lower plate 208B is shown separated from the end of the lower adjustment member 206B.

[0047] In some embodiments, the distance that the adjustment members 206A-206B protrude into the opening 203 can be controlled. For example, in some embodiments, the adjustment members 206A-206B can include a threaded shaft that extends through a similar threaded hole in the connector 100. In this way, rotating the adjustment members 206A-206B will raise or lower the adjustment members 206A-206D, similar to the operation of a set screw or the like. The adjustment members 206A-206B can be rotated (e.g., "adjusted") manually or using an electric mechanism or the like. The combination of the adjustment members 206A-206B and the springs 204A-204B allows for precise vertical positioning of the inserted optical fiber array. Therefore, the adjustment members 206A-206B can be used to adjust the vertical position of one or two connected optical fiber arrays to provide more precise optical alignment between the optical fiber arrays. In some embodiments, the use of the threaded adjustment members 206A-206B as described herein can allow for fine adjustment of the vertical position of the optical fiber array. Additionally, the adjustment members 206A-206B can be "tightened" to compress the plates 208A-208B against the fiber array and more securely hold the fiber array while still allowing for removal of the fiber array. In this manner, the combination of the upper and lower springs, upper and lower plates, and upper and lower adjustment members can be considered a "spring compression device."

[0048] As an example, Fig. 7A and Figure 7B A cross-sectional view of a connector 200 connecting two optical fiber arrays 210A-210B is shown in accordance with some embodiments. Fig. 7A The view and Figure 6 The view is similar to that of Figure 7B The view is perpendicular to Fig. 7A A cross-sectional side view of the view. FIG. 7A to FIG. 7B The connector 200 allows two optical fiber arrays 210A-210B to be connected while allowing the vertical alignment of the optical fiber arrays 210A-210B to be adjusted or optimized. In addition, the connector 200 allows optical fiber arrays 210A-210B of different sizes (e.g., thickness) to be connected using the same connector 200, and allows optical fiber arrays 210A-210B with different sizes to be aligned more easily. The connector 200 is an illustrative example, and other configurations of connectors using springs, plates, and adjusters are possible.

[0049] exist FIG. 7A to FIG. 7BIn the embodiment of the present invention, the connector 200 includes a first opening 203A and a second opening 203B, and the optical fiber array 210A is inserted into the first opening 203A for connection, and the optical fiber array 210B is inserted into the second opening 203B for connection. The first opening 203A and the second opening 203B can be parts of the same larger opening and can have similar sizes or different sizes. The optical fiber array 210A is sandwiched between the plates 208A-208B, and due to the compression force ( Figure 7B 208A-208B compress the top and bottom of the fiber array 210A. Similarly, the fiber array 210B is sandwiched between the plates 208C-208D due to the compression force of the spring ( Figure 7B 204A-204B), the plates 208C-208D compress the top and bottom of the fiber array 210B. The adjustment members 206A-206B can be operated to adjust the vertical position of the fiber array 210A while allowing the compression force of the springs 204A-204B to secure the fiber array 210A. Similarly, the adjustment members 206C-206D can be operated to adjust the vertical position of the fiber array 210B while allowing the compression force of the springs to secure the fiber array 210B. In this way, after the fiber arrays 210A-210B are inserted, the adjustment members 206A-206D can be used to adjust the vertical position of the fiber array 210A and / or the fiber array 210B to more accurately optically align the fiber arrays 210A-210B.

[0050] Figure 8 2 shows a cross-sectional side view of a connector 200 connecting two optical fiber arrays 210A-210B having the same thickness. Figure 8 As shown, when the inserted optical fiber arrays 210A-210B have the same thickness, a single upper plate 208A and a single lower plate 208B may be used to fix the two optical fiber arrays 210A-210B. Figure 8 The connector 200 also includes an upper spring 204A and a lower spring 204B, although they are not shown. In addition, a single upper adjustment member 206A and a single lower adjustment member 206B can be used to fix and align the two optical fiber arrays 210A-210B. For example, in some embodiments, tightening the adjustment members 206A-206B to press the plates 208A-208B against the two optical fiber arrays 210A-210B can better optically align the optical fiber arrays 210A-210B.

