An electronic component solder paste printing device

Abstract

A solder paste printing device for electronic components belongs to the technical field of electronic component production and processing equipment. The present invention includes a shell, a steel mesh is fixedly connected to the inside of the shell, and a fixed slide rod is fixedly connected to the top of the steel mesh, a slide groove is provided on the side wall of the steel mesh, and a feeding mechanism is provided on the outer wall of the fixed slide rod to stir the solder paste and automatically feed it during printing, a scraper mechanism is provided on the inner wall of the slide groove to automatically recycle the solder paste during printing, and a storage mechanism is provided on the top of the steel mesh to seal and store the solder paste when it is recycled. The sealing block is slidably squeezed by the feeding box to release the seal of the feeding slot, thereby realizing automatic feeding, avoiding placing a large amount of solder paste in the processing area at one time, and reducing the risk of oxidation or deterioration caused by long-term exposure of the solder paste to the air, thereby ensuring the effect of electronic component printing.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component production and processing equipment, and particularly relates to a solder paste printing device for electronic components. Background Art

[0002] Printed circuit boards (PCBs) in electronic products generally have many electronic components configured thereon, such as chips, resistors, capacitors, and inductors, etc., in order to form a circuit with specific functions; therefore, multiple welding points for welding the above-mentioned electronic components will be provided on the PCB. In order to obtain a better welding effect and improve the welding efficiency, before welding the above-mentioned electronic components, a layer of material that can assist welding will first be applied to the welding points of the PCB, and this auxiliary welding material generally selects solder paste.

[0003] Solder paste, a gray paste, is a new type of welding material that emerged along with SMT. It is a paste-like mixture formed by mixing solder powder, flux, and other surfactants, thixotropic agents, etc., and is mainly used for welding electronic components such as surface resistors, capacitors, and ICs on PCBs in the SMT industry. Currently, most of the solder paste feeding is carried out manually.

[0004] Generally, the change in the viscosity of solder paste will also affect the printing quality of solder paste. For example, the viscosity of solder paste will change due to the influence of temperature. During the solder paste printing process, the solder paste is mostly extruded through an extrusion nozzle that moves back and forth and then leveled by a squeegee. When feeding the solder paste, if the extrusion amount is large, a considerable part of the solder paste will not be fully utilized, and multiple printing operations are required to complete its use. However, after the solder paste has been in contact with the air for a long time, long-term placement may cause the solder paste to deteriorate or be contaminated, such as contact with dust, moisture, or other pollutants in the air, which will reduce the welding effect of the solder paste and also affect the solder paste printing effect of the next electronic component. If a small amount of solder paste is added each time, but it will increase the number of times of stopping the machine for feeding, affecting the work efficiency. Summary of the Invention

[0005] The purpose of the present invention is to solve the problem that the solder paste has been placed for too long after feeding in the prior art, and to propose a solder paste printing device for electronic components.

[0006] To achieve the above purpose, the present invention adopts the following technical scheme: A solder paste printing device for electronic components, including a housing, a steel mesh is fixedly connected inside the housing, and a fixed sliding rod is fixedly connected to the top of the steel mesh, and a chute is opened on the side wall of the steel mesh;

[0007] A feeding mechanism is arranged on the outer wall of the fixed sliding rod to stir the solder paste and automatically feed the solder paste during the printing work;

[0008] A scraping mechanism is provided on the inner wall of the chute to automatically recover the solder paste during printing work;

[0009] A storage mechanism is provided on the top of the stencil to seal and store the solder paste when recovering the solder paste.

[0010] Furthermore, the feeding mechanism includes a feeding box, and an inclined chute rod is fixedly connected to the inner wall of the feeding box. The inclined chute rod is threadedly connected to a stirring blade, and the top of the stirring blade is rotatably connected to a connecting plate. The top of the connecting plate is fixedly connected to a connecting rod, and the top of the connecting rod is fixedly connected to a pressing plate. A pressing groove is formed in the top of the feeding box. A feeding groove is formed through the bottom of the feeding box, and a sealing block is slidably connected to the inner wall of the feeding groove. The top of the sealing block is fixedly connected to a second spring, and the end of the second spring away from the sealing block is fixedly connected to the inner wall of the feeding box.

