Automatic soldering tin cooling device for LED circuit board

Abstract

The invention relates to the technical field of circuit boards, in particular to an automatic soldering tin cooling device for an LED circuit board, which comprises a bracket, a lower shell and an upper shell, the bracket is fixedly connected with a lower shell; the lower shell is hinged with an upper shell; the device further comprises a connecting semi-ring, an arch-shaped cooling plate and the like. A plurality of connecting semi-rings are respectively arranged in the lower shell and the upper shell; all the connecting semi-rings in the lower shell are fixedly connected with an arch-shaped cooling plate together. And all the connecting semi-rings in the upper shell are jointly and fixedly connected with another arched cooling plate. According to the invention, the cooling airflow flows through the right side surface of each plate from right to left, so that the right side surfaces of a plurality of plates are well cooled at the same time, and the problems that only a single circuit board can be cooled at a time, a plurality of plates cannot be cooled at the same time and the cooling efficiency is low in the prior art are solved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to an automatic solder cooling device for an LED circuit board. Background Art

[0002] Circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Because it is made by electronic printing, it is called a "printed" circuit board. During the production of circuit boards, the solder of the circuit board is generally cooled by a cooling device; however, the current traditional circuit board solder cooling device can only cool a single circuit board at a time during use, and cannot cool multiple circuit boards at the same time. The cooling efficiency is low and needs to be improved. Summary of the invention

[0003] In order to overcome the disadvantages of the problems mentioned in the background, the present invention provides an automatic solder cooling device for an LED circuit board.

[0004] The technical solution is: an automated solder cooling device for an LED circuit board, comprising a bracket, a lower shell and an upper shell; the bracket is fixedly connected to the lower shell; the lower shell is hingedly connected to the upper shell; it also includes a connecting semi-ring, an arched cooling plate, an air ring, a connecting disk, a telescopic airbag and a slot; a plurality of connecting semi-rings are respectively arranged in the lower shell and the upper shell; all the connecting semi-rings in the lower shell are commonly fixedly connected to an arched cooling plate; all the connecting semi-rings in the upper shell are commonly fixedly connected to another arched cooling plate; the two arched cooling plates are symmetrical to each other and jointly form a cylinder with an open end; the arched cooling plate is installed with an air ring; the air ring is fixedly connected to the connecting disk; the connecting disk is provided with a telescopic airbag; the telescopic airbag is provided with an air injection port, and the air injection port is connected to an external air pump; each arched cooling plate is provided with a plurality of ventilation slots one; the expanded telescopic airbag is provided with a plurality of ventilation slots two, and the ventilation slots one and the ventilation slots two are staggered; each arched cooling plate is provided with a plurality of slots.

[0005] Furthermore, the upper shell is provided with a handle.

[0006] Furthermore, a convex portion 1 is provided on the left side of each ventilation slot 1 of the arched cooling plate; and a convex portion 2 is provided on the left side of each ventilation slot 2 of the inflated telescopic airbag.

[0007] Furthermore, a curved portion is respectively provided on the left side of the lower shell and the left side of the upper shell.

[0008] Furthermore, the connecting half ring is configured as a heat dissipation fin structure.

[0009] Furthermore, the air injected into the telescopic airbag from the air injection port is cold air.

[0010] Furthermore, a plurality of baffle half rings are fixedly connected in each lower shell and each upper shell, and the baffle half rings and the connecting half rings are staggered, and there is a distance between the baffle half rings and the arched cooling plates.

[0011] Furthermore, the wind ring is equipped with a frustoconical guide cylinder which is smaller on the left and larger on the right.

[0012] Furthermore, the guide tube is equipped with a filter screen plate.

[0013] The beneficial effects of the present invention are: 1. In the present invention, the cooling airflow flows from right to left through the right side of each plate, thereby having a good cooling effect on the right sides of multiple plates at the same time, solving the problem in the prior art that only a single circuit board can be cooled at a time, multiple circuit boards cannot be cooled at the same time, and the cooling efficiency is low.

[0014] 2. In the present invention, after the telescopic airbag expands toward the inner side of the arched cooling plate, continuing to inject air into the telescopic airbag will cause the convex portion 2 on the telescopic airbag to expand. Then, in the above-mentioned cooling process, a part of the cold air moves along the original path to cool the right side of the plate, while the other part of the cold air, after being intercepted and guided by the convex portion 1 and the convex portion 2, will move toward the left side of the plate to cool the left side of the plate. In this way, double-sided cooling of the plate is achieved at the same time, thereby improving the cooling efficiency.

