Wafer vertical stripping mechanism and wafer vertical stripping method

Abstract

The invention provides a wafer vertical stripping mechanism and a wafer vertical stripping method. The stripping mechanism comprises a position adjusting plate, a coplanar sensor, a driving structure for rotating the position adjusting plate, a motion sensor for detecting whether the position adjusting plate is vertical or not, and a wafer auxiliary structure for pushing a wafer to be stripped and the position adjusting plate to rotate in parallel. Through cooperation of the position adjusting plate, the coplanar sensor, the rotation driving structure, the motion sensor and the wafer auxiliary structure, the to-be-stripped wafer and the position adjusting plate rotate in parallel to be perpendicular and then are stripped and taken, the vertical stripping efficiency of the wafer is improved, and defects caused by wafer stripping are avoided; meanwhile, the swing roller is in contact with the to-be-stripped wafer, so that the stress on the to-be-stripped wafer is reduced, and the vertical stripping yield of the wafer is improved; in addition, the stress on the wafer to be stripped is further reduced by materials of the position adjusting plate and the swing roller, and the wafer damage risk is reduced; and finally, the wafer is conveniently and vertically stripped and taken through the wafer taking groove with an opening in the upper part, so that the wafer stripping efficiency and yield are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor integrated circuit manufacturing, and in particular relates to a wafer vertical peeling mechanism and a wafer vertical peeling method. Background Art

[0002] At present, in the process of using the wafer stripping and cleaning mechanism after wire cutting, the wafer that is still connected by the resin plate after the crystal rod is wire cut needs to be immersed in the debonding tank upside down, and the connection between the wafer and the resin plate is soaked at high temperature; the viscosity of the resin glue decreases due to the high temperature, so that the wafer can be debonded. However, during the debonding process of the wafer, the debonding tank will circulate water to maintain a uniform temperature. The airflow generated by the debonding tank during the water circulation process will cause the wafer to tilt to varying degrees.

[0003] The existing wafer peeling mechanism cannot detect whether the wafer is tilted, resulting in the wafer being difficult to be adsorbed by the wafer picking robot arm due to the tilt during the wafer debonding process, resulting in wafer picking failure and triggering equipment alarm. At the same time, if the wafer tilt angle is too large during the peeling process, it will also cause product abnormalities such as broken wafers or broken edges, thereby seriously reducing the yield of wafer peeling and cleaning after wire cutting.

[0004] When the wafer fails to be removed during the debonding process, the technician needs to adjust the wafer tilt angle on site. After a crystal rod is wire-cut, the technician needs to repeatedly adjust the wafer tilt angle. However, during the process of adjusting the wafer tilt angle, due to the design limitations of the stripping and cleaning mechanism, the technician cannot directly observe whether the current position of the wafer meets the normal stripping requirements. Therefore, additional product equipment must be used for stripping observation. If the angle of the wafer is not good after adjustment, the wafer will still be squeezed and cracked during the stripping process. Therefore, the technician needs to perform wafer knocking verification after the adjustment action is completed. If the wafer is damaged by knocking, the wafer tilt angle needs to be readjusted. A lot of time will be wasted in these adjustments and verifications. At the same time, the accuracy of judging whether the wafer position is normal is not high enough, resulting in the inability of the existing wafer stripping mechanism to effectively detect and correct the wafer tilt angle function during the stripping process. When the wafer tilt angle is too large, it will cause frequent stripping failure alarms and product breakage during the stripping period, greatly reducing the operational efficiency, production yield and product stability of wafer stripping and cleaning after slicing.

[0005] Therefore, there is an urgent need for a structure or method that can improve the operational efficiency and production yield of wafer peeling after slicing.

[0006] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology part of the present application. Summary of the invention

[0007] In view of the above shortcomings of the prior art, an object of the present invention is to provide a wafer vertical peeling mechanism and a wafer vertical peeling method, so as to solve the problems of low operating efficiency and low production yield of wafer peeling after slicing in the prior art.

[0008] To achieve the above-mentioned object, the present invention provides a wafer vertical peeling mechanism, which includes a position adjustment plate, at least three coplanar sensors, a driving structure, a motion sensor and a wafer auxiliary structure;

[0009] Each of the coplanar sensors passes through and protrudes from the first plate surface of the position adjustment plate respectively. The point of all the coplanar sensors closest to the wafer to be peeled off is coplanar on a plane parallel to the first plate surface but does not pass through the same straight line. Each of the coplanar sensors is used to detect whether the wafer to be peeled off that is closest to the position adjustment plate is in contact with the corresponding coplanar sensor; the driving structure includes a rotation driving structure, which is used to drive the position adjustment plate to rotate around a preset straight line on the first plate surface as an axis. The motion sensor is used to detect the position relationship between the first plate surface of the position adjustment plate and a set vertical reference plane. The wafer auxiliary structure is used to push the wafer to be peeled off that is closest to the position adjustment plate to rotate parallel to the set vertical reference plane.

[0010] Optionally, the position adjustment plate is provided with through slots having the same number as the coplanar sensors at preset positions, the central axis of each through slot is perpendicular to the first plate surface, and the through slots are used to set the coplanar sensors;

[0011] The coplanar sensor includes a swing guide rod, a swing bracket, a roller guide rod, a swing roller, a displacement trigger structure and a displacement sensing receiving structure; the swing guide rod is parallel to the first plate surface and fixedly mounted in the through slot along a first direction; the swing bracket includes a swing through hole and a swing frame, the swing guide rod passes through the swing through hole, and the swing bracket can swing and rotate with the swing guide rod as the axis, and the central axis of the swing frame is parallel to the central axis of the through slot; the roller guide rod is fixedly connected to the swing bracket in the swing frame along the first direction, the swing roller includes a rotating through hole passing through the central axis, the roller guide rod passes through the rotating through hole, and the swing roller can rotate with the roller guide rod as the axis; the displacement trigger structure is fixed to the swing bracket, the displacement sensing receiving structure is fixed to the position of the position adjustment plate close to the corresponding through slot, and the displacement sensing receiving structure is used to sense the position movement state of the displacement trigger structure.

[0012] Optionally, the position adjustment plate is made of polytetrafluoroethylene; and / or the swing roller is made of nitrile rubber.

[0013] Optionally, the wafer vertical peeling mechanism includes three coplanar sensors, namely a first sensor, a second sensor, and a third sensor, wherein the first sensor and the second sensor are located at preset positions on the upper half of the position adjustment plate, and the third sensor is located at a preset position on the lower half of the position adjustment plate; the line between the first sensor and the second sensor is parallel to the first direction, and the perpendicular bisector of the line between the first sensor and the second sensor passes through the third sensor.

