A cleaning apparatus for wafer carriers

Abstract

The present application relates to the technical field of semiconductor carrier, and particularly relates to a cleaning equipment for wafer carrier, which comprises a rotating mechanism. The wafer carrier comprises a carrier main body and a carrier cover. The carrier main body is provided with a lifting part, a handle and a positioning groove. The rotating mechanism comprises a rotating motor, a rotating shaft, a product support, a supporting side support, a rotating side support and a reset spring. Compared with the prior art, the wafer carrier is cleaned and dried by hot air and hot water, so that the cleaning efficiency of the wafer carrier is improved. The wafer carrier is driven to rotate by the lifting mechanism and the rotating mechanism, so that the wafer carrier can be fully cleaned, the cleaning efficiency is high, the production capacity is improved, the water and gas consumption is saved, and the production cost is reduced. The wafer carrier placed in the product support is fixed by the supporting side support and the rotating side support, so that the cleaning is efficient and stable, and the feeding and discharging are convenient and simple.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor carriers, in particular to a cleaning device for wafer carriers. BACKGROUND

[0002] Wafer carriers, which belong to a kind of semiconductor carriers, are precision bearing devices specially designed for semiconductor wafers. Their design aims to meet strict clean room standards to ensure the physical safety and chemical purity of wafers during the entire manufacturing process. Wafers are the basis of semiconductor devices, and are covered with thousands or even millions of tiny integrated circuits. Any slight contamination or damage can cause a large number of chips to fail, so the importance of wafer carriers is self-evident. Therefore, the wafer carriers need to be cleaned before use.

[0003] At present, most wafer carrier cleaning is carried out in normal environment by direct flushing, which often consumes a large amount of water for cleaning and also consumes a large amount of gas, resulting in high cleaning cost. Moreover, since the inside and outside of the wafer carrier need to be cleaned, the conventional flushing method needs to consume more time and has low cleaning efficiency. SUMMARY

[0004] In view of the above, the present application provides a cleaning device for wafer carriers to solve the above technical problems.

[0005] A cleaning device for wafer carrier includes a rotating mechanism. A wafer carrier placed in the cleaning device for wafer carrier includes a carrier body and a carrier cover covering the carrier body. The carrier body is provided with a lifting part at the top, two handles at the sides and three positioning grooves at the bottom. The lifting part, the handles and the positioning grooves are respectively located on the sides adjacent to the carrier cover on the carrier body, wherein the lifting part and the positioning grooves are respectively located on two opposite sides, and the two handles are respectively located on two opposite planes. The rotating mechanism includes a rotating motor, a rotating shaft connected to the rotating motor, a product support connected to the rotating shaft, two supporting side holders provided on the product support, two rotating side holders provided on the product support and two return springs respectively connected to the rotating side holders and the product support. The supporting side holders and the rotating side holders are respectively provided on two opposite sides of the product support and are adjacent to the connecting surface where the rotating shaft is located. The sides where the supporting side holders and the rotating side holders are provided are parallel to the sides where the driving assembly is provided. The two supporting side holders each include a side holder bottom plate, at least two side holder mounting rods vertically fixed to the side holder bottom plate and a side holder fixing block spaced from the side holder bottom plate. The rotating side holder includes a rotating part connected to the product support, a pressing end provided on the rotating part and a buckling end provided on the rotating part. The rotating part is located between the pressing end and the buckling end. The pressing end is located on the side of the rotating side holder close to the supporting side holder. The buckling end is located on the side of the rotating side holder close to the rotating motor. The pressing end and the buckling end form an acute angle. The length of the pressing end is less than the length of the buckling end. The line connecting the abutting point of the side holder fixing block and the lifting part and the abutting point of the pressing end and the edge of the wafer carrier has a first acute angle with the central axis of the rotating shaft. The center of the rotating part and the line connecting the abutting point of the side holder fixing block and the lifting part have a second acute angle with the central axis of the rotating shaft. The first acute angle is greater than the second acute angle.

