Cooling structure and relay

Abstract

The invention provides a cooling structure and a relay, the cooling structure comprises a cooling channel arranged in the relay, a cooling medium circularly flows in the cooling channel, and the cooling channel comprises a heat absorption part, a heat transfer part and a heat dissipation part which are sequentially communicated from top to bottom; the heat absorption part is arranged close to the heating part, the heat dissipation part is arranged at the bottom of the relay, the cooling medium can absorb heat in the heat absorption part to be vaporized and release heat in the heat dissipation part to be liquefied, and the liquefied cooling medium is driven to flow back to the heat absorption part through the heat transfer part. According to the cooling structure, the heat generated by the heating component is transmitted to the cooling medium in the heat absorption part, the cooling medium is vaporized after absorbing the heat, so that the temperature of the heating component is reduced, and the heat dissipation part is arranged at the bottom of the relay, so that the heat of the cooling medium can be released; and the heat transfer part is beneficial to circularly cooling the heating component by the cooling medium, so that the cooling efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of relays, and in particular to a cooling structure; meanwhile, the present invention also relates to a relay provided with the cooling structure. Background Art

[0002] A relay is an electrical control device that has an interactive relationship between the control system (also known as the input circuit) and the controlled system (also known as the output circuit). Relays can convert one signal form into another signal form, and the most common one is to convert weak current signals into strong current signals, thereby achieving control of circuits with different voltage and current levels.

[0003] In order to ensure the performance of the relay, a cooling structure is usually set inside the relay to cool the heat-generating components in the relay. The existing relay cooling method requires the relay to be inverted, and the relay is equipped with copper bars, bolts, and two electrical connection columns for external electrical connection, resulting in the relay's contact position being unable to effectively contact the cooling surface. And the cooling effect of the heat-generating part of the electrical connection column is poor. In order to coordinate the contact between the contact and the cooling plate, a thickened thermal pad or thermal conductive glue needs to be used, resulting in low cooling efficiency and also taking up space inside the relay. Summary of the invention

[0004] In view of this, the present invention aims to provide a cooling structure to improve the cooling efficiency of the relay.

[0005] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0006] A cooling structure for cooling a relay, the cooling structure comprising a cooling channel arranged in the relay, a cooling medium circulating in the cooling channel, and the cooling channel comprising a heat absorbing part, a heat transfer part and a heat dissipating part arranged in sequence from top to bottom;

[0007] The heat absorbing part is arranged close to the heat generating component, and the heat dissipating part is arranged at the bottom of the relay. The cooling medium can absorb heat and vaporize in the heat absorbing part, and release heat and liquefy in the heat dissipating part, and the liquefied cooling medium is driven to flow back to the heat absorbing part through the heat transfer part.

[0008] Furthermore, a liquid wick is provided on the inner wall of the cooling channel, and the liquid wick is used to drive the liquefied cooling medium to flow back to the heat absorption part through the heat transfer part.

[0009] Further, the heat generating component includes an electrical connection column of the relay;

[0010] The heat absorption portion extends along the circumference of the electrical connection column, and the heat transfer portion extends along the height direction of the relay.

[0011] Furthermore, there are two cooling channels arranged opposite to each other, and the heat absorption portion of each cooling channel is arranged in a one-to-one correspondence with the electrical connection column.

[0012] Furthermore, the heat absorbing part and the heat transferring part are formed in a housing of the relay.

[0013] Furthermore, the shell includes a shell body and a bottom plate arranged at the bottom end of the shell body;

[0014] The heat absorbing part and the heat transferring part are formed in the shell body, and the heat dissipating part is arranged at the bottom plate.

[0015] Furthermore, the heat dissipation unit includes a heat dissipation plate arranged at the bottom of the relay.

[0016] Furthermore, the bottom of the housing of the relay is provided with a hollow hole for exposing the heat sink; and / or,

[0017] An insulating layer is provided on the outer surface of the heat dissipation plate.

