Printed circuit board inspection method and device and terminal equipment

Abstract

The embodiment of the invention provides a printed circuit board inspection method and device and terminal equipment. The method comprises the following steps: acquiring an inspection request, wherein the inspection request comprises a design rule file corresponding to a printed circuit board (PCB) to be inspected and at least one pin corresponding to the PCB; determining a welding process of each pin according to the design rule file; in the design rule file, obtaining process design information corresponding to each pin; and according to the design rule file and the process design information corresponding to each pin, performing inspection processing on the at least one pin to obtain an inspection result corresponding to the inspection request. And the inspection accuracy of the welding process of the printed circuit board is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computer technology, and in particular to a printed circuit board inspection method, apparatus, and terminal device. Background Art

[0002] Currently, when designing a printed circuit board (PCB), it is necessary to consider the impact of the welding process on the layout, size, etc. of the printed circuit board.

[0003] In actual application, most PCB designs rely on the experience of designers to carry out component layout and soldering process design when designing the layout of wave soldering and through-hole reflow soldering. And the processability inspection of wave soldering and through-hole reflow soldering still relies on the experience and manual operation of designers. As the complexity of the design increases, the manual inspection process becomes time-consuming and prone to errors. As a result, the accuracy of printed circuit board soldering process inspection is low. Summary of the invention

[0004] The embodiments of the present application provide a printed circuit board inspection method, apparatus and terminal device, which are used to solve the problem of low accuracy in printed circuit board welding process inspection.

[0005] In a first aspect, an embodiment of the present application provides a printed circuit board inspection method, comprising:

[0006] Obtaining an inspection request, the inspection request including a design rule file corresponding to a printed circuit board PCB to be inspected, and at least one pin corresponding to the PCB;

[0007] Determine the welding process of each pin according to the design rule file;

[0008] In the design rule file, obtaining process design information corresponding to each pin;

[0009] According to the design rule file and the process design information corresponding to each pin, the at least one pin is inspected and processed to obtain an inspection result corresponding to the inspection request.

[0010] In the embodiment of the present application, each pin can be automatically checked according to the design rule file and the process design information corresponding to each pin to obtain the inspection result, thereby avoiding the process inspection still relying on the experience and manual operation of the designer, and improving the accuracy of the printed circuit board welding process inspection.

[0011] In a possible implementation manner, performing inspection processing on the at least one pin according to the design rule file and the process design information corresponding to each pin to obtain an inspection result corresponding to the inspection request includes:

[0012] For any pin, if the soldering process of the pin is a wave soldering process, first inspection information is obtained in the design rule file, and the pin is inspected and processed according to the first inspection information and the process design information corresponding to the pin to obtain a first inspection result corresponding to the pin;

[0013] If the soldering process of the pin is a through-hole reflow soldering process, obtaining second inspection information in the design rule file, and inspecting the pin according to the second inspection information and the process design information corresponding to the pin to obtain a second inspection result corresponding to the pin;

[0014] Determine that the inspection result corresponding to the inspection request includes a first inspection result and a second inspection result corresponding to each pin.

[0015] In the embodiment of the present application, for any pin, corresponding inspection information and process design information can be determined according to the welding process of the pin, and inspection can be performed, thereby improving the accuracy of the inspection.

[0016] For any pin; in the design rule file, obtain the process design information corresponding to the pin, including:

[0017] If the soldering process of the pin is a wave soldering process, then in the design rule file, the process design information is obtained including the number of copper connection layers of the pin, the through hole size corresponding to the pin, the pad size corresponding to the pin, the pin length of the pin, the first spacing between the pin and each adjacent device, and the second spacing between the pin and each first device;

[0018] If the soldering process of the pin is a through-hole reflow process, then in the design rule file, the process design information obtained includes the number of copper connection layers of the pin, the through-hole size corresponding to the pin, the pad size corresponding to the pin, and the third spacing between the pin and each adjacent device.

[0019] In an embodiment of the present application, process design information corresponding to the pin is obtained to facilitate subsequent inspection and processing of the pin, thereby avoiding the pin being unable to be produced during the production process due to incorrect process design information, thereby improving the accuracy of the inspection.

[0020] In a possible implementation, performing inspection processing on the pin according to the first inspection information and process design information corresponding to the pin to obtain a first inspection result corresponding to the pin includes:

[0021] In the first inspection information, determining the inspection information corresponding to each item of information in the process design information;

[0022] If each item of information in the process design information matches the corresponding inspection information in the first inspection information, determining the first inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0023] If there is information in the process design information that does not match the corresponding inspection information in the first inspection information, determining a first inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0024] In the embodiment of the present application, based on the first inspection information, the process design information of the pins corresponding to the wave soldering process is compared one by one to inspect the pins, thereby improving the accuracy of the pin inspection.

[0025] In a possible implementation manner, the first inspection information includes a first layer number range, a first through hole size range, a pad size range, a first preset spacing, a first length range, and a second preset spacing; each item of information in the process design information is matched with corresponding inspection information in the first inspection information, including:

[0026] The number of copper connection layers of the pin matches the first layer number range, the through-hole size corresponding to the pin matches the first through-hole size range, the pad size corresponding to the pin matches the pad size range, the first spacing between the pin and each adjacent component is greater than or equal to the first preset spacing, the pin length of the pin matches the first length range, the second spacing between the pin and each first component is greater than or equal to the second preset spacing, and the device height of the first device is greater than or equal to the preset height.

[0027] In the embodiment of the present application, each piece of information must be matched to determine whether the pin design complies with the design rule file, thereby improving the accuracy of the pin inspection.

[0028] In a possible implementation manner, the information in the process design information does not match the corresponding inspection information in the first inspection information, including:

[0029] If the number of copper connection layers of the pin does not match the first layer number range, and / or the through-hole size corresponding to the pin does not match the first through-hole size range, and / or the pad size corresponding to the pin does not match the pad size range, and / or the first spacing between the pin and each adjacent component is less than the first preset spacing, and / or the pin length of the pin does not match the first length range, and / or the second spacing between the pin and each first component is less than the second preset spacing.

[0030] In the embodiment of the present application, if one piece of information does not match, the pin design needs to be re-determined to avoid errors in subsequent production and improve the accuracy of pin inspection.

[0031] In a possible implementation manner, the second inspection information includes a second layer number range, a second through hole size range, a pad size range, and a third preset spacing; and the pin is inspected and processed according to the second inspection information and the process design information corresponding to the pin to obtain a second inspection result corresponding to the pin, including:

[0032] In the second inspection information, determining the inspection information corresponding to each item of information in the process design information;

[0033] If each item of information in the process design information matches the corresponding inspection information in the second inspection information, determining the second inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0034] If there is information in the process design information that does not match the corresponding inspection information in the second inspection information, determining the second inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0035] According to the second inspection information, the process design information of the pins corresponding to the through-hole reflow process is compared one by one to inspect the pins, thereby improving the accuracy of the pin inspection.