[0015] 3. The present invention dissipates heat for the arched cooling plate by means of a connecting half ring which is set as a heat dissipating fin structure, thereby avoiding the problem that the arched cooling plate is kept in a high temperature state for a long time, which will affect the service life of the arched cooling plate to a certain extent; and the cold air blown out from the left end of the arched cooling plate is guided by the curved portion, so that the cold air passes through the channel between the lower shell, the upper shell and the arched cooling plate from left to right after being guided, and then is blown out from the right side of the channel. In this process, the connecting half ring in the channel is dissipated by the cold air, and the heat absorbed by the connecting half ring is taken away, thereby ensuring its heat dissipation effect; at the same time, the baffle structure formed by the staggered connecting half rings and the baffle half rings makes the airflow passing through the channel move in a wave-like manner, thereby prolonging the contact time between the airflow and the connecting half ring, thereby improving the heat dissipation effect of the airflow on the connecting half ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the first structure disclosed in the present invention; Figure 2 This is a schematic diagram of the second structure disclosed in the present invention; Figure 3 It is a schematic diagram of the lower shell and the upper shell in the open state disclosed by the present invention; Figure 4It is an exploded view of the structure of the connecting semi-ring, the arched cooling plate and the telescopic airbag disclosed in the present invention; Figure 5 This is a schematic diagram of the placement state of the plate disclosed in the present invention; Figure 6 It is a schematic diagram of the expansion state of the telescopic airbag disclosed in the present invention; Figure 7 It is a schematic diagram of the structure of the convex part 1 and the convex part 2 disclosed in the present invention; Figure 8 This is a schematic diagram of the airflow direction disclosed in the present invention.

[0017] Markings in the accompanying drawings: 1- bracket, 2- lower shell, 3- upper shell, 4- connecting half ring, 5- arched cooling plate, 6- wind ring, 7- connecting plate, 8- telescopic air bag, 9- slot, 20- baffle half ring, 30- guide tube, 40- filter screen plate, 51- convex part one, 81- convex part two, 001- plate material, 2001- curved part, 5001- ventilation slot one, 8001- ventilation slot two. DETAILED DESCRIPTION

[0018] The following descriptions are merely preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention.

[0019] Example 1 An automatic solder cooling device for LED circuit boards, such as Figure 1-Figure 8 As shown, it includes a bracket 1, a lower shell 2 and an upper shell 3; the bracket 1 is bolted to the lower shell 2; the lower shell 2 is hinged to the upper shell 3; It also includes a connecting semi-ring 4, an arched cooling plate 5, an air ring 6, a connecting disk 7, a telescopic airbag 8 and a slot 9; a plurality of connecting semi-rings 4 are respectively arranged in the lower shell 2 and the upper shell 3; all the connecting semi-rings 4 in the lower shell 2 are commonly fixed to an arched cooling plate 5; all the connecting semi-rings 4 in the upper shell 3 are commonly fixed to another arched cooling plate 5; the two arched cooling plates 5 are symmetrical to each other and jointly form a cylinder with an open end; the arched cooling plate 5 is installed with an air ring 6, the air ring 6 is fixed to the connecting disk 7, and the connecting disk 7 is provided with a telescopic airbag 8; the telescopic airbag 8 is provided with an air injection port, and the air injection port is connected to an external air pump; each arched cooling plate 5 is respectively provided with a plurality of ventilation slots 1 5001; the inflated telescopic airbag 8 is provided with a plurality of ventilation slots 2 8001, and the ventilation slots 1 5001 and the ventilation slots 2 8001 are staggered; each arched cooling plate 5 is respectively provided with a plurality of slots 9.

[0020] The upper shell 3 is provided with a handle, through which the upper shell 3 can be quickly opened to improve convenience.

[0021] The present invention works specifically as follows: As explained above, when the telescopic airbag 8 is in the contracted state, the left end thereof is located on the right side of the rightmost slot 9 .

