Heat dissipation device, optical module device, switch and server

Abstract

The present invention provides a heat dissipation device, an optical module device, a switch, and a server, relating to the technical field of heat dissipation devices. The heat dissipation device includes: a first heat dissipation part configured to form heat conduction with a heat generating element; a second heat dissipation part configured to form heat conduction with a cooling element; an elastic part disposed on one of the first heat dissipation part and the second heat dissipation part and extending into the other; wherein the elastic part has an original state and a compressed state of being compressed and deformed. The elastic part in the original state has a first contact area with the other, and the elastic part in the compressed state has a second contact area with the other, and the second contact area is larger than the first contact area, so that the elastic part is connected to the other and forms heat conduction.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation devices, and in particular, to a heat dissipation device. In addition, the present invention also relates to an optical module device, a switch, and a server including the above heat dissipation device. Background Art

[0002] Based on the rate increase of the optical module, the overall power consumption of the optical module also increases accordingly. The traditional air-cooled heat dissipation form has been difficult to meet the heat dissipation requirements of the optical module and the devices equipped with the optical module. For this reason, the prior art has also configured a liquid-cooled heat dissipation form for the optical module.

[0003] Based on the requirements of liquid-cooled heat dissipation, an elastic device that can apply a pressure close to the cooling element is configured on the side of the optical module facing away from the cooling element, so that there is good contact between the optical module and the cooling element, thereby having a high heat dissipation efficiency. However, due to factors such as the flatness of the contact surface between the optical module and the cooling element, the assembly error, and the uniformity of the pressure provided by the elastic device, it is easy to cause poor surface contact between the optical module and the cooling element, thereby reducing the heat dissipation efficiency.

[0004] In view of this, how to provide a heat dissipation device so that the optical module and the devices equipped with the optical module can achieve good heat dissipation has become an urgent technical problem to be solved. Summary of the Invention

[0005] To solve at least one of the above and other technical problems in the prior art, the present invention provides a heat dissipation device, an optical module device, a switch, and a server. The heat dissipation device is located between the heating element and the cooling element, and the elastic part applies a pressure away from each other to the first heat dissipation part and the second heat dissipation part, so that good heat conduction is formed between the heat dissipation device and the heating element and the cooling element. Moreover, since the elastic part in the compressed state has a large contact area with the first heat dissipation part or the second heat dissipation part, the thermal resistance between the first heat dissipation part and the second heat dissipation part is also reduced.

[0006] An embodiment of the present invention provides a heat dissipation device, including: a first heat dissipation part configured to form heat conduction with a heating element; a second heat dissipation part configured to form heat conduction with a cooling element; an elastic part disposed on one of the first heat dissipation part and the second heat dissipation part and extending into a receiving groove formed by the other; wherein the elastic part has an original state and a compressed state of being deformed under pressure. The elastic part in the original state has a first contact area with the other, and the elastic part in the compressed state has a second contact area with the other. The second contact area is larger than the first contact area, so that the elastic part is connected to the other and forms heat conduction.

[0007] In some exemplary embodiments, the accommodating groove has a groove opening and a groove cavity; wherein the width of the groove opening is smaller than the width of the groove cavity.

[0008] In some exemplary embodiments, a through hole is formed by a portion surrounded by the elastic portion and the first heat dissipation portion, or a through hole is formed by a portion surrounded by the elastic portion and the second heat dissipation portion; when the elastic portion is in the compressed state, an area of ​​the through hole is larger than an area of ​​the elastic portion in the original state.

[0009] In some exemplary embodiments, at least a portion of the elastic portion is located in the accommodating groove; when the elastic portion is in the compressed state, the portion of the elastic portion located in the accommodating groove is compressed and deformed along a direction forming an angle with the pressure direction, and is confined to the accommodating groove.

[0010] In some exemplary embodiments, the elastic portion in the compressed state is configured to provide pressure to the first heat dissipation portion close to the heating element, so that the first heat dissipation portion is closely attached to the heating element.

[0011] In some exemplary embodiments, the first heat dissipation portion is detachably connected to the second heat dissipation portion via the elastic portion.

[0012] In some exemplary embodiments, the elastic portion is disposed on one of the first heat dissipation portion and the second heat dissipation portion, and the other of the first heat dissipation portion and the second heat dissipation portion is provided with a receiving groove; wherein the elastic portion faces the receiving groove and extends into the receiving groove.

[0013] In some exemplary embodiments, the elastic portion includes: a connecting end, which is arranged on the first heat dissipation portion or the second heat dissipation portion; a deformation end, which is arranged on the connecting end and extends into the accommodating groove; wherein at least the deformation end is made of elastic material so as to deform when subjected to pressure close to the connecting end, so that at least a portion of the deformation end fits tightly against the inner wall of the accommodating groove.

[0014] In some exemplary embodiments, the depth of the groove cavity is smaller than the height of the deformation end.

[0015] In some exemplary embodiments, the elastic portion is bent to form an elliptical arc segment with an opening to serve as the deformation end, and the opening portion of the elliptical arc segment is bent in a direction away from the opening to form the connection end.

[0016] In some exemplary embodiments, the width of the notch is smaller than the width of the slot cavity; wherein, the length of the major axis of the deformation end is configured to be greater than the depth of the slot cavity, and the length of the minor axis of the deformation end is configured to be greater than the width of the notch and smaller than the width of the slot cavity.

[0017] In some exemplary embodiments, the length of the inner perimeter of the slot cavity is configured to be less than or equal to the length of the elliptical arc segment.

[0018] In some exemplary embodiments, the cross-section of the slot cavity in the slot width direction is configured to be one of a circular shape, an elliptical shape, and a polygonal shape.

[0019] In some exemplary embodiments, the elastic part includes at least two of the connecting ends, and at least one of the deformation ends is provided at one of the connecting ends; wherein, the at least two connecting ends are arranged side by side and spaced apart on the first heat dissipation part or the second heat dissipation part.

[0020] In some exemplary embodiments, the heat dissipation device includes at least two of the deformation ends, and the at least two deformation ends are arranged side by side and spaced apart on the connecting end.

[0021] In some exemplary embodiments, the elastic part is provided on the first heat dissipation part.

[0022] In some exemplary embodiments, the first heat dissipation part has a first surface and a second surface facing away from each other; wherein, the first surface faces the heating element, and the elastic part is provided on the second surface.

[0023] In some exemplary embodiments, the second heat dissipation part has a third surface facing the first heat dissipation part, and a receiving groove is provided in a part of the third surface facing the elastic part; wherein, the deformation end of the elastic part extends into the receiving groove.

[0024] In some exemplary embodiments, the second heat dissipation part is formed on the cooling element; or, the second heat dissipation part is connected to the cooling element.

[0025] In some exemplary embodiments, at least two of the second heat dissipation parts form heat conduction with the same cooling element; and, each of the at least two second heat dissipation parts is configured with one of the first heat dissipation parts so that the at least two first heat dissipation parts are arranged in an array form; wherein, the array form includes at least one of a row array, a column array, and a ring array.

[0026] In some exemplary embodiments, the first heat dissipation part and / or the second heat dissipation part is configured as a plate-like structure.

[0027] In some illustrative embodiments, the above-mentioned cooling element includes: a substrate; a cold pipe disposed on the substrate and forming heat conduction with the substrate, and a circulating cooling medium is provided in the cold pipe; wherein, the second heat dissipation part is formed on the substrate, or the second heat dissipation part is connected to the substrate.

[0028] In some illustrative embodiments, the cooling element further includes a cover plate covering the substrate.

[0029] The present invention also provides an optical module device, including: a bracket provided with at least one installation position for installing an optical module; a cooling element disposed above the installation position; and a heat dissipation device disposed at the bottom of the cooling element and suspended above the installation position.

[0030] In some illustrative embodiments, when the optical module is installed in the installation position, the second heat dissipation part of the heat dissipation device, the first heat dissipation part of the heat dissipation device and the optical module are stacked; the elastic part of the heat dissipation device is located between the second heat dissipation part and the first heat dissipation part and is in a compressed state to connect with the second heat dissipation part and form heat conduction, and further makes the first heat dissipation part closely fit to the optical module.

[0031] In some illustrative embodiments, each of the above-mentioned installation positions is used to install one of the above-mentioned optical modules, and one of the above-mentioned optical modules abuts against one of the above-mentioned first heat dissipation parts.

[0032] In some illustrative embodiments, the above-mentioned bracket has a first installation area and a second installation area arranged in a stacked manner; wherein, the first installation area and the second installation area respectively have at least one of the above-mentioned installation positions; the optical module device includes at least two of the above-mentioned cooling elements, and a part of the above-mentioned cooling elements are arranged in the first installation area, and another part of the above-mentioned cooling elements are arranged in the second installation area.

[0033] In some illustrative embodiments, the above-mentioned bracket includes a top plate and a bottom plate arranged opposite to each other, and side plates arranged between the top plate and the bottom plate, and the part surrounded by the top plate, the bottom plate and the side plates forms an accommodation space; the bracket further includes a first partition plate arranged between two opposite side plates to stack and partition the accommodation space into the first installation area and the second installation area.

[0034] In some illustrative embodiments, the top plate and the first partition plate are provided with first installation holes; wherein, the first heat dissipation part abuts against the first partition plate, and the elastic part arranged on the first heat dissipation part is connected to the second heat dissipation part through the first installation hole.