[0011] Furthermore, both ends of the feeding box are slidably connected to the outer walls of the corresponding fixed sliding rods. The inside of the connecting plate is slidably penetrated through the outer wall of the inclined chute rod. The outer wall of the connecting rod is slidably penetrated through the top of the feeding box. The bottom of the pressing plate corresponds to the inner wall of the pressing groove.

[0012] Furthermore, the scraping mechanism includes a connecting block, and a recovery scraper is hinged to one side of the connecting block. A coating scraper is hinged to the other side of the connecting block, and a first pulling rope is fixedly connected through the inside of the connecting block. A winding assembly is fixedly installed on the top of the stencil. One end of the first pulling rope is fixedly connected to the output shaft of the winding assembly. A fixed block is fixedly connected to the top of the stencil, and a rotating rod is rotatably connected through the inner wall of the fixed block. The end of the first pulling rope away from the winding assembly is wound around the outer wall of the rotating rod, and a second pulling rope is wound around the outer wall of the rotating rod.

[0013] Furthermore, the end of the recovery scraper is slidably connected to the inner wall of the chute, and the bottom of the recovery scraper is slidably connected to the top of the stencil. The end of the coating scraper is slidably connected to the inner wall of the chute, and the bottom of the coating scraper is slidably connected to the top of the stencil. The end of the second pulling rope away from the rotating rod is fixedly connected to the outer wall of the feeding box.

[0014] Furthermore, a convex block is slidably connected to the inner wall of the chute, and one end of the convex block is fixedly connected to a first spring. The end of the first spring away from the convex block is fixedly connected to the inside of the stencil. The outer wall of the convex block corresponds to the side wall of the recovery scraper, and the outer wall of the convex block corresponds to the side wall of the coating scraper.

[0015] Furthermore, the storage mechanism includes a sliding plate and a first mounting bracket. A sealing plate is slidably connected to the inner wall of the sliding plate, and a third spring is fixedly connected to the side wall of the sealing plate. The end of the third spring away from the sealing plate is fixedly connected inside the sliding plate. A first rack is fixedly connected to the top of the sliding plate. A second mounting bracket is fixedly connected to the top of the steel mesh, and a gear is rotatably connected to the outer wall of the second mounting bracket. The inner wall of the teeth of the gear is matched and meshed with the inner wall of the tooth groove of the first rack. A tension spring is fixedly connected to the side wall of the first mounting bracket, and a second rack is fixedly connected to the end of the tension spring away from the first mounting bracket. The inner wall of the teeth of the gear is matched and meshed with the inner wall of the tooth groove of the second rack. A pressing plate is fixedly connected to the side wall of the second rack, and a storage box is fixedly connected to the side wall of the steel mesh.

[0016] Furthermore, the side wall of the sliding plate is slidably connected to the side wall of the steel mesh, and the inside of the storage box is communicated with the inside of the steel mesh.

[0017] Furthermore, an electric push rod is fixedly installed on the top of the housing, and the output shaft of the electric push rod is fixedly connected to the top of the pressing plate. A conveying component is fixedly installed on the inner wall of the housing, and a linear conveying component is fixedly installed on the side wall of the housing.

[0018] Compared with the prior art, the above solution has the following beneficial effects:

[0019] 1. When the feeding box slides downward, the sealing block will be squeezed and slide into the feeding groove. At this time, since the sealing block no longer seals the feeding groove, the solder paste inside the feeding box will flow downward through the inside of the feeding groove and then flow to the processing area on the surface of the steel mesh. Thus, before printing electronic components, it can automatically feed materials in the processing area, avoiding placing a large amount of solder paste in the processing area at one time and being exposed to the air for a long time, which may cause oxidation or deterioration and affect the printing effect.

[0020] 2. During the downward movement of the stirring blade, it will rotate along the outer wall of the inclined chute rod, and at the same time drive the movement of its blades. Thus, before each printing of electronic components, it can stir the solder paste inside the feeding box. Stirring the solder paste can keep the solder in good fluidity and viscosity, ensuring that the electronic components can be accurately and firmly pasted on the circuit board.

[0021] 3. The force that stretches the rotating rod through the spiral spring drives the recovery scraper to slide to the left. During this process, the excess solder paste adsorbed on the surface of the stencil after printing is scraped, achieving the automatic scraping of the residual solder paste on the stencil surface after each printing operation. Then, when the feeding mechanism contacts the surface of the stencil, the feeding operation for the next printing work is carried out at this time, thus realizing the scraping of the residual solder paste from the previous time, avoiding the mixing of the residual solder paste with the newly fed solder paste, thereby reducing the effect of solder paste printing. By recovering the solder paste on the stencil, the interruption time for cleaning the stencil during the printing process can be effectively reduced, and the production efficiency can be improved.

