Manipulator and semiconductor transmission equipment

Abstract

The invention discloses a manipulator and semiconductor transmission equipment, the manipulator comprises a manipulator body and a blowing device, the manipulator body is provided with a bearing surface and a gas circulation space, the bearing surface can be used for bearing a to-be-borne object, and the gas circulation space is located below the to-be-borne object borne on the bearing surface; the blowing device is arranged on the manipulator body and provided with a blowing opening, the blowing opening is used for blowing cooling gas to the gas circulation space in the direction parallel to the bearing face so that a negative pressure area used for adsorbing the to-be-borne object can be formed in the gas circulation space, and the to-be-borne object can be tightly pressed on the bearing face by means of the pressure difference between the two sides of the to-be-borne object. Therefore, the friction force between the to-be-borne object and the manipulator body is increased, it is guaranteed that the to-be-borne object is not prone to slipping or falling off under the condition that the manipulator operates at the high acceleration, and then the conveying efficiency and the productivity of the to-be-borne object are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor preparation technology, and in particular to a robot and semiconductor transmission equipment. Background Art

[0002] In the semiconductor processing process, taking wafer processing as an example, robots are usually mounted on the front end of wafer processing equipment such as lithography machines, ion implantation machines, cleaning machines, and thin film deposition equipment to achieve the flow of wafers between various workstations. The operating speed of the robot determines the production capacity to a certain extent.

[0003] In the relevant technology, the manipulator can be divided into three categories according to its working principle: vacuum adsorption, clamping, and passive friction. Taking passive friction as an example, the manipulator supports the wafer and uses the friction between the manipulator and the wafer to keep the wafer relatively still with the manipulator. However, when the acceleration is too large during the operation of the manipulator, the wafer is prone to slip or even fall off due to insufficient friction between the wafer and the manipulator. Summary of the invention

[0004] The present application discloses a robot and a semiconductor transfer device to solve the problem in the related art that when there is excessive acceleration during the operation of the robot, the wafer is prone to slip or even fall off.

[0005] In order to solve the above technical problems, this application is implemented as follows: In a first aspect, an embodiment of the present application discloses a manipulator, wherein the disclosed manipulator includes a manipulator body and a blowing device; The manipulator body is provided with a supporting surface and a gas circulation space, the supporting surface is used to support the object to be carried, and the gas circulation space is located below the object to be carried supported on the supporting surface; The blowing device is arranged on the manipulator body, and has a blowing port, which is used to blow cooling gas into the gas circulation space in a direction parallel to the supporting surface to form a negative pressure area in the gas circulation space for adsorbing the object to be carried.

[0006] In a second aspect, an embodiment of the present application discloses a semiconductor transmission device, which includes a robotic arm and a robotic hand as described above connected to the robotic arm, wherein the robotic arm is used to drive the robotic hand to move.

[0007] The technical solution adopted in this application can achieve the following technical effects: The manipulator disclosed in the embodiment of the present application improves the relevant technology. By arranging an air blowing device on the manipulator body, when the object to be carried is placed on the supporting surface, the air blowing port of the air blowing device can form a negative pressure area for adsorbing the object to be carried in the gas flow space below the object to be carried, and utilize the pressure difference on both sides of the object to be carried to press the object to be carried against the supporting surface, thereby increasing the friction between the object to be carried and the manipulator body; and, the cooling gas blown by the air blowing port can also cool the object to be carried, so that the friction coefficient between the object to be carried and the supporting surface is increased, and the friction between the object to be carried and the manipulator body is further increased, thereby ensuring that when the manipulator runs at a large acceleration, the object to be carried is not prone to slippage or falling off, thereby improving the transmission efficiency and production capacity of the object to be carried. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic diagram of the structure of the manipulator disclosed in the embodiment of the present application; Figure 2 for Figure 1 Cross-sectional view along the AA direction.