[0035] In some illustrative embodiments, the bracket further includes a second partition plate, which is disposed parallel and spaced above the first partition plate;

[0036] At least one of the cooling elements is located above the top plate, and at least another cooling element is located between the second partition plate and the first partition plate.

[0037] In some illustrative embodiments, the above-mentioned bracket further includes a third partition plate, which is disposed between the above-mentioned top plate and the above-mentioned bottom plate, and the above-mentioned third partition plate, the first partition plate and the above-mentioned top plate or the bottom plate define the above-mentioned installation position; wherein, both the above-mentioned side plate and the above-mentioned third partition plate have second installation holes penetrating along the first direction, and the above-mentioned cooling element is passed through the above-mentioned second installation holes and disposed on the above-mentioned side plate and the above-mentioned third partition plate.

[0038] In some illustrative embodiments, the optical module device further includes: a wiring portion, configured to be electrically connected to the above-mentioned optical module to electrically connect the above-mentioned optical module to a circuit structure, and the above-mentioned wiring portion is disposed at an end of the above-mentioned bracket along the second direction; wherein, the above-mentioned first direction is orthogonal to the above-mentioned second direction.

[0039] In some illustrative embodiments, the optical module device further includes a shunt element, and the above-mentioned shunt element has at least two branches; each of the above-mentioned branches is respectively communicated with one of the above-mentioned cooling elements and a liquid source storing a cooling medium to distribute the cooling medium among different above-mentioned cooling elements.

[0040] An embodiment of the present invention further provides a switch, including: an optical module device; and an optical module, disposed at the installation position of the above-mentioned optical module device.

[0041] An embodiment of the present invention further provides a server, including: an optical module device; and an optical module, disposed at the installation position of the above-mentioned optical module device.

[0042] According to the heat dissipation device, optical module device, switch and server provided by the embodiments of the present invention, the heat dissipation device is located between the heat generating element and the cooling element, wherein the first heat dissipation portion and the second heat dissipation portion are connected by an elastic portion to form heat conduction. The elastic portion also applies a pressure to the first heat dissipation portion to approach the heat generating element, so that the first heat dissipation portion is in close contact with the heat generating element, thereby reducing the thermal resistance. In addition, the elastic portion in the compressed state deforms, and has a larger contact area with the first heat dissipation portion or the second heat dissipation portion through the deformation than the original state, so as to reduce the thermal resistance between the first heat dissipation portion and the second heat dissipation portion, thereby improving the heat dissipation capacity of the heat dissipation device. Description of the Drawings

[0043] Figure 1It is a cross-sectional schematic diagram of a heat dissipation device according to a schematic embodiment of the present invention, showing the original state and the compressed state of the elastic part. Figure 1 In (a) of Figure 1 , the elastic part in the original state is shown. Figure 1 In (b) of Figure 1 , the elastic part in the compressed state is shown.

[0044] Figure 2 It is a cross-sectional schematic diagram of a heat dissipation device according to another schematic embodiment.

[0045] Figure 3 It is a cross-sectional schematic diagram of a heat dissipation device according to another schematic embodiment.

[0046] Figure 4 It is Figure 1 A partial enlarged view of part X of the schematic embodiment shown.

[0047] Figure 5 It is Figure 4 A three-dimensional view of the elastic part shown.

[0048] Figure 6 It is a three-dimensional view of an optical module device according to a schematic embodiment of the present invention.

[0049] Figure 7 It is Figure 6 A three-dimensional view of the optical module device with the circuit structure omitted.

[0050] Figure 8 It is Figure 7 A three-dimensional view of the upper first heat dissipation part of the optical module device shown.

[0051] Figure 9 It is Figure 7 A three-dimensional view of the lower first heat dissipation part of the optical module device shown.

[0052] Figure 10 It is Figure 6 A three-dimensional view of the bracket of the optical module device from a top-down perspective.

[0053] Figure 11 It is Figure 6 A three-dimensional view of the first partition and the second partition of the optical module device shown.

[0054] Figure 12 It is Figure 8 A usage state diagram of the bracket of the optical module device configured with the first heat dissipation part and the elastic part.

[0055] Figure 13 It is Figure 6 An exploded view of the parts of the cooling element of the optical module device shown.

[0056] Figure 14 It isFigure 6 Exploded view of the parts of the shunt element of the optical module device shown

[0057] In the said drawings, the meanings of the reference numerals are specifically as follows:

[0058] 1. Heat dissipation device; 11. First heat dissipation part; 111. First surface; 112. Second surface; 11A. Upper first heat dissipation part; 11B. Lower first heat dissipation part; 12. Second heat dissipation part; 121. Accommodating groove; 1211. Groove opening; 1212. Groove cavity; 122. Third surface; 13. Cooling element; 13A. First cooling element; 13B. Second cooling element; 131. Substrate; 132. Cold pipe; 133. Cover plate; 14. Elastic part; 141. Connection end; 142. Deformation end

[0059] 2. Bracket; 21. Top plate, 211. First mounting hole; 22. Side plate; 221. Second mounting hole; 23. First partition; 24. Third partition; 25. Bottom plate; 26. Mounting position

[0060] 3. Shunt element; 31. Water distributor base; 32. Water distributor cover plate, 33. First water nozzle; 34. Second water nozzle

[0061] 4. Circuit structure

[0062] 5. Optical module

[0063] 6. Wiring part Detailed implementation manners

[0064] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the following further elaborates on the present invention in detail with reference to specific embodiments and the accompanying drawings

[0065] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations and / or components, but do not exclude the presence or addition of one or more other features, steps, operations or components

[0066] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner

[0067] In cases where expressions such as "at least one of A, B, and C, etc." are used, generally, it should be interpreted according to the meaning that those skilled in the art usually understand this expression. For example, "a system having at least one of A, B, and C" should include, but not be limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc. In cases where expressions such as "at least one of A, B, or C, etc." are used, generally, it should be interpreted according to the meaning that those skilled in the art usually understand this expression. For example, "a system having at least one of A, B, or C" should include, but not be limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.

[0068] In the prior art, the heat dissipation device is mainly arranged on the side of the heating element facing away from the cooling element. At this time, the heat dissipation device mainly provides a pressure close to the cooling element to the heating element, in order to make the heating element and the cooling element fit tightly, form a larger contact area, and thus reduce the thermal resistance between the heating element and the cooling element.

[0069] However, limited by the flatness of the contact surface between the heating element and the cooling element, assembly errors, the uniformity of the pressure provided by the elastic device, and other factors, the pressure provided by the heat dissipation device to the heating element is often not perpendicular to the contact surface. Therefore, when observed from the outside, although the heating element and the cooling element are in a surface contact form, the actual contact positions may only form point contacts or line contacts. Therefore, the actual contact area between the heating element and the cooling element is often small, resulting in poor heat dissipation effect.

[0070] Therefore, how to provide a heat dissipation device that can enable good heat conduction between the heating element and the cooling element has become an urgent technical problem to be solved.

[0071] Figure 1 It is a cross-sectional schematic diagram of a heat dissipation device according to an exemplary embodiment of the present invention, showing the original state and the compressed state of the elastic part.

[0072] According to the heat dissipation device provided by the present invention, referring to Figure 1As shown, it includes a first heat dissipation part 11, a second heat dissipation part 12 and an elastic part 14. The first heat dissipation part 11 is configured to form heat conduction with a heating element. The second heat dissipation part 12 is configured to form heat conduction with a cooling element 13. The elastic part 14 is disposed on one of the first heat dissipation part 11 and the second heat dissipation part 12 and extends into a receiving groove 121 formed by the other. Wherein, the elastic part 14 has an original state and a compressed state of being compressed and deformed. The elastic part 14 in the original state has a first contact area with the other, and the elastic part 14 in the compressed state has a second contact area with the other. The second contact area is larger than the first contact area, so that the elastic part 14 is connected to the other and forms heat conduction.

[0073] In such an embodiment, the heat dissipation device 1 is located between a heating element (such as an optical module in the following embodiments) and the cooling element 13 (or between the main bodies of the cooling element 13, which will be described in the following embodiments). The heating element and the cooling element 13 indirectly form heat conduction through the heat dissipation device 1. At this time, since the position where the elastic part 14 applies pressure is closer to the heating element and the cooling element 13 than in the prior art, the application direction of this pressure is more conducive to being orthogonal to the heating element and the cooling element 13. And because the elastic part 14 applies pressure to the first heat dissipation part 11 close to the heating element, it is also conducive to making the first heat dissipation part 11 fit more closely with the heating element.

[0074] In addition, the elastic part 14 extends into the first heat dissipation part 11 or the second heat dissipation part 12, and also expands more space in the thickness direction of the first heat dissipation part 11 or the second heat dissipation part 12. In this way, both the heat transfer distance is shortened and the heat dissipation area is expanded. Therefore, it is more conducive to heat conduction, so that the heat dissipation device 1 has a better heat dissipation effect.

[0075] Refer to Figure 1 As shown, according to an embodiment of the present invention, the elastic part 14 is disposed on the first heat dissipation part 11.