[0014] Optionally, the driving structure further includes a linear driving structure, and the linear driving structure is used to drive the crystal rod for wafer stripping to move linearly along a first direction.

[0015] Optionally, the motion sensor is a gravity sensor.

[0016] Optionally, the wafer auxiliary structure is an air knife, and the air knife pushes the wafer to be peeled off to maintain a parallel state with the position adjustment plate and rotates to be parallel to the set vertical reference plane through airflow pressure.

[0017] Optionally, a film taking groove with an upper opening is provided at the position where the position adjustment plate is not provided with the coplanar sensor, and the film taking groove penetrates the position adjustment plate along a first direction. The film taking groove is a moving space for a stripping film taking structure to pass through the position adjustment plate to perform a film taking operation on the wafer to be stripped which is adjusted vertically.

[0018] Optionally, the wafer vertical peeling mechanism further includes an alarm structure, and the alarm structure is used to alarm an abnormal situation when the sensing structures of the coplanar sensor and the motion sensor are outside a preset judgment range.

[0019] The present invention also provides a wafer vertical peeling method, wherein the wafer vertical peeling method adopts any one of the above-mentioned wafer vertical peeling mechanisms to perform wafer vertical peeling, and the wafer vertical peeling method comprises:

[0020] Step 1: providing a crystal rod of a wafer to be peeled, wherein a position of the crystal rod closest to the position adjustment plate has a cut wafer to be peeled; moving the crystal rod of the wafer to be peeled so that the wafer to be peeled triggers at least one of the coplanar sensors;

[0021] Step 2: judging whether the wafer to be peeled is parallel to the first plate surface of the position adjustment plate according to the contact sensing state of each of the coplanar sensors;

[0022] Step 3: If it is determined that the wafer to be peeled is parallel to the first plate surface of the position adjustment plate, proceed to step 4; if it is determined that the wafer to be peeled is not parallel to the first plate surface of the position adjustment plate, proceed to step 5;

[0023] Step 4: Determine whether the first plate surface of the position adjustment plate sensed by the motion sensor is parallel to the set vertical reference plane; if it is determined that the first plate surface is not parallel to the set vertical reference plane, proceed to step 6; if it is determined that the first plate surface is parallel to the set vertical reference plane, proceed to step 7;

[0024] Step 5: Rotate the position adjustment plate according to the contact sensing state sensed by each of the coplanar sensors, and simultaneously move the overall position of the crystal rod of the wafer to be peeled off; if the wafer to be peeled off triggers at least one of the coplanar sensors before the position adjustment plate is rotated to be unable to rotate, return to step 2; if the wafer to be peeled off does not trigger any of the coplanar sensors after the position adjustment plate is rotated to be unable to rotate, issue an abnormal situation alarm;

[0025] Step 6: driving the position adjustment plate to rotate according to the vertical position sensed by the motion sensor, and at the same time, the wafer auxiliary structure drives the wafer to be peeled to rotate synchronously and parallel to the position adjustment plate, until the motion sensor senses that the first plate surface of the position adjustment plate is parallel to the set vertical reference plane, and then returning to step 2;

[0026] Step 7: vertically peeling the wafer to be peeled off.

[0027] As described above, the wafer vertical peeling mechanism and wafer vertical peeling method of the present invention have the following beneficial effects:

[0028] The present invention arranges a coplanar sensor at a preset position on the position adjustment plate to sense the parallel relationship between the wafer to be peeled and the position adjustment plate, a rotary driving structure rotates the position adjustment plate to be parallel to the wafer to be peeled, a motion sensor senses the vertical position of the position adjustment plate, and a wafer auxiliary structure pushes the wafer to be peeled to rotate parallel to the position adjustment plate to a vertical position for peeling and wafer taking, thereby improving the efficiency of automatic vertical adjustment before vertical wafer peeling, and avoiding problems such as wafer breakage, edge collapse, dark cracks or wafer taking failure caused by tilting during the peeling process;

[0029] The present invention sets a swing roller as a trigger body for triggering a coplanar sensor of a wafer to be peeled off, and the rolling setting can reduce the stress on the wafer to be peeled off and improve the yield rate of the wafer to be peeled off;

[0030] The present invention further reduces the stress on the wafer to be peeled when it contacts the swing roller or the position adjustment plate by setting the materials of the position adjustment plate and the swing roller, thereby reducing the risk of wafer damage.

[0031] The present invention can facilitate the stripping and fetching structure to pass through the position adjustment plate to strip the wafer to be stripped through the arrangement of the fetching groove with an upper opening, thereby improving the wafer stripping efficiency and yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It shows a schematic diagram of the structure presented by the air pressure detection structure in the prior art for detecting whether the wafer is tilted and performing wafer peeling.

[0033] Figure 2 It shows a schematic diagram of the structure presented when the wafer vertical peeling mechanism in the present invention is used for vertical wafer detection and peeling.

[0034] Figure 3 It is a schematic diagram of the front structure of the wafer vertical peeling mechanism on the position adjustment plate in the present invention.

[0035] Figure 4 It is a schematic diagram of the three-dimensional structure of the wafer vertical peeling mechanism on the position adjustment plate in the present invention.

[0036] Figure 5 Shown is a schematic diagram of the front view structure of a single coplanar sensor of the wafer vertical peeling mechanism in the present invention.

[0037] Figure 6 Shown is a schematic diagram of the side view structure of a single coplanar sensor of the wafer vertical peeling mechanism in the present invention.

[0038] Figure 7 Shown is a schematic diagram of the three-dimensional structure of a single coplanar sensor of the wafer vertical peeling mechanism in the present invention.

[0039] Figure 8 It is a schematic diagram showing the tilted state of the wafer to be peeled in an example of step 3 of the wafer vertical peeling method of the present invention.

[0040] Fig. 9 It is a schematic diagram showing the tilted state of the wafer to be peeled in an example of step 3 of the wafer vertical peeling method of the present invention.

[0041] Fig.10 It is a schematic diagram showing the structure presented when the position adjustment plate is rotated to be parallel to the wafer to be peeled in an example of step 4 of the wafer vertical peeling method of the present invention.

[0042] Fig.11 It is a schematic diagram of the structure presented after the wafer to be peeled and the position adjustment plate move in the opposite direction in step 4 of an example of the wafer vertical peeling method in the present invention.

