Sensor packaging structure and manufacturing method thereof

Abstract

The invention discloses a sensor packaging structure and a manufacturing method thereof. The manufacturing method of the sensor packaging structure comprises the following steps: installing a sensing chip on a circuit board, and connecting the sensing chip and the circuit board through a plurality of metal wires in a routing manner; wherein each metal wire is provided with an outer end part connected to the circuit board; an annular adhesive layer is formed on the circuit board along the outer end parts of the plurality of metal wires, so that the outer end parts of the plurality of metal wires are embedded in the adhesive layer; a cover body is bonded on the adhesive layer, and the adhesive layer is cured; wherein the bottom edge of the cover body sinks into and is adhered to the adhesive layer; and a packaging body is formed on the circuit board and covers the annular side surface of the cover body. Therefore, the sensor packaging structure can prevent the sensing chip from being polluted by the colloid at the same time on the premise of meeting the miniaturization requirement.

Description

Technical Field

[0001] The present invention relates to a packaging structure, and in particular to a sensor packaging structure and a manufacturing method thereof. Background Art

[0002] The existing sensor packaging structure faces the requirement of miniaturization, but this may affect the overall quality. For example, when the existing sensor packaging structure adopts a structure in which at least part of each metal wire is buried in the packaging body, a glue layer needs to be provided on the sensing chip, and the adhesive layer is easy to flow to the sensing area of ​​the sensing chip, thereby causing contamination. However, if the existing sensor packaging structure adopts a structure in which no part of each metal wire is not buried, the overall size is too large and cannot meet the requirements of miniaturization.

[0003] Therefore, the inventors believe that the above defects can be improved, and propose the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention

[0004] The embodiment of the present invention provides a sensor packaging structure and a manufacturing method thereof, which can effectively improve the defects that may occur in the existing sensor packaging structure.

[0005] The embodiment of the present invention discloses a method for manufacturing a sensor packaging structure, which includes: a pre-processing step: installing a sensing chip on a circuit board, and connecting the sensing chip and the circuit board through a plurality of metal wires; wherein each metal wire has an outer end connected to the circuit board and an inner end connected to the sensing chip; a glue spreading step: forming a ring-shaped adhesive layer on the circuit board along the outer ends of the plurality of metal wires; wherein the adhesive layer has: a protection section, in which the outer ends of the plurality of metal wires are buried; and a receiving section, surrounding the outer side of the protection section; a component placement step: bonding a cover body on the receiving section and curing the adhesive layer; wherein the cover body includes: a light-transmitting layer, having a light-transmitting area facing the sensing chip, and a layout area surrounding the outer side of the light-transmitting area; an opaque bracket, whose top edge is fixed to the layout area of ​​the light-transmitting layer, and whose bottom edge is sunken into and bonded to the receiving section of the adhesive layer; and a packaging step: forming a packaging body on the circuit board, which covers the ring side surface of the cover body.

[0006] Optionally, in the step of placing the components, the bottom edge of the light-proof bracket is bonded to the receiving section of the adhesive layer, and then the layout area of ​​the light-transmitting layer is bonded to the top edge of the light-proof bracket through an adhesive layer.

[0007] Optionally, before the step of placing the components, the layout area of ​​the light-transmitting layer is bonded to the top edge of the light-impermeable support through an adhesive layer.

[0008] Optionally, before the step of placing the components, a light-proof support is formed in the layout area of ​​the light-transmitting layer by injection molding to form a cover.

[0009] Optionally, the light-proof bracket includes: a shielding plate having a top edge; wherein a plurality of metal wires are located within a projection space formed by the shielding plate being projected toward the circuit board; and an annular frame connected to the shielding plate and having a bottom edge.

[0010] Optionally, the adhesive layer has an outer ring section surrounding the outer side of the receiving section; in the packaging step, the outer ring section is buried in the packaging body.

[0011] Optionally, the height of the adhesive layer is lower than the height of the sensing chip compared to the circuit board, and the adhesive layer does not touch the sensing chip.