[0036] In a possible implementation, the method further includes:

[0037] If the soldering process of the pin is a wave soldering process, and the copper connection layer of the pin is greater than or equal to a third preset number of layers, determining whether there is a corresponding thermal pad for the pin;

[0038] If yes, determining that the first inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0039] If not, it is determined that the first inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0040] When the pins are connected to multiple copper layers, a large amount of heat loss will occur, resulting in the tin material not being fully melted during welding, resulting in poor welding results. Checking the hot pads of the pins can avoid poor welding results and improve production accuracy.

[0041] In a possible implementation, the method further includes:

[0042] If the soldering process of the pin is a through-hole reflow soldering process, and the copper connection layer of the pin is greater than or equal to a fourth preset number of layers, determining whether the pin has a corresponding thermal pad;

[0043] If yes, determining that the second inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0044] If not, it is determined that the second inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0045] When the pins are connected to multiple copper layers, a large amount of heat loss will occur, resulting in the tin material not being fully melted during welding, resulting in poor welding results. Checking the hot pads of the pins can avoid poor welding results and improve production accuracy.

[0046] In a second aspect, an embodiment of the present application provides a printed circuit board inspection device, the device comprising:

[0047] A first acquisition module is used to acquire an inspection request, wherein the inspection request includes a design rule file corresponding to a printed circuit board PCB to be inspected, and at least one pin corresponding to the PCB;

[0048] A first determination module, used to determine the welding process of each pin according to the design rule file;

[0049] A second acquisition module is used to acquire process design information corresponding to each pin in the design rule file;

[0050] The processing module is used to perform inspection processing on the at least one pin according to the design rule file and the process design information corresponding to each pin, and obtain the inspection result corresponding to the inspection request.

[0051] In a possible implementation manner, the processing module is specifically used to:

[0052] For any pin, if the soldering process of the pin is a wave soldering process, first inspection information is obtained in the design rule file, and the pin is inspected and processed according to the first inspection information and the process design information corresponding to the pin to obtain a first inspection result corresponding to the pin;

[0053] If the soldering process of the pin is a through-hole reflow soldering process, obtaining second inspection information in the design rule file, and inspecting the pin according to the second inspection information and the process design information corresponding to the pin to obtain a second inspection result corresponding to the pin;

[0054] Determine that the inspection result corresponding to the inspection request includes a first inspection result and a second inspection result corresponding to each pin;

[0055] In a possible implementation manner, the second acquisition module is specifically configured to:

[0056] If the soldering process of the pin is a wave soldering process, then in the design rule file, the process design information is obtained including the number of copper connection layers of the pin, the through hole size corresponding to the pin, the pad size corresponding to the pin, the pin length of the pin, the first spacing between the pin and each adjacent device, and the second spacing between the pin and each first device;

[0057] If the soldering process of the pin is a through-hole reflow process, then in the design rule file, the process design information obtained includes the number of copper connection layers of the pin, the through-hole size corresponding to the pin, the pad size corresponding to the pin, and the third spacing between the pin and each adjacent device.

[0058] In a possible implementation manner, the processing module is specifically used to:

[0059] In the first inspection information, determining the inspection information corresponding to each item of information in the process design information;

[0060] If each item of information in the process design information matches the corresponding inspection information in the first inspection information, determining the first inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0061] If there is information in the process design information that does not match the corresponding inspection information in the first inspection information, determining a first inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0062] In a possible implementation manner, the processing module is specifically used to:

[0063] The number of copper connection layers of the pin matches the first layer number range, the through-hole size corresponding to the pin matches the first through-hole size range, the pad size corresponding to the pin matches the pad size range, the first spacing between the pin and each adjacent component is greater than or equal to the first preset spacing, the pin length of the pin matches the first length range, the second spacing between the pin and each first component is greater than or equal to the second preset spacing, and the device height of the first device is greater than or equal to the preset height.

[0064] In a possible implementation manner, the processing module is specifically used to:

[0065] The number of copper connection layers of the pin does not match the first layer number range, and / or the through-hole size corresponding to the pin does not match the first through-hole size range, and / or the pad size corresponding to the pin does not match the pad size range, and / or the first spacing between the pin and each adjacent component is less than the first preset spacing, and / or the pin length of the pin does not match the first length range, and / or the second spacing between the pin and each first component is less than the second preset spacing.

[0066] In a possible implementation manner, the processing module is specifically used to:

[0067] In the second inspection information, determining the inspection information corresponding to each item of information in the process design information;

[0068] If each item of information in the process design information matches the corresponding inspection information in the second inspection information, determining the second inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0069] If there is information in the process design information that does not match the corresponding inspection information in the second inspection information, determining the second inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0070] In a possible implementation, the device further includes a second determining module and a third determining module.

[0071] Wherein, the second determining module is used for:

[0072] If the soldering process of the pin is a wave soldering process, and the copper connection layer of the pin is greater than or equal to a third preset number of layers, determining whether there is a corresponding thermal pad for the pin;

[0073] If yes, determining that the first inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0074] If not, it is determined that the first inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0075] The third determination module is used for:

[0076] If the soldering process of the pin is a through-hole reflow soldering process, and the copper connection layer of the pin is greater than or equal to a fourth preset number of layers, determining whether the pin has a corresponding thermal pad;

[0077] If yes, determining that the second inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0078] If not, it is determined that the second inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0079] In a third aspect, an embodiment of the present application provides a terminal device, including:

[0080] at least one processor; and

[0081] a memory communicatively connected to the at least one processor; wherein,

[0082] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can perform any method described in the first aspect.

[0083] In a fourth aspect, an embodiment of the present application provides a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable the computer to execute any one of the methods described in the first aspect.

[0084] In a fifth aspect, an embodiment of the present application provides a computer program product, including a computer program, which implements any method in the first aspect when executed by a processor.

[0085] The printed circuit board inspection method, device and terminal device provided in the embodiment of the present application can automatically inspect each pin according to the design rule file and the process design information corresponding to each pin to obtain the inspection result. This avoids the process inspection still relying on the experience and manual operation of the designer, and improves the accuracy of the printed circuit board welding process inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0086] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0087] Figure 1 A schematic diagram of an application scenario provided by an embodiment of the present application;

[0088] Figure 2 A schematic diagram of a process flow of a printed circuit board inspection method provided in an embodiment of the present application;

[0089] Figure 3 A schematic diagram of the process of obtaining an inspection request provided in an embodiment of the present application;

[0090] Figure 4 A schematic flow chart of another printed circuit board inspection method provided in an embodiment of the present application;

[0091] Figure 5A schematic diagram of a printed circuit board inspection process provided by an embodiment of the present application;

[0092] Figure 6 A schematic diagram of the structure of a printed circuit board inspection device provided in an embodiment of the present application;

[0093] Figure 7 A schematic diagram of the structure of another printed circuit board inspection device provided in an embodiment of the present application;

[0094] Figure 8 A schematic diagram of the structure of a terminal device provided in an embodiment of the present application.

