Adaptive temperature control system

Abstract

An adaptive temperature control system includes: a computing component; an internal heat sink, the internal heat sink coupled to the computing component; a TEC in thermal communication with the internal heat sink; an outer heat sink including a shell surrounding the computing component, the inner heat sink, and the TEC; a sensor configured to detect a temperature of the computing component; a processor having access to a memory medium, the memory medium storing instructions executable by the processor to perform operations including: comparing the temperature of the computing component to a first threshold; determining that the temperature of the computing component is greater than a first threshold; in response to determining that the temperature of the computing component is greater than the first threshold: adjusting a temperature control mode of the TEC such that heat transferred from the computing component to the TEC through the internal heat sink is transferred by the TEC to the external heat sink.

Description

Technical Field

[0001] The present disclosure relates generally to an information handling system, and more particularly to an adaptive temperature control system for an information handling system. Background Art

[0002] As the value and use of information continue to increase, individuals and businesses seek other ways to process and store information. One option available to users is an information handling system. An information handling system typically processes, compiles, stores and / or communicates information or data for a business, individual or other purpose, thereby allowing users to take advantage of the value of this information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also differ in what information to handle, how to handle information, how much information to process, store or communicate, and how quickly and efficiently information can be processed, stored or communicated. Changes in information handling systems allow information handling systems to be general or configured for specific users or specific uses (such as financial transaction processing, flight reservations, enterprise data storage or global communications). In addition, an information handling system may include a variety of hardware and software components that can be configured to process, store and communicate information, and may include one or more computer systems, data storage systems and networking systems. Summary of the invention

[0003] Innovative aspects of the subject matter described in this specification may be embodied in an adaptive temperature control system comprising: a computing component; an internal heat sink coupled to the computing component; a thermoelectric cooler (TEC) in thermal communication with the internal heat sink; an external heat sink comprising a shell surrounding the computing component, the internal heat sink, and the TEC; a sensor configured to detect a temperature of the computing component; a processor having access to a memory medium storing instructions executable by the processor to perform operations comprising: comparing the temperature of the computing component to a first threshold; determining, based on the comparison, that the temperature of the computing component is greater than the first threshold; in response to determining that the temperature of the computing component is greater than the first threshold: adjusting a temperature control mode of the TEC so that heat transferred from the computing component to the TEC through the internal heat sink is transferred by the TEC to the external heat sink.

[0004] Other embodiments of these aspects include corresponding systems, apparatus, and computer programs configured to perform the actions of the methods and encoded on computer storage devices.

[0005] These and other embodiments may each optionally include one or more of the following features. For example, determining that the temperature of the computing component is less than a second threshold based on the comparison; in response to determining that the temperature of the computing component is less than the second threshold: adjusting the temperature control mode of the TEC to a second mode so that heat transferred from the external heat sink to the TEC is transferred by the TEC to the computing component through the internal heat sink. Adjusting the temperature control mode includes adjusting the polarity of the current provided to the TEC. Determining that the temperature of the computing component is less than the first threshold and greater than the second threshold based on the comparison; in response to determining that the temperature of the computing component is less than the first threshold and greater than the second threshold: adjusting the power state of the TEC to a power-off state. The TEC is coupled to the internal heat sink. The TEC is coupled to the external heat sink. An additional internal heat sink, the additional internal heat sink is thermally connected to the internal heat sink, the additional internal heat sink is spaced apart from the internal heat sink, wherein the additional external heat sink is coupled to the computing component. One or more heat pipes, the one or more heat pipes are coupled between the additional internal heat sink and the internal heat sink, wherein the one or more heat pipes are thermally connected between the additional heat sink and the internal heat sink. An additional computing component is in thermal communication with the internal heat sink, the additional computing component being spaced apart from the internal heat sink.

[0006] The details of one or more embodiments of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other potential features, aspects, and advantages of the subject matter will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a block diagram of selected elements of an embodiment of an information handling system.

[0008] Figure 2 , Figure 4 , Figure 6 A corresponding block diagram of an information handling system including a temperature control system is shown.

[0009] Figure 3 , Figure 5 , Figure 7 A corresponding side view of a portion of a temperature control system is shown.

[0010] Figure 8 A perspective view of an external heat sink is shown.

[0011] Fig. 9 A method for adaptive temperature control is shown. DETAILED DESCRIPTION

[0012] The present disclosure discusses an adaptive temperature control system for an information handling system. Briefly, the regulation (cooling and / or heating) of the temperature of a computing component is discussed, including the use of a thermoelectric cooler. An external heat sink, a housing for the external heat sink, and / or a housing for an information handling system may be used to facilitate temperature control of the computing component.

[0013] Specifically, the present disclosure discusses an adaptive temperature control system, which includes: a computing component; an internal heat sink, which is coupled to the computing component; a thermoelectric cooler (TEC), which is thermally connected to the internal heat sink; an external heat sink, which includes a shell surrounding the computing component, the internal heat sink and the TEC; a sensor, which is configured to detect the temperature of the computing component; a processor, which has access to a memory medium, which stores instructions, which can be executed by the processor to perform operations, the operations including: comparing the temperature of the computing component with a first threshold; determining that the temperature of the computing component is greater than the first threshold based on the comparison; in response to determining that the temperature of the computing component is greater than the first threshold: adjusting the temperature control mode of the TEC so that the heat transferred from the computing component to the TEC through the internal heat sink is transferred by the TEC to the external heat sink.

[0014] In the following description, details are set forth by way of examples to facilitate discussion of the disclosed subject matter. However, it should be apparent to one of ordinary skill in the art that the disclosed embodiments are exemplary rather than exhaustive of all possible embodiments.

[0015] For purposes of this disclosure, an information handling system may include a tool or collection of tools operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, indicate, detect, record, reproduce, dispose of, or utilize various forms of information, intelligence, or data for commercial, scientific, control, entertainment, or other purposes. For example, an information handling system may be a personal computer, a PDA, a consumer electronic device, a network storage device, or another suitable device, and may vary in size, shape, performance, functionality, and price. An information handling system may include a memory, one or more processing resources (such as a central processing unit (CPU)), or hardware or software control logic. Additional components of an information handling system may include one or more storage devices, one or more communication ports for communicating with external devices, and various other input / output (I / O) devices (such as a keyboard, a mouse, and a video display). An information handling system may also include one or more buses operable to transmit communications between various hardware components.

[0016] For purposes of this disclosure, a computer-readable medium may include a tool or collection of tools that can retain data and / or instructions for a period of time. Computer-readable media may include, but are not limited to: storage media such as direct access storage devices (e.g., hard drives or floppy disks), sequential access storage devices (e.g., tape disk drives), compact discs, CD-ROMs, DVDs, random access memories (RAM), read-only memories (ROMs), electrically erasable programmable read-only memories (EEPROMs), and / or flash memories (SSDs); and communication media such as wires, optical fibers, microwaves, radio waves, and other electromagnetic and / or optical carrier waves; and / or any combination of the foregoing.

[0017] By reference Figures 1 to 9 To best understand the particular embodiments, like reference numerals are used to designate like and corresponding parts.

