Method and device for calculating environmental coefficient of electronic components under preset temperature and vibration environment

Abstract

The application provides an environmental coefficient calculation method and device for electronic components under a preset temperature vibration environment. The method comprises the following steps: constructing a finite element model according to the structure parameters of a component to be predicted; performing temperature cycle simulation on the finite element model, and calculating temperature cycle damage according to the result of the temperature cycle simulation and the Miner law; performing random vibration simulation on the finite element model with a preset temperature cycle condition as a prestress, and calculating random vibration damage according to the result of the random vibration simulation and the Miner law; superimposing the temperature cycle damage and the random vibration damage, and calculating the total life of the component to be predicted according to the result of the damage superposition and the Miner law; and removing the influence of the packaging factor in the failure rate based on the total life and an electronic device reliability prediction manual, so as to obtain the environmental coefficient of the component to be predicted under the preset temperature cycle condition, and improve the accuracy and reliability of the failure rate prediction of the electronic component.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device reliability evaluation and prediction, and particularly relates to an environmental coefficient calculation method and device for electronic components under a preset temperature-vibration environment. BACKGROUND

[0002] In the field of electronic device reliability evaluation, accurately predicting the failure rate of electronic components is crucial for ensuring long-term stable operation of the device. Since GJB / Z 299C-2006 "Electronic Device Reliability Prediction Manual" was introduced in 2006, it has been widely used in the field of electronic component failure rate prediction as an authoritative standard. The manual builds a relatively complete failure rate prediction system by considering internal and external failure factors and introducing quality coefficient and maturity coefficient as adjustment factors, providing strong support for engineering practice.

[0003] In current engineering practice, GJB / Z 299C-2006 "Electronic Device Reliability Prediction Manual" is still the main reference for electronic component failure rate prediction. The manual not only considers the internal and external failure mechanisms of the device, but also improves the practicality and universality of the prediction model by introducing quality coefficient and maturity coefficient as adjustment factors. This standard has accumulated rich practical experience and data support in years of application, providing a reliable basis for the reliability evaluation of electronic components. However, with the continuous progress of technology, the requirement for prediction accuracy is also increasing, which has challenged the application of the manual under certain conditions.

[0004] Although GJB / Z 299C-2006 "Electronic Device Reliability Prediction Manual" plays an important role in electronic component failure rate prediction, its release time is relatively early, and the experimental data and technical background it is based on have large differences with the actual application environment of modern electronic components. In particular, in the setting of environmental coefficients, the manual only provides general environmental classifications such as general ground fixed, severe ground movement, missile flight, etc., lacking accurate quantitative description of environmental loads. Such general environmental classification often fails to accurately reflect the actual stress of electronic components when facing modern complex loading conditions, resulting in large errors in prediction results. Therefore, how to overcome the limitations of the existing manual in environmental coefficient setting and improve the accuracy and reliability of electronic component failure rate prediction has become a technical problem to be solved. SUMMARY

[0005] In order to solve the above problems existing in the prior art, the present application provides an environmental coefficient calculation method and device for electronic components under a preset temperature-vibration environment.

[0006] The technical problems to be solved by the present application are realized by the following technical solutions.

[0007] In a first aspect, the present application provides a method for calculating an environmental coefficient of an electronic component under a preset temperature-vibration environment, comprising:

[0008] constructing a finite element model according to structure parameters of the component to be predicted;

[0009] performing temperature cycle simulation on the finite element model, and calculating temperature cycle damage according to a result of the temperature cycle simulation and the Miner's law;

[0010] performing random vibration simulation on the finite element model under a preset temperature cycle condition as prestress, and calculating random vibration damage according to a result of the random vibration simulation and the Miner's law;

[0011] superimposing the temperature cycle damage and the random vibration damage, and calculating a total life of the component to be predicted according to a result of the superimposition and the Miner's law;

[0012] based on the total life and an electronic device reliability prediction manual, removing an influence of a packaging factor in a failure rate, and obtaining the environmental coefficient of the component to be predicted under the preset temperature cycle condition.

[0013] Optionally, the temperature cycle damage is calculated according to a result of the temperature cycle simulation on the finite element model and the Miner's law, and the temperature cycle simulation comprises:

[0014] performing temperature cycle simulation on the finite element model to obtain a shear plastic strain curve;

[0015] calculating a temperature cycle life of the component to be predicted based on the shear plastic strain curve and a modified Manson-Coffin formula;

[0016] calculating the temperature cycle damage according to the Miner's law on the temperature cycle life.