[0043] Fig.12 It is a schematic diagram showing the structure presented when the position adjustment plate is rotated to be parallel to the wafer to be peeled in an example of step 4 of the wafer vertical peeling method of the present invention.

[0044] Fig.13 It is a schematic diagram of the structure presented after the wafer to be peeled and the position adjustment plate move in the opposite direction in step 4 of an example of the wafer vertical peeling method in the present invention.

[0045] Description of Figure Numbers

[0046] 11. Debonding tank; 12. Crystal rod; 13. Wafer; 14. Resin board glue; 15. Air pressure detection structure; 16. Stripping and fetching mechanical arm; 17. Suction cup; 18. Air knife;

[0047] 21. Position adjustment plate; 211. Upper edge; 212. Through slot; 213. Film taking slot; 214. First plate surface; 22. Coplanar sensor; 221. Swing guide rod; 222. Swing bracket; 2221. Swing through hole; 2222. Swing frame; 223. Roller guide rod; 224. Swing roller; 2241. Rotating through hole; 225. Shift trigger structure; 226. Filling magnetic block; 227. Shift sensing receiving structure; 228. Reed switch sensing part; 23. Rotation drive structure; 24. Motion sensor; 241. Gravity sensor; 25. Wafer auxiliary structure; 26. First direction; 27. First sensor; 28. Second sensor; 29. ​​Third sensor. DETAILED DESCRIPTION

[0048] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0049] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the schematic diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0050] For convenience of description, spatially relative terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings.

[0051] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0052] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0053] At present, in the process of using the stripping and cleaning mechanism of the wafer 13 after the line cutting, as Figure 1 As shown, the wafer 13 that is still connected by the resin plate after the crystal rod 12 is wire-cut needs to be immersed upside down in the debonding tank 11, and the connection between the wafer 13 and the resin plate glue 14 is soaked at high temperature; the viscosity of the resin plate glue 14 decreases due to the high temperature, so that the wafer 13 can be debonded. However, during the debonding process of the wafer 13, the debonding tank 11 will circulate water in order to maintain a uniform temperature. The airflow generated by the debonding tank 11 during the water circulation process will cause the wafer 13 to tilt to varying degrees.

[0054] The existing wafer 13 peeling mechanism cannot effectively detect and correct the tilt angle of the wafer 13 during the peeling process, and requires manual adjustment and verification, which is time-consuming and labor-intensive, and the accuracy after adjustment and verification is not accurate enough; Figure 1 The air pressure detection structure 15 shown detects the air pressure changes at various positions on the surface of the wafer 13 to determine whether the wafer 13 is tilted, but the detection accuracy is still not ideal. When the tilt angle of the wafer 13 is too large after adjustment, the suction cup 17 of the peeling and fetching robot 16 will frequently alarm the wafer 13 for peeling failure and product breakage during peeling, which greatly reduces the operating efficiency, production yield and product stability of the wafer 13 peeling and cleaning after slicing.

[0055] The present invention provides a wafer 13 vertical peeling mechanism, such as Figure 2-Figure 3 As shown, Figure 2 The side structure diagram of the vertical peeling mechanism of wafer 13 used for vertical detection and peeling of wafer 13 is presented. Figure 3 The front structural diagram of the part of the wafer 13 vertical peeling mechanism on the position adjustment plate 21, the wafer 13 vertical peeling mechanism includes the position adjustment plate 21, at least three coplanar sensors 22, a driving structure, a motion sensor 24 and a wafer auxiliary structure 25;

[0056] Each of the coplanar sensors 22 passes through and protrudes from the first plate surface 214 of the position adjustment plate 21 respectively. The point of all the coplanar sensors 22 closest to the wafer 13 to be peeled off is coplanar on a plane parallel to the first plate surface 214 but does not pass through the same straight line. Each of the coplanar sensors 22 is used to detect whether the wafer 13 to be peeled off that is closest to the position adjustment plate 21 is in contact with the corresponding coplanar sensor 22; the driving structure includes a rotation driving structure 23, and the rotation driving structure 23 is used to drive the position adjustment plate 21 to rotate around a preset straight line on the first plate surface 214 as an axis. The motion sensor 24 is used to detect the position relationship between the first plate surface 214 of the position adjustment plate 21 and a set vertical reference plane. The wafer auxiliary structure 25 is used to push the wafer 13 to be peeled off that is closest to the position adjustment plate 21 to rotate to be parallel to the set vertical reference plane.

[0057] The present invention sets a coplanar sensor 22 at a preset position on the position adjustment plate 21 to sense the parallel relationship between the wafer 13 to be peeled and the position adjustment plate 21, the rotation driving structure 23 rotates the position adjustment plate 21 to be parallel to the wafer 13 to be peeled, the motion sensor 24 senses the vertical position of the position adjustment plate 21, and the wafer auxiliary structure 25 pushes the wafer 13 to be peeled to rotate parallel to the position adjustment plate 21 to a vertical position so that the suction cup 17 of the peeling and film-taking robot arm 16 can peel and take the wafer 13 to be peeled, thereby improving the efficiency of automatically adjusting the verticality of the wafer 13 before vertical peeling; at the same time, at least three coplanar sensors 22 are used to detect whether the wafer 13 to be peeled is parallel to the first plate surface 214 of the position adjustment plate 21, and the motion sensor 24 cooperates with the detection of the vertical position of the position adjustment plate 21, which can greatly improve the detection and adjustment accuracy of the verticality of the surface of the wafer 13 to be peeled, thereby greatly reducing the risk of the wafer 13 being broken, broken, dark cracked or failed to take the wafer due to tilting during the peeling process.

[0058] Specifically, the set vertical reference plane refers to the vertical position angle that the suction cup 17 of the stripping robot 16 needs to reach for the wafer 13 to be stripped. The vertical reference plane can be set according to actual needs.

[0059] In one embodiment, the preset straight line is an upper edge 211 of the position adjustment plate 21 .

[0060] Specifically, the preset straight line can be specifically set according to the actual space and the driving logic of the driving structure, all of which are within the protection scope of the present invention.

[0061] In one embodiment, the position adjustment plate 21 is made of polytetrafluoroethylene (PTFE).