[0095] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0096] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0097] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0098] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant laws, regulations and standards, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0099] For ease of understanding, below, combined Figure 1 , the application scenarios to which the embodiments of the present application are applicable are described.

[0100] Figure 1 This is a schematic diagram of an application scenario provided by an embodiment of the present application. Figure 1 , including a terminal device 101. The terminal device 101 may be a computer, and an application is provided in the terminal device 101. A user may design and check a PCB through the terminal device 101.

[0101] In actual application, most PCB designs rely on the experience of designers to carry out component layout and soldering process design when designing the layout of wave soldering and through-hole reflow soldering. And the processability inspection of wave soldering and through-hole reflow soldering still relies on the experience and manual operation of designers. As the complexity of the design increases, the manual inspection process becomes time-consuming and prone to errors. As a result, the accuracy of printed circuit board soldering process inspection is low.

[0102] In the embodiment of the present application, the terminal device can automatically check each pin according to the design rule file and the process design information corresponding to each pin to obtain the inspection result, thereby avoiding the process inspection still relying on the experience and manual operation of the designer, and improving the accuracy of the printed circuit board welding process inspection.

[0103] The method shown in the present application is described below through specific embodiments. It should be noted that the following embodiments can exist independently or in combination with each other, and the same or similar contents will not be described repeatedly in different embodiments.

[0104] Figure 2 A schematic diagram of a printed circuit board inspection method provided in an embodiment of the present application. Figure 2 , the method may include:

[0105] S201: Get an inspection request.

[0106] The execution subject of the embodiment of the present application may be a terminal device, or a printed circuit board inspection device arranged in the terminal device. The printed circuit board inspection device may be implemented by software, or by a combination of software and hardware. The terminal device may be a computer.

[0107] The inspection request includes a design rule file corresponding to the printed circuit board PCB to be inspected and at least one pin corresponding to the PCB. The pin is a pin corresponding to a through hole position in the PCB.

[0108] After the user completes the design of the PCB, the user can generate the design file of the PCB through the terminal device. The design file includes information such as the number of layers, routing, vias, and layout of the pads of the surface mount device. At the same time, the user can also obtain the file or database file of the PCB design rules. And based on the design file and the file or database file of the design rules, a design rule file is generated and stored in the storage area of ​​the terminal device. So that the user can directly obtain the design rule file when checking the PCB.

[0109] The rule file can be the default setting of the inspection tool or an external design file, and this application does not impose any restrictions.

[0110] Next, combine Figure 3 , describes the process of obtaining an inspection request. Figure 3 A schematic diagram of the process of obtaining an inspection request provided in an embodiment of the present application. Figure 3 , including interface 301 and interface 302. Interface 301 and interface 302 may be pages provided by the terminal device. Referring to interface 301, the user may click an icon corresponding to the check application in the terminal device. The terminal device displays an operation page in response to the user's click operation. The operation page includes a drop-down selection menu corresponding to at least one design rule file, and a text input box.

[0111] Referring to interface 302, the user determines that the PCB to be checked is PCB1, and determines that the design rule file corresponding to PCB1 is file A1 in the drop-down selection menu corresponding to design rule file 1, and clicks the confirmation icon. In response to the user's input selection operation, the terminal device obtains file A1 in the storage area. In file A1, the terminal device obtains at least one pin of PCB1 including pins A1 to A10. And determines that the inspection request includes file A1 and pins A1 to A10.

[0112] S202: Determine the welding process for each pin according to the design rule file.

[0113] The terminal device can obtain the package information of the pin in the design rule file. If the package information of the pin is used to indicate that there is no steel mesh layer, the soldering process of the pin is determined to be a wave soldering process. If the package information of the pin is used to indicate that there is a steel mesh layer, the soldering process of the pin is determined to be a through-hole reflow process.

[0114] For example, according to the above example, it is determined that the inspection request includes file A1 and pins A1 to A10. The terminal device obtains the packaging information of each pin in the design rule file. It is determined that the packaging information of pins A1 to A5 is used to indicate that there is no steel mesh layer, and then the welding process of pins A1 to A5 is determined to be a wave soldering process. It is determined that the packaging information of pins A6 to A10 is used to indicate that there is a steel mesh layer, and then the welding process of pins A6 to A10 is determined to be a through-hole reflow process.

[0115] S203 . Obtain process design information corresponding to each pin in the design rule file.

[0116] For any pin, if the soldering process of the pin is a wave soldering process, in the design rule file, the process design information obtained includes the number of copper connection layers of the pin, the through hole size corresponding to the pin, the pad size corresponding to the pin, the pin length of the pin, the first spacing between the pin and each adjacent device, and the second spacing between the pin and each first device. The device height of the first device is greater than or equal to the preset height.

[0117] If the soldering process of the pin is a through-hole reflow process, then in the design rule file, the process design information obtained includes the number of copper connection layers of the pin, the through-hole size corresponding to the pin, the pad size corresponding to the pin, and the third spacing between the pin and each adjacent device.

[0118] S204 . Perform inspection processing on at least one pin according to the design rule file and the process design information corresponding to each pin, and obtain an inspection result corresponding to the inspection request.

[0119] At least one pin can be inspected and processed according to the design rule file and the process design information corresponding to each pin to obtain the inspection result corresponding to the inspection request in the following manner: determine the welding process of each pin according to the design rule file; for any pin, if the welding process of the pin is a wave soldering process, obtain first inspection information from the design rule file, and inspect the pin according to the first inspection information and the process design information corresponding to the pin to obtain the first inspection result corresponding to the pin; if the welding process of the pin is a through-hole reflow process, obtain second inspection information from the design rule file, and inspect the pin according to the second inspection information and the process design information corresponding to the pin to obtain the second inspection result corresponding to the pin; determine that the inspection result corresponding to the inspection request includes the first inspection result and the second inspection result corresponding to each pin.

[0120] For any pin, corresponding inspection information and process design information can be determined according to the welding process of the pin, and inspection can be performed, thereby improving the accuracy of the inspection.

[0121] For example, for pins A1 to A5 shown in the above example, the terminal device obtains the first inspection information in file A1, and inspects and processes pins A1 to A5 according to the first inspection information and the process design information corresponding to the pins, and obtains the first inspection results corresponding to pins A1 to A5, which are respectively used to indicate that the pin design complies with file A1. For pins A6 to A10 shown in the above example, the terminal device obtains the second inspection information in file A1, and inspects and processes pins A6 to A10 according to the second inspection information and the process design information corresponding to the pins, and obtains the second inspection results corresponding to A6 to A10, which are respectively used to indicate that the pin design complies with file A1. Therefore, the terminal device determines that the inspection results of pins A1 to A10 are used to indicate that the design complies with file A1.

[0122] The printed circuit board inspection method provided in the embodiment of the present application obtains an inspection request. According to the design rule file, the welding process of each pin is determined. The process design information corresponding to each pin is obtained. According to the design rule file and the process design information corresponding to each pin, at least one pin is inspected and processed to obtain an inspection result corresponding to the inspection request. In the above process, the terminal device can automatically inspect each pin according to the design rule file and the process design information corresponding to each pin to obtain the inspection result. It avoids the process inspection still relying on the experience and manual operation of the designer, and improves the accuracy of the printed circuit board welding process inspection.

