Automatic test system and method for temperature control circuit

Abstract

The invention discloses an automatic test system and method for a temperature control circuit, and aims to solve the technical problem that a mature and universal automatic test scheme for the temperature control circuit is lacked in the prior art. The automatic test system comprises an MCU control module, a test module, a power supply module and a temperature acquisition module. The MCU control module coordinates the work of each module; the test module comprises a relay change-over switch module and an I / O test module and can test different working condition performances of the tested equipment; the power module provides stable power. The temperature acquisition module sets a range to regulate and control temperature acquisition data. The test method comprises the steps that the MCU control module sends a signal, all the modules operate according to commands, the test module tests and feeds back data, the power module supplies power, the temperature collection module conducts temperature adjustment and collection, and the MCU control module judges the performance. Full-scale automatic testing is achieved, efficiency is improved, human errors are reduced, a reliable scheme is provided for temperature control circuit testing, and development of related industries is assisted.

Description

Technical Field

[0001] The present invention relates to the field of automated testing, and in particular to an automated testing system and method for a temperature control circuit. Background Art

[0002] In the modern electronic manufacturing industry, hybrid integrated circuits are widely used in various electronic devices due to their high performance and miniaturization. With the continuous growth of market demand, companies are accelerating the automation of production lines in order to improve production efficiency and product quality. As a key link in the design, manufacturing and application of hybrid integrated circuits, automated testing is crucial to improving test efficiency, reducing production costs, reducing human errors and ensuring the reliability of test results.

[0003] At present, the testing of hybrid integrated circuits faces the challenge of "small batches and multiple varieties", which limits the advancement of production line automation. In order to solve this problem, enterprises have developed automated testing equipment that can adapt to different types of products through intelligent technology transformation, thereby improving the utilization rate of automated equipment. This transformation has transformed automated equipment from a single function to a multi-function one, better meeting market demand.

[0004] As the core component of hybrid integrated circuits, the performance stability of the temperature control circuit is crucial to the entire system. The existing temperature control circuit test system mainly tests the power supply voltage and current, chip conversion temperature, ambient temperature test, and power-on asynchronous function within the temperature range of -55℃ to 125℃, and judges the logic output function of the digital signal. The test results are recorded and saved in the database to generate fixed reports.

[0005] However, there is a lack of mature and universal automatic testing solutions for temperature control circuits in the market. Existing test systems often have high customization costs, long development cycles, and relatively high subsequent upgrade and maintenance costs. These factors limit the further development of enterprises in automated testing. In addition, existing test systems also have deficiencies in information management, and the security and transmission efficiency of information need to be improved.

[0006] Therefore, it is necessary to independently develop a new automatic test solution for temperature control circuits to overcome the shortcomings of existing technologies and meet the market demand for efficient and reliable testing. The ideal test solution should be able to adapt to the temperature control circuit testing of different types of products, improve the utilization rate of automated equipment, and improve test efficiency, reduce costs, and reduce human errors through automation and information technology. Summary of the invention

[0007] The object of the present invention is to provide a temperature control circuit automatic testing system and method, so as to overcome the deficiency of the prior art in lacking a mature and universal temperature control circuit automatic testing solution.

[0008] In order to achieve the above object, the present invention adopts the following technical solution: A temperature control circuit automatic testing system, comprising: MCU control module, used to send control signals to the test module, power module, and temperature acquisition module, and receive test data fed back by the test module, power module, and temperature acquisition module for judgment; A test module, used to test the device under test according to the control signal of the MCU control module; A power module, used to supply power according to a control signal of the MCU control module; The temperature acquisition module adjusts the temperature of the test environment according to the control signal of the MCU control module, collects the data of the device under test at different temperatures, and feeds the collected data back to the MCU control module.

[0009] The test modules include: A relay switching module, including a plurality of relays, is used to configure test resources; The I / O test module is connected to the relay switch module on the one hand to drive it, and is connected to the device under test on the other hand to perform logic testing on it.