[0076] Refer to Figure 1 As shown, according to an embodiment of the present invention, the first heat dissipation part 11 has a first surface 111 and a second surface 112 facing away from each other. Wherein, the first surface 111 (i.e., Figure 1 the lower end surface shown) faces the heating element, and the elastic part 14 is disposed on the second surface 112 (i.e., Figure 1 the upper end surface shown).

[0077] Refer to Figure 1 As shown, according to an embodiment of the present invention, the second heat dissipation part 12 has a third surface 122 facing the first heat dissipation part 11. A receiving groove 121 is provided in a part of the third surface 122 facing the elastic part 14. Wherein, the deformed end 142 of the elastic part 14 extends into the receiving groove 121.

[0078] Refer to Figure 1 As shown, in some exemplary embodiments, the second heat dissipation part 12 and the first heat dissipation part 11 are stacked, and the second heat dissipation part 12 is located above the first heat dissipation part 11. Correspondingly, a heat generating element ( Figure 1 not shown in the figure, specifically, it can be an optical module 5, which will be described in detail in the following embodiments) is located below the first heat dissipation part 11. Further, the elastic part 14 can be disposed on the first heat dissipation part 11 and extend into the second heat dissipation part 12.

[0079] Continue to refer to Figure 1 As shown in (a) of, the elastic part 14 in the original state is shown. At this time, it can be regarded that no heat generating element to be dissipated is arranged below the first heat dissipation part 11. In this state, the first heat dissipation part 11 is connected to the second heat dissipation part 12 through the elastic part 14, and the end face of the second heat dissipation part 12 facing the first heat dissipation part 11 is separated, that is, it can be regarded that only the part where the elastic part 14 is engaged with the second heat dissipation part 12 (the engaged part forms the first contact area) between the second heat dissipation part 12 and the first heat dissipation part 11 is in contact.

[0080] According to an embodiment of the present invention, the elastic part 14 in the compressed state is configured to provide a pressure to the first heat dissipation part 11 close to the heat generating element, so that the first heat dissipation part 11 closely fits the heat generating element.

[0081] Refer to Figure 1 As shown in (b) of, the elastic part 14 in the compressed state is shown. At this time, it can be regarded that a heat generating element is arranged below the first heat dissipation part 11.

[0082] In this state, the heat generating element presses against the first surface 111 (i.e., the lower end surface) of the first heat dissipation part 11, thereby causing the first heat dissipation part 11 to move upward as a whole. This will cause both ends (i.e., the upper end and the lower end) of the elastic part 14 to abut against the second heat dissipation part 12 and the first heat dissipation part 11 respectively, so that the elastic part 14 undergoes elastic deformation. The elastically deformed elastic part 14 further fits with the second heat dissipation part 12, so that the contact area between the elastic part 14 and the second heat dissipation part 12 increases, that is, it changes from the first contact area to the second contact area. At the same time, since the first heat dissipation part 11 also moves upward as a whole, for this reason, the second surface 112 (i.e., the upper end surface) of the first heat dissipation part 11 also closely fits the second heat dissipation part 12, which can further and directly increase the contact area between the first heat dissipation part 11 and the second heat dissipation part 12.

[0083] It should be noted that since the part where the elastic part 14 is connected to the first heat dissipation part 11 (i.e., the connection end 141 in the following embodiment) has a relatively thin thickness, refer to Figure 1As shown in (b) thereof, although the connecting end 141 will block between the first heat dissipation part 11 and the second heat dissipation part 12 when the first heat dissipation part 11 and the second heat dissipation part 12 are in close contact, good contact and heat conduction can still be formed between the elastic part 14 and the first heat dissipation part 11, and between the elastic part 14 and the second heat dissipation part 12.

[0084] On this basis, in order to further prevent the connecting end 141 of the elastic part 14 from blocking the first heat dissipation part 11 and the second heat dissipation part 12, resulting in the problem that the first heat dissipation part 11 and the second heat dissipation part 12 cannot form good surface contact. A groove can be provided on the third surface 122 of the second heat dissipation part 12, and this groove should face the connecting end 141 of the elastic part 14, and the depth of this groove should be configured to be greater than or equal to the thickness of the connecting end 141, so that when the elastic part 14 is in a compressed state, the connecting end 141 can just be fitted into this groove. In this way, the opposite end faces (i.e., the second surface 112 and the third surface 122) of the first heat dissipation part 11 and the second heat dissipation part 12 can be in close contact, so that the first heat dissipation part 11 and the second heat dissipation part 12 form a larger contact area for more effective heat conduction. It should be understood that the embodiments of the present invention are not limited to this.

[0085] Figure 2 is a cross-sectional schematic view of a heat dissipation device according to another schematic embodiment.

[0086] Referring to Figure 2 As shown, in some other schematic embodiments, the second heat dissipation part 12 and the first heat dissipation part 11 are stacked, and the second heat dissipation part 12 is located above the first heat dissipation part 11. Correspondingly, the heating element ( Figure 1 not shown in the figure, specifically it can be the optical module 5, which will be described in detail in the following embodiments) is located below the first heat dissipation part 11. Different from the Figure 1 embodiment shown, the elastic part 14 is provided on the second heat dissipation part 12 and extends into the first heat dissipation part 11. In this embodiment, only the position where the elastic part 14 is configured is opposite to the Figure 1 embodiment shown, but based on the deformation mode of the elastic part 14 in the original state and the compressed state and the principle of increasing the contact area are similar to those of the above embodiments, so it will not be elaborated here.

[0087] Continuing to refer to Figure 1 and Figure 2 As shown, according to an embodiment of the present invention, the second heat dissipation part 12 is formed on the cooling element 13. That is, the second heat dissipation part 12 can be a part of the cooling element 13, that is to say, there is no joint surface between the second heat dissipation part 12 and the cooling element 13, and the third surface 122 of the second heat dissipation part 12 can be regarded as the lower end surface of the cooling element 13. Among them, the main body of the cooling element 13 can be understood as the part where the substrate 131 is provided with grooves to accommodate the cold pipe 132.

[0088] Referring to Figure 1 and Figure 2 As shown, in some exemplary embodiments, the second heat dissipation part 12 and the cooling element 13 include, but are not limited to, being integrally formed. In this way, since there is no difference in thermal resistance between the second heat dissipation part 12 and the cooling element 13, therefore, it has good heat conduction performance.

[0089] Referring to Figure 1 and Figure 2 As shown, according to an embodiment of the present invention, the cooling element 13 includes a substrate 131 and a cold pipe 132. The cold pipe 132 is disposed on the substrate 131 and forms heat conduction with the substrate 131, and a circulating cooling medium is provided inside the cold pipe 132. Wherein, the second heat dissipation part 12 is formed on the substrate 131, or the second heat dissipation part 12 is connected to the substrate 131.

[0090] Referring to Figure 1 and Figure 2 As shown, according to an embodiment of the present invention, the cooling element 13 further includes a cover plate 133, and the cover plate 133 covers the substrate 131.

[0091] Referring to Figure 1 and Figure 2 As shown, in some exemplary embodiments, the cooling element 13 includes, but is not limited to, using a cold plate, specifically including a substrate 131, a cold pipe 132, and a cover plate 133 (covering the cold pipe 132) covering the substrate 131. Specifically, the substrate 131 has grooves inside, and the grooves include, but are not limited to, U-shaped grooves, S-shaped grooves, and grooves of any other shape. Further, the cold pipe 132 is located in the above grooves, and a cooling medium is provided inside it. The cooling medium communicates with an external circulating mechanism (such as at least a part of a liquid source, a pump, and a heat exchanger) to carry part of the heat of the heating element to the outside of the cooling element 13 through the cooling medium for heat exchange, and then to carry out the next cycle with the heating element again. Wherein, the substrate 131 includes, but is not limited to, being configured as a plate-like structure; further, the substrate 131 and / or the cold pipe 132 include, but are not limited to, being made of copper, copper alloy, aluminum, aluminum alloy, stainless steel, and other materials with good heat conductivity.

[0092] In addition, the cold plate also needs to be configured with interfaces (such as water nozzles) to introduce or export the cooling medium from the cooling element 13. And the cold plate can also be configured with other heat dissipation structures such as fins to increase the heat exchange area. Further, the cover plate 133 covers the end face of the substrate 131 facing away from the second heat dissipation part 12 to protect the substrate 131 and the cold pipe 132, and make the cooling element 13 more integral, so as to be more beautiful from the external view.

[0093] Referring to Figure 1 and Figure 2As shown, in some exemplary embodiments, to adapt to the plate-like structure of the cooling element 13, the first heat dissipation portion 11 and / or the second heat dissipation portion 12 are also configured as plate-like structures. In this way, the stacked cooling element 13, the first heat dissipation portion 11, and the heating element can be brought into contact with each other to form a surface contact, thereby having a large contact area.

[0094] In some exemplary embodiments, at least two second heat dissipation portions 12 form heat conduction with the same cooling element 13. Moreover, each of the at least two second heat dissipation portions 12 is provided with a first heat dissipation portion 11, so that the at least two first heat dissipation portions 11 are arranged in an array form. Among them, the array form includes at least one of a row array, a column array, and a ring array.