[0123] Based on any of the above embodiments, Figure 4 , the detailed process of printed circuit board inspection is explained.

[0124] Figure 4 A flow chart of another printed circuit board inspection method provided in an embodiment of the present application. Figure 4 , the method comprising:

[0125] S401: Get an inspection request.

[0126] It should be noted that the execution process of S401 can refer to S201 and will not be repeated here.

[0127] S402: Determine the welding process for each pin according to the design rule file.

[0128] For example, the inspection request obtained by the terminal device includes file B and pins B1, B2, and B3. The terminal device obtains the packaging information of each pin in the design rule file. It is determined that the packaging information of pins B1 and B2 is used to indicate that there is no steel mesh layer, and the welding process of pins B1 and B2 is determined to be a wave soldering process. It is determined that the packaging information of pin B3 is used to indicate that there is a steel mesh layer, and the welding process of pin B3 is determined to be a through-hole reflow process.

[0129] S403 . Obtain process design information corresponding to each pin in the design rule file.

[0130] For example, the process design information corresponding to each pin may be specifically shown in Table 1:

[0131] Table 1

[0132]

[0133] The first spacing between pin B1 and adjacent device B1 is 3.5 mm, and the first spacing between pin B1 and adjacent device B2 is 4 mm. The first spacing between pin B2 and adjacent device B1 is 4 mm, and the first spacing between pin B2 and adjacent device B2 is 3.5 mm. The first spacing between pin B3 and adjacent device B3 is 4 mm.

[0134] S404 . For any pin, if the soldering process of the pin is a wave soldering process, obtain first inspection information from a design rule file.

[0135] The first inspection information includes a first layer number range, a first through hole size range, a pad size range, a first preset spacing, a first length range, and a second preset spacing.

[0136] The first layer range is used to indicate the appropriate range of the number of copper connection layers of the pin. For the wave soldering process, the number of copper connection layers of the pin is within the first layer range to ensure that the tin wave can fully fill the through hole and form a stable solder joint. Too many layers may cause the heat to conduct too quickly during soldering, resulting in the tin wave failing to completely cover the pad or soldering point.

[0137] The first through-hole size range is used to indicate the appropriate range of through-hole sizes corresponding to the pins. For the wave soldering process, the through-hole diameter is within the first through-hole size range to ensure sufficient space for the tin wave to fill the through-hole and form a good solder joint connection.

[0138] The pad size range is used to indicate the appropriate range of pad sizes corresponding to the pins. For the wave soldering process, the pad size corresponding to the pins is within the pad size range. A pad that is too small will result in insufficient tin, and a pad that is too large may cause excessive solder accumulation or diffusion.

[0139] The first preset spacing is used to indicate the minimum spacing between the pin and the adjacent device. For the wave soldering process, the first spacing between the pin and the adjacent device is greater than or equal to the first preset spacing, which can ensure that no short circuit or solder bridge occurs during the soldering process.

[0140] The first length range is used to indicate the appropriate range of the pin length. For the wave soldering process, the pin length should be within the first length range. Pins that are too short may not be able to fully contact the solder wave, resulting in cold soldering or loose soldering.

[0141] The second preset spacing is used to indicate the minimum spacing between the pin and the first device (high device). For the wave soldering process, devices with higher heights require a larger spacing than ordinary devices to ensure that the fixtures opened during PCBA production can effectively cover the device. For example, when the preset height is 2mm, for devices with a height greater than 2mm, the second spacing between the wave soldering pin and the device needs to be greater than the second preset spacing.

[0142] For example, the first layer number range can be 1 to 3 layers, the first through hole size range can be 0.2mm larger than the pin diameter, the pad size range can be that the pad diameter of the pin corresponding to the pad is 0.5-0.8mm larger than the pin diameter, the first preset spacing can be 3mm, the first length range can be 1.0-1.5mm larger than the thickness of the PCB board, and the second preset spacing can be 4mm.

[0143] S405 . Inspect the pin according to the first inspection information and the process design information corresponding to the pin to obtain a first inspection result corresponding to the pin.

[0144] The first inspection result corresponding to the pin can be obtained in the following manner: in the first inspection information, the inspection information corresponding to each information in the process design information is determined; if each information in the process design information matches the corresponding inspection information in the first inspection information, respectively, then the first inspection result corresponding to the pin is determined to indicate that the pin design complies with the design rule file; if there is information in the process design information that does not match the corresponding inspection information in the first inspection information, then the first inspection result corresponding to the pin is determined to indicate that the pin design does not comply with the design rule file.

[0145] The following method can be used to determine whether each item of information in the process design information matches the corresponding inspection information in the first inspection information: if the number of copper connection layers of the pin matches the first layer number range, the through-hole size corresponding to the pin matches the first through-hole size range, the pad size corresponding to the pin matches the pad size range, the first spacing between the pin and each adjacent component is greater than or equal to the first preset spacing, the pin length of the pin matches the first length range, and the second spacing between the pin and each first component is greater than or equal to the second preset spacing, then it is determined that each item of information in the process design information corresponding to the pin matches the corresponding inspection information in the first inspection information, and the device height of the first device is greater than or equal to the preset height.

[0146] The following method can be used to determine whether the information in the process design information does not match the inspection information corresponding to the first inspection information: if the number of copper connection layers of the pin does not match the first layer number range, and / or the through-hole size corresponding to the pin does not match the first through-hole size range, and / or the pad size corresponding to the pin does not match the pad size range, and / or the first spacing between the pin and each adjacent component is less than the first preset spacing, and / or the pin length of the pin does not match the first length range, and / or the second spacing between the pin and each first component is less than the second preset spacing, then it is determined that the information in the process design information corresponding to the pin does not match the inspection information corresponding to the first inspection information.

[0147] According to the first inspection information, the process design information of the pins corresponding to the wave soldering process is compared one by one to inspect the pins, thereby improving the accuracy of the pin inspection.

[0148] For example, for the process design information of the pin B1 shown in Table 1 above, since the soldering process of the pin B1 is a wave soldering process. According to the above example, it can be determined that the first inspection information includes that the first layer number range can be 1 to 3 layers, the first through hole size range can be 0.2mm larger than the pin diameter, the pad size range can be 0.25-0.35mm larger than the pin diameter, the first preset spacing can be 3mm, the first length range can be 1.0-1.5mm larger than the thickness of the PCB board, and the second preset spacing can be 4mm. Assuming that the diameter of the pin B1 is 0.3mm, it can be determined that the copper connection layer number 2 of the pin B1 matches the first layer number range, the through hole size 0.5mm corresponding to the pin B1 matches the first through hole size range, the pad size 1mm corresponding to the pin B1 matches the pad size range, the first spacing 3.5mm between the pin B1 and the adjacent device B1 is greater than the first preset spacing, and the first spacing 4mm between the pin B1 and the adjacent device B2 is greater than the first preset spacing. The thickness of the PCB board where pin B1 is located is 1mm, so it can be determined that the pin length of pin B1, 2mm, matches the first length range. The second spacing of 4mm between pin B1 and the first device is equal to the second preset spacing. Therefore, the terminal device determines that each information in the process design information corresponding to pin B1 matches the corresponding inspection information in the first inspection information. It can be determined that the first inspection result corresponding to pin B1 is used to indicate that the design of pin B1 complies with file B.