[0062] The present invention sets the material of the position adjustment plate 21 to PTFE, which is soft and will not cause damage to the wafer 13 to be peeled when it comes into hard contact with the wafer 13 to be peeled. At the same time, it has high cleanliness, is not easy to deform, is heat-resistant, and has high wear resistance. Therefore, it can be ensured that the cleanliness and quality of the wafer 13 to be peeled are not affected after the wafer 13 to be peeled contacts the position adjustment plate 21, and the position adjustment plate 21 itself can have a long service life, detection sensitivity, and reliability.

[0063] Specifically, the position adjustment plate 21 may also be made of other suitable materials as required, which are all within the protection scope of the present invention.

[0064] In one embodiment, Figure 4-Figure 7 As shown, Figure 4 It is a partial three-dimensional diagram of the vertical peeling mechanism of the wafer 13 on the position adjustment plate 21. Figure 5is a front view of a single coplanar sensor 22, Figure 6 is a side view of a single coplanar sensor 22, Figure 7 is a stereoscopic diagram of a single coplanar sensor 22, wherein the position adjustment plate 21 is provided with through slots 212 having the same number as the coplanar sensors 22 at preset positions, wherein the central axis of each through slot 212 is perpendicular to the first plate surface 214, and the through slots 212 are used to set the coplanar sensors 22;

[0065] like Figure 5-Figure 7 As shown, the coplanar sensor 22 includes a swing guide rod 221, a swing bracket 222, a roller guide rod 223, a swing roller 224, a displacement trigger structure 225 and a displacement sensing receiving structure 227; the swing guide rod 221 is parallel to the first plate surface 214 and is fixedly mounted in the through slot 212 along the first direction 26; the swing bracket 222 includes a swing through hole 2221 and a swing frame 2222, the swing guide rod 221 passes through the swing through hole 2221, the swing bracket 222 can swing and rotate with the swing guide rod 221 as the axis, and the central axis of the swing frame 2222 is parallel to the central axis of the through slot 212 The roller guide rod 223 is fixedly connected with the swing bracket 222 along the first direction 26 in the swing frame 2222, and the swing roller 224 includes a rotating through hole 2241 passing through the central axis, and the roller guide rod 223 passes through the rotating through hole 2241, and the swing roller 224 can rotate with the roller guide rod 223 as the axis; the shift trigger structure 225 is fixed to the swing bracket 222, and the shift sensing receiving structure 227 is fixed to the position of the position adjustment plate 21 close to the corresponding through slot 212, and the shift sensing receiving structure 227 is used to sense the position movement state of the shift trigger structure 225.

[0066] The present invention sets a swing roller 224 as a trigger body for triggering the coplanar sensor 22 when the wafer 13 to be peeled is close to the position adjustment plate 21, so that when a part of the wafer 13 to be peeled contacts the swing roller 224, the swing roller 224 can roll with the movement of the wafer 13 to be peeled, thereby reducing the stress such as friction generated when the swing roller 224 contacts the wafer 13 to be peeled, reducing the risk of damage to the wafer 13 to be peeled caused by the contact between the swing roller 224 and the wafer 13 to be peeled, and improving the yield of the wafer 13 to be peeled. At the same time, the movement acceleration of the wafer 13 to be peeled when it contacts the swing roller 224 can also be increased, thereby improving the vertical detection and adjustment efficiency of the wafer 13 to be peeled.

[0067] In one embodiment, the swing roller 224 is made of nitrile rubber.

[0068] The present invention sets the swing roller 224 to be made of nitrile rubber, which is elastic and corrosion-resistant, thereby reducing damage to the wafer 13 to be peeled off during the wafer 13 peeling and cleaning process, while ensuring its own service life and reliability.

[0069] In one embodiment, the material of the swing roller 224 may also be a modified material of polytetrafluoroethylene, PDFE, but the corrosion resistance is poor and the effect is not as good as nitrile rubber.

[0070] Specifically, the material of the swing roller 224 may also be other suitable materials, all of which are within the protection scope of the present invention.

[0071] In one embodiment, Figure 5-Figure 6 As shown, the displacement sensing receiving structure 227 is a reed switch sensing portion 228 , and the displacement triggering structure 225 is a filling magnetic block 226 .

[0072] The present invention uses the reed switch sensing part 228 and the filling magnetic block 226, and utilizes the magnetic field generated when the filling magnetic block 226 approaches to magnetize the two reeds made of soft magnetic material in the reed switch sensing part 228, so that the two reeds that were originally not close to the magnetic field and separated from each other attract each other and contact and close the circuit, thereby outputting the position relationship between the swing bracket 222 where the corresponding shift trigger structure 225 is located and the reed switch sensing part 228 on the position adjustment plate 21; when the circuit is closed, it means that the swing roller 224 has not been moved outside the position of the reed switch sensing part 228, and the wafer to be peeled off 13 does not push the swing roller 224 to swing and rotate; when the circuit is disconnected, it means that the swing roller 224 is moved outside the position of the reed switch sensing part 228, and the wafer 13 to be peeled pushes the swing roller 224 to swing and rotate, so as to judge whether the swing roller 224 is pushed by the wafer 13 to be peeled and rotates around the swing guide rod 221 as the axis; through all the coplanar sensors 22, it is judged whether the corresponding swing roller 224 is pushed by the wafer 13 to be peeled at the same time through the contact sensing state, so as to judge whether the wafer 13 to be peeled is parallel to the first plate surface 214 of the position adjustment plate 21.

[0073] Specifically, the displacement sensing receiving structure 227 and the displacement triggering structure 225 can also be replaced with other sensors that can sense whether the swing roller 224 is pushed by the wafer 13 to be peeled and displaced, such as resistive, capacitive, inductive, optical, ultrasonic displacement sensors, magnetostrictive position sensors, Hall effect position sensors, etc., all of which are within the protection scope of the present invention.

[0074] In one embodiment, Figure 3As shown, the vertical peeling mechanism of the wafer 13 includes three coplanar sensors 22, namely a first sensor 27, a second sensor 28, and a third sensor 29, wherein the first sensor 27 and the second sensor 28 are located at preset positions in the upper half of the position adjustment plate 21, and the third sensor 29 is located at a preset position in the lower half of the position adjustment plate 21; the line between the first sensor 27 and the second sensor 28 is parallel to the first direction 26, and the perpendicular bisector of the line between the first sensor 27 and the second sensor 28 passes through the third sensor 29.

[0075] Specifically, the present invention sets the positions of three coplanar sensors 22 so that the three coplanar sensors 22 can detect the tilt of most of the wafers 13 to be peeled off, thereby simplifying the vertical peeling mechanism of the wafer 13, making it lightweight and reducing the preparation cost, while ensuring the feasibility of adjusting the wafer 13 to be peeled off.