[0012] The present invention also discloses a sensor packaging structure, which includes: a circuit board having a first board surface and a second board surface respectively located on opposite sides, and the circuit board includes a plurality of bonding pads located on the first board surface; a sensing chip installed on the first board surface of the circuit board, and the top surface of the sensing chip has a sensing area and a plurality of connection pads located outside the sensing area; a plurality of metal wires, each having an outer end and an inner end; wherein the outer ends of the plurality of metal wires are respectively connected to the plurality of bonding pads of the circuit board, and the inner ends of the plurality of metal wires are respectively connected to the plurality of connection pads of the sensing chip; an adhesive layer, which is annular and is arranged on the first board surface of the circuit board along the outer ends of the plurality of metal wires, and the adhesive layer is provided on the first board surface of the circuit board. The adhesive layer comprises: a protection section, in which the outer ends of a plurality of metal wires are buried; a receiving section, surrounding the outer side of the protection section; a cover body, bonded to the receiving section of the adhesive layer, so that the cover body, the circuit board, and the adhesive layer together surround a closed space; wherein the cover body comprises: a light-transmitting layer, having a light-transmitting area facing the sensing area, and a layout area surrounding the outer side of the light-transmitting area; an opaque bracket, whose top edge is fixed to the layout area of ​​the light-transmitting layer, and whose bottom edge is sunken into and bonded to the receiving section of the adhesive layer; and a packaging body, formed on the first board surface of the circuit board; wherein the cover body and the adhesive layer are buried in the packaging body, and the outer surface of the light-transmitting layer is at least partially exposed outside the packaging body.

[0013] Optionally, the light-proof bracket includes: a shielding plate having a top edge; wherein a plurality of metal wires are located within a projection space formed by the shielding plate being projected toward the circuit board; and an annular frame connected to the shielding plate and having a bottom edge.

[0014] Optionally, the light-proof bracket includes a structure reinforcement portion connected to the shielding plate and the annular frame, and the structure reinforcement portion is located on the inner side of the shielding plate and the annular frame.

[0015] Optionally, the cover body includes an adhesive layer, which is clamped and bonded between the layout area of ​​the light-transmitting layer and the opaque bracket.

[0016] Optionally, the light-proof bracket is formed in the layout area of ​​the light-transmitting layer by injection molding to form the cover body.

[0017] Optionally, the adhesive layer has an outer ring section surrounding the outside of the receiving section, and the outer ring section protrudes out of the light-proof bracket and is buried in the packaging body.

[0018] Optionally, the thickness of the receiving section is smaller than the thickness of the protecting section.

[0019] Optionally, the height of the adhesive layer is lower than the height of the sensing chip compared to the circuit board, and the adhesive layer does not touch the sensing chip.

[0020] In summary, the sensor packaging structure and the manufacturing method thereof disclosed in the embodiments of the present invention utilize the viscosity of the adhesive layer so that the adhesive layer can be properly matched with the plurality of metal wires and the cover body in structure, thereby effectively reducing the overall size, so that the sensor packaging structure can meet the requirements of miniaturization while preventing the sensing chip from being contaminated by the colloid.

[0021] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional schematic diagram of a sensor packaging structure according to an embodiment of the present invention.

[0023] Figure 2 for Figure 1 Schematic top view after omitting the package body.

[0024] Figure 3 for Figure 1 Schematic cross-sectional view along section line III-III.

[0025] Figure 4 for Figure 3 A cross-sectional schematic diagram of a first variation structure.

[0026] Figure 5 for Figure 3 A cross-sectional schematic diagram of a second variation structure.

[0027] Figure 6 for Figure 3 A cross-sectional schematic diagram of the third variation structure.

[0028] Figure 7 It is a cross-sectional schematic diagram of the preparatory steps of the sensor packaging structure manufacturing method according to an embodiment of the present invention.

[0029] Figure 8 It is a cross-sectional schematic diagram of the glue spreading step of the sensor packaging structure manufacturing method according to an embodiment of the present invention.

[0030] Fig. 9 It is a cross-sectional schematic diagram of a component placement step of a method for manufacturing a sensor packaging structure according to an embodiment of the present invention.

