Electronic component manufacturing equipment

Abstract

The invention relates to the technical field of electronic product production, in particular to electronic component manufacturing equipment. The device comprises a base structure, a chip is placed above the base structure, a pressing mold structure is arranged above the base structure, the pressing mold structure is connected with a resin extruder, resin carries out injection molding on the chip from bottom to top from the upper portion and the side face of the chip through the pressing mold structure, and a positioning structure is arranged below the pressing mold structure. And the chip is placed between the pressing die structure and the positioning structure. According to the invention, the air cylinder pushes the plurality of U-shaped positioning blocks to push the side wall of the chip from different directions at a constant speed, so that the chip slides to the position right below the mold, the gliding mold sleeves the chip, and the extruder injects molten resin into a gap between the chip and the mold from the feeding pipeline, so that plastic packaging of the chip is realized; in the process, the plurality of U-shaped positioning blocks push the chip at the same time, so that the distance between the die and the chip is more uniform, and the product quality is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product production, and in particular to electronic component manufacturing equipment. Background Art

[0002] There are many types of electronic components. Single devices such as resistors and capacitors are called basic devices, while chips integrate many basic devices into a very small circuit board, so they are also called integrated circuits. Chips are very small and are the most important part of electronic products, taking on the functions of calculation and storage. The complete process of chip production includes chip design, wafer production, packaging production, cost testing and other links. Among them, chip packaging is to install a shell outside the semiconductor integrated circuit chip, so as to place, fix, seal, protect and enhance the electrical and thermal performance of the chip. The packaging mainly includes the following processes: grinding, cutting, bonding, wire bonding, injection molding, etc. The injection molding process is to prevent the impact of the external environment. It uses EMC (epoxy resin) to encapsulate the rectangular chip with welded leads. In the injection molding process, only the top surface and the surrounding surfaces of the chip can be plastic-sealed, but the bottom surface of the chip cannot be plastic-sealed. The current injection molding method is generally: place the chip in the mold, and then inject the molten resin from the side of the mold. After the resin completely covers the top surface and the surrounding surfaces of the chip, cool it to form and solidify, and finally demold it. However, there are still the following defects in the injection molding process: the resin is injected from the side of the mold, which not only makes it easy for the resin to overflow to the bottom of the chip and produce overflow; and the resin can easily impact the leads of the chip near the injection port, so that the leads are offset and contacted under the action of the fluid, causing the wires to short-circuit, resulting in chip scrapping; and the product defect rate is increased. Summary of the invention

[0003] The object of the present invention is to provide an electronic component manufacturing device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, an electronic component manufacturing device is provided, including a base structure, a chip is placed above the base structure, a die structure is arranged above the base structure, the die structure is connected to a resin extruder, the resin is injected from the top and side of the chip from bottom to top through the die structure, when the bottom of the chip is injected, the die structure preliminarily cools the resin at the bottom, a positioning structure is arranged below the die structure, the chip is placed between the die structure and the positioning structure, the positioning structure pushes the side wall of the chip from different directions, so that the chip slides to the bottom of the die structure, and the positioning structure controls the airflow inside the die structure when sliding, so that when the resin is injected above the chip, the gas stops being discharged from the inside of the die structure to the outside.

[0005] As a further improvement of the present technical solution, the positioning structure includes a plurality of U-shaped positioning blocks, the base structure includes a placement platform, the chip is placed above the placement platform, and the plurality of U-shaped positioning blocks slide above the placement platform and push the chip toward the center of the placement platform.

[0006] As a further improvement of the present technical solution, the die structure includes a mold, which is sleeved above the chip. The top of the mold is connected to an extrusion resin extruder through a feed pipe. The resin is injected into the gap between the mold and the top surface and side wall of the chip through the feed pipe. A cavity is provided at the bottom of the mold. The cavity is connected to the outside world through a number of air outlets opened above the mold. When the U-shaped positioning block slides, it controls the opening and closing of the air outlet, thereby controlling the air flow inside the cavity.