[0010] Among them, the relay switch module includes: The power supply switching module is used to connect the device under test to power supplies of different voltages in the power supply module to test the performance of the device under test under different power supply voltages; The resistance switching module is used to connect the device under test to channels with different resistance values ​​to test the performance of the device under test under different resistance values; The power-on asynchronous switching module is used to connect different pins of the device under test to the MCU control module to test the performance of the device under test at different voltage levels.

[0011] The power module includes: The equipment power supply serves as the main power supply to power the entire test system; The power supply for the component under test is connected to the test module to provide the power resources required for the test.

[0012] Among them, the temperature acquisition module includes: The temperature test module is connected to the MCU control module and adjusts the test temperature within a set range according to the signal of the MCU control module; The data acquisition module is connected to the device under test, collects some parameters of the device under test during the test process and sends them to the MCU control module.

[0013] The test temperature adjustment setting range of the temperature test module is -55℃~125℃.

[0014] A temperature control circuit automatic testing method comprises the following steps: The MCU control module sends control signals to the test module, power module, and temperature acquisition module; The test module tests the device under test according to the control signal of the MCU control module to obtain test data; The power module supplies power according to the control signal of the MCU control module to obtain the power required for the test; The temperature acquisition module adjusts the temperature of the test environment according to the control signal of the MCU control module, collects the data of the device under test at different temperatures, and feeds the collected data back to the MCU control module to obtain the test data at different temperatures; The MCU control module receives the test data to judge the performance of the device under test.

[0015] Among them, the step test module tests the device under test according to the control signal of the MCU control module, including: The test module connects the device under test to power supplies of different voltages in the power module, and provides the MCU control module with test data of the device under test at different power supply voltages; The test module connects the device under test to channels with different resistance values, and provides the MCU control module with test data of the device under test in different resistance states; The test module connects different pins of the device under test to the MCU control module, and provides the MCU control module with test data of the device under test at different voltage levels; The test module inputs a logic test signal to the device under test and provides the logic test data of the device under test to the MCU control module.

[0016] The step of the power supply module supplying power according to the control signal of the MCU control module includes: The power module receives the control signal from the MCU control module and determines the required power supply configuration; According to the required power supply configuration, activate the power supply channel that provides the corresponding voltage for the test module to connect; After the test module is connected, it provides power of corresponding voltage to the device under test.

[0017] Among them, the temperature acquisition module adjusts the temperature of the test environment according to the control signal of the MCU control module, collects the data of the device under test at different temperatures, and feeds the collected data back to the MCU control module, including: The temperature acquisition module receives the control signal of the MCU control module, adjusts the test temperature, and obtains the state parameters of the device under test at the test temperature; Send the state parameters of the device under test to the MCU control module, adjust the test temperature to the next test temperature point, and obtain the state parameters of the device under test at the test temperature; Repeat the steps of: the temperature acquisition module receives the control signal of the MCU control module, adjusts the test temperature, obtains the state parameters of the device under test at the test temperature, and sends the state parameters of the device under test to the MCU control module, adjusts the test temperature to the next test temperature point, obtains the state parameters of the device under test at the test temperature, until all tests within the set test temperature range are completed.

[0018] Compared with the prior art, the present invention has the following beneficial technical effects: The present invention provides a temperature control circuit automatic test system, which realizes a highly automated and precise test process through close cooperation between modules. The centralized management of the MCU control module ensures the coordinated operation of various parts of the system, and improves the test efficiency and accuracy. The cooperation between the relay switching module and the I / O test module in the test module can comprehensively test the performance of the tested device in terms of different power supply voltages, resistance states, voltage levels and logical functions, effectively covering a variety of test requirements, and helping to quickly discover potential product problems. The power supply module provides a stable and flexibly configurable power supply, which can not only meet the system operation requirements, but also provide accurate power supply for the test of the tested device under different working conditions, and ensure the reliability of the test data. The temperature acquisition module accurately controls the temperature and collects data in a wide range of -55℃-125℃, which can simulate the impact of actual complex environmental temperature on the tested device, and provides a key basis for comprehensively evaluating product performance. The system as a whole improves the test efficiency, reduces the interference of human factors, helps to improve product quality, and reduces the test cost. It is suitable for product detection and quality control links in large-scale automated production, and promotes the efficient development of related industries.