[0009] Description of reference numerals: 100-manipulator body, 110-carrier, 111-supporting surface, 120-film placement slot, 121-first area, 122-second area, 123-third area, 200-blowing device, 210-blowing port, 211-first sub-blowing port, 212-second sub-blowing port, 213-third sub-blowing port, 220-intake pipeline, 221-first sub-pipeline, 222-second sub-pipeline, 223-third sub-pipeline, 230-thermostat, 240-flow controller, 250-temperature sensor, 300-gas source. DETAILED DESCRIPTION

[0010] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0011] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0012] The technical solutions disclosed in various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0013] In the semiconductor processing process, a robot is needed to transfer the objects to be carried, such as wafers, solar cells, etc. Taking wafer processing as an example, the robot is usually installed at the front end of wafer processing equipment such as lithography machines, ion implanters, cleaning machines, and thin film deposition equipment to realize the flow of wafers between various workstations. The operating speed of the robot determines the production capacity to a certain extent.

[0014] In the relevant technology, the manipulator can be divided into three categories according to its working principle: vacuum adsorption, clamping, and passive friction. Taking passive friction as an example, the manipulator supports the wafer and uses the friction between the manipulator and the wafer to keep the wafer relatively still with the manipulator. However, when there is excessive acceleration during the operation of the manipulator, such as during the start-up or stop process of the manipulator, the wafer is prone to slip or even fall off due to insufficient friction between the wafer and the manipulator.

[0015] Based on the above questions, please refer to Figure 1 and Figure 2 The embodiment of the present application discloses a manipulator, which may include a manipulator body 100 and a blowing device 200. The manipulator body 100 is mainly used to support an object to be carried. To facilitate the placement of the object to be carried, the manipulator body 100 is provided with a supporting surface 111 and a gas circulation space. The supporting surface 111 may be a plane, and the supporting surface 111 may be used to support the object to be carried. The gas circulation space is located below the object to be carried supported on the supporting surface 111.

[0016] In a specific implementation, the above-mentioned objects to be carried may be wafers, solar cells, etc. Taking wafers as an example, in order to facilitate the placement of wafers, the robot body 100 may be provided with an arc-shaped supporting surface 111. The supporting surface 111 is designed to be arc-shaped in order to better match the contour of the wafer.

[0017] It should be noted that, when the robot body 100 is used to place solar cells, the supporting surface 111 may also be designed in a shape that matches the solar cells, such as a rectangle, square, etc. The embodiment of the present application does not limit the specific shape of the supporting surface 111.

[0018] Continuing to use the wafer as a reference embodiment, the wafer has a first surface, a second surface and a side surface, the first surface and the second surface are two opposite surfaces of the wafer, and the first surface and the second surface are connected by the side surface. When the wafer is placed on the supporting surface 111, a part of the first surface or the second surface of the wafer will contact the supporting surface 111, and the gas flow space is located below the wafer and adjacent to the first surface or the second surface of the wafer. There is a certain friction between the first surface or the second surface of the wafer and the supporting surface 111, so that the robot body 100 can carry and transport the wafer by passive friction.

[0019] Considering that there will be a large acceleration when the robot body 100 is in the startup process, the stop process and other scenarios, a large friction force needs to be provided between the surface of the wafer and the supporting surface 111 so that the wafer can be stably placed on the supporting surface 111. Based on this, a blowing device 200 can be set on the robot body 100, and the blowing device 200 has a blowing port 210. The number of the blowing ports 210 can be one, two or more than two. The blowing port 210 can purge cooling gas into the gas circulation space in a direction parallel to the supporting surface 111. The cooling gas can be an inert gas such as nitrogen and helium. According to Bernoulli's principle, the flow of cooling gas in the gas circulation space will reduce the pressure of the gas circulation space, so that a negative pressure area for adsorbing wafers can be formed in the gas circulation space.

[0020] In combination with a specific usage scenario, the first surface of the wafer can be brought into contact with the supporting surface 111, so the gas circulation space is adjacent to the first surface of the wafer. When the air outlet 210 blows cooling gas into the gas circulation space in a direction parallel to the supporting surface 111, the air flow near the first surface of the wafer is accelerated and the pressure is reduced, thereby generating a pressure difference between the first surface and the second surface of the wafer. It can be understood that the pressure on the second surface of the wafer will be greater than the pressure on the first surface, thereby pressing the first surface of the wafer against the supporting surface 111, thereby increasing the friction between the wafer and the supporting surface 111.

