Manufacturing method of fan-out type packaging structure and fan-out type packaging structure

Abstract

The invention provides a manufacturing method of a fan-out type packaging structure and the fan-out type packaging structure, the fan-out type packaging structure comprises a rewiring layer, at least one plastic packaging layer, at least one first shielding layer, at least one chip and at least one electric connecting piece, the rewiring layer comprises a grounding circuit layer, the chip and the electric connecting piece are arranged on the first surface of the rewiring layer, and the grounding circuit layer is arranged on the second surface of the rewiring layer. The electric connecting piece is positioned on the outer side of the chip and is electrically connected to the grounding circuit layer; the plastic packaging layer is arranged on the first surface of the rewiring layer and packages the electric connecting piece and the chip; the first shielding layer at least partially covers the side surface of the plastic package layer; at least part of the electric connecting piece is exposed out of the side face of the plastic packaging layer and is electrically connected to the first shielding layer, and the first shielding layer and the grounding circuit layer are electrically conducted through the electric connecting piece. The first shielding layer is connected to the grounding line layer through the electric connecting piece, so that the electric connecting piece can be utilized to realize relatively large-area surface contact with the first shielding layer and the grounding line layer respectively, the resistance among the three layers is reduced, and the shielding effect is improved.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular to a manufacturing method of a fan-out packaging structure and a fan-out packaging structure. Background Art

[0002] As integrated circuits further develop towards high density and high integration, the packaging structure of chips and electronic devices also develops towards higher density. Fan-out wafer-level packaging and board-level packaging technology have become important packaging methods for high-demand mobile / wireless network and other electronic devices due to their advantages of miniaturization, low cost and high integration, as well as better performance and higher energy efficiency. It is one of the most promising packaging technologies at present.

[0003] At the same time, heavily digitalized and high-frequency electronic components radiate a large amount of electromagnetic waves of different frequencies and wavelengths into space when working. Severe electromagnetic radiation will interfere with the performance of electronic components. The demand for electromagnetic shielding devices in communications and consumer electronics continues to grow, and the requirements for electromagnetic shielding are also getting higher and higher.

[0004] However, compared with traditional substrates, in wafer-level or board-level fan-out packaging, especially the high-density redistribution layer is thinner. When the electromagnetic shielding film layer is deposited on the side and back of the package, the contact area between the conductive layer and the circuit layer is small, and the resistance will be higher, thus affecting the shielding effect. Summary of the invention

[0005] The object of the present invention is to provide a method for manufacturing a fan-out packaging structure and a fan-out packaging structure.

[0006] The present invention provides a method for manufacturing a fan-out packaging structure, comprising the steps of:

[0007] Providing a carrier board, manufacturing a patterned metal circuit layer and a dielectric layer on the carrier board, stacking them to form a redistribution layer, and forming a ground circuit layer with the metal circuit layer at least partially close to, covering or crossing at least a portion of the cutting path;

[0008] Placing a chip, and / or a chip package, and / or a passive device on the first surface of the redistribution layer, and electrically connecting the chip to the metal circuit layer;

[0009] An electrical connector is disposed on the first surface of the redistribution layer, covering or crossing at least a portion of the cutting path, and electrically connected to the ground circuit layer;

[0010] Plastic-sealing the chip and the electrical connector to form a plastic-sealing layer;

[0011] removing the carrier board and forming a first electrical contact block on a second surface opposite to the first surface of the redistribution layer;

[0012] Cutting the complete package body along the cutting path to form a single package structure;

[0013] A first shielding layer is formed outside the plastic encapsulation layer of the single packaging structure, wherein the first shielding layer at least covers the side surface of the plastic encapsulation layer to electrically connect a portion of the electrical connectors exposed on the side surface of the plastic encapsulation layer;

[0014] “Providing an electrical connector on the first surface of the redistribution layer” specifically includes:

[0015] Making a second through hole on the main body member that passes through the upper and lower surfaces thereof, plating metal in the second through hole, and providing a second metal layer on the upper and lower surfaces of the main body member, wherein the second metal layer covers or crosses over at least a portion of the cutting path;

[0016] A second electrical contact block is made on the second metal layer on the lower surface of the main body, and the electrical contact is bonded to the grounding circuit layer through the second electrical contact block.

[0017] As a further improvement of the present invention, the thickness of the metal circuit layer is less than 10 μm, and the minimum line spacing is less than 15 μm.