[0017] Optionally, the random vibration damage is calculated according to a result of the random vibration simulation on the finite element model under the preset temperature cycle condition as prestress and the Miner's law, and the random vibration simulation comprises:

[0018] inputting the preset temperature cycle condition as prestress into a preset simulation application to obtain a resonance frequency and an elastic strain range corresponding to the finite element model;

[0019] substituting the resonance frequency into a positive zero pass number formula to calculate a positive zero pass number value;

[0020] calculating a fatigue cycle number based on the elastic strain range;

[0021] The random vibration damage is obtained based on Miner's law, the positive zero pass value and the fatigue cycle number.

[0022] Optionally, the positive zero pass value is expressed as:

[0023] ;

[0024] wherein, represents the positive zero pass value, represents the total order of the resonance frequency, represents the acceleration power spectral density value corresponding to the resonance frequency of the order, represents the resonance frequency value of the order, represents the transmission rate obtained by the resonance frequency of the order, represents the natural circular frequency of the order.

[0025] Optionally, the relationship between the elastic strain range and the fatigue cycle number is expressed as:

[0026] ;

[0027] represents the elastic strain range of the random vibration excitation in the interval, represents the tensile strength of the component to be predicted, represents the elastic modulus, represents the fatigue cycle number of the random vibration excitation in the interval, is the variance of the normal distribution of the random vibration excitation.

[0028] Optionally, the formula of the random vibration calculation is expressed as:

[0029] ;

[0030] wherein, represents the random vibration damage, represents the positive zero pass value, , and correspond to the fatigue cycle number of the random vibration excitation in the , and interval, is the variance of the normal distribution of the random vibration excitation.

[0031] Optionally, the temperature cycle damage and the random vibration damage are superimposed, and the total life of the to-be-predicted component is calculated according to a result of the superimposition and the Miner law, including:

[0032] According to a preset weighting ratio, the temperature cycle damage and the random vibration damage are summed to obtain the total damage of the to-be-predicted component;

[0033] The total damage is taken as an inverse to obtain the total life of the to-be-predicted component.

[0034] Optionally, based on the total life and an electronic equipment reliability prediction manual, an influence of a packaging factor in a failure rate is removed to obtain an environmental coefficient of the to-be-predicted component under a preset temperature cycle condition, including:

[0035] The total life and a first preset formula are used to calculate a failure rate of the to-be-predicted component ;

[0036] The electronic equipment reliability prediction manual is used to look up a packaging complexity failure rate of the to-be-predicted component ;

[0037] The second preset formula, the failure rate and the packaging complexity failure rate are used to obtain the environmental coefficient;

[0038] The first preset formula is represented as: , wherein the total life is represented by L;

[0039] The second preset formula is represented as: ; The packaging complexity failure rate is represented by Fp, and the environmental coefficient is represented by K.

[0040] In a second aspect, the present application provides an environmental coefficient calculation device for an electronic component under a preset temperature-vibration environment, which comprises a model construction unit, a temperature simulation unit, a vibration simulation unit and a calculation unit.

[0041] The model construction unit is configured to construct a finite element model according to structure parameters of the to-be-predicted component;

[0042] The temperature simulation unit is configured to perform temperature cycle simulation on the finite element model, and calculate a temperature cycle damage according to a result of the temperature cycle simulation and the Miner law;

[0043] The vibration simulation unit is configured to perform random vibration simulation on the finite element model under a preset temperature cycle condition as a prestress, and calculate a random vibration damage according to a result of the random vibration simulation and the Miner law.

[0044] The computing unit is configured to: superimpose the temperature cycle damage and the random vibration damage, and calculate the total life of the to-be-predicted component according to a result of the superimposition and the Miner law;

[0045] The computing unit is further configured to: obtain the environmental coefficient of the to-be-predicted component under the preset temperature cycle condition based on the total life and an electronic device reliability prediction manual.

[0046] In a third aspect, the present application provides an environmental coefficient calculation device of an electronic component under a preset temperature-vibration environment, which comprises a processor, a storage medium and a bus, the storage medium stores machine-readable instructions executable by the processor, the processor communicates with the storage medium through the bus when the environmental coefficient calculation device is running, and the processor executes the machine-readable instructions to perform the steps of the environmental coefficient calculation method according to any one of the above first aspect.