[0095] Continuing with the above-described embodiment in which the cold plate is used as the cooling element as an example, the same cold plate can be connected to a plurality of (such as two or more) first heat dissipation portions 11 through the elastic portions 14, so that each first heat dissipation portion 11 can conduct the heat generated by the heating element in contact with it to the cooling element, thereby realizing the cooling of the heating element. It should be understood that the embodiments of the present invention are not limited thereto.

[0096] Figure 3 is a cross-sectional schematic view of a heat dissipation device according to another exemplary embodiment.

[0097] Referring to Figure 3 As shown, according to another embodiment of the present invention, the second heat dissipation portion 12 is connected to the cooling element 13.

[0098] Referring to Figure 3 As shown, in some exemplary embodiments, the second heat dissipation portion 12 and the cooling element 13 have a joint surface, and the joint surface is flat. Specifically, the second heat dissipation portion 12 and the cooling element 13 can be connected by, but not limited to, bonding, riveting, welding, or other means; alternatively, the second heat dissipation portion 12 can also be merely abutted against the cooling element 13, which can reduce the additional thermal resistance between different media (for example, when the second heat dissipation portion 12 is welded to the cooling element 13, the solder introduces additional thermal resistance).

[0099] In such an embodiment, the second heat dissipation portion 12 independent of the cooling element 13 is less restricted by thickness, and thus can be more conveniently processed.

[0100] For example, due to the insufficient thickness of the cooling element 13, if the cooling element 13 is directly processed to form a joint structure that cooperates with the elastic portion 14 as shown in Figure 1 and Figure 2 shown, it may cause the leakage of the cooling medium in the cooling element 13. Therefore, by arranging a joint structure that cooperates with the elastic portion 14 on the second heat dissipation portion 12, the processing difficulty can be greatly reduced.

[0101] It should be noted that, based on the embodiment in which the second heat dissipation part 12 is independent of the cooling element 13, since the action of force is mutual, when the elastic part 14 in the compressed state provides pressure to the first heat dissipation part 11, due to the position of the first heat dissipation part 11 being restricted by the heating element, therefore, the elastic part 14 also simultaneously provides a pressure in the opposite direction to the second heat dissipation part 12, so that the second heat dissipation part 12 is closely attached to the cooling element 13.

[0102] Figure 4 Yes Figure 1 A partial enlarged view of the X part of the schematic embodiment shown.

[0103] Referring to Figure 4 As shown, according to an embodiment of the present invention, the elastic part 14 is arranged on one of the first heat dissipation part 11 and the second heat dissipation part 12, and the other of the first heat dissipation part 11 and the second heat dissipation part 12 is provided with a receiving groove 121. Wherein, the elastic part 14 faces the receiving groove 121 and extends into the receiving groove 121.

[0104] Referring to Figure 1 And Figure 4 As shown, according to an embodiment of the present invention, the elastic part 14 includes a connection end 141 and a deformation end 142. The connection end 141 is arranged on the first heat dissipation part 11 or the second heat dissipation part 12. The deformation end 142 is arranged on the connection end 141 and extends into the receiving groove 121. Wherein, at least the deformation end 142 is made of an elastic material, so as to deform when being pressured near the connection end 141, and at least a part of the deformation end 142 is closely attached to the inner wall of the receiving groove 121.

[0105] Referring to Figure 4 As shown, according to an embodiment of the present invention, the elastic part 14 is bent to form an elliptical arc segment with an opening to be used as the deformation end 142, and the opening part of the elliptical arc segment is bent in the direction away from the opening to form the connection end 141. Referring to Figure 1 And Figure 4 Taking the embodiment in which the elastic part 14 is arranged on the first heat dissipation part 11 as an example for the shown embodiment. Wherein, the elliptical arc segment can be understood as that the deformation end 142 is bent to form a semi-closed elliptical cylinder structure. In the perspective facing the paper surface, the lower part of the cross-section of the deformation end 142 has an opening, such as the two ends of the opening extend along the dotted line part as shown in Figure 4 to form a closed approximate elliptical projection, and the elliptical projection has a major axis (i.e., A as shown in Figure 4 ) and a minor axis (i.e., B as shown in Figure 4 ). Figure 4

[0106] Referring to Figure 4 ​As shown, a through hole is formed in the part surrounded by the elastic part 14 and the first heat dissipation part 11, or a through hole is formed in the part surrounded by the elastic part 14 and the second heat dissipation part 12. When the elastic part 14 is in a compressed state, the area of the through hole is larger than the area when the elastic part 14 is in its original state.

[0107] Taking the deformation end 142 with an elliptical arc segment and the connection end 141 located at the opening part of the elliptical arc segment of the above elastic part as an example, the part surrounded by the elastic part 14 in its original state and the first heat dissipation part 11 (or the second heat dissipation part 12) can be regarded as forming an approximately elliptical through hole. The receiving groove 121 has a notch 1211 and a groove cavity 1212. When the deformation end 142 of the elastic part 14 is subjected to a pressure along the long axis direction, the deformation end 142 expands along the short axis direction until it is restricted by the groove cavity 1212 of the receiving groove 121 to form an approximately circular through hole. At this time, it can be regarded that the length of the deformation end 142 does not change visibly. Based on the isoperimetric principle, among all closed curves, a circle encloses the largest area for a given perimeter when the perimeter (i.e., the length of the deformation end 142) remains unchanged. Therefore, the area of the through hole formed by the part surrounded by the elastic part 14 in the compressed state and the first heat dissipation part 11 (or the second heat dissipation part 12) is larger than the area of the through hole formed by the part surrounded by the elastic part 14 in its original state and the first heat dissipation part 11 (or the second heat dissipation part 12).

[0108] Refer to Figure 4 As shown, in some exemplary embodiments, the elastic part 14 is configured as a sheet structure, and the deformation end 142 (i.e., the elliptical segment) and the connection end 141 (i.e., the end portions bent from the opening position of the elliptical segment to both sides) are integrally formed. Specifically, the elastic part 14 includes but is not limited to being made of beryllium copper alloy. Further, the bottom of the connection end 141 is flatly arranged to be connected to the end face of the first heat dissipation part 11 (or the second heat dissipation part 12). Among them, the elastic part 14 is connected to the first heat dissipation part 11 (or the second heat dissipation part 12) by including but not limited to riveting, welding, bonding, integral formation, and any other means, and the corresponding first heat dissipation part 11 includes but is not limited to being made of copper plate. It should be understood that the embodiments of the present invention are not limited thereto.

[0109] For example, the deformation end 142 of the elastic part 14 can also be bent from a sheet structure to form a butterfly shape, an oblate shape, a racetrack shape, and other smooth cylindrical structures.

[0110] Again, for example, the elastic part 14 and / or the first heat dissipation part 11 can also be made of materials other than copper and copper alloys, specifically, it can be made of aluminum, aluminum alloy, silver, and other materials with good heat conduction performance.

[0111] Refer to Figure 4As shown, in some exemplary embodiments, the receiving groove 121 has a notch 1211 and a cavity 1212. Among them, the width of the notch 1211 is smaller than the width of the cavity 1212.

[0112] Referring to Figure 4 As shown, according to an embodiment of the present invention, the depth of the cavity 1212 is smaller than the height of the deformable end 142.

[0113] Referring to Figure 4 As shown, in some exemplary embodiments, at least a part of the elastic part 14 is located in the receiving groove 121. When the elastic part 14 is in a compressed state, the part of the elastic part 14 located in the receiving groove 121 (which can be understood as the above-mentioned deformable end 142) is compressed and deformed along a direction forming an angle with the pressure direction and is restricted in the receiving groove 121. Referring to Figure 4 As shown, according to an embodiment of the present invention, the width of the notch 1211 is smaller than the width of the cavity 1212. Among them, the length of the major axis of the deformable end 142 is configured to be greater than the depth of the cavity 1212, and the length of the minor axis of the deformable end 142 is configured to be greater than the width of the notch 1211 and smaller than the width of the cavity 1212.

[0114] Continuing to refer to Figure 4 As shown, according to an embodiment of the present invention, the first heat dissipation part 11 is detachably connected to the second heat dissipation part 12 through the elastic part 14.

[0115] In some exemplary embodiments, referring to Figure 4 As shown, since the receiving groove 121 is configured as a through groove structure.

[0116] In some exemplary embodiments, when the elastic part 14 is in its original state, the elastic part 14 is configured to be detachable from the receiving groove 121 along the depth direction or the length direction of the receiving groove 121, so that the elastic part 14 can be detached from the receiving groove 121. And / or, when the elastic part 14 is in a compressed state, the elastic part 14 is configured to be restricted along both the depth direction and the length direction of the receiving groove 121, so that the elastic part 14 cannot be detached from the receiving groove 121.

[0117] Continuing to refer to Figure 4 As shown, the deformable end 142 of the elastic part 14 can be made of, for example Figure 4The perspective shown is inserted through the opening formed by the receiving groove 121. At this time, since the width of the deformed end 142 is slightly greater than the width of the notch 1211, both sides of the deformed end 142 facing each other will overlap at the position of the notch 1211 formed by the receiving groove 121 to form a first contact area. However, in this state, since no heating element is arranged below the first heat dissipation part 11, its lower part is suspended. That is, the position of the deformed end 142 of the elastic part 14 in the vertical direction is not restricted. When it moves downward under its own weight and the weight of the first heat dissipation part 11, the deformed end 142 will move from the part of the groove cavity 1212 to the position of the notch 1211, and then be squeezed and deformed. Therefore, the connection between the elastic part 14 in the original state and the receiving groove 121 is unstable. The elastic part 14 may be disengaged from the receiving groove 121 under the influence of vibration and other factors, that is, the elastic part 14 does not form an effective connection with the receiving groove 121.