[0018] As a further improvement of the present invention, the material of the dielectric layer includes one or more combinations of organic polymer resin, organic polymer resin with inorganic filler, organic polymer resin with glass fiber cloth and filler sheet, and polyimide; the material of the metal circuit layer includes one or more combinations of copper, titanium, and titanium tungsten.

[0019] As a further improvement of the present invention, the material of the main body is an organic polymer resin with inorganic fillers, or an organic polymer resin with glass fiber cloth and filler sheets.

[0020] As a further improvement of the present invention, before manufacturing the first shielding layer, the method further includes the following steps:

[0021] Making one or more shielding layers on the plastic sealing layer to form a second shielding layer;

[0022] Making a plurality of shielding layer grooves or shielding layer through holes on the second shielding layer;

[0023] The first shielding layer material is filled or plated on the shielding layer groove or the shielding layer through hole.

[0024] As a further improvement of the present invention, the second shielding layer has a shielding coefficient different from that of the first shielding layer at least in a part of the frequency range.

[0025] The present invention provides a fan-out packaging structure, which is manufactured according to any of the above-mentioned methods for manufacturing a fan-out packaging structure.

[0026] As a further improvement of the present invention, the second metal layer is exposed to the side surface of the plastic packaging layer and is electrically connected to the first shielding layer.

[0027] As a further improvement of the present invention, a green oil material layer is provided on the upper and lower surfaces of the main body that are not covered with the second metal layer and on a portion of the surface of the second metal layer.

[0028] As a further improvement of the present invention, the electrical connectors are located at four corners and / or four sides of the redistribution layer and are distributed substantially symmetrically with respect to the center of the redistribution layer.

[0029] The beneficial effect of the present invention is that the first shielding layer is connected to the grounding circuit layer through the electrical connector, so that the electrical connector can be used to achieve a relatively large surface contact with the first shielding layer and the grounding circuit layer respectively, thereby reducing the resistance between the three, to improve the shielding effect of the first shielding layer, and avoid directly connecting the first shielding layer to the thin metal circuit layer at the side to cause a higher resistance. At the same time, the electrical connector in the present invention uses conventional low-cost materials, has a simple process, is easy to implement, and is suitable for large-scale industrial manufacturing processes. In addition, the first shielding layer and the second shielding layer can cooperate to effectively shield electromagnetic waves in different frequency ranges. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the fan-out packaging structure in the first embodiment of the present invention.

[0031] Figures 2 to 4 Schematic diagram of different distribution positions of electrical connectors in the present invention

[0032] Figure 5 yes Figure 1 An enlarged schematic diagram of the electrical connector in FIG.

[0033] Figure 6 It is a top view of the main body in the first embodiment of the present invention.

[0034] Figure 7 , Fig. 9 , Fig.11 They are respectively schematic diagrams of another implementation of the fan-out packaging structure in the first embodiment of the present invention.

[0035] Figure 8 , Fig.10 , Fig.12 They are Figure 7 , Fig. 9 , Fig.11 An enlarged schematic diagram of the electrical connector in FIG.

[0036] Fig.13It is a schematic diagram of the fan-out packaging structure in the second embodiment of the present invention.

[0037] Fig.14 yes Fig.13 An enlarged schematic diagram of the electrical connector in FIG.

[0038] Fig.15 , Fig.16 , Fig.17 , Fig.18 They are schematic diagrams of the fan-out packaging structures in the third, fourth, fifth and sixth embodiments of the present invention respectively.

[0039] Fig.19 It is a schematic flow chart of a method for manufacturing a fan-out packaging structure provided by the present invention.

[0040] Figures 20 to 27 It is a schematic diagram of each step of a method for manufacturing a fan-out packaging structure provided by the present invention.

[0041] Figure 28-Figure 35 It is a schematic diagram of various steps for setting electrical connectors in a method for manufacturing a fan-out packaging structure provided by the present invention. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in combination with the specific implementation methods of this application and the corresponding drawings. Obviously, the described implementation methods are only part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0043] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0044] For ease of explanation, this document uses terms that represent relative positions in space for description, such as "above", "below", "back", "front", etc., to describe the relationship of one unit or feature shown in the drawings relative to another unit or feature. Terms of relative positions in space can include different orientations of the device in use or operation other than the orientation shown in the figure. For example, if the device in the figure is turned over, the unit described as being "below" or "above" other units or features will be located "below" or "above" the other units or features. Therefore, the exemplary term "below" can encompass both the spatial orientations of below and above.