[0006] Further, the cleaning device for wafer carrier further includes a cleaning conveying mechanism, a cleaning mechanism provided in the cleaning conveying mechanism, an air jet mechanism provided in the cleaning conveying mechanism and an infrared heating mechanism provided in the cleaning conveying mechanism.

[0007] Further, the cleaning conveying mechanism includes a cleaning cavity enclosed by side plates, a lifting cover plate covering the cleaning cavity and a lifting mechanism connecting the cleaning cavity and the lifting cover plate. The edge of the lifting cover plate is provided with a sealing strip.

[0008] Further, the lifting mechanism comprises a pair of driving assemblies arranged on the outer wall of the cleaning cavity, and two support rods arranged on the two driving assemblies respectively, the two driving assemblies are arranged on two opposite sides of the cleaning cavity, one end of the support rod is fixed on the driving assembly, and the other end is connected to the lifting cover plate.

[0009] Further, the cleaning mechanism comprises a plurality of hot water inlets arranged on the outer wall of the cleaning cavity, a plurality of water spraying pipes arranged in the cleaning cavity, a plurality of hot water nozzles arranged on the water spraying pipes, and a hot water outlet arranged on the side wall of the cleaning cavity, the air injection pipe is arranged in parallel with the water spraying pipe.

[0010] Further, the lifting part comprises a connecting end arranged on the carrier body, and a lifting end arranged on the connecting end.

[0011] Further, the product support is provided with two fixed support rods for arranging the support side holder, a rotating support rod for arranging the rotating side holder, and a spring support rod for arranging the reset spring, the fixed support rod and the support side holder are located on the same side, the rotating support rod and the spring support rod are located on the same side and arranged in parallel with each other.

[0012] Further, the air injection mechanism comprises an air inlet arranged on the outer wall of the cleaning cavity, a plurality of air injection pipes arranged in the cleaning cavity, and a plurality of gas nozzles arranged on the water spraying pipes.

[0013] Further, the infrared heating mechanism comprises a plurality of infrared fixed tubes arranged on the outer wall of the cleaning cavity, and a plurality of infrared lamp tubes arranged on the infrared fixed tubes.

[0014] Further, one end of the reset spring is connected to the buckling end, and the other end is connected to the spring support rod.

[0015] Compared with existing technologies, the cleaning equipment for wafer carriers provided by this invention maintains the temperature inside the cleaning chamber by setting the infrared heating mechanism, thus keeping the wafer carrier at a higher cleaning temperature, making it easier to remove impurities from the surface of the wafer carrier. Furthermore, by setting the cleaning mechanism and the air jet mechanism, hot air and hot water are used to clean and dry the carrier, improving the cleaning efficiency. By setting the lifting and rotating mechanisms to drive the wafer carrier to rotate, centrifugal force is used to remove dust and wastewater from the carrier surface, while ensuring 360° comprehensive cleaning of the inner and outer sides of the wafer carrier. This results in fast cleaning speed and high efficiency, increasing production capacity, and saving water and air consumption, thus reducing production costs. By setting the supporting side support and the rotating side support, the wafer carrier placed in the product holder is fixed. The weight of the wafer carrier causes the rotating side support to rotate, which in turn supports and fixes the wafer carrier, thus preventing the wafer carrier from shifting during the cleaning process. This ensures efficient and stable cleaning, while also facilitating loading and unloading, simplifying operation, and effectively improving loading and unloading efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a cleaning device for a wafer carrier provided by the present invention.

[0017] Figure 2 for Figure 1 A schematic diagram of the structure of the wafer carrier 60 used in the cleaning equipment for the wafer carrier.

[0018] Figure 3 for Figure 2 A schematic diagram of the structure of the wafer carrier 60, which is a cleaning device for a wafer carrier, from another perspective.

[0019] Figure 4 for Figure 1 A schematic diagram of the structure of the rotating mechanism 20 in the cleaning equipment for wafer carriers.

[0020] Figure 5 for Figure 1 A partial structural diagram of a cleaning device used for wafer carriers.