[0149] When it is determined that the first inspection result corresponding to the pin indicates that the pin design does not comply with the design rule file, the process design information corresponding to the design rule file is determined to be inconsistent, and the process design information corresponding to the design rule file is added to the first inspection result.

[0150] For example, for the process design information of pin B2 shown in Table 1 above, since the welding process of pin B1 is a wave soldering process. Assuming that the diameter of pin B2 is 0.3mm, it can be determined that the number of copper connection layers 1 of pin B2 matches the first layer number range, the through hole size 0.5mm corresponding to pin B2 matches the first through hole size range, the pad size 0.6mm corresponding to pin B2 does not match the pad size range, the first spacing 4mm between pin B2 and the adjacent device B1 is greater than the first preset spacing, and the first spacing 3.5mm between pin B2 and the adjacent device B2 is greater than the first preset spacing. The thickness of the PCB board where pin B2 is located is 1mm, then it can be determined that the pin length 2mm of pin B2 matches the first length range. The spacing 4mm between pin B2 and the first device is equal to the second preset spacing. Therefore, if the terminal device determines that there is information in the process design information corresponding to pin B1 that does not match the corresponding inspection information in the first inspection information, it can be determined that the first inspection result corresponding to pin B1 is used to indicate that the design of pin B2 does not comply with file B. And it is determined that the process design information that does not conform to the file B is the pad size of the pad corresponding to the pin B2. Then it can be determined that the first inspection result includes that the pad size design of the pad corresponding to the pin B2 does not conform to the file B.

[0151] If the welding process of the pin is a wave soldering process, and the copper connection layer of the pin is greater than or equal to the third preset number of layers, it is determined whether there is a corresponding hot pad for the pin; if so, it is determined that the first inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file; if not, it is determined that the first inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0152] When the pins are connected to multiple copper layers, a large amount of heat loss will occur, resulting in the tin material not being fully melted during welding, resulting in poor welding results. Checking the hot pads of the pins can avoid poor welding results and improve production accuracy.

[0153] If the number of copper layers connected to the pins of the wave soldering is greater than or equal to the third preset number of layers, a thermal pad is usually required to prevent rapid heat loss and poor soldering. The thermal pad is usually designed as a cross-shaped pad with a gap to limit heat loss. For example, the third preset number of layers can be 2 layers.

[0154] For example, for the pin B1 shown in the above example, it can be determined that the soldering process of the pin B1 is a wave soldering process, and the number of copper connection layers of the pin B1 is equal to the third preset number of layers. Therefore, the terminal device determines that there is a corresponding hot pad for the pin B1. Then, it can be determined that the first inspection result corresponding to the pin B1 is used to indicate that the design of the pin B1 complies with the file B.

[0155] S406: If the soldering process of the pin is a through-hole reflow process, obtain second inspection information from the design rule file.

[0156] The second inspection information includes a second layer number range, a second through hole size range, a pad size range, and a third preset spacing.

[0157] The second layer range is used to indicate the appropriate range of the number of copper connection layers of the pin. For the through-hole reflow process, the number of copper connection layers of the pin is within the second layer range to ensure welding quality and electrical connectivity. If the number of copper connection layers is insufficient, it may not be able to carry large currents, affecting electrical performance. However, too many connection layers may also lead to insufficient welding.

[0158] The second through-hole size range is used to indicate the appropriate range of through-hole sizes corresponding to the pins. For through-hole reflow process, the through-hole diameter is within the second through-hole size range to ensure that the solder paste can fully melt and fill the through-hole during the reflow process, while avoiding too little tin or loss of solder paste.

[0159] The pad size range is used to indicate the appropriate range of pad sizes for the pins. For through-hole reflow soldering, the pad size corresponding to the pin is within the pad size range. A pad that is too small will result in insufficient tin, while a pad that is too large may cause excessive solder accumulation or diffusion.

[0160] The third preset spacing is used to indicate the minimum spacing between the pin and the adjacent device. For the through-hole reflow process, the third spacing between the pin and the adjacent device is greater than or equal to the first preset spacing. The solder paste will melt and flow after heating. If the spacing between the pin and the adjacent device is too small, the solder paste may spread to the adjacent pads or components, causing a short circuit or poor welding.

[0161] For example, the second layer number range can be 2 to 4 layers, the second through hole size range can be 0.25-0.35mm larger than the pin diameter, the pad size range can be that the pad diameter of the pin corresponding to the pad is 0.5-0.8mm larger than the pin diameter, and the third preset spacing can be 1.5mm.

[0162] S407 . Inspect the pin according to the second inspection information and the process design information corresponding to the pin to obtain a second inspection result corresponding to the pin.

[0163] The second inspection result corresponding to the pin can be obtained in the following manner: in the second inspection information, the inspection information corresponding to each information in the process design information is determined; if each information in the process design information matches the corresponding inspection information in the second inspection information, respectively, then the second inspection result corresponding to the pin is determined to indicate that the pin design complies with the design rule file; if there is information in the process design information that does not match the corresponding inspection information in the second inspection information, then the second inspection result corresponding to the pin is determined to indicate that the pin design does not comply with the design rule file.

[0164] The following method can be used to determine whether each item of information in the process design information matches the corresponding inspection information in the second inspection information: if the number of copper connection layers of the pin matches the second layer number range, the through-hole size corresponding to the pin matches the second through-hole size range, the pad size corresponding to the pin matches the pad size range, and the third spacing between the pin and each adjacent device is greater than or equal to the third preset spacing, then it is determined that each item of information in the process design information corresponding to the pin matches the corresponding inspection information in the second inspection information.

[0165] The following method can be used to determine whether the information in the process design information does not match the corresponding inspection information in the second inspection information: if the number of copper connection layers of the pin does not match the second layer number range, and / or the through-hole size corresponding to the pin does not match the second through-hole size range, and / or the pad size corresponding to the pin does not match the pad size range, and / or the third spacing between the pin and each adjacent component is less than the third preset spacing, then it is determined that the information in the process design information corresponding to the pin does not match the corresponding inspection information in the second inspection information.

[0166] According to the second inspection information, the process design information of the pins corresponding to the through-hole reflow process is compared one by one to inspect the pins, thereby improving the accuracy of the pin inspection.

[0167] When it is determined that the first inspection result corresponding to the pin indicates that the pin design does not comply with the design rule file, the process design information corresponding to the design rule file is determined to be inconsistent, and the process design information corresponding to the design rule file is added to the first inspection result.