[0007] As a further improvement of the present technical solution, a plurality of cranks are arranged on the side walls of the mold, and the middle section of the crank is hingedly mounted on the side walls of the mold through two fixed seats, and one end of the crank close to the U-shaped positioning block is fixedly connected to a pressure plate, and the pressure plate is arranged between the U-shaped positioning block and the mold, and the other end of the crank is fixedly connected to a baffle, and the baffle is arranged above the air outlet, and the U-shaped positioning block squeezes the pressure plate to make the crank swing and thereby drive the baffle to swing above the air outlet, and a torsion spring is fixedly connected to the side wall of the crank inside the fixed seat, and the torsion spring pushes the baffle downward to the air outlet through the crank, thereby controlling the air flow rate in the cavity.

[0008] As a further improvement of the technical solution, a plurality of fins are fixedly installed on the bottom inner wall of the mold, a turbofan is fixedly installed on the side wall of the mold, an air outlet of the turbofan is connected to the cavity inside the mold, and the turbofan blows air into the cavity.

[0009] As a further improvement of the technical solution, a plurality of sliding rods are fixedly installed above the placing platform, a plurality of connecting columns are fixedly connected above the mold, an upper slide is fixedly connected to the top of the connecting column, the upper slide sliding sleeve is slidably mounted on a plurality of sliding rods, and the sliding of the upper slide drives the mold sliding sleeve to be mounted above the chip.

[0010] As a further improvement of the present technical solution, a notch is provided on the side of the U-shaped positioning block close to the chip, a sliding groove is provided on the side wall below the notch, and a plurality of sliding blocks are fixedly installed below the placement platform. The U-shaped positioning block slides on the placement platform by engaging the sliding blocks through the sliding grooves.

[0011] As a further improvement of the present technical solution, a bracket is fixedly connected to the bottom of the placement platform, a plurality of pneumatic rods are installed at the bottom of the bracket, a sliding platform is fixedly connected to the upper end of the pneumatic rods, the sliding platform is arranged in a cross shape, and the sliding platform is hinged to the U-shaped positioning block through a plurality of connecting rods.

[0012] As a further improvement of the present technical solution, a cylinder is fixedly connected to the lower side of the placing platform, a piston rod of the cylinder is fixedly connected to the center of the sliding platform, the cylinder pushes the sliding platform to move up and down, and the sliding platform drives several U-shaped positioning blocks to slide through several connecting rods.

[0013] As a further improvement of the technical solution, a plurality of air guide plates are fixedly installed in the cavity, and the air guide plates are arranged in an L shape. The air guide plates guide the airflow blown out by the turbofan so that the airflow flows from the surface of the fins.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. In the electronic component manufacturing equipment, a plurality of U-shaped positioning blocks are pushed by a cylinder to push the side wall of the chip at a uniform speed from different directions, so that the chip slides to the bottom of the mold. The mold sleeve is set above the chip, and the extruder injects the molten resin from the feed pipe into the gap between the chip and the mold to achieve the plastic sealing of the chip. In this process, since a plurality of U-shaped positioning blocks push the chip at the same time, the distance between the mold and the chip is more uniform, and the thickness of the solidified resin layer is more uniform, thereby improving the product quality.

[0016] 2. In the electronic component manufacturing equipment, a turbo fan continuously blows cold air into the cavity, so that the heat in the cavity at the bottom of the mold can be effectively dissipated into the air, thereby slightly solidifying the molten resin near the bottom of the chip, reducing the fluidity of the resin, and avoiding this part of the resin overflowing to the bottom of the chip during the subsequent injection molding of the top surface of the chip, thereby improving the product qualification rate.