[0047] The present application provides an environmental coefficient calculation method and device of an electronic component under a preset temperature-vibration environment. The environmental coefficient calculation method of an electronic component under a preset temperature-vibration environment comprises the following steps: constructing a finite element model according to the structure parameters of a to-be-predicted component; performing temperature cycle simulation on the finite element model, calculating temperature cycle damage according to the result of the temperature cycle simulation and the Miner law; performing random vibration simulation on the finite element model by taking the preset temperature cycle condition as a prestress, calculating random vibration damage according to the result of the random vibration simulation and the Miner law; superimposing the temperature cycle damage and the random vibration damage, and calculating the total life of the to-be-predicted component according to the result of the superimposition and the Miner law; and obtaining the environmental coefficient of the to-be-predicted component under the preset temperature cycle condition by removing the influence of the packaging factor in the failure rate based on the total life and an electronic device reliability prediction manual. In the present application, the stress and strain of the electronic component under the preset temperature-vibration environment can be more accurately reflected by constructing the finite element model and performing temperature cycle simulation and random vibration simulation, thereby improving the accuracy of failure rate prediction. The reliability of the electronic component under complex loading conditions can be more comprehensively considered by superimposing the temperature cycle damage and the random vibration damage to obtain the total damage, and calculating the total life and the failure rate accordingly. Finally, the environmental coefficient under the corresponding loading condition is calculated by excluding the influence of the packaging factor, which provides more accurate data support for the reliability evaluation of the electronic component. In summary, the present application improves the accuracy and reliability of failure rate prediction of the electronic component.

[0048] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0049] Figure 1A flowchart of an environmental coefficient calculation method of an electronic component under a preset temperature-vibration environment provided by an embodiment of the present application is shown in the figure.

[0050] Figure 2 A structural diagram of an environmental coefficient calculation device of an electronic component under a preset temperature-vibration environment provided by an embodiment of the present application is shown in the figure.

[0051] Figure 3 A structural diagram of an environmental coefficient calculation device of an electronic component under a preset temperature-vibration environment provided by an embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0052] The present application will be further described in detail below in combination with specific embodiments, but the embodiments of the present application are not limited thereto.

[0053] In order to improve the accuracy and reliability of the failure rate prediction of electronic components, an environmental coefficient calculation method of an electronic component under a preset temperature-vibration environment is provided by an embodiment of the present application. Figure 1 A flowchart of an environmental coefficient calculation method of an electronic component under a preset temperature-vibration environment provided by an embodiment of the present application is shown in the figure. As shown in the figure, it includes:

[0054] S101, constructing a finite element model according to the structure parameters of the component to be predicted.

[0055] Specifically, first, the structure parameters of the component to be predicted are obtained, including size, material properties, and expected load and boundary conditions; based on these parameters, an accurate 3D geometric model is constructed in SOLIDWORKS and the material is specified. Then, the simulation environment is set by using the ANSYS Workbench module, the corresponding boundary conditions and loads are applied, and the mesh is divided to prepare for calculation. Finally, the finite element analysis is run, the results are evaluated, and thus the finite element model that can be used to predict the behavior of the component is obtained.

[0056] 102, temperature cycle simulation is performed on the finite element model, and temperature cycle damage is calculated according to the results of the temperature cycle simulation and the Miner law.

[0057] Optionally, S102 can specifically include:

[0058] The temperature cycle simulation is performed on the finite element model to obtain a shear plastic strain curve;

[0059] Based on the shear plastic strain curve and the modified Manson-Coffin formula, the temperature cycle life of the component to be predicted is calculated;

[0060] According to the Miner law, the temperature cycle life is inverted to obtain the temperature cycle damage.

[0061] In this embodiment, the temperature cycling damage is the temperature cycling damage accumulated per cycle. The specific logic of performing temperature cycling simulation on the finite element model is as follows: first, ensure that the material properties include temperature dependence and plastic behavior, and build or import a 3D model in ANSYS Workbench; then, set up the thermo-mechanical analysis, apply temperature cycling loads and boundary conditions, perform meshing and configure the solution parameters; finally, run the simulation, extract data and generate a shear plastic strain curve through the post-processing tool, and evaluate the performance of the component under temperature cycling based on this shear plastic strain curve. The modified Manson-Coffin formula is specifically the Engelmaier modified Coffin-Manson formula.