[0031] Fig.10 It is a cross-sectional schematic diagram of a component placement step of a method for manufacturing a sensor packaging structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0032] The following is an explanation of the implementation methods of the "sensor packaging structure and its manufacturing method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0033] It should be understood that although the terms "first", "second", "third" and the like may be used herein to describe various components or features, these components or features should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one feature from another feature. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0034] See also Figures 1 to 10 As shown, it is an embodiment of the present invention. This embodiment discloses a sensor packaging structure 100 and a manufacturing method thereof, and the sensor packaging structure 100 can be manufactured by implementing the sensor packaging structure manufacturing method recorded in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the sensor packaging structure 100 can also be manufactured by implementing methods other than this embodiment. In addition, to facilitate understanding of this embodiment, the following content will first introduce the sensor packaging structure 100, and then explain the sensor packaging structure manufacturing method.

[0035] [Sensor packaging structure]

[0036] In this embodiment Figures 1 to 3The sensor packaging structure 100 includes a circuit board 1, a sensing chip 2 mounted on the circuit board 1, a plurality of metal wires 3 electrically coupling the circuit board 1 and the sensing chip 2, an adhesive layer 4 arranged on the circuit board 1 along the plurality of metal wires 3, a cover body 5 bonded to the adhesive layer 4, and a packaging body 6 formed on the circuit board 1.

[0037] The circuit board 1 is square or rectangular in this embodiment, but the present invention is not limited thereto. The circuit board 1 has a first board surface 11 and a second board surface 12 respectively located on opposite sides, and the circuit board 1 is provided with a solid crystal area 111 substantially in the center of the first board surface 11, and the circuit board 1 includes a plurality of bonding pads 112 located on the first board surface 11 and distributed on the outside of the solid crystal area 111. The plurality of bonding pads 112 are generally arranged in a ring shape in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the solid crystal area 111.

[0038] In addition, in this embodiment, the circuit board 1 can also be provided with a plurality of solder balls 7 on the second board surface 12, and the sensor packaging structure 100 can be soldered and fixed on an electronic component (not shown in the figure) through the plurality of solder balls 7, so that the sensor packaging structure 100 can be electrically coupled to the electronic component.

[0039] The sensing chip 2 is described as an image sensing chip in this embodiment, but is not limited to this. Among them, the sensing chip 2 (bottom surface 22) is fixed to the first board surface 11 (such as: the solid crystal area 111) of the circuit board 1, and the sensing chip 2 is located on the inner side of the plurality of bonding pads 112. It should be additionally explained that the sensor packaging structure 100 in this embodiment includes a glue material (not shown) arranged on the solid crystal area 111, and the sensing chip 2 is fixed to the solid crystal area 111 by the glue material, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the glue material may also be omitted or replaced by other components according to actual needs.

[0040] Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a plurality of connection pads 212 located outside the sensing area 211, and the number and positions of the plurality of connection pads 212 of the sensing chip 2 in this embodiment respectively correspond to the number and positions of the plurality of bonding pads 112 of the circuit board 1; that is, the plurality of connection pads 212 are generally arranged in a ring shape and their number is equal to the number of the plurality of bonding pads 112.

[0041] Each of the metal wires 3 has an outer end 31 and an inner end 32, and the outer ends 31 of the plurality of metal wires 3 are respectively connected to the plurality of bonding pads 112 of the circuit board 1, and the inner ends 32 of the plurality of metal wires 3 are respectively connected to the plurality of connection pads 212 of the sensing chip 2, so that the circuit board 1 can be electrically coupled to the sensing chip 2 through the plurality of metal wires 3. Any of the metal wires 3 can be in a normal bond form or a reverse bond form according to design requirements, and the present invention is not limited thereto.

[0042] The adhesive layer 4 is annular and is disposed on the first board surface 11 of the circuit board 1 along the outer ends 31 of the plurality of metal wires 3. In this embodiment, the adhesive layer 4 is formed by applying the adhesive to the circuit board 1 by dispensing and then curing, and the height of the adhesive layer 4 is lower than the height of the sensing chip 2 compared to the circuit board 1, and the adhesive layer 4 preferably does not touch the sensing chip 2, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the height of the adhesive layer 4 can also be equal to or slightly higher than the height of the sensing chip 2 according to actual needs.