[0019] The present invention provides an automatic test method for a temperature control circuit based on the above system architecture, and each step is closely connected and carried out in an orderly manner, which has significant advantages. The MCU control module uniformly sends a control signal to start the test process, so that the test process is highly controllable and repeatable, and the consistency and comparability of the test results are guaranteed. The test module performs diversified tests according to the control signal, and can comprehensively obtain the performance data of the device under test under different working conditions, providing rich information for accurate evaluation. The power module provides the corresponding voltage power supply according to the instruction, ensuring that the device under test is tested in a stable power supply environment, and avoiding the influence of power supply fluctuations on the test results. The temperature acquisition module realizes a detailed analysis of the performance of the device under test in the full temperature range by gradually adjusting the temperature and collecting data, which helps to find temperature-sensitive problems. The method realizes full-range automatic testing, replaces the manual testing method, greatly shortens the test time of a single circuit, improves the test efficiency, avoids human error operation, enhances the safety and efficiency of the test work, and provides a strong support means for the research and development, production and quality control of the temperature control circuit, which helps to improve the overall performance and market competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of an automatic testing system for a temperature control circuit in an embodiment of the present invention.

[0021] Figure 2 Schematic diagram of an automatic testing method for a temperature control circuit in an embodiment of the present invention.

[0022] Figure 3 The present invention is a schematic diagram of a temperature control circuit automatic testing method in which a testing module tests a device under test according to a control signal of an MCU control module.

[0023] Figure 4 The present invention is a schematic diagram of a power supply module supplying power according to a control signal of an MCU control module in an automatic test method for a temperature control circuit in an embodiment of the present invention.

[0024] Figure 5 This is a schematic diagram of a temperature acquisition module in an automatic test method for a temperature control circuit in an embodiment of the present invention that adjusts the temperature of the test environment according to a control signal of an MCU control module, collects data of the device under test at different temperatures, and feeds the collected data back to the MCU control module. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0029] Embodiment 1: A specific embodiment of the present invention provides a temperature control circuit automatic testing system, such as Figure 1 As shown, the system includes: The MCU control module, as the "central nervous system" of the system, has the ability to send control signals to other modules, and can efficiently receive and process feedback test data from the test module, power module, and temperature acquisition module to accurately determine the performance status of the device under test. Relying on the powerful computing and communication capabilities of the microcontroller, the module has built-in intelligent algorithms and data processing procedures to ensure the orderly issuance of test instructions and effective analysis of test results.

[0030] The test module, in which the relay switching module integrates the power supply switching module, the resistance switching module, and the power-on asynchronous switching module, uses multiple high-quality relays to configure test resources on demand. The power supply switching module can flexibly connect the device under test with different voltage power supplies in the power module to explore its performance under various power supply voltages; the resistance switching module realizes the switching of the device under test with different resistance channels, and analyzes the impact of resistance changes on device performance; the power-on asynchronous switching module focuses on adjusting the connection method between the pins of the device under test and the MCU, simulating the performance of the device under different voltage levels. The I / O test module can drive the relay switching module to operate, and at the same time connect to the device under test, input preset logic test signals, monitor the output in real time, and obtain logic test data. With precise logic level control and data acquisition capabilities, it provides strong support for comprehensive testing.

[0031] The power module is subdivided into power supply for equipment and power supply for tested components. The former serves as the cornerstone of the overall system power supply to ensure the stable operation of each module; the latter, as a programmable power supply, strictly follows the MCU instructions, outputs the precise power resources required for the test, and adapts to the power requirements of different test stages.

[0032] The temperature acquisition module, in which the temperature test module flexibly adjusts the test environment temperature within the setting range of -55℃ to 125℃ according to the MCU control signal, controls the temperature accuracy and stability with high-precision temperature control components and sensors. The data acquisition module directly interacts with the device under test to collect its key parameters such as voltage, current, signal frequency, etc. during different temperature test processes, and feeds back the data to the MCU control module in real time to build a complete temperature-performance data chain.

