Plate positioning and workpiece machining method and device, machining equipment and storage medium

Abstract

The invention relates to a plate positioning and workpiece machining method and device, machining equipment and a storage medium. The method comprises the steps that an initial positioning point, located above a plate, of a displacement sensor and an analog quantity feedback value when the displacement sensor moves relative to the plate are obtained; determining a length edge target point and a width edge target point of the plate according to the initial positioning point and the analog quantity feedback value; and determining position information of the plate according to the length edge target point and the width edge target point. According to the method, the precision of edge searching of the plate is effectively improved, so that the precision of the angular point position and the offset angle of the plate is improved, the problem of plate waste caused by large size of a reserved frame in plate processing due to inaccurate calculation of the angular point position and the offset angle of the plate is solved, the positioning precision of the plate can be ensured, and the production efficiency is improved. And higher requirements of laser processing are met.

Description

Technical Field

[0001] The present application relates to the field of laser processing, and in particular to a plate positioning and workpiece processing method, device, processing equipment and storage medium. Background Art

[0002] With the continuous development of laser processing technology and the increasing demand for lasers, the requirements for laser processing are getting higher and higher. During the laser processing process, the placement of the plate may have position or angle deviations due to irresistible factors, and it is necessary to find the plate corners and plate inclination angles for the next step of processing.

[0003] In the related art, the approximate edge position of the plate is usually found, and the corner position and offset angle of the plate are calculated based on the approximate edge position of the plate for processing. Since the determination of the edge position point is not accurate enough, the corner position and offset angle of the plate are also not accurate enough, resulting in a large reserved frame size in the plate processing, thereby wasting the plate, and it is difficult to meet the laser processing requirements. Summary of the invention

[0004] Based on this, it is necessary to provide a plate positioning and workpiece processing method, device, processing equipment and storage medium to address the above technical problems.

[0005] A plate positioning method, comprising:

[0006] Acquire an initial positioning point of the displacement sensor above the plate and an analog feedback value when the displacement sensor moves relative to the plate;

[0007] According to the initial positioning point and the analog feedback value, a length edge target point and a width edge target point of the plate are determined, wherein the length edge target point is located at the length edge of the plate, and the width edge target point is located at the width edge of the plate;

[0008] The position information of the plate is determined according to the length edge target point and the width edge target point.

[0009] In one embodiment, determining the position information of the plate according to the length edge target point and the width edge target point includes:

[0010] Determining the plate corner point position and edge inclination angle of the plate according to the length edge target point and the width edge target point;

[0011] The position information of the plate is determined according to the position of the plate corner point and the edge inclination angle.

[0012] In one embodiment, the length edge target point includes a first length edge target point and a second length edge target point, and determining the plate corner point position and edge inclination angle of the plate according to the length edge target point and the width edge target point includes:

[0013] Determining a length edge slope value of the plate according to the first length edge target point and the second length edge target point;

[0014] Determining the width edge slope value of the plate according to the width edge target point and the length edge slope value;

[0015] The plate corner point position and the edge inclination angle are determined according to the length edge slope value, the width edge slope value, the length edge target point and the width edge target point.

[0016] In one embodiment, determining the plate corner point position and the edge inclination angle according to the length edge slope value, the width edge slope value, the length edge target point and the width edge target point includes:

[0017] Determine the length edge line segment of the plate according to the length edge slope value, the first length edge target point and the second length edge target point;

[0018] Determining a width edge line segment of the plate according to the width edge slope value and the width edge target point;

[0019] Determining the plate corner point position of the plate according to the length edge line segment and the width edge line segment;

[0020] The edge inclination angle of the plate is determined according to the position of the corner point of the plate.

[0021] In one embodiment, the plate is placed on a processing platform, and determining the length edge target point and the width edge target point of the plate according to the initial positioning point and the analog feedback value includes:

[0022] Obtaining a processing platform coordinate system and a positioning adjustment coefficient, wherein the processing platform coordinate system takes a corner point of the processing platform as a coordinate origin, takes a length direction of the processing platform as a coordinate horizontal axis, and takes a width direction of the processing platform as a coordinate vertical axis;

[0023] Determining the width edge target point according to the analog feedback value, the initial positioning point and the horizontal axis of the machining platform coordinate system;

[0024] The length edge target point is determined according to the analog feedback value, the initial positioning point, the positioning adjustment coefficient and the longitudinal axis of the machining platform coordinate system.

[0025] In one embodiment, the length edge target point includes a first length edge target point and a second length edge target point, and determining the length edge target point according to the analog feedback value, the initial positioning point, the positioning adjustment coefficient and the longitudinal axis of the processing platform coordinate system includes:

[0026] Determining the first length edge target point according to the analog feedback value, the initial positioning point and the longitudinal axis of the machining platform coordinate system;

[0027] Determining the edge positioning process point of the plate according to the initial positioning point and the positioning adjustment coefficient;

[0028] A second length edge target point is determined according to the analog feedback value, the positioning process point and the longitudinal axis of the machining platform coordinate system.