[0018] Turning now to the accompanying drawings, Figure 1 A block diagram depicting selected elements of an information handling system 100 according to some embodiments of the present disclosure is shown. In various embodiments, the information handling system 100 may represent different types of portable information handling systems, such as display devices, head-mounted displays, head-mounted display systems, smart phones, tablet computers, notebook computers, media players, digital cameras, two-in-one tablet-laptop combination computers, and wireless organizers or other types of portable information handling systems. In one or more embodiments, the information handling system 100 may also represent other types of information handling systems, including desktop computers, server systems, controllers and microcontroller units, and other types of information handling systems. The components of the information handling system 100 may include, but are not limited to: a processor subsystem 120, which may include one or more processors; and a system bus 121 that communicatively couples various system components to the processor subsystem 120, including, for example, a memory subsystem 130, an I / O subsystem 140, a local storage resource 150, and a network interface 160. The system bus 121 may represent various suitable types of bus structures, such as a memory bus, a peripheral bus, or a local bus using various bus architectures in selected embodiments. For example, such architectures may include, but are not limited to, Micro Channel Architecture (MCA) bus, Industry Standard Architecture (ISA) bus, Enhanced ISA (EISA) bus, Peripheral Component Interconnect (PCI) bus, PCI Express bus, HyperTransport (HT) bus, and Video Electronics Standards Association (VESA) local bus.

[0019] like Figure 1As depicted, processor subsystem 120 may include a system, device, or apparatus operable to interpret and / or execute program instructions and / or process data, and may include a microprocessor, a microcontroller, a digital signal processor (DSP), an application specific integrated circuit (ASIC), or another digital or analog circuit configured to interpret and / or execute program instructions and / or process data. In some embodiments, processor subsystem 120 may interpret and / or execute program instructions and / or process locally stored data (e.g., stored in memory subsystem 130 and / or another component of the information handling system). In the same or alternative embodiments, processor subsystem 120 may interpret and / or execute program instructions and / or process remotely stored data (e.g., stored in network storage resource 170).

[0020] Also in Figure 1 In the present invention, the memory subsystem 130 may include a system, device or apparatus (e.g., a computer readable medium) operable to retain and / or retrieve program instructions and / or data over a period of time. The memory subsystem 130 may include random access memory (RAM), electrically erasable programmable read-only memory (EEPROM), PCMCIA card, flash memory, magnetic storage device, optical magnetic storage device and / or a series and / or batch of suitable volatile or non-volatile memories that retain data after power is removed from its associated information handling system (such as system 100).

[0021] In information handling system 100, I / O subsystem 140 may include systems, devices, or apparatuses that are generally operable to receive data from and / or transmit data to / within information handling system 100. I / O subsystem 140 may represent, for example, various communication interfaces, graphics interfaces, video interfaces, user input interfaces, and / or peripheral interfaces. In various embodiments, I / O subsystem 140 may be used to support various peripheral devices, such as a touch panel, a display adapter, a keyboard, an accelerometer, a touch pad, a gyroscope, an IR sensor, a microphone, a sensor, or a camera or another type of peripheral device.

[0022] The local storage resources 150 may include computer-readable media (e.g., a hard drive, a floppy disk drive, a CD-ROM, and / or other types of rotating storage media, flash memory, EEPROM, and / or another type of solid-state storage media) and are generally operable to store instructions and / or data. Similarly, the network storage resources may include computer-readable media (e.g., a hard drive, a floppy disk drive, a CD-ROM, and / or other types of rotating storage media, flash memory, EEPROM, and / or another type of solid-state storage media) and are generally operable to store instructions and / or data.

[0023] exist Figure 1 , network interface 160 may be a suitable system, device, or apparatus operable to act as an interface between information handling system 100 and network 110. Network interface 160 may enable information handling system 100 to communicate via network 110 using suitable transmission protocols and / or standards, including but not limited to those listed below in the discussion of network 110. In some embodiments, network interface 160 may be communicatively coupled to network storage resources 170 via network 110. Network 110 may be a public network or a private (e.g., corporate) network. The network may be implemented as a storage area network (SAN), a personal area network (PAN), a local area network (LAN), a metropolitan area network (MAN), a wide area network (WAN), a wireless local area network (WLAN), a virtual private network (VPN), an intranet, the Internet, or another suitable architecture or system that facilitates the transmission of signals, data, and / or messages (commonly referred to as data), or may be a part of them. Network interface 160 may enable wired and / or wireless communications (eg, NFC or Bluetooth) to and / or from information handling system 100 .

[0024] In a particular embodiment, the network 110 may include one or more routers for routing data between the client information handling system 100 and the server information handling system 100. Devices on the network 110 (e.g., the client information handling system 100 or the server information handling system 100) may be addressed by corresponding network addresses, including, for example, Internet Protocol (IP) addresses, Internet names, Windows Internet Name Service (WINS) names, domain names, or other system names. In a particular embodiment, the network 110 may include one or more logical groupings of network devices, such as, for example, one or more sites (e.g., customer sites) or subnets. As an example, a corporate network may include potentially thousands of offices or branches, each of which has its own subnet (or multiple subnets) with many devices. One or more client information handling systems 100 may communicate with one or more server information handling systems 100 via any suitable connection, including, for example, a modem connection, a LAN connection including Ethernet, or a broadband WAN connection including DSL, cable, Ti, T3, fiber, Wi-Fi, or a mobile network connection including GSM, GPRS, 3G, or WiMax.

[0025] The network 110 may transmit data using a desired storage and / or communication protocol including, but not limited to, Fibre Channel, Frame Relay, Asynchronous Transfer Mode (ATM), Internet Protocol (IP), other packet-based protocols, Small Computer System Interface (SCSI), Internet SCSI (iSCSI), Serial Attached SCSI (SAS) or another transport operating with the SCSI protocol, Advanced Technology Attachment (ATA), Serial ATA (SATA), Advanced Technology Attachment Packet Interface (ATAPI), Serial Storage Architecture (SSA), Integrated Drive Electronics (IDE), and / or any combination thereof. The network 110 and its various components may be implemented using hardware, software, or any combination thereof.

[0026] Steering Figure 2 , Figure 2 An environment 200 is shown that includes an information handling system 202. Information handling system 202 may include a temperature control system 210. Temperature control system 210 may include a temperature control management computing module 220, a temperature sensor 222, a computing component 224, an internal heat sink 226, a thermoelectric cooler (TEC) 228, and an external heat sink 230. In some examples, information handling system 202 may be similar to Figure 1 In some examples, the temperature control management computing module 220 may be included in the information processing system 100 or including the information processing system. Figure 1 In some examples, the temperature control management computing module 220 is included in or communicates with a baseband management controller (BMC) of the information handling system 100. In some examples, the information handling system 202 may include multiple temperature control systems 210.

[0027] The computing component 224 may be in thermal communication with an internal heat sink 226. The internal heat sink 226 may be in thermal communication with the computing component 224 and a TEC 228. The TEC 228 may be in thermal communication with the internal heat sink 226 and an external heat sink 230. The external heat sink 230 may be in thermal communication with the TEC 228.

[0028] The sensor 222 may be in communication with the computing component 224. The thermal control management computing module 220 may be in communication with the sensor 222 and the TEC 228.

[0029] In brief, temperature control management computing module 220 may facilitate regulation (cooling and / or heating) of temperature of computing component 224, including utilizing TEC 228. In some examples, temperature control management computing module 220 may utilize external heat sink 230, a housing of external heat sink 230, and / or a housing of information handling system 202 to facilitate temperature control of computing component 224. Additionally, temperature control system 210 is fanless and avoids fan reliability issues and fan noise.

[0030] In a first embodiment, the temperature control system 210 may include a direct heat transfer embodiment. That is, based on the operating mode, the temperature control system 210 may directly utilize the internal heat sink 226 and the TEC 228 to transfer heat between the computing component 224 and the external heat sink 230 (housing) and transfer heat from the external heat sink 230 (housing) to the computing component 224, as further described herein.

[0031] Figure 3 A side view of a portion of a temperature control system 210 is shown. The temperature control system 210 may include a computing component 224. In some examples, the computing component 224 may include a central processing unit (CPU), a graphics processing unit (GPU), a memory, a chipset, or any other type of computing component. The temperature control system 210 may include an internal heat sink 226. The internal heat sink 226 may be coupled to the computing component 224. The internal heat sink 226 may facilitate the transfer of heat from the computing component 224 and / or the transfer of heat to the computing component 224.