[0033] This specific implementation also provides a test method based on the above-mentioned temperature control circuit automatic test system, that is, a temperature control circuit automatic test method, such as Figure 2 As shown, the following steps are included: The MCU control module sends control signals to the test module, power module, and temperature acquisition module; The test module tests the device under test according to the control signal of the MCU control module to obtain test data; The power module supplies power according to the control signal of the MCU control module to obtain the power required for the test; The temperature acquisition module adjusts the temperature of the test environment according to the control signal of the MCU control module, collects the data of the device under test at different temperatures, and feeds the collected data back to the MCU control module to obtain the test data at different temperatures; The MCU control module receives the test data to judge the performance of the device under test.

[0034] During the specific implementation, the operator connects the device under test to the test module, and the MCU control module to the host computer, which is a computer device. The operator inputs the test instructions through the host computer. After the MCU control module receives the test instructions from the host computer, it analyzes and processes the test instructions and sends the corresponding working signal to the corresponding module. After receiving the working signal, the corresponding module starts the corresponding test process for the device under test.

[0035] Among them, Figure 3 As shown, the step test module tests the device under test according to the control signal of the MCU control module, including: Power supply switching test: The test module connects the device under test to power supplies of different voltages in the power module, and provides the MCU control module with test data of the device under test at different power supply voltages; Resistance switching test: The test module connects the device under test to channels with different resistance values, and provides the MCU control module with test data of the device under test in different resistance states; Power-on asynchronous test: The test module connects different pins of the device under test to the MCU control module, and provides the MCU control module with test data of the device under test at different voltage levels; Logic test: The test module inputs logic test signals to the device under test and provides logic test data of the device under test to the MCU control module.

[0036] When performing a power supply switching test, the relay switching module switches the power supply of the component under test by switching the connection between the internal relay and the different power supply voltages in the power module. The power supply for the component under test in the power module is a linear power supply that converts AC to DC.

[0037] When performing a resistance switching test, the relay switching switch module is connected to different resistance channels by switching internal relays. In this specific implementation, a number of relays are connected to different AD channels in the relay switching switch module. According to the signal of the MCU control module, the relays connected to different AD channels are connected to the device under test to achieve the acquisition of analog signal response data of the device under test in different resistance states.

[0038] When performing a power-on asynchronous test, the relay switching module is internally configured with multiple relays, each relay corresponds to a test pin of the device under test, and different relays are activated at different time points according to the received signal from the MCU control module. Various parts of the device under test are powered on under different voltage conditions, realizing the simulation of a power-on asynchronous situation.

[0039] When performing logic testing, the I / O test module inputs signals to the device under test after receiving test instructions, and collects output signals after the device under test is running. The I / O test module sends the output signals of the device under test to the MCU control module for judgment, and obtains the test results of the logical function integrity test of the device under test.

[0040] Among them, Figure 3 As shown, the power supply module supplies power according to the control signal of the MCU control module, including: The power module receives the control signal from the MCU control module and determines the required power supply configuration; According to the required power supply configuration, activate the power supply channel that provides the corresponding voltage for the test module to connect; After the test module is connected, it provides power of corresponding voltage to the device under test.

[0041] The device power supply in the power module continues to serve as the main power supply to power the entire test system. After parsing the control signal received from the MCU control module, the power supply of the tested component compares it with the power supply configuration of the tested component power supply itself to determine the required power supply configuration parameters, and then activates the corresponding voltage generation unit to make the power supply channel corresponding to the voltage required for the test enter the working state, so as to connect the corresponding relay in the test module, thereby realizing the power supply for the power supply switching test of the tested device.