[0029] A workpiece processing method, wherein the workpiece is located on the upper surface of a plate, and the position information of the plate includes the plate corner point position and edge inclination angle of the plate; the workpiece processing method comprises:

[0030] Obtaining the relative position of the workpiece and the machining center;

[0031] Determine the origin coordinates of the workpiece according to the relative position between the workpiece and the machining center and the position of the corner point of the plate;

[0032] The workpiece is processed according to the workpiece origin coordinates and the edge inclination angle.

[0033] A plate positioning device, the plate positioning device comprising:

[0034] An acquisition module, used for acquiring an initial positioning point of the displacement sensor located above the plate and an analog feedback value when the displacement sensor moves relative to the plate;

[0035] An edge determination module, connected to the acquisition module, is used to determine a length edge target point and a width edge target point of the plate according to the initial positioning point and the analog feedback value, wherein the length edge target point is located at the length edge of the plate, and the width edge target point is located at the width edge of the plate;

[0036] The plate position determination module is connected to the edge determination module and is used to determine the position information of the plate according to the length edge target point and the width edge target point.

[0037] A processing device includes a memory and a processor, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the above method.

[0038] A computer-readable storage medium stores a computer program, which implements the above method when executed by a processor.

[0039] A computer program product, when the computer program product is run on a terminal device, enables the terminal device to execute any of the methods described above.

[0040] The beneficial effects of the embodiments provided in this application include:

[0041] The plate positioning method determines the length edge target point and the width edge target point of the plate applicable to different initial positioning points and different analog feedback values ​​according to the initial positioning point of the displacement sensor located above the plate and the analog feedback value when the displacement sensor moves relative to the plate, wherein the length edge target point is located at the length edge of the plate, and the width edge target point is located at the width edge of the plate, and then performs position analysis on the plate according to the obtained length edge target point and width edge target point to determine the position information of the plate (such as the position coordinates of the plate in the processing platform coordinate system); compared with the traditional method of calculating the plate corner point position and the offset angle according to the approximate edge position of the plate, the method of detecting the length edge and the width edge of the plate by the displacement sensor can effectively improve the accuracy of plate edge finding, thereby improving the accuracy of the plate corner point position and the offset angle, thereby improving the problem of wasting the plate due to the large reserved frame size in plate processing caused by inaccurate calculation of the plate corner point position and the offset angle, and can ensure the accuracy of plate positioning to meet higher requirements of laser processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 A schematic diagram of a process of a plate positioning method in one embodiment;

[0044] Figure 2 A schematic diagram of the positional relationship between a plate and a displacement sensor in one embodiment;

[0045] Figure 3A schematic diagram of the working process of a displacement sensor in one embodiment;

[0046] Figure 4 is a specific flow chart of step 104 in one embodiment;

[0047] Figure 5 This is a specific flow chart of step 106 in one embodiment;

[0048] Figure 6 A schematic flow chart of a workpiece processing method in one embodiment;

[0049] Figure 7 is a schematic diagram of a plate positioning process in one embodiment;

[0050] Figure 8 is a schematic block diagram of the structure of a plate positioning device in one embodiment;

[0051] Fig. 9 is a schematic block diagram of a specific structure of an edge determination module 40 in an embodiment;

[0052] Fig.10 is a schematic block diagram of a specific structure of a plate position determination module 60 in one embodiment;

[0053] Fig.11 is a schematic structural block diagram of a workpiece processing device in one embodiment;

[0054] Fig.12 Schematic diagram of the structure of a processing device in one embodiment. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0056] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0057] Figure 1 , is a schematic flow chart of a plate positioning method in one embodiment.

[0058] In this embodiment, if Figure 1 As shown, the plate positioning method includes steps 102 to 106.

[0059] Step 102, obtaining an initial positioning point of the displacement sensor above the plate and an analog feedback value when the displacement sensor moves relative to the plate.

[0060] The displacement sensor may be a sensor located at a certain height above the plate, capable of moving in the horizontal direction relative to the plate, and having a significant change in the output analog value when moving to the edge position and non-edge position of the plate. The initial positioning point may be the position at a certain moment when the horizontal projection of the displacement sensor is located inside the plate. The analog feedback value may be the analog value of the plate thickness value fed back by the displacement sensor as the position changes during the horizontal movement of the displacement sensor relative to the plate.

[0061] The situations of obtaining the initial positioning point of the displacement sensor above the plate and the analog feedback value when the displacement sensor moves relative to the plate include: detecting the initial position of the displacement sensor through a position detection unit to obtain the initial positioning point of the displacement sensor above the plate; and analyzing the displacement sensor moving in the horizontal direction relative to the plate through a sensor analysis unit to obtain the analog value related to the plate thickness value fed back by the displacement sensor.