[0076] In one embodiment, the number of coplanar sensors 22 can be increased and the positions of the coplanar sensors 22 can be adjusted according to the accuracy of the verticality judgment of the wafer 13 to be peeled off, so that the coplanar sensors 22 can monitor the vertical position of the wafer 13 to be peeled off more accurately.

[0077] In one embodiment, the driving structure further includes a linear driving structure, and the linear driving structure is used to drive the crystal rod 12 for peeling the wafer 13 to perform linear motion along the first direction 26 .

[0078] Since the position adjustment plate 21 can only rotate, and the distance between the position adjustment plate 21 and the wafer 13 to be peeled will increase or decrease during the rotation process, the increase in distance may cause the wafer 13 to be peeled to be unable to trigger any coplanar sensor 22 on the position adjustment plate 21, while the decrease in distance may cause the position adjustment plate 21 to touch the wafer 13 to be peeled during the rotation process, resulting in the wafer 13 to be peeled. Problems such as broken pieces. Therefore, the present invention sets a linear drive structure to move the integral crystal rod 12 where the wafer 13 to be peeled is located, and adjusts the distance between the wafer 13 to be peeled and the position adjustment plate 21, thereby improving the vertical peeling adjustment efficiency and product yield of the wafer 13 to be peeled.

[0079] In one embodiment, the linear drive structure can be a crystal rod 12 transplanting mechanism of the crystal rod 12 itself, or a moving mechanism that can be directly used by other equipment, and is not part of the wafer 13 vertical peeling mechanism, but its working principle is the same and is within the protection scope of the present invention.

[0080] In one embodiment, the driving structure is a servo motor.

[0081] In one embodiment, Figure 3As shown, the motion sensor 24 is a gravity sensor 241 .

[0082] The present invention sets the motion sensor 24 as a gravity sensor 241 , so that the vertical position of the position adjustment plate 21 can be detected by using a simple and small sensor structure.

[0083] Specifically, the motion sensor 24 may also be provided with other suitable structures such as precise position sensitive detectors, displacement sensors, anisotropic magnetoresistive sensors, Hall sensors, time-of-flight sensors, laser displacement sensors, gyroscope sensors and other different sensors to realize the position angle relationship between the first plate surface 214 of the position adjustment plate 21 and the set vertical reference plane, all of which are within the protection scope of the present invention.

[0084] In one embodiment, Figure 2 As shown, the wafer auxiliary structure 25 is an air knife 18, and the air knife 18 pushes the wafer 13 to be peeled off to maintain a parallel state with the position adjustment plate 21 and rotate to be parallel to the set vertical reference plane through airflow pressure.

[0085] The present invention uses the wind knife 18 originally present in the semiconductor cleaning equipment to push the wafer 13 to be peeled and the position adjustment plate 21 to rotate parallel to each other in a non-contact manner through the air flow pressure, thereby improving the alignment accuracy of the parallel rotation of the wafer 13 to be peeled and the position adjustment plate 21, while avoiding contact damage to the wafer 13 to be peeled, further improving the product yield of the wafer 13 to be peeled, and convenient modification and low cost.

[0086] Specifically, the wafer auxiliary structure 25 may also adopt other structures that can push the wafer 13 to be peeled off to rotate parallel to the position adjustment plate 21, all of which are within the protection scope of the present invention.

[0087] In one embodiment, Figure 4 As shown, a film taking groove 213 with an upper opening is provided at the position where the position adjustment plate 21 is not provided with the coplanar sensor 22. The film taking groove 213 penetrates the position adjustment plate 21 along the first direction 26. The film taking groove 213 is a moving space for a stripping film taking structure (a suction cup 17 of a stripping film taking robot arm 16) to pass through the position adjustment plate 21 to perform a film taking operation on the wafer 13 to be stripped which is adjusted vertically.

[0088] The present invention can facilitate the stripping and stripping structure to pass through the position adjustment plate 21 to strip the wafer 13 to be stripped by setting the wafer stripping groove 213 with an upper opening, thereby improving the stripping efficiency and yield of the wafer 13.

[0089] In one embodiment, Figure 4As shown, the projection of the film taking slot 213 on the first plate surface 214 is in the shape of an inverted arch.

[0090] The present invention sets the projection of the film taking groove 213 on the first plate surface 214 to be an inverted arch shape, so that it can match the extension and film taking movement trajectory of the stripping and film taking robot arm 16 for stripping and taking the wafer 13 to be stripped, so that the stripping and film taking robot arm 16 can use the suction cup 17 to absorb the wafer 13 to be stripped at the center point of the wafer 13 to be stripped, and the stripping and film taking robot arm 16 can be raised along the upper opening of the film taking groove 213 to move the wafer 13 to be stripped and the remaining crystal rod 12 to be stripped and complete the film taking, thereby improving the reliability of film taking and stripping and the operational efficiency, and at the same time, it can also meet the requirements of the position adjustment plate 21 for detecting the vertical position of the wafer 13 to be stripped, and ensure the mechanical strength of the position adjustment plate 21, thereby improving the service life and reliability.

[0091] Specifically, the projection of the wafer removal groove 213 on the first plate surface 214 may also be other suitable shapes to ensure the operation of peeling and removing the wafer 13 .

[0092] In one embodiment, the wafer 13 vertical peeling mechanism further includes an alarm structure, and the alarm structure is used to alarm when the sensing structures of the coplanar sensor 22 and the motion sensor 24 are outside a preset judgment range.

[0093] By setting an alarm structure, the present invention can alarm for abnormal situations outside the preset judgment range (for example, due to breakage, edge collapse and other problems, even if the overall surface of the wafer 13 is parallel to the position adjustment plate 21, the missing part of the wafer 13 cannot trigger the coplanar sensor 22), so as to manually intervene to deal with the abnormal situation, avoid the vertical peeling mechanism of the wafer 13 from falling into an endless loop due to the abnormal situation outside the preset judgment range, or cause greater damage to the abnormal wafer 13 by subsequent operations, and ensure the timely discovery and handling of abnormal situations.

[0094] In one embodiment, a PLC (Programmable Logic Controller) is used to perform corresponding logic control on the operation of each structure of the vertical peeling mechanism of the wafer 13 and actions such as sensor feedback.

[0095] In one embodiment, the detected vertical position of the position adjustment plate 21 is determined by software corresponding to the motion sensor 24 .