[0043] More specifically, the adhesive layer 4 in this embodiment has a protection section 41, a receiving section 42 connected to the protection section 41, and an outer ring section 43 connected to the receiving section 42, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the outer ring section 43 may also be omitted according to actual needs.

[0044] The protection section 41 is annular and buries the outer ends 31 of the plurality of metal wires 3 therein, and the receiving section 42 is annular and surrounds the outer side of the protection section 41, and the outer ring section 43 surrounds the outer side of the receiving section 42. In other words, the receiving section 42 is located between the protection section 41 and the outer ring section 43. Furthermore, the thickness T42 of the receiving section 42 is smaller than the thickness T41 of the protection section 41 and also smaller than the thickness T43 of the outer ring section 43, and the thickness T41 of the protection section 41 may be equal to or slightly larger than the thickness T43 of the outer ring section 43. In other words, the top side of the adhesive layer 4 is equivalent to forming a groove in the receiving section 42.

[0045] It should be noted that the outer end 31 of each metal wire 3 is limited to be buried in the protection section 41 of the adhesive layer 4 in this embodiment, so that the outer end 31 is protected and the miniaturization of the sensor packaging structure 100 can be achieved. In other words, any packaging structure in which the metal wire is not buried in the adhesive is different from the sensor packaging structure 100 referred to in this embodiment.

[0046] The cover 5 is bonded to the receiving section 42 of the adhesive layer 4, so that the cover 5, the circuit board 1, and the adhesive layer 4 together surround a closed space E, which accommodates the sensing chip 2 and a part of each metal wire 3. It should be noted that the cover 5 in this embodiment is fixed to each other by the adhesiveness of the adhesive layer 4 itself, so no adhesive is disposed between the cover 5 and the adhesive layer 4.

[0047] In this embodiment, the cover 5 includes a light-transmitting layer 51, a light-proof bracket 52 fixed to the light-transmitting layer 51, and a bonding layer 53 bonding the light-transmitting layer 51 and the light-proof bracket 52. In this embodiment, the light-transmitting layer 51 is described as a flat glass plate in a transparent state, and the light-transmitting layer 51 has a light-transmitting area 511 facing the sensing area 211, and a layout area 512 in a ring shape and surrounding the outside of the light-transmitting area 511. The top edge 521 of the light-proof bracket 52 is fixed to the layout area 512 of the light-transmitting layer 51 (through the bonding layer 53), and the bottom edge 522 of the light-proof bracket 52 is sunken and bonded to the receiving section 42 of the adhesive layer 4, and the outer ring section 43 protrudes out of the light-transmitting bracket 52.

[0048] Furthermore, the light-proof bracket 52 in this embodiment is an integrally formed one-piece structure, and the light-proof bracket 52 includes a shielding plate 523 and an annular frame 524 connected to the shielding plate 523. The shielding plate 523 has the top edge 521, and the adhesive layer 53 is clamped and bonded between the layout area 512 of the light-transmitting layer 51 and the light-proof bracket 52 (such as the shielding plate 523), and the annular frame 524 is connected to the outer portion of the shielding plate 523 and has the bottom edge 522.

[0049] Furthermore, the plurality of metal wires 3 are located within a projection space formed by the orthographic projection of the shielding plate 523 toward the circuit board 1 , so that the sensor packaging structure 100 can effectively reduce the glare caused by the plurality of metal wires 3 through the light-proof bracket 52 .

[0050] In other words, the light-transmitting area 511 can be defined as the portion of the light-transmitting layer 51 that is not covered by the shielding plate 523, and the light-transmitting area 511 faces the sensing area 211 of the sensing chip 2. In other words, the light-transmitting area 511 is a projection area formed by the orthographic projection of the top surface 21 of the sensing chip 2, which covers the entire sensing area 211 but does not cover any of the connection pads 212 (or any of the metal wires 3).

