Display substrate and preparation method thereof

Abstract

At least one embodiment of the invention provides a display substrate and a preparation method thereof. The display substrate comprises a substrate; the pixel units are arranged on the substrate in an array mode, each pixel unit comprises a plurality of sub-pixels emitting light of different colors, and each sub-pixel comprises a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; the pixel defining layer is arranged on one side, far away from the substrate, of the pixel driving circuit; the pixel defining layer comprises a plurality of pixel openings, each pixel opening corresponds to a sub-pixel, and according to the embodiment of the invention, the preparation of the RGB full-color OLED pixelated device is realized through a graphical technology of depositing the light-emitting layer and the functional layer with different colors for three times and exposing and etching for two times; the problem that the display resolution cannot be further improved when an AMOLED evaporation technology is expanded to a medium-and-large-size display product is solved, and the resolution and the display effect of a display device are improved.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a display substrate and a method for preparing the same. Background Art

[0002] Compared with liquid crystal display panels, organic light emitting diodes (OLEDs) are self-luminous display devices that do not require any light source, that is, active light emitting display devices, and organic light emitting diodes have the advantages of high light efficiency, wide viewing angle, high contrast, low driving voltage, extremely high response speed, thinness, flexibility and low cost, etc., and thus have good development prospects in the field of display technology. With the continuous development of display technology, flexible display devices (Flexible Display) using OLED as a light-emitting device and signal control by thin film transistors (TFTs) have become the mainstream products in the current display field. With the continuous development of display technology, optimizing display effects has become an inevitable trend.

[0003] The organic light emitting display device includes an organic light emitting diode corresponding to the self-luminous element, and the organic light emitting diode includes an emission layer formed between two electrodes. The organic light emitting diode generates excitons by injecting electrons and holes into the emission layer via an electron injection electrode (i.e., cathode) and a hole injection electrode (i.e., anode) and recombining the electrodes and holes in the emission layer, and the organic light emitting diode emits light when the excitons are converted from an excited state to a ground state. Light emitting diodes are classified into top emission mode, bottom emission mode, and bidirectional emission mode according to different light emission directions. Organic light emitting display devices can also be divided into passive matrix type and active matrix type. Summary of the invention

[0004] At least one embodiment of the present disclosure provides a display substrate and a preparation method thereof, wherein the display substrate comprises: a base substrate; pixel units arranged in an array on the base substrate, wherein each pixel unit comprises a plurality of sub-pixels emitting light of different colors, each sub-pixel comprises a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; a pixel defining layer arranged on a side of the pixel driving circuit away from the base substrate; the pixel defining layer comprises a plurality of pixel openings, each pixel opening corresponding to a sub-pixel. The embodiment of the present disclosure realizes the preparation of an RGB full-color OLED pixelated device by respectively depositing a light-emitting layer and a functional layer of different colors three times and a graphic technique of two exposure etchings, thereby solving the problem that the display resolution cannot be further improved when the AMOLED evaporation technology is expanded to medium and large-sized display products, and also improves the resolution and display effect of the display device.

[0005] At least one embodiment of the present disclosure provides a display substrate, which includes: a base substrate; pixel units arranged in an array on the base substrate, wherein each of the pixel units includes a plurality of sub-pixels emitting light of different colors, and each of the sub-pixels includes a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; a pixel defining layer arranged on a side of the pixel driving circuit away from the base substrate; wherein the pixel defining layer includes a plurality of pixel openings, and each of the pixel openings corresponds to one sub-pixel.

[0006] For example, in the display substrate provided in at least one embodiment of the present disclosure, each of the pixel units includes three sub-pixels, and the light-emitting element corresponding to each of the sub-pixels includes a first electrode and a light-emitting unit that are stacked; the light-emitting units included in the three sub-pixels in the same pixel unit respectively include a first color light-emitting layer, a second color light-emitting layer and a third color light-emitting layer; a second electrode is provided on a side of the light-emitting unit away from the base substrate, and a shielding layer is provided on a side of the second electrode away from the base substrate; a third color retaining film layer is provided at a position of the shielding layer away from the second color light-emitting layer and at a position away from the first color light-emitting layer.

[0007] For example, in the display substrate provided in at least one embodiment of the present disclosure, a second color retaining film layer is further provided at a position of the shielding layer away from the first color light-emitting layer, and the second color retaining film layer and the third color retaining film layer are stacked sequentially in a direction away from the base substrate.

[0008] For example, in the display substrate provided by at least one embodiment of the present disclosure, the maximum distance between the third color retaining film layer and the first color light-emitting layer at a position of the shielding layer far away from the first color light-emitting layer is different from the maximum distance between the third color retaining film layer and the second color light-emitting layer at a position of the shielding layer far away from the second color light-emitting layer.

[0009] For example, in the display substrate provided in at least one embodiment of the present disclosure, a packaging structure is provided on a side of the third color retaining film layer away from the base substrate.

[0010] For example, in the display substrate provided in at least one embodiment of the present disclosure, the display substrate includes a display area and a peripheral area arranged around the display area; in the peripheral area, a first common voltage connection line, a second common voltage connection line and a third common voltage connection line are sequentially arranged from a position close to the display area to a position far from the display area; in each of the pixel units, the light-emitting element includes a first light-emitting element, a second light-emitting element and a third light-emitting element, and the first common voltage connection line, the second common voltage connection line and the third common voltage connection line are electrically connected to the first light-emitting element, the second light-emitting element and the third light-emitting element, respectively.

[0011] For example, in the display substrate provided in at least one embodiment of the present disclosure, the pixel defining layer also includes a plurality of spacers that separate adjacent pixel openings, an auxiliary electrode is provided in each of the spacers, and the auxiliary electrode and the second electrode are electrically connected through a first via structure.

[0012] For example, in the display substrate provided in at least one embodiment of the present disclosure, the auxiliary electrode includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a metal oxide layer stacked in sequence from a position close to the base substrate to a position far away from the base substrate.

[0013] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thickness of the first titanium metal layer ranges from 100 angstroms to 800 angstroms, the thickness of the aluminum metal layer ranges from 2000 angstroms to 6000 angstroms, the thickness of the second titanium metal layer ranges from 100 angstroms to 500 angstroms, and the thickness of the metal oxide layer ranges from 100 angstroms to 300 angstroms.

[0014] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thicknesses of the first titanium metal layer, the aluminum metal layer, the second titanium metal layer and the metal oxide layer are 500 angstroms, 5000 angstroms, 300 angstroms and 200 angstroms, respectively.

[0015] For example, in the display substrate provided in at least one embodiment of the present disclosure, the pixel defining layer also includes a plurality of spacers, the plurality of spacers include a first spacer, a second spacer and a third spacer that are adjacent to each other in sequence, the first electrode is arranged between the first spacer and the second spacer, and a connecting electrode is arranged between the second spacer and the third spacer.

[0016] For example, in the display substrate provided by at least one embodiment of the present disclosure, the first electrode and the connecting electrode are formed by using the same material in the same process step, and the first electrode and the connecting electrode are spaced apart from each other.

[0017] For example, in the display substrate provided in at least one embodiment of the present disclosure, an auxiliary electrode is further provided on the side of the layer where the pixel driving circuit is located away from the base substrate, a planarization layer is further provided between the auxiliary electrode and the pixel defining layer, the connecting electrode and the auxiliary electrode are electrically connected through a second via structure located in the planarization layer, and the connecting electrode and the second electrode are electrically connected.

[0018] For example, in the display substrate provided in at least one embodiment of the present disclosure, a plurality of the auxiliary electrodes are connected to form a grid structure.

[0019] For example, in the display substrate provided in at least one embodiment of the present disclosure, the auxiliary electrode includes a stacked structure formed by a molybdenum metal layer, a copper metal layer, a titanium metal layer, an aluminum metal layer and a titanium metal layer, or a stacked structure formed by an indium tin oxide layer, a silver metal layer and an indium tin oxide layer.

[0020] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thickness of the auxiliary electrode is 1000 angstroms to 6000 angstroms, and the sheet resistance of the auxiliary electrode is 0 to 0.5 Ω / sq.

[0021] For example, in the display substrate provided in at least one embodiment of the present disclosure, the connection resistance between the second electrode and the connection electrode is 0 to 0.1Ω.

[0022] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first light-emitting element, the second light-emitting element and the third light-emitting element are electrically connected to the power supply voltage line through the first common voltage connection line, the second common voltage connection line and the third common voltage connection line, respectively.

[0023] For example, in the display substrate provided in at least one embodiment of the present disclosure, the light-emitting unit includes a functional layer and a light-emitting layer which are stacked, and the functional layer includes a hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer which are stacked in a direction away from the first electrode in sequence, and the light-emitting layer is arranged between the hole transport layer and the electron transport layer, and the light-emitting layer includes the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer; the third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color light-emitting retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

[0024] For example, in the display substrate provided in at least one embodiment of the present disclosure, the light-emitting unit includes a functional layer and a light-emitting layer which are stacked, and the functional layer includes a hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer which are stacked in a direction away from the first electrode in sequence, and the light-emitting layer is arranged between the hole transport layer and the electron transport layer, and the light-emitting layer includes the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer; the second color retaining film layer includes a second hole injection retaining layer, a second hole transport retaining layer, a second color light-emitting retaining layer, a second electron transport retaining layer, a second electron injection retaining layer, a second electrode retaining second sublayer and a second shielding retaining layer which are stacked; and the third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color light-emitting retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

[0025] For example, in the display substrate provided in at least one embodiment of the present disclosure, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit which are stacked, and the second electrode is arranged on a side of the second light-emitting unit away from the base substrate.

[0026] For example, in the display substrate provided in at least one embodiment of the present disclosure, the light-emitting layer includes a first organic emission layer and a second organic emission layer which are stacked; the first color light-emitting layer includes a first color light-emitting first sublayer and a first color light-emitting second sublayer which are stacked; the second color light-emitting layer includes a second color light-emitting first sublayer and a second color light-emitting second sublayer which are stacked; the third color light-emitting layer includes a third color light-emitting first sublayer and a third color light-emitting second sublayer which are stacked; the first light-emitting unit includes the first organic emission layer, and the first organic emission layer includes the first color light-emitting first sublayer, the second color light-emitting first sublayer and the third color light-emitting first sublayer; the second light-emitting unit includes the second organic emission layer, and the second organic emission layer includes the first color light-emitting second sublayer, the second color light-emitting second sublayer and the third color light-emitting second sublayer.

[0027] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thickness of the first color luminescent first sublayer and the thickness of the first color luminescent second sublayer are different from each other; the thickness of the second color luminescent first sublayer and the second color luminescent second sublayer are different from each other; the thickness of the third color luminescent first sublayer and the third color luminescent second sublayer are different from each other.

[0028] For example, in the display substrate provided in at least one embodiment of the present disclosure, the sum of the thicknesses of the first color emitting first sublayer and the first color emitting second sublayer, the sum of the thicknesses of the second color emitting first sublayer and the second color emitting second sublayer, and the sum of the thicknesses of the third color emitting first sublayer and the third color emitting second sublayer are different from each other.

[0029] For example, in the display substrate provided in at least one embodiment of the present disclosure, a charge generation layer is arranged at least between the first color light-emitting first sublayer and the first color light-emitting second sublayer, and / or between the second color light-emitting first sublayer and the second color light-emitting second sublayer, and / or between the third color light-emitting first sublayer and the third color light-emitting second sublayer.

[0030] For example, in the display substrate provided in at least one embodiment of the present disclosure, the charge generation layer includes a first charge generation layer and a second charge generation layer which are stacked.

[0031] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first charge generation layer and the second charge generation layer are constructed according to a PN junction structure.

[0032] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first light-emitting unit includes a stacked hole injection layer, a first hole transport layer, a first electron blocking layer, the first organic emission layer, a first hole blocking layer, a first electron transport layer and the first charge generating layer; the second light-emitting unit includes a stacked second charge generating layer, a second hole transport layer, a second electron blocking layer, the second organic emission layer, a second hole blocking layer, a second electron transport layer and an electron injection layer.

[0033] For example, in the display substrate provided in at least one embodiment of the present disclosure, the third color retaining film layer includes a first part and a second part which are stacked, the first part includes a third hole injection retaining layer, a third hole transport first retaining layer, a third electron blocking first retaining layer, a third color light emitting first retaining layer, a third hole blocking first retaining layer, a third electron transport first retaining layer and a third charge generating first retaining layer which are stacked, and the second part includes a third charge generating second retaining layer, a third hole transport second retaining layer, a third electron blocking second retaining layer, a third color light emitting second retaining layer, a third hole blocking second retaining layer, a third electron transport second retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

[0034] For example, in the display substrate provided in at least one embodiment of the present disclosure, the third color retaining film layer includes a first part and a second part which are stacked, the first part includes a third hole injection retaining layer, a third hole transport first retaining layer, a third electron blocking first retaining layer, a third color luminescent first retaining layer, a third hole blocking first retaining layer, a third electron transport first retaining layer and a third charge generating first retaining layer which are stacked, and the second part includes a third charge generating second retaining layer, a third hole transport second retaining layer, a third electron blocking second retaining layer, a third color luminescent second retaining layer, a third hole blocking second retaining layer, a third electron transport second retaining layer, a third electron injection retaining layer and a second electrode retaining third layer which are stacked. sublayer and a third shielding retention layer; and the second color retaining film layer includes a third part and a fourth part stacked, the third part includes a second hole injection retention layer, a second hole transport first retention layer, a second electron blocking first retention layer, a second color luminescent first retention layer, a second hole blocking first retention layer, a second electron transport first retention layer, and a second charge generating first retention layer stacked, the fourth part includes a second charge generating second retention layer, a second hole transport second retention layer, a second electron blocking second retention layer, a second color luminescent second retention layer, a second hole blocking second retention layer, a second electron transport second retention layer, a second electron injection retention layer, a second electrode retaining second sublayer and a second shielding retention layer stacked.

[0035] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer are respectively a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer, the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer are all phosphorescent light-emitting layers, and the third color light-emitting layer also contains a boron element.

[0036] For example, in the display substrate provided in at least one embodiment of the present disclosure, the red light-emitting layer, the green light-emitting layer and the blue light-emitting layer all include a matrix material and a phosphorescent material, and the molecular weight of the phosphorescent material included in the red light-emitting layer is greater than the molecular weight of the phosphorescent material included in the green light-emitting layer, and greater than the molecular weight of the phosphorescent material included in the blue light-emitting layer.

[0037] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first electrode includes a reflective metal layer and a transparent conductive layer that are stacked.

[0038] For example, in the display substrate provided in at least one embodiment of the present disclosure, the material of the reflective metal layer includes at least one of aluminum and silver, and the material of the transparent conductive layer includes at least one of indium tin oxide and indium zinc oxide.

[0039] For example, in the display substrate provided in at least one embodiment of the present disclosure, the second electrode includes a single-layer structure or a multi-layer structure formed of at least one of silver, aluminum, magnesium, lithium, calcium, lithium fluoride, indium tin oxide and indium zinc oxide.

[0040] For example, in the display substrate provided in at least one embodiment of the present disclosure, the transmittance of the first electrode is greater than 80%.

[0041] For example, in the display substrate provided in at least one embodiment of the present disclosure, the pixel driving circuit includes a plurality of thin film transistors, at least one of the thin film transistors is a metal oxide thin film transistor, and at least one of the thin film transistors is a low-temperature polysilicon thin film transistor.

[0042] At least one embodiment of the present disclosure further provides a display substrate, which includes: a base substrate; pixel units arranged in an array on the base substrate, wherein each of the pixel units includes a plurality of sub-pixels emitting light of different colors, and each of the sub-pixels includes a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; a pixel defining layer arranged on a side of the pixel driving circuit away from the base substrate; wherein the pixel defining layer includes a plurality of pixel openings, and each of the pixel openings corresponds to one of the sub-pixels; the pixel defining layer also includes a plurality of spacers that space adjacent pixel openings apart, and an auxiliary electrode is arranged in each of the spacers, and the auxiliary electrode and the second electrode are electrically connected through a first via structure.

[0043] For example, in the display substrate provided in at least one embodiment of the present disclosure, each of the pixel units includes three sub-pixels, and the light-emitting element corresponding to each of the sub-pixels includes a first electrode and a light-emitting unit that are stacked; the light-emitting units included in the three sub-pixels in the same pixel unit respectively include a first color light-emitting layer, a second color light-emitting layer and a third color light-emitting layer; a second electrode is provided on a side of the light-emitting unit away from the base substrate, and a shielding layer is provided on a side of the second electrode away from the base substrate; a third color retaining film layer is provided at a position of the shielding layer away from the second color light-emitting layer and at a position away from the first color light-emitting layer.

[0044] For example, in the display substrate provided in at least one embodiment of the present disclosure, a second color retaining film layer is further provided at a position of the shielding layer away from the first color light-emitting layer, and the second color retaining film layer and the third color retaining film layer are stacked sequentially in a direction away from the base substrate.

[0045] For example, in the display substrate provided by at least one embodiment of the present disclosure, the maximum distance between the third color retaining film layer and the first color light-emitting layer at a position of the shielding layer far away from the first color light-emitting layer is different from the maximum distance between the third color retaining film layer and the second color light-emitting layer at a position of the shielding layer far away from the second color light-emitting layer.

[0046] For example, in the display substrate provided in at least one embodiment of the present disclosure, a packaging structure is provided on a side of the third color retaining film layer away from the base substrate.

[0047] For example, in the display substrate provided in at least one embodiment of the present disclosure, the display substrate includes a display area and a peripheral area arranged around the display area; in the peripheral area, a first common voltage connection line, a second common voltage connection line and a third common voltage connection line are sequentially arranged from a position close to the display area to a position far from the display area; in each of the pixel units, the light-emitting element includes a first light-emitting element, a second light-emitting element and a third light-emitting element, and the first common voltage connection line, the second common voltage connection line and the third common voltage connection line are electrically connected to the first light-emitting element, the second light-emitting element and the third light-emitting element, respectively.

[0048] For example, in the display substrate provided in at least one embodiment of the present disclosure, the auxiliary electrode includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a metal oxide layer stacked in sequence from a position close to the base substrate to a position far away from the base substrate.

[0049] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thickness of the first titanium metal layer ranges from 100 angstroms to 800 angstroms, the thickness of the aluminum metal layer ranges from 2000 angstroms to 6000 angstroms, the thickness of the second titanium metal layer ranges from 100 angstroms to 500 angstroms, and the thickness of the metal oxide layer ranges from 100 angstroms to 300 angstroms.

[0050] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thicknesses of the first titanium metal layer, the aluminum metal layer, the second titanium metal layer and the metal oxide layer are 500 angstroms, 5000 angstroms, 300 angstroms and 200 angstroms, respectively.

[0051] For example, in the display substrate provided in at least one embodiment of the present disclosure, the auxiliary electrode includes a multi-layer structure stacked together, and the multi-layer structure included in the auxiliary electrode is connected in parallel through a via hole.

[0052] For example, the display substrate provided by at least one embodiment of the present disclosure further includes gate lines, data lines, power supply voltage signal lines and initialization signal lines, wherein the auxiliary electrode and at least one of the gate lines, data lines, power supply voltage signal lines and initialization signal lines are arranged in the same layer.

[0053] For example, the display substrate provided by at least one embodiment of the present disclosure also includes a gate line, a data line, a power supply voltage signal line, an initialization signal line, a reference voltage signal line and an induction voltage signal line, wherein the auxiliary electrode and at least one of the gate line, the data line, the power supply voltage signal line, the initialization signal line, the reference voltage signal line and the induction voltage signal line are arranged in the same layer.

[0054] For example, in the display substrate provided in at least one embodiment of the present disclosure, the light-emitting unit includes a functional layer and a light-emitting layer which are stacked, and the functional layer includes a hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer which are stacked in a direction away from the first electrode in sequence, and the light-emitting layer is arranged between the hole transport layer and the electron transport layer, and the light-emitting layer includes the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer; the third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color light-emitting retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

[0055] For example, in the display substrate provided in at least one embodiment of the present disclosure, the light-emitting unit includes a functional layer and a light-emitting layer which are stacked, and the functional layer includes a hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer which are stacked in a direction away from the first electrode in sequence, and the light-emitting layer is arranged between the hole transport layer and the electron transport layer, and the light-emitting layer includes the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer; the second color retaining film layer includes a second hole injection retaining layer, a second hole transport retaining layer, a second color light-emitting retaining layer, a second electron transport retaining layer and a second electron injection retaining layer which are stacked, a second electrode retaining second sublayer and a second shielding retaining layer; and the third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color light-emitting retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

[0056] For example, in the display substrate provided in at least one embodiment of the present disclosure, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit which are stacked, and the second electrode is arranged on a side of the second light-emitting unit away from the base substrate.

[0057] For example, in the display substrate provided in at least one embodiment of the present disclosure, the light-emitting layer includes a first organic emission layer and a second organic emission layer which are stacked; the first color light-emitting layer includes a first color light-emitting first sublayer and a first color light-emitting second sublayer which are stacked; the second color light-emitting layer includes a second color light-emitting first sublayer and a second color light-emitting second sublayer which are stacked; the third color light-emitting layer includes a third color light-emitting first sublayer and a third color light-emitting second sublayer which are stacked; the first light-emitting unit includes the first organic emission layer, and the first organic emission layer includes the first color light-emitting first sublayer, the second color light-emitting first sublayer and the third color light-emitting first sublayer; the second light-emitting unit includes the second organic emission layer, and the second organic emission layer includes the first color light-emitting second sublayer, the second color light-emitting second sublayer and the third color light-emitting second sublayer.

[0058] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thickness of the first color luminescent first sublayer and the thickness of the first color luminescent second sublayer are different from each other; the thickness of the second color luminescent first sublayer and the second color luminescent second sublayer are different from each other; the thickness of the third color luminescent first sublayer and the third color luminescent second sublayer are different from each other.

[0059] For example, in the display substrate provided in at least one embodiment of the present disclosure, the sum of the thicknesses of the first color emitting first sublayer and the first color emitting second sublayer, the sum of the thicknesses of the second color emitting first sublayer and the second color emitting second sublayer, and the sum of the thicknesses of the third color emitting first sublayer and the third color emitting second sublayer are different from each other.

[0060] For example, in the display substrate provided in at least one embodiment of the present disclosure, a charge generation layer is arranged at least between the first color light-emitting first sublayer and the first color light-emitting second sublayer, and / or between the second color light-emitting first sublayer and the second color light-emitting second sublayer, and / or between the third color light-emitting first sublayer and the third color light-emitting second sublayer.

[0061] For example, in the display substrate provided in at least one embodiment of the present disclosure, the charge generation layer includes a first charge generation layer and a second charge generation layer which are stacked.

[0062] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first charge generation layer and the second charge generation layer are constructed according to a PN junction structure.

[0063] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first light-emitting unit includes a stacked hole injection layer, a first hole transport layer, a first electron blocking layer, the first organic emission layer, a first hole blocking layer, a first electron transport layer and the first charge generating layer; the second light-emitting unit includes a stacked second charge generating layer, a second hole transport layer, a second electron blocking layer, the second organic emission layer, a second hole blocking layer, a second electron transport layer and an electron injection layer.