[0032] The temperature control system 210 may include a TEC 228. The TEC 228 may be in thermal communication with an internal heat sink 226. The TEC 228 may be switched between temperature control modes (i.e., a heating control mode and a cooling control mode). Specifically, the temperature control management module 220 may provide a signal to control a power state of the TEC 228, and additionally, control a temperature control mode of the TEC 228 when the TEC 228 is in a powered-on state, as further described herein.

[0033] In some examples, TEC 228 is coupled to internal heat sink 226 .

[0034] The temperature control system 210 may include an external heat sink 230 . Figure 8 A perspective view of the external heat sink 230 is shown. The external heat sink 230 may include a housing 802. The housing 802 may surround the computing component 224, the internal heat sink 226, and the TEC 228.

[0035] In some examples, TEC 228 is coupled to external heat sink 230. In some examples, TEC 228 is in direct contact with a housing of external heat sink 230. In some examples, TEC 228 is additionally in contact with a housing of information handling system 202 (e.g., a housing or shell of the information handling system). For example, when information handling system 202 includes a portable computing device (such as a laptop / notebook computer), TEC 228 can be in direct contact with a cover ("D" cover) of the portable computing device. To this end, the housing of external heat sink 230 and / or the housing of information handling system 202 can facilitate heat transfer from and / or to computing component 224, as further described herein.

[0036] In some examples, external heat sink 230 is in direct contact with a housing (e.g., a housing or case of information handling system) of information handling system 202. For example, when information handling system 202 comprises a portable computing device (such as a laptop / notebook computer), external heat sink 230 may be in direct contact with a cover ("D" cover) of the portable computing device. To this end, the housing of external heat sink 230 and / or the housing of information handling system 202 may facilitate heat transfer from and / or to computing component 224, as further described herein.

[0037] Return to reference Figure 3 , the sensor 222 is configured to detect the temperature of the computing component 224. For example, the sensor 222 may detect the temperature of the computing component 224 and / or the environment near the computing component 224. The sensor 222 may provide the temperature of the computing component 224 to the temperature control management computing module 220. The sensor 222 may provide the temperature of the computing component 224 to the temperature control management computing module 220 in response to a request from the temperature control management computing module 220 or automatically at certain intervals (e.g., every 1 millisecond, 1 second).

[0038] For this purpose, refer to Figure 2 and Figure 3 , the temperature control management computing module 220 receives data indicating the temperature (of the computing component 224) from the sensor 222. The temperature control management computing module 220 compares the temperature of the computing component 224 to a first threshold. For example, the first threshold may be above the operating range of the information handling system 202. For example, the first threshold may be 90 degrees Celsius.

[0039] In some examples, the temperature control management calculation module 220 determines that the temperature of the computing component 224 is greater than the first threshold value based on the comparison. For example, the temperature of the computing component 224 is greater than 90 degrees Celsius. In response to determining that the temperature of the computing component 224 is greater than the first threshold value, the temperature control management calculation module 220 adjusts the temperature control mode of the TEC 228 by providing a signal to the TEC 228 to enable the cooling control mode of the TEC 228. Specifically, when the TEC 228 is in the cooling control mode, the heat generated by the computing component 224 and transferred through the internal heat sink 226 is transferred by the TEC 228 to the external heat sink 230. In some examples, the temperature control management calculation module 220 adjusts the polarity of the current provided to the TEC 228 so that the cooling mode of the TEC 228 is enabled.

[0040] In some examples, heat transferred by TEC 228 to external heat sink 230 is transferred directly to the housing of external heat sink 230. In some examples, heat transferred by TEC 228 to external heat sink 230 is transferred directly to the housing of information handling system 202.

[0041] To this end, after enabling the cooling control mode of TEC 228, temperature control management computing module 220 receives (at a later time) additional data indicating an updated temperature (of computing component 224) from sensor 222. Temperature control management computing module 220 compares the updated temperature of computing component 224 to the first threshold. In some examples, temperature control management computing module 220 determines, based on the comparison, that the temperature of computing component 224 is less than the first threshold. For example, the temperature of computing component 224 is less than 90 degrees Celsius. Temperature control management computing module 220 adjusts the power state of TEC 228 to the power-off state in response to determining that the temperature of computing component 224 is less than the first threshold.

[0042] In some examples, when the temperature control management computing module 220 receives data indicating the temperature (of the computing component 224) from the sensor 222, the temperature control management computing module 220 compares the temperature of the computing component 224 to a second threshold. For example, the second threshold may be below the operating range of the information handling system 202. For example, the first threshold may be 0 degrees Celsius.

[0043] The temperature control management calculation module 220 determines that the temperature of the computing component 224 is less than the second threshold value based on the comparison. For example, the temperature of the computing component 224 is less than 0 degrees Celsius. The temperature control management calculation module 220 adjusts the temperature control mode of the TEC 228 by providing a signal to the TEC 228 to enable the heating control mode of the TEC 228 in response to determining that the temperature of the computing component 224 is less than the second threshold value. Specifically, when the TEC 228 is in the heating control mode, the heat transferred from the external heat sink 230 to the TEC 228 is transferred by the TEC 228 to the computing component 224 through the internal heat sink 226.

[0044] In some examples, temperature control management computing module 220 adjusts the polarity of the current provided to TEC 228 so that a heating mode of TEC 228 is enabled. In some examples, the polarity is opposite to the polarity that enables a cooling mode of TEC 228. In some examples, the heat transferred by TEC 228 to computing component 224 is transferred directly from the housing of external heat sink 230. In some examples, the heat transferred by TEC 228 to computing component 224 is transferred directly from the housing of information handling system 202.

[0045] To this end, after enabling the heating control mode of the TEC 228, the temperature control management computing module 220 receives (at a later time) additional data indicating an updated temperature (of the computing component 224) from the sensor 222. The temperature control management computing module 220 compares the updated temperature of the computing component 224 to the second threshold. In some examples, the temperature control management computing module 220 determines, based on the comparison, that the temperature of the computing component 224 is greater than the second threshold. For example, the temperature of the computing component 224 is greater than 0 degrees Celsius. The temperature control management computing module 220 adjusts the power state of the TEC 228 to the power-off state in response to determining that the temperature of the computing component 224 is greater than the second threshold.

[0046] In some examples, the temperature control management computing module 220 determines, based on the comparison, that the temperature of the computing component 224 is less than a first threshold and greater than a second threshold. For example, the temperature of the computing component 224 is less than 90 degrees Celsius and greater than 0 degrees Celsius. The temperature control management computing module 220 adjusts the power state of the TEC 228 to the power-off state in response to determining that the temperature of the computing component 224 is less than the first threshold and greater than the second threshold.

[0047] In some examples, temperature control system 210 includes an additional computing component 250 similar to computing element 224. Temperature control system 210 may also include an additional internal heat sink 252 similar to internal heat sink 226. Temperature control system 210 may also include an additional TEC 254 similar to TEC 228. Temperature control system 210 may also include an additional sensor 256 similar to sensor 222.

[0048] Additional internal heat sink 252 may be coupled to additional computing component 250. Additional internal heat sink 252 may facilitate the transfer of heat from additional computing component 250 and / or the transfer of heat to additional computing component 250.

[0049] The additional TEC 228 may be in thermal communication with the additional internal heat sink 252. The additional TEC 256 may be switched between temperature control modes (i.e., a heating control mode and a cooling control mode). Specifically, the temperature control management module 220 may provide a signal to control a power state of the additional TEC 256, and additionally, when the additional TEC 256 is in a powered-on state, control a temperature control mode of the additional TEC 256, as further described herein.