[0168] For example, for the process design information of pin B3 shown in Table 1 above, since the welding process of pin B3 is a through-hole reflow process. According to the above example, it can be determined that the second inspection information includes that the second layer number range can be 2 to 4 layers, the second through-hole size range can be 0.25-0.35mm larger than the pin diameter, the pad size range can be that the pad diameter of the pad corresponding to the pin is 0.5-0.8mm larger than the pin diameter, and the third preset spacing can be 1.5mm. Assuming that the diameter of pin B3 is 0.3mm, it can be determined that the copper connection layer number 3 of pin B3 matches the second layer number range, the through-hole size 0.6mm corresponding to pin B3 matches the first through-hole size range, the pad size 0.8mm corresponding to pin B3 matches the pad size range, and the third spacing 4mm between pin B3 and adjacent device B3 is greater than the third preset spacing. Therefore, if the terminal device determines that each item of information in the process design information corresponding to pin B3 matches the corresponding inspection information in the second inspection information, it can be determined that the second inspection result corresponding to pin B3 is used to indicate that the design of pin B3 complies with file B.

[0169] If the soldering process of the pin is a through-hole reflow soldering process, and the copper connection layer of the pin is greater than or equal to the fourth preset number of layers, it is determined whether the pin has a corresponding thermal pad; if so, it is determined that the second inspection result of the pin is used to indicate that the pin design complies with the design rule file; if not, it is determined that the second inspection result of the pin is used to indicate that the pin design does not comply with the design rule file. The fourth preset number of layers can be 3.

[0170] When the pins are connected to multiple copper layers, a large amount of heat loss will occur, resulting in the tin material not being fully melted during welding, resulting in poor welding results. Checking the hot pads of the pins can avoid poor welding results and improve production accuracy.

[0171] For example, for the pin B3 shown in the above example, it can be determined that the soldering process of the pin B3 is a through-hole reflow soldering process, and the number of copper connection layers of the pin B3 is equal to the fourth preset number of layers. Therefore, the terminal device determines that there is no corresponding thermal pad for the pin B3. Then it can be determined that the second inspection result corresponding to the pin B3 is used to indicate that the thermal pad corresponding to the pin B3 does not exist and does not comply with the file B.

[0172] S408: Determine that the inspection result corresponding to the inspection request includes a first inspection result and a second inspection result corresponding to each pin.

[0173] After the inspection result is determined, the terminal device displays the inspection result and stores the inspection result according to the preset storage path. The user can obtain the inspection result through the preset storage path.

[0174] For example, according to the above example, the inspection result may be specifically determined as shown in Table 2:

[0175] Table 2

[0176]

[0177] The terminal device can display the inspection results shown in Table 2.

[0178] The printed circuit board inspection method provided in the embodiment of the present application obtains an inspection request. According to the design rule file, the welding process of each pin is determined. The process design information corresponding to each pin is obtained. For any pin, if the welding process of the pin is a wave soldering process, the first inspection information is obtained in the design rule file. According to the first inspection information and the process design information corresponding to the pin, the pin is inspected and processed to obtain the first inspection result corresponding to the pin. If the welding process of the pin is a through-hole reflow process, the second inspection information is obtained in the design rule file. According to the second inspection information and the process design information corresponding to the pin, the pin is inspected and processed to obtain the second inspection result corresponding to the pin. It is determined that the inspection result corresponding to the inspection request includes the first inspection result and the second inspection result corresponding to each pin. In the above process, the terminal device can automatically inspect each pin according to the design rule file and the process design information corresponding to each pin to obtain the inspection result. It avoids the processability inspection still relying on the experience and manual operation of the designer, and improves the accuracy of the printed circuit board welding process inspection.

[0179] Based on any of the above embodiments, Figure 5 , the process of printed circuit board inspection is illustrated with an example.

[0180] Figure 5 A schematic diagram of the printed circuit board inspection process provided by the embodiment of the present application. Figure 5 , including a terminal device 501. A storage area and an inspection tool are provided in the terminal device 501. A design rule file is stored in the storage area, and the inspection tool is used to inspect at least one pin in the design rule file according to the design rule file. In the inspection tool of the terminal device 501, the user determines that the PCB to be inspected is PCB2, and determines that the design rule file corresponding to PCB2 is file C. In response to the user's input selection operation, the inspection tool of the terminal device 501 obtains file C in the storage area. And obtains at least one pin of PCB2 including pin C1 and pin C2. The inspection tool of the terminal device 501 determines that the inspection request includes file C, and pin C1 and pin C2.

[0181] The inspection tool of the terminal device 501 determines that the soldering process of the pin C1 is the wave soldering process and the soldering process of the pin C2 is the through-hole reflow process according to the file C. The inspection tool of the terminal device 501 obtains the process design information corresponding to each pin in the design rule file, which can be specifically shown in Table 3:

[0182] Table 3

[0183]

[0184] Among them, the first spacing between pin B3 and adjacent device B3 is 4mm. The inspection tool of terminal device 501 obtains the first layer number range of 1 to 3 layers in the design rule file, the first through hole size range is 0.2mm larger than the pin diameter, the pad size range is 0.5-0.8mm larger than the pin diameter, the first preset spacing is 3mm, the first length range is 1.0-1.5mm larger than the thickness of the PCB board, and the second preset spacing is 4mm. The inspection tool of terminal device 501 obtains the diameter of pin C1 as 0.4mm in the design rule file. According to the process design information and the first inspection information of pin C1 shown in Table 3, the inspection tool of terminal device 501 determines that the copper connection layer number 1 of pin C1 matches the first layer number range, the through hole size 0.5mm corresponding to pin C1 does not match the first through hole size range, the pad size 1mm corresponding to pin C1 matches the pad size range, and the first spacing 4mm between pin C1 and adjacent devices is greater than the first preset spacing. The thickness of the PCB board where pin C1 is located is 1mm, so it can be determined that the pin length of pin C1, 2.4mm, matches the first length range. The second spacing of 4mm between pin B1 and the first device is equal to the second preset spacing. The inspection tool of terminal device 501 determines that the soldering process of pin C1 is a wave soldering process, and the third preset number of layers is 2. Therefore, there is no need to check whether there is a hot pad on pin C1. In summary, it can be determined that the first inspection result corresponding to pin C1 includes that the through-hole size design corresponding to pin C1 does not comply with file C.