[0017] 3. In the electronic component manufacturing equipment, when the molten resin is injected to the same level as the top surface of the chip, the cylinder is used to push a plurality of U-shaped positioning blocks to slide again, so that the U-shaped positioning blocks squeeze the pressure plate, and then the baffle is driven away from the air outlet by the swinging crank, so that the air flow in the cavity forms a circulation with the outside, effectively improving the cooling efficiency of the bottom resin. When the molten resin is injected to a level higher than the top surface of the chip, the cylinder is used to drive a plurality of U-shaped positioning blocks to slide, so that the U-shaped positioning blocks are away from the pressure plate, and then the baffle is moved close to the air outlet by the torsion spring, so as to avoid the rapid loss of heat in the cavity, which helps to improve the quality of the formed product while also effectively reducing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is one of the overall structural schematic diagrams of the present invention;

[0019] Figure 2 This is the second schematic diagram of the overall structure of the present invention;

[0020] Figure 3 This is the third schematic diagram of the overall structure of the present invention;

[0021] Figure 4 It is a schematic diagram of the base structure of the present invention;

[0022] Figure 5 This is one of the schematic diagrams of the positioning structure of the present invention;

[0023] Figure 6 This is the second schematic diagram of the positioning structure of the present invention;

[0024] Figure 7 It is an overall schematic diagram of the die structure of the present invention;

[0025] Figure 8 It is a schematic cross-sectional view of the die structure of the present invention;

[0026] Fig. 9 It is a schematic diagram of the mold structure of the present invention;

[0027] Fig.10 It is a schematic diagram of the mold structure flipping of the present invention;

[0028] Fig.11 It is an enlarged schematic diagram of the structure at A of the present invention;

[0029] Fig.12 It is an enlarged schematic diagram of the structure at B of the present invention;

[0030] Fig.13 It is an enlarged schematic diagram of the structure at position C of the present invention.

[0031] The meaning of each number in the figure is:

[0032] 1. Base structure; 11. Bracket; 12. Sliding rod; 13. Gas pressure rod; 14. Sliding block; 15. Placing platform;

[0033] 2. Die structure; 21. Upper slide plate; 22. Connecting column; 23. Feeding pipe; 24. Mold; 241. Fin; 242. Air guide plate; 243. Air outlet; 25. Turbofan; 26. Crank; 261. Fixed seat; 262. Press plate; 263. Baffle; 3. Positioning structure; 31. Sliding platform; 32. Connecting rod; 33. U-shaped positioning block; 34. Cylinder. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0036] Example 1

[0037] See also Figure 1-Figure 13As shown, the purpose of this embodiment is to provide an electronic component manufacturing equipment, including a base structure 1, a chip is placed on the top of the base structure 1, and a die structure 2 is arranged on the top of the base structure 1. The die structure 2 is used to position the chip to ensure that the chip maintains the correct position and direction during the injection molding process. The die structure 2 is connected to a resin extruder, and the resin extruder is responsible for conveying the molten plastic material to the die structure 2. The resin is injected from the top and side of the chip from bottom to top through the die structure 2. The die structure 2 is used to prevent the resin from being injected into the bottom of the chip. The injection of the resin into the bottom of the chip may cause molding defects, such as incomplete microchannel replication, surface ripples, flash, warping and deformation, etc. These problems can be effectively avoided by setting the die structure 2. When the bottom of the chip is injected, the die structure 2 preliminarily cools the resin at the bottom, so that the resin at the bottom is preliminarily solidified, reducing the fluidity of the bottom resin, and avoiding that when the top of the chip is subsequently injected, the molten resin is squeezed to the bottom of the chip under the extrusion pressure of the extruder, thereby ensuring In order to ensure the quality and performance of the manufactured chip, a positioning structure 3 is arranged below the die structure 2, and the chip is placed between the die structure 2 and the positioning structure 3. The positioning structure 3 pushes the side wall of the chip from four different directions to make the chip slide to the bottom of the die structure 2, so as to ensure that the chip will not be damaged during the sliding process, and at the same time ensure that the chip maintains the correct position and direction during the injection molding process, effectively improving the accuracy of injection molding. The positioning structure 3 controls the airflow inside the die structure 2 when sliding, so that when the resin is injected above the chip, the gas stops being discharged from the inside of the die structure 2 to the outside, and the temperature of the die structure 2 is controlled by controlling the loss rate of the hot air flow inside the die structure 2. Temperature control helps to ensure the temperature uniformity of the entire hot runner system, thereby ensuring uniform filling of resin and back pressure conditions in the cavity of the die structure 2, as well as uniform quality of the molded product. If the temperature control is not good, the performance of the resin will deteriorate and the quality of the molded chip will be affected; at the same time, by converting the traditional temperature control system to a more efficient solution, energy consumption and water consumption can be significantly reduced, while improving productivity and reducing scrap rate.