[0118] Furthermore, when a heating element is arranged below the first heat dissipation part 11, the elastic part 14 will move upward with the first heat dissipation part 11. At this time, since the upper end of the deformed end 142 abuts against the top of the second heat dissipation part 12 (i.e., the receiving groove 121), the elastic part 14 will be subjected to a pressure in the up and down direction as shown in Figure 4 At this time, the deformed end 142 will be deformed in the left and right directions that are not restricted, which can be understood as gradually widening the short axis part of the deformed end 142 (i.e., the deformed end 142 gradually expands along the short axis direction). In this state, since the positions of the upper end and the lower end of the deformed end 142 are restricted, it cannot rebound elastically by itself until it is in close contact with the inner wall of the groove cavity 1212. At this time, since the displacement of the elastic part 14 in the up and down direction is restricted, the elastic part 14 cannot disengage from the notch 1211 of the receiving groove 121. Furthermore, since the deformed end 142 is in close contact with the inner wall of the groove cavity 1212, the pressure of the deformed end 142 on the contact surface of the groove cavity 1212 is increased. Therefore, a greater frictional force will be formed between the elastic part 14 and the receiving groove 121. In this way, an effective connection is formed between the elastic part 14 and the receiving groove 121, and this connection will prevent the elastic part 14 from being easily disengaged from the second heat dissipation part 12.

[0119] Referring to Figure 4 As shown, according to an embodiment of the present invention, the length of the inner circumference of the groove cavity 1212 is configured to be less than or equal to the length of the elliptical arc segment.

[0120] Furthermore, referring to Figure 1 and Figure 2As shown, the third surface of the second heat dissipation part 12 may have multiple rows of receiving grooves 121. Correspondingly, the first heat dissipation part 11 is provided with the same number of elastic parts 14 corresponding to each receiving groove 121. Further, each elastic part 14 may include a connecting end 141 and multiple deforming ends 142 formed on the same connecting end 141. Among them, the multiple deforming ends 142 may be arranged at intervals along the extending direction of the receiving groove 121, so that the multiple deforming ends 142 located on the same connecting end 141 are extended into the same receiving groove 121.

[0121] Referring to Figure 4 As shown, in some exemplary embodiments, the receiving groove 121 includes but is not limited to a through groove. Specifically, in the perspective facing the paper surface, the inner wall of the groove cavity 1212 in the cross-section of the receiving groove 121 forms an arc-shaped projection, and this arc-shaped projection is a major arc, and the unconnected part of this arc-shaped projection forms the notch 1211 of the receiving groove 121. Further, a smooth transition is formed between the groove cavity 1212 and the notch 1211. Among them, the width of the notch 1211 (i.e., W as shown Figure 4 should be configured to be smaller than the inner diameter of the approximately circular groove cavity 1212. Figure 4 As shown

[0122] Continuing to refer to Figure 4 As shown, for the above-mentioned elastic part 14 and receiving groove 121, the height of the deforming end 142 (which can be regarded as the major axis, i.e., Figure 4 A as shown) is greater than the depth of the groove cavity 1212 (i.e., Figure 4 D as shown), that is, A > D. In this way, when the elastic part 14 is in the original state, the upper end part of the deforming end 142 can be pressed against the bottom of the groove cavity 1212 (i.e., Figure 4 the top as shown), and the lower end part (and the connecting end 141) of the deforming end 142 is exposed outside the receiving groove 121. In this way, when the heating element is assembled under the first heat dissipation part 11, the elastic part 14 will move upward as a whole with the first heat dissipation part 11. At this time, since the upper end of the deforming end 142 is restricted by the groove cavity 1212, for this reason, deformation will occur immediately, and then the elastic part 14 will deform in a timely manner in the compressed state to make full use of the displacement amount of the first heat dissipation part 11.

[0123] In addition, since the length of the minor axis of the deforming end 142 is configured to be greater than the width of the notch 1211 and less than the width of the groove cavity 1212. It can be seen that in the original state, most of the deforming end 142 is located inside the receiving groove 121. For this reason, when the deforming end 142 deforms, the groove cavity 1212 of the receiving groove 121 can play a guiding role to prevent the deforming end 142 from detaching from the receiving groove 121 or causing failure.

[0124] On this basis, based on the structural characteristics of the elliptical structure (i.e., the deformed end 142 configured as an elliptical segment), when its major axis (i.e., Figure 4 A shown) is compressed, it will extend to both sides along the minor axis (i.e., Figure 4 B shown) and gradually approach the inner wall of the groove cavity 1212. Since the length of the inner circumference of the groove cavity 1212 (i.e., P1 as shown in Figure 4 ) is configured to be less than or equal to the length of the elliptical arc segment (i.e., P2 as shown in Figure 4 ), and the inner wall of the groove cavity 1212 is configured as a major arc, for this reason, when the deformed end 142 is compressed to the point where the length of the minor axis is approximately the same as that of the major axis (which can be regarded as the inner diameter of the groove cavity 1212) (i.e., without considering the wall thickness, it can be understood that the deformed end 142 forms an approximate circle), the deformed end 142 can be made to fit as closely as possible to the inner wall of the groove cavity 1212, thus having a relatively large contact surface (such as the above-mentioned second contact area).

[0125] It should be understood that in some other embodiments of the present invention, the cross-section of the groove cavity 1212 in the groove width direction may also be configured as one of a circle, an ellipse, and a polygon. Among them, the cross-section of the groove cavity 1212 in the groove width direction can be understood as the cross-section formed by the minimum spacing position of the opposite wall surfaces of the groove cavity 1212.

[0126] On this basis, the cross-section of the groove cavity 1212 in the groove width direction can also be configured as a circle, which can be understood as an approximate circle, that is, the circle is non-closed, and the inner wall of the cross-section of the groove cavity 1212 visually presents a continuous and relatively uniform curve without obvious corners or protrusions. Similarly, the ellipse can be understood as an approximate ellipse.

[0127] Furthermore, the polygon can be understood as an approximate polygon, that is, the polygon is non-closed, and the inner wall of the cross-section of the groove cavity 1212 visually presents a plurality of continuous line segments.

[0128] Figure 5 is Figure 4 the three-dimensional view of the elastic part shown.

[0129] Referring to Figure 5 shown, according to an embodiment of the present invention, the elastic part 14 includes at least two deformed ends 142. The at least two deformed ends 142 are arranged side by side and spaced apart on the connecting end 141.

[0130] Continuing to refer to Figure 5 shown, according to an embodiment of the present invention, the elastic part 14 includes at least two connecting ends 141, and at least one deformed end 142 is provided on one connecting end 141. Among them, the at least two connecting ends 141 are arranged side by side and spaced apart on the first heat dissipation part 11 or the second heat dissipation part 12.

[0131] Referring toFigure 4 and Figure 5 As shown in Figure 5 , the elastic part 14 includes a plurality of connecting ends 141, and the plurality of connecting ends 141 are arranged side by side at intervals. Further, each connecting end 141 also has a plurality of deforming ends 142, and the deforming ends 142 provided for each connecting end 141 are evenly spaced in a direction orthogonal to the arrangement direction of the connecting ends 141. Among them, the number of the connecting ends 141 configured for the elastic part 14 should be consistent with the number of the accommodating grooves 121 provided, that is, the plurality of deforming ends 142 provided for each connecting end 141 are all configured in the same accommodating groove 121.

[0132] Continue to refer to Figure 4 and Figure 5 As shown in Figure 5 , a plurality of deforming ends 142 are provided on the same connecting end 141 of each elastic part 14. Specifically, taking the accommodating groove 121 configured as a through groove as an example above, the length of the accommodating groove 121 can be understood as the distance between the openings formed at both ends of the through groove. Further, the connecting end 141 of the elastic part 14 includes but is not limited to being configured to be substantially the same as the length of the accommodating groove 121, and the number of the deforming ends 142 should be set as many as possible on the basis that each deforming end 142 is located within the accommodating groove 121.

[0133] For example, the plurality of connecting ends 141 can also be integrally formed in a sheet structure. That is, the plurality of connecting ends 141 are integral and continuous, and each connecting end 141 further forms a plurality of deforming ends 142.

[0134] Figure 6 is a perspective view of an optical module device according to a schematic embodiment of the present invention.

[0135] Based on the same inventive concept, referring to Figure 6 As shown in Figure 6 , the present invention further provides an optical module device including a bracket 2, a cooling element 13 and a heat dissipation device 1. The bracket 2 is provided with at least one installation position 26 for installing the optical module 5. The cooling element 13 is arranged above the installation position 26. The heat dissipation device 1 is arranged at the bottom of the cooling element 13 and is suspended above the installation position 26.

[0136] Refer to Figure 6 As shown in Figure 6 , the bracket 2 has a first direction (X direction), a second direction (Y direction) and the following third direction (Z direction). Among them, the first direction can be understood as the length direction of the bracket 2, the second direction can be understood as the width direction of the bracket 2, and the third direction can be understood as the height direction of the bracket 2. Unless otherwise specified, the following first direction, second direction and third direction can all refer to Figure 6 as shown in Figure 6 .