[0050] In some examples, additional TEC 256 is coupled to additional internal heat sink 252 .

[0051] In some examples, additional TEC 256 is coupled to external heat sink 230. In some examples, additional TEC 256 is in direct contact with a housing of external heat sink 230. In some examples, additional TEC 256 is additionally in contact with a housing of information handling system 202 (e.g., a housing or shell of the information handling system). For example, when information handling system 202 includes a portable computing device (such as a laptop / notebook computer), additional TEC 256 can be in direct contact with a cover ("D" cover) of the portable computing device. To this end, the housing of external heat sink 230 and / or the housing of information handling system 202 can facilitate heat transfer from and / or to computing component 224, as further described herein.

[0052] To this end, the temperature control management computing module 220 may receive temperature data from the sensor 256 similar to the temperature data of the sensor 222 and compare such temperature to the first threshold value and / or the second threshold value. To this end, the temperature control management computing module 220 may provide appropriate signals to the additional TEC 256 to cause the additional TEC 256 to enter the appropriate cooling or heating control mode.

[0053] Additionally, once each of the components 225 and 250 is in an appropriate temperature zone (less than the first threshold and greater than the second threshold), the temperature control management computing module 220 adjusts the power state of the TEC 228 and the additional TEC 256 to a power-off state.

[0054] Steering Figure 4 , Figure 4 An environment 400 is shown that includes an information handling system 402. Information handling system 402 may include a temperature control system 410. Temperature control system 410 may include a temperature control management computing module 420, a temperature sensor 422, a computing component 424, an internal heat sink 426, a thermoelectric cooler (TEC) 428, and an external heat sink 430. Temperature control system 410 may also include a heat pipe (or multiple heat pipes) 450 and additional internal heat sinks 452. In some examples, information handling system 402 may include multiple temperature control systems 410.

[0055] In some examples, information handling system 402 is similar to Figure 1 In some examples, the temperature control management computing module 420 may be included in the information processing system 100 or including the information processing system. Figure 1 In some examples, the temperature control management computing module 420 is included in or communicates with a baseband management controller (BMC) of the information handling system 100.

[0056] The computing component 424 may be in thermal communication with an additional internal heat sink 452. The additional internal heat sink 452 may be in thermal communication with the computing component 424 and the heat pipe 450. The heat pipe 450 may be in thermal communication with the additional internal heat sink 452 and the internal heat sink 426. The internal heat sink 426 may be in thermal communication with the heat pipe 450 and the TEC 428. The TEC 428 may be in thermal communication with the internal heat sink 426 and the external heat sink 430. The external heat sink 450 may be in thermal communication with the TEC 428.

[0057] The sensor 422 may be in communication with the computing component 424. The thermal control management computing module 420 may be in communication with the sensor 422 and the TEC 428.

[0058] In a second embodiment, the temperature control system 410 may include a remote heat transfer embodiment. That is, based on the operating mode, the temperature control system 410 may use heat pipes 450 to transfer heat from the computing components 424 to the internal heat sink 426, and ultimately to the external heat sink 430 (housing) and from the external heat sink 430 (housing) to the computing components 424, as further described herein.

[0059] Figure 5A side view of a portion of a temperature control system 410 is shown. The temperature control system 410 may include a computing component 424. In some examples, the computing component 424 may include a central processing unit (CPU), a graphics processing unit (GPU), a memory, a chipset, or any other type of computing component. The temperature control system 410 may include an additional internal heat sink 452. The additional internal heat sink 452 may be coupled to the computing component 424. The additional internal heat sink 452 may facilitate heat transfer from and / or heat transfer to the computing component 424.

[0060] The temperature control system 410 may include a heat pipe 450. The heat pipe 450 is coupled between the additional internal heat sink 452 and the internal heat sink 426. The heat pipe 452 may facilitate heat transfer between the additional internal heat sink 452 and the internal heat sink 426.

[0061] The temperature control system 410 may include an internal heat sink 426. The internal heat sink 426 may be coupled to the heat pipe 450 and the TEC 428. The internal heat sink 426 may facilitate heat transfer from and / or to the additional internal heat sink 452.

[0062] The temperature control system 410 may include a TEC 428. The TEC 428 may be in thermal communication with an internal heat sink 426. The TEC 428 may be switched between temperature control modes (i.e., a heating control mode and a cooling control mode). Specifically, the temperature control management module 420 may provide a signal to control a power state of the TEC 428, and additionally, when the TEC 428 is in a powered-on state, control a temperature control mode of the TEC 428, as further described herein.

[0063] In some examples, TEC 428 is coupled to internal heat sink 426 .

[0064] The temperature control system 410 may include a Figure 8 An external heat sink 430 is shown as an external heat sink 230 .

[0065] In some examples, TEC 428 is coupled to external heat sink 430. In some examples, TEC 428 is in direct contact with a housing of external heat sink 430. In some examples, TEC 430 is additionally in contact with a housing of information handling system 402 (e.g., a housing or shell of the information handling system). For example, when information handling system 402 includes a portable computing device (such as a laptop / notebook computer), TEC 428 can be in direct contact with a cover ("D" cover) of the portable computing device. To this end, the housing of external heat sink 430 and / or the housing of information handling system 402 can facilitate heat transfer from and / or to computing component 424, as further described herein.

[0066] In some examples, external heat sink 430 is in direct contact with a housing (e.g., a housing or case of information handling system) of information handling system 402. For example, when information handling system 402 comprises a portable computing device (such as a laptop / notebook computer), external heat sink 430 may be in direct contact with a cover ("D" cover) of the portable computing device. To this end, the housing of external heat sink 430 and / or the housing of information handling system 402 may facilitate heat transfer from and / or to computing component 424, as further described herein.

[0067] Return to reference Figure 3 , the sensor 422 is configured to detect the temperature of the computing component 424. For example, the sensor 422 may detect the temperature of the computing component 424 and / or the environment near the computing component 424. The sensor 422 may provide the temperature of the computing component 424 to the temperature control management computing module 420. The sensor 422 may provide the temperature of the computing component 424 to the temperature control management computing module 420 in response to a request from the temperature control management computing module 420 or automatically at certain intervals (e.g., every 1 millisecond, 1 second).

[0068] For this purpose, refer to Figure 4 and Figure 5 , the temperature control management computing module 420 receives data indicating the temperature (of the computing component 424) from the sensor 422. The temperature control management computing module 420 compares the temperature of the computing component 424 to a first threshold. For example, the first threshold may be above the operating range of the information handling system 402. For example, the first threshold may be 90 degrees Celsius.

[0069] In some examples, the temperature control management calculation module 420 determines that the temperature of the computing component 424 is greater than a first threshold value based on the comparison. For example, the temperature of the computing component 424 is greater than 90 degrees Celsius. The temperature control management calculation module 420 adjusts the temperature control mode of the TEC 428 by providing a signal to the TEC 428 in response to determining that the temperature of the computing component 424 is greater than the first threshold value to enable the cooling control mode of the TEC 428. Specifically, when the TEC 428 is in the cooling control mode, the heat generated by the computing component 424 and transferred through the additional internal heat sink 452 is transferred to the internal heat sink 426 through the heat pipe 450 and transferred to the external heat sink 430 by the TEC 428. In some examples, the temperature control management calculation module 420 adjusts the polarity of the current provided to the TEC 428 so that the cooling mode of the TEC 428 is enabled.

[0070] In some examples, heat transferred by TEC 428 to external heat sink 430 is transferred directly to the housing of external heat sink 430. In some examples, heat transferred by TEC 428 to external heat sink 430 is transferred directly to the housing of information handling system 402.