[0038] The positioning structure 3 includes a plurality of U-shaped positioning blocks 33, and the base structure 1 includes a placement platform 15. The chip is placed above the placement platform 15. The plurality of U-shaped positioning blocks 33 slide above the placement platform 15 and push the chip toward the center of the platform 15. This design enables the chip to be accurately positioned at the center of the placement platform 15 before injection molding, ensuring that the injection molding resin can flow evenly around the chip, so that the manufactured chip is wrapped with resin of uniform thickness, thereby improving the accuracy of injection molding and the qualified rate of the product. At the same time, the manual calibration process can be omitted, effectively improving the manufacturing efficiency of the equipment.

[0039] The die structure 2 includes a die 24, which is sleeved on the top of the chip to ensure that the resin can be injected from the top and side of the chip to form a uniform resin layer, which helps to improve the qualified rate of the product. The top of the die 24 is connected to the extrusion resin extruder through the feeding pipe 23, and the resin is injected into the gap between the die 24 and the top surface and side wall of the chip through the feeding pipe 23. The bottom of the die 24 is provided with a cavity, and the cavity is connected to the outside through a plurality of air outlets 243 opened on the top of the die 24. The hot air flow inside the cavity flows into the outside air through the air outlet 243. In this process, the heat at the bottom of the die 24 is dissipated into the air, thereby reducing the temperature at the bottom of the die 24, which helps to speed up the die 24. The solidification speed of the molten resin between the top surface of the chip and the bottom of the chip reduces the fluidity of the molten resin at the bottom of the mold 24 when the top surface of the chip is injection molded, thereby preventing the molten resin from being squeezed to the bottom of the chip due to continuous pressure when the extruder continues to inject the top of the chip, thereby ensuring the quality and performance of the manufactured chip. The U-shaped positioning block 33 controls the switch of the air outlet 243 when sliding, and then controls the air flow inside the cavity. When the top surface of the chip is injection molded, the air outlet 243 is closed, thereby ensuring that when the top surface of the chip is injection molded, the molten resin between the top surface of the chip and the top wall of the mold 24 will not solidify too quickly, ensuring that the injection resin can flow evenly around the chip, thereby improving the quality of the produced chips.