[0064] For example, in the display substrate provided in at least one embodiment of the present disclosure, the third color retaining film layer includes a first part and a second part which are stacked, the first part includes a third hole injection retaining layer, a third hole transport first retaining layer, a third electron blocking first retaining layer, a third color light emitting first retaining layer, a third hole blocking first retaining layer, a third electron transport first retaining layer and a third charge generating first retaining layer which are stacked, and the second part includes a third charge generating second retaining layer, a third hole transport second retaining layer, a third electron blocking second retaining layer, a third color light emitting second retaining layer, a third hole blocking second retaining layer, a third electron transport second retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

[0065] For example, in the display substrate provided in at least one embodiment of the present disclosure, the third color retaining film layer includes a first part and a second part stacked, the first part includes a third hole injection retaining layer, a third hole transport first retaining layer, a third electron blocking first retaining layer, a third color luminescent first retaining layer, a third hole blocking first retaining layer, a third electron transport first retaining layer and a third charge generating first retaining layer stacked, the second part includes a third charge generating second retaining layer, a third hole transport second retaining layer, a third electron blocking second retaining layer, a third color luminescent second retaining layer, a third hole blocking second retaining layer, a third electron transport second retaining layer, a third electron injection retaining layer, and a second retaining layer stacked. The electrode retains a third sublayer and a third shielding retaining layer; and the second color retaining film layer includes a third part and a fourth part arranged in a stacked manner, the third part includes a second hole injection retaining layer, a second hole transport first retaining layer, a second electron blocking first retaining layer, a second color luminescent first retaining layer, a second hole blocking first retaining layer, a second electron transport first retaining layer, and a second charge generating first retaining layer arranged in a stacked manner, and the fourth part includes a second charge generating second retaining layer, a second hole transport second retaining layer, a second electron blocking second retaining layer, a second color luminescent second retaining layer, a second hole blocking second retaining layer, a second electron transport second retaining layer, and a second electron injection retaining layer arranged in a stacked manner.

[0066] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer are respectively a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer, the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer are all phosphorescent light-emitting layers, and the third color light-emitting layer also contains a boron element.

[0067] For example, in the display substrate provided in at least one embodiment of the present disclosure, the red light-emitting layer, the green light-emitting layer and the blue light-emitting layer all include a matrix material and a phosphorescent material, and the molecular weight of the phosphorescent material included in the red light-emitting layer is greater than the molecular weight of the phosphorescent material included in the green light-emitting layer, and greater than the molecular weight of the phosphorescent material included in the blue light-emitting layer.

[0068] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first electrode includes a reflective metal layer and a transparent conductive layer that are stacked.

[0069] For example, in the display substrate provided in at least one embodiment of the present disclosure, the material of the reflective metal layer includes at least one of aluminum and silver, and the material of the transparent conductive layer includes at least one of indium tin oxide and indium zinc oxide.

[0070] For example, in the display substrate provided in at least one embodiment of the present disclosure, the second electrode includes a single-layer structure or a multi-layer structure formed of at least one of silver, aluminum, magnesium, lithium, calcium, lithium fluoride, indium tin oxide and indium zinc oxide.

[0071] For example, in the display substrate provided in at least one embodiment of the present disclosure, the transmittance of the first electrode is greater than 80%.

[0072] For example, in the display substrate provided in at least one embodiment of the present disclosure, the pixel driving circuit includes a plurality of thin film transistors, at least one of the thin film transistors is a metal oxide thin film transistor, and at least one of the thin film transistors is a low-temperature polysilicon thin film transistor.

[0073] At least one embodiment of the present disclosure further provides a method for preparing a display substrate, the method comprising: providing a base substrate; forming pixel units arranged in an array on the base substrate, wherein each of the pixel units comprises a plurality of sub-pixels emitting light of different colors, each of the sub-pixels comprises a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; forming a pixel defining layer on a side of the pixel driving circuit away from the base substrate; wherein the pixel defining layer comprises a plurality of pixel openings, each of the pixel openings corresponds to one of the sub-pixels, and each of the pixel units corresponds to a first color opening area, a second color opening area, and a second color opening area that are adjacent in sequence. opening area and a third color opening area; forming a first electrode in each of the pixel openings; forming a first color light-emitting layer, a first functional layer, a second electrode first sublayer and a first shielding layer at a position corresponding to the first color opening area; forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area; forming a third color light-emitting film, a third functional film, a second electrode third sublayer film and a third shielding film on the first shielding layer, the second shielding layer, the pixel defining layer and the first electrode corresponding to the third color opening area on a side away from the base substrate.

[0074] For example, in the preparation method provided by at least one embodiment of the present disclosure, the third color light-emitting film, the third functional film, the second electrode third sublayer film and the portion of the third blocking film corresponding to the position of the third color opening area serve as the third color light-emitting layer, the third functional layer, the second electrode third sublayer and the third blocking layer, respectively, and the remaining portion serves as the third color retaining film layer.

[0075] For example, in the preparation method provided by at least one embodiment of the present disclosure, the third functional layer includes a hole injection layer and a hole transport layer formed in sequence on a side of the third color light-emitting layer close to the first electrode, and an electron transport layer and an electron injection layer formed in sequence on a side of the third color light-emitting layer away from the first electrode; the third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color light-emitting retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer, which are respectively formed in sequence on a side of the first shielding layer and the second shielding layer away from the base substrate.

[0076] For example, in the preparation method provided in at least one embodiment of the present disclosure, in the process of forming the second color light-emitting layer, the second functional layer, the second electrode second sublayer and the second shielding layer at the position corresponding to the second color opening area, it also includes: forming a second color retaining film layer on the first shielding layer, and the second color retaining film layer is on the side of the third color retaining film layer close to the base substrate.

[0077] For example, in the preparation method provided in at least one embodiment of the present disclosure, the second color retention film layer includes a second hole injection retention layer, a second hole transport retention layer, a second color luminescence retention layer, a second electron transport retention layer, a second electron injection retention layer, a second electrode retention second sublayer and a second shielding retention layer which are sequentially formed on the side of the first shielding layer away from the base substrate.

[0078] For example, in the preparation method provided by at least one embodiment of the present disclosure, the third color light-emitting layer includes a third color light-emitting first sublayer and a third color light-emitting second sublayer which are stacked, and the third color light-emitting first sublayer is closer to the first electrode than the third color light-emitting second sublayer; the third functional layer includes a third functional first sublayer and a third functional second sublayer which are stacked, and the third functional first sublayer is closer to the first electrode than the third functional second sublayer; the third functional first sublayer includes a hole injection layer, a first hole transport layer and a first electron blocking layer which are sequentially formed on a side of the third color light-emitting first sublayer close to the first electrode, and a first hole blocking layer, a first electron transport layer and a first charge generating layer which are sequentially formed on a side of the third color light-emitting first sublayer away from the first electrode; the third functional second sublayer includes a third functional first sublayer and a third functional second sublayer which are stacked, and the third functional first sublayer is closer to the first electrode than the third functional second sublayer. The second charge generation layer, the second hole transport layer and the second electron blocking layer on one side of the first electrode, and the second hole blocking layer, the second electron transport layer and the electron injection layer are sequentially formed on the side of the third color light-emitting second sublayer away from the first electrode; the third color retaining film layer includes a third hole injection retaining layer, a third hole transport first retaining layer, a third electron blocking first retaining layer, a third color light-emitting first retaining layer, a third hole blocking first retaining layer, a third electron transport first retaining layer, a third charge generation first retaining layer, a third charge generation second retaining layer, a third hole transport second retaining layer, a third electron blocking second retaining layer, a third color light-emitting second retaining layer, a third hole blocking second retaining layer, a third electron transport second retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer, which are respectively formed in sequence on the side of the first shielding layer and the second shielding layer away from the substrate.

[0079] For example, in the preparation method provided in at least one embodiment of the present disclosure, in the process of forming the second color light-emitting layer, the second functional layer, the second electrode second sublayer and the second shielding layer at the position corresponding to the second color opening area, it also includes: forming a second color retaining film layer on the first shielding layer, and the second color retaining film layer is on the side of the third color retaining film layer close to the base substrate.

[0080] For example, in the preparation method provided by at least one embodiment of the present disclosure, the second color light-emitting layer includes a second color light-emitting first sublayer and a second color light-emitting second sublayer arranged in a stacked manner, and the second color light-emitting first sublayer is closer to the first electrode than the second color light-emitting second sublayer; the second functional layer includes a second functional first sublayer and a second functional second sublayer arranged in a stacked manner, and the second functional first sublayer is closer to the first electrode than the second functional second sublayer; the second functional first sublayer includes a hole injection layer, a first hole transport layer and a first electron blocking layer formed in sequence on a side of the second color light-emitting first sublayer close to the first electrode, and a first hole blocking layer, a first electron transport layer and a first charge generating layer formed in sequence on a side of the second color light-emitting first sublayer away from the first electrode; the second functional second sublayer includes a second functional first sublayer and a second functional second sublayer formed in sequence on a side of the second color light-emitting second sublayer close to the first electrode The second charge generating layer, the second hole transport layer and the second electron blocking layer on one side of the first electrode, and the second hole blocking layer, the second electron transport layer and the electron injection layer are sequentially formed on the side of the second color luminescent second sublayer away from the first electrode; the second color retaining film layer includes the second hole injection retaining layer, the second hole transport first retaining layer, the second electron blocking first retaining layer, the second color luminescent first retaining layer, the second hole blocking first retaining layer, the second electron transport first retaining layer, the second charge generating first retaining layer, the second charge generating second retaining layer, the second hole transport second retaining layer, the second electron blocking second retaining layer, the second color luminescent second retaining layer, the second hole blocking second retaining layer, the second electron transport second retaining layer, the second electron injection retaining layer, the second electrode retaining second sublayer and the second shielding retaining layer, which are respectively formed sequentially on the side of the first shielding layer and the second shielding layer away from the substrate.

[0081] For example, in the preparation method provided in at least one embodiment of the present disclosure, forming a first color light-emitting layer, a first functional layer, a second electrode first sublayer and a first blocking layer at a position corresponding to the first color opening area includes: forming a first color light-emitting film, a first functional film, a second electrode first sublayer film and a first blocking film on a side of the pixel defining layer and the first electrode away from the base substrate; forming a first photoresist layer on the first blocking film and at a position corresponding to the first color opening area; patterning the first blocking film using the first photoresist layer as a mask to form a first blocking layer; patterning the first color light-emitting film, the first functional film and the second electrode first sublayer film using the first blocking layer as a mask to form the first color light-emitting layer, the first functional layer and the second electrode first sublayer.

[0082] For example, in the preparation method provided in at least one embodiment of the present disclosure, forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area includes: forming a second color light-emitting film, a second functional film, a second electrode second sublayer film and a second shielding film on the first shielding layer, the pixel defining layer and the side of the first electrode corresponding to the second color opening area and the third color opening area away from the base substrate; forming a second photoresist layer on the second shielding film and at a position corresponding to the first color opening area and the second color opening area; patterning the second shielding film using the second photoresist layer as a mask to form a second shielding layer; patterning the second color light-emitting film, the second functional film and the second electrode second sublayer film using the second shielding layer as a mask to form the second color light-emitting layer, the second functional layer and the second electrode second sublayer, and forming a second color retaining film layer on the first shielding layer.

[0083] For example, in the preparation method provided in at least one embodiment of the present disclosure, forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area includes: forming a second color light-emitting film, a second functional film, a second electrode second sublayer film and a second shielding film on the first shielding layer, the pixel defining layer and the side of the first electrode corresponding to the second color opening area and the third color opening area away from the base substrate; forming a second photoresist layer on the second shielding film and at a position corresponding to the second color opening area; patterning the second shielding film using the second photoresist layer as a mask to form a second shielding layer, and removing the second color retaining film layer on the first shielding layer; patterning the second color light-emitting film, the second functional film and the second electrode second sublayer film using the second shielding layer as a mask to form the second color light-emitting layer, the second functional layer and the second electrode second sublayer.

[0084] For example, the manufacturing method provided by at least one embodiment of the present disclosure further includes forming a packaging structure on a side of the third blocking film away from the base substrate.

[0085] For example, in the preparation method provided in at least one embodiment of the present disclosure, the pixel defining layer includes a plurality of spacers that separate adjacent pixel openings, and before forming the pixel defining layer, an auxiliary electrode is also formed, and the auxiliary electrode is arranged in each of the spacers, and the auxiliary electrode and the second electrode are electrically connected through a first via structure.

[0086] For example, in the preparation method provided by at least one embodiment of the present disclosure, the pixel defining layer includes a plurality of spacers that separate adjacent pixel openings, and the plurality of spacers include a first spacer, a second spacer, and a third spacer that are adjacent to each other in sequence. In the process of forming the first electrode between the first spacer and the second spacer, a connecting electrode is also formed between the second spacer and the third spacer.

[0087] For example, in the preparation method provided in at least one embodiment of the present disclosure, after forming the pixel driving circuit and before forming the pixel defining layer, it also includes forming an auxiliary electrode, a planarization layer and a second via structure passing through the planarization layer, the auxiliary electrode is arranged in the planarization layer, and the connecting electrode and the auxiliary electrode are electrically connected through the second via structure.

[0088] For example, in the preparation method provided in at least one embodiment of the present disclosure, the display substrate includes a display area and a peripheral area arranged around the display area; in the peripheral area, a first common voltage connection line, a second common voltage connection line and a third common voltage connection line are sequentially formed from a position close to the display area to a position far from the display area; the first common voltage connection line, the second common voltage connection line and the third common voltage connection line are electrically connected to a first light-emitting element, a second light-emitting element and a third light-emitting element including the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting film, respectively.

[0089] For example, in the preparation method provided in at least one embodiment of the present disclosure, the first light-emitting element, the second light-emitting element and the third light-emitting element are electrically connected to the power supply voltage line through the first common voltage connection line, the second common voltage connection line and the third common voltage connection line, respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0090] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, but are not intended to limit the present disclosure.

[0091] Figure 1 A schematic diagram of a cross-sectional structure of a display substrate provided in at least one embodiment of the present disclosure;

[0092] Figure 2 A schematic diagram of a circuit structure of a pixel circuit provided in one embodiment of the present disclosure;

[0093] Figure 3 for Figure 2 A timing diagram of a driving method of a pixel circuit;

[0094] Figure 4 A schematic cross-sectional structure diagram of yet another display substrate provided in at least one embodiment of the present disclosure;

[0095] Figure 5 A schematic diagram of a planar structure of a display substrate provided in at least one embodiment of the present disclosure;

[0096] Figure 6 for Figure 5 The cross-sectional structure schematic diagram of the display substrate is shown;

[0097] Figure 7 for Figure 6 The scanning electron microscope image of the cross-sectional structure of the display substrate is shown;

[0098] Figure 8 A schematic diagram of a planar structure of another display substrate provided in at least one embodiment of the present disclosure;

[0099] Fig. 9 for Figure 8 The cross-sectional structure schematic diagram of the display substrate is shown;

[0100] Fig.10 A schematic cross-sectional structure diagram of a partial structure of another display substrate provided in at least one embodiment of the present disclosure;

[0101] Fig.11 for Fig.10 A schematic diagram of the planar structure of the first electrode and the connecting electrode shown;

[0102] Fig.12 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure;

[0103] Fig.13 A schematic cross-sectional structure diagram of another display substrate provided for at least one embodiment of the present disclosure;

[0104] Fig.14 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure;

[0105] Fig.15 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure;

[0106] Fig.16 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure;

[0107] Fig.17 A schematic diagram of a planar structure of another display substrate provided for at least one embodiment of the present disclosure;

[0108] Fig.18 for Fig.17 The cross-sectional structure schematic diagram of the display substrate is shown;

[0109] Fig.19 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure;

[0110] Fig. 20 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure;

[0111] Fig.21 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure;

[0112] Fig. 22 A flow chart of a method for preparing a display substrate provided for at least one embodiment of the present disclosure;

[0113] Figure 23 to Figure 29A process diagram of a method for preparing a display substrate provided in at least one embodiment of the present disclosure;

[0114] Figure 23 to Figure 30 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure;

[0115] Figure 31 to Figure 37 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure;

[0116] Figure 31 to Figure 38 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure;

[0117] Figure 31 to Figure 37 and Figure 39 to Figure 41 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure;

[0118] Figure 31 to Figure 37 and Figure 39 to Figure 42 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure;

[0119] Figure 31 to Figure 37 and Figure 39 to Figure 43 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure;

[0120] Figure 23 to Figure 29 and Figures 44 to 49 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure;

[0121] Figure 23 to Figure 29 and Figures 44 to 50 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure; and

[0122] Figure 23 to Figure 29 and Figures 44 to 51 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0123] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0124] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0125] Unless otherwise defined, the features such as "parallel", "perpendicular" and "same" used in the embodiments of the present invention include the situations of "parallel", "perpendicular", "same" in a strict sense, as well as the situations of "approximately parallel", "approximately perpendicular", "approximately the same", etc., which contain certain errors. For example, the above-mentioned "approximately" may mean that the difference of the compared objects is within 10% or 5% of the average value of the compared objects. When the number of a component or element is not specifically indicated in the following text of the embodiments of the present invention, it means that the component or element may be one or more, or may be understood as at least one. "At least one" refers to one or more, and "multiple" refers to at least two. The "same-layer arrangement" in the embodiments of the present invention refers to the relationship between multiple film layers formed by the same material after the same step (for example, a one-step patterning process). The "same layer" here does not always mean that the thickness of multiple film layers is the same or the height of multiple film layers in the cross-sectional view is the same.

[0126] The mass production process route of active matrix organic light emitting diode (AMOLED) display technology can be divided into large-size technology and small and medium-size technology. Due to the advantages of RGB full-color display technology such as good display effect (high color purity), brilliant colors, high brightness and low power consumption, it occupies the vast majority of the market share on the mobile side. With the development of display technology, active matrix organic light emitting diodes have gradually expanded to fields such as automotive and artificial intelligence. However, due to the current level of evaporation and fine metal mask (FMM) technology, G6 (1500*1850mm) and above generation lines are still immature, and the cost of low-generation line cutting technology is too high, so it is impossible to take into account both cost and mass production efficiency. The current sixth-generation OLED production line uses a "half-cut" cutting method, but this method has the disadvantage of low utilization of the glass substrate. Therefore, it is particularly important to develop a full-color solution that is not limited by FMM technology.

[0127] As the number of production line generations increases, the size of the equipment increases, and the scale of investment also increases accordingly, that is, the investment scale of the 6th generation production line is much larger than that of the 4.5th generation production line. Taking the rigid AMOLED production line as an example, the total investment of the 4.5th generation production line is about 5 billion to 7 billion based on the production capacity of 15K / month, and the total investment of the 6th generation production line is about 10 billion to 14 billion based on the production capacity of 15K / month. Without considering other factors, the area of ​​the glass substrate obtained by the high-generation production line is larger, the economic effect is more obvious and the output is higher. The fixed asset investment cost per unit area of ​​the display panel formed by the high-generation production line is significantly reduced.

[0128] In addition, the main cutting size of the 4.5-generation AMOLED production line is 1 to 4 inches, and the main products cut are smaller panel products such as smart wearables. The 6th-generation AMOLED production line is mainly used to cut products with a size of 5 to 17 inches, for example, smartphones, tablets / laptops and other products with larger panel sizes. Based on the consideration of cutting effectiveness, large-size substrates are used to cut larger-size products to avoid the waste of substrate area caused by cutting larger-size products with small-size substrates, thereby increasing the utilization efficiency of the substrate and reducing costs. Moreover, there is currently no mature and stable FMM technology for substrate sizes above the G6 generation, which makes it impossible to produce similar substrates like the production line of liquid crystal display panels. The larger the substrate size, the lower the cost per unit area.

[0129] Based on the current G6 generation flexible LTPs-AMOLED production line design, the drive circuit is first prepared on a flexible substrate with a size of 1500*1850. For example, the drive circuit includes a pixel circuit, a GOA circuit, an EOA circuit, a capacitor, and an ESD, etc., and then it is cut into two pieces (one piece into two pieces) to become a substrate with a size of 1500*925mm. Then, the FMM technology is used for RGB full-color display device evaporation and thin film packaging and other process processes. Such a process design makes the substrate have disadvantages in cutting efficiency, preparation yield, production cost, and medium and large size high-resolution product planning. For example, in the process of cutting the substrate into two pieces, a cutting area and a buffer area with a width of 10 to 50mm need to be reserved. Compared with the technical solution of full-size evaporation, a certain proportion of the substrate area is sacrificed, which reduces the production efficiency of the substrate per unit area, resulting in a decrease in cutting efficiency. Moreover, the substrate will produce fragmentation losses in the process of cutting the substrate into two pieces, thereby reducing the yield. Evaporation after the split also reduces the efficiency of the back-end packaging process, so it is necessary to improve the preparation yield and efficiency.

[0130] The inventors of the present disclosure have noticed that full-size array processes, evaporation processes and packaging processes can be used to improve output efficiency, and FMM technology can be used to achieve RGB graphic film formation and prepare independent light-emitting devices, thereby saving the manufacturing cost and cleaning cost of FMM. In addition, only some of the original equipment of the production line (for example, exposure machines and etcher) is needed to prepare RGB pixels, so that the position accuracy of the formed devices is higher, so as to avoid the occurrence of undesirable phenomena such as color mixing and coating position offset. Moreover, as the size of display products increases, the difficulty of FMM processing also increases significantly, especially the high-resolution (ppi>320) FMM technology, but according to the current exposure (CD>2.0μm) and etching process levels (Space>2.0μm), the preparation of large-size and high-resolution display products is no longer a major challenge, and the solution can also save the process steps of cutting, splitting and grinding, thereby further shortening the process flow.

[0131] The inventors of the present disclosure also noticed that the preparation of RGB full-color OLED pixelated devices can be achieved by depositing light-emitting layers and functional layers of different colors three times respectively, and by two exposure and etching graphic technologies, that is, without using a fine metal mask (FMM), solving the problem that the display resolution cannot be further improved when the AMOLED evaporation technology is extended to medium and large-sized display products. Moreover, it can also solve the problem that the product resolution is limited by the FMM technology, the preparation of medium and large-sized high-resolution FMM is difficult, and the production cost is high. By using exposure and etching processes to prepare large-size, high-resolution, RGB full-color AMOLED display products on a large-generation AMOLED production line, the resolution and display effect of the display device can also be improved.

[0132] The inventors of the present disclosure noticed that the various film layers of the organic light-emitting diode can also be deposited on the driving backplane by mask plate thermal evaporation coating (EV), and each film layer can be protected by an ultra-thin encapsulation layer, and then exposed and etched to remove the encapsulation layer and OLED film layer deposited in some areas. The OLED film layer includes a cathode and a stack of various functional layers of the OLED. The process is repeated three times to achieve large-size high-resolution RGB pixelation, thereby solving the high-generation line, G6 substrate size 1500*1800mm and above large-size high-resolution AMOLED product preparation, no longer due to the preparation level of the fine metal mask (FMM) limit the application of RGB full-color technology in large size.

[0133] At least one embodiment of the present disclosure provides a display substrate, which includes: a base substrate; pixel units arranged in an array on the base substrate, wherein each pixel unit includes a plurality of sub-pixels emitting light of different colors, and each sub-pixel includes a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; a pixel defining layer arranged on a side of the pixel driving circuit away from the base substrate; the pixel defining layer includes a plurality of pixel openings, and each pixel opening corresponds to a sub-pixel. For example, the display substrate is a bottom-emitting structure, that is, light is emitted from the bottom of the display substrate, and the display substrate is a large-size product and can be mass-produced.

