Concentrator cavity and laser with automatic adjustment of coolant flow
By using a shape memory alloy spring and an automatic adjustment structure with a liquid-blocking component in the focusing cavity, the problem of difficult coolant flow regulation was solved, temperature stability was improved, and the output performance of the laser was enhanced.
Patent Information
- Application Number
- CN202411852805.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2044-12-16
AI Technical Summary
In existing technologies, it is difficult to monitor the temperature of the working medium inside the focusing cavity in real time, which makes it difficult to adjust the coolant flow rate and affects temperature stability and laser output parameters.
An automatic adjustment structure consisting of a shape memory alloy spring and a liquid blocking component is adopted to adjust the coolant flow rate according to temperature changes. The automatic adjustment of coolant flow rate is achieved through the porous structure of the connecting component and the pump sidewall, ensuring the stability of the working medium temperature.
Automatic adjustment of the coolant flow rate in the focusing cavity was achieved, improving temperature stability and enhancing the output performance of the laser.
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Figure CN119834033B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present specification relates to the technical field of laser, and particularly relates to a light condensing cavity capable of automatically adjusting the flow of cooling liquid and a laser. BACKGROUND
[0002] Generally, the light condensing cavity is composed of a working medium, a pumping light device and a temperature control system, etc. In the working process, the pumping light will produce a large amount of heat when irradiating the working medium, which will directly affect the performance of the working medium and thus affect the output parameters of the laser.
[0003] In the prior art, the temperature of the light condensing cavity is usually controlled by using cooling liquid to ensure the constant temperature state of the light condensing cavity. When the cooling liquid is connected to one end of the light condensing cavity, the cooling liquid will be divided into two paths, one of which is used for heat dissipation of the working medium and the other of which is used for heat dissipation of the pumping side wall. Among them, the heat dissipation of the working medium is the main heat dissipation requirement.
[0004] However, since the inside of the light condensing cavity is in a sealed state, it is difficult to determine the real-time temperature of the working medium, and it is more difficult to adjust the flow of the cooling liquid based on the temperature. SUMMARY
[0005] The present specification provides a light condensing cavity capable of automatically adjusting the flow of cooling liquid and a laser to at least partially solve the above problems existing in the prior art.
[0006] The present specification adopts the following technical solutions:
[0007] The present specification provides a light condensing cavity capable of automatically adjusting the flow of cooling liquid, which comprises a liquid inlet assembly, a communication assembly and a pumping assembly.
[0008] The liquid inlet assembly comprises a sealed shell and n automatic adjusting structures; a total liquid inlet hole, a first liquid outlet hole and n second liquid outlet holes are formed on the outer surface of the sealed shell; the n automatic adjusting structures are arranged in the sealed shell; the automatic adjusting structure comprises a memory spring and a liquid blocking piece; the memory spring can be elongated or shortened with the change of temperature, and the first end of the memory spring is in close contact with the first end of the liquid blocking piece, and the memory spring can push the liquid blocking piece to move in the first direction during the elongation process; the shape of the second end of the liquid blocking piece is adapted to the second liquid outlet hole, and the second end of the liquid blocking piece can gradually block the second liquid outlet hole during the movement in the first direction;
[0009] The communication assembly comprises a sealed tube and a heat conducting piece arranged in the sealed tube; the top end of the sealed tube is in close contact with the first liquid outlet hole, and the top end of the heat conducting piece passes through the first liquid outlet hole and enters the inside of the liquid inlet assembly, and the second end of the n memory springs are adjacent to the heat conducting piece respectively;
[0010] The pumping assembly comprises n pumping side walls; the first surface area and the interior of the pumping side walls are both porous structures; and the first surface area of the pumping side wall is in close contact with the second liquid outlet hole.
[0011] Preferably, the automatic adjusting structure further comprises a return member;
[0012] The first force between the return member and the liquid blocking member can push and / or drive the liquid blocking member to move towards the second direction opposite to the first direction;
[0013] When the temperature of the memory spring is within the preset temperature range, the second force exerted by the memory spring on the liquid blocking member corresponds to the size of the first force;
[0014] After the memory spring absorbs the heat conducted by the heat conduction member, the temperature of the memory spring can be increased to be greater than the preset temperature range, and the second force can be increased with the increase of the temperature of the memory spring, the memory spring is elongated and pushes the liquid blocking member to move towards the first direction, and the second force can be decreased with the elongation of the memory spring until the second force again corresponds to the size of the first force.