[0040] A plurality of cranks 26 are provided on the side wall of the mold 24. The plurality of cranks 26 that can swing are used to control whether the air outlet 243 is connected to the outside world, thereby controlling the temperature of the mold 24 during different injection molding processes, thereby preventing the molten resin from being squeezed to the bottom of the chip due to excessive pressure, thereby ensuring the quality of the product. The middle section of the crank 26 is hingedly mounted on the side wall of the mold 24 through two fixing seats 261. A torsion spring is fixedly connected to the side wall of the crank 26 inside the fixing seat 261. The torsion spring pushes the baffle through the crank 26. 263 moves downward close to the air outlet 243, and the torsion spring is provided to provide a restoring force to ensure that the baffle 263 can return to its original position after swinging, while maintaining a certain pressure, thereby avoiding excessive air flow velocity in the cavity, achieving precise control of the temperature of the mold 24, ensuring the temperature uniformity of the resin during the injection molding process, thereby improving the quality and consistency of the chip. The end of the crank 26 close to the U-shaped positioning block 33 is fixedly connected to a pressing plate 262, which drives the crank 26 to swing by squeezing the pressing plate 262 to control the air outlet. The switch of 243, the pressing plate 262 is arranged between the U-shaped positioning block 33 and the mold 24, the other end of the crank 26 is fixedly connected with a baffle 263, and the baffle 263 is arranged above the air outlet 243. The U-shaped positioning block 33 squeezes the pressing plate 262, so that the crank 26 swings and drives the baffle 263 to swing above the air outlet 243. When the molten resin is injected into the bottom of the chip, the baffle 263 approaches and blocks the air outlet 243, so as to avoid the uneven resin flow caused by the low temperature in the cavity, which affects the quality of the chip. , and can effectively save energy at the same time; when the molten resin is injected to the same level as the top surface of the chip, the baffle 263 is away from the outlet 243, so that the air flow in the outlet 243 remains unobstructed, so that the molten resin at the bottom can be initially cooled, and the molten resin is prevented from overflowing to the bottom of the chip when the top surface of the chip is subsequently injection molded, thereby ensuring the quality of the chip; when the top of the chip is subsequently injection molded, the baffle 263 is close to and blocks the outlet 243, thereby ensuring the fluidity of the molten resin and improving the qualified rate of the product.

[0041] A plurality of fins 241 are fixedly mounted on the inner side wall of the bottom of the mold 24. The fins 241 increase the surface area of ​​heat dissipation to improve the heat dissipation efficiency. A larger surface area means that more heat can be dissipated from the surface of the fins 241 by convection and radiation. A turbofan 25 is fixedly mounted on the side wall of the mold 24. When the blades of the turbofan 25 are working, the rotation of the blades will drive the flow of surrounding air to form forced convection. This forced convection can speed up the heat exchange speed between the air and the heat sink or heat source, thereby effectively dissipating the heat. The heat is taken away from the heat source and dissipated into the surrounding environment. The air outlet of the turbofan 25 is connected with the cavity inside the mold 24. The turbofan 25 blows air into the cavity, thereby quickly reducing the temperature in the cavity and preventing the molten resin from overflowing to the bottom of the chip. A number of air guide plates 242 are fixedly installed in the cavity. The air guide plates 242 are set in an L shape. The air guide plates 242 guide the airflow blown out by the turbofan 25, so that the airflow flows from the surface of the fin 241, so that the cold airflow blown out by the turbofan 25 can contact the fin 241 more effectively, thereby improving the cooling efficiency.

[0042] A plurality of slide bars 12 are fixedly installed above the placement platform 15, a plurality of connecting columns 22 are fixedly connected above the mold 24, an upper slide plate 21 is fixedly connected to the top of the connecting column 22, and the upper slide plate 21 is slidably sleeved on the plurality of slide bars 12. The sliding of the upper slide plate 21 drives the mold 24 to slide over the chip, so that the mold 24 can slide precisely along the slide bars 12, thereby making the distance between the inner wall of the mold 24 and the top surface and side wall of the chip more uniform, which is of great significance for improving the quality and output of chip packaging.

[0043] A notch is provided on the side of the U-shaped positioning block 33 close to the chip, and a slide groove is provided on the side wall below the notch. A plurality of sliders 14 are fixedly installed below the placement platform 15. The U-shaped positioning block 33 slides on the placement platform 15 by engaging the sliders 14 through the slide groove. By limiting the moving range of the U-shaped positioning block 33, equipment damage and accidents are prevented, and the equipment is ensured to work in the correct position. Through such an arrangement, the surface of the placement platform 15 is kept intact, avoiding burrs on the surface of the product during injection molding, thereby eliminating the subsequent manual burr removal process and improving the company's production efficiency.