[0021] From the above, it can be seen that the manipulator disclosed in the embodiment of the present application improves the relevant technology. By arranging a blowing device 200 on the manipulator body 100, when the object to be carried is placed on the supporting surface 111, the blowing port 210 of the blowing device 200 can form a negative pressure area for adsorbing the object to be carried in the gas flow space below the object to be carried, and utilize the pressure difference on both sides of the object to be carried to press the object to be carried on the supporting surface 111, thereby increasing the friction between the object to be carried and the manipulator body 100; and, the cooling gas blown by the blowing port 210 can also cool the object to be carried, so that the friction coefficient between the object to be carried and the supporting surface 111 is increased, and the friction between the object to be carried and the manipulator body 100 is further increased, thereby ensuring that when the manipulator runs at a large acceleration, the object to be carried is not prone to slippage or falling off, thereby improving the transmission efficiency and production capacity of the object to be carried.

[0022] like Figure 1 As shown, the manipulator body 100 may include a carrier 110 with an arc-shaped structure, and the supporting surface 111 is the top surface of the carrier 110. The area defined by the carrier 110 can form the above-mentioned gas circulation space, and the air outlet 210 can be arranged on the inner side of the carrier 110. The manipulator body 100 may also include a substrate, which is the structural basis of the manipulator body 100. The substrate may be a plate-like structure, and the carrier 110 may be formed on the surface of the substrate by integral molding. Of course, the carrier 110 and the substrate may also be made separately and then assembled together by welding, bonding, etc. By integrating the supporting surface 111 and the air outlet 210 on the top surface and the inner side of the carrier 110, respectively, the number of parts of the manipulator body 100 can be reduced.

[0023] In combination with the above, only relying on the friction between the supporting surface 111 and the object to be carried to fix the object to be carried will still cause the risk of slipping and falling off of the object to be carried. In an optional embodiment of the present application, the robot body 100 is also provided with a sheet placing groove 120, and the shape of the sheet placing groove 120 matches the contour of the object to be carried. Taking the wafer as an example, the shape of the sheet placing groove 120 can be circular, semicircular, etc. The carrier 110 can be set at the bottom of the sheet placing groove 120. Along the depth direction of the sheet placing groove 120, the carrier 110 is lower than the groove side wall of the sheet placing groove 120, and the gas circulation space is located between the bottom of the groove of the sheet placing groove 120 and the object to be carried. When the object to be carried is placed in the sheet placing groove 120, the groove side wall of the sheet placing groove 120 can cooperate with the side limit of the object to be carried, and then the friction between the supporting surface 111 and the object to be carried and the negative pressure area provided by the gas circulation space can be superimposed, which can further reduce the risk of slipping and falling off of the object to be carried.

[0024] In a specific embodiment of the present application, Figure 1 and Figure 2 As shown, for the above-mentioned arc-shaped carrier 110, the arc-shaped structure can be C-shaped, and the C-shaped opening is located on the side of the manipulator body 100 away from the air blowing port 210. The carrier 110 adopts the above-mentioned C-shaped design, which can make the cooling gas blown by the air blowing port 210 be discharged through the C-shaped opening, avoiding the accumulation of air flow in the gas circulation space and generating air flow disturbance. At the same time, after the cooling gas exchanges heat with the object to be carried, the heat can also be quickly transferred to the outside of the gas circulation space, which is conducive to the rapid heat dissipation of the object to be carried.

[0025] In a specific implementation, the wafer placement groove 120 is provided with an opening on the side away from the blowing port 210, and the groove bottom on the side away from the blowing port 210 has a notch recessed toward the blowing port 210, so that the robot arm avoids the pin needles on the base when taking and placing the wafer in the semiconductor chamber.