[0015] Preferably, the return member is provided with a first magnetic pole, and the liquid blocking member is provided with a second magnetic pole opposite to the first magnetic pole;
[0016] The first magnetic pole and the second magnetic pole have the same magnetism, and the repulsive force between the first magnetic pole and the second magnetic pole can push the liquid blocking member to move towards the second direction opposite to the first direction.
[0017] Preferably, the return member is further provided with a third magnetic pole and a sliding rail;
[0018] The automatic adjusting structure further comprises a close contact heat conduction member;
[0019] The close contact heat conduction member comprises a sliding part, a close contact part and a heat conduction part; the sliding part and the heat conduction part are both fixed to the first side of the close contact part;
[0020] The shape of the sliding part is adapted to the sliding rail, and the sliding part can slide along the sliding rail towards the first direction and the second direction; the second side of the close contact part is adapted to the shape of the heat conduction member, and the second side can be in close contact with the heat conduction member; the sliding part is provided with a fourth magnetic pole opposite to the third magnetic pole, the third magnetic pole and the fourth magnetic pole have the same magnetism, and the repulsive force between the third magnetic pole and the fourth magnetic pole can push and maintain the close contact part in close contact with the heat conduction member; the heat conduction part is a cylindrical structure, and the outer diameter of the heat conduction part is adapted to the inner diameter of the memory spring;
[0021] The memory spring is sleeved outside the heat-conducting part.
[0022] Preferably, the bottom of the sealed shell is further provided with n fixing holes.
[0023] The bottom of the return part is provided with a fixing protrusion, and the shape and / or position and / or size of the fixing protrusion are matched with the fixing hole, and the fixing protrusion can be embedded into the fixing hole.
[0024] Preferably, the light condensing cavity capable of automatically adjusting the flow of cooling liquid further comprises a liquid outlet structure.
[0025] The second surface area of the pump side wall is a loose porous structure.
[0026] The outer surface of the liquid outlet structure is provided with a total liquid outlet hole, a first liquid inlet hole and n second liquid inlet holes; the n second liquid inlet holes are respectively in close contact with the second surface area of the n pump side walls.
[0027] The bottom end of the sealed tube penetrates through the first liquid inlet hole and enters the inside of the liquid outlet structure.
[0028] Preferably, the sealed shell comprises a shell body and a cover plate.
[0029] The liquid outlet structure comprises a structure body and a bottom plate.
[0030] Preferably, the light condensing cavity capable of automatically adjusting the flow of cooling liquid further comprises a working medium.
[0031] The working medium is arranged between the n pump side walls, and the working medium is in close contact with the sealed tube.
[0032] n=3.
[0033] Preferably, the material of the memory spring at least comprises a memory alloy.
[0034] The memory alloy contains iron elements and / or nickel elements.
[0035] In another aspect, the present specification provides a laser comprising the light condensing cavity capable of automatically adjusting the flow of cooling liquid provided in any of the above aspects.
[0036] The above at least one technical scheme adopted by the present specification can achieve the following beneficial effects:
[0037] Based on the above embodiment, the light condensation cavity capable of automatically adjusting the flow of cooling liquid comprises a liquid inlet assembly, a communication assembly and a pumping assembly. The liquid inlet assembly comprises a sealed shell and n automatic adjusting structures. The outer surface of the sealed shell is provided with a total liquid inlet hole, a first liquid outlet hole and n second liquid outlet holes. The n automatic adjusting structures are arranged in the sealed shell. The automatic adjusting structure comprises a memory spring and a liquid blocking piece. The memory spring can be elongated or shortened with the change of temperature, and the first end of the memory spring is in close contact with the first end of the liquid blocking piece. During the elongation process, the liquid blocking piece can be pushed to move in the first direction, and the second end of the liquid blocking piece is adapted to the shape of the second liquid outlet hole. During the movement in the first direction, the second end of the liquid blocking piece can gradually block the second liquid outlet hole. The communication assembly comprises a sealed tube and a heat conducting piece arranged in the sealed tube. The top end of the sealed tube is in close contact with the first liquid outlet hole, and the top end of the heat conducting piece passes through the first liquid outlet hole and enters the inside of the liquid inlet assembly, and is adjacent to the second end of the n memory springs. The pumping assembly comprises n pumping side walls. The first surface area and the inside of the pumping side wall are porous structures, and the first surface area of the pumping side wall is in close contact with the second liquid outlet hole.
