Methods, systems, and apparatus for forming layers having single crystal structures

Abstract

Embodiments of the present disclosure generally relate to methods, systems, and apparatus for forming layers having a single crystal structure. In one implementation, a method of processing a substrate includes positioning the substrate in a processing space of a chamber, and heating the substrate to a substrate temperature of 800 degrees Celsius or less. The method includes maintaining the processing space at a pressure in the range of 1.0 Torr to 8.0 Torr, and flowing one or more silicon-containing gases and one or more dilution gases into the processing space. The method includes reacting one or more silicon-containing gases to form one or more reactants, and depositing the one or more reactants onto an exposed surface of a substrate to form one or more silicon-containing layers on the exposed surface. The one or more silicon-containing layers each have a single crystal structure.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to methods, systems, and apparatus for forming a layer having a single crystal structure.In one or more embodiments, the layer includes one or more silicon (Si) layers and one or more silicon germanium (SiGe) layers. Background Art

[0002] The performance capability may require certain semiconductor properties, such as in the case of 3D DRAM applications. However, attempting to meet this property may involve several obstacles. For example, the processing chamber may be expensive, complex, and time consuming. As an example, the chamber may use a large amount of power during processing (such as due to relatively high temperatures) and may involve complex and expensive components. As another example, the processing chamber may involve low throughput. In addition, for single-sided and double-sided deposition applications, the modularity of operation may be limited.

[0003]

[0006] Therefore, there is a need for improved methods, systems, and apparatus that promote beneficial substrate properties while promoting one or more of reduced cost, reduced complexity, reduced operating time, increased modularity, and increased throughput. Summary of the invention

[0004] Embodiments of the present disclosure generally relate to methods, systems, and apparatus for forming layers having a single crystal structure. In one or more embodiments, the layers include one or more silicon (Si) layers and one or more silicon germanium (SiGe) layers.

[0005] In one or more embodiments, a method for processing a substrate includes positioning the substrate in a processing space of a chamber, and heating the substrate to a substrate temperature of 800 degrees Celsius or less. The method includes maintaining the processing space at a pressure in the range of 1.0 Torr to 8.0 Torr, and flowing one or more silicon-containing gases and one or more dilution gases into the processing space. The method includes reacting the one or more silicon-containing gases to form one or more reactants, and depositing the one or more reactants onto an exposed surface of the substrate to form one or more silicon-containing layers on the exposed surface. The one or more silicon-containing layers each have a single crystal structure.

[0006] In one or more embodiments, a non-transitory computer readable medium includes instructions that, when executed, cause multiple operations to be performed. Multiple operations include positioning a substrate in a processing space of a chamber, and heating the substrate to a substrate temperature of 800 degrees Celsius or less. Multiple operations include maintaining the processing space at a pressure in the range of 1.0 Torr to 8.0 Torr, and flowing one or more silicon-containing gases and one or more dilution gases into the processing space. Multiple operations include reacting one or more silicon-containing gases to form one or more reactants, and depositing one or more reactants onto an exposed surface of the substrate to form one or more silicon-containing layers on the exposed surface. One or more silicon-containing layers each have a single crystal structure.

[0007] In one or more embodiments, a system for processing a substrate includes a chamber. The chamber includes one or more side walls that at least partially define a processing space, a substrate support positioned in the processing space, one or more heating assemblies embedded in the substrate support, and a cover that defines a ceiling of the processing space. The cover includes one or more gas channels. The chamber includes a radio-frequency (RF) power supply electrically coupled to the chamber, and a controller including instructions that, when executed by a processor, cause multiple operations to be performed. Multiple operations include positioning a substrate in a processing space of the chamber, and heating the substrate to a substrate temperature in the range of 545 degrees Celsius to 555 degrees Celsius. Multiple operations include forming a plasma in the processing space, and using the plasma to activate an exposed surface of the substrate. Multiple operations include extinguishing the plasma, evacuating the processing space, maintaining the substrate at the substrate temperature, and maintaining the processing space at a pressure in the range of 5.8 torr to 6.2 torr. Multiple operations include causing one or more silicon-containing gases and one or more dilution gases to flow into the processing space through the ceiling of the processing space. The plurality of operations include reacting one or more silicon-containing gases to form one or more reactants, and depositing the one or more reactants onto an exposed surface of the substrate to form one or more silicon-containing layers on the exposed surface. The one or more silicon-containing layers each have a single crystal structure, a steepness of less than 1.0, and a surface roughness of less than 0.2 nm. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order that the manner in which the above-mentioned features of the present disclosure can be understood in detail, a more specific description of the present disclosure briefly summarized above may be obtained by reference to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings illustrate only exemplary embodiments and therefore should not be considered as limiting the scope, as the present disclosure may admit to other equally effective embodiments.

[0009] Figure 1 is a schematic top view of a system for processing a substrate according to one or more embodiments.

[0010] Figure 2 is a schematic cross-sectional view of a processing chamber according to one or more embodiments.

[0011] Figure 3 is a schematic cross-sectional view of a processing chamber according to one or more embodiments.

[0012] Figure 4 is a schematic block diagram of a method of processing a substrate according to one or more embodiments.

[0013] Figure 5 is a schematic cross-sectional view of a substrate and a plurality of layers formed on the substrate according to one or more embodiments.