[0062] Specifically, the displacement sensor detects the distance between the sensor and the object to be measured by the principle of light reflection. The displacement sensor can obtain the distance between the displacement sensor and the lower plate within 300mm to 100mm. The analog signal (i.e. analog feedback value) of the displacement sensor is received: voltage = analog signal / 3276.7. The full-scale analog voltage 32767 = 300mm = 10V can be obtained by setting. The unit length analog voltage 1mm = 163.835 can be obtained by the displacement sensor detection range of 300mm to 100mm. Assuming that the current position of the displacement sensor is as follows Figure 2 As shown, the calculation formula for the actual height value of the displacement sensor is: actual height value = 100 + (200-analog feedback value / 163.835).

[0063] To achieve the required height value D 2 , you need to calculate the coordinate Z that you need to move to along the vertical Z axis 2 ;like Figure 3 As shown, the current height of the custom displacement sensor point is D 1 , target height is D 2 The distance to be moved is D 3 ; Since the processing platform (such as a machine tool) moves downward from the vertical Z axis coordinate position of 0, the current position of the Z axis is -Z 1 , Z-axis target position is -Z 2 , then -Z 2 =-Z 1 -D 3 =-Z1 -(D 1 -D 2 ), that is, the Z-axis coordinate is -Z 2 When the set D is reached 2 height.

[0064] After moving the vertical Z axis to the target position, the distance between the displacement sensor and the plate is obtained. Then, the displacement sensor is moved in the horizontal direction so that the displacement sensor senses the distance from the surface of the plate. When the displacement sensor moves to the edge position and non-edge position of the plate, the analog feedback value of the displacement sensor will change. When the actual height value sensed is greater than the thickness of the plate, the position of the edge of the plate (i.e., the length edge target point or the width edge target point) can be obtained. In addition, the displacement sensor will send out a digital signal. By comparing the change in the analog feedback value and the digital signal, it can be determined whether the edge of the plate has been exceeded.

[0065] From the above, it can be known that by utilizing the characteristics of the displacement sensor in the plate, the horizontal projection of the displacement sensor is located at a position in the plate at a certain moment (i.e., the initial positioning point). After the vertical Z-axis of the processing platform is raised and lowered to the set height of the displacement sensor, the Z-axis remains stationary and the X-axis and Y-axis are moved horizontally. When the displacement sensor detects that: the analog feedback value related to the plate thickness value ≥ the preset plate thickness value, the position of the edge of the plate is detected.

[0066] Step 104, determining the length edge target point and the width edge target point of the plate according to the initial positioning point and the analog feedback value.

[0067] The length edge target point may be a position feature point formed based on the initial positioning point and the analog feedback value and located at the length edge of the plate. The width edge target point may be a position feature point formed based on the initial positioning point and the analog feedback value and located at the width edge of the plate. Optionally, the length edge target point includes a first length edge target point and a second length edge target point.

[0068] The situations in which the length edge target point and the width edge target point of the plate are determined according to the initial positioning point and the analog feedback value include: determining the length edge target point and the width edge target point of the plate according to the initial positioning point and the analog feedback value and combining the processing platform coordinate system.

[0069] Step 106, determining the position information of the plate according to the length edge target point and the width edge target point.

[0070] The position information of the plate may be the position information of the plate in the processing platform. Alternatively, the position information of the plate may be the position coordinates of the plate in the processing platform coordinate system.

[0071] The situations in which the position information of the plate is determined according to the length edge target point and the width edge target point include: determining the plate corner point position and edge inclination angle of the plate according to the length edge target point and the width edge target point; determining the plate position information according to the plate corner point position and the edge inclination angle.

[0072] The plate corner position may be the intersection of the plate length edge and the plate width edge of the plate. The edge inclination angle may be the inclination angle value of the plate length edge relative to the processing platform edge, or the inclination angle value of the plate width edge relative to the processing platform edge.

[0073] The situations in which the position information of the plate is determined according to the plate corner position and edge tilt angle include: determining the position information of each location of the plate according to the obtained plate corner position and edge tilt angle, combined with the plate length value and plate width value.

[0074] When it is necessary to position the plate, firstly, the initial position of the displacement sensor is detected by the position detection unit to obtain the initial positioning point of the displacement sensor above the plate, and the displacement sensor moving in the horizontal direction relative to the plate is analyzed by the sensor analysis unit to obtain the analog quantity related to the plate thickness value fed back by the displacement sensor; secondly, according to the initial positioning point and the analog quantity feedback value, and in combination with the processing platform coordinate system, the length edge target point and the width edge target point of the plate are determined; then, according to the length edge target point and the width edge target point, the plate corner point position and the edge inclination angle of the plate are determined; according to the plate corner point position and the edge inclination angle, the position information of the plate is determined.