[0021] Fixing tool 10, cleaning cavity 11, lifting cover plate 12, lifting mechanism 13, driving assembly 131, support rod 132, rotating mechanism 20, rotating motor 21, rotating shaft 22, product support 23, fixed support rod 231, rotating support rod 232, spring support rod 233, support side bracket 24, side bracket bottom plate 241, side bracket mounting rod 242, side bracket fixing block 243, rotating side bracket 25, rotating part 251, pressing end 252, buckling end 253, return spring 26, cleaning mechanism 30, hot water inlet 31, water spraying pipe 32, hot water nozzle 33, hot water outlet 34, air injection mechanism 40, air inlet interface 41, air injection pipe 42, gas nozzle 43, infrared heating mechanism 50, infrared fixed tube 51, infrared lamp tube 52, wafer carrier 60, carrier main body 61, carrier cover 62, lifting part 63, connecting end 631, lifting end 632, handle 64, positioning groove 65. DETAILED DESCRIPTION

[0022] The specific embodiments of the present application are described in further detail below. It should be understood that the description of the embodiments of the present application herein is not intended to limit the protection scope of the present application.

[0023] As shown in Figures 1 to 5 , it is a structural schematic view of a cleaning equipment for wafer carrier provided by the present application. The cleaning equipment for wafer carrier comprises a cleaning conveying mechanism 10, a rotating mechanism 20 arranged on the cleaning conveying mechanism 10, a cleaning mechanism 30 arranged in the cleaning conveying mechanism 10, an air injection mechanism 40 arranged in the cleaning conveying mechanism 10, and an infrared heating mechanism 50 arranged in the cleaning conveying mechanism 10. It is conceivable that the cleaning equipment for wafer carrier further comprises other functional modules such as valve components, electrical intelligent control systems, etc., which are known to those skilled in the art, and will not be described one by one here.

[0024] It should be noted that, as shown in Figures 2 to 3 , it is a structural schematic view of a wafer carrier 60 placed in the cleaning equipment for wafer carrier for cleaning. The wafer carrier 60 comprises a carrier main body 61 and a carrier cover 62 covering the carrier main body 61. The carrier main body 61 is a box-shaped structure with a single opening, and a wafer placing rack is arranged inside. The carrier cover 62 is connected to the opening of the carrier main body 61 through a buckle structure, and seals the inside of the carrier main body 61.

[0025] The carrier body 61 is provided with a pulling part 63 on the top, two handles 64 on the two sides, and three positioning grooves 65 on the bottom. The pulling part 63, the handle 64 and the positioning groove 65 are respectively located on the side of the carrier body 61 adjacent to the carrier cover 62, wherein the pulling part 63 and the positioning groove 65 are respectively located on two opposite sides, and the two handles 64 are respectively located on the other two opposite sides.

[0026] The pulling part 63 includes a connecting end 631 provided on the carrier body 61 and a lifting end 632 provided on the connecting end 631. The connecting end 631 is located between the lifting end 632 and the carrier body 61, which is a rectangular cylindrical structure, and has a plurality of openings on the side wall for the insertion of a mechanical hand or a crane. The lifting end 632 is a rectangular plate structure, and the area of the plate surface is greater than the cross-sectional area of the connecting end 631 in the radial direction. Specifically, the edge of the lifting end 632 is perpendicular to the side wall of the connecting end 631 and protrudes, so as to form a "π" shaped structure in the axial cross section of the connecting end 631, thereby facilitating the gripping of the mechanical hand or the crane.

[0027] The handle 64 is a structure convenient for workers to hold for carrying the carrier body 61. The positioning groove 65 is a groove provided on the carrier body 61 for positioning the carrier body 61. The specific arrangement and orientation are not the main content of the present application, and therefore will not be described here. The two positioning grooves 65 located near the side of the carrier cover 62 have the same distance to the carrier cover 62, and can be axially symmetrical with the central axis of the edge where the carrier cover 62 is located as the axis of symmetry.