[0071] To this end, after enabling the cooling control mode of TEC 428, temperature control management computing module 420 receives (at a later time) additional data indicating an updated temperature (of computing component 424) from sensor 422. Temperature control management computing module 420 compares the updated temperature of computing component 424 to a first threshold. In some examples, temperature control management computing module 420 determines, based on the comparison, that the temperature of computing component 424 is less than the first threshold. For example, the temperature of computing component 424 is less than 90 degrees Celsius. Temperature control management computing module 420 adjusts the power state of TEC 428 to a powered-off state in response to determining that the temperature of computing component 424 is less than the first threshold.

[0072] In some examples, when temperature control management computing module 420 receives data indicating a temperature (of computing component 424) from sensor 422, temperature control management computing module 420 compares the temperature of computing component 424 to a second threshold value. For example, the second threshold value may be below an operating range of information handling system 402. For example, the first threshold value may be 0 degrees Celsius.

[0073] The temperature control management calculation module 420 determines that the temperature of the computing component 424 is less than the second threshold value based on the comparison. For example, the temperature of the computing component 424 is less than 0 degrees Celsius. In response to determining that the temperature of the computing component 424 is less than the second threshold value, the temperature control management calculation module 420 adjusts the temperature control mode of the TEC 428 by providing a signal to the TEC 428 to enable the heating control mode of the TEC 428. Specifically, when the TEC 428 is in the heating control mode, the heat transferred from the external heat sink 430 to the TEC 428 is transferred by the TEC 428 to the internal heat sink 426 through the heat pipe 450 and to the computing component 424.

[0074] In some examples, temperature control management computing module 420 adjusts the polarity of the current provided to TEC 428 so that a heating mode of TEC 428 is enabled. In some examples, the polarity is opposite to the polarity that enables a cooling mode of TEC 428. In some examples, the heat transferred by TEC 428 to computing component 424 is transferred directly from the housing of external heat sink 430. In some examples, the heat transferred by TEC 428 to computing component 424 is transferred directly from the housing of information handling system 402.

[0075] To this end, after enabling the heating control mode of TEC 428, temperature control management computing module 420 receives (at a later time) additional data indicating an updated temperature (of computing component 424) from sensor 422. Temperature control management computing module 420 compares the updated temperature of computing component 424 to a second threshold. In some examples, temperature control management computing module 420 determines, based on the comparison, that the temperature of computing component 424 is greater than the second threshold. For example, the temperature of computing component 424 is greater than 0 degrees Celsius. Temperature control management computing module 420 adjusts the power state of TEC 428 to a powered-off state in response to determining that the temperature of computing component 424 is greater than the second threshold.

[0076] In some examples, the temperature control management computing module 420 determines, based on the comparison, that the temperature of the computing component 424 is less than a first threshold and greater than a second threshold. For example, the temperature of the computing component 424 is less than 90 degrees Celsius and greater than 0 degrees Celsius. The temperature control management computing module 420 adjusts the power state of the TEC 428 to the power-off state in response to determining that the temperature of the computing component 424 is less than the first threshold and greater than the second threshold.

[0077] Steering Figure 6 , Figure 6 An environment 600 is shown that includes an information handling system 602. Information handling system 602 may include a temperature control system 610. Temperature control system 610 may include a temperature control management computing module 620, a temperature sensor 622, a computing component 624, an internal heat sink 626, a thermoelectric cooler (TEC) 628, and an external heat sink 630. Temperature control system 610 may also include additional computing components 660 and additional sensors 662. In some examples, information handling system 602 may include multiple temperature control systems 610.

[0078] In some examples, information handling system 602 is similar to Figure 1 In some examples, the temperature control management computing module 620 may be included in the information processing system 100 or including the information processing system. Figure 1 In some examples, the temperature control management computing module 620 is included in or communicates with a baseband management controller (BMC) of the information handling system 100.

[0079] Computing component 624 may be in thermal communication with additional internal heat sink 652. Additional internal heat sink 652 may be in thermal communication with computing component 624 and internal heat sink 626. Internal heat sink 626 may be in thermal communication with additional internal heat sink 652, additional computing component 660, and TEC 628. TEC 628 may be in thermal communication with internal heat sink 626 and external heat sink 630. External heat sink 630 may be in thermal communication with TEC 628.

[0080] Sensor 622 may communicate with computing component 624. Sensor 662 may communicate with additional computing component 660.

[0081] Thermal control management computing module 620 may communicate with sensor 622 , sensor 662 , and TEC 628 .

[0082] In a third embodiment, the temperature control system 610 may include an indirect heat conduction embodiment. That is, based on the operating mode, the temperature control system 610 may use indirect heat conduction to conduct heat from the computing component 624 to the internal heat sink 626, and ultimately to the external heat sink 630 (shell) and from the external heat sink 630 (shell) to the computing component 624, as further described herein. Additionally, based on the operating mode, the temperature control system 610 may use indirect heat conduction to conduct heat from the additional computing component 660 to the internal heat sink 626, and ultimately to the external heat sink 630 (shell) and from the external heat sink 630 (shell) to the additional computing component 660, as further described herein.

[0083] Figure 7 A side view of a portion of a temperature control system 610 is shown. The temperature control system 610 may include a computing component 624. In some examples, the computing component 624 may include a central processing unit (CPU), a graphics processing unit (GPU), a memory, a chipset, or any other type of computing component. The temperature control system 610 may include an additional internal heat sink 652. The additional internal heat sink 652 may be coupled to the computing component 624. The additional internal heat sink 652 may facilitate heat transfer from and / or heat transfer to the computing component 624.

[0084] The temperature control system 610 may include an internal heat sink 626. The internal heat sink 626 may be thermally coupled to the additional internal heat sink 652 and the TEC 628. The internal heat sink 626 may facilitate heat transfer from and / or to the additional internal heat sink 652.

[0085] The temperature control system 610 may include a TEC 628. The TEC 628 may be in thermal communication with an internal heat sink 626. The TEC 628 may be switched between temperature control modes (i.e., a heating control mode and a cooling control mode). Specifically, the temperature control management module 620 may provide a signal to control a power state of the TEC 628, and additionally, when the TEC 628 is in a powered-on state, control a temperature control mode of the TEC 628, as further described herein.

[0086] In some examples, TEC 628 is coupled to internal heat sink 626 .

[0087] The temperature control system 610 may include a Figure 8 An external heat sink 630 is shown as an external heat sink 230 .

[0088] In some examples, TEC 628 is coupled to external heat sink 630. In some examples, TEC 628 is in direct contact with a housing of external heat sink 630. In some examples, TEC 630 is additionally in contact with a housing of information handling system 602 (e.g., a housing or shell of the information handling system). For example, when information handling system 602 includes a portable computing device (such as a laptop / notebook computer), TEC 628 can be in direct contact with a cover ("D" cover) of the portable computing device. To this end, the housing of external heat sink 630 and / or the housing of information handling system 602 can facilitate heat transfer from and / or to computing component 624, as further described herein.

[0089] In some examples, external heat sink 630 is in direct contact with a housing (e.g., a housing or case of information handling system) of information handling system 602. For example, when information handling system 602 comprises a portable computing device (such as a laptop / notebook computer), external heat sink 630 can be in direct contact with a cover ("D" cover) of the portable computing device. To this end, the housing of external heat sink 630 and / or the housing of information handling system 602 can facilitate heat transfer from and / or to computing component 624, as further described herein.