[0134] For example, Figure 1 A schematic cross-sectional structure diagram of a display substrate provided in at least one embodiment of the present disclosure is shown in FIG. Figure 1 As shown, the display substrate 100 includes: a base substrate 101, pixel units 102 arranged in an array on the base substrate 101, each pixel unit 102 includes a plurality of sub-pixels 103 emitting light of different colors, each sub-pixel 103 includes a light-emitting element 1031 and a pixel driving circuit 1032 driving the corresponding light-emitting element 1031 to emit light; a pixel defining layer 104 arranged on a side of the pixel driving circuit 1032 away from the base substrate 101, the pixel defining layer 104 includes a plurality of pixel openings 1041, and each pixel opening 1041 corresponds to a sub-pixel 103. For example, the display substrate with this structure is a large-size display product, and the display product with this structure can be mass-produced, thereby improving production efficiency and reducing production costs.

[0135] For example, in one example, the display substrate 100 includes a plurality of pixel units 102 arranged in a matrix, each pixel unit 102 including a red sub-pixel, a green sub-pixel, and a blue sub-pixel. Alternatively, each pixel unit 102 includes a white sub-pixel and a color conversion layer, the color conversion layer being configured to convert white light emitted from the white sub-pixel into red light, green light, and blue light. The display substrate includes an active sub-pixel, the active sub-pixel including a switching transistor, a capacitor, a driving transistor, and an organic light emitting diode. The switching transistor is configured to transmit a data signal in response to a scan signal, the capacitor is configured to store a data voltage corresponding to the data signal, the driving transistor is configured to generate a driving current corresponding to the data voltage, and the organic light emitting diode is configured to emit light corresponding to the driving current. For example, an active sub-pixel can be constructed according to a 2T1C (two transistors and one capacitor) structure, which includes a switching transistor, a capacitor, a driving transistor and an organic light-emitting diode. The active sub-pixel can also be configured to further include at least one transistor and at least one capacitor to form a pixel circuit of other structure, and can form a sub-pixel in one of a top emission mode, a bottom emission mode and a dual emission mode according to the light emission direction.

[0136] For example, Figure 2 A schematic diagram of a circuit structure of a pixel circuit provided by an embodiment of the present disclosure is shown in FIG. Figure 2 As shown, the pixel circuit 121 includes: a first transistor T1, a second transistor T2, a driving transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7 and a storage capacitor C.

[0137] For example, Figure 2 As shown, in order to further reduce the refresh frequency, the material of the active layer of the first transistor T1 and the second transistor T2 can be designed to be IGZO, and the second transistor G2 can be designed to be a dual-gate structure to reduce leakage current, thereby achieving adjustment of the dynamic refresh frequency of 1 to 120 Hz to reduce driving power consumption and extend the service life of the display substrate.

[0138] For example, Figure 2 As shown, the first transistor T1 is the first reset transistor T1, the second transistor T2 is the threshold compensation transistor T2, the fourth transistor T4 is the data writing transistor T4, the fifth transistor T5 is the second light emission control transistor T5, the sixth transistor T6 is the first light emission control transistor T6, and the seventh transistor T7 is the second reset control transistor T7.

[0139] For example, the first electrode of the first transistor T1 is connected to the N1 node, that is, electrically connected to the gate of the driving transistor T3, the second electrode of the first transistor T1 is connected to the first initial signal terminal Vinit1, that is, electrically connected to the first reset signal line to receive the reset signal, and the gate of the first transistor T1 is connected to the first reset signal terminal Re1, that is, electrically connected to the reset control signal line to receive the reset control signal; the first electrode of the second transistor T2, that is, the threshold compensation transistor, is connected to the N1 node, that is, electrically connected to the gate of the driving transistor T3, the second electrode of the second transistor T2 is connected to the second electrode of the driving transistor T3, and the gate of the second transistor T2 is connected to the first gate drive signal terminal G1 to receive the compensation control signal; the gate of the driving transistor T3 is connected to the N1 node to be connected to the first electrode plate of the storage capacitor C, the first electrode of the first transistor T1, and the first electrode of the second transistor T2; the first electrode of the fourth transistor T4, that is, the data writing transistor, is connected to the data signal terminal Data to receive the data signal, the second electrode of the fourth transistor T4 is connected to the first electrode of the driving transistor T3, and the gate of the fourth transistor T4 is connected to the second gate The driving signal terminal G2 is used to receive the scanning signal; the first electrode of the fifth transistor T5, that is, the second light-emitting control transistor, is connected to the first power supply terminal VDD to receive the first power supply signal, the second electrode of the fifth transistor T5 is connected to the first electrode of the driving transistor T3, and the gate of the fifth transistor T5 is connected to the light-emitting control signal terminal EM to receive the light-emitting control signal; the first electrode of the sixth transistor T6, that is, the first light-emitting control transistor, is connected to the second electrode of the driving transistor T3, the second electrode of the sixth transistor T6 is connected to the first electrode of the seventh transistor T7, and the gate of the sixth transistor T6 is connected to the light-emitting control signal terminal EM to receive the light-emitting control signal; the second electrode of the seventh transistor T7 is connected to the second initial signal terminal Vinit2, that is, electrically connected to the second reset power supply signal line to receive the reset signal Vinit, and the gate of the seventh transistor T7 is connected to the second reset signal terminal Re2, that is, electrically connected to the reset control signal line to receive the reset control signal; the first plate of the storage capacitor C is connected to the N1 node and is electrically connected to the gate of the driving transistor T3, and the second plate of the storage capacitor C is connected to the first power supply terminal VDD, that is, connected to the first power supply signal line. The pixel circuit can be connected to the light emitting element 120, which can be an organic light emitting diode (OLED). The pixel circuit is used to drive the light emitting element 120 to emit light. The light emitting element 120 can be connected between the second electrode of the sixth transistor T6 and the second power supply terminal VSS, that is, connected to the second power signal line.

[0140] For example, the first power signal line refers to a signal line that outputs a voltage signal VDD, which can be connected to a voltage source to output a constant voltage signal, such as a positive voltage signal. The second power signal line refers to a signal line that outputs a voltage signal VSS, which can be connected to a voltage source to output a constant voltage signal, such as a negative voltage signal.

[0141] For example, the scanning signal and the compensation control signal can be the same, that is, the gate of the data writing transistor T4 and the gate of the threshold compensation transistor T2 can be electrically connected to the same signal line to receive the same signal, so as to reduce the number of signal lines. For example, the gate of the data writing transistor T4 and the gate of the threshold compensation transistor T2 can also be electrically connected to different signal lines, that is, the gate of the data writing transistor T4 is electrically connected to the second scanning signal line (second gate line), and the gate of the threshold compensation transistor T2 is electrically connected to the first scanning signal line (first gate line), and the signals transmitted by the first scanning signal line and the second scanning signal line can be the same or different, so that the gate of the data writing transistor T4 and the gate of the threshold compensation transistor T2 can be separately controlled, thereby increasing the flexibility of controlling the pixel circuit.

[0142] For example, the light control signals input to the first light control transistor T6 and the second light control transistor T5 may be the same, that is, the gate of the first light control transistor T6 and the gate of the second light control transistor T5 may be electrically connected to the same signal line to receive the same signal, thereby reducing the number of signal lines. For example, the gate of the first light control transistor T6 and the gate of the second light control transistor T5 may also be electrically connected to different light control signal lines, respectively. In this case, the signals transmitted by different light control signal lines may be the same or different.

[0143] For example, the reset control signal input to the second reset transistor T7 and the first reset transistor T1 can be the same, that is, the gate of the second reset transistor T7 and the gate of the first reset transistor T1 can be electrically connected to the same signal line to receive the same signal, thereby reducing the number of signal lines. For example, the gate of the second reset transistor T7 and the gate of the first reset transistor T1 can also be electrically connected to different reset control signal lines, respectively, in which case the signals on different reset control signal lines can be the same or different.

[0144] For example, the first transistor T1 and the second transistor T2 may be N-type transistors. For example, the first transistor T1 and the second transistor T2 may be N-type metal oxide transistors, which have a smaller leakage current, thereby preventing the N1 node from leaking through the first transistor T1 and the second transistor T2 during the light-emitting phase. At the same time, the driving transistor T3, the fourth transistor T4, the fifth transistor T5, the sixth transistor T6, and the seventh transistor T7 may be P-type transistors, for example, the driving transistor T3, the fourth transistor T4, the fifth transistor T5, the sixth transistor T6, and the seventh transistor T7 may be P-type low-temperature polycrystalline silicon transistors, which have a higher carrier mobility, thereby facilitating the realization of a display panel with high resolution, high response speed, high pixel density, and high aperture ratio. The first initial signal terminal Vinit1 and the second initial signal terminal Vinit2 may output the same or different voltage signals according to actual conditions.

[0145] For example, Figure 3 for Figure 2 The timing diagram of the driving method of the pixel circuit in FIG. Figure 3 In the figure, G1 represents the timing of the first gate drive signal terminal G1, G2 represents the timing of the second gate drive signal terminal G2, Re1 represents the timing of the first reset signal terminal Re1, Re2 represents the timing of the second reset signal terminal Re2, EM represents the timing of the light emitting control signal terminal EM, and Data represents the timing of the data signal terminal Data. The driving method of the pixel circuit may include a first reset stage t1, a compensation stage t2, a second reset stage t3, and a light emitting stage t4. In the first reset stage t1: the first reset signal terminal Re1 outputs a high level signal, the first transistor T1 is turned on, and the first initial signal terminal Vinit1 inputs an initial signal to the node N1. In the compensation stage t2: the first gate drive signal terminal G1 outputs a high level signal, the second gate drive signal terminal G2 outputs a low level signal, the fourth transistor T4 and the second transistor T2 are turned on, and at the same time, the data signal terminal Data outputs a drive signal to write a voltage Vdata+Vth (i.e., the sum of the voltage Vdata and Vth) to the node N1, where Vdata is the voltage of the drive signal and Vth is the threshold voltage of the drive transistor T3. In the second reset stage t3, the second reset signal terminal Re2 outputs a low level signal, the seventh transistor T7 is turned on, and the second initial signal terminal Vinit2 inputs an initial signal to the second electrode of the sixth transistor T6. Light-emitting stage t4: the light-emitting control signal terminal EM outputs a low level signal, the sixth transistor T6 and the fifth transistor T5 are turned on, and the driving transistor T3 emits light under the action of the voltage Vdata+Vth stored in the storage capacitor C.

[0146] It should be noted that, in the embodiment of the present disclosure, each pixel circuit can Figure 2In addition to the 7T1C structure (i.e., seven transistors and one capacitor) shown, it can also be a structure including other numbers of transistors, such as a 7T2C structure, a 6T1C structure, a 6T2C structure, an 8T1C structure, or a 9T2C structure, which is not limited in the embodiments of the present disclosure.

[0147] For example, Figure 1 As shown, a plurality of first electrodes 105 are respectively formed in different pixel openings 1041. In one example, the first electrode 105 is an anode formed of a transparent metal oxide, for example, the material of the first electrode 105 is indium gallium zinc oxide, and the first electrode 105 is defined as a red sub-pixel region, a green sub-pixel region, and a blue sub-pixel region, and the material of the first electrode 105 is a transparent metal oxide, and the display substrate is a bottom emission display substrate. For example, the transmittance of the first electrode 105 is greater than 80%.

[0148] For example, in another example, the first electrode 105 includes a first conductive layer and a second conductive layer stacked, the material of the first conductive layer is a metal material with high reflectivity, and the material of the second metal layer is a transparent conductive material. The material of the first conductive layer is at least one of metal aluminum and metal silver. The material of the second metal layer is at least one of indium tin oxide and indium zinc oxide.

[0149] For example, Figure 1 As shown, each pixel unit 102 includes three sub-pixels 103, and the colors of the light emitted by the three sub-pixels 103 are different, which can be red light, green light and blue light respectively. The light-emitting element 1031 corresponding to each sub-pixel 103 includes a first electrode 105 and a light-emitting unit 106 arranged in a stacked manner, and the three light-emitting units 106 included in the three sub-pixels 103 in the same pixel unit 102 respectively include a first color light-emitting layer 107, a second color light-emitting layer 108 and a third color light-emitting layer 109. In an example, the first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 can be a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer respectively. For example, a second electrode 110 is provided on a side of the light-emitting unit 106 away from the base substrate 101, a shielding layer 111 is provided on a side of the second electrode 110 away from the base substrate 101, and a third color retaining film layer 112 is provided at a position of the shielding layer 111 away from the second color light-emitting layer 108 and at a position away from the first color light-emitting layer 107. Through the shielding of the shielding layer 111 and the photoresist, it is possible to perform a composition process on each layer structure without using a fine mask plate, thereby being suitable for large-scale production.

[0150] For example, Figure 1As shown, the light-emitting unit 106 includes a functional layer and a light-emitting layer which are stacked, and the functional layer includes a hole injection layer 113, a hole transport layer 114, an electron transport layer 115 and an electron injection layer 116 which are stacked in a direction away from the first electrode 105 in sequence, and the light-emitting layer includes a first color light-emitting layer 107, a second color light-emitting layer 108 and a third color light-emitting layer 109, and the light-emitting layer is arranged between the hole transport layer 114 and the electron transport layer 115 to achieve recombination of holes and electrons in the light-emitting layer to emit light.

[0151] For example, in one example, the material of the shielding layer 111 is an inorganic insulating material, and the material of the shielding layer 111 is at least one of silicon nitride, silicon carbonitride, and silicon carbide.

[0152] For example, in one example, Figure 1 As shown, a third color retaining film layer 112 is further provided at a position of the shielding layer 111 away from the first color light emitting layer 107, and at a position of the shielding layer 111 away from the second color light emitting layer 108. The third color retaining film layer 112 includes a third hole injection retaining layer 1122, a third hole transport retaining layer 1123, a third color light emitting retaining layer 1121, a third electron transport retaining layer 1124, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126, and a third shielding retaining layer 1127. The third color light emitting retaining layer 1121 and the third color light emitting layer 109 included in the third color retaining film layer 112 are formed using the same material in the same process step. The third hole injection retaining layer 1122 and the hole injection layer 113 corresponding to the third color light emitting layer 109 included in the third color retaining film layer 112 are formed using the same material in the same process step. The third hole transport retention layer 1123 included in the third color retention film layer 112 and the hole transport layer 114 corresponding to the third color light-emitting layer 109 are formed using the same material in the same process step. The third electron transport retention layer 1124 included in the third color retention film layer 112 and the electron transport layer 115 corresponding to the third color light-emitting layer 109 are formed using the same material in the same process step. The third electron injection retention layer 1125 included in the third color retention film layer 112 and the electron injection layer 116 corresponding to the third color light-emitting layer 109 are formed using the same material in the same process step. The second electrode retention third sublayer 1126 included in the third color retention film layer 112 and the second electrode 110 corresponding to the third color light-emitting layer 109 are formed using the same material in the same process step. The third shielding retention layer 1127 included in the third color retention film layer 112 and the shielding layer 111 corresponding to the third color light-emitting layer 109 are formed using the same material in the same process step.

[0153] For example, in one example, the second electrode 110 is a cathode disposed in an entire layer, and the material of the second electrode 110 may be a conductive metal.

[0154] For example, Figure 1 As shown, the maximum distance between the third color retaining film layer 112 and the first color light-emitting layer 107 at a position of the shielding layer 111 far away from the first color light-emitting layer 107 and the maximum distance between the third color retaining film layer 112 and the second color light-emitting layer 108 at a position of the shielding layer 111 far away from the second color light-emitting layer 108 may be the same as or different. For example, the sum of the thicknesses of the first color light-emitting layer 107 and the functional layers stacked therewith is greater than the sum of the thicknesses of the second color light-emitting layer 108 and the functional layers stacked therewith. For example, the sum of the thicknesses of the hole injection layer 113, the hole transport layer 114, the first color light-emitting layer 107, the electron transport layer 115 and the electron injection layer 116 included in the light-emitting unit 106 including the first color light-emitting layer 107 is greater than the sum of the thicknesses of the hole injection layer 113, the hole transport layer 114, the second color light-emitting layer 108, the electron transport layer 115 and the electron injection layer included in the light-emitting unit 106 including the second color light-emitting layer 108, so that the maximum distance between the third color retaining film layer 112 and the first color light-emitting layer 107 at a position of the shielding layer 111 away from the first color light-emitting layer 107 is greater than the maximum distance between the third color retaining film layer 112 and the second color light-emitting layer 108 at a position of the shielding layer 111 away from the second color light-emitting layer 108.

[0155] For example, Figure 1 As shown, a packaging structure 117 is arranged on the side of the third color retaining film layer 112 away from the base substrate 101. The packaging structure 117 may include a first packaging layer, a second packaging layer and a third packaging layer that are stacked. The first packaging layer and the third packaging layer may be made of inorganic materials, the second packaging layer may be made of organic materials, and the second packaging layer is arranged between the first packaging layer and the third packaging layer, which can ensure that external water vapor cannot enter the light-emitting structure layer.

[0156] For example, Figure 4 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure is shown. Figure 4 The structure shown and Figure 1 The difference of the structure shown is that a second color retaining film layer 122 is further provided at a position of the shielding layer 111 away from the first color light emitting layer 107, and the second color retaining film layer 122 and the third color retaining film layer 112 are sequentially stacked in a direction away from the base substrate 101. Figure 4As shown, the second color retaining film layer 122 and the third color retaining film layer 112 are stacked at a position of the shielding layer 111 away from the first color light emitting layer 107, and the second color retaining film layer 122 is closer to the base substrate 101 than the third color retaining film layer 112. Only the third color retaining film layer 112 is disposed at a position of the shielding layer 111 away from the second color light emitting layer 108.

[0157] For example, Figure 4 As shown, the maximum distance between the third color retaining film layer 112 and the first color light-emitting layer 107 at a position of the shielding layer 111 far away from the first color light-emitting layer 107 is different from the maximum distance between the third color retaining film layer 112 and the second color light-emitting layer 108 at a position of the shielding layer 111 far away from the second color light-emitting layer 108, and the second color retaining film layer 122 is spaced between the third color retaining film layer 112 and the first color light-emitting layer 107 at a position of the shielding layer 111 far away from the first color light-emitting layer 107, and the second color retaining film layer 122 includes a multi-layer stacked structure.

[0158] For example, Figure 4 As shown, the light-emitting unit 106 includes a stacked functional layer and a light-emitting layer, the functional layer includes a hole injection layer 113, a hole transport layer 114, an electron transport layer 115 and an electron injection layer 116 which are stacked in sequence in the direction away from the first electrode 105, the light-emitting layer includes a first color light-emitting layer 107, a second color light-emitting layer 108 and a third color light-emitting layer 109, and the light-emitting layer is arranged between the hole transport layer 114 and the electron transport layer 115, so as to realize the recombination of holes and electrons in the light-emitting layer to emit light. For example, the first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 are arranged in the same layer. The second color retaining film layer 122 includes a second hole injection retaining layer 1222, a second hole transport retaining layer 1223, a second color luminescent retaining layer 1221, a second electron transport retaining layer 1224, a second electron injection retaining layer 1225, a second electrode retaining second sublayer 1226 and a second shielding retaining layer 1227 which are stacked, and the third color retaining film layer 112 includes a third hole injection retaining layer 1122, a third hole transport retaining layer 1123, a third color luminescent retaining layer 1121, a third electron transport retaining layer 1124, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retaining layer 1127 which are stacked.

[0159] For example, Figure 4As shown, the third color retaining film layer 112 disposed at a position of the shielding layer 111 away from the second color light emitting layer 108 includes a stacked third hole injection retaining layer 1122, a third hole transport retaining layer 1123, a third color light emitting retaining layer 1121, a third electron transport retaining layer 1124, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retaining layer 1127. The respective layer structures included in the third color retaining film layer 112 disposed at a position of the shielding layer 111 away from the second color light emitting layer 108 and the respective corresponding layer structures included in the third color retaining film layer 112 disposed at a position of the shielding layer 111 away from the first color light emitting layer 107 are disposed at different layers.

[0160] For example, Figure 5 A schematic diagram of a planar structure of a display substrate provided in at least one embodiment of the present disclosure is shown in FIG. Figure 5 As shown, the display substrate 100 includes a display area 130 and a peripheral area 140 surrounding the display area 130. For example, the display area 130 is an area for display, and the peripheral area 140 is provided with some wirings and a flip chip film 150. Figure 5 As shown, in the peripheral area 140, except for one side where the chip-on-chip film 150 is provided, on the other three sides, respectively, from a position close to the display area 130 to a position far away from the display area 130, a first common voltage connection line 141, a second common voltage connection line 142 and a third common voltage connection line 143 are provided in sequence. The first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are provided in different layers and are all connected to the chip-on-chip film 150. A first cathode 1101a is arranged in the area enclosed by the first common voltage connecting line 141 and the chip-on-chip film 150, a second cathode 1101b is arranged in the area enclosed by the second common voltage connecting line 142 and the chip-on-chip film 150, and a third cathode 1101c is arranged in the area enclosed by the third common voltage connecting line 143 and the chip-on-chip film 150. The first cathode 1101a, the second cathode 1101b and the third cathode 1101c are located in different layer structures and are connected through the corresponding first common voltage connecting line 141, the second common voltage connecting line 142 and the third common voltage connecting line 143 and the chip-on-chip film 150, respectively.

[0161] For example, Figure 6 for Figure 5 The cross-sectional structure diagram of the display substrate is shown in FIG. Figure 6The cross-sectional structure shown is described by taking as an example that the second color retaining film layer 122 and the third color retaining film layer 112 are stacked at a position of the shielding layer 111 away from the first color light-emitting layer 107, and only the third color retaining film layer 112 is disposed at a position of the shielding layer 111 away from the second color light-emitting layer 108. Figure 7 for Figure 6 The scanning electron microscope image of the cross-sectional structure of the display substrate is shown in FIG. Figure 5 and Figure 6 In each pixel unit, the light-emitting element 1031 includes a first light-emitting element 1031a, a second light-emitting element 1031b and a third light-emitting element 1031c, and the first light-emitting element 1031a, the second light-emitting element 1031b and the third light-emitting element 1031c respectively include a first cathode 1101a, a second cathode 1101b and a third cathode 1101c located in different layers, and the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are electrically connected to the first light-emitting element 1031a, the second light-emitting element 1031b and the third light-emitting element 1031c respectively.

[0162] It should be noted that although Figure 6 In the cross-sectional structure diagram shown in FIG. 1 , the first cathode 1101a, the second cathode 1101b and the third cathode 1101c are located on the same layer. However, in the actual product structure, Figure 7 As shown, the first cathode 1101a, the second cathode 1101b and the third cathode 1101c are located in different layers. Figures 5 to 7 , at the positions corresponding to the second light-emitting element 1031b and the third light-emitting element 1031c, the first cathode 1101a has a hollow area; at the positions corresponding to the first light-emitting element 1031a and the third light-emitting element 1031c, the second cathode 1101b has a hollow area; at the positions corresponding to the first light-emitting element 1031a and the third light-emitting element 1031c, the third cathode 1101c has a hollow area.