[0028] The cleaning conveying mechanism 10 includes a cleaning cavity 11 enclosed by side plates, a lifting cover plate 12 covering the cleaning cavity 11, and a lifting mechanism 13 connecting the cleaning cavity 11 and the lifting cover plate 12.

[0029] The cleaning cavity 11 is enclosed by a plurality of side plates and a bottom plate, and the opening direction is vertically upward, so that the products can be placed into the cleaning cavity 11 for cleaning operation by the lifting action of the lifting mechanism 13.

[0030] The lifting cover plate 12 is a rectangular plate which can cover the top opening of the cleaning cavity 11, and a sealing strip is provided at the edge of the lifting cover plate 12, so that when the lifting cover plate 12 is lowered and covers the cleaning cavity 11 under the action of the lifting mechanism 13, the edge remains sealed and the internal cleaning does not occur. The cleaning liquid leaks.

[0031] The lifting mechanism 13 comprises a pair of driving assemblies 131 arranged on the outer wall of the cleaning cavity 11, and two support rods 132 arranged on the two driving assemblies 131 respectively. The driving assembly 131 comprises a sliding rail, a sliding block and a driving motor, which is a prior art widely used in the field of mechanical production and should be well known to those skilled in the art, and is not the main content of the present application, so it is only briefly described here. In addition, the two driving assemblies 131 are arranged on the two opposite sides of the cleaning cavity 11 to evenly distribute the force and ensure stable support of the lifting cover plate 12. One end of the support rod 132 is fixed to the driving assembly 131, and the other end is connected to the lifting cover plate 12 for supporting and connecting the lifting cover plate 12, and can be driven away from and cover the cleaning cavity 11 under the driving action of the driving assembly 131.

[0032] The rotating mechanism 20 comprises a rotating motor 21 arranged on the lifting cover plate 12, a rotating shaft 22 connected to the rotating motor 21, a product support 23 connected to the rotating shaft 22, two support side holders 24 arranged on the product support 23, two rotating side holders 25 arranged on the product support 23, and two return springs 26 connected to the rotating side holders 25 and the product support 23 respectively.

[0033] The main body of the rotating motor 21 is fixed to the lifting cover plate 12, the driving end penetrates through the lifting cover plate 12 and is arranged towards the cleaning cavity 11, so as to serve as the driving force for driving the rotating mechanism 20 to rotate, which can be a servo motor or other driving device, which is not specifically limited here.

[0034] One end of the rotating shaft 22 is connected to the driving end of the rotating motor 21, and the other end is connected to the top of the product support 23 for transmission, so that the product support 23 is driven to rotate under the driving action of the rotating motor 21. The rotating shaft 22 can be a hollow shaft body, so that the wires and air pipes are arranged in the rotating shaft 22 by arranging a contact ring at the connection end.

[0035] The product support 23 is a rectangular frame structure, which can be built by stainless steel or alloy material. The product support 23 is provided with two fixed support rods 231 for arranging the support side holders 24, one rotating support rod 232 for arranging the rotating side holders 25, and one spring support rod 233 for arranging the return springs 26. The fixed support rod 231 and the support side holder 24 are located on the same side. The rotating support rod 232 and the spring support rod 233 are located on the same side and are arranged in parallel with each other.

[0036] The support side holders 24 and the rotation side holders 25 are respectively arranged on two opposite sides of the product support 23 and are adjacent to the connecting surface where the rotation shaft 22 is located, so as to correspond to the lifting part 63 and the positioning groove 65 respectively. In addition, the sides where the support side holders 24 and the rotation side holders 25 are arranged are parallel to the sides where the driving assembly 131 is arranged, so as to reserve a path for the wafer carrier 60 to be placed in the product support 23.

[0037] The two support side holders 24 are arranged adjacently and symmetrically. Each of the support side holders 24 comprises a side holder bottom plate 241, at least two side holder mounting rods 242 vertically fixed on the side holder bottom plate 241, and a side holder fixing block 243 arranged spaced apart from the side holder bottom plate 241.