[0026] Considering that there may be certain temperature differences in different areas of the surface of the object to be carried, it is necessary to partition the surface of the object to be carried. Specifically, Figure 1 As shown, the film placing groove 120 may have a first area 121, a second area 122 and a third area 123, and the second area 122 and the third area 123 are respectively located on both sides of the first area 121. When the object to be carried is placed in the film placing groove 120, the first area 121, the second area 122 and the third area 123 may respectively correspond to different areas on the surface of the object to be carried. Correspondingly, the air blowing port 210 of the air blowing device 200 may include a first sub-air blowing port 211, a second sub-air blowing port 212 and a third sub-air blowing port 213, and the first sub-air blowing port 211, the second sub-air blowing port 212 and the third sub-air blowing port 213 are respectively arranged on the inner side of the carrier 110 facing the C-shaped opening, which is conducive to the smooth discharge of the cooling gas through the C-shaped opening. The second sub-air blowing port 212 and the third sub-air blowing port 213 are respectively located on both sides of the first sub-air blowing port 211, the first sub-air blowing port 211 faces the first area 121, the second sub-air blowing port 212 faces the second area 122, and the third sub-air blowing port 213 faces the third area 123. In other words, the first sub-air blowing port 211, the second sub-air blowing port 212 and the third sub-air blowing port 213 can also respectively purge cooling gas to different areas of the surface of the object to be carried.

[0027] By adopting the above-mentioned partition design, when there is a temperature difference in different areas of the surface of the object to be carried, the temperature, flow rate and other parameters of the cooling gas blown by the first sub-blowing port 211, the second sub-blowing port 212 and the third sub-blowing port 213 can be adjusted accordingly, so as to achieve partition control of the surface of the object to be carried, and avoid the problem of warping and breakage of the object to be carried due to the large internal temperature difference. It should be noted that this embodiment only lists three partition schemes. Of course, the number of partitions can also be two, four, five, etc. Correspondingly, the number of sub-blowing ports 210 is equal to the number of partitions and corresponds one to one. For the specific number of partitions of the sheet placing slot 120, it can be selected according to the size of the sheet placing slot 120 and the actual temperature control requirements, and the embodiment of the present application does not limit this.

[0028] For the three partition schemes described above, the first area 121 corresponds to the central area of ​​the object to be carried, and the second area 122 and the third area 123 correspond to the edge areas on both sides of the object to be carried. Considering that the central area of ​​the object to be carried may have the problem of untimely heat dissipation, the temperature of the central area of ​​the object to be carried may be slightly higher than the edge areas on both sides. Based on this, the flow area of ​​the second sub-blowing port 212 and the flow area of ​​the third sub-blowing port 213 can be made smaller than the flow area of ​​the first sub-blowing port 211. Correspondingly, the flow rate of the cooling gas purged by the first sub-blowing port 211 will be greater than that of the second sub-blowing port 212 and the third sub-blowing port 213. Therefore, the heat dissipation efficiency of the central area of ​​the object to be carried corresponding to the first sub-blowing port 211 will be improved, which is conducive to maintaining the consistency of the temperature of each area of ​​the object to be carried and avoiding the problems of warping and breakage.

[0029] like Figure 1 and Figure 2 As shown, the blowing device 200 includes an air inlet pipeline 220, the air inlet end of the air inlet pipeline 220 is used to connect to the gas source 300, the gas source 300 can be a compressed nitrogen tank, a compressed helium tank, etc., and the air outlet end of the air inlet pipeline 220 is provided with a blowing port 210, and the gas source 300 can blow cooling gas into the gas circulation space through the air inlet pipeline 220 and the blowing port 210. The air inlet pipeline 220 can be set on the surface of the manipulator body 100 and fixed by a structure such as a buckle; of course, the air inlet pipeline 220 can also be arranged inside the manipulator body 100 to avoid interference between the air inlet pipeline 220 and other parts of the manipulator body 100, and at the same time, it can also improve the consistency of the appearance of the manipulator body 100.

[0030] like Figure 1 and Figure 2As shown, since the air outlet 210 includes a first sub-air outlet 211, a second sub-air outlet 212 and a third sub-air outlet 213, correspondingly, the air intake pipeline 220 may include a first sub-pipeline 221, a second sub-pipeline 222 and a third sub-pipeline 223, and the first sub-pipeline 221, the second sub-pipeline 222 and the third sub-pipeline 223 are all arranged inside the manipulator body 100.

[0031] Among them, one end of the first sub-pipeline 221 is used to communicate with the gas source 300, and the other end of the first sub-pipeline 221 is provided with a first sub-air blowing port 211, one end of the second sub-pipeline 222 is used to communicate with the gas source 300, and the other end of the second sub-pipeline 222 is provided with a second sub-air blowing port 212, and one end of the third sub-pipeline 223 is used to communicate with the gas source 300, and the other end of the third sub-pipeline 223 is provided with a third sub-air blowing port 213. Through the corresponding cooperation between the above-mentioned sub-pipelines and the sub-air blowing ports 210, it is conducive to realizing the zoned control of parameters such as the temperature and flow rate of the cooling gas on the surface of the object to be carried.