[0062] Furthermore, the temperature cycle simulation process can also be replaced by life calculation methods such as strain energy-based and creep-based methods.

[0063] S103. Perform random vibration simulation on the finite element model using a preset temperature cycle condition as prestress, and calculate random vibration damage based on the results of the random vibration simulation and Miner's law.

[0064] Optionally, S103 may specifically include:

[0065] Using the preset temperature cycle conditions as prestress input in the preset simulation application, the corresponding resonance frequency and elastic strain range of the finite element model are obtained;

[0066] Substitute the resonance frequency into the positive zero passing number formula to calculate the positive zero passing number value;

[0067] The number of fatigue cycles is calculated based on the elastic strain range;

[0068] Random vibration damage is obtained by performing random vibration calculation based on Miner's law, the number of positive zero passes and the number of fatigue cycles.

[0069] It should be noted that, in this embodiment, the random vibration damage refers specifically to the random vibration damage accumulated per second.

[0070] In addition, the random vibration simulation process can also be replaced by life calculation methods such as the rain flow counting method.

[0071] Alternatively, the positive zero passing number formula is expressed as:

[0072] ;

[0073] in, represents the number of positive zero passages, represents the total order of resonant frequencies, Indicates the The acceleration power spectrum density value corresponding to the first-order resonance frequency is: representing the first order resonance frequency value, representing the first order resonance frequency, representing the first order natural circular frequency.

[0074] ;

[0075] ;

[0076] wherein, is a preset number of gravity units, dimensionless.

[0077] In the embodiments of the present application, the fatigue cycle number is calculated using a Steinberg model based on normal distribution, which divides the loaded random vibration excitation into three intervals of (-1 , +1 ), (-2 , -1 )∪(+1 , +2 ) and (-3 , -2 )∪(+2 , +3 ), and ignores random vibration higher than 3 . The probabilities of instantaneous acceleration appearing in the three intervals are 68.3%, 27.1% and 4.33% respectively, is the variance of the Gaussian normal distribution of the random vibration excitation.

[0078] The corresponding fatigue cycle number under the excitation level of each interval is calculated by the Coffin-Manson formula considering only elastic strain:

[0079] ;

[0080] represents the elastic strain range of the random vibration excitation in the interval, represents the tensile strength of the component to be predicted, represents the elastic modulus, represents the fatigue cycle number of the random vibration excitation in the interval, is the variance of the normal distribution of the random vibration excitation.

[0081] Alternatively, the formula for random vibration calculation is represented as:

[0082] ;

[0083] wherein, represents the random vibration damage, represents the positive zero pass value, , and correspond to the fatigue cycle number of the random vibration excitation in , and interval, is the variance of the normal distribution of the random vibration excitation.

[0084] It should be noted that the preset simulation application is ANSYS Workbench.

[0085] S104, superimpose the temperature cycle damage and the random vibration damage, and calculate the total life of the to-be-predicted component according to a result of the damage superposition and the Miner law.

[0086] Optionally, S104 can specifically include:

[0087] perform sum processing on the temperature cycle damage and the random vibration damage according to a preset weighting ratio, to obtain the total damage of the to-be-predicted component;

[0088] take the reciprocal of the total damage, to obtain the total life of the to-be-predicted component.

[0089] It should be noted that the total damage is the total damage accumulated by the to-be-predicted component per hour.

[0090] In the embodiment of the present application, the total damage is represented as:

[0091] ;

[0092] wherein, represents the total damage accumulated by the to-be-predicted component per hour, represents the temperature cycle damage, represents the random vibration damage, represents the temperature cycle damage coefficient, represents the random vibration damage coefficient. Specifically, is the damage caused by the temperature cycle per cycle, is the damage caused by the random vibration per second.

[0093] In addition, the process of calculating the total life of the to-be-predicted component by S101-S104 can also be obtained by performing a destructive experiment on a large number of sample components and then fitting the experimental results.

[0094] S105, based on the total life and the electronic equipment reliability prediction manual, removing the influence of the packaging factor in the failure rate, obtaining the environmental coefficient of the to-be-predicted component under the preset temperature cycle condition.