[0014] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical components that are common to the figures. It is contemplated that components and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0015] Embodiments of the present disclosure generally relate to methods, systems, and apparatus for forming a layer having a single crystal structure.In one or more embodiments, the layer includes one or more silicon (Si) layers and one or more silicon germanium (SiGe) layers.

[0016] Figure 11 is a schematic top view of a system 100 for processing a substrate according to one or more embodiments. The system 100 includes a cluster tool 180. The cluster tool 180 includes a factory interface 102, one or more transfer chambers 108 (one shown) having a transfer robot 110 disposed therein. The cluster tool 180 includes one or more first chambers 124 (sixteen shown) and one or more second chambers 126 (four shown) mounted to a main frame 151 of a single cluster tool 180. One or more first chambers 124 are deposition chambers, such as chemical vapor deposition (CVD) chambers. One or more second chambers 126 are cleaning chambers. One or more of the second chambers 126 are pre-clean chambers (where cleaning occurs before deposition in the first chamber 124), and one or more of the second chambers 126 are post-clean chambers (where cleaning occurs after deposition in the first chamber 124). The chambers 124, 126 can all be operated simultaneously to process substrates. The present disclosure contemplates that the first chamber 124 and the second chamber 126 may be on different mainframes such that there is a vacuum break during transfer between the first chamber 124 and the second chamber 126. The present disclosure contemplates that the vacuum break may also occur within a single cluster tool 180 during transfer of substrates between chambers. In one or more embodiments, the vacuum break lasts for a duration in the range of 4.0 minutes to 5.0 minutes or less than 4.0 minutes.

[0017] In one or more embodiments, substrates in the system 100 can be processed in and transferred between various chambers without being exposed to the ambient environment outside of the cluster tool 180. In one or more embodiments, the system 100 provides an integrated cluster tool 180 to perform processing operations on substrates.

[0018] exist Figure 1 In the implementation shown in , the factory interface 102 includes a docking station 140 and a factory interface robot 142 to facilitate the transfer of substrates. The docking station 140 is configured to receive one or more front opening unified pods (FOUPs) 149. In one or more embodiments, each factory interface robot 142 includes a blade 148 disposed on one end of the respective factory interface robot 142, and the blade 148 is configured to transfer the substrate from the factory interface 102 to the load lock chambers 104, 106.

[0019] The load lock chambers 104, 106 have respective doors 150, 152 that interface with the factory interface 102 and respective doors 154, 156 that interface with the transfer chamber 108. The first chamber 124 and the second chamber 126 have respective doors that interface with the transfer chamber 108.

[0020] The door may include, for example, a slit opening with a slit valve for transferring a substrate therethrough by the transfer robot 110 and for providing a seal between the respective chambers to prevent gas from being transferred between the respective chambers. The door may be opened to transfer a substrate therethrough and otherwise closed.

[0021] The load lock chambers 104, 106, the transfer chamber 108, the first chamber 124, and the second chamber 126 may be fluidly coupled to a gas and pressure control system. The gas and pressure control system may include one or more gas pumps (e.g., a turbo pump, a cryopump, a roughing pump, a vacuum pump, etc.), gas sources, various valves, and conduits fluidly coupled to the various chambers.

[0022] The system 100 includes a controller 190 configured to control the system 100 or its components. For example, the controller 190 can control the operation of the system 100 using direct control of the chambers 104, 106, 108, 124, 126 of the system 100 or by controlling other computers or controllers (such as sub-controllers) associated with the chambers 104, 106, 108, 124, 126. In one or more embodiments, the controller 190 is communicatively coupled to a dedicated controller, and the controller 190 acts as a central controller. The controller 190 is configured to control the gas and pressure control systems. In operation, the controller 190 enables data collection and feedback from the respective chambers and the gas and pressure control systems to coordinate and control the performance of the system 100.

[0023] The controller 190 generally includes a central processing unit (CPU) 192, a memory 194, and support circuits 196. The CPU 192 may be any form of general purpose processor and one of the sub-processors thereon or therein that may be used in an industrial environment to control various substrate processing chambers and equipment. The memory 194 or non-transitory computer readable medium is accessible by the CPU 192 and may be one or more of readily available memories such as random access memory (RAM), dynamic random access memory (DRAM), static RAM (SRAM) and synchronous dynamic RAM (SDRAM (e.g., DDR1, DDR2, DDR3, DDR3L, LPDDR3, DDR4, LPDDR4, etc.), read only memory (ROM), a floppy disk, a hard disk, a thumb drive, or any other form of digital storage (local or remote). Support circuits 196 are coupled to CPU 192 to support CPU 192 and may include cache, clock circuits, input / output circuitry and / or subsystems, power supplies, and the like.

[0024] The various methods (such as method 400) and operations disclosed herein can generally be implemented under the control of CPU 192 by CPU 192 executing computer instruction codes stored in memory 194 (or in the memory of a particular processing chamber) as, for example, a software program. When the computer instruction codes (e.g., instructions) are executed by CPU 192, CPU 192 controls the chamber to perform processes according to the various methods and operations described herein. In one or more embodiments, memory 194 includes instructions stored therein that, when executed, result in the execution of methods (such as method 400) and operations (such as operations 401, 402, 404, 405, 406, 408, 410, 412, 414, 416) described herein using various devices and components (such as chambers 124, 126) described herein. In one or more embodiments, the controller 190 is configured to use one or more machine learning algorithms and / or artificial intelligence algorithms to optimize one or more processing parameters, such as substrate temperature and / or pressure used in chamber 124 and / or chamber 126. The one or more machine learning algorithms and / or artificial intelligence algorithms may consider data collected from the system 100 (such as from chamber 124 and / or chamber 126) during processing of a substrate to optimize the one or more processing parameters.