[0137] Based on the embodiment of the above heat dissipation device 1, the second heat dissipation part 12 of the heat dissipation device 1 can be independent of the cooling element 13. At this time, the heat dissipation device 1 is located between the optical module 5 and the cooling element.

[0138] In addition, the second heat dissipation part 12 of the heat dissipation device 1 can also be a part of the cooling element 13, but this part (i.e., the second heat dissipation part 12) should be arranged between the main body of the cooling element 13 and the optical module 5.

[0139] For example, in an embodiment where a cold plate is used as the cooling element 13, the second heat dissipation part 12 can be formed on the bottom surface of the substrate 131 of the cold plate, and the main body of the substrate 131 can be understood as the part of the substrate 131 where grooves are provided to accommodate the cold pipe 132. In this embodiment, the second heat dissipation part 12 is located between the main body of the cold plate and the optical module 5.

[0140] In such an embodiment, the heat dissipation device 1 is located between the optical module 5 and the cooling element 13 (or the main body of the cooling element 13), and the optical module 5 and the cooling element 13 indirectly form heat conduction through the heat dissipation device 1. At this time, since the position where the elastic part 14 applies pressure is closer to the optical module 5 and the cooling element 13 than in the prior art, therefore, the application direction of this pressure is more conducive to being orthogonal to the optical module 5 and the cooling element 13. And, since the elastic part 14 applies a pressure close to the optical module 5 to the first heat dissipation part 11, therefore, it is also beneficial to make the first heat dissipation part 11 fit more closely with the optical module 5 to form good heat dissipation.

[0141] Figure 7 Yes Figure 6 The perspective view of the optical module device shown omits the circuit structure.

[0142] Refer to Figure 6 And Figure 7 As shown in the figure, according to an embodiment of the present invention, the bracket 2 has a first installation area and a second installation area arranged in a stacked manner. Among them, the first installation area and the second installation area respectively have at least one installation position 26. The optical module device includes at least two cooling elements 13, and a part of the cooling elements 13 are arranged in the first installation area, and another part of the cooling elements 13 are arranged in the second installation area. Among them, the optical module 5 can also be called an optical transceiver or a fiber optic transceiver, and is an electronic device that transmits and receives optical signals in an optical communication system. Among them, refer to Figure 7 As shown in the embodiment with two cooling elements 13, the two cooling elements 13 are arranged in parallel and at intervals along the height direction (Z direction) of the bracket 2.

[0143] Refer to Figure 7As shown, according to an embodiment of the present invention, the bracket 2 includes a top plate 21 and a bottom plate 25 arranged opposite to each other, and side plates 22 disposed between the top plate 21 and the bottom plate 25. The portion surrounded by the top plate 21, the bottom plate 25, and the side plates 22 forms an accommodation space. The bracket further includes a first partition 23 disposed between two opposite side plates 22 to stackedly partition the accommodation space into a first installation area and a second installation area.

[0144] Referring to Figure 7 As shown, according to an embodiment of the present invention, the bracket 2 further includes a third partition 24 disposed between the top plate 21 and the bottom plate 25. Among them, both the side plate 22 and the third partition 24 have a second installation hole 221 penetrating along a first direction, and the cooling element 13 is disposed through the second installation hole 221 in the side plate 22 and the third partition 24.

[0145] Referring to Figure 7 As shown, in some exemplary embodiments, the bracket 2 includes, but is not limited to, an optical cage, including two side plates 22 arranged in a plane along a second direction (Y direction) and a third direction (Z direction), and a top plate 21 and a bottom plate 25 arranged in a plane between the two side plates 22 along a first direction (X direction) and the second direction (Y direction). Among them, the top plate 21 is located above the bottom plate 25 so that the bracket 2 forms a substantially cubic structure. Further, within the accommodation space formed by enclosing the top plate 21, the side plates 22, and the bottom plate 25, a first partition 23 parallel to the top plate 21 and a third partition 24 parallel to the side plates 22 are further provided to partition the accommodation space into multiple (including but not limited to Figure 7 As shown, 8) installation positions 26, and each installation position 26 is suitable for installing an optical module 5. In this way, each installation position 26 can independently install the optical module 5 without affecting other installation positions 26.

[0146] Referring to Figure 7 As shown, according to an embodiment of the present invention, the optical module device further includes: a wiring portion 6 configured to be electrically connected to the optical module to electrically connect the optical module to the circuit structure 4, and the wiring portion 6 is disposed at an end of the bracket 2 along the second direction. Among them, the first direction is orthogonal to the second direction.

[0147] Referring to Figure 7As shown, in some exemplary embodiments, the above-mentioned bracket 2 has a front end and a rear end. Herein, the front end can be understood as the end with an opening for inserting the optical module 5, and conversely, the rear end can be understood as the end provided with a wiring terminal. Further, the bracket 2 also has an interface connected to the wiring terminal. In this way, after the optical module 5 is inserted into the installation position through the front end of the bracket 2, the optical module 5 can be connected to the wiring part 6 through the interface, and then electrically connected to the circuit structure 4 (such as a printed circuit board, i.e., PCB) arranged below the bracket to form signal transmission.

[0148] Referring to Figure 7 As shown, in some exemplary embodiments, the side plate 22 and the third partition 24 are also provided with second mounting holes 221 penetrating in the second direction (Y direction). Specifically, the second mounting holes 221 include, but are not limited to, openings configured to be substantially rectangular. The shape and size of the second mounting holes 221 should be configured to be substantially the same as the external shape and size of the cooling element 13, so that the cooling element 13 can be inserted into the accommodation space through the second mounting holes 221.

[0149] Figure 8 is Figure 7 The perspective view of the upper first heat dissipation part of the optical module device shown. Figure 9 is Figure 7 The perspective view of the lower first heat dissipation part of the optical module device shown.

[0150] Referring to Figures 6 to 9 As shown, in some exemplary embodiments, to adapt to the double-layer bracket 2 (i.e., the bracket having stacked first mounting areas and second mounting areas) shown in Figure 7 As shown, the upper first heat dissipation part 11A and the lower first heat dissipation part 11B shown in Figure 8 are respectively configured. Figure 9 As shown in

[0151] Among them, the upper first heat dissipation part 11A is arranged under the top plate 21. An elastic part 14 is provided at the part facing the first mounting hole 211 provided on the top plate 21, and the elastic part 14 extends out from the first mounting hole 211 to connect the cooling element 13 located above the top plate 21 ( Figures 6 to 9 not shown in Figures 7 to 9 and can be understood as the first cooling element 13A as described below); the lower first heat dissipation part 11B is arranged under the first partition 23. An elastic part 14 is provided at the part facing the first mounting hole 211 provided on the first partition 23, and the elastic part 14 extends out from the first mounting hole 211 to connect the cooling element 13 located above the first partition 23 (

[0152] Figure 10 is Figure 6A perspective view of the top view of the bracket of the optical module device shown.

[0153] Referring to Figure 10 As shown, according to an embodiment of the present invention, the top plate 21 and the first partition 23 are provided with first mounting holes 211. Among them, the first heat dissipation part 11 abuts against the first partition 23, and the elastic part 14 provided on the first heat dissipation part 11 is connected to the second heat dissipation part 12 through the first mounting hole 211.

[0154] Figure 11 is Figure 6 A perspective view of the first partition and the second partition of the optical module device shown.

[0155] Referring to Figure 11 As shown, according to an embodiment of the present invention, the first partition 23 divides the accommodation space in the bracket 2 into two upper and lower regions (i.e., the first installation region and the second installation region). To meet the heat dissipation requirements of the optical modules 5 located in the two regions, the first partition 23 and the top plate 21 are provided with a substantially rectangular first mounting hole 211, and the first mounting hole 211 can be configured to be slightly smaller than the size of the first heat dissipation part 11 of the heat dissipation device 1. In this way, when the first heat dissipation part 11 (including the elastic part 14) is disposed in the first mounting hole 211, the first heat dissipation part 11 can be supported on the top plate 21 or the first partition 23 to prevent it from falling out of the first mounting hole 211 (specifically, refer to Figure 7 the usage state).

[0156] Referring to Figure 11 As shown, according to an embodiment of the present invention, the bracket 2 further includes a second partition 27. The second partition 27 is disposed parallel and spaced above the first partition 23. At least one cooling element 13 is located above the top plate 21, and at least one other cooling element 13 is located between the second partition 27 and the first partition 23.

[0157] Referring to Figure 11 As shown, in some exemplary embodiments, the first partition 23, the second partition 27, and the third partition 24 are integrally formed and bent to form a substantially cubic box structure. Among them, the second partition 27 serves as the upper plate of the box structure, the third partition 24 serves as the vertical plate, and the first partition 23 serves as the lower plate. Specifically, the opening area formed between the first partitions 23 serves as the first mounting hole of the first partition 23, and the third partition 24 is provided with a second mounting hole.