[0095] Optionally, S105 can specifically include:

[0096] calculating the failure rate of the to-be-predicted component based on the total life and the first preset formula ;

[0097] obtaining the packaging complexity failure rate of the to-be-predicted component by looking up the table through the electronic equipment reliability prediction manual ;

[0098] obtaining the environmental coefficient by using the second preset formula, the failure rate , and the packaging complexity failure rate ;

[0099] wherein the first preset formula is represented as: , represents the total life, the unit of the total life is hour h, the failure rate has the unit of h -1 .

[0100] In the embodiment of the application, after the failure rate is calculated, because the solder is the main dangerous point of the component under the temperature vibration condition, the failure rate can be regarded as the packaging failure rate of the component. According to the electronic equipment reliability prediction manual GJB / Z299C-2006, the packaging failure rate can be obtained by multiplying the packaging complexity failure rate by the environmental coefficient , so the environmental coefficient under the corresponding loading condition can be calculated by the following second preset formula:

[0101] The second preset formula is represented as: ; represents the packaging complexity failure rate, represents the environmental coefficient.

[0102] In summary, the application obtains the environmental coefficient under the coupling loading condition of specific temperature cycle and random vibration through finite element analysis, solves the problem that the general environmental classification in GJB / Z 299C-2006 Electronic Equipment Reliability Prediction Manual has a large error when facing the complex and diverse loading conditions today. In addition, the application method gives the environmental coefficient calculation method related to the loading condition only on the basis of the reliability model in GJB / Z 299C-2006 Electronic Equipment Reliability Prediction Manual. The environmental coefficient calculated by the method can be directly used in the reliability prediction of other devices under the same loading condition in the future, and the accuracy and efficiency of the reliability prediction are improved.

[0103] The application embodiment provides an environmental coefficient calculation method of an electronic component under a preset temperature-vibration environment, including: constructing a finite element model according to structure parameters of a component to be predicted; performing temperature cycle simulation on the finite element model, and calculating temperature cycle damage according to a result of the temperature cycle simulation and a Miner law; performing random vibration simulation on the finite element model by taking a preset temperature cycle condition as a prestress, and calculating random vibration damage according to a result of the random vibration simulation and the Miner law; superimposing the temperature cycle damage and the random vibration damage, and calculating total life of the component to be predicted according to a result of the superimposition and the Miner law; and removing an influence of a packaging factor in a failure rate based on the total life and an electronic equipment reliability prediction manual, to obtain the environmental coefficient of the component to be predicted under the preset temperature cycle condition. In the application embodiment, the stress and strain of the electronic component under the preset temperature-vibration environment can be more accurately reflected by constructing the finite element model and performing the temperature cycle simulation and the random vibration simulation, so that the accuracy of the failure rate prediction is improved. The total damage is obtained by superimposing the temperature cycle damage and the random vibration damage, and the total life and the failure rate are calculated accordingly, so that the reliability of the electronic component under the complex loading condition can be more comprehensively considered. Finally, the influence of the packaging factor is excluded, the environmental coefficient under the corresponding loading condition is calculated, more accurate data support is provided for the reliability evaluation of the electronic component, and in summary, the application method improves the accuracy and reliability of the failure rate prediction of the electronic component.

[0104] The method provided by the application embodiment can be applied to an electronic device. Specifically, the electronic device can be a desktop computer, a portable computer, a smart mobile terminal, a server, and the like, and the application embodiment is not limited thereto.

[0105] Based on the same inventive concept, the application embodiment further provides an environmental coefficient calculation device of an electronic component under a preset temperature-vibration environment. Figure 2 A structural schematic diagram of an environmental coefficient calculation device of an electronic component under a preset temperature-vibration environment provided by the application embodiment is shown in FIG. 2. Figure 2As shown, it comprises: a model construction unit 201, a temperature simulation unit 202, a vibration simulation unit 203 and a calculation unit 204.