[0018] Furthermore, a heat dissipation layer connected to the heat dissipation plate is provided at the bottom of the housing of the relay.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] The cooling structure of the present invention transfers the heat generated by the heat-generating component to the cooling medium in the heat-absorbing part through the heat-absorbing part, the heat-transfer part and the heat-dissipating part in the cooling channel. The cooling medium quickly vaporizes after absorbing the heat, thereby reducing the temperature of the heat-generating component. The heat-dissipating part is arranged at the bottom of the relay, which is conducive to releasing the heat of the cooling medium and converting the cooling medium from a vaporized state to a liquefied state. The heat-transfer part is conducive to the cooling medium circulating to cool the heat-generating component, thereby improving the cooling efficiency.

[0021] In addition, a liquid wick is arranged on the inner wall of the cooling channel. The liquid wick usually has a porous structure and can absorb the liquefied cooling medium by capillary action. When the cooling medium is liquefied in the heat dissipation part, due to the capillary force of the liquid wick, the cooling medium will be adsorbed in the pores of the liquid wick and flow from the heat dissipation part to the heat absorption part along the pores of the liquid wick driven by the capillary force. The liquid wick serves as the power for the cooling medium to flow back and has the advantage of small space occupation. The heat absorption part extends along the circumference of the electrical connection column, which can increase the contact area between the heat absorption part and the electrical connection column, thereby improving the heat absorption efficiency. The heat transfer part is extended along the height direction of the relay, which is convenient for layout and implementation.

[0022] In addition, each cooling channel corresponds to the electrical connection column, which helps to ensure that each electrical connection column can be adequately cooled and avoid overheating of a certain electrical connection column due to insufficient cooling. Forming the heat absorption part and the heat transfer part directly in the shell can make the cooling structure more compact and reduce the space occupied by the cooling structure. It also helps to reduce thermal resistance and improve heat transfer efficiency, so that the cooling medium can absorb and transfer heat faster. By arranging the heat absorption part and the heat transfer part on the shell body and arranging the heat dissipation part on the bottom plate, it is convenient to arrange the cooling channel and form an optimized heat transfer path.

[0023] Furthermore, a heat sink is provided at the bottom of the relay to provide a dedicated heat dissipation area for the heat dissipation part. The large area and good thermal conductivity of the heat sink can accelerate the speed at which the cooling medium in the heat dissipation part releases heat. A hollow hole is provided at the bottom of the relay housing for exposing the heat sink, which can increase the contact area between the heat sink and the surrounding air, thereby facilitating the improvement of the heat dissipation efficiency. By providing a heat dissipation layer connected to the heat sink, the cooling efficiency of the heat dissipation part can be further improved.

[0024] In addition, another object of the present invention is to provide a relay, on which the cooling structure as described above is provided.

[0025] The relay of the present invention is beneficial to improving the performance of the relay by providing the above cooling structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 A schematic diagram of the structure of a relay according to an embodiment of the present invention at one viewing angle;

[0028] Figure 2 It is a structural schematic diagram of the relay according to the embodiment of the present invention from another viewing angle;

[0029] Figure 3 A schematic diagram of the internal structure of a relay according to an embodiment of the present invention;

[0030] Figure 4 It is a schematic structural diagram of the cooling structure and the electrical connection column according to an embodiment of the present invention;

[0031] Figure 5 It is a structural schematic diagram of the cooling structure according to an embodiment of the present invention;

[0032] Figure 6 It is a schematic structural diagram of the cooling structure and the shell body according to an embodiment of the present invention.

[0033] Description of reference numerals:

[0034] 1. Shell; 2. Electrical connection column; 3. Cooling channel; 4. Heat sink; 5. Moving contact; 6. Static contact;

[0035] 101, shell body; 102, bottom plate;

[0036] 301, heat absorbing part; 302, heat transfer part; 3021, upper connecting section; 303, heat dissipation part;

[0037] 401. Extension. DETAILED DESCRIPTION

[0038] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0039] In the description of the present invention, it should be noted that if there are terms indicating orientation or positional relationship such as "upper", "lower", "inner", "back", etc., they are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, if there are terms such as "first", "second", etc., they are also used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0040] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0041] The present embodiment relates to a cooling structure for cooling a relay. In terms of overall structure, the cooling structure includes a cooling channel 3 provided in the relay, a cooling medium circulates in the cooling channel 3, and the cooling channel 3 includes a heat absorbing part 301, a heat transfer part 302, and a heat dissipating part 303 which are connected and arranged in sequence from top to bottom.