[0051] In some embodiments, Figures 1 to 5B The magnetic member 102 described in the figure can be incorporated into the connector 200. Therefore, the magnetic member 12 / 13 can also be incorporated into the optical fiber array 210A-210B. As a non-limiting example, Fig. 9A cross-sectional view of a connector 250 including magnetic members 102 / 12 and an optical fiber array 260 is shown according to some embodiments. Fig. 9 The view is similar to Fig. 7A . The connector 250 can be similar to the previously described connector 200, except that the connector 250 includes magnetic members 102A-102B located at opposite side walls of the opening 203. The magnetic members 102A-102B can be similar to the magnetic members previously described for the connector 100, and can have any suitable number or arrangement. The optical fiber array 260 can be similar to the optical fiber array 10A. For example, the optical fiber array 260 includes magnetic members 12A-12B located on opposite side walls, and during insertion of the connector 250, the magnetic members 12A-12B are attracted to the corresponding magnetic members 102A-102B. In this way, the magnetic members 102 / 12 can allow the optical fiber array 260 to be easily aligned and fixed, and the adjustment members 206A-206B can allow the alignment of the optical fiber array 260 to be adjusted to improve accuracy or efficiency. This embodiment also allows the optical fiber array 260 to be easily removed. The connector 250 is an example, and other configurations are possible.

[0052] Fig. 10A and Fig. 10B A side view and a top view of a fiber array structure 300 are shown according to some embodiments, the fiber array structure including a fiber array 310 optically coupled to a flat connector 350. For example, optical signals and / or optical power of optical fibers 311 of the fiber array 310 are optically coupled to corresponding waveguides 351 of the flat connector 350, which will be described in more detail below. The flat connector 350 includes a magnetic member 352 that facilitates optical coupling of the fiber array 310 with another fiber array, which will be described in more detail below. The fiber array 310 includes a plurality of optical fibers 311, similar to the fiber array 10 or 210 described above.

[0053] In some embodiments, the optical fiber array structure 300 includes a coupling region 320 between the optical fiber array 310 and the flat connector 350. Within the coupling region 320, optical signals and / or optical power are transmitted between each optical fiber 311 and the corresponding waveguide 351 of the flat connector 350. In some cases, the coupling region 320 can be part of the optical fiber array 310. The coupling region 320 includes an optical fiber coupler 323 and a corresponding waveguide coupler 321. Each optical fiber coupler 323 is optically coupled to a corresponding optical fiber 311, so that the optical signal and / or optical power is transmitted between the optical fiber 311 and its corresponding optical fiber coupler 323. In some cases, the optical fiber coupler 323 can be a part or an extension of the optical fiber 311. Each waveguide coupler 321 is optically coupled to a corresponding waveguide 351, so that the optical signal and / or optical power is transmitted between the waveguide 351 and its corresponding waveguide coupler 321. In some cases, the waveguide coupler 321 can be a part or an extension of the waveguide 351. Each fiber coupler 323 is located next to the corresponding waveguide coupler 321, so that each fiber coupler 423 is transiently coupled to the waveguide coupler 321. Fig. 10A As shown by the arrows in , optical signals and / or optical power can be transmitted between the optical fiber coupler 323 and its corresponding waveguide coupler 321.

[0054] In some embodiments, the flat connector 350 includes a plurality of waveguides 351, wherein each waveguide 351 is optically coupled to a corresponding optical fiber 311 via a corresponding waveguide coupler 321 and a corresponding optical fiber coupler 323. In some embodiments, the waveguides 351 may be arranged in a row or array. The waveguides 351 may be, for example, slat waveguides, rectangular waveguides, or other suitable waveguides configured to transmit optical signals and / or optical power. The waveguides 351 may be close to a coupling surface 353 of the flat connector 350 and may be configured to transiently couple optical signals and / or optical power via the coupling surface 353 when connected, as will be described in more detail below. In some embodiments, the thickness of the flat connector 350 is less than the thickness of the optical fiber array 310.

[0055] In some embodiments, the flat connector 350 includes one or more magnetic members 352. The magnetic member 352 can attract a corresponding magnetic member of another flat connector to connect the flat connectors together and align their waveguides, as described in more detail below. The magnetic member 352 can be adjacent to the waveguide 351. For example, in some embodiments, the waveguide 351 can be located between two magnetic members 352, such as Fig. 10B The magnetic member 352 may be further away from the coupling surface 353 than the waveguide 351, as shown in FIG. Fig. 10A In other embodiments, the magnetic member 352 can be closer to or as close to the coupling surface 353 as the waveguide 351 . FIG. 10A to FIG. 10BThe flat connector 350 is an example, and the magnetic members 352 may have a different number or arrangement than shown. For example, the flat connector 350 may have a single magnetic member 352 or more than two magnetic members 352.