[0106] The model construction unit 201 is configured to construct a finite element model according to the structure parameters of the to-be-predicted component;

[0107] The temperature simulation unit 202 is configured to perform temperature cycle simulation on the finite element model, and calculate temperature cycle damage according to the result of the temperature cycle simulation and the Miner law;

[0108] The vibration simulation unit 203 is configured to perform random vibration simulation on the finite element model with the preset temperature cycle condition as prestress, and calculate random vibration damage according to the result of the random vibration simulation and the Miner law;

[0109] The calculation unit 204 is configured to superimpose the temperature cycle damage and the random vibration damage, and calculate the total life of the to-be-predicted component according to the result of the damage superposition and the Miner law.

[0110] The calculation unit 204 is further configured to obtain the environmental coefficient of the to-be-predicted component under the preset temperature cycle condition based on the total life and the electronic device reliability prediction manual.

[0111] Figure 3 A structural schematic diagram of an electronic component environmental coefficient calculation device under a preset temperature-vibration environment provided by the embodiment of the present application, comprising: a processor 310, a storage medium 320 and a bus 330, the storage medium 320 stores machine readable instructions executable by the processor 310, when the electronic component environmental coefficient calculation device under the preset temperature-vibration environment runs, the processor 310 and the storage medium 320 communicate through the bus 330, the processor 310 executes the machine readable instructions to execute the steps of the above method embodiment. The specific implementation and technical effects are similar, and will not be repeated here.

[0112] The storage medium can include a random access memory (RAM) and can also include a non-volatile memory (NVM), such as at least one disk memory. Optionally, the storage medium can also be at least one storage device located away from the aforementioned processor.

[0113] The processor described above can be a general processor, including a central processing unit (CPU), a network processor (NP), etc.; can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component.

[0114] It should be noted that the terms "first", "second", and so on are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of devices and methods consistent with some aspects of the present application.

[0115] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" means that the specific features or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.

[0116] Although the present application is described herein in conjunction with various embodiments, other variations of the disclosed embodiments can be understood and implemented by those skilled in the art with reference to the drawings and the disclosure. In the description of the present application, the word "comprising" does not exclude other components or steps, "one" or "an" does not exclude a plurality, and "plurality" means two or more, unless otherwise explicitly specified. In addition, some measures are described in different embodiments, but this does not mean that these measures cannot be combined to produce good results.

[0117] The above is further detailed description of the present application in combination with specific preferred embodiments, and cannot be deemed as limitation of the specific implementation of the present application to these descriptions. For those skilled in the art to which the present application belongs, without departing from the concept of the present application, a number of simple deductions or substitutions can be made, and all of them shall be deemed as falling within the protection scope of the present application.

Claims

1. An environmental coefficient calculation method for electronic components under a preset temperature-vibration environment, characterized in that, The method comprises the following steps: constructing a finite element model according to a structure parameter of a component to be predicted; performing temperature cycle simulation on the finite element model, and calculating temperature cycle damage according to a result of the temperature cycle simulation and a Miner law; performing random vibration simulation on the finite element model with a preset temperature cycle condition as prestress, and calculating random vibration damage according to a result of the random vibration simulation and the Miner law; superimposing the temperature cycle damage and the random vibration damage, and calculating total life of the component to be predicted according to a result of the superimposition and the Miner law; based on the total life and an electronic device reliability prediction manual, removing an influence of a packaging factor in a failure rate, and obtaining an environmental coefficient of the component to be predicted under the preset temperature cycle condition; the method for calculating the environmental coefficient of the electronic component under the preset temperature-vibration environment comprises the following steps: calculate the failure rate of the to-be-predicted component based on the total life and a first preset formula ; By means of the electronic equipment reliability prediction manual, a table is looked up to obtain the packaging complexity failure rate of the component to be predicted ; utilizing a second preset formula, the failure rate and the packaging complexity failure rate to obtain the environmental coefficient; The first preset formula is represented as: , represents total life. The second preset formula is represented as: ; represents a packaging complexity failure rate, represents the environmental coefficient.

2. The method according to claim 1, wherein the method is characterized by: the temperature cycle simulation on the finite element model, and the calculation of the temperature cycle damage according to the result of the temperature cycle simulation and the Miner law, comprise the following steps: performing temperature cycle simulation on the finite element model, and obtaining a shear plastic strain curve; calculating a temperature cycle life of the component to be predicted based on the shear plastic strain curve and a modified Manson-Coffin formula; calculating the temperature cycle damage according to the inverse of the temperature cycle life according to the Miner law.