[0042] Among them, the heat absorption part 301 is arranged close to the heat-generating component, and the heat dissipation part 303 is arranged at the bottom of the relay. The cooling medium can absorb heat and vaporize in the heat absorption part 301, and release heat and liquefy in the heat dissipation part 303, and the liquefied cooling medium is driven to flow back to the heat absorption part 301 through the heat transfer part 302.

[0043] The cooling structure described in this embodiment transfers the heat generated by the heat-generating component to the cooling medium in the heat-absorbing part 301 through the heat-absorbing part 301, the heat-transfer part 302 and the heat-dissipating part 303 in the cooling channel 3. The cooling medium quickly vaporizes after absorbing the heat, thereby reducing the temperature of the heat-generating component. The heat-dissipating part 303 is arranged at the bottom of the relay, which is conducive to releasing the heat of the cooling medium and converting the cooling medium from a vaporized state to a liquefied state. The heat-transferring part 302 is conducive to the cooling medium cyclically cooling the heat-generating component, thereby improving the cooling efficiency.

[0044] Based on the above overall introduction, the structure of the relay described in this embodiment is as follows Figures 1 to 3 As shown in the figure, the cooling structure is as Figure 4 and Figure 5 As shown in . The top ends of the two electrical connection columns 2 are exposed through the through holes at the top end of the shell body 101 to facilitate electrical connection with external components. The bottom ends of the electrical connection columns 2 constitute the static contacts 6. The moving contact 5 is located below the two static contacts 6 and has a connection state in which it is electrically connected to the two static contacts 6, and a disconnection state in which it is disconnected from the two static contacts 6.

[0045] In order to facilitate the liquefied cooling medium in the heat dissipation part 303 to flow back to the heat absorption part 301, a liquid absorption core is provided on the inner wall of the cooling channel 3, and the liquid absorption core is used to drive the liquefied cooling medium to flow back to the heat absorption part 301 through the heat transfer part 302. The liquid absorption core here can be a heat absorption core used in a heat pipe in the prior art.

[0046] In this embodiment, a liquid absorbent core is arranged on the inner wall of the cooling channel 3. The liquid absorbent core usually has a porous structure and can use capillary action to attract the liquefied cooling medium. When the cooling medium is liquefied in the heat dissipation part 303, due to the capillary force of the liquid absorbent core, the cooling medium will be adsorbed in the pores of the liquid absorbent core, and driven by the capillary force, it will flow from the heat dissipation part 303 to the heat absorption part 301 along the pores of the liquid absorbent core. The liquid absorbent core serves as the power for the reflux of the cooling medium and also has the advantage of small space occupation.

[0047] At the same time, the surface characteristics of the wick also contribute to the reflux of the cooling medium. The cooling medium forms a thin liquid film on the surface of the wick through surface tension, while the adhesion force enables the liquid film to firmly adhere to the surface of the wick. Under the combined effects of capillary force, surface tension and adhesion, the cooling medium can overcome gravity and flow resistance and smoothly reflux from the heat dissipation part 303 to the heat absorption part 301.

[0048] The wick of this embodiment can provide a driving force for the liquefied cooling medium to reflux, ensuring that the circulation of the cooling medium in the cooling channel 3 is not disturbed by external factors. Even when the gravity effect is not obvious or the cooling system is in a tilted state, the wick can effectively drive the cooling medium to reflux.

[0049] In addition, the porous structure of the wick increases the contact area between the cooling medium and the inner wall of the cooling channel 3, thereby improving the heat transfer efficiency. When the cooling medium flows in the pores of the wick, it can more fully exchange heat with the inner wall of the cooling channel 3, accelerating the transfer speed of heat. During specific implementation, the material of the wick should have good capillary properties, heat transfer properties and corrosion resistance. Common wick materials include metal wire mesh, sintered metal powder, fiber materials, etc.