[0096] The present invention also provides a method for vertically peeling off a wafer 13, wherein the method for vertically peeling off a wafer 13 adopts any one of the vertical peeling mechanisms for wafer 13 described above to perform vertical peeling off the wafer 13. The method for vertically peeling off a wafer 13 of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the above sequence does not strictly represent the sequence of the method for vertically peeling off a wafer 13 protected by the present invention, and those skilled in the art may make changes according to the actual method steps.

[0097] The vertical peeling method of the wafer 13 includes:

[0098] Step 1: providing a crystal rod 12 of a wafer 13 to be peeled, wherein the position of the crystal rod 12 closest to the position adjustment plate 21 has a cut wafer 13 to be peeled; moving the crystal rod 12 of the wafer 13 to be peeled so that the wafer 13 to be peeled triggers at least one of the coplanar sensors 22;

[0099] Step 2: judging whether the wafer 13 to be peeled off is parallel to the first plate surface 214 of the position adjustment plate 21 according to the contact sensing state of each of the coplanar sensors 22;

[0100] Step 3: If it is determined that the wafer 13 to be peeled is parallel to the first plate surface 214 of the position adjustment plate 21, proceed to step 4; if it is determined that the wafer 13 to be peeled is not parallel to the first plate surface 214 of the position adjustment plate 21, proceed to step 5;

[0101] Step 4: Determine whether the first plate surface 214 of the position adjustment plate 21 sensed by the motion sensor 24 is parallel to the set vertical reference plane; if it is determined that the first plate surface 214 is not parallel to the set vertical reference plane, proceed to step 6; if Figure 2 As shown, it is determined that the first plate surface 214 is parallel to the set vertical reference plane, and step 7 is performed;

[0102] Step 5: Rotate the position adjustment plate 21 according to the contact sensing state sensed by each of the coplanar sensors 22, and simultaneously move the overall position of the crystal rod 12 of the wafer 13 to be peeled off; if the wafer 13 to be peeled off triggers at least one of the coplanar sensors 22 before the position adjustment plate 21 is rotated to be unable to rotate, the process returns to step 2; if the wafer 13 to be peeled off does not trigger any of the coplanar sensors 22 after the position adjustment plate 21 is rotated to be unable to rotate, an abnormal situation alarm is issued;

[0103] Step 6: driving the position adjustment plate 21 to rotate according to the vertical position sensed by the motion sensor 24, and at the same time, the wafer auxiliary structure 25 drives the wafer to be peeled 13 to rotate synchronously and parallel to the position adjustment plate 21, until the motion sensor 24 senses that the first plate surface 214 of the position adjustment plate 21 is parallel to the set vertical reference plane, and then returning to step 2;

[0104] Step 7: vertically peeling the wafer 13 to be peeled off.

[0105] In one embodiment, Figure 2 As shown, the provided crystal rod 12 for the wafer 13 to be peeled off is a crystal rod 12 that has been wire cut but the individual wafers 13 obtained by wire cutting are still connected by a resin plate.

[0106] In one embodiment, before moving the crystal rod 12 of the wafer 13 to be peeled off in step 1, it is determined whether the first plate surface 214 of the position adjustment plate 21 is parallel to the set vertical reference plane according to the sensing state of the motion sensor 24. If it is determined that the first plate surface 214 of the position adjustment plate 21 is not parallel to the set vertical reference plane, the rotation driving structure 23 drives the position adjustment plate 21 to rotate until the motion sensor 24 senses that the first plate surface 214 of the position adjustment plate 21 is parallel to the set vertical reference plane. Figure 2 shown.

[0107] The present invention rotates the position adjustment plate 21 to be parallel to a set vertical reference plane before detecting whether the wafer 13 to be peeled off is parallel to the position adjustment plate 21, so that it can be used as an initial calibration position, which facilitates the calculation of the driving control parameters of the driving structure when the wafer 13 to be peeled off is subsequently rotated back to be parallel to the position adjustment plate 21 to the set vertical reference plane.

[0108] In one embodiment, before moving the crystal rod 12 of the wafer 13 to be peeled off in step 1, the first plate surface 214 of the position adjustment plate 21 is in a position naturally placed by gravity. At this time, the first plate surface 214 and the set vertical reference plane may overlap, or may need to be fine-tuned; if it is necessary to fine-tune the angle of the first plate surface 214, the process can be directly carried out in steps 4 and 6 to rotate the position adjustment plate 21 so that the first plate surface 214 is rotated to the set vertical reference plane, so as to reduce the initial step of adjusting the position of the first plate surface 214.

[0109] In one embodiment, before moving the crystal rod 12 to be peeled off the wafer 13 in step 1, the position adjustment plate 21 can be rotated according to the vertical position sensed by the motion sensor 24 to adjust the vertical position of the first plate surface 214 to be parallel to the set vertical reference plane.

[0110] Those skilled in the art can select the timing for adjusting the first plate surface 214 and the set vertical reference plane according to needs, all of which are within the protection scope of the present invention.

[0111] In one embodiment, the vertical peeling mechanism of the wafer 13 includes three coplanar sensors 22, namely a first sensor 27, a second sensor 28, and a third sensor 29, wherein the first sensor 27 and the second sensor 28 are located at preset positions in the upper half of the position adjustment plate 21, and the third sensor 29 is located at a preset position in the lower half of the position adjustment plate 21; the connecting line between the first sensor 27 and the second sensor 28 is parallel to the first direction 26, and the perpendicular bisector of the connecting line between the first sensor 27 and the second sensor 28 passes through the third sensor 29.

[0112] Specifically, when the wafer to be peeled 13 contacts at least one of the coplanar sensors 22, the following contact sensing states are generally obtained in step 2:

[0113] 1) If Figure 2 As shown, the three coplanar sensors 22 are triggered at the same time, indicating that the wafer 13 to be peeled is in contact with the three coplanar sensors 22 at the same time. Since the points of the three coplanar sensors 22 closest to the wafer 13 to be peeled are coplanar on a plane parallel to the first plate surface 214, the three coplanar sensors 22 will be triggered at the same time only when the wafer 13 to be peeled is parallel to the position adjustment plate 21. Since the position adjustment plate 21 has been rotated to be parallel to the first plate surface 214 and the set vertical reference plane, the position adjustment plate 21 is parallel to the wafer 13 to be peeled before it is rotated again, indicating that the surface of the wafer 13 to be peeled is parallel to the first plate surface 214 and is in the vertical state required for wafer removal, and no adjustment is required.