[0045] like Figure 1 As shown, the present invention provides a fan-out packaging structure, which includes a redistribution layer 1, at least one chip 2, a plastic packaging layer 4, a first shielding layer 51 and at least one electrical connector 3.

[0046] The chip 2 may be a chip package.

[0047] The redistribution layer 1 includes a patterned metal wiring layer 11 and a patterned dielectric layer 12 . The metal wiring layer 11 and the dielectric layer 12 are alternately stacked to form the redistribution layer 1 . At least a portion of the metal wiring layer 11 forms a ground wiring layer 111 .

[0048] The metal circuit layer 11 and the dielectric layer 12 can be a single layer or multiple layers.

[0049] Specifically, the thickness of the metal circuit layer 11 is less than 10 μm, and the minimum line spacing is less than 15 μm. The redistribution layer 1 under this size condition can meet the wiring requirements of high density and high integration.

[0050] Furthermore, a plurality of first electrical contact blocks 13 are disposed on a second surface relative to the first surface of the redistribution layer 1 , and the first electrical contact blocks 13 are electrically connected to the metal circuit layer 11 .

[0051] The first electrical contact block 13 may be a solder ball with a lower metal layer 33 or a composite structure with a tin cap, such as a copper-nickel-tin-silver structure, etc., as long as it is an interconnection structure that can form an electrical connection with the outside world.

[0052] The material of the dielectric layer 12 includes one or more combinations of organic polymer resin, organic polymer resin with inorganic filler, polymer resin with glass fiber cloth and organic filler sheet, and polyimide. The material of the metal circuit layer 11 includes one or more combinations of copper, titanium, and titanium tungsten.

[0053] The chip 2 is disposed on the first surface of the redistribution layer 1 and is electrically connected to the metal circuit layer 11 . When there are at least two chips 2 , the metal circuit layer 11 provides electrical interconnection between the multiple chips 2 .

[0054] In some other embodiments of the present invention, other passive components such as capacitors, resistors, etc., or other functional components such as heat sinks, reinforcing ribs, etc. may be arranged on the redistribution layer 1.

[0055] In some embodiments of the present invention, an underfill 21 is further provided between the chip 2, the chip package, the passive components, the functional devices and the redistribution layer.

[0056] The metal circuit layer 11 includes a partial ground circuit layer 111 , and the ground circuit layer 111 is disposed on the outer side of the metal circuit layer 11 connected to the chip 2 or the passive components.

[0057] The electrical connection member 3 is disposed on the first surface of the redistribution layer 1 , outside the chip 2 , and electrically connected to the ground circuit layer 111 .

[0058] The plastic encapsulation layer 4 is arranged on the first surface of the redistribution layer 1, encapsulating the electrical connector 3 and the chip 2. The plastic encapsulation layer 4 is filled with a plastic encapsulation material, which can be a polymer composite material with fillers such as epoxy resin, polyimide, dry film, etc. The plastic encapsulation layer 4 provides physical support for the packaging structure and protects the chip 2, the electrical connector 3, the passive components, etc.

[0059] Furthermore, in this embodiment, the plastic encapsulation layer 4 covers the side surface and the upper surface of the chip 2 , and fills the area between the chip 2 and the redistribution layer 1 .

[0060] Furthermore, the plastic encapsulation layer 4 covers most of the surface of the electrical connector 3, and the electrical connector 3 is at least partially exposed to the side of the plastic encapsulation layer 4. The exposed portion is conductive, and a conductive path is formed in the electrical connector 3 from the end of the electrical connector 3 connected to the ground circuit layer 111 to the end of the electrical connector 3 exposed to the plastic encapsulation layer 4.

[0061] The first shielding layer 51 at least partially covers the side surface of the plastic packaging layer 4 .

[0062] Furthermore, in this embodiment, the first shielding layer 51 covers the side surface and the upper surface of the plastic packaging layer 4, and basically covers all surfaces of the plastic packaging layer 4 by forming a multi-sided coating on the packaging structure, thereby providing protection against electromagnetic interference for the chip 2 or other passive components packaged therein, and the full coverage structure can further enhance the shielding effect of the first shielding layer 51.