[0038] The side holder bottom plate 241 is a clamping plate fixed by fasteners, which is clamped with each other and fixed on the two fixed support rods 231 by fastener screws, so as to be stably arranged and serve as the base plate of the support side holder 24. The side holder mounting rods 242 are arranged spaced apart from each other and are used for supporting the side holder fixing block 243. Preferably, one end of the side holder mounting rod 242 close to the side holder bottom plate 241 is provided with a threaded structure, so as to adjust the distance between the side holder fixing block 243 and the side holder bottom plate 241, thereby adapting to the wafer carrier 60 of different sizes. The side holder fixing block 243 is fixed on the end of the side holder mounting rod 242 and is open on one side. The width of the opening is consistent with the thickness of the lifting end 632, so that two adjacent side holder fixing blocks 243 together form a slot for the lifting end 632 to be inserted into, so as to limit the wafer carrier 60 when placed in the product support 23, so that the wafer carrier 60 will not be displaced due to the rotation of the product support 23.

[0039] The rotation side holder 25 is a V-shaped structure, which comprises a rotation part 251 connected with the product support 23, a pressing end 252 arranged on the rotation part 251, and a buckling end 253 arranged on the rotation part 251.

[0040] The rotating part 251 is located between the pressing end 252 and the buckling end 253, and is connected to the rotating support rod 232 through a connecting bearing, such as a ball bearing, so that the rotating side holder 25 can rotate along the rotating support rod 232. The pressing end 252 is located on the side of the rotating side holder 25 facing the supporting side holder 24, and the buckling end 253 is located on the side of the rotating side holder 25 facing the lifting cover plate 12. The pressing end 252 and the buckling end 253 form a V-shaped structure with an acute angle therebetween. The length of the pressing end 252 is less than the length of the buckling end 253, so that when the opening of the wafer carrier 60 is directed to the product support 23, the edge of the opening of the carrier body 61 presses on the pressing end 252, and the rotating side holder 25 is driven to rotate clockwise until the buckling end 253 abuts against the positioning groove 65. Correspondingly, the free end of the pressing end 252 is provided with a pressing block extending in the same direction as the pressing end 252, so that the buckling end 253 contacts vertically when buckled in the positioning groove 65, thereby achieving better abutting effect.

[0041] One end of the reset spring 26 is connected to the buckling end 253, and the other end is connected to the spring support rod 233, which will pull the buckling end 253 perpendicular to the rotating support rod 232 under the action of no external force. It is conceivable that when the wafer carrier 60 is completed and taken out from the product support 23, the reset spring 26 will pull the rotating side holder 25 to rotate counterclockwise, and the pressing end 252 will be raised, thereby facilitating the placement of the next wafer carrier 60.

[0042] Because of the product characteristics of the wafer carrier 60, and other devices can be arranged inside, such as wafer holder, when the wafer carrier 60 is placed in the product support 23, in order to ensure the balance of the wafer carrier 60 rotation and the uniformity of cleaning, and not to leave dead angle, the center axis of the wafer carrier 60 must be in line with the rotation axis 22. But because of the structure design of the wafer carrier 60, the pull part 63 which is in contact with the support side 24 and the edge of the wafer carrier 60 which is in contact with the rotation side 25 are not in the same plane, that is, the line of the two support points and the center axis of the rotation axis 22 has an angle. At the same time, the contact point of the lower end 252 and the edge of the wafer carrier 60 is not located in the center of the rotation part 251, so when the wafer carrier 60 is placed vertically, the line between the contact point of the side support fixed block 243 and the pull part 63 and the contact point of the lower end 252 and the edge of the wafer carrier 60 and the center axis of the rotation axis 22 has a first acute angle. At the same time, the center of the rotation part 251 and the line between the contact point of the side support fixed block 243 and the pull part 63 and the center axis of the rotation axis 22 has a second acute angle, and the first acute angle is greater than the second acute angle.