[0163] For example, in conventional designs, organic light-emitting diode display devices usually adopt a single-layer common cathode structure, that is, the cathodes corresponding to sub-pixels of different colors are of the same layer structure, and the cathodes arranged in the entire layer are overlapped on the power supply voltage signal line on the outer ring, and the power supply voltage signal line is electrically connected to the flip chip film. However, in the display substrate provided in the embodiment of the present disclosure, during the preparation process, the light-emitting layer, functional layer, cathode and encapsulation layer corresponding to the first light-emitting element are formed and then patterned as a whole, and the area covered by the encapsulation layer is larger than the area covered by the cathode, which will cause the encapsulation layer to cover the edge of the cathode, or the encapsulation layer is not removed cleanly, or because the thickness of the light-emitting layer and the functional layer corresponding to the light-emitting elements of different colors are different, the cathodes corresponding to the light-emitting elements of different colors are located in different layers, and they are not electrically connected, and thus it is impossible to electrically connect the light-emitting elements of different colors to the power supply voltage signal line by setting a whole piece of cathode. In the embodiment of the present disclosure, the first light emitting element 1031a, the second light emitting element 1031b and the third light emitting element 1031c respectively include a first cathode 1101a, a second cathode 1101b and a third cathode 1101c, and the first cathode 1101a, the second cathode 1101b and the third cathode 1101c are located in different layers and spaced apart from each other, and a first common voltage connection line 141, a second common voltage connection line 142 and a third common voltage connection line 143 are arranged in the peripheral area 140 around the display area 130, and the first common voltage connection line 141 and the first cathode 1101a are respectively electrically connected to each other. The second common voltage connection line 142 is electrically connected to the second cathode 1101b, the third common voltage connection line 143 is electrically connected to the third cathode 1101c, and then the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are all electrically connected to the power supply voltage line, and the power supply voltage line is electrically connected to the flip chip film 150. This design can be based on the simple preparation process provided by the embodiment of the present invention when preparing the display substrate, so that the first cathode 1101a, the second cathode 1101b and the third cathode 1101c located in different layers are all connected to the flip chip film.

[0164] It should be noted that in another example, Figure 6 It can also be Figure 1 The design is based on the cross-sectional structure shown in FIG. 1 , that is, the third color retaining film layer 112 is provided at a position of the shielding layer 111 away from the first color light-emitting layer 107, and the shielding layer 111 does not have a retaining structure at a position away from the second color light-emitting layer 108. In another example, Figure 6It can also be described by taking the example that there is no retained structure at the position of the shielding layer 111 away from the first color light-emitting layer 107 and at the position of the shielding layer 111 away from the second color light-emitting layer 108, and the specific structure is not illustrated again.

[0165] For example, Figure 8 A schematic diagram of a planar structure of another display substrate provided in at least one embodiment of the present disclosure is shown as follows: Figure 8 As shown, the display substrate 100 includes a display area 130 and a peripheral area 140 surrounding the display area 130. For example, the display area 130 is an area for display, and the peripheral area 140 is provided with some wirings and a flip chip film 150. Figure 8 As shown, in the peripheral area 140, except for one side where the cover chip film 150 is provided, on the other three sides, respectively, from a position close to the display area 130 to a position far away from the display area 130, a first common voltage connection line 141, a second common voltage connection line 142 and a third common voltage connection line 143 are provided in sequence, and the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are all connected to a power supply voltage line 133, and the power supply voltage line 133 is connected to the cover chip film 150, and an auxiliary electrode 1043 is also provided between adjacent light-emitting elements in the display area 130.

[0166] For example, Fig. 9 for Figure 8 The cross-sectional structure diagram of the display substrate is shown in FIG. Fig. 9 The cross-sectional structure shown is described by taking the case where there is no retained structure at a position of the shielding layer 111 away from the first color light emitting layer 107 and at a position of the shielding layer 111 away from the second color light emitting layer 108 as an example. Figure 8 and Fig. 9 In each pixel unit, the second electrode 110 is a cathode, the light-emitting element 1031 includes a first light-emitting element 1031a, a second light-emitting element 1031b and a third light-emitting element 1031c, the first light-emitting element 1031a, the second light-emitting element 1031b and the third light-emitting element 1031c respectively include a first cathode 1101a, a second cathode 1101b and a third cathode 1101c located in different layers, and the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are electrically connected to the first light-emitting element 1031a, the second light-emitting element 1031b and the third light-emitting element 1031c respectively.

[0167] For example, Fig. 9As shown, the pixel defining layer 104 further includes a plurality of spacers 1042 that separate adjacent pixel openings 1041, and an auxiliary electrode 1043 is disposed in each spacer 1042, and the auxiliary electrode 1043 is electrically connected to the second electrode 110 through a first via structure 1044. For example, each auxiliary electrode 1043 is electrically connected to the cathode of the corresponding light-emitting element, and the auxiliary electrode 1043 can reduce the resistance of the cathode.

[0168] For example, in one example, the auxiliary electrode 1043 includes a multi-layer structure that is stacked, and the multi-layer structure included in the auxiliary electrode 1043 is connected in parallel through vias.

[0169] For example, in one example, the display substrate further includes a gate line, a data line, a power supply voltage signal line, and an initialization signal line, and the gate line, the data line, the power supply voltage signal line, and the initialization signal line are located in different layer structures, and the auxiliary electrode 1043 is arranged in the same layer as at least one of the gate line, the data line, the power supply voltage signal line, and the initialization signal line. For example, in one example, the multi-layer structure included in the auxiliary electrode 1043 is arranged in the same layer as the gate line, the data line, the power supply voltage signal line, and the initialization signal line.

[0170] For example, in one example, the auxiliary electrodes 1043 corresponding to the first light emitting element 1031 a , the second light emitting element 1031 b , and the third light emitting element 1031 c may be located at different layers.

[0171] It should be noted that although Fig. 9 In the cross-sectional structure diagram shown in FIG. 1 , the first cathode 1101a, the second cathode 1101b and the third cathode 1101c are located on the same layer. However, in the actual product structure, Fig.10 As shown, the first cathode 1101a, the second cathode 1101b and the third cathode 1101c are located in different layers. Figures 8 to 10 , at the positions corresponding to the second light-emitting element 1031b and the third light-emitting element 1031c, the first cathode 1101a has a hollow area; at the positions corresponding to the first light-emitting element 1031a and the third light-emitting element 1031c, the second cathode 1101b has a hollow area; at the positions corresponding to the first light-emitting element 1031a and the third light-emitting element 1031c, the third cathode 1101c has a hollow area.

[0172] For example, in one example, the auxiliary electrode 1043 includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer, and a metal oxide layer stacked in sequence from a position close to the base substrate 101 to a position away from the base substrate 101. For example, the thickness of the first titanium metal layer ranges from 100 angstroms to 800 angstroms, the thickness of the aluminum metal layer ranges from 2000 angstroms to 6000 angstroms, the thickness of the second titanium metal layer ranges from 100 angstroms to 500 angstroms, and the thickness of the metal oxide layer ranges from 100 angstroms to 300 angstroms. For example, in another example, the thicknesses of the first titanium metal layer, the aluminum metal layer, the second titanium metal layer, and the metal oxide layer are 500 angstroms, 5000 angstroms, 300 angstroms, and 200 angstroms, respectively.

[0173] For example, in one example, a first interlayer insulating layer and a second interlayer insulating layer are arranged between adjacent layers formed by a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a metal oxide layer. The first interlayer insulating layer is an organic insulating layer, and the thickness of the first interlayer insulating layer is 1.5 microns. The material of the second interlayer insulating layer is an inorganic insulating layer, and the material of the second interlayer insulating layer can specifically be silicon nitride, and the thickness of the second interlayer insulating layer is 300 angstroms to 1000 angstroms.

[0174] For example, in one example, the auxiliary electrode 1043 includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer, and a metal oxide layer which are sequentially stacked from a position close to the base substrate 101 to a position far from the base substrate 101 .

[0175] For example, Fig. 9 As shown, a packaging structure 117 is arranged on the side of the second electrode 110 away from the base substrate 101. The packaging structure 117 includes a first packaging layer 1171, a second packaging layer 1172 and a third packaging layer 1173 which are stacked. The first packaging layer 1171 and the third packaging layer 1173 can be made of inorganic materials, the second packaging layer 1172 can be made of organic materials, and the second packaging layer 1172 is arranged between the first packaging layer 1171 and the third packaging layer 1173. The stacked packaging structure 117 can ensure that external water vapor cannot enter the light-emitting layer of each light-emitting element.

[0176] For example, Fig.10 A schematic cross-sectional structure diagram of a partial structure of another display substrate provided in at least one embodiment of the present disclosure, Fig.11 for Fig.10 The planar structure diagram of the first electrode and the connecting electrode is shown in FIG. Fig.10 and Fig.11As shown, the display substrate 100 includes a pixel driving circuit 1032, a planarization layer 118 and a pixel defining layer 104 arranged on a side of the pixel driving circuit 1032 away from the base substrate 101, the pixel defining layer 104 also includes a plurality of spacers 119, the plurality of spacers 119 include a first spacer 1191, a second spacer 1192 and a third spacer 1193 adjacent to each other in sequence, a first electrode 105 is arranged between the first spacer 1191 and the second spacer 1192, a connecting electrode 161 is arranged between the second spacer 1192 and the third spacer 1193, that is, a first electrode 105 or a connecting electrode 161 is arranged between two adjacent spacers 119, the first electrode 105 and the connecting electrode 161 are arranged alternately in sequence, and the length of the first electrode 105 is greater than the length of the connecting electrode 161.

[0177] For example, Fig.10 As shown, the first electrode 105 and the connecting electrode 161 are formed of the same material in the same process step. For example, the first electrode 105 and the connecting electrode 161 are both formed of indium tin oxide, and the thickness of the first electrode 105 and the connecting electrode 161 are both less than the thickness of the spacer.

[0178] For example, Fig.10 As shown, an auxiliary electrode 1043 is also arranged on the side of the layer where the pixel driving circuit 1032 is located away from the base substrate 101, and a planarization layer 118 is also arranged between the auxiliary electrode 1043 and the pixel defining layer 104. The connecting electrode 161 and the auxiliary electrode 1043 are electrically connected through a second via structure 1045 located in the planarization layer 118, thereby electrically connecting the connecting electrode 161 and the second electrode 110 to further reduce the resistance of the second electrode 110.

[0179] For example, in one example, the plurality of auxiliary electrodes 1043 are connected to form a grid structure, and the grid structure can reduce the resistance of the auxiliary electrode 1043 , and ultimately further reduce the resistance of the second electrode 110 connected to the auxiliary electrode 1043 .

[0180] For example, in one example, the auxiliary electrode 1043 includes a stacked structure formed by a molybdenum metal layer, a copper metal layer, a titanium metal layer, an aluminum metal layer and a titanium metal layer, or a stacked structure formed by an indium tin oxide layer, a silver metal layer and an indium tin oxide layer. The auxiliary electrode 1043 is formed by a multi-layer stacked structure, which can further reduce the resistance of the auxiliary electrode 1043.

[0181] For example, in one example, the thickness of the auxiliary electrode 1043 is 1000 angstroms to 6000 angstroms, and the sheet resistance of the auxiliary electrode 1043 is 0 to 0.5 Ω / sq. For example, the thickness of the auxiliary electrode 1043 is 1000 angstroms, 2000 angstroms, 3000 angstroms, 4000 angstroms, 5000 angstroms, and 6000 angstroms, and the corresponding sheet resistances may be 0.1 Ω / sq, 0.2 Ω / sq, 0.3 Ω / sq, 0.4 Ω / sq, 0.45 Ω / sq, and 0.5 Ω / sq, respectively.

[0182] For example, in one example, the connection resistance between the second electrode 110 and the connection electrode 161 is 0-0.1Ω, that is, compared with the second electrode 110 alone, the connection resistance between the second electrode 110 and the connection electrode 161 is greatly reduced.

[0183] For example, Fig.11 As shown, the first electrodes 105 and the connecting electrodes 161 are arranged at intervals from each other, and at least two connecting electrodes 161 are arranged between every two adjacent first electrodes 105 .

[0184] For example, the structure and Figure 8 The embodiments shown are combined with Figure 8 and Fig.10 As shown, the first light-emitting element 1031a, the second light-emitting element 1031b and the third light-emitting element 1031c are electrically connected to the power supply voltage line 133 through the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 respectively, and the power supply voltage line 133 is connected to the flip chip film 150.

[0185] For example, Fig.12 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure is shown in FIG. Fig.12 As shown, each light-emitting unit 106 includes a first light-emitting unit 1061 and a second light-emitting unit 1062 which are stacked, and the second electrode 110 is arranged on a side of the second light-emitting unit 1062 away from the base substrate 101. By stacking the first light-emitting unit 1061 and the second light-emitting unit 1062 to form a light-emitting unit 106, the efficiency of the light-emitting unit 106 emitting light can be improved, and the color purity of the light emitted by the light-emitting unit 106 can be made greater.

[0186] For example, Fig.12As shown, the light-emitting layer 133 includes a first color light-emitting layer 107, a second color light-emitting layer 108 and a third color light-emitting layer 109, each light-emitting layer 133 includes a first organic emission layer 1331 and a second organic emission layer 1332 stacked; the first color light-emitting layer 107 includes a first color light-emitting first sublayer 1071 and a first color light-emitting second sublayer 1072 stacked; the second color light-emitting layer 108 includes a second color light-emitting first sublayer 1081 and a second color light-emitting second sublayer 1082 stacked; the third color light-emitting layer 109 includes a first color light-emitting first sublayer 1081 and a second color light-emitting second sublayer 1082 stacked; The first sublayer 1091 of the third color light-emitting layer and the second sublayer 1092 of the third color light-emitting layer; the first light-emitting unit 1061 includes a first organic emission layer 1331, and the first organic emission layer 1331 includes a first color light-emitting first sublayer 1071, a second color light-emitting first sublayer 1081 and a third color light-emitting first sublayer 1091; the second light-emitting unit 1062 includes a second organic emission layer 1332, and the second organic emission layer 1332 includes a first color light-emitting second sublayer 1072, a second color light-emitting second sublayer 1082 and a third color light-emitting second sublayer 1092.

[0187] For example, in one example, the thickness of the first color emitting first sublayer 1071 and the thickness of the first color emitting second sublayer 1072 are different from each other; the thickness of the second color emitting first sublayer 1081 and the second color emitting second sublayer 1082 are different from each other; the thickness of the third color emitting first sublayer 1091 and the third color emitting second sublayer 1092 are different from each other. For example, the thickness of the first color emitting first sublayer 1071 and the thickness of the first color emitting second sublayer 1072 are set to be different from each other, the thickness of the second color emitting first sublayer 1081 and the second color emitting second sublayer 1082 are set to be different from each other, and the thickness of the third color emitting first sublayer 1091 and the third color emitting second sublayer 1092 are designed to be different from each other, which can reduce the difference in the distance between the light-emitting layer in the first light-emitting unit 1061 and the light-emitting layer in the second light-emitting unit 1062 and the first electrode or the second electrode, resulting in the difference in the efficiency of the emitted light effect, that is, the above design can improve the efficiency of the first light-emitting unit 1061 and the second light-emitting unit 1062 emitting light.

[0188] For example, in one example, the sum of the thicknesses of the first color light-emitting first sublayer 1071 and the first color light-emitting second sublayer 1072 is different from the sum of the thicknesses of the second color light-emitting first sublayer 1081 and the second color light-emitting second sublayer 1082, and the sum of the thicknesses of the third color light-emitting first sublayer 1091 and the third color light-emitting second sublayer 1092.

[0189] For example, in one example, a charge generation layer 123 is provided at least between the first color light-emitting first sublayer 1071 and the first color light-emitting second sublayer 1072, and / or between the second color light-emitting first sublayer 1081 and the second color light-emitting second sublayer 1082, and / or between the third color light-emitting first sublayer 1091 and the third color light-emitting second sublayer 1092.

[0190] For example, in one example, the charge generation layer 123 includes a stacked first charge generation layer 1231 and a second charge generation layer 1232. For example, the first charge generation layer 1231 and the second charge generation layer 1232 are constructed according to a PN junction structure, the first charge generation layer 1231 is an N-type charge generation layer, and the second charge generation layer 1232 is a P-type charge generation layer.

[0191] For example, in one example, Fig.12 As shown, the first light-emitting unit 1061 includes a stacked hole injection layer 113, a first hole transport layer 1141, a first electron blocking layer 124, a first organic emission layer 1331, a first hole blocking layer 125, a first electron transport layer 1151 and a first charge generating layer 1231; the second light-emitting unit 1062 includes a stacked second charge generating layer 1232, a second hole transport layer 1142, a second electron blocking layer 126, a second organic emission layer 1332, a second hole blocking layer 127, a second electron transport layer 1152 and an electron injection layer 116.

[0192] For example, in one example, Fig.12 As shown, the third color retaining film layer 112 includes a first part 112a and a second part 112b which are stacked, the first part 112a includes a third hole injection retaining layer 1122, a third hole transport first retaining layer 1123a, a third electron blocking first retaining layer 1241, a third color light emitting first retaining layer 1121a, a third hole blocking first retaining layer 1251, a third electron transport first retaining layer 1124a and a third charge generating first retaining layer 1231a which are stacked, and the second part 112b includes a third charge generating second retaining layer 1231b, a third hole transport second retaining layer 1123b, a third electron blocking second retaining layer 1261, a third color light emitting second retaining layer 1121b, a third hole blocking second retaining layer 1252, a third electron transport second retaining layer 1124b, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retaining layer 1127 which are stacked.

[0193] For example, Fig.13 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure is shown in FIG. Fig.13As shown, the third color retention film layer 112 includes a first portion 112a and a second portion 112b which are stacked, wherein the first portion 112a includes a third hole injection retention layer 1122, a third hole transport first retention layer 1123a, a third electron blocking first retention layer 1241, a third color light emitting first retention layer 1121a, a third hole blocking first retention layer 1251, a third electron transport first retention layer 1124a and a third charge generating first retention layer 1231a which are stacked, and the second portion 112b includes a third charge generating second retention layer 1231b, a third hole transport second retention layer 1123b, a third electron blocking second retention layer 1261, a third color light emitting second retention layer 1121b, a third hole blocking second retention layer 1252, a third electron transport second retention layer 1124b, a third electron injection retention layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retention layer 1127 which are stacked ; and the second color retention film layer 122 includes a third part 122a and a fourth part 122b which are stacked, the third part 122a includes a second hole injection retention layer 1222, a second hole transport first retention layer 12231, a second electron blocking first retention layer 1262, a second color light-emitting first retention layer 1221a, a second hole blocking first retention layer 1271, a second electron transport first retention layer 12241, and a second charge generation first retention layer 12321 which are stacked, and the fourth part 122b includes a second charge generation second retention layer 12322, a second hole transport second retention layer 12231, a second electron blocking second retention layer 1263, a second color light-emitting second retention layer 1222b, a second hole blocking second retention layer 1253, a second electron transport second retention layer 12242, a second electron injection retention layer 1225, a second electrode retention second sublayer 1226 and a second shielding retention layer 1227 which are stacked.

[0194] For example, in one example, Fig.12 and Fig.13 As shown, the first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 are respectively a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer. The first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 are all phosphorescent light-emitting layers, and the third color light-emitting layer 109 also contains boron element.

[0195] For example, in one example, the red light-emitting layer, the green light-emitting layer and the blue light-emitting layer all include a host material and a phosphorescent material, and the molecular weight of the phosphorescent material included in the red light-emitting layer is greater than the molecular weight of the phosphorescent material included in the green light-emitting layer, and greater than the molecular weight of the phosphorescent material included in the blue light-emitting layer.

[0196] For example, in one example, the first electrode 105 includes a reflective metal layer and a transparent conductive layer stacked together, and the reflective metal layer and the transparent conductive layer stacked together can reduce the resistance of the first electrode 105, and the display substrate is a top emission display substrate.

[0197] For example, in one example, the material of the reflective metal layer includes at least one of aluminum and silver, and the material of the transparent conductive layer includes at least one of indium tin oxide and indium zinc oxide.

[0198] For example, in one example, the second electrode 110 includes a single-layer structure or a multi-layer structure formed of at least one of silver, aluminum, magnesium, lithium, calcium, lithium fluoride, indium tin oxide, and indium zinc oxide.

[0199] For example, in one example, the display substrate is a bottom emission type display substrate, and the transmittance of the first electrode is greater than 80%.

[0200] For example, in one example, the pixel driving circuit 1032 includes a plurality of thin film transistors 1032a, at least one thin film transistor 1032a is a metal oxide thin film transistor, and at least one thin film transistor is a low temperature polysilicon thin film transistor.

[0201] At least one embodiment of the present disclosure further provides a display substrate, for example, Fig.14 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure is shown in FIG. Fig.14 As shown, the display substrate 100 includes: a base substrate 101; pixel units 102 arranged in an array on the base substrate 101, each pixel unit 102 includes a plurality of sub-pixels 103 emitting light of different colors, each sub-pixel 103 includes a light-emitting element 1031 and a pixel driving circuit 1032 driving the corresponding light-emitting element 1031 to emit light; a pixel defining layer 104 arranged on a side of the pixel driving circuit 1032 away from the base substrate 101; the pixel defining layer 104 includes a plurality of pixel openings 1041, each pixel opening 1041 corresponds to a sub-pixel 103, and the pixel defining layer 104 also includes a plurality of spacers 119 separating adjacent pixel openings 1041, and an auxiliary electrode 1043 is arranged in each spacer 119, and the auxiliary electrode 1043 and the second electrode 110 are electrically connected through a first via structure 1044 to reduce the resistance of the second electrode 110.

[0202] For example, in one example, the boundary of the second electrode 110 is located in the display area, and the second electrode 110 is electrically connected to one of the gate line layer, the data line layer, and the power supply voltage line layer in the display area.

[0203] For example, in one example, the auxiliary electrode 1043 includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer, and a metal oxide layer stacked in sequence from a position close to the base substrate 101 to a position away from the base substrate 101. For example, the thickness of the first titanium metal layer ranges from 100 angstroms to 800 angstroms, the thickness of the aluminum metal layer ranges from 2000 angstroms to 6000 angstroms, the thickness of the second titanium metal layer ranges from 100 angstroms to 500 angstroms, and the thickness of the metal oxide layer ranges from 100 angstroms to 300 angstroms. For example, in another example, the thicknesses of the first titanium metal layer, the aluminum metal layer, the second titanium metal layer, and the metal oxide layer are 500 angstroms, 5000 angstroms, 300 angstroms, and 200 angstroms, respectively.

[0204] For example, in one example, a first interlayer insulating layer and a second interlayer insulating layer are arranged between adjacent layers formed by a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a metal oxide layer. The first interlayer insulating layer is an organic insulating layer, and the thickness of the first interlayer insulating layer is 1.5 microns. The material of the second interlayer insulating layer is an inorganic insulating layer, and the material of the second interlayer insulating layer can specifically be silicon nitride, and the thickness of the second interlayer insulating layer is 300 angstroms to 1000 angstroms.

[0205] For example, in one example, the auxiliary electrode 1043 includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer, and a metal oxide layer which are sequentially stacked from a position close to the base substrate 101 to a position far from the base substrate 101 .