[0063] The first shielding layer 51 can be a sputtered interlayer metal film material such as copper, stainless steel, titanium, such as stainless steel / copper / stainless steel, titanium / copper / titanium, etc., or it can be a conductive composite material such as a conductive resin containing high-density metal fillers such as silver / copper, or it can be a combination of at least two of the above materials, as long as it can shield or absorb electromagnetic waves.

[0064] In some other embodiments of the present invention, a second shielding layer 52 is further provided between the first shielding layer 51 and the plastic sealing layer 4. The second shielding layer 52 is a single-layer shielding layer or a multi-layer composite shielding layer. The second shielding layer 52 has a different shielding coefficient from the first shielding layer 51 at least in a part of the frequency range, so that they can cooperate to shield electromagnetic waves in a wider frequency range.

[0065] Furthermore, a plurality of shielding layer grooves or shielding layer through holes 53 are provided in the second shielding layer 52, and the first shielding layer 51 is filled in the shielding layer grooves or the shielding layer through holes 53, or the first shielding layer 51 is plated on the inner wall surface of the shielding layer grooves or the shielding layer through holes 53. Thus, the electrical contact area between the first shielding layer 51 and the second shielding layer 52 can be increased, and the conductivity between the two can be improved. At the same time, the structure of the grooves or holes will not cause significant damage to the shielding performance of the second shielding layer.

[0066] The end of the electrical connector 3 exposed in the plastic packaging layer 4 is electrically connected to the first shielding layer 51, and the first shielding layer 51 and the grounding circuit layer 111 are electrically conductive through the electrical connector 3, so that the first shielding layer 51 is electrically connected to an external low-impedance grounding point through the electrical connector 3 and the grounding circuit layer 111.

[0067] Furthermore, the upper end surface of the electrical connector 3 is lower than the upper end surface of the chip 2 .

[0068] Preferably, the distance between the upper end surface of the electrical connector 3 and the upper end surface of the chip 2 is greater than or equal to 15 μm.

[0069] Here, since the thickness of the redistribution layer 1 is relatively thin and the thickness of the metal circuit layer 11 is less than 10 μm, the first shielding layer 51 is connected to the ground circuit layer 111 through the electrical connector 3, so that the electrical connector 3 can be used to achieve relatively large-area surface contact with the first shielding layer 51 and the ground circuit layer 111 respectively, thereby reducing the resistance between the three, to improve the shielding effect of the first shielding layer 51, and to avoid directly connecting the first shielding layer 51 to the thin metal circuit layer 11 at the side to cause a higher resistance.

[0070] like Figures 2 to 4As shown, in some embodiments of the present invention, the electrical connectors 3 are located at multiple locations on the four corners and / or four sides of the redistribution layer 1, and are distributed substantially symmetrically with respect to the center of the redistribution layer 1. Since the material of the electrical connectors 3 has a relatively large thermal expansion coefficient, the warping can be suppressed to a certain extent. In addition, the distribution position and size of the electrical connectors 3 can be adjusted accordingly according to the size structure and distribution of the components on the redistribution layer 1.

[0071] In the present invention, the electrical connector 3 has multiple implementations, which will be described in detail below in conjunction with multiple specific embodiments.

[0072] like Figures 5 and 6 As shown, in the first embodiment, the electrical connector 3 includes a main body 31 , and a through hole 311 penetrating through the upper and lower surfaces of the main body 31 is provided on one side of the main body 31 facing the side wall of the first shielding layer 51 adjacent thereto.

[0073] The material of the main body 31 is an organic polymer resin with inorganic fillers, or an organic polymer resin with glass fiber cloth and fillers, a polymer material such as a synthetic resin, or other low-cost basic materials with a certain structural strength such as silicon and ceramics, so as to provide structural support for the electrical connector 3.

[0074] The first through hole 311 is filled with a conductive filler 32 , and the side surface of the conductive filler 32 is exposed and electrically connected to the first shielding layer 51 .

[0075] The bottom of the main body 31 is covered by the conductive filler 32 and is electrically connected to the grounding circuit layer 111 through the conductive filler 32 , so that the first shielding layer 51 is electrically connected to the grounding circuit layer 111 through the conductive filler 32 .

[0076] The conductive filler 32 is a conductive filler such as silver and / or copper conductive glue or metal solder.