[0025] Various operations described herein (such as operations 401, 402, 404, 405, 406, 408, 410, 412, 414, 416 of method 400) may be performed automatically using controller 390 or may be performed automatically or manually through certain operations performed by a user.

[0026] Other processing systems in other configurations are contemplated. For example, more or fewer processing chambers (e.g., six first chambers 124) may be coupled to the transfer apparatus. Figure 1 In the embodiment shown in FIG. 1 , the transfer apparatus includes a transfer chamber 108. In other embodiments, more or fewer transfer chambers (eg, two transfer chambers) may be implemented as a transfer apparatus in a system for processing substrates.

[0027] Figure 2 FIG. 2 is a schematic cross-sectional view of a processing chamber 200 according to one or more embodiments. The processing chamber 200 is a cleaning chamber, such as a pre-cleaning chamber. The processing chamber 200 can be used as Figure 1 . The processing chamber 200 may be configured to perform a thermal or plasma-based oxidation process and / or a plasma-assisted dry etching process. The processing chamber 200 includes a chamber body 212, a lid assembly 214, and a support assembly 216. The lid assembly 214 is disposed at an upper end of the chamber body 212, and the support assembly 216 is at least partially disposed within the chamber body 212. A vacuum system may be used to remove gas from the processing chamber 200. The vacuum system includes a vacuum pump 218, which is coupled to a vacuum port 221 disposed in the chamber body 212. The vacuum system may be Figure 1 Part of a gas and pressure control system.

[0028] The lid assembly 214 includes at least two stacked components 222, 241, 242 (three are shown), and the stacked components 222, 241, 242 are configured to form a plasma space or cavity therebetween. The first electrode 220 is disposed vertically above the second electrode 222, and the second electrode 222 confines the plasma space. The first electrode 220 is connected to a power source 224 (such as a radio frequency (RF) power supply), and the second electrode 222 is connected to a ground or source return, thereby forming a capacitor between the first electrode 220 and the second electrode 222. The lid assembly 214 includes one or more gas inlets 226 for providing a cleaning gas to the substrate surface through a baffle plate 228 and a gas distribution plate 230. The cleaning gas can be an etchant or an ionized active radical (such as ionized fluorine, chlorine, or ammonia); and / or an oxidant (such as ozone). The processing chamber 200 includes a controller 202 for controlling the process within the processing chamber 200. The controller 202 can be Figure 1A portion of the controller 190 shown in (eg, integrated with the controller 190 ) or in communication with the controller 190 .

[0029] The support assembly 216 may include a substrate support 232 to support the substrate 210 on the substrate support 232 during processing. The substrate support 232 may be coupled to an actuator 234 via a shaft 236 that extends through a centrally located opening formed in a bottom surface of the chamber body 212. The actuator 234 may be flexibly sealed to the chamber body 212 via a bellows (not shown) that prevents vacuum from leaking around the shaft 236. The actuator 234 allows the substrate support 232 to move vertically within the chamber body 212 between a processing position and a lower transfer position. The transfer position is slightly lower than an opening 243 of a slit valve formed in a sidewall of the chamber body 212. A pumping ring 244 (which may include one or more pumping liners) is disposed in the first processing volume 211 of the processing chamber 200 to facilitate exhausting gases from the first processing volume 211.

[0030] The substrate support 232 has a flat or substantially flat surface for supporting a substrate 210 to be processed on the substrate support 232. The substrate support 232 can be moved vertically within the chamber body 212 by an actuator 234, which is coupled to the substrate support 232 by a shaft 236. In operation, the substrate support 232 can be raised to a position close to the lid assembly 214 to control the temperature of the substrate 210 being processed. Thus, the substrate 210 can be heated via radiation emitted from the gas distribution plate 230 or convection from the gas distribution plate 230.

[0031] The processing chamber 200 is configured to perform a cleaning operation on the substrate 210 to remove, for example, native oxide from the substrate 210. The native oxide may include SiO2. The cleaning operation is performed while maintaining the first processing space 211 of the processing chamber 200 at a cleaning pressure and a cleaning temperature. The cleaning temperature is 1,000 degrees Celsius or less, such as 800 degrees Celsius or less. In one or more embodiments, the cleaning temperature is in the range of 15 degrees Celsius to 130 degrees Celsius, such as 20 degrees Celsius to 100 degrees Celsius. In one or more embodiments, the cleaning temperature is in the range of 0 degrees Celsius to 50 degrees Celsius, such as 20 degrees Celsius to 40 degrees Celsius. The cleaning pressure is less than 700 Torr, such as 600 Torr or less. In one or more embodiments, the cleaning pressure is in the range of 5 Torr to 600 Torr. In one or more embodiments, the cleaning pressure is in the range of 30 Torr to 80 Torr. In one or more embodiments, the cleaning pressure is 5 Torr, 300 Torr, or 600 Torr.