[0022] 4. After the sliding plate slides upward, the recovery scraper drives the solder paste into the interior of the sliding plate, thus realizing the collection of the solder paste. Then, when the feeding box stops moving after the collection is completed, the tension spring will reset at this time, causing the gear to drive the first rack to move downward, and then the first rack drives the sealing plate to move downward. Then, through the release of the elastic force of the third spring, it can be engaged at the entrance of the storage box, thereby making the internal space of the storage box in a sealed state, avoiding oxidation or deterioration caused by long-term exposure to the air, being conducive to the recovery and storage of the solder paste. The recovered solder paste can be reused after being processed, reducing waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of the overall structure proposed by the present invention;

[0024] Figure 2 is a sectional view of the overall structure proposed by the present invention;

[0025] Figure 3 is a schematic diagram of the first part of the structure of the feeding mechanism proposed by the present invention;

[0026] Figure 4 is a sectional view of the second part of the structure of the feeding mechanism proposed by the present invention;

[0027] Figure 5 is a schematic diagram of the first part of the structure of the scraper mechanism proposed by the present invention;

[0028] Figure 6 is a sectional view of the second part of the structure of the scraper mechanism proposed by the present invention;

[0029] Figure 7 is a sectional view of the local structure proposed by the present invention;

[0030] Figure 8 is a sectional view of the first part of the structure of the storage mechanism proposed by the present invention;

[0031] Figure 9 is a sectional view of the second part of the structure of the storage mechanism proposed by the present invention.

[0032] The reference signs in the drawings are: 1, housing; 2, steel mesh; 3, fixed slide bar; 4, feeding mechanism; 5, chute; 6, scraping mechanism; 7, storage mechanism; 8, bump; 9, first spring; 10, electric push rod; 11, conveying assembly; 12, linear conveying assembly; 401, feeding box; 402, inclined chute rod; 403, stirring blade; 404, connecting plate; 405, connecting rod; 406, pressing plate; 407, pressing groove; 408, feeding chute; 409, sealing block; 410, second spring; 601, connecting block; 602, recycling scraper; 603, coating scraper; 604, first pulling rope; 605, winding assembly; 606, fixed block; 607, rotating rod; 608, second pulling rope; 701, sliding plate; 702, first mounting bracket; 703, sealing plate; 704, third spring; 705, first rack; 706, tension spring; 707, second rack; 708, abutting plate; 709, second mounting bracket; 710, gear; 711, storage box. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0034] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "top surface", "bottom surface", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated position or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not require or imply any actual relationship, order or relative importance between these entities or operations.

[0035] Example 1, please refer to Figures 1-4 , an electronic component solder paste printing device, including a housing 1, a steel mesh 2 is fixedly connected inside the housing 1, and a fixed slide bar 3 is fixedly connected to the top of the steel mesh 2. A chute 5 is opened on the side wall of the steel mesh 2. An electric push rod 10 is fixedly installed on the top of the housing 1, a conveying assembly 11 is fixedly installed on the inner wall of the housing 1, and a linear conveying assembly 12 is fixedly installed on the side wall of the housing 1.

[0036] The outer wall of the fixed sliding rod 3 is provided with a feeding mechanism 4 to stir and automatically feed the solder paste during the printing work. The feeding mechanism 4 includes a feeding box 401, and an inclined groove rod 402 is fixedly connected to the inner wall of the feeding box 401. The inclined groove rod 402 is threadedly connected to a stirring blade 403, and the top of the stirring blade 403 is rotatably connected to a connecting plate 404. The top of the connecting plate 404 is fixedly connected to a connecting rod 405, and the top of the connecting rod 405 is fixedly connected to a pressing plate 406. A pressing groove 407 is opened at the top of the feeding box 401, and a feeding groove 408 is penetratingly opened at the bottom of the feeding box 401. A sealing block 409 is slidably connected to the inner wall of the feeding groove 408. The top of the sealing block 409 is fixedly connected to a second spring 410, and the end of the second spring 410 away from the sealing block 409 is fixedly connected to the inner wall of the feeding box 401.