[0022] First, the operator adjusts the upper housing 3 to the position as shown in the figure. Figure 3 The open state shown; Then, see Figure 5 The operator places the plates 001 into the lower housing 2 one by one, and is limited by the slot 9. The position of the ventilation slot 1 5001 will leave a gap with the inner annular surface of the plate 001 to facilitate airflow. Next, the operator adjusts the upper housing 3 to the position as shown in the figure. Figure 1 The closed state shown; Then, the external air pump is controlled to inject air into the telescopic airbag 8 through the air injection port, so that the telescopic airbag 8 gradually expands laterally to the left; When the left end of the telescopic airbag 8 abuts against the lower shell 2 and the upper shell 3, the telescopic airbag 8 stops expanding laterally. Continuing to inject air into the telescopic airbag 8 will cause the telescopic airbag 8 to expand toward the inner side of the arched cooling plate 5 until the outer side of the telescopic airbag 8 abuts against the inner annular surface of the plate 001, and there will be a gap between the position of the second ventilation groove 8001 and the inner annular surface of the plate 001 to facilitate airflow. At this time, the control wind ring 6 inputs cold air for cooling between the arched cooling plate 5 and the telescopic airbag 8, so that the cold air passes between the arched cooling plate 5 and the telescopic airbag 8 from right to left. During this process, the cold air will first contact the right side of the rightmost plate 001, and then move along the right side of the plate 001 to ventilation groove 1 5001, and then pass through ventilation groove 1 5001, move to the left along the inner side surface of the arched cooling plate 5, and then contact the right side of the next plate 001, and move along the right side of the next plate 001 to ventilation groove 2 8001, after passing through ventilation groove 2 8001, continue to move to the left along the outer side surface of the telescopic airbag 8, and so on, so that the airflow flows from right to left through the right side of each plate 001, thereby having a good cooling effect on the right sides of multiple plates 001 at the same time.

[0023] After the cooling of the right side of the plate 001 is completed, the telescopic airbag 8 is controlled to shrink first, and then the upper shell 3 is opened. After the operator adjusts the direction of the plate 001, the other side of the plate 001 is cooled according to the above steps.

[0024] Example 2 On the basis of the above-mentioned embodiment 1, Figure 7-Figure 8 As shown, a convex portion 51 is disposed on the left side of each ventilation slot 1 5001 of the arched cooling plate 5; a convex portion 2 81 is disposed on the left side of each ventilation slot 2 8001 of the inflated telescopic airbag 8.

[0025] The present invention works specifically as follows: According to the above work, only the right side of the plate 001 can be cooled at one time. If the left side of the plate 001 is to be cooled, the upper shell 3 needs to be opened and the direction of the plate 001 needs to be adjusted, and the cooling efficiency needs to be improved. Therefore, the present invention sets convex part 1 51 and convex part 2 81. After the telescopic airbag 8 expands toward the inner side of the arched cooling plate 5, the air injected into the telescopic airbag 8 will continue to expand the convex part 2 81 on the telescopic airbag 8. Then, in the above cooling process, a part of the cold air moves along the original path to cool the right side of the plate 001, while the other part of the cold air moves toward the left side of the plate 001 after being intercepted and guided by the convex part 1 51 and the convex part 2 81 to cool the left side of the plate 001. In this way, double-sided cooling of the plate 001 is achieved at the same time, thereby improving the cooling efficiency.

[0026] Example 3 Based on the above embodiment 2, Figure 3-Figure 8 As shown, a curved portion 2001 is respectively provided on the left side of the lower shell 2 and the left side of the upper shell 3 .

[0027] The connecting half ring 4 is configured as a heat dissipation fin structure.

[0028] The air injected into the telescopic airbag 8 from the air injection port is cold air, which prevents the temperature on the plate 001 from being transferred into the telescopic airbag 8, causing the air temperature in the telescopic airbag 8 to rise rapidly, resulting in the temperature of the area where the telescopic airbag 8 is located and the inner area of ​​the arched cooling plate 5 to rise, affecting the cooling effect on the plate 001.

[0029] A plurality of baffle half rings 20 are fixedly connected in each lower shell 2 and each upper shell 3 , and the baffle half rings 20 and the connecting half rings 4 are staggered, and there is a distance between the baffle half rings 20 and the arched cooling plates 5 .

[0030] The air ring 6 is provided with a truncated cone-shaped guide tube 30 which is smaller on the left and larger on the right.

[0031] The guide tube 30 is equipped with a filter screen 40, which filters the airflow blown out from the right side of the channel between the lower shell 2, the upper shell 3 and the arched cooling plate 5, intercepts the tin particles falling off the surface of the plate 001 in the airflow, and prevents the tin particles from being carried into the outside air by the airflow and causing pollution to the outside air.

[0032] The present invention works specifically as follows: During the above cooling process, the part of the arched cooling plate 5 in contact with the plate 001 will be subjected to heat transfer, resulting in an increase in the temperature of the arched cooling plate 5. If the arched cooling plate 5 is in a high temperature state for a long time, the service life of the arched cooling plate 5 will be affected to a certain extent.