[0158] In such an embodiment, the part of the cooling element 13 ( Figure 11 not shown in Figure 11If not shown in the figure), it is abutted between the cooling element 13 and the first partition 23. The upper end surface of the second partition 27 is used to set another optical module 5 to support the lower end surface of the optical module 5 located in the upper part. Figure 12 is Figure 8 The usage state diagram of the first heat dissipation part and the elastic part of the bracket of the optical module device shown

[0159] Refer to Figure 12 As shown, according to an embodiment of the present invention, when the optical module 5 is installed at the installation position 26, the second heat dissipation part 12 of the heat dissipation device 1, the first heat dissipation part 11 of the heat dissipation device 1 and the optical module 5 are stacked. The elastic part 14 of the heat dissipation device 1 is located between the second heat dissipation part 12 and the first heat dissipation part 11 and is in a compressed state to connect with the second heat dissipation part 12 to form heat conduction and also make the first heat dissipation part 11 closely fit the optical module.

[0160] Refer to Figure 12 As shown, according to an embodiment of the present invention, one installation position 26 is used to install one optical module 5, and one optical module 5 abuts against one first heat dissipation part 11.

[0161] Refer to Figure 12 As shown, in some illustrative embodiments, the second heat dissipation part 12 of the heat dissipation device 1 includes but is not limited to being a part of the cooling element 13 (such as a part of the base plate 131 of the cold plate). The length of the cooling element 13 should be at least configured to be greater than the length of two installation positions 26 so that one cooling element 13 can extend to at least two installation positions 26 and be connected to the first heat dissipation parts 11 configured in the two installation positions through the respective configured elastic parts 14 (in a compressed state) and form heat conduction with the above-mentioned at least two first heat dissipation parts 11, thereby dissipating heat from multiple optical modules 5 located in the same area (i.e., the first installation area or the second installation area).

[0162] Take Figure 12 The embodiment shown as an example. The length (i.e., the dimension along the X direction) of each cooling unit 13 can be configured to be substantially the same as the dimension of the bottom plate 25 (or the top plate 21, which is blocked and not shown) so that each cooling unit 13 can penetrate each installation position 26 located in the same area, thereby realizing heat exchange with the optical module 5 in each installation position 26.

[0163] Refer to Figure 12As shown, in order to distinguish the cooling elements 13 arranged on the top plate 21 and the first partition plate 23, the cooling element 13 arranged on the top plate 21 is characterized as the first cooling element 13A, and the cooling element 13 arranged on the first partition plate 23 is characterized as the second cooling element 13B. In detail, the first cooling element 13A includes but is not limited to being connected to the top plate 21, and can be connected by welding, riveting, bonding, snap connection or any other method; similarly, the second cooling element 13B is limited to the first partition plate 23. In addition to the above connection method, since the second cooling element 13B is located in the bracket 2, there may be inconvenient operation. For this reason, the second cooling element 13B can be limited by configuring the size and shape of the second mounting hole 221, so that the positions of the first cooling element 13A and the second cooling element 13B along the third direction (Z direction) are limited.

[0164] In such an implementation, since the positions of the first cooling element 13A and the second cooling element 13B along the third direction (Z direction) are restricted, it can be considered that the position of the second heat dissipation portion 12 of the heat dissipation device 1 is restricted (the second heat dissipation portion 12 is a part of the cooling element 13). In this way, when the optical module 5 is inserted from the bracket opening, when the first heat dissipation portion 11 (including the elastic portion 14) of the heat dissipation device 1 moves upward, the second heat dissipation portion 12 will not be pressed upward by the elastic portion 14, thereby causing one end of the second cooling element 13B to tilt up. For this reason, the optical modules 5 in each installation position 26 can be installed without affecting each other, and good heat dissipation can be achieved. It should be noted that the matching method and heat dissipation principle of the first heat dissipation portion 11, the elastic portion and the second heat dissipation portion 12 have been explained in the above-mentioned implementation of the heat dissipation device 1, so it will not be repeated here.

[0165] Figure 13 yes Figure 6 An exploded view of the cooling element of the optical module device is shown. Figure 14 yes Figure 6 An exploded view of the parts of the shunt element of the optical module device is shown.

[0166] Reference Figure 6 , Figure 13 and Figure 14 As shown, according to an embodiment of the present invention, the optical module device further comprises a flow dividing element 3, wherein the flow dividing element 3 has at least two branches. Each branch is respectively connected to a cooling element 13 and a liquid source storing a cooling medium, so as to distribute the cooling medium among different cooling elements 13.

[0167] Reference Figure 6 and Figure 13As shown, in some exemplary embodiments, the cooling element 13 includes, but is not limited to, a cold plate, specifically including a base plate 131, a cold tube 132, and a cover plate 133 covering the base plate 131 (and covering the cold tube 132). Specifically, the base plate 131 has a groove therein, which is U-shaped, and the corresponding cold tube 132 is also configured in a U-shaped structure to be embedded in the groove. Among them, one end of the U-shaped cold tube serves as the water inlet end, and the other end serves as the water return end.

[0168] Referring to Figure 14 As shown, in some exemplary embodiments, the flow splitting element 3 includes a water distribution base 31, a water distribution cover plate 32, a first water nozzle 33, and a second water nozzle 34. Specifically, the flow splitting element 3 is disposed outside the side plate of the bracket 2 having the second mounting hole 221 and covers the second mounting hole 221. Further, the water distribution base 31 has a water distribution groove and a water return groove provided therein, and the water distribution cover plate 32 closes the water distribution groove and the water return groove and is provided with through holes communicating with the cold tubes of the cold plate. Among them, the water inlet end and the water return end of the cold tube 132 are respectively connected to a through hole to communicate with the water distribution groove and the water return groove respectively. Further, the first water nozzle 33 and the second water nozzle 34 are also connected to the water distribution base 31 to introduce or discharge the cooling medium into or out of the flow splitting element 3.

[0169] The present invention also provides a switch, including the optical module device and the optical module 5 in the above-described embodiment, and the optical module 5 is disposed at the installation position of the optical module device. Among them, the optical module 5 is adapted to convert the electrical signal generated by the switch into an optical signal for transmission on the optical fiber; at the same time, the optical module 5 can also convert the received optical signal back into an electrical signal for use by the switch.

[0170] Based on a similar inventive concept, the present invention also provides a server, including the optical module device and the optical module 5 in the above-described embodiment, and the optical module 5 is disposed at the installation position of the optical module device. Among them, the optical module 5 is adapted to convert the electrical signal generated by the switch into an optical signal for transmission on the optical fiber; at the same time, the optical module 5 can also convert the received optical signal back into an electrical signal for use by the switch.

[0171] Based on a similar inventive concept, in the switch and the server, the optical module device has features similar to or the same as those in the above-described embodiment, and also has similar or the same functions based on these features. Therefore, they will not be described in detail.

[0172] The groove includes, but is not limited to, a U-shaped groove, an S-shaped groove, and grooves of any other shape. Further, the cold pipe 132 is located in the above groove, and a cooling medium is provided inside it. The cooling medium communicates with an external circulation mechanism (such as at least a part of a liquid source, a pump, and a heat exchanger) to carry the heat of the heating element to outside the cooling element 13 for heat exchange and then circulate with the heating element again for the next cycle. Among them, the substrate 131 includes, but is not limited to, being configured as a plate-like structure; further, the substrate 131 and / or the cold pipe 132 are made of, but are not limited to, copper, copper alloy, aluminum, aluminum alloy, stainless steel, and other materials with good thermal conductivity.

[0173] In addition, the cold plate also needs to be configured with interfaces to introduce or export the cooling medium. Moreover, the cold plate can also be configured with other heat dissipation structures such as fins to increase the heat exchange area. Further, the cover plate 133 covers the end face of the substrate 131 facing away from the second heat dissipation part 12 to protect the substrate 131 and the cold pipe 132, make the cooling element 13 more integral, and more aesthetically pleasing.

[0174] It should also be noted that the directional terms mentioned in the embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only for reference to the drawings and are not used to limit the protection scope of the present invention. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or configurations will be omitted when they may cause confusion in the understanding of the present invention.

[0175] The embodiments of the present invention have been described above. However, these embodiments are only for illustrative purposes and not for limiting the scope of the present invention. Although the embodiments have been described separately above, this does not mean that the measures in each embodiment cannot be used advantageously in combination. The scope of the present invention is defined by the appended claims and their equivalents. Without departing from the scope of the present invention, those skilled in the art can make various substitutions and modifications, and these substitutions and modifications should all fall within the scope of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A first heat dissipation portion (11) is configured to form heat conduction with the heating element; A second heat dissipation portion (12) configured to form heat conduction with the cooling element (13); an elastic portion (14) disposed on one of the first heat dissipation portion (11) and the second heat dissipation portion (12), and extending into a receiving groove (121) formed in the other; The elastic part (14) has an original state and a compressed state in which the elastic part (14) is deformed under pressure. The elastic part (14) in the original state has a first contact area with the other part. The elastic part (14) in the compressed state has a second contact area with the other part. The second contact area is larger than the first contact area, so that the elastic part (14) is connected to the other part and forms heat conduction. The elastic part (14) in the compressed state is configured to provide pressure to the first heat dissipation part (11) close to the heating element, so that the first heat dissipation part (11) is tightly attached to the heating element.

2. The heat dissipation device according to claim 1, characterized in that: The containing groove (121) has a groove opening (1211) and a groove cavity (1212); Wherein, the width of the notch (1211) is smaller than the width of the groove cavity (1212).