3. The method according to claim 1, wherein the method is characterized by: the random vibration simulation on the finite element model with the preset temperature cycle condition as prestress, and the calculation of the random vibration damage according to the result of the random vibration simulation and the Miner law, comprise the following steps: inputting the preset temperature cycle condition as the prestress into a preset simulation application, and obtaining a resonance frequency and an elastic strain range corresponding to the finite element model; calculating a positive zero pass value by substituting the resonance frequency into a positive zero pass formula; calculating a fatigue cycle number based on the elastic strain range; calculating the random vibration damage based on the Miner law, the positive zero pass value and the fatigue cycle number.

4. The method according to claim 3, wherein the method is characterized by: the positive zero pass formula is expressed as: ； wherein, represents the positive zero pass value, represents the total order of the resonance frequency, represents the acceleration power spectral density value corresponding to the order resonance frequency, represents the acceleration power spectral density value corresponding to the order resonance frequency, represents the transmission rate resulting from the order resonance frequency, represents the natural circular frequency of the order.

5. The method of claim 3, wherein the method is characterized by: a relationship between the elastic strain range and the fatigue cycle number is expressed as: ； represents the number of fatigue cycles of the random vibration excitation in the interval represents the range of elastic strain in the interval, represents the tensile strength of the component to be predicted, represents the modulus of elasticity, represents the number of fatigue cycles of the random vibration excitation in the interval represents the range of elastic strain in the interval, is the variance of the normal distribution of the random vibration excitation.

6. The method of claim 3, wherein the method is characterized by: a formula of the random vibration calculation is expressed as: ； wherein represents the random vibration damage, represents the positive zero pass value, , and corresponds to the number of fatigue cycles of the random vibration excitation in , and the interval, is the variance of the normal distribution of the random vibration excitation.

7. The method of claim 1, wherein the method is performed in a predetermined temperature-vibration environment. the superimposition of the temperature cycle damage and the random vibration damage, and the calculation of the total life of the component to be predicted according to a result of the superimposition and the Miner law, comprise the following steps: performing summation processing on the temperature cycle damage and the random vibration damage according to a preset weighting proportion, and obtaining total damage of the component to be predicted; calculating the total life of the component to be predicted by taking the inverse of the total damage.

8. A device for calculating the environmental coefficient of electronic components under a preset temperature and vibration environment, characterized in that: the device for calculating the environmental coefficient of the electronic component under the preset temperature-vibration environment comprises a model construction unit, a temperature simulation unit, a vibration simulation unit and a calculation unit; the model construction unit is configured to construct a finite element model according to a structure parameter of a component to be predicted; The temperature simulation unit is configured to perform temperature cycle simulation on the finite element model, and calculate temperature cycle damage according to a result of the temperature cycle simulation and a Miner law; The vibration simulation unit is configured to perform random vibration simulation on the finite element model with preset temperature cycle conditions as prestress, and calculate random vibration damage according to a result of the random vibration simulation and the Miner law; The calculation unit is configured to superimpose the temperature cycle damage and the random vibration damage, and calculate total life of the to-be-predicted component according to a result of the damage superposition and the Miner law; The calculation unit is further configured to remove an influence of a packaging factor in a failure rate based on the total life and an electronic equipment reliability prediction manual, and obtain an environmental coefficient of the to-be-predicted component under the preset temperature cycle conditions. The calculation unit, based on the total life and the electronic equipment reliability prediction manual, removes the influence of the packaging factor in the failure rate, and obtains the environmental coefficient of the to-be-predicted component under the preset temperature cycle conditions, including: calculate the failure rate of the to-be-predicted component based on the total life and a first preset formula ; By means of the electronic equipment reliability prediction manual, a table is looked up to obtain the packaging complexity failure rate of the component to be predicted ; utilizing a second preset formula, the failure rate and the packaging complexity failure rate to obtain the environmental coefficient; The first preset formula is represented as: , represents total life. The second preset formula is represented as: ; represents a packaging complexity failure rate, represents the environmental coefficient.

9. An environmental coefficient calculation device for electronic components under a preset temperature and vibration environment, characterized in that: including: A processor, a storage medium and a bus, the storage medium storing machine readable instructions executable by the processor, when the environmental coefficient calculation device is running, the processor and the storage medium communicate through the bus, the processor executes the machine readable instructions to perform the steps of the environmental coefficient calculation method of any one of claims 1-7.

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