[0042] Among them, Figure 4 As shown in the figure, the temperature acquisition module adjusts the temperature of the test environment according to the control signal of the MCU control module, collects the data of the device under test at different temperatures, and feeds the collected data back to the MCU control module, including: The temperature acquisition module receives the control signal of the MCU control module, adjusts the test temperature, and obtains the state parameters of the device under test at the test temperature; Send the state parameters of the device under test to the MCU control module, adjust the test temperature to the next test temperature point, and obtain the state parameters of the device under test at the test temperature; Repeat the steps of: the temperature acquisition module receives the control signal of the MCU control module, adjusts the test temperature, obtains the state parameters of the device under test at the test temperature, and sends the state parameters of the device under test to the MCU control module, adjusts the test temperature to the next test temperature point, obtains the state parameters of the device under test at the test temperature, until all tests within the set test temperature range are completed.

[0043] After the temperature acquisition module receives the control signal from the MCU control module, its built-in temperature control chip will start the corresponding temperature adjustment mechanism according to the temperature setting value in the signal. First, the temperature control chip sends a drive signal to the cooling and heating elements connected to the test environment, such as high-precision semiconductor refrigerators and heating wires, to accurately adjust their power output to change the test environment temperature. During the temperature adjustment process, multiple high-precision temperature sensors distributed in the test environment, such as platinum resistance temperature sensors, will monitor the changes in ambient temperature in real time and feed back the temperature data to the temperature control chip. The temperature control chip uses advanced PID algorithms to analyze and process the feedback data. By continuously adjusting the working status of the cooling and heating elements, the test environment temperature quickly and stably approaches and eventually reaches the set test temperature value, and the error is controlled within a very small range, generally accurate to ±0.1°C.

[0044] When the test environment temperature stabilizes at the set value, the data acquisition unit starts working. The data acquisition unit is connected to multiple key test points of the device under test through low-noise, high-impedance signal acquisition cables, and uses a high-precision analog-to-digital converter (ADC) to synchronously collect various state parameters of the device under test at this temperature, such as operating voltage, operating current, key signal frequency, and internal chip temperature. After preliminary filtering, amplification, and digital processing, the collected data is transmitted to the data cache unit for temporary storage.

[0045] Subsequently, the data transmission module sends the state parameters of the device under test in the cache to the MCU control module completely and accurately according to the predetermined communication protocol, such as high-speed SPI or Ethernet protocol. After receiving the data, the MCU control module stores and organizes the data on the one hand, and performs preliminary integrity and rationality checks on the data on the other hand.

[0046] After completing the data collection and transmission at the current test temperature, the temperature acquisition module calculates the next test temperature point according to the preset test temperature sequence. Then, repeat the above temperature adjustment process again, that is, drive the cooling and heating elements through the temperature control chip to change the ambient temperature, use the temperature sensor feedback and PID algorithm to stabilize the temperature at the new set value, and then the data acquisition unit collects the state parameters of the device under test at this temperature, and sends them to the MCU control module after processing. This cycle is repeated, and within the entire set test temperature range (for example, from -55°C to 125°C), tests are performed in sequence according to the set temperature step (such as 5°C) until the test work at all temperature points is completed. During this period, the temperature acquisition module always maintains precise control and stable operation of the temperature adjustment and data acquisition process, providing comprehensive and reliable data support for the performance evaluation of the device under test in different temperature environments.

[0047] Embodiment 2: This specific embodiment provides another use scenario of a temperature control circuit automatic test system and method. The temperature control circuit automatic test system is mainly composed of an MCU control module, a test module, a power module and a temperature acquisition module. Each module works together to achieve a comprehensive test of the device under test (DUT) under different temperature and power conditions.

[0048] The MCU control module uses the STC15F2K60S2 microcontroller, which is the control center of the system. It interacts with the host computer through the RS-232 interface, receives test parameters and instructions, and coordinates the work of other modules based on the custom communication protocol. It sends control signals to the test, power supply, and temperature acquisition modules, and receives feedback data for processing and analysis. In PCB design, the layout is optimized to ensure anti-interference with other modules, decoupling capacitors are arranged around the chip, the crystal oscillator circuit is reasonably laid out, and the IO port wiring is regular to ensure signal transmission quality.