[0032] During the cleaning operation, the substrate 210 may be exposed to the generated plasma. The plasma includes one or more of NH3 and / or NF3. The plasma may also include one or more inert gases, such as, one or more of helium (He), nitrogen (N2) and / or argon (Ar). The plasma may be a capacitively coupled plasma or an inductively coupled plasma. The plasma may be supplied from a remote plasma source, and the plasma may be introduced into the processing chamber through a gas distribution plate (such as, a showerhead). NH3 is directly injected into the chamber via a separate gas inlet. The cleaning operation may include exposing the substrate 210 to a hot combination of anhydrous HF and NH3, exposing the substrate 210 to aqueous HF, a dry etching operation (such as, a remote plasma assisted dry etching operation), and / or a silicon etching operation (e.g., ICP H2 / Cl2 silicon etching). The dry etching operation may include exposing the substrate 210 to NF3 and NH3 plasma byproducts.

[0033] The cleaning operation may include a wet cleaning operation. The substrate 210 may be cleaned using a wet cleaning operation in which the substrate 210 is exposed to a cleaning solution such as an HF-last type cleaning solution, an ozonated water cleaning solution, a hydrofluoric acid (HF) and hydrogen peroxide (H2O2) solution, and / or other suitable cleaning solutions. The cleaning solution may be heated.

[0034] Figure 3 is a schematic cross-sectional view of a processing chamber 300 according to one or more embodiments. The processing chamber 300 is a chemical vapor deposition (CVD) chamber in which a substrate is heated. Exemplary processing chambers that may benefit from the embodiments described herein include CVD-enabled chambers available from Applied Materials, Inc. of Santa Clara, California. Series and / or CVD enabled chambers It is contemplated that other process chambers from other manufacturers may also benefit from the embodiments described herein.

[0035] The processing chamber 300 includes a chamber body 302, a susceptor 304 disposed within the chamber body 302, and a lid assembly 306 coupled to the chamber body 302 and enclosing the susceptor 304 in a processing space 320. The lid assembly 306 includes a gas distributor 312. A substrate 307 is provided to the processing space 320 through an opening 326 (such as a slit valve) formed in the chamber body 302.

[0036] An isolation member 310 (which may be a dielectric material such as a ceramic or metal oxide, such as aluminum oxide and / or aluminum nitride) separates a gas distributor 312 from the chamber body 302. The gas distributor 312 includes an opening 318 for allowing a process gas to enter the process space 320. The process gas may be supplied to the process chamber 300 via a conduit 314, and the process gas may enter a gas mixing region 316 before flowing through the opening 318. An exhaust device 352 is formed in the chamber body 302 at a position below the susceptor 304. The exhaust device 352 may be connected to a vacuum pump to remove unreacted substances and byproducts from the process chamber 300. The conduit 314 is in fluid communication with one or more gas sources 319 that supply the process gas. The process gas may include one or more of a reactive gas (such as for a deposition operation), an inert gas (such as for a deposition operation), a cleaning gas (such as for a chamber cleaning operation), and / or a aging gas (such as for an aging operation). The process gas (in Figure 3 The gas (shown as P1 in FIG. 1 ) flows into the processing space 320 through the ceiling 321 of the processing space 320. The ceiling 321 may be at least partially defined by a lower surface of the gas distributor 312.

[0037] The gas distributor 312 may be coupled to a power source 341, such as an RF generator or a DC power supply. The DC power supply may supply continuous and / or pulsed DC power to the gas distributor 312. The RF generator may supply continuous and / or pulsed RF power to the gas distributor 312. The power source 341 is turned on during operation to supply power to the gas distributor 312 to facilitate formation of a plasma in the processing space 320.

[0038] The base 304 may be formed of a ceramic material, for example, a metal oxide or nitride or an oxide / nitride mixture, such as aluminum, aluminum oxide, aluminum nitride, or an oxide / nitride mixture of aluminum. The base 304 is supported by a shaft 343. The base 304 may be grounded. One or more heating components 328 are embedded in the base 304. In one or more embodiments, one or more heating components 328 (one is shown) are one or more resistive heaters. The heating component 328 may be a plate, a through-hole plate, a mesh (such as a wire mesh), a wire mesh screen, or any other distributed arrangement. The heating component 328 is coupled to a power source 332 via a connector 330. The power source 332 may be a power supply that controls the heating component 328. The power source 332 supplies power (such as an alternating current) to the heating component 328 to generate heat. One or more cooling channels 380 may be formed in the base 304 to cool the substrate 307. One or more cooling channels 380 receive a cooling fluid to cool the substrate 307 .

[0039] The pedestal 304 includes an electrode 306 and a power source 338 electrically coupled to the electrode 336. The electrode 336 may be a plate, a perforated plate, a mesh (such as a wire mesh), a wire mesh screen, or any other distributed arrangement. The power source 338 is configured to supply an adsorption voltage and / or RF power to the electrode 136 through the electrode 136. Using the electrode 336, the pedestal 304 acts as an electrostatic chuck to which the substrate 307 is adsorbed. Using the electrode 336, the power source 338 may be used to control the properties of the plasma formed in the processing space 320, or to promote the generation of plasma within the processing space 320. For example, the power source 341 and the power source 338 may be tuned to two different frequencies to facilitate the ionization of a variety of species in the processing space 320. The power source 341 and the power source 332 may be used to generate a capacitively coupled plasma within the processing space 320. The present disclosure also contemplates that an inductively coupled plasma may be used.