[0075] The plate positioning method provided in this embodiment determines the length edge target point and width edge target point of the plate applicable to different initial positioning points and different analog feedback values ​​according to the initial positioning point of the displacement sensor located above the plate and the analog feedback value when the displacement sensor moves relative to the plate, the length edge target point is located at the length edge of the plate, and the width edge target point is located at the width edge of the plate, and then based on the obtained length edge target point and width edge target point, the plate is positionally analyzed to determine the position information of the plate (such as the position coordinates of the plate in the processing platform coordinate system); compared with the traditional method of calculating the plate corner point position and offset angle according to the approximate edge position of the plate, the method of detecting the length edge and the width edge of the plate by the displacement sensor can effectively improve the accuracy of the plate edge finding, thereby improving the accuracy of the plate corner point position and the offset angle, thereby improving the problem of wasting the plate due to the large reserved frame size in the plate processing caused by the inaccurate calculation of the plate corner point position and the offset angle, and can ensure the accuracy of the plate positioning to meet the higher requirements of laser processing.

[0076] Figure 4, which is a specific flow chart of step 104 in an embodiment.

[0077] In this embodiment, if Figure 4 As shown, step 104 includes sub-steps 402 to 406 .

[0078] In sub-step 402, the machining platform coordinate system and positioning adjustment coefficient are obtained.

[0079] The processing platform coordinate system may be a system with the corner point of the processing platform as the coordinate origin, the length direction of the processing platform as the coordinate horizontal axis, and the width direction of the processing platform as the coordinate vertical axis. The positioning adjustment coefficient may be formed based on the initial positioning point of the displacement sensor located above the plate, and the coefficient of the length edge target point may be obtained by combining the analog feedback value, the initial positioning point, and the vertical axis of the processing platform coordinate system. Optionally, the positioning adjustment coefficient may be a value greater than 0 and less than 1.

[0080] The situations of obtaining the processing platform coordinate system include: obtaining the corner points, length values ​​and width values ​​of the processing platform, and constructing the processing platform coordinate system with the corner points of the processing platform as the coordinate origin, the length direction of the processing platform as the coordinate horizontal axis and the width direction of the processing platform as the coordinate vertical axis.

[0081] In sub-step 404, the width edge target point is determined according to the analog feedback value, the initial positioning point and the horizontal axis of the machining platform coordinate system.

[0082] The situations in which the width edge target point is determined based on the analog feedback value, the initial positioning point and the horizontal axis of the machining platform coordinate system include: based on the initial positioning point, the displacement sensor moves horizontally relative to the plate toward the horizontal axis of the machining platform coordinate system, and the width edge target point is determined based on the position of the sudden change in the analog feedback value.

[0083] In sub-step 406, the length edge target point is determined according to the analog feedback value, the initial positioning point, the positioning adjustment coefficient and the longitudinal axis of the machining platform coordinate system.

[0084] The situations in which the length edge target point is determined according to the analog feedback value, the initial positioning point, the positioning adjustment coefficient and the longitudinal axis of the machining platform coordinate system include: determining the first length edge target point according to the analog feedback value, the initial positioning point and the longitudinal axis of the machining platform coordinate system; determining the edge positioning process point of the plate according to the initial positioning point and the positioning adjustment coefficient; determining the second length edge target point according to the analog feedback value, the positioning process point and the longitudinal axis of the machining platform coordinate system.

[0085] The edge positioning process point can be formed based on the initial positioning point and the positioning adjustment coefficient, and can be used in conjunction with the analog feedback value and the longitudinal axis of the machining platform coordinate system to derive the process position of the second length edge target point.

[0086] By measuring the changes in the analog feedback value of the initial positioning point and the displacement sensor relative to the plate in the horizontal direction approaching the horizontal axis and vertical axis of the processing platform coordinate system, and combining the processing platform coordinate system, the length edge target point and the width edge target point of the plate are determined, thereby improving the accuracy of the plate edge finding and ensuring the accuracy of the subsequent plate positioning process.

[0087] Figure 5 , which is a specific flow chart of step 106 in one embodiment.

[0088] In this embodiment, if Figure 5 As shown, step 106 includes sub-steps 502 to 506 .

[0089] Step 502: Determine the length edge slope value of the plate according to the first length edge target point and the second length edge target point.

[0090] Step 504, determining the width edge slope value of the plate according to the width edge target point and the length edge slope value.

[0091] Step 506, determining the plate corner point position and edge inclination angle according to the length edge slope value, the width edge slope value, the length edge target point and the width edge target point.

[0092] The first length edge target point can be formed based on the analog feedback value, the initial positioning point and the longitudinal axis of the machining platform coordinate system, and can cooperate with the second length edge target point to obtain the length edge feature point of the length edge slope value of the plate. The second length edge target point can be formed based on the analog feedback value, the positioning process point and the longitudinal axis of the machining platform coordinate system, and can cooperate with the first length edge target point to obtain the length edge feature point of the length edge slope value of the plate.

[0093] The situations of determining the position of the corner point and the edge inclination angle of the plate according to the length edge slope value, the width edge slope value, the length edge target point and the width edge target point include: determining the length edge segment of the plate according to the length edge slope value, the first length edge target point and the second length edge target point; determining the width edge segment of the plate according to the width edge slope value and the width edge target point; determining the position of the plate corner point of the plate according to the length edge segment and the width edge segment; determining the edge inclination angle of the plate according to the position of the plate corner point.