[0049] The relay switching module contains multiple relays for configuring test resources. The power supply switching module can connect the device under test to power supplies of different voltages to test the performance under different power supply voltages; the resistance switching module connects the device under test to channels of different resistance values ​​to analyze the characteristics of different resistance loads; the power-on asynchronous switching module connects the pins of the device under test to the MCU control module to simulate power-on conditions at different voltage levels.

[0050] On the one hand, the I / O test module drives the relay switching module to ensure that the test environment is configured correctly; on the other hand, it inputs logic test signals, such as pulses or logic level combinations, to the device under test, while monitoring the output signals, comparing and analyzing them to form truth table-like data, which is then transmitted to the MCU control module to determine the logical function of the device under test.

[0051] The power supply for the equipment in the power module converts AC 220V into a variety of DC voltages to power each module of the system. The power supply for the tested component uses a linear power supply with small ripple, which outputs different voltages under the control of the MCU control module to meet the test requirements of the tested device. The internal voltage and current sensors monitor the power supply parameters in real time and feed back to the MCU control module. The MCU control module monitors according to the threshold and takes measures such as cutting off the power supply or alarming when abnormal to ensure system safety.

[0052] The temperature test module is connected to the MCU control module, and uses high-precision temperature control chips and sensors to adjust the test environment temperature in the range of -55℃-125℃. By driving the cooling and heating elements to change the temperature, the sensor feedbacks data, and uses the PID algorithm for closed-loop control, the temperature reaches the target value with minimal error, providing a stable test environment.

[0053] The data acquisition module is directly connected to the device under test and connected to key test points via signal acquisition cables. It uses a high-precision ADC to synchronously collect parameters such as operating voltage, current, signal frequency, chip temperature, etc., and transmits them to the MCU control module after processing.

[0054] When using the above system to automatically test the temperature control circuit, the system is initialized and prepared first. The system is powered on, and the device power supply starts to power the module. The MCU control module is initialized and communicates with the host computer to receive instructions. The temperature acquisition module self-checks and calibrates, and feedbacks the initial temperature; the power supply module resets the output of the tested element power supply, and the device power supply reports the status after stabilization; the test module relay is reset, and the I / O test module presets the logic level and prepares for testing.

[0055] The operator sends control signals to the MCU control module through the host computer, and sends control signals to other modules through RS-232, including test module relay switching instructions, power module power configuration instructions, temperature acquisition module temperature setting and heating rate instructions. The relay switching module operates the relay according to the instructions of the MCU control module, connecting the device under test with the corresponding test resources. The I / O test module inputs the logic test signal and monitors the output, collects and analyzes the data and then feeds it back to the MCU control module. The power module parses the power configuration instructions of the MCU control module, activates the corresponding voltage channel, calibrates the current and voltage stabilization, and then supplies power to the device under test through the test module, continuously monitors and feeds back the parameters. The temperature test module receives the signal of the MCU control module, drives the cooling and heating elements to adjust the temperature, and the sensor feeds back the data, and uses the PID algorithm to control the temperature to the target value. After stabilization, the data acquisition module collects the state parameters of the device under test and transmits them to the MCU control module. After completing the current temperature test, the temperature is adjusted in sequence to continue collecting until the full temperature range test of -55℃-125℃ is completed. The MCU control module collects the test data, evaluates the performance of the device under test according to the algorithm and threshold, and records and analyzes the abnormal data. The results are transmitted to the host computer to generate a visual test report containing basic information, test data, performance evaluation and abnormal analysis, which can be saved and printed out to provide support for circuit research and development, production and quality control.

[0056] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A temperature control circuit automatic testing system, characterized in that: include: MCU control module, used to send control signals to the test module, power module, and temperature acquisition module, and receive test data fed back by the test module, power module, and temperature acquisition module for judgment; A test module, used to test the device under test according to the control signal of the MCU control module; A power module, used to supply power according to a control signal of the MCU control module; The temperature acquisition module adjusts the temperature of the test environment according to the control signal of the MCU control module, collects the data of the device under test at different temperatures, and feeds the collected data back to the MCU control module.