[0056] Fig.11A and Fig. 11B Shown are cross-sectional views of two optical fiber array structures 300A-300B before and after connection, according to some embodiments. Fig.12 FIG. 4 shows a plan view of the optical fiber array structure 300A-300B after connection. The optical fiber array structure 300A and the optical fiber array structure 400B can be similar to FIG. 10A to FIG. 10B . For example, the optical fiber array structure 300A has a flat connector 350A, which includes a magnetic member 352A and a waveguide 351A optically coupled to an optical fiber 311A, and the optical fiber array structure 300B has a flat connector 350B, which includes a magnetic member 352B and a waveguide 351B optically coupled to an optical fiber 311B.

[0057] When the optical fiber array structures 300A-300B are connected, Fig. 11B and Fig.12 As shown, the coupling surface 353A of the flat connector 350A contacts the coupling surface 353B of the flat connector 350B. When connected, each waveguide 351A is adjacent to the corresponding waveguide 351B, so that the corresponding waveguides 351A-351B are transiently coupled to each other. Therefore, optical signals and / or optical power can be transmitted between the waveguide 351A and the corresponding waveguide 351B. In some cases, the waveguides 351A-351B may include transient couplers, or may be considered to be transient couplers. In this way, the optical fiber 311A ​​of the optical fiber array structure 300A is optically coupled to the optical fiber 311B of the optical fiber array structure 300B through the flat connectors 350A-350B. For example, as Fig. 11B As shown by the arrows in , optical signals and / or optical power can be coupled between optical fiber 311A ​​and corresponding waveguide 351A, between waveguide 351A and corresponding waveguide 351B, and between waveguide 351B and corresponding optical fiber 311B. As described herein, using transiently coupled waveguides 351A-351B to couple optical fibers 311A-311B can avoid instability or insertion loss caused by deviation of the end face of the coupler of the end-to-end connection. In addition, the flat connectors 350A-350B described herein can also realize multi-channel connection or multi-path connection, improving flexibility, reliability or scalability.

[0058] The optical fiber array structures 300A-300B can be connected by contacting the coupling surface 353B of the flat connector 350B with the coupling surface 353A of the flat connector 350A. As the flat connector 350B is brought toward the flat connector 350A, the magnetic member 352B of the flat connector 350B is pulled toward the magnetic member 352A of the flat connector 350 by magnetic attraction. In particular, the magnetic members 352A-352B are configured to attract the flat connectors 350A-350B to each other so that when the coupling surfaces 353A-353B ​​are in contact, the waveguides 351A-351B are optically aligned. In this way, the magnetic members 352A-352B can facilitate precise "automatic" alignment of the waveguides 351A-351B to achieve transient coupling. Furthermore, the attractive force between the magnetic members 352A-352B secures the flat connectors 350A-350B to one another while also allowing the flat connectors 350A-350B to be disconnected when desired.

[0059] Fig.13 and Fig.14 Enclosures 400 and 500 are shown connected to an optical fiber array via connector 450 in accordance with some embodiments. Figure 13 to Figure 14 The connector 450 shown in FIG. 4 can be similar to any of the embodiment connectors described herein, such as connectors 100, 200, 250, or 350. Connector 450 is used to optically couple a first optical fiber array 410A to a second optical fiber array 410B, wherein the first optical fiber array 410A is optically coupled to a photonic component (e.g., waveguide 404, photonic component 406, etc.) within the package 400 / 500, and the second optical fiber array 410B is optically coupled to an external component or device. Fig.13 In the package 400 of FIG. 4 , the first optical fiber array 410A is vertically attached to the package 400 and optically coupled to the photonic component using a grating coupler 407. Fig.14 In the package 500 of FIG. 4 , the first optical fiber array 410A is horizontally attached to the package 500 and optically coupled to the photonic assembly using an edge coupler 507. Similar components or parts of the packages 400 and 500 have similar numerical designations and are not described repeatedly. Figure 13 to Figure 14 The packages 400 and 500 are intended as representative examples of packages that can be connected using the connectors described herein, and other packages, components, devices, or configurations thereof can be used in other cases. Using the connectors described herein can allow for more reliable connections between photonic packages and optical fibers while also improving system transmission speed and efficiency.