[0206] For example, in one example, the plurality of auxiliary electrodes 1043 are connected to form a grid structure, and the grid structure can reduce the resistance of the auxiliary electrode 1043 , and ultimately further reduce the resistance of the second electrode 110 connected to the auxiliary electrode 1043 .

[0207] For example, Fig.14 As shown, each pixel unit 102 includes three sub-pixels 103, and the light-emitting element 1031 corresponding to each sub-pixel 103 includes a first electrode 105 and a light-emitting unit 106 that are stacked. The light-emitting units 106 included in the three sub-pixels 103 in the same pixel unit 102 include a first color light-emitting layer 107, a second color light-emitting layer 108, and a third color light-emitting layer 109, respectively; a second electrode 110 is arranged on a side of the light-emitting unit 106 away from the base substrate 101, and a packaging structure 117 is arranged on a side of the second electrode 110 away from the base substrate 101. Although in Fig.14Only a single-layer structure is shown in the figure. In other examples, the encapsulation structure 117 may include a first encapsulation layer, a second encapsulation layer and a third encapsulation layer arranged in a stacked manner. The first encapsulation layer and the third encapsulation layer may be made of inorganic materials, and the second encapsulation layer may be made of organic materials. The second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer to ensure that external water vapor cannot enter the light-emitting structure layer.

[0208] For example, despite Fig.14 In the cross-sectional structure diagram shown, the second electrodes 110 corresponding to the three adjacent sub-pixels 103 are located in the same layer, but in the actual product structure, the second electrodes 110 corresponding to the three adjacent sub-pixels 103 are located in different layers.

[0209] For example, Fig.15 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure, Fig.15 The structure of the display substrate and Fig.14 The structure of the display substrate shown is different in that Fig.15 In the display substrate shown, a shielding layer 111 is further provided on the side of the second electrode 110 away from the base substrate 101, that is, the shielding layer 111 is located between the second electrode 110 and the encapsulation structure 117. For example, the shielding layer 111 is made of an inorganic insulating material.

[0210] For example, in the embodiment of the present disclosure, unnecessary parts are removed when forming the corresponding light-emitting element by using a photoresist material, and thus the shielding layer 111 is required for shielding, so the shielding layer 111 is retained.

[0211] For example, Fig.15 The structure of the display substrate and Fig.14 The structure of the display substrate shown is also different in that a third color retaining film layer 112 is disposed at a position of the shielding layer 111 away from the second color light emitting layer 108 and a position away from the first color light emitting layer 107 . Fig.15 The cross-sectional structure and Fig.14 The similarities of the cross-sectional structures shown are not described in detail here, and only the differences are described.

[0212] For example, in one example, the third color retention film layer 112 includes a third hole injection retention layer 1122, a third hole transport retention layer 1123, a third color luminescent retention layer 1121, a third electron transport retention layer 1124 and a third electron injection retention layer 1125, a second electrode retention third sublayer 1126 and a third shielding retention layer 1127. The third color luminescent retention layer 1121 and the third color luminescent layer 109 included in the third color retention film layer 112 are formed using the same material in the same process step. The third hole injection retention layer 1122 and the hole injection layer 113 corresponding to the third color luminescent layer 109 included in the third color retention film layer 112 are formed using the same material in the same process step. The third hole transport retention layer 1123 and the hole transport layer 114 corresponding to the third color luminescent layer 109 included in the third color retention film layer 112 are formed using the same material in the same process step. The third electron transport retention layer 1124 included in the third color retention film layer 112 and the electron transport layer 115 corresponding to the third color light emitting layer 109 are formed using the same material in the same process step. The third electron injection retention layer 1125 included in the third color retention film layer 112 and the electron injection layer 116 corresponding to the third color light emitting layer 109 are formed using the same material in the same process step. The second electrode retention third sublayer 1126 included in the third color retention film layer 112 and the second electrode 110 corresponding to the third color light emitting layer 109 are formed using the same material in the same process step. The third shielding retention layer 1127 included in the third color retention film layer 112 and the shielding layer 111 corresponding to the third color light emitting layer 109 are formed using the same material in the same process step.

[0213] For example, Fig.16 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure, Fig.16 The structure of the display substrate and Fig.15 The structure of the display substrate shown is different in that a second color retaining film layer 122 is further provided at a position of the shielding layer 111 away from the first color light-emitting layer 107, that is, the second color retaining film layer 122 and the third color retaining film layer 112 are stacked in sequence in a direction away from the base substrate 101, but only the third color retaining film layer 112 is provided at a position of the shielding layer 111 away from the second color light-emitting layer 108. Fig.16 The cross-sectional structure and Fig.15 The similarities of the cross-sectional structures shown are not described in detail here, and only the differences are described.

[0214] For example, Fig.16As shown, the maximum distance between the third color retaining film layer 112 and the first color light-emitting layer 107 at a position of the shielding layer 111 far away from the first color light-emitting layer 107 is different from the maximum distance between the third color retaining film layer 112 and the second color light-emitting layer 108 at a position of the shielding layer 111 far away from the second color light-emitting layer 108, and the second color retaining film layer 122 is spaced between the third color retaining film layer 112 and the first color light-emitting layer 107 at a position of the shielding layer 111 far away from the first color light-emitting layer 107, and the second color retaining film layer 122 includes a multi-layer stacked structure.

[0215] For example, Fig.16 As shown, the light-emitting unit 106 includes a stacked functional layer and a light-emitting layer, the functional layer includes a hole injection layer 113, a hole transport layer 114, an electron transport layer 115 and an electron injection layer 116 which are stacked in sequence in the direction away from the first electrode 105, the light-emitting layer includes a first color light-emitting layer 107, a second color light-emitting layer 108 and a third color light-emitting layer 109, and the light-emitting layer is arranged between the hole transport layer 114 and the electron transport layer 115, so as to realize the recombination of holes and electrons in the light-emitting layer to emit light. For example, the first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 are arranged in the same layer. The second color retaining film layer 122 includes a second hole injection retaining layer 1222, a second hole transport retaining layer 1223, a second color luminescent retaining layer 1221, a second electron transport retaining layer 1224, a second electron injection retaining layer 1225, a second electrode retaining second sublayer 1226 and a second shielding retaining layer 1227 which are stacked, and the third color retaining film layer 112 includes a third hole injection retaining layer 1122, a third hole transport retaining layer 1123, a third color luminescent retaining layer 1121, a third electron transport retaining layer 1124, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retaining layer 1127 which are stacked.

[0216] For example, Fig.16 As shown, the third color retaining film layer 112 disposed at a position of the shielding layer 111 away from the second color light emitting layer 108 includes a stacked third hole injection retaining layer 1122, a third hole transport retaining layer 1123, a third color light emitting retaining layer 1121, a third electron transport retaining layer 1124, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retaining layer 1127. The respective layer structures included in the third color retaining film layer 112 disposed at a position of the shielding layer 111 away from the second color light emitting layer 108 and the respective corresponding layer structures included in the third color retaining film layer 112 disposed at a position of the shielding layer 111 away from the first color light emitting layer 107 are disposed at different layers.

[0217] For example, Fig.16 As shown, a packaging structure 117 is provided on a side of the third color retaining film layer 112 away from the base substrate 101 . The features of the packaging structure 117 can be found in the above related descriptions and will not be repeated here.

[0218] For example, Fig.17 A schematic diagram of a planar structure of another display substrate provided in at least one embodiment of the present disclosure is shown as follows: Fig.17 As shown, the display substrate 100 includes a display area 130 and a peripheral area 140 surrounding the display area 130. For example, the display area 130 is an area for display, and the peripheral area 140 is provided with some wirings and a flip chip film 150. Fig.17 As shown, in the peripheral area 140, except for one side where the cover chip film 150 is provided, on the other three sides, respectively, from a position close to the display area 130 to a position far away from the display area 130, a first common voltage connection line 141, a second common voltage connection line 142 and a third common voltage connection line 143 are provided in sequence, and the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are all connected to a power supply voltage line 133, and the power supply voltage line 133 is connected to the cover chip film 150, and an auxiliary electrode 1043 is also provided between adjacent light-emitting elements in the display area 130.

[0219] For example, Fig.18 for Fig.17 The cross-sectional structure diagram of the display substrate is shown in FIG. Fig.18 The cross-sectional structure shown is described by taking the case where there is no retained structure at a position of the shielding layer 111 away from the first color light emitting layer 107 and at a position of the shielding layer 111 away from the second color light emitting layer 108 as an example. Fig.17 and Fig.18 In each pixel unit, the second electrode 110 is a cathode, the light-emitting element 1031 includes a first light-emitting element 1031a, a second light-emitting element 1031b and a third light-emitting element 1031c, the first light-emitting element 1031a, the second light-emitting element 1031b and the third light-emitting element 1031c respectively include a first cathode 1101a, a second cathode 1101b and a third cathode 1101c located in different layers, and the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are electrically connected to the first light-emitting element 1031a, the second light-emitting element 1031b and the third light-emitting element 1031c respectively.

[0220] For example, Fig.18As shown, the pixel defining layer 104 further includes a plurality of spacers 1042 that separate adjacent pixel openings 1041, and an auxiliary electrode 1043 is disposed in each spacer 1042, and the auxiliary electrode 1043 is electrically connected to the second electrode 110 through a first via structure 1044. For example, each auxiliary electrode 1043 is electrically connected to the cathode of the corresponding light-emitting element, and the auxiliary electrode 1043 can reduce the resistance of the cathode.

[0221] It should be noted that although Fig.18 In the cross-sectional structure diagram shown, the first cathode 1101a, the second cathode 1101b and the third cathode 1101c are located on the same layer, but in the actual product structure, the first cathode 1101a, the second cathode 1101b and the third cathode 1101c are located on different layers. Fig.17 and Fig.18 , at the positions corresponding to the second light-emitting element 1031b and the third light-emitting element 1031c, the first cathode 1101a has a hollow area; at the positions corresponding to the first light-emitting element 1031a and the third light-emitting element 1031c, the second cathode 1101b has a hollow area; at the positions corresponding to the first light-emitting element 1031a and the third light-emitting element 1031c, the third cathode 1101c has a hollow area.

[0222] For example, in one example, the auxiliary electrode 1043 includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer, and a metal oxide layer stacked in sequence from a position close to the base substrate 101 to a position away from the base substrate 101. For example, the thickness of the first titanium metal layer ranges from 100 angstroms to 800 angstroms, the thickness of the aluminum metal layer ranges from 2000 angstroms to 6000 angstroms, the thickness of the second titanium metal layer ranges from 100 angstroms to 500 angstroms, and the thickness of the metal oxide layer ranges from 100 angstroms to 300 angstroms. For example, in another example, the thicknesses of the first titanium metal layer, the aluminum metal layer, the second titanium metal layer, and the metal oxide layer are 500 angstroms, 5000 angstroms, 300 angstroms, and 200 angstroms, respectively.

[0223] For example, in one example, a first interlayer insulating layer and a second interlayer insulating layer are arranged between adjacent layers formed by a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a metal oxide layer. The first interlayer insulating layer is an organic insulating layer, and the thickness of the first interlayer insulating layer is 1.5 microns. The material of the second interlayer insulating layer is an inorganic insulating layer, and the material of the second interlayer insulating layer can specifically be silicon nitride, and the thickness of the second interlayer insulating layer is 300 angstroms to 1000 angstroms.

[0224] For example, in one example, the auxiliary electrode 1043 includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer, and a metal oxide layer which are sequentially stacked from a position close to the base substrate 101 to a position far from the base substrate 101 .

[0225] For example, Fig.18 As shown, the light-emitting unit 106 includes a stacked functional layer and a light-emitting layer, and the functional layer includes a stacked hole injection layer 113, a hole transport layer 114, an electron transport layer 115 and an electron injection layer 116 in a direction away from the first electrode 105, and the light-emitting layer is arranged between the hole transport layer 114 and the electron transport layer 115 to achieve the recombination of holes and electrons in the light-emitting layer to emit light. The light-emitting layer includes a first color light-emitting layer 107, a second color light-emitting layer 108 and a third color light-emitting layer 109. The third color retention film layer 112 includes a stacked third hole injection retention layer 1122, a third hole transport retention layer 1123, a third color light-emitting retention layer 1121, a third electron transport retention layer 1124 and a third electron injection retention layer 1125, a second electrode retention third sublayer 1126 and a third shielding retention layer 1127.

[0226] For example, Fig.18 As shown, the second color retaining film layer 122 includes a second hole injection retaining layer 1222, a second hole transport retaining layer 1223, a second color luminescent retaining layer 1221, a second electron transport retaining layer 1224, a second electron injection retaining layer 1225, a second electrode retaining second sublayer 1226 and a second shielding retaining layer 1227 which are stacked, and the third color retaining film layer 112 includes a third hole injection retaining layer 1122, a third hole transport retaining layer 1123, a third color luminescent retaining layer 1121, a third electron transport retaining layer 1124, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retaining layer 1127 which are stacked.

[0227] It should be noted that although Fig.18 1 shows that the second color retaining film layer 122 and the third color retaining film layer 112 are stacked at a position of the shielding layer 111 away from the first color light emitting layer 107, and the second color retaining film layer 122 is closer to the base substrate 101 than the third color retaining film layer 112, and only the third color retaining film layer 112 is provided at a position of the shielding layer 111 away from the second color light emitting layer 108, but Fig.17The illustrated embodiment is also applicable to the case where the third color retaining film layer 112 is disposed at positions of the shielding layer 111 away from the first color light-emitting layer 107 and away from the second color light-emitting layer 108, and is also applicable to the case where the second color retaining film layer 122 and the third color retaining film layer 112 are not disposed at positions of the shielding layer 111 away from the first color light-emitting layer 107 and away from the second color light-emitting layer 108.

[0228] For example, Fig.19 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure is shown. Fig.19 The cross-sectional structure shown is described by taking the example that there is no remaining structure at a position of the shielding layer 111 away from the first color light-emitting layer 107 and at a position of the shielding layer 111 away from the second color light-emitting layer 108 .

[0229] For example, Fig.19 As shown, each light-emitting unit 106 includes a first light-emitting unit 1061 and a second light-emitting unit 1062 which are stacked, and the second electrode 110 is arranged on a side of the second light-emitting unit 1062 away from the base substrate 101. By stacking the first light-emitting unit 1061 and the second light-emitting unit 1062 to form a light-emitting unit 106, the efficiency of the light-emitting unit 106 emitting light can be improved, and the color purity of the light emitted by the light-emitting unit 106 can be made greater.

[0230] For example, Fig.19 As shown, the light-emitting layer 133 includes a first color light-emitting layer 107, a second color light-emitting layer 108 and a third color light-emitting layer 109, each light-emitting layer 133 includes a first organic emission layer 1331 and a second organic emission layer 1332 stacked; the first color light-emitting layer 107 includes a first color light-emitting first sublayer 1071 and a first color light-emitting second sublayer 1072 stacked; the second color light-emitting layer 108 includes a second color light-emitting first sublayer 1081 and a second color light-emitting second sublayer 1082 stacked; the third color light-emitting layer 109 includes a first color light-emitting first sublayer 1081 and a second color light-emitting second sublayer 1082 stacked; The first sublayer 1091 of the third color light-emitting layer and the second sublayer 1092 of the third color light-emitting layer; the first light-emitting unit 1061 includes a first organic emission layer 1331, and the first organic emission layer 1331 includes a first color light-emitting first sublayer 1071, a second color light-emitting first sublayer 1081 and a third color light-emitting first sublayer 1091; the second light-emitting unit 1062 includes a second organic emission layer 1332, and the second organic emission layer 1332 includes a first color light-emitting second sublayer 1072, a second color light-emitting second sublayer 1082 and a third color light-emitting second sublayer 1092.

[0231] For example, in one example, Fig.19As shown, the thickness of the first color emitting first sublayer 1071 and the thickness of the first color emitting second sublayer 1072 are different from each other; the thickness of the second color emitting first sublayer 1081 and the second color emitting second sublayer 1082 are different from each other; the thickness of the third color emitting first sublayer 1091 and the third color emitting second sublayer 1092 are different from each other. For example, the thickness of the first color emitting first sublayer 1071 and the thickness of the first color emitting second sublayer 1072 are set to be different from each other, the thickness of the second color emitting first sublayer 1081 and the second color emitting second sublayer 1082 are set to be different from each other, and the thickness of the third color emitting first sublayer 1091 and the third color emitting second sublayer 1092 are designed to be different from each other, which can reduce the difference in the distance between the light-emitting layer in the first light-emitting unit 1061 and the light-emitting layer in the second light-emitting unit 1062 and the first electrode or the second electrode, resulting in the difference in the efficiency of the emitted light effect, that is, the above design can improve the efficiency of the first light-emitting unit 1061 and the second light-emitting unit 1062 emitting light.

[0232] For example, in one example, the sum of the thicknesses of the first color light-emitting first sublayer 1071 and the first color light-emitting second sublayer 1072 is different from the sum of the thicknesses of the second color light-emitting first sublayer 1081 and the second color light-emitting second sublayer 1082, and the sum of the thicknesses of the third color light-emitting first sublayer 1091 and the third color light-emitting second sublayer 1092.

[0233] For example, in one example, a charge generation layer 123 is provided at least between the first color light-emitting first sublayer 1071 and the first color light-emitting second sublayer 1072, and / or between the second color light-emitting first sublayer 1081 and the second color light-emitting second sublayer 1082, and / or between the third color light-emitting first sublayer 1091 and the third color light-emitting second sublayer 1092.

[0234] For example, Fig.19 As shown, the charge generation layer 123 includes a first charge generation layer 1231 and a second charge generation layer 1232 stacked. For example, the first charge generation layer 1231 and the second charge generation layer 1232 are constructed according to a PN junction structure, the first charge generation layer 1231 is an N-type charge generation layer, and the second charge generation layer 1232 is a P-type charge generation layer.

[0235] For example, in one example, Fig.19As shown, the first light-emitting unit 1061 includes a stacked hole injection layer 113, a first hole transport layer 1141, a first electron blocking layer 124, a first organic emission layer 1331, a first hole blocking layer 125, a first electron transport layer 1151 and a first charge generating layer 1231; the second light-emitting unit 1062 includes a stacked second charge generating layer 1232, a second hole transport layer 1142, a second electron blocking layer 126, a second organic emission layer 1332, a second hole blocking layer 127, a second electron transport layer 1152 and an electron injection layer 116.

[0236] For example, Fig.19 As shown, the first cathode 1101a, the second cathode 1101b and the third cathode 1101c corresponding to the first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 are electrically connected to the auxiliary electrode 1043 through the first via structure 1044. For example, each auxiliary electrode 1043 is electrically connected to the cathode of the corresponding light-emitting element, and the auxiliary electrode 1043 can reduce the resistance of the cathode.

[0237] For example, in Fig.19 In the display substrate shown, the first cathode 1101a, the second cathode 1101b and the third cathode 1101c are located in different layers.

[0238] For example, Fig. 20 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure is shown in FIG. Fig. 20 As shown, the first cathode 1101a, the second cathode 1101b and the third cathode 1101c corresponding to the first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 are electrically connected to the auxiliary electrode 1043 through the first via structure 1044. For example, each auxiliary electrode 1043 is electrically connected to the cathode of the corresponding light-emitting element, and the auxiliary electrode 1043 can reduce the resistance of the cathode. Fig. 20 The display substrate and Fig.19 The same aspects of the display substrates shown are not described in detail here.

[0239] For example, Fig. 20As shown, a third color retaining film layer 112 is disposed at a position of the shielding layer 111 away from the second color light emitting layer 108 and a position of the shielding layer 111 away from the first color light emitting layer 107 . The third color retaining film layer 112 includes a first part 112a and a second part 112b which are stacked. The first part 112a includes a third hole injection retaining layer 1122, a third hole transport first retaining layer 1123a, a third electron blocking first retaining layer 1241, a third color light emitting first retaining layer 1121a, a third hole blocking first retaining layer 1251, a third electron transport first retaining layer 1124a and a third charge generating first retaining layer 1231a which are stacked. The second part 112b includes a third charge generating second retaining layer 1231b, a third hole transport second retaining layer 1123b, a third electron blocking second retaining layer 1261, a third color light emitting second retaining layer 1121b, a third hole blocking second retaining layer 1252, a third electron transport second retaining layer 1124b, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retaining layer 1127 which are stacked.

[0240] For example, Fig.21 A schematic cross-sectional structure diagram of another display substrate provided in at least one embodiment of the present disclosure is shown in FIG. Fig.21 As shown, the first cathode 1101a, the second cathode 1101b and the third cathode 1101c corresponding to the first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 are electrically connected to the auxiliary electrode 1043 through the first via structure 1044. For example, each auxiliary electrode 1043 is electrically connected to the cathode of the corresponding light-emitting element, and the auxiliary electrode 1043 can reduce the resistance of the cathode. Fig.21 The display substrate and Fig.19 The same aspects of the display substrates shown are not described in detail here.

[0241] For example, Fig.21As shown, a third color retaining film layer 112 is disposed at a position of the shielding layer 111 away from the second color luminescent layer 108 , and a stacked structure of the third color retaining film layer 112 and the second color retaining film layer 122 is disposed at a position of the shielding layer 111 away from the first color luminescent layer 107 . The third color retention film layer 112 includes a first portion 112a and a second portion 112b which are stacked, wherein the first portion 112a includes a third hole injection retention layer 1122, a third hole transport first retention layer 1123a, a third electron blocking first retention layer 1241, a third color light emitting first retention layer 1121a, a third hole blocking first retention layer 1251, a third electron transport first retention layer 1124a and a third charge generating first retention layer 1231a which are stacked, and the second portion 112b includes a third charge generating second retention layer 1231b, a third hole transport second retention layer 1123b, a third electron blocking second retention layer 1261, a third color light emitting second retention layer 1121b, a third hole blocking second retention layer 1252, a third electron transport second retention layer 1124b, a third electron injection retention layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retention layer 1127 which are stacked; The second color retaining film layer 122 includes a third part 122a and a fourth part 122b which are stacked. The third part 122a includes a second hole injection retaining layer 1222, a second hole transport first retaining layer 12231, a second electron blocking first retaining layer 1262, a second color light emitting first retaining layer 1221a, a second hole blocking first retaining layer 1271, a second electron transport first retaining layer 12241, and a second charge generating first retaining layer 12321 which are stacked. The fourth part 122b includes a second charge generating second retaining layer 12322, a second hole transport second retaining layer 12231, a second electron blocking second retaining layer 1263, a second color light emitting second retaining layer 1222b, a second hole blocking second retaining layer 1253, a second electron transport second retaining layer 12242, a second electron injection retaining layer 1225, a second electrode retaining second sublayer 1226 and a second shielding retaining layer 1227 which are stacked.

[0242] For example, in Fig.21 In the illustrated embodiment, it is also shown that a first common voltage connection line 141, a second common voltage connection line 142 and a third common voltage connection line 143 are arranged in sequence from a position close to the display area to a position far away from the display area, and the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are arranged in different layers, and the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are respectively connected to the first cathode 1101a, the second cathode 1101b and the third cathode 1101c.