[0077] A first metal layer 33 may be optionally provided at one or more of the upper surface, the lower surface and the side wall of the first through hole 311 of the main body 31. The first metal layer 33 may be a layer formed of other suitable conductive materials such as copper, silver, tin, nickel, or a composite layer formed of multiple materials.

[0078] Furthermore, in the first embodiment, the upper surface, the lower surface and the side wall of the through hole 311 of the main body 31 are provided with a metal layer 33. The conductive filler 32 fills the first through hole 311 and partially covers the first metal layer 33 covered on the upper surface of the main body 31. By providing the metal layer 33, the electrical conductivity of the electrical connector 3 can be enhanced.

[0079] like Figure 7 and Figure 8 As shown, in some other implementations of the first embodiment, the conductive filler 32 may also be partially filled in the first through hole 311 , as long as the side surface is connected to the first shielding layer 51 and the bottom surface is connected to the grounding circuit layer 111 .

[0080] like Fig. 9 and Fig.10 As shown, in some other implementations of the first embodiment, the sidewall of the first through hole 311 is plated with a first metal layer 33 , and the conductive filler 32 is completely filled in the first through hole 311 .

[0081] like Fig.11 and Fig.12 As shown, in some other implementations of the first embodiment, the inner wall surface of the first through hole 311 and the upper and lower surfaces of the electrical connector 3 and its adjacent parts are all plated with a metal layer 33, and the surface of the main body 31 not covered with the first metal layer 33 and the surface of part of the first metal layer 33 are provided with a green oil material layer 34 to protect the electrical connector 3. The electrical connector 3 is connected to the first shielding layer 51 through the metal layer 33, and is connected to the grounding circuit layer 111 on the bottom surface of the main body 31 through a conductive adhesive.

[0082] like Fig.13 and Fig.14 As shown, in the second embodiment, the upper and lower surfaces of the main body 31 are provided with a second metal layer 35 , the second metal layer 35 is exposed to the side of the plastic packaging layer 4 , and is electrically connected to the first shielding layer 51 .

[0083] The main body is provided with a second through hole 312 , which connects the upper and lower surfaces of the main body 31 . The second through hole 312 is filled with metal or the inner wall is covered with metal, and electrically connects the second metal layer 35 on the upper and lower surfaces of the main body 31 .

[0084] The main body 31 has a second electrical contact block 36 disposed on a second metal layer 35 on a lower surface thereof. The second electrical contact block 36 is electrically connected to the ground circuit layer 111 .

[0085] A green oil material layer 34 is provided on the upper and lower surfaces of the main body 31 that are not covered with the second metal layer 35 and on a portion of the surface of the second metal layer 35 to protect the electrical connector 3 .

[0086] like Fig.15 As shown, in the third embodiment, the main material of the electrical connector 3 is a conductive material.

[0087] Specifically, the electrical connector 3 is a combination structure of one or more of a metal bump, a part of a solder ball, and a part of a copper core ball 61 bonded to the ground circuit layer.

[0088] It can be understood that, during the manufacturing process, the complete solder ball or the copper core ball 61 is welded on the ground circuit layer 111 and covers the cutting path. After the cutting process, the shape of the electrical connector 3 provided in a single packaging structure is roughly half of the solder ball or half of the copper core ball 61.

[0089] The cut surface of the combined structure of one or more of the metal bumps, partial solder balls, and partial copper core balls 61 is connected to the first shielding layer 51 , and the bottom surface is connected to the grounding circuit layer 111 by welding.

[0090] like Fig.16 As shown, in the fourth embodiment, the main material of the electrical connector 3 is a conductive material.

[0091] Specifically, the electrical connector 3 is a copper bump 62 electroplated on the ground circuit layer. The copper bump 62 can be cylindrical, square, rectangular, elliptical or racetrack-shaped.

[0092] like Fig.17 As shown, in the fifth embodiment, the main material of the electrical connector 3 is a conductive material.

[0093] Specifically, the electrical connector 3 is a portion of a metal welding wire 7 , one end of which is electrically connected to the grounding circuit layer 111 , and the other end of which is exposed to the side of the plastic packaging layer 4 and connected to the first shielding layer 51 .

[0094] It can be understood that, since during the manufacturing process, the two ends of the metal welding wire 7 are respectively bonded to the grounding circuit layer 111 on both sides of the cutting path, after the cutting process, the shape of the electrical connector 3 arranged in a single packaging structure is roughly half of the metal welding wire 7 structure cut from the middle, and the cut surface of the metal welding wire 7 is connected to the first shielding layer 51.