[0060] refer to Fig.13, according to some embodiments, the package 400 includes a photon engine 402 attached to a package substrate 440. The photon engine 402 includes an electronic die 422 connected to a photon die 420. The electronic die 422 can be located above the photon die 420 and bonded to the photon die 420. According to some embodiments, the electronic die 422 includes an integrated circuit for interfacing with the photon die 420, such as a circuit for controlling the operation of the photon die 420 or the photon assembly 406. For example, the electronic die 422 can include a controller, a driver, an amplifier, etc. or a combination thereof, and can include a serializer / deserializer (SerDes) function. The corresponding components in the electronic die 422 can be used as part of an I / O interface between optical signals and electrical signals.

[0061] The photonic die 420 may include a waveguide 404, such as a silicon waveguide, a silicon nitride waveguide, or other types of waveguides. The photonic die 420 may include a photonic component 406, such as a modulator, a photodetector, etc. For example, the photodetector may be optically coupled to the waveguide 404 to detect an optical signal within the waveguide 404 and generate an electrical signal corresponding to the optical signal. The modulator may be optically coupled to the waveguide 404 to receive the electrical signal and generate a corresponding optical signal within the waveguide 404 by modulating the optical power within the waveguide 404. Fig.13 The photonic die 420 also includes a grating coupler 407 that optically couples the waveguide 404 to the first optical fiber array 410A. Interconnect structures can be formed above and / or below the waveguide 404 and the photonic assembly 406. Each interconnect structure can include multiple dielectric layers and metal lines and vias located in the multiple dielectric layers. In some embodiments, optical signals and / or optical power can be transmitted through the dielectric layer of the upper interconnect structure, such as Fig.13 As shown. In such an embodiment, the first optical fiber array 410A can be attached to the upper interconnect structure using, for example, optical glue. The interconnect structures on the opposite sides of the photonic tube core 420 can be electrically interconnected through through holes. In some embodiments, the electronic tube core 422 can be bonded to the upper interconnect structure using dielectric to dielectric bonding and / or metal to metal bonding (e.g., direct bonding, fusion bonding, oxide to oxide bonding, hybrid bonding, etc.). In other embodiments, the electronic tube core 422 can be bonded to the upper interconnect structure using solder bumps, etc.

[0062] In some embodiments, the conductive connector 444 is formed on and electrically connected to the lower interconnect structure of the photonic die 420. In some embodiments, the conductive connector 444 may include a solder ball, a solder bump, or the like. For example, the conductive connector 444 may include a ball grid array (BGA) connector, a solder ball, a metal pillar, a controlled collapse chip connection (C4) bump, a microbump, a bump formed by electroless nickel-electroless palladium immersion gold technology (ENEPIG), or the like. The conductive connector 444 may include a conductive material such as solder, copper, aluminum, gold, nickel, silver, palladium, tin, or the like, or a combination thereof. In some embodiments, the conductive connector 444 is formed by initially forming a solder layer by such common methods as evaporation, electroplating, printing, solder transfer, ball placement, or the like. Once the solder layer is formed on the structure, a reflow may be performed to shape the material into a desired bump shape. In another embodiment, the conductive connector 444 includes a metal pillar (such as a copper pillar) formed by sputtering, printing, electroplating, chemical plating, CVD, etc. The metal pillar can be solder-free and have substantially vertical sidewalls. In some embodiments, a metal capping layer (not shown) is formed on top of the conductive connector 444. The metal capping layer can include nickel, tin, tin-lead, gold, silver, palladium, indium, nickel-palladium-gold, nickel-gold, etc. or a combination thereof, and can be formed by a plating process.

[0063] In some embodiments, the package substrate 440 includes conductive pads, conductive wiring, and / or other conductive components that provide interconnection and electrical wiring. In some embodiments, the package substrate 440 may include an interposer, a semiconductor substrate, a redistribution structure, an interconnect substrate, a core substrate, a printed circuit board (PCB), etc. In some embodiments, the package substrate 440 includes active and / or passive devices. In other embodiments, the package substrate 440 has no active and / or passive devices. In some embodiments, a conductive connector 442 is formed on the package substrate 440, and the conductive connector 442 may be similar to the conductive connector 444 described above.