[0040] The pedestal 304 includes a substrate supporting surface 342 for supporting the substrate 307. The pedestal 304 may include a step 340 having a recess 344. The step 340 may be an edge ring. The substrate 307 and the step 340 may be concentrically disposed on the substrate supporting surface 342 of the pedestal 304. The step 340 may be integrally formed with the pedestal 304.

[0041] The pedestal 304 may be at least a portion of a substrate support coupled to the shaft 343. The pedestal 304 may include a single support body, or may include multiple bodies, such as a top plate (support body) having a substrate supporting surface 342 mounted to a bottom plate, wherein the bottom plate is mounted to the shaft 343.

[0042] The processing chamber can be used as Figure 1 One or more (such as, all) of the first chambers 124 shown in .

[0043] Figure 4 is a schematic block diagram illustration of a method 400 of processing a substrate according to one or more embodiments.

[0044] Optional operation 401 includes cleaning the substrate in a cleaning chamber. Cleaning includes an etching operation. The etching operation includes one or more of dry etching (such as dry etching using NF3) and / or wet etching (such as wet etching using dilute hydrofluoric acid (DHF)). The etching operation may include exposing the substrate to a plasma (such as from a remote plasma source).

[0045] Operation 402 includes positioning a substrate in a processing volume of a chamber. In one or more embodiments, the substrate is positioned in the processing volume of the chamber after the substrate is transferred out of the cleaning chamber. The substrate is a Si substrate.

[0046] The present disclosure contemplates that one or more of the cleaning chambers and / or chambers may be conditioned prior to operations 401 and / or 402 .

[0047] Operation 404 includes heating the substrate to a substrate temperature of 800 degrees Celsius or less, such as 760 degrees Celsius or less. In one or more embodiments, the substrate temperature is less than 700 degrees Celsius, such as in the range of 450 degrees Celsius to 650 degrees Celsius. In one or more embodiments, the substrate temperature is 600 degrees Celsius or less. In one or more embodiments, the substrate temperature is about 550 degrees Celsius (such as 550 degrees Celsius, or in the range of 545 degrees Celsius to 555 degrees Celsius). In one or more embodiments, heating occurs as part of a deposition operation. In one or more embodiments, heating occurs as part of a baking operation performed prior to the deposition operation. In one or more embodiments, a baking operation is performed prior to the plasma treatment operation of optional operation 405. The baking operation lasts for a baking duration of about 30 seconds.

[0048] Optional operation 405 includes performing a plasma treatment operation on the substrate. The plasma treatment operation includes forming a plasma in the processing space, and using the plasma to activate the exposed surface of the substrate. The plasma treatment operation includes extinguishing the plasma and evacuating the processing space. In one or more embodiments, the plasma is a hydrogen (H2) plasma. In one or more embodiments, the plasma is a capacitively coupled plasma and is generated in situ in the chamber using a high frequency radio frequency (HFRF) power supply. In one or more embodiments, the plasma is generated by flowing H2 at a flow rate in the range of 0.1SCCM to 1,000SCCM and applying an RF power with a power in the range of 0.1W to 1,000W. The plasma treatment operation is performed with a plasma pressure. In one or more embodiments, the plasma pressure is in the range of 2.5 Torr to 5.0 Torr. In one or more embodiments, the plasma pressure is the same as the pressure used in the following operation 408. The plasma treatment operation lasts for a treatment duration of about 60 seconds.

[0049] Operation 406 includes maintaining the substrate at the substrate temperature.

[0050] Operation 408 includes maintaining the processing space at a pressure of 300 Torr or less, such as in the range of 0.2 Torr to 300 Torr. In one or more embodiments, the pressure is in the range of 1.0 Torr to 8.0 Torr. In one or more embodiments, the pressure is about 1.0 Torr (such as 1.0 Torr or in the range of 0.9 Torr to 1.1 Torr). In one or more embodiments, the pressure is about 6.0 Torr (such as 6.0 Torr or in the range of 5.8 Torr to 6.2 Torr).

[0051] Operation 410 includes flowing one or more silicon-containing gases and one or more dilution gases through the ceiling of the processing space into the processing space. In one or more embodiments, operation 410 is performed after operations 402, 404, 405, 406, and 408 are performed. The one or more silicon-containing gases include one or more of SiH4, Si2H6, and / or SiH2Cl2. The one or more dilution gases are inert gases and include one or more of nitrogen (N2), argon (Ar), and / or helium (He). The one or more silicon-containing gases flow at a flow rate in the range of 0.1 SCCM to 1,000 SCCM.

[0052] In one or more embodiments, operation 410 includes flowing one or more germanium-containing gases through the top plate into the processing space. In one or more embodiments, the one or more germanium-containing gases include one or more of GeH4 and / or GeF4. The one or more germanium-containing gases flow at a flow rate in a range of 0.1 SCCM to 1,000 SCCM.

[0053] Operation 412 includes reacting the one or more silicon-containing gases to form one or more reactants.