[0038] As can be seen from the above, the light condensation cavity can adjust the flow of cooling liquid flowing to the pumping side wall based on the temperature, thereby adjusting the flow of cooling liquid flowing to the sealed tube, adjusting the temperature of the working medium, and improving the stability of the temperature in the light condensation cavity. BRIEF DESCRIPTION OF DRAWINGS
[0039] The drawings described herein are used to provide further understanding of the present specification, constitute a part of the present specification, and the illustrative embodiments of the present specification and the description thereof are used to explain the present specification, and do not constitute an improper limitation on the present specification. In the drawings:
[0040] Figure 1 The structure diagram of the light condensation cavity capable of automatically adjusting the flow of cooling liquid is provided for an embodiment of the present specification;
[0041] Figure 2a The partial structure diagram of the sealed shell is provided for an embodiment of the present specification;
[0042] Figure 2b The partial structure diagram of the sealed shell is provided for an embodiment of the present specification;
[0043] Figure 3 The automatic adjusting process diagram of the automatic adjusting structure is provided for an embodiment of the present specification;
[0044] Figure 4 The partial structure diagram of the light condensation cavity capable of automatically adjusting the flow of cooling liquid is provided for an embodiment of the present specification;
[0045] Figure 5 Part structure diagram of light collecting cavity with automatic adjustment of cooling liquid flow for one embodiment of the present specification;
[0046] Figure 6 Part structure diagram of light collecting cavity with automatic adjustment of cooling liquid flow for one embodiment of the present specification;
[0047] Figure 7 Part structure diagram of light collecting cavity with automatic adjustment of cooling liquid flow for one embodiment of the present specification;
[0048] Figure 8 Part structure diagram of light collecting cavity with automatic adjustment of cooling liquid flow for one embodiment of the present specification;
[0049] Figure 9 Structure diagram of automatic adjustment structure for one embodiment of the present specification.
[0050] Explanation of reference signs:
[0051] Liquid inlet assembly 1; communication assembly 2; pump assembly 3; sealed housing 11; total liquid inlet hole 111; first liquid outlet hole 112; second liquid outlet hole 113; automatic adjustment structure 12; memory spring 121; liquid blocking member 122; sealed tube 21; heat conducting member 22; first magnetic pole 123; second magnetic pole 124; return member 125; third magnetic pole 126; fourth magnetic pole 134; tightly attached heat conducting member 13; heat conducting part 131; tightly attached part 132; sliding part 133; liquid outlet assembly 4; second liquid inlet hole 41; cover plate 114; side plate 5; housing sleeve 14. DETAILED DESCRIPTION
[0052] In order to make the purpose, technical scheme and advantages of the present specification clearer, the technical scheme of the present specification will be described clearly and completely below in combination with specific embodiments of the present specification and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present specification, but not all the embodiments. Based on the embodiments in the present specification, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0053] In the description of the present application, it should be noted that the term “or” is generally used in the sense of including “and / or” unless the context clearly indicates otherwise.
[0054] In the description of the present application, it should be noted that the terms "mounting", "connecting", "connection" should be interpreted in a broad sense unless otherwise explicitly defined and limited. In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish descriptions and can not be understood as indicating or implying relative importance.
[0055] Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0056] The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.
[0057] Figure 1 The structural schematic diagram of the light condensation cavity with automatic adjustment of coolant flow provided by an embodiment of the present application is shown in Figure 1 The light condensation cavity comprises a liquid inlet assembly 1, a communication assembly 2 and a pumping assembly 3.
[0058] Preferably, the liquid inlet assembly 1 comprises a sealed shell 11 and n automatic adjustment structures 12.
[0059] Preferably, the outer surface of the sealed shell 11 is provided with a total liquid inlet hole 111, a first liquid outlet hole 112 and n second liquid outlet holes 113.
[0060] Figure 2a In addition, Figure 2b The partial structural schematic diagram of the sealed shell 11 provided by an embodiment of the present application is shown in Figure 2a In addition, Figure 2b The total liquid inlet hole 111 is provided on the side wall of the sealed shell 11, the first liquid outlet hole 112 is provided at the middle position of the bottom surface of the sealed shell 11, and the n second liquid outlet holes 113 are provided around the bottom surface of the sealed shell 11.
[0061] Preferably, the n automatic adjustment structures 12 are arranged in the sealed shell 11.
[0062] Preferably, the automatic adjustment structure 12 comprises a memory spring 121 and a liquid blocking piece 122.
[0063] Preferably, the memory spring 121 can be elongated or shortened with the change of temperature, and the first end of the memory spring 121 is in close contact with the first end of the liquid blocking piece 122, and the elongation process can push the liquid blocking piece 122 to move towards the first direction.
[0064] Preferably, the second end of the liquid blocking member 122 is shaped to fit the second liquid outlet hole 113, and the second end of the liquid blocking member 122 can gradually block the second liquid outlet hole 113 during the movement towards the first direction.