[0043] Therefore, when the wafer carrier 60 is placed on the support side 24 and the rotation side 25, by making the first acute angle greater than the second acute angle, the inability of the wafer carrier 60 to be placed vertically due to the structural defects of the rotation side 25, that is, the contact point of the lower end 252 and the edge of the wafer carrier 60 is not located in the center of the rotation part 251, can be compensated. Therefore, the difference between the second acute angle and the first acute angle should be able to make the wafer carrier 60 be placed vertically, which is related to the size of the wafer carrier 60 and the structural accuracy of the support side 24 and the rotation side 25.

[0044] The reset spring 26 not only can automatically reset the rotation side 25 after the wafer carrier 60 is taken away from the rotation mechanism 20, but also can pull the buckle end 253. When the reset spring 26 reaches its limit extension position, the wafer carrier 60 is in the vertical placement position.

[0045] The cleaning mechanism 30 includes a plurality of hot water inlets 31 arranged on the outer wall of the cleaning cavity 11, a plurality of water spray pipes 32 arranged in the cleaning cavity 11, a plurality of hot water nozzles 33 arranged on the water spray pipes 32, and a hot water outlet 34 arranged on the side wall of the cleaning cavity 11.

[0046] The hot water inlet 31 is directly connected with the water spraying pipe 32 by a hot water pipe, such as a PPR hot water pipe. The hot water inlet 31 can be provided with an interface, a valve, etc. to facilitate the connection of a hot water source and a water pump. In actual products, the number of the water spraying pipe 32 and the hot water inlet 31 can be set according to the total number of the hot water nozzles 33, such as a combination of branch pipes and main pipes when the number is large. The hot water nozzle 33 is a high-pressure nozzle.

[0047] In the embodiment, one water spraying pipe 32 is arranged at each corner and in the center of the cleaning cavity 11, and a plurality of hot water nozzles 33 are arranged on each water spraying pipe 32. The hot water nozzles 33 on the water spraying pipe 32 in the center of the cleaning cavity 11 are directed in different directions to clean the wafer carrier 60 in all directions. In the embodiment, hot water at 60-70°C is used for flushing to ensure that the dust and impurities on the surface of the wafer carrier 60 can be flushed. Accordingly, the material of the connecting water pipe and the hot water nozzle 33 should meet the temperature requirement.

[0048] The hot water outlet 34 is arranged on the side wall of the cleaning cavity 11 close to the bottom plate, and is provided with a water pump and a water-gas separator. The hot water nozzle 33 and the valve are all prior art widely used in industrial production field, which should be well known to those skilled in the art, and thus will not be described in detail here.

[0049] The air spraying mechanism 40 includes an air inlet interface 41 arranged on the outer wall of the cleaning cavity 11, a plurality of air spraying pipes 42 arranged in the cleaning cavity 11, and a plurality of gas nozzles 43 arranged on the water spraying pipe 32.

[0050] The air inlet interface 41 is connected with the air spraying pipe 42 by an air pipe. The air spraying pipe 42 can be arranged in parallel with the water spraying pipe 32, and the number can be consistent. In addition, at least one air spraying pipe 42 is arranged between the product support 23 and the lifting cover plate 12 to blow air to the top of the wafer carrier 60. The air spraying pipe 42 can be fixed on the lifting cover plate 12 and supply air through the lifting cover plate 12, which are all conceivable by those skilled in the art, and thus will not be described in detail here.

[0051] The above-mentioned components, such as the air spraying pipe 42, the control valve and the connecting air pipe, are all prior art widely used in industrial production field, which should be well known to those skilled in the art, and thus will not be described in detail here.

[0052] The infrared heating mechanism 50 comprises a plurality of infrared fixed tubes 51 arranged on the outer wall of the cleaning cavity 11, and a plurality of infrared lamp tubes 52 arranged on the infrared fixed tubes 51.

[0053] The infrared fixed tubes 51 are fixed on the bottom plate of the cleaning cavity 11, and are hollow inside for wiring. The infrared lamp tubes 52 are arranged on the infrared fixed tubes 51, and can be provided with a lampshade, a protective rod, etc. In the embodiment, the infrared fixed tubes 51 and the infrared lamp tubes 52 are arranged at the corners and the center of the cleaning cavity 11, so as to heat the inner and outer sides of the wafer carrier 60.