2. A temperature control circuit automatic testing system according to claim 1, characterized in that: The test module includes: A relay switching module, including a plurality of relays, is used to configure test resources; The I / O test module is connected to the relay switch module on the one hand to drive it, and is connected to the device under test on the other hand to perform logic testing on it.

3. A temperature control circuit automatic testing system according to claim 2, characterized in that: The relay switch module comprises: The power supply switching module is used to connect the device under test to power supplies of different voltages in the power supply module to test the performance of the device under test under different power supply voltages; The resistance switching module is used to connect the device under test to channels with different resistance values ​​to test the performance of the device under test under different resistance values; The power-on asynchronous switching module is used to connect different pins of the device under test to the MCU control module to test the performance of the device under test at different voltage levels.

4. The temperature control circuit automatic testing system according to claim 1, characterized in that: The power module comprises: The equipment power supply serves as the main power supply to power the entire test system; The power supply for the component under test is connected to the test module to provide the power resources required for the test.

5. The temperature control circuit automatic testing system according to claim 1, characterized in that: The temperature acquisition module comprises: The temperature test module is connected to the MCU control module and adjusts the test temperature within a set range according to the signal of the MCU control module; The data acquisition module is connected to the device under test, collects some parameters of the device under test during the test process and sends them to the MCU control module.

6. A temperature control circuit automatic testing system according to claim 5, characterized in that: The test temperature adjustment setting range of the temperature test module is -55°C~125°C.

7. A temperature control circuit automatic testing method, characterized in that: The following steps are involved: The MCU control module sends control signals to the test module, power module, and temperature acquisition module; The test module tests the device under test according to the control signal of the MCU control module to obtain test data; The power module supplies power according to the control signal of the MCU control module to obtain the power required for the test; The temperature acquisition module adjusts the temperature of the test environment according to the control signal of the MCU control module, collects the data of the device under test at different temperatures, and feeds the collected data back to the MCU control module to obtain the test data at different temperatures; The MCU control module receives the test data to judge the performance of the device under test.

8. The automatic testing method for a temperature control circuit according to claim 7, characterized in that: The step test module tests the device under test according to the control signal of the MCU control module, including: The test module connects the device under test to power supplies of different voltages in the power module, and provides the MCU control module with test data of the device under test at different power supply voltages; The test module connects the device under test to channels with different resistance values, and provides the MCU control module with test data of the device under test in different resistance states; The test module connects different pins of the device under test to the MCU control module, and provides the MCU control module with test data of the device under test at different voltage levels; The test module inputs a logic test signal to the device under test and provides the logic test data of the device under test to the MCU control module.

9. The automatic testing method for a temperature control circuit according to claim 7, characterized in that: The step of the power supply module supplying power according to the control signal of the MCU control module includes: The power module receives the control signal from the MCU control module and determines the required power supply configuration; According to the required power supply configuration, activate the power supply channel that provides the corresponding voltage for the test module to connect; After the test module is connected, it provides power of corresponding voltage to the device under test.

10. The automatic testing method for a temperature control circuit according to claim 7, characterized in that: The temperature acquisition module in the step adjusts the temperature of the test environment according to the control signal of the MCU control module, collects data of the device under test at different temperatures, and feeds the collected data back to the MCU control module, including: The temperature acquisition module receives the control signal of the MCU control module, adjusts the test temperature, and obtains the state parameters of the device under test at the test temperature; Send the state parameters of the device under test to the MCU control module, adjust the test temperature to the next test temperature point, and obtain the state parameters of the device under test at the test temperature; Repeat the steps of: the temperature acquisition module receives the control signal of the MCU control module, adjusts the test temperature, obtains the state parameters of the device under test at the test temperature, and sends the state parameters of the device under test to the MCU control module, adjusts the test temperature to the next test temperature point, obtains the state parameters of the device under test at the test temperature, until all tests within the set test temperature range are completed.

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