[0095] like Fig.18 As shown, in the sixth embodiment, the electrical connector 3 is a solidified metal paste 8 .

[0096] The solidified metal paste 8 may be, for example, sintered silver or sintered copper or a silver-copper alloy.

[0097] like Fig.19 As shown, the present invention also provides a method for manufacturing a fan-out packaging structure, comprising the steps of:

[0098] S1: Fig. 20As shown, a carrier board 9 is provided, and a patterned metal circuit layer 11 and a dielectric layer 12 are made on the carrier board 9 and stacked to form a redistribution layer 1, and at least a portion of the metal circuit layer 11 close to the cutting path forms a ground circuit layer 111.

[0099] The carrier plate 9 is a low-cost sacrificial substrate with a certain rigidity such as glass, silicon, composite polymer, etc., for structural support.

[0100] Specifically, the thickness of the metal circuit layer 11 is less than 10 μm, and the minimum line spacing is less than 15 μm.

[0101] The material of the dielectric layer 12 includes a combination of one or more of photosensitive or non-photosensitive organic polymer resin, organic polymer resin with inorganic filler, organic polymer resin with glass fiber cloth and filler sheet, and polyimide. The material of the metal circuit layer 11 includes a combination of one or more of copper, titanium, and titanium tungsten.

[0102] S2: Fig.21 As shown, the chip 2 is disposed on the first surface of the redistribution layer 1 and is electrically connected to the metal circuit layer 11 .

[0103] In some other embodiments of the present invention, other passive components such as capacitors, resistors, etc., or other functional components such as heat sinks, reinforcing ribs, etc. may also be arranged on the redistribution layer 1.

[0104] In some other embodiments of the present invention, an underfill material may be filled between the chip 2 or other components and the redistribution layer 1 to protect and strengthen the connection.

[0105] S3: Fig. 22 As shown, the electrical connector 3 is disposed on the first surface of the redistribution layer 1 and covers or covers or crosses at least a portion of the cutting path and is electrically connected to the grounding circuit layer 111 .

[0106] In some embodiments of the present invention, the electrical connectors 3 are located at multiple locations on the four corners and / or four sides of the redistribution layer 1, and are distributed substantially symmetrically with respect to the center of the redistribution layer 1. In addition, the distribution position and size of the electrical connectors 3 can be adjusted accordingly according to the size structure and distribution of the components on the redistribution layer 1.

[0107] S4: Fig.23 As shown, the chip 2 and the electrical connector 3 are plastic-sealed to form a plastic-sealing layer 4 .

[0108] An organic polymer resin with inorganic fillers, or an organic polymer resin with glass fiber cloth and fillers, or a polymer composite material with fillers such as epoxy resin, polyimide (PI), dry film, etc. is used as a plastic encapsulation material and deposited on the first surface of the redistribution layer 1 to encapsulate the electrical connector 3 and the chip 2.

[0109] In some embodiments of the present invention, Fig.24 As shown, after the plastic sealing layer 4 is formed, step S41 is also included:

[0110] One or more shielding layers are made on the plastic packaging layer 4 to form a second shielding layer 52 , and a plurality of shielding layer grooves or shielding layer through holes 53 are made on the second shielding layer.

[0111] Step S41 may also be performed after step S5 , as long as it is performed before manufacturing the first shielding layer 51 .

[0112] S5: Fig.25 As shown, the carrier board 9 is removed, and a first electrical contact block 13 is formed on a second surface opposite to the first surface of the redistribution layer 1 .

[0113] The carrier 9 is peeled off by laser debonding, mechanical peeling, chemical etching, mechanical grinding and other methods to expose the active interface of the metal wiring layer 11 on the second surface of the redistribution layer 1, and the required cleaning is performed, and a solder ball with a ball lower metal layer 33 or a composite metal structure with a tin cap formed by photolithography and electroplating, such as a copper bump, is implanted as the first electrical contact block 13. Optionally, after separation and cleaning, a second redistribution stacking layer is formed between the first electrical contact block 13 and the previous redistribution layer 1,

[0114] S6: Fig.26 As shown, the complete package body is cut along the dicing lines to form individual package structures.

[0115] The complete package structure is divided into individual package structures along the cutting lines by a saw blade or a laser cutting device.