[0044] A bracket 11 is fixedly connected to the bottom of the placement platform 15, and a plurality of pneumatic rods 13 are installed at the bottom of the bracket 11. The upper end of the pneumatic rod 13 is fixedly connected to a sliding platform 31. The sliding platform 31 is supported from different directions by the plurality of pneumatic rods 13, so as to avoid the sliding platform 31 from tilting when positioning the chip, which helps to improve the stability of the equipment and the quality of the product. The sliding platform 31 is set in a cross shape, and the sliding platform 31 is hinged with the U-shaped positioning block 33 through a plurality of connecting rods 32. The sliding platform 31 drives a plurality of U-shaped positioning blocks at the same time. The block 33 slides, so that the several U-shaped positioning blocks 33 maintain synchronization when sliding, and the chip can be positioned more accurately. The lower side of the placement platform 15 is fixedly connected with a cylinder 34, and the piston rod of the cylinder 34 is fixedly connected to the center of the sliding platform 31. The sliding platform 31 is pushed up and down by the cylinder 34, and the sliding platform 31 drives the several U-shaped positioning blocks 33 to slide through several connecting rods 32, thereby making the several U-shaped positioning blocks 33 slide synchronously on the placement platform 15, thereby realizing the precise positioning of the chip and the control of the airflow in the air outlet 243.

[0045] When this embodiment is used, the chip is placed on the placement platform 15, and the cylinder 34 pushes several U-shaped positioning blocks 33 to push the side wall of the chip at a uniform speed from different directions, so that the chip slides to the bottom of the mold 24, and the mold 24 is set on the top of the chip. The extruder injects molten resin from the feed pipe 23 into the gap between the chip and the mold 24 to achieve plastic sealing of the chip. In this process, since several U-shaped positioning blocks 33 push the chip at the same time, the distance between the mold 24 and the chip is more uniform, and the thickness of the solidified resin layer is also more uniform, thereby improving the product quality; the turbo fan 25 continuously blows cold air into the cavity, so that the heat in the cavity at the bottom of the mold 24 can be effectively dissipated into the air, so that the molten resin near the bottom of the chip is slightly solidified, reducing the resin The fluidity is improved to prevent this part of the resin from overflowing to the bottom of the chip when the top surface of the chip is subsequently injected, thereby improving the qualified rate of the product; when the molten resin is injected to the same level as the top surface of the chip, the cylinder 34 is used to push a plurality of U-shaped positioning blocks 33 to slide again, so that the U-shaped positioning blocks 33 squeeze the pressure plate 262, and then the swinging crank 26 drives the baffle 263 away from the air outlet 243 so that the air flow in the cavity forms a circulation with the outside world, effectively improving the cooling efficiency of the bottom resin, and when the molten resin is injected to and above the top surface of the chip, the cylinder 34 drives a plurality of U-shaped positioning blocks 33 to slide, so that the U-shaped positioning blocks 33 are away from the pressure plate 262, and then the torsion spring is used to make the baffle 263 close to the air outlet 243, thereby preventing the heat in the cavity from being lost quickly, which is helpful to improve the quality of the formed product while also effectively reducing the energy consumption.

[0046] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An electronic component manufacturing device, comprising a base structure (1), a chip is placed on the base structure (1), and is characterized in that: A die structure (2) is arranged above the base structure (1), and the die structure (2) is connected to a resin extruder. The resin is injected from the top and side of the chip from bottom to top through the die structure (2). When the bottom of the chip is injected, the die structure (2) performs preliminary cooling on the resin at the bottom. A positioning structure (3) is arranged below the die structure (2). The chip is placed between the die structure (2) and the positioning structure (3). The positioning structure (3) pushes the side wall of the chip from different directions so that the chip slides to the bottom of the die structure (2). The positioning structure (3) controls the airflow inside the die structure (2) when sliding, so that when the resin is injected above the chip, the gas stops being discharged from the inside of the die structure (2).

2. The electronic component manufacturing equipment according to claim 1, characterized in that: The positioning structure (3) comprises a plurality of U-shaped positioning blocks (33); the base structure (1) comprises a placement platform (15); the chip is placed above the placement platform (15); the plurality of U-shaped positioning blocks (33) slide above the placement platform (15) and push the chip toward the center of the placement platform (15).