[0065] Figure 3 The automatic adjustment process of the automatic adjustment structure 12 is shown in the schematic diagram of FIG. 4. Figure 3 As the temperature changes, the length of the memory spring 121 gradually increases, and the liquid blocking member 122 gradually blocks the second liquid outlet hole 113.
[0066] Preferably, the communication assembly 2 includes a sealed tube 21 and a heat conducting member 22 arranged inside the sealed tube 21.
[0067] Preferably, the top end of the sealed tube 21 is in close contact with the first liquid outlet hole 112, and the top end of the heat conducting member 22 penetrates the first liquid outlet hole 112 and enters the inside of the liquid inlet assembly 1, and is adjacent to the second ends of the n memory springs 121 respectively.
[0068] Figure 4 The partial structure of the light condensation cavity with automatic adjustment of the cooling liquid flow is shown in the schematic diagram of FIG. 5. Figure 4 The sealed tube 21 is directly communicated with the first liquid outlet hole 112, and the heat conducting member 22 of the tubular structure penetrates the sealed tube 21.
[0069] Preferably, the pumping assembly 3 includes n pumping side walls.
[0070] Preferably, the first surface area and the inside of the pumping side wall are porous structures.
[0071] Preferably, the first surface area of the pumping side wall is in close contact with the second liquid outlet hole 113, so that the liquid can penetrate into the inside of the pumping side wall through the first surface area.
[0072] Preferably, the light condensation cavity with automatic adjustment of the cooling liquid flow further includes a working medium.
[0073] Preferably, the working medium is arranged between the n pumping side walls, and the working medium is in close contact with the sealed tube 21.
[0074] Based on the above embodiment, the light condensation cavity capable of automatically adjusting the flow of the cooling liquid comprises a liquid inlet assembly 1, a communication assembly 2 and a pumping assembly 3. The liquid inlet assembly 1 comprises a sealed shell 11 and n automatic adjusting structures 12. The outer surface of the sealed shell 11 is provided with a total liquid inlet hole 111, a first liquid outlet hole 112 and n second liquid outlet holes 113. The n automatic adjusting structures 12 are arranged in the sealed shell 11. The automatic adjusting structure 12 comprises a memory spring 121 and a liquid blocking piece 122. The memory spring 121 can be elongated or shortened with the change of temperature, and the first end of the memory spring 121 is in close contact with the first end of the liquid blocking piece 122. During the elongation process, the liquid blocking piece 122 can be pushed to move in the first direction, and the second end of the liquid blocking piece 122 is adapted to the shape of the second liquid outlet hole 113. During the movement of the liquid blocking piece 122 in the first direction, the second end of the liquid blocking piece 122 can gradually block the second liquid outlet hole 113. The communication assembly 2 comprises a sealed tube 21 and a heat conducting piece 22 arranged in the sealed tube 21. The top end of the sealed tube 21 is in close contact with the first liquid outlet hole 112, and the top end of the heat conducting piece 22 penetrates through the first liquid outlet hole 112 and enters the inside of the liquid inlet assembly 1, and is adjacent to the second end of the n memory springs 121 respectively. The pumping assembly 3 comprises n pumping side walls. The first surface area and the inside of the pumping side wall are porous structures, and the first surface area of the pumping side wall is in close contact with the second liquid outlet hole 113.
[0075] As can be seen from the above, the light condensation cavity can adjust the flow of the cooling liquid flowing to the pumping side wall based on the temperature, thereby adjusting the flow of the cooling liquid flowing to the sealed tube 21, adjusting the temperature of the working medium, and improving the stability of the temperature in the light condensation cavity.
[0076] Preferably, the automatic adjusting structure 12 further comprises a return piece 125.
[0077] Preferably, there is a first acting force between the return piece 125 and the liquid blocking piece 122, which can push and / or drive the liquid blocking piece 122 to move in the second direction opposite to the first direction.
[0078] Preferably, when the temperature of the memory spring 121 is in a preset temperature range, the second acting force exerted by the memory spring 121 on the liquid blocking piece 122 corresponds to the size of the first acting force.
[0079] Preferably, when the temperature of the memory spring 121 is in a preset temperature range, the liquid blocking piece 122 does not block the second liquid outlet hole 113.
[0080] Preferably, after absorbing the heat conducted by the heat conducting member 22, the temperature of the memory spring 121 can be increased to be greater than the preset temperature range, and the second force can be increased with the temperature increase of the memory spring 121, the memory spring 121 is elongated and pushes the liquid blocking member 122 to move in the first direction, and the second force can be decreased with the elongation of the memory spring 121, until the second force again corresponds to the size of the first force.