[0114] 2) If Figure 8 As shown, the third sensor 29 is triggered, and the first sensor 27 and the second sensor 28 are not triggered, indicating that only the lower half of the wafer 13 to be peeled is in contact with the coplanar sensor 22, and the upper half has not yet contacted the coplanar sensor 22. Therefore, the wafer 13 to be peeled is in a tilted state with the upper half away from the position adjustment plate 21, and the wafer 13 to be peeled needs to be rotated clockwise;

[0115] 3) If Fig. 9 As shown, the first sensor 27 and the second sensor 28 are triggered, and the third sensor 29 is not triggered, indicating that only the upper half of the wafer 13 to be peeled off is in contact with the coplanar sensor 22, and the lower half has not yet contacted the coplanar sensor 22. Therefore, the wafer 13 to be peeled off is in a tilted state with the lower half away from the position adjustment plate 21, and the wafer 13 to be peeled off needs to be rotated counterclockwise.

[0116] In one embodiment, when the first sensor 27, the second sensor 28 and the third sensor 29 are provided and the position adjustment plate 21 rotates with the upper edge 211 as the axis:

[0117] 1) When entering step 5 according to the judgment result in step 3, if Figure 8 As shown, the third sensor 29 is triggered, and the first sensor 27 and the second sensor 28 are not triggered, then in step 5, the rotation drive structure 23 drives the position adjustment plate 21 to rotate counterclockwise by a first angle, and at the same time, the crystal rod 12 is driven to move forward by a first distance in a direction close to the position adjustment plate 21;

[0118] like Fig.10 As shown, if the position adjustment plate 21 triggers at least one coplanar sensor 22 before rotating to the point where it cannot rotate anymore, the process returns to step 2. When it is sensed that the three coplanar sensors 22 are triggered by the wafer 13 to be peeled off at the same time, the position adjustment plate 21 and the crystal rod 12 stop moving, and after entering step 4, the process enters step 6 according to the judgment result of step 4; the rotation driving structure 23 rotates the position adjustment plate 21 clockwise according to the vertical position difference sensed by the motion sensor 24, and the crystal rod 12 is driven to move backward in the direction away from the position adjustment plate 21, and the wafer auxiliary structure 25 pushes the wafer 13 to be peeled off to keep parallel with the position adjustment plate 21 and rotate clockwise, as shown in FIG. Fig.11 As shown, after the position adjustment plate 21 and the wafer 13 to be peeled are rotated clockwise by the first angle and the crystal rod 12 retreats the first distance away from the position adjustment plate 21, the motion sensor 24 senses that the first plate surface 214 of the position adjustment plate 21 is parallel to the set vertical reference plane and then returns to step 2;

[0119] If the position adjustment plate 21 does not trigger any coplanar sensor 22 after being rotated to the point where it cannot rotate any more, an abnormal situation alarm is issued.

[0120] 2) When entering step 5 according to the judgment result in step 3, if Fig. 9 As shown, the first sensor 27 and the second sensor 28 are triggered, and the third sensor 29 is not triggered, then in step 5, the rotation drive structure 23 drives the position adjustment plate 21 to rotate clockwise by a second angle, and at the same time, the crystal rod 12 is driven to move backward by a second distance away from the position adjustment plate 21;

[0121] like Fig.12 As shown, if the position adjustment plate 21 triggers at least one coplanar sensor 22 before rotating to the point where it cannot rotate anymore, the process returns to step 2. When it senses that three coplanar sensors 22 are triggered by the wafer 13 to be peeled off at the same time, the position adjustment plate 21 and the crystal rod 12 stop moving, and after entering step 4, the process proceeds to step 6 according to the judgment result of step 4. The rotation drive structure 23 rotates the position adjustment plate 21 counterclockwise according to the vertical position difference sensed by the motion sensor 24, and the crystal rod 12 is driven to move forward in the direction close to the position adjustment plate 21. At the same time, the wafer auxiliary structure 25 pushes the wafer 13 to be peeled off to keep parallel with the position adjustment plate 21 and rotate counterclockwise, as shown in FIG. Fig.13As shown, after the position adjustment plate 21 and the wafer 13 to be peeled are rotated counterclockwise by a second angle and the crystal rod 12 moves forward a second distance toward the position adjustment plate 21, the motion sensor 24 senses that the first plate surface 214 of the position adjustment plate 21 is parallel to the set vertical reference plane and returns to step 2.

[0122] If the position adjustment plate 21 does not trigger any coplanar sensor 22 after being rotated to the point where it cannot rotate any more, an abnormal situation alarm is issued.

[0123] Specifically, when an abnormal situation alarm is sounded, it means that the angle that the wafer 13 to be peeled off needs to be rotated exceeds the maximum angle range that the position adjustment plate 21 can rotate. At this time, manual intervention is required to adjust the position of the wafer 13 to be peeled off.

[0124] Specifically, other abnormal alarm logics may also be set according to other abnormal situations that occur in actual applications, all of which are within the protection scope of the present invention.

[0125] In one embodiment, the motion sensor 24 can always sense the vertical position of the position adjustment plate 21 .

[0126] In one embodiment, the motion sensor 24 can be set to start sensing in the initial state, when the rotation position adjustment plate 21 to the coplanar sensor 22 in step 4 is simultaneously triggered by the wafer 13 to be peeled off, or under other required triggering conditions, and is set according to specific operation control logic.

[0127] In summary, the wafer vertical peeling mechanism and wafer vertical peeling method of the present invention can sense the parallel relationship between the wafer to be peeled and the position adjustment plate by setting a coplanar sensor at a preset position on the position adjustment plate, the rotary drive structure rotates the position adjustment plate to be parallel to the wafer to be peeled, the motion sensor senses the vertical position of the position adjustment plate, and the wafer auxiliary structure pushes the wafer to be peeled to rotate parallel to the position adjustment plate to a vertical position for peeling and film taking, thereby improving the efficiency of automatic vertical adjustment before vertical wafer peeling, and avoiding problems such as wafer breakage, edge collapse, dark cracks or film taking failure caused by tilting during the peeling process; at the same time, by setting a swing roller as a trigger body for triggering the coplanar sensor of the wafer to be peeled, its rolling setting can reduce the stress on the wafer to be peeled and improve the yield of the wafer to be peeled; in addition, by setting the materials of the position adjustment plate and the swing roller, the stress on the wafer to be peeled when it contacts the swing roller or the position adjustment plate is further reduced, thereby reducing the risk of wafer damage; finally, by setting the film taking groove with an upper opening, the stripping and film taking structure can be convenient for the wafer to pass through the position adjustment plate to strip the wafer to be peeled, thereby improving the wafer stripping efficiency and yield.