[0051] It should be additionally explained that the light-transmitting layer 51 and the light-impermeable bracket 52 in this embodiment Figures 1 to 3 The bonding and fixing of the adhesive layer 53 is used as an example, but the present invention is not limited thereto. Figures 4 to 6 As shown, the light-proof bracket 52 can be formed in the layout area 512 of the light-transmitting layer 51 by injection molding to constitute the cover body 5; or, in other embodiments not shown in the present invention, the fixation between the light-transmitting layer 51 and the light-proof bracket 52 can also be implemented by means other than the bonding layer 53.

[0052] In more detail, Figure 5 and Figure 6 As shown, the light-proof bracket 52 may further include a structural reinforcement portion 525 according to design requirements, which is connected to the shielding plate 523 and the annular frame 524. The structural reinforcement portion 525 may be annular or include a plurality of ribs, and the structural reinforcement portion 525 is located on the inner side of the shielding plate 523 and the annular frame 524, thereby effectively improving the stress concentration problem generated at the connection between the shielding plate 523 and the annular frame 524.

[0053] like Figures 1 to 3 As shown, the package body 6 is formed on the first board surface 11 of the circuit board 1, and the cover body 5 and the adhesive layer 4 (such as the outer ring segment 43) are embedded in the package body 6, and the outer surface 513 of the light-transmitting layer 51 is at least partially exposed outside the package body 6. Furthermore, the ring side surface 61 of the package body 6 is preferably cut flush with the side edge 13 of the circuit board 1, but the present invention is not limited thereto.

[0054] In addition, the package body 6 is described as a molding compound in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the package body 6 may adopt a liquid compound according to actual needs; or, the package body 6 may include a liquid compound and a molding compound located on the top surface of the liquid compound.

[0055] As described above, the sensor packaging structure 100 in this embodiment utilizes the viscosity of the adhesive layer 4 so that the adhesive layer 4 can be properly matched with the plurality of metal wires 3 and the cover 5 in structure, thereby effectively reducing the overall size, so that the sensor packaging structure 100 can meet the requirements of miniaturization while preventing the sensing chip 2 from being contaminated by the colloid.

[0056] In addition, the sensor packaging structure 100 in this embodiment can also be embedded in the adhesive layer 4 through the bottom edge 522 of the opaque bracket 52, so that when different parts of the bottom edge 522 of the opaque bracket 52 have a slight height tolerance, the adhesive layer 4 can absorb the height tolerance (such as Figure 4 As shown, different parts of the bottom edge 522 are embedded in the adhesive layer 4 at different depths), so that the shielding plate 523 can provide optional horizontality.

[0057] [Sensor packaging structure manufacturing method]

[0058] like Figure 3 and Figures 7 to 10 As shown, the sensor packaging structure manufacturing method in this embodiment includes: a pre-step S110, a glue spreading step S120, a component placement step S130, and a packaging step S140. It should be noted that the sensor packaging structure manufacturing method can manufacture the sensor packaging structure 100 described in the above content after implementing the above steps, so the technical content of the sensor packaging structure manufacturing method can also refer to the relevant description content of the sensor packaging structure 100. The following content will generally introduce the various steps of the sensor packaging structure manufacturing method, but the present invention is not limited thereto.

[0059] The preceding step S110: Figure 7 As shown, a sensing chip 2 is mounted on a circuit board 1, and the sensing chip 2 and the circuit board 1 are connected by bonding through a plurality of metal wires 3. Each of the metal wires 3 has an outer end 31 connected to the circuit board 1 and an inner end 32 connected to the sensing chip 2.

[0060] The adhesive application step S120: Figure 8As shown, a ring-shaped adhesive layer 4 is formed on the circuit board 1 along the outer ends 31 of the plurality of metal wires 3. The adhesive layer 4 has a protection section 41, a receiving section 42 surrounding the outer side of the protection section 41, and an outer ring section 43 surrounding the outer side of the receiving section 42. Furthermore, the protection section 41 buries the outer ends 31 of the plurality of metal wires 3 therein, and the height of the adhesive layer 4 is lower than the height of the sensing chip 2 compared to the circuit board 1, and the adhesive layer 4 does not touch the sensing chip 2.