[0081] Preferably, when the temperature of the memory spring 121 decreases to the preset temperature range, the second force decreases, the first force is greater than the second force, the memory spring 121 is shortened, and the second force gradually increases, and the liquid blocking member 122 is moved in the second direction opposite to the first direction under the pushing and / or driving of the first force, until the second force again corresponds to the size of the first force.
[0082] It should be emphasized that there is friction between each part, so the first force and the second force do not need to be exactly equal, and the blocking member can stop moving. That is, the second force corresponding to the first force described in the specification does not mean that the second force and the first force are exactly equal in size and opposite in direction, but under the influence of friction, the second force and the first force, the force balance between each part is zero and no longer deformed.
[0083] Preferably, the return member 125 is provided with a first magnetic pole 123, and the liquid blocking member 122 is provided with a second magnetic pole 124 opposite to the first magnetic pole 123. Moreover, the first magnetic pole 123 and the second magnetic pole 124 have the same magnetic properties, and the repulsion between the first magnetic pole 123 and the second magnetic pole 124 can push the liquid blocking member 122 to move in the second direction opposite to the first direction.
[0084] Preferably, the first force is the repulsion between the first magnetic pole 123 and the second magnetic pole 124. Of course, the first force can also be generated by other structures, which are not limited in the specification.
[0085] Figure 5 The partial structure diagram of the spotlight cavity with automatic adjustment of cooling liquid flow provided by an embodiment of the specification is shown in Figure 5 As shown, the first magnetic pole 123 and the second magnetic pole 124 are oppositely arranged, and the direction of the repulsion between the first magnetic pole 123 and the second magnetic pole 124 is opposite to the direction of the second force generated by the elongation of the memory spring 121. The first magnetic pole 123 is embedded in the return member 125, and the second magnetic pole 124 is fixed to the surface of the liquid blocking member 122.
[0086] Preferably, the returning member 125 is further provided with a third magnetic pole 126 and a sliding rail.
[0087] Preferably, the automatic adjusting structure 12 further comprises a close contact heat conducting member 13.
[0088] Preferably, the close contact heat conducting member 13 comprises a sliding part 133, a close contact part 132 and a heat conducting part 131.
[0089] Preferably, the sliding part 133 and the heat conducting part 131 are both fixed to the first side of the close contact part 132.
[0090] Preferably, the shape of the sliding part 133 is adapted to the sliding rail, and the sliding part 133 is capable of sliding along the sliding rail towards the first direction and the second direction.
[0091] Preferably, the second side of the close contact part 132 is adapted to the shape of the heat conducting member 22, and the close contact part 132 is capable of being in close contact with the heat conducting member 22.
[0092] Preferably, the sliding part 133 is provided with a fourth magnetic pole 134 opposite to the third magnetic pole 126, the magnetic property of the third magnetic pole 126 is the same as that of the fourth magnetic pole 134, and the repulsive force between the third magnetic pole 126 and the fourth magnetic pole 134 is capable of pushing and maintaining the close contact part 132 in close contact with the heat conducting member 22.
[0093] Preferably, the heat conducting part 131 is in a cylindrical structure, and the outer diameter of the heat conducting part 131 is adapted to the inner diameter of the memory spring 121.
[0094] Preferably, the memory spring 121 is sleeved on the outside of the heat conducting part 131.
[0095] Preferably, the material of the heat conducting part 131 and / or the close contact part 132 and / or the heat conducting member 22 is a heat conducting material, and the heat conductivity coefficient of the heat conducting material is greater than or equal to a first parameter. The first parameter is a preset value, which can be 300 W / m·K, 280 W / m·K, etc., and the present specification does not make any limitation.
[0096] Figure 6 A part structure diagram of the automatic adjusting cooling liquid flow spotlight cavity provided by one embodiment of the present specification is shown in Figure 6 The third magnetic pole 126 and the fourth magnetic pole 134 are oppositely arranged, the memory spring 121 is sleeved on the outside of the heat conducting part 131, the close contact part 132 is in close contact with the heat conducting member 22, and the sliding part 133 is capable of sliding along the sliding rail. The third magnetic pole 126 is inlaid in the sliding rail of the returning member 125, and the fourth magnetic pole 134 is fixed to the sliding part 133 of the close contact heat conducting member 13.
[0097] Preferably, the bottom of the sealed shell 11 is further provided with n fixing holes.
[0098] Preferably, the bottom of the returning member 125 is provided with a fixing protrusion, and the shape and / or position and / or size of the fixing protrusion is adapted to the fixing hole, and the fixing protrusion can be inlaid into the fixing hole.