[0094] The length edge segment can be formed based on the width edge slope value and the width edge target point, and can reflect the line segments at various positions of the length edge of the plate. The width edge segment can be formed based on the length edge slope value, the first length edge target point and the second length edge target point, and can reflect the line segments at various positions of the width edge of the plate. The plate corner point position can be based on the intersection of the length edge segment and the width edge segment. The edge inclination angle can be formed based on the plate corner point position, and can reflect the angle value of the inclination degree of the edge of the plate relative to the length direction or width direction of the processing platform.

[0095] By analyzing the first length edge target point and the second length edge target point, the length edge slope value and the width edge slope value of the plate are successively obtained, and the plate corner point position and the edge inclination angle of the plate are determined in combination with the width edge target point, the first length edge target point and the second length edge target point of the plate, thereby improving the accuracy of the plate corner point position and the offset angle, thereby improving the problem of large reserved frame size and waste of plate in plate processing due to inaccurate calculation of the plate corner point position and the offset angle.

[0096] Figure 6 , which is a schematic flow chart of a workpiece processing method in one embodiment.

[0097] In this embodiment, if Figure 6 As shown, the workpiece is located on the upper surface of the plate, and the processing method includes steps 602 to 606.

[0098] Step 602, obtaining the relative position of the workpiece and the machining center.

[0099] Step 604, determining the origin coordinates of the workpiece according to the relative position between the workpiece and the machining center and the position of the corner point of the plate.

[0100] Step 606, processing the workpiece according to the workpiece origin coordinates and the edge inclination angle.

[0101] The machining center can be the geometric center position of the machining equipment acting on the workpiece. The relative position of the workpiece and the machining center can be the relative position coordinates of the machining center in the workpiece coordinate system. The workpiece origin coordinates can be the relative position coordinates of the machining center in the machining platform coordinate system.

[0102] The situations of determining the coordinates of the workpiece origin according to the relative position of the workpiece and the machining center and the position of the corner point of the plate include: obtaining the sum of the horizontal coordinates and the difference of the vertical coordinates of the relative position of the workpiece and the machining center and the position of the corner point of the plate, and using the sum of the horizontal coordinates as the horizontal coordinate of the workpiece origin and the difference of the vertical coordinates as the vertical coordinate of the workpiece origin to determine the coordinates of the workpiece origin.

[0103] Through the relative position of the workpiece and the machining center, and the position of the plate corner in the machining platform coordinate system, the coordinate transformation of the workpiece coordinate system and the machining platform coordinate system can be realized, and the consistency between the workpiece machining position and the machining platform position can be achieved, thereby ensuring the accuracy of workpiece machining while effectively improving the workpiece machining efficiency.

[0104] Specifically, Figure 7 As shown, custom variables: P 0 (x 0 ,y 0 ), P 1 (x 1 ,y 1 ), P 2 (x 2 ,y 2 ), P 3 (x 3 ,y 3 ) and P 4 (x 4 ,y 4 ). 0 Point is the position of the horizontal projection of the displacement sensor in the plate at a certain moment (i.e., the initial positioning point), P 1 Point is the displacement sensor with P 0 Point is the starting point, relative to the plate, along the horizontal direction toward the horizontal axis X direction of the processing platform coordinate system to find the coordinates of the edge of the plate (i.e. the width edge target point), P 2 Point is the displacement sensor with P 0 Point is the starting point, relative to the plate, along the horizontal direction toward the longitudinal axis Y direction of the processing platform coordinate system to find the coordinates of the edge of the plate (i.e., the first length edge target point), P 3 Point is the edge positioning process point of the plate obtained based on the initial positioning point and the positioning adjustment coefficient, P 4 Point is the displacement sensor with P 3 The starting point is the coordinate of the edge of the plate in the horizontal direction relative to the plate toward the longitudinal axis Y direction of the processing platform coordinate system (ie, the second length edge target point).

[0105] It should be noted that when positioning the plate, the initial positioning point P of the displacement sensor 0 The point is located at the horizontal coordinate x in the machining platform coordinate system 0 and the ordinate y 0 Need to meet: x 0 >x 1 ,y 0 >y 2 , and the horizontal direction of the displacement sensor must be inside the plate, x 1 is the width edge target point P 1 The horizontal axis, y 2The first length edge target point P 2 The vertical coordinate of .

[0106] The displacement sensor is initially positioned at point P 0 Starting from the plate, move horizontally toward the horizontal axis X direction of the processing platform coordinate system until the width edge target point P 1 ; Then move back to the initial positioning point P 0 , and then P 0 Point is the starting point, and the plate moves horizontally toward the longitudinal axis Y direction of the processing platform coordinate system until the first length edge is the target point P 2 Then calculate the edge positioning process point P of the displacement sensor for edge finding at the third point 3 (x3=machining program length*0.8、y3=y0); then move to point P3 with P 3 Point is the starting point, and the plate moves horizontally toward the longitudinal axis Y direction of the processing platform coordinate system until the second length edge is the target point P 4 .