[0128] Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0129] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer vertical peeling mechanism, characterized in that: The wafer vertical peeling mechanism includes a position adjustment plate, at least three coplanar sensors, a driving structure, a motion sensor and a wafer auxiliary structure; Each of the coplanar sensors respectively penetrates and protrudes from the first plate surface of the position adjustment plate, and the points of all the coplanar sensors closest to the wafer to be peeled are coplanar on a plane parallel to the first plate surface but do not pass through the same straight line, and each of the coplanar sensors is used to detect whether the wafer to be peeled closest to the position adjustment plate is in contact with the corresponding coplanar sensor; The driving structure includes a rotation driving structure, which is used to drive the position adjustment plate to rotate around a preset straight line on the first plate surface; the motion sensor is used to detect the position relationship between the first plate surface of the position adjustment plate and a set vertical reference plane; the wafer auxiliary structure is used to push the wafer closest to the to-be-peeled wafer to rotate parallel to the position adjustment plate until it is parallel to the set vertical reference plane.

2. The wafer vertical peeling mechanism according to claim 1, characterized in that: The position adjustment plate is provided with through slots having the same number as the coplanar sensors at preset positions, the central axis of each through slot being perpendicular to the first plate surface, and the through slots are used to set the coplanar sensors; The coplanar sensor includes a swing guide rod, a swing bracket, a roller guide rod, a swing roller, a displacement trigger structure and a displacement sensing receiving structure; the swing guide rod is parallel to the first plate surface and fixedly mounted in the through slot along a first direction; the swing bracket includes a swing through hole and a swing frame, the swing guide rod passes through the swing through hole, and the swing bracket can swing and rotate with the swing guide rod as the axis, and the central axis of the swing frame is parallel to the central axis of the through slot; the roller guide rod is fixedly connected to the swing bracket in the swing frame along the first direction, the swing roller includes a rotating through hole passing through the central axis, the roller guide rod passes through the rotating through hole, and the swing roller can rotate with the roller guide rod as the axis; the displacement trigger structure is fixed to the swing bracket, the displacement sensing receiving structure is fixed to the position of the position adjustment plate close to the corresponding through slot, and the displacement sensing receiving structure is used to sense the position movement state of the displacement trigger structure.

3. The wafer vertical peeling mechanism according to claim 2, characterized in that: The material of the position adjustment plate is polytetrafluoroethylene; and / or the material of the rocking roller is nitrile rubber.

4. The wafer vertical peeling mechanism according to claim 1, characterized in that: The wafer vertical peeling mechanism includes three coplanar sensors, namely a first sensor, a second sensor, and a third sensor, wherein the first sensor and the second sensor are located at preset positions on the upper half of the position adjustment plate, and the third sensor is located at a preset position on the lower half of the position adjustment plate; a line connecting the first sensor and the second sensor is parallel to a first direction, and a perpendicular bisector of the line connecting the first sensor and the second sensor passes through the third sensor.

5. The wafer vertical peeling mechanism according to claim 1, characterized in that: The driving structure further includes a linear driving structure, and the linear driving structure is used to drive the crystal rod for wafer stripping to move linearly along a first direction.

6. The wafer vertical peeling mechanism according to claim 1, characterized in that: The motion sensor is a gravity sensor.

7. The wafer vertical peeling mechanism according to claim 1, characterized in that: The wafer auxiliary structure is an air knife, and the air knife pushes the wafer to be peeled to rotate parallel to the position adjustment plate through airflow pressure until it is parallel to the set vertical reference plane.

8. The wafer vertical peeling mechanism according to claim 1, characterized in that: A film taking groove with an upper opening is arranged at the position where the position adjustment plate is not provided with the coplanar sensor. The film taking groove penetrates the position adjustment plate along a first direction. The film taking groove is a moving space for a stripping film taking structure to pass through the position adjustment plate to perform a film taking operation on a wafer to be stripped which is adjusted vertically.

9. The wafer vertical peeling mechanism according to claim 1, characterized in that: The wafer vertical peeling mechanism also includes an alarm structure, and the alarm structure is used to alarm when the sensing structures of the coplanar sensor and the motion sensor are outside a preset judgment range.

10. A wafer vertical peeling method, characterized in that: The wafer vertical peeling method adopts the wafer vertical peeling mechanism according to any one of claims 1 to 9 to perform wafer vertical peeling, and the wafer vertical peeling method comprises: Step 1: providing a crystal rod of a wafer to be peeled, wherein a position of the crystal rod closest to the position adjustment plate has a cut wafer to be peeled; moving the crystal rod of the wafer to be peeled so that the wafer to be peeled triggers at least one of the coplanar sensors; Step 2: judging whether the wafer to be peeled is parallel to the first plate surface of the position adjustment plate according to the contact sensing state of each of the coplanar sensors; Step 3: If it is determined that the wafer to be peeled is parallel to the first plate surface of the position adjustment plate, proceed to step 4; if it is determined that the wafer to be peeled is not parallel to the first plate surface of the position adjustment plate, proceed to step 5; Step 4: Determine whether the first plate surface of the position adjustment plate sensed by the motion sensor is parallel to the set vertical reference plane; if it is determined that the first plate surface is not parallel to the set vertical reference plane, proceed to step 6; if it is determined that the first plate surface is parallel to the set vertical reference plane, proceed to step 7; Step 5: Rotate the position adjustment plate according to the contact sensing state sensed by each of the coplanar sensors, and simultaneously move the overall position of the crystal rod of the wafer to be peeled off; if the wafer to be peeled off triggers at least one of the coplanar sensors before the position adjustment plate is rotated to be unable to rotate, return to step 2; if the wafer to be peeled off does not trigger any of the coplanar sensors after the position adjustment plate is rotated to be unable to rotate, issue an abnormal situation alarm; Step 6: driving the position adjustment plate to rotate according to the vertical position sensed by the motion sensor, and at the same time, the wafer auxiliary structure drives the wafer to be peeled to rotate synchronously and parallel to the position adjustment plate, until the motion sensor senses that the first plate surface of the position adjustment plate is parallel to the set vertical reference plane, and then returning to step 2; Step 7: vertically peeling the wafer to be peeled off.

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