[0050] The cooling medium in this embodiment can be water, ethanol, Freon, etc. To ensure the use effect of the cooling medium, it is necessary to vacuumize the cooling channel 3 after filling the cooling medium inside, so as to reduce the boiling temperature of the liquid, thereby facilitating the vaporization efficiency of the cooling medium in the heat absorption part 301.

[0051] The heat-generating component in this embodiment includes the electrical connection column 2 of the relay, the heat-absorbing portion 301 extends circumferentially along the electrical connection column 2, and the heat-transfer portion 302 extends along the height direction of the relay. Here, the heat-absorbing portion 301 extends circumferentially along the electrical connection column 2, which can increase the contact area between the heat-absorbing portion 301 and the electrical connection column 2, thereby improving the heat absorption efficiency, and the heat-transfer portion 302 extends along the height direction of the relay. The heat-transfer portion 302 can be arranged in the middle of the left and right side walls of the shell body 101 to further facilitate the arrangement and implementation.

[0052] like Figure 3 and Figure 4 As shown in , considering that the heat of the electrical connection column 2 is concentrated at the output end of the electrical connection column 2, the cooling channel 3 in this embodiment is preferably arranged close to the output end of the electrical connection column 2, so as to facilitate targeted cooling of the electrical connection column 2, thereby ensuring the performance of the electrical connection column 2 and the relay. Since the heat absorption part 301 is arranged along the circumference of the electrical connection column 2, the heat absorption part 301 is annular, and its structure is simple and easy to form.

[0053] To further improve the performance of the cooling structure, such as Figure 4 As shown in the figure, there are two cooling channels 3 arranged opposite to each other, and the heat absorption part 301 of each cooling channel 3 is arranged one by one with the electrical connection column 2. Such arrangement enables each cooling channel 3 to correspond to the electrical connection column 2, which is conducive to ensuring that each electrical connection column 2 can be fully cooled and avoids the situation where a certain electrical connection column 2 is overheated due to insufficient cooling. The two cooling channels 3 arranged opposite to each other increase the contact area between the cooling medium and the electrical connection column 2, so that heat can be absorbed and transferred faster. At the same time, each electrical connection column 2 has a corresponding heat absorption part 301, which can cool the electrical connection column 2 more accurately and improve the cooling efficiency.

[0054] Furthermore, by providing an independent cooling channel 3 for each electrical connection column 2, the risk of overheating of the entire relay due to a failure of one cooling channel 3 can be reduced. Even if a problem occurs in one cooling channel 3, another cooling channel 3 can still continue to work, ensuring the normal operation of the relay and enhancing the reliability of the system.

[0055] As a preferred embodiment, the heat absorbing part 301 and the heat transfer part 302 are formed in the housing 1 of the relay. Here, the heat absorbing part 301 and the heat transfer part 302 are directly formed in the housing 1, which can make the cooling structure more compact, reduce the space occupied by the cooling structure, and also help to reduce thermal resistance and improve heat transfer efficiency, so that the cooling medium can absorb and transfer heat faster. Integrating the heat dissipation part 303 and the heat transfer part 302 together helps to reduce damage to the cooling structure caused by vibration, impact or temperature changes, and has higher stability.

[0056] In terms of specific structure, Figure 2 As shown in , the shell 1 includes a shell body 101 and a bottom plate 102 arranged at the bottom end of the shell body 101, a heat absorbing part 301 and a heat transfer part 302 are formed in the shell body 101, and a heat dissipating part 303 is arranged at the bottom plate 102. By arranging the heat absorbing part 301 and the heat transfer part 302 on the shell body 101 and arranging the heat dissipating part 303 on the bottom plate 102, it is convenient to arrange and implement the cooling channel 3 and to form an optimized heat transfer path. Specifically, the heat absorbing part 301 is arranged on the shell body 101 along the circumference of the through hole.

[0057] In this embodiment, the heat absorption part 301 is arranged on the top of the shell body 101, and the heat transfer part 302 is arranged on one side of the shell body 101 along the height direction of the shell body 101. To ensure the connection effect between the heat transfer part 302 and the heat absorption part 301, the top of the heat transfer part 302 has an upper connecting section 3021 extending in the horizontal direction, and is connected with the heat absorption part 301 through the upper connecting section 3021.