[0116] S7: Fig. 27 As shown, a first shielding layer 51 is formed outside the plastic sealing layer 4 of a single packaging structure, and the first shielding layer 51 at least covers the side surface of the plastic sealing layer 4 .

[0117] The first shielding layer 51 is formed on the plastic sealing layer 4 by a metal deposition process such as electroplating, sputtering, PVD, CVD, or the like, or a conductive composite layer deposition process such as ultrasonic spraying, vacuum lamination, or the like.

[0118] The first shielding layer 51 can be a sputtered interlayer metal film material such as copper, stainless steel, titanium, etc., such as stainless steel / copper / stainless steel, titanium / copper / titanium, etc., or it can be a conductive composite material such as a conductive resin containing high-density metal fillers such as silver / copper, or it can be a combination of at least two of the above materials, as long as it can shield or absorb electromagnetic waves.

[0119] When the second shielding layer 52 is present, the material of the first shielding layer 51 is filled or plated on the shielding layer groove or the shielding layer through hole 53.

[0120] In some other implementations of the present invention, step S7 may also be performed before step S6.

[0121] In the present invention, there are multiple implementations of “arranging the electrical connector 3 on the first surface of the redistribution layer 1 ”, and multiple manufacturing processes will be specifically described below.

[0122] Process 1:

[0123] S2a1: Fig.28 and Fig.29 As shown, a through hole 311 is made on the main body 31 to pass through its upper and lower surfaces, a conductive filler 32 is filled in the first through hole 311, and the conductive filler 32 is coated on the bottom surface of the main body 31, which is electrically connected to the grounding circuit layer 111 through the conductive filler 32, and the conductive filler 32 covers or crosses at least part of the cutting path.

[0124] The material of the main body 31 is a polymer material such as synthetic resin, or other basic materials with low cost and certain structural strength such as silicon, ceramics, etc., for structural support of the electrical connector 3 .

[0125] The first through hole 311 is formed on the main body 31 by laser drilling, mechanical drilling or deep reactive ion etching.

[0126] In some embodiments of the present invention, a metal layer 33 is formed on one or more of the upper surface, the lower surface of the main body 31 and the side wall surface of the first through hole 311 by metal deposition processes such as electroplating, sputtering, PVD, CVD, and filling. The first metal layer 33 can be a layer formed of other suitable conductive materials such as copper, silver, tin, nickel, etc., or a composite layer formed of multiple materials.

[0127] In some embodiments of the present invention, a green oil material layer 34 is provided on the surface of the main body 31 not covered by the first metal layer 33 .

[0128] The first through hole 311 is filled with a conductive filler 32, which is a conductive filler such as conductive glue or metal solder. The conductive filler 32 can completely fill the first through hole 311 and partially cover the first metal layer 33 covered on the upper surface of the main body 31.

[0129] In some other embodiments of the present invention, the conductive filler 32 may also partially fill the first through hole 311 .

[0130] The bottom of the main body 31 is covered by the conductive filler 32 and is electrically connected to the grounding circuit layer 111 through the conductive filler 32 .

[0131] Process 2:

[0132] S2b1: As Fig.30 and Fig.31 As shown, a second through hole 312 is made on the main body 31 and passes through the upper and lower surfaces thereof. The second through hole 312 is filled with metal or the inner wall is covered with metal. A second metal layer 35 is plated on the upper and lower surfaces of the main body 31.

[0133] A second electrical contact block 36 is provided on the second metal layer 35 on the lower surface of the main body 31;

[0134] The electrical connector 3 is bonded to the grounding circuit layer 111 through the second electrical contact block 36 , and the second metal layer 35 covers or crosses the cutting path.

[0135] Process three:

[0136] S2c1: Fig.32 As shown, a combination structure of one or more of metal bumps, solder balls, and copper core balls 61 is electrically connected to the grounding circuit layer 111 and covers the cutting path.

[0137] Process 4:

[0138] S2d1: Fig.33 As shown, a copper bump 62 is electroplated on the ground circuit layer 111 , and the copper bump 62 is located to cover or cross at least a portion of the cutting path.

[0139] Process 5:

[0140] S2e1: As Fig.34 As shown, the grounding line layer 111 on both sides of the cutting road is bonded and connected by conventional metal bonding wires 7 .