[0107] According to P 2 and P 4 Two points determine a straight line equation y = kx + b, we can get P 2 and P 4 The equation of the line formed by the points y 2 -kx 2 =y 4 -kx 4 , find the b value, and then P 2 and P 4 Substitute the point coordinates to get the k value and get P 2 and P 4 The equation of the straight line formed by the points is y = k 1 x+b 1 (i.e. the straight line where the length edge segment of the plate is located), according to the perpendicular relationship between the length edge and the width edge of the plate, it can be obtained through P 1 Point and P 2 P 4 The equation of the perpendicular line k 2 =-k 1 , substitute P 1 Point coordinates get b 2 After obtaining the value of P 1 Point and P 2 P 4 The equation of the perpendicular line is y=k 2 x+b 2 (i.e. the straight line where the width edge segment of the plate is located), calculate the coordinates of the intersection of the two straight lines P 5 (x 5 ,y 5)(i.e. the position of the plate corner point): k 1 x 5 +b 1 =k 2 x 5 +b 2 ,(y 5 -b 1 ) / k 1 =(y 5 –b 2 ) / k 2 ; Then, according to the obtained plate corner point position, calculate the edge inclination angle of the plate: tanα=(x 2 –x 5 ) / (y 2 –y 5 ), and then the edge inclination angle α of the plate is obtained.

[0108] In addition, according to the relative position of the workpiece and the machining center and the position of the corner point of the plate, the coordinates of the workpiece origin are determined, and the workpiece coordinate system is established with the machining center as the workpiece origin. The coordinates of the workpiece origin are set to (x7, y7). That is, according to the relative position of the workpiece and the machining center and the difference between the sum of the horizontal coordinates and the vertical coordinates of the position of the corner point of the plate, the horizontal and vertical coordinates of the workpiece origin are calculated as: x7=(x5+x6), y7=(y5-y6).

[0109] It should be understood that, although the various steps in the above flowchart are displayed in sequence according to the prompts of the arrows, these steps are not necessarily executed in sequence in the order of the arrow prompts. Unless clearly stated in this article, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the above sub-steps may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps. It should be noted that the above different embodiments can be combined with each other.

[0110] Figure 8 , is a schematic block diagram of the structure of a plate positioning device in one embodiment.

[0111] In this embodiment, if Figure 8 As shown, the plate positioning device includes an acquisition module 20 , an edge determination module 40 and a plate position determination module 60 .

[0112] The acquisition module 20 is used to acquire the initial positioning point of the displacement sensor above the plate and the analog feedback value when the displacement sensor moves relative to the plate.

[0113] The edge determination module 40 is connected to the acquisition module 20 and is used to determine the length edge target point and the width edge target point of the plate according to the initial positioning point and the analog feedback value.

[0114] The plate position determination module 60 is connected to the edge determination module 40 and is used to determine the position information of the plate according to the length edge target point and the width edge target point.

[0115] In this embodiment, each module is used to execute Figure 1 For details of the steps in the corresponding embodiments, please refer to Figure 1 as well as Figure 1 The relevant descriptions in the corresponding embodiments are not repeated here.

[0116] The plate positioning device provided in the present embodiment determines the length edge target point and the width edge target point of the plate applicable to different initial positioning points and different analog feedback values ​​according to the initial positioning point of the displacement sensor located above the plate and the analog feedback value when the displacement sensor moves relative to the plate, the length edge target point is located at the length edge of the plate, and the width edge target point is located at the width edge of the plate, and then based on the obtained length edge target point and width edge target point, the plate is positionally analyzed to determine the position information of the plate (such as the position coordinates of the plate in the coordinate system of the processing platform); compared with the traditional method of calculating the position of the corner point and the offset angle of the plate according to the approximate edge position of the plate, the method of detecting the length edge and the width edge of the plate by the displacement sensor can effectively improve the accuracy of the plate edge finding, thereby improving the accuracy of the plate corner point position and the offset angle, thereby improving the problem of wasting the plate due to the large reserved frame size in the plate processing caused by the inaccurate calculation of the plate corner point position and the offset angle, and can ensure the accuracy of the plate positioning to meet the higher requirements of laser processing.

[0117] Fig. 9 , is a schematic block diagram of the specific structure of the edge determination module 40 in an embodiment.

[0118] In this embodiment, if Fig. 9 As shown, the edge determination module 40 includes a coordinate system determination unit 420 , a width edge determination unit 440 and a length edge determination unit 460 .

[0119] The coordinate system determination unit 420 is used to obtain the processing platform coordinate system and positioning adjustment coefficient.

[0120] The width edge determination unit 440 is connected to the coordinate system determination unit 420 and is used to determine the width edge target point according to the analog feedback value, the initial positioning point and the horizontal axis of the machining platform coordinate system.