[0064] In some embodiments, the conductive connectors 444 of the photon engine 402 are placed on corresponding conductive pads of the packaging substrate 440, and a reflow process is then performed to bond the photon engine 402 to the packaging substrate 440. In this manner, the photon engine 402 can be electrically connected to the packaging substrate 440. In other embodiments, the photon engine 402 can be bonded to the packaging substrate 440 using dielectric-to-dielectric bonding and / or metal-to-metal bonding. In some embodiments, an underfill 446 can be deposited between the photon engine 402 and the packaging substrate 440. In other embodiments, other dies, chips, packages, etc. are also bonded to the packaging substrate 440. In this manner, the connectors described herein can be used to optically couple an external fiber array to a grating coupler of a package. Fig.13The package 400 shown is an example, and in other embodiments, the various components of the package 400 may have a different arrangement.

[0065] refer to Fig.14 According to some embodiments, package 500 includes a photon engine 502 attached to package substrate 440. Photon engine 502 is similar to Fig.13 4. The photon engine 402 of the embodiment of the present invention is similar to the photon engine 402 of the present invention, except that the photon engine 502 includes a photon die 520 that includes an edge coupler 507 instead of a grating coupler 407. The edge coupler 507 optically couples the waveguide 404 of the photon die 520 to the first optical fiber array 410A. Therefore, the first optical fiber array 410A is attached to the sidewall of the photon die 520 (e.g., using optical glue, etc.) to optically couple to the edge coupler 507. In this way, the connectors described herein can be used to optically couple an external optical fiber array to an edge coupler of a package. Fig.14 The illustrated package 500 is an example, and in other embodiments, the various components of the package 500 may have a different arrangement.

[0066] Embodiments of the present disclosure have some advantageous features. The connectors described herein allow two optical fiber arrays (or other optical fiber components) to be connected with improved accuracy. The connectors described herein utilize springs, magnets, or a combination thereof to ensure the stability and accuracy of the connection. In some cases, the connectors described herein allow the optical fiber arrays to be automatically aligned with high accuracy. Some embodiments describe adjustment members, which can be used to adjust the alignment of the connected optical fiber arrays to improve coupling efficiency and reduce insertion loss. In addition, the connectors described herein allow the fixed connection of the optical fiber arrays, while also allowing the optical fiber arrays to be removed and disconnected. This can improve the convenience of repairing or replacing the optical fiber arrays, and thus reduce maintenance time and cost. Therefore, the connectors described herein are modular connectors, which facilitate convenient disassembly and repair. The automatic correction and connection features of the connectors described herein can reduce human errors, improve stability, and improve the reliability of the photon system. The connectors described herein can also be compatible with different types of optical fibers, including different types of connections, so this increases the diversity and application range of the photon system.

[0067] According to an embodiment of the present disclosure, a device includes: a first optical fiber array including a first optical fiber and a first magnetic member; a second optical fiber array including a second optical fiber and a second magnetic member; and a connector including a third magnetic member adjacent to an opening, wherein the opening extends from a first side of the connector to a second side of the connector, wherein the first magnetic member of the first optical fiber array corresponds to the third magnetic member near the first side, and wherein the second magnetic member of the second optical fiber array corresponds to the third magnetic member near the second side. In an embodiment, the first magnetic member is located on opposite vertical side walls of the first optical fiber array, and the third magnetic member is located on opposite vertical side walls of the opening. In an embodiment, the third magnetic member includes a first group of third magnetic members located near the first side and a second group of third magnetic members located near the second side. In an embodiment, the first optical fiber array has a different thickness from the second optical fiber array. In an embodiment, the connector is annular. In an embodiment, the first magnetic member is at least partially located within the opening. In an embodiment, the first optical fiber array is optically coupled to a grating coupler of a photonic core. In an embodiment, the first optical fiber array is optically coupled to an edge coupler of a photonic core.