[0141] Process six:

[0142] S2f1: Fig.35As shown, a metal paste 8 is coated on the grounding circuit layer 111 and covers or crosses over at least a portion of the cutting path.

[0143] In summary, the present invention connects the first shielding layer to the grounding circuit layer through the electrical connector, so that the electrical connector can be used to achieve relatively large-area surface contact with the first shielding layer and the grounding circuit layer, respectively, thereby reducing the resistance between the three, to improve the shielding effect of the first shielding layer, and to avoid directly connecting the first shielding layer to the thin metal circuit layer at the side to cause a higher resistance. At the same time, the electrical connector in the present invention uses conventional low-cost materials, has a simple process, is easy to implement, and is suitable for large-scale industrial manufacturing processes.

[0144] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0145] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention and are not intended to limit the scope of protection of the present invention. All equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for manufacturing a fan-out packaging structure, characterized in that: Includes steps: Providing a carrier board, manufacturing a patterned metal circuit layer and a dielectric layer on the carrier board, stacking them to form a redistribution layer, and forming a ground circuit layer with the metal circuit layer at least partially close to, covering or crossing at least a portion of the cutting path; Placing a chip, and / or a chip package, and / or a passive device on the first surface of the redistribution layer, and electrically connecting the chip to the metal circuit layer; An electrical connector is disposed on the first surface of the redistribution layer, covering or crossing at least a portion of the cutting path, and electrically connected to the ground circuit layer; Plastic-sealing the chip and the electrical connector to form a plastic-sealing layer; removing the carrier board and forming a first electrical contact block on a second surface opposite to the first surface of the redistribution layer; Cutting the complete package body along the cutting path to form a single package structure; A first shielding layer is formed outside the plastic encapsulation layer of the single packaging structure, wherein the first shielding layer at least covers the side surface of the plastic encapsulation layer to electrically connect a portion of the electrical connectors exposed on the side surface of the plastic encapsulation layer; “Providing an electrical connector on the first surface of the redistribution layer” specifically includes: Making a second through hole on the main body member that passes through the upper and lower surfaces thereof, plating metal in the second through hole, and providing a second metal layer on the upper and lower surfaces of the main body member, wherein the second metal layer covers or crosses over at least a portion of the cutting path; A second electrical contact block is made on the second metal layer on the lower surface of the main body, and the electrical contact is bonded to the grounding circuit layer through the second electrical contact block.

2. The method for manufacturing a fan-out packaging structure according to claim 1, characterized in that: The thickness of the metal circuit layer is less than 10 μm, and the minimum line spacing is less than 15 μm.

3. The method for manufacturing a fan-out packaging structure according to claim 1, characterized in that: The material of the dielectric layer includes one or more combinations of organic polymer resin, organic polymer resin with inorganic filler, organic polymer resin with glass fiber cloth and filler sheet, and polyimide. The material of the metal circuit layer includes one or more combinations of copper, titanium, and titanium tungsten.

4. The method for manufacturing a fan-out packaging structure according to claim 1, characterized in that: The material of the main body is an organic polymer resin with inorganic fillers, or an organic polymer resin with glass fiber cloth and fillers.

5. The method for manufacturing a fan-out packaging structure according to claim 1, characterized in that: Before making the first shielding layer, the method further comprises the following steps: Making one or more shielding layers on the plastic sealing layer to form a second shielding layer; Making a plurality of shielding layer grooves or shielding layer through holes on the second shielding layer; The first shielding layer material is filled or plated on the shielding layer groove or the shielding layer through hole.

6. The method for manufacturing a fan-out packaging structure according to claim 5, characterized in that: The second shielding layer has a shielding coefficient different from that of the first shielding layer at least in a part of the frequency range.

7. A fan-out packaging structure, characterized in that: The fan-out packaging structure is manufactured according to the manufacturing method of any one of claims 1-6.

8. The fan-out packaging structure according to claim 7, characterized in that: The second metal layer is exposed on a side surface of the plastic packaging layer and is electrically connected to the first shielding layer.

9. The fan-out packaging structure according to claim 8, characterized in that: The upper and lower surfaces of the main body that are not covered with the second metal layer and a portion of the surface of the second metal layer are provided with a green oil material layer.

10. The fan-out packaging structure according to claim 7, characterized in that: The electrical connectors are located at four corners and / or four sides of the redistribution layer and are distributed substantially symmetrically with respect to the center of the redistribution layer.

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