[0033] Therefore, in the above cooling process, the arched cooling plate 5 is cooled by the connecting half ring 4 which is set as a heat dissipation fin structure, so as to avoid the problem that the service life of the 5-arched cooling plate 5 is affected to a certain extent due to being in a high temperature state for a long time; and the cold air blown out from the left end of the arched cooling plate 5 is guided by the curved portion 2001, so that it passes through the channel between the lower shell 2, the upper shell 3 and the arched cooling plate 5 from left to right after being guided, and then blown out from the right side of the channel. In this process, the connecting half ring 4 in the channel is cooled by the cold air, and the heat absorbed by the connecting half ring 4 is taken away, thereby ensuring its heat dissipation effect; at the same time, the baffle structure formed by the staggered connecting half ring 4 and the baffle half ring 20 makes the airflow passing through the channel move in a wave-like manner, thereby prolonging the contact time between the airflow and the connecting half ring 4, thereby improving the heat dissipation effect of the airflow on the connecting half ring 4.

[0034] At the same time, the air flow blown out from the right side of the channel between the lower shell 2, the upper shell 3 and the arched cooling plate 5 is guided by the guide tube 30 to diffuse outward and away from the area where the wind ring 6 is located, thereby preventing the air flow blown out from the right side of the channel from being sucked into the wind ring 6, resulting in the problem of too high air temperature input into the arched cooling plate 5 by the wind ring 6 and poor cooling effect.

[0035] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An automated solder cooling device for an LED circuit board, comprising a bracket (1), a lower shell (2) and an upper shell (3); the bracket (1) is fixedly connected to the lower shell (2); the lower shell (2) is hingedly connected to the upper shell (3); the characteristics are: The invention also comprises a connecting half ring (4), an arched cooling plate (5), an air ring (6), a connecting plate (7), a telescopic air bag (8) and a slot (9); a plurality of connecting half rings (4) are respectively arranged in the lower shell (2) and the upper shell (3); all the connecting half rings (4) in the lower shell (2) are fixedly connected to one arched cooling plate (5); all the connecting half rings (4) in the upper shell (3) are fixedly connected to another arched cooling plate (5); the two arched cooling plates (5) are symmetrical to each other and together form a cylinder with an open end; the arched cooling plates (5 ) is installed with an air ring (6); the air ring (6) is fixedly connected with a connecting plate (7); the connecting plate (7) is provided with a telescopic airbag (8); the telescopic airbag (8) is provided with an air injection port, and the air injection port is connected to an external air pump; each arched cooling plate (5) is provided with a plurality of ventilation slots 1 (5001); the inflated telescopic airbag (8) is provided with a plurality of ventilation slots 2 (8001), and the ventilation slots 1 (5001) and the ventilation slots 2 (8001) are staggered; each arched cooling plate (5) is provided with a plurality of card slots (9).

2. The automatic solder cooling device for LED circuit board according to claim 1, characterized in that: The upper shell (3) is provided with a handle.

3. An automatic solder cooling device for LED circuit board according to any one of claims 1-2, characterized in that: A convex portion 1 (51) is provided on the left side of each ventilation slot 1 (5001) of the arched cooling plate (5); a convex portion 2 (81) is provided on the left side of each ventilation slot 2 (8001) of the inflated telescopic airbag (8).

4. The automatic solder cooling device for LED circuit board according to claim 3, characterized in that: A curved portion (2001) is respectively provided on the left side of the lower shell (2) and the left side of the upper shell (3).

5. The automatic solder cooling device for LED circuit board according to claim 4, characterized in that: The connecting half ring (4) is configured as a heat dissipation fin structure.

6. The automatic solder cooling device for LED circuit board according to claim 5, characterized in that: The air injected into the telescopic airbag (8) from the air injection port is cold air.

7. The automatic solder cooling device for LED circuit board according to claim 6, characterized in that: A plurality of baffle half rings (20) are fixedly connected in each lower shell (2) and each upper shell (3), and the baffle half rings (20) and the connecting half rings (4) are arranged in a staggered manner, and there is a spacing between the baffle half rings (20) and the arched cooling plates (5).

8. The automatic solder cooling device for LED circuit board according to claim 7, characterized in that: The wind ring (6) is provided with a truncated cone-shaped guide tube (30) which is smaller on the left and larger on the right.

9. The automatic solder cooling device for LED circuit board according to claim 8, characterized in that: The guide tube (30) is equipped with a filter screen plate (40).

Images