[0243] It should be noted that in the above Fig.19 and Fig. 20 In the structure, a first common voltage connection line 141, a second common voltage connection line 142 and a third common voltage connection line 143 are also provided. The first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are provided in different layers and are respectively connected to the first cathode 1101a, the second cathode 1101b and the third cathode 1101c.

[0244] For example, in one example, Figures 19 to 21 As shown, the first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 are respectively a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer. The first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109 are all phosphorescent light-emitting layers, and the third color light-emitting layer 109 also contains boron element.

[0245] For example, in one example, the red light-emitting layer, the green light-emitting layer and the blue light-emitting layer all include a host material and a phosphorescent material, and the molecular weight of the phosphorescent material included in the red light-emitting layer is greater than the molecular weight of the phosphorescent material included in the green light-emitting layer, and greater than the molecular weight of the phosphorescent material included in the blue light-emitting layer.

[0246] For example, in one example, the first electrode 105 includes a reflective metal layer and a transparent conductive layer that are stacked, and the reflective metal layer and the transparent conductive layer that are stacked can reduce the resistance of the first electrode 105 .

[0247] For example, in one example, the material of the reflective metal layer includes at least one of aluminum and silver, and the material of the transparent conductive layer includes at least one of indium tin oxide and indium zinc oxide.

[0248] For example, in one example, the second electrode 110 includes a single-layer structure or a multi-layer structure formed of at least one of silver, aluminum, magnesium, lithium, calcium, lithium fluoride, indium tin oxide, and indium zinc oxide.

[0249] For example, in one example, the pixel driving circuit 1032 includes a plurality of thin film transistors 1032a, at least one thin film transistor 1032a is a metal oxide thin film transistor, and at least one thin film transistor is a low temperature polysilicon thin film transistor.

[0250] At least one embodiment of the present disclosure also provides a method for preparing a display substrate, the preparation method comprising: providing a base substrate; forming pixel units arranged in an array on the base substrate, wherein each pixel unit comprises a plurality of sub-pixels emitting light of different colors, each sub-pixel comprises a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; forming a pixel defining layer on a side of the pixel driving circuit away from the base substrate; the pixel defining layer comprises a plurality of pixel openings, each pixel opening corresponds to a sub-pixel, and each pixel unit corresponds to a first color opening area, a second color opening area, and a third color opening area adjacent in sequence; forming a first electrode in each pixel opening; forming a first color light-emitting layer, a first functional layer, and a first shielding layer at a position corresponding to the first color opening area; forming a first color light-emitting layer, a first functional layer, and a first shielding layer at a position corresponding to the second color opening area A second color light-emitting layer, a second functional layer and a second shielding layer are formed at the positions; a third color light-emitting film, a third functional film and a third shielding film are formed on the first shielding layer, the second shielding layer, the pixel defining layer and the side of the first electrode corresponding to the third color opening area away from the substrate. The embodiments of the present disclosure realize the preparation of RGB full-color OLED pixelated devices, for example, by depositing light-emitting layers and functional layers of different colors multiple times, and multiple exposure and etching graphic techniques, that is, without using a fine metal mask (FMM), and solve the problem that the display resolution cannot be further improved when the AMOLED evaporation technology is extended to medium and large-sized display products. In addition, it can also solve the problem that the product resolution is limited by the FMM technology, the medium and large-sized high-resolution FMM preparation is difficult, and the production cost is high. By preparing large-size high-resolution RGB full-color AMOLED display products on the large-generation AMOLED production line using exposure and etching processes, the resolution and display effect of the display device can also be improved.

[0251] For example, Fig. 22 A flow chart of a method for preparing a display substrate provided in at least one embodiment of the present disclosure, Figure 23 to Figure 29 A process diagram of a method for preparing a display substrate provided in at least one embodiment of the present disclosure, combined with Fig. 22 and Figure 23 to Figure 29 As shown, the preparation method includes the following steps.

[0252] Step S101: providing a substrate;

[0253] Step S102: forming pixel units arranged in an array on a substrate, wherein each pixel unit includes a plurality of sub-pixels emitting light of different colors, and each sub-pixel includes a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light;

[0254] Step S103: forming a pixel defining layer on a side of the pixel driving circuit away from the base substrate; wherein the pixel defining layer includes a plurality of pixel openings, each pixel opening corresponds to a sub-pixel, and each pixel unit corresponds to a first color opening region, a second color opening region, and a third color opening region that are adjacent in sequence;

[0255] Step S104: forming a first electrode in each pixel opening;

[0256] Step S105: forming a first color light-emitting layer, a first functional layer, a second electrode first sublayer and a first shielding layer at a position corresponding to the first color opening area;

[0257] Step S106: forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area;

[0258] Step S107: forming a third color light-emitting film, a third functional film, a second electrode third sub-layer film and a third shielding film on the first shielding layer, the second shielding layer, the pixel defining layer and the side of the first electrode corresponding to the third color opening area away from the base substrate.

[0259] For example, Fig.23 As shown, a base substrate 101 is provided, and the base substrate 101 may be a glass substrate, a quartz substrate, or a flexible display substrate, etc., which is not limited in the embodiments of the present disclosure.

[0260] For example, Fig.24 As shown, an array of pixel units is formed on a base substrate 101, wherein each pixel unit includes a plurality of sub-pixels emitting light of different colors, and each sub-pixel includes a light-emitting element and a pixel driving circuit 1032 for driving the corresponding light-emitting element to emit light.

[0261] It should be noted that although Fig.24 The pixel unit and the sub-pixels it includes, and the light-emitting elements corresponding to each sub-pixel are mentioned, but since each light-emitting element includes many stacked structures, they cannot be used in this step. Therefore, a close-up of the formation of the pixel driving circuit 1032 is shown in this step.

[0262] For example, Fig.25 As shown, a pixel defining layer 104 is formed on the side of the pixel driving circuit 1032 away from the base substrate 101, and the pixel defining layer 104 includes a plurality of pixel openings 1041, each pixel opening 1041 corresponds to a sub-pixel, and each pixel unit corresponds to a first color opening area 1041a, a second color opening area 1041b and a third color opening area 1041c that are adjacent in sequence.

[0263] For example, Fig.26 As shown, a first electrode 105 is formed in each pixel opening 1041 .

[0264] For example, in Fig.26 In the structure shown, adjacent sub-pixels are divided by the first electrode 105 , that is, each first electrode 105 formed in each pixel opening 1041 corresponds to one sub-pixel.

[0265] For example, Figures 27A to 27E This is a process diagram for forming a first color light-emitting layer, a first functional layer, a second electrode first sublayer and a first shielding layer at a position corresponding to the first color opening area.

[0266] For example, Fig.27A As shown, a first color light-emitting layer 107, a first functional layer 171, a second electrode first sublayer 177 and a first blocking layer 172 are formed at a position corresponding to the first color opening area 1041a, including: a first color light-emitting film 107', a first functional film 171', a second electrode first sublayer film 177' and a first blocking film 172' are formed on the side of the pixel defining layer 104 and the first electrode 105 away from the base substrate 101.

[0267] For example, the first functional film 171' is a structure including a plurality of layers stacked together. Fig.27A In the figure, only the position corresponding to one layer of structure is marked, but in Fig.27A The first functional film 171' includes two film layers on the side of the first color luminescent film 107' close to the base substrate 101 and two film layers on the side away from the base substrate 101, that is, the first functional film 171' includes at least a four-layer structure. The first color luminescent film 107' may also include a multi-layer stacked structure.

[0268] For example, Fig.27B As shown, a first photoresist layer 181 is formed on the first shielding film 172' and at a position corresponding to the first color opening area 1041a. For example, the material of the first photoresist layer 181 can refer to conventional materials, which will not be described in detail here.

[0269] For example, Fig.27C As shown, the first blocking film 172 ′ is patterned using the first photoresist layer 181 as a mask to form a first blocking layer 172 .

[0270] For example, in Fig.27C In the structure shown, the first shielding layer 172 only covers the area corresponding to the leftmost sub-pixel.

[0271] For example, the material of the first shielding layer 172 may be an inorganic insulating material. For example, the material of the first shielding layer 172 is at least one of silicon nitride, silicon dioxide, silicon oxynitride, and the like.

[0272] For example, Fig.27D As shown, the first photoresist layer 181 on the side of the first blocking layer 172 away from the substrate 101 is removed.

[0273] For example, Fig.27E As shown, the first color light-emitting film 107 ′, the first functional film 171 ′ and the second electrode first sublayer film 177 ′ are patterned using the first blocking layer 172 as a mask to form the first color light-emitting layer 107 , the first functional layer 171 and the second electrode first sublayer 177 .

[0274] For example, Figures 28A to 28E This is a process diagram for forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area.

[0275] For example, Fig.28A As shown, a second color light-emitting layer 108, a second functional layer 173, a second electrode second sublayer 178 and a second shielding layer 174 are formed at the position corresponding to the second color opening area 1041b, including: a second color light-emitting film 108', a second functional film 173', a second electrode second sublayer film 178' and a second shielding film 174' are formed on the first shielding layer 172, the pixel defining layer 104 and the side of the first electrode 105 corresponding to the second color opening area 1041b and the third color opening area 1041c away from the base substrate 101.

[0276] For example, Fig.28B As shown, a second photoresist layer 182 is formed on the second blocking film 174 ′ and at positions corresponding to the first color opening area 1041 a and the second color opening area 1041 b .

[0277] For example, Fig.28C As shown, the second shielding film 174' is patterned with the second photoresist layer 182 as a mask to form a second shielding layer 174. For example, the second shielding layer 174 covers the area corresponding to the left sub-pixel and the middle sub-pixel. For example, the material of the second shielding layer 174 is the same as that of the first shielding layer 172, and the embodiments of the present disclosure will not be repeated.

[0278] For example, Fig.28D As shown, the second photoresist layer 182 on the side of the second blocking layer 174 away from the substrate 101 is removed.

[0279] For example, Fig.28EAs shown, the second color light-emitting film 108 ′, the second functional film 173 ′ and the second electrode second sublayer film 178 ′ are patterned using the second blocking layer 174 as a mask to form the second color light-emitting layer 108 , the second functional layer 173 and the second electrode second sublayer 178 , and a second color retaining film layer 122 is formed on the first blocking layer 172 .

[0280] For example, the structure of the second color retaining film layer 122 can refer to the related descriptions of other embodiments, which will not be repeated here.

[0281] For example, Fig.29 A process diagram for forming a third color light-emitting film, a third functional film, a second electrode third sub-layer film and a third shielding film on the first shielding layer, the second shielding layer, the pixel defining layer and the side of the first electrode corresponding to the third color opening area away from the base substrate. Fig.29 As shown, a third color light-emitting film 109', a third functional film 175', a second electrode third sublayer film 179' and a third shielding film 176' are formed on the first shielding layer 172, the second shielding layer 174, the pixel defining layer 104 and the side of the first electrode 105 corresponding to the third color opening area 1041c away from the base substrate 101.

[0282] For example, Fig.29 As shown, the portions of the third color light-emitting film 109', the third functional film 175', the second electrode third sublayer film 179' and the third blocking film 176' corresponding to the third color opening area 1041c serve as the third color light-emitting layer 109, the third functional layer 175, the second electrode third sublayer 179 and the third blocking layer 176 respectively, and the remaining portions serve as the third color retaining film layer 121.

[0283] For example, the structures of the second color retaining film layer 122 and the third color retaining film layer 121 can refer to the related descriptions in other embodiments, which will not be described in detail here.

[0284] For example, in another example, Fig.30 As shown, in Fig.29 Based on the structure shown, the method for preparing the display substrate also includes forming a packaging structure 117 on the side of the third blocking film 176' away from the base substrate 101. The packaging structure 117 can be a three-layer structure. The layer structure included in the packaging structure can be found in the relevant description above and will not be repeated here.

[0285] For example, in one example, the preparation method provided by the embodiment of the present disclosure is used to form Fig.30 The display substrate shown is also Figure 4 The display substrate shown, combined with Fig.30 and Figure 4As shown, the light-emitting layer includes the first color light-emitting layer 107, the second color light-emitting layer 108 and the third color light-emitting layer 109, and the functional layer includes the first functional layer 171, the second functional layer 173 and the third functional layer 175. The first functional layer 171 includes a hole injection layer 113 and a hole transport layer 114 sequentially formed on the side of the second color light-emitting layer 108 close to the first electrode 105, and an electron transport layer 115 and an electron injection layer 116 sequentially formed on the side of the second color light-emitting layer 108 away from the first electrode 105. The second functional layer 173 includes a hole injection layer 113 and a hole transport layer 114 sequentially formed on the side of the second color light-emitting layer 108 close to the first electrode 105, and an electron transport layer 115 and an electron injection layer 116 sequentially formed on the side of the second color light-emitting layer 108 away from the first electrode 105. The third functional layer 175 includes a hole injection layer 113 and a hole transport layer 114 formed in sequence on the side of the third color light-emitting layer 108 close to the first electrode 105, and an electron transport layer 115 and an electron injection layer 116 formed in sequence on the side of the third color light-emitting layer 108 away from the first electrode 105.

[0286] For example, combined with Fig.30 and Figure 4 As shown, the third color retaining film layer 112 includes a third hole injection retaining layer 1122, a third hole transport retaining layer 1123, a third color light emitting retaining layer 1121, a third electron transport retaining layer 1124, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retaining layer 1127, which are respectively formed on the first shielding layer 172 and the second shielding layer 174 on the side away from the base substrate 101.

[0287] For example, combined with Fig.30 and Figure 4 As shown, the second color retention film layer 123 includes a second hole injection retention layer 1222, a second hole transport retention layer 1223, a second color light emitting retention layer 1221, a second electron transport retention layer 1224, a second electron injection retention layer 1225, a second electrode retention second sublayer 1226 and a second shielding retention layer 1227 which are sequentially formed on the side of the first shielding layer 172 away from the base substrate 101.

[0288] For example, in Figure 4 , Fig.29 and Fig.30In the display substrate shown, each light-emitting element corresponds to a light-emitting unit, and a stacked second color retaining film layer 122 and a third color retaining film layer 112 are formed on the first shielding layer 172, and the second color retaining film layer 122 is on the side of the third color retaining film layer 112 close to the base substrate 101, and only the third color retaining film layer 112 is formed on the second shielding layer 174.

[0289] For example, in another example, the preparation method provided by the embodiment of the present disclosure is used to form Fig.30 The display substrate shown is also Fig.13 The display substrate shown is about to Fig.30 The functional layers and luminescent layers in Fig.13 The structure shown, combined with Fig.30 and Fig.13 As shown, each light emitting unit 106 includes a first light emitting unit 1061 and a second light emitting unit 1062 which are stacked, and the second electrode 110 is disposed on a side of the second light emitting unit 1062 away from the base substrate 101 .

[0290] For example, combined with Fig.30 and Fig.13 As shown, the light-emitting layer 133 includes a first color light-emitting layer 107, a second color light-emitting layer 108 and a third color light-emitting layer 109, each light-emitting layer 133 includes a first organic emission layer 1331 and a second organic emission layer 1332 stacked; the first color light-emitting layer 107 includes a first color light-emitting first sublayer 1071 and a first color light-emitting second sublayer 1072 stacked; the second color light-emitting layer 108 includes a second color light-emitting first sublayer 1081 and a second color light-emitting second sublayer 1082 stacked; the third color light-emitting layer 109 includes a first color light-emitting first sublayer 1081 and a second color light-emitting second sublayer 1082 stacked; The first sublayer 1091 of the third color light-emitting layer and the second sublayer 1092 of the third color light-emitting layer; the first light-emitting unit 1061 includes a first organic emission layer 1331, and the first organic emission layer 1331 includes a first color light-emitting first sublayer 1071, a second color light-emitting first sublayer 1081 and a third color light-emitting first sublayer 1091; the second light-emitting unit 1062 includes a second organic emission layer 1332, and the second organic emission layer 1332 includes a first color light-emitting second sublayer 1072, a second color light-emitting second sublayer 1082 and a third color light-emitting second sublayer 1092.

[0291] For example, the functional layer includes the above-mentioned first functional layer 171, the second functional layer 173 and the third functional layer 175. The first functional layer 171 includes a first functional first sublayer and a first functional second sublayer which are stacked, and the first functional first sublayer is closer to the first electrode 105 than the first functional second sublayer, and the first functional first sublayer includes a hole injection layer 113, a first hole transport layer 1141 and a first electron blocking layer 124 which are sequentially formed on a side of the first color light-emitting first sublayer 1071 close to the first electrode 105, and a first hole blocking layer 125, a first electron transport layer 1151 and a first charge generating layer 1231 which are sequentially formed on a side of the first color light-emitting first sublayer 1071 away from the first electrode 105. The first functional second sublayer 1072 includes a second charge generation layer 1232, a second hole transport layer 1142 and a second electron blocking layer 126 formed in sequence on a side of the first color light-emitting second sublayer 1072 close to the first electrode 105, and a second hole blocking layer 127, a second electron transport layer 1152 and an electron injection layer 116 formed in sequence on a side of the third color light-emitting second sublayer 1072 away from the first electrode 105. The second functional layer 173 includes a second functional first sublayer and a second functional second sublayer which are stacked, and the second functional first sublayer is closer to the first electrode 105 than the second functional second sublayer, and the second functional first sublayer includes a hole injection layer 113, a first hole transport layer 1141 and a first electron blocking layer 124 which are sequentially formed on the side of the second color light-emitting first sublayer 1731 close to the first electrode 105, and a first hole blocking layer 125, a first electron transport layer 1151 and a first charge generating layer 1231 which are sequentially formed on the side of the second color light-emitting first sublayer 1731 away from the first electrode 105. The second functional second sublayer 1732 includes a second charge generating layer 1232, a second hole transport layer 1142 and a second electron blocking layer 126 which are sequentially formed on the side of the second color light-emitting second sublayer 1732 close to the first electrode 105, and a second hole blocking layer 127, a second electron transport layer 1152 and an electron injection layer 116 which are sequentially formed on the side of the second color light-emitting second sublayer 1732 away from the first electrode 105. The third functional layer 175 includes a third functional first sublayer and a third functional second sublayer which are stacked, and the third functional first sublayer is closer to the first electrode 105 than the third functional second sublayer. The third functional first sublayer includes a hole injection layer 113, a first hole transport layer 1141 and a first electron blocking layer 124 which are sequentially formed on the side of the third color light-emitting first sublayer 1091 close to the first electrode 105, and a first hole blocking layer 125, a first electron transport layer 1151 and a first charge generating layer 1231 which are sequentially formed on the side of the third color light-emitting first sublayer 1091 away from the first electrode 105.The third functional second sublayer 1092 includes a second charge generation layer 1232, a second hole transport layer 1142 and a second electron blocking layer 126 formed in sequence on the side of the third color light-emitting second sublayer 1092 close to the first electrode 105, and a second hole blocking layer 127, a second electron transport layer 1152 and an electron injection layer 116 formed in sequence on the side of the third color light-emitting second sublayer 1092 away from the first electrode 105.

[0292] For example, the charge generation layer 123 includes a first charge generation layer 1231 and a second charge generation layer 1232 which are stacked. The first light emitting unit 1061 includes a hole injection layer 113, a first hole transport layer 1141, a first electron blocking layer 124, a first organic emission layer 1331, a first hole blocking layer 125, a first electron transport layer 1151 and a first charge generation layer 1231 which are stacked; the second light emitting unit 1062 includes a second charge generation layer 1232, a second hole transport layer 1142, a second electron blocking layer 126, a second organic emission layer 1332, a second hole blocking layer 127, a second electron transport layer 1152 and an electron injection layer 116 which are stacked.

[0293] Combination Fig.30 and Fig.13 As shown, the third color retaining film layer 112 includes a first part 112a and a second part 112b which are stacked, the first part 112a includes a third hole injection retaining layer 1122, a third hole transport first retaining layer 1123a, a third electron blocking first retaining layer 1241, a third color light emitting first retaining layer 1121a, a third hole blocking first retaining layer 1251, a third electron transport first retaining layer 1124a and a third charge generating first retaining layer 1231a which are stacked, and the second part 112b includes a third charge generating second retaining layer 1231b, a third hole transport second retaining layer 1123b, a third electron blocking second retaining layer 1261, a third color light emitting second retaining layer 1121b, a third hole blocking second retaining layer 1252, a third electron transport second retaining layer 1124b, a third electron injection retaining layer 1125, a second electrode retaining third sublayer 1126 and a third shielding retaining layer 1127 which are stacked.

[0294] Combination Fig.30 and Fig.13As shown, the second color retention film layer 122 includes a third part 122a and a fourth part 122b which are stacked. The third part 122a includes a second hole injection retention layer 1222, a second hole transport first retention layer 12231, a second electron blocking first retention layer 1262, a second color light-emitting first retention layer 1221a, a second hole blocking first retention layer 1271, a second electron transport first retention layer 12241, and a second charge generation first retention layer 12321 which are stacked. The fourth part 122b includes a second charge generation second retention layer 12322, a second hole transport second retention layer 12231, a second electron blocking second retention layer 1263, a second color light-emitting second retention layer 1222b, a second hole blocking second retention layer 1253, a second electron transport second retention layer 12242, a second electron injection retention layer 1225, a second electrode retention second sublayer 1226, and a second shielding retention layer 1227 which are stacked.

[0295] For example, the materials of the above-mentioned various layer structures, the size relationship between the thicknesses of different layers, etc. can all be found in the above-mentioned related descriptions, which will not be repeated here.

[0296] For example, Figure 31 to Figure 37 A process diagram of another method for preparing a display substrate provided in at least one embodiment of the present disclosure, for example, Fig.31 As shown, a base substrate 101 is provided. The material of the base substrate 101 can refer to the relevant description above, and the embodiments of the present disclosure are not limited to this.

[0297] For example, Fig.32 As shown, an array of pixel units is formed on a base substrate 101, wherein each pixel unit includes a plurality of sub-pixels emitting light of different colors, and each sub-pixel includes a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light.

[0298] It should be noted that although Fig.32 The pixel unit and the sub-pixels it includes, and the light-emitting elements corresponding to each sub-pixel are mentioned, but since each light-emitting element includes many stacked structures, they cannot be used in this step. Therefore, a close-up of the formation of the pixel driving circuit 1032 is shown in this step.

[0299] For example, Fig.33 As shown, a pixel defining layer 104 is formed on the side of the pixel driving circuit 1032 away from the base substrate 101, and the pixel defining layer 104 includes a plurality of pixel openings 1041, each pixel opening 1041 corresponds to a sub-pixel, and each pixel unit corresponds to a first color opening area 1041a, a second color opening area 1041b and a third color opening area 1041c that are adjacent in sequence.

[0300] For example, Fig.34 As shown, a first electrode 105 is formed in each pixel opening 1041 .

[0301] For example, in Fig.34 In the structure shown, adjacent sub-pixels are divided by the first electrode 105 , that is, each first electrode 105 formed in each pixel opening 1041 corresponds to one sub-pixel.

[0302] For example, Figures 35A to 35E This is a process diagram for forming a first color light-emitting layer, a first functional layer, a second electrode first sublayer and a first shielding layer at a position corresponding to the first color opening area.

[0303] For example, Fig.35A As shown, a first color light-emitting layer 107, a first functional layer 171, a second electrode first sublayer 177 and a first blocking layer 172 are formed at a position corresponding to the first color opening area 1041a, including: a first color light-emitting film 107', a first functional film 171', a second electrode first sublayer film 177' and a first blocking film 172' are formed on the side of the pixel defining layer 104 and the first electrode 105 away from the base substrate 101.