[0061] The step S130 of placing components: Fig. 9 and Fig.10 As shown, a cover 5 is bonded on the receiving section 42, and the adhesive layer 4 is cured. The cover 5 includes a light-transmitting layer 51 and a light-proof bracket 52. The light-transmitting layer 51 has a light-transmitting area 511 facing the sensing chip 2, and a layout area 512 surrounding the outside of the light-transmitting area 511. The top edge 521 of the light-proof bracket 52 is fixed to the layout area 512 of the light-transmitting layer 51, and the bottom edge 522 of the light-proof bracket 52 is sunken and bonded to the receiving section 42 of the adhesive layer 4.

[0062] Furthermore, in the placement step S130 of the present embodiment, the opaque bracket 52 is first bonded to the receiving section 42 of the adhesive layer 4 with its bottom edge 522, and then the layout area 512 of the transparent layer 51 is bonded to the top edge 521 of the opaque bracket 52 through an adhesive layer 53, but not limited thereto.

[0063] For example, the layout area 512 of the light-transmitting layer 51 may be bonded to the top edge 521 of the light-proof bracket 52 through the adhesive layer 53 before the component placement step S130 to form the cover 5, and then the cover 5 is used in the component placement step S130. Alternatively, the light-proof bracket 52 may be formed on the layout area 512 of the light-transmitting layer 51 by injection molding before the component placement step S130 to form the cover 5, and then the cover 5 is used in the component placement step S130.

[0064] In addition, the light-proof support 52 in this embodiment includes a shielding plate 523 and an annular frame 524 connected to the shielding plate 523. The shielding plate 523 has the top edge 521, and the annular frame 524 has the bottom edge 522, and the plurality of metal wires 3 are located in a projection space formed by the orthographic projection of the shielding plate 523 toward the circuit board 1.

[0065] The packaging step S140: Figure 3 As shown, a packaging body 6 is formed on the circuit board 1, which is covered on the annular side surface 54 of the cover body 5, and the outer ring section 43 of the adhesive layer 4 is also buried in the packaging body 6, and the outer surface 513 of the light-transmitting layer 51 is at least partially exposed outside the packaging body 6.

[0066] [Technical Effects of Embodiments of the Invention]

[0067] In summary, the sensor packaging structure and the manufacturing method thereof disclosed in the embodiments of the present invention utilize the viscosity of the adhesive layer so that the adhesive layer can be properly matched with the plurality of metal wires and the cover body in structure, thereby effectively reducing the overall size, so that the sensor packaging structure can meet the requirements of miniaturization while preventing the sensing chip from being contaminated by the colloid.

[0068] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.

Claims

1. A method for manufacturing a sensor packaging structure, characterized in that: The sensor packaging structure manufacturing method comprises: A pre-step: installing a sensing chip on a circuit board, and connecting the sensing chip and the circuit board by bonding a plurality of metal wires; wherein each of the metal wires has an outer end connected to the circuit board and an inner end connected to the sensing chip; A glue spreading step: forming a ring-shaped adhesive layer on the circuit board along the outer ends of the plurality of metal wires; wherein the adhesive layer has: a protection segment, wherein the outer ends of the plurality of metal wires are buried inside the protection segment; and a receiving section, surrounding the outer side of the protection section; and A step of placing a component: bonding a cover body on the receiving section and curing the adhesive layer; wherein the cover body comprises: a light-transmitting layer having a light-transmitting area facing the sensing chip and a layout area surrounding the light-transmitting area; and a light-proof bracket, the top edge of which is fixed to the layout area of ​​the light-transmitting layer, and the bottom edge of which is sunken into and adhered to the receiving section of the adhesive layer; and A packaging step: forming a packaging body on the circuit board, wherein the packaging body is coated on the ring side surface of the cover body.

2. The method for manufacturing a sensor packaging structure according to claim 1, characterized in that: In the step of placing the components, the bottom edge of the light-proof support is bonded to the receiving section of the adhesive layer, and then the layout area of ​​the light-transmitting layer is bonded to the top edge of the light-proof support through an adhesive layer.