3. The heat dissipation device according to claim 1, characterized in that: The elastic portion (14) is arranged on the first heat dissipation portion (11), and the portion surrounded by the elastic portion (14) and the first heat dissipation portion (11) forms a through hole, or the elastic portion (14) is arranged on the second heat dissipation portion (12), and the portion surrounded by the elastic portion (14) and the second heat dissipation portion (12) forms a through hole; When the elastic part (14) is in the compressed state, the area of ​​the through hole is larger than the area of ​​the elastic part (14) when it is in the original state.

4. The heat dissipation device according to claim 1, characterized in that: At least a portion of the elastic portion (14) is located in the accommodating groove (121); When the elastic portion (14) is in the compressed state, the portion of the elastic portion (14) located in the accommodating groove (121) is compressed and deformed in a direction forming an angle with the pressure direction, and is confined in the accommodating groove (121).

5. The heat dissipation device according to claim 1, characterized in that: The first heat dissipation portion (11) is detachably connected to the second heat dissipation portion (12) via the elastic portion (14).

6. The heat dissipation device according to claim 2, characterized in that: The elastic portion (14) is arranged on one of the first heat dissipation portion (11) and the second heat dissipation portion (12), and the other of the first heat dissipation portion (11) and the second heat dissipation portion (12) is provided with a receiving groove (121); Wherein, the elastic portion (14) faces the accommodating groove (121) and extends into the accommodating groove (121).

7. The heat dissipation device according to claim 6, characterized in that: The elastic portion (14) comprises: A connection end (141) is arranged on the first heat dissipation portion (11) or the second heat dissipation portion (12); A deformation end (142) is arranged at the connection end (141) and extends into the accommodation groove (121); Wherein, at least the deformable end (142) is made of elastic material so as to deform when subjected to pressure close to the connecting end (141), so that at least a portion of the deformable end (142) fits tightly against the inner wall of the containing groove (121).

8. The heat dissipation device according to claim 7, characterized in that: The depth of the groove cavity (1212) is less than the height of the deformation end (142).

9. The heat dissipation device according to claim 8, characterized in that: The elastic portion (14) is bent to form an elliptical arc segment with an opening to serve as the deformation end (142), and the opening portion of the elliptical arc segment is bent in a direction away from the opening to form the connection end (141).

10. The heat dissipation device according to claim 9, characterized in that: The length of the major axis of the deformation end (142) is configured to be greater than the depth of the groove cavity (1212), and the length of the minor axis of the deformation end (142) is configured to be greater than the width of the notch (1211) and less than the width of the groove cavity (1212).

11. The heat dissipation device according to claim 10, characterized in that: The length of the inner circumference of the groove cavity (1212) is configured to be less than or equal to the length of the elliptical arc segment.

12. The heat dissipation device according to any one of claims 8 to 11, characterized in that: The cross-section of the groove cavity (1212) along the groove width direction is configured as one of a circular shape, an elliptical shape and a polygonal shape.

13. The heat dissipation device according to any one of claims 7 to 11, characterized in that: The elastic portion (14) comprises at least two deformation ends (142), and the at least two deformation ends (142) are arranged side by side and at intervals on the connection end (141).

14. The heat dissipation device according to any one of claims 7 to 11, characterized in that: The elastic portion (14) comprises at least two connecting ends (141), and one connecting end (141) is provided with at least one deforming end (142); Wherein, at least two of the connection ends (141) are arranged side by side and at intervals on the first heat dissipation portion (11) or the second heat dissipation portion (12).

15. The heat dissipation device according to any one of claims 7 to 11, characterized in that: The elastic portion (14) is arranged on the first heat dissipation portion (11).

16. The heat dissipation device according to claim 15, characterized in that: The first heat dissipation portion (11) has a first surface (111) and a second surface (112) which are opposite to each other; Wherein, the first surface (111) faces the heating element, and the elastic portion (14) is arranged on the second surface (112).

17. The heat dissipation device according to claim 16, characterized in that: The second heat dissipation portion (12) has a third surface (122) facing the first heat dissipation portion (11), and a portion of the third surface (122) facing the elastic portion (14) is provided with the accommodation groove (121); Wherein, the deformed end (142) of the elastic portion (14) extends into the accommodating groove (121).

18. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The second heat dissipation portion (12) is formed on the cooling element (13); Alternatively, the second heat dissipation portion (12) is connected to the cooling element (13).

19. The heat dissipation device according to claim 18, characterized in that: At least two of the second heat dissipation parts (12) form heat conduction with the same cooling element (13); Furthermore, at least two of the second heat dissipation parts (12) are each configured with one of the first heat dissipation parts (11), so that at least two of the first heat dissipation parts (11) are arranged in an array form; The array form includes at least one of a row array, a column array and a ring array.

20. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The first heat dissipation portion (11) and / or the second heat dissipation portion (12) are configured as a plate-shaped structure.

21. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The cooling element (13) comprises: substrate(131); A cooling pipe (132) is arranged on the substrate (131) and forms heat conduction with the substrate (131), wherein a circulating cooling medium is contained in the cooling pipe (132); Wherein, the second heat dissipation portion (12) is formed on the substrate (131), or the second heat dissipation portion (12) is connected to the substrate (131).

22. The heat dissipation device according to claim 21, characterized in that: The cooling element (13) further comprises a cover plate (133), wherein the cover plate (133) is disposed on the base plate (131).

23. An optical module device, characterized in that: include: A bracket (2) provided with at least one mounting position (26) for mounting an optical module (5); a cooling element (13) disposed above the mounting position (26); and The heat dissipation device (1) according to any one of claims 1 to 22, is arranged at the bottom of the cooling element (13) and is suspended above the installation position (26).

24. The optical module device according to claim 23, characterized in that: When the optical module (5) is installed at the installation position (26), the second heat dissipation portion (12) of the heat dissipation device (1), the first heat dissipation portion (11) of the heat dissipation device (1) and the optical module (5) are stacked; The elastic portion (14) of the heat dissipation device (1) is located between the second heat dissipation portion (12) and the first heat dissipation portion (11) and is in a compressed state so as to be connected to the second heat dissipation portion (12) and form heat conduction, and also to enable the first heat dissipation portion (11) to fit tightly to the optical module.

25. The optical module device according to claim 24, characterized in that: Each of the mounting positions (26) is used to mount one of the optical modules (5), and one of the optical modules (5) abuts against one of the first heat dissipation portions (11).

26. The optical module device according to claim 23, characterized in that: The bracket (2) comprises a first installation area and a second installation area which are stacked; Wherein, the first installation area and the second installation area respectively have at least one installation position (26); The optical module device comprises at least two cooling elements (13), a portion of the cooling elements (13) being arranged in the first installation area, and another portion of the cooling elements (13) being arranged in the second installation area.

27. The optical module device according to claim 26, characterized in that: The bracket (2) comprises a top plate (21) and a bottom plate (25) arranged facing each other, and a side plate (22) arranged between the top plate (21) and the bottom plate (25), wherein a portion surrounded by the top plate (21), the bottom plate (25) and the side plate (22) forms a receiving space; The bracket further comprises a first partition plate (23) arranged between two opposite side plates (22) to divide the accommodation space into the first installation area and the second installation area in a stacked manner.

28. The optical module device according to claim 27, characterized in that: The top plate (21) and the first partition plate (23) are provided with a first mounting hole (211); The first heat dissipation portion (11) abuts against the first partition plate (23), and the elastic portion (14) arranged on the first heat dissipation portion (11) is connected to the second heat dissipation portion (12) via the first mounting hole (211).

29. The optical module device according to claim 28, characterized in that: The support (2) further comprises a second partition (27), wherein the second partition (27) is arranged on the first partition (23) in parallel and at intervals; At least one of the cooling elements (13) is located above the top plate (21), and at least another of the cooling elements (13) is located between the second baffle plate (27) and the first baffle plate (23).

30. The optical module device according to claim 27, characterized in that: The bracket (2) further comprises a third partition plate (24), wherein the third partition plate (24) is arranged between the top plate (21) and the bottom plate (25), and the third partition plate (24), the first partition plate (23) and the top plate (21) or the bottom plate (25) define the installation position (26); The side plate (22) and the third partition plate (24) both have a second mounting hole (221) extending through the side plate (22) in a first direction, and the cooling element (13) is disposed on the side plate (22) and the third partition plate (24) through the second mounting hole (221).

31. The optical module device according to claim 30, characterized in that: Also includes: a wiring portion (6) configured to be electrically connected to the optical module (5) so as to electrically connect the optical module (5) to the circuit structure (4), and the wiring portion (6) is arranged at an end portion of the bracket (2) along the second direction; The first direction is orthogonal to the second direction.

32. The optical module device according to any one of claims 26 to 31, characterized in that: It also includes a shunt element (3), wherein the shunt element (3) has at least two branches; Each of the branches is respectively connected to one of the cooling elements (13) and a liquid source storing a cooling medium, so as to distribute the cooling medium between different cooling elements (13).

33. A switch, characterized in that: include: The optical module device as claimed in any one of claims 23 to 32; as well as The optical module (5) is arranged at the installation position (26) of the optical module device.

34. A server, characterized in that: include: The optical module device as claimed in any one of claims 23 to 32; as well as The optical module (5) is arranged at the installation position (26) of the optical module device.

Images