[0068] According to an embodiment of the present disclosure, a device includes: an annular connector, the annular connector includes an opening, a first alignment member located at a first side of the opening, and a second alignment member located at a second side of the opening, wherein the opening is shaped to receive a first optical fiber array on a first side and receive a second optical fiber array on a second side, wherein the first alignment member is configured to align the first optical fiber array within the opening, and wherein the second alignment member is configured to align the second optical fiber array within the opening. In an embodiment, the first alignment member includes a first plate mechanically connected to a first surface of the opening by at least one first spring. In an embodiment, the first alignment member also includes a second plate mechanically connected to a second surface of the opening by at least one second spring. In an embodiment, the first alignment member includes a threaded shaft rotatably extending through the annular connector to the first plate. In an embodiment, the first alignment member includes a magnetic member. In an embodiment, the first alignment member includes a first magnet, and the second alignment member includes a second magnet. In an embodiment, the first optical fiber array includes a third magnet corresponding to the first magnet.

[0069] According to an embodiment of the present disclosure, a method includes bringing an end of a first optical fiber array to the vicinity of an end of a second optical fiber array, wherein the first optical fiber array includes a first magnet and the second optical fiber array includes a second magnet; magnetically attracting the first magnet to a third magnet to align the end of the first optical fiber array with the end of the second optical fiber array; and magnetically attracting the second magnet to a fourth magnet to align the end of the second optical fiber array with the end of the first optical fiber array. In an embodiment, bringing the end of the first optical fiber array to the vicinity of the end of the second optical fiber array includes inserting the end of the first optical fiber array and the end of the second optical fiber array into an annular connector, wherein the annular connector includes a third magnet and a fourth magnet. In an embodiment, magnetically attracting the first magnet to the third magnet aligns the end of the first optical fiber in the first optical fiber array with the end of the second optical fiber in the second optical fiber array. In an embodiment, the first optical fiber array includes a fourth magnet, and the second optical fiber array includes a third magnet. In an embodiment, magnetically attracting the first magnet to the third magnet aligns the first transient coupler in the first optical fiber array with the second transient coupler in the second optical fiber array.

[0070] The features of several embodiments are summarized above so that those skilled in the art can better understand aspects of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis to design or modify other processes and structures for implementing the same purpose and / or achieving the same advantages as the embodiments introduced herein. Those skilled in the art should also appreciate that such equivalent constructions do not deviate from the spirit and scope of the present disclosure, and that they can make various changes, substitutions, and modifications herein without departing from the spirit and scope of the present disclosure.

Claims

1. A semiconductor device, comprising: A first optical fiber array includes a plurality of first optical fibers and a plurality of first magnetic members; A second optical fiber array includes a plurality of second optical fibers and a plurality of second magnetic members; as well as A connector comprising a plurality of third magnetic members adjacent to an opening, wherein the opening extends from a first side of the connector to a second side of the connector, wherein the first magnetic member of the first optical fiber array corresponds to a third magnetic member adjacent to the first side, and wherein the second magnetic member of the second optical fiber array corresponds to a third magnetic member adjacent to the second side.

2. The semiconductor device according to claim 1, wherein The first magnetic members are located on opposite vertical side walls of the first optical fiber array, and the third magnetic members are located on opposite vertical side walls of the opening.

3. The semiconductor device according to claim 1, wherein The plurality of third magnetic members include a first group of third magnetic members located proximate the first side and a second group of third magnetic members located proximate the second side.

4. The semiconductor device according to claim 1, wherein: The first optical fiber array has a different thickness than the second optical fiber array.

5. The semiconductor device according to claim 1, wherein The connecting piece is annular.

6. The semiconductor device according to claim 1, wherein The plurality of first magnetic members are at least partially located within the opening.

7. The semiconductor device according to claim 1, wherein The first optical fiber array is optically coupled to a grating coupler of the photonic die.

8. The semiconductor device according to claim 1, wherein The first optical fiber array is optically coupled to an edge coupler of the photonic die.

9. A semiconductor device comprising: An annular connector comprises an opening, a first alignment member located at a first side of the opening, and a second alignment member located at a second side of the opening, wherein the opening is shaped to receive a first optical fiber array on the first side and to receive a second optical fiber array on the second side, wherein the first alignment member is configured to align the first optical fiber array within the opening, and wherein the second alignment member is configured to align the second optical fiber array within the opening.

10. A method of forming a semiconductor device, comprising: Bringing an end of a first optical fiber array proximate an end of a second optical fiber array, wherein the first optical fiber array includes a first magnet and the second optical fiber array includes a second magnet; magnetically attracting the first magnet to a third magnet to align the end of the first optical fiber array with the end of the second optical fiber array; and The second magnet is magnetically attracted to a fourth magnet to align the end of the second optical fiber array with the end of the first optical fiber array.