[0090] The sensor 622 is configured to detect the temperature of the computing component 624. For example, the sensor 622 may detect the temperature of the computing component 624 and / or the environment near the computing component 624. The sensor 622 may provide the temperature of the computing component 624 to the temperature control management computing module 620. The sensor 622 may provide the temperature of the computing component 624 to the temperature control management computing module 620 in response to a request from the temperature control management computing module 620 or automatically at certain intervals (e.g., every 1 millisecond, 1 second).

[0091] For this purpose, refer to Figure 6 and Figure 7 , the temperature control management computing module 620 receives data indicating the temperature (of the computing component 624) from the sensor 622. The temperature control management computing module 620 compares the temperature of the computing component 624 to a first threshold. For example, the first threshold may be above the operating range of the information handling system 602. For example, the first threshold may be 90 degrees Celsius.

[0092] In some examples, the temperature control management calculation module 620 determines that the temperature of the computing component 624 is greater than a first threshold value based on the comparison. For example, the temperature of the computing component 624 is greater than 90 degrees Celsius. The temperature control management calculation module 620 adjusts the temperature control mode of the TEC 628 by providing a signal to the TEC 628 in response to determining that the temperature of the computing component 624 is greater than the first threshold value to enable the cooling control mode of the TEC 628. Specifically, when the TEC 628 is in the cooling control mode, the heat generated by the computing component 624 and transferred through the additional internal heat sink 652 is transferred to the internal heat sink 626 by thermal radiation and transferred to the external heat sink 630 by the TEC 628. In some examples, the temperature control management calculation module 620 adjusts the polarity of the current provided to the TEC 628 so that the cooling mode of the TEC 628 is enabled.

[0093] In some examples, heat transferred by TEC 628 to external heat sink 630 is transferred directly to the housing of external heat sink 630. In some examples, heat transferred by TEC 628 to external heat sink 630 is transferred directly to the housing of information handling system 602.

[0094] To this end, after enabling the cooling control mode of the TEC 628, the temperature control management computing module 620 receives (at a later time) additional data indicating an updated temperature (of the computing component 624) from the sensor 622. The temperature control management computing module 620 compares the updated temperature of the computing component 624 to the first threshold. In some examples, the temperature control management computing module 620 determines, based on the comparison, that the temperature of the computing component 624 is less than the first threshold. For example, the temperature of the computing component 624 is less than 90 degrees Celsius. The temperature control management computing module 620 adjusts the power state of the TEC 628 to the power-off state in response to determining that the temperature of the computing component 624 is less than the first threshold.

[0095] In some examples, when the temperature control management computing module 620 receives data indicating the temperature (of the computing component 624) from the sensor 622, the temperature control management computing module 620 compares the temperature of the computing component 624 to a second threshold. For example, the second threshold can be below the operating range of the information handling system 602. For example, the first threshold can be 0 degrees Celsius.

[0096] The temperature control management calculation module 620 determines that the temperature of the computing component 624 is less than the second threshold value based on the comparison. For example, the temperature of the computing component 624 is less than 0 degrees Celsius. In response to determining that the temperature of the computing component 624 is less than the second threshold value, the temperature control management calculation module 620 adjusts the temperature control mode of the TEC 628 by providing a signal to the TEC 628 to enable the heating control mode of the TEC 628. Specifically, when the TEC 628 is in the heating control mode, the heat transferred from the external heat sink 630 to the TEC 628 is transferred by the TEC 628 to the internal heat sink 626 and to the computing component 624 through thermal radiation.

[0097] In some examples, temperature control management computing module 620 adjusts the polarity of the current provided to TEC 628 so that a heating mode of TEC 628 is enabled. In some examples, the polarity is opposite to the polarity that enables a cooling mode of TEC 628. In some examples, the heat transferred by TEC 628 to computing component 624 is transferred directly from the housing of external heat sink 630. In some examples, the heat transferred by TEC 628 to computing component 624 is transferred directly from the housing of information handling system 602.

[0098] To this end, after enabling the heating control mode of the TEC 628, the temperature control management computing module 620 receives (at a later time) additional data indicating an updated temperature (of the computing component 624) from the sensor 622. The temperature control management computing module 620 compares the updated temperature of the computing component 624 to the second threshold. In some examples, the temperature control management computing module 620 determines, based on the comparison, that the temperature of the computing component 624 is greater than the second threshold. For example, the temperature of the computing component 624 is greater than 0 degrees Celsius. The temperature control management computing module 620 adjusts the power state of the TEC 628 to the power-off state in response to determining that the temperature of the computing component 624 is greater than the second threshold.

[0099] In some examples, the temperature control management computing module 620 determines, based on the comparison, that the temperature of the computing component 624 is less than a first threshold and greater than a second threshold. For example, the temperature of the computing component 624 is less than 90 degrees Celsius and greater than 0 degrees Celsius. The temperature control management computing module 620 adjusts the power state of the TEC 628 to the power-off state in response to determining that the temperature of the computing component 624 is less than the first threshold and greater than the second threshold.

[0100] The sensor 662 is configured to detect the temperature of the additional computing component 660. For example, the sensor 662 may detect the temperature of the additional computing component 660, the environment near the additional computing component 660. The sensor 662 may provide the temperature of the additional computing component 660 to the temperature control management computing module 620. The sensor 662 may provide the temperature of the additional computing component 660 to the temperature control management computing module 620 in response to a request from the temperature control management computing module 620 or automatically at certain intervals (e.g., every 1 millisecond, 1 second).

[0101] For this purpose, refer to Figure 6 and Figure 7 , the temperature control management computing module 620 receives data indicating the temperature (of the additional computing component 660) from the sensor 662. The temperature control management computing module 620 compares the temperature of the additional computing component 660 to a first threshold. For example, the first threshold may be above the operating range of the information handling system 602. For example, the first threshold may be 90 degrees Celsius.

[0102] In some examples, the temperature control management calculation module 620 determines that the temperature of the additional computing component 660 is greater than a first threshold value based on the comparison. For example, the temperature of the additional computing component 660 is greater than 90 degrees Celsius. The temperature control management calculation module 620 adjusts the temperature control mode of the TEC 628 by providing a signal to the TEC 628 in response to determining that the temperature of the additional computing component 660 is greater than the first threshold value to enable the cooling control mode of the TEC 628. Specifically, when the TEC 628 is in the cooling control mode, the heat generated by the additional computing component 660 is transferred to the internal heat sink 626 by thermal radiation and transferred to the external heat sink 630 by the TEC 628. In some examples, the temperature control management calculation module 620 adjusts the polarity of the current provided to the TEC 628 so that the cooling mode of the TEC 628 is enabled.

[0103] In some examples, heat transferred by TEC 628 to external heat sink 630 is transferred directly to the housing of external heat sink 630. In some examples, heat transferred by TEC 628 to external heat sink 630 is transferred directly to the housing of information handling system 602.

[0104] To this end, after enabling the cooling control mode of the TEC 628, the temperature control management computing module 620 receives (at a later time) additional data indicating an updated temperature (of the additional computing component 660) from the sensor 622. The temperature control management computing module 620 compares the updated temperature of the additional computing component 660 to the first threshold. In some examples, the temperature control management computing module 620 determines, based on the comparison, that the temperature of the additional computing component 660 is less than the first threshold. For example, the temperature of the additional computing component 660 is less than 90 degrees Celsius. The temperature control management computing module 620 adjusts the power state of the TEC 628 to the power-off state in response to determining that the temperature of the additional computing component 660 is less than the first threshold.

[0105] In some examples, when the temperature control management computing module 620 receives data indicating the temperature (of the additional computing component 660) from the sensor 622, the temperature control management computing module 620 compares the temperature of the additional computing component 660 to a second threshold. For example, the second threshold can be below the operating range of the information handling system 602. For example, the first threshold can be 0 degrees Celsius.