[0054] Operation 414 includes depositing one or more reactants onto the exposed surface of the substrate to form one or more silicon-containing layers on the exposed surface. The one or more silicon-containing layers include one or more Si layers (the Si layers may include (one or more) dopants) and / or one or more SiGe layers (the SiGe layers may include dopants). The SiGe layer has a Ge atomic percentage in the range of 0.1% to less than 100%. The one or more silicon-containing layers each have a single crystal structure. In one or more embodiments, the one or more silicon-containing gases react with the exposed surface of the substrate (at operation 412) to form one or more reactants. In one or more embodiments in which one or more germanium-containing gases are used, the one or more silicon-containing gases react with the one or more germanium-containing gases (at operation 412) to form one or more reactants.

[0055] Optional operation 416 includes cleaning one or more components of the chamber after operation 414 and after removing the substrate from the chamber. In one or more embodiments, cleaning includes flowing a plasma having NF3 into the processing space. The plasma may be generated in a remote plasma source and supplied to the processing space.

[0056] Operations 406, 408, 410, 412, and / or 414 may be part of a CVD operation. The present disclosure contemplates that one or more operations of method 400 may be repeated, such as one or more operations of method 400 may be repeated across multiple substrates and / or to form multiple layers on the same substrate. Method 400 may be used to form one or more layers on a single side of a substrate or on both sides of a substrate.

[0057] The present disclosure contemplates that there may be a vacuum break of the substrate at some point between operation 401 (e.g., a pre-clean operation) and operations 406, 408, 410, 412, 414 (e.g., a CVD operation). In this embodiment, operations 404, 405 may be used to mitigate effects from the surrounding environment on the substrate (such as oxidation). Operations 404, 405 may be used in conjunction with other operations.

[0058] One or more exemplary embodiments may be used according to method 400. According to exemplary "Embodiment 1", the pressure is about 6.0 Torr (such as 6.0 Torr or in the range of 5.8 Torr to 6.2 Torr), and the substrate temperature is about 550 degrees Celsius (such as 550 degrees Celsius or in the range of 545 degrees Celsius to 555 degrees Celsius). In Embodiment 1, one or more silicon-containing gases include Si2H6, which flows into the processing space at a first flow rate in the range of 20 standard cubic centimeters per minute (SCCM) to 200 SCCM (such as about 200 SCCM), and one or more dilution gases include nitrogen (N2), which flows into the processing space at a second flow rate of about 600 SCCM. In Embodiment 1, one or more Si layers are formed on the substrate at a formation rate in the range of 10 nm / minute to 12 nm / minute. Embodiment 1 may include a vacuum break of less than 4.5 minutes.

[0059] According to exemplary "Implementation 2", the pressure is about 1.0 Torr (such as 1.0 Torr or in the range of 0.9 Torr to 1.1 Torr), and the one or more silicon-containing gases include Si2H6, which flows into the processing space at a flow rate in the range of 20 SCCM to 200 SCCM. In Implementation 2, one or more Si layers are formed on the substrate.

[0060] According to exemplary "Implementation 3", the pressure is about 6.0 Torr (such as 6.0 Torr or in the range of 5.8 Torr to 6.2 Torr), and the substrate temperature is about 550 degrees Celsius (such as 550 degrees Celsius or in the range of 545 degrees Celsius to 555 degrees Celsius). In Implementation 3, the one or more silicon-containing gases include Si2H6, which flows into the processing space at a first flow rate in the range of 20 SCCM to 200 SCCM, and the one or more dilution gases include nitrogen (N2), which flows into the processing space at a second flow rate of about 600 SCCM. In Implementation 3, one or more germanium-containing gases are used, and the one or more germanium-containing gases include GeH4, which is carried in hydrogen (H2) and flows into the processing space at a third flow rate in the range of 10 SCCM to 1,000 SCCM (such as 200 SCCM to 1,000 SCCM). GeH4 is about 10% of the third flow rate, and hydrogen (H2) is about 90% of the third flow rate. In embodiment 3, one or more SiGe layers are formed on a substrate. The SiGe layer has a Ge atomic percentage in the range of 5% to 60% and a Si atomic percentage in the range of 40% to 95%. Embodiment 3 may include a vacuum break of less than 4.0 minutes. In one or more embodiments of embodiment 3, the first flow rate is about 200 SCCM, the third flow rate is about 200 SCCM, and one or more SiGe layers are formed on the substrate at a formation rate of about 12 nm / minute. In one or more embodiments of embodiment 3, the first flow rate is about 20 SCCM, the third flow rate is about 1,000 SCCM, and one or more SiGe layers are formed on the substrate at a formation rate of about 41 nm / minute.

[0061] According to exemplary "Implementation 4", the pressure is about 1.0 Torr (such as 1.0 Torr or in the range of 0.9 Torr to 1.1 Torr), and one or more silicon-containing gases include Si2H6, which flows into the processing space at a first flow rate in the range of 20 SCCM to 200 SCCM. In Implementation 4, one or more germanium-containing gases are used, and one or more germanium-containing gases include GeH4, which is carried in hydrogen (H2) and flows into the processing space at a second flow rate in the range of 10 SCCM to 1,000 SCCM (such as 200 SCCM to 1,000 SCCM). GeH4 is about 10% of the second flow rate, and hydrogen (H2) is about 90% of the second flow rate. The SiGe layer has a Ge atomic percentage in the range of 5% to 60% and a Si atomic percentage in the range of 40% to 95%.