[0099] Preferably, the light collecting cavity with automatically adjusted cooling liquid flow further comprises a liquid outlet structure.
[0100] Preferably, the second surface area of the pump side wall is a loose porous structure.
[0101] Preferably, the outer surface of the liquid outlet structure is provided with a total liquid outlet hole, a first liquid inlet hole and n second liquid inlet holes 41, and the n second liquid inlet holes 41 are respectively in close contact with the second surface area of the n pump side walls.
[0102] Preferably, the bottom end of the sealing tube 21 penetrates through the first liquid inlet hole into the inside of the liquid outlet structure.
[0103] Figure 7 The partial structure diagram of the light collecting cavity with automatically adjusted cooling liquid flow provided by an embodiment of the present application is shown in Figure 7 As shown, the liquid inlet assembly 1 and the liquid outlet assembly 4 are communicated through the sealing tube 21, and the heat conducting member 22 penetrates through the liquid inlet assembly 1 and the liquid outlet assembly 4. Moreover, the second liquid inlet hole 41 is provided on the side surface of the liquid outlet structure.
[0104] Preferably, the first liquid inlet hole is provided on the side surface of the liquid inlet assembly 1.
[0105] Preferably, the sealing shell 11 comprises a shell main body and a cover plate 114.
[0106] Preferably, the liquid outlet structure comprises a structure main body and a bottom plate.
[0107] Preferably, n = 3.
[0108] Preferably, the material of the memory spring 121 at least comprises a memory alloy.
[0109] Preferably, the memory alloy contains iron element and / or nickel element.
[0110] Preferably, the light collecting cavity with automatically adjusted cooling liquid flow comprises a plurality of side plates 5.
[0111] Preferably, the side plates 5 are arranged between the liquid inlet assembly 1 and the liquid outlet assembly 4.
[0112] Figure 8 The partial structure diagram of the light collecting cavity with automatically adjusted cooling liquid flow provided by an embodiment of the present application is shown in Figure 8 As shown, the cover plate 114 seals the top of the sealing shell 11, and the side plates 5 are arranged between the liquid inlet assembly 1 and the liquid outlet assembly 4.
[0113] Preferably, the automatic adjusting structure 12 further comprises n housing sleeves 14.
[0114] Preferably, the housing sleeve 14 can be sleeved to the outside of the memory spring 121 and part of the structure of the close contact heat conducting member 13.
[0115] Figure 9 The structural schematic diagram of the automatic adjusting structure 12 provided by one embodiment of the present application is shown in the figure, in which the close contact heat conducting member 13 is connected with the liquid blocking member 122 and the memory spring 121, and part of the structure of the close contact heat conducting member 13 and the memory spring 121 is sleeved in the housing sleeve 14. Figure 9
[0116] Those skilled in the art can understand that the memory alloy can be deformed with the change of temperature, and the performance parameters such as the degree of deformation and the temperature range corresponding to the deformation can be adjusted, which will not be described herein.
[0117] The above is the light collecting cavity provided by one or more embodiments of the present application, and the corresponding laser is also provided by the present application based on the same idea.
[0118] Preferably, the laser comprises the light collecting cavity provided by any one of the above embodiments.
[0119] It should be noted that all the actions of obtaining signals, information or data in the present application are performed under the premise of complying with the corresponding data protection regulations and policies of the country where the device is located, and with the authorization given by the owner of the corresponding device.
[0120] In the 1990s, it was relatively easy to distinguish whether an improvement in a technology was a hardware improvement (e.g., an improvement in the circuit structure of a diode, transistor, switch, etc.) or a software improvement (an improvement in a method flow). However, as technology has evolved, many improvements in method flows today can be considered as direct improvements in hardware circuit structures. Designers almost always obtain the corresponding hardware circuit structures by programming the improved method flows into hardware circuits. Therefore, it cannot be said that an improvement in a method flow cannot be implemented using hardware entity modules. For example, a programmable logic device (PLD) (e.g., a field programmable gate array (FPGA)) is an integrated circuit whose logic function is determined by user programming of the device. A digital system is "integrated" on a PLD by the designer programming the PLD, rather than by ordering a custom integrated circuit chip from a chip fabricator. Moreover, instead of manually fabricating an integrated circuit chip, this programming is now mostly implemented using "logic compiler" software, which is similar to software compilers used in program development, and the original code to be compiled is written in a specific programming language, which is called a hardware description language (HDL), and there are many such languages, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc., and the most commonly used are VHDL (Very-High-Speed Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art should be aware that, as long as the method flow is logically programmed and programmed into an integrated circuit using the above-mentioned hardware description languages, a hardware circuit that implements the logical method flow can be easily obtained.