[0054] The above-mentioned components, such as the infrared lamp tubes 52 and the electrical controller, are all prior art widely used in the industrial production field, and should be well known to those skilled in the art, so they will not be described in detail here.

[0055] In use, after the wafer carrier 60 is fixed in the product support 23, the lifting mechanism 13 drives the lifting cover plate 12 to descend, and after the lifting cover plate 12 covers the cleaning cavity 11, the rotating motor 21 drives the product support 23 to continuously rotate in the positive rotation and reverse rotation combination, and at the same time, the air inlet valve is opened, and the hot water nozzle 33 sprays high-pressure water to the inner and outer sides of the wafer carrier 60. After the water spraying operation is completed, the cleaning mechanism 30 is closed, the infrared heating mechanism 50 is turned on and heated, and at the same time, the air blowing mechanism 40 blows air to the inner and outer sides of the wafer carrier 60, so as to achieve rapid cleaning of the wafer carrier 60. After the cleaning is completed, the infrared heating mechanism 50 and the air blowing mechanism 40 are closed, and the rotation is stopped. The lifting mechanism 13 lifts the lifting cover plate 12, and the unloading mechanism unloads.

[0056] In addition, in order to realize separate cleaning of the carrier cover 62, a tool for fixing the carrier cover 62 can be arranged on one side of the product support 23, and a cleaning compartment is arranged in the cleaning cavity 11, and at least one set of the cleaning mechanism 30, the air blowing mechanism 40 and the infrared heating mechanism 50 are arranged in the cleaning compartment, so that when the product support 23 descends into the cleaning cavity 11, the carrier cover 62 enters the cleaning compartment for cleaning.

[0057] Compared with the prior art, the cleaning device for wafer carriers provided by the application keeps the temperature in the cleaning cavity 11 by setting the infrared heating mechanism 50, so that the wafer carrier 60 is at a higher cleaning temperature, thereby facilitating the removal of impurities on the surface of the wafer carrier 60, and by setting the cleaning mechanism 30 and the air jet mechanism 40, the carrier is cleaned and dried by hot air and hot water, thereby improving the cleaning efficiency of the carrier. By setting the lifting mechanism 13 and the rotating mechanism 20 to drive the wafer carrier 60 to rotate, on the one hand, the centrifugal force can be used to shake off the dust and sewage on the surface of the carrier, and on the other hand, the inside and outside of the wafer carrier 60 can be fully cleaned at 360°, thereby improving the production capacity, saving water and gas, and reducing the production cost. By setting the support side holder 24 and the rotating side holder 25, the wafer carrier 60 placed in the product support 23 is fixed, the rotating side holder 25 is rotated by the weight of the wafer carrier 60, the wafer carrier 60 is stopped and fixed, so that the wafer carrier 60 does not displace during the cleaning process, thereby ensuring the efficiency and stability of the cleaning, facilitating the feeding and discharging, and improving the efficiency of the feeding and discharging.

[0058] The above is only a preferred embodiment of the application, and is not used to limit the protection scope of the application. Any modification, equivalent replacement or improvement within the spirit of the application is covered by the claim scope of the application.