[0185] The inspection tool of the terminal device 501 obtains the second inspection information in the design rule file, including the second number of layers ranging from 2 to 4 layers, the second through hole size range being 0.25-0.35 mm larger than the pin diameter, the pad size range being 0.5-0.8 mm larger than the pin diameter of the pad corresponding to the pin, and the third preset spacing being 1.5 mm. The inspection tool of the terminal device 501 obtains the diameter of the pin C2 in the design rule file as 0.4 mm. According to the process design information and the first inspection information of the pin C2 shown in Table 3, the inspection tool of the terminal device 501 determines that the number of copper connection layers of the pin C2, 3, matches the second number of layers, the through hole size 0.7 mm corresponding to the pin C2 matches the first through hole size range, the pad size 1 mm corresponding to the pin C2 matches the pad size range, and the third spacing 2 mm between the pin C2 and the adjacent device is greater than the third preset spacing. The inspection tool of the terminal device 501 determines that the welding process of the pin C2 is the through-hole reflow process, and the fourth preset number of layers is 3. Therefore, the inspection tool of the terminal device 501 determines that there is a corresponding thermal pad for the pin C2. In summary, the inspection tool of the terminal device 501 determines that the second inspection result corresponding to the pin C2 is used to indicate that the design of the pin C2 complies with the file C. The inspection result determined by the inspection tool of the terminal device 501 can be specifically shown in Table 4:

[0186] Table 4

[0187]

[0188] The inspection tool of the terminal device 501 stores the inspection results shown in Table 4 according to the preset storage path, and displays the inspection results shown in Table 4.

[0189] The printed circuit board inspection process provided in the embodiment of the present application obtains an inspection request. According to the design rule file, the welding process of each pin is determined. The process design information corresponding to each pin is obtained. For any pin, if the welding process of the pin is a wave soldering process, the first inspection information is obtained in the design rule file. According to the first inspection information and the process design information corresponding to the pin, the pin is inspected and processed to obtain the first inspection result corresponding to the pin. If the welding process of the pin is a through-hole reflow process, the second inspection information is obtained in the design rule file. According to the second inspection information and the process design information corresponding to the pin, the pin is inspected and processed to obtain the second inspection result corresponding to the pin. It is determined that the inspection result corresponding to the inspection request includes the first inspection result and the second inspection result corresponding to each pin. In the above process, the terminal device can automatically inspect each pin according to the design rule file and the process design information corresponding to each pin to obtain the inspection result. It avoids the processability inspection still relying on the experience and manual operation of the designer, and improves the accuracy of the printed circuit board welding process inspection.

[0190] Figure 6 This is a schematic diagram of the structure of a printed circuit board inspection device provided in an embodiment of the present application. Figure 6 , the printed circuit board inspection device 10 may include:

[0191] A first acquisition module 11 is used to acquire an inspection request, wherein the inspection request includes a design rule file corresponding to a printed circuit board PCB to be inspected, and at least one pin corresponding to the PCB;

[0192] A first determination module 12, used to determine the welding process of each pin according to the design rule file;

[0193] A second acquisition module 13 is used to acquire process design information corresponding to each pin in the design rule file;

[0194] The processing module 14 is used to perform inspection processing on the at least one pin according to the design rule file and the process design information corresponding to each pin, and obtain an inspection result corresponding to the inspection request.

[0195] In a possible implementation manner, the processing module 14 is specifically used to:

[0196] For any pin, if the soldering process of the pin is a wave soldering process, first inspection information is obtained in the design rule file, and the pin is inspected and processed according to the first inspection information and the process design information corresponding to the pin to obtain a first inspection result corresponding to the pin;

[0197] If the soldering process of the pin is a through-hole reflow soldering process, obtaining second inspection information in the design rule file, and inspecting the pin according to the second inspection information and the process design information corresponding to the pin to obtain a second inspection result corresponding to the pin;

[0198] Determine that the inspection result corresponding to the inspection request includes a first inspection result and a second inspection result corresponding to each pin.

[0199] In a possible implementation manner, the second acquisition module 13 is specifically configured to:

[0200] If the soldering process of the pin is a wave soldering process, then in the design rule file, the process design information is obtained including the number of copper connection layers of the pin, the through hole size corresponding to the pin, the pad size corresponding to the pin, the pin length of the pin, the first spacing between the pin and each adjacent device, and the second spacing between the pin and each first device;

[0201] If the soldering process of the pin is a through-hole reflow process, then in the design rule file, the process design information obtained includes the number of copper connection layers of the pin, the through-hole size corresponding to the pin, the pad size corresponding to the pin, and the third spacing between the pin and each adjacent device.

[0202] In a possible implementation manner, the processing module 14 is specifically used to:

[0203] In the first inspection information, determining the inspection information corresponding to each item of information in the process design information;

[0204] If each item of information in the process design information matches the corresponding inspection information in the first inspection information, determining the first inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0205] If there is information in the process design information that does not match the corresponding inspection information in the first inspection information, determining a first inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0206] In a possible implementation manner, the processing module 14 is specifically used to:

[0207] The number of copper connection layers of the pin matches the first layer number range, the through-hole size corresponding to the pin matches the first through-hole size range, the pad size corresponding to the pin matches the pad size range, the first spacing between the pin and each adjacent component is greater than or equal to the first preset spacing, the pin length of the pin matches the first length range, the second spacing between the pin and each first component is greater than or equal to the second preset spacing, and the device height of the first device is greater than or equal to the preset height.

[0208] In a possible implementation manner, the processing module 14 is specifically used to:

[0209] The number of copper connection layers of the pin does not match the first layer number range, and / or the through-hole size corresponding to the pin does not match the first through-hole size range, and / or the pad size corresponding to the pin does not match the pad size range, and / or the first spacing between the pin and each adjacent component is less than the first preset spacing, and / or the pin length of the pin does not match the first length range, and / or the second spacing between the pin and each first component is less than the second preset spacing.

[0210] In a possible implementation manner, the processing module 14 is specifically used to:

[0211] In the second inspection information, determining the inspection information corresponding to each item of information in the process design information;

[0212] If each item of information in the process design information matches the corresponding inspection information in the second inspection information, determining the second inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0213] If there is information in the process design information that does not match the corresponding inspection information in the second inspection information, determining the second inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0214] The printed circuit board inspection device provided in the embodiment of the present application can implement the technical solution shown in the above method embodiment, and its implementation principle and beneficial effects are similar, which will not be repeated here.

[0215] Figure 7 A schematic diagram of the structure of another printed circuit board inspection device provided in an embodiment of the present application. Figure 6 Based on the examples shown, see Figure 7 The data acquisition device 10 also includes a second determination module 15 and a third determination module 16.

[0216] Wherein, the second determining module 15 is used for:

[0217] If the soldering process of the pin is a wave soldering process, and the copper connection layer of the pin is greater than or equal to a third preset number of layers, determining whether there is a corresponding thermal pad for the pin;

[0218] If yes, determining that the first inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0219] If not, it is determined that the first inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0220] The third determination module 16 is used for:

[0221] If the soldering process of the pin is a through-hole reflow soldering process, and the copper connection layer of the pin is greater than or equal to a fourth preset number of layers, determining whether the pin has a corresponding thermal pad;

[0222] If yes, determining that the second inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file;

[0223] If not, it is determined that the second inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

[0224] The printed circuit board inspection device provided in the embodiment of the present application can implement the technical solution shown in the above method embodiment, and its implementation principle and beneficial effects are similar, which will not be repeated here.