[0121] The controller can be implemented in any suitable way, for example, the controller can take the form of a microprocessor or processor and a computer readable medium storing computer readable program code, such as software or firmware, executable by the (micro)processor, logic gates, switches, an application specific integrated circuit (ASIC), a programmable logic controller and an embedded microcontroller, examples of which include but are not limited to the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20 and Silicone Labs C8051F320, the memory controller can also be implemented as part of the control logic of the memory. Those skilled in the art will also know that, in addition to being implemented in pure computer readable program code, the controller can equally well be implemented to perform the same functions using logic gates, switches, an application specific integrated circuit, a programmable logic controller and an embedded microcontroller, etc. by means of a logical programming of the method steps. The controller can thus be considered as a hardware component, and the means comprised therein for performing the various functions can be considered as structures within the hardware component. Alternatively, the means for performing the various functions can even be considered as both a software module implementing the method and a structure within the hardware component.
[0122] The systems, apparatuses, modules or units illustrated by the above embodiments can be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer can be a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.
[0123] For the sake of description, the above apparatuses are described in various units with functions respectively. Of course, the functions of the units can be implemented in one or more software and / or hardware in implementing the present specification.
[0124] Those skilled in the art will understand that the embodiments of the present application can be provided as a method, a system or a computer program product. Therefore, the present application can take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Moreover, the present application can take the form of a computer program product implemented on one or more computer usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage etc.) containing computer usable program code.
[0125] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 one or more flowcharts and / or blocks in the flowcharts and / or combination thereof. Figure 1 one or more flowcharts and / or blocks in the flowcharts and / or combination thereof.
[0126] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 one or more flowcharts and / or blocks in the flowcharts and / or combination thereof. Figure 1 one or more flowcharts and / or blocks in the flowcharts and / or combination thereof.
[0127] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 one or more flowcharts and / or blocks in the flowcharts and / or combination thereof. Figure 1 one or more flowcharts and / or blocks in the flowcharts and / or combination thereof.
[0128] In one typical configuration, the computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.
[0129] The memory can include non-persistent memory and / or volatile memory, such as random access memory (RAM) and / or cache memory, non-volatile memory, such as read-only memory (ROM), EPROM, and / or flash memory. The memory is an example of computer-readable media.
[0130] Computer-readable media includes permanent and non-permanent, movable and non-movable media that can be implemented by any method or technology to store information. The information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information accessible to a computing device. According to the definition herein, computer-readable media does not include transitory media such as modulated data signals and carriers.
[0131] It should also be noted that the terms "comprising", "containing", or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or apparatus that comprises a list of elements does not only include those elements, but can also include other elements not expressly listed or inherent to such process, method, article or apparatus. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article or apparatus that includes the element.
[0132] Those skilled in the art will appreciate that embodiments of the present specification can be provided as methods, systems or computer program products. Therefore, the present specification can take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Moreover, the present specification can take the form of a computer program product implemented on one or more computer-usable storage media (including, but not limited to, magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0133] The present specification can be described in the general context of computer-executable instructions, such as program modules, executed by computers. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types. The present specification can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in both local and remote computer storage media including storage devices.
[0134] The various embodiments described in this specification are described using a numbering of embodiments approach: these are each individually integrated contributions pertaining to different but related aspects of the description. Each of the various embodiments can stand on its own, and each can be combined with the subject matter of other embodiments to produce further embodiments. Where the same numbers appear in different embodiments, such numbers are used for the sake of ease of understanding only and do not imply that the embodiments in which such numbers appear must be the same.
[0135] The above description is embodied in the form of only a few examples of the present description and is not intended to limit the present description. Various modifications and changes can be made by those skilled in the art to which the present description pertains. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present description shall be included in the scope of the claims of the present application.
Claims
1. A light condensing chamber automatically adjusting a flow of a coolant, characterized by, This includes the inlet assembly, the connecting assembly, and the pump assembly; The liquid inlet assembly includes a sealed outer shell and n automatic adjustment structures. The outer surface of the sealed outer shell has a main liquid inlet, a first liquid outlet, and n second liquid outlets. All n automatic adjustment structures are disposed within the sealed outer shell. Each automatic adjustment structure includes a memory spring and a liquid-blocking component. The memory spring can extend or shorten with temperature changes, and its first end is in close contact with the first end of the liquid-blocking component. During extension, the memory spring can push the liquid-blocking component to move in a first direction. The shape of the second end of the liquid-blocking component is adapted to the second liquid outlet. As the liquid-blocking component moves in the first direction, its second end can gradually block the second liquid outlet. The connecting component includes a sealing tube and a heat-conducting element disposed inside the sealing tube; the top end of the sealing tube is in close contact with the first liquid outlet hole, and the top end of the heat-conducting element passes through the first liquid outlet hole, enters the interior of the liquid inlet component, and is adjacent to the second ends of the n memory springs respectively. The pump assembly includes n pump sidewalls; the first surface area and the interior of the pump sidewalls are both loose and porous; the first surface area of the pump sidewalls is in close contact with the second liquid outlet.