[0121] The length edge determination unit 460 is connected to the coordinate system determination unit 420, and is used to determine the length edge target point according to the analog feedback value, the initial positioning point, the positioning adjustment coefficient and the longitudinal axis of the machining platform coordinate system.

[0122] In this embodiment, each unit is used to execute Figure 4 For details of the steps in the corresponding embodiments, please refer to Figure 4 as well as Figure 4 The relevant descriptions in the corresponding embodiments are not repeated here.

[0123] Fig.10 , is a schematic block diagram of the specific structure of the plate position determination module 60 in an embodiment.

[0124] In this embodiment, if Fig.10 As shown, the plate position determination module 60 includes a length edge slope unit 620 , a width edge slope unit 640 and a plate position determination unit 660 .

[0125] The length edge slope unit 620 is used to determine the length edge slope value of the plate according to the first length edge target point and the second length edge target point.

[0126] The width edge slope unit 640 is connected to the length edge slope unit 620 and is used to determine the width edge slope value of the plate according to the width edge target point and the length edge slope value.

[0127] The plate position determination unit 660 is connected to the length edge slope unit 620 and the width edge slope unit 640, and is used to determine the plate corner point position and edge inclination angle according to the length edge slope value, the width edge slope value, the length edge target point and the width edge target point.

[0128] In this embodiment, each unit is used to execute Figure 5 For details of the steps in the corresponding embodiments, please refer to Figure 5 as well as Figure 5 The relevant descriptions in the corresponding embodiments are not repeated here.

[0129] Fig.11 , which is a schematic block diagram of the structure of a workpiece processing device in one embodiment.

[0130] In this embodiment, if Fig.11 As shown, the workpiece processing device includes a relative position acquisition module 10 , a workpiece origin determination module 30 and a processing module 50 .

[0131] The relative position acquisition module 10 is used to acquire the relative position between the workpiece and the machining center.

[0132] The workpiece origin determination module 30 is connected to the relative position acquisition module 10 and is used to determine the workpiece origin coordinates according to the relative position between the workpiece and the machining center and the position of the plate corner point.

[0133] The processing module 50 and the workpiece origin determination module 30 are used to process the workpiece according to the workpiece origin coordinates and the edge inclination angle.

[0134] In this embodiment, each module is used to execute Figure 6 For details of the steps in the corresponding embodiments, please refer to Figure 6 as well as Figure 6 The relevant descriptions in the corresponding embodiments are not repeated here.

[0135] The division of the modules in the above-mentioned plate positioning device is only for illustration. In other embodiments, the plate positioning device can be divided into different modules as needed to complete all or part of the functions of the above-mentioned plate positioning device.

[0136] The specific definition of the plate positioning device can be found in the definition of the plate positioning method above, which will not be repeated here. Each module in the above-mentioned plate positioning device can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the processing equipment in the form of hardware, or can be stored in the memory of the processing equipment in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0137] Fig.12 , is a schematic diagram of the structure of a processing device in an embodiment.

[0138] In this embodiment, if Fig.12 As shown, the processing equipment includes a memory A1 and a processor A2; it may also include a display screen A3, a communications interface (Communications Interface) and a bus. Optionally, the processing equipment may be a laser processing equipment.

[0139] Among them, the memory A1, the processor A2, the display screen A3 and the communication interface can communicate with each other through a bus; the display screen A3 is set to display the user operation interface preset in the initial setting mode, and the display screen A3 can also display the process control window; the communication interface can transmit information; the memory A1 stores a computer program, and the processor A2 can call the logical instructions in the memory A1 to execute the method in the above embodiment.

[0140] In addition, the logic instructions in the above-mentioned memory A1 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent workpiece.

[0141] The memory A1 is a computer-readable storage medium that can be configured to store software programs, computer executable programs, such as program instructions or modules corresponding to the methods in the embodiments of the present application. The processor A2 executes functional applications and data processing by running the software programs, instructions or modules stored in the memory A1, that is, implementing the methods in the above embodiments.

[0142] The memory A1 includes a program storage area and a data storage area, wherein the program storage area can store an operating system and an application required for at least one function; the data storage area can store data created according to the use of the terminal device, etc. In addition, the memory A1 can include a high-speed random access memory and a non-volatile memory.

[0143] Processor A2 can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0144] The present application also provides a computer-readable storage medium, one or more non-volatile computer-readable storage media containing computer-executable instructions, which, when executed by one or more processors, enable the processors to execute the method in the above embodiment.

[0145] The embodiment of the present application also provides a computer program product. When the computer program product is run on a terminal device, the terminal device executes the method in the above embodiment.