[0037] When solder paste printing is required for electronic components, first add the solder paste to be used into the inside of the feeding box 401, then drive the device. Next, the operator places the electronic components on the linear conveying component 12 at the device feeding port. Then, the electronic components will be conveyed through the linear conveying component 12 into the inside of the housing 1 and then be transported to the processing area on top of the conveying component 11. A vision recognition system is provided inside the conveying component 11, which can accurately identify the fiducial marks and feature points on the electronic components through a high-resolution camera and advanced image processing algorithms, and can automatically detect and correct the position and angle deviations of the electronic components, thus ensuring that each printing can accurately align with the target area. Then, it drives the electronic components to be pressed and attached to the bottom of the stencil 2. Through the positioning of the vision recognition system, the area of the electronic components to be processed can be aligned with the processing holes penetrating through the stencil 2. Next, drive the electric push rod 10 to output. The output shaft of the electric push rod 10 is fixedly connected to the top of the pressing plate 406. Then, when the electric push rod 10 outputs, it will drive the pressing plate 406 on the output shaft to move. Both ends of the feeding box 401 are slidably connected to the outer walls of the corresponding fixed sliding rods 3. The inside of the connecting plate 404 is slidably connected to the outer wall of the inclined groove rod 402 in a penetrating manner. The outer wall of the connecting rod 405 is slidably connected to the top of the feeding box 401 in a penetrating manner. The bottom of the pressing plate 406 corresponds to the inner wall of the pressing groove 407. Then, the pressing plate 406 will drive the connecting rod 405 to slide into the inside of the feeding box 401. At the same time, the connecting rod 405 will drive the connecting plate 404 to slide downward along the outside of the inclined groove rod 402. During this process, the connecting plate 404 can drive the stirring blade 403 to move downward synchronously. Since the stirring blade 403 is threadedly connected to the outer wall of the inclined groove rod 402, when the stirring blade 403 moves downward, it will rotate along the outer wall of the inclined groove rod 402. At the same time, by driving the movement of its blades, the function of stirring the solder paste inside the feeding box 401 can be realized every time before printing the electronic components. Stirring the solder paste can keep the solder in good fluidity and viscosity, ensuring that the electronic components can be accurately and firmly adhered to the circuit board.

[0038] Next, when the pressing plate 406 moves downward to a certain position, the pressing plate 406 will be engaged inside the pressing groove 407. Then, the pressing plate 406 will drive the pressing groove 407 to move downward synchronously. Next, both ends of the feeding box 401 will slide downward along the outer wall of the fixed slide bar 3. When sliding downward a certain distance, at this time, the bottom of the sealing block 409 will contact the top of the steel mesh 2. Since the steel mesh 2 is in a fixed position, the sealing block 409 will be squeezed, and then it will slide upward along the inner wall of the feeding groove 408, and at the same time, it will squeeze the second spring 410. After that, when the whole sealing block 409 slides into the feeding groove 408, at this time, since the sealing block 409 no longer seals the feeding groove 408, the solder paste just stirred inside the feeding box 401 will flow downward through the inside of the feeding groove 408, and then will flow to the top of the steel mesh 2, so as to realize the feeding for the printing work of electronic components. After that, after the feeding is completed, the output shaft of the electric push rod 10 is driven to reset. After the connecting plate 404 slides to the top along the outer wall of the inclined groove rod 402, then the connecting plate 404 will drive the feeding box 401 to move upward for reset. During the feeding process, the automatic stirring of the solder paste can make the flux in the solder paste evenly distributed, ensuring the use effect of the solder paste.

[0039] Embodiment 2. Please refer to Figure 2 , Figures 6-7 , on the basis of Embodiment 1, in this embodiment, a squeegee mechanism 6 is provided on the inner wall of the chute 5 to automatically recover the solder paste during the printing work.