[0062] Figure 5Schematic cross-sectional view of a substrate 500 and a plurality of layers 510, 511 formed on the substrate 500 according to one or more embodiments. The layer 510 is a SiGe layer, and the layer 511 is a Si layer. The substrate 500 and each of the layers 510, 511 have a single crystal structure. The layers 510, 511 are formed on the substrate 500 using the method 400 (such as, by multiple iterations of at least a portion of the method 400). The substrate 500 having the layers 510, 511 can be used in 3D DRAM applications.

[0063] The thickness T1 of the layers 510, 511 has a non-uniformity gradient of less than 1.0% across the layers 510, 511. The substrate 500 and the layers 511, 512 each have a haze of less than 0.5%. Each of the layers 510, 511 has a steepness of less than 1.0. Each of the layers 510, 511 has a surface roughness of less than 0.2 nm.

[0064] A single crystal structure refers to a lattice structure that is completely crystallized and has the same lattice order from beginning to end of the corresponding material. In a single crystal structure, each grain of the material is aligned in the same direction. A single crystal structure does not include an amorphous part.

[0065] Benefits of the present disclosure include reduced cost, reduced power consumption, reduced operational complexity, reduced component complexity, reduced operational time, enhanced modularity (such as for use with dual-sided deposition operations and single-sided deposition operations), and enhanced throughput. Benefits of the present disclosure also include reduced substrate haze, enhanced substrate-to-substrate uniformity, reduced chamber particle contamination (such as in a deposition chamber), and less than 1.0% film non-uniformity.

[0066] It is believed that the operations and / or parameters described herein promote the aforementioned benefits compared to other operations. As an example, the pressure and substrate temperature of method 400 promote the benefits. As another example, the operations and parameters described for exemplary embodiment 1, exemplary embodiment 2, exemplary embodiment 3, and exemplary embodiment 4 promote the benefits.

[0067] It is contemplated that one or more aspects disclosed herein may be combined. As an example, one or more aspects, features, components, and / or properties of the system 100, the processing chamber 200, the processing chamber 300, the method 400, and / or the substrate 500 and the layers 511, 512 may be combined. Furthermore, it is contemplated that one or more aspects disclosed herein may include some or all of the aforementioned benefits.

[0068] Although the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be designed without departing from the basic scope of the present disclosure. The present disclosure also contemplates that one or more aspects of the embodiments described herein may be replaced by one or more of the other aspects described. The scope of the present disclosure is determined by the appended claims.

Claims

1. A method for processing a substrate, comprising: positioning a substrate in a processing volume of the chamber; heating the substrate to a substrate temperature of 800 degrees Celsius or less; maintaining the processing space at a pressure in a range of 1.0 Torr to 8.0 Torr; flowing one or more silicon-containing gases and one or more dilution gases into the processing space; reacting the one or more silicon-containing gases to form one or more reactants; as well as The one or more reactants are deposited onto the exposed surface of the substrate to form one or more silicon-containing layers on the exposed surface, the one or more silicon-containing layers each having a single crystalline structure.

2. The method of claim 1 , further comprising, prior to the flow of the one or more silicon-containing gases: forming a plasma in the processing space; and The exposed surface of the substrate is activated using the plasma.

3. The method of claim 2, wherein the substrate is heated to the substrate temperature prior to the formation of the plasma.

4. The method of claim 3, wherein the plasma is a hydrogen (H2) plasma, and the method further comprises, prior to the flow of the one or more silicon-containing gases: extinguishing the plasma; and The processing space is evacuated.

5. The method of claim 1, wherein the substrate temperature is in a range of 450 degrees Celsius to 650 degrees Celsius.

6. The method of claim 1, wherein the one or more silicon-containing gases react with the exposed surface of the substrate to form the one or more reactants, and the one or more silicon-containing gases and the one or more dilution gases flow into the processing space through a ceiling of the processing space.

7. The method of claim 1, wherein the one or more silicon-containing gases include one or more of SiH4, Si2H6, or SiH2Cl2.

8. The method of claim 7, wherein the pressure is about 6.0 Torr, the substrate temperature is about 550 degrees Celsius, the one or more silicon-containing gases include Si2H6, Si2H6 flows into the processing space at a first flow rate in the range of 20 SCCM to 200 SCCM, and the one or more dilution gases include nitrogen (N2), nitrogen flows into the processing space at a second flow rate of about 600 SCCM.

9. The method of claim 7, wherein the pressure is about 1.0 Torr and the one or more silicon-containing gases include Si2H6, which is flowed into the processing volume at a flow rate in a range of 20 SCCM to 200 SCCM.

10. The method of claim 7, further comprising: One or more germanium-containing gases are flowed through the top plate into the processing volume, wherein the one or more silicon-containing gases react with the one or more germanium-containing gases to form the one or more reactants.

11. The method of claim 10, wherein the one or more germanium-containing gases include one or more of GeH4 or GeF4.

12. The method of claim 11, wherein the pressure is about 6.0 Torr, the substrate temperature is about 550 degrees Celsius, the one or more silicon-containing gases include Si2H6, Si2H6 flows into the processing space at a first flow rate in the range of 20 SCCM to 200 SCCM, the one or more dilution gases include nitrogen (N2), nitrogen flows into the processing space at a second flow rate of about 600 SCCM, and the one or more germanium-containing gases include GeH4, GeH4 is carried in hydrogen (H2) and flows into the processing space at a third flow rate in the range of 10 SCCM to 1,000 SCCM.