[0106] The temperature control management computing module 620 determines, based on the comparison, that the temperature of the additional computing component 660 is less than the second threshold. For example, the temperature of the additional computing component 660 is less than 0 degrees Celsius. The temperature control management computing module 620 adjusts the temperature control mode of the TEC 628 by providing a signal to the TEC 628 to enable a heating control mode of the TEC 628 in response to determining that the temperature of the additional computing component 660 is less than the second threshold. Specifically, when the TEC 628 is in the heating control mode, the heat transferred from the external heat sink 630 to the TEC 628 is transferred by the TEC 628 through the internal heat sink 626 and transferred to the additional computing component 660 by heat radiation.

[0107] In some examples, temperature control management computing module 620 adjusts the polarity of the current provided to TEC 628 so that a heating mode of TEC 628 is enabled. In some examples, the polarity is opposite to the polarity that enables a cooling mode of TEC 628. In some examples, the heat transferred by TEC 628 to additional computing component 660 is transferred directly from the housing of external heat sink 630. In some examples, the heat transferred by TEC 628 to additional computing component 660 is transferred directly from the housing of information handling system 602.

[0108] To this end, after enabling the heating control mode of the TEC 628, the temperature control management computing module 620 receives (at a later time) additional data indicating an updated temperature (of the additional computing component 660) from the sensor 622. The temperature control management computing module 620 compares the updated temperature of the additional computing component 660 to the second threshold. In some examples, the temperature control management computing module 620 determines, based on the comparison, that the temperature of the additional computing component 660 is greater than the second threshold. For example, the temperature of the additional computing component 660 is greater than 0 degrees Celsius. The temperature control management computing module 620 adjusts the power state of the TEC 628 to the power-off state in response to determining that the temperature of the additional computing component 660 is greater than the second threshold.

[0109] In some examples, the temperature control management computing module 620 determines, based on the comparison, that the temperature of the additional computing component 660 is less than a first threshold and greater than a second threshold. For example, the temperature of the additional computing component 660 is less than 90 degrees Celsius and greater than 0 degrees Celsius. The temperature control management computing module 620 adjusts the power state of the TEC 628 to the power-off state in response to determining that the temperature of the additional computing component 660 is less than the first threshold and greater than the second threshold.

[0110] Fig. 9 A flow chart depicting selected elements of an embodiment of a method 900 for adaptive temperature control is shown. The method 900 may be performed by the information handling system 100, the information handling system 202, 402, 602, and / or the temperature control system 210, 410, 610 and referenced Figures 1 to 8 It should be noted that certain operations described in method 900 may be optional or may be rearranged in different embodiments.

[0111] At 902, a sensor detects a temperature of a computing component. For example, sensor 222 detects a temperature of computing component 224; sensor 256 detects a temperature of additional computing component 250; sensor 422 detects a temperature of computing component 424; sensor 622 detects a temperature of computing component 624; and / or sensor 662 detects a temperature of additional computing component 660.

[0112] At 904, the temperature control management calculation module compares the temperature of the computing component to the first threshold. For example, the temperature control management calculation module 220 compares the temperature of the computing component 224 to the first threshold; the temperature control management calculation module 220 compares the temperature of the additional computing component 250 to the first threshold; the temperature control management calculation module 420 compares the temperature of the computing component 424 to the first threshold; the temperature control management calculation module 620 compares the temperature of the computing component 624 to the first threshold; and / or the temperature control management calculation module 620 compares the temperature of the additional computing component 660 to the first threshold.

[0113] At 906, the temperature control management calculation module determines whether the temperature of the computing component is greater than the first threshold based on the comparison. For example, the temperature control management calculation module 220 determines whether the temperature of the computing component 224 is greater than the first threshold based on the comparison; the temperature control management calculation module 220 determines whether the temperature of the additional computing component 250 is greater than the first threshold based on the comparison; the temperature control management calculation module 420 determines whether the temperature of the computing component 424 is greater than the first threshold based on the comparison; the temperature control management calculation module 620 determines whether the temperature of the computing component 624 is greater than the first threshold based on the comparison; and / or the temperature control management calculation module 620 determines whether the temperature of the additional computing component 660 is greater than the first threshold based on the comparison.

[0114] In some examples, the temperature control management calculation module determines that the temperature of the computing component is greater than the first threshold value based on the comparison (at 906), and in response, adjusts the temperature control mode of the TEC by providing a signal to the TEC to enable the cooling control mode of the TEC at 908. For example, the temperature control management calculation module 220 adjusts the temperature control mode of the TEC 228 by providing a signal to the TEC 228 in response to determining that the temperature of the computing component 224 is greater than the first threshold value to enable the cooling control mode of the TEC 228. For example, the temperature control management calculation module 220 adjusts the temperature control mode of the TEC 256 by providing a signal to the TEC 256 in response to determining that the temperature of the additional computing component 250 is greater than the first threshold value to enable the cooling control mode of the TEC 256. For example, the temperature control management calculation module 420 adjusts the temperature control mode of the TEC 428 by providing a signal to the TEC 428 in response to determining that the temperature of the computing component 424 is greater than the first threshold value to enable the cooling control mode of the TEC 428. For example, the temperature control management computing module 620 adjusts the temperature control mode of the TEC 628 by providing a signal to the TEC 628 to enable the cooling control mode of the TEC 628 in response to determining that the temperature of the computing component 624 is greater than the first threshold. For example, the temperature control management computing module 620 adjusts the temperature control mode of the TEC 628 by providing a signal to the TEC 628 to enable the cooling control mode of the TEC 628 in response to determining that the temperature of the additional computing component 660 is greater than the first threshold.

[0115] In some examples, the temperature control management computing module determines that the temperature of the computing component is less than the first threshold based on the comparison (at 906), and in response, the temperature control management computing module compares the temperature of the computing component to a second threshold at 910. For example, the temperature control management computing module 220 compares the temperature of the computing component 224 to the second threshold; the temperature control management computing module 220 compares the temperature of the additional computing component 250 to the second threshold; the temperature control management computing module 420 compares the temperature of the computing component 424 to the second threshold; the temperature control management computing module 620 compares the temperature of the computing component 624 to the second threshold; and / or the temperature control management computing module 620 compares the temperature of the additional computing component 660 to the second threshold.

[0116] At 912, the temperature control management calculation module determines whether the temperature of the computing component is less than the second threshold based on the comparison. For example, the temperature control management calculation module 220 determines whether the temperature of the computing component 224 is less than the second threshold based on the comparison; the temperature control management calculation module 220 determines whether the temperature of the additional computing component 250 is less than the second threshold based on the comparison; the temperature control management calculation module 420 determines whether the temperature of the computing component 424 is less than the second threshold based on the comparison; the temperature control management calculation module 620 determines whether the temperature of the computing component 624 is less than the second threshold based on the comparison; and / or the temperature control management calculation module 620 determines whether the temperature of the additional computing component 660 is less than the second threshold based on the comparison.

[0117] In some examples, the temperature control management calculation module determines that the temperature of the computing component is less than the second threshold value based on the comparison (at 912), and in response, adjusts the temperature control mode of the TEC by providing a signal to the TEC to enable the heating control mode of the TEC at 914. For example, the temperature control management calculation module 220 adjusts the temperature control mode of the TEC 228 by providing a signal to the TEC 228 in response to determining that the temperature of the computing component 224 is less than the second threshold value to enable the heating control mode of the TEC 228. For example, the temperature control management calculation module 220 adjusts the temperature control mode of the TEC 256 by providing a signal to the TEC 256 in response to determining that the temperature of the additional computing component 250 is less than the second threshold value to enable the heating control mode of the TEC 228. For example, the temperature control management calculation module 420 adjusts the temperature control mode of the TEC 428 by providing a signal to the TEC 428 in response to determining that the temperature of the computing component 424 is less than the second threshold value to enable the heating control mode of the TEC 428. For example, the temperature control management computing module 620 adjusts the temperature control mode of the TEC 628 by providing a signal to the TEC 628 to enable the heating control mode of the TEC 628 in response to determining that the temperature of the computing component 624 is less than the second threshold. For example, the temperature control management computing module 620 adjusts the temperature control mode of the TEC 628 by providing a signal to the TEC 628 to enable the heating control mode of the TEC 628 in response to determining that the temperature of the additional computing component 660 is less than the second threshold.