3. The electronic component manufacturing equipment according to claim 2, characterized in that: The die structure (2) comprises a die (24), wherein the die (24) is sleeved on the top of the chip, and the top of the die (24) is connected to an extruder for extruding resin via a feed pipe (23), and resin is injected into the gap between the die (24) and the top surface and side wall of the chip via the feed pipe (23). A cavity is provided at the bottom of the die (24), and the cavity is connected to the outside world via a plurality of air outlets (243) provided on the top of the die (24). When the U-shaped positioning block (33) slides, it controls the opening and closing of the air outlet (243), thereby controlling the flow of air inside the cavity.

4. The electronic component manufacturing equipment according to claim 3, characterized in that: A plurality of cranks (26) are arranged on the side wall of the mold (24); the middle section of the crank (26) is hingedly mounted on the side wall of the mold (24) via two fixing seats (261); one end of the crank (26) close to the U-shaped positioning block (33) is fixedly connected to a pressure plate (262); the pressure plate (262) is arranged between the U-shaped positioning block (33) and the mold (24); the other end of the crank (26) is fixedly connected to a baffle (263); The baffle (263) is arranged above the air outlet (243); the U-shaped positioning block (33) presses the pressure plate (262), causing the crank (26) to swing and thereby driving the baffle (263) to swing above the air outlet (243); a torsion spring is fixedly connected to the side wall of the crank (26) inside the fixed seat (261); the torsion spring pushes the baffle (263) downward toward the air outlet (243) through the crank (26), thereby controlling the air flow rate in the cavity.

5. The electronic component manufacturing equipment according to claim 3, characterized in that: A plurality of fins (241) are fixedly mounted on the inner side wall of the bottom of the mold (24), a turbofan (25) is fixedly mounted on the side wall of the mold (24), an air outlet of the turbofan (25) is connected to the cavity inside the mold (24), and the turbofan (25) blows air into the cavity.

6. The electronic component manufacturing equipment according to claim 3, characterized in that: A plurality of slide bars (12) are fixedly installed above the placement platform (15), a plurality of connection columns (22) are fixedly connected above the mold (24), an upper slide plate (21) is fixedly connected to the top of the connection column (22), and the upper slide plate (21) is slidably sleeved on the plurality of slide bars (12), and the upper slide plate (21) slides to drive the mold (24) to slide above the chip.

7. The electronic component manufacturing equipment according to claim 2, characterized in that: A notch is provided on a side of the U-shaped positioning block (33) close to the chip, a sliding groove is provided on the side wall below the notch, a plurality of sliding blocks (14) are fixedly installed below the placement platform (15), and the U-shaped positioning block (33) slides on the placement platform (15) by engaging the sliding blocks (14) through the sliding grooves.

8. The electronic component manufacturing equipment according to claim 2, characterized in that: A bracket (11) is fixedly connected below the placement platform (15), a plurality of pneumatic rods (13) are installed at the bottom of the bracket (11), a sliding platform (31) is fixedly connected to the upper end of the pneumatic rod (13), the sliding platform (31) is arranged in a cross shape, and the sliding platform (31) is hinged to a U-shaped positioning block (33) via a plurality of connecting rods (32).

9. The electronic component manufacturing equipment according to claim 8, characterized in that: A cylinder (34) is fixedly connected to the lower side of the placement platform (15); a piston rod of the cylinder (34) is fixedly connected to the center of the sliding platform (31); the cylinder (34) pushes the sliding platform (31) to move up and down; and the sliding platform (31) drives a plurality of U-shaped positioning blocks (33) to slide via a plurality of connecting rods (32).

10. The electronic component manufacturing equipment according to claim 5, characterized in that: A plurality of air guide plates (242) are fixedly installed in the cavity. The air guide plates (242) are arranged in an L shape. The air guide plates (242) guide the airflow blown out by the turbo fan (25) so that the airflow flows from the surface of the fin (241).

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