[0146] The plate positioning and workpiece processing method, device, processing equipment and storage medium provided in the above embodiments determine the length edge target point and width edge target point of the plate applicable to different initial positioning points and different analog feedback values ​​according to the initial positioning point of the displacement sensor located above the plate and the analog feedback value when the displacement sensor moves relative to the plate, the length edge target point is located at the length edge of the plate, and the width edge target point is located at the width edge of the plate, and then the plate is positionally analyzed according to the obtained length edge target point and width edge target point to determine the position information of the plate (such as the position coordinates of the plate in the processing platform coordinate system); compared with the traditional method of calculating the plate corner point position and offset angle according to the approximate edge position of the plate, the method of detecting the length edge and the width edge of the plate by the displacement sensor can effectively improve the accuracy of the plate edge finding, thereby improving the accuracy of the plate corner point position and the offset angle, and further improving the problem of wasting the plate due to the large reserved frame size in the plate processing caused by the inaccurate calculation of the plate corner point position and the offset angle, which can ensure the accuracy of the plate positioning, meet the higher requirements of laser processing, and have important economic value and promotion practice value.

[0147] Any reference to memory, storage, database or other medium used in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM), which is used as an external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0148] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0149] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A plate positioning method, characterized in that: include: Acquire an initial positioning point of the displacement sensor above the plate and an analog feedback value when the displacement sensor moves relative to the plate; Determine a target point along the length edge and a target point along the width edge of the plate according to the initial positioning point and the analog feedback value, wherein the target point along the length edge is located at the length edge of the plate, and the target point along the width edge is located at the width edge of the plate; The position information of the plate is determined according to the length edge target point and the width edge target point.

2. The plate positioning method according to claim 1, characterized in that: The step of determining the position information of the plate according to the length edge target point and the width edge target point includes: Determining the plate corner point position and edge inclination angle of the plate according to the length edge target point and the width edge target point; The position information of the plate is determined according to the position of the plate corner point and the edge inclination angle.

3. The plate positioning method according to claim 2, characterized in that: The length edge target point includes a first length edge target point and a second length edge target point, and determining the plate corner point position and edge inclination angle of the plate according to the length edge target point and the width edge target point includes: Determining a length edge slope value of the plate according to the first length edge target point and the second length edge target point; Determining the width edge slope value of the plate according to the width edge target point and the length edge slope value; The plate corner point position and the edge inclination angle are determined according to the length edge slope value, the width edge slope value, the length edge target point and the width edge target point.

4. The plate positioning method according to claim 3, characterized in that: The step of determining the plate corner point position and the edge inclination angle according to the length edge slope value, the width edge slope value, the length edge target point and the width edge target point comprises: Determine the length edge line segment of the plate according to the length edge slope value, the first length edge target point and the second length edge target point; Determining a width edge line segment of the plate according to the width edge slope value and the width edge target point; Determining the plate corner point position of the plate according to the length edge line segment and the width edge line segment; The edge inclination angle of the plate is determined according to the position of the corner point of the plate.

5. The plate positioning method according to claim 1, characterized in that: The plate is placed on a processing platform, and the length edge target point and the width edge target point of the plate are determined according to the initial positioning point and the analog feedback value, including: Obtaining a processing platform coordinate system and a positioning adjustment coefficient, wherein the processing platform coordinate system takes a corner point of the processing platform as a coordinate origin, takes a length direction of the processing platform as a coordinate horizontal axis, and takes a width direction of the processing platform as a coordinate vertical axis; Determining the width edge target point according to the analog feedback value, the initial positioning point and the horizontal axis of the machining platform coordinate system; The length edge target point is determined according to the analog feedback value, the initial positioning point, the positioning adjustment coefficient and the longitudinal axis of the machining platform coordinate system.

6. The plate positioning method according to claim 5, characterized in that: The length edge target point includes a first length edge target point and a second length edge target point, and the length edge target point is determined according to the analog feedback value, the initial positioning point, the positioning adjustment coefficient and the longitudinal axis of the machining platform coordinate system, including: Determining the first length edge target point according to the analog feedback value, the initial positioning point and the longitudinal axis of the machining platform coordinate system; Determining the edge positioning process point of the plate according to the initial positioning point and the positioning adjustment coefficient; A second length edge target point is determined according to the analog feedback value, the positioning process point and the longitudinal axis of the machining platform coordinate system.

7. A method for processing a workpiece, wherein the workpiece is located on the upper surface of a plate, characterized in that: The position information of the plate includes the plate corner position and edge inclination angle of the plate; the workpiece processing method includes: Obtaining the relative position of the workpiece and the machining center; Determine the origin coordinates of the workpiece according to the relative position between the workpiece and the machining center and the position of the corner point of the plate; The workpiece is processed according to the workpiece origin coordinates and the edge inclination angle.

8. A plate positioning device, characterized in that: The plate positioning device comprises: An acquisition module, used for acquiring an initial positioning point of the displacement sensor located above the plate and an analog feedback value when the displacement sensor moves relative to the plate; An edge determination module, connected to the acquisition module, is used to determine a length edge target point and a width edge target point of the plate according to the initial positioning point and the analog feedback value, wherein the length edge target point is located at the length edge of the plate, and the width edge target point is located at the width edge of the plate; The plate position determination module is connected to the edge determination module and is used to determine the position information of the plate according to the length edge target point and the width edge target point.

9. A processing equipment, characterized in that: The method comprises a memory and a processor, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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