Claims

1. A cleaning apparatus for a wafer carrier, the wafer carrier comprising a carrier body and a carrier cover coupled to the carrier body, the carrier body having a lifting portion at a top portion, two handles at two side portions, and three positioning slots at a bottom portion, the lifting portion, the handles and the positioning slots being located on adjacent sides of the carrier body, respectively, wherein the lifting portion and the positioning slots are located on two opposite sides, respectively, and the two handles are located on the other two opposite sides, respectively, characterized in that: The cleaning device for wafer carrier comprises a rotating mechanism, the rotating mechanism comprises a rotating motor, a rotating shaft connected to the rotating motor, a product support connected to the rotating shaft, two supporting side holders arranged on the product support, two rotating side holders arranged on the product support, and two return springs respectively connected to the rotating side holders and the product support, the supporting side holders and the rotating side holders are arranged on two opposite sides of the product support, the sides where the supporting side holders and the rotating side holders are arranged are adjacent to the connecting surface where the rotating shaft is located, the two supporting side holders each comprise a side holder bottom plate, at least two side holder mounting rods vertically fixed to the side holder bottom plate, and a side holder fixing block arranged at a distance from the side holder bottom plate, the rotating side holder comprises a rotating part connected to the product support, a pressing end arranged on the rotating part, and a buckling end arranged on the rotating part, the rotating part is located between the pressing end and the buckling end, the pressing end is located on the side of the rotating side holder facing the supporting side holder, the buckling end is located on the side of the rotating side holder facing the rotating motor, the pressing end and the buckling end form an acute angle, the length of the pressing end is less than the length of the buckling end, the line connecting the abutting point between the side holder fixing block and the lifting part and the abutting point between the pressing end and the edge of the wafer carrier has a first acute angle with the central axis of the rotating shaft, the center of the rotating part and the line connecting the abutting point between the side holder fixing block and the lifting part have a second acute angle with the central axis of the rotating shaft, the first acute angle is greater than the second acute angle, the difference between the second acute angle and the first acute angle enables the wafer carrier to be placed vertically, and the wafer carrier is in the vertically placed position when the return spring reaches its limit extension position.

2. The cleaning apparatus for a wafer carrier according to claim 1, wherein: The cleaning device for wafer carrier further comprises a cleaning conveying mechanism, a cleaning mechanism arranged in the cleaning conveying mechanism, an air jet mechanism arranged in the cleaning conveying mechanism, and an infrared heating mechanism arranged in the cleaning conveying mechanism.

3. The cleaning apparatus for a wafer carrier as recited in claim 2, wherein: The cleaning conveying mechanism comprises a cleaning cavity enclosed by side plates, a lifting cover plate covering the cleaning cavity, and a lifting mechanism connecting the cleaning cavity and the lifting cover plate, a sealing strip is arranged at the edge of the lifting cover plate.

4. The cleaning apparatus for wafer carriers as recited in claim 3, wherein: The lifting mechanism comprises a pair of driving assemblies arranged on the outer wall of the cleaning cavity, and two support rods respectively arranged on the two driving assemblies, the two driving assemblies are arranged on two opposite sides of the cleaning cavity, one end of the support rod is fixed to the driving assembly, and the other end is connected to the lifting cover plate.

5. The cleaning apparatus for wafer carriers as recited in claim 2, wherein: The cleaning mechanism comprises a plurality of hot water inlets arranged on the outer wall of the cleaning cavity, a plurality of water spray pipes arranged in the cleaning cavity, a plurality of hot water nozzles arranged on the water spray pipes, and a hot water outlet arranged on the side wall of the cleaning cavity.

6. The cleaning apparatus for wafer carriers of claim 1, wherein: The pulling part comprises a connecting end arranged on the carrier body and a lifting end arranged on the connecting end.

7. The cleaning apparatus for wafer carriers of claim 1, wherein: The product support is provided with two fixed support rods for arranging the support side holders, a rotating support rod for arranging the rotating side holder, and a spring support rod for arranging the reset spring, the fixed support rods are arranged on the same side with the support side holders, and the rotating support rod and the spring support rod are arranged on the same side and parallel to each other.

8. The cleaning apparatus for wafer carriers of claim 2, wherein: The air jet mechanism comprises an air inlet arranged on the outer wall of the cleaning cavity, a plurality of air jet pipes arranged in the cleaning cavity, and a plurality of air jet nozzles arranged on the air jet pipes.

9. The cleaning apparatus for wafer carriers of claim 2, wherein: The infrared heating mechanism comprises a plurality of infrared fixed pipes arranged on the outer wall of the cleaning cavity, and a plurality of infrared lamp tubes arranged on the infrared fixed pipes.

10. The cleaning apparatus for wafer carriers of claim 7, wherein: One end of the reset spring is connected to the buckling end, and the other end is connected to the spring support rod.

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