[0058] like Figure 4 and Figure 6 As shown in the figure, the heat dissipation part 303 includes a heat dissipation plate 4 arranged at the bottom of the relay. Here, the heat dissipation plate 4 is arranged at the bottom of the relay to provide a special heat dissipation area for the heat dissipation part 303. The large area and good thermal conductivity of the heat dissipation plate 4 can accelerate the speed at which the cooling medium in the heat dissipation part 303 releases heat. In the specific arrangement, the heat dissipation plate 4 is usually made of a material with good thermal conductivity, such as metal (such as aluminum, copper, etc.), which can effectively dissipate the heat of the heat dissipation part 303 to the surrounding environment.

[0059] In order to facilitate the connection between the heat transfer part 302 and the heat dissipation part 303, an extension part 401 extending toward the heat transfer part 302 is formed on the heat dissipation plate 4, and a lower connecting section for connecting the heat transfer part 302 and the heat dissipation part 303 is provided in the extension part 401. In addition, a hollow hole for exposing the heat dissipation plate 4 is provided at the bottom of the relay housing 1. The hollow hole for exposing the heat dissipation plate 4 at the bottom of the relay housing 1 can increase the contact area between the heat dissipation plate 4 and the surrounding air, thereby facilitating the improvement of heat dissipation efficiency.

[0060] In this embodiment, the hollow holes allow the heat on the heat sink 4 to be dissipated to the external environment more quickly. The heat will not be completely enclosed inside the housing 1, but can be quickly diffused out through the hollow holes. In some embodiments, the shape of the hollow holes follows the shape of the heat sink 4 to ensure the overall exposed area of ​​the heat sink and the performance of the bottom plate 102.

[0061] In this embodiment, in order to further improve the liquefaction efficiency of the cooling medium in the heat dissipation part 303, a heat dissipation layer connected to the heat dissipation plate 4 is provided at the bottom of the housing 1 of the relay. By providing a heat dissipation layer connected to the heat dissipation plate 4, the cooling efficiency of the heat dissipation part 303 can be further improved. The heat dissipation layer can be provided at the bottom of the entire bottom plate 102, or only at the bottom of the heat dissipation plate 4. In addition, the heat dissipation layer needs to fit closely with the heat dissipation plate 4 to ensure a good heat transfer effect. Therefore, the heat dissipation layer usually has a certain degree of flexibility and viscosity, can adapt to different surface shapes and firmly adhere to the housing 1, and has high thermal conductivity. For example, the heat dissipation layer uses thermal conductive silicone.

[0062] In addition, an insulating layer is provided on the outer surface of the heat sink 4. Providing an insulating layer on the outer surface of the heat sink 4 can prevent the heat sink 4 from accidentally contacting other conductive components, thereby avoiding safety issues such as electrical short circuits. In addition, the insulating layer can protect the heat sink 4 from moisture, dust and other pollutants in the external environment. This helps to extend the service life of the heat sink 4 and maintain its good heat dissipation performance.

[0063] When the cooling structure of this embodiment is in use, when the moving contact 5 is closed, the moving contact 5 connects the two internal static contacts 6, and the electrical connection column 2 generates heat during the power-on process. At this time, the heat absorption part 301 tightly combined with the electrical connection column 2 absorbs the heat and vaporizes it, and at the same time transports it to the heat dissipation part 303 through the heat transfer part 302, and releases heat through the heat dissipation part 303 to cool the cooling medium and liquefy it. The liquefied cooling medium is driven by the liquid wick to flow back to the heat absorption part 301 through the heat transfer part 302 to cool the electrical connection column 2 again.

[0064] In the cooling structure of this embodiment, the cooling channel is divided into a heat absorption part, a heat transfer part and a heat dissipation part, and they are connected in sequence from top to bottom. This layout makes full use of the heat transfer principle and gravity. The heat absorption part is close to the heat-generating component and can absorb heat efficiently. The heat transfer part is responsible for transferring the gaseous cooling medium to the heat dissipation part. The heat dissipation part is arranged at the bottom, which conforms to the natural law that hot air rises and cold air falls, and is conducive to heat exchange. Moreover, the channel is directly arranged inside the relay and is in close contact with the heat-generating component, which can achieve precise cooling, avoid excessive heat loss during the transfer process, and improve the cooling efficiency.