3. The method for manufacturing a sensor packaging structure according to claim 1, characterized in that: Before the step of placing the components, the layout area of ​​the light-transmitting layer is bonded to the top edge of the light-impermeable support through an adhesive layer.

4. The method for manufacturing a sensor packaging structure according to claim 1, characterized in that: Before the step of placing the components, the light-proof bracket is formed in the layout area of ​​the light-transmitting layer by injection molding to form the cover.

5. The method for manufacturing a sensor packaging structure according to claim 1, characterized in that: The light-proof bracket comprises: a shielding plate having the top edge; wherein the plurality of metal wires are located within a projection space formed by the orthographic projection of the shielding plate toward the circuit board; and An annular frame is connected to the shielding plate and has the bottom edge.

6. The method for manufacturing a sensor packaging structure according to claim 1, characterized in that: The adhesive layer has an outer ring section surrounding the outer side of the receiving section; in the packaging step, the outer ring section is buried in the packaging body.

7. The method for manufacturing a sensor packaging structure according to claim 1, characterized in that: The height of the adhesive layer is lower than that of the sensing chip compared to the circuit board, and the adhesive layer does not touch the sensing chip.

8. A sensor packaging structure, characterized in that: The sensor packaging structure comprises: a circuit board having a first board surface and a second board surface respectively located on opposite sides, and the circuit board comprises a plurality of bonding pads located on the first board surface; A sensing chip is mounted on the first board surface of the circuit board, and the top surface of the sensing chip has a sensing area and a plurality of connection pads located outside the sensing area; A plurality of metal wires, each having an outer end and an inner end; wherein the outer ends of the plurality of metal wires are respectively connected to the plurality of bonding pads of the circuit board, and the inner ends of the plurality of metal wires are respectively connected to the plurality of connection pads of the sensing chip; An adhesive layer is annular and is disposed on the first board surface of the circuit board along the outer ends of the plurality of metal wires, and the adhesive layer has: a protection segment, wherein the outer ends of the plurality of metal wires are buried inside the protection segment; and A receiving section, surrounding the outer side of the protection section; A cover body is bonded to the receiving section of the adhesive layer so that the cover body, the circuit board, and the adhesive layer together surround a closed space; wherein the cover body includes: a light-transmitting layer having a light-transmitting area facing the sensing area and a layout area surrounding the light-transmitting area; and a light-proof bracket, the top edge of which is fixed to the layout area of ​​the light-transmitting layer, and the bottom edge of which is sunken into and adhered to the receiving section of the adhesive layer; and A packaging body is formed on the first board surface of the circuit board; wherein the cover body and the adhesive layer are embedded in the packaging body, and the outer surface of the light-transmitting layer is at least partially exposed outside the packaging body.

9. The sensor packaging structure according to claim 8, characterized in that: The light-proof bracket comprises: a shielding plate having the top edge; wherein the plurality of metal wires are located within a projection space formed by the orthographic projection of the shielding plate toward the circuit board; and An annular frame is connected to the shielding plate and has the bottom edge.

10. The sensor packaging structure according to claim 9, characterized in that: The light-proof bracket includes a structure reinforcement part, the structure reinforcement part is connected to the shielding plate and the annular frame, and the structure reinforcement part is located at the inner side of the shielding plate and the annular frame.

11. The sensor packaging structure according to claim 8, characterized in that: The cover body includes a bonding layer, and the bonding layer is clamped and bonded between the layout area of ​​the light-transmitting layer and the light-proof bracket.

12. The sensor packaging structure according to claim 8, characterized in that: The light-proof bracket is formed in the layout area of ​​the light-transmitting layer by injection molding to form the cover body.

13. The sensor packaging structure according to claim 8, characterized in that: The adhesive layer has an outer ring section surrounding the outer side of the receiving section, and the outer ring section protrudes out of the light-proof bracket and is buried in the packaging body.

14. The sensor packaging structure according to claim 8, characterized in that: The thickness of the receiving section is smaller than the thickness of the protecting section.

15. The sensor packaging structure according to claim 8, characterized in that: The height of the adhesive layer is lower than that of the sensing chip compared to the circuit board, and the adhesive layer does not touch the sensing chip.

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