[0032] In an optional embodiment of the present application, Figure 1 As shown, along the airflow direction, the cross-sectional areas of the first sub-pipeline 221, the second sub-pipeline 222 and the third sub-pipeline 223 gradually increase, so that the cooling gas provided by the gas source 300 can be evenly transmitted along the above-mentioned sub-pipelines to the corresponding sub-blowing ports 210, ensuring uniform distribution of the airflow at the blowing ports 210 and avoiding the occurrence of local jet phenomena.

[0033] like Figure 1 As shown, the blowing device 200 may further include a thermostat 230, which may be disposed between the first sub-pipeline 221 and the gas source 300 to adjust the temperature of the cooling gas purged by the first sub-blowing port 211; and / or, the thermostat 230 may be disposed between the second sub-pipeline 222 and the gas source 300 to adjust the temperature of the cooling gas purged by the second sub-blowing port 212; and / or, the thermostat 230 may be disposed between the third sub-pipeline 223 and the gas source 300 to adjust the temperature of the cooling gas purged by the third sub-blowing port 213. It should be noted that the thermostat 230 may be disposed inside the corresponding sub-pipeline, or the thermostat 230 itself has an air inlet and an air outlet, which are respectively connected to the gas source 300 and the corresponding sub-pipeline, and the cooling gas may be heated or cooled by the thermostat 230 when passing through the thermostat 230 to achieve temperature regulation of the cooling gas.

[0034] By setting the temperature controller 230 at the above position, the temperature of the cooling gas blown by the first sub-blowing port 211, the second sub-blowing port 212 and the third sub-blowing port 213 can be flexibly adjusted according to the temperature distribution of different areas of the object to be carried, so as to realize the temperature zoning control of the surface of the object to be carried. For example, when the temperature of the area opposite to the first area 121 of the surface of the object to be carried is relatively high, the temperature of the cooling gas blown by the first sub-blowing port 211 can be correspondingly reduced to achieve rapid cooling; when the temperature of the area opposite to the second area 122 of the surface of the object to be carried is relatively high, the temperature of the cooling gas blown by the second sub-blowing port 212 can be correspondingly reduced to achieve rapid cooling; similarly, when the temperature of the area opposite to the third area 123 of the surface of the object to be carried is relatively high, the temperature of the cooling gas blown by the third sub-blowing port 213 can be correspondingly reduced to achieve rapid cooling. For other areas of the object to be carried, the above-mentioned adjustment logic can also be referred to, and the embodiments of the present application will not be repeated here.

[0035] As for the temperature zoning control method of the surface of the object to be carried, it can also be achieved by controlling the flow rate of the cooling gas blown by the first sub-blowing port 211, the second sub-blowing port 212 and the third sub-blowing port 213. Specifically, the blowing device 200 can also include a flow controller 240, and the flow controller 240 can be arranged between the first sub-pipeline 221 and the gas source 300 to adjust the flow rate of the cooling gas blown by the first sub-blowing port 211; and / or, the flow controller 240 can be arranged between the second sub-pipeline 222 and the gas source 300 to adjust the flow rate of the cooling gas blown by the second sub-blowing port 212; and / or, the flow controller 240 can be arranged between the third sub-pipeline 223 and the gas source 300 to adjust the flow rate of the cooling gas blown by the third sub-blowing port 213. It should be noted that the flow controller 240 can be set inside the corresponding sub-pipeline, or the flow controller 240 itself has an air inlet end and an air outlet end, and the air inlet end and the air outlet end are respectively connected to the gas source 300 and the corresponding sub-pipeline. When the cooling gas passes through the flow controller 240, the flow rate can be adjusted.