[0040] The doctor blade mechanism 6 includes a connecting block 601, and a recovery doctor blade 602 is hinged to one side of the connecting block 601, and an application doctor blade 603 is hinged to the other side of the connecting block 601. A first drawstring 604 is fixedly connected through the inside of the connecting block 601. A winding assembly 605 is fixedly installed on the top of the stencil 2. One end of the first drawstring 604 is fixedly connected to the output shaft of the winding assembly 605. A fixed block 606 is fixedly connected to the top of the stencil 2, and a rotating rod 607 is rotatably connected through the inner wall of the fixed block 606. The end of the first drawstring 604 away from the winding assembly 605 is wound around the outer wall of the rotating rod 607. A second drawstring 608 is wound around the outer wall of the rotating rod 607. The end of the recovery doctor blade 602 is slidably connected to the inner wall of the chute 5, and the bottom of the recovery doctor blade 602 is slidably connected to the top of the stencil 2. The end of the application doctor blade 603 is slidably connected to the inner wall of the chute 5, and the bottom of the application doctor blade 603 is slidably connected to the top of the stencil 2. The end of the second drawstring 608 away from the rotating rod 607 is fixedly connected to the outer wall of the feeding box 401. A convex block 8 is slidably connected to the inner wall of the chute 5, and a first spring 9 is fixedly connected to one end of the convex block 8. The end of the first spring 9 away from the convex block 8 is fixedly connected to the inside of the stencil 2. The outer wall of the convex block 8 corresponds to the side wall of the recovery doctor blade 602, and the outer wall of the convex block 8 corresponds to the side wall of the application doctor blade 603.

[0041] After the solder paste feeding is completed, the reset and upward movement of the feeding box 401 will pull the second pulling rope 608, and then the rotating rod 607 will rotate, thereby winding up the first pulling rope 604. During this process, the first pulling rope 604 will drive the coating squeegee 603 to slide along the surface of the stencil 2, so that the solder paste can be scraped into multiple processing holes on the surface of the stencil 2, and then be extruded onto the electrical components, thus completing the printing work of the electronic components. The printed electronic components will be conveyed out through the linear conveying component 12 at the discharge port. After that, when the coating squeegee 603 slides along the inner wall of the chute 5 for a certain distance, it will touch the outer wall of the convex block 8 at this time. Then the coating squeegee 603 will be squeezed, and then rotate at an angle with the hinge joint of the connecting block 601 as the axis. At this time, the coating squeegee 603 will move away from the surface of the stencil 2. After that, when passing over the convex block 8, the rotated coating squeegee 603 will rotate back to its original position. At this time, the solder paste driven by the stencil 2 will stay on the left side of the coating squeegee 603. Then the recovery squeegee 602 will rotate synchronously with the coating squeegee 603, so that the solder paste stays on the left side of the recovery squeegee 602. After that, when it is necessary to print solder paste on the electronic components, since one end of the first pulling rope 604 is connected to the clockwork spring of the winding component 605, and the clockwork spring pulls the rotating rod 607 through the first pulling rope 604. When feeding, one end of the second pulling rope 608 is driven to move downward by the feeding box 401. At this time, the rotating rod 607 no longer receives the pulling force of the second pulling rope 608, and then will be pulled by the first pulling rope 604. Thus, the rotating rod 607 rotates along the inner wall of the fixed block 606. After rotation, the first pulling rope 604 wound around the end of the rotating rod 607 will move into the interior of the winding component 605. During this process, it will drive the connecting block 601 to move. At the same time, the connecting block 601 will drive the recovery squeegee 602 to slide leftward and fit along the top of the stencil 2. During the process, it will drive the solder paste on the left side to move, so that the excess solder paste adsorbed on the surface of the stencil 2 after printing can be scraped, realizing that after each printing work is completed, the residual solder paste on the surface of the stencil 2 can be automatically scraped. After that, when the feeding mechanism 4 contacts the surface of the stencil 2, the feeding work for the next printing work will be carried out at this time, thus realizing the scraping of the residual solder paste from the previous time, avoiding the mixing of the residual solder paste and the newly fed solder paste, thereby reducing the effect of solder paste printing. By recovering the solder paste on the stencil 2, the interruption time for cleaning the stencil 2 during the printing process can be effectively reduced, and the production efficiency can be improved.

[0042] Embodiment 3. Please refer to Figures 8-9 , on the basis of Embodiment 2, in this embodiment, a storage mechanism 7 is provided on the top of the stencil 2, which can seal and store the solder paste when recovering the solder paste.