[0304] For example, the first functional film 171' is a structure including a plurality of layers stacked together. Fig.35A In the figure, only the position corresponding to one layer of structure is marked, but in Fig.35A The first functional film 171' includes two film layers on the side of the first color light-emitting film 107' close to the base substrate 101 and two film layers on the side away from the base substrate 101, that is, the first functional film 171' includes a four-layer structure stacked together, but the embodiments of the present disclosure are not limited to this, and the first functional film 171' may also include a structure formed by stacking more layers.

[0305] For example, Fig.35B As shown, a first photoresist layer 181 is formed on the first shielding film 172' and at a position corresponding to the first color opening area 1041a. For example, the material of the first photoresist layer 181 can refer to conventional materials, which will not be described in detail here.

[0306] For example, Fig.35C As shown, the first blocking film 172 ′ is patterned using the first photoresist layer 181 as a mask to form a first blocking layer 172 .

[0307] For example, in Fig.35C In the structure shown, the first shielding layer 172 only covers the area corresponding to the leftmost sub-pixel.

[0308] For example, the material of the first shielding layer 172 can refer to the relevant description above, which will not be repeated here.

[0309] For example, Fig.35D As shown, the first photoresist layer 181 on the side of the first blocking layer 172 away from the substrate 101 is removed.

[0310] For example, Fig.35E As shown, the first color light-emitting film 107 ′, the first functional film 171 ′ and the second electrode first sublayer film 177 ′ are patterned using the first blocking layer 172 as a mask to form the first color light-emitting layer 107 , the first functional layer 171 and the second electrode first sublayer 177 .

[0311] For example, Figure 36A to Figure 36E This is a process diagram for forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area.

[0312] For example, Fig.36A As shown, a second color light-emitting layer 108, a second functional layer 173, a second electrode second sublayer 178 and a second shielding layer 174 are formed at the position corresponding to the second color opening area 1041b, including: a second color light-emitting film 108', a second functional film 173', a second electrode second sublayer film 178' and a second shielding film 174' are formed on the first shielding layer 172, the pixel defining layer 104 and the side of the first electrode 105 corresponding to the second color opening area 1041b and the third color opening area 1041c away from the base substrate 101.

[0313] For example, Fig.36B As shown, a second photoresist layer 182 is formed on the second blocking film 174 ′ and at a position corresponding to the second color opening area 1041 b .

[0314] For example, Fig.36C As shown, the second shielding film 174' is patterned using the second photoresist layer 182 as a mask to form a second shielding layer 174. For example, the second shielding layer 174 only covers the area corresponding to the middle sub-pixel. For example, the material of the second shielding layer 174 is the same as that of the first shielding layer 172, and the embodiments of the present disclosure will not be repeated.

[0315] For example, Fig.36D As shown, the second photoresist layer 182 on the side of the second blocking layer 174 away from the substrate 101 is removed.

[0316] For example, Fig.36EAs shown, the second color light-emitting film 108', the second functional film 173' and the second electrode second sublayer film 178' are patterned using the second blocking layer 174 as a mask to form the second color light-emitting layer 108, the second functional layer 173 and the second electrode second sublayer 178, and the remaining film layer on the first blocking layer 172 is removed.

[0317] For example, Fig.37 A process diagram for forming a third color light-emitting film, a third functional film, a second electrode third sub-layer film and a third shielding film on the first shielding layer, the second shielding layer, the pixel defining layer and the side of the first electrode corresponding to the third color opening area away from the base substrate. Fig.37 As shown, a third color light-emitting film 109', a third functional film 175', a second electrode third sublayer film 179' and a third shielding film 176' are formed on the first shielding layer 172, the second shielding layer 174, the pixel defining layer 104 and the side of the first electrode 105 corresponding to the third color opening area 1041c away from the base substrate 101.

[0318] For example, Fig.37 As shown, the portions of the third color light-emitting film 109', the third functional film 175', the second electrode third sublayer film 179' and the third blocking film 176' corresponding to the third color opening area 1041c serve as the third color light-emitting layer 109, the third functional layer 175, the second electrode third sublayer 179 and the third blocking layer 176 respectively, and the remaining portions serve as the third color retaining film layer 121.

[0319] For example, the structure of the third color retaining film layer 121 can refer to the related descriptions in other embodiments, which will not be repeated here.

[0320] For example, in another example, Fig.38 As shown, in Fig.37 Based on the structure shown, the method for preparing the display substrate also includes forming a packaging structure 117 on the side of the third blocking film 176' away from the base substrate 101. The packaging structure 117 can be a three-layer structure. The layer structure included in the packaging structure can be found in the relevant description above and will not be repeated here.

[0321] For example, in another example, the preparation method provided by the embodiment of the present disclosure is used to form Fig.38 The display substrate shown is also Figure 1 The display substrate shown, combined with Fig.38 and Figure 1 As shown, each light emitting element corresponds to a light emitting unit, and a third color retaining film layer 112 is formed on the first shielding layer 172 and the second shielding layer 174. The various layer structures included in the display substrate can refer to Figure 1The relevant description will not be repeated here.

[0322] For example, in another example, the preparation method provided by the embodiment of the present disclosure is used to form Fig.38 The display substrate shown is also Fig.12 The display substrate shown, combined with Fig.38 and Fig.12 As shown, each light emitting element corresponds to two light emitting units, and a third color retaining film layer 112 is formed on the first shielding layer 172 and the second shielding layer 174. The various layer structures included in the display substrate can be referred to Fig.12 The relevant description will not be repeated here.

[0323] For example, at least one embodiment of the present disclosure also provides another method for preparing a display substrate, which includes: Figure 31 to Figure 37 In addition to the steps shown, Figure 39 to Figure 41 The steps shown are Figure 31 to Figure 37 and Figure 39 to Figure 41 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure.

[0324] For example, Fig.39 As shown, in Fig.37 On the basis of the cross-sectional structure shown, a third photoresist layer 183 is formed on the third blocking film 176 ′ and at a position corresponding to the third color opening area 1041 c .

[0325] For example, Fig.40 As shown, the third photoresist layer 183 is used as a mask to remove the portion of the third blocking film 176 ′ on the third color retaining film layer 121 except the third blocking layer 176 .

[0326] For example, Fig.41 As shown, the third photoresist layer 183 is removed, and the remaining portion of the third color retaining film layer 121 is removed.

[0327] For example, in another embodiment, Fig.41 Based on the cross-sectional structure formed, it can also include Fig.42 The steps shown are Figure 31 to Figure 37 and Figure 39 to Figure 42 A process diagram of another method for preparing a display substrate provided in at least one embodiment of the present disclosure, such as Fig.42 As shown, the first shielding layer 172 , the second shielding layer 174 and the third shielding layer 176 are removed, and an electrode connection structure 186 is formed on the second electrode 110 , and the electrode connection structure 186 is electrically connected to the second electrode 110 .

[0328] For example, in another embodiment, Fig.42Based on the cross-sectional structure formed, it can also include Fig.43 The steps shown are Figure 31 to Figure 37 and Figure 39 to Figure 43 A process diagram of another method for preparing a display substrate provided in at least one embodiment of the present disclosure, such as Fig.43 As shown, in Fig.42 A packaging structure 117 is formed on the structure of the display substrate. The specific structure of the packaging structure can be found in the above related descriptions, which will not be repeated here.

[0329] For example, at least one embodiment of the present disclosure also provides another method for preparing a display substrate, which includes: Figure 23 to Figure 29 In addition to the steps shown, Figures 44 to 49 The steps shown are Figure 23 to Figure 29 and Figures 44 to 49 A process diagram of another method for preparing a display substrate provided for at least one embodiment of the present disclosure.

[0330] For example, Fig.44 As shown, in Fig.29 On the basis of the cross-sectional structure shown, a third photoresist layer 183 is formed on the third blocking film 176 ′ and at a position corresponding to the third color opening area 1041 c .

[0331] For example, Fig.45 As shown, the third photoresist layer 183 is used as a mask to remove the portion of the third blocking film 176 ′ on the third color retaining film layer 121 except the third blocking layer 176 .

[0332] For example, Fig.46 As shown, the third photoresist layer 183 is removed, and the remaining portion of the third color retaining film layer 121 is removed.

[0333] For example, Fig.47 As shown, in Fig.46 On the basis of the cross-sectional structure shown, a fourth photoresist layer 184 is formed on the second blocking layer 174 and the third blocking layer 176 and at positions corresponding to the second color opening region 1041b and the third color opening region 1041c.

[0334] For example, Fig.48 As shown, the fourth photoresist layer 184 is used as a mask to remove the remaining second shielding film on the second color retaining film layer 122 .

[0335] For example, Fig.49 As shown, the fourth photoresist layer 184 is removed, and the remaining portion of the second color retaining film layer 122 is removed.

[0336] For example, in another embodiment, Fig.49Based on the cross-sectional structure formed, it can also include Fig.50 The steps shown are Figure 23 to Figure 29 and Figures 44 to 50 A process diagram of another method for preparing a display substrate provided in at least one embodiment of the present disclosure, such as Fig.50 As shown, the first shielding layer 172 , the second shielding layer 174 and the third shielding layer 176 are removed, and an electrode connection structure 186 is formed on the second electrode 110 , and the electrode connection structure 186 is electrically connected to the second electrode 110 .

[0337] For example, in another embodiment, Fig.50 Based on the cross-sectional structure formed, it can also include Fig.51 The steps shown are Figure 23 to Figure 29 and Figures 44 to 51 A process diagram of another method for preparing a display substrate provided in at least one embodiment of the present disclosure, such as Fig.51 As shown, in Fig.50 A packaging structure 117 is formed on the structure of the display substrate. The specific structure of the packaging structure can be found in the above related descriptions, which will not be repeated here.

[0338] For example, in at least one embodiment of the present disclosure, in the embodiments of each of the above preparation methods, Fig.24 After the steps shown, and in Fig.25 Before the step shown in the figure, that is, before forming the pixel defining layer 104, it also includes forming an auxiliary electrode 1043, and then Fig.25 In the step shown in FIG. 1 , a pixel defining layer 104 is formed, and an auxiliary electrode 1043 is formed in each spacer 1042 of the pixel defining layer 104. Fig.16 and Fig.21 In the structure shown, the auxiliary electrode 1043 and the second electrode 110 are electrically connected through the first via structure 1044 .

[0339] For example, in at least one embodiment of the present disclosure, in the embodiments of each of the above preparation methods, Fig.32 After the steps shown, and in Fig.33 Before the step shown in the figure, that is, before forming the pixel defining layer 104, it also includes forming an auxiliary electrode 1043, and then Fig.33 In the step shown in FIG. 1 , a pixel defining layer 104 is formed, and an auxiliary electrode 1043 is formed in each spacer 1042 of the pixel defining layer 104. Fig.15 and 20 In the structure shown, the auxiliary electrode 1043 and the second electrode 110 are electrically connected through the first via structure 1044 .

[0340] For example, in at least one embodiment of the present disclosure, in the embodiments of each of the above preparation methods, Fig.24 After the steps shown, and in Fig.25 before the step shown; or, Fig.32 After the steps shown, and in Fig.33 Before the step shown, that is, after forming the pixel driving circuit 1032 and before forming the pixel defining layer 104, the auxiliary electrode 1043, the planarization layer 118 and the second via structure 1045 penetrating the planarization layer 118 are formed. The auxiliary electrode 1043 is disposed in the planarization layer 118, and then Fig.25 or Fig.32 The pixel defining layer 104 is formed in the steps shown. The pixel defining layer 104 includes a first spacer 1191, a second spacer 1192 and a third spacer 1193 adjacent to each other in sequence. In the process of forming the first electrode 105 between the first spacer 1191 and the second spacer 1192, a connecting electrode 161 is formed between the second spacer 1192 and the third spacer 1193. The connecting electrode 161 and the auxiliary electrode 1043 are electrically connected through the second via structure 1045. For the relevant content of the connecting electrode 161, please refer to Fig. 9 and Fig.10 The structure shown.

[0341] For example, in at least one embodiment of the present disclosure, in the embodiments of the above-mentioned preparation methods, combined with Fig.21 The display substrate includes a display area 130 and a peripheral area 140 arranged around the display area 130. In the peripheral area 140, from a position close to the display area 130 to a position far from the display area 130, and when the second electrode 110 corresponding to the first color opening area 1041a, the second color opening area 1041b and the third color opening area 1041c are formed respectively, a first common voltage connection line 141, a second common voltage connection line 142 and a third common voltage connection line 143 are also formed respectively. The first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 are electrically connected to the first light-emitting element, the second light-emitting element and the third light-emitting element including the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting film respectively.

[0342] For example, combined with Figure 8 and Fig.17 The first light emitting element, the second light emitting element and the third light emitting element are electrically connected to the power supply voltage line 133 through the first common voltage connection line 141, the second common voltage connection line 142 and the third common voltage connection line 143 respectively.

[0343] The display substrate and preparation method thereof provided by at least one embodiment of the present disclosure have at least the following beneficial technical effects: by depositing light-emitting layers and functional layers of different colors three times respectively, and by two exposure and etching patterning techniques, that is, without using a fine metal mask (FMM), the preparation of RGB full-color OLED pixelated devices can be realized, solving the problem that the display resolution cannot be further improved when the AMOLED evaporation technology is extended to medium and large-sized display products, and it can also solve the problem that the product resolution is limited by the FMM technology, the medium and large-sized high-resolution FMM preparation is difficult, and the production cost is high. By using the exposure and etching process to prepare large-size high-resolution RGB full-color AMOLED display products on the large-generation AMOLED production line, the resolution and display effect of the display device can also be improved.

[0344] There are a few points to note:

[0345] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0346] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is enlarged or reduced, that is, these drawings are not drawn according to the actual scale.

[0347] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0348] The above description is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A display substrate, comprising: substrate substrate; An array of pixel units arranged on the substrate, wherein each of the pixel units includes a plurality of sub-pixels emitting light of different colors, and each of the sub-pixels includes a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; A pixel defining layer is arranged on a side of the pixel driving circuit away from the substrate; wherein the pixel defining layer includes a plurality of pixel openings, and each of the pixel openings corresponds to one of the sub-pixels.

2. The display substrate according to claim 1, wherein: Each of the pixel units includes three sub-pixels, and the light-emitting element corresponding to each of the sub-pixels includes a first electrode and a light-emitting unit that are stacked; The light-emitting units included in the three sub-pixels in the same pixel unit respectively include a first color light-emitting layer, a second color light-emitting layer and a third color light-emitting layer; A second electrode is provided on a side of the light emitting unit away from the base substrate, and a shielding layer is provided on a side of the second electrode away from the base substrate; A third color retaining film layer is disposed at a position of the shielding layer away from the second color light emitting layer and at a position of the shielding layer away from the first color light emitting layer.

3. The display substrate according to claim 2, wherein: A second color retaining film layer is further arranged at a position of the shielding layer away from the first color light emitting layer, and the second color retaining film layer and the third color retaining film layer are sequentially stacked in a direction away from the base substrate.

4. The display substrate according to claim 3, wherein: A maximum distance between the third color retaining film layer and the first color light emitting layer at a position of the shielding layer far from the first color light emitting layer is different from a maximum distance between the third color retaining film layer and the second color light emitting layer at a position of the shielding layer far from the second color light emitting layer.

5. The display substrate according to claim 3, wherein: A packaging structure is arranged on a side of the third color retaining film layer away from the base substrate.

6. The display substrate according to any one of claims 2 to 5, wherein: The display substrate comprises a display area and a peripheral area surrounding the display area; In the peripheral area, a first common voltage connection line, a second common voltage connection line and a third common voltage connection line are sequentially arranged from a position close to the display area to a position far from the display area; In each of the pixel units, the light-emitting elements include a first light-emitting element, a second light-emitting element and a third light-emitting element, and the first common voltage connection line, the second common voltage connection line and the third common voltage connection line are electrically connected to the first light-emitting element, the second light-emitting element and the third light-emitting element respectively.

7. The display substrate according to claim 6, wherein: The pixel defining layer further includes a plurality of spacers for spacing the adjacent pixel openings apart, an auxiliary electrode is disposed in each of the spacers, and the auxiliary electrode and the second electrode are electrically connected through a first via structure.

8. The display substrate according to claim 7, wherein: The auxiliary electrode includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a metal oxide layer which are sequentially stacked from a position close to the base substrate to a position far from the base substrate.

9. The display substrate according to claim 8, wherein: The thickness of the first titanium metal layer ranges from 100 angstroms to 800 angstroms, the thickness of the aluminum metal layer ranges from 2000 angstroms to 6000 angstroms, the thickness of the second titanium metal layer ranges from 100 angstroms to 500 angstroms, and the thickness of the metal oxide layer ranges from 100 angstroms to 300 angstroms.

10. The display substrate according to claim 9, wherein: The thicknesses of the first titanium metal layer, the aluminum metal layer, the second titanium metal layer and the metal oxide layer are 500 angstroms, 5000 angstroms, 300 angstroms and 200 angstroms respectively.

11. The display substrate according to claim 6, wherein: The pixel defining layer also includes a plurality of spacers, which include a first spacer, a second spacer, and a third spacer that are adjacent to each other in sequence, the first electrode is arranged between the first spacer and the second spacer, and a connecting electrode is arranged between the second spacer and the third spacer.

12. The display substrate according to claim 11, wherein: The first electrode and the connecting electrode are formed by using the same material in the same process step, and the first electrode and the connecting electrode are spaced apart from each other.

13. The display substrate according to claim 11 or 12, wherein: An auxiliary electrode is also arranged on the side of the layer where the pixel driving circuit is located away from the base substrate, and a planarization layer is also arranged between the auxiliary electrode and the pixel defining layer. The connecting electrode and the auxiliary electrode are electrically connected through a second via structure located in the planarization layer, and the connecting electrode and the second electrode are electrically connected.

14. The display substrate according to claim 13, wherein: A plurality of the auxiliary electrodes are connected to form a grid structure.

15. The display substrate according to claim 14, wherein: The auxiliary electrode includes a stacked structure formed by a molybdenum metal layer, a copper metal layer, a titanium metal layer, an aluminum metal layer and a titanium metal layer, or a stacked structure formed by an indium tin oxide layer, a silver metal layer and an indium tin oxide layer.

16. The display substrate according to claim 14 or 15, wherein: The thickness of the auxiliary electrode is 1000 angstroms to 6000 angstroms, and the sheet resistance of the auxiliary electrode is 0 to 0.5 Ω / sq.

17. The display substrate according to claim 13, wherein: The connection resistance between the second electrode and the connection electrode is 0-0.1Ω.

18. The display substrate according to claim 6, wherein: The first light emitting element, the second light emitting element and the third light emitting element are electrically connected to a power supply voltage line through the first common voltage connection line, the second common voltage connection line and the third common voltage connection line, respectively.

19. The display substrate according to claim 18, wherein: The light-emitting unit includes a stacked functional layer and a light-emitting layer, wherein the functional layer includes a stacked hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer in a direction away from the first electrode in sequence, and the light-emitting layer is arranged between the hole transport layer and the electron transport layer, and the light-emitting layer includes the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer; The third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color luminescent retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

20. The display substrate according to claim 19, wherein: The light-emitting unit includes a stacked functional layer and a light-emitting layer, wherein the functional layer includes a stacked hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer in a direction away from the first electrode in sequence, and the light-emitting layer is arranged between the hole transport layer and the electron transport layer, and the light-emitting layer includes the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer; The second color retention film layer includes a second hole injection retention layer, a second hole transport retention layer, a second color luminescence retention layer, a second electron transport retention layer, a second electron injection retention layer, a second electrode retention second sublayer and a second shielding retention layer which are stacked; and The third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color luminescent retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

21. The display substrate according to claim 19, wherein: The light emitting unit includes a first light emitting unit and a second light emitting unit which are stacked, and the second electrode is arranged on a side of the second light emitting unit away from the base substrate.

22. The display substrate according to claim 21, wherein: The light-emitting layer includes a first organic emission layer and a second organic emission layer which are stacked; The first color light-emitting layer includes a first color light-emitting first sublayer and a first color light-emitting second sublayer which are stacked; The second color light-emitting layer includes a second color light-emitting first sublayer and a second color light-emitting second sublayer which are stacked; The third color light-emitting layer comprises a third color light-emitting first sublayer and a third color light-emitting second sublayer which are stacked; The first light-emitting unit includes the first organic emission layer, and the first organic emission layer includes the first color light-emitting first sublayer, the second color light-emitting first sublayer, and the third color light-emitting first sublayer; The second light emitting unit includes the second organic emission layer, and the second organic emission layer includes the first color light emitting second sublayer, the second color light emitting second sublayer, and the third color light emitting second sublayer.

23. The display substrate according to claim 22, wherein: The thickness of the first color light-emitting first sublayer and the thickness of the first color light-emitting second sublayer are different from each other; the thickness of the second color light-emitting first sublayer and the thickness of the second color light-emitting second sublayer are different from each other; The thicknesses of the third color light-emitting first sublayer and the third color light-emitting second sublayer are different from each other.

24. The display substrate according to claim 23, wherein: The sum of the thicknesses of the first color emitting first sublayer and the first color emitting second sublayer is different from the sum of the thicknesses of the second color emitting first sublayer and the second color emitting second sublayer and the sum of the thicknesses of the third color emitting first sublayer and the third color emitting second sublayer.

25. The display substrate according to any one of claims 22 to 24, wherein: A charge generation layer is arranged at least between the first color luminescent first sublayer and the first color luminescent second sublayer, and / or between the second color luminescent first sublayer and the second color luminescent second sublayer, and / or between the third color luminescent first sublayer and the third color luminescent second sublayer.

26. The display substrate according to claim 25, wherein: The charge generation layer includes a first charge generation layer and a second charge generation layer which are stacked.

27. The display substrate according to claim 26, wherein: The first charge generation layer and the second charge generation layer are constructed according to a PN junction structure.

28. The display substrate according to claim 25, wherein: The first light emitting unit includes a hole injection layer, a first hole transport layer, a first electron blocking layer, the first organic emission layer, a first hole blocking layer, a first electron transport layer and the first charge generating layer which are stacked; The second light emitting unit includes the second charge generating layer, the second hole transporting layer, the second electron blocking layer, the second organic emission layer, the second hole blocking layer, the second electron transporting layer and the electron injection layer which are stacked.

29. The display substrate according to claim 2, wherein: The third color retention film layer includes a first part and a second part which are stacked, wherein the first part includes a third hole injection retention layer, a third hole transport first retention layer, a third electron blocking first retention layer, a third color light emitting first retention layer, a third hole blocking first retention layer, a third electron transport first retention layer and a third charge generating first retention layer which are stacked, and the second part includes a third charge generating second retention layer, a third hole transport second retention layer, a third electron blocking second retention layer, a third color light emitting second retention layer, a third hole blocking second retention layer, a third electron transport second retention layer, a third electron injection retention layer, a second electrode retaining third sublayer and a third shielding retention layer which are stacked.