[0036] By setting the flow controller 240 at the above position, the flow of cooling gas purged by the first sub-blowing port 211, the second sub-blowing port 212 and the third sub-blowing port 213 can be flexibly adjusted according to the temperature distribution of different areas of the object to be carried, so as to realize the temperature zoning control of the surface of the object to be carried. For example, when the temperature of the area opposite to the first area 121 of the surface of the object to be carried is relatively high, the flow of cooling gas purged by the first sub-blowing port 211 can be increased accordingly to realize rapid cooling; when the temperature of the area opposite to the second area 122 of the surface of the object to be carried is relatively high, the flow of cooling gas purged by the second sub-blowing port 212 can be increased accordingly to realize rapid cooling; similarly, when the temperature of the area opposite to the third area 123 of the surface of the object to be carried is relatively high, the flow of cooling gas purged by the third sub-blowing port 213 can be increased accordingly to realize rapid cooling. For other areas of the object to be carried, the above-mentioned adjustment logic can also be referred to, and the embodiments of the present application will not be repeated here.

[0037] like Figure 1 As shown, the film placing groove 120 is divided into a first area 121, a second area 122 and a third area 123, and the first area 121, the second area 122 and the third area 123 correspond to different areas of the surface of the object to be carried, respectively. A temperature sensor 250 can be set in at least one of the first area 121, the second area 122 and the third area 123, so that the temperature of different areas of the surface of the object to be carried can be detected, and the temperature data detected by the temperature sensor 250 can be used as the adjustment basis of the above-mentioned temperature controller 230 and the flow controller 240. Exemplarily, since the temperature difference in the central area of ​​the object to be carried is more obvious, three temperature sensors 250 can be set in the first area 121, and the three temperature sensors 250 are arranged at intervals along the radial direction of the film placing groove 120, and one temperature sensor 250 is set in each of the second area 122 and the third area 123.

[0038] It should be added that the manipulator disclosed in the embodiment of the present application may also include a control module, which may be electrically connected to the temperature sensor 250, the temperature controller 230 and the flow controller 240 respectively to form a feedback adjustment mechanism. For example, when the temperature sensor 250 detects that the surface of the object to be carried corresponding to the first area 121 has a high temperature, the control module may control the temperature controller 230 and / or the flow controller 240 corresponding to the first sub-blowing port 211 to perform corresponding actions according to the temperature data detected by the temperature sensor 250, so as to achieve rapid feedback adjustment.

[0039] Please refer to Figure 1 and Figure 2The embodiment of the present application also discloses a semiconductor transmission device. The disclosed semiconductor transmission device may include a robotic arm and the above-mentioned robotic arm. The robotic arm is connected to the robotic arm, and the robotic arm is used to drive the robotic arm to move to realize the transfer of the object to be carried.

[0040] From the above, it can be seen that the manipulator disclosed in the embodiment of the present application improves the relevant technology. By arranging a blowing device 200 on the manipulator body 100, when the object to be carried is placed on the supporting surface 111, the blowing port 210 of the blowing device 200 can form a negative pressure area for adsorbing the object to be carried in the gas flow space below the object to be carried, and the pressure difference on both sides of the object to be carried can be used to press the object to be carried on the supporting surface 111, thereby increasing the friction between the object to be carried and the manipulator body 100; and, the cooling gas blown by the blowing port 210 can also cool the object to be carried, further increasing the friction between the object to be carried and the manipulator body 100, thereby ensuring that when the manipulator runs at a large acceleration, the object to be carried is not prone to slippage or falling off, thereby improving the transmission efficiency and production capacity of the object to be carried.

[0041] The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different technical features between the various embodiments are not contradictory, they can be combined to form more specific embodiments. Considering the simplicity of the text, they will not be repeated here.

[0042] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A robot, characterized in that: It comprises a robot body (100) and an air blowing device (200); The robot body (100) is provided with a supporting surface (111) and a gas circulation space, the supporting surface (111) is used to support an object to be carried, and the gas circulation space is located below the object to be carried supported on the supporting surface (111); The blowing device (200) is arranged on the manipulator body (100), and the blowing device (200) has a blowing port (210). The blowing port (210) is used to blow cooling gas into the gas circulation space in a direction parallel to the supporting surface (111), so as to form a negative pressure area in the gas circulation space for adsorbing the object to be carried.