[0225] Figure 8 This is a schematic diagram of the structure of the terminal device provided in the embodiment of the present application. Figure 8 The terminal device 20 may include: a memory 21 and a processor 22. Exemplarily, the memory 21 and the processor 22 are interconnected via a bus 23.

[0226] The memory 21 is used to store program instructions;

[0227] The processor 22 is used to execute the program instructions stored in the memory, so as to enable the terminal device 20 to execute the method shown in the above method embodiment.

[0228] The terminal device provided in the embodiment of the present application can execute the technical solution shown in the above method embodiment, and its implementation principle and beneficial effects are similar, which will not be repeated here.

[0229] An embodiment of the present application provides a computer-readable storage medium, in which computer-executable instructions are stored. When the computer-executable instructions are executed by a processor, they are used to implement the above method.

[0230] The embodiment of the present application may also provide a computer program product, including a computer program, which can implement the above method when executed by a processor.

[0231] All or part of the steps of the above-mentioned method embodiments can be completed by hardware related to program instructions. The above-mentioned program can be stored in a readable memory. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the above-mentioned memory (storage medium) includes: read-only memory (ROM), random access memory (RAM), flash memory, hard disk, solid state drive, magnetic tape, floppy disk, optical disc and any combination thereof.

[0232] The embodiments of the present application are described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processing unit of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processing unit of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0233] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0234] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0235] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

[0236] In the present application, the term "include" and its variations may refer to non-restrictive inclusion; the term "or" and its variations may refer to "and / or". The terms "first", "second", etc. in the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. In the present application, "plurality" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the previously associated objects are in an "or" relationship.

Claims

1. A printed circuit board inspection method, characterized in that: include: Obtaining an inspection request, the inspection request including a design rule file corresponding to a printed circuit board PCB to be inspected, and at least one pin corresponding to the PCB; Determine the welding process of each pin according to the design rule file; In the design rule file, obtaining process design information corresponding to each pin; According to the design rule file and the process design information corresponding to each pin, the at least one pin is inspected and processed to obtain an inspection result corresponding to the inspection request.

2. The method according to claim 1, characterized in that According to the design rule file and the process design information corresponding to each pin, the at least one pin is inspected and processed to obtain an inspection result corresponding to the inspection request, including: For any pin, if the soldering process of the pin is a wave soldering process, first inspection information is obtained in the design rule file, and the pin is inspected and processed according to the first inspection information and the process design information corresponding to the pin to obtain a first inspection result corresponding to the pin; If the soldering process of the pin is a through-hole reflow soldering process, obtaining second inspection information in the design rule file, and inspecting the pin according to the second inspection information and the process design information corresponding to the pin to obtain a second inspection result corresponding to the pin; Determine that the inspection result corresponding to the inspection request includes a first inspection result and a second inspection result corresponding to each pin.

3. The method according to claim 2, characterized in that For any pin; in the design rule file, obtain the process design information corresponding to the pin, including: If the soldering process of the pin is a wave soldering process, then in the design rule file, the process design information is obtained including the number of copper connection layers of the pin, the through hole size corresponding to the pin, the pad size corresponding to the pin, the pin length of the pin, the first spacing between the pin and each adjacent device, and the second spacing between the pin and each first device; If the soldering process of the pin is a through-hole reflow process, then in the design rule file, the process design information obtained includes the number of copper connection layers of the pin, the through-hole size corresponding to the pin, the pad size corresponding to the pin, and the third spacing between the pin and each adjacent device.

4. The method according to claim 2, characterized in that: According to the first inspection information and the process design information corresponding to the pin, the pin is inspected and processed to obtain a first inspection result corresponding to the pin, including: In the first inspection information, determining the inspection information corresponding to each item of information in the process design information; If each item of information in the process design information matches the corresponding inspection information in the first inspection information, determining the first inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file; If there is information in the process design information that does not match the corresponding inspection information in the first inspection information, determining a first inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

5. The method according to claim 4, characterized in that The first inspection information includes a first layer number range, a first through hole size range, a pad size range, a first preset spacing, a first length range, and a second preset spacing; Each item of information in the process design information is matched with corresponding inspection information in the first inspection information, including: The number of copper connection layers of the pin matches the first layer number range, the through-hole size corresponding to the pin matches the first through-hole size range, the pad size corresponding to the pin matches the pad size range, the first spacing between the pin and each adjacent component is greater than or equal to the first preset spacing, the pin length of the pin matches the first length range, the second spacing between the pin and each first component is greater than or equal to the second preset spacing, and the device height of the first device is greater than or equal to the preset height.

6. The method according to claim 4, characterized in that The information in the process design information does not match the corresponding inspection information in the first inspection information, including: The number of copper connection layers of the pin does not match the first layer number range, and / or the through-hole size corresponding to the pin does not match the first through-hole size range, and / or the pad size corresponding to the pin does not match the pad size range, and / or the first spacing between the pin and each adjacent component is less than the first preset spacing, and / or the pin length of the pin does not match the first length range, and / or the second spacing between the pin and each first component is less than the second preset spacing.

7. The method according to claim 2, characterized in that The second inspection information includes a second layer number range, a second through hole size range, a pad size range, and a third preset spacing; According to the second inspection information and the process design information corresponding to the pin, the pin is inspected and processed to obtain a second inspection result corresponding to the pin, including: In the second inspection information, determining the inspection information corresponding to each item of information in the process design information; If each item of information in the process design information matches the corresponding inspection information in the second inspection information, determining the second inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file; If there is information in the process design information that does not match the corresponding inspection information in the second inspection information, determining the second inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

8. The method according to any one of claims 1 to 7, characterized in that: The method further comprises: If the soldering process of the pin is a wave soldering process, and the copper connection layer of the pin is greater than or equal to a third preset number of layers, determining whether there is a corresponding thermal pad for the pin; If yes, determining that the first inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file; If not, it is determined that the first inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

9. The method according to any one of claims 1 to 7, characterized in that: The method further comprises: If the soldering process of the pin is a through-hole reflow soldering process, and the copper connection layer of the pin is greater than or equal to a fourth preset number of layers, determining whether the pin has a corresponding thermal pad; If yes, determining that the second inspection result corresponding to the pin is used to indicate that the pin design complies with the design rule file; If not, it is determined that the second inspection result corresponding to the pin is used to indicate that the pin design does not comply with the design rule file.

10. A printed circuit board inspection device, characterized in that: The device comprises: A first acquisition module is used to acquire an inspection request, wherein the inspection request includes a design rule file corresponding to a printed circuit board PCB to be inspected, and at least one pin corresponding to the PCB; A first determination module, used to determine the welding process of each pin according to the design rule file; A second acquisition module is used to acquire process design information corresponding to each pin in the design rule file; The processing module is used to perform inspection processing on the at least one pin according to the design rule file and the process design information corresponding to each pin, and obtain the inspection result corresponding to the inspection request.

11. A terminal device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 9.

12. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: in, The computer instructions are used to make a computer execute the method according to any one of claims 1 to 9.

13. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the method according to any one of claims 1 to 9 is implemented.

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