[0065] Among them, the cooling medium can absorb and release a large amount of heat through the phase change process of vaporization heat absorption and liquefaction heat dissipation. Compared with traditional air cooling or simple liquid cooling, it has higher cooling efficiency and can reduce the temperature of the relay more quickly and effectively. Using the phase change latent heat of the cooling medium for cooling does not require a large amount of additional energy to drive the cooling equipment, reducing energy consumption and operating costs. The cooling channel is built into the relay, and there is no need to set up a complex and large cooling device on the outside, saving space, which is suitable for application scenarios with high space requirements, such as miniaturized design inside electronic equipment. Furthermore, the phase change cooling process is relatively stable, which reduces the possibility of relay failure due to excessive temperature, extends the service life of the relay, and improves the reliability of the entire system.

[0066] In the cooling structure described in this embodiment, the heat absorption part 301 and the heat transfer part 302 in the cooling channel 3 are integrated with the housing 1, which reduces the space occupied in the relay and provides good electrical insulation performance for the cooling channel 3, avoiding the problems of insulation protection, condensation and cooling medium leakage caused by the direct contact cooling solution between the electrical connection column 2 and the cold plate in the prior art, thereby achieving the dual effects of cooling and electrical safety. In addition, it is also beneficial to solve the technical problem of the prior art that the relay needs to be inverted for cooling, and effectively increase the heat exchange area, thereby improving the cooling efficiency.

[0067] In addition, the present embodiment also relates to a relay, on which the cooling structure as described above is provided.

[0068] The relay described in this embodiment is helpful to improve the performance of the relay by providing the above cooling structure.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A cooling structure for cooling a relay, characterized in that: The cooling structure comprises a cooling channel arranged in the relay, a cooling medium circulates in the cooling channel, and the cooling channel comprises a heat absorbing part, a heat transfer part and a heat dissipating part which are sequentially connected and arranged from top to bottom; The heat absorbing part is arranged close to the heat generating component, and the heat dissipating part is arranged at the bottom of the relay. The cooling medium can absorb heat and vaporize in the heat absorbing part, and release heat and liquefy in the heat dissipating part, and the liquefied cooling medium is driven to flow back to the heat absorbing part through the heat transfer part.

2. The cooling structure according to claim 1, characterized in that: The inner wall of the cooling channel is provided with a liquid wick, and the liquid wick is used to drive the liquefied cooling medium to flow back to the heat absorption part through the heat transfer part.

3. The cooling structure according to claim 1, characterized in that: The heat generating component includes an electrical connection post of the relay; The heat absorption portion extends along the circumference of the electrical connection column, and the heat transfer portion extends along the height direction of the relay.

4. The cooling structure according to claim 3, characterized in that: The number of the cooling channels is two and they are arranged opposite to each other, and the heat absorbing portion of each cooling channel is arranged in one-to-one correspondence with the electrical connection column.

5. The cooling structure according to claim 1, characterized in that: The heat absorbing part and the heat transferring part are formed in a housing of the relay.

6. The cooling structure according to claim 5, characterized in that: The shell comprises a shell body and a bottom plate arranged at the bottom end of the shell body; The heat absorbing part and the heat transferring part are formed in the shell body, and the heat dissipating part is arranged at the bottom plate.

7. The cooling structure according to any one of claims 1 to 6, characterized in that: The heat dissipation unit includes a heat dissipation plate arranged at the bottom of the relay.

8. The cooling structure according to claim 7, characterized in that: The bottom of the housing of the relay is provided with a hollow hole for exposing the heat sink; and / or, An insulating layer is provided on the outer surface of the heat dissipation plate.

9. The cooling structure according to claim 7, characterized in that: A heat dissipation layer connected to the heat dissipation plate is provided at the bottom of the housing of the relay.

10. A relay, characterized in that: The relay is provided with a cooling structure according to any one of claims 1 to 9.

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