[0043] The storage mechanism 7 includes a sliding plate 701 and a first mounting bracket 702. A sealing plate 703 is slidably connected to the inner wall of the sliding plate 701, and a third spring 704 is fixedly connected to the side wall of the sealing plate 703. The end of the third spring 704 away from the sealing plate 703 is fixedly connected inside the sliding plate 701. A first rack 705 is fixedly connected to the top of the sliding plate 701. A second mounting bracket 709 is fixedly connected to the top of the steel mesh 2, and a gear 710 is rotatably connected to the outer wall of the second mounting bracket 709. The inner wall of the teeth of the gear 710 is matched and engaged with the inner wall of the tooth grooves of the first rack 705. A tension spring 706 is fixedly connected to the side wall of the first mounting bracket 702, and a second rack 707 is fixedly connected to the end of the tension spring 706 away from the first mounting bracket 702. The inner wall of the teeth of the gear 710 is matched and engaged with the inner wall of the tooth grooves of the second rack 707. A pressing plate 708 is fixedly connected to the side wall of the second rack 707. A storage box 711 is fixedly connected to the side wall of the steel mesh 2. The side wall of the sliding plate 701 is slidably connected to the side wall of the steel mesh 2. The inside of the storage box 711 is communicated with the inside of the steel mesh 2.

[0044] When the printing work for one time is completed and the residual solder paste on the surface of the stencil 2 is scraped and cleaned by the recycling squeegee 602, when the connecting block 601 moves to a certain position, the side wall of the connecting block 601 will contact the abutment plate 708 at this time, and then the abutment plate 708 will be extruded, and then the abutment plate 708 will be driven to move. Then the abutment plate 708 will drive the second rack 707 to move, and at the same time the tension spring 706 will be stretched. Since the guide rod is fixedly connected to the side wall of the first mounting bracket 702, the second rack 707 will slide along the outer wall of the guide rod when moving, which can ensure that the second rack 707 will not shift during the movement. Then the second rack 707 will drive the gear 710 to rotate during the movement, and at the same time the gear 710 will drive the first rack 705 to move upward. Then the first rack 705 will drive the sliding plate 701 to move upward, and then the sliding plate 701 will drive the sealing plate 703 to move upward. Since the sealing plate 703 fits on the inner wall of the stencil 2, the inclined surface of the sealing plate 703 will be extruded, and then it will slide inward along the inner wall of the third spring 704, and at the same time the third spring 704 will be compressed. When the sliding plate 701 slides upward, then the recycling squeegee 602 will push the residual solder paste on the surface of the stencil 2 below the sliding plate 701, and then it will enter the interior of the storage box 711, thus realizing the collection of the solder paste. After the collection is completed, when the feeding box 401 stops moving, at this time the tension spring 706 will reset, and the second rack 707 will be driven to move in the reverse direction by the pulling force, so that the gear 710 drives the first rack 705 to move downward. Then the first rack 705 drives the sealing plate 703 to move downward. When the sealing plate 703 moves down to a certain position, at this time, through the elastic force release of the third spring 704, it can be engaged at the entrance of the storage box 711, so as to change the internal space of the storage box 711 into a sealed state, avoiding oxidation or deterioration caused by long-term exposure to the air, which is beneficial to the recycling and storage of the solder paste. The recycled solder paste can be reused after being processed, reducing waste.

[0045] The working principle of the present invention is as follows: Place the electronic components on the linear conveying component 12 at the device feed port. Then, the electronic components will be conveyed into the interior of the housing 1 through the linear conveying component 12 and then be transported to the processing area on top of the conveying component 11. A visual recognition system is provided inside the conveying component 11, which can align the area of the electronic component to be processed with the processing holes penetrating through the stencil 2. Then, drive the electric push rod 10 to output. Next, the pressing plate 406 will drive the connecting rod 405 to slide into the interior of the feeding box 401. At the same time, the connecting rod 405 will drive the connecting plate 404 to slide downward along the outside of the inclined groove rod 402. During this process, the connecting plate 404 can drive the stirring blade 403 to move downward synchronously. Since the stirring blade 403 is connected to the outer wall of the inclined groove rod 402 by threads, when the stirring blade 403 moves downward, it will rotate along the outer wall of the inclined groove rod 402. At the same time, by driving the movement of its blades, the function of stirring the solder paste inside the feeding box 401 every time before printing the electronic components is realized. Stirring the solder paste can keep the tin in good fluidity and viscosity;