13. The method of claim 12, wherein the GeH4 is approximately 10% of the third flow rate and the hydrogen (H2) is approximately 90% of the third flow rate.

14. The method of claim 11, wherein the pressure is about 1.0 Torr, the one or more silicon-containing gases include Si2H6, Si2H6 flows into the processing space at a first flow rate in the range of 20 SCCM to 200 SCCM, and the one or more germanium-containing gases include GeH4, GeH4 is carried in hydrogen (H2) and flows into the processing space at a second flow rate in the range of 10 SCCM to 1,000 SCCM, wherein the GeH4 is about 10% of the second flow rate, and the hydrogen (H2) is about 90% of the second flow rate.

15. A non-transitory computer readable medium comprising instructions that, when executed, cause a plurality of operations to be performed, the plurality of operations comprising: positioning a substrate in a processing volume of the chamber; heating the substrate to a substrate temperature of 800 degrees Celsius or less; maintaining the processing space at a pressure in a range of 1.0 Torr to 8.0 Torr; flowing one or more silicon-containing gases and one or more dilution gases into the processing space; reacting the one or more silicon-containing gases to form one or more reactants; as well as The one or more reactants are deposited onto the exposed surface of the substrate to form one or more silicon-containing layers on the exposed surface, the one or more silicon-containing layers each having a single crystalline structure.

16. The non-transitory computer-readable medium of claim 15, wherein the one or more silicon-containing gases include one or more of SiH4, Si2H6, or SiH2Cl2, the pressure is approximately 6.0 Torr, the substrate temperature is approximately 550 degrees Celsius, the one or more silicon-containing gases include Si2H6, Si2H6 flows into the processing space at a first flow rate in a range of 20 SCCM to 200 SCCM, and the one or more dilution gases include nitrogen (N2), nitrogen flows into the processing space at a second flow rate of approximately 600 SCCM.

17. The non-transitory computer readable medium of claim 15, wherein the one or more silicon-containing gases include one or more of SiH4, Si2H6, or SiH2Cl2, the pressure is about 1.0 Torr, and the one or more silicon-containing gases include Si2H6, Si2H6 flows into the processing volume at a flow rate in a range of 20 SCCM to 200 SCCM.

18. The non-transitory computer readable medium of claim 15, wherein the plurality of operations further comprises: One or more germanium-containing gases are flowed through the top plate into the processing space, wherein the one or more silicon-containing gases react with the one or more germanium-containing gases to form the one or more reactants, and wherein the one or more silicon-containing gases include one or more of SiH4, Si2H6, or SiH2Cl2, the one or more germanium-containing gases include one or more of GeH4 or GeF4, the pressure is about 6.0 Torr, the substrate temperature is about 550 degrees Celsius, the one or more silicon-containing gases include Si2H6, Si2H6 flows into the processing space at a first flow rate in the range of 20 SCCM to 200 SCCM, the one or more diluent gases include nitrogen (N2), nitrogen flows into the processing space at a second flow rate of about 600 SCCM, and the one or more germanium-containing gases include GeH4, GeH4 is carried in hydrogen (H2) and flows into the processing space at a third flow rate in the range of 10 SCCM to 1,000 SCCM.

19. The non-transitory computer readable medium of claim 15, wherein the plurality of operations further comprises: One or more germanium-containing gases are flowed through the top plate into the processing space, wherein the one or more silicon-containing gases react with the one or more germanium-containing gases to form the one or more reactants, and wherein the one or more silicon-containing gases include one or more of SiH4, Si2H6, or SiH2Cl2, the one or more germanium-containing gases include one or more of GeH4 or GeF4, the pressure is about 1.0 Torr, the one or more silicon-containing gases include Si2H6, Si2H6 flows into the processing space at a first flow rate in the range of 20 SCCM to 200 SCCM, and the one or more germanium-containing gases include GeH4, GeH4 is carried in hydrogen (H2) and flows into the processing space at a second flow rate in the range of 10 SCCM to 1,000 SCCM, wherein the GeH4 is about 10% of the second flow rate, and the hydrogen (H2) is about 90% of the second flow rate.

20. A system for processing a substrate, comprising: Chamber, including: one or more side walls, the one or more side walls at least partially defining a processing space, a substrate support disposed in the processing space, one or more heating assemblies, the one or more heating assemblies embedded in the substrate support, a cover at least partially defining a ceiling of the processing space, the cover comprising one or more gas channels, a radio frequency (RF) power source electrically coupled to the chamber; and A controller comprising instructions that, when executed by a processor, cause a plurality of operations to be performed, the plurality of operations comprising: positioning a substrate in the processing volume of the chamber, heating the substrate to a substrate temperature in a range of 545 degrees Celsius to 555 degrees Celsius, forming a plasma in the processing space, activating the exposed surface of the substrate using the plasma, extinguishing the plasma, evacuating the processing space, maintaining the substrate at the substrate temperature, maintaining the processing space at a pressure in a range of 5.8 Torr to 6.2 Torr, flowing one or more silicon-containing gases and one or more dilution gases into the processing space through the ceiling of the processing space, reacting the one or more silicon-containing gases to form one or more reactants, and The one or more reactants are deposited onto the exposed surface of the substrate to form one or more silicon-containing layers on the exposed surface, the one or more silicon-containing layers each having: Single crystal structure, A steepness less than 1.0, and Surface roughness less than 0.2nm.

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