2. The robot according to claim 1, characterized in that: The robot body (100) comprises a carrier (110) with an arc-shaped structure, the supporting surface (111) is the top surface of the carrier (110), the area defined by the carrier (110) forms the gas circulation space, and the blowing port (210) is arranged on the inner side surface of the carrier (110).

3. The robot according to claim 2, characterized in that: The robot body (100) is provided with a sheet placing groove (120), the carrier (110) is arranged at the bottom of the sheet placing groove (120), along the depth direction of the sheet placing groove (120), the carrier (110) is lower than the groove side wall of the sheet placing groove (120), and the groove side wall of the sheet placing groove (120) is used to cooperate with the side limit of the object to be carried; The gas circulation space is located between the bottom of the sheet placing groove (120) and the object to be carried.

4. The robot according to claim 3, characterized in that: The arc-shaped structure is C-shaped, and the opening of the C-shaped structure is located on a side of the robot body (100) away from the blowing port (210).

5. The robot according to claim 4, characterized in that: The film placing groove (120) comprises a first area (121), a second area (122) and a third area (125), wherein the second area (122) and the third area (125) are respectively located on two sides of the first area (121); The air blowing port (210) comprises a first sub-air blowing port (211), a second sub-air blowing port (212) and a third sub-air blowing port (213); the first sub-air blowing port (211), the second sub-air blowing port (212) and the third sub-air blowing port (213) are respectively arranged on the inner side surface of the carrier (110) facing the C-shaped opening, and the second sub-air blowing port (212) and the third sub-air blowing port (213) are respectively located on both sides of the first sub-air blowing port (211); the first sub-air blowing port (211) faces the first area (121), the second sub-air blowing port (212) faces the second area (122), and the third sub-air blowing port (213) faces the third area (125).

6. The robot according to claim 5, characterized in that: The flow area of ​​the second sub-blowing port (212) and the flow area of ​​the third sub-blowing port (213) are both smaller than the flow area of ​​the first sub-blowing port (211).

7. The robot according to claim 5, characterized in that: The air blowing device (200) comprises an air inlet pipeline (220), wherein the air inlet pipeline (220) is arranged inside the manipulator body (100), the air inlet end of the air inlet pipeline (220) is used to connect to an air source (300), and the air outlet end of the air inlet pipeline (220) is provided with the air blowing port (210).

8. The robot according to claim 7, characterized in that: The air intake pipeline (220) comprises a first sub-pipeline (221), a second sub-pipeline (222) and a third sub-pipeline (223); the first sub-pipeline (221), the second sub-pipeline (222) and the third sub-pipeline (223) are all arranged inside the manipulator body (100); One end of the first sub-pipeline (221) is used for communicating with the gas source (300), and the other end of the first sub-pipeline (221) is provided with the first sub-air blowing port (211); one end of the second sub-pipeline (222) is used for communicating with the gas source (300), and the other end of the second sub-pipeline (222) is provided with the second sub-air blowing port (212); one end of the third sub-pipeline (223) is used for communicating with the gas source (300), and the other end of the third sub-pipeline (223) is provided with the third sub-air blowing port (213).

9. The robot according to claim 8, characterized in that: Along the airflow direction, the cross-sectional areas of the first sub-pipeline (221), the second sub-pipeline (222), and the third sub-pipeline (223) all gradually increase.

10. The robot according to claim 8, characterized in that: The air blowing device (200) further comprises a temperature controller (230), and the temperature controller (230) is provided at least one of between the first sub-pipeline (221) and the air source (300), between the second sub-pipeline (222) and the air source (300), and between the third sub-pipeline (223) and the air source (300).

11. The robot according to claim 8, characterized in that: The blowing device (200) further comprises a flow controller (240), and the flow controller (240) is provided in at least one of between the first sub-pipeline (221) and the gas source (300), between the second sub-pipeline (222) and the gas source (300), and between the third sub-pipeline (223) and the gas source (300).

12. The robot according to claim 5, characterized in that: The air blowing device (200) further comprises a temperature sensor (250), and at least one of the first area (121), the second area (122), and the third area (125) is provided with the temperature sensor (250).

13. A semiconductor transmission device, characterized in that: It comprises a mechanical arm and a manipulator as described in any one of claims 1 to 12 connected to the mechanical arm, wherein the mechanical arm is used to drive the manipulator to move.

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