[0046] Next, when the pressing plate 406 moves downward to a certain position, then the pressing plate 406 will be engaged in the pressing groove 407. Then, the pressing plate 406 will drive the pressing groove 407 to move downward synchronously. Next, both ends of the feeding box 401 will slide downward along the outer wall of the fixed sliding rod 3. When sliding downward a certain distance, at this time, the bottom of the sealing block 409 will contact the top of the stencil 2. Since the stencil 2 is in a fixed position, the sealing block 409 will be squeezed and then slide upward along the inner wall of the feeding groove 408. At the same time, it will squeeze the second spring 410. After that, when the whole sealing block 409 slides into the feeding groove 408, at this time, since the sealing block 409 no longer seals the feeding groove 408, the just-stirred solder paste inside the feeding box 401 will flow downward through the inside of the feeding groove 408 and then flow to the top of the stencil 2, thus realizing the feeding for the printing work of the electronic components;

[0047] After the solder paste feeding is completed, the reset and upward movement of the feeding box 401 will pull the second pulling rope 608, and then the rotating rod 607 will rotate, thereby winding up the first pulling rope 604. During this process, the first pulling rope 604 will drive the coating squeegee 603 to slide along the surface of the stencil 2, so that the solder paste can be scraped into multiple processing holes on the surface of the stencil 2, and then be extruded onto the electrical components, thus completing the printing work of the electronic components. The printed electronic components will be conveyed out through the linear conveying component 12 at the discharge port. After that, the coating squeegee 603 slides along the inner wall of the chute 5 for a certain distance and then contacts the outer wall of the convex block 8. Then the coating squeegee 603 will be squeezed. After passing over the convex block 8, the rotated coating squeegee 603 will reset and rotate. At this time, the solder paste driven by the stencil 2 will stay on the left side of the coating squeegee 603. Then the recovery squeegee 602 will rotate synchronously with the coating squeegee 603, so that the solder paste stays on the left side of the recovery squeegee 602. When the solder paste printing is required for the electronic components, since one end of the first pulling rope 604 is connected to the clockwork spring of the winding component 605, and the clockwork spring pulls the rotating rod 607 through the first pulling rope 604. When feeding, one end of the second pulling rope 608 is driven by the feeding box 401 to move downward. At this time, the rotating rod 607 no longer receives the pulling force of the second pulling rope 608 and will then be pulled by the first pulling rope 604. Thus, the rotating rod 607 rotates along the inner wall of the fixed block 606. After rotation, the first pulling rope 604 wound around the end of the rotating rod 607 will move into the inside of the winding component 605. During this process, the connecting block 601 will be driven to move. At the same time, the connecting block 601 will drive the recovery squeegee 602 to slide leftward and fit along the top of the stencil 2, driving the solder paste on the left side to move during the process, so that the excess solder paste adsorbed on the surface of the stencil 2 after printing can be scraped, realizing that after each printing work is completed, the residual solder paste on the surface of the stencil 2 can be automatically scraped off.

[0048] It should be noted that each device in this application is a common device in the market and can be selected according to requirements during specific use. And the circuit connection relationships of each device all belong to simple series and parallel connection circuits, and there is no innovation point in the circuit connection part. Those skilled in the art can easily implement it, which belongs to the prior art and will not be elaborated here.

[0049] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. A solder paste printing device for electronic components, comprising a housing (1), characterized in that: A steel mesh (2) is fixedly connected to the interior of the housing (1), and a fixed sliding rod (3) is fixedly connected to the top of the steel mesh (2), and a sliding groove (5) is provided on the side wall of the steel mesh (2); The outer wall of the fixed slide bar (3) is provided with a feeding mechanism (4) for stirring the solder paste and automatically feeding the solder paste during printing. The feeding mechanism (4) comprises a feeding box (401), and the inner wall of the feeding box (401) is fixedly connected with an inclined groove rod (402), the inclined groove rod (402) is threadedly connected with a stirring blade (403), and the top of the stirring blade (403) is rotatably connected with a connecting plate (404), and the top of the connecting plate (404) is fixedly connected with a connecting rod (405), and the connecting rod (406) is connected to the connecting plate (406). A pressing plate (406) is fixedly connected to the top of the connecting rod (405), a pressing groove (407) is provided on the top of the feeding box (401), a feeding groove (408) is provided through the bottom of the feeding box (401), and a sealing block (409) is slidably connected to the inner wall of the feeding groove (408), a second spring (410) is fixedly connected to the top of the sealing block (409), and an end of the second spring (410) away from the sealing block (409) is fixedly connected to the inner wall of the feeding box (401); Both ends of the feeding box (401) are slidably connected to the outer wall of the corresponding fixed slide rod (3), the interior of the connecting plate (404) penetrates and is slidably connected to the outer wall of the inclined groove rod (402), the outer wall of the connecting rod (405) penetrates and is slidably connected to the top of the feeding box (401), and the bottom of the pressing plate (406) corresponds to the inner wall of the pressing groove (407); The inner wall of the slide trough (5) is provided with a scraper mechanism (6) for automatically recovering the solder paste; A storage mechanism (7) is provided on the top of the steel mesh (2) to seal and store the solder paste when the solder paste is recycled.