2. The light cavity automatically adjusting the flow of cooling liquid according to claim 1, wherein, The automatic adjustment structure also includes a return component; There is a first force between the return component and the liquid blocking component, and the first force can push and / or drive the liquid blocking component to move in a second direction opposite to the first direction; When the temperature of the memory spring is within a preset temperature range, the memory spring applies a second force to the liquid-blocking component, which corresponds to the magnitude of the first force. After absorbing the heat conducted by the heat-conducting component, the temperature of the memory spring can rise to a level greater than the preset temperature range. The second force can increase as the temperature of the memory spring rises. The memory spring extends and pushes the liquid-blocking component to move in the first direction. The second force can decrease as the memory spring extends until the second force corresponds to the magnitude of the first force again.
3. The light cavity automatically adjusting the flow of cooling liquid according to claim 2, characterized in that, The return component is equipped with a first magnetic pole, and the liquid blocking component is equipped with a second magnetic pole opposite to it; The first magnetic pole and the second magnetic pole have the same magnetism, and the repulsive force between the first magnetic pole and the second magnetic pole can push the liquid blocking component to move in a second direction opposite to the first direction.
4. The light cavity automatically adjusting the flow of cooling liquid according to claim 3, characterized in that, The return component is also equipped with a third magnetic pole and a slide rail; The automatic adjustment structure also includes a closely fitted heat-conducting component; The close-fitting heat-conducting component includes a sliding part, a close-fitting part, and a heat-conducting part; both the sliding part and the heat-conducting part are fixed to a first side of the close-fitting part; The shape of the sliding part is adapted to the slide rail, and it can slide along the slide rail in the first and second directions; the second side of the contact part is adapted to the shape of the heat-conducting element, and it can be in close contact with the heat-conducting element; the sliding part is provided with a fourth magnetic pole opposite to the third magnetic pole, the third magnetic pole and the fourth magnetic pole have the same magnetism, and the repulsive force between the third magnetic pole and the fourth magnetic pole can push and maintain the contact part in close contact with the heat-conducting element; the heat-conducting part has a cylindrical structure, and the outer diameter of the heat-conducting part is adapted to the inner diameter of the memory spring; The memory spring is sleeved on the outside of the heat-conducting part.
5. The light cavity automatically adjusting the flow of cooling liquid according to claim 2, wherein, The bottom of the sealed outer shell is also provided with n fixing holes; The bottom of the return piece is provided with a fixing protrusion, and the shape and / or position and / or size of the fixing protrusion is adapted to the fixing hole, and the fixing protrusion can be embedded into the fixing hole.
6. The focusing cavity for automatically adjusting coolant flow rate according to any one of claims 1-5, characterized in that, The focusing cavity that automatically adjusts the coolant flow rate also includes a liquid outlet structure; The second surface region of the pump sidewall has a loose and porous structure; The outer surface of the liquid outlet structure is provided with a main liquid outlet, a first liquid inlet, and n second liquid inlets; the n second liquid inlets are respectively in close contact with the second surface areas of the n pump sidewalls; The bottom end of the sealing tube passes through the first inlet hole and enters the interior of the outlet structure.
7. The focusing cavity for automatically adjusting coolant flow rate according to claim 6, characterized in that, The sealed housing includes a housing body and a cover plate; The liquid outlet structure includes a main body and a base plate.
8. The focusing cavity for automatically adjusting coolant flow rate according to any one of claims 1-5, characterized in that, The focusing cavity that automatically adjusts the coolant flow rate also includes a working medium; The working medium is disposed between the n pump sidewalls, and the working medium is in close contact with the sealing tube; n=3。 9. The focusing cavity for automatically adjusting coolant flow rate according to any one of claims 1-5, characterized in that, The material of the memory spring includes at least a memory alloy; The shape memory alloy contains iron and / or nickel.
10. A laser, characterized in that, The concentrating cavity includes the automatically adjustable coolant flow rate as described in any one of claims 1-9.
Citation Information
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