[0118] In some examples, the temperature control management computing module determines based on the comparison that the temperature of the computing component is greater than the second threshold (at 912), and in response, the temperature control management computing module adjusts the power state of the TEC to the off-power state. For example, the temperature control management computing module 220 adjusts the power state of the TEC 228 to the off-power state. For example, the temperature control management computing module 220 adjusts the power state of the TEC 256 to the off-power state. For example, the temperature control management computing module 420 adjusts the power state of the TEC 428 to the off-power state. For example, the temperature control management computing module 620 adjusts the power state of the TEC 628 to the off-power state.

[0119] The subject matter disclosed above should be considered illustrative rather than restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments that fall within the true spirit and scope of the present disclosure. Therefore, to the maximum extent permitted by law, the scope of the present disclosure is determined by the broadest permissible interpretation of the appended claims and their equivalents, and shall not be restricted or limited by the foregoing specific embodiments.

[0120] As used herein, "or" is inclusive and not exclusive, unless expressly indicated otherwise or the context indicates otherwise. Thus, as used herein, "A or B" means "A, B, or both," unless expressly indicated otherwise or the context indicates otherwise. Additionally, "and" is both conjunctive and individual, unless expressly indicated otherwise or the context indicates otherwise. Thus, as used herein, "A and B" means "A and B jointly or individually," unless expressly indicated otherwise or the context indicates otherwise.

[0121] The scope of the present disclosure covers all changes, substitutions, variations, alterations and modifications to the example embodiments described or shown herein that would be conceived by those of ordinary skill in the art. The scope of the present disclosure is not limited to the example embodiments described or shown herein. In addition, although the present disclosure describes and illustrates the corresponding embodiments herein as including specific parts, elements, features, functions, operations or steps, any of these embodiments may include any combination or arrangement of any parts, elements, features, functions, operations or steps described or shown anywhere herein that would be conceived by those of ordinary skill in the art. In addition, the reference in the attached claims to the device or system or the part of the device or system adapted to, arranged to, capable of, configured to, enabled to, operable to or operated to perform a specific function covers the device, system, part, regardless of whether the device, system, part or the specific function is activated, opened or unlocked, as long as the device, system or part is adapted to, arranged to, capable of, configured to, enabled to, operable to or operated to perform a specific function.

Claims

1. An adaptive temperature control system, comprising: Computing components; an internal heat sink coupled to the computing component; a thermoelectric cooler (TEC), the TEC being in thermal communication with the internal heat sink; an external heat sink comprising a housing surrounding the computing component, the internal heat sink, and the TEC; a sensor configured to detect a temperature of the computing component; A processor having access to a memory medium storing instructions executable by the processor to perform operations comprising: comparing the temperature of the computing component to a first threshold; determining, based on the comparing, that the temperature of the computing component is greater than a first threshold; In response to determining that the temperature of the computing component is greater than the first threshold: A temperature control mode of the TEC is adjusted so that heat transferred from the computing component to the TEC through the internal heat sink is transferred by the TEC to the external heat sink.

2. The adaptive temperature control system of claim 1, wherein the operations further comprise: determining, based on the comparing, that the temperature of the computing component is less than a second threshold; In response to determining that the temperature of the computing component is less than the second threshold: The temperature control mode of the TEC is adjusted to a second mode so that heat transferred from the external heat sink to the TEC is transferred by the TEC to the computing component through the internal heat sink.

3. The adaptive temperature control system of claim 2, wherein adjusting the temperature control mode comprises adjusting the polarity of the current provided to the TEC.

4. The adaptive temperature control system of claim 2, wherein the operations further comprise: determining, based on the comparison, that the temperature of the computing component is less than the first threshold and greater than the second threshold; In response to determining that the temperature of the computing component is less than the first threshold and greater than the second threshold: The power state of the TEC is adjusted to a power-off state.

5. The adaptive temperature control system of claim 1, wherein the TEC is coupled to the internal heat sink.

6. The adaptive temperature control system of claim 5, wherein the TEC is coupled to the external heat sink.

7. The adaptive temperature control system of claim 1, further comprising: an additional internal heat sink in thermal communication with the internal heat sink, the additional internal heat sink being spaced apart from the internal heat sink, Wherein the additional internal heat sink is coupled to the computing component.

8. The adaptive temperature control system of claim 7, further comprising: one or more heat pipes coupled between the additional internal heat sink and the internal heat sink, The one or more heat pipes are in thermal communication between the additional heat sink and the internal heat sink.

9. The adaptive temperature control system of claim 7, further comprising: An additional computing component is in thermal communication with the internal heat sink, the additional computing component being spaced apart from the internal heat sink.

10. An information processing system, comprising: processor; a memory medium storing instructions executable by the processor to perform operations; An adaptive temperature control system, the adaptive temperature control system comprising: Computing components; an internal heat sink coupled to the computing component; a thermoelectric cooler (TEC), the TEC being in thermal communication with the internal heat sink; an external heat sink comprising a housing surrounding the computing component, the internal heat sink, and the TEC; a sensor configured to detect a temperature of the computing component; The operations include: comparing the temperature of the computing component to a threshold value; determining, based on the comparing, that the temperature of the computing component is greater than a first threshold; In response to determining that the temperature of the computing component is greater than the first threshold: A temperature control mode of the TEC is adjusted so that heat transferred from the computing component to the TEC through the internal heat sink is transferred by the TEC to the external heat sink.

11. The information handling system of claim 10, wherein the operations further comprise: determining, based on the comparing, that the temperature of the computing component is less than a second threshold; In response to determining that the temperature of the computing component is less than the second threshold: The temperature control mode of the TEC is adjusted to a second mode so that heat transferred from the external heat sink to the TEC is transferred by the TEC to the computing component through the internal heat sink.

12. The information handling system of claim 11, wherein adjusting the temperature control mode comprises adjusting a polarity of a current provided to the TEC.

13. The information handling system of claim 11, wherein the operations further comprise: determining, based on the comparison, that the temperature of the computing component is less than the first threshold and greater than the second threshold; In response to determining that the temperature of the computing component is less than the first threshold and greater than the second threshold: The power state of the TEC is adjusted to a power-off state.

14. The information handling system of claim 10, wherein the TEC is coupled to the internal heat sink.

15. The information handling system of claim 14, wherein the TEC is coupled to the external heat sink.

16. The information handling system of claim 10, wherein the adaptive temperature control system further comprises: an additional internal heat sink in thermal communication with the internal heat sink, the additional internal heat sink being spaced apart from the internal heat sink, Wherein the additional internal heat sink is coupled to the computing component.

17. The information handling system of claim 16, wherein the adaptive temperature control system further comprises: one or more heat pipes coupled between the additional internal heat sink and the internal heat sink, The one or more heat pipes are in thermal communication between the additional heat sink and the internal heat sink.

18. The information handling system of claim 16, wherein the adaptive temperature control system further comprises: An additional computing component is in thermal communication with the internal heat sink, the additional computing component being spaced apart from the internal heat sink.

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