2. The electronic component solder paste printing device according to claim 1, characterized in that: The scraper mechanism (6) comprises a connecting block (601), and a recovery scraper (602) is hinged on one side of the connecting block (601), and a smearing scraper (603) is hinged on the other side of the connecting block (601), and a first pull rope (604) is fixedly connected to the inside of the connecting block (601), a winding assembly (605) is fixedly installed on the top of the steel mesh (2), one end of the first pull rope (604) is fixedly connected to the output shaft of the winding assembly (605), a fixed block (606) is fixedly connected to the top of the steel mesh (2), and a rotating rod (607) is rotatably connected to the inner wall of the fixed block (606), and the end of the first pull rope (604) away from the winding assembly (605) is wrapped around the outer wall of the rotating rod (607), and the outer wall of the rotating rod (607) is wrapped with a second pull rope (608).

3. The electronic component solder paste printing device according to claim 2, characterized in that: The end of the recovery scraper (602) is slidably connected to the inner wall of the slide groove (5), and the bottom of the recovery scraper (602) is slidably connected to the top of the steel mesh (2), the end of the smearing scraper (603) is slidably connected to the inner wall of the slide groove (5), and the bottom of the smearing scraper (603) is slidably connected to the top of the steel mesh (2), and the end of the second pull rope (608) away from the rotating rod (607) is fixedly connected to the outer wall of the feeding box (401).

4. The electronic component solder paste printing device according to claim 3, characterized in that: The inner wall of the slide groove (5) is slidably connected to a protrusion (8), and one end of the protrusion (8) is fixedly connected to a first spring (9), and the end of the first spring (9) away from the protrusion (8) is fixedly connected to the inside of the steel mesh (2), and the outer wall of the protrusion (8) corresponds to the side wall of the recovery scraper (602), and the outer wall of the protrusion (8) corresponds to the side wall of the coating scraper (603).

5. An electronic component solder paste printing device according to any one of claims 1 to 4, characterized in that: The storage mechanism (7) comprises a sliding plate (701) and a first mounting frame (702), the inner wall of the sliding plate (701) is slidably connected to a sealing plate (703), and the side wall of the sealing plate (703) is fixedly connected to a third spring (704), an end of the third spring (704) away from the sealing plate (703) is fixedly connected to the inside of the sliding plate (701), the top of the sliding plate (701) is fixedly connected to a first rack (705), the top of the steel net (2) is fixedly connected to a second mounting frame (709), and the outer wall of the second mounting frame (709) is rotatably connected to the second rack (709). A gear (710) is provided, the inner wall of the gear teeth of the gear (710) matches and meshes with the inner wall of the tooth groove of the first rack (705), a tension spring (706) is fixedly connected to the side wall of the first mounting frame (702), and the end of the tension spring (706) away from the first mounting frame (702) is fixedly connected to the second rack (707), the inner wall of the gear teeth of the gear (710) matches and meshes with the inner wall of the tooth groove of the second rack (707), the side wall of the second rack (707) is fixedly connected to a back plate (708), and the side wall of the steel mesh (2) is fixedly connected to a storage box (711).

6. The electronic component solder paste printing device according to claim 5, characterized in that: The side wall of the sliding plate (701) is slidably connected to the side wall of the steel mesh (2), and the interior of the material storage box (711) is connected to the interior of the steel mesh (2).

7. The electronic component solder paste printing device according to claim 1, characterized in that: An electric push rod (10) is fixedly mounted on the top of the shell (1), and an output shaft of the electric push rod (10) is fixedly connected to the top of the pressure plate (406), a conveying assembly (11) is fixedly mounted on the inner wall of the shell (1), and a linear transmission assembly (12) is fixedly mounted on the side wall of the shell (1).

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