30. The display substrate according to claim 3, wherein: The third color retention film layer includes a first part and a second part stacked, the first part includes a third hole injection retention layer, a third hole transport first retention layer, a third electron blocking first retention layer, a third color luminescent first retention layer, a third hole blocking first retention layer, a third electron transport first retention layer and a third charge generation first retention layer stacked, the second part includes a third charge generation second retention layer, a third hole transport second retention layer, a third electron blocking second retention layer, a third color luminescent second retention layer, a third hole blocking second retention layer, a third electron transport second retention layer, a third electron injection retention layer, a second electrode retention third sublayer and a third shielding retention layer stacked; And the second color retention film layer includes a third part and a fourth part which are stacked, the third part includes a second hole injection retention layer, a second hole transport first retention layer, a second electron blocking first retention layer, a second color light-emitting first retention layer, a second hole blocking first retention layer, a second electron transport first retention layer, and a second charge generation first retention layer which are stacked, and the fourth part includes a second charge generation second retention layer, a second hole transport second retention layer, a second electron blocking second retention layer, a second color light-emitting second retention layer, a second hole blocking second retention layer, a second electron transport second retention layer, a second electron injection retention layer, a second electrode retention second sublayer and a second shielding retention layer which are stacked.

31. The display substrate according to claim 29 or 30, wherein: The first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer are respectively a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer. The first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer are all phosphorescent light-emitting layers, and the third color light-emitting layer also contains boron element.

32. The display substrate according to claim 31, wherein: The red light-emitting layer, the green light-emitting layer and the blue light-emitting layer all include a host material and a phosphorescent material, and the molecular weight of the phosphorescent material included in the red light-emitting layer is greater than the molecular weight of the phosphorescent material included in the green light-emitting layer, and greater than the molecular weight of the phosphorescent material included in the blue light-emitting layer.

33. The display substrate according to claim 32, wherein: The first electrode includes a reflective metal layer and a transparent conductive layer which are stacked.

34. The display substrate according to claim 33, wherein: The material of the reflective metal layer includes at least one of aluminum and silver, and the material of the transparent conductive layer includes at least one of indium tin oxide and indium zinc oxide.

35. The display substrate according to claim 33, wherein: The second electrode includes a single-layer structure or a multi-layer structure formed of at least one of silver, aluminum, magnesium, lithium, calcium, lithium fluoride, indium tin oxide, and indium zinc oxide.

36. The display substrate according to claim 32, wherein: The transmittance of the first electrode is greater than 80%.

37. The display substrate according to any one of claims 1 to 5, wherein: The pixel driving circuit includes a plurality of thin film transistors, at least one of the thin film transistors is a metal oxide thin film transistor, and at least one of the thin film transistors is a low temperature polysilicon thin film transistor.

38. A display substrate, comprising: substrate substrate; An array of pixel units arranged on the substrate, wherein each of the pixel units includes a plurality of sub-pixels emitting light of different colors, and each of the sub-pixels includes a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; A pixel defining layer disposed on a side of the pixel driving circuit away from the base substrate; wherein the pixel defining layer comprises a plurality of pixel openings, each of the pixel openings corresponding to one of the sub-pixels; The pixel defining layer further includes a plurality of spacers for spacing the adjacent pixel openings apart, an auxiliary electrode is disposed in each of the spacers, and the auxiliary electrode and the second electrode are electrically connected through a first via structure.

39. The display substrate according to claim 38, wherein: Each of the pixel units includes three sub-pixels, and the light-emitting element corresponding to each of the sub-pixels includes a first electrode and a light-emitting unit that are stacked; The light-emitting units included in the three sub-pixels in the same pixel unit respectively include a first color light-emitting layer, a second color light-emitting layer and a third color light-emitting layer; A second electrode is provided on a side of the light emitting unit away from the base substrate, and a shielding layer is provided on a side of the second electrode away from the base substrate; A third color retaining film layer is disposed at a position of the shielding layer away from the second color light emitting layer and at a position of the shielding layer away from the first color light emitting layer.

40. The display substrate according to claim 39, wherein: A second color retaining film layer is further arranged at a position of the shielding layer away from the first color light emitting layer, and the second color retaining film layer and the third color retaining film layer are sequentially stacked in a direction away from the base substrate.

41. The display substrate according to claim 40, wherein: A maximum distance between the third color retaining film layer and the first color light emitting layer at a position of the shielding layer far from the first color light emitting layer is different from a maximum distance between the third color retaining film layer and the second color light emitting layer at a position of the shielding layer far from the second color light emitting layer.

42. The display substrate according to claim 40, wherein: A packaging structure is arranged on a side of the third color retaining film layer away from the base substrate.

43. The display substrate according to claim 42, wherein: The display substrate comprises a display area and a peripheral area surrounding the display area; In the peripheral area, a first common voltage connection line, a second common voltage connection line and a third common voltage connection line are sequentially arranged from a position close to the display area to a position far from the display area; In each of the pixel units, the light-emitting elements include a first light-emitting element, a second light-emitting element and a third light-emitting element, and the first common voltage connection line, the second common voltage connection line and the third common voltage connection line are electrically connected to the first light-emitting element, the second light-emitting element and the third light-emitting element respectively.

44. The display substrate according to claim 43, wherein: The auxiliary electrode includes a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a metal oxide layer which are sequentially stacked from a position close to the base substrate to a position far from the base substrate.

45. The display substrate according to claim 44, wherein: The thickness of the first titanium metal layer ranges from 100 angstroms to 800 angstroms, the thickness of the aluminum metal layer ranges from 2000 angstroms to 6000 angstroms, the thickness of the second titanium metal layer ranges from 100 angstroms to 500 angstroms, and the thickness of the metal oxide layer ranges from 100 angstroms to 300 angstroms.

46. ​​The display substrate according to claim 45, wherein: The thicknesses of the first titanium metal layer, the aluminum metal layer, the second titanium metal layer and the metal oxide layer are 500 angstroms, 5000 angstroms, 300 angstroms and 200 angstroms respectively.

47. The display substrate according to claim 44, wherein: The auxiliary electrode includes a multi-layer structure that is stacked, and the multi-layer structure included in the auxiliary electrode is connected in parallel through a via hole.

48. The display substrate according to claim 47, further comprising a gate line, a data line, a power supply voltage signal line and an initialization signal line, wherein: The auxiliary electrode is disposed in the same layer as at least one of the gate line, the data line, the power supply voltage signal line and the initialization signal line.

49. The display substrate according to claim 47, further comprising a gate line, a data line, a power supply voltage signal line, an initialization signal line, a reference voltage signal line and a sensing voltage signal line, wherein: The auxiliary electrode is disposed in the same layer as at least one of the gate line, the data line, the power supply voltage signal line, the initialization signal line, the reference voltage signal line and the induction voltage signal line.

50. The display substrate according to any one of claims 39 to 49, wherein: The light-emitting unit includes a stacked functional layer and a light-emitting layer, wherein the functional layer includes a stacked hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer in a direction away from the first electrode in sequence, and the light-emitting layer is arranged between the hole transport layer and the electron transport layer, and the light-emitting layer includes the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer; The third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color luminescent retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

51. The display substrate according to claim 50, wherein: The light-emitting unit includes a stacked functional layer and a light-emitting layer, wherein the functional layer includes a stacked hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer in a direction away from the first electrode in sequence, and the light-emitting layer is arranged between the hole transport layer and the electron transport layer, and the light-emitting layer includes the first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer; The second color retention film layer includes a second hole injection retention layer, a second hole transport retention layer, a second color luminescence retention layer, a second electron transport retention layer and a second electron injection retention layer, a second electrode retention second sublayer and a second shielding retention layer which are stacked; and The third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color luminescent retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer which are stacked.

52. The display substrate according to claim 40, wherein: The light emitting unit includes a first light emitting unit and a second light emitting unit which are stacked, and the second electrode is arranged on a side of the second light emitting unit away from the base substrate.

53. The display substrate according to claim 52, wherein: The light-emitting layer includes a first organic emission layer and a second organic emission layer which are stacked; The first color light-emitting layer includes a first color light-emitting first sublayer and a first color light-emitting second sublayer which are stacked; The second color light-emitting layer includes a second color light-emitting first sublayer and a second color light-emitting second sublayer which are stacked; The third color light-emitting layer comprises a third color light-emitting first sublayer and a third color light-emitting second sublayer which are stacked; The first light-emitting unit includes the first organic emission layer, and the first organic emission layer includes the first color light-emitting first sublayer, the second color light-emitting first sublayer, and the third color light-emitting first sublayer; The second light emitting unit includes the second organic emission layer, and the second organic emission layer includes the first color light emitting second sublayer, the second color light emitting second sublayer, and the third color light emitting second sublayer.

54. The display substrate according to claim 53, wherein: The thickness of the first color light-emitting first sublayer and the thickness of the first color light-emitting second sublayer are different from each other; the thickness of the second color light-emitting first sublayer and the thickness of the second color light-emitting second sublayer are different from each other; The thicknesses of the third color light-emitting first sublayer and the third color light-emitting second sublayer are different from each other.

55. The display substrate according to claim 54, wherein: The sum of the thicknesses of the first color emitting first sublayer and the first color emitting second sublayer is different from the sum of the thicknesses of the second color emitting first sublayer and the second color emitting second sublayer and the sum of the thicknesses of the third color emitting first sublayer and the third color emitting second sublayer.

56. The display substrate according to any one of claims 53 to 55, wherein: A charge generation layer is arranged at least between the first color luminescent first sublayer and the first color luminescent second sublayer, and / or between the second color luminescent first sublayer and the second color luminescent second sublayer, and / or between the third color luminescent first sublayer and the third color luminescent second sublayer.

57. The display substrate according to claim 56, wherein: The charge generation layer includes a first charge generation layer and a second charge generation layer which are stacked.

58. The display substrate according to claim 57, wherein: The first charge generation layer and the second charge generation layer are constructed according to a PN junction structure.

59. The display substrate according to claim 56 or 57, wherein: The first light emitting unit includes a hole injection layer, a first hole transport layer, a first electron blocking layer, the first organic emission layer, a first hole blocking layer, a first electron transport layer and the first charge generating layer which are stacked; The second light emitting unit includes the second charge generating layer, the second hole transporting layer, the second electron blocking layer, the second organic emission layer, the second hole blocking layer, the second electron transporting layer and the electron injection layer which are stacked.

60. The display substrate according to claim 39, wherein: The third color retention film layer includes a first part and a second part which are stacked, wherein the first part includes a third hole injection retention layer, a third hole transport first retention layer, a third electron blocking first retention layer, a third color light emitting first retention layer, a third hole blocking first retention layer, a third electron transport first retention layer and a third charge generating first retention layer which are stacked, and the second part includes a third charge generating second retention layer, a third hole transport second retention layer, a third electron blocking second retention layer, a third color light emitting second retention layer, a third hole blocking second retention layer, a third electron transport second retention layer, a third electron injection retention layer, a second electrode retaining third sublayer and a third shielding retention layer which are stacked.

61. The display substrate according to claim 40, wherein: The third color retention film layer includes a first part and a second part stacked, the first part includes a third hole injection retention layer, a third hole transport first retention layer, a third electron blocking first retention layer, a third color luminescent first retention layer, a third hole blocking first retention layer, a third electron transport first retention layer and a third charge generation first retention layer stacked, the second part includes a third charge generation second retention layer, a third hole transport second retention layer, a third electron blocking second retention layer, a third color luminescent second retention layer, a third hole blocking second retention layer, a third electron transport second retention layer, a third electron injection retention layer, a second electrode retention third sublayer and a third shielding retention layer stacked; And the second color retention film layer includes a third part and a fourth part which are stacked, the third part includes a second hole injection retention layer, a second hole transport first retention layer, a second electron blocking first retention layer, a second color light-emitting first retention layer, a second hole blocking first retention layer, a second electron transport first retention layer, and a second charge generation first retention layer which are stacked, and the fourth part includes a second charge generation second retention layer, a second hole transport second retention layer, a second electron blocking second retention layer, a second color light-emitting second retention layer, a second hole blocking second retention layer, a second electron transport second retention layer and a second electron injection retention layer, a second electrode retention second sublayer and a second shielding retention layer which are stacked.

62. The display substrate according to claim 60 or 61, wherein: The first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer are respectively a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer. The first color light-emitting layer, the second color light-emitting layer and the third color light-emitting layer are all phosphorescent light-emitting layers, and the third color light-emitting layer also contains boron element.

63. The display substrate according to claim 62, wherein: The red light-emitting layer, the green light-emitting layer and the blue light-emitting layer all include a host material and a phosphorescent material, and the molecular weight of the phosphorescent material included in the red light-emitting layer is greater than the molecular weight of the phosphorescent material included in the green light-emitting layer, and greater than the molecular weight of the phosphorescent material included in the blue light-emitting layer.

64. The display substrate according to any one of claims 60 to 63, wherein: The first electrode includes a reflective metal layer and a transparent conductive layer which are stacked.

65. The display substrate according to claim 64, wherein: The material of the reflective metal layer includes at least one of aluminum and silver, and the material of the transparent conductive layer includes at least one of indium tin oxide and indium zinc oxide.

66. The display substrate according to claim 65, wherein: The second electrode includes a single-layer structure or a multi-layer structure formed of at least one of silver, aluminum, magnesium, lithium, calcium, lithium fluoride, indium tin oxide, and indium zinc oxide.

67. The display substrate according to any one of claims 60 to 63, wherein: The transmittance of the first electrode is greater than 80%.

68. The display substrate according to claim 65 or 66, wherein: The pixel driving circuit includes a plurality of thin film transistors, at least one of the thin film transistors is a metal oxide thin film transistor, and at least one of the thin film transistors is a low temperature polysilicon thin film transistor.

69. A method for preparing a display substrate, comprising: providing a substrate base plate; Forming pixel units arranged in an array on the substrate, wherein each pixel unit includes a plurality of sub-pixels emitting light of different colors, and each sub-pixel includes a light-emitting element and a pixel driving circuit driving the corresponding light-emitting element to emit light; A pixel defining layer is formed on a side of the pixel driving circuit away from the base substrate; wherein the pixel defining layer includes a plurality of pixel openings, each of the pixel openings corresponds to one of the sub-pixels, and each of the pixel units corresponds to a first color opening region, a second color opening region, and a third color opening region that are sequentially adjacent; forming a first electrode in each of the pixel openings; Forming a first color light-emitting layer, a first functional layer, a second electrode first sublayer and a first shielding layer at a position corresponding to the first color opening area; Forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area; A third color luminescent film, a third functional film, a second electrode third sublayer film and a third shielding film are formed on the first shielding layer, the second shielding layer, the pixel defining layer and the first electrode corresponding to the third color opening area on the side away from the base substrate.

70. The preparation method according to claim 69, wherein The third color light-emitting film, the third functional film, the second electrode third sublayer film and the third blocking film portions corresponding to the third color opening area serve as the third color light-emitting layer, the third functional layer, the second electrode third sublayer and the third blocking layer respectively, and the remaining portions serve as the third color retaining film layer.

71. The preparation method according to claim 70, wherein The third functional layer includes a hole injection layer and a hole transport layer formed in sequence on a side of the third color light-emitting layer close to the first electrode, and an electron transport layer and an electron injection layer formed in sequence on a side of the third color light-emitting layer away from the first electrode; the third color retaining film layer includes a third hole injection retaining layer, a third hole transport retaining layer, a third color light-emitting retaining layer, a third electron transport retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer, which are respectively formed in sequence on a side of the first shielding layer and the second shielding layer away from the base substrate.

72. The preparation method according to claim 71, wherein In the process of forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area, it also includes: forming a second color retaining film layer on the first shielding layer, and the second color retaining film layer is on the side of the third color retaining film layer close to the base substrate.

73. The preparation method according to claim 72, wherein: The second color retention film layer includes a second hole injection retention layer, a second hole transport retention layer, a second color luminescence retention layer, a second electron transport retention layer, a second electron injection retention layer, a second electrode retention second sublayer and a second shielding retention layer, which are sequentially formed on the side of the first shielding layer away from the base substrate.

74. The preparation method according to claim 70, wherein The third color light-emitting layer includes a third color light-emitting first sublayer and a third color light-emitting second sublayer which are stacked, and the third color light-emitting first sublayer is closer to the first electrode than the third color light-emitting second sublayer; The third functional layer includes a third functional first sublayer and a third functional second sublayer which are stacked, and the third functional first sublayer is closer to the first electrode than the third functional second sublayer; The third functional first sublayer includes a hole injection layer, a first hole transport layer and a first electron blocking layer sequentially formed on a side of the third color light-emitting first sublayer close to the first electrode, and a first hole blocking layer, a first electron transport layer and a first charge generating layer sequentially formed on a side of the third color light-emitting first sublayer away from the first electrode; The third functional second sublayer includes a second charge generation layer, a second hole transport layer, and a second electron blocking layer formed sequentially on a side of the third color light-emitting second sublayer close to the first electrode, and a second hole blocking layer, a second electron transport layer, and an electron injection layer formed sequentially on a side of the third color light-emitting second sublayer away from the first electrode; The third color retaining film layer includes a third hole injection retaining layer, a third hole transport first retaining layer, a third electron blocking first retaining layer, a third color light emitting first retaining layer, a third hole blocking first retaining layer, a third electron transport first retaining layer, a third charge generating first retaining layer, a third charge generating second retaining layer, a third hole transport second retaining layer, a third electron blocking second retaining layer, a third color light emitting second retaining layer, a third hole blocking second retaining layer, a third electron transport second retaining layer, a third electron injection retaining layer, a second electrode retaining third sublayer and a third shielding retaining layer, which are respectively formed in sequence on the side of the first shielding layer and the second shielding layer away from the substrate.

75. The preparation method according to claim 74, wherein In the process of forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area, it also includes: forming a second color retaining film layer on the first shielding layer, and the second color retaining film layer is on the side of the third color retaining film layer close to the base substrate.

76. The preparation method according to claim 75, wherein The second color light-emitting layer includes a second color light-emitting first sublayer and a second color light-emitting second sublayer which are stacked, and the second color light-emitting first sublayer is closer to the first electrode than the second color light-emitting second sublayer; The second functional layer includes a second functional first sublayer and a second functional second sublayer which are stacked, and the second functional first sublayer is closer to the first electrode than the second functional second sublayer; The second functional first sublayer includes a hole injection layer, a first hole transport layer and a first electron blocking layer sequentially formed on a side of the second color light-emitting first sublayer close to the first electrode, and a first hole blocking layer, a first electron transport layer and a first charge generating layer sequentially formed on a side of the second color light-emitting first sublayer away from the first electrode; The second functional second sublayer includes a second charge generation layer, a second hole transport layer, and a second electron blocking layer sequentially formed on a side of the second color light-emitting second sublayer close to the first electrode, and a second hole blocking layer, a second electron transport layer, and an electron injection layer sequentially formed on a side of the second color light-emitting second sublayer away from the first electrode; The second color retention film layer includes a second hole injection retention layer, a second hole transport first retention layer, a second electron blocking first retention layer, a second color light-emitting first retention layer, a second hole blocking first retention layer, a second electron transport first retention layer, a second charge generating first retention layer, a second charge generating second retention layer, a second hole transport second retention layer, a second electron blocking second retention layer, a second color light-emitting second retention layer, a second hole blocking second retention layer, a second electron transport second retention layer, a second electron injection retention layer, a second electrode retaining second sublayer and a second shielding retention layer, which are respectively formed in sequence on the side of the first shielding layer and the second shielding layer away from the base substrate.

77. The preparation method according to claim 69 or 70, wherein: Forming a first color light-emitting layer, a first functional layer, a second electrode first sublayer and a first shielding layer at a position corresponding to the first color opening area includes: forming a first color light-emitting film, a first functional film, a second electrode first sublayer film and a first shielding film on a side of the pixel defining layer and the first electrode away from the base substrate; forming a first photoresist layer on the first shielding film and at a position corresponding to the first color opening area; Using the first photoresist layer as a mask, patterning the first shielding film to form a first shielding layer; The first color light-emitting film, the first functional film and the second electrode first sublayer film are patterned using the first shielding layer as a mask to form the first color light-emitting layer, the first functional layer and the second electrode first sublayer.

78. The preparation method according to claim 77, wherein Forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area includes: Forming a second color luminescent film, a second functional film, a second electrode second sub-layer film and a second shielding film on the first shielding layer, the pixel defining layer and on the side of the first electrode corresponding to the second color opening area and the third color opening area away from the base substrate; forming a second photoresist layer on the second shielding film and at positions corresponding to the first color opening area and the second color opening area; Using the second photoresist layer as a mask, patterning the second shielding film to form a second shielding layer; The second color luminescent film, the second functional film and the second electrode second sublayer are patterned using the second shielding layer as a mask to form the second color luminescent layer, the second functional layer and the second electrode second sublayer, and a second color retaining film layer is formed on the first shielding layer.

79. The preparation method according to claim 77, wherein Forming a second color light-emitting layer, a second functional layer, a second electrode second sublayer and a second shielding layer at a position corresponding to the second color opening area includes: Forming a second color luminescent film, a second functional film, a second electrode second sub-layer film and a second shielding film on the first shielding layer, the pixel defining layer and on the side of the first electrode corresponding to the second color opening area and the third color opening area away from the base substrate; forming a second photoresist layer on the second shielding film and at a position corresponding to the second color opening area; Using the second photoresist layer as a mask, patterning the second shielding film to form a second shielding layer, and removing the second color retaining film layer on the first shielding layer; The second color light-emitting film, the second functional film and the second electrode second sublayer film are patterned using the second shielding layer as a mask to form the second color light-emitting layer, the second functional layer and the second electrode second sublayer.

80. The preparation method according to claim 79, further comprising forming a packaging structure on a side of the third blocking film away from the base substrate.

81. The preparation method according to any one of claims 69 to 80, wherein The pixel defining layer includes a plurality of spacers that separate adjacent pixel openings. Before forming the pixel defining layer, an auxiliary electrode is formed, and the auxiliary electrode is disposed in each of the spacers. The auxiliary electrode and the second electrode are electrically connected through a first via structure.

82. The preparation method according to any one of claims 69 to 80, wherein The pixel defining layer includes a plurality of spacers that separate adjacent pixel openings, and the plurality of spacers include a first spacer, a second spacer, and a third spacer that are adjacent to each other in sequence. In the process of forming the first electrode between the first spacer and the second spacer, a connecting electrode is also formed between the second spacer and the third spacer.

83. The preparation method according to claim 82, wherein After forming the pixel driving circuit and before forming the pixel defining layer, it also includes forming an auxiliary electrode, a planarization layer and a second via structure penetrating the planarization layer, the auxiliary electrode is arranged in the planarization layer, and the connecting electrode and the auxiliary electrode are electrically connected through the second via structure.

84. The preparation method according to claim 75, wherein The display substrate comprises a display area and a peripheral area surrounding the display area; In the peripheral area, a first common voltage connection line, a second common voltage connection line and a third common voltage connection line are sequentially formed from a position close to the display area to a position far from the display area; The first common voltage connection line, the second common voltage connection line and the third common voltage connection line are electrically connected to a first light emitting element, a second light emitting element and a third light emitting element including the first color light emitting layer, the second color light emitting layer and the third color light emitting film, respectively.

85. The preparation method according to claim 84, wherein The first light emitting element, the second light emitting element and the third light emitting element are electrically connected to a power supply voltage line through the first common voltage connection line, the second common voltage connection line and the third common voltage connection line, respectively.

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